Display panel, preparation method thereof and display device

Abstract

The invention relates to the technical field of display, and discloses a display panel, a preparation method thereof and a display device. The display panel comprises a driving backboard, a connecting electrode and at least two light-emitting devices, the driving back plate comprises a driving electrode; the connecting electrode is arranged on one side of the driving backboard, and the connecting electrode is electrically connected to the driving electrode; the light-emitting devices are arranged on the side, away from the driving backboard, of the connecting electrode, and the connecting electrode is electrically connected with at least two light-emitting devices. According to the display panel, when the light-emitting device has defects or is damaged in the bonding process, one transfer unit electrically connected with one connecting electrode can be directly removed for replacement, so that the repair difficulty can be reduced, and the display effect of the display panel is ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display panel, a preparation method thereof, and a display device. Background Art

[0002] In view of the fact that Micro LED (Micro-Light Emitting Diode) display technology has many advantages such as high display brightness, large viewing angle, long service life, short response time, and low power consumption; at the same time, it also has the characteristics of self-luminescence (without a backlight source), small size, and being thin and light. Therefore, Micro LED display technology is considered to be the mainstream trend and development direction of future display technologies. Micro LEDs can be transferred to the driving backplane in batches at the micron level through mass transfer and can adopt active addressing; any pixel of a Micro LED display device can be individually addressed and driven to emit light, and the Micro LEDs are lit in a scanning manner for graphic display. Compared with traditional LEDs, it has two major characteristics. One is miniaturization, where the pixel size and pixel pitch are reduced from the millimeter level to the micron level, and the other is matrixization and integration, including the driving backplane and the LED matrix array.

[0003] However, when there are defects in the Micro LEDs of the current display panel or damage occurs during the bonding process, the repair of Micro LEDs cannot be achieved, and there will be defects in the display screen.

[0004] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0005] The purpose of the present disclosure is to overcome the above-mentioned deficiencies of the prior art and provide a display panel, a preparation method thereof, and a display device.

[0006] According to one aspect of the present disclosure, a display panel is provided, including:

[0007] A driving backplane including driving electrodes;

[0008] A connection electrode disposed on one side of the driving backplane, and the connection electrode is electrically connected to the driving electrode;

[0009] At least two light-emitting devices, the light-emitting devices are disposed on the side of the connection electrode away from the driving backplane, and the connection electrode is electrically connected to at least two of the light-emitting devices.

[0010] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0011] A planarization layer is provided on one side of the driving backplane. An opening is provided on the planarization layer, and the connection electrode extends into the opening.

[0012] A passivation layer is provided on the side of the planarization layer facing away from the driving backplane and covers at least part of the sidewall of the opening to form a recess. At least part of the light-emitting device is located in the recess. A via is provided on the passivation layer, and the connection electrode is electrically connected to the light-emitting device through the via. The cross-sectional area of the light-emitting device in the first direction increases as the distance from the driving backplane increases, and the first direction is parallel to the driving backplane.

[0013] In an exemplary embodiment of the present disclosure, the connection electrode is provided between the driving backplane and the planarization layer; at least two light-emitting devices include a first light-emitting device, a second light-emitting device, and a third light-emitting device; the connection electrode includes a first part and a second part arranged at intervals; the first light-emitting device is located on the side of the first part facing away from the driving backplane, the second light-emitting device is located on the side of the first part facing away from the driving backplane, the third light-emitting device is located on the side of the second part facing away from the driving backplane, and the second part is electrically connected to the driving electrode; the display panel further includes:

[0014] An electrode layer includes a first electrode and a second electrode arranged at intervals. The first electrode is provided on the side of the first light-emitting device facing away from the driving backplane, and the second electrode is provided on the sides of the second light-emitting device and the third light-emitting device facing away from the driving backplane and electrically connects the second light-emitting device and the third light-emitting device.

[0015] In an exemplary embodiment of the present disclosure, the positive and negative electrodes of the second light-emitting device are arranged in the opposite direction to the positive and negative electrodes of the first light-emitting device in the second direction, and the positive and negative electrodes of the second light-emitting device are arranged in the opposite direction to the positive and negative electrodes of the third light-emitting device in the second direction. The second direction is perpendicular to the driving backplane.

[0016] In an exemplary embodiment of the present disclosure, a part of the connection electrode is provided between the planarization layer and the passivation layer; the connection electrode includes a first part and a second part arranged at intervals. One end of the first part is located in the opening, and the first part extends to the side of the planarization layer facing away from the driving backplane. At least two light-emitting devices include a first light-emitting device and a second light-emitting device. The first light-emitting device is located on the side of the first part facing away from the driving backplane, and the second light-emitting device is located on the side of the second part facing away from the driving backplane. The second part is electrically connected to the driving electrode; the display panel further includes:

[0017] The electrode layer includes a first electrode and a second electrode which are arranged at intervals. The first electrode is disposed on a side of the first light-emitting device facing away from the driving backplane, and the second electrode is disposed on a side of the second light-emitting device facing away from the driving backplane. The second electrode is electrically connected to the first portion.

[0018] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0019] A reflective layer is disposed between the driving backplane and the passivation layer. A reflective opening is provided on the reflective layer, and the light-emitting device is located within the reflective opening.

[0020] According to another aspect of the present disclosure, there is provided a method for manufacturing a display panel for manufacturing the display panel described in any one of the above, including:

[0021] Provide a first substrate, and form at least two light-emitting devices on one side of the first substrate;

[0022] Form connection electrodes on a side of at least two of the light-emitting devices facing away from the substrate;

[0023] Provide a second substrate, and form driving electrodes on one side of the second substrate;

[0024] Bond the connection electrodes to the driving electrodes.

[0025] In an exemplary embodiment of the present disclosure, after forming the light-emitting devices, the manufacturing method further includes:

[0026] Form a passivation layer that covers at least two of the light-emitting devices;

[0027] Perform patterning on the passivation layer to form vias.

