Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel and a manufacturing method thereof and a display device, the display panel comprises a first area, a second area, a third area, a plurality of sub-pixels, a substrate and at least one partition structure located on the substrate, the partition structure is located in the third area, the partition structure comprises a first isolation structure and a second isolation structure, and the first isolation structure and the second isolation structure are arranged in a stacked mode. The second isolation structure is located on the side, away from the substrate, of the first isolation structure, the edge of the second isolation structure protrudes relative to the edge of the first isolation structure, the partition structure is configured to partition at least one layer of the light-emitting functional layers, and the display panel further comprises an insulating layer located on the substrate. At least part of the insulating layer is located on the side wall of at least one partition structure, the part, used for playing a partition role, in the partition structure is not covered or filled with other film layers, the second partition structure in the partition structure can have an obvious protruding part, and therefore the risk of crosstalk can be reduced.

Description

Display panel, manufacturing method thereof, and display device Technical Field

[0001] Embodiments of the present disclosure relate to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Organic light-emitting diode (OLED) display products offer advantages such as rich colors, fast response times, and foldability. With the advancement of display technology, users have increasingly demanded higher lifespans and power consumption of display devices. A tandem organic light-emitting display device, by adding at least one light-emitting layer and a charge-generating layer to the organic light-emitting device, improves the lifespan and brightness of the light-emitting device and reduces power consumption, thus meeting user demands for display device lifespan and power consumption.

[0003] Summary of the Invention

[0004] At least one embodiment of the present disclosure provides a display panel, a manufacturing method thereof, and a display device.

[0005] At least one embodiment of the present disclosure provides a display panel, comprising: a first region, a second region, a third region, a plurality of sub-pixels, a base substrate, and at least one partition structure located on the base substrate, wherein the first region is configured for display; the second region is configured to transmit light, and the first region is located on at least one side of the second region; the third region is located between the first region and the second region; a plurality of sub-pixels are located in the first region, and each of at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes multiple film layers; the partition structure is located in the third region, and the partition structure includes a first isolation structure and a second isolation structure that are stacked, and the second isolation structure is located on a side of the first isolation structure away from the base substrate, and an edge of the second isolation structure protrudes relative to an edge of the first isolation structure, and the partition structure is configured to isolate at least one layer of the light-emitting functional layer, wherein the display panel also includes an insulating layer located on the base substrate, and in the third region, at least a portion of the insulating layer is located on a sidewall of at least one of the partition structures.

[0006] For example, in a display panel provided according to at least one embodiment of the present disclosure, the second isolation structure includes a protrusion, which protrudes relative to the edge of the first isolation structure, and the at least portion of the insulating layer located on the side wall of the partition structure and the protrusion of the partition structure are spaced from each other in a direction perpendicular to the base substrate.

[0007] For example, in a display panel provided according to at least one embodiment of the present disclosure, at least a portion of the insulating layer is located on the side wall of the first isolation structure; and / or the partition structure further includes a third isolation structure, which is located on a side of the first isolation structure close to the base substrate, and at least a portion of the insulating layer is located on the side wall of the third isolation structure.

[0008] For example, in a display panel provided according to at least one embodiment of the present disclosure, the partition structure further includes a third isolation structure, which is located on a side of the first isolation structure close to the base substrate, wherein the first isolation structure, the second isolation structure and the third isolation structure all include metal materials, the material of the first isolation structure is different from the material of the second isolation structure, and the material of the second isolation structure is the same as the material of the third isolation structure; or the material of the first isolation structure, the material of the second isolation structure and the material of the third isolation structure are different.

[0009] For example, according to a display panel provided in accordance with at least one embodiment of the present disclosure, the display panel further includes at least one layer of metal structure located between the partition structure and the base substrate BS, and within the third region, the orthographic projection of the partition structure on the base substrate falls within the orthographic projection of the at least one layer of metal structure on the base substrate.

[0010] For example, in the display panel provided according to at least one embodiment of the present disclosure, the at least one layer of metal structure includes a first metal structure and a second metal structure stacked together, and within the third region, the first metal structure, the second metal structure and the partition structure are stacked in sequence along a direction perpendicular to the base substrate, and the partition structure is located on the side of the second metal structure away from the base substrate.

[0011] For example, in the display panel provided according to at least one embodiment of the present disclosure, the orthographic projection of the partition structure on the base substrate falls within the orthographic projection of the second metal structure on the base substrate.

[0012] For example, a display panel provided according to at least one embodiment of the present disclosure further includes a pixel defining pattern and a defining structure, the pixel defining pattern being located in the first region and on the base substrate, the pixel defining pattern including a plurality of first openings to define the light-emitting area of ​​at least some of the sub-pixels; the defining structure being located in the first region and between the light-emitting functional layer and the base substrate, the defining structure including a portion surrounding the light-emitting area of ​​each sub-pixel in the at least some of the sub-pixels, wherein the pixel defining pattern further includes a second opening, the portion of at least one layer of the light-emitting functional layer located in the first opening is a continuous portion, and at least the portion located in at least one second opening is isolated, and the portion of the defining structure exposed by the second opening is configured to isolate the at least one layer of the light-emitting functional layer.

[0013] For example, in a display panel provided according to at least one embodiment of the present disclosure, the defining structure includes a first sub-defining structure and a second sub-defining structure that are stacked, the first sub-defining structure is located on a side of the second sub-defining structure close to the base substrate, the edge of the second sub-defining structure protrudes relative to the edge of the first sub-defining structure, and the portion of the insulating layer located in the first area includes at least one of the first sub-defining structure and the second sub-defining structure.

[0014] For example, according to the display panel provided by at least one embodiment of the present disclosure, the portion of the insulating layer located in the first area includes the first sub-defining structure, and at least part of the insulating layer covers the outer wall of the first metal structure and the outer wall of the second metal structure.

[0015] For example, in a display panel provided according to at least one embodiment of the present disclosure, the average thickness of the portion of the insulating layer covering the outer wall of the first metal structure and the outer wall of the second metal structure is a first thickness, and the average thickness of the first sub-defining structure in the insulating layer located in the first area is a second thickness, and the first thickness is less than the second thickness.

[0016] For example, in the display panel provided according to at least one embodiment of the present disclosure, the first thickness is 1 / 100 to 1 / 10 of the second thickness.

[0017] For example, according to at least one embodiment of the present disclosure, a display panel is provided, which includes a plurality of partition structures arranged at intervals, wherein the partition structures are annular and surround the second area, and within the third area, at least a portion of the base substrate located between adjacent partition structures does not overlap with the insulating layer.

[0018] For example, in a display panel provided according to at least one embodiment of the present disclosure, each of the at least some sub-pixels further includes: a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the base substrate, the first electrode being located between the light-emitting functional layer and the base substrate, the pixel defining pattern being located on a side of the first electrode away from the base substrate, and the second sub-defining structure being located between the first electrode and the base substrate; the display panel further includes a pixel circuit, the pixel circuit being located on a side of the first sub-defining structure close to the base substrate, and the pixel circuit being electrically connected to the first electrode.

[0019] For example, in a display panel provided according to at least one embodiment of the present disclosure, the film layer where the first sub-defining structure is located includes a connecting via, the pixel circuit is electrically connected to the first electrode through the connecting via, and at least a portion of the second sub-defining structure extends into the connecting via and covers the side wall of the connecting via.

[0020] For example, in a display panel provided according to at least one embodiment of the present disclosure, the material of the first sub-defining structure is different from the material of the second sub-defining structure, the material of the first sub-defining structure includes an organic material or an inorganic non-metallic material, and the material of the second sub-defining structure includes an inorganic non-metallic material or a metal material.

[0021] For example, according to the display panel provided by at least one embodiment of the present disclosure, for the same etching solution, the etching selectivity of the first isolation structure, the etching selectivity of the first sub-definition structure, and the etching selectivity of the second sub-definition structure decrease successively.

[0022] At least one embodiment of the present disclosure further provides a display device, comprising the display panel described in any of the above embodiments.

[0023] At least one embodiment of the present disclosure further provides a method for manufacturing a display panel, wherein the display panel includes a first area, a second area, and a third area located between the first area and the second area, the first area is configured to display, the second area is configured to transmit light, and the first area is located on at least one side of the second area; the manufacturing method includes: patterning an initial partition structure located on a base substrate in the third area, wherein the initial partition structure includes a first sub-isolation structure and a second isolation structure arranged in a stacked manner, the first sub-isolation structure is closer to the base substrate than the second isolation structure, and in a direction perpendicular to the base substrate, the edges of the first sub-isolation structure and the second isolation structure are roughly flush; forming a first defining layer on a side of the initial partition structure away from the base substrate, and patterning the first defining layer to form a first sub-defining portion, in the In the third region, the first sub-defining portion covers the side surface of the initial partition structure and its upper surface away from the base substrate; a second defining layer is formed on the side of the first sub-defining portion away from the base substrate, and the second defining layer and the first sub-defining portion are patterned to expose at least part of the initial partition structure; and the initial partition structure is patterned to form a partition structure, wherein the partition structure includes a first isolation structure and a second isolation structure arranged in a stacked manner, the second isolation structure is located on the side of the first isolation structure away from the base substrate, the edge of the second isolation structure protrudes relative to the edge of the first isolation structure, and the partition structure is configured to isolate at least one layer of the light-emitting functional layer of the sub-pixel, and in the third region, the sidewall of at least one of the partition structures is covered with at least part of the second defining layer and at least part of the first sub-defining portion.

[0024] For example, according to the manufacturing method of the display panel provided by at least one embodiment of the present disclosure, patterning the first defining layer to form a first sub-defining portion includes: in the third area, removing the portion of the first defining layer located between adjacent initial partition structures; and thinning the portion of the first defining layer covering the side surface and the upper surface of the initial partition structure.

[0025] For example, according to the manufacturing method of the display panel provided by at least one embodiment of the present disclosure, in the third area, the first defining layer is patterned using a half-tone mask to remove the portion of the first defining layer located between the adjacent initial partition structures, while thinning the portion of the first defining layer covering the side surface of the initial partition structure and the upper surface thereof. The thickness of the first defining layer after thinning is 100-10000 angstroms.

[0026] For example, according to the manufacturing method of the display panel provided by at least one embodiment of the present disclosure, the second defining layer formed and the first sub-defining portion formed both include a portion located in the first area, and patterning the second defining layer and the first sub-defining portion to expose the initial partition structure includes: patterning the second defining layer and the first sub-defining portion at the same time to form a defining structure in the first area, while removing the second defining layer in the third area, and removing at least a portion of the first sub-defining portion covering the side surface of the initial partition structure and the upper surface thereof, wherein the defining structure includes a first sub-defining structure and a second sub-defining structure arranged in a stacked manner, the first sub-defining structure is located on the side of the second sub-defining structure close to the base substrate, and the edge of the second sub-defining structure protrudes relative to the edge of the first sub-defining structure.

[0027] For example, according to the manufacturing method of the display panel provided by at least one embodiment of the present disclosure, within the third area, the portion of the first sub-defining portion covering the upper surface of the initial partition structure is removed, and the portion of the first sub-defining portion covering the side surface of the first sub-isolation structure in the initial partition structure is basically removed.

[0028] For example, according to the manufacturing method of the display panel provided by at least one embodiment of the present disclosure, before forming the initial partition structure on the base substrate, the manufacturing method also includes: in the third area, patterning at least one layer of metal structure, wherein the metal structure and the initial partition structure are stacked, the metal structure is closer to the base substrate than the initial partition structure, and the orthographic projection of the initial partition structure on the base substrate falls into the orthographic projection of the metal structure on the base substrate.

