A flexible integrated array for electromyography and ultrasound co-sensing and a method of manufacturing the same

Abstract

The application discloses a flexible integrated array of electromyography and ultrasonic collaborative sensing and a preparation method thereof. The flexible integrated array comprises an ultrasonic sensing array and an electromyography sensing array integrated on a wearable flexible film. The piezoelectric module layer of each ultrasonic sensing module and the electromyography electrode layer of each electromyography sensing module are connected to an external circuit. The sensing modules are arranged and designed according to the muscle position and direction of a specific part of a human body, forming a high-density and high-precision ultrasonic / electromyography collaborative sensing hybrid integrated array. The ultrasonic signal and the electromyography signal of the muscle can be acquired simultaneously, so that multi-dimensional muscle state monitoring is realized. When the flexible integrated array monitors an abnormal signal, the position of the abnormal muscle can be determined through an array element receiving the abnormal signal, so that automatic positioning of the abnormal muscle is realized.

Description

Technical Field

[0001] This application relates to the field of signal fusion technology, and in particular to a flexible integrated array for electromyography and ultrasound co-sensing and its fabrication method. Background Technology

[0002] Electromyography (EMG) signals are electrical signals generated by muscles during contraction, providing an objective and accurate assessment of muscle function. For example, in cases of muscle fatigue or pain, EMG signals exhibit increased time-domain amplitude and a leftward shift in the frequency domain spectrum. However, EMG signals are one-dimensional signals, lacking spatial domain information and susceptible to interference from superficial skin fat. In contrast, ultrasound technology, especially high-frequency ultrasound, can clearly observe the structure of soft tissues such as intervertebral discs, muscles, and ligaments, directly reflecting the spatial state of muscles. Therefore, ultrasound and EMG signals provide effective complementary information. Combining these two technologies allows for a more comprehensive understanding of the physiological state of human muscles, providing more comprehensive and accurate diagnostic information for clinical practice.

[0003] Numerous studies have combined these two technologies to investigate muscle physiology. However, these studies typically employ two separate traditional detection methods to acquire signals: rigid Ag / AgCl gel electrodes for electromyography (EMG) and handheld rigid probes for ultrasound. The traditional Ag / AgCl electrode method struggles to establish reliable and stable contact with the skin, significantly impacting the accuracy of EMG monitoring. Furthermore, traditional handheld rigid probes require manual operation by a physician, hindering long-term continuous measurements. Additionally, the need to acquire two separate sets of signals complicates the process and reduces integration.

[0004] Therefore, overcoming the limitations of combining ultrasound and electromyography signals has become a current research hotspot and challenge. Summary of the Invention

[0005] The purpose of this application is to provide a flexible integrated array for electromyography and ultrasound co-sensing and its fabrication method, which can simultaneously acquire ultrasound signals and electromyography signals of muscles, thereby realizing multi-dimensional muscle state monitoring.

[0006] To achieve the above objectives, this application provides the following solution: In a first aspect, this application provides a flexible integrated array for electromyography (EMG) and ultrasound co-sensing, comprising: an ultrasound sensing array and an EMG sensing array, the ultrasound sensing array and the EMG sensing array being integrated on a wearable flexible film. The ultrasound sensing array includes several ultrasound sensing modules, and the EMG sensing array includes several EMG sensing modules. The ultrasound sensing modules and the EMG sensing modules are arranged according to the muscle location and direction of a specific part of the human body. The ultrasound sensing module comprises, from top to bottom, a first thin-film electrode layer, a piezoelectric module layer, and a second thin-film electrode layer; the first thin-film electrode layer... The membrane electrode layer comprises, from top to bottom, a first elastic encapsulation layer, a first electromagnetic shielding layer, a first elastic isolation layer, and a grounding electrode layer; the second thin-film electrode layer comprises, from top to bottom, an excitation electrode layer, a second elastic isolation layer, a second electromagnetic shielding layer, and a second elastic encapsulation layer; the electromyography sensing module comprises, from top to bottom, a third thin-film electrode layer and an electrophysiological adhesion layer; the third thin-film electrode layer comprises, from top to bottom, a third elastic encapsulation layer, a third electromagnetic shielding layer, a third elastic isolation layer, and an electromyography electrode layer; the piezoelectric module layer of each ultrasound sensing module and the electromyography electrode layer of each electromyography sensing module are all connected to an external circuit.

