Display panel and display device

Abstract

The invention discloses a display panel and a display device, and relates to the technical field of display. The display panel comprises a driving substrate, multiple sets of refrigeration structures, hot melt adhesive and multiple light-emitting chips, the multiple sets of refrigeration structures are evenly distributed on the driving substrate at intervals, and each set of refrigeration structure comprises a driving electrode and refrigeration assemblies arranged on the two sides of the driving electrode; the hot melt adhesive is arranged on the driving substrate and covers the multiple sets of refrigeration structures. The plurality of light-emitting chips are respectively arranged corresponding to the plurality of driving electrodes; the refrigeration assembly works so that the hot melt adhesive close to the refrigeration assembly can be in a solidified state; according to the display panel, the refrigeration assembly is arranged, so that the situation that in the process that the light-emitting chips are transferred from the transfer substrate to the display panel, due to the deviation influence caused by flowing of hot melt adhesive, mass transfer fails is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a display panel and a display device. Background Art

[0002] Since Micro-LED (Micro Light Emitting Diode) has the advantages of low power consumption, high brightness, and high resolution, it has become a very popular display technology at present.

[0003] In the existing work of Micro-LED mass transfer, hot melt adhesive is usually set on a driving substrate, and the hot melt adhesive is melted by laser positioning to form a groove for placing Micro-LED. However, the position where laser irradiation is required is very precise. If the position of laser irradiation is offset, the hot melt adhesive on the driving substrate will melt and increase its fluidity. At this time, when Micro-LED falls into the hot melt adhesive, there is a risk of deviation, resulting in the failure of Micro-LED mass transfer. Summary of the Invention

[0004] The purpose of the present application is to provide a display panel and a display device, which avoid the influence of deviation caused by the flow of hot melt adhesive during the transfer of light-emitting chips from a transfer substrate to a display panel, resulting in the failure of mass transfer.

[0005] The present application discloses a display panel, including a driving substrate, multiple groups of refrigeration structures, hot melt adhesive, and multiple light-emitting chips. The multiple groups of refrigeration structures are evenly distributed at intervals on the driving substrate. Each group of refrigeration structures includes a driving electrode and refrigeration components arranged on both sides of the driving electrode; the hot melt adhesive is set on the driving substrate and covers multiple groups of refrigeration structures; multiple light-emitting chips are respectively arranged corresponding to multiple driving electrodes; wherein, the refrigeration components work to make the hot melt adhesive close to the refrigeration components in a solidified state.

[0006] Optionally, the refrigeration component includes a first insulating layer, an electron transport layer arranged on the first insulating layer, a photoelectric material layer arranged on the electron transport layer, a hole transport layer arranged on the photoelectric material layer, an anode layer arranged on the hole transport layer, a refrigeration layer arranged on the anode layer, a cathode layer arranged on the side of the first insulating layer, and a second insulating layer arranged between the cathode layer and the anode layer; wherein, the first insulating layer is used to isolate the cathode layer and the driving electrode, and the second insulating layer is used to isolate the anode layer and the cathode layer.

[0007] Optionally, the refrigeration component includes a first insulating layer, a cathode layer disposed on the first insulating layer, a refrigeration layer disposed on the cathode layer, an electron transport layer disposed on the cathode layer, a photoelectric material layer disposed on the electron transport layer, a hole transport layer disposed on the photoelectric material layer, an anode layer disposed on the hole transport layer, and a second insulating layer disposed between the photoelectric material layer and the refrigeration layer; wherein, the first insulating layer is used to isolate the cathode layer from the driving electrode, and the refrigeration layer is disposed opposite to the electron transport layer, the photoelectric material layer, the hole transport layer, and the anode layer.

[0008] Optionally, the refrigeration component includes a first insulating layer, a refrigeration layer disposed on the first insulating layer, a second insulating layer disposed on the refrigeration layer, a cathode layer disposed on the first insulating layer and the second insulating layer, an electron transport layer disposed on the cathode layer, a photoelectric material layer disposed on the electron transport layer, a hole transport layer disposed on the photoelectric material layer, and an anode layer disposed on the first insulating layer and the hole transport layer; wherein, the first insulating layer is used to isolate the anode layer from the driving electrode, and the second insulating layer is used to isolate the anode layer from the cathode layer.

[0009] Optionally, the refrigeration component includes a first insulating layer, an electron transport layer disposed on the first insulating layer, a photoelectric material layer disposed on the electron transport layer, a hole transport layer disposed on the photoelectric material layer, an anode layer disposed on the hole transport layer, a refrigeration layer disposed on the anode layer, a cathode layer disposed on the electron transport layer, and a second insulating layer disposed between the cathode layer and the anode layer; wherein, the first insulating layer is used to isolate the cathode layer from the driving electrode, and the second insulating layer is used to isolate the cathode layer from the anode layer.