[0029] For example, according to the manufacturing method of the display panel provided by at least one embodiment of the present disclosure, patterning the first defining layer to form a first sub-defining portion also includes: in the third area, thinning the portion of the first defining layer covering the surface of the metal structure; patterning the second defining layer and the first sub-defining portion to expose the initial partition structure also includes: patterning the second defining layer and the first sub-defining portion at the same time so that in the third area, the portion of the first defining layer covering the surface of the metal structure is retained. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0031] FIG1 is a plan view of a display panel provided by at least one embodiment of the present disclosure.

[0032] FIG. 2 is a partial cross-sectional schematic diagram taken along line W1 - W1 ′ shown in FIG. 1 .

[0033] FIG. 3 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in an example.

[0034] FIG. 4 is a partial cross-sectional schematic diagram taken along line W2 - W2 ′ shown in FIG. 3 .

[0035] FIG. 5 is an enlarged view of a local structure of the connecting via N1 in FIG. 2 .

[0036] FIG. 6 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0037] FIG. 7 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0038] FIG8 is a structural diagram of the first area of ​​the display panel shown in FIG1 in another example.

[0039] FIG. 9 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0040] FIG. 10 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0041] FIG. 11 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0042] FIG. 12 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0043] FIG. 13 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0044] 14 to 20 are flow charts of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0045] FIG21 shows a schematic diagram of a partial planar structure of a display panel provided by an embodiment of the present disclosure.

[0046] FIG22 is a schematic diagram of a partially enlarged structure of the area in FIG21 . DETAILED DESCRIPTION

[0047] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0048] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are simply used to distinguish different components. The words "include" or "comprising" and similar terms mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0049] The features such as “parallel”, “perpendicular” and “same” used in the embodiments of the present disclosure include the features such as “parallel”, “perpendicular” and “same” in the strict sense, as well as the cases where “approximately parallel”, “approximately perpendicular” and “approximately the same” contain certain errors, taking into account the errors associated with the measurement and the measurement of specific quantities (for example, the limitations of the measurement system), and are expressed as being within the acceptable deviation range for a specific value determined by a person of ordinary skill in the art. For example, “approximately” can mean within one or more standard deviations, or within 10% or 5% of the value. When the number of a component is not specifically indicated below in the embodiments of the present disclosure, it means that the component can be one or more, or can be understood as at least one. “At least one” refers to one or more, and “a plurality” refers to at least two.

[0050] Typically, a display panel with a “pinhole screen” generally includes a display area for normal display and a hollow area for setting a sensor (for example, a camera). The display area for normal display generally includes a light-emitting element and a pixel circuit, the pixel circuit is connected to the light-emitting element, and the pixel circuit is used to drive the light-emitting element to emit light. The sensor is generally set in the hollow area, and the hollow area is an area where the material is removed relative to the normal display area, so that the sensor can receive external ambient light. Therefore, the display panel with a “pinhole screen” is different from the display panel with a “full screen”. The hollow area of ​​the display panel with a “pinhole screen” has good light transmittance.

[0051] Tandem (Tandem) devices have the characteristics of low power consumption and long life. For tandem devices, the light-emitting functional layer in the light-emitting element can include a stacked multilayer film layer. However, because a charge generation layer (CGL) is provided between at least two of the multilayer film layers in the tandem device, and the charge generation layer (CGL) has a high conductivity, when the charge generation layer (CGL) is a full-surface film layer, the charge generation layers (CGL) of two adjacent light-emitting elements are continuous film layers. Therefore, lateral charge migration is prone to occur, causing the display panel to shift in low grayscale monochrome chromaticity, which can easily cause crosstalk between adjacent sub-pixels and cause color shift on the display panel.

[0052] During the research, the inventors of the present application found that in order to reduce the risk of crosstalk between sub-pixels of different colors, it is necessary to isolate at least one film layer in the light-emitting functional layer between sub-pixels of different colors, and in order to ensure the isolation effect of the light-emitting functional layer and other film layers, it is necessary to further set a partition structure in the edge area of ​​the display area, thereby further isolating the light-emitting functional layer and other film layers in the edge area of ​​the display area to reduce the crosstalk phenomenon. In some display panels, the manufacturing process of the partition structure in the edge area close to the display area is relatively cumbersome, and the process accuracy is difficult to control. For example, in the process of manufacturing the partition structure, some materials of other film layers may remain near the "undercut" structure ("undercut" structure) of the partition structure, so that the "partition feature" of the partition structure is weakened, resulting in poor partition effect of the partition structure.

[0053] At least one embodiment of the present disclosure provides a display panel, a manufacturing method thereof, and a display device.

[0054] At least one embodiment of the present disclosure provides a display panel including a first area, a second area, a third area, a plurality of sub-pixels, a base substrate, and at least one partition structure located on the base substrate, wherein the first area is configured for display; the second area is configured to transmit light, and the first area is located on at least one side of the second area; the third area is located between the first area and the second area; a plurality of sub-pixels are located in the first area, and each of at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes multiple film layers; the partition structure is located in the third area, and the partition structure includes a first isolation structure and a second isolation structure that are stacked, and the second isolation structure is located on a side of the first isolation structure away from the base substrate, and an edge of the second isolation structure protrudes relative to an edge of the first isolation structure, and the partition structure is configured to isolate at least one layer of the light-emitting functional layer. The display panel also includes an insulating layer located on the base substrate, and in the third area, at least a portion of the insulating layer is located on the side wall of at least one partition structure.

[0055] The partition structure in the display panel provided by at least one embodiment of the present disclosure has a simple structure and its manufacturing process is easy to control. The part of the partition structure used to play a "partitioning role" is not covered or filled by other film layers, and only a part of the insulating layer that is not completely removed remains on its side wall, so that the edge of the second isolation structure in the partition structure protrudes relative to the edge of the first isolation structure, so that the second isolation structure in the partition structure has an obvious protrusion, which is beneficial to reduce the risk of crosstalk.

[0056] The display panel, its manufacturing method, and the display device provided by the embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0057] FIG1 is a plan view of a display panel provided by at least one embodiment of the present disclosure; FIG2 is a partial cross-sectional schematic view taken along line W1 - W1 ′ shown in FIG1 .

[0058] As shown in Figure 1, the display panel 01 includes a first area A1, a second area A2, and a third area A3. The first area A1 is a display area and is configured to display. The second area A2 is a hollow area and is configured to transmit light. For example, devices such as photosensors can be provided in the second area A2. For example, the first area A1 can be located on at least one side of the second area A2. For example, in some embodiments, the first area A1 surrounds the second area A2, that is, the second area A2 can be surrounded by the first area A1. For example, the second area A2 can also be provided at other locations, depending on the needs. For example, the second area A2 can be located in the middle of the top of the base substrate BS.

[0059] For example, the light-sensitive sensor may include an infrared sensor, an ultrasonic sensor, a LIDAR (Light Detection and Ranging) sensor, a radar sensor, a camera, or a distance sensor, but is not limited thereto. The display panel 01 shown in FIG1 is described by taking the second area A2 as a circular area, and the second area A2 is located in the upper middle portion of the display panel 01 as an example, but is not limited thereto.

[0060] As shown in FIG1 , the display panel 01 includes a base substrate BS and a plurality of sub-pixels 10 located on the base substrate BS. The plurality of sub-pixels 10 are located in a first area A1, so that the first area A1 serves as a display area. As shown in FIG1 and FIG2 , each sub-pixel 10 in at least some of the sub-pixels 10 includes a light-emitting functional layer 130, and the light-emitting functional layer 130 includes a plurality of film layers. For example, each sub-pixel 10 in at least some of the sub-pixels 10 includes a light-emitting element 100, and the light-emitting element 100 includes a light-emitting functional layer 130 and a first electrode 110 and a second electrode 120 located on both sides of the light-emitting functional layer 130 in a direction perpendicular to the base substrate BS, and the first electrode 110 is located between the light-emitting functional layer 130 and the base substrate BS. For example, each sub-pixel 10 located in the first area A1 includes a light-emitting element 100, and for example, the light-emitting element 100 can be an organic light-emitting element.

[0061] For example, as shown in FIG2 , the light-emitting functional layer 130 in the light-emitting element 100 may include a first light-emitting layer (EML) 131, a charge generation layer (CGL) 133, and a second light-emitting layer (EML) 132, which are stacked, and the charge generation layer 133 is located between the first light-emitting layer 131 and the second light-emitting layer 132. The charge generation layer 133 has strong conductivity, which can make the light-emitting functional layer 130 have the advantages of long life, low power consumption, and high brightness. For example, compared with a light-emitting functional layer 130 without a charge generation layer 133, providing the charge generation layer 133 in the light-emitting functional layer 130 can increase the luminous brightness of the light-emitting element 100 by nearly double. For example, the light-emitting element 100 of the sub-pixel 10 can be a tandem light-emitting element, such as a Tandem OLED. For example, the first light-emitting layer 131 and the second light-emitting layer 132 can be a structure obtained after patterning, and the charge generation layer 133 can be a structure provided as a whole layer.

[0062] For example, as shown in FIG2 , the charge generation layer 133 may include an N-type charge generation layer and a P-type charge generation layer. For example, in each sub-pixel 10, the light-emitting functional layer 130 may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). For example, the hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), the electron injection layer (EIL), and the charge generation layer 133 are all shared film layers of multiple sub-pixels 10 and may be referred to as common layers.

[0063] For example, as shown in FIG2 , the second light-emitting layer 132 can be located between the first light-emitting layer 131 and the second electrode 120, and the hole injection layer can be located between the first electrode 110 and the first light-emitting layer 131. For example, an electron transport layer can be disposed between the charge generation layer 133 and the first light-emitting layer 131. For example, a hole transport layer can be disposed between the second light-emitting layer 132 and the charge generation layer 133. For example, an electron transport layer and an electron injection layer can be disposed between the second light-emitting layer 132 and the second electrode 120.

[0064] For example, the material of the electron transport layer may include aromatic heterocyclic compounds, such as imidazole derivatives such as benzimidazole derivatives, imidazopyridine derivatives, and benzimidazolephenanthridine derivatives; oxazine derivatives such as pyrimidine derivatives and triazine derivatives; quinoline derivatives, isoquinoline derivatives, phenanthroline derivatives, and other compounds containing nitrogen-containing six-membered ring structures (including compounds having phosphine oxide-based substituents on the heterocyclic ring). For example, the material of the charge generation layer 133 may be a material containing a phosphorus oxide group or a material containing a triazine. For example, the ratio of the electron mobility of the material of the charge generation layer 133 to the electron mobility of the electron transport layer is 10 -2 ~10 2 .

[0065] For example, as shown in FIG2 , the first electrode 110 may be an anode, and the second electrode 120 may be a cathode. For example, the cathode may be formed of a material with high conductivity and low work function, such as a metal material. For example, the anode may be formed of a transparent conductive material with a high work function.

[0066] For example, as shown in FIG2 , the orthographic projection of the second electrode 120 in at least some of the sub-pixels 10 on the base substrate BS is a full-surface structure. For example, the second electrode 120 may be a common electrode shared by multiple sub-pixels 10. For example, the second electrode 120 may be a common electrode shared by at least some of the sub-pixels 10.

[0067] For example, as shown in Figure 2, an insulating layer 50 is provided between the first electrode 110 and the base substrate BS. Figure 2 omits some structures between the insulating layer 50 and the base substrate BS, such as the film layer where the data lines and other signal lines are located and other insulating layers.

[0068] As shown in Figures 1 and 2, the display panel 01 also includes at least one partition structure 200 located on the base substrate BS. The partition structure 200 is located in the third area A3 and includes a first isolation structure 210 and a second isolation structure 220 arranged in a stacked manner. The second isolation structure 220 is located on a side of the first isolation structure 210 away from the base substrate BS, and the edge of the second isolation structure 220 protrudes relative to the edge of the first isolation structure 210. The partition structure 200 is configured to isolate at least one film layer of the light-emitting functional layer 130.