[0007] Optionally, the ultrasound sensing module and the electromyography sensing module, located at the same muscle location, are integrated together through a VIA via, with the electrophysiological adhesion layer of the electromyography sensing module in contact with the human skin surface.

[0008] Optionally, the ground electrode layer, excitation electrode layer, and electromyography electrode layer are structural layers made primarily of a composite conductive material composed of layered transition metal carbide / nitride MXene and metal nanomaterial AgNW, which are spin-coated onto a silicon wafer with patterned grooves using a solution.

[0009] Optionally, the first electromagnetic shielding layer, the second electromagnetic shielding layer, and the third electromagnetic shielding layer are structural layers made primarily of a composite conductive material composed of a layered transition metal carbide / nitride MXene and a metal nanomaterial AgNW, and fabricated by a solution spin coating method.

[0010] Optionally, the first elastic encapsulation layer, the first elastic isolation layer, the second elastic isolation layer, the second elastic encapsulation layer, the third elastic isolation layer, and the third elastic encapsulation layer are structural layers made by a solution spin coating method, with hot-melt high-elasticity polymer monomer powder hydrogenated styrene-butadiene block copolymer as the main material and dichlorobenzene organic solution as the auxiliary material, which are mixed to form a solution.

[0011] Secondly, this application provides a method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing, used to fabricate the flexible integrated array for electromyography and ultrasound co-sensing as described above. The fabrication method includes the following steps: Several thin-film electrode layers were prepared; the thin-film electrode layers consist of an elastic encapsulation layer, an electromagnetic shielding layer, an elastic isolation layer, and an electrode layer from top to bottom.

[0012] Two thin-film electrode layers are used as the first and second thin-film electrode layers, respectively, and are bonded to the upper and lower sides of a piezoelectric module layer to obtain an ultrasonic sensing module; the first and second thin-film electrode layers are bonded to the piezoelectric module layer through their respective electrode layers.

[0013] A thin-film electrode layer is used as a third thin-film electrode layer, and an electrophysiological adhesion layer is prepared at the bottom of the electrode layer of the third thin-film electrode layer to obtain an electromyographic sensing module.

[0014] Several ultrasound sensing modules and several electromyography (EMG) sensing modules are arranged and integrated on a wearable flexible film according to the location and direction of muscles in specific parts of the human body, resulting in a flexible integrated array of EMG and ultrasound sensing. Several ultrasound sensing modules form an ultrasound sensing array, and several EMG sensing modules form an EMG sensing array.

[0015] Optionally, several thin-film electrode layers are prepared, specifically including the following steps: A dry etching process was used to etch grooves of a certain depth on a silicon substrate according to the pattern of the electromyography sensing module and the ultrasound sensing module.

[0016] Electrosensing materials are drop-coated onto an etched patterned silicon substrate to obtain corresponding electrode layers; the electrode layers are electromyographic electrode layers, ground electrode layers, or excitation electrode layers.

[0017] An elastic isolation layer, an electromagnetic shielding layer, and an elastic encapsulation layer are sequentially fabricated in the electrode layer to obtain a thin-film electrode layer.

[0018] Optionally, the elastic encapsulation layer and the elastic isolation layer are structural layers made by mixing hot-melt high-elasticity polymer monomer powder hydrogenated styrene-butadiene block copolymer as the main material and dichlorobenzene organic solution as the auxiliary material to form a solution and then spin-coating the mixture into a film; the electromagnetic shielding layer is a structural layer made by mixing a composite conductive material composed of layered transition metal carbon / nitride MXene and metal nanomaterial AgNW as the main material and spin-coating the mixture into a film; the electrode layer is a structural layer made by spin-coating a composite conductive material composed of layered transition metal carbon / nitride MXene and metal nanomaterial AgNW onto a silicon wafer with patterned grooves.

[0019] Optionally, an organic solution bonding method may be used when bonding the first thin-film electrode layer and the second thin-film electrode layer to the upper and lower sides of the piezoelectric module layer, respectively.

[0020] Optionally, after obtaining the ultrasound sensing module and the electromyography (EMG) sensing module, the electrode pads in the EMG sensing module are made to be on the same plane as the electrode pads in the ultrasound sensing module through VIA vias, and the electrode pads of both are connected to the flexible PCB board.