[0028] In an exemplary embodiment of the present disclosure, after forming the connection electrodes, the manufacturing method further includes:

[0029] Form a reflective layer on a side of the connection electrodes facing away from the first substrate. A reflective opening is provided on the reflective layer, and the light-emitting device is located within the reflective opening;

[0030] Form a planarization layer that fills a gap between the reflective layer and the light-emitting device.

[0031] In an exemplary embodiment of the present disclosure, after forming the passivation layer, the manufacturing method further includes:

[0032] A reflective layer is formed on a side of the passivation layer facing away from the first substrate, and a reflective opening is provided on the reflective layer, and the light-emitting device is located within the reflective opening;

[0033] A planarization layer is formed, and the planarization layer fills a gap between the reflective layer and the light-emitting device.

[0034] In an exemplary embodiment of the present disclosure, when forming at least two of the light-emitting devices, an electrode material layer is formed;

[0035] After forming at least two of the light-emitting devices, the manufacturing method further includes:

[0036] The electrode material layer is patterned to form a first electrode and a second electrode that are spaced apart;

[0037] Alternatively, after removing the first substrate, the manufacturing method further includes:

[0038] The electrode material layer is patterned to form a first electrode and a second electrode that are spaced apart.

[0039] In an exemplary embodiment of the present disclosure, forming at least two light-emitting devices on a side of the first substrate includes:

[0040] A first light-emitting device and a third light-emitting device are formed on a side of the first substrate;

[0041] A second light-emitting device is bonded to a side of the first substrate, and positive and negative electrodes of the second light-emitting device are arranged in a direction opposite to that of the positive and negative electrodes of the first light-emitting device in a second direction, and positive and negative electrodes of the second light-emitting device are arranged in a direction opposite to that of the positive and negative electrodes of the third light-emitting device in the second direction, and the second direction is perpendicular to the first substrate.

[0042] According to another aspect of the present disclosure, a display device is provided, including:

[0043] A display panel, which is the display panel described in any one of the above.

[0044] In the display panel of the present disclosure, since the light-emitting device is provided on a side of the connection electrode facing away from the driving backplane, therefore, it is necessary to first electrically connect at least two light-emitting devices through the connection electrode, and then bond the light-emitting device to the driving backplane, so that at least two light-emitting devices are electrically connected and transferred as a transfer unit. When there is a defect in the light-emitting device or damage during the bonding process, a transfer unit electrically connected by one connection electrode can be directly removed and replaced, thereby reducing the repair difficulty and ensuring the display effect of the display panel.

[0045] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0047] Figure 1 Schematic structural diagram of a first exemplary embodiment of a display panel according to the present disclosure.

[0048] Figure 2 Schematic structural diagram of a second exemplary embodiment of a display panel according to the present disclosure.

[0049] Figure 3 Schematic structural diagram of a third exemplary embodiment of a display panel according to the present disclosure.

[0050] Figure 4 Schematic circuit diagram of four light-emitting devices connected in series in a display panel according to the present disclosure.

[0051] Figure 5 Schematic flowchart of a method for manufacturing a display panel according to the present disclosure.

[0052] Figures 6 - 8 Schematic structural diagrams of the respective steps for preparing a material film layer for forming a light-emitting device.

[0053] Figures 9 - 15 For preparing to form Figure 1 Schematic structural diagrams of the respective steps for the display panel in

[0054] Figures 16 - 21 For preparing to form Figure 2 Schematic structural diagrams of the respective steps for the display panel in

[0055] Figures 22 - 29 For preparing to form Figure 3 Schematic structural diagrams of the respective steps for the display panel in

[0056] Description of reference numerals:

[0057] 1a, first substrate; 1b, substrate

[0058] 2a, buffer layer; 2b, N-type semiconductor material layer; 2c, light-emitting material layer; 2d, P-type semiconductor material layer; 2e, electrode material layer

[0059] 1. Driving backplane; 11. Second substrate; 12. Insulating layer; 13. Driving electrode; 14. dummy electrode;

[0060] 2. Connecting electrode; 21. First part; 22. Second part;

[0061] 3. Light-emitting device; 3a. First light-emitting device; 3a1. First P-type semiconductor layer; 3a2. First light-emitting layer; 3a3. First N-type semiconductor layer; 3b. Second light-emitting device; 3b1. Second P-type semiconductor layer; 3b2. Second light-emitting layer; 3b3. Second N-type semiconductor layer; 3c. Third light-emitting device; 3c1. Third P-type semiconductor layer; 3c2. Third light-emitting layer; 3c3. Third N-type semiconductor layer;

[0062] 4. Planarization layer; 41. Opening;

[0063] 5. Passivation layer; 51. Depression; 52. Via;

[0064] 6. Reflective layer; 61. Reflective opening;

[0065] 7. Electrode layer; 71. First electrode; 72. Second electrode;

[0066] X. First direction; Y. Second direction. Detailed implementation

[0067] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0068] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the icon to another component, these terms are used in this specification only for convenience, for example, according to the directions of the examples described in the drawings. It can be understood that if the device of the icon is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" disposed on another structure, or that a structure is "indirectly" disposed on another structure through another structure.

[0069] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and refer to the existence of additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second", "third", etc. are used only as labels and are not a limitation on the quantity of their objects.

[0070] In this application, unless otherwise clearly specified and defined, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral one; it can be directly connected or indirectly connected through an intermediate medium. "And / or" is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this text generally represents an "or" relationship between the associated objects before and after.

[0071] The exemplary embodiments of the present disclosure provide a display panel. Referring to Figures 1 - 4 as shown, the display panel may include a driving backplane 1, a connection electrode 2, and at least two light-emitting devices 3; the driving backplane 1 may include a driving electrode 13; the connection electrode 2 is disposed on one side of the driving backplane 1, and the connection electrode 2 is electrically connected to the driving electrode 13; the light-emitting devices 3 are disposed on the side of the connection electrode 2 facing away from the driving backplane 1, and the connection electrode 2 is electrically connected to at least two light-emitting devices 3.