[0010] Optionally, in the horizontal plane direction of the driving substrate, the length of the refrigeration layer is greater than or equal to the length of the anode layer.

[0011] Optionally, in the thickness direction of the driving substrate, the thickness of the refrigeration layer is greater than or equal to 1 micron.

[0012] Optionally, the refrigeration layer is made of a light-transmitting material.

[0013] Optionally, the photoelectric material layer is made of at least one material selected from lead telluride, mercury cadmium telluride, triglycine sulfate, and lithium tantalate.

[0014] This application also discloses a display device, including the display panel and a driving circuit as described above, and the driving circuit drives the display panel to be arranged.

[0015] In this application, a refrigeration component is added to the display panel so that when the laser irradiates the hot melt adhesive, only the hot melt adhesive at the position corresponding to the light-emitting chip will be melted by the laser, while the hot melt adhesive corresponding to the refrigeration component will cool and solidify, so that the hot melt adhesive on the display panel will form a groove for installing the light-emitting chip, which facilitates the massive transfer and installation of the light-emitting chip, and the installation positioning is accurate, avoiding the influence of deviation caused by the flow of the hot melt adhesive during the transfer of the light-emitting chip from the transfer substrate to the display panel, thereby causing the failure of the massive transfer. Brief Description of the Drawings

[0016] The accompanying drawings included are used to provide a further understanding of the embodiments of the present application, which form a part of the specification, are used to illustrate the implementation manners of the present application, and are used to explain the principles of the present application together with the text description. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0017] Figure 1 It is a schematic structural diagram of a display panel according to the first embodiment of the present application;

[0018] Figure 2 It is a schematic structural diagram of a display panel according to the second embodiment of the present application;

[0019] Figure 3 It is a schematic structural diagram of a display panel according to the third embodiment of the present application;

[0020] Figure 4 It is a schematic structural diagram of a display panel according to the fourth embodiment of the present application;

[0021] Figure 5 It is a schematic structural diagram of a display panel according to the fifth embodiment of the present application;

[0022] Figure 6 It is a schematic structural diagram of a display device according to the sixth embodiment of the present application;

[0023] Figure 7 It is a schematic structural diagram of a transfer substrate according to the seventh embodiment of the present application;

[0024] Figure 8 It is another schematic structural diagram of a transfer substrate according to the seventh embodiment of the present application;

[0025] Figure 9 It is still another schematic structural diagram of a transfer substrate according to the seventh embodiment of the present application;

[0026] Figure 10 It is a schematic structural diagram of a transfer substrate according to the eighth embodiment of the present application;

[0027] Figure 11 is a schematic cross-sectional view taken along line A-A in the present application Figure 10 in the present application;

[0028] Figure 12 is a schematic structural view of a transfer substrate according to a ninth embodiment of the present application.

[0029] Among them, 100 is a display panel; 110 is a driving substrate; 120 is a refrigeration structure; 130 is a driving electrode; 140 is a refrigeration component; 141 is a first insulating layer; 142 is an electron transport layer; 143 is a photoelectric material layer; 144 is a hole transport layer; 145 is an anode layer; 146 is a refrigeration layer; 147 is a cathode layer; 148 is a second insulating layer; 150 is a hot melt adhesive; 200 is a light-emitting chip; 300 is a driving circuit; 400 is a display device; 500 is a transfer substrate; 510 is a bottom plate; 520 is an adhesive; 521 is a refrigeration particle; 530 is a refrigeration component; 531 is a refrigeration element; 532 is a driving anode; 533 is a driving cathode. Detailed implementation manners

[0030] It should be understood that the terms, the specific structures and functional details disclosed herein are only for the purpose of describing specific embodiments, which are representative, but the present application can be specifically implemented in many alternative forms and should not be construed as being limited only to the embodiments set forth herein.

[0031] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating relative importance or implicitly indicating the number of the indicated technical features. Thus, unless otherwise specified, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features; the meaning of "a plurality" is two or more. The term "comprising" and any deformation thereof means non-exclusive inclusion, and there may be or additional one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0032] In addition, the terms indicating the orientation or positional relationship such as "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are described based on the orientation or relative positional relationship shown in the drawings, and are only for the purpose of facilitating the simplified description of the present application, rather than indicating that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application.

[0033] In addition, unless otherwise clearly defined and limited, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] The present application will be described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined to form new embodiments.

[0035] As Figure 1 shown, as the first embodiment of the present application, a display panel 100 is disclosed. The display panel 100 includes a driving substrate 110, multiple groups of refrigeration structures 120, a hot melt adhesive 150, and multiple light-emitting chips 200. The multiple groups of refrigeration structures 120 are evenly distributed at intervals on the driving substrate 110. Each group of refrigeration structures 120 includes a driving electrode 130 and refrigeration components 140 arranged on both sides of the driving electrode 130. The hot melt adhesive 150 is disposed on the driving substrate 110 and covers the multiple groups of refrigeration structures 120. The multiple light-emitting chips 200 are respectively arranged corresponding to the multiple driving electrodes 130. The refrigeration components 140 operate to make the hot melt adhesive 150 close to the refrigeration components 140 in a solidified state.

