Discharge beam vector analytic analysis method based on multi-plane solar blind photon counting
Through the discharge beam vector analysis analysis method based on multi-plane sun blind photon counting, the existing sun blind ultraviolet imaging technology has been solved, and a low-cost and simple structure discharge positioning method is realized, which is suitable for built-in online monitoring of drones and power equipment.
Patent Information
- Application Number
- CN202510409988.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-10-25
- Filing Date
- 2025-04-02
- Publication Date
- 2025-06-13
AI Technical Summary
The existing daily blind ultraviolet imaging technology has the problems of high cost, large size and poor robustness, and it is difficult to apply on a large scale under the conditions of drone-mounted online monitoring of power equipment.
Using a discharge beam vector analysis analysis method based on multi-plane sun blind photon counting, a photoelectric sensor array containing multiple photoelectric sensor units is designed to capture the counting responses on each plane of the sun blind ultraviolet photons that discharge power supply, calculate the spatial vector of the discharge light source, and realize discharge positioning.
It realizes a local discharge positioning method with low cost, simple structure and easy deployment, simplifies the system optical path design, reduces costs, and improves system flexibility and scalability.
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Figure CN120142872A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of partial discharge solar-blind ultraviolet detection, and particularly to a method for analyzing the discharge light beam vector based on multi-plane solar-blind photon counting. Background Art
[0002] Corona discharge or partial discharge is a common abnormal electrical phenomenon, especially in the insulators of high-voltage transmission lines and the internal insulation of high-voltage electrical equipment. Discharge detection and positioning are crucial for preventing power accidents and ensuring the safe operation of the power system. However, the existing discharge optical positioning or imaging technology methods have problems such as high cost, large volume, and poor robustness, and it is difficult to be applied on a large scale under the conditions of unmanned aerial vehicle (UAV) carrying or built-in online monitoring of electrical equipment. The solar-blind ultraviolet detection technology is an optoelectronic detection technology that uses ultraviolet light in the 200 - 300 nm band for spectral analysis. It is called "solar-blind" because the light energy in this band of natural light is almost zero, so that all-weather discharge optical detection can be carried out in this band without being interfered by sunlight. This technology has broad application prospects in the fields of military, environmental monitoring, industrial detection, etc. In the power field, it is mainly applied to the imaging detection of abnormal discharge of external insulation of lines. Although the solar-blind ultraviolet detection technology has significant advantages, it still faces some challenges and limitations in practical applications. The traditional ultraviolet solar-blind imaging method relies on a complex optical system and high-cost optoelectronic devices, and mainly includes the following problems: First, the key components constituting the solar-blind ultraviolet imager at least include a solar-blind ultraviolet optical lens, a single-photon level microchannel plate, a fluorescence display plate, etc. The production cost of each component is high, the yield is low, and the continuous service life is relatively limited. Secondly, the existing solar-blind ultraviolet imaging technology usually requires an aperture imaging optical lens system to focus and transmit the target field of view, and requires dual optical paths for fusion. This optical path structure makes it difficult to reduce the volume and weight of the overall device, and its mechanical robustness is poor, which is not conducive to being carried on a UAV platform, and the difficulty and cost of daily maintenance are also high. Thirdly, the existing imaging technology based on CCD or CMOS has high parameters in terms of resolution and frame rate, but this also poses high requirements for the performance of optoelectronic information processing and acquisition. However, the dynamic morphology of the discharge object itself has little significance for judging the insulation state. Therefore, there is a large redundancy in the existing solar-blind ultraviolet imaging system, which results in poor economy and is not conducive to large-scale popularization and application. Finally, there is no effective mapping relationship between the existing ultraviolet discharge image and the discharge state and intensity, and more analysis and judgment are carried out based on the image distribution characteristics, and information such as the number of photons per unit time or spatial region is difficult to be described.
