Display device and electronic equipment

Abstract

The invention discloses a display device and electronic equipment, the display device comprises a substrate, a packaging layer and a filling layer, the substrate is provided with a first area and a second area connected with the first area, the first area is provided with a circuit layer and a light emitting layer, and the second area is connected with a target edge of the substrate; the packaging layer comprises a first packaging part, the projection of the first packaging part in the first direction covers the light-emitting layer, and the projection of the first packaging part in the first direction at least partially covers the circuit layer; the filling layer is at least partially arranged in the second area, the filling layer is located between the edge of the first packaging part and the target edge in the second direction, the filling layer is connected with the first packaging part so that the side, facing the filling layer, of the first packaging part can be separated from the target edge, and the first direction is perpendicular to the second direction.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of display devices, and in particular, to a display device and an electronic device. Background Art

[0002] With the iterative development of intelligent electronic devices, foldable electronic devices have gradually become a new trend in the industry's development. This is mainly attributed to the fact that foldable electronic devices can meet users' demand for large-sized screens while also improving the portability of electronic devices. In related technologies, foldable electronic devices generally include a housing and a display device disposed in the housing. The housing includes a first housing and a second housing that are rotatably connected, and the form of the display device can be changed by rotating the first housing and the second housing.

[0003] The problem with the above-mentioned electronic device is that during the unfolding or folding process of the electronic device, the encapsulation layer on the display device is prone to failure due to cracks, thereby affecting the normal use of the display device. Summary of the Invention

[0004] In a first aspect, the present application provides a display device, which includes a substrate, an encapsulation layer, and a filling layer. The substrate has a first region and a second region connected to the first region. The first region is provided with a circuit layer and a light-emitting layer, and the second region is connected to a target edge of the substrate; the encapsulation layer includes a first encapsulation portion, and the projection of the first encapsulation portion along a first direction covers the light-emitting layer, and the projection of the first encapsulation portion along the first direction at least partially covers the circuit layer; the filling layer is at least partially disposed in the second region, the filling layer is located between the first encapsulation portion and the target edge along a second direction, and the filling layer is connected to the first encapsulation portion, so that one side of the first encapsulation portion facing the filling layer is separated from the target edge, and the first direction and the second direction are perpendicular to each other.

[0005] In a possible implementation manner of the present application, one side of the light-emitting layer facing the target edge is connected to the first encapsulation portion, so that the projection of the first encapsulation portion along the second direction covers the light-emitting layer, and one side of the circuit layer facing the target edge is connected to the filling layer, so that the projection of the filling layer along the second direction covers the circuit layer.

[0006] In a possible implementation manner of the present application, one side of both the light-emitting layer and the circuit layer facing the target edge is connected to the first encapsulation portion, so that the projection of the first encapsulation portion along the second direction covers the circuit layer and the light-emitting layer.

[0007] In a possible implementation manner of the present application, one side of the filling layer facing the target edge along the second direction is flush with the target edge, and one side of the filling layer facing away from the target edge along the second direction is connected to the first encapsulation portion.

[0008] In a possible implementation manner of the present application, the size of the first encapsulation portion along the first direction is less than or equal to the size of the filling layer along the first direction.

[0009] In a possible implementation manner of the present application, an overlapping area is formed between the projection of the filling layer in the first direction and the projection of the first encapsulation part in the first direction.

[0010] In a possible implementation manner of the present application, the encapsulation layer further includes a second encapsulation part, the second encapsulation part is arranged in the second area, along the second direction, one side of the second encapsulation part facing the target edge is flush with the target edge, the target edge has a bending part, the substrate can be folded through the bending part to change its shape, one side of the second encapsulation part facing away from the target edge is arranged at an interval from the first encapsulation part, and the filling layer is located between the first encapsulation part and the second encapsulation part to separate the first encapsulation part and the second encapsulation part.

[0011] In a possible implementation manner of the present application, multiple layers of filling layers are stacked in the first direction, the multiple layers of filling layers include a first filling layer and a second filling layer, and the materials of the first filling layer and the second filling layer are different.

[0012] In a possible implementation manner of the present application, the filling layer is an organic material, a groove is formed in the second area, one side of the filling layer facing the substrate is received in the groove, and the projection of the filling layer in the second direction covers the second encapsulation part.

[0013] In a second aspect, the present application provides an electronic device, the electronic device includes a housing and a display device, the housing includes a first housing and a second housing that are rotatably connected, the display device is arranged in the housing, the first housing and the second housing can change the shape of the display device by relative rotation, the display device includes a substrate, an encapsulation layer and a filling layer, the substrate has a first area and a second area connected to the first area, a circuit layer and a light-emitting layer are arranged in the first area, the second area is connected to the target edge of the substrate; the encapsulation layer includes a first encapsulation part, the projection of the first encapsulation part in the first direction covers the light-emitting layer, and the projection of the first encapsulation part in the first direction at least partially covers the circuit layer; the filling layer is at least partially arranged in the second area, the filling layer is located between the first encapsulation part and the target edge in the second direction, and the filling layer is connected to the first encapsulation part, so that one side of the first encapsulation part facing the filling layer is separated from the target edge, the target edge is arranged relative to the connection between the first housing and the second housing, and the first direction and the second direction are perpendicular to each other. Description of the Drawings

[0014] Figure 1 It is a schematic structural diagram of the electronic device provided by the embodiment of the present application;

[0015] Figure 2 It is Figure 1 the cross-sectional view taken along A-A in

[0016] Figure 3 It is Figure 1Schematic diagram of the middle substrate (first example);

