Display device and method of manufacturing same

Abstract

The invention relates to a display device and a method of manufacturing the same. The display device includes a substrate having a light emitting region and a non-light emitting region. The light emitting element is disposed in the light emitting region on the substrate. The light-transmitting layer is provided on the light-emitting element. The light transmissive layer includes a plurality of openings spaced apart from each other. The light transmissive layer includes a plasma treated surface portion. A plurality of light control patterns are disposed in the plurality of openings.

Description

Technical Field

[0001] Embodiments of the present disclosure provide a display device and a method of manufacturing the display device. More specifically, embodiments of the present disclosure relate to a display device that provides visual information and a method of manufacturing the display device. Background Art

[0002] A display device is a communication medium between a user and information. With the development of information technology, display devices have become increasingly important. Accordingly, consumer use of display devices such as liquid crystal display devices, organic light emitting display devices, plasma display devices, etc. is increasing.

[0003] A display device may display an image with a wide viewing angle, or the viewing angle of an image displayed on the display device may be restricted for safety reasons or to reduce image reflection. Summary of the Invention

[0004] Embodiments provide a display device that can effectively control a viewing angle.

[0005] Embodiments provide a method of manufacturing a display device.

[0006] According to an embodiment of the present disclosure, a display device includes a substrate having a light emitting region and a non-light emitting region. A light emitting element is disposed in the light emitting region on the substrate. A light transmissive layer is disposed on the light emitting element. The light transmissive layer includes a plurality of openings spaced apart from each other. The light transmissive layer includes a plasma-treated surface portion. A plurality of light control patterns are disposed in the plurality of openings.

[0007] In an embodiment, each of the plurality of light control patterns may have a trapezoidal shape in cross-section, the trapezoidal shape having a width that decreases as the distance from the light emitting element increases.

[0008] In an embodiment, the plurality of light control patterns may include an organic material including at least one material selected from the group consisting of a black pigment and a black dye.

[0009] In an embodiment, the plasma-treated surface portion may include nitrogen (N2).

[0010] In an embodiment, for the same etching process, an upper portion of the light transmissive layer including the plasma-treated surface portion may have a first etching rate, and a lower portion of the light transmissive layer other than the upper portion may have a second etching rate different from the first etching rate.

[0011] In an embodiment, the first etching rate may be less than the second etching rate.

[0012] In an embodiment, a plurality of light control patterns may be spaced apart from each other in a first direction, and each of the plurality of light control patterns may extend longitudinally in a second direction intersecting the first direction.

[0013] In an embodiment, the light-transmitting layer may include a transparent organic material.

[0014] In an embodiment, a plurality of light control patterns may overlap with a light-emitting region and a non-light-emitting region.

[0015] In an embodiment, a plurality of light control patterns may not overlap with the light-emitting region and may overlap with the non-light-emitting region.

[0016] According to an embodiment of the present disclosure, a method of manufacturing a display device includes: forming a light-emitting element in a light-emitting region on a substrate; forming an organic layer on the light-emitting element; forming a plasma-treated surface portion by plasma-treating a surface of the organic layer; forming a light-transmitting layer on the light-emitting element by patterning the organic layer, the light-transmitting layer including a plurality of openings spaced apart from each other; and forming a plurality of light control patterns in the plurality of openings.

[0017] In an embodiment, before forming the light-transmitting layer, the method of manufacturing a display device may further include: forming a hard mask layer on the organic layer; forming a photosensitive organic pattern on the hard mask layer; and patterning the organic layer and the hard mask layer simultaneously using the photosensitive organic pattern as a mask.

[0018] In an embodiment, plasma treatment of the surface of the organic layer may be performed before forming the hard mask layer.

[0019] In an embodiment, plasma treatment of the surface of the organic layer may be performed after forming the hard mask layer.

[0020] In an embodiment, the plasma-treated surface portion may include nitrogen (N2).

[0021] In an embodiment, plasma treatment of the surface of the organic layer may be performed by an ion implantation process or a dry plasma treatment.

[0022] In an embodiment, for the same etching process, an upper portion of the light-transmitting layer including the plasma-treated surface portion may have a first etching rate, and a lower portion of the light-transmitting layer other than the upper portion may have a second etching rate different from the first etching rate.

[0023] In an embodiment, the first etching rate may be less than the second etching rate.

[0024] In an embodiment, the plurality of light control patterns may include an organic material including at least one material selected from the group consisting of a black pigment and a black dye.

[0025] In an embodiment, when forming the light transmissive layer, the organic layer may be patterned by a dry etching process.

[0026] According to an embodiment of the present disclosure, a display device includes a light emitting element disposed on a substrate. A light transmissive layer is disposed on the light emitting element. The light transmissive layer includes a plurality of openings spaced apart from each other. A plurality of light control patterns are disposed in the plurality of openings. Each of the plurality of light control patterns has a trapezoidal shape in a cross section, and the trapezoidal shape has a width that decreases as the distance from the light emitting element increases.

[0027] In an embodiment, the upper surface of each of the plurality of light control patterns is concave.

[0028] In an embodiment, a encapsulation layer is disposed on the light emitting element. A touch sensing layer is disposed between the light emitting element and the light transmissive layer.

[0029] In an embodiment, the plurality of light control patterns include an organic material including at least one material selected from the group consisting of a black pigment and a black dye. The light transmissive layer includes a transparent organic material.

[0030] A display device according to an embodiment of the present disclosure may include: a light transmissive layer disposed on a light emitting element, defining a plurality of openings spaced apart from each other, and including a plasma processed surface portion; and a plurality of light control patterns each filling the plurality of openings. Here, each of the plurality of light control patterns may have a trapezoidal shape in a cross section, and the trapezoidal shape has a width that decreases as the distance from the light emitting element increases. Accordingly, the light efficiency of the display device may be increased. In addition, the display device may more effectively control the viewing angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Exemplary, non-limiting embodiments will be more clearly understood from the following detailed description in conjunction with the accompanying drawings.

