Display device

Abstract

The invention relates to a display device. The display device includes: a light emitting element disposed in an active area of a substrate; a touch sensor disposed on the light emitting element; an encapsulation unit disposed between the light emitting element and the touch sensor, the encapsulation unit including a plurality of inorganic encapsulation layers and at least one organic encapsulation layer disposed between the inorganic encapsulation layers; a touch pad disposed in the pad area of the substrate and connected to the touch sensor via a routing line; and a first bank and a second bank disposed between the active region and the pad region, a total thickness of the at least one inorganic insulating layer disposed on a region above each of the first bank and the second bank is different from a total thickness of the at least one inorganic insulating layer disposed in a trench region between the first bank and the second bank. Accordingly, a photoresist for forming a routing line may be formed to have a consistent thickness on a region above each of the banks and a trench region between the banks, thereby improving productivity.

Description

[0001] This application is a divisional application of Chinese invention patent application No. 201911023622.5, filed on October 25, 2019, with the invention name “Display Device”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the benefit of Korean Patent Application No. 10-2018-0137407, filed on Nov. 9, 2018, which is hereby incorporated by reference as if fully set forth herein. Technical Field

[0004] The present invention relates to a display device, and more particularly to a display device for improving productivity. Background Art

[0005] A touch screen is an input device through which a user can input commands by selecting instructions displayed on the screen of a display device using a hand or an object. That is, the touch screen converts the contact position of a direct contact human hand or object into an electrical signal, and receives the selected instruction based on the contact position as an input signal. Such a touch screen can replace a separate input device (such as a keyboard or a mouse) that is connected to a display device and operated, and thus the application range of the touch screen is increasing.

[0006] Therefore, many attempts are being made to install a touch screen in a display panel such as a liquid crystal display panel or an organic light emitting display panel in order to improve productivity or reduce the size of a display device.

[0007] When the touch screen is installed in the organic light emitting display panel, the signal line of the touch screen is arranged on the bank of the organic light emitting display panel. However, in this case, the residual film of the photoresist used to form the touch screen is likely to remain in the deep grooves between the banks. If the exposure is increased in order to prevent the residual film of the photoresist used to form the touch screen from being left, the productivity will be reduced. Summary of the invention

[0008] SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a display device that substantially obviates one or more problems due to limitations and disadvantages of the related art.

[0009] An object of the present invention is to provide a display device for improving productivity.

[0010] Additional advantages, objects and features of the present invention will be described in part in the following description, and will become apparent to those skilled in the art in part when studying the following or can be learned from the practice of the present invention. The objects and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and claims and the drawings.

[0011] To achieve these purposes and other advantages and in accordance with the object of the present invention, as embodied and broadly described herein, according to one aspect of the present invention, a display device includes: a light emitting element disposed in an active area of ​​a substrate; a touch sensor disposed on the light emitting element; an encapsulation unit disposed between the light emitting element and the touch sensor, the encapsulation unit including a plurality of inorganic encapsulation layers and at least one organic encapsulation layer disposed between the inorganic encapsulation layers; a touch pad disposed in a pad area of ​​the substrate, the touch pad being connected to the touch sensor via a routing line; and a first bank and a second bank disposed between the active area and the pad area, wherein the total thickness of at least one inorganic insulating layer disposed on an area above each of the first bank and the second bank is different from the total thickness of at least one inorganic insulating layer disposed in a groove area between the first bank and the second bank. Thus, a photoresist for forming a routing line can be formed to have a uniform thickness on the area above each of the bank and the groove area between the bank, thereby improving productivity.

[0012] Alternatively, a total thickness of at least one inorganic insulating layer disposed on a region above each of the first bank and the second bank may be smaller than a total thickness of at least one inorganic insulating layer disposed in a trench region between the first bank and the second bank.

[0013] Optionally, the total thickness of at least one inorganic insulating layer disposed between the first and second embankments and the routing line may be less than the total thickness of at least one inorganic insulating layer disposed between a thin film layer exposed between the first and second embankments and the routing line.

[0014] Optionally, the total number of at least one inorganic insulating layer disposed between the first and second embankments and the routing line may be less than the total number of at least one inorganic insulating layer disposed between the thin film layer exposed between the first and second embankments and the routing line.

[0015] Optionally, the touch sensor includes a touch insulating film arranged on the packaging unit, and a touch sensing line and a touch driving line arranged so that the touch insulating film is interposed therebetween, wherein the at least one inorganic insulating layer includes at least one of the inorganic packaging layer and the touch insulating film.

[0016] Optionally, one of the inorganic encapsulation layers may be disposed between the first embankment, the second embankment and the routing line, wherein the inorganic encapsulation layer and the touch insulation film are disposed between the thin film layer exposed between the first embankment and the second embankment and the routing line.

[0017] Optionally, the touch pad includes:

[0018] A lower touch pad electrode disposed on the substrate; and

[0019] An upper touch pad electrode connected to the lower touch pad electrode, the lower touch pad electrode being exposed through a touch contact hole penetrating the inorganic encapsulation layer and the touch insulating film.

[0020] Optionally, the display device also includes: a touch buffer film arranged on the encapsulation unit, wherein the touch sensor includes: a touch insulating film arranged on the touch buffer film; and a touch sensing line and a touch driving line arranged so that the touch insulating film is interposed between the two, wherein the at least one inorganic insulating layer includes at least one of the inorganic encapsulation layer, the touch buffer film and the touch insulating film.

[0021] Optionally, at least one of the inorganic encapsulation layers is arranged between the first embankment, the second embankment and the routing line, wherein the inorganic encapsulation layer, the touch buffer film and the touch insulation film are arranged between the thin film layer exposed between the first embankment and the second embankment and the routing line.

[0022] Optionally, the touch pad includes: a lower touch pad electrode disposed on the substrate; and an upper touch pad electrode connected to the lower touch pad electrode, the lower touch pad electrode being exposed through a touch contact hole penetrating the touch buffer film and the touch insulating film.

[0023] Optionally, the thin film layer exposed between the first bank and the second bank is electrically connected to a cathode of the light emitting element.

[0024] Optionally, the display device further includes a color filter disposed above or below the touch sensor.

[0025] Optionally, the display device further comprises a thin film transistor arranged in the active region and connected to the light emitting element.

[0026] Optionally, the display device further includes a low-voltage power supply line disposed on the substrate and below the first bank and the second bank.

[0027] Optionally, the display device further includes an auxiliary electrode which is provided between the low voltage power supply line and the cathode of the light emitting element and electrically connects the low voltage power supply line and the cathode to each other.