[0072] In the display panel of the present disclosure, since the light-emitting devices 3 are disposed on the side of the connection electrode 2 facing away from the driving backplane 1, therefore, it is necessary to first achieve the electrical connection of at least two light-emitting devices 3 through the connection electrode 2, and then perform the bonding of the light-emitting devices 3 and the driving backplane 1, so that at least two light-emitting devices 3 are electrically connected and then transferred as a transfer unit. When a light-emitting device 3 is defective or damaged during the bonding process, a transfer unit directly electrically connected by a connection electrode 2 can be directly removed and replaced, thereby reducing the repair difficulty and ensuring the display effect of the display panel.

[0073] In this exemplary embodiment, referring to Figures 1 - 3As shown, the driving backplane 1 may include a second substrate 11 and driving electrodes 13. The material of the second substrate 11 may include inorganic materials. For example, the inorganic material may be glass, quartz, metal, etc. The material of the second substrate 11 may also include organic materials. For example, the organic material may be resin materials such as polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate. The second substrate 11 may be formed by multiple material layers. For example, the second substrate 11 may include multiple base material layers, and the material of the base material layer may be any of the above materials. Of course, the second substrate 11 may also be provided as a single layer, which may be any of the above materials.

[0074] The driving electrodes 13 are provided on one side of the second substrate 11. Specifically, an insulating layer 12 is provided on one side of the second substrate 11, and driving electrodes 13 are provided on the side of the insulating layer 12 facing away from the second substrate 11. The driving electrodes 13 are electrically connected to the pixel circuit. To ensure the unity of the process, dummy electrodes 14 may be provided on the side of the insulating layer 12 facing away from the second substrate 11, and the dummy electrodes 14 are not connected to the pixel circuit.

[0075] Of course, in some other exemplary embodiments of the present disclosure, the driving backplane 1 may further include a driving circuit composed of thin film transistors and capacitors to achieve active driving, and the driving electrodes 13 are electrically connected to the driving circuit. The switching of the light-emitting device 3 is controlled by the driving circuit.

[0076] In the present exemplary embodiment, referring to Figures 1 - 3 As shown, a connection electrode 2 is provided on one side of the driving backplane 1, and the connection electrode 2 is electrically connected to the driving electrodes 13; the material of the connection electrode 2 may be metal, and the metal has a small resistance and good electrical conductivity.

[0077] The light-emitting device 3 is provided on the side of the connection electrode 2 facing away from the driving backplane 1, so that the light-emitting device 3 is directly electrically connected to the connection electrode 2. The connection electrode 2 is electrically connected to at least two light-emitting devices 3. For example, adjacent two light-emitting devices 3 can be connected in series through the connection electrode 2, and adjacent three light-emitting devices 3 can be connected in series through the connection electrode 2. Referring to Figure 4 As shown, adjacent multiple light-emitting devices 3 can be connected in series through the connection electrode 2. The first light-emitting device 3 is electrically connected to the power supply terminal Vdd through the pixel circuit, and the last light-emitting device 3 is grounded to Vss. Of course, adjacent two light-emitting devices 3 can be connected in parallel through the connection electrode 2.

[0078] Since the light-emitting device 3 is disposed on the side of the connection electrode 2 facing away from the driving backplane 1, it is necessary to first electrically connect at least two light-emitting devices 3 through the connection electrode 2, and then bond the light-emitting device 3 to the driving backplane 1, so that at least two light-emitting devices 3 are electrically connected and transferred as a transfer unit. When there is a defect in the light-emitting device 3 or damage during the bonding process, a transfer unit electrically connected to one connection electrode 2 can be directly removed and replaced, thereby reducing the repair difficulty and ensuring the display effect of the display panel.

[0079] Referring Figures 1 - 3 As shown, in some exemplary embodiments of the present disclosure, the display panel may further include a planarization layer 4 and a passivation layer 5. The planarization layer 4 is disposed on one side of the driving backplane 1, and an opening 41 is provided on the planarization layer 4. The connection electrode 2 extends into the opening 41. Specifically, the connection electrode 2 extends to the bottom of the opening 41.

[0080] The passivation layer 5 is disposed on the side of the planarization layer 4 facing away from the driving backplane 1, and the passivation layer 5 covers at least part of the side wall of the opening 41 to form a recess 51. At least part of the light-emitting device 3 is located in the recess 51. For example, the light-emitting device 3 may be entirely located in the recess 51, or a part of the light-emitting device 3 may be located in the recess 51.

[0081] A via 52 is provided on the passivation layer 5, and the connection electrode 2 is electrically connected to the light-emitting device 3 through the via 52, that is, the connection electrode 2 passes through the via 52 and is connected to the light-emitting device 3, so that an electrical signal can be transmitted from the connection electrode 2 to the light-emitting device 3.

[0082] Moreover, the cross-sectional area of the light-emitting device 3 in the first direction X increases as the distance from the driving backplane 1 increases. For example, the light-emitting device 3 is arranged in an inverted trapezoidal structure. With such an arrangement, it is necessary to cover the passivation layer 5 and the planarization layer 4 after forming the light-emitting device 3, and then bond the light-emitting device 3 to the driving backplane 1, so that the passivation layer 5 and the planarization layer 4 can better cover the side wall of the light-emitting device 3, reduce the process difficulty, and avoid the poor coverage of the side wall of the light-emitting device 3 by the passivation layer 5 and the planarization layer 4 due to the high step difference and inverted trapezoidal structure of the light-emitting device 3, and also avoid the reliability problem caused by the exposure of the side wall of the light-emitting device 3.