[0032] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0033] Figure 2 is according to an embodiment of the present disclosure Figure 1 An enlarged plan view of a part of a display area of the display device.

[0034] Figure 3 is according to an embodiment of the present disclosure along Figure 2 A cross-sectional view taken along line I-I'.

[0035] Figure 4 is a plan view showing an example of a light control pattern according to an embodiment of the present disclosure Figure 3 of.

[0036] Figure 5 is a cross-sectional view showing a light control pattern and a light transmissive layer according to an embodiment of the present disclosure. Figure 3 of

[0037] Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 and Figure 14 is a cross-sectional view showing some steps of a method of manufacturing a display device according to an embodiment of the present disclosure. Figure 3 of

[0038] Figure 15 is a plan view showing an example of a light control pattern according to an embodiment of the present disclosure. Figure 3 of

[0039] Figure 16 is a cross-sectional view showing a display device according to an embodiment of the present disclosure.

[0040] Figure 17 is a view schematically showing a vehicle according to an embodiment of the present disclosure.

[0041] Figure 18 is a view showing the interior of a vehicle according to an embodiment of the present disclosure. Figure 17 of DETAILED DESCRIPTION

[0042] Hereinafter, a display device and a method of manufacturing the display device according to an embodiment of the present disclosure will be explained in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same components, and redundant descriptions of the same components may be omitted for convenience of explanation.

[0043] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0044] Referring Figure 1 to

[0045] Multiple pixels PX may be arranged in a display area DA. Each of the multiple pixels PX may emit light. In an embodiment, the multiple pixels PX may include a first pixel PX1 and a second pixel PX2. Although two pixels of the multiple pixels PX are shown for illustrative convenience, embodiments of the present disclosure are not necessarily limited thereto, and the number of the multiple pixels PX may vary. For example, the first pixel PX1 and the second pixel PX2 may emit light simultaneously with each other. Alternatively, when the first pixel PX1 emits light, the second pixel PX2 may not emit light. Alternatively, when the first pixel PX1 does not emit light, the second pixel PX2 may emit light. As each of the multiple pixels PX emits light, the display area DA may display an image.

[0046] The multiple pixels PX may be repeatedly arranged in a plan view along a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, the second pixel PX2 may be adjacent to the first pixel PX1. In an embodiment, the second pixel PX2 may be adjacent to the first pixel PX1 in the second direction DR2 (e.g., closely adjacent thereto).

[0047] A non-display area NDA may be located around the display area DA. For example, the non-display area NDA may surround at least a part of the display area DA (e.g., in the first direction DR1 and / or the second direction DR2). A driver may be disposed in the non-display area NDA. The driver may supply signals and / or voltages to the multiple pixels PX. For example, in an embodiment, the driver may include a data driver, a gate driver, etc. The non-display area NDA may not display an image.

[0048] In this specification, a plane may be defined in the first direction DR1 and the second direction DR2. For example, the first direction DR1 may be perpendicular to the second direction DR2. However, embodiments of the present disclosure are not necessarily limited thereto, and the first direction DR1 and the second direction DR2 may intersect each other at various different angles.

[0049] In an embodiment of the present disclosure, the display device 100 may include an organic light emitting display device (OLED), a liquid crystal display device (LCD), a field emission display device (FED), a plasma display device (PDP), an electrophoretic display device (EPD), or an inorganic light emitting display device (ILED). However, embodiments of the present disclosure are not necessarily limited thereto.

[0050] Figure 2 is Figure 1 An enlarged plan view of a part of a display area of a display device.

[0051] Reference Figure 1 and Figure 2, as described above, the display device 100 may include a display area DA and a non-display area NDA, and a plurality of pixels PX may be disposed in the display area DA. In an embodiment, the plurality of pixels PX may include a first pixel PX1 and a second pixel PX2.

[0052] In an embodiment, each of the first pixel PX1 and the second pixel PX2 may include a first light-emitting area EA1, a second light-emitting area EA2, a third light-emitting area EA3, and a non-light-emitting area NEA.

[0053] The first light-emitting area EA1 may emit light of a first color, the second light-emitting area EA2 may emit light of a second color, and the third light-emitting area EA3 may emit light of a third color. The first color to the third color may be different from each other. In an embodiment, the first color may be red, the second color may be green, and the third color may be blue. As the light of the first color, the light of the second color, and the light of the third color are combined, each of the first pixel PX1 and the second pixel PX2 may emit light of various colors. However, the embodiments of the present disclosure are not necessarily limited thereto, and the colors of the first light-emitting area EA1 to the third light-emitting area EA3 may vary. The non-light-emitting area NEA may not emit light.

[0054] The area of the first light-emitting area EA1 (e.g., on a plane defined in a first direction DR1 and a second direction DR2) may be different from the areas of the second light-emitting area EA2 and the third light-emitting area EA3 (e.g., on a plane defined in the first direction DR1 and the second direction DR2), respectively. For example, in an embodiment, the area of the third light-emitting area EA3 may be greater than the area of the first light-emitting area EA1, and the area of the first light-emitting area EA1 may be greater than the area of the second light-emitting area EA2. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0055] Figure 3 is a cross-sectional view taken along line I-I'. Figure 2 Figure 4 is a plan view showing an example of a light control pattern of Figure 3 Figure 5 is a cross-sectional view showing a light control pattern and a light-transmitting layer of Figure 3

[0056] Refer to Figure 3 ​​​, the display device 100 according to an embodiment of the present disclosure may include a substrate SUB, a buffer layer BUF, a first transistor TR1, a second transistor TR2, and a third transistor TR3, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, a pixel defining layer PDL, a first light-emitting element LED1, a second light-emitting element LED2, and a third light-emitting element LED3, a packaging layer TFE, a plurality of light control patterns LCP, and a light transmission layer LTL.

