Photosensitive element module, camera module and electronic device

Abstract

A photosensitive element module, a camera module and an electronic device, the photosensitive element module having an optical path and including a photosensitive element, a reflective element, an optical multilayer deposition structure layer and a nano rough surface. The photosensitive element corresponds to the light path. The reflecting element faces and is adjacent to the photosensitive element, and the reflecting element turns the light path. The optical multilayer deposition structure layer is farther from the photosensitive element than the reflective element along the optical path. The nanometer rough surface is arranged on one side, facing the reflecting element, of the photosensitive element, the nanometer rough surface comprises a plurality of nanometer protruding structures, and the nanometer protruding structures are irregular in shape and are arranged adjacently. Therefore, optical quality reduction can be avoided, and the industrial utilization rate is improved.

Description

Technical Field

[0001] The present disclosure relates to a photosensitive element module and a camera module, and in particular to a photosensitive element module and a camera module applied to a portable electronic device. Background Art

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices and tablet computers, which have become part of modern people's lives, and the camera modules and photosensitive element modules installed on portable electronic devices have also developed rapidly. However, as technology becomes more and more advanced, users have higher and higher requirements for the quality of photosensitive element modules.

[0003] Specifically, infrared light can penetrate the light shielding element more easily than visible light, so it is easy for infrared light to penetrate the original light shielding position from the turning point of the light path to reach the photosensitive surface, resulting in incorrect exposure of the image and failure to present the correct color. Therefore, developing a photosensitive element module that can improve the problem of infrared light easily generating glare in the reflex telephoto lens has become an important and urgent problem to be solved in the industry. Summary of the invention

[0004] The present disclosure provides a photosensitive element module, a camera module and an electronic device, which can help improve industrial utilization and improve glare problems by configuring a reflective element, a nano-rough surface and an optical multi-layer deposition structure layer on an optical path.

[0005] According to an embodiment of the present disclosure, a photosensitive element module is provided, which has an optical path and includes a photosensitive element, a reflective element, an optical multilayer deposition structure layer and a nano-rough surface. The photosensitive element corresponds to the optical path. The reflective element faces and is adjacent to the photosensitive element, and the reflective element turns the optical path. The optical multilayer deposition structure layer is farther away from the photosensitive element than the reflective element along the optical path, and the reflectivity of the optical multilayer deposition structure layer to light with a wavelength of 450nm to 600nm is less than or equal to 10%. The nano-rough surface is arranged on the side of the photosensitive element facing the reflective element, and the nano-rough surface includes a plurality of nano-protrusion structures, the shapes of the nano-protrusion structures are irregular and arranged adjacently, the width of the nano-protrusion structures is less than or equal to 300nm, and the height is less than or equal to 350nm. The reflectivity of the nano-rough surface corresponds to the reflectivity of the optical multilayer deposition structure layer, and the wavelength at which the reflectivity of the optical multilayer deposition structure layer is 50% is R50, and the maximum reflectivity of the nano-rough surface to 450nm to wavelength R50 is less than or equal to 0.49%, which satisfies the following conditions: 600nm≤R50≤720nm.

[0006] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflective element may include a prism, wherein the prism includes a light incident surface, at least one reflective surface and a light emitting surface along the light path, and the light emitting surface faces and is adjacent to the nano-rough surface.

[0007] According to the photosensitive element module of the embodiment described in the previous paragraph, the optical multi-layer deposition structure layer can be disposed on the light incident surface.

[0008] According to the photosensitive element module of the embodiment described in the previous paragraph, the prism can be a red light absorbing element.

[0009] According to the photosensitive element module of the embodiment described in the previous paragraph, at least one of the light incident surface, the reflection surface and the light emitting surface of the prism may include an aspherical surface, and the aspherical surface is arranged corresponding to the light path.

[0010] According to the photosensitive element module of the embodiment described in the previous paragraph, the prism may further include a plurality of concave structures, wherein the concave structures are arranged adjacent to each other and gradually shrink toward the direction close to the light path, and two adjacent concave structures form a tip. The distance between two adjacent tips in the tip may be between 0.3 mm and 2.9 mm.

[0011] According to the photosensitive element module of the embodiment described in the previous paragraph, the prism may be a glass element, and the prism may further include an injection mark, and the prism is injection-molded through the injection mark.

[0012] According to the photosensitive element module of the embodiment described in the previous paragraph, the prism may further include an edge surface, the injection mark extends from the edge surface in a direction away from the light path, and the injection mark gradually widens in a direction close to the edge surface.

[0013] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflective element may include a reflector, and the reflector deflects the light path.

[0014] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflective element may further include a frame, and the frame and the reflector are integrally formed by insert injection molding.

[0015] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflective element may further include a nano-rough surface, and the nano-rough surface is disposed on at least a portion of the reflector and the frame.

[0016] The photosensitive element module according to the embodiment described in the previous paragraph may further include a bracket and an air compartment. The bracket is covered on the photosensitive element, wherein the reflective element is disposed on the bracket. The air compartment is formed between the reflective element and the photosensitive element, the bracket surrounds the air compartment, and the nano-rough surface and the air compartment at least partially overlap in the optical path.

[0017] According to the photosensitive element module of the embodiment described in the previous paragraph, the nano-rough surface can extend from a photosensitive surface toward the bracket, and the nano-rough surface is disposed on at least a portion of the bracket.

[0018] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflective element may include a bracket portion, wherein the bracket portion and the photosensitive element are relatively fixed. The photosensitive element module may further include an air compartment, wherein the air compartment is formed between the reflective element and the photosensitive element, the bracket portion surrounds the air compartment, and the nano-rough surface and the air compartment at least partially overlap in the optical path.

[0019] The photosensitive element module according to the embodiment described in the previous paragraph may further include an infrared light absorbing coating, wherein the infrared light absorbing coating is disposed on the reflective element, and the thickness of the infrared light absorbing coating may be between 900 nm and 5 um.

[0020] The photosensitive element module according to the embodiment described in the previous paragraph may further include a filter element, wherein the filter element may include a red light absorption plate, and the optical multi-layer deposition structure layer is disposed on the red light absorption plate.

[0021] According to the photosensitive element module of the embodiment described in the previous paragraph, the photosensitive element may include a plurality of pixel units, the pixel size of the pixel unit may be between 400nm and 2000nm, any of the pixel units includes a microlens, and the nano-rough surface is disposed on the microlens of any of the pixel units.

[0022] According to an embodiment of the present disclosure, a camera module is provided, comprising a photosensitive element module as described in the above embodiment and an imaging lens, wherein the imaging lens is disposed on an object side of the photosensitive element module along an optical path.

[0023] The camera module according to the embodiment described in the previous paragraph may further include an object side reflective element, wherein the object side reflective element is disposed on the object side of the photosensitive element module, and the optical multilayer deposition structure layer is disposed on the object side reflective element.

[0024] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may include an object-side lens group, and the object-side lens group is disposed on an object side of the object-side reflective element.

[0025] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may include an image side lens group, the image side lens group is arranged between the object side reflective element and the photosensitive element module, and the optical multilayer deposition structure layer is arranged between the image side lens group and the reflective element.

[0026] The camera module according to the embodiment described in the previous paragraph may further include an object side reflective element, wherein the object side reflective element is arranged on an object side of the reflective element, the object side reflective element may include an infrared light absorbing coating, the light path passes through the infrared light absorbing coating, and the thickness of the infrared light absorbing coating may be between 900nm and 5um.

[0027] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may include a plurality of lenses, the lenses are arranged in sequence along the optical path, and the optical multi-layer deposition structure layer is disposed on one of the lenses.

[0028] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may further include a lens group, the lens group and the reflective element are relatively fixed, and the optical multi-layer deposition structure layer is disposed on the lens group.

[0029] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may further include an optical absorption lens, and an absorption peak of the optical absorption lens may be between 600nm and 800nm.

[0030] According to the camera module of the embodiment described in the previous paragraph, the photosensitive element module may further include a primary optical multilayer deposition structure layer, a secondary optical multilayer deposition structure layer is arranged on the reflective element, the reflectivity of the secondary optical multilayer deposition structure layer to light with a wavelength of 450nm to 550nm may be less than or equal to 10%, and the wavelength at which the reflectivity of the secondary optical multilayer deposition structure layer is 50% is R50', which can meet the following conditions: 600nm≤R50'≤720nm.

[0031] According to the camera module of the embodiment described in the previous paragraph, the average wavelength transmittance of the imaging lens for light with a wavelength of 700nm to 800nm ​​can be less than or equal to 5%, and the transmittance of a maximum transmittance wavelength for light with a wavelength of 400nm to 800nm ​​can be greater than or equal to 82%.

[0032] According to the camera module of the embodiment described in the previous paragraph, the width of the nano-protrusion structure may be less than or equal to 250nm, and the height may be less than or equal to 250nm, wherein the number of layers of the optical multilayer deposition structure layer may be greater than 30. The imaging lens may include an optical absorption lens, and an absorption peak of the optical absorption lens may be between 650nm and 750nm. The imaging lens may have an average wavelength transmittance of 700nm to 800nm ​​wavelength light of less than or equal to 1%, and a maximum transmittance wavelength transmittance of 400nm to 800nm ​​wavelength light of greater than or equal to 85%. The reflectivity of the optical multilayer deposition structure layer is 50% of the wavelength R50, and the maximum reflectivity of the nano-rough surface from 450nm to the wavelength R50 may be less than or equal to 0.2%, which may meet the following conditions: 650nm≤R50≤700nm.

