Display device

Abstract

A display device of the present disclosure includes a display panel including an active area having at least one circular portion, an inactive area disposed around the active area, and a connection area disposed in the inactive area, where the active area includes an anode electrode, a light emitting layer, and a cathode electrode, where the connection area includes a first electrode, a second electrode, and a third electrode. The passive region includes a gate driving portion and a crack prevention pattern, in which the connection region is disposed adjacent to the gate driving portion, and the cathode electrode and the connection electrode disposed over the gate driving portion are in contact with each other in the connection region, and in which the passive region further includes at least one dam structure, and at least one dam structure is disposed between the crack prevention pattern and the gate driving portion.

Description

[0001] This application is a divisional application of invention patent application No. 202011373583.4, with the filing date of November 30, 2020 and the invention name being “Display Device”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0164575, filed on December 11, 2019, which is hereby incorporated by reference in its entirety. Technical Field

[0004] The present disclosure relates to a display device.

[0005] Description of Related Technology

[0006] Recently, with the advent of the information age, the display field that visually expresses electrical information signals has been rapidly developed, and in response thereto, various display devices having excellent properties of thinness, light weight, and low power consumption have been developed.

[0007] Specific examples of the display device include a liquid crystal display device (LCD), an organic light emitting display device (OLED), a quantum dot display device, and the like.

[0008] OLED can include a display panel and multiple components for providing various functions. For example, one or more display drive circuits for controlling the display panel can be included in the display assembly. Examples of drive circuits include gate drivers, light-emitting (source) drivers, power (VDD) wiring, electrostatic discharge (ESD) circuits, multiplexing (MUX) circuits, data signal lines, cathode contacts, and external functional elements. Multiple peripheral circuits for providing various types of additional functions (e.g., touch sensing or fingerprint recognition functions) can be included in the display assembly. Some components can be arranged on the display panel itself, or can be arranged on an area adjacent to the display area as a non-display area and / or an inactive or non-active area. In addition, the organic light-emitting device used in the organic light-emitting display device is a self-luminous device, in which a light-emitting layer is formed between two electrodes. The organic light-emitting device is a device that emits light when an exciton falls from an excited state to a ground state, and the exciton is generated by injecting and combining electrons and holes from an electron injection electrode and a hole injection electrode, respectively, inside. The electron injection electrode may be the upper electrode or cathode, and the hole injection electrode may be the lower electrode or anode. The upper electrode needs to be connected to a low voltage supply line, and a contact structure for connection may be arranged in the inactive area.

[0009] The size of the display device is a very important factor in the design, and in particular, a high ratio of the size of the active area to the size of the passive area can be one of the main features, and the ratio of the size of the active area to the size of the passive area is called the ratio of the screen to the frame. However, arranging some of the above-mentioned components in the display assembly and arranging the contact structure of the upper electrode and the low voltage supply line outside requires a relatively large passive area. The contact structure of the upper electrode and the low voltage supply line arranged outside the component may be easily exposed to the penetration of external moisture generated at the trimming line (trimming line) in the outermost passive area of ​​the substrate or from the cracks at the trimming line of the substrate. Therefore, in order to protect the element from the penetration of external moisture, outside the contact structure of the upper electrode and the low voltage supply line, a certain distance from the trimming line of the substrate is required, and there are limitations in reducing the frame area. Summary of the invention

[0010] The inventors of the present disclosure have recognized that various technologies including the arrangement of components such as a gate driver or ESD and an optimal driving method are required in order to achieve a narrow frame that reduces the size of the passive area. Therefore, the inventors of the present disclosure have conducted various experiments on the arrangement of components that can well protect the organic light-emitting device in the active area while effectively using the space of the passive area. Through several experiments, a new structure in which a low voltage supply line and an upper electrode constituting the organic light-emitting device are in contact with each other was invented.

[0011] For example, an isolation region may be provided in an inactive region of an organic insulating layer, which is one of the paths through which moisture from outside penetrates the active region. The organic insulating layer has been removed outside the gate-in-panel (GIP) region of the inactive region to prevent moisture penetration, but the isolation region of the organic insulating layer may also be provided in the GIP region. If the planarization layer, the bank layer, and the spacer layer are removed within a certain period of time, the inorganic insulating layer may be the only path through the active region.

[0012] In addition, the connection structure of the upper electrode and the low voltage supply line can be set by using the isolation area of ​​the organic insulating layer. The upper electrode and the low voltage supply line can have a connection structure outside the GIP area, and since an additional space is required for the connection structure, there is a limitation in reducing the border area. As a way to reduce this limitation, the space of the border area can be saved by connecting the upper electrode and the intermediate connection electrode in the GIP area and connecting the intermediate connection electrode and the low voltage supply line outside the GIP area.

[0013] An intermediate connection electrode is required in order to simplify the connection structure of the upper electrode and the low voltage supply line while forming an isolation region of the organic insulating layer. If an isolation region of the organic insulating layer is formed in the GIP region, a hole as deep as the thickness of the organic insulating layer is created. When the upper electrode is formed in a deep hole, the upper electrode may be broken or insufficiently formed due to its thin thickness. In order to prevent this phenomenon, an intermediate connection electrode may be arranged in the hole region, and a contact guarantee region may be formed in which the upper electrode and the intermediate connection electrode may contact each other, thereby realizing a more stable connection structure.

[0014] Through these experiments, a display device capable of preventing moisture penetration while reducing an inactive area of ​​the display device can be realized.

[0015] Accordingly, the present disclosure is directed to a display device that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.

[0016] An object of the present disclosure is to provide an external structure of an organic light emitting display device.

[0017] Problems of the present disclosure are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

[0018] A display device according to an embodiment of the present disclosure includes: a display panel including an active area and an inactive area, wherein the active area includes an anode electrode, an organic light-emitting layer and a cathode electrode, and the inactive area includes a gate driving part and a crack prevention pattern, and also includes a contact area (or connection area) arranged in an area adjacent to the gate driving part, wherein in the contact area, the cathode electrode and the connection electrode above the gate driving part can contact each other.

[0019] In another aspect, a display device according to an embodiment of the present disclosure includes: a display panel including an active area and an inactive area, wherein the active area includes a thin film transistor, and a planarization layer, a first electrode, a dam layer, an organic light-emitting layer and a second electrode are sequentially arranged on the thin film transistor, wherein the inactive area includes a gate driving part, a dam structure and a crack prevention structure, and also includes a contact area in which a connecting electrode arranged above the gate driving part is connected to an extension of the second electrode.

[0020] In another aspect, a display device according to an embodiment of the present disclosure includes: a display panel, the display panel including an active area having at least one circular portion, an inactive area arranged around the active area, and a connection area arranged in the inactive area, wherein the active area includes an anode electrode, a light-emitting layer and a cathode electrode, wherein the inactive area includes a gate driving part and a crack prevention pattern, wherein the connection area is arranged to be adjacent to the gate driving part, and the cathode electrode and the connection electrode arranged above the gate driving part are in contact with each other in the connection area, and wherein the inactive area also includes at least one dam structure, and the at least one dam structure is arranged between the crack prevention pattern and the gate driving part.

[0021] Details of other implementations are included in the detailed description and accompanying drawings.

[0022] The display device according to the embodiment may have a structure for disconnecting the organic insulating layer connected to the active region in the inactive region, and moisture introduced from the outside may be prevented from reaching the organic light-emitting device in the active region. For example, a structure may be provided that partially removes the planarization layer and the bank layer above the gate driving part in the inactive region and disconnects the planarization layer and the bank layer, and a path through which moisture can penetrate may be blocked by further removing the inorganic insulating layer other than the planarization layer and the bank layer, thereby providing a display device resistant to moisture penetration.