[0017] Figure 4 For Figure 1 Schematic diagram of the middle substrate (second example);

[0018] Figure 5 For Figure 1 Schematic diagram of the middle substrate (third example);

[0019] Figure 6 Schematic diagram of the display device provided by the embodiment of the present application (first example);

[0020] Figure 7 Schematic diagram of the display device provided by the embodiment of the present application (second example);

[0021] Figure 8 Schematic diagram of the display device provided by the embodiment of the present application (third example);

[0022] Figure 9 Schematic diagram of the display device provided by the embodiment of the present application (fourth example);

[0023] Figure 10 Schematic diagram of the display device provided by the embodiment of the present application (fifth example);

[0024] Figure 11 Schematic diagram of the display device provided by the embodiment of the present application (sixth example);

[0025] Figure 12 Schematic diagram of the display device provided by the embodiment of the present application (seventh example);

[0026] Figure 13 Schematic diagram of the display device provided by the embodiment of the present application (eighth example);

[0027] Figure 14 Schematic diagram of the display device provided by the embodiment of the present application (ninth example);

[0028] Figure 15 Schematic diagram of the display device provided by the embodiment of the present application (tenth example);

[0029] Figure 16 Schematic diagram of the display device provided by the embodiment of the present application (eleventh example);

[0030] Figure 17 Schematic diagram of the display device provided by the embodiment of the present application (twelfth example);

[0031] Figure 18Schematic diagram of the display device provided by the embodiment of the present application (the thirteenth example);

[0032] Figure 19 Schematic diagram of the display device provided by the embodiment of the present application (the fourteenth example);

[0033] Figure 20 Schematic diagram of the display device provided by the embodiment of the present application (the fifteenth example);

[0034] Figure 21 Schematic diagram of the display device provided by the embodiment of the present application (the sixteenth example).

[0035] Reference numerals:

[0036] 1 - Housing; 11 - First housing; 12 - Second housing; 13 - Stripping bar; 2 - Display device; 2a - First part; 2b - Second part; 2c - Transition part; 21 - Substrate; 211 - First region; 212 - Second region; 213 - Target edge; 214 - Groove; 22 - Circuit layer; 221 - Thin film transistor region; 222 - Driving circuit; 223 - Protrusion; 23 - Light emitting layer; 24 - Encapsulation layer; 24a - First encapsulation part; 24b - Second encapsulation part; 241 - First chemical vapor deposition layer; 242 - Ink layer; 243 - Second chemical vapor deposition layer; 25 - Filling layer; 25a - First filling layer; 25b - Second filling layer. Detailed implementation manners

[0037] It should be noted that, without conflict, the embodiments in the present application and the technical features in the embodiments can be combined with each other. The detailed description in the specific implementation manners should be understood as an explanatory illustration of the purpose of the present application and should not be regarded as an improper limitation to the present application.

[0038] To make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the following will further describe the specific technical solutions of the present application in detail with reference to the accompanying drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application but are not used to limit the scope of the present application.

[0039] In the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise stated, the meaning of "a plurality" is two or more.

[0040] In addition, in the embodiments of the present application, orientation terms such as "upper", "lower", "left", and "right" are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and they can change accordingly with the change of the orientation in which the components in the drawings are placed.

[0041] In the embodiments of the present application, unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium.

[0042] In the embodiments of the present application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element.

[0043] In the embodiments of the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0044] With the iterative development of intelligent electronic devices, folding electronic devices have gradually become a new trend in the industry's development. This is mainly attributed to the fact that folding electronic devices can meet users' demands for large-sized screens while also improving the portability of electronic devices. In related technologies, folding electronic devices generally include a housing and a display device disposed in the housing. The housing includes a first housing and a second housing that are rotatably connected, and the form of the display device can be changed by rotating the first housing and the second housing. In addition, there is a pressing strip on the housing for limiting the edge of the display device. There is usually a gap between the pressing strip and the edge of the display device to reserve a moving space for the form change of the display device.

[0045] The problem with the above-mentioned electronic device is that foreign objects will enter the gap between the pressing strip and the edge of the display device. During the unfolding or folding process of the electronic device, the foreign objects will inevitably interact with the edge of the display device. Moreover, the edge of the encapsulation layer on the display device is flush with the edge of the display device, making the edge of the encapsulation layer prone to cracks due to direct force. Under the influence of the brittle characteristics of the encapsulation layer, the cracks at the edge of the encapsulation layer are likely to continue to extend through the entire encapsulation layer, causing large-area failure of the encapsulation layer, thereby affecting the normal use of the display device 2.

[0046] Therefore, an embodiment of the present application provides an electronic device. Here, it should be explained that the electronic device mentioned in the embodiment of the present application can be a mobile phone, a tablet computer, or a game console. The embodiment of the present application does not limit this.

[0047] In the embodiment of the present application, for the convenience of describing directions, refer to Figures 2 to 5 、 Figures 7 to 21 Both are marked with directions. Among them, the first direction is the thickness direction of the display device 2, and the second direction is perpendicular to the first direction. It should be noted that the second direction can be the length direction of the display device 2 or the width direction of the display device 2. The embodiment of the present application does not limit this. In the case where the electronic device is a foldable electronic device, the second direction can be parallel to the rotation axis when the electronic device is folded or perpendicular to the rotation axis when the electronic device is folded. The embodiment of the present application also does not limit this. In addition, the direction markings are only used to describe the present application, but not to limit the scope of the present application.