[0036] The display panel 100 of this embodiment is used in combination with the transfer substrate 500. During use, the transfer substrate 500 first adsorbs a plurality of light-emitting chips 200, and then the transfer substrate 500 moves to a position corresponding to the display panel 100, so that the positions of the light-emitting chips 200 correspond to the positions of the driving electrodes 130. Subsequently, laser irradiation is used. The laser irradiates from the transfer substrate 500 towards the display panel 100, so that the light-emitting chips 200 are separated from the transfer substrate 500, and the hot melt adhesive 150 on the display panel 100 melts. During this process, the laser can pass through the hot melt adhesive 150 and irradiate the refrigeration component 140, so that the refrigeration component 140 operates to cool and solidify the hot melt adhesive 150 covering the refrigeration component 140, while the hot melt adhesive 150 at other positions of the display panel 100 will melt and become fluid, so that the display panel 100 forms a plurality of grooves, and the plurality of grooves correspond to the plurality of light-emitting chips 200. After the light-emitting chips 200 are separated from the transfer substrate 500, they will fall into the grooves to complete the preliminary connection between the light-emitting chips 200 and the driving electrodes 130, thus facilitating the next process; the display panel 100 of this embodiment, by adding a refrigeration component 140 on the display panel 100, when the laser irradiates the hot melt adhesive 150, only the hot melt adhesive 150 corresponding to the position of the light-emitting chip 200 will be melted by the laser, while the hot melt adhesive 150 corresponding to the refrigeration component 140 will cool and solidify, so that the hot melt adhesive 150 on the display panel 100 will form grooves for installing the light-emitting chips 200, which is convenient for the massive transfer and installation of the light-emitting chips 200, and the installation positioning is accurate, avoiding the influence of deviation caused by the flow of the hot melt adhesive 150 during the transfer of the light-emitting chips 200 from the transfer substrate 500 to the display panel 100, which may lead to the failure of massive transfer; it should be noted that the two refrigeration components 140 in each group of the refrigeration structures 120 are symmetrically arranged.

[0037] As Figure 2 shown, as the second embodiment of the present application, which is a further refinement of the first embodiment of the present application, a display panel 100 is disclosed. The refrigeration component 140 includes a first insulating layer 141, an electron transport layer 142 provided on the first insulating layer 141, a photoelectric material layer 143 provided on the electron transport layer 142, a hole transport layer 144 provided on the photoelectric material layer 143, an anode layer 145 provided on the hole transport layer 144, a refrigeration layer 146 provided on the anode layer 145, a cathode layer 147 provided on the side of the first insulating layer 141, and a second insulating layer 148 provided between the cathode layer 147 and the anode layer 145; the first insulating layer 141 is used to isolate the cathode layer 147 and the driving electrode 130, and isolate the anode layer 145 and the cathode layer 147;

[0038] In this embodiment, the first insulating layer 141 has an L-shaped structure. One end of the first insulating layer 141 is disposed on the driving substrate 110, and the other end is disposed on the side of the driving electrode 130 to isolate the driving electrode 130 from the cathode layer 147 and the electron transport layer 142. There is a protrusion on the anode layer 145, and the protrusion is disposed on one side of the refrigeration layer 146. The other side of the refrigeration layer 146 is connected to the cathode layer 147. The second insulating layer 148 semi-surrounds the anode layer 145, the hole transport layer 144, and the optoelectronic material layer 143 to isolate the anode layer 145 from the cathode layer 147 and prevent the anode layer 145 and the cathode layer 147 from directly contacting each other;

[0039] When the refrigeration component 140 of this embodiment is working, the laser will pass through the hot melt adhesive 150 and then irradiate the optoelectronic material layer 143 in the refrigeration component 140. The optoelectronic material layer 143 absorbs the laser light to generate excitons. The excitons separate electrons and holes at the interfaces of the optoelectronic material layer 143 and the adjacent hole transport layer 144 and electron transport layer 142, and are respectively transmitted to the anode layer 145 and the cathode layer 147 through the hole transport layer 144 and the electron transport layer 142, and form a current loop with the refrigeration layer 146 to drive the refrigeration layer 146 to cool down, so that the hot melt adhesive 150 near the refrigeration layer 146 cools down and solidifies, avoiding the influence of displacement caused by the flow of the hot melt adhesive 150 during the transfer process of the light-emitting chip 200 to the display panel 100, and further resulting in the failure of the massive transfer; moreover, in this embodiment, in order to make the cooling effect of the refrigeration layer 146 reach the best, the refrigeration layer 146 is disposed at one end of the refrigeration component 140 away from the driving substrate 110, so that the refrigeration layer 146 is in direct contact with the hot melt adhesive 150 to achieve the best cooling effect when the refrigeration layer 146 is working.