[0069] For example, as shown in Figures 1 and 2, at least one film layer in the light-emitting functional layer 130 can be disconnected at the edge of the partition structure 200. For example, the at least one film layer in the light-emitting functional layer 130 that is disconnected by the partition structure 200 can be at least one film layer in the common layer. By disconnecting at least one film layer in the common layer at the edge of the partition structure 200, the risk of crosstalk in the third area A3 is reduced, thereby facilitating the sub-pixels 10 in the first area A1 to have a good light-emitting state.

[0070] As shown in Figures 1 and 2, the display panel also includes an insulating layer 215 located on the base substrate BS. In the third area A3, at least a portion of the insulating layer 215 is located on the sidewall of at least one partition structure 200. For example, the insulating layer 215 may be a residual structure remaining on the sidewall of the partition structure 200 during the process of forming the partition structure 200. For example, in the process of forming the partition structure 200, the outer surface of the initial partition structure used to form the partition structure 200 is covered by a "protective film layer", and when the other film layers are patterned, they are removed. After the initial partition structure is patterned, the partition structure 200 is formed, and the partition structure 200 has a "bottom cut" structure. For example, the above-mentioned "protective film layer" may be an insulating film layer, but is not limited thereto. For example, the insulating layer 215 may include a residual film layer that has not been completely removed from the above-mentioned "protective film layer", but is not limited thereto. For example, the aforementioned “protective film layer” is completely removed, and the insulating layer 215 may include some film layers formed on the aforementioned “protective film layer” but not completely removed during the patterning process.

[0071] For example, the aforementioned "protective film layer" can provide preliminary protection for the formation of the partition structure 200, allowing the partition structure 200 to be formed separately after the patterning of other structures is completed. This can reduce the impact of other film layers on the partition structure 200. For example, it can prevent other film layers from filling the "undercut" structure of the partition structure 200, making it difficult for the partition structure 200 to perform its partitioning function. Due to the precision of the process implementation, it is difficult to completely remove the insulating layer 215 on the sidewalls of the partition structure 200 that is finally formed. Therefore, at least a portion of the insulating layer 215 will remain on the sidewalls of the partition structure 200.

[0072] The partition structure 200 provided in the embodiment of the present disclosure has a simple structure and its manufacturing process is easy to control. The portion of the partition structure 200 used to perform the "partitioning function" is not covered or filled by other film layers. The edge of the second isolation structure 220 in the partition structure 200 protrudes relative to the edge of the first isolation structure 210, so that the second isolation structure 220 in the partition structure 200 has a significant protrusion, which is beneficial to reducing the risk of crosstalk.

[0073] For example, as shown in FIG2 , the second isolation structure 220 includes a protrusion 221 that protrudes relative to the edge of the first isolation structure 210, thereby allowing the second isolation structure 220 to have an "undercut" structure to isolate at least one film layer in the light-emitting functional layer 130. For example, at least a portion of the insulating layer 215 located on the sidewall of the partition structure 200 is spaced apart from the protrusion 221 of the partition structure 200 in a direction perpendicular to the base substrate BS. For example, the insulating layer 215 located on the sidewall of the partition structure 200 is spaced apart from the protrusion 221 in a direction perpendicular to the base substrate BS. Therefore, this portion of the insulating layer 215 does not affect the isolation function of the partition structure 200.

[0074] For example, as shown in FIG2 , a direction perpendicular to the substrate BS is the Z direction. For example, at least a portion of the insulating layer 215 may be located on the sidewalls of the first isolation structure 210. For example, the size of the insulating layer 215 located on the sidewalls of the first isolation structure 210 in the Z direction may be 1 / 10 to 1 / 3 of the size of the first isolation structure 210 in the Z direction, for example, at least one of 1 / 5 to 1 / 3, 1 / 6 to 1 / 4, 1 / 7 to 1 / 5, 1 / 8 to 1 / 6, and 1 / 9 to 1 / 7, which is not limited in the embodiments of the present disclosure.

[0075] For example, as shown in FIG2 , the partition structure 200 may further include a third isolation structure 230. The first isolation structure 210, the second isolation structure 220, and the third isolation structure 230 are stacked, and the third isolation structure 230 is located on the side of the first isolation structure 210 close to the substrate BS. For example, the third isolation structure 230 may also have a protrusion protruding relative to the edge of the first isolation structure 210, so that the partition structure 200 has an "I" structure. For example, at least a portion of the insulating layer 215 may also be located on the sidewall of the third isolation structure 230, so that the insulating layer 215 and the protrusion 221 of the second isolation structure 220 have a larger distance in the Z direction, so as to facilitate the partition structure 200 to isolate at least one film layer in the light-emitting functional layer 130.

[0076] For example, as shown in FIG2 , the first isolation structure 210, the second isolation structure 220, and the third isolation structure 230 all include metal materials. For example, the material of the first isolation structure 210 is different from the material of the second isolation structure 220, and the material of the second isolation structure 220 is the same as the material of the third isolation structure 230. For example, the partition structure 200 may include a titanium / aluminum / titanium structure, but the embodiments of the present disclosure are not limited thereto. For example, in some embodiments, the material of the first isolation structure 210, the material of the second isolation structure 220, and the material of the third isolation structure 230 may also be different, but the embodiments of the present disclosure are not limited thereto.

[0077] For example, as shown in FIG2 , the display panel 01 further includes a pixel-defining pattern 300. The pixel-defining pattern 300 is located in the first area A1 and on the base substrate BS. The pixel-defining pattern 300 includes a plurality of first openings 310 to define the light-emitting areas of at least a portion of the sub-pixels 10. For example, each sub-pixel 10 corresponds to at least one first opening 310. At least a portion of the light-emitting element 100 of the sub-pixel 10 is located in the first opening 310 corresponding to the sub-pixel 10. The first opening 310 is configured to expose the first electrode 110 of the sub-pixel 10. For example, the first opening 310 exposes a portion of the first electrode 110. For example, each sub-pixel 10 may correspond to one first opening 310.

[0078] For example, as shown in FIG2 , when the light-emitting functional layer 130 is formed in the first opening 310 of the pixel defining pattern 400, the first electrode 110 and the second electrode 120 located on both sides of the light-emitting functional layer 130 can drive the light-emitting functional layer 130 in the first opening 310 to emit light. For example, the light-emitting region may refer to the region of the sub-pixel that effectively emits light, and the shape of the light-emitting region may refer to a two-dimensional shape. For example, the shape of the light-emitting region may be the same as the shape of the first opening 310 of the pixel defining pattern 400.

[0079] For example, as shown in FIG2 , the display panel 01 further includes a defining structure 500. The defining structure 500 is located in the first area A1 and between the light-emitting functional layer 130 and the base substrate BS. The defining structure 500 includes a portion surrounding the light-emitting region of each sub-pixel 10 in at least some of the sub-pixels 10. For example, the defining structure 500 is located between the first electrode 110 and the base substrate BS, and the orthographic projection of the first opening 310 on the base substrate BS falls within the orthographic projection of the defining structure 500 on the base substrate BS. For example, the orthographic projection of the first electrode 110 on the base substrate BS falls within the orthographic projection of the defining structure 500 on the base substrate BS.

[0080] Fig. 3 is a structural diagram of an example of the first region of the display panel shown in Fig. 1. Fig. 4 is a partial cross-sectional schematic diagram taken along line W2-W2' shown in Fig. 3.

[0081] For example, as shown in Figures 2 and 3, the pixel defining pattern 300 further includes a second opening 320. The portion of at least one film layer in the light-emitting functional layer 130 located in the first opening 310 is a continuous portion, and at least the portion of at least one film layer in the light-emitting functional layer 130 located in the at least one second opening 320 is blocked. The portion of the defining structure 500 exposed by the second opening 320 is configured to block at least one film layer in the light-emitting functional layer 130. For example, in some embodiments of the present disclosure, the first light-emitting layer 131 and the second light-emitting layer 132 may not be disposed in the third area A3, so that the blocking structure 200 can be used to block at least one film layer in the light-emitting functional layer 130 other than the first light-emitting layer 131 and the second light-emitting layer 132.

[0082] For example, as shown in FIG4 , the portion of the defining structure 500 exposed by the second opening 320 includes a defining partition 501. The defining partition 501 is provided between at least two adjacent sub-pixels 10, and at least one film layer in the light-emitting functional layer 130 is disconnected at the edge of the defining partition 501. Providing the defining partition 501 between adjacent sub-pixels 10 to isolate at least one film layer in the light-emitting functional layer 130 helps reduce the probability of crosstalk between adjacent sub-pixels 10. For example, the defining partition 501 mentioned above refers to the structure of the defining structure 500 exposed by the second opening 320.

[0083] In any embodiment of the present disclosure, "adjacent sub-pixels" refer to two sub-pixels with no other sub-pixels arranged between them. The adjacent sub-pixels may be two sub-pixels of the same color or two sub-pixels of different colors.

[0084] For example, as shown in FIG. 4 , at least a portion of the second electrode 120 is disconnected at an edge defining the partition portion 501 .

[0085] For example, as shown in Figure 4, the limiting structure 500 includes a first sub-limiting structure 510 and a second sub-limiting structure 520 that are stacked. The first sub-limiting structure 510 is located on the side of the second sub-limiting structure 520 close to the base substrate BS, and the edge of the second sub-limiting structure 520 protrudes relative to the edge of the first sub-limiting structure 510 to achieve isolation of at least one film layer of the light-emitting functional layer 130, thereby reducing the risk of crosstalk between adjacent sub-pixels.

[0086] For example, as shown in FIG2 , insulating layer 215 may include a portion located in first region A1, and this portion may include at least one of first sub-definition structure 510 and second sub-definition structure 520. For example, an initial partition structure for forming partition structure 200 is formed before forming definition structure 500. After patterning, this initial partition structure may form partition structure 200 having an "undercut" structure. For example, when forming definition structure 500, a film layer for forming first sub-definition structure 510 and a film layer for forming second sub-definition structure 520 are disposed in first region A1 and third region A3, and then patterned to obtain first sub-definition structure 510 and second sub-definition structure 520, thereby forming definition structure 500. During this process, the portion of the film layer used to form the first sub-defining structure 510 located in the third area A3 and the portion of the film layer used to form the second sub-defining structure 520 located in the third area A3 are substantially removed, with only a small portion remaining on the sidewalls of the partition structure 200. Subsequently, the initial partition structure is patterned to obtain the partition structure 200. This arrangement reduces the risk of other film layers filling the "undercut" structure of the partition structure 200 without adding additional process steps, thereby facilitating the partition structure 200 to perform its partitioning function.

[0087] For example, as shown in FIG2 , the insulating layer 215 may be a residual structure of a portion of the film layer used to form the first sub-defining structure 510 located in the third area A3 that has not been completely removed during the patterning process. Any one of the first sub-defining structure 510 and the second sub-defining structure 520 may be included. For example, the first sub-defining structure 510 may be included, and the insulating layer 215 may be a residual structure of a portion of the film layer used to form the first sub-defining structure 510 located in the third area A3 that has not been completely removed during the patterning process. For example, the portion of the film layer forming the first sub-defining structure 510 located in the third area A3 covers the surface of the initial partition structure, and then after (or at the same time as) the patterning process of the other film layers is completed, the portion of the film layer of the first sub-defining structure 510 located in the third area A3 is basically removed, so that the initial partition structure can form a partition structure 200 with an "undercut" structure through patterning. Thus, when the portion of the film layer of the first sub-defining structure 510 located in the third area A3 covers the surface of the initial partition structure, the risk of other film layers filling the “undercut” structure of the partition structure 200 can be reduced.