[0048] Refer to Figure 1 and Figure 2, the electronic device provided by the embodiment of the present application includes a housing 1 and a display device 2. The housing 1 includes a first housing body 11 and a second housing body 12 that are rotatably connected. The display device 2 is disposed in the housing 1. The first housing body 11 and the second housing body 12 can change the form of the display device 2 through relative rotation. The display device 2 includes a substrate 21, a packaging layer 24, and a filling layer 25. The substrate 21 has a first region 211 and a second region 212 connected to the first region 211. A circuit layer 22 and a light-emitting layer 23 are disposed in the first region 211. The second region 212 is connected to a target edge 213 of the substrate 21. The packaging layer 24 includes a first packaging portion 24a. The projection of the first packaging portion 24a in the first direction covers the light-emitting layer 23, and the projection of the first packaging portion 24a in the first direction at least partially covers the circuit layer 22. The filling layer 25 is at least partially disposed in the second region 212. The filling layer 25 is located between the edge of the first packaging portion 24a and the target edge 213 in the second direction, and the filling layer 25 is connected to the first packaging portion 24a, so that one side of the first packaging portion 24a facing the filling layer 25 is separated from the target edge 213. The target edge 213 is disposed relative to the connection between the first housing body 11 and the second housing body 12. The first direction is perpendicular to the second direction.

[0049] In the embodiment of the present application, the function of the housing 1 can be to provide a receiving space for the display device 2. Referring to Figure 1 and Figure 2 , the display device 2 may include a first part 2a, a second part 2b, and a transition part 2c located between the first part 2a and the second part 2b. When the display device 2 is located in the housing 1, the first part 2a may be located in the first housing body 11. The bar 13 at the first housing body 11 covers the edge of the first part 2a in the first direction to fix the first part 2a. The second part 2b may be located in the second housing body 12. The bar 13 at the second housing body 12 covers the edge of the second part 2b in the first direction to fix the second part 2b. The transition part 2c may be located at the connection between the first housing body 11 and the second housing body 12. The bar 13 at the connection covers the edge of the transition part 2c in the first direction to fix the transition part 2c. In this way, when the first housing body 11 and the second housing body 12 rotate relative to each other, the first part 2a can move with the first housing body 11, the second part 2b can move with the second housing body 12, and the transition part 2c will undergo a bending deformation to change the form of the display device 2, that is, to realize the unfolding or folding of the electronic device.

[0050] In the embodiments of the present application, when the first housing 11 and the second housing 12 rotate relative to each other, the gap between the pressure strip 13 and the edge of the display device 2 changes with the change of the folding angle. For example, when the display device 2 is folded inward, the pressure strip 13 moves outward to maintain the flatness and integrity of the display device 2. At this time, the gap between the pressure strip 13 and the display device 2 gradually increases. When the folding angle of the display device 2 reaches the maximum, the gap between the pressure strip 13 and the display device 2 also reaches the maximum. On the contrary, when the folding screen mobile phone is unfolded, the pressure strip 13 moves inward to adapt to the unfolding angle of the display device 2. As the unfolding angle of the display device 2 increases, the gap between the pressure strip 13 and the display device 2 gradually decreases. When the unfolding angle of the display device 2 reaches the maximum, the gap between the pressure strip 13 and the display device 2 also reaches the minimum.

[0051] In the embodiments of the present application, the substrate 21 is the basic material for manufacturing a Printed Circuit Board (PCB), and generally refers to a copper-clad laminate. As the basic layer of the display device 2, the substrate 21 provides physical support and protection for other layers of the display device 2, ensuring that the display device 2 can maintain a stable shape and performance when bent, folded or curled. The substrate 21 can be made by impregnating a reinforcing material (such as a glass fiber cloth) with a resin adhesive, then covering it with a copper foil, and undergoing high-temperature and high-pressure forming processing.

[0052] In the embodiments of the present application, the light-emitting layer 23 is the core layer of the display device 2, and its functions can be to generate light, display images, etc. The light-emitting layer 23 is usually composed of Organic Light-Emitting Diodes (OLEDs) and can emit light by itself.

[0053] In the embodiments of the present application, the function of the circuit layer 22 can be to control the current and voltage of the light-emitting layer 23 to achieve precise image display. Refer to Figure 3 and the circuit layer 22 may include a Thin-Film Transistor (TFT) region 221 and a driving circuit 222. Among them, the TFT region 221 is disposed opposite to the light-emitting layer 23 in the first direction. One thin-film transistor in the TFT region 221 can correspond to one pixel of the light-emitting layer 23, and the brightness of the corresponding pixel can be controlled by controlling the current of the thin-film transistor. The driving circuit 222 can be disposed on opposite sides of the TFT region 221 in the second direction. The driving circuit 222 can provide signals for the thin-film transistors to control the switching and current magnitude of the thin-film transistors, thereby controlling the brightness of the corresponding pixels.

[0054] In the embodiment of the present application, the function of the encapsulation layer 24 can be to protect the light-emitting layer 23 and the circuit layer 22 it covers, so as to prevent the intrusion of water, oxygen and dust, thereby extending the service life of the display device 2. The encapsulation layer 24 can be a multi-layer structure formed by an inorganic film / organic film.

[0055] In the embodiment of the present application, referring to Figure 4 , the encapsulation layer 24 can be disposed only in the first region 211 to provide protection for the circuit layer 22 and the light-emitting layer 23. Alternatively, referring to Figure 2 , the encapsulation layer 24 can also be disposed in both the first region 211 and the second region 212 at the same time, so that while the encapsulation layer 2 provides protection for the circuit layer 22 and the light-emitting layer 23, it can also provide protection for the covered part of the second region 212, increasing the protection area of the encapsulation layer 2 and improving the reliability of the display device 2 during use.

