Semiconductor wafer detection device

Abstract

The invention discloses a semiconductor wafer detection device, and relates to the technical field of semiconductor wafer detection. The semiconductor wafer detection device comprises a height-adjustable wafer defect detection lamp group, a cabinet is fixed on a supporting plate of the wafer defect detection lamp group, a linear driving module is rotatably arranged in the cabinet, and the linear driving module comprises a slidable sliding block; an angle adjuster is rotatably connected to the sliding block, a forward adjusting assembly is fixed to the angle adjuster, a wafer clamping disc used for clamping a wafer is fixed to the angle adjuster, and a reciprocating swing driving assembly is slidably connected to the linear driving module; the linear driving module rotates to switch the sliding direction of the sliding block, and the linear driving module follows the rotating wafer clamping disc and is switched through the forward adjusting assembly to keep the forward state. The wafer is clamped through the wafer clamping disc, the wafer does not need to be held by a detector for a long time, the visual angle of the wafer is more stable, and scratches on the surface of the wafer are observed through the light reflection condition on the surface of the wafer in the front-back and left-right moving process of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer detection, and in particular to a semiconductor wafer detection device. Background Art

[0002] Semiconductor wafers are one of the important basic materials for semiconductor device manufacturing. During production, in order to ensure the production quality of semiconductor wafers, a defect detection device is required to conduct spot checks on the defects of its production batches.

[0003] Currently, when using the wafer defect detection lamp SL8900 for spot checks, the wafer defect detection lamp SL8900 adopts a desktop design and mainly consists of 4 parts: a lamp head, a bracket, a cabinet, and a dimmer. Through the combination of an optical lens module, the illuminance at 30 cm can reach 400,000 lux, and it can detect defects as small as 1 um on the surface. It is mainly used for detecting surface defects of wafers, especially suitable for detecting defects of dust and foreign objects on the wafer surface.

[0004] When using the wafer defect detection lamp SL8900 to conduct spot checks on wafer slices, the inspection personnel need to hold the wafer slice by hand, and then continuously switch the angle between the wafer slice and the cabinet through the arm to find the best viewing angle. After the best viewing angle is determined and the arm maintains this angle, the wafer slice is moved back and forth and left and right through the arm, and finally, the micro-scratches on the surface of the wafer slice are detected by the light reflection of the lamp head.

[0005] However, this detection method requires the arm to maintain the best viewing angle and move back and forth and left and right. The arm is in a tense state for a long time, causing soreness in the arm, and when the arm shakes, it will cause the problem of unstable viewing angle of the wafer slice. Summary of the Invention

[0006] The purpose of the present invention is to provide a semiconductor wafer detection device to solve the problem that when traditional semiconductor wafers are detected under a defect detection lamp, the arm needs to maintain the best viewing angle and move back and forth and left and right. The arm is in a tense state for a long time, causing soreness in the arm, and when the arm shakes, it will lead to the problem of unstable viewing angle of the wafer slice.

[0007] To achieve the above purpose, the present invention adopts the following technical solution: a semiconductor wafer detection device, including a wafer defect detection lamp group with adjustable height. A cabinet is fixed on the support plate of the wafer defect detection lamp group. A linear drive module is rotatably arranged in the cabinet. The linear drive module includes a slidable slider. A angle adjuster is rotatably connected to the slider. A forward adjustment component is fixed on the angle adjuster. A wafer slice clamping plate for clamping the wafer slice is fixed on the angle adjuster. A reciprocating swing drive component is slidably connected to the linear drive module. The linear drive module switches the sliding direction of the slider through rotation, and the wafer chucking disk following the rotation switches to maintain a positive state through the positive adjustment component; The reciprocating swing drive component slides to the lower end of the angle adjusting rod of the angle adjuster, and during the sliding, the angle adjusting rod drives the wafer chucking disk to reciprocate through the reciprocating swing drive component; The reciprocating swing drive component slides away from the angle adjusting rod, and the wafer chucking disk slides at a fixed angle.

[0008] As a further description of a semiconductor wafer detection device of the above technology: The positive adjustment component includes a gear; The linear drive module further includes a first guide rail adapted to the slider, a ball screw is rotatably provided on the first guide rail, the gear is rotatably connected to the second shaft hole of the slider through a drive shaft, and the angle adjuster is fixed to the upper end of the drive shaft; The cabinet includes a housing fixed on the upper surface of the support plate, the first guide rail is fixed on the support circular plate, the support circular plate is rotatably connected to the first shaft hole of the housing, and an incomplete internal gear ring coaxial with the first shaft hole is fixed on the housing; After rotation, the gear is magnetically fixed to the slider.