[0057] In an embodiment, the first transistor TR1 may include a first active pattern ACT1, a first gate electrode GE1, a first source electrode SE1, and a first drain electrode DE1, the second transistor TR2 may include a second active pattern ACT2, a second gate electrode GE2, a second source electrode SE2, and a second drain electrode DE2, and the third transistor TR3 may include a third active pattern ACT3, a third gate electrode GE3, a third source electrode SE3, and a third drain electrode DE3.

[0058] In addition, in an embodiment, the first light-emitting element LED1 may include a first pixel electrode AE1, a first emission layer EML1, and a first common electrode CE1, the second light-emitting element LED2 may include a second pixel electrode AE2, a second emission layer EML2, and a second common electrode CE2, and the third light-emitting element LED3 may include a third pixel electrode AE3, a third emission layer EML3, and a third common electrode CE3.

[0059] The substrate SUB may include a transparent material or an opaque material. For example, in an embodiment, the substrate SUB may be made of a transparent resin substrate. Examples of the transparent resin substrate may include a polyimide substrate. In this embodiment, the polyimide substrate may include a first organic layer, a first barrier layer, a second organic layer, etc. Optionally, the substrate SUB may include a quartz substrate (e.g., a synthetic quartz substrate, a fluorine-doped quartz substrate), a calcium fluoride substrate, a soda-lime glass substrate, a non-alkali glass substrate, etc. These may be used alone or in combination with each other.

[0060] The buffer layer BUF may be disposed on the substrate SUB (e.g., directly disposed on the substrate SUB in the vertical direction). The buffer layer BUF may prevent metal atoms or impurities from diffusing from the substrate SUB to the first transistor TR1, the second transistor TR2, and the third transistor TR3. In addition, when the surface of the substrate SUB is uneven, the buffer layer BUF may increase the flatness of the surface of the substrate SUB. For example, in an embodiment, the buffer layer BUF may include an inorganic material such as silicon oxide, silicon nitride, silicon oxynitride, etc. These materials may be used alone or in combination with each other.

[0061] The first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3 may be disposed on the buffer layer BUF (e.g., directly on the buffer layer BUF in the vertical direction). In an embodiment, each of the first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3 may include a metal oxide semiconductor, an inorganic semiconductor (e.g., amorphous silicon, polysilicon), or an organic semiconductor. Each of the first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3 may include a source region, a drain region, and a channel region located between the source region and the drain region. In an embodiment, the first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3 may be formed by the same process and may include the same materials as each other.

[0062] In an embodiment, the metal oxide semiconductor may include binary compounds (AB x ) containing indium (In), zinc (Zn), gallium (Ca), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), magnesium (Mg), etc., ternary compounds (AB x C y ), quaternary compounds (AB x C y D z ), etc. For example, in an embodiment, the metal oxide semiconductor may include zinc oxide (ZnO x ), gallium oxide (GaO x ), tin oxide (SnO x ), indium oxide (InO x ), indium gallium oxide (IGO), indium zinc oxide (IZO), indium tin oxide (ITO), indium zinc tin oxide (IZTO), indium gallium zinc oxide (IGZO), etc. These materials may be used alone or in combination with each other.

[0063] The gate insulating layer GI may be disposed on the buffer layer BUF (e.g., directly on the buffer layer BUF in the vertical direction). In an embodiment, the gate insulating layer GI may sufficiently cover the first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3, and may have a substantially flat upper surface without creating steps around the first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3. Optionally, the gate insulating layer GI may cover the first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3, and may be disposed along the contour of each of the first active pattern ACT1, the second active pattern ACT2, and the third active pattern ACT3 with a uniform thickness. For example, in an embodiment, the gate insulating layer GI may include, such as, silicon oxide (SiOx ) Silicon nitride (SiN x ) Silicon carbide (SiC x ) Silicon oxynitride (SiO x N y ) Silicon oxycarbide (SiO x C y ) and other inorganic materials. These materials can be used alone or in combination with each other.

[0064] The first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3 can be disposed on the gate insulating layer GI (e.g., directly disposed on the gate insulating layer GI in the vertical direction). The first gate electrode GE1 can overlap (e.g., in the vertical direction) with the channel region of the first active pattern ACT1, the second gate electrode GE2 can overlap (e.g., in the vertical direction) with the channel region of the second active pattern ACT2, and the third gate electrode GE3 can overlap (e.g., in the vertical direction) with the channel region of the third active pattern ACT3.

[0065] In an embodiment, each of the first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3 can include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. Examples of metals can include silver (Ag), molybdenum (Mo), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), etc. Examples of conductive metal oxides can include indium tin oxide, indium zinc oxide, etc. In addition, examples of metal nitrides can include aluminum nitride (AlN x ) Tungsten nitride (WN x ) Chromium nitride (CrN x ) etc. These materials can be used alone or in combination with each other.

[0066] In an embodiment, the first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3 can be formed by the same process and can include the same materials as each other.

[0067] The interlayer insulating layer ILD may be disposed on the gate insulating layer GI (e.g., directly disposed on the gate insulating layer GI in the vertical direction). In an embodiment, the interlayer insulating layer ILD may sufficiently cover the first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3, and may have a substantially flat upper surface without creating steps around the first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3. Optionally, the interlayer insulating layer ILD may cover the first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3, and may be disposed along the contour of each of the first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3 with a uniform thickness. For example, in an embodiment, the interlayer insulating layer ILD may include inorganic materials such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, silicon carbonitride, etc. These materials may be used alone or in combination with each other.