[0056] In the embodiment of the present application, referring to Figure 3 , a protrusion 223 can be provided at the edge of the circuit layer 22. On the one hand, the protrusion 223 can change the local structure of the encapsulation layer 24, affect the deposition and distribution of the encapsulation layer 24, and contribute to the formation of a more stable and denser encapsulation structure; on the other hand, the protrusion 223 can increase the contact area between the circuit layer 22 and the encapsulation layer 24, which helps to improve the adhesion of the encapsulation layer 24 on the circuit layer 22.

[0057] In the embodiment of the present application, there are various possible ways to set the protrusion 223 on the circuit layer 22. For example, the protrusion 223 can be integrally provided on the circuit layer 22, or can be fixed to the circuit layer 22 by bonding or other means. The embodiment of the present application does not limit this.

[0058] In the embodiment of the present application, referring to Figure 4 and Figure 5 , the protrusion 223 may not be provided at the edge of the circuit layer 22. In this way, the structural design of the circuit layer 22 can be simplified, the processing of the circuit layer 22 can be facilitated, and thus the processing cost of the display device 2 can be reduced.

[0059] In the embodiment of the present application, the filling layer 25 is located between the edge of the first encapsulation part 24a and the target edge 213 along the second direction, and the filling layer 25 is connected to the first encapsulation part 24a. Its function can be to separate the side of the first encapsulation part 24a facing the filling layer 25 from the target edge 213, so as to prevent cracks in the area corresponding to the target edge 213 along the first direction from extending to the first encapsulation part 24a, thereby improving the reliability of the first encapsulation part 24a during use. The material of the filling layer 25 is different from that of the first encapsulation part 24a. In this way, the bonding strength of the connection interface between the filling layer 25 and the first encapsulation part 24a will be lower than the strength of the filling layer 25 and the first encapsulation part 24a itself. The low-strength bonding interface is more likely to undergo plastic deformation, which helps to absorb energy and relieve the stress concentration at the crack tip, so that the crack can change direction or stop propagating when it extends to the connection interface.

[0060] In the embodiment of the present application, there are various possible structural forms of the target edge 213. For example, referring to Figure 6 , the target edge 213 can be the edge around the substrate 21; or, referring to Figure 7 , the target edge 213 can be the edge of the long side on the substrate 21, that is, the edge of the foldable side on the substrate 21; or, referring to Figure 8 , the target edge 213 can also be only the edge of the foldable part on the substrate 21. The present application does not limit the structural form of the target edge 213.

[0061] In the technical solution provided by the embodiment of the present application, the electronic device includes a housing 1 and a display device 2. Among them, the housing 1 includes a first housing 11 and a second housing 12 that are rotatably connected, and the display device 2 is disposed in the housing 1 for displaying images. During the use of the electronic device, the expansion and folding of the electronic device can be achieved through the relative rotation of the first housing 11 and the second housing 12, and at the same time, the form of the display device 2 can also be changed. The display device 2 includes a substrate 21, a packaging layer 24, and a filling layer 25. Among them, the substrate 21 serves as the base layer of the display device 2, and it can have a first region 211 and a second region 212 connected to the first region 211. Among them, the second region 212 is connected to the target edge 213 of the substrate 21. The first region 211 is provided with a light-emitting layer 23 and a circuit layer 22. The light-emitting layer 23 can be used to display images, and the circuit layer 22 can be used to control the light-emitting layer 23 so that the first region 211 can correspond to the image display area of the display device 2, and the second region 212 can serve as a transition region between the first region 211 and the target edge 213. When the display device 2 is disposed in the housing 1, the target edge 213 can be disposed opposite to the bead 13 on the housing 1 in a first direction. The packaging layer 24 includes a first packaging portion 24a. The projection of the first packaging portion 24a in the first direction covers the light-emitting layer 23, and the projection of the first packaging portion 24a in the first direction at least partially covers the circuit layer 22, so that the first packaging portion 24a can cover the light-emitting layer 23 and at least part of the circuit layer 22 in the first direction to protect the covered light-emitting layer 23 and circuit layer 22. The filling layer 25 is at least partially disposed in the second region 212. The filling layer 25 is located between the first packaging portion 24a and the target edge 213 in a second direction, and the filling layer 25 is connected to the first packaging portion 24a so that one side of the first packaging portion 24a facing the filling layer 25 is separated from the target edge 213. Under the separation of the filling layer 25, one side of the first packaging portion 24a facing the filling layer 25 can be kept at a distance from the target edge 213. The target edge 213 is disposed relative to the connection portion of the first housing 11 and the second housing 12. Here, the connection portion of the first housing 11 and the second housing 12 corresponds to the bending portion where the form of the display device 2 changes. During the expansion or folding of the electronic device, due to the large movement amplitude of the bending portion of the display device 2, the interaction force between the foreign matter and the edge of the bending portion of the display device 2 is large, resulting in a relatively high probability of cracks appearing at the edge of the bending portion of the display device 2. The target edge 213 is disposed relative to the connection portion of the first housing 11 and the second housing 12, so that the filling layer 25 can be located between the edge of the bending portion of the display device 2 and the first packaging portion 24a in the second direction. When cracks appear at the edge of the bending portion of the display device 2, the cracks can be prevented from extending to the first packaging portion 24a, thereby improving the reliability of the packaging layer 24 during use.