[0003] Therefore, there is an urgent need in the art to develop a low-cost, simple-structured, and easy-to-deploy partial discharge positioning method. Summary of the Invention
[0004] In view of the defects existing in the above-mentioned prior art, the present invention discloses a method for analyzing the vector of a discharge light beam based on multi-plane solar-blind photon counting. This method calculates the vector in the main axis direction of the discharge and detection device based on the photon counting responses of multiple solar-blind ultraviolet plane devices, and finally obtains the spatial direction angle of the discharge to achieve discharge positioning, with the characteristics of low cost, simple structure, and easy deployment.
[0005] To achieve the above object, the present invention adopts the following solutions: A method for analyzing the vector of a discharge light beam based on multi-plane solar-blind photon counting, comprising the following steps: S100. Design a photoelectric sensor array including multiple photoelectric sensor units; S200. Perform a direction response test on the photoelectric sensor array through a discharge point light source, and fit to obtain a direction response function; S300. Synchronously detect the solar-blind wavelength ultraviolet photon beam generated by the discharge through each photoelectric sensor unit; S400. Record the photon number sequence of each photoelectric sensor unit in real time, process and calculate the parameters in the photon number sequence, and obtain the spatial vector of the discharge point light source relative to the main axis of the photoelectric sensor array to achieve discharge positioning.
[0006] Preferably, in S100, the photoelectric sensor unit is a solar-blind photoelectric sensor, and its photonic conversion efficiency is not less than 20%.
[0007] Preferably, in S100, the internal photoelectric gain of the photoelectric sensor unit is not less than 10 5 A / W order of magnitude.
[0008] Preferably, in S100, the effective light-receiving area of the photoelectric sensor unit is not less than 4mm 2 .
[0009] Preferably, in S200, when performing a direction response test on the photoelectric sensor array through a discharge point light source, a ultraviolet scintillating spherical light source covering the solar-blind band is selected, and synchronous response tests are performed on each photoelectric sensor unit at equal interval angles within the spherical surface of equal radius of the main axis and the horizontal plane of the photoelectric sensor array.
[0010] Preferably, in S300, the solar-blind wavelength ultraviolet photon beam of the discharge is synchronously detected through each photoelectric sensor unit.
[0011] Preferably, in S300, the light pulse response time resolution of each unit is not less than 0.5 μs, and the time synchronization error range is less than ±50 ns.
[0012] Preferably, in S400, the real-time recording of the photon number beam sequences of each photoelectric sensor unit includes: within a continuous monitoring time T recording the photon number beam sequences of each photoelectric sensor unit ( t ph , N ph ), and the photon number beam sequence includes the beam pulse moment t ph and the relative photon number N ph .
[0013] Preferably, in S400, processing the parameters in the photon number beam sequence, performing specific signal cleaning, and forming a new sequence array after cleaning ( t’ ph , N’ ph ).
[0014] Preferably, in S400, calculating the parameters in the photon number beam sequence includes: S401. Translating the two perpendicular lines of the planes where any two photoelectric sensor units in the photoelectric sensor array are located to form a γ plane. The axial vectors n a and n b of the two photoelectric sensor units have an included angle of γ in the plane. At this time, the apparent response parameters of the two photoelectric sensor units to the beam are and ; S402. Let the intersection line vector of the plane where the beam is located in the vector n x and the γ plane be n x,γ . When introducing another sensor plane n c , construct n a and n c , or n b and n c as the intersection line vectors of the plane n x,γ’ . Through n x,γ and n x,γ’ , the analytical vector n x of the beam can be described.
[0015] Compared with the prior art, the present invention has the following beneficial technical effects: The present invention calculates the spatial vector of the discharge light source by capturing the counting responses on each plane of the solar-blind ultraviolet photons from the discharge source, calculates the vector in the main axis direction of the discharge and detection device, and finally obtains the spatial direction angle of the discharge to achieve discharge positioning. This not only simplifies the optical path design of the system, reduces costs, but also improves the flexibility and scalability of the system. The method of the present invention adapts to a wider range of application scenarios by simplifying the system structure, reducing costs, improving the positioning accuracy and response speed. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, are used to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are included in this specification and form a part of this specification.