[0068] The first source electrode SE1, the second source electrode SE2, and the third source electrode SE3 may be disposed on the interlayer insulating layer ILD (e.g., directly disposed on the interlayer insulating layer ILD in the vertical direction). In an embodiment, the first source electrode SE1 may be connected to the source region of the first active pattern ACT1 through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD (e.g., directly connected to the source region of the first active pattern ACT1). The second source electrode SE2 may be connected to the source region of the second active pattern ACT2 through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD (e.g., directly connected to the source region of the second active pattern ACT2). The third source electrode SE3 may be connected to the source region of the third active pattern ACT3 through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD (e.g., directly connected to the source region of the third active pattern ACT3).

[0069] The first drain electrode DE1, the second drain electrode DE2, and the third drain electrode DE3 may be disposed on the interlayer insulating layer ILD (e.g., directly disposed on the interlayer insulating layer ILD in the vertical direction). In an embodiment, the first drain electrode DE1 may be connected to the drain region of the first active pattern ACT1 through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD (e.g., directly connected to the drain region of the first active pattern ACT1). The second drain electrode DE2 may be connected to the drain region of the second active pattern ACT2 through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD (e.g., directly connected to the drain region of the second active pattern ACT2). The third drain electrode DE3 may be connected to the drain region of the third active pattern ACT3 through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD (e.g., directly connected to the drain region of the third active pattern ACT3).

[0070] For example, in an embodiment, each of the first source electrode SE1, the second source electrode SE2, and the third source electrode SE3 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These materials may be used alone or in combination with each other. In an embodiment, the first drain electrode DE1, the second drain electrode DE2, and the third drain electrode DE3 may be formed by the same process as the first source electrode SE1, the second source electrode SE2, and the third source electrode SE3, and may include the same materials as the first source electrode SE1, the second source electrode SE2, and the third source electrode SE3.

[0071] Accordingly, a first transistor TR1 including a first active pattern ACT1, a first gate electrode GE1, a first source electrode SE1, and a first drain electrode DE1 may be disposed on a substrate SUB, a second transistor TR2 including a second active pattern ACT2, a second gate electrode GE2, a second source electrode SE2, and a second drain electrode DE2 may be disposed on the substrate SUB, and a third transistor TR3 including a third active pattern ACT3, a third gate electrode GE3, a third source electrode SE3, and a third drain electrode DE3 may be disposed on the substrate SUB.

[0072] A via insulating layer VIA may be disposed on the interlayer insulating layer ILD (e.g., directly disposed on the interlayer insulating layer ILD in a vertical direction). The via insulating layer VIA may sufficiently cover the first source electrode SE1, the second source electrode SE2, and the third source electrode SE3, as well as the first drain electrode DE1, the second drain electrode DE2, and the third drain electrode DE3. The via insulating layer VIA may include an organic material. For example, in an embodiment, the via insulating layer VIA may include an organic material such as a phenolic resin, a polyacrylate resin, a polyimide resin, a polyamide resin, a silicone resin, an epoxy resin, etc. These materials may be used alone or in combination with each other.

[0073] The first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3 may be disposed on the via insulating layer VIA (e.g., directly disposed on the via insulating layer VIA in the vertical direction). The first pixel electrode AE1 may be disposed in the first light-emitting region EA1, the second pixel electrode AE2 may be disposed in the third light-emitting region EA3, and the third pixel electrode AE3 may be disposed in the second light-emitting region EA2. In an embodiment, the first pixel electrode AE1 may be connected to the first drain electrode DE1 through a contact hole penetrating the via insulating layer VIA (e.g., directly connected to the first drain electrode DE1), the second pixel electrode AE2 may be connected to the second drain electrode DE2 through a contact hole penetrating the via insulating layer VIA (e.g., directly connected to the second drain electrode DE2). In addition, the third pixel electrode AE3 may be connected to the third drain electrode DE3 through a contact hole penetrating the via insulating layer VIA (e.g., directly connected to the third drain electrode DE3).

[0074] For example, in an embodiment, each of the first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These materials may be used alone or in combination with each other. In an embodiment, each of the first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3 may have a stacked structure including ITO / Ag / ITO. In an embodiment, the first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3 may be formed by the same process and may include the same materials as each other. For example, each of the first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3 may function as an anode.

[0075] The pixel defining layer PDL may be disposed on the via insulating layer VIA (e.g., directly disposed on the via insulating layer VIA in the vertical direction). The pixel defining layer PDL may overlap with the non-emitting area NEA (e.g., in the vertical direction). In an embodiment, the pixel defining layer PDL may cover the side edges of each of the first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3. In addition, an opening exposing a part of the upper surface of each of the first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3 may be defined in the pixel defining layer PDL. For example, in an embodiment, the opening may expose the central portion of the upper surface (e.g., in the second direction DR2) of each of the first pixel electrode AE1 to the third pixel electrode AE3. For example, in an embodiment, the pixel defining layer PDL may be an inorganic material. In an embodiment, the pixel defining layer PDL may include an organic material such as an epoxy resin, a silicone resin, etc. These materials may be used alone or in combination with each other. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the pixel defining layer PDL may include an inorganic material and / or an organic material containing a light-blocking material, such as a black pigment, a black dye, etc.

[0076] The first emitting layer EML1 may be disposed on the first pixel electrode AE1 (e.g., in the vertical direction), and the second emitting layer EML2 may be disposed on the second pixel electrode AE2 (e.g., in the vertical direction). In addition, the third emitting layer EML3 may be disposed on the third pixel electrode AE3 (e.g., in the vertical direction). Each of the first emitting layer EML1, the second emitting layer EML2, and the third emitting layer EML3 may include a light-emitting material that emits light of a preset color. For example, in an embodiment, the first emitting layer EML1 may include a light-emitting material that emits red light, the second emitting layer EML2 may include a light-emitting material that emits blue light, and the third emitting layer EML3 may include a light-emitting material that emits green light. However, the embodiments of the present disclosure are not necessarily limited thereto, and the colors of the light emitted by the first emitting layer EML1 to the third emitting layer EML3 may vary.