[0083] It should be noted that the first direction X is parallel to the driving backplane 1. Specifically, the first direction X is parallel to the surface of the driving backplane 1 where the connection electrode 2 is provided. The first direction X has multiple directions, and only one is shown in the figure as an example. The second direction Y is perpendicular to the driving backplane 1. Specifically, the second direction Y is perpendicular to the surface of the driving backplane 1 where the connection electrode 2 is provided, that is, the second direction Y is perpendicular to the first direction X, or it can be said that the second direction Y is perpendicular to the first substrate 1a.

[0084] Referring to Figure 3 As shown, in some exemplary embodiments of the present disclosure, at least two light-emitting devices 3 may include a first light-emitting device 3a, a second light-emitting device 3b, and a third light-emitting device 3c; the light-emitting colors of the at least two light-emitting devices 3 are the same. For example, the at least two light-emitting devices 3 may all be red light-emitting devices, or the at least two light-emitting devices 3 may all be green light-emitting devices, or the at least two light-emitting devices 3 may all be blue light-emitting devices. Of course, the at least two light-emitting devices 3 may also be other colors, which will not be elaborated one by one here.

[0085] Referring to Figure 9 、 Figure 10 and Figure 24 As shown, the first light-emitting device 3a may include a first P-type semiconductor layer 3a1, a first light-emitting layer 3a2, and a first N-type semiconductor layer 3a3 that are stacked in sequence. The second light-emitting device 3b may include a second P-type semiconductor layer 3b1, a second light-emitting layer 3b2, and a second N-type semiconductor layer 3b3 that are stacked in sequence. The third light-emitting device 3c may include a third P-type semiconductor layer 3c1, a third light-emitting layer 3c2, and a third N-type semiconductor layer 3c3 that are stacked in sequence.

[0086] Referring to Figure 3 As shown, the connection electrode 2 is disposed between the driving backplane 1 and the planarization layer 4. The connection electrode 2 may be directly connected to the driving electrode 13 to achieve the transmission of electrical signals. The connection electrode 2 may include a first portion 21 and a second portion 22, and the first portion 21 and the second portion 22 are spaced apart, that is, there is no connection between the first portion 21 and the second portion 22. The first portion 21 is directly connected to the dummy electrode 14, and the resistance of the first portion 21 can be reduced through the dummy electrode 14 to improve the conductivity effect; the second portion 22 is directly connected to the driving electrode 13.

[0087] The first light-emitting device 3a is located on the side of the first portion 21 away from the driving backplane 1, and the second light-emitting device 3b is also located on the side of the first portion 21 away from the driving backplane 1. Specifically, one end of the first portion 21 extends to the via 52 of a recess 51, so that one end of the first portion 21 is connected to the first light-emitting device 3a through the via 52; the other end of the first portion 21 extends to the via 52 of another recess 51, so that the other end of the first portion 21 is connected to the second light-emitting device 3b through the via 52; in this way, the electrical connection between the first light-emitting device 3a and the second light-emitting device 3b is achieved through the first portion 21.

[0088] The third light-emitting device 3c is located on the side of the second part 22 away from the driving backplane 1. In this way, the electrical connection between the third light-emitting device 3c and the driving electrode 13 is realized through the second part 22, so that the pixel circuit is electrically connected to the third light-emitting device 3c through the driving electrode 13 and the second part 22.

[0089] With such a setting, the connection electrode 2 does not need to climb, and the disconnection defect caused by the disconnection of the connection electrode 2 due to climbing can be avoided.

[0090] In this case, the display panel may further include an electrode layer 7. The electrode layer 7 may include a first electrode 71 and a second electrode 72. The first electrode 71 and the second electrode 72 are arranged at intervals, that is, there is no connection between the first electrode 71 and the second electrode 72. The first electrode 71 is arranged on the side of the first light-emitting device 3a away from the driving backplane 1, so that the first electrode 71 is electrically connected to the first light-emitting device 3a; the second electrode 72 is arranged on the side of the second light-emitting device 3b and the third light-emitting device 3c away from the driving backplane 1, and is electrically connected to the second light-emitting device 3b and the third light-emitting device, that is, the electrical connection between the second light-emitting device 3b and the third light-emitting device is realized through the second electrode 72. Thus, the electrical connection of the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c is realized through the first part 21 and the second electrode 72.

[0091] The first P-type semiconductor layer 3a1 of the first light-emitting device 3a is the positive electrode of the first light-emitting device 3a, and the first N-type semiconductor layer 3a3 of the first light-emitting device 3a is the negative electrode of the first light-emitting device 3a. The second P-type semiconductor layer 3b1 of the second light-emitting device 3b is the positive electrode of the second light-emitting device 3b, and the second N-type semiconductor layer 3b3 of the second light-emitting device 3b is the negative electrode of the second light-emitting device 3b. The third P-type semiconductor layer 3c1 of the third light-emitting device 3c is the positive electrode of the third light-emitting device 3c, and the third N-type semiconductor layer 3c3 of the third light-emitting device 3c is the negative electrode of the third light-emitting device 3c.

[0092] Optionally, the positive and negative electrodes of the second light-emitting device 3b are arranged in the opposite direction to the positive and negative electrodes of the first light-emitting device 3a in the second direction Y. For example, the first N-type semiconductor layer 3a3, the first light-emitting layer 3a2, and the first P-type semiconductor layer 3a1 of the first light-emitting device 3a are sequentially stacked in the direction away from the driving backplane 1, and the second P-type semiconductor layer 3b1, the second light-emitting layer 3b2, and the second N-type semiconductor layer 3b3 of the second light-emitting device 3b are sequentially stacked in the direction away from the driving backplane 1.