[0088] For example, as shown in FIG2 , the material of first sub-definition structure 510 is different from the material of second sub-definition structure 520. For example, the material of first sub-definition structure 510 includes an organic material or an inorganic non-metallic material, and the material of second sub-definition structure 520 includes an inorganic non-metallic material or a metallic material. For example, the material of first sub-definition structure 510 may include silicon nitride or silicon oxide. For example, the material of second sub-definition structure 520 may include a material such as polyimide.

[0089] For example, as shown in FIG2 , for the same etching solution, the etching selectivity of the first isolation structure 210, the etching selectivity of the first sub-definition structure 510, and the etching selectivity of the second sub-definition structure 520 decrease in sequence. For example, for the same etching solution, the etching selectivity of the first sub-definition structure 510 is greater than the etching selectivity of the second sub-definition structure 520, thereby facilitating the edge of the etched first sub-definition structure 510 to be retracted relative to the edge of the second sub-definition structure 520, thereby enabling the defining structure 500 to have a barrier capability. For example, for the same etching solution, the etching selectivity of the first isolation structure 210 is greater than the etching selectivity of the first sub-definition structure 510, thereby enabling at least a portion of the first isolation structure 210 to be etched simultaneously with the formation of the first sub-definition structure 510, thereby facilitating the edge of the first isolation structure 210 to be retracted relative to the edge of the second isolation structure 220, thereby facilitating the barrier structure 200 to have an "undercut" structure.

[0090] For example, as shown in Figure 2, to improve exposure capabilities, the display panel 01 further includes at least one metal structure 4000 located between the partition structure 200 and the base substrate BS. Within the third area A3, the orthographic projection of the partition structure 200 on the base substrate BS falls within the orthographic projection of the at least one metal structure 4000 on the base substrate BS. For example, the placement of the at least one metal structure 4000 can further distance the partition structure 200 from the base substrate BS in the Z direction, thereby improving exposure during the formation of the partition structure 200 and ensuring that the partition structure 200 has a desired "undercut" structure.

[0091] For example, as shown in Figure 2, the at least one metal structure 4000 includes a first metal structure 410 and a second metal structure 420. Within the third area A3, the first metal structure 410, the second metal structure 420, and the partition structure 200 are stacked sequentially in a direction perpendicular to the base substrate BS, with the partition structure 200 located on the side of the second metal structure 420 away from the base substrate BS. For example, the first metal structure 410 and the second metal structure 420 can be made of different metal materials, with the first metal structure 410 located on the side of the second metal structure 420 closer to the base substrate BS. For example, the first metal structure 410 and the second metal structure 420 can separate the partition structure 200 from the base substrate BS and "raise" the partition structure 200, thereby improving the exposure effect during the formation of the partition structure 200.

[0092] For example, as shown in FIG2 , the orthographic projection of the partition structure 200 on the base substrate BS falls within the orthographic projection of the second metal structure 420 on the base substrate BS. This configuration can make the partition structure 200 more stable and reduce the risk of the partition structure 200 shifting or misaligning. For example, the edge of the partition structure 200 has a certain indentation relative to the edge of the second metal structure 420. For example, the indentation can be 0.05 to 0.5 microns, for example, at least one of 0.05 to 0.1 microns, 0.15 to 0.2 microns, 0.25 to 0.3 microns, 0.35 to 0.4 microns, and 0.45 to 0.5 microns. The embodiments of the present disclosure are not limited to this.

[0093] For example, as shown in Figure 2, the edge of the second metal structure 420 may also have a certain inward dimension relative to the edge of the first metal structure 410, so that the second metal structure 420 can be firmly arranged on the first metal structure 410, thereby facilitating the improvement of the stability of the partition structure 200 and reducing the risk of displacement or misalignment of the partition structure 200. For example, in some embodiments of the present disclosure, in the Z direction, the edge of the second metal structure 420 may also be flush with the edge of the first metal structure 410.

[0094] For example, as shown in FIG2 , the portion of insulating layer 215 located in first area A1 includes a first sub-definition structure 510, and at least a portion of insulating layer 215 covers the outer wall of first metal structure 410 and the outer wall of second metal structure 420. For example, the portion of insulating layer 215 located in first area A1 may include only first sub-definition structure 510. For example, an initial partition structure for forming partition structure 200 is formed before forming definition structure 500. After patterning, the initial partition structure can form a partition structure 200 having an "undercut" structure. For example, when forming definition structure 500, a film layer for forming first sub-definition structure 510 and a film layer for forming second sub-definition structure 520 are disposed in first area A1 and third area A3, and then patterned to obtain first sub-definition structure 510 and second sub-definition structure 520, thereby forming definition structure 500. During this process, the portion of the film layer used to form the second sub-defining structure 520 located in the third area A3 is basically removed; the portion of the film layer used to form the first sub-defining structure 510 located in the third area A3 is not completely removed, but a portion covering the outer wall of the first metal structure 410 and the outer wall of the second metal structure 420 is retained, so that the light-emitting functional layer 130 can be separated from both the first metal structure 410 and the second metal structure 420 to reduce the risk of crosstalk.

[0095] For example, as shown in FIG2 , the portion of the insulating layer 215 covering the outer walls of the first metal structure 410 and the outer walls of the second metal structure 420 has an average thickness of a first thickness L1, and the first sub-defining structure 510 in the insulating layer 215 located in the first area A1 has an average thickness of a second thickness L2, and the first thickness L1 is less than the second thickness L2. For example, the thickness of the portion of the insulating layer 215 covering the outer walls of the first metal structure 410 and the thickness of the portion of the insulating layer 215 covering the outer walls of the second metal structure 420 are substantially equal, and both are less than the average thickness L2 of the portion of the insulating layer 215 located in the first area A1 (e.g., the first sub-defining structure 510). By reducing the first thickness L1 of the portion of the insulating layer 215 covering the outer walls of the first metal structure 410 and the outer walls of the second metal structure 420, it is beneficial to reduce the spacing between adjacent partition structures 200 in the third area A3 while isolating the first metal structure 410 and the second metal structure 420 from the light-emitting functional layer 130, thereby saving layout space in the third area A3.

[0096] For example, as shown in Figure 2, the first thickness L1 is 1 / 100 to 1 / 10 of the second thickness L2, for example, it can be at least one of 1 / 100 to 1 / 50, 1 / 80 to 1 / 40, 1 / 70 to 1 / 60, 1 / 40 to 1 / 20, 1 / 15 to 1 / 10, 1 / 12 to 1 / 10 and 1 / 10 to 1 / 5, and the embodiments of the present disclosure are not limited to this.

[0097] For example, as shown in Figures 1 and 2, the display panel 01 includes a plurality of partition structures 200 spaced apart from each other. The partition structures 200 are annular and surround the second area A2. For example, the partition structure 200 may include an annular structure surrounding the second area A2. For example, the orthographic projection of the partition structure 200 on the base substrate BS may be a closed annular shape, but is not limited thereto. For example, the number of partition structures 200 in the third area A3 may be 2 to 8, for example, at least one of 2 to 5, 3 to 6, 4 to 7, 5 to 6, and 7 to 8, and the embodiments of the present disclosure are not limited thereto.

[0098] For example, as shown in FIG2 , at least a portion of the base substrate BS located between adjacent partition structures 200 does not overlap with the insulating layer 215. For example, during the manufacturing process of the display panel 01, portions of the insulating layer 215 located between adjacent partition structures 200 are removed to facilitate the formation of the partition structures 200. For example, in some embodiments, a portion of the base substrate BS located between an edge of the first area A1 near the third area A3 and the partition structure 200 adjacent to the edge also does not overlap with the insulating layer 215.

[0099] For example, as shown in FIG2 , the display panel further includes a pixel circuit 600. The pixel circuit 600 is located on a side of the first sub-defining structure 510 that is close to the base substrate BS, and the pixel circuit 600 is electrically connected to the first electrode 110. For example, the pixel circuit 600 is configured to drive the light-emitting element 100 to emit light. For example, the pixel circuit 600 is configured to provide a driving current to drive the light-emitting element 100 to emit light. For example, the pixel circuit may include a plurality of transistors and at least one capacitor (not shown in the figure), and the first electrode 110 may be electrically connected to the pixel circuit 600 via a connecting via N1.

[0100] FIG. 5 is an enlarged view of a local structure of the connecting via N1 in FIG. 2 .

[0101] For example, as shown in Figures 2, 3 and 5, the film layer where the first sub-defining structure 510 is located includes a connecting via N1, the pixel circuit 600 is electrically connected to the first electrode 110 through the connecting via N1, and at least a portion of the second sub-defining structure 520 extends into the connecting via N1 and covers the side wall of the connecting via N1.

[0102] For example, as shown in Figures 2, 3 and 5, when at least a portion of the second sub-defining structure 520 extends into the connecting via N1, a portion of the first sub-defining structure 510 located near the opening edge of the connecting via N1 is covered by the second sub-defining structure 520. Therefore, in the process of forming the second sub-defining structure 520, the portion of the first sub-defining structure 510 located near the opening edge of the connecting via N1 will be difficult to etch, thereby reducing the loss of this portion of the first sub-defining structure 510, and further, reducing the risk of the first electrode 110 breaking near the opening of the connecting via N1, thereby reducing the risk of problems such as mura or dark spots in pixels occurring in the display panel.

[0103] For example, as shown in Figures 2, 3, and 5, when at least a portion of second sub-defining structure 520 extends into connection via N1, that portion of second sub-defining structure 520 may only cover a portion of the sidewall of connection via N1. For example, at least a portion of second sub-defining structure 520 may only cover a portion near the opening of connection via N1. For example, when at least a portion of second sub-defining structure 520 extends into connection via N1 and completely covers the sidewall of connection via N1, no loss of first sub-defining structure 510 occurs during the formation of second sub-defining structure 520.

[0104] For example, as shown in Figures 2, 3 and 5, the thickness L3 of the portion of the second sub-defining structure 520 extending into the connecting via N1 and covering the side wall of the connecting via N1 is greater than 1 micron, for example, it can be at least one of 1 to 1.2 microns, 1.3 to 1.5 microns, 1.4 to 1.6 microns, 1.6 to 1.8 microns and 1.7 to 2 microns, and the embodiments of the present disclosure are not limited to this.

[0105] For example, as shown in FIG2 , a partition structure R is further provided in the third area A3, and the partition structure R is also configured to partition at least one layer of the light-emitting functional layer 130. For example, the orthographic projection of the partition structure R on the base substrate BS may be a closed ring. For example, the number of partition structures R may be 1 to 5, such as at least one of 2 to 4, 3 to 5, and 1 to 2, but the embodiments of the present disclosure are not limited thereto.

[0106] For example, as shown in FIG3 , the display panel includes a first sub-pixel 11, a second sub-pixel 12, and a third sub-pixel 13. For example, the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 are configured to emit light of different colors, but are not limited thereto. For example, any two of the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 may also be configured to emit light of the same color. For example, the area of ​​the light-emitting region of a first sub-pixel 11 is greater than the area of ​​the light-emitting region of a second sub-pixel 12, and the area of ​​the light-emitting region of a first sub-pixel 11 is greater than the area of ​​the light-emitting region of a third sub-pixel 13. For example, the area of ​​the light-emitting region of a second sub-pixel 12 is greater than the area of ​​the light-emitting region of a third sub-pixel 13.

[0107] In some examples, as shown in FIG3 , the first subpixel 11 is a blue subpixel, one of the second subpixel 12 and the third subpixel 13 is a red subpixel, and the other of the second subpixel 12 and the third subpixel 13 is a green subpixel. FIG3 schematically illustrates that the second subpixel 12 is a red subpixel and the third subpixel 13 is a green subpixel, but the present invention is not limited thereto. For example, the second subpixel 12 may also be a green subpixel and the third subpixel 13 may be a red subpixel.