[0077] The first common electrode CE1 can be disposed on the first emission layer EML1 and the pixel defining layer PDL, and the second common electrode CE2 can be disposed on the second emission layer EML2 and the pixel defining layer PDL. In addition, the third common electrode CE3 can be disposed on the third emission layer EML3 and the pixel defining layer PDL. In an embodiment, the first common electrode CE1, the second common electrode CE2, and the third common electrode CE3 can be integrally formed. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, each of the first common electrode CE1, the second common electrode CE2, and the third common electrode CE3 can include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These materials can be used alone or in combination with each other. The first common electrode CE1, the second common electrode CE2, and the third common electrode CE3 can operate as a cathode.

[0078] Therefore, the first light-emitting element LED1 including the first pixel electrode AE1, the first emission layer EML1, and the first common electrode CE1 can be disposed in the first light-emitting region EA1 on the substrate SUB, the second light-emitting element LED2 including the second pixel electrode AE2, the second emission layer EML2, and the second common electrode CE2 can be disposed in the third light-emitting region EA3 on the substrate SUB, and the third light-emitting element LED3 including the third pixel electrode AE3, the third emission layer EML3, and the third common electrode CE3 can be disposed in the second light-emitting region EA2 on the substrate SUB.

[0079] In an embodiment, the first light-emitting element LED1 can be electrically connected to the first transistor TR1, the second light-emitting element LED2 can be electrically connected to the second transistor TR2, and the third light-emitting element LED3 can be electrically connected to the third transistor TR3.

[0080] The encapsulation layer TFE can be disposed on the first common electrode CE1, the second common electrode CE2, and the third common electrode CE3 (e.g., directly disposed on the first common electrode CE1, the second common electrode CE2, and the third common electrode CE3 in the vertical direction). The encapsulation layer TFE can prevent impurities, moisture, external air, etc. from penetrating into the first light-emitting element LED1, the second light-emitting element LED2, and the third light-emitting element LED3 from the outside (e.g., the external environment). In an embodiment, the encapsulation layer TFE can include at least one inorganic layer and at least one organic layer. For example, in an embodiment, the inorganic layer can include silicon oxide, silicon nitride, silicon oxynitride, etc. These materials can be used alone or in combination with each other. The organic layer can include a cured polymer such as polyacrylate.

[0081] The light transmissive layer LTL can be disposed on the encapsulation layer TFE (e.g., directly on the encapsulation layer TFE in the vertical direction). The light emitted from the first light emitting element LED1, the second light emitting element LED2, and the third light emitting element LED3 can pass through the light transmissive layer LTL. In an embodiment, the light transmissive layer LTL can have a substantially flat upper surface. In an embodiment, the light transmissive layer LTL can include a transparent organic material. For example, in an embodiment, the light transmissive layer LTL can include a transparent organic material such as epoxy resin, silicone resin, polyimide resin, photoresist, etc. These materials can be used alone or in combination with each other.

[0082] In an embodiment, a plurality of openings OP spaced apart from each other can be defined in the light transmissive layer LTL. In an embodiment, the plurality of openings OP can be spaced apart from each other along the second direction DR2. However, embodiments of the present disclosure are not necessarily limited thereto.

[0083] In an embodiment, each of the plurality of openings OP can have a trapezoidal shape in cross-section in which the width of the opening OP (e.g., the length in the second direction DR2) decreases as the distance from the first light emitting element LED1, the second light emitting element LED2, and the third light emitting element LED3 (e.g., in the vertical direction) increases. In this embodiment, the portion of the light transmissive layer LTL located between two adjacent openings OP can have an inverted conical shape in cross-section (e.g., a trapezoidal shape having a width that increases as the distance from the first light emitting element LED1, the second light emitting element LED2, and the third light emitting element LED3 increases).

[0084] Reference Figures 3 to 5 , in an embodiment, the light transmissive layer LTL can include a plasma-treated surface portion SP. In an embodiment, the plasma-treated surface portion SP can be disposed on the upper surface of the light transmissive layer LTL. For example, in an embodiment, the plasma-treated surface portion SP can include nitrogen gas (N2). However, embodiments of the present disclosure are not necessarily limited thereto, and the plasma-treated surface portion SP can include various different plasma gases.

[0085] In an embodiment, since the light transmissive layer LTL includes the plasma-treated surface portion SP, surface modification such as carbon-carbon bonding may occur on the surface of the light transmissive layer LTL. Therefore, for the same etching process, the upper portion UP of the light transmissive layer LTL including the plasma-treated surface portion SP can have a first etching rate, and the lower portion LP of the light transmissive layer LTL other than the upper portion UP can have a second etching rate different from the first etching rate.

[0086] In an embodiment, the first etching rate may be less than the second etching rate. Since the first etching rate is less than the second etching rate, each of the plurality of openings OP may have a trapezoidal shape in cross-section, the trapezoidal shape having a width that decreases as the distance from the first light-emitting element LED1, the second light-emitting element LED2, and the third light-emitting element LED3 increases.

[0087] A plurality of light control patterns LCP spaced apart from each other may be provided on the encapsulation layer TFE (e.g., directly provided on the encapsulation layer TFE in the vertical direction). The plurality of light control patterns LCP may be surrounded by a light-transmissive layer LTL. In an embodiment, the plurality of light control patterns LCP may respectively fill the plurality of openings OP. In an embodiment, the plurality of light control patterns LCP may overlap with the non-light-emitting region NEA and the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3. However, embodiments of the present disclosure are not necessarily limited thereto.

[0088] In an embodiment, each of the plurality of light control patterns LCP may include an organic material containing a light-blocking material (such as at least one material selected from the group consisting of a black pigment and a black dye). However, embodiments of the present disclosure are not necessarily limited thereto.