[0009] As a further description of a semiconductor wafer detection device of the above technology: On one side of the gear close to the slider, a second magnet and a third magnet are symmetrically fixed, the second magnet and the third magnet are arranged at intervals, and a first magnet is symmetrically fixed on the slider.

[0010] As a further description of a semiconductor wafer detection device of the above technology: The support circular plate fixes a sealing circular plate through a plurality of support columns, and a ring plate coaxial with the first shaft hole is fixed above the housing; A strip-shaped hole is opened on the sealing circular plate, and the drive shaft slides along the strip-shaped hole.

[0011] As a further description of a semiconductor wafer detection device of the above technology: An aperture corresponding ring groove is opened on the outer surface of the sealing circular plate, and the aperture corresponding ring groove is coaxial with the sealing circular plate.

[0012] As a further description of a semiconductor wafer detection device of the above technology: The angle adjuster includes an angle measuring seat, the angle measuring seat inserts a long screw rod with a wing nut, a plurality of fan-shaped grooves are opened on the angle measuring seat, and a corner plate is installed in each fan-shaped groove, and the long screw rod passes through the installation hole opened on the corner plate; Angle measuring instruments coaxial with the long screw rod are fixed at both ends of the angle measuring seat, and an indicating groove pointing to the angle measuring instrument is opened on the corner plate.

[0013] Further description of a semiconductor wafer detection device of the above technology: The wafer clamping disc includes a support disc fixed on the angle plate. A wafer placement groove is provided on one side of the support disc. A plurality of screws are threadedly connected to the outer edge of the support disc, and a pressing needle is inserted on each screw; The support disc is provided with finger holes.

[0014] Further description of a semiconductor wafer detection device of the above technology: The reciprocating swing driving component includes a guiding rod. A plurality of grooves are provided on the upper surface of the guiding rod, and a plurality of sliding grooves are provided at the bottom of the guiding rod. A second guide rail is slidably provided in the sliding groove, and the second guide rail is fixed on the linear driving module.

[0015] Further description of a semiconductor wafer detection device of the above technology: Limiting plates are fixed at both ends of the second guide rail. A plurality of male magnetic buttons are fixed on the side of the limiting plate close to the guiding rod, and a plurality of female magnetic buttons are fixed on the side of the guiding rod close to the male magnetic buttons.

[0016] Further description of a semiconductor wafer detection device of the above technology: A bracket is fixed on the upper surface of the support plate. A support arm with a locking screw is slidably provided on the bracket, and a lamp head is fixed on the support arm; An operation hole is provided on one side of the bottom of the outer shell, and an operation rod is fixed on the side wall of the support circular plate.

[0017] In summary, due to adopting a semiconductor wafer detection device of the above technology, the beneficial effects of the present invention are: 1. The optimal viewing angle of the wafer is fixed by the angle adjuster, and the wafer is clamped by the wafer clamping disc. There is no need for the detector to hold the wafer for a long time, and the viewing angle of the wafer is more stable. The rotation of the linear driving module is used to switch the forward and backward, left and right traveling states of the slider. During the switching process, the wafer clamping disc is switched by the forward adjustment component, so that when the wafer is in the forward and backward traveling states and the left and right traveling states, the detection surface of the wafer always faces the detector. During the forward and backward, left and right movement of the wafer, the scratches on the wafer surface are observed through the light reflection on the wafer surface.

[0018] 2. By sliding the reciprocating swing driving component towards and close to the slider, during the traveling process, the slider drives the wafer clamping disc through the reciprocating swing driving component to form a reciprocating swing angle adjustment action within a certain angle range. Therefore, when the slider is in the forward and backward traveling state, the reciprocating deflection angle of the wafer changes with the change of the wafer position, thereby changing the light reflection on the wafer surface. Therefore, when the wafer travels in the forward and backward direction, through the reciprocating swing of the wafer, the detector observes the light reflection on the surface of the reciprocating swing wafer, which is more conducive to finding scratches. Description of the Drawings

