Novel communication vehicle integrated system

Abstract

The invention discloses a novel communication vehicle integrated system, and relates to the field of communication networks. According to the invention, innovation of a communication vehicle integration mode is realized through two-stage reconstruction of a physical layer and a protocol layer. Communication equipment is modularly designed and deployed on a modular bearing platform, and interconnection cables between the equipment are arranged in the modular equipment bearing platform and used for being connected with the modular equipment deployed on the modular equipment bearing platform. A bus type wiring mode is adopted in the modular equipment bearing platform, the modular equipment bearing platform is mainly composed of five kinds of buses including an exchange bus, a management bus, a clock bus, a password bus and a power supply bus, and five kinds of connections including information exchange, health management, clock information, password management and power supply management can be provided for modular equipment integration installed on the modular equipment bearing platform. And the number of integrated cables loaded on the communication vehicle can be greatly reduced.

Description

Technical Field

[0001] The present invention relates to a new type of communication vehicle integrated system, belonging to the field of tactical communication. Background Art

[0002] Traditional communication vehicles adopt a distributed device layout and an independent wiring mode, which have significant technical defects:

[0003] 1. Cable redundancy problem: Taking a certain type of communication vehicle as an example, 12 types of communication devices (including switches, servers, encryption machines, etc.) need to be integrated. Each device is independently powered and connected point-to-point, resulting in more than 313 cables (including 130 power cables and 183 signal cables) in the whole vehicle, with a total weight of 28 kg and a space occupancy of 0.2 m 3 .

[0004] 2. Difficulty in system expansion: When adding new devices, the wiring path needs to be redesigned. The typical expansion period requires more than 72 hours, and the cable interweaving causes electromagnetic interference (the test shows that the crosstalk between adjacent cables reaches -28 dB).

[0005] 3. Low maintenance efficiency: Fault location requires manual section-by-section troubleshooting. Statistical data shows that the average mean time to repair (MTTR) is as long as 4.5 hours, and 68% of the time is consumed in cable detection.

[0006] 4. Poor clock synchronization accuracy: Each device uses an independent clock source, and the time deviation of the whole network exceeds ±500 μs, seriously affecting the quality of collaborative communication. Summary of the Invention

[0007] To solve the above problems, the present invention discloses a new type of communication vehicle integrated system, which realizes the innovation of the communication vehicle integration method through two-level reconstruction of the physical layer and the protocol layer:

[0008] A new type of communication vehicle integrated system includes: a modular device carrier platform, which is composed of a 6061-T6 aluminum alloy frame and has a three-layer structure including an upper device installation area, a middle platform bus area, and a lower heat dissipation fan area;

[0009] The upper device installation area integrates standardized device interfaces, including a shock-proof locking mechanism and a 48-core military connector, to realize the blind plug-in installation of modular devices.

[0010] The five types of buses integrated in the middle platform bus area are:

[0011] a) Switching bus: The modular device carrier platform integrates a switching module and a switching bus; the switching module constructs a star topology network through the switching bus to receive and send services and supports VLAN isolation;

[0012] b) Management Bus: The modular device hosting platform integrates a management module and a management bus; the management module interacts with the management agent module of the modular device through the management bus based on the device management protocol and device management messages to achieve device health monitoring;

[0013] c) Clock Bus: The modular device hosting platform integrates a clock module and a clock bus; the clock module interacts with the clock agent module of the modular device through the clock bus based on the device clock protocol and device clock messages to exchange timestamps and achieve nanosecond-level synchronization;

[0014] d) Cryptography Bus: The modular device hosting platform integrates a cryptography module and a cryptography bus; the cryptography module interacts with the cryptography agent module of the modular device through the cryptography bus based on the device cryptography protocol and device cryptography messages, and it supports SM2 / SM4 / SM9 encryption algorithms;

[0015] e) Power Bus: The modular device hosting platform integrates a power module and a power bus; the power module interacts with the power agent module of the modular device through the power bus based on the device power protocol and device power messages, and it supports dynamic power distribution;

[0016] The lower-layer cooling fan area integrates cooling fans and cooling channels to achieve the cooling of the modular device.