[0033] According to an embodiment of the present disclosure, an electronic device is provided, comprising the camera module of the aforementioned embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1A A three-dimensional diagram of a camera module according to a first embodiment of the present disclosure is shown;

[0035] Figure 1B Draw according to Figure 1A A cross-sectional view of a camera module in a first embodiment;

[0036] Figure 1C Draw according to Figure 1A A cross-sectional view of a camera module in a first embodiment;

[0037] Figure 1D Draw according to Figure 1A Scanning electron microscope image of the photosensitive element and the nano-rough surface in the first embodiment;

[0038] Figure 1E Draw according to Figure 1A A partial schematic diagram of a camera module in a first embodiment of a first implementation mode;

[0039] Figure 1F Draw according to Figure 1E A partial enlarged view of the photosensitive element module in the first embodiment of the first implementation mode;

[0040] Figure 1G Draw according to Figure 1A A partial schematic diagram of a camera module in a second embodiment of the first embodiment;

[0041] Figure 1H Draw according to Figure 1A A perspective view of a prism in a third example of the first embodiment;

[0042] Fig. 1I Draw according to Figure 1H A schematic diagram of a prism in a third example of the first embodiment;

[0043] Figure 1J Draw according to Fig. 1I A cross-sectional view of the prism along the section line 1J-1J in the third example of the first embodiment;

[0044] Figure 1K Draw according to Figure 1A A perspective view of a prism in a fourth example of the first embodiment;

[0045] Figure 1L Draw according to Figure 1K A schematic diagram of a prism in a fourth example of the first embodiment;

[0046] Figure 1M Draw according to Figure 1L A cross-sectional view of the prism along the section line 1M-1M in the fourth example of the first embodiment;

[0047] Figure 1N Draw according to Figure 1A A perspective view of a prism in a fifth example of the first embodiment;

[0048] Fig.1O Draw according to Figure 1N A schematic diagram of a prism in a fifth example of the first embodiment;

[0049] Figure 1P Draw according to Fig.1O A cross-sectional view of the prism along the section line 1P-1P in the fifth example of the first embodiment;

[0050] Figure 1Q Draw according to Figure 1A A perspective view of a prism in a sixth example of the first embodiment;

[0051] Figure 1R Draw according to Figure 1Q A schematic diagram of a prism in a sixth example of the first embodiment;

[0052] Figure 1S Draw according to Figure 1A A perspective view of a prism in a seventh example of the first embodiment;

[0053] Figure 1T Draw according to Figure 1S A schematic diagram of a prism in a seventh example of the first embodiment;

[0054] Figure 1U Draw according to Figure 1A The reflectivity of the optical multilayer deposited structure layer in the first embodiment;

[0055] Figure 1V Draw according to Figure 1A The transmittance of the filter element in the first embodiment;

[0056] Figure 1W Draw according to Figure 1A The reflectivity of the nano-rough surface in the first embodiment;

[0057] Figure 1X Draw according to Figure 1A The penetration rate of the imaging lens in the first embodiment;

[0058] Figure 1Y Draw according to Figure 1A The transmittance of the lens in the first embodiment;

[0059] Figure 2A A perspective view of a camera module according to a second embodiment of the present disclosure is shown;

[0060] Figure 2B Draw according to Figure 2A A partial cross-sectional view of a camera module in a second embodiment;

[0061] Figure 2C Draw according to Figure 2A A cross-sectional view of the camera module in the first embodiment of the second implementation mode;

[0062] Figure 2D Draw according to Figure 2C A partial enlarged view of the camera module in the first embodiment of the second implementation mode;

[0063] Figure 2E Draw according to Figure 2C Another enlarged view of a portion of the camera module in the first embodiment of the second implementation mode;

[0064] Figure 2F Draw according to Figure 2A A partial schematic diagram of a camera module in a second embodiment of the second implementation mode;

[0065] Figure 2G Draw according to Figure 2F A partial enlarged view of the camera module in the second embodiment of the second implementation mode;

[0066] Figure 2H Draw according to Figure 2A A partial schematic diagram of a camera module in a third example of the second implementation mode;

[0067] Fig.2I Draw according to Figure 2A A partial schematic diagram of a camera module in a fourth embodiment of the second implementation mode;

[0068] Figure 2J Draw according to Fig.2I A partial enlarged view of the camera module in the fourth example of the second embodiment;

[0069] Figure 2K Draw according to Figure 2A A partial schematic diagram of a camera module in a fifth embodiment of the second implementation mode;

[0070] Figure 2L Draw according to Figure 2K A partial enlarged view of the camera module in the fifth embodiment of the second implementation mode;

[0071] Figure 2M Draw according to Figure 2A A partial schematic diagram of a camera module in a sixth embodiment of the second implementation mode;

[0072] Figure 3A A three-dimensional diagram of a camera module according to a third embodiment of the present disclosure is shown;

[0073] Figure 3B Draw according to Figure 3A An exploded view of a camera module in a third embodiment;

[0074] Figure 3C Draw according to Figure 3A A cross-sectional view of a camera module in a third embodiment;

[0075] Figure 3D Draw according to Figure 3C A partial enlarged view of the camera module in the third embodiment;

[0076] Figure 3E Draw according to Figure 3A An exploded view of a photosensitive element module in a third embodiment;

[0077] Figure 4A A three-dimensional diagram of a camera module according to a fourth embodiment of the present disclosure is shown;

[0078] Figure 4B Draw according to Figure 4A An exploded view of a camera module in a fourth embodiment;

[0079] Figure 4C Draw according to Figure 4A A cross-sectional view of a camera module in a fourth embodiment;

[0080] Figure 4D Draw according to Figure 4A An exploded view of the photosensitive element module in the fourth embodiment;

[0081] Figure 5A A schematic diagram of an electronic device according to a fifth embodiment of the present disclosure is shown;

[0082] Figure 5B Draw according to Figure 5A Another schematic diagram of the electronic device in the fifth embodiment;

[0083] Figure 6 A schematic diagram showing an electronic device disposed on a drone according to a sixth embodiment of the present disclosure;

[0084] Figure 7 A schematic diagram showing an electronic device installed in a car according to a seventh embodiment of the present disclosure;

[0085] Figure 8 A schematic diagram illustrating an electronic device disposed on a computer according to an eighth embodiment of the present disclosure; and

[0086] Fig. 9 A schematic diagram illustrating an electronic device disposed on a wearable device according to a ninth embodiment of the present disclosure.

[0087]

Explanation of symbols

[0088] 10,20,30,40: Camera module

[0089] 11,31,41: Photosensitive element module

[0090] 13,33: Imaging lens carrier

[0091] 110,210,310,410: Photosensitive elements

[0092] 110a: Photosensitive element surface

[0093] 111: Pixel unit

[0094] 112: Microlens

[0095] 120a, 220a, 320, 420a: Reflective element

[0096] 120b, 220b, 420b: Object side reflective element

[0097] 121,221,321,421: light incident side

[0098] 122,222,322a,322b,322c,322d,322e,422: Reflective surface

[0099] 123,223,323,423: light-emitting surface

[0100] 124: Cutting Edge

[0101] 125: injection mark

[0102] 126: Edge surface

[0103] 127:Rounded surface

[0104] 131,231,331,431: Optical multilayer deposition structure layer

[0105] 132,232,332: Infrared light absorbing coating

[0106] 133,433: Sub-optical multilayer deposition structure layer

[0107] 140,240:Nano rough surface

[0108] 141:Nanoprotrusion structure

[0109] 161,261,361: Bracket

[0110] 162,262: Air compartment

[0111] 163,263:Inner wall

[0112] 170,270,370: Filter elements

[0113] 171,271,371: Red light absorption plate

[0114] 181: Image side lens group

[0115] 181a,181b: Group lens

[0116] 182: Object side lens group

[0117] 22,32,42a,42b: Imaging lenses

[0118] 234: Reflection layer

[0119] 250: Reflector Group

[0120] 251: Reflector

[0121] 252:Frame

[0122] 253,453: Bracket

[0123] 254: Flat plate element

[0124] 255:Substrate

[0125] 264:Substrate

[0126] 265:Carrier

[0127] 272: Red light absorbing glass

[0128] 291:Drive

[0129] 292,392: Image processing components

[0130] 366:Maintaining element

[0131] 384: Infrared light absorption lens

[0132] 493: Image Stabilization Driver

[0133] 494: Focus driver

[0134] 50: Electronic devices

[0135] 510: Image acquisition control interface

[0136] 511: Video playback button

[0137] 512: Camera module switch button

[0138] 513: Focus and photo button

[0139] 514: Integrated menu button

[0140] 515: Zoom control key

[0141] 521: Front camera module

[0142] 522: Wide-angle camera module

[0143] 523: Telephoto camera module

[0144] 524:Ultra-wide-angle camera module

[0145] 525: Macro camera module

[0146] 526:TOF module

[0147] 53: Tip light

[0148] 54: Electronic component board

[0149] 541:Connector

[0150] 542: Electronic components

[0151] 55: Single chip system

[0152] 56: Auxiliary focusing element

[0153] 561: Light-emitting element

[0154] 60: Drone

[0155] 61a, 71a: Front camera module

[0156] 61b, 71b: Side camera module

[0157] 61c: Bottom camera module

[0158] 71c: Rear camera module

[0159] 70: Car

[0160] 80: Computer

[0161] 81a: Infrared camera module

[0162] 81b,91: Video camera module

[0163] 90: Wearable Devices

[0164] AP: Absorption Peak

[0165] BS: Base

[0166] E: Circuit

[0167] ES: light emitting side

[0168] G:Glue

[0169] L: Light path

[0170] LE: Lens

[0171] IMG: Photosensitive surface

[0172] IS: Light incident side

[0173] I1, I2, I3, I4: External space information

[0174] W1: Width of the nanoprotrusion structure

[0175] W2: pixel size of pixel unit

[0176] H1: Height of nanoprotrusion structure

[0177] H2: The distance between the nanoprotrusion structure and the surface of the photosensitive element

[0178] SP,SP1,SP2: The distance between two adjacent tips DETAILED DESCRIPTION

[0179] The present disclosure provides a photosensitive element module, which has an optical path and includes a photosensitive element, a reflective element, an optical multilayer deposition structure layer and a nano-rough surface. The photosensitive element corresponds to the optical path. The reflective element faces and is adjacent to the photosensitive element, and the reflective element turns the optical path. The optical multilayer deposition structure layer is farther away from the photosensitive element than the reflective element along the optical path, and the reflectivity of the optical multilayer deposition structure layer to light with a wavelength of 450nm to 600nm is less than or equal to 10%. The nano-rough surface is arranged on the side of the photosensitive element facing the reflective element, and the nano-rough surface includes a plurality of nano-protrusion structures, the shapes of the nano-protrusion structures are irregular and arranged adjacently, the width of the nano-protrusion structures is less than or equal to 300nm, and the height is less than or equal to 350nm. The reflectivity of the nano-rough surface corresponds to the reflectivity of the optical multilayer deposition structure layer, and the wavelength at which the reflectivity of the optical multilayer deposition structure layer is 50% is R50, and the maximum reflectivity of the nano-rough surface to 450nm to wavelength R50 is less than or equal to 0.49%, which satisfies the following conditions: 600nm≤R50≤720nm.