[0028] Alternatively, the second bank may include a first sub-bank and a second sub-bank, and the auxiliary electrode is partially disposed between the first sub-bank and the second sub-bank.

[0029] Optionally, the second bank may be closer to the pad region than the first bank.

[0030] Optionally, the second bank may be higher than the first bank.

[0031] Optionally, the auxiliary electrode may be at least partially disposed on a side surface of the first sub-bank of the second bank.

[0032] Optionally, the routing line above the second bank may be higher than the routing line above the first bank.

[0033] Optionally, the second bank may cover a side surface of the low-voltage power supply line.

[0034] Optionally, the touch pad may include a lower touch pad electrode and an upper touch pad electrode extending from the routing line, the upper touch pad electrode being electrically connected to the lower touch pad electrode, the lower touch pad electrode being formed of the same material as a source and a drain of a driving thin film transistor disposed in the active area and connected to the light-emitting element, and the upper touch pad electrode being formed of the same material as the routing line.

[0035] Optionally, the low voltage power supply line and the source and the drain of the driving thin film transistor may be formed of the same material.

[0036] According to another aspect of the present invention, a display device is provided, comprising: a light-emitting element arranged in an active area of ​​a substrate; a touch sensor arranged on the light-emitting element; an encapsulation unit arranged between the light-emitting element and the touch sensor, the encapsulation unit comprising a plurality of inorganic encapsulation layers and at least one organic encapsulation layer arranged between the inorganic encapsulation layers; a touch pad arranged in a pad area of ​​the substrate, the touch pad being connected to the touch sensor via a routing line; a first embankment and a second embankment arranged between the active area and the pad area; a low-voltage power supply line arranged on the substrate and below the first embankment and the second embankment; and an auxiliary electrode arranged between the low-voltage power supply line and the first embankment and the second embankment and electrically connecting the low-voltage power supply line and the cathode of the light-emitting element; wherein the second embankment comprises a first sub-embankment and a second sub-embankment, and the auxiliary electrode is partially arranged between the first sub-embankment and the second sub-embankment.

[0037] Optionally, a total thickness of at least one inorganic insulating layer disposed on a region above each of the first bank and the second bank is different from a total thickness of at least one inorganic insulating layer disposed in a trench region between the first bank and the second bank.

[0038] It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings, which are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this application, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention. In the drawings:

[0040] Figure 1 is a perspective view showing an organic light emitting display device having a touch sensor according to the present invention;

[0041] Figure 2 is a plan view showing an organic light emitting display device having a touch sensor according to a first embodiment of the present invention;

[0042] Figure 3 Shown along Figure 2 A cross-sectional view taken along lines II-I' and II-II';

[0043] Figure 4 is a cross-sectional view showing an organic light emitting display device having a touch sensor according to a second embodiment of the present invention;

[0044] FIG. 5A to FIG. 5Cis a cross-sectional view showing a method of manufacturing a comparative example, in which a first inorganic encapsulation layer and a second inorganic encapsulation layer, a touch buffer film and a touch insulating film are provided on Figure 4 on the first and second banks shown;

[0045] FIG. 6A to FIG. 6C is a cross-sectional view showing a method of manufacturing an embodiment, wherein at least one of a first inorganic encapsulation layer and a second inorganic encapsulation layer is provided on Figure 4 on the first and second banks shown;

[0046] Figure 7 is a cross-sectional view showing an organic light emitting display device having a touch sensor according to a third embodiment of the present invention;

[0047] FIG. 8A to FIG. 8D It shows the manufacturing Figure 4 A cross-sectional view of the method of manufacturing an organic light emitting display device with a touch sensor; and

[0048] Fig. 9A and Fig. 9B They are shown respectively Figure 4 FIG. 1 is a plan view and a cross-sectional view of another example of the first touch electrode, the second touch electrode and the second bridge portion. DETAILED DESCRIPTION

[0049] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used throughout the drawings to refer to the same or like parts.

[0050] Figure 1 is a perspective view showing an organic light emitting display device having a touch sensor according to the present invention.

[0051] Figure 1 The organic light emitting display device with a touch sensor shown in the figure is touched during Figure 2 The touch electrodes 152e and 154e shown sense the change of the mutual capacitance Cm (touch sensor) in response to the user's touch to sense whether there is a touch and the touch position. Then, Figure 1 The organic light emitting display device with a touch sensor shown displays an image through unit pixels, each of which includes a light emitting element 120. Each unit pixel may include red (R), green (G), and blue (B) sub-pixels PXL, or may include red (R), green (G), blue (B), and white (W) sub-pixels PXL.

[0052] to this end, Figure 1The organic light emitting display device shown includes: a plurality of sub-pixels PXL arranged in a matrix on a substrate 111 , an encapsulation unit 140 disposed on the sub-pixels PXL, and a mutual inductance capacitor array Cm disposed on the encapsulation unit 140 .

[0053] Each of the sub-pixels PXL includes a pixel driving circuit and a light emitting element 120 connected to the pixel driving circuit.

[0054] The pixel driving circuit includes a switching transistor T1, a driving transistor T2, and a storage capacitor Cst. In the present invention, a structure in which the pixel driving circuit includes two transistors T and one capacitor C is described by way of example, but the present invention is not limited thereto. That is, a pixel driving circuit having a structure in which three or more transistors T and one or more capacitors C are provided (such as a 3T1C structure or a 3T2C structure) may be used.

[0055] When a scan pulse is supplied to the scan line SL, the switching transistor T1 is turned on and supplies the data signal supplied to the data line DL to the storage capacitor Cst and the gate electrode of the driving transistor T2.

[0056] The driving transistor T2 controls the current I supplied from the high voltage (VDD) power supply line to the light emitting element 120 in response to the data signal supplied to the gate of the driving transistor T2, thereby adjusting the amount of light emitted from the light emitting element 120. Then, even if the switching transistor T1 is turned off, the driving transistor T2 can maintain the emission of light of the light emitting element 120 by supplying a constant amount of current to the light emitting element 120 using the voltage charged in the storage capacitor Cst until the next frame data signal is supplied.

[0057] like Figure 3 As shown, the driving thin film transistor T2 or 130 includes: a semiconductor layer 134 disposed on a buffer layer 112; a gate electrode 132 overlapping the semiconductor layer 134, wherein a gate insulating film 102 is interposed between the semiconductor layer 134 and the gate electrode 132; and a source electrode 136 and a drain electrode 138 formed on the interlayer insulating film 114 to contact the semiconductor layer 134. Here, the semiconductor layer 134 is formed of at least one of an amorphous semiconductor material, a polycrystalline semiconductor material, and an oxide semiconductor material.