[0021] According to the specific embodiments provided in this application, the following technical effects are disclosed: This application provides a flexible integrated array for electromyography (EMG) and ultrasound co-sensing and its fabrication method. The flexible integrated array includes an ultrasound sensing array and an EMG sensing array integrated on a wearable flexible film. Specifically, the ultrasound sensing array includes several ultrasound sensing modules, and the EMG sensing array includes several EMG sensing modules. The piezoelectric module layer of each ultrasound sensing module and the EMG electrode layer of each EMG sensing module are connected to an external circuit, and these are arranged according to the muscle location and direction of specific parts of the human body. The resulting high-density, high-precision ultrasound / EMG co-sensing hybrid integrated array can simultaneously acquire ultrasound signals and EMG signals of muscles, thereby achieving multi-dimensional muscle status monitoring. It can also provide electrical stimulation to specific areas for timely rehabilitation treatment of muscle fatigue and injury. Since the flexible integrated array is arranged according to the muscle location and direction of specific parts of the human body, when the flexible integrated array detects an abnormal signal, the location of the abnormal muscle can be determined by the array element receiving the abnormal signal, thus achieving automatic localization of the abnormal muscle. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a flexible integrated array for electromyography and ultrasound co-sensing, provided as an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the hierarchy of the ultrasound sensing module in a flexible integrated array for electromyography and ultrasound co-sensing, provided as an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of the hierarchy of the electromyography (EMG) sensing module in a flexible integrated array for coordinated EMG and ultrasound sensing, provided as an embodiment of this application.

[0026] Figure 4 This is a flowchart illustrating a method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing, as provided in an embodiment of this application.

[0027] Figure 5 This is a process flow diagram of the fabrication of a thin-film electrode layer in a method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing, provided in an embodiment of this application. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] This application provides a flexible integrated array for electromyography and ultrasound co-sensing. In one exemplary embodiment, such as... Figure 1 As shown, it includes an ultrasound sensing array and an electromyography (EMG) sensing array. The ultrasound sensing array and the EMG sensing array are integrated on a wearable flexible film. The ultrasound sensing array includes several ultrasound sensing modules, and the EMG sensing array includes several EMG sensing modules. The ultrasound sensing modules and the EMG sensing modules are arranged according to the location and direction of muscles in specific parts of the human body.

[0031] Specifically, such as Figure 2 As shown, the ultrasonic sensing module comprises, from top to bottom, a first thin-film electrode layer, a piezoelectric module layer, and a second thin-film electrode layer; the first thin-film electrode layer comprises, from top to bottom, a first elastic encapsulation layer, a first electromagnetic shielding layer, a first elastic isolation layer, and a grounding electrode layer; the second thin-film electrode layer comprises, from top to bottom, an excitation electrode layer, a second elastic isolation layer, a second electromagnetic shielding layer, and a second elastic encapsulation layer; as shown... Figure 3 As shown, the electromyography sensing module includes a third thin-film electrode layer and an electrophysiological adhesion layer from top to bottom; the third thin-film electrode layer includes a third elastic encapsulation layer, a third electromagnetic shielding layer, a third elastic isolation layer and an electromyography electrode layer from top to bottom; the piezoelectric module layer of each ultrasound sensing module and the electromyography electrode layer of each electromyography sensing module are all connected to an external circuit.

[0032] In the above structure, the elastic encapsulation layer protects the internal structure of the device, improving durability and wearing comfort. The elastic isolation layer prevents damage to the flexible electrodes during use. The electromagnetic shielding layer shields against external electromagnetic interference. The electromyography electrode layer is used to collect electromyographic signals, and the electrophysiological adhesion layer helps the patch adhere better to the skin and prevents it from falling off.

[0033] The following embodiment uses the design for measuring the lower back muscles as an example. The structure of the flexible integrated array for electromyography and ultrasound co-sensing is as follows: Figure 1 As shown, based on the location and distribution of the lower back muscles, the ultrasound sensing module and the electromyography (EMG) sensing module are designed as 4×8 array structures. The disc-shaped probes represent EMG electrodes, and the square probes represent piezoelectric modules within the ultrasound probes. These are distributed on the left and right sides of the erector spinae and multifidus muscles. The size of each electrode module can be determined according to the size of the muscles in different locations. By constructing a high-density lower back ultrasound and EMG sensing array, synchronous and coordinated sensing of multi-source signals is achieved, improving the stability and accuracy of lower back condition monitoring. This enables precise monitoring of specific abnormal lower back muscle tissue, meeting the requirements for accurate lower back muscle condition assessment. Furthermore, this structure can be expanded to include more array elements to adapt to practical application needs.