[0019] Figure 1 Shows a schematic structural diagram of the front and rear traveling states of a wafer clamping disk provided according to an embodiment of the present invention; Figure 2 Shows a schematic structural diagram of a cabinet, a linear drive module, a support disk, and a reciprocating swing drive assembly provided according to an embodiment of the present invention; Figure 3 Shows a schematic diagram provided according to an embodiment of the present invention Figure 2 The enlarged structural diagram at position A in; Figure 4 Shows a schematic partial structure diagram of a guide rod provided according to an embodiment of the present invention; Figure 5 Shows a schematic diagram provided according to an embodiment of the present invention Figure 2 The sectional structural diagram of the cabinet, the support circular plate, and the sealing circular plate in; Figure 6 Shows a schematic structural diagram of a gear and a protractor seat provided according to an embodiment of the present invention; Figure 7 Shows a schematic structural diagram of a wafer clamping disk provided according to an embodiment of the present invention; Figure 8 Shows a schematic diagram provided according to an embodiment of the present invention Figure 6 The right view structural diagram; Figure 9 Shows a schematic structural diagram of a slider provided according to an embodiment of the present invention; Figure 10 Shows a schematic structural diagram of a linear drive module provided according to an embodiment of the present invention; Figure 11 Shows a schematic structural diagram of a cabinet and an incomplete internal gear provided according to an embodiment of the present invention; Figure 12 Shows a sectional structural diagram of a cabinet and an incomplete internal gear provided according to an embodiment of the present invention; Figure 13 Shows a schematic structural diagram of the left and right traveling states of a wafer clamping disk provided according to an embodiment of the present invention.

[0020] Legend: 10. Wafer defect detection lamp group; 11. Support plate; 12. Bracket; 13. Support arm; 131. Locking screw; 14. Lamp head; 20. Cabinet; 21. Ring plate; 211. Operation hole; 22. Outer shell; 221. First shaft hole; 30. Linear drive module; 31. Slide block; 311. Second shaft hole; 312. First magnet; 32. Servo motor; 33. First guide rail; 34. Ball screw; 35. Support circular plate; 351. Operating rod; 352. Support column; 36. Sealing circular plate; 361. Strip-shaped hole; 362. Aperture corresponding annular groove; 37. Gear; 371. Drive shaft; 372. Second magnet; 373. Third magnet; 38. Incomplete internal gear ring; 381. Teeth; 382. Support rod; 40. Angle adjuster; 41. Protractor seat; 411. Protractor; 412. Sector-shaped groove; 42. Long screw; 43. Wing nut; 44. Angle plate; 441. Mounting hole; 442. Indication groove; 45. Angle adjusting rod; 451. Roller; 50. Wafer clamping disc; 51. Support disc; 511. Wafer placement groove; 512. Finger hole; 52. Screw; 53. Pressing pin; 60. Reciprocating swing drive assembly; 61. Guide rod; 611. Chute; 62. Second guide rail; 63. Limit plate; 64. Male magnetic buckle; 65. Female magnetic buckle. Detailed implementation manners

[0021] Next, the technical solution of a semiconductor wafer detection device in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] As Figure 1 - Figure 13 shown, the present invention provides: a semiconductor wafer detection device, including a wafer defect detection lamp group 10 with adjustable height. By adjusting the height of the wafer defect detection lamp group 10, the radiation aperture irradiated on the cabinet 20 can be adjusted. The cabinet 20 is fixed on the support plate 11 of the wafer defect detection lamp group 10. A linear drive module 30 is rotatably arranged in the cabinet 20. The linear drive module 30 includes a slidable slide block 31. By rotating the linear drive module 30, the rotation of the slide block 31 is driven, and then the sliding direction of the slide block 31 is switched; A angle adjuster 40 is rotatably connected to the slider 31. A forward adjustment component is fixed to the angle adjuster 40. A wafer chucking plate 50 for chucking a wafer is fixed to the upper end of the angle adjuster 40. The angle between the wafer chucking plate 50 and the cabinet 20 is adjusted by the angle adjuster 40, so that the wafer chucked on the wafer chucking plate 50 is fixed after being tilted to the optimal angle. After the wafer chucking plate 50 is tilted to the optimal angle and fixed, the reciprocating swing drive component 60 slidably connected to the sliding linear drive module 30 moves away from the angle adjuster 40. At this time, the wafer chucking plate 50 linearly slides following the angle adjuster 40 and the slider 31; By rotating the linear drive module 30, the traveling directions (front-back or left-right directions) can be switched. During the rotation, the wafer chucking plate 50 passes through the forward adjustment component to switch the angle of the wafer chucking plate 50, so that the wafer on the wafer chucking plate 50 can always maintain a forward state (that is, the side facing the inspector); When in the front-back traveling state, the reciprocating swing drive component 60 slides to the lower end of the angle adjusting rod 45 of the angle adjuster 40. The slider 31 during the front-back sliding drives the wafer chucking plate 50 to form a reciprocating swing angle adjustment action within a certain angle range through the reciprocating swing drive component 60. Therefore, when the slider 31 is in the front-back traveling state, the reciprocating deflection angle of the wafer at this time changes with the change of the wafer position, thereby changing the light reflection on the wafer surface. Therefore, when the wafer travels in the front-back direction, through the reciprocating swing of the wafer, the inspector can more easily find scratches by observing the light reflection on the surface of the reciprocating swing wafer.