[0180] Specifically, by configuring the reflective element, nano-rough surface and optical multi-layer deposition structure layer on the optical path, it can effectively improve color contrast, avoid glare, shorten the height of the camera module, and improve industrial utilization. Furthermore, the present disclosure can improve the problem of infrared light easily generating glare in the reflex telephoto lens.

[0181] By placing the optical multilayer deposited structure layer farther away from the nano-rough surface than the reflective element along the optical path, glare caused by reflection between the optical multilayer deposited structure layer and the photosensitive surface can be avoided, thereby avoiding a decrease in optical quality. At the same time, the thickness of the optical multilayer deposited structure layer in the direction perpendicular to the photosensitive surface can be reduced, thereby improving industrial utilization.

[0182] Furthermore, the optical multilayer deposition structure layer allows light in the visible light range to pass through, and reflects infrared light and ultraviolet light, thereby achieving the functionality of filtering light. The nano-rough surface optimizes the light transmission rate that can pass through the optical multilayer deposition structure layer, greatly reducing the reflection of light on the photosensitive surface to increase the proportion of visible light received.

[0183] The optical multilayer deposition structure layer is multilayer, and the number of layers can be greater than or equal to 10, wherein the optical multilayer deposition structure layer with a high number of layers can be a superposition of multiple sets of coatings, and the adjacent layers of the optical multilayer deposition structure layer have different refractive indices, thereby providing different reflectivities for light of different frequencies. By stacking layers with high and low refractive indices, the light with wavelengths below 400nm and above 700nm has a higher reflectivity, thereby achieving a filtering effect. In addition, the number of layers can be further greater than or equal to 36. In addition, the number of layers can be further greater than or equal to 72.

[0184] Furthermore, the nano-rough surface can be prepared by nano-imprinting, etching, epitaxy and other processes, but is not limited thereto.

[0185] The reflective element may include a prism, wherein the prism includes a light incident surface, at least one reflective surface and a light emitting surface along the light path, and the light emitting surface faces and is adjacent to the nano-rough surface. Specifically, the prism can reduce assembly tolerance to improve yield. Furthermore, the air compartment can be further sealed by the light emitting surface to achieve good sealing.

[0186] The optical multilayer deposition structure layer can be disposed on the light incident surface. Thus, the optical multilayer deposition structure layer and the light incident surface can be prevented from having surface reflection. Furthermore, the optical multilayer deposition structure layer can be directly disposed on the light incident surface, and can be bonded to the prism through a filter element to achieve the above structure, but is not limited thereto.

[0187] The prism may be a red light absorbing element, wherein the red light absorbing element may be blue glass, thereby reducing the interference of red light on other photosensitive pixels, thereby further improving the optical quality.

[0188] At least one of the light incident surface, the reflection surface and the light emitting surface of the prism may include an aspherical surface, and the aspherical surface is arranged corresponding to the light path, thereby further improving the optical quality after passing through the optical multi-layer deposition structure layer.

[0189] The prism may further include a plurality of concave structures, wherein the concave structures are arranged adjacent to each other and gradually shrink toward the direction close to the light path, and two adjacent concave structures form a tip. The distance between two adjacent tips may be between 0.3 mm and 2.9 mm. In this way, glare caused by reflection of light through the wall of the prism is avoided.

[0190] The prism may be a glass element, wherein the prism may further include an injection mark, and the prism is injection-molded through the injection mark. Specifically, the material of the prism may be transparent glass, red light absorbing glass, etc., but is not limited thereto.

[0191] The prism may further include an edge surface, wherein the injection mark extends from the edge surface in a direction away from the light path, and the injection mark gradually widens in a direction close to the edge surface. In this way, glare generated by the cut of the injection mark can be avoided. In detail, the injection mark may include a rounded surface, wherein the rounded surface is connected to the edge surface, so as to improve the formability.

[0192] The reflective element may include a reflector, wherein the reflective mirror deflects the light path. By reducing the weight of the reflective element, the weight of the photosensitive element module is reduced, and the energy and time consumed in driving the reflective element can also be indirectly reduced.

[0193] The reflective element may further include a frame, wherein the frame and the reflector are integrally formed by insert injection molding, thereby reducing assembly tolerance and assembly process.

[0194] The reflective element may further include a nano-rough surface, wherein the nano-rough surface is disposed on at least a portion of the reflector and the frame, thereby reducing reflections generated by the substrate surface of the reflector to avoid ghosting, and simultaneously reducing glare caused by frame reflections.

[0195] The photosensitive element module may further include a bracket and an air compartment. The bracket is covered on the photosensitive element, wherein the reflective element is disposed on the bracket. The air compartment is formed between the reflective element and the photosensitive element, the bracket surrounds the air compartment, and the nano-rough surface and the air compartment at least partially overlap in the optical path. In this way, contamination of the photosensitive surface can be avoided during the assembly process.

[0196] The nano-rough surface can extend from a photosensitive surface toward the support, and the nano-rough surface is disposed on at least a portion of the support, thereby preventing light from being reflected by the support to form glare.

[0197] The reflective element may include a bracket portion, wherein the bracket portion and the photosensitive element are relatively fixed. The photosensitive element module may further include an air compartment, wherein the air compartment is formed between the reflective element and the photosensitive element, the bracket portion surrounds the air compartment, and the nano-rough surface and the air compartment at least partially overlap in the optical path. By molding the reflective element and the bracket portion into one body, the assembly process and assembly tolerance are reduced, thereby improving the optical quality. The method of molding into one body can be achieved by injection molding, embedded injection molding and other processes, but is not limited thereto.

[0198] The photosensitive element module may further include an infrared light absorbing coating, wherein the infrared light absorbing coating is disposed on the reflective element, and the thickness of the infrared light absorbing coating may be between 900nm and 5um. This can prevent the residual infrared light after passing through the optical multilayer deposition structure layer from affecting the image quality. Furthermore, when the infrared light absorbing coating is disposed on the reflective surface, it can be equivalent to passing through the infrared light absorbing coating twice, thereby reducing the thickness of the coating.

[0199] The photosensitive element module may further include a filter element, wherein the filter element may include a red light absorption plate, and the optical multilayer deposition structure layer is disposed on the red light absorption plate. The red light absorption plate can reduce the interference of red light on other photosensitive pixels to further improve the optical quality. Specifically, the modular filter element can improve the assembly process to ensure production feasibility.

[0200] The photosensitive element may include a plurality of pixel units, wherein the pixel size of the pixel unit may be between 400nm and 2000nm, any of the pixel units may include a microlens, and the nano-rough surface is disposed on the microlens of any of the pixel units. By improving the light collection efficiency of the pixel unit, the optical quality of the edge is improved. Furthermore, an intermediate layer may be further included between the nano-rough surface and the microlens to improve adhesion.

[0201] The various technical features of the photosensitive element module disclosed above can be configured in combination to achieve corresponding effects.

[0202] The present disclosure provides a camera module, comprising the aforementioned photosensitive element module and an imaging lens, wherein the imaging lens is disposed on an object side of the photosensitive element module along the optical path, and the optical multilayer deposition structure layer can be disposed on the object side of the reflective element.

[0203] The camera module may further include an object side reflective element, wherein the object side reflective element is disposed on the object side of the photosensitive element module, and the optical multilayer deposition structure layer is disposed on the object side reflective element. Thus, non-imaging light can be further prevented from entering the camera module to form glare.

[0204] The imaging lens may include an object side lens group, wherein the object side lens group is disposed on an object side of the object side reflective element. By controlling the light passing through the optical multilayer deposition structure layer, its efficiency is improved.

[0205] The imaging lens may include an image side lens group, wherein the image side lens group is disposed between the object side reflective element and the photosensitive element module, and the optical multilayer deposition structure layer is disposed between the image side lens group and the reflective element. The optical quality is improved by optimizing the light passing through the optical multilayer deposition structure layer.

[0206] The camera module may further include an object side reflective element, wherein the object side reflective element is disposed on an object side of the reflective element, and the object side reflective element may include an infrared light absorbing coating, the light path passes through the infrared light absorbing coating, and the thickness of the infrared light absorbing coating may be between 900nm and 5um. Further, the object side reflective element may include an infrared light absorbing coating, wherein the infrared light absorbing coating may cooperate with the optical multilayer deposition structure layer to prevent light in the infrared light band from entering the photosensitive surface, thereby improving the optical quality.

[0207] The imaging lens may include a plurality of lenses, wherein the lenses are arranged in sequence along the optical path, and the optical multilayer deposition structure layer is disposed on one of the lenses. Specifically, the lens material may further be an infrared light absorbing material to further filter infrared light.

[0208] The imaging lens may further include a lens group, wherein the lens group and the reflective element are relatively fixed, and the optical multilayer deposition structure layer is disposed on the lens group, thereby reducing the risk caused by the optical multilayer deposition structure layer shifting.

[0209] The imaging lens may further include an optical absorption lens, wherein an absorption peak of the optical absorption lens may be between 600nm and 800nm. By cooperating with the optical multilayer deposition structure layer, the color deviation generated by the optical multilayer deposition structure layer can be corrected, thereby further improving the light filtering effect. In detail, the optical multilayer deposition structure layer can be further disposed on the optical absorption lens.