[0040] In this embodiment, since the refrigeration layer 146 is disposed at one end of the refrigeration component 140 away from the driving substrate 110, in order to ensure the light transmission effect of the refrigeration layer 146 and enable the laser to penetrate the refrigeration layer 146 and irradiate into the optoelectronic material layer 143, in the thickness direction of the driving substrate 110, the thickness of the refrigeration layer 146 is greater than or equal to 1 micron, which can ensure the light transmission effect of the refrigeration layer 146 while ensuring the refrigeration effect of the refrigeration layer 146; wherein, the refrigeration layer 146 can be made of an electrocooling material such as bismuth telluride. Since the film thickness of the refrigeration layer and other layers in this embodiment is in the order of um, the refrigeration layer will have a certain light transmission property. Of course, it can also be made of a light-transmitting material. The specific light-transmitting material can be a light-transmitting material with refrigeration ability, and the designer can select and design according to the actual situation; the optoelectronic material layer 143 is made of at least one material selected from lead telluride, mercury cadmium telluride, triglycine sulfate, and lithium tantalate.

[0041] The inventors of the present application considered that in the refrigeration component 140 described in the above embodiments, during operation, the refrigeration layer 146 can only transmit part of the laser, and part of the laser will be blocked by the refrigeration layer 146, resulting in poor refrigeration effect. Based on this, the following improvements were made to the refrigeration component 140, such as Figure 3 As shown, as the third embodiment of the present application, which is a further refinement of the first embodiment of the present application, a display panel 100 is disclosed. The refrigeration component 140 includes a first insulating layer 141, a cathode layer 147 disposed on the first insulating layer 141, a refrigeration layer 146 disposed on the cathode layer 147, an electron transport layer 142 disposed on the cathode layer 147, a photoelectric material layer 143 disposed on the electron transport layer 142, a hole transport layer 144 disposed on the photoelectric material layer 143, an anode layer 145 disposed on the hole transport layer 144, and a second insulating layer 148 disposed between the photoelectric material layer 143 and the refrigeration layer 146; the first insulating layer 141 is used to isolate the cathode layer 147 and the driving electrode 130, and the refrigeration layer 146 is disposed opposite to the electron transport layer 142, the photoelectric material layer 143, the hole transport layer 144, and the anode layer 145;

[0042] In this embodiment, the first insulating layer 141 has an L-shaped structure. One end of the first insulating layer 141 is disposed on the driving substrate 110, and the other end is disposed on the side of the driving electrode 130 to isolate the driving electrode 130 from the cathode layer 147 and the refrigeration layer 146; in the vertical direction of the driving substrate 110, the projected area of the refrigeration layer 146 is almost the same as the projected area of the anode layer 145, that is, the hot melt adhesive 150 located above the refrigeration component 140 is in contact with the anode layer 145 for half of the area and in contact with the refrigeration layer 146 for the other half of the area; of course, in order to ensure the refrigeration effect of the refrigeration layer 146, in the horizontal plane direction of the driving substrate 110, the length of the refrigeration layer 146 is greater than or equal to the length of the anode layer 145, so that the contact area between the refrigeration layer 146 and the hot melt adhesive 150 is increased in this embodiment; one end of the refrigeration layer 146 is connected to the cathode layer 147, and a protrusion is provided at the other end, and the protrusion protrudes toward the anode layer 145, and the anode layer 145 is connected to the protrusion. In the thickness direction of the driving substrate 110, the thickness of the second insulating layer 148 is the same as the sum of the thicknesses of the electron transport layer 142, the photoelectric material layer 143, and the hole transport layer 144, that is, the second insulating layer 148 isolates the refrigeration layer 146 from the electron transport layer 142, the photoelectric material layer 143, and the hole transport layer 144;

[0043] When the refrigeration component 140 of this embodiment is working, the laser passes through the anode layer 145 and the hole transport layer 144 to irradiate the optoelectronic material layer 143. The optoelectronic material layer 143 absorbs the laser light to generate excitons. The excitons are separated into electrons and holes at the interfaces of the optoelectronic material layer 143 and the adjacent hole transport layer 144 and electron transport layer 142, and are respectively transmitted to the anode layer 145 and the cathode layer 147 through the hole transport layer 144 and the electron transport layer 142, and form a current loop with the refrigeration layer 146 to drive the refrigeration layer 146 to cool down, so that the hot melt adhesive 150 near the refrigeration layer 146 cools down and solidifies, avoiding the influence of displacement caused by the flow of the hot melt adhesive 150 during the transfer process of the light-emitting chip 200 to the display panel 100, and further causing the failure of mass transfer; compared with the refrigeration component 140 described in the above embodiment, in the refrigeration component 140 of this embodiment, the laser light can directly avoid irradiating the refrigeration layer 146 onto the optoelectronic material layer 143, so that the optoelectronic material layer 143 can absorb more laser light, thereby increasing the refrigeration effect of the refrigeration layer 146, improving the cooling effect, and ensuring that the hot melt adhesive 150 located above the refrigeration component 140 can be in a solidified state under laser irradiation.