[0023] The reciprocating swing drive component 60 slides away from the angle adjusting rod 45. The optimal viewing angle of the wafer is fixed by the angle adjuster 40, and the wafer is chucked by the wafer chucking plate 50. There is no need for the inspector to hold the wafer for a long time. By rotating the linear drive module 30, the traveling states of the slider 31 in the front-back and left-right directions are switched, realizing the fixed-angle sliding of the wafer chucking plate 50. And during the switching process, the wafer chucking plate 50 is switched by the forward adjustment component, so that the wafer always faces the inspector when in the front-back traveling state and the left-right traveling state. During the front-back and left-right movement of the wafer, the scratches on the wafer surface are observed through the light reflection on the wafer surface.

[0024] As Figure 5 、 Figure 6 、 Figure 8 、 Figure 9 shown, the forward adjustment component includes a gear 37. The gear 37 is coaxially fixed with the drive shaft 371, and the angle adjuster 40 is fixed to the upper end of the drive shaft 371; As Figure 10As shown, the linear drive module 30 also includes a first guide rail 33 adapted to the slider 31, the slider 31 is threadedly connected to the ball screw 34, the ball screw 34 is rotatably arranged on the first guide rail 33, one end of the ball screw 34 fixes the output shaft of the servo motor 32 coaxially through a coupling, the servo motor 32 housing is fixed on the first guide rail 33, the servo motor 32 drives the ball screw 34 to rotate, and the slider 31 slides along the first guide rail 33 under the action of the thread; like Figure 5 , Figure 8 As shown, the gear 37 is rotatably connected to the second shaft hole 311 of the slider 31 through a coaxially fixed drive shaft 371 in cooperation with a bearing, so that the angle adjuster 40 and the wafer clamping plate 50 can be driven to rotate and adjust through the rotation of the gear 37 and the drive shaft 371; like Figure 5 , Figure 11 , Figure 12 As shown, the cabinet 20 includes a shell 22 fixed on the upper surface of the support plate 11, the top of the shell 22 is an open structure, the first axial hole 221 in the center of the shell 22 is placed directly below the lamp holder 14, the first guide rail 33 is fixed on the support circular plate 35, the lower surface of the support circular plate 35 is connected to the first axial hole 221 of the shell 22 by the cooperation and rotation of the shaft rod in the bearing, the support circular plate 35 is coaxial with the first axial hole 221, the upper inner wall of the shell 22 is fixed with an incomplete inner tooth ring 38 by a plurality of annularly distributed support rods 382, ​​and the incomplete inner tooth ring 38 is coaxially arranged with the first axial hole 221; like Figure 5 As shown, when the slider 31 slides to the end of the first guide rail 33 away from the servo motor 32, when the supporting circular plate 35 is rotated clockwise and passes through the incomplete inner gear ring 38, the gear 37 can mesh with the multiple teeth 381 of the incomplete inner gear ring 38, and the multiple teeth 381 drive the gear 37 to rotate 90° counterclockwise under the action of meshing, so that when the rotating supporting circular plate 35 switches the travel state of the slider 31, the gear 37 is driven by the multiple teeth 381 of the incomplete inner gear ring 38 to drive the drive shaft 371 and the angle adjuster 40 fixed on the drive shaft 371 to rotate 90° counterclockwise, so as to adjust the wafer clamping plate 50 and the clamped wafer to always face the inspection personnel when moving forward and backward and left and right; In order to prevent the angle adjuster 40 and the wafer clamping plate 50 fixed above from shaking after rotation, the gear 37 is magnetically fixed to the slider 31 after the gear 37 rotates 90°, so that the wafer clamping plate 50 is positioned by the magnetic fixation of the gear 37 and the slider 31.

[0025] like Figure 6 , Figure 8 , Figure 9As shown, a second magnet 372 and a third magnet 373 are symmetrically fixed on one side of the gear 37 close to the slider 31, and the second magnet 372 and the third magnet 373 are arranged at intervals. A first magnet 312 is symmetrically fixed on the slider 31, and the second magnet 372 and the third magnet 373 are both magnetically attracted to the first magnet 312. When the slider 31 is in a forward and backward movement state, the second magnet 372 is magnetically attracted to the first magnet 312 at this time. When the slider 31 rotates clockwise, the gear 37 is meshed and driven by the incomplete inner gear ring 38, and the gear 37 rotates counterclockwise, and the second magnet 372 is disengaged from the first magnet 312. When the tooth 381 is disengaged from the gear 37, the gear 37 rotates counterclockwise by 90°, and the third magnet 373 is magnetically attracted to the first magnet 312. In the process of completing the wafer clamping plate 50, the magnets can be mutually attracted to each other, so that the rotated gear 37 is fixed on the slider 31.