[0210] The photosensitive element module may further include a primary optical multilayer deposition structure layer, wherein the secondary optical multilayer deposition structure layer is disposed on a reflective element, and the reflectivity of the secondary optical multilayer deposition structure layer to light with a wavelength of 450nm to 550nm may be less than or equal to 10%, and a wavelength R50' at which the reflectivity of the secondary optical multilayer deposition structure layer is 50% may meet the following conditions: 600nm≤R50'≤720nm. The optical quality is ensured by performing secondary filtering on the incident light, wherein the secondary optical multilayer deposition structure layer may be further disposed on a filter element.

[0211] The average wavelength transmittance of the imaging lens for 700nm to 800nm ​​wavelength light can be less than or equal to 5%, and the transmittance of a wavelength with a maximum transmittance for 400nm to 800nm ​​wavelength light can be greater than or equal to 82%. The imaging lens has the function of filtering light, thereby saving space for using traditional filter elements and further reducing the size of the camera module.

[0212] The width of the nano-protrusion structure may be less than or equal to 250nm, and the height may be less than or equal to 250nm, wherein the number of layers of the optical multilayer deposition structure layer may be greater than 30. The imaging lens may include an optical absorption lens, and an absorption peak of the optical absorption lens may be between 650nm and 750nm. The imaging lens may have an average wavelength transmittance of 700nm to 800nm ​​wavelength light of less than or equal to 1%, and a maximum transmittance wavelength transmittance of 400nm to 800nm ​​wavelength light of greater than or equal to 85%. The reflectivity of the optical multilayer deposition structure layer is 50% of the wavelength R50, and the maximum reflectivity of the nano-rough surface from 450nm to the wavelength R50 may be less than or equal to 0.2%, which may meet the following conditions: 650nm≤R50≤700nm.

[0213] The various technical features of the camera module disclosed above can be configured in combination to achieve corresponding effects.

[0214] The present disclosure provides an electronic device including the aforementioned camera module.

[0215] According to the above-mentioned implementation modes, specific implementation modes and examples are proposed below and described in detail with reference to the accompanying drawings.

[0216] <First embodiment>

[0217] Please refer to Figures 1A to 1C ,in Figure 1A A three-dimensional diagram of a camera module 10 according to a first embodiment of the present disclosure is shown. Figure 1B Draw according to Figure 1A A cross-sectional view of the camera module 10 in the first embodiment, Figure 1C Draw according to Figure 1A A cross-sectional view of the camera module 10 in the first embodiment. Figures 1A to 1C It can be seen that the camera module 10 includes a photosensitive element module 11, an imaging lens (not shown) and an imaging lens carrier 13 (marked on Figure 1E ), wherein the imaging lens is disposed along an optical path L at an object side of the photosensitive element module 11, and the imaging lens carrier 13 is used to load the imaging lens.

[0218] Please refer to Figures 1D to 1F ,in Figure 1D Draw according to Figure 1A Scanning electron microscope images of the photosensitive element 110 and the nano-rough surface 140 in the first embodiment, Figure 1E Draw according to Figure 1A A partial schematic diagram of a camera module 10 in a first embodiment of a first implementation mode, Figure 1F Draw according to Figure 1E A partial enlarged view of the photosensitive element module 11 in the first example of the first embodiment. Figures 1B to 1F It can be seen that the photosensitive element module 11 has an optical path L, and includes a photosensitive element 110, a reflective element 120a, an optical multilayer deposition structure layer 131 and a nano-rough surface 140. The photosensitive element 110 corresponds to the optical path L. The reflective element 120a faces and is adjacent to the photosensitive element 110, and the reflective element 120a turns the optical path L. The optical multilayer deposition structure layer 131 is farther away from the photosensitive element 110 than the reflective element 120a along the optical path L, and the optical multilayer deposition structure layer 131 is arranged on an object side of the reflective element 120a. The nano-rough surface 140 is arranged on the side of the photosensitive element 110 facing the reflective element 120a, and the nano-rough surface 140 includes a plurality of nano-protrusion structures 141, and the shapes of the nano-protrusion structures 141 are irregular and arranged adjacent to each other.

[0219] By locating the optical multilayer deposited structure layer 131 farther away from the nano-rough surface 140 than the reflective element 120a along the optical path L, glare caused by reflection between the optical multilayer deposited structure layer 131 and a photosensitive surface IMG of the photosensitive element 110 can be avoided, thereby preventing the optical quality from being reduced. At the same time, the thickness of the optical multilayer deposited structure layer 131 in the direction perpendicular to the photosensitive surface IMG can be reduced, thereby improving industrial utilization.

[0220] In detail, the optical multilayer deposited structure layer 131 allows light in the visible light range to pass through and reflects infrared light and ultraviolet light, or reflects infrared light or ultraviolet light to achieve the functionality of filtering light. The nano-rough surface 140 optimizes the light transmission rate that can pass through the optical multilayer deposited structure layer 131, greatly reducing the reflection of light on the photosensitive surface IMG to increase the proportion of visible light received.

[0221] The optical multilayer deposition structure layer 131 is multilayer, and the number of layers may be greater than or equal to 10, wherein the optical multilayer deposition structure layer 131 with a high number of layers may be a superposition of multiple sets of coatings. In addition, the number of layers may be further greater than or equal to 30. In addition, the number of layers may be further greater than or equal to 36. In addition, the number of layers may be further greater than or equal to 72. Furthermore, the nano-rough surface 140 may be prepared by nano-imprinting, etching, epitaxy and other processes, but is not limited thereto.

[0222] Please refer to Table 1, which lists the refractive index classification and thickness value of the optical multilayer deposition structure layer 131 in the first embodiment, wherein the optical multilayer deposition structure layer 131 is a superposition of two sets of coatings, but is not limited to this. As can be seen from Table 1, the adjacent layers of the optical multilayer deposition structure layer 131 are different refractive index materials, thereby providing different reflectivities for light of different frequencies. Further, H and L in the refractive index of Table 1 represent high refractive index materials and low refractive index materials, respectively, the high refractive index material is silicon oxide, and the low refractive index material is magnesium fluoride.

[0223]

[0224]

[0225]

[0226] Depend on Figure 1B and Figure 1C It can be seen that the camera module 10 may further include an object-side reflective element 120b, wherein the object-side reflective element 120b is disposed on an object side of the photosensitive element module 11, and the optical multilayer deposition structure layer 131 is disposed on the object-side reflective element 120b. Further, the object-side reflective element 120b is disposed on the object side of the reflective element 120a. In this way, non-imaging light can be further prevented from entering the camera module 10 to form glare.

[0227] Depend on Figures 1A to 1C It can be known that the camera module 10 may further include a base BS, wherein the object-side reflective element 120 b may move relative to the base BS to achieve optical stability functionality.

[0228] The camera module 10 may further include a circuit E, wherein the circuit E is disposed on one side of the photosensitive element 110 .

[0229] Depend on Figure 1B , Figure 1C and Figure 1E It can be seen that the imaging lens may include an image side lens group 181 and an object side lens group 182, wherein the image side lens group 181 includes two lens groups 181a and 181b, wherein the image side lens group 181 is disposed between the object side reflective element 120b and the photosensitive element module 11, the optical multilayer deposition structure layer 131 is disposed between the image side lens group 181 and the reflective element 120a, and the object side lens group 182 is disposed on an object side of the object side reflective element 120b. The image side lens group 181 can optimize the light passing through the optical multilayer deposition structure layer 131, thereby improving the optical quality. Furthermore, the object side lens group 182 can control the light passing through the optical multilayer deposition structure layer 131, thereby improving its efficiency.

[0230] Specifically, the lens group 181 b of the image side lens group 181 and the object side lens group 182 are fixed, while the lens group 181 a of the image side lens group 181 is movable.

[0231] The imaging lens may include a plurality of lenses LE, wherein the lenses LE are sequentially arranged along the optical path L. Specifically, the material of the lenses LE may further be an infrared light absorbing material to further filter the infrared light.

[0232] Depend on Figure 1E and Figure 1FIt can be seen that the photosensitive element module 11 may further include a bracket 161 and an air compartment 162. The bracket 161 is covered on the photosensitive element 110, and the reflective element 120a is disposed on the bracket 161. The air compartment 162 is formed between the reflective element 120a and the photosensitive element 110, the bracket 161 surrounds the air compartment 162, and the nano-rough surface 140 and the air compartment 162 at least partially overlap in the optical path L. In this way, the photosensitive surface IMG can be prevented from being contaminated during the assembly process.

[0233] Specifically, the nano-rough surface 140 extends from the photosensitive surface IMG toward the bracket 161, and is disposed on at least a portion of the bracket 161, wherein the nano-rough surface 140 is further disposed on an inner wall 163 of the bracket 161. Thus, glare caused by light reflection through the bracket 161 can be avoided.

[0234] Depend on Figure 1D and Figure 1E It can be seen that the photosensitive element module 11 may further include an infrared light absorbing coating 132 and a filter element 170, wherein the filter element 170 includes a red light absorbing plate 171, and the optical multilayer deposition structure layer 131 and the infrared light absorbing coating 132 are arranged on the red light absorbing plate 171. The red light absorbing plate 171 can reduce the interference of red light on other photosensitive pixels to further improve the optical quality. Furthermore, the infrared light absorbing coating 132 can prevent the residual infrared light after passing through the optical multilayer deposition structure layer 131 from affecting the image quality. Specifically, the modular filter element 170 can improve the assembly process to ensure production feasibility.

[0235] Depend on Figure 1E and Figure 1F It can be seen that the reflective element 120a may include a prism (not shown), wherein the prism includes a light incident surface 121, at least one reflective surface 122 and a light emitting surface 123 along the light path L, and the light emitting surface 123 faces and is adjacent to the nano-rough surface 140 and the photosensitive surface IMG. Specifically, the prism can reduce the assembly tolerance to improve the yield. Furthermore, the air compartment 162 can be further sealed by the light emitting surface 123 to achieve good sealing.