[0023] An intermediate structure for electrically connecting the cathode electrode of the organic light-emitting device and the low voltage supply line arranged in the passive area can be provided in the structure for disconnecting the organic insulating layer in the passive area. For example, when the connection electrode is arranged in the isolation area of ​​the organic insulating layer and the cathode electrode is arranged above the connection electrode, the low voltage connection structure of the organic light-emitting device requiring additional space can be arranged to overlap with the gate driving part. This minimizes the border area, so that the user of the display device can use the device with the emission screen displayed substantially beautifully on the entire display device, and can provide the user with a display device with a better grip and light weight by using a compact module applying a narrow border.

[0024] Since the summary of the present invention described in terms of problems to be solved, means for solving the problems, and effects does not specify essential features of the claims, the scope of the claims is not limited by the description in the summary of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure, and together with the description serve to explain the principles of the present disclosure. In the drawings:

[0026] Figure 1 is a plan view of a display panel according to an embodiment of the present disclosure;

[0027] Figure 2 is along Figure 1 A cross-sectional view of a display panel according to an embodiment taken along a cutting line II';

[0028] Figure 3 is along Figure 1 A cross-sectional view of a display panel according to another embodiment taken along a cutting line II';

[0029] Figure 4 is along Figure 1 A cross-sectional view of a display panel according to another embodiment taken along a cutting line II'; and

[0030] Figure 5 is a plan view of a display panel to which the connection structure of the embodiment is applied. DETAILED DESCRIPTION

[0031] The advantages and technical features of the present disclosure and the methods for achieving the advantages and technical features will be explained with reference to the embodiments described in detail below and the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but will be implemented in various different forms. The embodiments make the disclosure of the present disclosure complete and fully understood by those of ordinary skill in the art. The present disclosure is limited only by the scope of the claims.

[0032] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings used to describe embodiments of the present invention are exemplary, and the present invention is not limited by the drawings. Throughout the specification, the same reference numerals refer to the same components. In addition, in the description of the present disclosure, when it is determined that the detailed description of the relevant known technology may unnecessarily obscure the subject matter of the present disclosure, its detailed description will be omitted. When "including", "having", "including", etc. are used in this specification, other parts may be added unless "only" is used. When a component is represented in the singular, the plural form is included unless otherwise specified.

[0033] When interpreting the components, they are interpreted as including the error range even if not explicitly described.

[0034] In the case of describing a positional relationship, for example, when the positional relationship of two parts is described as 'on', 'above', 'below', 'on one side', etc., unless 'just' or 'directly' is used, one or more other parts may be located between the two parts.

[0035] In the case of describing a temporal relationship, for example, when describing a temporal order relationship as 'after', 'continuously', 'next', 'before', etc., a discontinuous case may be included unless 'just' or 'directly' is used.

[0036] The terms 'first', 'second', etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, within the technical spirit of the present disclosure, the first component mentioned below may be the second component.

[0037] When describing the components of the present disclosure, terms such as 'first', 'second', 'A', 'B', '(a)', '(b)', etc. may be used. These terms are only used to distinguish the component from other components, and the nature, turn, sequence or number of the component is not limited by these terms. When a component is described as being "connected", "combined" or "contacting" to another component, the component is directly connected or contacting to the other component, but it should be understood that other components may be "interposed" between the two components, or the two components may be "connected", "combined" or "contacting" through other components.

[0038] In the present disclosure, "display device" may include a narrow sense display device having a display panel and a driving part for driving the display panel, for example, a liquid crystal module (LCM), an organic light emitting module (OLED module) and a quantum dot module (QD module). In addition, the display device may include a complete product or final product having an LCM, an OLED module or a QD module, such as a notebook computer, a television, a computer monitor, an equipment display including an automobile display device or different types of transportation, a mobile electronic device such as a smart phone or an electronic pad, a set of electronic devices, or a set of devices or a set of devices.

[0039] Therefore, the display apparatus of the present disclosure may include a narrow-sense display device itself such as an LCM, an OLED module, or a QD module, as well as an application product or a formal device as a final consumer device including an LCM, an OLED module, or a QD module.

[0040] In addition, in some cases, an LCM, an OLED module, or a QD module including a display panel and a driving part may be represented as a narrow “display device”, and an electronic device as a complete product including the LCM, the OLED module, or the QD module may be individually represented as a “formal device”. For example, a narrow display device may include a display panel such as an LC panel, an OLED panel, or a QD panel, and a source PCB as a control unit for driving the display panel, and a formal device may be a concept that also includes a formal PCB, which is a formal control unit electrically connected to the source PCB to control the entire formal device.

[0041] The display panel used in the embodiments of the present disclosure may include all types of display panels such as a liquid crystal display panel, an organic light emitting diode display panel, a quantum dot display panel, or an electroluminescent display panel, and is not limited to a specific display panel having a bendable frame with a flexible substrate for the OLED display panel of the present embodiment and a backplane support structure thereunder. In addition, the display panel used in the embodiments of the present disclosure is not limited to the shape or size of the display panel.

[0042] For example, when the display panel is an OLED display panel, the display panel may include a plurality of gate lines and data lines and pixels formed at the intersection of the gate lines and the data lines. In addition, the display panel may be configured to include: an array including a thin film transistor as an element for selectively applying a voltage to each pixel; an organic light-emitting device (OLED) layer on the array; an encapsulation substrate or encapsulation layer above the array to cover the organic light-emitting device layer, etc. The encapsulation layer can protect the thin film transistor and the organic light-emitting device layer from external impacts and prevent moisture or oxygen from penetrating into the organic light-emitting device layer. In addition, the inorganic light-emitting layer formed on the array may include, for example, a nano-sized material layer or quantum dots.

[0043] Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings.

[0044] In this disclosure, Figure 1 An exemplary organic light emitting diode (OLED) display panel 100 is shown that may be integrated in a display device.

[0045] Figure 1 is a plan view of a display panel according to an embodiment of the present disclosure. Figure 1 The OLED display panel 100 includes at least one active area AA, in which a light emitting device and an array for driving the light emitting device are formed.

[0046] The display panel 100 may include an inactive area arranged around the active area AA, and the top, bottom, left and right sides of the active area AA may be referred to as inactive areas. The active area AA may have a rectangular shape or may have a shape with a groove and rounded corners. Various types of display devices such as a circular, elliptical or polygonal shape may be applied to a smart watch or a display device for a vehicle. Therefore, the arrangement of the inactive area around the active area AA is not limited to Figure 1 OLED display panel 100 shown in FIG. Various components for driving the light emitting device and array formed in active area AA are arranged in passive areas on the left and right sides of active area AA, thereby providing a function for stable light emission. For example, in the passive areas on the left and right sides of active area AA, there may be: circuits such as gate-in-panel (GIP) circuit 300 and electrostatic discharge (ESD) circuit 500; an area of ​​contact between an upper electrode or cathode as part of the light emitting device and a low voltage supply line (VSS) 410 as a voltage reference point of the light emitting device; and a plurality of dam structures that prevent overflow to the outside of display panel 100 during the coating process of a particle compensation layer of an encapsulation layer for protecting the light emitting device from external moisture or particles. In addition, a crack prevention structure 460 may be arranged to prevent cracks that may occur during the scribing process of dividing the mother glass into individual display panels 100 from being transferred to the inside of the display panel 100.

[0047] The crack prevention structure 460 of the present disclosure can prevent the impact generated at the trimming line of the substrate 110 during the scribing process from reaching and damaging the GIP circuit 300, the ESD circuit 500 or the low voltage supply line 410 formed in the passive area, or prevent providing a moisture penetration path to the light emitting device or array formed in the active area AA, so that the growth of dark spots or the generation of pixel shrinkage can be prevented.

[0048] The crack stopper structure 460 may be configured as an inorganic layer or an organic layer, or may be configured as a multi-layer structure of an inorganic layer and an organic layer, but is not limited thereto. Figure 1 , it is shown that the crack stopper structure 460 is arranged in two long sides and one short side of the display panel 100, but is not limited thereto.