[0093] The positive and negative electrodes of the second light-emitting device 3b are arranged in the opposite direction to those of the third light-emitting device 3c in the second direction Y. For example, in the direction away from the driving backplane 1, the second P-type semiconductor layer 3b1, the second light-emitting layer 3b2, and the second N-type semiconductor layer 3b3 of the second light-emitting device 3b are sequentially stacked, and in the direction away from the driving backplane 1, the third N-type semiconductor layer 3c3, the third light-emitting layer 3c2, and the third P-type semiconductor layer 3c1 of the third light-emitting device 3c are sequentially stacked.

[0094] Such an arrangement enables the series connection of the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c through the first part 21 and the second electrode 72.

[0095] Of course, the stacking structures of the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c can be opposite to those described above, which will not be elaborated here.

[0096] Referring to Figure 1 and Figure 2 As shown, in some exemplary embodiments of the present disclosure, a part of the connection electrode 2 is disposed between the planarization layer 4 and the passivation layer 5, and another part of the connection electrode 2 is not disposed between the planarization layer 4 and the passivation layer 5. The connection electrode 2 may include a first part 21 and a second part 22, and the first part 21 and the second part 22 are spaced apart, that is, there is no connection between the first part 21 and the second part 22. The first part 21 is directly connected to the dummy electrode 14, and the resistance of the first part 21 can be reduced through the dummy electrode 14 to improve the conductive effect; the second part 22 is directly connected to the driving electrode 13.

[0097] One end of the first part 21 is located within the opening 41, and the first part 21 extends to the side of the planarization layer 4 away from the driving backplane 1. Specifically, one end of the first part 21 is located within the opening 41 where the first light-emitting device 3a is disposed, and is connected to the first light-emitting device 3a through the via hole 52 in the passivation layer 5. The first part 21 extends along the side wall of the opening 41 to the side of the planarization layer 4 away from the driving backplane 1. In this case, one end of the first part 21 is located between the driving backplane 1 and the passivation layer 5, and the remaining part of the connection electrode 2 is located between the passivation layer 5 and the planarization layer 4.

[0098] At least two light-emitting devices 3 may include a first light-emitting device 3a and a second light-emitting device 3b. The first light-emitting device 3a is located on the side of the first part 21 away from the driving backplane 1, and the second light-emitting device 3b is located on the side of the second part 22 away from the driving backplane 1. In this way, the second light-emitting device 3b is electrically connected to the driving electrode 13 through the second part 22, so that the pixel circuit is electrically connected to the second light-emitting device 3b through the driving electrode 13 and the second part 22.

[0099] In this case, the display panel may further include an electrode layer 7. The electrode layer 7 may include a first electrode 71 and a second electrode 72, which are spaced apart, that is, there is no connection between the first electrode 71 and the second electrode 72. The first electrode 71 is disposed on a side of the first light-emitting device 3a away from the driving backplane 1, such that the first electrode 71 is electrically connected to the first light-emitting device 3a. The second electrode 72 is disposed on a side of the second light-emitting device 3b away from the driving backplane 1, such that the second electrode 72 is electrically connected to the second light-emitting device 3b. And the second electrode 72 is electrically connected to the first portion 21. Specifically, the first portion 21 is electrically connected to the second electrode 72 through a via 52 in the passivation layer 5. Thus, the electrical connection between the first light-emitting device 3a and the second light-emitting device 3b is achieved through the first portion 21.

[0100] Of course, in the case where a third light-emitting device 3c is provided, the electrical connection between the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c can be achieved through two first portions 21.

[0101] Optionally, the positive and negative electrodes of the second light-emitting device 3b are arranged in the same way as those of the first light-emitting device 3a in the second direction Y. For example, the first N-type semiconductor layer 3a3, the first light-emitting layer 3a2, and the first P-type semiconductor layer 3a1 of the first light-emitting device 3a may be sequentially stacked in a direction away from the driving backplane 1, and the second N-type semiconductor layer 3b3, the second light-emitting layer 3b2, and the second P-type semiconductor layer 3b1 of the second light-emitting device 3b may be sequentially stacked in a direction away from the driving backplane 1. Thus, the series connection between the first light-emitting device 3a and the second light-emitting device 3b is achieved through the connection electrode 2.

[0102] Of course, in the case where a third light-emitting device 3c is provided, the positive and negative electrodes of the third light-emitting device 3c are arranged in the same way as those of the first light-emitting device 3a in the second direction Y. For example, the first N-type semiconductor layer 3a3, the first light-emitting layer 3a2, and the first P-type semiconductor layer 3a1 of the first light-emitting device 3a may be sequentially stacked in a direction away from the driving backplane 1, and the third N-type semiconductor layer 3c3, the third light-emitting layer 3c2, and the third P-type semiconductor layer 3c1 of the third light-emitting device 3c may be sequentially stacked in a direction away from the driving backplane 1. Thus, the series connection between the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c can be achieved through two first portions 21.

[0103] Optionally, the display panel may further include a reflective layer 6 disposed between the driving backplane 1 and the passivation layer 5. A reflective opening 61 is provided on the reflective layer 6, and the light-emitting device 3 is located within the reflective opening 61, such that the light emitted from the light-emitting device 3 can reach the sidewall of the reflective opening 61, and the sidewall of the reflective opening 61 can reflect the light to the target light-emitting direction, thereby improving the light-emitting efficiency of each light-emitting device 3 and further improving the light-emitting efficiency of the entire display panel.

[0104] The reflective layer 6 can be a reflective ramp (Bank), a Bragg reflective layer, or a metal reflective layer. The Bragg reflective layer is an optical structure commonly used to reflect light of a specific wavelength. The Bragg reflective layer is composed of multiple stacked materials with alternating refractive indices. The reflective ramp (Bank) is like the structure shown in Figures 1 - 3 In this case, the material of the reflective layer 6 can be an organic material with a reflective function. The metal reflective layer is a metal layer with a relatively high reflectivity. For example, Ag (silver), Al (aluminum), etc.