[0017] Figure 1 is a flowchart of a method for analyzing the discharge beam vector based on multi-plane solar-blind photon counting according to an embodiment of the present invention; Figure 2 is a schematic diagram of the principle for calculating the beam direction according to an embodiment of the present invention; Figure 3 is a schematic diagram of the optoelectronic sensor unit according to an embodiment of the present invention; Figure 4 is a schematic diagram of the optoelectronic sensor array according to an embodiment of the present invention; Figure 5 is a physical diagram of the optoelectronic sensor array according to an embodiment of the present invention; Figure 6 is a diagram of the actual measurement results of the discharge according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] The following will further elaborate on the present invention in detail in conjunction with the attached Figures 1 to 6 drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the relevant content and do not limit the present invention. Additionally, it should be noted that, for the sake of convenience of description, only the parts related to the present invention are shown in the drawings.
[0019] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. The technical solutions of the present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments.
[0020] Unless otherwise stated, the illustrated exemplary embodiments will be understood to provide exemplary features of various details of some ways in which the technical concept of the present invention can be implemented in practice. Therefore, unless otherwise stated, the features of the various embodiments can be additionally combined, separated, interchanged, and / or rearranged without departing from the technical concept of the present invention.
[0021] In the drawings, the use of cross-hatching and / or shading is generally used to make the boundaries between adjacent components clear. Thus, unless stated otherwise, the presence or absence of cross-hatching or shading does not convey or imply any preference or requirement regarding the specific material, material properties, dimensions, proportions, commonality between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. Additionally, in the drawings, the dimensions and relative dimensions of components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process orders may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to that described. Further, the same reference numerals denote the same components.
[0022] When a component is referred to as being "on" or "above" another component, "connected to" or "coupled to" another component, the component can be directly on, directly connected to, or directly coupled to the other component, or there may be intermediate components. However, when a component is referred to as being "directly on" another component, "directly connected to" or "directly coupled to" another component, there are no intermediate components. For this reason, the term "connected" can refer to a physical connection, an electrical connection, etc., and can have or not have intermediate components.
[0023] For descriptive purposes, the present invention may use spatial relative terms such as "under", "below", "beneath", "lower", "above", "upper", "on", "over", "higher", and "side (e.g., as in "sidewall")" to describe the relationship of one component to another (other) component as shown in the drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are also intended to encompass different orientations of the device during use, operation, and / or manufacturing. For example, if the device in the drawings is flipped, a component described as being "under" or "beneath" another component or feature will then be positioned "above" the other component or feature. Thus, the exemplary term "under" can encompass both "above" and "below" orientations. Additionally, the device may be positioned otherwise (e.g., rotated 90 degrees or at other orientations), and accordingly, the spatial relative descriptors used herein are to be interpreted.
[0024] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are also intended to include the plural forms. In addition, when the terms "comprising" and / or "including" and their variants are used in this specification, it is stated that there are the stated features, integers, steps, operations, components, assemblies and / or groups thereof, but does not exclude the presence or addition of one or more other features, integers, steps, operations, components, assemblies and / or groups thereof. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as terms of degree, so that they are used to explain the inherent deviations of measured values, calculated values and / or provided values that would be recognized by those of ordinary skill in the art.
[0025] In one embodiment, the present invention provides a method for analyzing the vector of a discharge light beam based on multi-plane solar-blind photon counting, comprising the following steps: S100. Design a photoelectric sensor array including at least three photoelectric sensor units with different planar angles; It can be understood that the present invention uses at least three photoelectric sensor units with different planar angles to form an array. This means that the present invention captures the solar-blind ultraviolet photon signals of the discharge light source in different spatial directions through a multi-plane layout, replacing the traditional complex optical path system, thereby facilitating the simplification of the optical path structure, realizing a modular sensor array, reducing the hardware cost, and at the same time enhancing the flexibility and scalability of the system (adapting to different installation scenarios).