[0049] In the area adjacent to the trimming line of the substrate 110 outside the crack stopper structure 460, a part or all of the insulating layer such as the gate insulating layer (GI), the buffer layer, etc. deposited over the entire surface when the active area AA is formed may be etched. A small amount of the insulating layer remains on the substrate 110, or the upper surface of the substrate 110 is completely exposed by etching, so that the trimming impact cannot be transferred to the corresponding insulating layer.

[0050] The display panel 100 according to the example may include: a thin film transistor array substrate including a plurality of pixels defined by a plurality of gate lines and a plurality of data lines and a thin film transistor disposed in each pixel for driving each pixel; an organic light emitting device layer disposed on the thin film transistor array substrate; and an encapsulation layer covering the organic light emitting device layer. Here, the encapsulation layer protects the thin film transistor and the organic light emitting device layer from external impact and prevents moisture from penetrating the organic light emitting device layer.

[0051] Reference Figure 1 , an FPCB with an external power supply may be provided in the lower area of ​​the display panel 100, and the FPCB may be electrically connected to a pad 450 formed to receive a data drive signal or exchange a touch signal. A high voltage supply (VDD) line 420, a low voltage supply (VSS) line 410, and / or a data voltage line extending from the FPCB may be arranged. The low voltage supply line 410 is used to form a reference voltage for a device in the active area AA, and may be arranged to surround the active area AA to reduce impedance. The low voltage supply line 410 may be arranged to surround three sides of the active area AA except for one side where the pad 450 is arranged, and may have a connection structure for connecting to an upper electrode.

[0052] The data voltage line of the present disclosure may be routed to be connected to a data driver IC that generates a light emitting signal of the light emitting device.

[0053] The region where the above-mentioned pad 450 is arranged may be the second component forming portion. A portion of the low voltage supply line 410 and the high voltage supply line 420 may be arranged in the second component forming portion.

[0054] The member connected to the pad 450 formed on the upper surface of the display panel 100 is not limited to the FPCB, various members may be connected, and the pad 450 may be arranged on the upper surface or the rear surface of the display panel 100 .

[0055] The substrate 110 as the basis of the display panel 100 may be formed of various materials such as glass, metal or plastic. When the substrate 110 is a flexible substrate, the substrate 110 may include a polymer resin, such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC) or cellulose acetate propionate (CAP). In addition, the substrate 110 may have a structure including two plastic substrates and an inorganic layer between the two plastic substrates. The two plastic substrates may include the polymer resin mentioned above and may have the same thickness or different thicknesses. For example, each of the two plastic substrates may include polyimide and may have a thickness of 3 μm to 20 μm. The inorganic layer is a barrier layer that prevents the penetration of particles from the outside and may be a single layer or a multilayer including an inorganic material such as silicon nitride (SiNx) and / or silicon oxide (SiOx). The inorganic layer may have a thickness of about The thickness may be, but is not limited thereto.

[0056] Figure 2 Shows Figure 1 The thin film transistor 200 is arranged in the active area AA of the substrate 110. In addition to the thin film transistor 200, a display device electrically connected to the thin film transistor 200 may be arranged. Figure 2 In the embodiment of the present disclosure, the organic light-emitting device is shown as a display device. Hereinafter, it will be described that the display panel 100 according to the embodiment of the present disclosure includes an organic light-emitting device as a display device. The fact that the organic light-emitting device as a display device is electrically connected to the thin film transistor 200 can be understood as that the anode 240 included in the organic light-emitting device is electrically connected to the thin film transistor 200. The thin film transistor 200 may also be arranged in the inactive area IA of the periphery of the substrate 110. The thin film transistor 200 arranged in the inactive area IA may be a part of a circuit portion for controlling an electrical signal applied to the active area AA.

[0057] The thin film transistor 200 includes: a semiconductor layer 210 including amorphous silicon, polycrystalline silicon or an organic semiconductor material; a gate electrode 220; and a source / drain electrode 230. A buffer layer 120 formed of silicon oxide, silicon nitride or silicon oxynitride may be disposed on the substrate 100 to planarize the surface of the substrate 110 or prevent impurities from penetrating the semiconductor layer 210, and the semiconductor layer 210 may be disposed on the buffer layer 120.

[0058] The gate electrode 220 may be disposed above the semiconductor layer 210. The gate electrode 220 may be formed of one or more of, for example, aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and may be a single layer or multiple layers in consideration of adhesion to adjacent layers, surface flatness of layers to be stacked, and processability. At this time, a gate insulating layer 130 formed of silicon oxide, silicon nitride, or silicon oxynitride may be inserted between the semiconductor layer 210 and the gate electrode 220 to ensure insulation between the semiconductor layer 210 and the gate electrode 220. An inorganic insulating layer 140 may be disposed on the gate electrode 220. The inorganic insulating layer 140 may be formed of silicon oxide, silicon nitride, or silicon oxynitride, and may be a single layer or multiple layers.

[0059] The source / drain electrodes 230 are disposed on the inorganic insulating layer 140. The source / drain electrodes 230 are electrically connected to the semiconductor layer 210 through respective contact holes formed in the inorganic insulating layer 140 and the gate insulating layer 130.

[0060] The source / drain electrode 230 may be formed of one or more of, for example, aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and may be a single layer or a multilayer in consideration of conductivity.

[0061] A passivation layer (not shown) covering the thin film transistor 200 may be disposed to protect the thin film transistor 200 having such a structure. The passivation layer may be formed of, for example, an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride. The passivation layer may be a single layer or multiple layers.

[0062] A planarization layer 150 may be disposed on the passivation layer. Figure 2 When the organic light-emitting device is arranged on the thin film transistor 200 as shown in , the planarization layer 150 can be used to substantially planarize the upper portion of the passivation layer covering the thin film transistor 200. The planarization layer 150 may include an organic material, which includes, for example, a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a blend thereof, but is not limited thereto. In addition, although in Figure 2The planarization layer 150 is shown as a single layer, but various modifications such as multiple layers are possible. The display panel according to an embodiment of the present disclosure may have a passivation layer and a planarization layer 150, or may have a planarization layer 150 as needed. The planarization layer 150 may be referred to as a first insulating layer.

[0063] In the active area AA of the substrate 110, the organic light-emitting device includes an anode electrode 240, a cathode electrode 250, and a light-emitting layer interposed therebetween. Here, the organic light-emitting device is described as an organic material layer including the light-emitting layer, but can be more broadly considered to include the anode electrode 240 and the cathode electrode 250 as necessary elements for emitting light.

[0064] The planarization layer 150 includes an opening portion that exposes at least one of the source / drain electrodes 230 of the thin film transistor 200, and an anode electrode 240 electrically connected to one of the source / drain electrodes 230 through the opening portion is arranged on the planarization layer 150. The anode electrode 240 may be formed of a conductive material having a relatively high work function. The anode electrode 240 may be a (semi) transparent electrode or a reflective electrode. When the anode electrode 240 is a (semi) transparent electrode, the anode electrode 240 may include, for example, ITO, IZO, ZnO, In 2 O 3 When the anode electrode 240 is a reflective electrode, the anode electrode 240 may include a reflective layer formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or an alloy thereof and a reflective layer formed of ITO, IZO, ZnO, In 2 O 3 , IGO or AZO. However, the present disclosure is not limited thereto. The anode electrode 240 may include various materials and may have a single-layer or multi-layer structure. Various modifications may be made. Although described as the anode electrode 240 in the present embodiment, it may be referred to as a pixel electrode or a first electrode.

[0065] The bank layer 160 may be disposed on the planarization layer 150. The bank layer 160 is used to define a pixel by having an opening corresponding to each sub-pixel, that is, an opening through which at least a central portion of the anode electrode 240 is exposed. Figure 2 As shown in , the bank layer 160 increases the distance between the edge of the anode electrode 240 and the cathode electrode above the anode electrode 240, so that the bank layer 160 is used to prevent arcing at the edge of the anode electrode 240. The bank layer 160 can be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO), for example. The bank layer 160 can be referred to as a second insulating layer or a pixel defining layer.