[0017] Furthermore,

[0018] The process of the device management protocol interaction is as follows:

[0019] Step 101: After the modular device is powered on, the management agent module sends a discovery message to the management module in a broadcast manner, reporting that the modular device has been powered on and the status information after power-on, including temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P);

[0020] Step 102: After receiving the discovery message of the modular device, the management module sends a polling message to the management module in a broadcast manner every 30 seconds by default to query the status information of the modular device;

[0021] Step 103: After receiving the polling message from the management module, the management agent module replies with a status report message, reporting the status information of the modular device, including temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P);

[0022] Step 104: The management module dynamically constructs a modular device health model based on the received management module status information. The modular device health calculation formula is as follows:

[0023] Y = a * X T+b*X V +c*X G +d*X L +e*X M +f*X P

[0024] wherein, X T 、X V 、X G 、X L 、X M 、X P are respectively the change values of the temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P) in the last two times, and a, b, c, d, e, and f are the corresponding weighting coefficients.

[0025] Step 105: The management module dynamically adjusts the polling time interval according to the modular device health. The polling time interval is set as follows:

[0026]

[0027]

[0028] Step 106: The management module uses the LSTM model to predict the failure probability (0 - 100%) of the modular device within the next 24 hours based on the received temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P) of the modular device;

[0029] Step 107: If the predicted failure probability of the modular device is ≥ 80%, an alarm is sent to the user to remind the user to conduct an inspection or replace the device as soon as possible.

[0030] The device management message is carried based on the Ethernet message, and the Ethernet message type field is 0x88D2; the device management message includes: discovery message, polling message, and status report message.

[0031] Furthermore,

[0032] The device clock protocol interaction includes:

[0033] Step 201, the clock module periodically (synchronization interval T new = 2 seconds, basic period) sends a device clock message carrying the timestamp t1;

[0034] Step 202, the clock proxy module records the message arrival time t2;

[0035] Step 203, after randomly delaying for a period of time (between 0 - 1 millisecond), the clock proxy sends a device clock message carrying the timestamp t3;

[0036] Step 204, the clock module returns a device clock message carrying the timestamp t4.

[0037] Step 205, the clock proxy module records the message arrival time t4, calculates the clock offset OS_raw = (t2 - t1 - t4 + t3) / 2, calculates the path delay DL = (t2 - t1 + t4 - t3) / 2, and calculates the network jitter Jitter = |(t2 - t1) - (t4 - t3)|;

[0038] Step 206, calculate the optimal synchronization interval T in real time according to the network jitter (Jitter) and the clock offset (OS) new = T base *(1 + α * |OS_raw| + β * Jitter), and adjust the subsequent clock synchronization interval.

[0039] Where: T base = 2 seconds (basic period), α = 0.1 (offset weight coefficient), β = 0.05 (jitter weight coefficient)

[0040] Step 207, calculate the temperature drift compensation amount T_T = k1 * (T_current - T_cal) + k2 * (T_current - T_cal) 2

[0041] Where, T_current is the temperature value of the environment where the device is located collected in real time by the temperature sensor, T_cal is the reference temperature calibrated under laboratory standard conditions (such as 25°C) for calculating the temperature deviation. k1 is the first-order temperature compensation coefficient (unit: ns / °C) for describing the linear effect of temperature change on the clock offset, and k1 = 0.05 ns / °C is set (indicating that for every 1°C increase, the clock offset linearly increases by 0.05 ns), k2 is the second-order temperature compensation coefficient (unit: ns / °C2). For describing the non-linear effect of temperature change (such as the frequency-temperature curve of the crystal oscillator showing a parabolic characteristic), k2 = 0.001 ns / °C2 is set (indicating that for every 1°C deviation of the temperature from T_cal, the non-linear deviation increases by 0.001 ns)

[0042] Step 208, calculate the phase noise compensation caused by the vibration of the communication vehicle. The calculation formula is as follows:

[0043] T_V = ∫(a(t) * K)dt

[0044] (a(t) is the real-time vibration acceleration collected by the acceleration sensor (such as a MEMS three-axis accelerometer), and K is the vibration-time deviation conversion coefficient (unit: ns / g) for describing the cumulative effect of unit vibration acceleration on the clock offset, and the default value of K is 0.1 ns / g)

[0045] Step 209: Correct the local clock to achieve time synchronization with the clock module, ensuring dynamic adaptation to the network environment and maintaining clock synchronization accuracy. The calculation formula is as follows:

[0046] OS_corrected = OS_raw - (T_T + T_V)

[0047] Where OS_raw is the uncorrected clock deviation calculated (unit: ns), and OS_corrected is the corrected clock deviation (unit: ns).

[0048] The device clock message is carried based on the Ethernet message, and the Ethernet message type field is 0x88D3.

