Display panel, manufacturing method of display panel and display device

By setting connection lines on the side surface of the display panel and adopting a protective structure, the problem of insufficient border width and reliability of existing OLED display products is solved, and the performance of the display panel is improved.

CN120076630APending Publication Date: 2025-05-30SUZHOU GUOXIAN INNOVATION TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510238604.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-28
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

The performance of existing OLED display products needs to be improved, especially in terms of frame width and reliability.

Method used

By setting connection lines on the side surface of the display panel, the first trace in the array layer is connected to the second trace on the back, the frame width is reduced, and structures such as side encapsulation layer, waterproof layer and conductive film layer are used when necessary to improve reliability.

Benefits of technology

This solution reduces the border width of the display panel, improves performance, and enhances the reliability of the panel through a protective structure.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120076630A_ABST
    Figure CN120076630A_ABST
Patent Text Reader

Abstract

The invention provides a display panel, a manufacturing method of the display panel and a display device.The display panel comprises a substrate, an array layer and a second wiring layer, the substrate comprises a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged in the thickness direction, the side surface is connected with the first surface and the second surface, and a connecting line is arranged on the side surface; the array layer is located on the first surface, and the array layer comprises a first wire; the second wiring layer is located on the side, away from the array layer, of the second surface, the second wiring layer comprises a second wire, and at least part of the first wire and the second wire are electrically connected through a connecting wire. According to the display panel provided by the invention, the first wires in the array layer are connected to the second wires on the back surface through the connecting wires on the side surface, compared with a scheme of bending the display panel to the back surface, the bending radius of the bending area does not need to be considered, the frame width of the display panel is reduced, and the use performance of the display panel is further improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the performance of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, including a substrate, an array layer and a second routing layer, the substrate including a first surface, a second surface and a side surface connecting the first surface and the second surface which are arranged opposite to each other in a thickness direction, and a connecting line is provided on the side surface; the array layer is located on the first surface, and the array layer includes a first routing line; the second routing layer is located on a side of the second surface away from the array layer, and the second routing layer includes a second routing line, and at least part of the first routing line and the second routing line are electrically connected via the connecting line.

[0006] According to an implementation scheme of the first aspect of the present application, the display panel includes a display area and a non-display area that at least partially encloses the display area, the connecting line is located in the non-display area, and at least part of the first wiring extends from the display area to the non-display area; optionally, the connecting line extends along the thickness direction of the display panel; optionally, the first wiring includes at least one of a drive signal line, a data line, and a scan line.

[0007] An embodiment of the first aspect of the present application provides a display panel, wherein a non-display area includes a first sub-area, a second sub-area, a third sub-area and a fourth sub-area, the first sub-area and the second sub-area are located on both sides of the display area in a first direction, the third sub-area and the fourth sub-area are located on both sides of the display area in a second direction, the first sub-area, the second sub-area, the third sub-area and the fourth sub-area are all provided with connecting lines, and the first direction, the second direction and the thickness direction of the display panel are intersected in pairs.

[0008] An embodiment of the first aspect of the present application provides a display panel, further comprising: a side encapsulation layer covering the side of the connection line facing away from the substrate and sealingly connected to the substrate; optionally, the orthographic projection of the connection line on the side surface is located within the orthographic projection of the side encapsulation layer on the side surface; optionally, the side encapsulation layer is an inorganic encapsulation layer.

[0009] An embodiment of the first aspect of the present application provides a display panel, further comprising: a side waterproof layer located on the side of the side encapsulation layer facing away from the connection line, and the side waterproof layer extends along the thickness direction of the display panel; optionally, the orthographic projection of the connection line on the side surface is located within the orthographic projection of the side waterproof layer on the side surface.

[0010] An embodiment of the first aspect of the present application provides a display panel, further comprising: a control component located on the side of the second wiring layer facing away from the substrate, and at least part of the second wiring is electrically connected to the control component; optionally, the control component includes at least one of a flexible circuit board, a chip on film, and an integrated circuit; optionally, the display panel further comprises a second waterproof layer located on the side of the control component facing away from the substrate, and the orthographic projection of the control component on the substrate is located within the orthographic projection of the second waterproof layer on the substrate.