[0044] As Figure 4 shown, as the fourth embodiment of the present application, which is a further refinement of the first embodiment of the present application, a display panel 100 is disclosed. The refrigeration component 140 includes a first insulating layer 141, a refrigeration layer 146 disposed on the first insulating layer 141, a second insulating layer 148 disposed on the refrigeration layer 146, a cathode layer 147 disposed on the first insulating layer 141 and the second insulating layer 148, an electron transport layer 142 disposed on the cathode layer 147, an optoelectronic material layer 143 disposed on the electron transport layer 142, a hole transport layer 144 disposed on the optoelectronic material layer 143, and an anode layer 145 disposed on the first insulating layer 141 and the hole transport layer 144. The first insulating layer 141 is used to isolate the anode layer 145 and the driving electrode 130, and the second insulating layer 148 is used to isolate the anode layer 145 and the cathode layer 147;

[0045] In this embodiment, the first insulating layer 141 is an L-shaped structure. One end of the first insulating layer 141 is disposed on the driving substrate 110, and the other end is disposed on the side of the driving electrode 130 to isolate the driving electrode 130 from the anode layer 145. The cathode layer 147 and the anode layer 145 are both in an inverted L-shaped structure. The anode layer 145, the cathode layer 147 and the refrigeration layer 146 are all disposed on the first insulating layer 141. The anode layer 145 and the cathode layer 147 are respectively disposed at both ends of the refrigeration layer 146. The second insulating layer 148 is an L-shaped structure so that the anode layer 145 and the cathode layer 147 are isolated from each other.

[0046] When the refrigeration component 140 of this embodiment is working, light will pass through the anode layer 145 and the hole transport layer 144 and irradiate onto the optoelectronic material layer 143. The optoelectronic material layer 143 absorbs the laser light to generate excitons. The excitons are separated into electrons and holes at the interfaces between the optoelectronic material layer 143 and the adjacent hole transport layer 144 and electron transport layer 142, and are respectively transmitted to the anode layer 145 and the cathode layer 147 through the hole transport layer 144 and the electron transport layer 142, and form a current loop with the refrigeration layer 146 to drive the refrigeration layer 146 to cool down. After the refrigeration layer 146 cools down, it will conduct the temperature to the hot melt adhesive 150 above the refrigeration component 140 to cool and solidify the hot melt adhesive 150, avoiding the influence of displacement caused by the flow of the hot melt adhesive 150 during the transfer process of the light-emitting chip 200 to the display panel 100, and further causing the failure of mass transfer; compared with the refrigeration component 140 of the above embodiment, in the refrigeration component 140 of this embodiment, the optoelectronic material layer 143 can receive the laser light to the greatest extent (the cross-sectional area of the optoelectronic material layer 143 in the horizontal direction of the driving substrate 110 is the largest), and the refrigeration layer 146 is arranged below the optoelectronic material layer 143, avoiding the situation that the laser light will be partially blocked by the refrigeration layer 146, thereby increasing the refrigeration effect of the refrigeration layer 146, improving the cooling effect, and ensuring that the hot melt adhesive 150 above the refrigeration component 140 can be in a solidified state under laser irradiation.

[0047] The inventor also considered that in the solution of the second embodiment of this application, since spaces for arranging the anode layer 145 and the cathode layer 147 need to be reserved on both sides of the refrigeration layer 146, it may cause the area of the refrigeration layer 146 in this size to shrink, and further cause the refrigeration effect to decline. Therefore, the solution was improved, such as Figure 5 As shown, as the fifth embodiment of this application, which is a further refinement of the first embodiment of this application, a display panel 100 is disclosed. The refrigeration component 140 includes a first insulating layer 141, an electron transport layer 142 arranged on the first insulating layer 141, an optoelectronic material layer 143 arranged on the electron transport layer 142, a hole transport layer 144 arranged on the optoelectronic material layer 143, an anode layer 145 arranged on the hole transport layer 144, a refrigeration layer 146 arranged on the anode layer 145, a cathode layer 147 arranged on the electron transport layer 142, and a second insulating layer 148 arranged between the cathode layer 147 and the anode layer 145. The first insulating layer 141 is used to isolate the cathode layer 147 and the driving electrode 130, and the second insulating layer 148 is used to isolate the cathode layer 147 and the anode layer 145;