[0058] The light emitting element 120 includes an anode 122 , at least one light emitting stack 124 formed on the anode 122 , and a cathode 126 formed on the light emitting stack 124 .

[0059] The anode 122 is electrically connected to the drain 138 of the driving thin film transistor T2 or 130 , and the drain 138 is exposed through a pixel contact hole formed through the pixel planarization layer 118 .

[0060] The light emitting stack 124 is formed on the anode 122 in a light emitting region defined by the bank 128. The light emitting stack 124 is formed by sequentially stacking a hole-related layer, an organic light emitting layer, and an electron-related layer on the anode 122 or stacking them in the reverse order. In addition, the light emitting stack 124 may include a first light emitting stack and a second light emitting stack, the first light emitting stack and the second light emitting stack facing each other and a charge generating layer interposed therebetween. In this case, the organic light emitting layer of any one of the first light emitting stack and the second light emitting stack generates blue light, and the organic light emitting layer of the other of the first light emitting stack and the second light emitting stack generates yellow-green light, thereby generating white light through the first light emitting stack and the second light emitting stack. Since the white light generated in the light emitting stack 124 is incident on a color filter located above or below the light emitting stack 124, a color image can be realized. In addition, color light corresponding to each sub-pixel can be generated in each light emitting stack 124 to form a color image without a separate color filter. That is, the light emitting stack 124 of the red (R) sub-pixel may generate red light, the light emitting stack 124 of the green (G) sub-pixel may generate green light, and the light emitting stack 124 of the blue (B) sub-pixel may generate blue light.

[0061] The cathode 126 may be formed to face the anode 122, wherein the light emitting stack 124 is interposed between the cathode 126 and the anode 122. The cathode 126 is connected to a low voltage (VSS) power supply line 106 via an auxiliary electrode 108. The low voltage (VSS) power supply line 106 is formed of the same material as the source 136 and the drain 138 on the substrate 111. The auxiliary electrode 108 is disposed between the low voltage (VSS) power supply line 106 and the cathode 126, and electrically connects the low voltage (VSS) power supply line 106 and the cathode 126 to each other. The auxiliary electrode 108 is formed of the same material as the anode 122.

[0062] The encapsulation unit 140 prevents external moisture or oxygen from entering the light emitting element 120 that is susceptible to external moisture or oxygen. To this end, the encapsulation unit 140 includes a plurality of inorganic encapsulation layers 142 and 146 and an organic encapsulation layer 144 disposed between the inorganic encapsulation layers 142 and 146. The inorganic encapsulation layer 146 is the uppermost layer. Here, the encapsulation unit 140 includes at least two inorganic encapsulation layers 142 and 146 and at least one organic encapsulation layer 144. In the present invention, the following structure of the encapsulation unit 140 will be described by way of example, i.e., a structure in which the organic encapsulation layer 144 is disposed between the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146.

[0063] The first inorganic encapsulation layer 142 is formed on the substrate 111 on which the cathode 126 is formed so as to be closest to the light emitting element 120. The first inorganic encapsulation layer 142 is made of an inorganic insulating material (such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON) or aluminum oxide (Al2O3)) that can be deposited at low temperature. 2 O 3 Therefore, since the first inorganic encapsulation layer 142 is deposited in a low temperature atmosphere, damage to the light emitting stack 124 that is susceptible to a high temperature atmosphere can be prevented during the process of depositing the first inorganic encapsulation layer 142.

[0064] The organic encapsulation layer 144 is used to suppress stress between corresponding layers caused by bending of the organic light emitting display device and to increase planarization performance. The organic encapsulation layer 144 is formed of an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene or silicon oxycarbide (SiOC).

[0065] If the organic encapsulation layer 144 is formed by an inkjet method, a plurality of banks 162 and 164 are formed to prevent the organic encapsulation layer 144 in a liquid state from flowing into the edge region of the substrate 111. The banks 162 and 164 are disposed closer to the edge region of the substrate 111 than the organic encapsulation layer 144. The banks 162 and 164 can prevent the organic encapsulation layer 144 from flowing into a pad region disposed in the edge region of the substrate 111 and in which the touch pad 170 and the display pad 180 are disposed. To this end, as Figure 2As shown, the embankments 162 and 164 may be formed to completely surround the active area in which the light emitting element 120 is disposed, or may be formed only between the active area and the pad area. In the case where the pad area (in which the touch pad 170 and the display pad 180 are disposed) is disposed on one side of the substrate 111, the embankments 162 and 164 may be disposed only on this side of the substrate 111. In the case where the pad area (in which the touch pad 170 and the display pad 180 are disposed) is disposed on both sides of the substrate 111, the embankments 162 and 164 are disposed on both sides of the substrate 111. Here, the embankments 162 and 164 spaced a predetermined distance apart from each other may be disposed parallel to each other. As shown Figure 2 and Figure 3 As shown, in the present invention, the structure in which the bank includes the closed first bank 162 surrounding the active area and the second bank 164 disposed between the first bank 162 and the pad area has been described by way of example, but the present invention is not limited thereto.

[0066] Each of the first bank 162 and the second bank 164 is formed to have a single-layer or multi-layer structure. The second bank 164, which is relatively close to the touch pad 170 and the display pad 180, is formed to be higher than the first bank 162, which is relatively far from the touch pad 170 and the display pad 180. To this end, the first bank 162 is formed of the same material and simultaneously formed with one of the pixel planarization layer 118 and the bank 128. The second bank 164 includes a first sub-bank 164a and a second sub-bank 164b, the first sub-bank 164a is formed of the same material and simultaneously formed with the pixel planarization layer 118, and the second sub-bank 164b is formed of the same material and simultaneously formed with the bank 128 on the first sub-bank 164a. The auxiliary electrode 108 may be disposed between the first sub-bank 164 a and the second sub-bank 164 b so that a height difference between an upper surface of the second bank 164 and an upper surface of the first bank 162 becomes larger.

[0067] The second inorganic encapsulating layer 146 is formed on the substrate 111 on which the organic encapsulating layer 144 is formed to cover the upper surface and the side surface of each of the organic encapsulating layer 144 and the first inorganic encapsulating layer 142. Therefore, the second inorganic encapsulating layer 146 minimizes or prevents external moisture or oxygen from entering the first inorganic encapsulating layer 142 and the organic encapsulating layer 144. The second inorganic encapsulating layer 146 is made of an inorganic insulating material (such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON) or aluminum oxide (Al 2 O 3 ))form.