[0026] like Figure 2 , Figure 5 , Figure 10 As shown, the support circular plate 35 is fixed with a sealing circular plate 36 through a plurality of support columns 352, and a ring plate 21 coaxial with the first axial hole 221 is fixed above the shell 22, the upper surface of the sealing circular plate 36 abuts against the lower surface of the ring plate 21, and the sealing circular plate 36 is placed between the incomplete inner tooth ring 38 and the ring plate 21, and the lower surface of the sealing circular plate 36 abuts against the upper surface of the incomplete inner tooth ring 38. The outer diameter of the sealing circular plate 36 is larger than the inner diameter of the ring plate 21, so that the top opening of the shell 22 is covered by the sealing circular plate 36 to improve the overall aesthetics and reduce foreign matter from falling into the shell 22; like Figure 10 As shown, a strip hole 361 is opened on the sealing circular plate 36, and the length direction of the strip hole 361 is arranged along the sliding direction of the slider 31, and the driving shaft 371 at the upper end of the gear 37 slides along the strip hole 361, that is, the linear drive module 30 is shielded in the outer shell 22 by the sealing circular plate 36, and is fixedly supported by multiple support columns 352, so that the sealing circular plate 36 can rotate along with the supporting circular plate 35.

[0027] like Figure 5As shown, an aperture corresponding annular groove 362 is formed on the outer surface of the sealing circular plate 36. The aperture corresponding annular groove 362 is coaxial with the sealing circular plate 36, and the axis of the sealing circular plate 36 is placed directly below the lamp holder 14. When replacing lamp holders 14 with different color temperatures and colors, since the different radiation apertures of the lens also vary with the height change of the lamp holder 14, when replacing and adjusting the height of the lamp holder 14, the lamp holder 14 is energized to irradiate the upper surface of the sealing circular plate 36. When the outer edge of the radiation aperture irradiated by the lamp holder 14 coincides with the aperture corresponding annular groove 362, the adjustment of the height of the lamp holder 14 can be completed. Furthermore, it is not necessary for the inspection personnel to measure the diameter of the radiation aperture with a ruler, improving the adjustment efficiency of the lamp holder 14.

[0028] As Figure 3 , Figure 6 , Figure 7 , Figure 8 As shown, the angle adjuster 40 includes an angle measuring seat 41. The angle measuring seat 41 is inserted with a long screw rod 42 with a wing nut 43. A plurality of sector-shaped grooves 412 are formed on the angle measuring seat 41. A corner plate 44 is installed in each sector-shaped groove 412. The wafer clamping plate 50 is fixed at the upper ends of the plurality of corner plates 44. The long screw rod 42 passes through the mounting holes 441 formed on the corner plates 44. Therefore, the wafer clamping plate 50 and the corner plates 44 can be adjusted in angle along the sector-shaped grooves 412 with the long screw rod 42 as the axis. After the angle adjustment, by rotating the wing nut 43 clockwise, under the action of extrusion and / or friction, the angle measuring seat 41 clamps the corner plates 44 and the wafer clamping plate 50 to position the wafer after the angle adjustment. After loosening the wing nut 43, at this time, the corner plate 44 is deflected with the long screw rod 42 as the axis through the cooperation of the mounting hole 441 and the long screw rod 42; Angle measuring instruments 411 coaxial with the long screw rod 42 are fixed at both ends of the angle measuring seat 41. An indicating groove 442 pointing to the angle measuring instrument 411 is formed on the corner plate 44. When the wafer clamping plate 50 is in a vertical state perpendicular to the support plate 11, the indicating groove 442 indicates at the zero scale line position of the angle measuring instrument 411 at this time. By rotating the corner plate 44, the indicating groove 442 rotates with the axis of the angle measuring instrument 411, and thus the angle of the angle measuring instrument 411 corresponding to the indicating groove 442 can be observed, so as to judge the included angle between the wafer and the cabinet 20.