[0236] Depend on Figure 1D It can be seen that the photosensitive element 110 may include a plurality of pixel units 111, and any of the pixel units 111 includes a microlens 112, wherein the nano-rough surface 140 is disposed on the microlens 112 of any of the pixel units 111. The optical quality of the edge is improved by improving the light collection efficiency of the pixel unit 111. Furthermore, an intermediate layer (not shown) may be further included between the nano-rough surface 140 and the microlens 112 to improve adhesion.

[0237] Specifically, the width W1 of the nanoprotrusion structure 141 is 193 nm, the height H1 of the nanoprotrusion structure 141 is 137 nm, the pixel size W2 of the pixel unit 111 is 800 nm, and the distance H2 between the nanoprotrusion structure 141 and the photosensitive element surface 110 a is 240 nm.

[0238] Please refer to Figure 1G , which is shown in accordance with Figure 1A A partial schematic diagram of the camera module 10 in the second embodiment of the first embodiment. Figure 1G It can be seen that the infrared light absorbing coating 132 is disposed on the red light absorbing plate 171 , and the optical multilayer deposition structure layer 131 is disposed on one of the lenses LE.

[0239] The lens group 181 b of the image side lens group 181 is relatively fixed to the reflective element 120 a, and the optical multilayer deposition structure layer 131 is disposed on the lens group 181 b of the image side lens group 181. Thus, the risk of the optical multilayer deposition structure layer 131 shifting can be reduced.

[0240] The photosensitive element module 11 may further include a primary optical multilayer deposition structure layer 133 , wherein the secondary optical multilayer deposition structure layer 133 is disposed on the reflective element 120 a . The incident light is filtered twice to ensure optical quality, wherein the secondary optical multilayer deposition structure layer 133 may be further disposed on the filter element 170 .

[0241] Please refer to Figures 1H to 1J ,in Figure 1H Draw according to Figure 1A A three-dimensional diagram of a prism in the third example of the first embodiment, Fig. 1I Draw according to Figure 1H A schematic diagram of a prism in a third example of the first embodiment, Figure 1J Draw according to Fig. 1I A cross-sectional view of the prism along the section line 1J-1J in the third example of the first embodiment. Figures 1H to 1J It can be seen that the light incident surface 121 is disposed at a light incident side IS of the prism, and the light emitting surface 123 is disposed at a light emitting side ES of the prism.

[0242] Depend on Figure 1J It can be seen that the prism may further include a plurality of concave structures, wherein the concave structures are arranged adjacent to each other and gradually shrink toward the direction close to the light path L, and two adjacent concave structures form a tip 124. In this way, glare caused by reflection of light through the wall of the prism is avoided.

[0243] In the third example of the first embodiment, the distances between two adjacent tips 124 are SP1 and SP2 respectively, wherein the distance SP1 between two adjacent tips 124 is 0.7 mm, and the distance SP2 between two adjacent tips 124 is 0.99 mm.

[0244] Please refer to Figure 1K to Figure 1M ,in Figure 1K Draw according to Figure 1A A three-dimensional diagram of a prism in a fourth example of the first embodiment, Figure 1L Draw according to Figure 1K A schematic diagram of a prism in a fourth example of the first embodiment, Figure 1M Draw according to Figure 1L A cross-sectional view of the prism along the section line 1M-1M in the fourth example of the first embodiment. Figure 1K to Figure 1M It can be known that the distance between two adjacent tips 124 is SP, wherein the distance SP between two adjacent tips 124 is 0.7 mm.

[0245] Please refer to Figure 1N to Figure 1P ,in Figure 1N Draw according to Figure 1A A three-dimensional diagram of a prism in a fifth example of the first embodiment, Fig.1O Draw according to Figure 1N A schematic diagram of a prism in a fifth embodiment of the first embodiment, Figure 1P Draw according to Fig.1O A cross-sectional view of the prism along the section line 1P-1P in the fifth example of the first embodiment. Figure 1N to Figure 1P It can be seen that the light incident surface 121 and the light emitting surface 123 each include an aspherical surface, and the aspherical surface is disposed corresponding to the light path L. Thus, the optical quality after passing through the optical multi-layer deposition structure layer 131 can be further improved.

[0246] The prism may be a plastic prism, and the prism may further include an injection mark 125 , wherein the prism is injection-molded through the injection mark 125 .

[0247] In the fifth example of the first embodiment, the distance between two adjacent tips 124 is SP, wherein the distance SP between two adjacent tips 124 is 1.4 mm.

[0248] Please refer to Figure 1Q and Figure 1R ,in Figure 1Q Draw according to Figure 1A A three-dimensional diagram of a prism in the sixth example of the first embodiment, Figure 1R Draw according to Figure 1Q A schematic diagram of a prism in the sixth example of the first embodiment. Figure 1Q and Figure 1R It can be known that the light incident surface 121 and the light emitting surface 123 respectively include an aspherical surface, and the aspherical surface is disposed corresponding to the light path L.

[0249] Please refer to Figure 1S and Figure 1T ,in Figure 1S Draw according to Figure 1A A three-dimensional diagram of a prism in the seventh embodiment of the first embodiment, Figure 1T Draw according to Figure 1S A schematic diagram of a prism in the seventh embodiment of the first embodiment. Figure 1S and Figure 1T It can be known that the light incident surface 121 and the light emitting surface 123 respectively include an aspherical surface, and the aspherical surface is disposed corresponding to the light path L.

[0250] The prism may be a glass element, and the prism may further include a injection mark 125 and an edge surface 126, wherein the prism is injection molded through the injection mark 125, the injection mark 125 extends from the edge surface 126 in a direction away from the light path L, and the injection mark 125 gradually widens in a direction close to the edge surface 126. In this way, glare generated by the cutout of the injection mark 125 can be avoided.

[0251] The injection mark 125 may include a rounded surface 127 , wherein the rounded surface 127 is connected to the edge surface 126 to improve moldability.

[0252] Specifically, a glass prism can be formed by glass injection molding, and the material of the prism can be red light absorbing glass, but is not limited thereto. In this way, the interference of red light on other photosensitive pixels can be reduced to further improve the optical quality. Furthermore, the prism can be a red light absorbing element, wherein the red light absorbing element can be blue glass.

[0253] Please refer to Figure 1U , which is shown in accordance with Figure 1A The reflectivity of the optical multilayer deposition structure layer 131 in the first embodiment is given by Figure 1U It can be seen that the reflectivity of the nano-rough surface 140 corresponds to the reflectivity of the optical multilayer deposition structure layer 131, and the wavelength at which the reflectivity of the optical multilayer deposition structure layer 131 is 50% is R50, and the parameters meet the conditions of Table 2 below. It must be noted that samples a to h can all be applied to the first embodiment of the first embodiment to the seventh embodiment of the first embodiment. Further, sample a achieves a filtering effect by stacking layers of high and low refractive indices to make the light with wavelengths below 400nm and above 700nm have a higher reflectivity.

[0254]

[0255]

[0256] Please refer to Figure 1V , which is shown in accordance with Figure 1A The transmittance of the filter element 170 in the first embodiment is Figure 1V It can be seen that both sample i and sample ii can be applied to the first embodiment of the first embodiment to the seventh embodiment of the first embodiment.

[0257] Please refer to Figure 1W , which is shown in accordance with Figure 1A The reflectivity of the nano-rough surface 140 in the first embodiment is given by Figure 1W It can be seen that samples 1 to 9 can all be applied to the first embodiment to the seventh embodiment of the first embodiment.

[0258] Please refer to Figure 1X , which is shown in accordance with Figure 1A The transmittance of the imaging lens in the first embodiment is given by Figure 1X It can be seen that the average wavelength transmittance of the imaging lens for light with a wavelength of 700nm to 800nm ​​is 0.31%, and the wavelength transmittance of the imaging lens with a maximum transmittance for light with a wavelength of 400nm to 800nm ​​is 86.42%.

[0259] Please refer to Figure 1Y , which is shown in accordance with Figure 1A The transmittance of the lens LE in the first embodiment is given by Figure 1Y It can be seen that the imaging lens may include an optical absorption lens, wherein at least one of the lenses LE may be an optical absorption lens. By cooperating with the optical multilayer deposition structure layer 131, the color deviation generated by the optical multilayer deposition structure layer 131 can be corrected, thereby further improving the light filtering effect. In detail, the optical multilayer deposition structure layer 131 can be further disposed on the optical absorption lens. Further, the wavelength of the absorption peak AP of the lens LE is 698nm.

[0260] It must be pointed out that Figure 1J , Figure 1M and Figure 1P The range within the middle dotted line is the range of the optical path L.

[0261] <Second embodiment>

[0262] Please refer to FIG. 2A to FIG. 2C ,in Figure 2A A three-dimensional diagram of a camera module 20 according to a second embodiment of the present disclosure is shown. Figure 2B Draw according to Figure 2A A partial cross-sectional view of the camera module 20 in the second embodiment, Figure 2C Draw according to Figure 2A A cross-sectional view of the camera module 20 in the first embodiment of the second embodiment. FIG. 2A to FIG. 2C It can be seen that the camera module 20 includes a photosensitive element module (not shown), an imaging lens 22 and a carrier 265, wherein the imaging lens 22 is arranged on an object side of the photosensitive element module along an optical path L, and the carrier 265 is used to load the imaging lens 22 and the photosensitive element module.

[0263] Please refer to Figure 2D and Figure 2E ,in Figure 2D Draw according to Figure 2C A partial enlarged view of the camera module 20 in the first embodiment of the second embodiment, Figure 2E Draw according to Figure 2C Another enlarged view of a portion of the camera module 20 in the first embodiment of the second embodiment. FIG. 2B to FIG. 2E It can be seen that the photosensitive element module has an optical path L, and includes a photosensitive element 210, a reflective element 220a, an optical multilayer deposition structure layer 231 and a nano-rough surface 240. The photosensitive element 210 corresponds to the optical path L. The reflective element 220a faces and is adjacent to the photosensitive element 210, and the reflective element 220a turns the optical path L. The optical multilayer deposition structure layer 231 is farther away from the photosensitive element 210 than the reflective element 220a along the optical path L, and the optical multilayer deposition structure layer 231 is arranged on an object side of the reflective element 220a. The nano-rough surface 240 is arranged on the side of the photosensitive element 210 facing the reflective element 220a, and the nano-rough surface 240 includes a plurality of nano-protrusion structures (not shown in the figure), and the shapes of the nano-protrusion structures are irregular and arranged adjacent to each other.