[0048] In this embodiment, the first insulating layer 141 has an L-shaped structure. One end of the first insulating layer 141 is disposed on the driving substrate 110, and the other end is disposed on the side of the driving electrode 130 to isolate the driving electrode 130 and the cathode layer 147. Moreover, the lower part of the refrigeration layer 146 is respectively connected to the anode layer 145 and the cathode layer 147, that is, the refrigeration layer 146 covers the anode layer 145 and the cathode layer 147, so that there is no need to reserve space for arranging the anode layer 145 and the cathode layer 147 on both sides of the refrigeration layer 146. Therefore, compared with the refrigeration layer 146 in the refrigeration component 140 of the second embodiment, when the volumes of the refrigeration components are equal, the refrigeration layer 146 in this embodiment can achieve the maximum area, thereby improving the refrigeration effect of the refrigeration layer 146 to a certain extent, ensuring the cooling effect of the refrigeration layer 146, and enabling the hot melt adhesive 150 located above the refrigeration component 140 to be in a solidified state under laser irradiation.

[0049] Moreover, in the solution of the above-described embodiment, when the display panel 100 is operating normally, the light emitted by the light-emitting chip 200 can irradiate the optoelectronic material layer 143 of the refrigeration component 140. The optoelectronic material layer 143 absorbs the laser light to generate excitons. The excitons are separated into electrons and holes at the interface between the optoelectronic material layer 143 and the adjacent hole transport layer 144 and electron transport layer 142, and are respectively transmitted to the anode layer 145 and the cathode layer 147 through the hole transport layer 144 and the electron transport layer 142, and form a current loop with the refrigeration layer 146 to drive the refrigeration layer 146 to cool down, so that the display panel 100 can achieve the cooling function through the refrigeration component 140 during use, ensuring the reliability of the display panel 100 during use.

[0050] As Figure 6 shown, as the sixth embodiment of the present application, a display device 400 is disclosed. The display device 400 includes the display panel 100 and the driving circuit 300 as described in the above embodiment, and the driving circuit 300 drives the display panel 100 to be arranged. In the display device 400 of the present application, by adding a refrigeration component 140 to the display panel 100, when the laser irradiates the hot melt adhesive 150, only the hot melt adhesive 150 corresponding to the position of the light-emitting chip 200 will be melted by the laser, while the hot melt adhesive 150 corresponding to the refrigeration component 140 will cool down and solidify, so that the hot melt adhesive 150 on the display panel 100 will form a groove for installing the light-emitting chip 200, facilitating the massive transfer and installation of the light-emitting chip 200, and the installation positioning is accurate, avoiding the influence of deviation caused by the flow of the hot melt adhesive 150 during the transfer of the light-emitting chip 200 from the transfer substrate 500 to the display panel 100, thereby preventing the massive transfer from failing.

[0051] AsFigure 7 As shown in the figure, as the seventh embodiment of the present application, a transfer substrate 500 is disclosed. The transfer substrate 500 is used in cooperation with a display panel 100 for the mass transfer of light-emitting chips 200. The transfer substrate 500 includes a bottom plate 510, an adhesive 520, and a refrigeration component 530. The refrigeration component 530 includes a refrigeration element 531, a driving anode 532, and a driving cathode 533. The driving anode 532 and the driving cathode 533 are used to drive the refrigeration element 531 to work for refrigeration and temperature reduction, so that the temperature of the adhesive 520 is reduced, and the fluidity of the adhesive 520 is reduced. The adhesive 520 is disposed at the lower end of the bottom plate 510, that is, on the side of the bottom plate 510 facing the display panel 100. The adhesive 520 is used to adhere the light-emitting chip 200. During use, first move the transfer substrate 500 to adhere the light-emitting chip 200 through the adhesive 520, so that the light-emitting chip 200 is adhered to the transfer substrate 500. Subsequently, the refrigeration component 530 is used to cool the adhesive 520 to reduce the fluidity of the adhesive 520, so that the light-emitting chip 200 does not move in the adhesive 520, avoiding the situation that the landing point of the light-emitting chip 200 deviates and causes the transfer of the light-emitting chip 200 to fail. When the light-emitting chip 200 moves above the display panel 100 through the transfer substrate 500 (that is, after the light-emitting chip 200 is in a predetermined installation position), the refrigeration component 530 stops working, and the temperature of the adhesive 520 is increased by laser irradiation or other means, so that the light-emitting chip 200 can be separated from the adhesive 520 and transferred to the display panel 100 to realize the transfer work of the light-emitting chip 200, facilitating the next process; Generally speaking, by setting the refrigeration component 530, the refrigeration component 530 works to cool the adhesive 520, reduce the fluidity of the adhesive 520 to avoid the situation that the light-emitting chip 200 moves in the adhesive 520 and causes the transfer of the light-emitting chip 200 to fail, improve the accuracy of the transfer of the light-emitting chip 200, and reduce the defect rate of mass transfer.