[0066] The intermediate layer of the organic light-emitting device may include a low molecular weight or high molecular weight material. When the intermediate layer includes a low molecular weight material, the intermediate layer may have the following structure: wherein a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), an electron injection layer (EIL), etc. are stacked one by one or in a complex manner, and the intermediate layer may include various organic materials, such as copper phthalocyanine (CuPc), N,N-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (N,N'-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine: NPB), tri-8-hydroxyquinoline aluminum (Alq3), etc. These layers may be formed by a vacuum evaporation method.

[0067] When the intermediate layer includes a high molecular weight material, the intermediate layer may have a structure including a hole transport layer (HTL) and an emission layer (EML). In this case, the hole transport layer may include PEDOT, and the emission layer may include a polymer material such as PPV (polyphenylene vinylene) and polyfluorene. The intermediate layer may be formed by screen printing or inkjet printing or laser induced thermal imaging.

[0068] However, the intermediate layer is not necessarily limited thereto and may have various structures.

[0069] The cathode electrode 250 is disposed above the active area AA and Figure 2 As shown in , the cathode electrode 250 may be arranged to cover the active area AA. That is, the cathode electrode 250 may be integrally formed with respect to a plurality of organic light-emitting devices and may correspond to a plurality of anode electrodes 240. The cathode electrode 250 may be a (semi) transparent electrode or a reflective electrode.

[0070] When the cathode electrode 250 is a (semi) transparent electrode, the cathode electrode 250 may have a layer formed of a metal having a relatively low work function, such as Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, or an alloy thereof, and a layer formed of ITO, IZO, ZnO, In 2 O 3 When the cathode electrode 250 is a reflective electrode, the cathode electrode 250 may have a layer formed of Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg or an alloy thereof. However, the configuration and material of the cathode electrode 250 are not limited thereto, and various modifications may be made.

[0071] Since a display device such as an organic light-emitting device includes a cathode electrode 250, a predetermined electrical signal needs to be applied to the cathode electrode 250 in order to display an image. Therefore, the low voltage supply line 410 is located in the inactive area IA to transmit the predetermined electrical signal to the cathode electrode 250. Although described as the cathode electrode 250 in the present embodiment, it may be referred to as a cathode, an opposing electrode, an upper electrode, or a second electrode.

[0072] Reference Figure 2 , you can see along Figure 1 A cross section of the inactive area IA arranged on one side of the active area AA of the cutting line II'. In the inactive area IA, the gate driving part 300, the plurality of dam structures 170 and the crack stopping structure 460 may be arranged in sequence adjacent to the active area AA. The gate driving part 300 may be a GIP circuit. The gate driving part 300 may include an emission signal driving unit 310, a scan signal driving unit 320 and a linking unit 330. The circuit configuration may vary according to the configuration of the organic light-emitting device, and the gate driving part 300 may transmit at least one emission control signal and at least one scan control signal to a sub-pixel including the organic light-emitting device. The linking unit 330 may be arranged between the emission signal driving unit 310 and the organic light-emitting device and between the scan signal driving unit 320 and the organic light-emitting device for transmitting signals. Each of the emission signal driving unit 310 and the scan signal driving unit 320 may include a plurality of transistors and at least one capacitor.

[0073] As described in the active area AA, the planarization layer 150 may be disposed on the gate driving part 300, and a metal layer formed of the same material as the anode electrode 240 may be disposed on the planarization layer 150. The metal layer formed of the same material as the anode electrode 240 may be referred to as a connection electrode 740. At least one degassing pattern 750 may be provided in the connection electrode 740. The degassing pattern 750 may be disposed in the inactive area IA and may have a structure for discharging hydrogen (H 2 ) pore shape, the hydrogen (H 2 ) may be generated in the planarization layer 150 during a heat treatment process in a process for manufacturing the display panel 100. The connection electrode 740 and the degassing pattern 750 may overlap the gate driving portion 300 of the inactive area IA in at least some sections. The bank layer 160 disposed in the active area AA may extend over the connection electrode 740 in the inactive area IA. The cathode electrode 250 disposed in the active area AA may extend over the bank layer 160 in the inactive area IA.

[0074] Reference Figure 2, the gate driving part 300 includes an emission signal driving unit 310 and a scan signal driving unit 320, and for example, the emission signal driving unit 310 may be arranged outside the scan signal driving unit 320. That is, the scan signal driving unit 320 may be arranged between the emission signal driving unit 310 and the active area AA. However, the positions of the emission signal driving unit 310 and the scan signal driving unit 320 are not limited thereto. In order to prevent moisture from penetrating from the outside, an isolation structure may be formed between the emission signal driving unit 310 and the scan signal driving unit 320 so that portions of the planarization layer 150 and the bank layer 160, which are the main paths of moisture, are disconnected. For example, the planarization layer 150 and the bank layer 160 may be etched to form a hole exposing the inorganic insulating layer 140 or the gate insulating layer 130. External moisture passing through the planarization layer 150 and the bank layer 160 cannot move at the etched portion. The connecting electrode 740 and the cathode electrode 250 may be arranged on the hole. The structure in which the connection electrode 740 and the cathode electrode 250 are arranged in the etched portion of the planarization layer 150 and the bank layer 160 and connected to each other may be a contact region 600. The contact region 600 may include a contact guarantee region 610 and a contact hole 620. The cathode electrode 250 and the connection electrode 740 may be electrically contacted with each other through the contact region 600, and the connection electrode 740 may extend to the periphery of the inactive region 1A to be connected to the low voltage supply line 410. A plurality of dam structures 170 may be arranged near the region where the connection electrode 740 and the low voltage supply line 410 are connected. The plurality of dam structures 170 may form an encapsulation layer to prevent penetration of external moisture after forming an organic light-emitting device. The dam structure 170 may prevent the organic layer of the encapsulation layer from flowing downward to the periphery of the substrate 110. The above-mentioned crack prevention structure 460 may be arranged to be spaced apart from the plurality of dam structures 170 toward the periphery of the substrate 110 by a predetermined distance.

[0075] In order to prevent the penetration of external moisture, the contact area 600 can be used to cut off the organic insulating layer, which is the main path for moisture penetration, so that the extension of the organic insulating layer to the active area AA is disconnected. In addition, the electrical connection point of the cathode electrode 250 and the connecting electrode 740 can be moved from the outside to the inside of the gate driving part 300. The electrical connection point of the cathode electrode 250 and the connecting electrode 740 arranged outside the gate driving part 300 can be moved to the inside of the gate driving part 300, so that the space occupied by the border area can be reduced. The contact area 600 can be arranged to overlap with the area where the gate driving part 300 is arranged, and thus the plurality of dam structures 170 and the crack prevention structure 460 can be arranged closer to the active area AA.