[0068] During the formation of the second bridge portion 154b, at least one of the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146 is disposed to cover the lower touch pad electrode 172 and the lower display pad electrode 182 formed of the same material as the second bridge portion 154b. In this case, at least one of the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146 prevents the lower touch pad electrode 172 and the lower display pad electrode 182 from being exposed to the outside during the formation of the second bridge portion 154b. Therefore, during the process of etching the second bridge portion 154b, at least one of the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146 prevents the lower touch pad electrode 172 and the lower display pad electrode 182 from being etched, thereby preventing damage to the lower touch pad electrode 172 and the lower display pad electrode 182.

[0069] The touch sensor (mutual capacitance Cm) is provided on the packaging unit 140, and includes a touch insulating film 156 and also includes a touch sensing line 154 and a touch driving line 152, and the touch sensing line 154 and the touch driving line 152 are provided to cross each other with the touch insulating film 156 interposed therebetween. The touch sensor is charged with a touch driving pulse supplied to the touch driving line 152 and discharged to the touch sensing line 154.

[0070] The touch driving line 152 includes a plurality of first touch electrodes 152 e and a first bridge portion 152 b electrically connecting the first touch electrodes 152 e.

[0071] The first touch electrodes 152e are spaced apart from each other at regular intervals along the X-axis direction (first direction) on the touch insulating film 156. Each of the first touch electrodes 152e is electrically connected to an adjacent first touch electrode 152e via the first bridge portion 152b.

[0072] The first bridge portion 152b is disposed in the same plane as the second touch electrode 154e on the touch insulating film 156 and is electrically connected to the second touch electrode 154e without a separate contact hole. Since the first bridge portion 152b is disposed to overlap the bank portion 128, the aperture ratio can be prevented from being deteriorated by the first bridge portion 152b.

[0073] The touch sensing line 154 includes a plurality of second touch electrodes 154 e and a second bridge portion 154 b electrically connecting the second touch electrodes 154 e.

[0074] The second touch electrodes 154e are spaced apart from each other at regular intervals along the Y-axis direction (second direction) on the touch insulating film 156. Each of the second touch electrodes 154e is electrically connected to an adjacent second touch electrode 154e via the second bridge portion 154b.

[0075] The second bridge portion 154b is formed on the second inorganic encapsulation layer 146 and is exposed through the touch contact hole 150 penetrating the touch insulating film 156 to be electrically connected to the first touch electrode 152e. Similar to the first bridge portion 152b, the second bridge portion 154b is arranged to overlap with the bank portion 128, thereby preventing the aperture ratio from being deteriorated by the second bridge portion 154b.

[0076] The touch protection film 158 is formed to cover the touch electrodes 152e and 154e, the bridges 152b and 154b, and a portion of the routing line 160. The touch protection film 158 prevents the touch electrodes 152e and 154e and the bridges 152b and 154b from being damaged by external impact, moisture, etc. In addition, the touch protection film 158 is formed to expose the display pad 180 and the touch pad 170. The touch protection film 158 may be formed of an organic insulating material such as epoxy or acrylic, or may be formed of a polarizing film.

[0077] Each of the touch driving line 152 and the touch sensing line 154 is connected to a touch driving unit (not shown) via the routing line 160 and the touch pad 170 .

[0078] The touch pad 170 is connected to a signal transmission film (not shown) on which the touch driving unit is mounted. The touch pad 170 includes a lower touch pad electrode 172 and an upper touch pad electrode 174 .

[0079] The lower touch pad electrode 172 is disposed on at least one of the substrate 111, the buffer layer 112, and the interlayer insulating film 114 (which is disposed below the encapsulation unit 140). For example, the lower touch pad electrode 172 is disposed on the substrate 111 to contact the substrate 111. The lower touch pad electrode 172 and at least one of the gate electrode 132 and the source electrode 136 and the drain electrode 138 of the driving transistor T2 or 130 are formed of the same material and formed in the same plane to have a single-layer or multi-layer structure. For example, since the lower touch pad electrode 172 and the source electrode 136 and the drain electrode 138 are formed on the substrate 111 of the same material, the lower surface of the lower touch pad electrode 172 is in contact with the substrate 111.

[0080] The upper touch pad electrode 174 is electrically connected to the lower touch pad electrode 172, and the lower touch pad electrode 172 is exposed through a touch pad contact hole 176 that penetrates the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146 and the touch insulation film 156. The upper touch pad electrode 174 is formed of the same material as the routing line 160 and is formed by the same mask process as the routing line 160. Since the upper touch pad electrode 174 extends from the routing line 160, the upper touch pad electrode 174 is electrically connected to the routing line 160 without a separate contact hole.

[0081] The display pad 180 is also disposed in the non-active (frame) area in which the touch pad 170 is disposed. Figure 2 As shown in , the display pad 180 may be disposed between the touch pads 170, or the touch pad 170 may be disposed between the display pads 180. Alternatively, the touch pad 170 may be disposed on one side of the display panel, and the display pad 180 may be disposed on the opposite side of the display panel. The arrangement of the touch pad 170 and the display pad 180 is not limited to Figure 2 The structure shown, but can be modified in various ways according to the design choices made for the display device.

[0082] The display pad 180 may be formed in a different stacking structure from the touch pad 170, or may be formed in the same stacking structure as the touch pad 170, such as Figure 3 shown.

[0083] That is to say, Figure 3 The illustrated display pad 180 includes a lower display pad electrode 182 and an upper display pad electrode 184 .

[0084] The lower display pad electrode 182 is formed to be connected to at least one signal line of the scan line SL, the data line DL, the low voltage (VSS) power supply line 106, and the high voltage (VDD) power supply line in the active region in which the light emitting element 120 is formed. The lower display pad electrode 182 is formed of the same material as the gate electrode 132 and at least one of the source electrode 136 and the drain electrode 138 of the driving transistor T2 or 130, and is formed as a single layer or multi-layer structure on the substrate 111. For example, similar to the lower touch pad electrode 172, the lower display pad electrode 182 is formed on the substrate 111 and is formed of the same material as the source electrode 136 and the drain electrode 138.