[0049] Furthermore,

[0050] The specific process of the device password protocol interaction is as follows:

[0051] Step 301: The password module integrates a quantum random number generator (QRNG), collects the photon polarization state in real time to generate a quantum entropy source QRNG_output; at the same time, combines a chaotic map (Logistic μ = 3.999) to generate a chaotic sequence Chaos_sequence, and performs XOR fusion with the quantum entropy source to generate a session key Sec. The calculation formula is:

[0052] Sec = QRNG_output ⊕ Chaos_sequence

[0053] Step 302: When a modular device is accessed, use the password proxy module to collect the hardware fingerprints (SHA3-256 (FPGA bitstream), voiceprint features (MFCC coefficients + Gaussian mixture model), and dynamic power consumption signature (power consumption trajectory of running specific instructions)), and send an authentication and encryption request message to the password module;

[0054] Step 303: After receiving the message, the password module performs verification. If the verification fails, it refuses to send the session key, determines that there may be an attack, and sends a power-off instruction to the corresponding modular device to the power supply module; if the verification passes, it sends the session key to the password proxy module;

[0055] Step 304: The password proxy module calls the encryption algorithm, encrypts the data using the session key, and sends it to the receiving end.

[0056] Furthermore,

[0057] The device power supply protocol interaction process includes:

[0058] Step 401: After the modular device is powered on, the power proxy module sends a registration request message to the power module, carrying the device hardware fingerprint (SHA3-256), rated power (16-bit), security certificate (SM2 signature), and dynamic power consumption signature information. Apply for power allocation required by the modular device;

[0059] Step 402: After receiving it, the power module verifies the validity of the certificate and compares it with the power consumption signature database to prevent cloned devices from accessing. If the verification fails, power supply to the modular device is refused; after the verification passes, dynamic allocation is performed according to the power required by the modular device;

[0060] Step 403: The power module uses the LSTM neural network model to input the historical power sequence (sampled every 1 s), device type, and task queue depth to predict the power consumption Ppred of the modular device in the next 30 seconds and dynamically pre-allocate power, which can convert traditional reactive allocation into predictive allocation, shorten the power supply response time for sudden load increases, and avoid instantaneous overload:

[0061] Step 404: The power proxy module detects the device terminal voltage in real time. After finding that the voltage change does not meet the usage requirements of the modular device, it sends feedback to the power module in real time, and the power module makes dynamic adjustments;

[0062] Step 405: When the power module receives the power-off instruction sent by the password module, it directly powers off the corresponding modular device;

[0063] Step 406: When the power module detects that the current > 110% of the rated value, it sends an overload power-off message to the power proxy module of the modular device and cuts off the power supply.

[0064] Compared with the background art, the present invention has the following advantages:

[0065] An integration method for communication vehicles proposed by the present invention aims at the problem of a large number of cables in the traditional distributed wiring method in communication vehicle integration. By designing a modular device carrier platform, the communication devices are modularly designed and deployed on the modular carrier platform. The inter-device connection cables are built into the modular device carrier platform to connect the modular devices deployed on the modular device carrier platform. The internal of the modular device carrier platform adopts a bus-type wiring method, mainly composed of five types of buses: switching, management, clock, password, and power supply, which can provide five connections: information exchange, health management, clock information, password management, and power supply management for the integration of the modular devices installed on the modular device carrier platform. It can significantly reduce the number of cables for the integration of communication vehicles. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 It is a schematic diagram of the internal structure of the modular device carrier platform of the present invention. Detailed implementation manners

[0067] The present invention will be further described below.

[0068] I. Physical layer reconstruction - Design of modular device carrier platform

[0069] 1. Structure design: Use 6061-T6 aluminum alloy frame, which is divided into three layers: upper, middle and lower:

[0070] (1) The upper layer is the device installation area, integrating an installation rack and an anti-seismic locking mechanism, and carrying 8 modular devices;

[0071] (2) The middle layer is the platform bus area, setting independent shielding channels for five types of functional buses. The inner wall of the channels is copper-plated (thickness 50μm), and the shielding effectiveness reaches 90dB;

[0072] (3) The lower layer is the cooling fan area, using 5 centrifugal fans to build a positive pressure ventilation system, and the air volume ≥ 200CFM.

[0073] 2. Interface design: The standardized device interface includes:

[0074] (1) Mechanical interface: Three-point snap lock, insertion and extraction force ≤ 20N;

[0075] (2) Electrical interface: 48-core military connector, integrating network ports (4 groups), SMA (2 groups), and power contacts (6 groups).