[0011] An embodiment of the first aspect of the present application provides a display panel, further comprising: a conductive film layer located between the second wiring layer and the control component, and the second wiring and the control component are electrically connected through the conductive film layer; optionally, the display panel further comprises a conductive adhesive layer, and conductive adhesive layers are provided on both the side of the conductive film layer facing the second wiring layer and the side facing the control component.

[0012] An embodiment of the first aspect of the present application provides a display panel. The display panel includes a display area and at least part of a non-display area surrounding the display area. The display panel further comprises a pixel definition layer, a light shielding layer, and a polarizer layer. The pixel definition layer is located on the side of the array layer facing away from the substrate. The pixel definition layer includes pixel openings located in the display area, and the pixel openings are used to accommodate light-emitting units; the polarizer layer is located on the side of the pixel definition layer facing away from the substrate; the light shielding layer includes light shielding portions located in the non-display area, and the light shielding layer is provided between the polarizer layer and the pixel definition layer, and / or at least part of the light shielding layer and the polarizer layer are provided on the same layer, and / or the light shielding layer is located on the side of the polarizer layer facing away from the substrate; optionally, the material of the light shielding portion includes at least one of a black pigment, toner, a black inorganic material, and a black adhesive material.

[0013] An embodiment of the first aspect of the present application provides a display panel. The light shielding layer is located on the side of the polarizer layer facing away from the substrate. The light shielding layer further includes a light-transmitting portion located in the display area, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the light-transmitting portion on the substrate; optionally, the material of the light-transmitting portion includes a transparent optical adhesive, and the material of the light shielding portion includes a black optical adhesive.

[0014] An embodiment of the second aspect of the present application further provides a method for manufacturing a display panel, including: the substrate includes a first surface, a second surface disposed opposite to each other in the thickness direction, and a side surface connecting the first surface and the second surface, a connection line is formed on the side surface of the substrate; an array layer is formed on the first surface, and a first trace is formed on the array layer; a second trace layer is formed on the second surface, a second trace is formed on the second trace layer, and at least part of the first trace and the second trace are electrically connected through the connection line.

[0015] An embodiment of the second aspect of the present application provides a method for manufacturing a display panel. After the step of electrically connecting at least part of the first trace and the second trace through the connection line, it further includes: covering the connection line with a side encapsulation layer and sealingly connecting it to the substrate.

[0016] An embodiment of the second aspect of the present application provides a method for manufacturing a display panel. After the step of covering the connection line with a side encapsulation layer and sealingly connecting it to the substrate, it further includes: covering the side encapsulation layer with a side waterproof layer.

[0017] An embodiment of the second aspect of the present application provides a method for manufacturing a display panel. After the step of electrically connecting at least part of the first trace and the second trace through the connection line, it further includes: electrically connecting a control component to at least part of the second trace.

[0018] An embodiment of the second aspect of the present application provides a method for manufacturing a display panel. The second trace and the control component are electrically connected through a conductive film layer.

[0019] An embodiment of the second aspect of the present application provides a method for manufacturing a display panel. After the step of electrically connecting the second trace and the control component through a conductive film layer, it further includes: providing conductive adhesive layers on both sides of the conductive film layer.

[0020] An embodiment of the second aspect of the present application provides a method for manufacturing a display panel. After the step of forming an array layer on the first surface and forming a first trace on the array layer, it further includes: the display panel includes a display area and at least part of a non-display area surrounding the display area, a light-shielding layer is formed on the array layer, and the light-shielding layer includes a light-shielding portion located in the non-display area.

[0021] An embodiment of the second aspect of the present application provides a method for manufacturing a display panel. The light-shielding layer includes a light-shielding portion located in the non-display area, and the material of the light-shielding portion includes at least one of black pigment, carbon powder, black inorganic material, and black adhesive.

[0022] An embodiment of the third aspect of the present application further provides a display device, including the display panel provided by any one of the above first aspect embodiments and the display panel manufactured by the method for manufacturing a display panel provided by any one of the above second aspect embodiments.