[0085] The upper display pad electrode 184 is electrically connected to the lower display pad electrode 182 exposed through the display pad contact hole 186 penetrating the first and second inorganic encapsulation layers 142 and 146 and the touch insulation film 156. The upper display pad electrode 184 is formed of the same material as the routing line 160 and is formed by the same mask process as the routing line 160.

[0086] The routing line 160 transmits the touch driving pulse generated in the touch driving unit to the touch driving line 152 via the touch pad 170, and transmits the touch signal from the touch sensing line 154 to the touch driving unit via the touch pad 170. Therefore, the routing line 160 is formed between each of the first touch electrode 152e and the second touch electrode 154e and the touch pad 170, and electrically connects each of the first touch electrode 152e and the second touch electrode 154e and the touch pad 170. Here, as Figure 2 As shown, the routing line 160 extends from the first touch electrode 152e to at least one of the left and right sides of the active area AA, and is connected to the touch pad 170. In addition, the routing line 160 extends from the second touch electrode 154e to at least one of the upper and lower sides of the active area, and is connected to the touch pad 170. The arrangement of the routing line 160 can be variously changed according to the design selection made for the display device.

[0087] The routing line 160 is disposed to intersect the first bank 162 and the second bank 164 above the first bank 162 and the second bank 164 .

[0088] Here, the total thickness of at least one inorganic insulating layer disposed on the first bank 162 and the second bank 164 is different from the total thickness of at least one inorganic insulating layer disposed in the groove region formed between the first bank 162 and the second bank 164. That is, the total thickness of at least one inorganic insulating layer disposed between each of the first bank 162 and the second bank 164 and the routing line 160 is less than the total thickness of at least one inorganic insulating layer disposed between the auxiliary electrode 108 exposed between the first bank 162 and the second bank 164 and the routing line 160. To this end, the total number of at least one inorganic insulating layer disposed between each of the first bank 162 and the second bank 164 and the routing line 160 is less than the total number of at least one inorganic insulating layer disposed between the auxiliary electrode 108 exposed between the first bank 162 and the second bank 164 and the routing line 160. Specifically, the first and second inorganic encapsulation layers 142 and 146 and the touch insulating film 156 are disposed between the auxiliary electrode 108 and the routing line 160 exposed between the first and second embankments 162 and 164, and one of the first and second inorganic encapsulation layers 142 and 146 and the touch insulating film 156 is disposed between each of the first and second embankments 162 and 164 and the routing line 160. If no inorganic insulating film is disposed between each of the first and second embankments 162 and 164 and the routing line 160, external moisture or oxygen may be introduced therein. Therefore, one of the first and second inorganic encapsulation layers 142 and 146 and the touch insulating film 156 needs to be disposed between each of the first and second embankments 162 and 164 and the routing line 160. In the present invention, the structure in which the first inorganic encapsulation layer 142 is disposed between each of the first bank 162 and the second bank 164 and the routing line 160 will be described below by way of example. Here, the first inorganic encapsulation layer 142 disposed between each of the first bank 162 and the second bank 164 and the routing line 160 is formed to have a thickness equal to or less than a thickness of the first inorganic encapsulation layer 142 disposed between the auxiliary electrode 108 exposed between the first bank 162 and the second bank 164 and the routing line 160. Therefore, unevenness between the groove region 166 formed between the first bank 162 and the second bank 164 and a region above each of the first bank 162 and the second bank 164 is minimized.As a result, electrical short or disconnection of the routing line 160 in the trench region 166 formed between the first bank 162 and the second bank 164 and the region above each of the first bank 162 and the second bank 164 can be prevented.

[0089] Figure 4 is a cross-sectional view showing an organic light emitting display device having a touch sensor according to a second embodiment of the present invention.

[0090] In addition to further providing a touch buffer film 148, Figure 4 The organic light emitting display device with a touch sensor is shown Figure 3 The organic light emitting display devices with touch sensors shown have the same components, and detailed descriptions of the same components will be omitted.

[0091] Figure 4 The touch buffer film 148 shown is disposed between the second inorganic encapsulation layer 146 (which is disposed at the uppermost portion of the encapsulation unit 140) and the second bridge portion 154b (which is disposed at the lowermost portion of the touch sensor). The spacing distance between each of the touch sensing line 154 and the touch driving line 152 and the light emitting element 120 is increased by the touch buffer film 148. Therefore, the capacity of the parasitic capacitance formed between each of the touch sensing line 154 and the touch driving line 152 and the light emitting element 120 can be minimized, and interaction caused by coupling between each of the touch sensing line 154 and the touch driving line 152 and the light emitting element 120 can be prevented.

[0092] In addition, during the formation of the second bridge portion 154b, the touch buffer film 148 is provided to cover the lower touch pad electrode 172 and the lower display pad electrode 182 formed of the same material as the second bridge portion 154. In this case, the touch buffer film 148 prevents the lower touch pad electrode 172 and the lower display pad electrode 182 from being exposed to the outside during the formation of the second bridge portion 154b. Therefore, during the process of etching the second bridge portion 154b, the lower touch pad electrode 172 and the lower display pad electrode 182 are prevented from being etched, thereby preventing damage to the lower touch pad electrode 172 and the lower display pad electrode 182.

[0093] so, Figure 4 The lower touch pad electrode 172 and the lower display pad electrode 182 are shown to be protected by the touch buffer film 148 during the process of etching the second bridge portion 154 b. Therefore, the touch pad 170 and the display pad 180 do not overlap with the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146.

[0094] Therefore, if Figure 4 As shown, the display pad 180 includes the lower display pad electrode 182 and the upper display pad electrode 184 , and the lower display pad electrode 182 and the upper display pad electrode 184 are connected to each other via a display pad contact hole 186 penetrating the touch buffer film 148 and the touch insulating film 156 .

[0095] The touch pad 170 includes the lower touch pad electrode 172 and the upper touch pad electrode 174 , and the lower touch pad electrode 172 and the upper touch pad electrode 174 are connected to each other via a touch pad contact hole 176 penetrating the touch buffer film 148 and the touch insulating film 156 .

[0096] The routing line 160 connected to the upper touch pad electrode 174 is disposed to intersect the first bank 162 and the second bank 164 above the first bank 162 and the second bank 164 .