[0076] II. Protocol layer reconstruction - Five-bus collaboration mechanism

[0077] a) Switching bus: The modular device carrier platform integrates a switching module and a switching bus. The switching module constructs a star topology network through the switching bus to receive and send services, and supports VLAN isolation;

[0078] b) Management bus: The modular device carrier platform integrates a management module and a management bus. The management module interacts with the management agent module of the modular device through the management bus based on the device management protocol and device management messages to achieve device health monitoring;

[0079] c) Clock bus: The modular device carrier platform integrates a clock module and a clock bus. The clock module interacts with the clock agent module of the modular device through the clock bus based on the device clock protocol and device clock messages to achieve nanosecond-level synchronization;

[0080] d) Cryptography bus: The modular device carrier platform integrates a cryptography module and a cryptography bus. The cryptography module interacts with the cryptography agent module of the modular device through the cryptography bus based on the device cryptography protocol and device cryptography messages, and supports SM2 / SM4 / SM9 encryption algorithms;

[0081] e) Power bus: The modular device carrier platform integrates a power module and a power bus. The power module interacts with the power proxy module of the modular device through the power bus based on the device power protocol and device power messages, supporting intelligent dynamic power distribution;

[0082] III. Modular Device Design

[0083] The original devices (such as switches, servers, and cryptographic machines) are transformed into modular devices, which contain a switching proxy module, a management proxy module, a cryptographic proxy module, a clock proxy module, and a power proxy module. A 48-core military connector is installed on the back and interconnected with the modular device carrier platform, and interactions are carried out through the corresponding buses and protocols.

[0084] As Figure 1 shown, the present invention designs a new type of integrated communication vehicle system. By designing a modular device carrier platform, the communication devices are modularly designed and deployed on the modular carrier platform. The inter-device interconnecting cables are built into the modular device carrier platform and used to connect the modular devices deployed on the modular device carrier platform. The internal of the modular device carrier platform adopts a bus-type wiring method, mainly composed of five types of buses: switching, management, clock, cryptographic, and power, which can provide five types of connections for the integration of the modular devices installed on the modular device carrier platform, namely information exchange, health management, clock information, cryptographic management, and power supply management.

[0085] 1. Construction of the Modular Device Carrier Platform

[0086] (1) Mechanical Structure Design

[0087] Overall framework: It is welded and formed by 6061-T6 aluminum alloy profiles. The framework is divided into three layers:

[0088] a) Upper device installation area: 8 modular device slots are installed, and each slot is equipped with a three-point anti-vibration locking mechanism (locking force ≥ 200N, unlocking force ≤ 20N).

[0089] b) Middle-layer platform bus area: 5 independent shielded channels (size 50mm × 80mm) are set, which respectively accommodate the switching bus, management bus, clock bus, cryptographic bus, and power bus. The inner wall of the channel is copper-plated (thickness 50μm, shielding effectiveness ≥ 90dB@1GHz).

[0090] c) Lower-layer cooling fan area: 5 centrifugal fans are built in to form a positive pressure cooling system, and a HEPA filter (filtration efficiency 99.97%) is set at the air inlet.

[0091] 2. Implementation of the Switching Bus:

[0092] Adopt the Broadcom BCM56960 switching chip, with a backplane bandwidth of 40 Gbps, supporting VLAN division and QoS priority marking.

[0093] The physical layer uses CAT7 shielded twisted pair (wire gauge AWG24), and each device is allocated 1 ten-gigabit port (10GBase-T).

[0094] 3. Management bus implementation:

[0095] The management module is deployed on an ARM Cortex-A53 processor (main frequency 1.2 GHz).

[0096] (1) The device management protocol interaction includes:

[0097] Step 101: After the modular device is powered on, the management agent module sends a discovery message to the management module via broadcast, reporting that the modular device has been powered on and the status information after power-on, including temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P).

[0098] Step 102: After receiving the discovery message of the modular device, the management module sends a polling message to the management module via broadcast every 30 seconds by default to query the status information of the modular device.

[0099] Step 103: After receiving the polling message from the management module, the management agent module replies with a status report message, reporting the status information of the modular device, including temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P).

[0100] Step 104: Based on the status information received by the management module, the management module dynamically constructs a modular device health model. The modular device health calculation formula is as follows:

[0101] Y = a*X T +b*X V +c*X G +d*X L +e*X M +f*X P

[0102] Where, X T 、X V 、X G 、X L 、X M 、X PThe most recent two change values of temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P) respectively, and a, b, c, d, e, f are the corresponding weighting coefficients.