[0108] For example, as shown in FIG3 , in a direction perpendicular to the substrate BS, the defining structure 500 includes a portion overlapping with the pixel defining pattern 300, a portion overlapping with the first opening 310, and a portion overlapping with the second opening 320. The portion of the defining structure 500 exposed by the second opening 320 is configured to isolate at least one film layer of the light-emitting functional layer 130. For example, the defining structure 500 includes a first defining structure 511, a second defining structure 522, and a third defining structure 533. For example, the first defining structure 511 includes a portion overlapping with the light-emitting area of ​​the first sub-pixel 11 and a portion surrounding the light-emitting area of ​​the first sub-pixel 11, the second defining structure 522 includes a portion overlapping with the light-emitting area of ​​the second sub-pixel 12 and a portion surrounding the light-emitting area of ​​the second sub-pixel 12, and the third defining structure 533 includes a portion overlapping with the light-emitting area of ​​the third sub-pixel 13 and a portion surrounding the light-emitting area of ​​the third sub-pixel 13.

[0109] For example, as shown in Figures 3 and 4, the portion of the first confining structure 511 exposed by the second opening 320 is a first confining partition 5011, the portion of the second confining structure 522 exposed by the second opening 320 is a second confining partition 5012, and the portion of the third confining structure 533 exposed by the second opening 320 is a third confining partition 5013. The light-emitting functional layer 130 and the second electrode 120 of the first sub-pixel 11 are disconnected at the edge of the first confining partition 5011. The light-emitting functional layer 130 and the second electrode 120 of the second sub-pixel 12 are disconnected at the edge of the second confining partition 5012. The light-emitting functional layer 130 and the second electrode 120 of the third sub-pixel 13 are disconnected at the edge of the third confining partition 5013.

[0110] For example, as shown in FIG3 , only one limiting structure is provided between two adjacent sub-pixels arranged along the U direction, and only one limiting structure is provided between two adjacent sub-pixels arranged along the V direction, thereby balancing crosstalk and power consumption between adjacent sub-pixels.

[0111] For example, as shown in FIG3 , the portions of the corresponding defining structures of the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 exposed by the second opening 320 are all arranged in a spaced-apart structure. The orthographic projections of the first defining partition 5011, the second defining partition 5012, and the third defining partition 5013 on the substrate are all non-closed rings.

[0112] For example, as shown in FIG3 , a first sub-pixel 11 includes a first corner portion 1011 formed by connecting two adjacent sides of its light-emitting area, and at least one first limiting partition portion 5011 surrounds only the portion of the two adjacent sides of the light-emitting area of ​​the first sub-pixel 11 except the first corner portion 1011. A second sub-pixel 12 includes a second corner portion 1012 formed by connecting two adjacent sides of its light-emitting area, and at least one second limiting partition portion 5012 surrounds only the portion of the two adjacent sides of the light-emitting area of ​​the second sub-pixel 12 except the second corner portion 1012. A third sub-pixel 13 includes a third corner portion 1013 formed by connecting two adjacent sides of its light-emitting area, and at least one third limiting partition portion 5013 surrounds only the portion of the two adjacent sides of the light-emitting area of ​​the third sub-pixel 13 except the third corner portion 1013. The first corner portion 1011, the second corner portion 1012, and the third corner portion 1013 all have the same orientation.

[0113] For example, as shown in FIG3 , each side of the light-emitting area of ​​the first subpixel 11 or its extension is sequentially connected to form a polygon, and multiple vertex corners of the polygon have areas that do not overlap with multiple corners of the corresponding light-emitting area. The light-emitting area of ​​the first subpixel 11 includes at least one specific corner 1014, and the area of ​​the area that does not overlap between the specific corner 1014 and the vertex corner of the corresponding polygon is greater than the area of ​​the area that does not overlap between each of at least some of the other corners and the vertex corner of the polygon corresponding to that corner.

[0114] FIG3 schematically illustrates that the first corner portion 1011, the second corner portion 1012, and the third corner portion 1013 are all oriented to the right, such as in the Y direction, but the present invention is not limited thereto. For example, the first corner portion 1011, the second corner portion 1012, and the third corner portion 1013 may all be oriented to the left (e.g., in the direction opposite to the direction indicated by the arrow in the Y direction) or downward, such as in the direction opposite to the direction indicated by the arrow in the X direction.

[0115] For example, as shown in FIG3 , by configuring the limiting structures at the corresponding positions of the first corner 1011 , the second corner 1012 and the third corner 1013 to not be exposed by the second opening 320 , the continuity of the second electrode 120 is improved and the power consumption of the display panel is reduced.

[0116] FIG. 6 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0117] For example, the difference between the display panel shown in Figure 6 and the display panel shown in Figure 3 lies in that the shape of the portion of the first limiting structure 511 exposed by the second opening 320 (i.e., the first limiting partition portion 5011) is different, and the shape of the portion of the second limiting structure 522 exposed by the second opening 320 (i.e., the second limiting partition portion 5012) is different. For other structural features, please refer to the relevant description of Figure 3 in the above embodiment and will not be repeated here.

[0118] For example, as shown in Figure 6, the portion of the first limiting structure 511 corresponding to the first sub-pixel 11 exposed by the second opening 320 is a continuously arranged structure, the portion of the second limiting structure 522 corresponding to the second sub-pixel 12 exposed by the second opening 320 is a continuously arranged structure, and the portion of the third limiting structure 533 corresponding to the third sub-pixel 13 exposed by the second opening 320 is an intermittently arranged structure.

[0119] For example, as shown in FIG6 , the first sub-pixel 11 includes a first corner portion 1011 formed by connecting two adjacent sides of its light-emitting area, and at least one first limiting partition portion 5011 surrounds the two adjacent sides of the light-emitting area of ​​the first sub-pixel 11. The second sub-pixel 12 includes a second corner portion 1012 formed by connecting two adjacent sides of its light-emitting area, and at least one second limiting partition portion 5012 surrounds the two adjacent sides of the light-emitting area of ​​the second sub-pixel 12. The third sub-pixel 13 includes a third corner portion 1013 formed by connecting two adjacent sides of its light-emitting area, and at least one third limiting partition portion 5013 surrounds only the portion of the two adjacent sides of the light-emitting area of ​​the third sub-pixel 13 except for the third corner portion 1013. The first corner portion 1011, the second corner portion 1012, and the third corner portion 1013 are oriented in the same direction.

[0120] By not providing the second opening 320 in the third limiting partition portion 5013 at the position of the third triangular portion 1013, while isolating at least one film layer of the light-emitting functional layer of the adjacent sub-pixels, it is beneficial to improve the continuity of the second electrode of the third sub-pixel 13, thereby reducing power consumption.

[0121] FIG. 7 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0122] For example, the display panel shown in FIG. 7 differs from the display panel shown in FIG. 3 in that the first defining structure 511 is not exposed by the second opening 320 , and the portion of the second defining structure 522 exposed by the second opening 320 (ie, the second defining partition portion 5012 ) has a different shape.

[0123] For example, as shown in Figure 7, the first limiting structure 511 corresponding to the first sub-pixel 11 is not exposed by the second opening 320, the second limiting structure 522 corresponding to the second sub-pixel 12 is exposed by the second opening 320 as a continuously arranged structure, and the third limiting structure 533 corresponding to the third sub-pixel 13 is exposed by the second opening 320 as an intermittently arranged structure.

[0124] For example, as shown in FIG7 , the second sub-pixel 12 includes a second corner portion 1012 formed by connecting two adjacent sides of its light-emitting area, and at least one second limiting partition portion 5012 surrounds the two adjacent sides of the light-emitting area of ​​the second sub-pixel 12. The third sub-pixel 13 includes a third corner portion 1013 formed by connecting two adjacent sides of its light-emitting area, and at least one third limiting partition portion 5013 surrounds only the portion of the two adjacent sides of the light-emitting area of ​​the third sub-pixel 13 except for the third corner portion 1013. The second corner portion 1012 and the third corner portion 1013 have the same orientation.

[0125] For example, as shown in FIG7 , since the area of ​​the light-emitting region of the first sub-pixel 11 is relatively large, by preventing the first limiting structure 511 corresponding to the first sub-pixel 11 from being exposed by the second opening 320 , the second electrode of the first sub-pixel 11 can have good continuity, thereby effectively reducing power consumption.

[0126] FIG8 is a structural diagram of the first area of ​​the display panel shown in FIG1 in another example.

[0127] For example, the display panel shown in FIG. 8 is different from the display panel shown in FIG. 7 in that the portion of the third defining structure 533 exposed by the second opening 320 (ie, the third defining partition portion 5013 ) has a different shape.

[0128] For example, as shown in Figure 8, the first limiting structure 511 corresponding to the first sub-pixel 11 is not exposed by the second opening 320, the second limiting structure 522 corresponding to the second sub-pixel 12 is exposed by the second opening 320 as a continuously arranged structure, and the third limiting structure 533 corresponding to the third sub-pixel 13 is exposed by the second opening 320 as a continuously arranged structure.

[0129] For example, as shown in FIG8 , the second sub-pixel 12 includes a second corner portion 1012 formed by connecting two adjacent sides of its light-emitting area, and at least one second limiting partition portion 5012 surrounds the two adjacent sides of the light-emitting area of ​​the second sub-pixel 12. The third sub-pixel 13 includes a third corner portion 1013 formed by connecting two adjacent sides of its light-emitting area, and at least one third limiting partition portion 5013 surrounds only the two adjacent sides of the light-emitting area of ​​the third sub-pixel 13. The second corner portion 1012 and the third corner portion 1013 have the same orientation.

[0130] For example, as shown in FIG8 , a defining structure is provided between the first sub-pixel 11 and the second sub-pixel 12, a defining structure is provided between the second sub-pixel 12 and the third sub-pixel 13, and substantially no defining structure is provided between the first sub-pixel 11 and the third sub-pixel 13. This helps reduce the probability of crosstalk between the first sub-pixel 11 and the second sub-pixel 12, as well as the probability of crosstalk between the second sub-pixel 12 and the third sub-pixel 13. Furthermore, since the light-emitting area of ​​the first sub-pixel 11 is relatively large, by preventing the first defining structure 511 corresponding to the first sub-pixel 11 from being exposed by the second opening 320, the second electrode of the first sub-pixel 11 can maintain good continuity, effectively reducing power consumption.

[0131] For example, compared to the display panels shown in Figures 3-7, the edge length of the third defining structure 533 exposed by the second opening 320 in the display panel shown in Figure 8 accounts for a smaller proportion of the perimeter of the first opening 310 corresponding to the third sub-pixel 13. For example, the proportion may be at least one of 10% to 20%, 10% to 15%, 11% to 13%, 12% to 14%, 15% to 16%, 17% to 19%, and 18% to 20%. The embodiments of the present disclosure are not limited to this. This configuration can ensure good continuity of the second electrode between adjacent first sub-pixels 11 and third sub-pixels 13.

[0132] Figure 9 is a structural diagram of the first area of ​​the display panel shown in Figure 1 in another example; Figure 10 is a structural diagram of the first area of ​​the display panel shown in Figure 1 in another example; Figure 11 is a structural diagram of the first area of ​​the display panel shown in Figure 1 in another example; Figure 12 is a structural diagram of the first area of ​​the display panel shown in Figure 1 in another example.

[0133] For example, the display panel shown in FIG9 differs from the display panel shown in FIG3 in the shape of the light-emitting area of ​​first sub-pixel 11. As shown in FIG9 , the light-emitting area of ​​first sub-pixel 11 includes four corners, each of which has the same characteristics. That is, the light-emitting area of ​​first sub-pixel 11 shown in FIG9 does not include specific corner 1014 shown in FIG3 . Except for the shape of the light-emitting area of ​​the first sub-pixel in the display panel shown in FIG9 being different from the shape of the light-emitting area of ​​the first sub-pixel shown in FIG3 , the other features of the display panel shown in FIG9 are the same as those of the display panel shown in FIG3 and are not further described here.