[0097] Here, the total thickness of at least one thin film layer disposed between each of the first bank 162 and the second bank 164 and the routing line 160 is less than the total thickness of at least one thin film layer disposed between the auxiliary electrode 108 exposed between the first bank 162 and the second bank 164 and the routing line 160. For example, the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146, the touch buffer film 148, and the touch insulating film 156 are disposed between the auxiliary electrode 108 exposed between the first bank 162 and the second bank 164 and the routing line 160, and one of the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146, the touch buffer film 148, and the touch insulating film 156 is disposed between each of the first bank 162 and the second bank 164 and the routing line 160. The first inorganic encapsulation layer 142 is disposed between each of the first bank 162 and the second bank 164 and the routing line 160.

[0098] Therefore, unevenness between the groove region 166 formed between the first bank 162 and the second bank 164 and the region above each of the first bank 162 and the second bank 164 is minimized. As a result, electrical short circuit or disconnection of the routing line 160 in the groove region 166 formed between the first bank 162 and the second bank 164 and the region above each of the first bank 162 and the second bank 164 can be prevented.

[0099] FIG. 5A to FIG. 5Cis a cross-sectional view showing a method of manufacturing a routing line according to a comparative example, FIG. 6A to FIG. 6C 16 is a cross-sectional view showing a method of manufacturing a routing line according to an embodiment. The comparative example has a structure in which the total thickness of the inorganic insulating layer disposed above the embankments 162 and 164 is the same as the total thickness of the inorganic insulating layer disposed in the groove region 166 between the embankments 162 and 164. The embodiment has a structure in which the total thickness of the inorganic insulating layer disposed above the embankments 162 and 164 is less than the total thickness of the inorganic insulating layer disposed in the groove region 166 between the embankments 162 and 164.

[0100] In the comparative example, Figure 5A As shown, a conductive layer 178a is deposited on the entire surface of the touch insulating film 156 to cover the first bank 162 and the second bank 164, and a photoresist 188a is coated on the conductive layer 178a. Here, since the photoresist 188a is an organic insulating material in a liquid state, the thickness d1 of the photoresist 188a coated on the groove area 166 between the first bank 162 and the second bank 164 is greater than the thickness d2 of the photoresist 188a coated on the area above each of the first bank 162 and the second bank 164. If the exposure is determined based on the thickness of the photoresist 188a formed on the area above each of the first bank 162 and the second bank 164, the photoresist 188a formed with a larger thickness on the groove area 166 between the first bank 162 and the second bank 164 is not normally exposed. Therefore, as Figure 5B As shown in FIG. 1 , a residual film 188c of the photoresist is left after the development process. If the conductive layer 178a is etched using the photoresist pattern 188b having the residual film 188c, Figure 5C As shown, the conductive layer 178a remains in the region corresponding to the residual film 188c of the photoresist, and thus a short circuit occurs between adjacent routing lines 160. On the other hand, if exposure is increased to prevent the residual film 188c of the photoresist from remaining in the groove region 166 between the first bank 162 and the second bank 164, productivity decreases.

[0101] In the described embodiment, Fig. 6AAs shown, a conductive layer 178a is deposited on the entire surface of the touch insulating film 156 in the groove region 166 disposed between the first bank 162 and the second bank 164 and the second inorganic encapsulation layer 146 disposed in the region above each of the first bank 162 and the second bank 164, and a photoresist 188a is coated on the conductive layer 178a. Here, the thickness of the photoresist 188a formed in the region above each of the first bank 162 and the second bank 164 and the thickness of the photoresist 188a formed in the groove region between the first bank 162 and the second bank 164 are the same as each other. After the exposure and development process of the photoresist 188a, as shown in FIG. Figure 6B As shown, a photoresist pattern 188b having a uniform thickness is formed in a region above each of the first bank 162 and the second bank 164 and in a trench region 166 between the first bank 162 and the second bank 164. Figure 6B The thickness of the photoresist pattern 188b formed in the trench region 166 between the first bank 162 and the second bank 164 is less than Figure 5B The thickness of the photoresist pattern 188 b formed between the first bank 162 and the second bank 164 is shown, and thus the exposure can be reduced compared to the comparative example, whereby the embodiment can shorten the exposure time and thus can improve productivity.

[0102] Using the photoresist pattern 188b as a mask, the conductive layer 178a is patterned by an etching process to form a routing line 160 having a desired design width, such as Figure 6C Therefore, the embodiments of the present invention can prevent short circuits between adjacent routing lines 160 .

[0103] As described above, in the organic light-emitting display device with a touch sensor according to the present invention, the thickness of the thin film layer disposed on the region above each of the first bank 162 and the second bank 164 is less than the thickness of the thin film layer disposed on the groove region 166 between the first bank 162 and the second bank 164. In this case, the photoresist for forming the routing line is formed to have a uniform thickness on the groove region 166 between the first bank 162 and the second bank 164 and the region above each of the first bank 162 and the second bank 164. Therefore, even when the exposure of the photoresist for forming the routing line in the groove region 166 between the first bank 162 and the second bank 164 is reduced compared to the comparative example, the generation of residual film of the photoresist for forming the routing line can be prevented. As a result, the short circuit of the routing line 160 in the groove region 166 between the first bank 162 and the second bank 164 can be prevented and the productivity can be improved.

[0104] Figure 7 is a cross-sectional view showing an organic light emitting display device having a touch sensor according to a third embodiment of the present invention.

[0105] In addition to being further provided with a color filter 194, Figure 7 The organic light emitting display device shown is Figure 3 and Figure 4 The organic light emitting display devices shown have the same components, and detailed descriptions of the same components will be omitted.

[0106] The color filter 194 is formed between each of the touch sensing lines 154 and the touch driving lines 152 and the light emitting element 120. The spacing distance between each of the touch sensing lines 154 and the touch driving lines 152 and the light emitting element 120 is increased by the color filter 194. Therefore, the capacity of the parasitic capacitance formed between each of the touch sensing lines 154 and the touch driving lines 152 and the light emitting element 120 can be minimized, and interaction caused by coupling between each of the touch sensing lines 154 and the touch driving lines 152 and the light emitting element 120 can be prevented. In addition, the color filter 194 can prevent liquid chemicals (developers, etchants, etc.) used to manufacture the touch sensing lines 154 and the touch driving lines 152 or external moisture from penetrating the light emitting stack 124. Therefore, the color filter 194 can prevent damage to the light emitting stack 124 that is susceptible to liquid chemicals or moisture. Figure 7As shown, the structure in which the touch electrodes 152e and 154e are disposed on the color filter 194 has been described by way of example, but the color filter 194 may be disposed on the touch electrodes 152e and 154e. In this case, the touch electrodes 152e and 154e are disposed between the color filter 194 and the encapsulation unit 140.