[0026] S200. Perform a direction response test on the photoelectric sensor array through a point light source, and fit to obtain a direction response function: s = f(θ); This means that the present invention establishes a mathematical relationship between the response of the sensor unit and the direction angle of the light source, providing a quantitative basis for spatial vector calculation. This can improve the positioning accuracy, reduce the dependence on empirical calibration, and enhance the universality of the algorithm.
[0027] S300. Synchronously detect the solar-blind wavelength ultraviolet photon beams generated by the discharge through each unit of the photoelectric sensor array; S400. Real-time record the photon number beam sequences of each photoelectric sensor unit, process and calculate the parameters in the photon number beam sequences, and obtain the spatial vector of the discharge light source relative to the main axis of the photoelectric sensor array to achieve discharge positioning.
[0028] This means that the present invention calculates the spatial vector of the discharge light source in real time through the response function by synchronously detecting the photon sequences of multiple units. Essentially, it directly analyzes the direction angle of the light source by using multi-plane data fusion, which is significantly different from the multi-step iterative calculation method. It can be understood that this is beneficial to improving the response speed and positioning efficiency and adapting to the requirements of dynamic discharge monitoring.
[0029] The present invention calculates the spatial vector of the discharge light source by capturing the counting responses on each plane of the solar-blind ultraviolet photons from the discharge source, calculates the vector of the direction between the discharge and the main axis direction of the detection device, and finally obtains the spatial direction angle of the discharge to achieve discharge positioning. In S100, a solar-blind photoelectric sensor is selected as the array unit of the photoelectric sensor array, with a photo quantum conversion efficiency of not less than 20% and an internal photoelectric gain of not less than 10 5 orders of magnitude of A / W and an effective light-receiving area of not less than 4 mm 2 , and it has good cosine response characteristics under these parameters; the plane angle refers to the plane perpendicular to the response central axis of the photoelectric sensor unit, and the angle between the central axes of the sensors on different planes and the main axis of the array is not less than 30°.
[0030] In S200, when the point light source conducts a direction response test on the above photoelectric sensor array, a solar-blind band ultraviolet scintillation spherical light source is selected as the test point light source, and synchronous response tests are conducted on each plane sensor unit at equal interval angles within the spherical surface range of equal radius of the main axis (0°) and the horizontal plane (90°) of the photoelectric sensor array. The equal interval angle is not higher than 2°, and the spherical radius is not less than 1 m, and the relationship between the response parameters of each sensing unit and the test angle is obtained: (1) In the formula, s is the sum of the relative intensities (number of photons) of the light pulses during the continuous monitoring time T , , is the continuous monitoring time T and the relative intensity (number of photons) of the i-th light pulse monitored during
[0031] In another embodiment, a sensor device with a fitting degree of the response relationship and the cosine function higher than 0.85 is selected to ensure the fitting degree.
[0032] In S300, when the sensor array synchronously detects the solar-blind wavelength ultraviolet photon beam of the discharge, the light pulse response time resolution of each unit is not less than 0.5 μs, and the time synchronization error range is less than ±50 ns to ensure the accuracy.
[0033] In S400, the photon number beam sequences of each photoelectric sensor are recorded in real time, and the photon number beam sequences of the sensors on each plane are recorded within the continuous monitoring time T ( t ph , N ph ), including the beam pulse moments T within the continuous monitoring time t ph and the relative number of photonsN ph .
[0034] Among them, the parameters in the photon number beam sequence are processed. First, specific signal cleaning is performed. Exemplarily, for example, the photon number sequence array with a standard deviation greater than 3 at the beam pulse moment of each sensor unit ( t ph1 ~t phn , unit in μs) is removed, so as to screen the data with a dispersion degree meeting the requirements and form a new sequence array after cleaning (( t’ ph , N’ ph ).
[0035] Among them, the calculation of the parameters in the photon number beam sequence includes: S401. Calculate the translation of the two perpendicular lines of the plane where two sensor units (axial vectors are respectively n a and n b ) are located to form γ plane, n a and n b The included angle in this plane is , and at this time, the apparent response parameters of the two sensor units to the beam are and , and their relationship is constrained by the following equation: (2) In the formula, and are respectively the included angles between the discharge beam and the perpendicular vectors of the plane n a , n b .