[0029] As Figure 7As shown in the figure, the wafer clamping disk 50 includes a support disk 51 fixed on the angle plate 44. A wafer placement groove 511 is provided on the side of the support disk 51 away from the bracket 12. The wafer is placed in the wafer placement groove 511 to prevent the wafer from slipping. And a plurality of screws 52 are threadedly connected to the outer edge of the support disk 51, and a pressing pin 53 is inserted on each screw 52. The pressing pin 53 is rotated to the front end of the wafer placement groove 511, so that the wafer can be clamped in the support disk 51. And in order to prevent the pressing pin 53 and the support disk 51 from wearing the wafer, a silica gel layer is wrapped on the surfaces of the pressing pin 53 and the support disk 51; When the wafer in the wafer placement groove 511 needs to be taken out from the support disk 51, through the finger holes 512 provided on the support disk 51, the finger passes through the back surface of the wafer and penetrates into the finger holes 512, and then the wafer can be ejected, and then the wafer is turned over to perform scratch detection.

[0030] As Figure 3 、 Figure 4 As shown in the figure, a plurality of grooves are provided on the upper surface of the guide rod 61. The grooves are of a V-shaped structure. An angle adjusting rod 45 is fixed to the angle plate 44 close to the guide rod 61. The angle adjusting rod 45 is arranged parallel to the long screw rod 42, and a roller 451 is rotatably connected coaxially to the angle adjusting rod 45, so as to reduce the friction with the guide rod 61 through the rotation of the roller 451; The guide rod 61 is arranged along the sliding direction of the slider 31. When the slider 31 slides in the front and back traveling state, the roller 451 closely adheres to the upper surface of the guide rod 61 and moves. When it reaches the bottom of the groove, the included angle between the wafer and the cabinet 20 at this time is 60°. When the roller 451 moves along the slope of the groove to the top position, the included angle between the sliding wafer and the cabinet 20 at this time is 30°. Therefore, when the angle adjusting rod 45 fits and slides along the groove, the angle plate 44 makes a reciprocating lifting motion within an angle range of 30° - 60° with the long screw rod 42 as the axis, and finally realizes the wafer swinging within an angle range of 30° - 60° when detecting in the front and back directions.

[0031] As Figure 3 、 Figure 4 As shown in the figure, the guide rod 61 is provided with a plurality of sliding grooves 611. A second guide rail 62 is slidably arranged in the sliding grooves 611. The second guide rail 62 is fixed on the linear driving module 30. The guide rod 61 slides along a direction perpendicular to the movement of the slider 31. When the wafer on the support disk 51 needs to move in the front and back directions at a fixed angle, the guide rod 61 slides to the left along the second guide rail 62, so that the angle adjusting rod 45 is separated from the guide rod 61. When the guide rod 61 needs to be used to reciprocally lift the wafer, the guide rod 61 slides towards the angle adjusting rod 45 and is placed below the angle adjusting rod 45; It should be noted that one end of the guiding rod 61 close to the angle adjusting rod 45 is lower than the angle adjusting rod 45. Therefore, when the angle adjusting rod 45 rotates following the angle adjuster 40, the problem of interference between the angle adjusting rod 45 and the guiding rod 61 can be avoided; As Figure 3 shown, limiting plates 63 are fixed at both ends of the second guide rail 62. A plurality of male magnetic buttons 64 are fixed on the side of the limiting plate 63 close to the guiding rod 61, and a plurality of female magnetic buttons 65 are fixed on the side of the guiding rod 61 close to the male magnetic buttons 64. The male magnetic buttons 64 and the female magnetic buttons 65 are magnetically attracted to each other. Slide the guiding rod 61 to the left, and the male magnetic buttons 64 and the female magnetic buttons 65 on the left are magnetically attracted to each other. At this time, the guiding rod 61 is far from the angle adjusting rod 45 and fixed. Then slide the guiding rod 61 to the right, and at this time, the right side of the guiding rod 61 is magnetically attracted and fixed through the male magnetic buttons 64 and the female magnetic buttons 65.

[0032] As Figure 2 、 Figure 5 、 Figure 12 、 Figure 13 shown, a bracket 12 is fixed on the upper surface of the support plate 11. A support arm 13 with a locking screw 131 is slidably arranged on the bracket 12, and a lamp holder 14 is fixed on the support arm 13; by adjusting the height of the support arm 13 on the bracket 12 and fixing it by the locking screw 131 against the bracket 12, the height of the lamp holder 14 can be adjusted, and finally the adjustment of the radiation aperture of the lamp holder 14 is completed; An operation hole 211 is opened on one side of the bottom of the outer shell 22. An L-shaped operation rod 351 is fixed on the side wall of the support circular plate 35. One end of the operation rod 351 after passing through the operation hole 211 is placed outside the outer shell 22. The operation rod 351 is parallel to the first guide rail 33, and the included angle between both ends of the operation hole 211 and the first shaft hole 221 is 90°. Therefore, when pushing the handle at the outer end of the operation rod 351 and it abuts against both ends of the operation hole 211, at this time, the support circular plate 35 can be driven to rotate 90° through the operation rod 351.