[0023] In the display panel provided in the embodiment of the present application, the display panel includes a substrate, an array layer and a second wiring layer, the substrate includes a first surface, a second surface and a side surface connecting the first surface and the second surface arranged opposite to each other in the thickness direction, and a connecting line is provided on the side surface; the array layer is located on the first surface, and the array layer includes a first wiring; the second wiring layer is located on the side of the second surface away from the array layer, and the second wiring layer includes a second wiring, and at least part of the first wiring and the second wiring are electrically connected through the connecting line. The display panel provided in the present application connects the first wiring in the array layer to the second wiring on the back side by connecting the connecting line located on the side surface, so compared with the solution of bending the display panel to the back side, there is no need to consider the bending radius of the bending zone, and the frame width of the display panel is reduced, thereby improving the performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0025] Figure 1 is a top view of a display panel provided in an embodiment of the present application;

[0026] Figure 2 It is an example Figure 1 Sectional view at AA in the middle;

[0027] Figure 3 is a top view of another exemplary display panel;

[0028] Figure 4 Another example is Figure 1 Sectional view at AA in the middle;

[0029] Figure 5 This is another example Figure 1 Sectional view at AA in the middle;

[0030] Figure 6 It is another example Figure 1 Sectional view at AA in the middle;

[0031] Figure 7 It is another example Figure 1 Sectional view at AA in the middle;

[0032] Figure 8 It is another example Figure 1 Sectional view at AA in the middle;

[0033] Figure 9 This is one of the flow charts of a method for manufacturing a display panel provided in an embodiment of the present application;

[0034] Figure 10 It is the second flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.

[0035] Explanation of reference numerals:

[0036] 10. Display panel;

[0037] 100. Substrate; 110. First surface; 120. Second surface; 130. Side surface; 131. Connection line;

[0038] 200. Array layer; 210. First trace;

[0039] 300. Second trace layer; 310. Second trace;

[0040] 400. Side encapsulation layer; 410. Side waterproof layer;

[0041] 500. Control component; 510. Second waterproof layer; 520. Conductive film layer; 530. Conductive adhesive layer;

[0042] 600. Pixel definition layer; 610. Pixel opening; 620. Light-emitting unit; 630. Encapsulation layer;

[0043] 700. Light-shielding layer; 710. Light-shielding portion; 720. Light-transmitting portion;

[0044] 800. Polarizer layer;

[0045] 900. Cover plate;

[0046] AA. Display area; NA. Non-display area; NA1. First sub-area; NA2. Second sub-area; NA3. Third sub-area; NA4. Fourth sub-area; z. Thickness direction; x. First direction; y. Second direction. Detailed implementation manners

[0047] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application. In the drawings and the following description, at least some of the well-known structures and technologies are not shown in order to avoid unnecessarily obscuring the present application; and, for clarity, the dimensions of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0048] In the description of the present application, it should be noted that unless otherwise specified, the meaning of "a plurality" is more than two; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0049] The orientation words appearing in the following description are all the directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0050] For a better understanding of the present application, the following will Figures 1 to 8 describe in detail the display panel, the manufacturing method of the display panel, and the display device according to the embodiments of the present application. Among them, the z direction is the thickness direction of the display panel.

[0051] Please refer to Figure 1 and Figure 2 , Figure 1 which is a top view of a display panel provided by an embodiment of the present application; Figure 2 is an example of Figure 1 a cross-sectional view taken along line A-A in

[0052] As shown in Figure 1 and Figure 2 , an embodiment of the first aspect of the present application provides a display panel 10, which includes a substrate 100, an array layer 200, and a second wiring layer 300. The substrate 100 includes a first surface 110, a second surface 120 that are oppositely arranged along the thickness direction (the z direction in the figure), and a side surface 130 connecting the first surface 110 and the second surface 120. A connection line 131 is provided on the side surface 130. The array layer 200 is located on the first surface 110, and the array layer 200 includes a first wiring 210. The second wiring layer 300 is located on the side of the second surface 120 away from the array layer 200. The second wiring layer 300 includes a second wiring 310, and at least part of the first wiring 210 and the second wiring 310 are electrically connected through the connection line 131.

[0053] The display panel 10 provided by the present application connects the first trace 210 in the array layer 200 to the second trace 310 on the back surface through the connection line 131 located on the side surface 130. Compared with the solution of bending the display panel to the back surface, there is no need to consider the bending radius of the bending area, reducing the border width of the display panel 10, thereby improving the performance of the display panel 10.