[0107] The black matrix 192 is disposed between the color filters 194. The black matrix 192 is used to separate the sub-pixel areas from each other and prevent optical interference and light leakage between adjacent sub-pixel areas. The black matrix 192 is formed of a black insulating material having a high resistance, or is formed so that at least two of the red (R), green (G) and blue (B) color filters 194 are stacked. A touch planarization layer 196 is formed on the substrate 111 on which the color filters 194 and the black matrix 192 have been formed. The substrate 111 on which the color filters 194 and the black matrix 192 have been formed is planarized by the touch planarization layer 196.

[0108] FIG. 8A to FIG. 8D 2 is a view showing a method of manufacturing an organic light emitting display device having a touch sensor according to the present invention. Figure 4 The organic light emitting display device is shown to describe the manufacturing method.

[0109] refer to Fig. 8A The second bridge portion 154 b is formed on the substrate 111 on which the switching transistor, the driving transistor T2 or 130 , the lower touch pad electrode 172 , the lower display pad electrode 182 , the light emitting element 120 , the dams 162 and 164 , the encapsulation unit 140 , and the touch buffer film 148 are formed.

[0110] Specifically, a substrate 111 on which a switching transistor, a driving transistor T2 or 130, a lower touch pad electrode 172, a lower display pad electrode 182, a light emitting element 120, dams 162 and 164, an encapsulation unit 140, and a touch buffer film 148 are formed is provided. Here, the touch buffer film 148 is provided on the lower touch pad electrode 172 and the lower display pad electrode 182 to cover the lower touch pad electrode 172 and the lower display pad electrode 182. Subsequently, a first conductive layer is deposited on the substrate 111 on which the touch buffer film 148 is formed, and the first conductive layer is formed of the same material as the lower touch pad electrode 172 and the lower display pad electrode 182. The first conductive layer is formed of a metal material (such as Ti, Cu, Mo, Ta, or MoTi) and is formed into a single layer or a multilayer structure. For example, the first conductive layer is formed into a three-layer structure such as a Ti / Al / Ti, MoTi / Cu / MoTi, or a Ti / Al / Mo stack. Subsequently, the first conductive layer is patterned by a photolithography process and an etching process using a photomask, thereby forming the second bridge portion 154b on the touch buffer film 148. During the formation of the second bridge portion 154b, the lower touch pad electrode 172 and the lower display pad electrode 182 are protected by the buffer film 148, thereby preventing the lower touch pad electrode 172 and the lower display pad electrode 182 from being damaged.

[0111] refer to Figure 8B , wherein a touch insulating film 156 having a touch contact hole 150, a touch pad contact hole 176, and a display pad contact hole 186 is formed on the substrate 111 on which the second bridge portion 154b has been formed.

[0112] Specifically, the touch insulating film 156 is formed by coating an inorganic insulating material or an organic insulating material on the entire surface of the substrate 111 on which the second bridge portion 154b has been formed. Here, the touch insulating film 156 is made of an inorganic insulating material (such as SiNx, SiON or SiO 2 ) or photo propylene, polyparaxylene or siloxane-based organic insulating material. Subsequently, the touch insulating film 156 and the touch buffer film 148 are selectively etched using a photoresist pattern (which is formed by a photolithography process using a photomask) as a mask. Thus, the touch contact hole 150, the touch pad contact hole 176 and the display pad contact hole 186 are formed, and the touch insulating film 156 and the touch buffer film 148 disposed on the first bank 162 and the second bank 164 are removed. At this time, the second inorganic encapsulation layer 146 disposed on the first bank 162 and the second bank 164 may be removed, or a portion of the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146 may be removed.

[0113] refer to Figure 8C A first touch electrode 152e and a second touch electrode 154e, a first bridge portion 152b, a routing line 160, an upper touch pad electrode 174 and an upper display pad electrode 184 are formed on a substrate 111 on which the touch insulating film 156 is formed, and the touch insulating film 156 has the touch contact hole 150, the touch pad contact hole 176 and the display pad contact hole 186 therein.

[0114] Specifically, a second conductive layer is deposited on the substrate 111 on which the touch contact hole 150, the touch pad contact hole 176, and the display pad contact hole 186 are formed. Here, the second conductive layer can be formed of at least one of a transparent conductive layer and an opaque conductive layer. The transparent conductive layer is formed of IGZO, IZO, ITO, or ZnO, and the opaque conductive layer is formed of a metal material such as Al, Ti, Cu, Mo, Ta, or MoTi, and is formed into a single layer or a multilayer structure. For example, the second conductive layer is formed into a three-layer structure such as Ti / Al / Ti, MoTi / Cu / MoTi, or Ti / Al / Mo stacking. Subsequently, the second conductive layer is patterned by a photolithography process and an etching process to form the first touch electrode 152e and the second touch electrode 154e, the first bridge portion 152b, the routing line 160, the upper touch pad electrode 174, and the upper display pad electrode 184.

[0115] refer to Fig.8D A touch protection film 158 is formed on the substrate 111 on which the first touch electrode 152e and the second touch electrode 154e, the first bridge portion 152b, the routing line 160, the upper touch pad electrode 174 and the upper display pad electrode 184 are formed.

[0116] Specifically, an inorganic insulating material or an organic insulating material is formed on the entire surface of the substrate 111 on which the first touch electrode 152e and the second touch electrode 154e, the first bridge portion 152b, the first touch routing line 162, the touch pad 170, and the display pad 180 are formed. Subsequently, the inorganic insulating material or the organic insulating material is patterned by a photolithography process and an etching process to form the touch protection film 158. The touch protection film 158 is formed as a film or thin film structure using an organic insulating material such as epoxy resin or acrylic resin, or is formed of an inorganic insulating material such as SiNx or SiOx.

[0117] As described above, in the organic light emitting display device with a touch sensor according to the present invention, the thickness of the thin film layer disposed on the region above each of the first bank 162 and the second bank 164 is smaller than the thickness of the thin film layer disposed on the groove region 166 between the first bank 162 and the second bank 164. Therefore, it is possible to prevent the photoresist used to form the routing line from generating a residual film in the groove region 166 between the first bank 162 and the second bank 164, and prevent the routing line 160 from being short-circuited in the groove region 166 between the first bank 162 and the second bank 164.