[0033] Working principle: (1) Adjustment of the lamp holder 14: Replace the lamp holder 14 with different lenses or colors according to needs, slide the support arm 13 on the bracket 12, power on the lamp holder 14 and irradiate the upper surface of the sealing circular plate 36, and then adjust the support arm 13 up and down so that the radiation aperture corresponds to the aperture corresponding annular groove 362. The locking screw 131 fixes the support arm 13 on the bracket 12 to complete the adjustment of the height of the lamp holder 14; (2) Installation of the wafer: Toggle a plurality of pressing needles 53 to deviate from the wafer placing groove 511, place the wafer into the wafer placing groove 511, then press the wafer with the pressing needles 53, and rotate the screw 52 clockwise to squeeze and fix the pressing needles 53 in the support disc 51 to complete the installation of the wafer; (3) Angle adjustment for wafer fixed - angle detection: Loosen the wing nut 43 and adjust the angle of the support disk 51 to find the best viewing angle. Then, turn the wing nut 43 clockwise to fix the support disk 51 and the angle plate 44 on the protractor seat 41. Subsequently, slide the guide rod 61 to the left away from the angle - adjusting rod 45 and magnetically attach it to the left - hand limit plate 63. (4) Wafer front - and - back sliding detection: Power on and operate the servo motor 32 to drive the ball screw 34 to rotate clockwise. Under the action of the thread, the slider 31 slides towards the end away from the servo motor 32. The slider 31 slides back and forth along the first guide rail 33. At this time, the inspector observes the scratches through the light reflection on the surface of the wafer. After the slider 31 abuts against the end of the first guide rail 33 away from the servo motor 32, the servo motor 32 stops. (5) Wafer left - and - right sliding switching: Push and hold the operating rod 351 to drive the support circular plate 35, the sealing circular plate 36, and the first guide rail 33 to rotate clockwise. When the gear 37 passes through the tooth 381 of the incomplete internal gear ring 38, the gear 37 rotates counter - clockwise by 90° after being engaged and driven by the incomplete internal gear ring 38. The second magnet 372 detaches from the first magnet 312, and the third magnet 373 rotates to the position of the first magnet 312 and magnetically attaches. When the operating rod 351 abuts against the inner wall of the operation hole 211, at this time, the slider 31 and the support disk 51 rotate by 90°, and the surface of the wafer placement groove 511 faces the inspector, completing the travel - state switching. (6) Wafer left - and - right sliding detection: Start the servo motor 32 to drive the ball screw 34 counter - clockwise. The ball screw 34 drags the slider 31 to slide from right to left. At this time, the inspector observes the scratches through the light reflection on the surface of the wafer. (7) Detection of the reciprocating swing angle adjustment when the wafer slides back and forth: Loosen the wing nut 43, then place the guide rod 61 under the roller 451. Subsequently, repeat the operation in the above step (4) to complete the wafer's swing around the long screw 42 as the axis while moving back and forth in the front - and - back direction. The inspector observes the scratches through the light reflection on the surface of the swinging wafer. When it is necessary to inspect the other side of the wafer, just remove the wafer, turn it around and install it in the wafer placement groove 511, then the servo motor 32 drives the ball screw 34 to rotate clockwise, the slider 31 slides from left to right, and after it hits the end of the first guide rail 33, the operating rod 351 is rotated counterclockwise and rotated 90° around the first axial hole 221. During this process, the incomplete internal gear ring 38 drives the gear 37 to drive the support plate 51 to rotate 90° clockwise, and then the servo motor 32 is started again to drive the ball screw 34 to rotate counterclockwise, and the slider 31 is pulled to slide in the direction of the inspector.

[0034] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes to a semiconductor wafer detection device and its inventive concept according to the technology of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor wafer inspection device, characterized in that: It comprises a height-adjustable wafer defect detection light group (10), a cabinet (20) being fixed on a support plate (11) of the wafer defect detection light group (10), a linear drive module (30) being rotatably arranged in the cabinet (20), and the linear drive module (30) comprising a slidable slider (31); The slider (31) is rotatably connected to an angle adjuster (40), a forward adjustment component is fixed to the angle adjuster (40), a wafer clamping plate (50) for clamping a wafer is fixed to the angle adjuster (40), and a reciprocating swing driving component (60) is slidably connected to the linear driving module (30); The linear drive module (30) switches the sliding direction of the slider (31) by rotation, and the wafer clamping plate (50) that follows the rotation is switched to maintain a forward state by a forward adjustment component; The reciprocating swing driving component (60) slides to the lower end of the angle adjustment rod (45) of the angle adjuster (40), and during the sliding, the angle adjustment rod (45) drives the wafer clamping plate (50) to reciprocate through the reciprocating swing driving component (60); The reciprocating swing driving assembly (60) slides away from the angle adjustment rod (45), and the wafer clamping plate (50) slides at a fixed angle.