[0036] S402. Let the intersection line vector of the plane where the beam is located in the vector n x and the γ plane be n x,γ , as Figure 2 shown. When introducing another plane where the sensor is located n c (the plane is represented by its normal vector), the above method can be used to construct n a and n c , or n b andn c is the intersection line vector of the plane n x,γ’ , through n x,γ and n x,γ’ the beam analysis vector can be completely described n x : (3) The beam analysis vector n x provides the direction information of the beam. By calculating n x the angle θ between n c and the normal vector of the sensor plane 、 are respectively the modulus of the vector n x 、n c .
[0037] Taking the relative photon number N ph as an example, it can be obtained by the following formula: where I represents the beam intensity and A represents the effective area of the sensor.
[0038] The present invention requires at least 3 sensor units in different planes to complete the description of the beam vector. When the beam vector forms a negative angle with any sensor plane, the calculation of the beam vector will fail; therefore, in practical application of this method, according to the field of view range requirements, more than 3 sensor units are preferably used to expand the beam detection angle.
[0039] In another embodiment, the present invention provides a method for analyzing the discharge beam vector based on multi-plane solar-blind photon counting, including: 1. Select a solar-blind solid-state optoelectronic device with a light-receiving area of 2.5 mm × 2.5 mm, whose photonic conversion efficiency is 22% and the internal photoelectric gain is not less than 2.3×10 5 A / W, as shown in Figure 3 .
[0040] 2. Construct a sensor array with 3 different planes, where n a 、 nb and n c The direction forms an axial angle of 42°, and an arrangement with an included angle of a negative angle is adopted, as Figure 4 shown. Considering that the size of this sensor unit is much smaller than the beam distance, it is considered that the displacement error can be ignored when the sensor array applies the beam calculation method of the present invention.
[0041] 3. When specifically manufacturing the sensor array, sensor unit chips with better consistency and cosine characteristics are selected. For this purpose, each sensor unit needs to be tested and screened. The experiment uses a flashing solar-blind ultraviolet light source and places it successively within a spherical surface with a radius of 1.5 m, with an equal interval angle of 1.5°. After the above tests, the fitting degree of the response relationship of each sensor unit with the cosine function is within the range of (0.89 - 0.93); the physical object of the finally manufactured sensor array is as Figure 5 shown.
[0042] 4. A flashing pulse light source is used to test the sensor response. The optical pulse response time resolution of each unit is 210 ns, and the time synchronization error range is less than ±25 ns.
[0043] 5. A high-speed acquisition card with 500 MHz and 2.5 Gs is used to synchronously collect the signals of three-way sensors, obtain the beam pulse sequence array, and perform specific signal cleaning through the upper computer, that is, remove the photon number sequence array with a standard deviation greater than 3 μs at the beam pulse moments (t ph1 ~t phn , in μs) of each sensor unit, and form a new sequence array (t ph , N ph ) after cleaning. In this embodiment, the proportion of specific signals is about 6.43%.
[0044] 6. Calculate the processed array: ① Calculate the translation of two perpendicular lines in the plane where two sensor units (axial vectors are respectively n a and n b ) are located to form γ plane, n a and n b The included angle in this plane is , and at this time, the apparent response parameters of the two sensor units to the beam are and , and their relationship is constrained by the following equation: In the formula, and They are the included angles between the discharge beam and the plane perpendicular vector respectively n a 、 n b respectively.
[0045] ② Let the included angle between the beam in the plane where the vector n x is located and the intersection line vector of the plane γ be n x,γ . When introducing another plane where the sensor is located n c , the n a and n c 、or n b and n c can be constructed as the intersection line vectors of the plane n x,γ’ . Through n x,γ and n x,γ’ , the analytical vector of the discharge beam n x can be calculated as follows 7. In a single plane at a radius of 5 m, the beams at 5 discharge positions are set for testing. The results show that when the beam angle ≤ ±30°, the maximum absolute error of the strong discharge beam is 2.134°, and the maximum absolute error of the weak discharge beam is 3.435°; when ±30° < beam angle ≤ ±60°, the maximum absolute error of the strong discharge beam is 4.179°, and the maximum absolute error of the weak discharge beam is 5.329°. The test results are as shown in Figure 6 and Table 1.