[0134] For example, the display panel shown in FIG10 differs from the display panel shown in FIG6 in the shape of the light-emitting area of ​​first sub-pixel 11. As shown in FIG10 , the light-emitting area of ​​first sub-pixel 11 includes four corners, each of which has the same characteristics. That is, the light-emitting area of ​​first sub-pixel 11 shown in FIG10 does not include specific corner 1014 shown in FIG6 . Except for the shape of the light-emitting area of ​​the first sub-pixel in the display panel shown in FIG10 being different from the shape of the light-emitting area of ​​the first sub-pixel shown in FIG6 , the other features of the display panel shown in FIG10 are the same as those of the display panel shown in FIG6 and are not further described here.

[0135] For example, the display panel shown in FIG11 differs from the display panel shown in FIG7 in the shape of the light-emitting area of ​​first sub-pixel 11. As shown in FIG11 , the light-emitting area of ​​first sub-pixel 11 includes four corners, each of which has the same characteristics. That is, the light-emitting area of ​​first sub-pixel 11 shown in FIG11 does not include specific corner 1014 shown in FIG7 . Except for the shape of the light-emitting area of ​​the first sub-pixel in the display panel shown in FIG11 being different from the shape of the light-emitting area of ​​the first sub-pixel shown in FIG7 , the other features of the display panel shown in FIG11 are the same as those of the display panel shown in FIG7 and are not further described here.

[0136] For example, the display panel shown in FIG12 differs from the display panel shown in FIG8 in the shape of the light-emitting area of ​​first sub-pixel 11. As shown in FIG12 , the light-emitting area of ​​first sub-pixel 11 includes four corners, each of which has the same characteristics. That is, the light-emitting area of ​​first sub-pixel 11 shown in FIG12 does not include specific corner 1014 shown in FIG8 . Except for the shape of the light-emitting area of ​​the first sub-pixel in the display panel shown in FIG12 being different from the shape of the light-emitting area of ​​the first sub-pixel shown in FIG8 , the other features of the display panel shown in FIG12 are the same as those of the display panel shown in FIG8 and are not further described here.

[0137] FIG. 13 is a structural diagram of the first area of ​​the display panel shown in FIG. 1 in another example.

[0138] For example, the difference between the display panel shown in Figure 13 and the display panel shown in Figure 3 is that the shape of the portion of the first limiting structure 511 exposed by the second opening 320 (i.e., the first limiting partition portion 5011) is different, the shape of the portion of the second limiting structure 522 exposed by the second opening 320 (i.e., the second limiting partition portion 5012) is different, and the shape of the portion of the third limiting structure 533 exposed by the second opening 320 (i.e., the third limiting partition portion 5013) is also different.

[0139] For example, as shown in FIG13 , the portion of the first confining structure 511 corresponding to the first sub-pixel 11 exposed by the second opening 320 is continuously disposed, the portion of the second confining structure 522 corresponding to the second sub-pixel 12 exposed by the second opening 320 is continuously disposed, and the portion of the third confining structure 533 corresponding to the third sub-pixel 13 exposed by the second opening 320 is also continuously disposed. This arrangement facilitates isolating at least one film layer of the light-emitting functional layer between adjacent sub-pixels, thereby effectively reducing the risk of crosstalk.

[0140] At least one embodiment of the present disclosure further provides a display device comprising the display panel described in any of the above examples. Other structures and functions of the display device provided in the embodiments of the present disclosure may be implemented with reference to conventional techniques, and are not limited in the embodiments of the present disclosure. The technical effects of the display device provided in the embodiments of the present disclosure can be described with reference to the above description of the technical effects of the display panel provided in the embodiments of the present disclosure, and will not be further elaborated here.

[0141] For example, the display device can be a display device such as an organic light emitting diode display device, as well as any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, etc. that includes the display device, but this embodiment is not limited to this.

[0142] 14 to 20 are flow charts of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0143] At least one embodiment of the present disclosure further provides a method for manufacturing a display panel. For example, the method is applicable to the display panel described in any of the above embodiments.

[0144] As shown in Figure 14, the display panel 02 includes a first area A1, a second area A2, and a third area A3 located between the first and second areas A1 and A2. The first area A1 is configured for display, and the second area A2 is configured for light transmission. The first area A1 is located on at least one side of the second area A2. For example, the first area A1 is a display area configured for display. The second area A2 is a hollow area configured for light transmission. For example, hardware such as a photosensor can be located in the second area A2.

[0145] As shown in FIG14 , the method for manufacturing a display panel 02 includes patterning an initial partition structure 2000 on a base substrate BS in a third area A3. The initial partition structure 2000 includes a first sub-isolation structure 2100 and a second isolation structure 220, which are stacked together. The first sub-isolation structure 2100 is closer to the base substrate BS than the second isolation structure 220. In a direction perpendicular to the base substrate BS, the edges of the first sub-isolation structure 2100 and the second isolation structure 220 are substantially flush. For example, the material of the first sub-isolation structure 2100 is different from that of the second isolation structure 220.

[0146] Next, as shown in Figures 15 and 17, a first defining layer 5100 is formed on the side of the initial partitioning structure 2000 facing away from the base substrate BS, and the first defining layer 5100 is patterned to form a first sub-defining portion 5101. In the third region A3, the first sub-defining portion 5101 covers the side surfaces of the initial partitioning structure 2000 and its upper surface facing away from the base substrate BS. That is, in the third region A3, when the first defining layer 5100 is patterned, the portion of the first defining layer 5100 located on the side surfaces of the initial partitioning structure 2000 and its upper surface facing away from the base substrate BS remains. The upper surface of the initial partitioning structure 2000 refers to the surface facing away from the base substrate BS. For example, the upper surface of the initial partitioning structure 2000 is substantially parallel to the base substrate BS and perpendicular to the Z direction; alternatively, a cross-section of the upper surface of the initial partitioning structure 2000 is parallel to the base substrate BS and perpendicular to the Z direction.

[0147] Next, as shown in Figures 18 and 19, a second confining layer 5200 is formed on a side of the first sub-defining portion 5101 away from the base substrate BS. The second confining layer 5200 and the first sub-defining portion 5101 are patterned to expose at least a portion of the initial partition structure 2000. When patterning the second confining layer 5200, the portion of the second confining layer 5200 located in the third area A3 is substantially removed, and the portion of the second confining layer 5200 located in the first area A1 is patterned to form the second sub-defining structure 520. When patterning the first sub-defining portion 5101, the portion of the first sub-defining portion 5101 located in the third area A3 is substantially removed, and the portion of the first sub-defining portion 5101 located in the first area A1 is patterned to form the first sub-defining structure 510. For example, the first sub-defining portion 5101 and the second confining layer 5200 can be etched simultaneously using dry etching.

[0148] Finally, as shown in Figures 19 and 20, the initial partition structure 2000 is patterned to form a partition structure 200. The partition structure 200 includes a first isolation structure 210 and a second isolation structure 220 that are stacked. The second isolation structure 220 is located on a side of the first isolation structure 210 away from the base substrate BS, and the edge of the second isolation structure 220 protrudes relative to the edge of the first isolation structure 210. The partition structure 200 is configured to isolate at least one film layer of the light-emitting functional layer of the sub-pixel 10. In the third area A3, the sidewalls of at least one partition structure 200 are covered with at least one of at least a portion of the second defining layer 5200 (as shown in Figure 18) and at least a portion of the first sub-defining portion 5101.

[0149] For example, as shown in Figures 19 and 20, when patterning the initial partition structure 2000, the first sub-isolation structure 2100 can be etched by wet etching so that the edge of the first sub-isolation structure 2100 is retracted relative to the edge of the second isolation structure 220, thereby making the formed partition structure 200 have a "bottom cut" structure to isolate at least one film layer in the subsequently formed light-emitting functional layer.

[0150] Taking into account the precision of the actual manufacturing process, as shown in Figures 18-20, during the patterning of the first sub-defining portion 5101 and the second defining layer 5200, in the third area A3, at least a portion of the first sub-defining portion 5101 and at least a portion of the second defining layer 5200 are difficult to completely remove, resulting in a portion remaining on the sidewalls of the initial partition structure 2000. Finally, as shown in Figure 20, during the patterning of the initial partition structure 2000, at least a portion of the first sub-defining portion 5101 and at least a portion of the second defining layer 5200 remain on the sidewalls of the partition structure 200.

[0151] For example, as shown in Figures 15 to 20, the portion of the first defining layer 5100 covering the side surfaces and top surface of the initial partition structure 2000 can play an insulating role. After the other structures are patterned, the first defining layer 5100 covering the side surfaces and top surface of the initial partition structure 2000 is removed, and finally the initial partition structure 2000 is patterned to form the partition structure 200. In this way, the influence of other film layers on the partition structure 200 can be reduced. For example, it can prevent at least a portion of other film layers (for example, the second defining layer 5200) from being filled in the "undercut" structure of the partition structure 200, making it difficult for the partition structure 200 to perform its partitioning function.

[0152] The manufacturing method of the display panel provided by the embodiment of the present disclosure is simple and easy to implement, which can make the manufacturing process of the partition structure 200 easy to control, and ensure that the part of the partition structure 200 used to perform the "partitioning function" is not covered or filled by other film layers. The edge of the second isolation structure 220 in the partition structure 200 protrudes relative to the edge of the first isolation structure 210, so that the second isolation structure 220 in the partition structure 200 has a significant protrusion, which is beneficial to reduce the risk of crosstalk.

[0153] For example, as shown in Figures 15 and 16 , patterning the first defining layer 5100 to form the first sub-defining portion 5101 includes removing portions of the first defining layer 5100 located between adjacent initial partitioning structures 2000 in the third area A3. At this point, as shown in Figure 16 , at least a portion of the first defining layer 5100 covers the side and top surfaces of the initial partitioning structures 200, and this portion has a greater thickness, substantially equal to the thickness of the portion of the first defining layer 5100 located in the first area A1. Then, as shown in Figures 16 and 17 , the portion of the first defining layer 5100 covering the side and top surfaces of the initial partitioning structures 2000 is thinned. At this point, in the third area A3, the portion of the first sub-defining portion 5101 covering the side and top surfaces of the initial partitioning structures 2000 is thinner than the thickness of the first sub-defining portion 5101 located in the first area A1.

[0154] For example, as shown in Figures 15-17, within the third region A3, the first defining layer 5100 can be patterned using a halftone mask. This removes portions of the first defining layer 5100 located between adjacent initial partitioning structures 2000 while thinning the portions of the first defining layer 5100 covering the side surfaces and top surfaces of the initial partitioning structures 2000, resulting in a thickness of the first defining layer 5100 of 100-10,000 angstroms after thinning. For example, the mask used to pattern the first defining layer 5100 can have different transmittances in different regions. For example, in the third region A3, the transmittance of the mask located between two adjacent initial partitioning structures 2000 is 100%, so that after exposure, the portions of the first defining layer 5100 located between the adjacent initial partitioning structures 2000 are completely removed. For example, the transmittance of the portion of the mask covering the side surface and the upper surface of the initial partition structure 2000 is 40% to 90%, for example, it can be at least one of 40% to 50%, 45% to 55%, 60% to 70%, 65% to 75%, 80% to 85% and 85% to 90%, so that after exposure treatment, the portion of the first limiting layer 5100 covering the side surface and the upper surface of the initial partition structure 2000 is thinned, for example, the thickness of this portion of the first limiting layer 5100 after thinning is at least one of 100 to 1000 angstroms, 500 to 1500 angstroms, 1200 to 1800 angstroms, 2000 to 2500 angstroms, 3000 to 3500 angstroms, 4000 to 6000 angstroms and 7000 to 8000 angstroms.