[0034] Figure 1 The overall thickness of the flexible integrated array shown is approximately 1 mm, with the ultrasound sensing module being 800 micrometers thick and the electromyography (EMG) sensing module being 200 micrometers thick. Within the ultrasound sensing module, the piezoelectric module layer is 500 micrometers thick, the upper first elastic encapsulation layer, first electromagnetic shielding layer, first elastic isolation layer, and grounding electrode layer total 150 micrometers, and the lower second elastic encapsulation layer, second electromagnetic shielding layer, second elastic isolation layer, and excitation electrode layer total 150 micrometers thick. In the EMG sensing module, the third elastic encapsulation layer, third electromagnetic shielding layer, third elastic isolation layer, and EMG electrode layer total 150 micrometers thick, and the electrophysiological adhesion layer is 50 micrometers thick. The spacing between the ultrasound sensing modules and the EMG sensing modules is 2 cm, maintaining a roughly identical arrangement. This spacing can be adjusted based on the muscle distribution at the actual application site.

[0035] In one exemplary embodiment, an ultrasound sensing module and an electromyography (EMG) sensing module located at the same muscle location are integrated together via a VIA via, with the electrophysiological adhesion layer of the EMG sensing module in contact with the surface of human skin.

[0036] Specifically, in this embodiment, the grounding electrode layer, the excitation electrode layer, and the electromyography electrode layer are structural layers made primarily of a composite conductive material composed of layered transition metal carbide / nitride MXene and metal nanomaterial AgNW, which are spin-coated onto a silicon wafer with patterned grooves using a solution. Depending on the application, this can be extended to other nanomaterials with conductive and shielding properties.

[0037] The first, second, and third electromagnetic shielding layers are structural layers primarily composed of a composite conductive material made from a mixture of layered transition metal carbide / nitride MXene and metallic nanomaterial AgNW, fabricated using a solution spin-coating method. Depending on the application, these layers can be extended to include other nanomaterials with conductive and shielding properties. This electromagnetic shielding layer effectively blocks noise interference introduced by other instruments, improving the signal-to-noise ratio.

[0038] The first elastic encapsulation layer, the first elastic isolation layer, the second elastic isolation layer, the second elastic encapsulation layer, the third elastic isolation layer, and the third elastic encapsulation layer are structural layers made by spin-coating a solution of hydrogenated styrene-butadiene block copolymer powder, a hot-melt high-elasticity polymer monomer powder, as the main material and dichlorobenzene organic solution as the auxiliary material. This mixture can be extended to more types of high-elasticity polymer materials according to actual applications.

[0039] The piezoelectric module layer is mainly made of composite piezoelectric ceramics, and can be expanded into more types of piezoelectric materials depending on the application.

[0040] The embodiments described above in this application have developed a highly ductile and biocompatible layered MXene-based elastic conductive film. This film is prepared by a mixed solution of silver nanowires (AgNW) and MXene conductive film, which not only enables reliable and stable electromyography sensing, but also provides a highly reliable excitation and echo signal transmission channel for flexible ultrasonic transducers. Finally, it is integrated and prepared by large-area, low-cost transfer printing and liquid phase film formation processes.

[0041] Based on the same inventive concept, this application also provides a method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing as described above. The solution provided by this fabrication method is similar to the solution described above, employing large-area, low-cost transfer printing and liquid-phase film deposition processes to fabricate a high-density, high-precision muscle ultrasound / electromyography co-sensing hybrid integrated device. In an exemplary embodiment, such as... Figure 4 As shown, a method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing is provided, comprising the following steps: A1. Several thin-film electrode layers are prepared. From top to bottom, each thin-film electrode layer includes an elastic encapsulation layer, an electromagnetic shielding layer, an elastic isolation layer, and an electrode layer. In this embodiment, the process flow for preparing the thin-film electrode layers in step A1 is as follows: Figure 5 As shown, the specific steps include: Using a dry etching process, grooves of a certain depth are patterned and etched on a silicon substrate according to the electromyography (EMG) and ultrasound sensing modules. Specifically, using a dry etching process, grooves of a certain depth are patterned and etched on the silicon substrate according to the EMG and ultrasound sensing modules. Figure 1The horizontal structure shown has grooves of a certain depth etched on the silicon substrate according to the pattern of the electromyography sensing module and the ultrasound sensing module, respectively. The ultrasound sensing module includes an excitation electrode layer and a ground electrode layer.