[0054] Optionally, the first surface 110 faces the light-emitting side of the display panel 10, and the second surface 120 faces the backlight side of the display panel 10. The display panel 10 further includes a display area AA and a non-display area NA that at least partially encloses the display area AA. The connection line 131 is located in the non-display area NA. At least part of the first trace 210 extends from the display area AA to the non-display area NA. The connection line 131 extends along the thickness direction z of the display panel 10.

[0055] Optionally, there are various ways to arrange the array layer 200. The array layer 200 may include a first metal layer, a second metal layer, and a third metal layer that are stacked. Insulation layers are provided between adjacent metal layers. Optionally, a driving device layer is provided on the array layer 200. A pixel driving circuit is provided in the driving device layer. The pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode plate and a second electrode plate. As an example, the gate and the first electrode plate may be located in the first metal layer, the second electrode plate may be located in the second metal layer, and the source and the drain may be located in the third metal layer. The first trace 210 may be located in any metal layer, and the first trace 210 may be at least one of a driving signal line, a data line, and a scanning line.

[0056] Optionally, when manufacturing the display panel 10, the array layer 200 and the second trace layer 300 may be prepared on the first surface 110 and the second surface 120 of the substrate 100 respectively, and then the side surface of the array layer 200 is ground to expose the interface of the first trace 210. The grinding method may use a dicing wheel or laser cutting. Then, the connection line 131 is prepared on the side surface 130 and electrically connects the first trace 210 and the second trace 310. The connection line 131 may be prepared by processes such as nanoimprinting, a mask plate, and laser patterning.

[0057] Please refer to Figure 3 , Figure 3 which is a top view of another example of a display panel.

[0058] As shown in Figure 3As shown, in some alternative embodiments, the non-display area NA includes a first sub-area NA1, a second sub-area NA2, a third sub-area NA3, and a fourth sub-area NA4. The first sub-area NA1 and the second sub-area NA2 are located on both sides of the display area AA in the first direction (the x-direction in the figure), and the third sub-area NA3 and the fourth sub-area NA4 are located on both sides of the display area AA in the second direction (the y-direction in the figure). Connection lines 131 are provided in the first sub-area NA1, the second sub-area NA2, the third sub-area NA3, and the fourth sub-area NA4. The first direction x, the second direction y, and the thickness direction z intersect pairwise.

[0059] Optionally, the first direction x is the vertical direction, and the second direction y is the horizontal direction. It can be understood that the first sub-area NA1, the second sub-area NA2, the third sub-area NA3, and the fourth sub-area NA4 are the upper border area, the lower border area, the left border area, and the right border area of the display panel 10, respectively.

[0060] Compared with the solution of only routing wires at the lower border, for the display panel 10 provided in the present application, by arranging connection lines 131 in the non-display area NA around the display area AA, the wiring density per unit size is effectively reduced, and thus the wiring difficulty is reduced.

[0061] As Figure 4 shown, in some alternative embodiments, the display panel 10 may further include a side encapsulation layer 400. The side encapsulation layer 400 covers the side of the connection line 131 facing away from the substrate 100 and is hermetically connected to the substrate 100.

[0062] Optionally, the orthographic projection of the connection line 131 on the side surface 130 is located within the orthographic projection of the side encapsulation layer 400 on the side surface 130.

[0063] Optionally, the side encapsulation layer 400 is an inorganic encapsulation layer.

[0064] Optionally, the side encapsulation layer 400 is prepared by atomic vapor deposition.

[0065] For the display panel 10 provided in the present application, by covering the side encapsulation layer 400 outside the first trace 210 to protect the first trace 210, the probability of the first trace 210 being corroded due to exposure is reduced, and thus the reliability of the display panel 10 is improved.

[0066] In some alternative embodiments, the display panel 10 may further include a side waterproof layer 410. The side waterproof layer 410 is located on the side of the side encapsulation layer 400 facing away from the connection line 131, and the side waterproof layer 410 extends along the thickness direction z of the display panel 10.

[0067] Optionally, the orthographic projection of the connection line 131 on the side surface 130 is located within the orthographic projection of the side waterproof layer 410 on the side surface 130.

[0068] Optionally, the orthographic projection of the side encapsulation layer 400 on the side surface 130 coincides with or is located within the orthographic projection of the side waterproof layer 410 on the side surface 130.