[0155] For example, as shown in Figures 15 to 17, when the portion of the first defining layer 5100 covering the side surface and the upper surface thereof of the initial partition structure 2000 is thinned, in the first display area A1, the thickness of the portion of the first defining layer 5100 that needs to be removed subsequently will also be thinned accordingly (not shown in the figures), so as to facilitate improving the degree of patterning of the portion of the first defining layer 5100 located in the first display area A1.

[0156] Fig. 21 is a schematic diagram of a partial planar structure of a display panel provided by an embodiment of the present disclosure. Fig. 22 is a schematic diagram of a partial enlarged structure of the area in Fig. 21 .

[0157] For example, as shown in Figure 21, the display panel includes a plurality of initial partition structures 2000 arranged at intervals. A limiting structure 500 is provided on one side of the initial partition structure 2000 to partition at least one film layer in the light-emitting functional layer.

[0158] For example, as shown in Figures 15-17 and 22, when a half-tone mask 650 is used to pattern the first defining layer 5100, the transmittance of a portion M1 of the half-tone mask 650 corresponding to the space between adjacent initial partition structures 2000 is 100%, so that after the exposure process, the portion of the first defining layer 5100 located between adjacent initial partition structures 2000 is completely removed. For example, the portion of the half-tone mask 650 corresponding to the space between the side surfaces and the top surface of the initial partition structure 2000 is M2, and the transmittance of M2 is 40% to 90%, so that after the exposure process, the portion of the first defining layer 5100 covering the side surfaces and the top surface of the initial partition structure 2000 is thinned.

[0159] For example, as shown in FIG18 , the formed second defining layer 5200 and the formed first sub-defining portion 5101 both include a portion located in the first area A1. The portion of the first sub-defining portion 5101 located in the first area A1 is located on the base substrate BS, and the portion of the first sub-defining portion 5101 located in the third area A3 covers the side surfaces and top surface of the initial partition structure 2000. For example, the portion of the second defining layer 5200 located in the first area A1 and the portion located in the third area A3 are continuous film layers, and the portion of the second defining layer 5200 located in the first area A1 and the portion located in the third area A3 are an integrated structure.

[0160] For example, as shown in Figures 18 and 19, patterning the second defining layer 5200 and the first sub-defining portion 5101 to expose the initial partition structure 2000 includes: patterning the second defining layer 5200 and the first sub-defining portion 5101 at the same time to form the defining structure 500 in the first area A1, while removing the second defining layer 5200 in the third area A3, and removing at least part of the first sub-defining portion 5101 covering the side surface and the upper surface of the initial partition structure 200.

[0161] For example, as shown in Figures 18 and 19, when patterning the second defining layer 5200, the portion of the second defining layer 5200 located in the first area A1 is patterned to form the second sub-definition structure 520, while the portion of the second defining layer 5200 located in the third area A3 is substantially removed after patterning. For example, the first sub-definition portion 5101 and the second defining layer 5200 are patterned simultaneously. The portion of the first sub-definition portion 5101 located in the first display area A1 is patterned to form the first sub-definition structure 510, while the portion of the first sub-definition portion 5101 located in the third area A3 is substantially removed. For example, due to process precision limitations, at least one of at least a portion of the first sub-definition portion 5101 and at least a portion of the second defining layer 5200 may remain on the sidewalls of the initial partition structure 2000 in the third area A3.

[0162] As shown in Figure 19, in the first area A1, the limiting structure 500 includes a first sub-limiting structure 510 and a second sub-limiting structure 520 that are stacked. The first sub-limiting structure 510 is located on the side of the second sub-limiting structure 520 close to the base substrate BS, and the edge of the second sub-limiting structure 520 protrudes relative to the edge of the first sub-limiting structure 510. Thus, the limiting structure 500 can be configured to isolate at least one film layer in the light-emitting functional layer located between adjacent sub-pixels.

[0163] For example, as shown in Figures 18 and 19, within the third area A3, the portion of the first sub-defining portion 5101 covering the upper surface of the initial partition structure 2000 is removed, and the portion of the first sub-defining portion 5101 covering the side surface of the first sub-isolating structure 2100 within the initial partition structure 2000 is substantially removed. For example, in the third area A3, at least a portion of the first sub-defining portion 5101 remains on the side surface of the first sub-isolating structure 2100 within the initial partition structure 2000. For example, the portion of the first sub-defining portion 5101 remaining on the side surface of the first sub-isolating structure 2100 is spaced a certain distance from the second isolating structure 220 in the Z direction, thereby facilitating the formation of an "undercut" structure within the initial partition structure 2000.

[0164] For example, as shown in Figure 14, before the initial partition structure 2000 is formed on the base substrate BS, the manufacturing method of the display panel 02 also includes: in the third area A3, patterning at least one layer of metal structure 4000, the metal structure 4000 and the initial partition structure 200 are stacked, the metal structure 4000 is closer to the base substrate BS than the initial partition structure 200, and the orthographic projection of the initial partition structure 2000 on the base substrate BS falls into the orthographic projection of the metal structure 4000 on the base substrate BS.

[0165] The display panel 02 shown in FIG14 includes a first metal structure 410 and a second metal structure 420. The first metal structure 410, the second metal structure 420, and the initial partition structure 2000 are stacked sequentially along the Z direction. The initial partition structure 2000 is located on the side of the second metal structure 420 that is away from the base substrate BS. For example, the first metal structure 410 and the second metal structure 420 can be made of different metal materials. The first metal structure 410 is located on the side of the second metal structure 420 that is closer to the base substrate BS. For example, the first metal structure 410 and the second metal structure 420 can separate the initial partition structure 2000 from the base substrate BS, thereby "raising" the initial partition structure 2000, thereby improving the exposure effect during the formation of the initial partition structure 2000.

[0166] For example, as shown in Figures 16 and 17, patterning the first confinement layer 5100 to form the first sub-defining portion 5101 further includes thinning the portion of the first confinement layer 5100 that covers the surface of the metal structure 4000 in the third region A3. For example, at least a portion of the first confinement layer 5100 covers the surface of the metal structure 4000, and its thickness decreases during the patterning process. For example, as shown in Figure 17, after the first confinement layer 5100 is patterned, at least a portion of the first confinement layer 5100 covers the surface of the stacked structure formed by the first metal structure 410, the second metal structure 420, and the initial partition structure 2000.

[0167] For example, as shown in Figures 18 and 19, patterning the second defining layer 5200 and the first sub-defining portion 5101 to expose the initial partitioning structure 2000 further includes: simultaneously patterning the second defining layer 5200 and the first sub-defining portion 5101 so that, within the third area A3, the portion of the first defining layer 5100 that covers the surface of the metal structure 4000 is retained. For example, as shown in Figure 19, after patterning, the portion of the first sub-defining portion 5101 that covers the top and side surfaces of the initial partitioning structure 2000 is substantially removed, leaving at least a portion of the first sub-defining portion 5101 covering the surface of the metal structure 4000. This arrangement can separate the metal structure 4000 from the light-emitting functional layer, thereby reducing the risk of crosstalk.

[0168] For example, as shown in FIG2 , the manufacturing method of the display panel provided by the embodiment of the present disclosure may include: preparing a base substrate BS on a glass carrier. For example, the base substrate BS may be a flexible base substrate. For example, forming the base substrate BS may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked on the glass carrier. The materials of the first flexible material layer and the second flexible material layer are polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The materials of the first inorganic material layer and the second inorganic material layer are silicon nitride (SiNx) or silicon oxide (SiOx), etc., which are used to improve the water and oxygen resistance of the base substrate. The first inorganic material layer and the second inorganic material layer are also referred to as barrier layers.

[0169] For example, as shown in FIG2 , the manufacturing method of the display panel provided by the embodiment of the present disclosure may further include: forming a driving structure layer of a pixel circuit on a base substrate BS. The driving structure layer includes a plurality of pixel circuits, each pixel circuit includes a plurality of transistors and at least one storage capacitor, for example, the pixel circuit may adopt a 2T1C, 3T1C or 7T1C design. For example, forming the driving structure layer may include sequentially depositing a first insulating film and an active layer film on the base substrate BS, patterning the active layer film through a patterning process to form a first insulating layer covering the entire base substrate BS, and an active layer pattern provided on the first insulating layer, the active layer pattern including at least an active layer. For example, sequentially depositing a second insulating film and a first metal film, patterning the first metal film through a patterning process to form a second insulating layer covering the active layer pattern, and a first gate metal layer pattern provided on the second insulating layer, the first gate metal layer pattern including at least a gate electrode and a first capacitor electrode. For example, a third insulating film and a second metal film are sequentially deposited, and the second metal film is patterned through a composition process to form a third insulating layer covering the first gate metal layer, and a second gate metal layer pattern disposed on the third insulating layer, wherein the second gate metal layer pattern includes at least a second capacitor electrode, and the position of the second capacitor electrode corresponds to the position of the first capacitor electrode. Subsequently, a fourth insulating film is deposited and patterned through a composition process to form a fourth insulating layer covering the second gate metal layer, wherein at least two vias are provided on the fourth insulating layer, and the fourth insulating layer, the third insulating layer, and the second insulating layer within the two vias are etched away to expose the surface of the active layer of the active layer pattern. Subsequently, a third metal film is deposited and patterned through a composition process to form a source-drain metal layer pattern on the fourth insulating layer, wherein the source-drain metal layer pattern includes at least a source electrode and a drain electrode located in the display area. The source electrode and the drain electrode can be connected to the active layer in the active layer pattern through the vias, respectively.

[0170] For example, the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer can be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, a multilayer or a composite layer. The first insulating layer can be a buffer layer for improving the water and oxygen resistance of the substrate BS; the second insulating layer and the third insulating layer can be gate insulating (GI) layers; and the fourth insulating layer can be an interlayer insulating (ILD) layer. The first metal film, the second metal film and the third metal film are made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single layer structure or a multilayer composite structure, such as Ti / Al / Ti. The active layer thin film adopts one or more materials such as amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene, polythiophene, etc., that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology and organic technology.

[0171] For example, as shown in FIG2 , after forming the partition structure 200, the method for manufacturing a display panel provided by an embodiment of the present disclosure further includes patterning a first electrode 110 on the limiting structure 500. For example, the first electrode 110 can be made of a metal material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy material of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It can be a single-layer structure, a multi-layer composite structure, such as Ti / Al / Ti, or a stacked structure formed by a metal and a transparent conductive material, such as reflective materials such as ITO / Ag / ITO or Mo / AlNd / ITO. For example, the first electrode 110 is electrically connected to the pixel circuit through a connecting via N1.

[0172] For example, as shown in FIG2 , after forming the first electrode 110, a pixel-defining pattern 300 can be formed. For example, a pixel-defining film is coated on the base substrate BS on which the aforementioned pattern is formed, and a masking, exposure, and development process are performed to form the pixel-defining pattern 300. For example, the pixel-defining pattern 300 in the display area includes a first opening 310 and a second opening 320 (see FIG4 ). The pixel-defining film within the first opening 310 and the second opening 320 is developed away. The first opening 310 exposes at least a portion of the surface of the first electrode 110 of the plurality of sub-pixels, and the second opening 320 exposes the defining structure 500.

[0173] For example, as shown in FIG2 , after forming the pixel defining pattern 300, spacers can be formed on the pixel defining pattern 300. For example, a thin film of organic material is coated on the base substrate BS on which the aforementioned pattern is formed, and the spacers are formed through masking, exposure, and development processes. The spacers can serve as a support layer, configured to support the FMM (high-precision mask) during the evaporation process.