[0052] Specifically, the refrigeration component 530 can be arranged in a variety of ways, which will be illustrated one by one as follows:

[0053] As Figure 7 shown, the first setting method of the refrigeration component 530: The refrigeration component 530 is disposed on the side of the bottom plate 510 away from the adhesive 520. The driving anode 532 and the driving cathode 533 are respectively disposed at both ends of the refrigeration element 531. The driving anode 532 and the driving cathode 533 at both ends of the refrigeration element 531 drive the refrigeration element 531 to work for refrigeration and temperature reduction, and the temperature is conducted to the adhesive 520 through the bottom plate 510, so that the temperature of the adhesive 520 is reduced and the fluidity of the adhesive 520 is reduced;

[0054] AsFigure 8 As shown in the figure, the setting method of the second refrigeration component 530: The refrigeration component 530 is arranged between the bottom plate 510 and the adhesive 520. The two ends of the refrigeration element 531 are respectively provided with a driving anode 532 and a driving cathode 533. The refrigeration element 531 is in direct contact with the adhesive 520. Compared with the setting method of the first refrigeration component 530, due to the direct contact between the adhesive 520 and the refrigeration element 531, the refrigeration effect of the refrigeration element 531 is improved to a certain extent, so that the temperature of the adhesive 520 drops faster, and the probability of the light-emitting chip 200 shifting its position is greatly reduced;

[0055] As Figure 9 and Figure 10 shown, the setting method of the third refrigeration component 530: The refrigeration component 530 is arranged between the bottom plate 510 and the adhesive 520. A plurality of spaced grooves are provided on the refrigeration element 531, and the adhesive 520 is filled in the plurality of spaced grooves, so that the contact area between the adhesive 520 and the refrigeration element 531 is increased compared with the above two setting methods, so that the temperature of the adhesive 520 drops faster, and the probability of the light-emitting chip 200 shifting its position is greatly reduced. Among them, a driving cathode 533 and a driving anode 532 are arranged on the groove wall of the spaced groove, and the driving anode 532 and the driving cathode 533 are arranged opposite to each other to drive the refrigeration element 531 arranged between the driving anode 532 and the driving cathode 533.

[0056] As Figure 11 shown, as the eighth embodiment of the present application, which is an improvement of the seventh embodiment of the present application, a transfer substrate 500 is disclosed. A plurality of groups of the driving anode 532 and the driving cathode 533 are provided. The refrigeration element 531 is arranged on the side of the light-emitting chip 200 close to the bottom plate 510 (that is, on the side where the light-emitting chip 200 is connected to the adhesive 520). Each group of the driving anode 532 and the driving cathode 533 are arranged at intervals, and the interval distance matches the size of the light-emitting chip 200, so that the light-emitting chip 200 can be preliminarily positioned through the driving anode 532 and the driving cathode 533. Moreover, when the light-emitting chip 200 adheres to the adhesive 520, the refrigeration element 531 on the light-emitting chip 200 will be wrapped by the adhesive 520, and the light-emitting chip 200 will generate pressure on the refrigeration element 531 coated in the adhesive 520, so that the refrigeration element 531 starts to absorb the heat of the surrounding adhesive 520 and reduces the fluidity of the adhesive 520.

[0057] As Figure 12As shown, as the ninth embodiment of the present application, a transfer substrate 500 is disclosed. The transfer substrate 500 includes a bottom plate 510 and an adhesive 520. Refrigeration particles 521 are provided in the adhesive 520. The refrigeration particles 521 are made of one or more of superionic conductors, ferroelastic materials, shape memory alloys, ferroelectric materials, plastic crystal materials, zeolites, etc. When the light-emitting chip 200 adheres to the adhesive 520, it will exert pressure on the adhesive 520. After the refrigeration particles 521 in the adhesive 520 are subjected to pressure, they will absorb the heat of the surrounding adhesive 520 to reduce the fluidity of the adhesive 520, so that the light-emitting chip 200 will not shift its position during the transfer process, ensuring the position accuracy of the light-emitting chip 200 during the transfer process. Among them, the refrigeration particles 521 can account for 1%-10% of the overall volume of the adhesive 520 to ensure that the refrigeration particles 521 can cover most of the adhesive 520 and ensure that the refrigeration particles 521 can work properly when adsorbing the light-emitting chip 200.

[0058] In the transfer substrate 500 described in the above seventh embodiment and ninth embodiment, during the transfer process, the temperature of the adhesive 520 is lowered when the light-emitting chip 200 adheres to reduce the fluidity of the adhesive 520, so as to prevent the light-emitting chip 200 adhered in the adhesive 520 from shifting, ensuring the position accuracy of the light-emitting chip 200 during the mass transfer process, and ensuring the display quality of the Micro LED display panel 100.