[0089] Light emitted from the first light-emitting element LED1, the second light-emitting element LED2, and the third light-emitting element LED3 may be incident on the light control pattern LCP or pass through the light-transmissive layer LTL between the light control patterns LCP. Light incident on the light control pattern LCP may be reflected by the light control pattern LCP, transmitted by the light control pattern LCP, or absorbed by the light control pattern LCP. For example, in an embodiment, most of the light incident on the light control pattern LCP may be absorbed by the light control pattern LCP. Thus, the light control pattern LCP may control the viewing angle of the display device 100.

[0090] For example, in an embodiment where the display device 100 is a front emission type, the light control pattern LCP may be provided (e.g., in the vertical direction) above the first light-emitting element LED1, the second light-emitting element LED2, and the third light-emitting element LED3. Alternatively, when the display device 100 is a bottom emission type, the light control pattern LCP may be provided (e.g., in the vertical direction) below the first light-emitting element LED1, the second light-emitting element LED2, and the third light-emitting element LED3.

[0091] In an embodiment, the light control patterns LCP may be spaced apart from each other in a second direction DR2, and each of the light control patterns LCP may extend longitudinally in a first direction DR1 (see Figure 4 ). However, embodiments of the present disclosure are not necessarily limited thereto.

[0092] In an embodiment, each of the light control patterns LCP may have a cross-sectional shape having a width that decreases as the distance from the first light-emitting element LED1, the second light-emitting element LED2, and the third light-emitting element LED3 increases. For example, in this embodiment, the angle θ formed between the side surface of each of the light control patterns LCP and the upper surface of the encapsulation layer TFE may be an acute angle. Here, the angle θ refers to the smaller angle among the angles formed between the side surface of each of the light control patterns LCP and the upper surface of the encapsulation layer TFE.

[0093] For example, in an embodiment, the upper surface US of each of the plurality of light control patterns LCP may have a concave shape. For example, with respect to the substrate SUB, the upper surface US of each of the plurality of light control patterns LCP may be located (e.g., in the vertical direction) at a level lower than the upper surface of the light-transmissive layer LTL (see Figure 5 ). Thus, in an embodiment, the light control pattern LCP may not completely fill the uppermost surface of the opening OP and may fill the remaining portion of the opening OP. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0094] Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 are cross-sectional views showing some steps of a method of manufacturing a Figure 3 display device. Hereinafter, for ease of explanation, descriptions overlapping with the description of the display device 100 described with reference to Figure 3 may be omitted or simplified.

[0095] Reference Figure 3 and Figure 6, in an embodiment, a buffer layer BUF, a first active pattern ACT1, a second active pattern ACT2, and a third active pattern ACT3, a gate insulating layer GI, a first gate electrode GE1, a second gate electrode GE2, and a third gate electrode GE3, an interlayer insulating layer ILD, a first source electrode SE1, a second source electrode SE2, and a third source electrode SE3, a first drain electrode DE1, a second drain electrode DE2, and a third drain electrode DE3, a via insulating layer VIA, a first pixel electrode AE1, a second pixel electrode AE2, and a third pixel electrode AE3, a pixel defining layer PDL, a first emission layer EML1, a second emission layer EML2, and a third emission layer EML3, a first common electrode CE1, a second common electrode CE2, and a third common electrode CE3, and a packaging layer TFE may be sequentially formed on a substrate SUB. In an embodiment, light-emitting elements LED1, LED2, and LED3 may be formed in light-emitting regions EA1, EA3, and EA2 on the substrate SUB.

[0096] In an embodiment, an organic layer OL may be formed on the packaging layer TFE (e.g., directly on the packaging layer TFE in a vertical direction). In an embodiment, the organic layer OL may be formed on the light-emitting elements LED1, LED2, and LED3. For example, a transparent organic material such as an epoxy resin, a silicone resin, a polyimide resin, a photoresist, etc. may be used to form the organic layer OL.

[0097] Reference Figure 7 and Figure 8 , in an embodiment, the surface of the organic layer OL (e.g., the upper surface of the organic layer OL in a vertical direction) may be plasma-treated. Thus, the organic layer OL may include a plasma-treated surface portion SP on its (e.g., in a vertical direction) upper surface. For example, in an embodiment, the plasma-treated surface portion SP of the organic layer OL may include nitrogen gas (N2). However, embodiments of the present disclosure are not necessarily limited thereto.

[0098] In an embodiment, the plasma treatment of the surface of the organic layer OL may be performed by an ion implantation process or a dry plasma treatment.

[0099] In an embodiment, the plasma treatment of the surface of the organic layer OL may be performed before forming a hard mask layer HML to be described later. However, embodiments of the present disclosure are not necessarily limited thereto, and the plasma treatment of the surface of the organic layer OL may be performed after forming the hard mask layer HML to be described later.

[0100] Reference Figure 9, a hard mask layer HML can be formed on the organic layer OL. For example, in an embodiment, the hard mask layer HML can be directly formed on the upper surface of the plasma-treated surface portion SP. In an embodiment, a metal material can be used to form the hard mask layer HML. For example, in an embodiment, a transparent oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), etc. can be used to form the hard mask layer HML. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0101] Reference Figure 10 , a photosensitive organic pattern PR can be formed on the hard mask layer HML. For example, in an embodiment, the photosensitive organic pattern PR can be directly formed on the upper surface of the hard mask layer HML. In an embodiment, a positive photoresist can be used to form the photosensitive organic pattern PR. Optionally, a negative photoresist can be used to form the photosensitive organic pattern PR.

[0102] Reference Figure 11 , in an embodiment, the photosensitive organic pattern PR can be used as a mask to simultaneously pattern the organic layer OL and the hard mask layer HML by irradiating light to the organic layer OL and the hard mask layer HML. In this embodiment, the portions of the organic layer OL that do not overlap with the photosensitive organic pattern PR and the portions of the hard mask layer HML that do not overlap with the photosensitive organic pattern PR can be removed. In an embodiment, the organic layer OL and the hard mask layer HML can be patterned by a dry etching process.