[0076] The contact region 600 may have a stepped structure so that the cathode electrode 250 and the connection electrode 740 may be in good contact with each other. For example, the width of the first isolation structure for disconnecting the planarization layer 150 may be different from the width of the second isolation structure for disconnecting the bank layer 160. The width of the second isolation structure of the bank layer 160 may be wider than the width of the first isolation structure of the planarization layer 150, so that the connection electrode 740 may be formed along the first isolation structure of the planarization layer 150. Figure 2 As shown in , when the cathode electrode 250 is formed along the second isolation structure of the embankment layer 160, it can be seen that the connecting electrode 740 and the cathode electrode 250 can have a certain step shape and contact each other. The area where the width of the first isolation structure of the planarization layer 150 and the width of the second isolation structure of the embankment layer 160 are different can be referred to as the contact guarantee area 610. If the planarization layer 150 and the embankment layer 160 are etched at the same time, the process can be simple. However, the connecting electrode 740 and the cathode electrode 250 may have to be connected to each other through the vertical sidewalls of the isolation structure. In addition, the bottom area of ​​the isolation structure may be very narrow. For example, considering that a residual layer may be left in the planarization layer 150 when the first isolation structure of the planarization layer 150 is formed, over-etching may be performed until the inorganic insulating layer 140 below the planarization layer 150. At this time, the isolation structure of the etched inorganic insulating layer 140 can be formed to be small. When considering that the cathode electrode 250 is formed to be very thin to about 100 to When the thickness of the isolation structure is greater than or equal to 0.1, the cathode electrode 250 and the connection electrode 740 may not be in stable electrical contact with each other through the side wall or the bottom of the isolation structure. In order to make the cathode electrode 250 and the connection electrode 740 in stable contact, a contact guarantee area 610 may be arranged. The isolation structures of the planarization layer 150 and the embankment layer 160 may be formed separately by respective processes. By making the center of the isolation structure or the width of the isolation structure different, a portion where the connection electrode 740 is formed flat on the planarization layer 150 may be formed. When the cathode electrode 250 is formed on the portion where the connection electrode 740 is formed flat, a more stable contact may be achieved.

[0077] The contact assurance region 610 may be arranged near the active area AA relative to the center of the contact region 600. The closer the contact between the cathode electrode 250 and the connection electrode 740 is to the active area AA, the more favorable it is for the impedance of the cathode electrode 250, and the contact point of the cathode electrode 250 and the connection electrode 740 is protected from external moisture penetration.

[0078] The contact area 600 may be disposed between the emission signal driving unit 310 and the scan signal driving unit 320 of the gate driving part 300. Since the contact area 600 is close to the active area AA just like the space of the emission signal driving unit 310, there are advantages that the space of the frame area can be saved and the penetration of external moisture can be prevented at the periphery of the gate driving part 300. However, for the spatial arrangement, it is necessary to change the design of the gate driving part 300 and partially adjust the distance between the emission signal driving unit 310 and the scan signal driving unit 320 so as to dispose the contact area 600.

[0079] Reference Figure 1 , the contact region 600 may be arranged on the left and right sides of the active area AA where the gate driving part 300 is arranged. In addition, the contact region 600 may be arranged on the upper side of the active area AA and on the lower side of the active area AA where the pad 450 is arranged. On the other hand, since the gate driving part 300 may not be arranged on the upper and lower sides of the active area AA, the contact region 600 may be freely designed on the upper and lower sides of the active area AA regardless of the position of the gate driving part 300.

[0080] Figure 3 Shown along Figure 1 FIG. 1 is a cross section of the inactive area IA arranged on one side of the active area AA, along a cutting line II′. Figure 3 The description of the active region is Figure 2 The description of the active region is the same and will be omitted. Figure 3, in the inactive area IA, the gate driving part 300, the plurality of dam structures 170 and the crack stopping structure 46 may be sequentially arranged adjacent to the active area AA. The gate driving part 300 may be a GIP circuit. The gate driving part 300 may include an emission signal driving unit 310, a scan signal driving unit 320 and a link unit 330. The circuit configuration may vary according to the configuration of the organic light-emitting device, and the gate driving part 300 may transmit at least one emission control signal and at least one scan control signal to a sub-pixel including the organic light-emitting device. The link unit 330 may be arranged between the emission signal driving unit 310 and the organic light-emitting device and between the scan signal driving unit 320 and the organic light-emitting device for transmitting signals. Each of the emission signal driving unit 310 and the scan signal driving unit 320 may include a plurality of transistors and at least one capacitor. As described in the active area AA, the planarization layer 150 may be arranged on the gate driving part 300, and a metal layer formed of the same material as the anode electrode 240 may be arranged on the planarization layer 150. The metal layer formed of the same material as the anode electrode 240 may be referred to as a connection electrode 740. At least one degassing pattern 750 may be provided in the connection electrode 740. The degassing pattern 750 may be disposed in the inactive area IA and may have a structure for discharging hydrogen (H 2 ) pore shape, the hydrogen (H 2 ) may be generated in the planarization layer 150 during a heat treatment process in a process for manufacturing the display panel 100. The connection electrode 740 and the degassing pattern 750 may overlap the gate driving portion 300 of the inactive area IA in at least some sections. The bank layer 160 disposed in the active area AA may extend over the connection electrode 740 in the inactive area IA. The cathode electrode 250 disposed in the active area AA may extend over the bank layer 160 in the inactive area IA.

[0081] Reference Figure 3, the gate driving part 300 includes an emission signal driving unit 310 and a scan signal driving unit 320, and for example, the emission signal driving unit 310 may be arranged outside the scan signal driving unit 320. That is, the scan signal driving unit 320 may be arranged between the emission signal driving unit 310 and the active area AA. However, the positions of the emission signal driving unit 310 and the scan signal driving unit 320 are not limited thereto. In order to prevent moisture from penetrating from the outside, an isolation structure may be formed between the scan signal driving unit 320 and the link unit 330 so that portions of the planarization layer 150 and the bank layer 160, which are the main paths of moisture, are disconnected. For example, the planarization layer 150 and the bank layer 160 may be etched to form a hole exposing the inorganic insulating layer 140 or the gate insulating layer 130. External moisture passing through the planarization layer 150 and the bank layer 160 cannot move at the etched portion. The connecting electrode 740 and the cathode electrode 250 may be arranged on the hole. The structure in which the connection electrode 740 and the cathode electrode 250 are arranged in the etched portion of the planarization layer 150 and the bank layer 160 and connected to each other may be a contact region 600. The contact region 600 may include a contact guarantee region 610 and a contact hole 620. The cathode electrode 250 and the connection electrode 740 may be electrically contacted with each other through the contact region 600, and the connection electrode 740 may extend to the periphery of the inactive region 1A to be connected to the low voltage supply line 410. A plurality of dam structures 170 may be arranged near the region where the connection electrode 740 and the low voltage supply line 410 are connected. The plurality of dam structures 170 may form an encapsulation layer to prevent penetration of external moisture after forming an organic light-emitting device. The dam structure 170 may prevent the organic layer of the encapsulation layer from flowing downward to the periphery of the substrate 110. The above-mentioned crack prevention structure 460 may be arranged to be spaced apart from the plurality of dam structures 170 toward the periphery of the substrate 110 by a predetermined distance.

[0082] In order to prevent the penetration of external moisture, the contact area 600 can be used to cut off the organic insulating layer, which is the main path for moisture penetration, so that the extension of the organic insulating layer to the active area AA is disconnected. In addition, the electrical connection point of the cathode electrode 250 and the connecting electrode 740 can be moved from the outside to the inside of the gate driving part 300. The electrical connection point of the cathode electrode 250 and the connecting electrode 740 arranged outside the gate driving part 300 can be moved to the inside of the gate driving part 300, so that the space occupied by the border area can be reduced. The contact area 600 can be arranged to overlap with the area where the gate driving part 300 is arranged, and thus the plurality of dam structures 170 and the crack prevention structure 460 can be arranged closer to the active area AA.