[0103] Step 105, the management module dynamically adjusts the polling time interval according to the modular device health. The polling time interval is set as follows:

[0104] Health degree Polling time interval ≥80 300 seconds 60-79 120 seconds <60 30 seconds

[0105] Step 106: The management module uses the LSTM model to predict the failure probability (0 - 100%) of the modular device within the next 24 hours based on the received temperature (T), voltage (V), vibration (G), CPU load (L), memory usage rate (M), and packet loss rate (P) of the modular device;

[0106] Step 107: If the predicted failure probability of the modular device is ≥ 80%, then an alarm is sent to the user to remind the user to conduct inspections or replace the device as soon as possible.

[0107] The device management message is carried based on the Ethernet message, and the Ethernet message type field is 0x88D2; the device management message includes: discovery message, polling message, and status report message.

[0108] (2) The device management message described above includes:

[0109] a) The device management message is carried based on the Ethernet message, and the Ethernet message type field is 0x88D2. The device management message includes: Discover message, Get message, Put message, and Alarm message.

[0110] b) The message format of the device management message is shown in Table 1:

[0111] Table 1

[0112]

[0113] 4. Implementation of the clock bus:

[0114] The clock module uses a Symmetricom SA.45s cesium atomic clock (accuracy ±1×10 - 12) and is equipped with a Beidou time service module.

[0115] (1) The device clock protocol interaction described above includes:

[0116] Step 201, the clock module periodically (synchronization interval T new = 2 seconds, basic period) sends a device clock message carrying the timestamp t1;

[0117] Step 202, the clock proxy module records the packet arrival time t2;

[0118] Step 203, after the clock proxy randomly delays for a period of time (between 0 - 1 millisecond), it sends a device clock packet carrying the timestamp t3;

[0119] Step 204, the clock module returns a device clock packet carrying the timestamp t4.

[0120] Step 205, the clock proxy module records the packet arrival time t4, calculates the clock offset OS_raw = (t2 - t1 - t4 + t3) / 2, calculates the path delay DL = (t2 - t1 + t4 - t3) / 2, and calculates the network jitter Jitter = |(t2 - t1) - (t4 - t3)|;

[0121] Step 206, calculates the optimal synchronization interval T in real time according to the network jitter (Jitter) and the clock offset (OS) new = T base *(1 + α*|OS_raw| + β*Jitter), and adjusts the subsequent clock synchronization interval.

[0122] Where: T base = 2 seconds (basic period), α = 0.1 (offset weight coefficient), β = 0.05 (jitter weight coefficient)

[0123] Step 207, calculates the temperature drift compensation amount T_T = k1*(T_current - T_cal) + k2*(T_current - T_cal) 2

[0124] Where, T_current is the temperature value of the environment where the device is located collected in real time through a temperature sensor, T_cal is the reference temperature calibrated under laboratory standard conditions (such as 25°C), which is used to calculate the temperature deviation. k1 is the first-order temperature compensation coefficient (unit: ns / °C), which is used to describe the linear effect of temperature change on the clock offset, and k1 = 0.05 ns / °C is set (indicating that for every 1°C increase, the clock offset linearly increases by 0.05 ns), and k2 is the second-order temperature compensation coefficient (unit: ns / °C²). It is used to describe the non-linear effect of temperature change (such as the frequency-temperature curve of a crystal oscillator showing a parabolic characteristic), and k2 = 0.001 ns / °C² is set (indicating that for every 1°C deviation of the temperature from T_cal, the non-linear deviation increases by 0.001 ns)

[0125] Step 208, calculates the phase noise compensation caused by the vibration of the communication vehicle, and the calculation formula is as follows:

[0126] T_V = ∫(a(t)*K)dt

[0127] (a(t) is the real-time vibration acceleration collected by an acceleration sensor (such as a MEMS triaxial accelerometer), K is the vibration-time deviation conversion coefficient (unit: ns / g), which is used to describe the cumulative impact of unit vibration acceleration on the clock deviation, and the default value of K is 0.1 ns / g)

[0128] Step 209, correct the local clock to achieve time synchronization with the clock module, ensure the ability to dynamically adapt to the network environment, and maintain the clock synchronization accuracy. The calculation formula is as follows:

[0129] OS_corrected = OS_raw - (T_T + T_V)

[0130] Among them, OS_raw is the uncorrected clock deviation calculated (unit: ns), and OS_corrected is the corrected clock deviation (unit: ns)

[0131] The device clock message is carried based on the Ethernet message, and the Ethernet message type field is 0x88D3.