[0062] Compared with the solution in the related art where the edge of the encapsulation layer 24 on the display device 2 is flush with the edge of the display device 2, in the embodiment of the present application, the display device 2 includes an encapsulation layer 24 and a filling layer 25. Among them, the encapsulation layer 24 includes a first encapsulation part 24a, and the first encapsulation part 24a is used to provide protection for the circuit layer 22 and the light-emitting layer 23. The filling layer 25 is arranged between the target edge 213 and the first encapsulation part 24a along the second direction, so that the edge of the first encapsulation part 24a is kept at a distance from the target edge 213, and the target edge 213 is flush with the edge of the display device 2. In this way, on the one hand, when a crack appears at the edge of the display device 2, the crack will not extend to the first encapsulation part 24a under the barrier of the filling layer 25, improving the reliability of the encapsulation layer 24 during use; on the other hand, since the side of the first encapsulation part 24a facing the filling layer 25 is kept at a distance from the target edge 213, during the unfolding or folding process of the electronic device, the acting force of foreign objects on the display device 2 will not be directly transmitted to the edge of the first encapsulation part 24a, further reducing the probability of cracks appearing in the first encapsulation part 24a.

[0063] In addition, referring to Figure 2 and Figure 3 , the embodiment of the present application further provides a display device 2. The display device 2 includes a substrate 21, an encapsulation layer 24 and a filling layer 25. The substrate 21 has a first area 211 and a second area 212 connected to the first area 211. The first area 211 is provided with a circuit layer 22 and a light-emitting layer 23, and the second area 212 is connected to the target edge 213 of the substrate 21; the encapsulation layer 24 includes a first encapsulation part 24a, and the projection of the first encapsulation part 24a along the first direction covers the light-emitting layer 23, and the projection of the first encapsulation part 24a along the first direction at least partially covers the circuit layer 22; the filling layer 25 is at least partially arranged in the second area 212, and the filling layer 25 is located between the edge of the first encapsulation part 24a and the target edge 213 along the second direction, and the filling layer 25 is connected to the first encapsulation part 24a, so that the side of the first encapsulation part 24a facing the filling layer 25 is separated from the target edge 213, and the first direction is perpendicular to the second direction.

[0064] In the embodiment of the present application, referring to Figure 2 , the projection of the first encapsulation part 24a along the first direction may entirely cover the circuit layer 22. In this way, the first encapsulation part 24a can completely cover the light-emitting layer 23 and the circuit layer 22 in the first direction, improving the protection effect on the circuit layer 22 and the light-emitting layer 23, and further extending the service life of the display device 2. Or, referring to Figure 4, the projection of the first encapsulation part 24a along the first direction may also partially cover the circuit layer 22. In this way, while the first encapsulation part 24a provides protection to the covered circuit layer 22, the size of the first encapsulation part 24a in the second direction can be reduced, thereby increasing the distance between the first encapsulation part 24a and the target edge 213 in the second direction, and further reducing the influence of the foreign object force on the first encapsulation part 24a.

[0065] In the embodiments of the present application, referring to Figure 9 , the filling layer 25 may be entirely disposed in the second region 212, and the filling layer 25 entirely fills the space between the first encapsulation part 24a and the target edge 213, simplifying the filling manner of the filling layer 25, thereby reducing the production cost of the display device 2. Alternatively, referring to Figure 10 , the filling layer 25 may be partially disposed in the second region 212 and may also be disposed in the first region 211 at the same time, so that the size of the first encapsulation part 24a in the second direction can be reduced, and further reducing the influence of the foreign object force on the first encapsulation part 24a.

[0066] In the embodiments of the present application, there are various possibilities for the corresponding manner of the projection of the first encapsulation part 24a in the second direction with respect to the circuit layer 22 and the light-emitting layer 23. For example, referring to Figure 3 and Figure 4 , in a possible embodiment, the side of the light-emitting layer 23 facing the target edge 213 may be connected to the first encapsulation part 24a, so that the projection of the first encapsulation part 24a along the second direction covers the light-emitting layer 23, and the side of the circuit layer 22 facing the target edge 213 may be connected to the filling layer 25, so that the projection of the filling layer 25 along the second direction covers the circuit layer 22. Here, the projection of the first encapsulation part 24a along the second direction covers the light-emitting layer 23, so that the first encapsulation part 24a can only cover the light-emitting layer 23 in the second direction, reducing the size of the first encapsulation part 24a in the second direction, increasing the distance between the first encapsulation part 24a and the target edge 213 in the second direction, and further reducing the influence of the foreign object force on the first encapsulation part 24a. The projection of the filling layer 25 along the second direction covers the circuit layer 22, so that the filling layer 25 can cover the circuit layer 22 in the second direction, thereby providing a protection effect on the circuit layer 22.

[0067] In the embodiments of the present application, in the case where the side of the circuit layer 22 facing the target edge 213 is connected to the filling layer 25, referring to Figure 11, one side of the filling layer 25 facing away from the circuit layer 22 can be connected to the target edge 213. In this way, while the projection of the filling layer 25 along the second direction covers the circuit layer 22, the projection of the filling layer 25 along the first direction can also cover the second region, so that the filling layer 25 is completely filled between the first encapsulation part 24a and the target edge 213, improving the protection effect of the filling layer 25 on the circuit layer in the second direction. Or, when the side of the circuit layer 22 facing the target edge 213 is connected to the filling layer 25, referring to Figure 12 , one side of the filling layer 25 facing away from the circuit layer may not be connected to the target edge 213 either. In this way, other parts of the display device 2 can be arranged between the filling layer 25 and the target edge 213, increasing the design flexibility of the display device 2.