[0059] It should be noted that the limitations of the various steps involved in this solution, without affecting the implementation of the specific solution, are not considered as limiting the order of the steps. The steps written in the front can be executed first, or can be executed later, or even can be executed simultaneously. As long as the solution can be implemented, it should be regarded as falling within the protection scope of the present application.

[0060] It should be noted that the inventive concept of the present application can form a very large number of embodiments, but the space of the application documents is limited and cannot list them all. Therefore, on the premise of no conflict, the above-described embodiments or technical features can be arbitrarily combined to form new embodiments. After the combination of each embodiment or technical feature, the original technical effect will be enhanced.

[0061] The above content is a further detailed description of the present application in combination with specific optional implementation manners. It cannot be determined that the specific implementation of the present application is only limited to these descriptions. For those of ordinary skill in the technical field to which the present application belongs, without departing from the concept of the present application, several simple deductions or substitutions can still be made, which should all be regarded as falling within the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: Driver substrate; A plurality of groups of cooling structures are evenly spaced on the driving substrate, each group of cooling structures comprising a driving electrode and cooling components arranged on both sides of the driving electrode; Hot melt adhesive, disposed on the driving substrate and covering multiple groups of the cooling structures; as well as A plurality of light-emitting chips, wherein the plurality of light-emitting chips are respectively arranged corresponding to the plurality of driving electrodes; The refrigeration component works so that the hot melt adhesive near the refrigeration component is in a solidified state.

2. The display panel according to claim 1, characterized in that: The refrigeration assembly includes a first insulating layer, an electron transport layer arranged on the first insulating layer, a photoelectric material layer arranged on the electron transport layer, a hole transport layer arranged on the photoelectric material layer, an anode layer arranged on the hole transport layer, a refrigeration layer arranged on the anode layer, a cathode layer arranged on the side of the first insulating layer, and a second insulating layer arranged between the cathode layer and the anode layer; The first insulating layer is used to isolate the cathode layer from the driving electrode, and the second insulating layer is used to isolate the anode layer from the cathode layer.

3. The display panel according to claim 1, characterized in that: The refrigeration assembly includes a first insulating layer, a cathode layer arranged on the first insulating layer, a refrigeration layer arranged on the cathode layer, an electron transport layer arranged on the cathode layer, a photoelectric material layer arranged on the electron transport layer, a hole transport layer arranged on the photoelectric material layer, an anode layer arranged on the hole transport layer, and a second insulating layer arranged between the photoelectric material layer and the refrigeration layer; The first insulating layer is used to isolate the cathode layer from the driving electrode, and the cooling layer is arranged opposite to the electron transport layer, the photoelectric material layer, the hole transport layer and the anode layer.

4. The display panel according to claim 1, characterized in that: The refrigeration assembly includes a first insulating layer, a refrigeration layer arranged on the first insulating layer, a second insulating layer arranged on the refrigeration layer, a cathode layer arranged on the first insulating layer and the second insulating layer, an electron transport layer arranged on the cathode layer, a photoelectric material layer arranged on the electron transport layer, a hole transport layer arranged on the photoelectric material layer, and an anode layer arranged on the first insulating layer and the hole transport layer; The first insulating layer is used to isolate the anode layer from the driving electrode, and the second insulating layer is used to isolate the anode layer from the cathode layer.

5. The display panel according to claim 1, characterized in that: The refrigeration assembly includes a first insulating layer, an electron transport layer disposed on the first insulating layer, a photoelectric material layer disposed on the electron transport layer, a hole transport layer disposed on the photoelectric material layer, an anode layer disposed on the hole transport layer, a refrigeration layer disposed on the anode layer, a cathode layer disposed on the electron transport layer, and a second insulating layer disposed between the cathode layer and the anode layer; The first insulating layer is used to isolate the cathode layer from the driving electrode, and the second insulating layer is used to isolate the cathode layer from the anode layer.

6. The display panel according to claim 3, characterized in that: In the horizontal plane direction of the driving substrate, the length of the cooling layer is greater than or equal to the length of the anode layer.

7. The display panel according to any one of claims 2 to 5, characterized in that: In the thickness direction of the driving substrate, the thickness of the cooling layer is greater than or equal to 1 micron.

8. The display panel according to any one of claims 2 to 5, characterized in that: The refrigeration layer is made of light-transmitting material.

9. The display panel according to any one of claims 2 to 5, characterized in that: The photoelectric material layer is made of at least one of lead tin telluride, mercury cadmium telluride, triglycyl sulfate and lithium tantalate.

10. A display device, characterized in that: The device comprises a display panel and a driving circuit as described in any one of claims 1 to 9, wherein the driving circuit drives the display panel.

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