[0132] (2) The device clock message described above includes:

[0133] a) The device clock message is carried based on the Ethernet message, and the Ethernet message type field is 0x88D3.

[0134] b) The message format of the device clock message is shown in Table 2:

[0135] Table 2

[0136] Field Length Description Ver 1 byte Version Sn 2 bytes Message sequence number ID 4 bytes Device ID Timestamp 10 bytes Timestamp of the sending time (nanosecond level) Correct 8 bytes Path delay compensation

[0137] 5. Implementation of the password bus:

[0138] Integrate the Jiangnan Keyou SJK1928 password chip, support SM2 / SM4 / SM9 algorithms, and the key generation rate reaches 500 times per second. Send encryption requests through the PCIe 3.0 interface, and the bus response time ≤ 10 μs.

[0139] (1) The device password protocol interaction described above includes:

[0140] Step 301, the password module integrates a quantum random number generator (QRNG), real-time collects the photon polarization state, and generates the quantum entropy source QRNG_output; at the same time, combines the chaotic mapping (Logistic μ = 3.999) to generate the chaotic sequence Chaos_sequence, and performs XOR fusion with the quantum entropy source to generate the session key Sec. The calculation formula is:

[0141] Sec = QRNG_output ⊕ Chaos_sequence

[0142] In step 302, when a modular device is accessed, the password proxy module is used to collect the hardware fingerprints (SHA3-256 (FPGA bitstream)), voiceprint features (MFCC coefficients + Gaussian mixture model), and dynamic power consumption signatures (power consumption trajectories for running specific instructions), and send an authentication and encryption request message to the password module;

[0143] In step 303, the password module verifies after receiving. If the verification fails, it refuses to send the session key, determines that there may be an attack, and sends a power-off instruction for the corresponding modular device to the power module; if the verification passes, it sends the session key to the password proxy module;

[0144] In step 304, the password proxy module calls the encryption algorithm, encrypts the data using the session key, and sends it to the receiving end.

[0145] (2) The device password message includes:

[0146] The protocol message format is shown in Table 3:

[0147] Table 3

[0148] Field Length Description Type 1 byte Message type, 0x1 is the encrypted request message, 0x2 is the encrypted response message Crypt 1 byte Encryption type, 0x1 is SM2, 0x2 is SM4, 0x1 is SM9 Len 2 bytes Indicates the length of the data payload Data Variable Plaintext / ciphertext data

[0149] 6. Power bus implementation:

[0150] The Vicor DCM3623 power module is adopted to dynamically adjust the output power according to the device load (step accuracy 1%), and the overcurrent protection threshold is programmable (default 110% rated current).

[0151] (1) The device power protocol interaction includes:

[0152] In step 401, after the modular device is powered on, the power proxy module sends a registration request message to the power module, carrying the device hardware fingerprint (SHA3-256), rated power (16-bit), security certificate (SM2 signature), and dynamic power consumption signature information. Apply for power distribution required by the modular device;

[0153] In step 402, after the power module receives it, it verifies the validity of the certificate, compares the power consumption signature database to prevent cloned devices from accessing. If the verification fails, it refuses to supply power to the modular device; after the verification passes, it dynamically allocates power according to the required power of the modular device;

[0154] In step 403, the power module uses the LSTM neural network model, inputs the historical power sequence (sampled every 1 s), device type, and task queue depth, predicts the power consumption Ppred of the modular device in the next 30 seconds, and dynamically pre-allocates power, which can convert the traditional reactive allocation into predictive allocation, shorten the power supply response time for sudden increased loads, and avoid instantaneous overload:

[0155] Step 404: The power supply agent module detects the device-side voltage in real time. After finding that the voltage change does not meet the usage requirements of the modular device, it sends feedback to the power supply module in real time, and the power supply module makes dynamic adjustments.

[0156] Step 405: When the power supply module receives the power-off instruction sent by the password module, it directly cuts off the power supply to the corresponding modular device.

[0157] Step 406: When the power supply module detects that the current > 110% of the rated value, it sends an overload power-off message to the power supply agent module of the modular device and cuts off the power supply.