[0103] Therefore, in an embodiment, a light-transmissive layer LTL including the plasma-treated surface portion SP and defining a plurality of openings OP spaced apart from each other (e.g., in the second direction DR2) and a plurality of hard mask patterns HMP on the light-transmissive layer LTL can be formed. In an embodiment, after forming the light-transmissive layer LTL and the plurality of hard mask patterns HMP, the photosensitive organic pattern PR can be removed.

[0104] Reference Figure 12 , after removing the photosensitive organic pattern PR, the plurality of hard mask patterns HMP can be removed. For example, the plurality of hard mask patterns HMP can be removed by a dry etching process.

[0105] Reference Figure 13 , a preliminary light control pattern LCP_P can be formed on the light-transmissive layer LTL (e.g., directly on the light-transmissive layer LTL). The preliminary light control pattern LCP_P can be formed by filling the plurality of openings OP of the light-transmissive layer LTL. For example, an organic material containing a light-blocking material such as a black pigment, a black dye, etc. can be used to form the preliminary light control pattern LCP_P. In an embodiment, the upper surface of the preliminary light control pattern LCP_P can have a concave shape in the portion overlapping with the opening OP (e.g., in the vertical direction).

[0106] Further referring to Figure 14 , a part of the upper portion of the preliminary light control pattern LCP_P can be removed. For example, in an embodiment, the part of the upper portion of the preliminary light control pattern LCP_P can be removed by a chemical mechanical polishing (CMP) process. Thus, a plurality of light control patterns LCP can be formed to each fill a plurality of openings OP. The upper surface US of each of the plurality of light control patterns LCP can have a concave shape similar to the upper surface of the removed portion of the preliminary light control pattern LCP_P in the portion overlapping with the opening OP as shown in Figure 13 .

[0107] Hereinafter, effects of embodiments of the present disclosure according to comparative examples and embodiments will be described.

[0108] In Comparative Example 1 and Comparative Example 2, a light transmissive layer including a polyimide resin is formed on the encapsulation layer, and a plurality of light control patterns surrounded by the light transmissive layer, spaced apart from each other, and including a known black matrix material are formed. The plurality of light control patterns do not have a trapezoidal shape in cross section. Table 1 below shows the width L of each of the plurality of light control patterns, the distance S between a plurality of adjacent light control patterns, the height H of each of the plurality of light control patterns, and the angle θ between the side surface of each of the plurality of light control patterns and the encapsulation layer.

[0109] In Embodiment 1 and Embodiment 2, a light transmissive layer LTL including a polyimide resin is formed on the encapsulation layer TFE, and a plurality of light control patterns LCP surrounded by the light transmissive layer LTL, spaced apart from each other, and including a known black matrix material are formed. Table 1 below shows the width L of each of the plurality of light control patterns LCP, the distance S between a plurality of adjacent light control patterns LCP, the height H of each of the plurality of light control patterns LCP, and the angle θ between the side surface of each of the plurality of light control patterns LCP and the encapsulation layer TFE (see Figure 5 ).

[0110]

[0111] Embodiment 1 Embodiment 2 Comparative Example 1 Comparative Example 2 Width L 4 μm 12 μm 4 μm 12 μm Distance S 13 μm 39 μm 13 μm 39 μm Height H 35 μm 105 μm 35 μm 105 μm Angle θ 87.5 degrees 87.5 degrees 90 degrees 90 degrees

[0112] The light efficiency and cut-off characteristics of a display device including a light transmissive layer and a plurality of light control patterns satisfying Comparative Example 1 and Comparative Example 2 were measured. In addition, the light efficiency and cut-off characteristics of the display device 100 including the light transmissive layer LTL and the plurality of light control patterns LCP satisfying Embodiment 1 and Embodiment 2 were measured. Here, the "light efficiency" refers to the light transmittance of the display device from the front, and the "cut-off characteristic" refers to the light transmittance of the display device at an angle of approximately 35 degrees based on the thickness direction of the display device.

[0113] As a result, referring to Table 2 below, it can be confirmed that the light efficiency of the display device 100 that satisfies Embodiment 1 and Embodiment 2 is higher than that of the display devices that satisfy Comparative Example 1 and Comparative Example 2. In addition, it can be confirmed that the cut-off characteristics of the display device 100 that satisfies Embodiment 1 and Embodiment 2 are reduced compared to the cut-off characteristics of the display devices that satisfy Comparative Example 1 and Comparative Example 2.

[0114]

[0115] Embodiment 1 Embodiment 2 Comparative Example 1 Comparative Example 2 Light efficiency (%) 88.5 91.0 75.6 75.0 Cut-off characteristic (%) 2.6 2.6 4.3 4.4

[0116] Accordingly, it can be confirmed that since each of the plurality of light control patterns LCP has a trapezoidal shape in cross-section, and the trapezoidal shape has a width that decreases as the distance from the light-emitting elements (e.g., Figure 3 the first light-emitting element LED1, the second light-emitting element LED2, and the third light-emitting element LED3) increases, the light efficiency of the display device 100 is relatively high, and the cut-off characteristics of the display device 100 are relatively reduced. Here, the reduction in the cut-off characteristics of the display device 100 means that the value of the cut-off characteristics of the display device 100 is relatively small.

[0117] Figure 15 is a plan view showing an embodiment of the light control pattern. Figure 3 of

[0118] Referring to Figure 15 , in the embodiment, the plurality of light control patterns LCP may overlap with the non-light-emitting area NEA and may not overlap with the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3.

[0119] Figure 16 is a cross-sectional view showing a display device according to an embodiment of the present disclosure.