[0264] Depend on Figure 2B and Figure 2C It can be known that the camera module 20 may further include an object-side reflective element 220b, wherein the object-side reflective element 220b is disposed on an object side of the photosensitive element module. Specifically, the object-side reflective element 220b is disposed on the object side of the reflective element 220a.

[0265] Depend on FIG. 2A to FIG. 2C It can be known that the camera module 20 may further include a substrate 264 , a circuit E, a driver 291 and an image processing element 292 , wherein the circuit E is disposed on a surface of the substrate 264 , and the driver 291 and the image processing element 292 are disposed in the circuit E.

[0266] Depend on Figure 2E It can be seen that the photosensitive element module may further include a bracket 261 and an air compartment 262. The bracket 261 is covered on the photosensitive element 210, and the reflective element 220a is disposed on the bracket 261. The air compartment 262 is formed between the reflective element 220a and the photosensitive element 210, the bracket 261 surrounds the air compartment 262, and the nano-rough surface 240 and the air compartment 262 at least partially overlap in the optical path L.

[0267] Specifically, the nano-rough surface 240 extends from the photosensitive surface IMG toward the bracket 261 , and the nano-rough surface 240 is disposed on at least a portion of the bracket 261 , wherein the nano-rough surface 240 is further disposed on an inner sidewall 263 of the bracket 261 .

[0268] Depend on Figure 2C and Figure 2E It can be seen that the reflective element 220a may include a prism (not shown), wherein the prism includes a light incident surface 221, at least one reflective surface 222 and a light emitting surface 223 along the optical path L, the light emitting surface 223 faces and is adjacent to the nano-rough surface 240, and the light emitting surface 223 faces and is adjacent to the photosensitive surface IMG. Further, the optical multilayer deposition structure layer 231 is disposed on the light incident surface 221. Thereby, the optical multilayer deposition structure layer 231 and the light incident surface 221 can be prevented from having surface reflection. Furthermore, the optical multilayer deposition structure layer 231 can be directly disposed on the light incident surface 221, but is not limited thereto.

[0269] Depend on Figure 2D It can be seen that the object-side reflective element 220b may include an infrared light absorbing coating 232, a reflective layer 234 and a red light absorbing glass 272, wherein the light path L passes through the infrared light absorbing coating 232, the nano-rough surface 240 is disposed on one side of the red light absorbing glass 272, the infrared light absorbing coating 232 is disposed on the other side of the red light absorbing glass 272, and the reflective layer 234 is disposed on the infrared light absorbing coating 232. Furthermore, the thickness of the infrared light absorbing coating 232 may be between 900nm and 5um.

[0270] Please refer to Figure 2F and Figure 2G ,in Figure 2F Draw according to Figure 2A A partial schematic diagram of a camera module 20 in a second embodiment of the second implementation mode, Figure 2G Draw according to Figure 2F A partial enlarged view of the camera module 20 in the second embodiment of the second embodiment. Figure 2F and Figure 2G It can be seen that the optical multilayer deposition structure layer 231 is disposed on the light incident surface 221 of the reflective element 220a, the infrared light absorption coating 232 is disposed on the reflective surface 222 of the reflective element 220a, and the reflective element 220a is fixed to the bracket 261 by a glue G. Furthermore, the nano-rough surface 240 is disposed on the light emitting surface 223 of the reflective element 220a and the photosensitive element 210.

[0271] It must be noted that when the infrared light absorbing coating 232 is disposed on the reflective surface 222 , it is equivalent to passing the infrared light absorbing coating twice, thereby reducing the thickness of the coating.

[0272] Please refer to Figure 2H , which is shown in accordance with Figure 2A A partial schematic diagram of the camera module 20 in the third embodiment of the second implementation mode. Figure 2HIt can be seen that the photosensitive element module may further include a filter element 270, wherein the filter element 270 is arranged on the light incident surface 221 of the reflective element 220a, the filter element 270 includes a red light absorption plate 271, and the optical multi-layer deposition structure layer 231 is arranged on one side of the red light absorption plate 271, and the infrared light absorption coating 232 is arranged on the other side of the red light absorption plate 271.

[0273] Furthermore, the above structure can be achieved by bonding the filter element 270 to the prism, but the present invention is not limited thereto.

[0274] Please refer to Fig.2I and Figure 2J ,in Fig.2I Draw according to Figure 2A A partial schematic diagram of the camera module 20 in the fourth example of the second embodiment, Figure 2J Draw according to Fig.2I A partial enlarged view of the camera module 20 in the fourth example of the second embodiment. Fig.2I and Figure 2J It can be seen that the reflective element 220a may include a reflector 251, a frame 252, a flat element 254 and a nano-rough surface 240, wherein the reflector 251 turns the light path L, the frame 252 and the reflector 251 may be integrally formed by insert injection molding to reduce assembly tolerance and assembly process, the flat element 254 is disposed on the frame 252, and the nano-rough surface 240 is disposed on at least a portion of the reflector 251 and the frame 252.

[0275] Specifically, by reducing the weight of the reflective element 220a, the weight of the photosensitive element module is reduced, and the energy and time consumed in driving the reflective element 220a can be indirectly reduced. Furthermore, the nano-rough surface 240 can reduce the reflection of a substrate 255 of the reflector 251 to avoid ghosting, and can also reduce the glare caused by the reflection of the frame 252, wherein the reflective layer 234 is disposed on the substrate 255. Furthermore, the filter element 270, the reflector 251, the frame 252 and the flat element 254 are combined to form a reflector assembly 250.

[0276] Please refer to Figure 2K and Figure 2L ,in Figure 2K Draw according to Figure 2A A partial schematic diagram of the camera module 20 in the fifth embodiment of the second embodiment, Figure 2L Draw according to Figure 2K A partial enlarged view of the camera module 20 in the fifth embodiment of the second embodiment. Figure 2K and Figure 2LIt can be seen that the reflective element 220a may include a bracket portion 253, and the photosensitive element module may further include an air compartment 262, wherein the bracket portion 253 and the photosensitive element 210 are relatively fixed, the air compartment 262 is formed between the reflective element 220a and the photosensitive element 210, the bracket portion 253 surrounds the air compartment 262, and the nano-rough surface 240 and the air compartment 262 at least partially overlap in the optical path L.

[0277] By molding the reflective element 220a and the bracket portion 253 into one body, the assembly process and assembly tolerance are reduced, thereby improving the optical quality. The molding method can be achieved through injection molding, embedded injection molding and other processes, but is not limited thereto.

[0278] Please refer to Figure 2M , which is shown in accordance with Figure 2A A partial schematic diagram of the camera module 20 in the sixth embodiment of the second embodiment. Figure 2M It can be seen that the infrared light absorbing coating 232 and the optical multilayer deposition structure layer 231 are disposed on the light incident surface 221 of the reflective element 220a. Specifically, the infrared light absorbing coating 232 can cooperate with the optical multilayer deposition structure layer 231 to prevent infrared light from entering the photosensitive surface IMG, thereby improving the optical quality.

[0279] <Third embodiment>

[0280] Please refer to FIG. 3A to FIG. 3C ,in Figure 3A A three-dimensional diagram of a camera module 30 according to a third embodiment of the present disclosure is shown. Figure 3B Draw according to Figure 3A An exploded view of the camera module 30 in the third embodiment, Figure 3C Draw according to Figure 3A A cross-sectional view of a camera module 30 in the third embodiment. FIG. 3A to FIG. 3C It can be seen that the camera module 30 includes a photosensitive element module 31 , an imaging lens 32 and an imaging lens carrier 33 , wherein the imaging lens 32 is disposed on an object side of the photosensitive element module 31 along an optical path L, and the imaging lens carrier 33 is used to carry the imaging lens 32 .

[0281] Please refer to Figure 3D and Figure 3E ,in Figure 3D Draw according to Figure 3C A partial enlarged view of the camera module 30 in the third embodiment, Figure 3E Draw according to Figure 3A An exploded view of the photosensitive element module 31 in the third embodiment. FIG. 3C to FIG. 3EIt can be seen that the photosensitive element module 31 has an optical path L, and includes a photosensitive element 310, a reflective element 320, an optical multilayer deposition structure layer 331 and a nano-rough surface (not shown). The photosensitive element 310 corresponds to the optical path L. The reflective element 320 faces and is adjacent to the photosensitive element 310, and the reflective element 320 turns the optical path L. The optical multilayer deposition structure layer 331 is farther away from the photosensitive element 310 than the reflective element 320 along the optical path L, and the optical multilayer deposition structure layer 331 is arranged on an object side of the reflective element 320. The nano-rough surface is arranged on the side of the photosensitive element 310 facing the reflective element 320, and the nano-rough surface includes a plurality of nano-protrusion structures (not shown), and the shapes of the nano-protrusion structures are irregular and arranged adjacent to each other.

[0282] Depend on Figure 3C and Figure 3E It can be known that the camera module 30 may further include a circuit E, a maintaining element 366 and an image processing element 392 , wherein the image processing element 392 is disposed in the circuit E, and the reflective element 320 is disposed in the maintaining element 366 .

[0283] The photosensitive element module 31 may further include a bracket 361, an infrared light absorbing coating 332 and a filter element 370, wherein the bracket 361 is covered on the photosensitive element 310, the reflective element 320 is disposed on the bracket 361, the filter element 370 includes a red light absorbing plate 371, and the optical multilayer deposition structure layer 331 and the infrared light absorbing coating 332 are disposed on the red light absorbing plate 371.

[0284] Depend on Figure 3C It can be known that the imaging lens 32 may include an infrared light absorbing lens 384 , wherein the optical multi-layer deposition structure layer 331 is disposed on an image side surface of the infrared light absorbing lens 384 .