[0068] Referring to Figure 13 and Figure 14 , in another possible embodiment, the light-emitting layer 23 and the side of the circuit layer 22 facing the target edge 213 can both be connected to the first encapsulation part 24a, so that the projection of the first encapsulation part 24a along the second direction covers the circuit layer 22 and the light-emitting layer 23. In this way, the projection of the first encapsulation part 24a along the second direction can completely cover the circuit layer 22 and the light-emitting layer 23, improving the protection effect on the circuit layer 22 and the light-emitting layer 23 and further extending the service life of the display device 2. In the embodiments of the present application, when the side of the light-emitting layer 23 and the circuit layer 22 facing the target edge 213 are both connected to the first encapsulation part 24a, referring to Figure 13 , one side of the filling layer 25 facing away from the first encapsulation part 24a can be connected to the target edge 213. In this way, the filling layer 25 can be completely filled between the first encapsulation part 24a and the target edge 213, simplifying the structure of the display device 2 and reducing the production cost of the display device 2; or, referring to Figure 14 , one side of the filling layer 25 facing away from the first encapsulation part 24a may not be connected to the target edge 213 either, so that other parts of the display device 2 can be arranged between the filling layer 25 and the target edge 213, increasing the design flexibility of the display device 2.

[0069] Referring to Figure 11 , in the embodiments of the present application, the side of the filling layer 25 facing the target edge 213 along the second direction can be flush with the target edge 213, and the side of the filling layer 25 facing away from the target edge 213 along the second direction can be connected to the first encapsulation part 24a. In this way, the filling layer 25 can be entirely arranged between the side of the first encapsulation part 24a facing the filling layer 25 and the target edge 213, which can simplify the structure of the display device 2 and reduce the production cost of the display device 2.

[0070] In the embodiments of the present application, there are various possibilities for the relationship between the dimension of the first encapsulation part 24a in the first direction and the dimension of the filling layer 25 in the first direction. For example, the dimension of the first encapsulation part 24a in the first direction can be greater than the dimension of the filling layer 25 in the first direction, can be less than the dimension of the filling layer 25 in the first direction, or can be equal to the dimension of the filling layer 25 in the first direction. The embodiments of the present application do not limit this.

[0071] In a possible embodiment of the present application, the dimension of the first encapsulation part 24a in the first direction is less than or equal to the dimension of the filling layer 25 in the first direction. In this way, the projection of the filling layer 25 in the second direction can cover the first encapsulation part 24a, and can more comprehensively block cracks from extending to the first encapsulation part 24a in the second direction, thereby playing a better protective role for the first encapsulation part 24a.

[0072] In the embodiments of the present application, referring to Figure 14 , the dimension of the first encapsulation part 24a in the first direction can be less than the dimension of the filling layer 25 in the first direction. That is, the side of the filling layer 25 facing the substrate 21 can be lower than the corresponding side of the first encapsulation part 24a, and the side of the filling layer 25 facing away from the substrate 21 can be flush with the corresponding side of the first encapsulation part 24a. In this way, on the premise that the projection of the filling layer 25 in the second direction can cover the first encapsulation part 24a, the requirement for the dimensional processing accuracy of the filling layer 25 is reduced, and the production cost of the display device 2 is reduced. Or, referring to Figure 2 , the dimension of the first encapsulation part 24a in the first direction can be equal to the dimension of the filling layer 25 in the first direction. In this way, the opposite sides of the filling layer 25 in the first direction are respectively flush with the corresponding sides of the first encapsulation part 24a, and there is no need to process a recess on the surface of the substrate 21, reducing the processing procedures of the substrate 21 and helping to improve the production efficiency of the display device 2.

[0073] In the embodiments of the present application, the shape of the connection interface between the filling layer 25 and the first encapsulation part 24a has various possibilities. For example, referring to Figure 15 , the connection interface between the filling layer 25 and the first encapsulation part 24a can be an inclined surface; or, referring to Figure 14 , the connection interface between the filling layer 25 and the first encapsulation part 24a can be a plane; or, referring to Figure 16 , the connection interface between the filling layer 25 and the first encapsulation part 24a can be an arc surface; or, referring to Figure 13 , the connection interface between the filling layer 25 and the first encapsulation part 24a can be an irregular surface. The embodiments of the present application do not limit this.

[0074] Referring to Figure 13 、 Figure 15 、 Figure 16 and Figure 20, in a possible embodiment of the present application, an overlapping area is formed between the projection of the filling layer 25 in the first direction and the projection of the first encapsulation portion 24a in the first direction. In this way, the filling layer 25 can be connected to the first encapsulation portion 24a in a staggered manner along the first direction, so that the stress distribution at the connection interface between the filling layer 25 and the first encapsulation portion 24a is more uniform, reducing the phenomenon of stress concentration, thereby improving the structural stability of the display device 2.

[0075] In the embodiment of the present application, when an overlapping area is formed between the projection of the filling layer 25 in the first direction and the projection of the first encapsulation portion 24a in the first direction, referring to Figure 13 , the side of the filling layer 25 facing away from the first encapsulation portion 24a can be connected to the target edge 213. In this way, the filling layer 25 can completely fill between the first encapsulation portion 24a and the target edge 213, simplifying the structure of the display device 2 and reducing the production cost of the display device 2; or, referring to Figure 15 、 Figure 16 and Figure 20 , the side of the filling layer 25 facing away from the first encapsulation portion 24a may not be connected to the target edge 213, so that other parts of the display device 2 can be arranged between the filling layer 25 and the target edge 213, increasing the design flexibility of the display device 2.