[0105] Based on the same inventive concept, the exemplary embodiments of the present disclosure provide a method for manufacturing a display panel. This manufacturing method is used to manufacture the display panel described in any one of the above, and referring to Figure 5 as shown, this manufacturing method may include the following steps:

[0106] Step S10: Provide a first substrate 1a, and form at least two light-emitting devices 3 on one side of the first substrate 1a.

[0107] Step S20: Form a connection electrode 2 on the side of at least two light-emitting devices 3 facing away from the substrate 1b.

[0108] Step S30: Provide a second substrate 11, and form a driving electrode 13 on one side of the second substrate 11.

[0109] Step S40: Bond the connection electrode 2 and the driving electrode 13.

[0110] The following gives examples of each step of the method for manufacturing the display panel.

[0111] Step S10: Provide a first substrate 1a, and form at least two light-emitting devices 3 on one side of the first substrate 1a.

[0112] In this exemplary embodiment, the material of the first substrate 1a may include inorganic materials. For example, the inorganic material may be glass, quartz, or metal, etc.

[0113] The specific process of forming the light-emitting device 3 is as follows: Provide a substrate 1b, and the material of the substrate 1b can be sapphire, that is, the substrate 1b can be a sapphire substrate 1b; of course, the material of the substrate 1b can also be silicon carbide, silicon, etc. Refer to Figure 6 As shown, a buffer layer 2a, an N-type semiconductor material layer 2b, a light-emitting material layer 2c, a P-type semiconductor material layer 2d, and an electrode material layer 2e are sequentially epitaxially grown on one side of the substrate 1b. Refer to Figure 7 As shown, a first substrate 1a is attached to the side of the electrode material layer 2e facing away from the substrate 1b. Refer to Figure 8 As shown, the substrate 1b and the buffer layer 2a are removed so that the N-type semiconductor material layer 2b becomes the outermost layer.

[0114] Refer to Figure 9 As shown, the N-type semiconductor material layer 2b, the light-emitting material layer 2c, and the P-type semiconductor material layer 2d are patterned to form at least two light-emitting devices 3 with a vertical structure, that is, at least two light-emitting devices 3 are formed on one side of the first substrate 1a. The patterning process can be lithography.

[0115] Optionally, in some exemplary embodiments of the present disclosure, refer to Figure 10 As shown, after forming the light-emitting device 3, the electrode material layer 2e can be patterned to form a first electrode 71, a second electrode 72, and a third electrode 73 arranged at intervals. Refer to Figure 11 As shown, after forming the light-emitting device 3, the manufacturing method may further include forming a passivation layer 5 that covers at least two light-emitting devices 3, and then patterning the passivation layer 5 to form vias 52. The passivation layer 5 can repair the sidewall defects of the light-emitting device 3 and improve the light-emitting efficiency of the light-emitting device 3.

[0116] Of course, in some other exemplary embodiments of the present disclosure, refer to Figure 16 As shown, the electrode material layer 2e may not be patterned, and the passivation layer 5 is directly formed; that is, after forming the light-emitting device 3, the passivation layer 5 is directly formed, the passivation layer 5 covers at least two light-emitting devices 3, and then the passivation layer 5 is patterned to form vias 52.

[0117] With such a setting, the passivation layer 5 can better cover the sidewalls of the light-emitting device 3, reduce the process difficulty, avoid the poor coverage of the passivation layer 5 on the sidewalls of the light-emitting device 3 caused by the high step difference and inverted trapezoidal structure of the light-emitting device 3, and avoid the reliability problems caused by the exposure of the sidewalls of the light-emitting device 3.

[0118] Optionally, in some exemplary embodiments of the present disclosure, refer to Figure 25As shown, after forming the passivation layer 5, the manufacturing method may further include forming a reflective layer 6 on a side of the passivation layer 5 facing away from the first substrate 1a. A reflective opening 61 is provided on the reflective layer 6. Specifically, a reflective material layer is formed on the side of the passivation layer 5 facing away from the first substrate 1a, and the reflective material layer is patterned to form the reflective opening 61 on the reflective layer 6. The reflective layer 6 is located within a recessed portion 51 formed in the passivation layer 5. The light-emitting device 3 is located within the reflective opening 61, such that light emitted from the light-emitting device 3 can be incident on a sidewall of the reflective opening 61, and the sidewall of the reflective opening 61 can reflect the light to a target light-emitting direction, thereby improving the light-emitting efficiency of each light-emitting device 3 and further improving the light-emitting efficiency of the entire display panel.

[0119] In this case, referring to Figure 26 As shown, the manufacturing method may further include forming a planarization layer 4. The planarization layer 4 fills a gap between the reflective layer 6 and the light-emitting device 3, that is, the planarization layer 4 fills into the reflective opening 61 to fill a portion of the reflective opening 61 not filled by the light-emitting device 3. A relatively flat plane can be formed through the planarization layer 4, facilitating the formation of the subsequent connection electrode 2 and facilitating the bonding of the subsequent light-emitting device 3 to the driving backplane 1.

[0120] Referring to Figure 27 As shown, then, the passivation layer 5 is patterned to form a via 52.

[0121] Step S20, forming a connection electrode 2 on a side of at least two of the light-emitting devices 3 facing away from the substrate 1b.

[0122] In the present exemplary embodiment, referring to Figure 12 and Figure 17 As shown, a connection electrode material layer is formed on a side of the passivation layer 5 facing away from the first substrate 1a, and the connection electrode material layer is patterned to form a connection electrode 2 including a first portion 21 and a second portion 22 arranged at intervals.