[0285] The reflective element 320 may include a prism (not shown), wherein the prism includes a light incident surface 321, five reflective surfaces 322a, 322b, 322c, 322d, 322e and a light emitting surface 323 along the optical path L, and the light emitting surface 323 faces and is adjacent to the photosensitive surface. Specifically, the light incident surface 321, the reflective surfaces 322b, 322d and the light emitting surface 323 are coplanar.

[0286] <Fourth embodiment>

[0287] Please refer to FIG. 4A to FIG. 4C ,in Figure 4A A three-dimensional diagram of a camera module 40 according to a fourth embodiment of the present disclosure is shown. Figure 4B Draw according to Figure 4A An exploded view of the camera module 40 in the fourth embodiment, Figure 4C Draw according to Figure 4A A cross-sectional view of a camera module 40 in the fourth embodiment. FIG. 4A to FIG. 4C It can be seen that the camera module 40 includes a photosensitive element module 41 and two imaging lenses 42a and 42b, and the imaging lenses 42a and 42b are arranged on an object side of the photosensitive element module 41 along an optical path L, wherein the imaging lens 42b is arranged between the imaging lens 42a and the photosensitive element module 41.

[0288] Please refer to Figure 4D , which is shown in accordance with Figure 4A An exploded view of the photosensitive element module 41 in the fourth embodiment. Figure 4C and Figure 4D It can be seen that the photosensitive element module 41 has an optical path L, and includes a photosensitive element 410, a reflective element 420a, an optical multilayer deposition structure layer 431 and a nano-rough surface (not shown). The photosensitive element 410 corresponds to the optical path L. The reflective element 420a faces and is adjacent to the photosensitive element 410, and the reflective element 420a turns the optical path L. The optical multilayer deposition structure layer 431 is farther away from the photosensitive element 410 than the reflective element 420a along the optical path L, and the optical multilayer deposition structure layer 431 is arranged on an object side of the reflective element 420a. The nano-rough surface is arranged on the side of the photosensitive element 410 facing the reflective element 420a, and the nano-rough surface includes a plurality of nano-protrusion structures (not shown), and the shapes of the nano-protrusion structures are irregular and arranged adjacent to each other.

[0289] Depend on Figure 4C It can be seen that the camera module 40 may further include an object-side reflective element 420b, wherein the object-side reflective element 420b is disposed on an object side of the photosensitive element module 41, and the optical multilayer deposition structure layer 431 is disposed on the object-side reflective element 420b. Further, the imaging lens 42a includes the object-side reflective element 420b, and the object-side reflective element 420b is disposed on the object side of the reflective element 420a.

[0290] Depend on Figure 4C and Figure 4D It can be seen that the reflective element 420a can include a prism (not shown), wherein the prism includes a light incident surface 421, at least one reflection surface 422 and a light emitting surface 423 along the light path L, the light emitting surface 423 faces and is adjacent to the nano-rough surface, and the light emitting surface 423 faces and is adjacent to the photosensitive surface IMG.

[0291] The photosensitive element module 41 may further include a primary optical multi-layer deposition structure layer 433 , wherein the secondary optical multi-layer deposition structure layer 433 is disposed on the reflective element 420 a .

[0292] Depend on Figure 4C and Figure 4DIt can be seen that the camera module 40 may further include a circuit E, an image stabilization driver 493 and a focus driver 494, wherein the photosensitive element 410 is disposed in the circuit E, the object side reflection element 420b is disposed in the image stabilization driver 493, and the imaging lens 42b is disposed in the focus driver 494.

[0293] The reflective element 420 a may include a bracket portion 453 , wherein the bracket portion 453 and the photosensitive element 410 are fixed relative to each other.

[0294] <Fifth embodiment>

[0295] Please refer to Figure 5A and Figure 5B ,in Figure 5A A schematic diagram of an electronic device 50 according to a fifth embodiment of the present disclosure is shown. Figure 5B Draw according to Figure 5A Another schematic diagram of the electronic device 50 in the fifth embodiment. Figure 5A and Figure 5B It can be seen that the electronic device 50 is a smart phone, wherein the electronic device 50 can also be a notebook computer, a tablet computer, a driving recorder, etc., but not limited thereto. The electronic device 50 includes a camera module, wherein the camera module can be the camera module of the first embodiment to the fourth embodiment described above, but the present disclosure is not limited thereto.

[0296] In the fifth embodiment, the camera modules are respectively a front camera module 521, a wide-angle camera module 522, a telephoto camera module 523, an ultra-wide-angle camera module 524, a macro camera module 525 and a TOF module (Time-Of-Flight) 526, wherein the TOF module 526 may also be other types of camera modules and is not limited to this configuration.

[0297] In detail, in the fifth embodiment, the front camera module 521 and the TOF module 526 are disposed on the front side of the electronic device 50 , while the wide-angle camera module 522 , the telephoto camera module 523 , the ultra-wide-angle camera module 524 and the macro camera module 525 are disposed on the back side of the electronic device 50 .

[0298] The image capture control interface 510 may be a touch screen, which is used to display images and has a touch function, and can be used to manually adjust the shooting angle. Specifically, the image capture control interface 510 includes an image playback button 511, a camera module switching button 512, a focus and photo button 513, an integrated menu button 514, and a zoom control button 515. Specifically, the user enters the shooting mode through the image capture control interface 510 of the electronic device 50. The camera module switching button 512 can freely switch to use one of the front camera module 521, wide-angle camera module 522, telephoto camera module 523, ultra-wide-angle camera module 524 and macro camera module 525 for shooting. The zoom control button 515 is used to adjust the zoom. The focus and photo button 513 is used to capture images after taking a good view and confirming one of the front camera module 521, wide-angle camera module 522, telephoto camera module 523, ultra-wide-angle camera module 524 and macro camera module 525. The image playback button 511 allows the user to view the photos after capturing the photos. The integrated menu button 514 is used to adjust the details of the image capture (such as timed photo capture, photo ratio, etc.).

[0299] The electronic device 50 may further include a reminder light 53 , which is disposed on the front of the electronic device 50 and can be used to remind the user of unread messages, missed calls and the status of the phone.

[0300] Furthermore, after the user enters the shooting mode through the image capture control interface 510 of the electronic device 50, the camera module collects imaging light on the photosensitive element and outputs electronic signals related to the image to the image signal processor (not shown in the figure) of the single-chip system 55, wherein the single-chip system 55 may also include a random access memory (RAM) (not shown in the figure), a central processing unit (not shown in the figure) and a storage unit (Storage Unit) (not shown in the figure), and may also include but not be limited to a display unit (Display), a control unit (Control Unit), a read-only memory (ROM) or a combination thereof.

[0301] Furthermore, the electronic device 50 may further include an image software processor and an image signal processor, and may further integrate the image software processor, the image signal processor, a position locator, a transmission signal processor, a gyroscope, a storage unit and a random access memory into a single chip system 55 .

[0302] In response to the camera specifications of the electronic device 50, the electronic device 50 may further include an optical image stabilization component (not shown in the figure). Furthermore, the electronic device 50 may further include at least one auxiliary focus element 56 and at least one sensing element (not shown in the figure). The auxiliary focus element 56 may include a light emitting element 561 for compensating color temperature, an infrared ranging element (not shown in the figure), a laser focus module (not shown in the figure), etc. The sensing element may have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, a Hall Effect Element, a position locator, and a transmission signal processor to sense the shaking and jitter imposed by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component configured in the camera module of the electronic device 50 to obtain good imaging quality, and helping the electronic device 50 according to the present disclosure to have multiple modes of shooting functions, such as optimized Selfie, low-light HDR (High Dynamic Range), high-resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly view the shooting screen of the camera through the image capture control interface 510 and manually operate the framing range on the image capture control interface 510 to achieve a what-you-see-is-what-you-get auto-focus function.

[0303] Further, the camera module, optical image stabilization component, sensor element, auxiliary focus element 56 and electronic element 542 can be arranged on an electronic component board 54, and electrically connected to image signal processor and other related components through connector 541 to execute the shooting process, wherein the electronic component board 54 can be a flexible printed circuit board (Flexible Printed Circuitboard, FPC). Current electronic devices such as smart phones have a trend of being thin and light. The camera module and related components are arranged on the circuit board, and the circuit is integrated to the main board of the electronic device by using the connector, which can meet the requirements of the mechanism design and circuit layout of the limited space inside the electronic device and obtain a greater margin, and also make the automatic focus function of its camera module more flexible through the touch screen of the electronic device. In the fifth embodiment, the sensor element and the auxiliary focus element 56 are arranged on the electronic component board 54 and at least one other flexible circuit board (not shown in the figure), and are electrically connected to the imaging signal processing element and other related components through the corresponding connector to execute the shooting process. In other embodiments (not shown in the figure), the sensor element and the auxiliary optical element can also be arranged on the main board of the electronic device or other forms of carrier according to the requirements of the mechanism design and circuit layout.

[0304] Furthermore, the wide-angle camera module 522 can capture images with high pixels within a certain range, and has the function of high resolution and low distortion. The imaging result of the telephoto camera module 523 can have a smaller viewing angle and depth of field than the wide-angle camera module 522, and can be used to capture moving targets, that is, the actuator (not shown) of the electronic device 50 can drive the telephoto camera module 523 to quickly and continuously auto focus on the target, so that the target object is not blurred due to being far away from the focus position. The imaging result of the ultra-wide-angle camera module 524 can have a larger viewing angle and depth of field than the wide-angle camera module 522, but it is often accompanied by greater distortion.

[0305] Specifically, by using camera modules with different focal lengths to frame and combining with image processing technology, the zoom function can be implemented in the electronic device 50 .

[0306] <Sixth embodiment>

[0307] Please refer to Figure 6 , which is a schematic diagram showing an electronic device installed in a drone 60 according to a sixth embodiment of the present disclosure. Figure 6 It can be known that the electronic device (not shown) includes a camera module, wherein the camera module can be the camera module of the first to fourth embodiments described above, but the present disclosure is not limited thereto.