[0046] Table 1 Analysis of the experimental orientation error of the discharge beam in the embodiment In the description of this specification, the description referring to terms such as "one embodiment / way", "some embodiments / ways", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment / way or example are included in at least one embodiment / way or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment / way or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments / ways or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments / ways or examples described in this specification and the features of different embodiments / ways or examples.
[0047] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of such features. In the description of this application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0048] Those skilled in the art should understand that the above embodiments are merely for clearly explaining the present invention and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or variations can be made on the basis of the above disclosure, and these changes or variations are still within the scope of the present invention.
Claims
1. A discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting, characterized in that: The following steps are involved: S100, designing a photoelectric sensor array including a plurality of photoelectric sensor units; S200, performing a directional response test on the photoelectric sensor array by using a discharge point light source, and fitting to obtain a directional response function; S300, synchronously detecting the day-blind wavelength ultraviolet photon beam generated by the discharge through each photoelectric sensor unit; S400, recording the photon beam sequence of each photoelectric sensor unit in real time, processing and calculating the parameters in the photon beam sequence, obtaining the space vector of the discharge point light source relative to the main axis of the photoelectric sensor array, and realizing discharge positioning.
2. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting as claimed in claim 1, characterized in that: Preferably, in S100, the photoelectric sensor unit is a solar-blind photoelectric sensor, and its photon conversion efficiency is not less than 20%.
3. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting according to claim 1, characterized in that: In S100, the internal photoelectric gain of the photoelectric sensor unit is not less than 10 5 A / W order of magnitude.
4. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting according to claim 1, characterized in that: In S100, the effective light receiving area of the photoelectric sensor unit is not less than 4 mm 2 .
5. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting according to claim 1, characterized in that: In S200, when the directional response test of the photoelectric sensor array is performed by a discharge point light source, an ultraviolet scintillation spherical light source covering the solar-blind band is selected, and a synchronous response test is performed on each photoelectric sensor unit at an equal interval angle within a spherical range of equal radius on the main axis and horizontal plane of the photoelectric sensor array.
6. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting according to claim 1, characterized in that: In S300, the discharge day-blind wavelength ultraviolet photon beam is synchronously detected by each photoelectric sensor unit.
7. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting according to claim 1, characterized in that: In S300, the optical pulse response time resolution of each unit is not less than 0.5μs, and the time synchronization error range is less than ±50ns.
8. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting as claimed in claim 1, characterized in that: In S400, the real-time recording of the photon number sequence of each photoelectric sensor unit includes: T The photon number sequence of each photoelectric sensor unit is recorded in t ph , N ph ), the photon beam sequence includes the beam pulse time t ph and the relative photon number N ph .
9. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting as claimed in claim 8, characterized in that: In S400, the parameters in the photon beam sequence are processed, and the specific signal is cleaned to form a new sequence array after cleaning ( t’ ph , N’ ph ).
10. The discharge beam vector analytical analysis method based on multi-plane solar-blind photon counting according to claim 9, characterized in that: In S400, the parameters in the photon beam sequence are calculated, including: S401, the two vertical lines of the plane where any two photoelectric sensor units in the photoelectric sensor array are located are translated to form γ plane, axis vectors of the two photoelectric sensor units n a and n b exist γ The angle in the plane is , at this time, the apparent response parameters of the two photoelectric sensor units to the light beam are and ; S402, set the light beam in vector n x The plane and γ The intersection vector on the plane is n x,γ , when another sensor plane is introduced n c When building n a and n c ,or n b and n c is the intersection vector of the plane n x,γ’ ,pass n x,γ and n x,γ’ The analytical vector that describes the beam is n x .