[0118] Meanwhile, in the present invention, the following examples have been described. Figure 4 The first touch electrode 152e and the second touch electrode 154e and the first bridge portion 152b and the second bridge portion 154b are formed to have a plate-shaped configuration, and the first touch electrode 152e and the second touch electrode 154e and the first bridge portion 152b and the second bridge portion 154b may be formed to have a mesh shape, such as Fig. 9A and Fig. 9B As shown. That is, at least one of the first touch electrode 152e and the second touch electrode 154e and at least one of the first bridge portion 152b and the second bridge portion 154b may be formed of a transparent conductive film 1541 (such as ITO or IZO) and a mesh metal film 1542 disposed above or below the transparent conductive film 1541 and having a mesh shape. Alternatively, the first touch electrode 152e and the second touch electrode 154e and at least one of the first bridge portion 152b and the second bridge portion 154b may be formed of only the mesh metal film 1542 without the transparent conductive film 1541, or may be formed of the transparent conductive film 1541 having a mesh shape without the mesh metal film 1542. Here, the mesh metal film 1542 is formed to have a mesh shape using a conductive layer of at least one of Ti, Al, Mo, MoTi, Cu, Ta, or ITO to have a higher conductivity than the transparent conductive film 1541. For example, the mesh metal film 1542 is formed into a three-layer structure such as Ti / Al / Ti, MoTi / Cu / MoTi or Ti / Al / Mo stack. Thus, the resistance and capacitance of the first touch electrode 152e and the second touch electrode 154e and the first bridge portion 152b can be reduced, and the RC time constant can be reduced, which can lead to increased touch sensitivity. In addition, since the mesh metal film 1542 of each of the first touch electrode 152e and the second touch electrode 154e and the first bridge portion 152b has a very small line width, the degradation of the aperture ratio and the transmittance due to the mesh metal film 1542 can be prevented.

[0119] In addition, in the present invention, a mutual capacitance type touch sensor including a touch sensing line 154 and a touch driving line 152 that cross each other and have a touch insulating film 156 interposed therebetween has been described by way of example, but the present invention can also be applied to a self-capacitive touch sensor. Each of a plurality of self-capacitive touch electrodes has an electrically independent self-capacitive capacitance, and thus functions as a self-capacitive touch sensor that senses a capacitance change caused by a user's touch. That is, a routing line 160 connected to the self-capacitive touch electrode is disposed on an area above each of the first bank 162 and the second bank 164 having reduced unevenness therebetween, and on a groove area 166 between the first bank 162 and the second bank 164. As a result, a short circuit of the routing line 160 is prevented, thereby improving reliability.

[0120] It is obvious from the above description that the display device with a touch sensor according to the present invention is configured so that the total thickness of the inorganic insulating layer on the area above each of the embankments is less than the total thickness of the inorganic insulating layer on the groove area between the embankments. Therefore, since the unevenness between the area above each of the embankments and the groove area between the embankments is reduced, the thickness of the photoresist used to form the routing line in the groove area between the embankments is reduced. As a result, the exposure of the photoresist used to form the routing line can be reduced, thereby improving productivity.

[0121] It will be apparent to those skilled in the art that various modifications and variations may be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to cover modifications and variations of the present invention that fall within the scope of the appended claims and their equivalents.

Claims

1. A display device, include: A light emitting element disposed in an active region of the substrate; A touch sensor disposed on the light emitting element; An encapsulation unit disposed between the light emitting element and the touch sensor, the encapsulation unit comprising a plurality of inorganic encapsulation layers and at least one organic encapsulation layer disposed between the inorganic encapsulation layers; a touch pad disposed in a pad region of the substrate, the touch pad being electrically connected to the touch sensor; as well as a first bank and a second bank disposed between the active region and the pad region, wherein a total thickness of at least one inorganic insulating layer disposed on an upper surface of the second bank portion is different from a total thickness of the at least one inorganic insulating layer disposed in a trench region between the first bank portion and the second bank portion, The touch sensor includes a touch insulating film disposed on the packaging unit, and The touch insulating film is disposed in the groove region. 2 . The display device according to claim 1 , further comprising a routing line electrically connecting the touch sensor and the touch pad, wherein the routing line is disposed on the packaging unit.

3. The display device according to claim 1, in, A total thickness of the at least one inorganic insulating layer disposed on the upper surface of the second bank is smaller than a total thickness of the at least one inorganic insulating layer disposed in the trench region.

4. The display device according to claim 2, in, The total thickness of the at least one inorganic insulating layer disposed between the upper surface of the second embankment and the lower surface of the routing line is smaller than the total thickness of the at least one inorganic insulating layer disposed between the upper surface of the conductive layer below the second embankment and the lower surface of the routing line.

5. The display device according to claim 2, in, The total number of the at least one inorganic insulating layer disposed between the upper surface of the second embankment and the lower surface of the routing line is less than the total number of the at least one inorganic insulating layer disposed between the upper surface of the conductive layer under the second embankment and the lower surface of the routing line.

6. The display device according to claim 1, in, The touch sensor includes a touch sensing line and a touch driving line arranged so that the touch insulating film is interposed therebetween, and The at least one inorganic insulating layer includes at least one of the inorganic encapsulation layer and the touch insulating film.

7. The display device according to claim 5, in, One of the plurality of inorganic encapsulation layers is disposed between the upper surface of the second bank and the lower surface of the routing line, and The plurality of inorganic encapsulation layers and the touch insulation film are disposed between the upper surface of the conductive layer and the lower surface of the routing line.

8. The display device according to claim 1, in, The touch pad comprises: A lower touch pad electrode disposed on the substrate; and An upper touch pad electrode connected to the lower touch pad electrode, the lower touch pad electrode being exposed through a touch contact hole penetrating the inorganic encapsulation layer and the touch insulating film.

9. The display device according to claim 4, in, The conductive layer is electrically connected to a cathode of the light emitting element.

10. The display device according to claim 6, further comprising: include: A touch buffer film is disposed between the touch insulating film and the packaging unit, The at least one inorganic insulating layer includes at least one of the inorganic encapsulation layer, the touch buffer film and the touch insulating film.

11. The display device according to claim 10, in, The touch pad comprises: A lower touch pad electrode disposed on the substrate; and An upper touch pad electrode connected to the lower touch pad electrode, the lower touch pad electrode being exposed through a touch contact hole penetrating the touch buffer film and the touch insulating film.

12. The display device according to claim 1, further comprising: include: A thin film transistor is provided in the active region and is electrically connected to the light emitting element.

13. The display device according to claim 1, in, The second bank is closer to the pad region than the first bank.

14. The display device according to claim 1, further comprising: include: A plurality of color filters are disposed on the touch sensor and the light emitting element.

Images