[0158] (2) The device power supply message includes:

[0159] The protocol message format is shown in Table 4:

[0160] Table 4

[0161] Field Length Description Type 1 byte Message type, 0x1 is the power request message, 0x2 is the overload power-off message Pow 2 bytes Power required for the modular device (unit: W) Sta 1 byte Device status, 0x00 = normal, 0x01 = overload

[0162] 7. Device Installation and Integration

[0163] (1) Modular Device Deployment

[0164] Transform the original devices (switches, servers, cryptographic machines, etc.) into modular devices, which include a switching agent module, a management agent module, a password agent module, a clock agent module, and a power supply agent module. Install a 48-core military connector on the back and interconnect it with the modular device bearing platform, and interact through the corresponding bus and protocol.

[0165] (2) Quick Loading Process

[0166] ① Fix the modular device bearing platform to the communication vehicle through four-point bolts (torque 50 N·m);

[0167] ② Insert the modular device into the slot of the modular device bearing platform in sequence. When you hear the "click" sound of the locking mechanism, it means the installation is in place.

Claims

1. A new communication vehicle integrated system, characterized in that: include: The modular equipment carrying platform is made of 6061-T6 aluminum alloy frame, which includes a three-layer structure of upper equipment installation area, middle platform bus area and lower cooling fan area; The upper equipment installation area integrates a standardized equipment interface, including a shock-proof locking mechanism and a 48-core military connector, to achieve blind-plug installation of modular equipment. The five types of buses integrated in the middle-level platform bus area are: a) Switching bus: The modular equipment carrier platform integrates switching modules and switching buses. The switching modules build a star topology network through the switching bus to send and receive services and support VLAN isolation. b) Management bus: modular equipment carrier platform integrates management modules and management bus; The management module interacts with the management agent module of the modular device through the management bus based on the device management protocol and device management messages to build a device health model and predict the future failure probability; c) Clock bus: The modular device carrier platform integrates the clock module and the clock bus. The clock module exchanges timestamps with the clock agent module of the modular device through the clock bus based on the device clock protocol and device clock message to achieve nanosecond synchronization; d) Cryptographic bus: The modular device carrier platform integrates the cryptographic module and the cryptographic bus. The cryptographic module interacts with the cryptographic proxy module of the modular device through the cryptographic bus based on the device cryptographic protocol and device cryptographic message. It supports SM2 / SM4 / SM9 encryption algorithms. e) Power bus: The modular device carrier platform integrates power modules and power buses. The power modules interact with the power proxy modules of modular devices through the power bus based on the device power protocol and device power messages to support dynamic power distribution. The lower cooling fan area integrates cooling fans and cooling channels to achieve heat dissipation of modular equipment.

2. According to claim 1, a new communication vehicle integration system is characterized in that: The device management protocol interaction process is as follows: Step 101, after the modular device is powered on, the management agent module sends a discovery message to the management module by broadcasting, reporting that the modular device has been powered on, as well as the status information after powering on, including temperature, voltage, vibration, CPU load, memory usage, and packet loss rate; Step 102, after receiving the discovery message of the modular device, the management module sends a polling message to the management module by broadcasting every 30 seconds by default to query the status information of the modular device; Step 103, after receiving the polling message from the management module, the management agent module replies with a status report message to report the modular device status information, including temperature, voltage, vibration, CPU load, memory usage, and packet loss rate; Step 104: The management module dynamically constructs a modular device health model based on the received management module status information. The modular device health calculation formula is as follows: Y=a*X T +b*X V +c*X G +d*X L +e*X M +f*X P Among them, X T , X V , X G , X L , X M , X P are the two most recent changes in temperature, voltage, vibration, CPU load, memory usage, and packet loss rate, respectively. a, b, c, d, e, and f are the corresponding weighting coefficients, respectively; Step 105, the management module dynamically adjusts the polling time interval according to the health of the modular device; Step 106: The management module uses the LSTM model to predict the failure probability (0-100%) of the modular device within the next 24 hours based on the received modular device temperature, voltage, vibration, CPU load, memory usage, and packet loss rate; Step 107: If the predicted modular device failure probability is ≥ 80%, an alarm is sent to the user to remind the user to conduct inspection or replace the device as soon as possible. Device management messages are carried over Ethernet messages, and the Ethernet message type field is 0x88D2. Device management messages include: discovery messages, polling messages, and status report messages.