[0042] Electrosensing materials are drop-coated onto an etched patterned silicon substrate to obtain corresponding electrode layers; these electrode layers can be electromyographic electrode layers, grounding electrode layers, or excitation electrode layers. In this step, an AgNW / MXene conductive mixed solution is drop-coated into the grooves etched in the previous step and then heated and annealed for curing.

[0043] An elastic insulating layer, an electromagnetic shielding layer, and an elastic encapsulation layer are sequentially fabricated in the electrode layer to obtain a thin-film electrode layer. In this step, thermoplastic elastic insulator SEBS is selected as the substrate material for the entire skin-like electronic device due to its good mechanical tensile properties, high biocompatibility, and low elastic modulus. Specifically, the steps include: First, an elastic substrate material solution is spin-coated onto the electrode layer obtained in the previous step using a solution spin-coating method. This solution is then annealed and cured on a heated stage. A stretchable, highly stable electrode film is then fabricated on the substrate using a liquid-phase film deposition method, serving as an elastic insulating layer. Next, an AgNW / MXene conductive mixed solution is drop-coated onto the surface of the elastic insulating layer and annealed to form an electromagnetic shielding layer. Finally, an elastic material solution identical to the substrate material is drop-coated onto the surface of the electromagnetic shielding layer and annealed to form an elastic encapsulation layer, ensuring the long-term use of the entire skin-like electronic device.

[0044] To ensure a high success rate in lifting the device off the silicon substrate, the contact quality between the elastic substrate material and the silicon wafer, as well as the contact quality of the composite thin film, is crucial. A simple mechanical lift-off method is used to obtain high-performance skin-like electronic devices. After lifting the thin-film electrode layer, the patterned etched silicon mold can be reused, significantly reducing the electrode pattern pretreatment process and substantially lowering the overall device fabrication cost. This lays a solid foundation for obtaining low-cost integrated systems.

[0045] A2. Two thin-film electrode layers are used as the first and second thin-film electrode layers, respectively, and bonded to the upper and lower sides of a piezoelectric module layer to obtain an ultrasonic sensing module. Both the first and second thin-film electrode layers are bonded to the piezoelectric module layer via their respective electrode layers. Specifically, an organic solvent is dripped onto a composite piezoelectric ceramic sheet and then attached to the thin-film electrode layer obtained in the above steps. One side of the piezoelectric ceramic sheet is bonded to the excitation electrode layer, and the other side is bonded to the ground electrode layer. In this embodiment, an organic solution bonding method is used when bonding the first and second thin-film electrode layers to the upper and lower sides of the piezoelectric module layer. Solution bonding has advantages over traditional conductive silver paste bonding. Conductive silver paste requires manual application, and the amount is difficult to control; while the organic solution method directly drips onto the surface in one go, solving the error caused by the amount of conductive silver paste applied manually, and at the same time minimizing the differences between channels.

[0046] A3. Using a thin-film electrode layer as the third thin-film electrode layer, an electrophysiological adhesion layer is prepared at the bottom of the electrode layer of the third thin-film electrode layer to obtain an electromyographic sensing module.

[0047] A4. Several ultrasound sensing modules and several electromyography (EMG) sensing modules are arranged and integrated on a wearable flexible film according to the muscle location and direction of specific parts of the human body to obtain a flexible integrated array of EMG and ultrasound sensing; several ultrasound sensing modules form an ultrasound sensing array, and several EMG sensing modules form an EMG sensing array.

[0048] Specifically, in this embodiment, the elastic encapsulation layer and the elastic isolation layer are structural layers made by mixing hot-melt high-elasticity polymer monomer powder hydrogenated styrene-butadiene block copolymer as the main material and dichlorobenzene organic solution as the auxiliary material to form a solution and then spin-coating the mixture into a film. The electromagnetic shielding layer is a structural layer made by mixing a layered transition metal carbon / nitride MXene and metal nanomaterial AgNW as the main material and spin-coating the mixture into a film. The electrode layer is a structural layer made by spin-coating a layered transition metal carbon / nitride MXene and metal nanomaterial AgNW onto a silicon wafer with patterned grooves.