[0083] The contact region 600 may have a stepped structure so that the cathode electrode 250 and the connection electrode 740 may be in good contact with each other. For example, the width of the first isolation structure for disconnecting the planarization layer 150 may be different from the width of the second isolation structure for disconnecting the bank layer 160. The width of the second isolation structure of the bank layer 160 may be wider than the width of the first isolation structure of the planarization layer 150, so that the connection electrode 740 may be formed along the first isolation structure of the planarization layer 150. Figure 3 As shown in , when the cathode electrode 250 is formed along the second isolation structure of the embankment layer 160, it can be seen that the connecting electrode 740 and the cathode electrode 250 can have a certain step shape and contact each other. The area where the width of the first isolation structure of the planarization layer 150 and the width of the second isolation structure of the embankment layer 160 are different can be referred to as the contact guarantee area 610. If the planarization layer 150 and the embankment layer 160 are etched at the same time, the process can be simple. However, the connecting electrode 740 and the cathode electrode 250 may have to be connected to each other through the vertical sidewalls of the isolation structure. In addition, the bottom area of ​​the isolation structure may be very narrow. For example, considering that a residual layer may be left in the planarization layer 150 when the first isolation structure of the planarization layer 150 is formed, over-etching may be performed until the inorganic insulating layer 140 below the planarization layer 150. At this time, the isolation structure of the etched inorganic insulating layer 140 can be formed to be small. When considering that the cathode electrode 250 is formed to be very thin to about 100 to When the thickness of the isolation structure is greater than or equal to 0.1, the cathode electrode 250 and the connection electrode 740 may not be in stable electrical contact with each other through the side wall or the bottom of the isolation structure. In order to make the cathode electrode 250 and the connection electrode 740 in stable contact, a contact guarantee area 610 may be arranged. The isolation structures of the planarization layer 150 and the embankment layer 160 may be formed separately by respective processes. By making the center of the isolation structure or the width of the isolation structure different, a portion where the connection electrode 740 is formed flat on the planarization layer 150 may be formed. When the cathode electrode 250 is formed on the portion where the connection electrode 740 is formed flat, a more stable contact may be achieved.

[0084] The contact assurance region 610 may be arranged near the active area AA relative to the center of the contact region 600. The closer the contact between the cathode electrode 250 and the connection electrode 740 is to the active area AA, the more favorable it is for the impedance of the cathode electrode 250, and the contact point of the cathode electrode 250 and the connection electrode 740 is protected from external moisture penetration.

[0085] The contact area 600 may be disposed between the scan signal driving unit 320 and the link unit 330 of the gate driving part 300. Since the contact area 600 is close to the active area AA as the space of the emission signal driving unit 310 and the scan signal driving unit 320, there are advantages in that the space of the frame area can be saved and the penetration of external moisture can be prevented in the middle of the gate driving part 300. Figure 2 Compared to the organic light emitting device, the contact area 600 is closer to the active area AA, so the infiltrated moisture can spread to an area relatively close to the organic light emitting device. Figure 2 In contrast, it may be advantageous that the cathode electrode 250 contacts the connection electrode 740 near the active area AA in terms of the resistance of the display panel 100. For example, the connection electrode 740 having a lower impedance than the cathode electrode 250 may have a lower resistance than the active area AA. Figure 2 The structure has a longer distance, thereby reducing the overall impedance of the low voltage supply line 410.

[0086] Reference Figure 1 , the contact region 600 may be arranged on the left and right sides of the active area AA where the gate driving part 300 is arranged. In addition, the contact region 600 may be arranged on the upper side of the active area AA and on the lower side of the active area AA where the pad 450 is arranged. On the other hand, since the gate driving part 300 may not be arranged on the upper and lower sides of the active area AA, the contact region 600 may be freely designed on the upper and lower sides of the active area AA regardless of the position of the gate driving part 300.

[0087] Figure 4 Shown along Figure 1 FIG. 1 is a cross section of the inactive area IA arranged on one side of the active area AA, along a cutting line II′. Figure 4 The description of the active region is Figure 2 and Figure 3 The description of the active region is the same and will be omitted. Figure 4, in the inactive area IA, the gate driving part 300, the plurality of dam structures 170, and the crack preventing structure 460 may be sequentially arranged adjacent to the active area AA. The gate driving part 300 may be a GIP circuit. The gate driving part 300 may include an emission signal driving unit 310, a scan signal driving unit 320, and a linking unit 330. The circuit configuration may vary according to the configuration of the organic light-emitting device, and the gate driving part 300 may transmit at least one emission control signal and at least one scan control signal to a sub-pixel including the organic light-emitting device. The linking unit 330 may be arranged between the emission signal driving unit 310 and the organic light-emitting device and between the scan signal driving unit 320 and the organic light-emitting device for transmitting signals. Each of the emission signal driving unit 310 and the scan signal driving unit 320 may include a plurality of transistors and at least one capacitor. As described in the active area AA, the planarization layer 150 may be arranged on the gate driving part 300, and a metal layer formed of the same material as the anode electrode 240 may be arranged on the planarization layer 150. The metal layer formed of the same material as the anode electrode 240 may be referred to as a connection electrode 740. At least one degassing pattern 750 may be provided in the connection electrode 740. The degassing pattern 750 may be disposed in the inactive area IA and may have a structure for discharging hydrogen (H 2 ) pore shape, the hydrogen (H 2 ) may be generated in the planarization layer 150 during a heat treatment process in a process for manufacturing the display panel 100. The connection electrode 740 and the degassing pattern 750 may overlap the gate driving portion 300 of the inactive area IA in at least some sections. The bank layer 160 disposed in the active area AA may extend over the connection electrode 740 in the inactive area IA. The cathode electrode 250 disposed in the active area AA may extend over the bank layer 160 in the inactive area IA.

[0088] Reference Figure 4, the gate driving part 300 includes an emission signal driving unit 310 and a scan signal driving unit 320, and for example, the emission signal driving unit 310 may be arranged outside the scan signal driving unit 320. That is, the scan signal driving unit 320 may be arranged between the emission signal driving unit 310 and the active area AA. However, the positions of the emission signal driving unit 310 and the scan signal driving unit 320 are not limited thereto. In order to prevent the penetration of moisture from the outside, an isolation structure may be formed between the link unit 330 and the active area AA so that the planarization layer 150 and the bank layer 160, which are the main paths of moisture, are disconnected. For example, the planarization layer 150 and the bank layer 160 may be etched to form a hole exposing the inorganic insulating layer 140 or the gate insulating layer 130. External moisture passing through the planarization layer 150 and the bank layer 160 cannot move at the etched portion. The connecting electrode 740 and the cathode electrode 250 may be arranged on the hole. The structure in which the connection electrode 740 and the cathode electrode 250 are arranged in the etched portion of the planarization layer 150 and the bank layer 160 and connected to each other may be a contact region 600. The contact region 600 may include a contact guarantee region 610 and a contact hole 620. The cathode electrode 250 and the connection electrode 740 may be electrically contacted with each other through the contact region 600, and the connection electrode 740 may extend to the periphery of the inactive region 1A to be connected to the low voltage supply line 410. A plurality of dam structures 170 may be arranged near the region where the connection electrode 740 and the low voltage supply line 410 are connected. The plurality of dam structures 170 may form an encapsulation layer to prevent penetration of external moisture after forming an organic light-emitting device. The dam structure 170 may prevent the organic layer of the encapsulation layer from flowing downward to the periphery of the substrate 110. The above-mentioned crack prevention structure 460 may be arranged to be spaced apart from the plurality of dam structures 170 toward the periphery of the substrate 110 by a predetermined distance.

[0089] In order to prevent the penetration of external moisture, the contact area 600 can be used to cut off the organic insulating layer, which is the main path for moisture penetration, so that the extension of the organic insulating layer to the active area AA is disconnected. In addition, the electrical connection point of the cathode electrode 250 and the connecting electrode 740 can be moved from the outside to the inside of the gate driving part 300. The electrical connection point of the cathode electrode 250 and the connecting electrode 740 arranged outside the gate driving part 300 can be moved to the inside of the gate driving part 300, so that the space occupied by the border area can be reduced. The contact area 600 can be arranged to overlap with the area where the gate driving part 300 is arranged, and thus the plurality of dam structures 170 and the crack prevention structure 460 can be arranged closer to the active area AA.