[0174] For example, as shown in FIG2 , after forming the spacer, the light-emitting functional layer 130 and the second electrode 120 are sequentially formed. For example, the second electrode 120 may be a transparent cathode. The light-emitting functional layer 130 can emit light from the side away from the substrate BS through the transparent cathode, thereby achieving top emission. For example, the second electrode 120 can be made of any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of a metal and a transparent conductive material.

[0175] For example, as shown in FIG2 , forming the light-emitting functional layer 130 may include: sequentially evaporating a hole injection layer and a hole transport layer using an open mask; sequentially evaporating a first light-emitting layer 131 emitting light of different colors, such as a blue light-emitting layer, a green light-emitting layer, or a red light-emitting layer using a FMM; sequentially evaporating an electron transport layer, a charge generation layer 133, and a hole transport layer using an open mask; sequentially evaporating a second light-emitting layer 132 emitting light of different colors, such as a blue light-emitting layer, a green light-emitting layer, or a red light-emitting layer using an FMM; and sequentially evaporating an electron transport layer, a second electrode 120, and a light coupling layer using an open mask. For example, the hole injection layer, the hole transport layer, the electron transport layer, the charge generation layer, the second electrode 120, and the light coupling layer are all common layers for multiple sub-pixels.

[0176] For example, as shown in FIG2 , in the first region A1, the light-emitting functional layer 130 is formed to be disconnected at the edge of the defining structure 500, thereby reducing the risk of crosstalk between adjacent sub-pixels. In the third region A3, the light-emitting functional layer 130 is formed to be disconnected at the edge of the partition structure 200, thereby further reducing the risk of crosstalk between sub-pixels located near the edge of the first region A1.

[0177] For example, after forming the second electrode 120, the method for manufacturing a display panel further includes forming an encapsulation layer. The encapsulation layer may include a stacked first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. The first encapsulation layer is made of an inorganic material and covers the second electrode 120 in the display area. The second encapsulation layer is made of an organic material. The third encapsulation layer is made of an inorganic material and covers the first and second encapsulation layers. However, this embodiment is not limited to this. For example, the encapsulation layer may also adopt a five-layer structure of inorganic / organic / inorganic / organic / inorganic.

[0178] There are a few points to note:

[0179] (1) The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures can refer to general designs.

[0180] (2) In the absence of conflict, features in the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0181] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure, which is determined by the appended claims.

Claims

1. A display panel, comprising: A first area is configured to display; a second region configured to transmit light, the first region being located on at least one side of the second region; a third area, located between the first area and the second area; A plurality of sub-pixels are located in the first region, and each of at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes a plurality of film layers; A base substrate, and at least one partition structure located on the base substrate, the partition structure is located in the third region, the partition structure includes a first isolation structure and a second isolation structure arranged in a stacked manner, the second isolation structure is located on a side of the first isolation structure away from the base substrate, an edge of the second isolation structure protrudes relative to an edge of the first isolation structure, and the partition structure is configured to isolate at least one layer of the light-emitting functional layer, The display panel further comprises an insulating layer located on the base substrate, and in the third region, at least a portion of the insulating layer is located on a side wall of at least one of the partition structures.

2. The display panel according to claim 1, wherein: The second isolation structure includes a protrusion, which protrudes relative to an edge of the first isolation structure, and the at least portion of the insulating layer located on the side wall of the partition structure is spaced from the protrusion of the partition structure in a direction perpendicular to the base substrate.

3. The display panel according to claim 1 or 2, wherein: At least a portion of the insulating layer is located on a sidewall of the first isolation structure; and / or The partition structure further includes a third isolation structure, which is located on a side of the first isolation structure close to the base substrate, and at least a portion of the insulating layer is located on a sidewall of the third isolation structure.

4. The display panel according to claim 1 or 2, wherein: The partition structure further includes a third isolation structure, and the third isolation structure is located on a side of the first isolation structure close to the substrate, wherein the first isolation structure, the second isolation structure and the third isolation structure all include metal materials. The material of the first isolation structure is different from the material of the second isolation structure, and the material of the second isolation structure is the same as the material of the third isolation structure; or The material of the first isolation structure, the material of the second isolation structure, and the material of the third isolation structure are different.

5. The display panel according to any one of claims 1 to 4, further comprising at least one metal structure between the partition structure and the base substrate, In the third region, the orthographic projection of the partition structure on the base substrate falls within the orthographic projection of the at least one layer of metal structure on the base substrate.

6. The display panel according to claim 5, wherein: The at least one metal structure comprises a first metal structure and a second metal structure which are stacked. In the third region, the first metal structure, the second metal structure and the partition structure are stacked in sequence along a direction perpendicular to the base substrate, and the partition structure is located on a side of the second metal structure away from the base substrate.

7. The display panel according to claim 6, wherein: The orthographic projection of the partition structure on the base substrate falls within the orthographic projection of the second metal structure on the base substrate.

8. The display panel according to claim 6 or 7, further comprising: A pixel defining pattern, located in the first area and on the base substrate, the pixel defining pattern comprising a plurality of first openings to define a light emitting area of ​​at least part of the sub-pixels; a defining structure, located in the first region and between the light-emitting functional layer and the substrate, the defining structure including a portion surrounding a light-emitting region of each sub-pixel in the at least some sub-pixels, In which, the pixel defining pattern also includes a second opening, the portion of at least one layer of the light-emitting functional layer located in the first opening is a continuous portion, and at least a portion located in at least one second opening is isolated, and the portion of the defining structure exposed by the second opening is configured to isolate the at least one layer of the light-emitting functional layer.

9. The display panel according to claim 8, wherein: The defining structure includes a first sub-defining structure and a second sub-defining structure which are stacked, the first sub-defining structure is located on a side of the second sub-defining structure close to the base substrate, and an edge of the second sub-defining structure protrudes relative to an edge of the first sub-defining structure. The portion of the insulating layer located in the first region includes at least one of the first sub-defining structure and the second sub-defining structure.

10. The display panel according to claim 9, wherein: The portion of the insulating layer located in the first region includes the first sub-definition structure, and at least a portion of the insulating layer covers an outer wall of the first metal structure and an outer wall of the second metal structure.

11. The display panel according to claim 10, wherein: The average thickness of the portion of the insulating layer covering the outer wall of the first metal structure and the outer wall of the second metal structure is a first thickness, and the average thickness of the first sub-defining structure in the insulating layer located in the first area is a second thickness, and the first thickness is less than the second thickness.

12. The display panel according to claim 11, wherein: The first thickness is 1 / 100 to 1 / 10 of the second thickness.

13. The display panel according to any one of claims 1 to 12, wherein: The display panel includes a plurality of partition structures arranged at intervals, wherein the partition structures are ring-shaped and surround the second region. In the third region, at least a portion of the base substrate located between adjacent partition structures does not overlap with the insulating layer.

14. The display panel according to any one of claims 9 to 12, wherein: Each of the at least some of the sub-pixels further comprises: a first electrode and a second electrode located at both sides of the light-emitting functional layer in a direction perpendicular to the substrate, the first electrode being located between the light-emitting functional layer and the substrate, the pixel defining pattern being located on a side of the first electrode away from the substrate, and the second sub-defining structure being located between the first electrode and the substrate; The display panel further includes a pixel circuit, which is located on a side of the first sub-defining structure close to the base substrate, and is electrically connected to the first electrode.

15. The display panel according to claim 14, wherein: The film layer where the first sub-defining structure is located includes a connecting via, the pixel circuit is electrically connected to the first electrode through the connecting via, and at least part of the second sub-defining structure extends into the connecting via and covers the side wall of the connecting via.

16. The display panel according to any one of claims 9 to 15, wherein: The material of the first sub-defining structure is different from the material of the second sub-defining structure. The material of the first sub-defining structure includes organic material or inorganic non-metallic material, and the material of the second sub-defining structure includes inorganic non-metallic material or metallic material.

17. The display panel according to any one of claims 9 to 16, wherein: For the same etching solution, the etching selectivity of the first isolation structure, the etching selectivity of the first sub-definition structure, and the etching selectivity of the second sub-definition structure decrease in sequence.

18. A display device comprising the display panel according to any one of claims 1 to 17.

19. A method for manufacturing a display panel, wherein: The display panel includes a first area, a second area, and a third area located between the first area and the second area, the first area is configured to display, the second area is configured to transmit light, and the first area is located on at least one side of the second area; The production method comprises: Patterning an initial partition structure located on the substrate in the third region, wherein the initial partition structure includes a first sub-isolation structure and a second isolation structure that are stacked, the first sub-isolation structure is closer to the substrate than the second isolation structure, and in a direction perpendicular to the substrate, the edges of the first sub-isolation structure and the second isolation structure are substantially flush; forming a first defining layer on a side of the initial partition structure away from the base substrate, and patterning the first defining layer to form a first sub-defining portion, wherein in the third region, the first sub-defining portion covers a side surface of the initial partition structure and an upper surface thereof away from the base substrate; forming a second defining layer on a side of the first sub-defining portion away from the base substrate, and patterning the second defining layer and the first sub-defining portion to expose at least a portion of the initial partition structure; and The initial partition structure is patterned to form a partition structure, The partition structure includes a first isolation structure and a second isolation structure which are stacked, the second isolation structure is located on a side of the first isolation structure away from the base substrate, an edge of the second isolation structure protrudes relative to an edge of the first isolation structure, and the partition structure is configured to isolate at least one layer of a light-emitting functional layer of a sub-pixel, In the third region, a side wall of at least one of the partition structures is covered with at least one of at least a portion of the second defining layer and at least a portion of the first sub-defining portion.

20. The method according to claim 19, wherein: Patterning the first defining layer to form a first sub-defining portion includes: In the third region, portions of the first defining layer located between adjacent initial partition structures are removed; and portions of the first defining layer covering the side surfaces and the upper surface of the initial partition structure are thinned.

21. The method according to claim 20, wherein: In the third area, the first defining layer is patterned using a half-tone mask to remove the portion of the first defining layer located between the adjacent initial partition structures while thinning the portion of the first defining layer covering the side surface and the upper surface of the initial partition structure. The thickness of the first defining layer after thinning is 100-10000 angstroms.

22. The method according to claim 20 or 21, wherein: The formed second defining layer and the formed first sub-defining portion both include a portion located in the first region, and patterning the second defining layer and the first sub-defining portion to expose the initial partition structure includes: The second defining layer and the first sub-defining portion are patterned simultaneously, so that the second defining layer is removed in the third region while the defining structure is formed in the first region, and at least a portion of the first sub-defining portion covering the side surface of the initial partition structure and the upper surface thereof is removed, The defining structure includes a first sub-defining structure and a second sub-defining structure which are stacked, the first sub-defining structure is located on a side of the second sub-defining structure close to the base substrate, and an edge of the second sub-defining structure protrudes relative to an edge of the first sub-defining structure.

23. The method according to claim 22, wherein: In the third region, a portion of the first sub-defining portion covering the upper surface of the initial partition structure is removed, and a portion of the first sub-defining portion covering the side surface of the first sub-isolating structure in the initial partition structure is substantially removed.

24. The method according to claim 22 or 23, wherein: Before forming the initial partition structure on the base substrate, the manufacturing method further includes: In the third region, at least one layer of metal structure is patterned, wherein the metal structure and the initial partition structure are stacked, the metal structure is closer to the base substrate than the initial partition structure, and the orthographic projection of the initial partition structure on the base substrate falls into the orthographic projection of the metal structure on the base substrate.

25. The method according to claim 24, wherein: Patterning the first defining layer to form a first sub-defining portion further comprises: thinning a portion of the first defining layer covering a surface of the metal structure in the third region; Patterning the second defining layer and the first sub-defining portion to expose the initial partition structure also includes: simultaneously patterning the second defining layer and the first sub-defining portion so that in the third region, a portion of the first defining layer covering the surface of the metal structure is retained.

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