[0069] Optionally, the material of the side waterproof layer 410 includes a colorless and transparent material for observing whether there are problems such as broken wires or poor connections in the connection line 131 through the side waterproof layer 410. The material of the side waterproof layer 410 is also required to be acid and alkali resistant and grease resistant to prevent corrosion of the connection line 131 by water vapor intrusion when the side encapsulation layer 400 fails to be encapsulated.

[0070] Please refer to Figure 5 , Figure 5 is a cross-sectional view taken along line A-A in another example of Figure 1 the

[0071] As Figure 5 shown, in some optional embodiments, the display panel 10 may further include a control component 500. The control component 500 is located on the side of the second wiring layer 300 away from the substrate 100, and at least a part of the second wiring 310 is electrically connected to the control component 500.

[0072] Optionally, the control component 500 includes at least one of a flexible printed circuit board (FPC), a chip on film (IC), and a chip on flexible substrate (COF).

[0073] Optionally, the display panel 10 may further include a second waterproof layer 510. The second waterproof layer 510 is located on the side of the control component 500 away from the substrate 100, and the orthographic projection of the control component 500 on the substrate 100 is located within the orthographic projection of the second waterproof layer 510 on the substrate 100.

[0074] Optionally, the second waterproof layer 510 is made of the same material as the side waterproof layer 410, and the second waterproof layer 510 and the side waterproof layer 410 are prepared in the same process.

[0075] For the display panel 10 provided in this application, by providing a control component 500 electrically connected to the second wiring 310 on the back of the second wiring layer 300, it is used to connect the external wiring of the display panel 10. By covering the outside of the control component 500 with the second waterproof layer 510, it is used to protect the control component 500 from water and oxygen erosion.

[0076] In some optional embodiments, the display panel 10 may further include a conductive film layer 520. The conductive film layer 520 is located between the second wiring layer 300 and the control component 500, and the second wiring 310 and the control component 500 are electrically connected through the conductive film layer 520.

[0077] Optionally, the display panel 10 may further include a conductive adhesive layer 530. The conductive adhesive layer 530 is provided on both the side of the conductive film layer 520 facing the second wiring layer 300 and the side facing the control component 500.

[0078] Optionally, the thickness of the single-layer conductive adhesive layer 530 is 10μm - 70μm. For example, the thickness of the single-layer conductive adhesive layer 530 can be 10μm, 30μm, 45μm, 50μm, 70μm. The thickness of the conductive film layer 520 is 10μm - 300μm, and the thickness of the conductive film layer 520 can be 10μm, 100μm, 200μm, 250μm, 300μm. The conductive adhesive layers 530 on both sides of the conductive film layer 520 are used to connect the control component 500 and the second wiring layer 300. The material of the conductive film layer 520 includes conductive metal or conductive fiber.

[0079] In the display panel 10 provided in this application, by using the conductive adhesive layer 530 to connect the control component 500 and the second wiring layer 300, compared with the method of connecting through an anisotropic conductive film, the conductive adhesive layer 530 does not require high-temperature and high-pressure preparation conditions, thereby reducing the damage to the display panel 10 caused by high temperature and high pressure.

[0080] As Figures 6 to 8 shown, in some optional embodiments, the display panel 10 may further include a pixel definition layer 600, a light shielding layer 700, and a polarizer layer 800. The pixel definition layer 600 is located on the side of the array layer 200 away from the substrate 100. The pixel definition layer 600 includes pixel openings 610 located in the display area AA, and the pixel openings 610 are used to accommodate the light-emitting units 620. The polarizer layer 800 is located on the side of the pixel definition layer 600 away from the substrate 100. The light shielding layer 700 includes light shielding portions 710 located in the non-display area NA. The light shielding layer 700 is located between the polarizer layer 800 and the pixel definition layer 600, and / or the light shielding layer 700 and the polarizer layer 800 are provided on the same layer, and / or the light shielding layer 700 is located on the side of the polarizer layer 800 away from the substrate 100.

[0081] Optionally, the material of the light shielding portion 710 includes at least one of black pigment, carbon powder, black inorganic material, and black adhesive. The blackness of the material of the light shielding portion 710 is greater than or equal to 5.

[0082] Optionally, as Figure 6 shown, the light shielding layer 700 is located between the polarizer layer 800 and the pixel definition layer 600, and the light shielding portion 710 is prepared by a coating process. The orthographic projection of the light shielding portion 710 on the substrate 100 overlaps with the orthographic projection of the non-display area NA on the substrate 100.