[0123] Optionally, in some exemplary embodiments of the present disclosure, referring to Figure 13 and Figure 18As shown, after forming the connection electrode 2, the manufacturing method may further include forming a reflective layer 6 on a side of the connection electrode 2 facing away from the first substrate 1a. A reflective opening 61 is provided on the reflective layer 6. Specifically, a reflective material layer is formed on the side of the connection electrode 2 facing away from the first substrate 1a, and the reflective material layer is patterned so that the reflective opening 61 is formed on the reflective layer 6. The reflective layer 6 is located in a recess 51 formed by the passivation layer 5. The light-emitting device 3 is located in the reflective opening 61, so that the light emitted from the light-emitting device 3 can be incident on the sidewall of the reflective opening 61, and the sidewall of the reflective opening 61 can reflect the light to the target light-emitting direction, thereby improving the light-emitting efficiency of each light-emitting device 3 and further improving the light-emitting efficiency of the entire display panel.

[0124] In this case, referring to Figure 14 and Figure 19 shown, the manufacturing method may further include forming a planarization layer 4. The planarization layer 4 fills the gap between the reflective layer 6 and the light-emitting device 3, that is, the planarization layer 4 fills into the reflective opening 61 to fill the part in the reflective opening 61 that is not filled by the light-emitting device 3. A relatively flat plane can be formed through the planarization layer 4, and it is also convenient for subsequent bonding of the light-emitting device 3 and the driving backplane 1.

[0125] In some exemplary embodiments of the present disclosure, referring to Figure 28 shown, a connection electrode material layer is formed on a side of the planarization layer 4 facing away from the first substrate 1a, and the connection electrode material layer is patterned to form a connection electrode 2 including a first part 21 and a second part 22 arranged at intervals.

[0126] Step S30: Provide a second substrate 11, and form a driving electrode 13 on one side of the second substrate 11.

[0127] In this exemplary embodiment, the specific structure of the second substrate 11 has been described in detail above, so it will not be elaborated here. Referring to Figure 15 and Figure 20 , Figure 29 shown, a driving electrode 13 is formed on one side of the second substrate 11; specifically, an insulating layer 12 may be formed on one side of the second substrate 11, and then the driving electrode 13 is formed on the insulating layer 12.

[0128] In the case where a driving circuit is provided, a driving circuit is formed on one side of the second substrate 11, and then the driving electrode 13 is formed. The driving electrode 13 is electrically connected to the driving circuit.

[0129] Step S40: Bond the connection electrode 2 and the driving electrode 13.

[0130] In this exemplary embodiment, referring toFigure 15 and Figure 20 、 Figure 29 As shown in Figure 29 , using a high-precision alignment system, the connection electrodes 2 on the first substrate 1a are aligned with the driving electrodes 13 on the second substrate 11. Using a constant-temperature laser system, the connection electrodes 2 and the driving electrodes 13 are heated to a certain temperature, and bonding is achieved by precisely controlling the processing temperature and processing time.

[0131] Finally, the first substrate 1a can be removed.

[0132] In the present exemplary embodiment, referring to Figures 1 - 3 As shown in Figures 1 - 3 , the first substrate 1a is removed, exposing the electrode layer 7.

[0133] Referring to Figure 21 As shown in Figure 21 , in some exemplary embodiments of the present disclosure, the electrode material layer 2e is not patterned in the previous step. Referring to Figure 2 As shown in Figure 2 , after removing the first substrate 1a, the electrode material layer 2e can also be patterned to form the first electrode 71, the second electrode 72, and the third electrode disposed at intervals.

[0134] Of course, in some other exemplary embodiments of the present disclosure, after removing the first substrate 1a, an insulating layer 12 and the like can also be formed on the side of the electrode layer 7 facing away from the second substrate 11.

[0135] Optionally, referring to Figures 22 - 24 As shown in Figures 22 - 24 , forming at least two light-emitting devices 3 on one side of the first substrate 1a may include: Referring to Figure 22 As shown in Figure 22 , forming the first light-emitting device 3a and the third light-emitting device 3c on one side of the first substrate 1a, that is, patterning the N-type semiconductor material layer 2b, the light-emitting material layer 2c, and the P-type semiconductor material layer 2d to form the first light-emitting device 3a and the third light-emitting device 3c with a vertical structure. Referring to Figure 23 As shown in Figure 23 , patterning the electrode material layer 2e to form the first electrode 71 and the second electrode 72 disposed at intervals.

[0136] Referring to Figure 24 As shown in Figure 24 , bonding the second light-emitting device 3b on one side of the first substrate 1a. Specifically, the second light-emitting device 3b can be bonded on the side of the second electrode 72 facing away from the first substrate 1a, such that the second electrode 72 directly electrically connects the second light-emitting device 3b and the third light-emitting device 3c.

[0137] In this case, the positive and negative electrodes of the second light-emitting device 3b are arranged in the second direction Y opposite to those of the first light-emitting device 3a, the positive and negative electrodes of the second light-emitting device 3b are arranged in the second direction Y opposite to those of the third light-emitting device 3c, and the second direction Y is perpendicular to the first substrate 1a.

[0138] It should be noted that although the steps of the method for manufacturing the display panel in the present disclosure are described in a specific order in the drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution, etc.

[0139] Based on the same inventive concept, the exemplary embodiments of the present disclosure provide a display device, which may include the display panel described in any one of the above. The specific structure of the display panel has been described in detail above, and thus will not be elaborated here.

[0140] The specific type of the display device is not particularly limited, and any common display device types in the art may be used, such as mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc. Those skilled in the art can make corresponding selections according to the specific use of the display device, which will not be elaborated here.

[0141] It should be noted that in addition to the display panel, the display device further includes other necessary components and compositions. Taking a display as an example, specifically, such as a housing, a circuit board, a power cord, etc. Those skilled in the art can make corresponding supplements according to the specific use requirements of the display device, which will not be elaborated here.

[0142] Compared with the prior art, the beneficial effects of the display device provided by the exemplary embodiments of the present invention are the same as those of the display panel provided by the above exemplary embodiments, and will not be elaborated here.

[0143] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily conceive of other embodiments of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed by the present disclosure. The specification and examples are only to be considered as exemplary, and the true scope and spirit of the present disclosure are pointed out by the appended claims.