[0076] In the embodiment of the present application, referring to Figure 18 、 Figure 19 、 Figure 20 and Figure 21, the encapsulation layer 24 may further include a second encapsulation portion 24b. The second encapsulation portion 24b may be disposed in the second region 212. Along the second direction, one side of the second encapsulation portion 24b facing the target edge 213 may be flush with the target edge 213. The target edge 213 has a bending portion, and the substrate 21 can be folded through the bending portion to change its form. One side of the second encapsulation portion 24b facing away from the target edge 213 is spaced apart from the first encapsulation portion 24a. The filling layer 25 is located between the first encapsulation portion 24a and the second encapsulation portion 24b to separate the first encapsulation portion 24a and the second encapsulation portion 24b. Here, the encapsulation layer 24 further includes the second encapsulation portion 24b. Along the second direction, one side of the second encapsulation portion 24b facing the target edge 213 is flush with the target edge 213. One side of the second encapsulation portion 24b facing the target edge 213 is connected to the filling layer 25, so that the projection of the second encapsulation portion 24b in the first direction covers the area between the filling layer 25 and the target edge 213 and provides protection for its covered area. The target edge 213 has a bending portion, and the substrate 21 can be folded through the bending portion to change its form. In this way, the substrate 21 can be folded through the bending portion at the target edge 213, thereby changing the form of the display device 2. In the case where cracks appear in the second encapsulation portion 24b due to stress, the filling layer 25 can block the cracks on the second encapsulation portion 24b from extending to the first encapsulation portion 24a, thereby reducing the possibility of the first encapsulation portion 24a failing due to the generation of cracks and improving the reliability of the display device 2 during use.

[0077] In the embodiments of the present application, with reference to Figure 17 , one side of the second encapsulation portion 24b facing the target edge 213 may not be flush with the target edge 213 either. In this way, when the display device 2 is installed in the housing 1, the overlapping area of the second encapsulation portion 24b and the bead 13 on the housing 1 in the first direction can be reduced, thereby reducing the probability of cracks generated in the second encapsulation portion 24b due to stress.

[0078] In the embodiments of the present application, the structural forms of the first encapsulation portion 24a and the second encapsulation portion 24b may be the same. For example, with reference to Figure 19 , along the first direction, both the first encapsulation portion 24a and the second encapsulation portion 24b may include a first chemical vapor deposition layer 241, an ink layer 242, and a second chemical vapor deposition layer 243. Among them, the first chemical vapor deposition layer 241 and the second chemical vapor deposition layer 243 can be deposited by chemical vapor deposition (CVD) technology. The ink layer 242 can be formed by ink jet printing (IJP) technology. The ink layer 242 is located between the first chemical vapor deposition layer 241 and the second chemical vapor deposition layer 243, and can make the stress distribution of the encapsulation layer 24 more uniform in the second direction. Or, with reference to Figure 20, along the first direction, the first encapsulation part 24a may include a first chemical vapor deposition layer 241, an ink layer 242, and a second chemical vapor deposition layer 243. The second encapsulation part 24b may include a first chemical vapor deposition layer 241 and a second chemical vapor deposition layer 243. The embodiments of the present application do not limit the structural forms of the first encapsulation part 24a and the second encapsulation part 24b.

[0079] In the embodiments of the present application, there are various possibilities for the material selection of the first chemical vapor deposition layer 241 and the second chemical vapor deposition layer 243. For example, the materials of the first chemical vapor deposition layer 241 and the second chemical vapor deposition layer 243 may be polysilicon, may also be silicon nitride, or may also be silicon dioxide. The embodiments of the present application do not limit this. Additionally, the materials of the first chemical vapor deposition layer 241 and the second chemical vapor deposition layer 243 may be the same or different. The embodiments of the present application do not limit this either.

[0080] In the embodiments of the present application, the function of the filling layer 25 is to separate the side of the first encapsulation part 24a facing the filling layer 25 from the target edge 213. Therefore, there are various possibilities for the structural form of the filling layer 25. For example, referring to Figure 14 , in a possible embodiment of the present application, the filling layer 25 is stacked in multiple layers along the first direction. The multiple layers of the filling layer 25 include a first filling layer 25a and a second filling layer 25b, and the materials of the first filling layer 25a and the second filling layer 25b are different. In this way, during the process of manufacturing the display device 2, the filling layer 25 can be formed synchronously through processes such as film formation, yellow light, etching, and manufacturing while depositing the filling layer 25, without the need to separately process the filling layer 25 after the deposition of the encapsulation layer 24 is completed, simplifying the production process of the display device 2 and improving the production efficiency of the display device 2.

[0081] In the embodiments of the present application, there are various possibilities for the number of layers of the filling layer 25 stacked along the first direction. For example, the filling layer 25 may be stacked three layers, five layers, or eight layers along the first direction. The embodiments of the present application do not limit this.

[0082] In the embodiments of the present application, there are various possibilities for the materials of the first filling layer 25a and the second filling layer 25b. For example, the material of the first filling layer 25a may be polysilicon, and the second filling layer 25b may be alumina; or, the first filling layer 25a may also be indium tin oxide, and the second filling layer 25b may be copper. The embodiments of the present application do not limit the materials of the first filling layer 25a and the second filling layer 25b.