3. A new communication vehicle integration system according to claim 1, characterized in that: The device clock bus includes deployed temperature and vibration sensors to collect environmental data in real time. The device clock protocol interaction includes: Step 201, the clock module periodically sends a device clock message carrying a timestamp t1; Step 202, the clock agent module records the message arrival time t2; Step 203, the clock agent sends a device clock message carrying a timestamp t3 after a random delay; Step 204: The clock module returns a device clock message carrying a timestamp t4. Step 205, the clock agent module records the message arrival time t4, calculates the clock deviation OS_raw = (t2-t1-t4+t3) / 2, calculates the path delay DL = (t2-t1+t4-t3) / 2, and calculates the network jitter Jitter = |(t2-t1)-(t4-t3)|; Step 206: Calculate the optimal synchronization interval T in real time based on the network jitter and the clock deviation OS. new =T base *(1+α*|OS_raw|+β*Jitter) and adjust the subsequent clock synchronization interval. Where: T base = basic period, α = deviation weight coefficient, β = jitter weight coefficient; Step 207, calculate the temperature drift compensation amount: T_T=k1*(T_current-T_cal)+k2*(T_current-T_cal) 2 Among them, T_current is the temperature value of the environment in which the device is located, which is collected in real time by the temperature sensor; T_cal is the reference temperature calibrated under standard laboratory conditions, which is used to calculate the temperature deviation; k1 is the first-order temperature compensation coefficient, which is used to describe the linear effect of temperature change on clock deviation; k2 is the second-order temperature compensation coefficient, which is used to describe the nonlinear effect of temperature change; Step 208, calculate the phase noise compensation caused by the vibration of the communication vehicle, and the calculation formula is as follows: T_V=∫(a(t)*K)dt a(t) is the real-time vibration acceleration collected by the acceleration sensor, and K is the vibration-time deviation conversion coefficient, which is used to describe the cumulative effect of unit vibration acceleration on clock deviation; Step 209, correct the local clock to achieve time synchronization with the clock module, ensure that it can dynamically adapt to the network environment and maintain clock synchronization accuracy; the calculation formula is as follows: OS_corrected=OS_raw-(T_T+T_V) Among them, OS_raw is the calculated uncorrected clock deviation, and OS_corrected is the corrected clock deviation; The device clock message is carried by Ethernet messages, and the Ethernet message type field is 0x88D3.

4. According to claim 1, a new communication vehicle integration system is characterized in that: The device password protocol interaction process is as follows: Step 301: The cryptographic module integrates a quantum random number generator QRNG, collects the polarization state of photons in real time, and generates a quantum entropy source QRNG_output. At the same time, the chaotic sequence Chaos_sequence is generated by combining the chaotic map, and is XOR-fused with the quantum entropy source to generate a session key Sec. The calculation formula is: Sec=QRNG_output⊕Chaos_sequence; Step 302, when the modular device is connected, the password proxy module is used to collect hardware fingerprints, voiceprint features and dynamic power consumption signatures, and send authentication and encryption request messages to the password module; Step 303, the password module verifies after receiving it; if the verification fails, the session key is refused to be sent, it is determined that there may be an attack, and a power-off instruction for the corresponding modular device is sent to the power module; if the verification passes, the session key is sent to the password proxy module, and the next step is performed; Step 304: The cryptographic proxy module calls the encryption algorithm, uses the session key to encrypt the data, and sends it to the receiving end.

5. According to claim 1, a new communication vehicle integration system is characterized in that: The device power protocol interaction process includes: Step 401, after the modular device is powered on, the power proxy module sends a registration request message to the power module, carrying the device hardware fingerprint, rated power, security certificate, and dynamic power consumption feature code information; and applies for the power allocation required by the modular device; Step 402: After receiving the certificate, the power module verifies the validity of the certificate and compares it with the power consumption signature database to prevent cloned devices from accessing. If the verification fails, the modular device will be denied power; if the verification passes, the power will be dynamically allocated according to the power requirements of the modular device; Step 403: The power module uses the LSTM neural network model to input the historical power sequence, device type, and task queue depth, predicts the power consumption Ppred of the modular device in the next 30 seconds, and dynamically pre-allocates power, which can convert the traditional responsive allocation into predictive allocation, shorten the power supply response time of the sudden increase load, and avoid instantaneous overload: Step 404, the power proxy module detects the voltage at the device end in real time, and after finding that the voltage change does not meet the use requirements of the modular device, sends feedback to the power module in real time, and the power module performs dynamic adjustment; Step 405: the power module receives the power-off instruction sent by the password module and directly powers off the corresponding modular device; Step 406: When the power module detects that the current is greater than 110% of the rated value, an overload power-off message is sent to the power agent module of the modular device, and the power supply is cut off.

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