Claims

1. A display panel, characterized in that: include: A driving backplane, including driving electrodes; A connecting electrode, disposed on one side of the driving backplane, wherein the connecting electrode is electrically connected to the driving electrode; At least two light emitting devices are provided on a side of the connecting electrode away from the driving backplane, and the connecting electrode electrically connects at least two of the light emitting devices.

2. The display panel according to claim 1, characterized in that: The display panel further includes: A planarization layer is provided on one side of the driving backplane, the planarization layer is provided with an opening, and the connecting electrode extends into the opening; A passivation layer is arranged on a side of the planarization layer away from the driving backplane, and covers at least a portion of the side wall of the opening to form a recessed portion, at least a portion of the light-emitting device is located in the recessed portion, and a via is provided on the passivation layer, and the connecting electrode is electrically connected to the light-emitting device through the via; a cross-sectional area of ​​the light-emitting device along a first direction increases with an increase in the distance from the driving backplane, and the first direction is parallel to the driving backplane.

3. The display panel according to claim 2, characterized in that: The connecting electrode is arranged between the driving backplane and the planarization layer; the at least two light-emitting devices include a first light-emitting device, a second light-emitting device and a third light-emitting device; the connecting electrode includes a first part and a second part arranged at intervals; the first light-emitting device is located at a side of the first part away from the driving backplane, the second light-emitting device is located at a side of the first part away from the driving backplane, the third light-emitting device is located at a side of the second part away from the driving backplane, and the second part is electrically connected to the driving electrode; The display panel further includes: The electrode layer includes a first electrode and a second electrode which are arranged at intervals, wherein the first electrode is arranged on a side of the first light-emitting device away from the driving backplane, and the second electrode is arranged on a side of the second light-emitting device and the third light-emitting device away from the driving backplane, and electrically connects the second light-emitting device and the third light-emitting device.

4. The display panel according to claim 3, characterized in that: The positive and negative poles of the second light-emitting device are arranged opposite to the positive and negative poles of the first light-emitting device in the second direction, and the positive and negative poles of the second light-emitting device are arranged opposite to the positive and negative poles of the third light-emitting device in the second direction, and the second direction is arranged perpendicular to the driving backplane.

5. The display panel according to claim 2, characterized in that: A portion of the connecting electrode is disposed between the planarization layer and the passivation layer; the connecting electrode comprises a first portion and a second portion which are spaced apart, an end portion of the first portion is located in the opening, the first portion extends to a side of the planarization layer away from the driving backplane, the at least two light-emitting devices comprise a first light-emitting device and a second light-emitting device, the first light-emitting device is located on a side of the first portion away from the driving backplane, the second light-emitting device is located on a side of the second portion away from the driving backplane, and the second portion is electrically connected to the driving electrode; The display panel further includes: The electrode layer includes a first electrode and a second electrode which are arranged at intervals, wherein the first electrode is arranged on a side of the first light emitting device away from the driving backplane, the second electrode is arranged on a side of the second light emitting device away from the driving backplane, and the second electrode is electrically connected to the first part.

6. The display panel according to any one of claims 2 to 5, characterized in that: The display panel further includes: The reflective layer is arranged between the driving back plate and the passivation layer. A reflective opening is arranged on the reflective layer. The light emitting device is located in the reflective opening.

7. A method for preparing a display panel, used for preparing the display panel according to any one of claims 1 to 6, characterized in that: include: Providing a first substrate, and forming at least two light emitting devices on one side of the first substrate; Forming a connecting electrode on a side of at least two of the light-emitting devices away from the base substrate; Providing a second substrate, and forming a driving electrode on one side of the second substrate; The connecting electrode is bonded to the driving electrode.

8. The method for preparing a display panel according to claim 7, characterized in that: After forming the light emitting device, the preparation method further comprises: forming a passivation layer, wherein the passivation layer covers at least two of the light-emitting devices; The passivation layer is patterned to form a via hole.

9. The method for preparing a display panel according to claim 8, characterized in that: After forming the connecting electrode, the preparation method further comprises: A reflective layer is formed on a side of the connecting electrode facing away from the first substrate, the reflective layer is provided with a reflective opening, and the light emitting device is located in the reflective opening; A planarization layer is formed, wherein the planarization layer fills a gap between the reflective layer and the light emitting device.

10. The method for preparing a display panel according to claim 8, characterized in that: After forming the passivation layer, the preparation method further comprises: A reflective layer is formed on a side of the passivation layer away from the first substrate, wherein a reflective opening is provided on the reflective layer, and the light emitting device is located in the reflective opening; A planarization layer is formed, wherein the planarization layer fills a gap between the reflective layer and the light emitting device.

11. The method for preparing a display panel according to any one of claims 7 to 10, characterized in that: When forming at least two of the light-emitting devices, forming an electrode material layer; After forming at least two of the light-emitting devices, the preparation method further comprises: Performing patterning on the electrode material layer to form a first electrode and a second electrode that are spaced apart; Alternatively, after removing the first substrate, the preparation method further comprises: The electrode material layer is patterned to form a first electrode and a second electrode that are spaced apart.

12. The method for preparing a display panel according to any one of claims 7 to 10, characterized in that: At least two light emitting devices are formed on one side of the first substrate, including: forming a first light emitting device and a third light emitting device on one side of the first base substrate; A second light-emitting device is bonded to one side of the first substrate, the positive and negative electrodes of the second light-emitting device are arranged opposite to the positive and negative electrodes of the first light-emitting device in a second direction, the positive and negative electrodes of the second light-emitting device are arranged opposite to the positive and negative electrodes of the third light-emitting device in the second direction, and the second direction is arranged perpendicular to the first substrate.

13. A display device, characterized in that: include: The display panel is the display panel according to any one of claims 1 to 6.

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