[0090] The contact region 600 may have a stepped structure so that the cathode electrode 250 and the connection electrode 740 may be in good contact with each other. For example, the width of the first isolation structure for disconnecting the planarization layer 150 may be different from the width of the second isolation structure for disconnecting the bank layer 160. The width of the second isolation structure of the bank layer 160 may be wider than the width of the first isolation structure of the planarization layer 150, so that the connection electrode 740 may be formed along the first isolation structure of the planarization layer 150. Figure 4 As shown in , when the cathode electrode 250 is formed along the second isolation structure of the embankment layer 160, it can be seen that the connecting electrode 740 and the cathode electrode 250 can have a certain step shape and contact each other. The area where the width of the first isolation structure of the planarization layer 150 and the width of the second isolation structure of the embankment layer 160 are different can be referred to as the contact guarantee area 610. If the planarization layer 150 and the embankment layer 160 are etched at the same time, the process can be simple. However, the connecting electrode 740 and the cathode electrode 250 may have to be connected to each other through the vertical sidewalls of the isolation structure. In addition, the bottom area of ​​the isolation structure may be very narrow. For example, considering that a residual layer may be left in the planarization layer 150 when the first isolation structure of the planarization layer 150 is formed, over-etching may be performed until the inorganic insulating layer 140 below the planarization layer 150. At this time, the isolation structure of the etched inorganic insulating layer 140 can be formed to be small. When considering that the cathode electrode 250 is formed to be very thin to about 100 to When the thickness of the isolation structure is greater than or equal to 0.1, the cathode electrode 250 and the connection electrode 740 may not be in stable electrical contact with each other through the side wall or the bottom of the isolation structure. In order to make the cathode electrode 250 and the connection electrode 740 in stable contact, a contact guarantee area 610 may be arranged. The isolation structures of the planarization layer 150 and the embankment layer 160 may be formed separately by respective processes. By making the center of the isolation structure or the width of the isolation structure different, a portion where the connection electrode 740 is formed flat on the planarization layer 150 may be formed. When the cathode electrode 250 is formed on the portion where the connection electrode 740 is formed flat, a more stable contact may be achieved.

[0091] The contact assurance region 610 may be arranged near the active area AA relative to the center of the contact region 600. The closer the contact between the cathode electrode 250 and the connection electrode 740 is to the active area AA, the more favorable it is for the impedance of the cathode electrode 250, and the contact point of the cathode electrode 250 and the connection electrode 740 is protected from external moisture penetration.

[0092] The contact area 600 may be disposed between the link unit 330 of the gate driving part 300 and the active area AA. Since the contact area 600 is close to the active area AA as the space of the gate driving part 300, there are advantages in that the space of the frame area can be saved and the penetration of external moisture can be prevented around the gate driving part 300, that is, between the gate driving part 300 and the active area AA. Figure 2 and Figure 3 Compared to the contact area 600, the contact area 600 is closer to the active area AA, so the infiltrated moisture can spread to the area close to the organic light emitting device. Figure 2 and Figure 3 In contrast, it may be advantageous that the cathode electrode 250 contacts the connection electrode 740 near the active area AA in terms of the resistance of the display panel 100. For example, the connection electrode 740 having a lower impedance than the cathode electrode 250 may have a lower resistance than the active area AA. Figure 2 and Figure 3 The structure of the gate driving part 300 has a longer distance, thereby reducing the total impedance of the low voltage supply line 410. In addition, since the contact area 600 is formed in a relatively large area between the gate driving part 300 and the active area AA, it can be minimized to change the design of the gate driving part 300. In addition, the space of the frame can be saved to the greatest extent, thereby realizing an extreme design of a narrow frame.

[0093] Reference Figure 1 , the contact region 600 may be arranged to surround four sides of the active area AA.

[0094] Figure 5 The plane of the display panel 100 is shown. Figure 1 The contact region 600 is omitted in the figure. The contact region 600 may be arranged on the left and right sides of the active region AA where the gate driving part 300 is arranged, but is not limited thereto. For example, the contact region 600 may also be arranged on the upper and lower sides of the active region AA, thereby surrounding the four sides of the active region AA.

[0095] Display apparatuses according to embodiments of the present disclosure include a liquid crystal display device (LCD), a field emission display device (FED), an organic light emitting display device (OLED), and a quantum dot display device.

[0096] A display device according to an embodiment of the present disclosure may include a complete product or final product having an LCM or OLED module, such as a laptop computer, a television, a computer monitor, an equipment display device including an automobile display device or different types of transportation, a formal electronic device device of a mobile electronic device device such as a smartphone or an electronic tablet, or a formal device or formal device.

[0097] A display device according to an embodiment of the present disclosure may be described as follows.

[0098] A display device according to an embodiment of the present disclosure may include: a display panel including an active area, an inactive area arranged around the active area, and a connection area arranged in the inactive area, wherein the active area may include an anode electrode, a light-emitting layer, and a cathode electrode, wherein the inactive area may include a gate driving part and a crack prevention pattern, and wherein the connection area may be arranged to be adjacent to the gate driving part, and the cathode electrode and the connection electrode arranged above the gate driving part may contact each other in the connection area.

[0099] In the display device according to the embodiment of the present disclosure, the anode electrode and the connection electrode may be formed of the same material.

[0100] In the display device according to the embodiment of the present disclosure, the gate driving part may include an emission signal driving unit, a scan signal driving unit, and a link unit.

[0101] In the display device according to an embodiment of the present disclosure, the connection region may be disposed between the emission signal driving unit and the scan signal driving unit.

[0102] In the display device according to an embodiment of the present disclosure, the connection region may include a contact hole and a connection auxiliary region.

[0103] In the display device according to an embodiment of the present disclosure, a connection auxiliary region may be disposed between the contact hole and the active region.

[0104] In the display device according to an embodiment of the present disclosure, the connection region may be disposed between the scan signal driving unit and the link unit.

[0105] In the display device according to an embodiment of the present disclosure, the connection region may be disposed between the link unit and the active region.

[0106] In the display device according to an embodiment of the present disclosure, the inactive region may further include a low voltage supply line and a dam structure, and the connection electrode may be connected to the low voltage supply line in a region adjacent to the dam structure.

[0107] In the display device according to an embodiment of the present disclosure, the inactive region may include a bank layer and a planarization layer extending from the active region, and the connection region may include a first portion where the planarization layer is removed and a second portion where the bank layer is removed in the inactive region.

[0108] In the display device according to an embodiment of the present disclosure, the first portion and the second portion may have different widths.

[0109] A display device according to an embodiment of the present disclosure may include: a display panel including an active area and an inactive area; an active area including a thin film transistor, on which a planarization layer, a first electrode, a dam layer, a light-emitting layer and a second electrode are sequentially arranged; an inactive area including a gate driving part, a dam structure and a crack prevention structure; and a connecting area, in which a connecting electrode arranged on the gate driving part is connected to an extension of the second electrode.

[0110] In the display device according to an embodiment of the present disclosure, the gate driving part may include an emission signal driving unit, a scan signal driving unit, and a link unit, and the connection region may be disposed between the emission signal driving unit and the scan signal driving unit.

[0111] In the display device according to an embodiment of the present disclosure, the gate driving part may include an emission signal driving unit, a scan signal driving unit, and a link unit, and the connection region may be disposed between the scan signal driving unit and the link unit.

[0112] In a display device according to an embodiment of the present disclosure, a connection area may include a first part and a second part, wherein the first part has a first width and the second part has a second width, and wherein the first width and the second width are different from each other, and due to the difference between the first width and the second width, the connection area also includes a connection auxiliary area, which is arranged on a planarization layer exposed in an area where the embankment layer is removed.

[0113] In the display device according to an embodiment of the present disclosure, the connection auxiliary area may be disposed closer to the active area than the center of the connection area.

[0114] In the display device according to the embodiment of the present disclosure, the first electrode and the connection electrode may be formed of the same material.

[0115] In the display device according to an embodiment of the present disclosure, the inactive area may further include a low voltage supply line, wherein at least a portion of the low voltage supply line is arranged under the dam structure, and the connection electrode may be connected to the low voltage supply line around the dam structure.