[0308] In the sixth embodiment, the camera modules are respectively a front camera module 61 a , a side camera module 61 b ​​, and a bottom camera module 61 c .

[0309] Specifically, the front camera module 61a is disposed at the front end of the drone 60, the side camera module 61b is disposed at the side of the drone 60, and the bottom camera module 61c is disposed at the bottom of the drone 60. In this way, the electronic device can cope with complex ambient light.

[0310] <Seventh embodiment>

[0311] Please refer to Figure 7 , which is a schematic diagram showing an electronic device installed in a car 70 according to a seventh embodiment of the present disclosure. Figure 7 It can be known that the electronic device (not shown) includes a camera module, wherein the camera module can be the camera module of the first to fourth embodiments described above, but the present disclosure is not limited thereto.

[0312] In the seventh embodiment, the camera modules are respectively a front camera module 71 a , a side camera module 71 b , and a rear camera module 71 c .

[0313] The front camera module 71a, the side camera module 71b and the rear camera module 71c are respectively disposed at the front, side and rear of the car 70 to help the driver obtain external space information outside the car 70, such as external space information I1, I2, I3, I4, but not limited thereto. In this way, more viewing angles can be provided to reduce blind spots, thereby helping to improve driving safety.

[0314] <Eighth Embodiment>

[0315] Please refer to Figure 8 , which is a schematic diagram showing an electronic device disposed on a computer 80 according to an eighth embodiment of the present disclosure. Figure 8 It can be known that the electronic device (not shown) includes a camera module. Further, the camera module can be the camera module of the first embodiment to the fourth embodiment described above, but the present disclosure is not limited thereto.

[0316] In the eighth embodiment, the camera modules are respectively an infrared camera module 81 a and a video camera module 81 b , wherein the infrared camera module 81 a and the video camera module 81 b are both disposed on the front side of the computer 80 .

[0317] <Ninth embodiment>

[0318] Please refer to Fig. 9 , which illustrates a schematic diagram of an electronic device disposed on a wearable device 90 according to a ninth embodiment of the present disclosure. Fig. 9 It can be known that the electronic device (not shown) includes a camera module. Further, the camera module can be the camera module of the first to fourth embodiments described above, but the present disclosure is not limited thereto.

[0319] In the ninth embodiment, the camera module is a video camera module 91 , wherein the video camera module 91 is disposed on the front side of the wearable device 90 .

[0320] Although the present invention has been disclosed as above by means of implementation modes and examples, they are not intended to limit the present invention. Any person with ordinary knowledge in the technical field may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

Claims

1. A photosensitive element module, characterized in that: Having an optical path, and comprising: a photosensitive element corresponding to the light path; a reflective element, facing and adjacent to the photosensitive element, and the reflective element deflects the light path; an optical multilayer deposition structure layer, which is farther away from the photosensitive element than the reflective element along the optical path, and the reflectivity of the optical multilayer deposition structure layer to light with a wavelength of 450nm to 600nm is less than or equal to 10%; as well as a nano-rough surface, disposed on a side of the photosensitive element facing the reflective element, the nano-rough surface comprising a plurality of nano-protrusion structures, the plurality of nano-protrusion structures having irregular shapes and arranged adjacent to each other, the plurality of nano-protrusion structures having a width of less than or equal to 300 nm, and a height of less than or equal to 350 nm; The reflectivity of the nano-rough surface corresponds to the reflectivity of the optical multilayer deposition structure layer, the wavelength at which the reflectivity of the optical multilayer deposition structure layer is 50% is R50, and the maximum reflectivity of the nano-rough surface from 450nm to the wavelength R50 is less than or equal to 0.49%, which meets the following conditions: 600nm≤R50≤720nm.

2. The photosensitive element module according to claim 1, wherein: The reflective element comprises: a prism including a light incident surface, at least one reflection surface and a light exiting surface along the light path; The light emitting surface faces and is adjacent to the nano-rough surface.

3. The photosensitive element module according to claim 2, wherein: The optical multi-layer deposition structure layer is arranged on the light incident surface.

4. The photosensitive element module according to claim 2, wherein: The prism is a red light absorbing element.

5. The photosensitive element module according to claim 2, wherein: At least one of the light incident surface, the at least one reflecting surface and the light emitting surface of the prism comprises an aspherical surface, and the aspherical surface is arranged corresponding to the light path.

6. The photosensitive element module according to claim 2, wherein: The prism also contains: A plurality of concave structures are arranged adjacent to each other and gradually contract toward the direction close to the optical path, and two adjacent concave structures among the plurality of concave structures form a pointed end; Wherein, the distance between two adjacent ones of the plurality of tips is between 0.3 mm and 2.9 mm.

7. The photosensitive element module according to claim 2, wherein: The prism is a glass element; The prism further comprises an injection mark, and the prism is injection-molded through the injection mark.

8. The photosensitive element module according to claim 7, wherein: The prism also contains: an edge surface, the injection mark extending from the edge surface in a direction away from the optical path; The injection mark gradually widens toward the edge surface.

9. The photosensitive element module according to claim 1, wherein: The reflective element comprises: A reflector deflects the light path.

10. The photosensitive element module according to claim 9, characterized in that: The reflective element also includes: A frame is integrally formed with the reflector by insert injection molding.

11. The photosensitive element module according to claim 10, wherein: The reflective element also includes: A nano-rough surface is disposed on at least a portion of the reflector and the frame.

12. The photosensitive element module according to claim 1, wherein: Also includes: a bracket, covering the photosensitive element, wherein the reflective element is disposed on the bracket; and An air compartment is formed between the reflective element and the photosensitive element. The bracket surrounds the air compartment, and the nano-rough surface and the air compartment at least partially overlap in the light path.

13. The photosensitive element module according to claim 12, wherein: The nano-rough surface extends from a photosensitive surface toward the support, and the nano-rough surface is disposed on at least a portion of the support.

14. The photosensitive element module according to claim 1, wherein: The reflective element includes a bracket portion fixed relative to the photosensitive element; The photosensitive element module further includes an air compartment formed between the reflective element and the photosensitive element. The bracket portion surrounds the air compartment, and the nano-rough surface and the air compartment at least partially overlap in the optical path.

15. The photosensitive element module according to claim 1, wherein: Also includes: an infrared light absorbing coating disposed on the reflective element; The thickness of the infrared light absorbing coating is between 900nm and 5um.

16. The photosensitive element module according to claim 1, wherein: Also includes: A filter element comprises a red light absorption plate, wherein the optical multi-layer deposition structure layer is arranged on the red light absorption plate.

17. The photosensitive element module according to claim 1, wherein: The photosensitive element comprises: A plurality of pixel units, wherein the pixel size of the plurality of pixel units is between 400 nm and 2000 nm, and any one of the plurality of pixel units comprises a microlens; Wherein, the nano-rough surface is disposed on the microlens of any one of the plurality of pixel units.

18. A camera module, characterized in that: Include: The photosensitive element module as claimed in claim 1; and An imaging lens is arranged along the optical path at an object side of the photosensitive element module.

19. The camera module according to claim 18, wherein: Also includes: An object side reflective element is arranged on the object side of the photosensitive element module, and the optical multilayer deposition structure layer is arranged on the object side reflective element.

20. The camera module according to claim 19, wherein: The imaging lens includes: An object side lens group is arranged on an object side of the object side reflective element.

21. The camera module according to claim 19, wherein: The imaging lens includes: An image side lens group is arranged between the object side reflective element and the photosensitive element module, wherein the optical multilayer deposition structure layer is arranged between the image side lens group and the reflective element.

22. The camera module of claim 18, wherein: Also includes: an object-side reflective element, disposed on an object side of the reflective element; The object-side reflective element includes an infrared light absorbing coating, the light path passes through the infrared light absorbing coating, and the thickness of the infrared light absorbing coating is between 900nm and 5um.

23. The camera module of claim 18, wherein: The imaging lens includes: A plurality of lenses are arranged in sequence along the optical path, and the optical multilayer deposition structure layer is disposed on one of the plurality of lenses.

24. The camera module according to claim 23, wherein: The imaging lens also includes: a lens group fixed relative to the reflective element; Wherein, the optical multi-layer deposition structure layer is arranged on the lens group.

25. The camera module of claim 23, wherein: The imaging lens also includes: An optical absorption lens has an absorption peak between 600nm and 800nm.

26. The camera module of claim 23, wherein: The photosensitive element module also includes: A primary optical multilayer deposition structure layer is disposed on the reflective element, the reflectivity of the secondary optical multilayer deposition structure layer to light with a wavelength of 450nm to 550nm is less than or equal to 10%, and the wavelength at which the reflectivity of the secondary optical multilayer deposition structure layer is 50% is R50', which satisfies the following conditions: 600nm≤R50'≤720nm.

27. The camera module of claim 23, wherein: The imaging lens has an average wavelength transmittance of 700nm to 800nm ​​light rays less than or equal to 5%, and a transmittance of a wavelength with a maximum transmittance of 400nm to 800nm ​​light rays greater than or equal to 82%.

28. The camera module of claim 18, wherein: The plurality of nanoprotrusion structures have a width of less than or equal to 250 nm and a height of less than or equal to 250 nm; Wherein, the number of layers of the optical multilayer deposition structure is greater than 30; The imaging lens comprises an optical absorption lens, and an absorption peak of the optical absorption lens is between 650nm and 750nm; The imaging lens has an average wavelength transmittance of 700nm to 800nm ​​light less than or equal to 1%, and a wavelength transmittance of 400nm to 800nm ​​light with a maximum transmittance greater than or equal to 85%; The wavelength at which the reflectivity of the optical multilayer deposition structure layer is 50% is R50, and the maximum reflectivity of the nano-rough surface from 450nm to the wavelength R50 is less than or equal to 0.2%, which meets the following conditions: 650nm≤R50≤700nm.

29. An electronic device, characterized in that: Include: The camera module of claim 18.

Images