[0083] Optionally, the display panel 10 may further include a packaging layer 630, which is located on the side of the light-emitting unit 620 facing away from the substrate 100. The packaging layer 630 may be an organic packaging layer and / or an inorganic packaging layer. The light-shielding layer 700 is disposed on the same layer as the packaging layer 630, or the light-shielding layer 700 is located between the packaging layer 630 and the polarizer layer 800.

[0084] Optionally, as Figure 7 shown, the light-shielding layer 700 and the polarizer layer 800 are disposed on the same layer. The orthographic projection of the polarizer layer 800 on the substrate 100 overlaps with the orthographic projection of the display area AA on the substrate 100, and the orthographic projection of the light-shielding portion 710 on the substrate 100 overlaps with the orthographic projection of the non-display area NA on the substrate 100. It can also be understood that the polarizer layer 800 is only located in the display area AA, the light-shielding portion 710 is only located in the non-display area NA, and the light-shielding portion 710 is disposed around the polarizer layer 800.

[0085] Optionally, the display panel 10 may further include a cover plate 900, which is located on the side of the polarizer layer 800 facing away from the substrate 100. The light-shielding layer 700 is located between the polarizer layer and the polarizer.

[0086] For the display panel 10 provided in the present application, by disposing the light-shielding portion 710 on at least one side of the polarizer layer 800 or on the same layer as the polarizer layer 800, the emitted light of the traces located in the non-display area NA is blocked and absorbed, reducing the light leakage and edge leakage problems in the non-display area NA.

[0087] As Figure 8 shown, in some alternative embodiments, the light-shielding layer 700 is located on the side of the polarizer layer 800 facing away from the substrate 100. The light-shielding layer 700 further includes a light-transmitting portion 720 located in the display area AA. The orthographic projection of the light-emitting unit 620 on the substrate 100 is located within the orthographic projection of the light-transmitting portion 720 on the substrate 100.

[0088] Optionally, the material of the light-transmitting portion 720 includes transparent optical glue, and the material of the light-shielding portion 710 includes black optical glue.

[0089] Optionally, the orthographic projection of the light-transmitting portion 720 on the substrate 100 overlaps with the orthographic projection of the display area AA on the substrate 100, and the orthographic projection of the light-shielding portion 710 on the substrate 100 overlaps with the orthographic projection of the non-display area NA on the substrate 100. The light-shielding portion 710 is disposed to enclose the light-transmitting portion 720.

[0090] For the display panel 10 provided in the present application, by making the light-shielding layer 700 further include the light-transmitting portion 720 located in the AA area, while improving the flatness of the entire surface of the light-shielding layer 700, the normal light emission of the light-emitting unit 620 is not affected.

[0091] An embodiment of the second aspect of the present application further provides a method for manufacturing a display panel, as Figure 2and Figure 9 as shown, including:

[0092] Step S100: The substrate 100 includes a first surface 110, a second surface 120 disposed opposite to each other in the thickness direction z, and a side surface 130 connecting the first surface 110 and the second surface 120. A connecting line 131 is formed on the side surface 130 of the substrate 100.

[0093] Step S200: An array layer 200 is formed on the first surface 110, and a first trace 210 is formed on the array layer 200.

[0094] Step S300: A second trace layer 300 is formed on the second surface 120, and a second trace 310 is formed on the second trace layer 300.

[0095] Step S400: At least part of the first trace 210 and the second trace 310 are electrically connected through the connecting line 131.

[0096] In the embodiment of the second aspect of the present application, the connecting line 131 is formed through step S100, the first trace 210 is formed through step S200, the second trace 310 is formed through step S300, and at least part of the first trace 210 and the second trace 310 are connected through the connecting line 131 in step S400. Compared with the solution of bending the display panel 10 to the back surface, there is no need to consider the bending radius of the bending area, the border width of the display panel 10 is reduced, and thus the service performance of the display panel 10 is improved.

[0097] In some alternative embodiments, as Figure 5 and Figure 10 shown, after step S400, step S500 is further included: covering the connecting line 131 with a side encapsulation layer 400 and sealingly connecting it to the substrate 100.