[0116] The features, structures, effects, etc. described in the examples of the present application are included in at least one example and are not necessarily limited to one example. In addition, those skilled in the art to which the present application belongs may combine or modify the features, structures, effects, etc. illustrated in at least one example of the present application into other examples. Therefore, the contents related to such combinations and modifications should be understood to be included in the scope of the present application.

[0117] The present application is not limited to the above-mentioned embodiments and drawings, and it will be obvious to those skilled in the art that various substitutions, modifications and changes can be made without departing from the technical spirit or scope of the present application. Therefore, the scope of the present application is indicated by the claims to be described later, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as included in the scope of the present application.

[0118] In addition, the embodiments of the present invention further include:

[0119] (1) A display device comprising:

[0120] The display panel comprises an active area, a passive area arranged around the active area, and a connection area arranged in the passive area.

[0121] Wherein, the active region includes an anode electrode, a light-emitting layer and a cathode electrode,

[0122] Wherein, the passive region includes a gate driving portion and a crack prevention pattern, and

[0123] The connection region is disposed adjacent to the gate driving portion, and the cathode electrode and a connection electrode disposed above the gate driving portion are in contact with each other in the connection region.

[0124] (2) The display device according to (1), wherein the anode electrode and the connection electrode are formed of the same material.

[0125] (3) The display device according to (1), wherein the gate driving part includes an emission signal driving unit, a scanning signal driving unit, and a link unit.

[0126] (4) The display device according to (3), wherein the connection region is arranged between the emission signal driving unit and the scanning signal driving unit.

[0127] (5) The display device according to (1), wherein the connection region includes a contact hole and a connection auxiliary region.

[0128] (6) The display device according to (5), wherein the connection auxiliary region is arranged between the contact hole and the active region.

[0129] (7) The display device according to (3), wherein the connection region is arranged between the scan signal driving unit and the link unit.

[0130] (8) The display device according to (3), wherein the connection region is disposed between the link unit and the active region.

[0131] (9) The display device according to (1), wherein the inactive area further includes a low voltage supply line and a dam structure, and

[0132] The connection electrode is connected to the low voltage supply line in a region adjacent to the dam structure.

[0133] (10) The display device according to (1), wherein the inactive region includes a bank layer and a planarization layer extending from the active region, and

[0134] The connection region includes the passive region where the first portion of the planarization layer is removed and the second portion of the bank layer is removed.

[0135] (11) The display device according to (10), wherein the first portion and the second portion have different widths.

[0136] (12) A display device comprising:

[0137] A display panel including an active area and a passive area;

[0138] a thin film transistor in the active region;

[0139] A planarization layer, a first electrode, a bank layer, a light-emitting layer and a second electrode arranged on the thin film transistor;

[0140] a gate driving portion, a dam structure and a crack stop structure in the inactive region; and

[0141] A connection region in which a connection electrode disposed above the gate driving portion is connected to an extension of the second electrode.

[0142] (13) The display device according to (12), wherein the gate driving part includes an emission signal driving unit, a scanning signal driving unit and a linking unit, and

[0143] Wherein, the connection area is arranged between the emission signal driving unit and the scanning signal driving unit.

[0144] (14) The display device according to (12), wherein the gate driving part includes an emission signal driving unit, a scanning signal driving unit and a linking unit, and

[0145] Wherein, the connection area is arranged between the scan signal driving unit and the link unit.

[0146] (15) The display device according to (13), wherein the connection area includes a first portion and a second portion,

[0147] wherein the first portion has a first width and the second portion has a second width, and

[0148] The first width and the second width are different from each other, and due to the difference between the first width and the second width, the connection region further includes a connection auxiliary region disposed on the planarization layer exposed in the region where the bank layer is removed.

[0149] (16) The display device according to (15), wherein the connection auxiliary area is arranged closer to the active area than a center of the connection area.

[0150] (17) The display device according to (12), wherein the first electrode and the connecting electrode are formed of the same material.

[0151] (18) The display device according to (12), wherein the inactive area further includes a low voltage supply line,

[0152] wherein at least a portion of the low voltage supply line is arranged below the dam structure, and

[0153] The connection electrode surrounds the dam structure and is connected to the low voltage supply line.

Claims

1. A display device, comprising: a display panel, the display panel including an active region having at least one circular portion, a passive region disposed around the active region, and a connection region disposed in the passive region, wherein the active region includes an anode electrode, a light-emitting layer, and a cathode electrode, wherein the passive region includes a gate driving portion and a crack prevention pattern, wherein the connection region is disposed adjacent to the gate driving portion, and the cathode electrode and a connection electrode disposed above the gate driving portion are in contact with each other in the connection region, and wherein the passive region further includes at least one dam structure, and the at least one dam structure is disposed between the crack prevention pattern and the gate driving portion.

2. The display device according to claim 1, wherein, the connection region is disposed between the crack prevention pattern and the active region.

3. The display device according to claim 2, wherein, a distance between the connection region and the crack prevention pattern is different from a distance between the connection region and the active region.

4. The display device according to claim 2, wherein, the crack prevention pattern is spaced apart from the connection electrode and the cathode electrode.

5. The display device according to claim 1, wherein, the passive region further includes a low voltage supply line and a high voltage supply line.

6. The display device according to claim 5, wherein, the passive region further includes a driving portion that supplies a signal to the active region, and the driving portion is disposed on one side of the active region.

7. The display device according to claim 6, wherein, the low voltage supply line and the high voltage supply line extend along a boundary of the active region and are disposed on both sides of the driving portion.

8. The display device according to claim 5, wherein, the at least one dam structure includes a plurality of dam structures having different heights.

9. The display device according to claim 8, wherein, each of the plurality of dam structures includes a planarization layer and a bank layer.

10. The display device according to claim 9, wherein, the bank layer of at least one of the plurality of dam structures is in contact with a top surface and a side surface of the planarization layer of the at least one dam structure.

11. The display device according to claim 9, wherein, the connection electrode is in contact with a top surface and a side surface of the planarization layer of at least one of the plurality of dam structures.

12. The display device according to claim 11, wherein, the bank layer of the at least one of the plurality of dam structures is in contact with a top surface and a side surface of the connection electrode.

13. The display device according to claim 9, wherein, the low voltage supply line is disposed below the planarization layer of at least one of the plurality of dam structures.

14. The display device according to claim 1, wherein, the anode electrode and the connection electrode are formed of the same material.

15. The display device according to claim 1, wherein, The gate driving part includes a transmission signal driving unit, a scanning signal driving unit, and a linking unit.

16. The display device according to claim 15, wherein, the connection area is disposed between the transmission signal driving unit and the scanning signal driving unit.

17. The display device according to claim 15, wherein, the connection area is disposed between the scanning signal driving unit and the linking unit.

18. The display device according to claim 15, wherein, the connection area is disposed between the linking unit and the active area.

19. The display device according to claim 1, wherein, the connection area includes a contact hole and a connection auxiliary area.

20. The display device according to claim 19, wherein, the connection auxiliary area is disposed between the contact hole and the active area.

21. The display device according to claim 1, wherein, the passive area further includes a low voltage supply line, and wherein the connection electrode is connected to the low voltage supply line in an area adjacent to the at least one dam structure.

22. The display device according to claim 1, wherein, the passive area includes a planarization layer and a bank layer extending from the active area, and wherein the connection area where the cathode electrode and the connection electrode are in contact with each other includes a first part removing the planarization layer and a second part removing the bank layer in the passive area.

23. The display device according to claim 22, wherein, the first part and the second part have different widths.

24. The display device according to claim 22, wherein, the connection area further includes a part corresponding to the first part for removing the inorganic insulating layer under the planarization layer.

25. The display device according to claim 1, wherein, the passive area further includes a low voltage supply line connected to the connection electrode, and wherein the low voltage supply line is disposed between the crack prevention pattern and the connection area.

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