[0049] In this embodiment, the performance of flexible stretchable electrodes with different AgNW:MXene ratios was compared, including electrical properties, tensile properties, stability, and elastic modulus. In-depth research and analysis revealed that the AgNW:MXene (3:0.2) flexible stretchable electrode exhibits excellent conductivity (3597 S / cm), tensile properties, stability, and a low elastic modulus (27.3 MPa). This ensures that the electrode can reliably and stably monitor high-quality physiological electrical signals even during human movement. In this embodiment, Ti3C2Tx was used as the MXene. The preparation steps of the AgNW / MXene conductive mixed solution are as follows: First, pipette 3 mL of AgNW (10 mg / mL) solution and 6.6 mL of deionized water into a glass bottle, and then sonicate the solution using an ultrasonic cell disruptor. Next, place the bottle containing the AgNW solution in a beaker filled with ice water, and simultaneously place the ultrasonic probe in the AgNW solution, ensuring the probe is submerged below the water surface and does not contact the glass bottle wall. Perform ice-water bath sonication at a power of 60-80 W for 10 minutes to obtain a uniformly distributed AgNW solution.

[0050] Then, pipette 0.4 mL of MXene (5 mg / mL) solution and inject it into the glass bottle containing the AgNW solution to mix the two conductive materials together. Then, perform the same ice-water bath sonication method as in step 1), with an ultrasonic power of 60-100 W for 20-30 minutes. Finally, a homogeneous AgNW / MXene conductive mixed solution is obtained.

[0051] To ensure consistent electrode contact and accurate signal transmission between the two sensing modules, after obtaining the ultrasound sensing module and the electromyography (EMG) sensing module, the electrode pads in the EMG sensing module are aligned with the electrode pads in the ultrasound sensing module via VIA vias, and then both electrode pads are connected to a flexible PCB board. The flexible electrodes are then connected to the flexible PCB board using a solution method, and the board is placed on a heating stage for annealing and drying. After annealing and drying, the final flexible integrated device for co-sensing EMG and ultrasound is obtained.

[0052] The high-density, high-precision flexible integrated array for electromyography and ultrasound co-sensing proposed in this application can simultaneously acquire ultrasound and electromyographic signals of muscles, thereby achieving multi-dimensional muscle status monitoring. It can also provide electrical stimulation to specific areas for timely rehabilitation treatment of muscle fatigue and injury. This hybrid integrated array has the advantages of automatic positioning and ease of use. Its layout is designed according to the location and direction of muscles in specific parts of the human body. When the integrated array detects an abnormal signal, it determines the location of the abnormal muscle by identifying the array element receiving the abnormal signal, thus achieving automatic positioning. Furthermore, an AgNW / MXene mixed solution was developed and used as the conductive material. The preparation process is simple and low-cost, providing significant application value for the diagnosis and rehabilitation of muscle conditions.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A flexible integrated array for electromyography and ultrasound co-sensing, characterized in that, include: An ultrasound sensing array and an electromyography (EMG) sensing array are integrated on a wearable flexible film. The ultrasound sensing array includes several ultrasound sensing modules, and the EMG sensing array includes several EMG sensing modules. The ultrasound sensing modules and the EMG sensing modules are arranged according to the muscle location and direction of specific parts of the human body to cover the erector spinae and multifidus muscles. The ultrasonic sensing module comprises, from top to bottom, a first thin-film electrode layer, a piezoelectric module layer, and a second thin-film electrode layer; the first thin-film electrode layer comprises, from top to bottom, a first elastic encapsulation layer, a first electromagnetic shielding layer, a first elastic isolation layer, and a grounding electrode layer; the second thin-film electrode layer comprises, from top to bottom, an excitation electrode layer, a second elastic isolation layer, a second electromagnetic shielding layer, and a second elastic encapsulation layer. The electromyography sensing module comprises, from top to bottom, a third thin-film electrode layer and an electrophysiological adhesion layer; the third thin-film electrode layer comprises, from top to bottom, a third elastic encapsulation layer, a third electromagnetic shielding layer, a third elastic isolation layer and an electromyography electrode layer; the piezoelectric module layer of each ultrasound sensing module and the electromyography electrode layer of each electromyography sensing module are all connected to an external circuit. The ultrasound sensing module and the electromyography sensing module, located at the same muscle location, are integrated together through a VIA through-hole, and the electrophysiological adhesion layer of the electromyography sensing module is in contact with the surface of human skin. The grounding electrode layer, the excitation electrode layer, and the electromyography electrode layer are structural layers made of a composite conductive material composed of layered transition metal carbon / nitride MXene and metal nanomaterial AgNW as the main material, which are spin-coated onto a silicon wafer with patterned grooves using a solution. The first electromagnetic shielding layer, the second electromagnetic shielding layer and the third electromagnetic shielding layer are structural layers made of a composite conductive material mainly composed of layered transition metal carbide / nitride MXene and metal nanomaterial AgNW, and formed by solution spin coating. The first elastic encapsulation layer, the first elastic isolation layer, the second elastic isolation layer, the second elastic encapsulation layer, the third elastic isolation layer, and the third elastic encapsulation layer are structural layers made by a solution spin coating method after mixing hot-melt high elastic polymer monomer powder hydrogenated styrene-butadiene block copolymer as the main material and dichlorobenzene organic solution as the auxiliary material to form a solution. The overall thickness of the flexible integrated array is 1 mm, wherein the thickness of the ultrasound sensing module is 800 micrometers and the thickness of the electromyography sensing module is 200 micrometers; in the ultrasound sensing module, the thickness of the piezoelectric module layer is 500 micrometers, the thickness of the first thin-film electrode layer is 150 micrometers, and the thickness of the second thin-film electrode layer is 150 micrometers; the thickness of the third thin-film electrode layer of the electromyography sensing module is 150 micrometers, and the thickness of the electrophysiological adhesion layer is 50 micrometers.