[0083] In the embodiments of the present application, in the case where the filling layer 25 is stacked in multiple layers along the first direction, referring to Figure 14, in the second region 212, a groove 214 may be formed such that the side of the filling layer 25 facing the substrate 21 can be received in the groove 214; alternatively, the groove 214 may not be formed in the second region 212, such that the side of the filling layer 25 facing the substrate 21 is flush with the side of the second encapsulation portion 24b facing the substrate 21. The embodiments of the present application do not limit this.

[0084] Referring to Figure 21 , in another possible embodiment of the present application, the filling layer 25 may be an organic material, the second region 212 is formed with a groove 214, the side of the filling layer 25 facing the substrate 21 is received in the groove 214, and the projection of the filling layer 25 in the second direction covers the second encapsulation portion 24b. In this way, after the encapsulation layer 24 is deposited, a hole is etched in the encapsulation layer 24, and then an organic material is filled. Organic materials usually have good flexibility and stability. Using an organic material for the filling layer 25 can improve the bending performance and reliability of the display device 2. The second region 212 is formed with a groove 214, the side of the filling layer 25 facing the substrate 21 is received in the groove 214, and the projection of the filling layer 25 in the second direction covers the second encapsulation portion 24b. In this way, the filling layer 25 can better block the crack on the second encapsulation portion 24b from extending to the first encapsulation portion 24a, further reducing the possibility of the first encapsulation portion 24a failing due to cracks.

[0085] In the embodiments of the present application, when the filling layer 25 is an organic material, the organic material may be polyimide, may be a hydrocarbon, or may be an organic semiconductor. The embodiments of the present application do not limit this.

[0086] In the embodiments of the present application, when the filling layer 25 is an organic material, referring to Figure 20 , the groove 214 may not be formed in the second region 212, such that the side of the filling layer 25 facing the substrate 21 is flush with the side of the second encapsulation portion 24b facing the substrate 21. The embodiments of the present application do not limit this.

[0087] The serial numbers of the embodiments of the present application above are only for description and do not represent the superiority or inferiority of the embodiments. The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A display device, comprising: A substrate, the substrate having a first area and a second area connected to the first area, the first area being provided with a circuit layer and a light-emitting layer, and the second area being connected to a target edge of the substrate; an encapsulation layer, the encapsulation layer comprising a first encapsulation portion, a projection of the first encapsulation portion along a first direction covers the light-emitting layer, and a projection of the first encapsulation portion along the first direction at least partially covers the circuit layer; A filling layer, wherein the filling layer is at least partially arranged in the second area, the filling layer is located between the first packaging part and the target edge along the second direction, and the filling layer is connected to the first packaging part so that a side of the first packaging part facing the filling layer is separated from the target edge, and the first direction and the second direction are perpendicular to each other.

2. The display device according to claim 1, wherein a side of the light-emitting layer facing the target edge is connected to the first packaging portion so that a projection of the first packaging portion along the second direction covers the light-emitting layer, and a side of the circuit layer facing the target edge is connected to the filling layer so that a projection of the filling layer along the second direction covers the circuit layer. 3 . The display device according to claim 1 , wherein the light-emitting layer and the circuit layer are both connected to the first packaging portion on one side facing the target edge, so that a projection of the first packaging portion along the second direction covers the circuit layer and the light-emitting layer. 4 . The display device according to claim 1 , wherein a side of the filling layer along the second direction facing the target edge is flush with the target edge, and a side of the filling layer along the second direction facing away from the target edge is connected to the first packaging portion. 5 . The display device according to claim 1 , wherein a size of the first encapsulation portion along the first direction is smaller than or equal to a size of the filling layer along the first direction. 6 . The display device according to claim 1 , wherein an overlapping area is formed between a projection of the filling layer along the first direction and a projection of the first encapsulation portion along the first direction.

7. According to the display device described in any one of claims 1-3, the encapsulation layer also includes a second encapsulation part, the second encapsulation part is arranged in the second area, along the second direction, the side of the second encapsulation part facing the target edge is flush with the target edge, the target edge has a bending portion, and the substrate can be folded by the bending portion to change its shape, the side of the second encapsulation part facing away from the target edge is spaced apart from the first encapsulation part, and the filling layer is located between the first encapsulation part and the second encapsulation part to separate the first encapsulation part and the second encapsulation part. 8 . The display device according to claim 7 , wherein the filling layer comprises multiple layers stacked along the first direction, the multiple filling layers comprise a first filling layer and a second filling layer, and a material of the first filling layer is different from a material of the second filling layer.

9. The display device according to claim 7, wherein the filling layer is an organic material, a groove is formed in the second region, a side of the filling layer facing the substrate is accommodated in the groove, and a projection of the filling layer along the second direction covers the second packaging portion.

10. An electronic device, comprising: A housing, the housing comprising a first housing and a second housing that are rotatably connected; A display device, wherein the display device is arranged in the shell, the first shell and the second shell can change the shape of the display device by relative rotation, the display device includes a substrate, a packaging layer and a filling layer, the substrate has a first area and a second area connected to the first area, the first area is provided with a circuit layer and a light-emitting layer, and the second area is connected to a target edge of the substrate; the packaging layer includes a first packaging part, the projection of the first packaging part along the first direction covers the light-emitting layer, and the projection of the first packaging part along the first direction at least partially covers the circuit layer; the filling layer is at least partially arranged in the second area, the filling layer is located between the edge of the first packaging part and the target edge along the second direction, and the filling layer is connected to the first packaging part so that a side of the first packaging part facing the filling layer is separated from the target edge, the target edge is arranged relative to the connection between the first shell and the second shell, and the first direction is perpendicular to the second direction.

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