[0098] In these alternative embodiments, the first trace 210 is protected through step S500, the probability of the first trace 210 being corroded due to exposure is reduced, and thus the reliability of the display panel 10 is improved.

[0099] Optionally, after step S400, the following is further included: covering the side encapsulation layer 400 with a side waterproof layer 410 for observing whether there are problems such as broken wires and loose connections in the connecting line 131 through the side waterproof layer 410.

[0100] Optionally, after step S300, the following is further included: electrically connecting a control component 500 to at least part of the second trace 310, and by disposing the control component 500 electrically connected to the second trace 310 on the back surface of the second trace layer 300, it is used to connect the external traces of the display panel 10.

[0101] Optionally, after the step of electrically connecting the control component 500 to at least a part of the second trace 310, the method further includes: electrically connecting the second trace 310 and the control component 500 through a conductive film layer 520. The second trace 310 and the control component 500 are electrically connected through the conductive film layer 520. Conductive adhesive layers 530 are provided on both sides of the conductive film layer 520. By using the conductive adhesive layers 530 to connect the control component 500 and the second trace layer 300, compared with the method of connecting through an anisotropic conductive film, the conductive adhesive layers 530 do not require preparation conditions of high temperature and high pressure, thereby reducing the damage to the display panel 10 caused by high temperature and high pressure.

[0102] In some alternative embodiments, such as Figure 6 and Figure 10 as shown, after step S500, the method further includes step S600: The display panel 10 includes a display area AA and at least a part of a non-display area NA surrounding the display area AA. A light-shielding layer 700 is formed on the array layer 200, and the light-shielding layer 700 includes a light-shielding portion 710 located in the non-display area NA.

[0103] In these alternative embodiments, the light-shielding portion 710 formed through step S500 can block and absorb the radiated light of the traces located in the non-display area NA, reducing the problems of light leakage and edge leakage in the non-display area NA.

[0104] Optionally, the light-shielding layer 700 includes a light-shielding portion 710 located in the non-display area NA, and the material of the light-shielding portion 710 includes at least one of black pigment, carbon powder, black inorganic material, and black adhesive.

[0105] An embodiment of the third aspect of the present application further provides a display device, including the display panel of any one of the above first aspect embodiments and the display panel manufactured by the manufacturing method of the display panel of any one of the above second aspect embodiments. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel of any one of the above embodiments, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel of any one of the above embodiments, which will not be elaborated here.

[0106] The display device in the embodiments of the present application includes, but is not limited to, devices with a display function such as mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control devices, smart landline telephones, consoles, etc.

[0107] Although the present application has been described with reference to the preferred embodiments, various modifications can be made thereto and components thereof can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any manner. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a first surface, a second surface and a side surface connecting the first surface and the second surface, wherein a connecting line is provided on the side surface; An array layer, located on the first surface, the array layer comprising a first trace; The second routing layer is located on a side of the second surface away from the array layer. The second routing layer includes second routing lines. At least part of the first routing lines and the second routing lines are electrically connected through the connecting wires.

2. The display panel according to claim 1, characterized in that: The display panel comprises a display area and a non-display area at least partially surrounding the display area, the connection line is located in the non-display area, and at least part of the first wiring extends from the display area to the non-display area; Preferably, the connecting line extends along the thickness direction of the display panel; Preferably, the first wiring includes at least one of a driving signal line, a data line, and a scan line.

3. The display panel according to claim 2, characterized in that: The non-display area includes a first sub-area, a second sub-area, a third sub-area and a fourth sub-area, the first sub-area and the second sub-area are located on both sides of the display area in a first direction, the third sub-area and the fourth sub-area are located on both sides of the display area in a second direction, the first sub-area, the second sub-area, the third sub-area and the fourth sub-area are all provided with the connecting line, and the first direction, the second direction and the thickness direction of the display panel are intersected in pairs.

4. The display panel according to claim 1, characterized in that: Also includes: A side encapsulation layer, covering a side of the connection line away from the substrate and being sealed and connected to the substrate; Preferably, the orthographic projection of the connecting line on the side surface is located within the orthographic projection of the side encapsulation layer on the side surface; Preferably, the side encapsulation layer is an inorganic encapsulation layer; Preferably, the display panel further comprises a side waterproof layer, the side waterproof layer is located on a side of the side encapsulation layer away from the connecting line, and the side waterproof layer extends along the thickness direction of the display panel; Preferably, the orthographic projection of the connecting line on the side surface is located within the orthographic projection of the side waterproof layer on the side surface.