2. A method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing, characterized in that, The method for fabricating the flexible integrated array for electromyography and ultrasound co-sensing as described in claim 1 includes: Several thin-film electrode layers were prepared; each of the several thin-film electrode layers includes, from top to bottom, an elastic encapsulation layer, an electromagnetic shielding layer, an elastic isolation layer, and an electrode layer; Two thin-film electrode layers are used as the first and second thin-film electrode layers, respectively, and are bonded to the upper and lower sides of a piezoelectric module layer to obtain an ultrasonic sensing module; the first and second thin-film electrode layers are bonded to the piezoelectric module layer through their respective electrode layers. Another thin-film electrode layer is used as the third thin-film electrode layer, and an electrophysiological adhesion layer is prepared at the bottom of the electrode layer of the third thin-film electrode layer to obtain an electromyography sensing module. Several ultrasound sensing modules and several electromyography (EMG) sensing modules are arranged and integrated on a wearable flexible film according to the muscle location and direction of specific parts of the human body to obtain a flexible integrated array for coordinated EMG and ultrasound sensing; several ultrasound sensing modules form an ultrasound sensing array, and several EMG sensing modules form an EMG sensing array.

3. The method for fabricating the flexible integrated array for electromyography and ultrasound co-sensing according to claim 2, characterized in that, Several thin-film electrode layers were prepared, specifically including: A dry etching process was used to etch grooves of a certain depth on a silicon substrate according to the patterns of the electromyography sensing module and the ultrasound sensing module. Electrosensing material is drop-coated onto the etched patterned silicon substrate to obtain a corresponding electrode layer; the electrode layer is an electromyographic electrode layer, a ground electrode layer, or an excitation electrode layer. An elastic isolation layer, an electromagnetic shielding layer, and an elastic encapsulation layer are sequentially fabricated on the electrode layer to obtain a thin-film electrode layer.

4. The method for fabricating the flexible integrated array for electromyography and ultrasound co-sensing according to claim 3, characterized in that, The elastic encapsulation layer and elastic isolation layer are structural layers made by mixing hot-melt high-elasticity polymer monomer powder hydrogenated styrene-butadiene block copolymer as the main material and dichlorobenzene organic solution as the auxiliary material, and then forming a solution by solution spin coating. The electromagnetic shielding layer is a structural layer made by mixing a layered transition metal carbon / nitride MXene and metal nanomaterial AgNW as the main material and forming a solution by solution spin coating. The electrode layer is a structural layer made by mixing a layered transition metal carbon / nitride MXene and metal nanomaterial AgNW as the main material and forming a solution by spin coating onto a silicon wafer with patterned grooves.

5. The method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing according to claim 2, characterized in that, An organic solution bonding method was used when bonding the first thin-film electrode layer and the second thin-film electrode layer to the upper and lower sides of the piezoelectric module layer, respectively.

6. The method for fabricating a flexible integrated array for electromyography and ultrasound co-sensing according to claim 2, characterized in that, After obtaining the ultrasound sensing module and the electromyography (EMG) sensing module, the electrode pads in the EMG sensing module are integrated with the electrode pads in the ultrasound sensing module on the same plane through VIA vias, and the electrode pads of both are connected to the flexible PCB board.

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