2. A semiconductor wafer detection device according to claim 1, characterized in that: The forward adjustment assembly includes a gear (37); The linear drive module (30) further comprises a first guide rail (33) adapted to the slider (31); a ball screw (34) is rotatably provided on the first guide rail (33); a gear (37) is rotatably connected to a second shaft hole (311) of the slider (31) via a drive shaft (371); and an angle adjuster (40) is fixed to an upper end of the drive shaft (371); The cabinet (20) comprises a housing (22) fixed to the upper surface of a support plate (11); a first guide rail (33) fixed to a support circular plate (35); the support circular plate (35) is rotatably connected to a first shaft hole (221) of the housing (22); an incomplete internal gear ring (38) coaxially arranged with the first shaft hole (221) is fixed to the housing (22); After rotation, the gear (37) and the slider (31) are fixed by magnetic attraction.

3. A semiconductor wafer detection device according to claim 2, characterized in that: A second magnet (372) and a third magnet (373) are symmetrically fixed on one side of the gear (37) close to the slider (31); the second magnet (372) and the third magnet (373) are arranged at intervals, and a first magnet (312) is symmetrically fixed on the slider (31).

4. A semiconductor wafer detection device according to claim 2, characterized in that: The supporting circular plate (35) is fixed with a sealing circular plate (36) via a plurality of supporting columns (352); a ring plate (21) coaxial with the first axial hole (221) is fixed above the housing (22); The sealing circular plate (36) is provided with a strip-shaped hole (361), and the driving shaft (371) slides along the strip-shaped hole (361).

5. A semiconductor wafer inspection device according to claim 4, characterized in that: An aperture corresponding annular groove (362) is formed on the outer surface of the sealing circular plate (36), and the aperture corresponding annular groove (362) is coaxial with the sealing circular plate (36).

6. The semiconductor wafer inspection device according to claim 1, characterized in that: The angle adjuster (40) comprises an angle seat (41), a long screw (42) with a butterfly nut (43) is inserted into the angle seat (41), a plurality of fan-shaped grooves (412) are provided on the angle seat (41), an angle plate (44) is installed in each fan-shaped groove (412), and the long screw (42) passes through a mounting hole (441) provided on the angle plate (44); A protractor (411) coaxially arranged with the long screw rod (42) is fixed to both ends of the protractor seat (41), and an indicating groove (442) pointing to the protractor (411) is provided on the angle plate (44).

7. A semiconductor wafer inspection device according to claim 6, characterized in that: The wafer clamping plate (50) comprises a support plate (51) fixed on the angle plate (44), a wafer placement groove (511) is provided on one side of the support plate (51), a plurality of screws (52) are threadedly connected to the outer edge of the support plate (51), and a pressure pin (53) is inserted into each screw (52); The support plate (51) is provided with a finger hole (512).

8. The semiconductor wafer inspection device according to claim 1, characterized in that: The reciprocating swing drive assembly (60) comprises a guide rod (61), the upper surface of the guide rod (61) is provided with a plurality of grooves, the bottom of the guide rod (61) is provided with a plurality of slide grooves (611), a second guide rail (62) is slidably arranged in the slide grooves (611), and the second guide rail (62) is fixed on the linear drive module (30).

9. The semiconductor wafer detection device according to claim 8, characterized in that: Limiting plates (63) are fixed to both ends of the second guide rail (62); a plurality of male magnetic buckles (64) are fixed to one side of the limiting plate (63) close to the guide rod (61); and a plurality of female magnetic buckles (65) are fixed to one side of the guide rod (61) close to the male magnetic buckle (64).

10. The semiconductor wafer inspection device according to claim 2, characterized in that: A bracket (12) is fixed on the upper surface of the support plate (11), a support arm (13) with a locking screw (131) is slidably mounted on the bracket (12), and a lamp holder (14) is fixed on the support arm (13); an operating hole (211) is provided on one side of the bottom of the housing (22), and an operating rod (351) is fixed on the side wall of the support circular plate (35).

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