5. The display panel according to claim 1, characterized in that: Also includes: A control component is located on a side of the second wiring layer away from the substrate, and at least part of the second wiring is electrically connected to the control component; Preferably, the control component includes at least one of a flexible printed circuit board, a chip-on-film, and an integrated circuit; Preferably, the display panel further comprises a second waterproof layer, the second waterproof layer is located on a side of the control component away from the substrate, and the orthographic projection of the control component on the substrate is located within the orthographic projection of the second waterproof layer on the substrate; Preferably, the display panel further comprises: a conductive film layer, located between the second wiring layer and the control component, wherein the second wiring layer and the control component are electrically connected through the conductive film layer; Preferably, the display panel further comprises a conductive adhesive layer, and the conductive adhesive layer is provided on both the side of the conductive film layer facing the second wiring layer and the side facing the control component.

6. The display panel according to claim 1, characterized in that: The display panel comprises a display area and a non-display area at least partially enclosing the display area, and the display panel further comprises a pixel definition layer, a light shielding layer and a polarizer layer, wherein the pixel definition layer is located on a side of the array layer away from the substrate, and the pixel definition layer comprises a pixel opening located in the display area, and the pixel opening is used to accommodate a light-emitting unit; the polarizer layer is located on a side of the pixel definition layer away from the substrate; the light shielding layer comprises a light shielding portion located in the non-display area, the light shielding layer is arranged between the polarizer layer and the pixel definition layer, and / or the light shielding layer and the polarizer layer are at least partially arranged in the same layer, and / or the light shielding layer is located on a side of the polarizer layer away from the substrate; Preferably, the material of the light shielding portion includes at least one of black pigment, carbon powder, black inorganic material, and black glue; Preferably, the light shielding layer is located on a side of the polarizer layer away from the substrate, the light shielding layer further comprises a light-transmitting portion located in the display area, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the light-transmitting portion on the substrate; Preferably, the material of the light-transmitting portion includes transparent optical glue, and the material of the light-shielding portion includes black optical glue.

7. A method for manufacturing a display panel, characterized in that: include: The substrate comprises a first surface, a second surface and a side surface connecting the first surface and the second surface, and a connection line is formed on the side surface of the substrate; forming an array layer on the first surface, and forming a first trace on the array layer; Forming a second routing layer on the second surface, and forming a second routing on the second routing layer; At least a portion of the first routing line and the second routing line are electrically connected via the connecting line.

8. The method for manufacturing a display panel according to claim 7, characterized in that: After the step of electrically connecting at least part of the first routing line and the second routing line through the connecting line, the step further includes: Covering the connection line with a side encapsulation layer and sealingly connecting the side encapsulation layer to the substrate; Preferably, after the step of covering the connecting wire with the side encapsulation layer and sealingly connecting with the substrate, the step further includes: covering the side encapsulation layer with a side waterproof layer; Preferably, after forming a second wiring layer on the second surface and forming second wirings on the second wiring layer, the method further includes: electrically connecting the control component to at least part of the second wirings; Preferably, after the step of electrically connecting the control component to at least part of the second wiring, the step further includes: electrically connecting the second wiring to the control component through a conductive film layer; Preferably, after electrically connecting the second wiring to the control component through the conductive film layer, the step further includes: providing conductive adhesive layers on both sides of the conductive film layer.

9. The method for manufacturing a display panel according to claim 8, characterized in that: After the step of covering the connecting wire with the side encapsulation layer and sealingly connecting the side encapsulation layer to the substrate, the following step is further included: The display panel comprises a display area and a non-display area at least partially surrounding the display area, a light shielding layer is formed on the array layer, and the light shielding layer comprises a light shielding portion located in the non-display area; Preferably, the light shielding layer includes a light shielding portion located in the non-display area, and a material of the light shielding portion includes at least one of black pigment, carbon powder, black inorganic material, and black glue.

10. A display device, characterized in that: A display panel comprising the display panel as claimed in any one of claims 1 to 6 and a display panel manufactured by the display panel manufacturing method as claimed in any one of claims 7 to 9.