[0120] Referring to Figure 16 , a display device 101 according to an embodiment of the present disclosure may include a substrate SUB, a buffer layer BUF, a first transistor TR1, a second transistor TR2, and a third transistor TR3, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, a pixel defining layer PDL, a first light-emitting element LED1, a second light-emitting element LED2, and a third light-emitting element LED3, a package layer TFE, a touch sensing layer TL, a plurality of light control patterns LCP, and a light transmission layer LTL.

[0121] However, the display device 101 described with reference to Figure 16 may be substantially the same as or similar to the display device 100 described with reference to Figure 3 , except that the display device 101 further includes a touch sensing layer TL. Therefore, hereinafter, for ease of explanation, overlapping descriptions will be omitted or simplified.

[0122] The touch sensing layer TL may be disposed on the encapsulation layer TFE. For example, in an embodiment, the touch sensing layer TL may be disposed (e.g., in a vertical direction) directly on the encapsulation layer TFE. In an embodiment, the touch sensing layer TL may be disposed (e.g., in a vertical direction) between the encapsulation layer TFE and the light transmissive layer LTL.

[0123] In an embodiment, the touch sensing layer TL may include a first touch electrode TE1, a first touch insulating layer TI1 disposed on the first touch electrode TE1, a second touch electrode TE2 disposed on the first touch insulating layer TI1, and a second touch insulating layer TI2 disposed on the second touch electrode TE2. In an embodiment, the second touch insulating layer TI2 may have a substantially flat upper surface. The second touch electrode TE2 may be connected to the first touch electrode TE1 (e.g., directly connected to the first touch electrode TE1) through a contact hole penetrating the first touch insulating layer TI1. The touch sensing layer TL may be used as an input means of the display device 101.

[0124] The display devices 100 and 101 according to embodiments of the present disclosure may include a light transmissive layer LTL disposed on the first light emitting element LED1, the second light emitting element LED2, and the third light emitting element LED3, defining a plurality of openings OP spaced apart from each other and including a plasma treatment surface portion SP, and a plurality of light control patterns LCP each filling the plurality of openings OP. In an embodiment, each of the plurality of light control patterns LCP may have a trapezoidal shape in cross section, the trapezoidal shape having a width that decreases as the distance from the first light emitting element LED1, the second light emitting element LED2, and the third light emitting element LED3 increases. Accordingly, the light efficiency of the display devices 100 and 101 may be increased. In addition, the display devices 100 and 101 may more effectively control the viewing angle.

[0125] Figure 17 is a view schematically showing a vehicle. Figure 18 is a view showing Figure 17 the interior of the vehicle.

[0126] Referring to Figure 17 and Figure 18 , in an embodiment, the vehicle 10 may include a vehicle body 20 and a vehicle display device 300. The vehicle body 20 may form the exterior of the vehicle 10 and may define an interior space in which a driver and passengers sit. The vehicle body 20 may include a windshield 30 that protects the driver and passengers from external influences and provides a view for the driver. The vehicle display device 300 may be disposed in the interior space. The vehicle display device 300 may have substantially the same structure as the Figure 3 display device 100 or Figure 16 display device 101.

[0127] In an embodiment, the vehicle display device 300 may include a first display area 300A, a second display area 300B, a third display area 300C, and a fourth display area 300D that are spaced apart from each other. For example, in an embodiment, the first display area 300A, the second display area 300B, and the third display area 300C may be provided on the instrument panel 40 disposed in the interior space. For example, the first display area 300A may be provided on the instrument panel 40 in front of the driver's seat 50 to provide speed information and the like to the driver, and the second display area 300B may be provided in the center of the instrument panel 40 to provide map information and the like. In addition, the third display area 300C may be provided on the instrument panel 40 in front of the passenger seat 60 to provide entertainment information to the passenger.

[0128] In addition, the fourth display area 300D may be included in the vehicle head-up display 70. The vehicle head-up display 70 may be provided on the instrument panel 40. For example, the fourth display area 300D may provide information helpful for driving to the driver.

[0129] For example, in an embodiment, the first display area 300A, the second display area 300B, and the third display area 300C may be included in one display device. In this embodiment, the fourth display area 300D may be included in a display device separate from the first display area 300A, the second display area 300B, and the third display area 300C. Alternatively, the first display area 300A, the second display area 300B, the third display area 300C, and the fourth display area 300D may all be included in one display device. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0130] The third display area 300C provided on the instrument panel 40 may adjust the viewing angle according to the mode. In an embodiment, the third display area 300C may display an image in a wide viewing angle mode or a narrow viewing angle mode. For example, the wide viewing angle mode may mean a state where the viewing angle (e.g., field of view) of the third display area 300C is relatively large. In the wide viewing angle mode, the image may be displayed to the driver in the driver's seat 50 and the passenger in the passenger seat 60. Therefore, both the passenger and the driver can view the image of the third display area 300C. In contrast, the narrow viewing angle mode may mean a state where the field of view of the third display area 300C is relatively small. In the narrow viewing angle mode, the image may be displayed only to the passenger in the front passenger seat 60 (e.g., only viewable by the passenger in the front passenger seat 60) and may not be displayed to the driver in the driver's seat 50 (e.g., not viewable by the driver in the driver's seat 50). Therefore, only the passenger can view the image of the third display area 300C.

[0131] Although described based on the third display area 300C provided on the instrument panel 40, embodiments of the present disclosure are not necessarily limited thereto. For example, the viewing angles of the first display area 300A, the second display area 300B, and the fourth display area 300D can be adjusted according to the mode.

[0132] In addition, although the vehicle display device 300 is described as being provided on the instrument panel 40, embodiments of the present disclosure are not necessarily limited thereto. For example, in some embodiments, the vehicle display device 300 can be provided on the windshield 30.

[0133] In addition, according to embodiments of the present disclosure Figure 3 the display device 100 or Figure 16 the display device 101 is not necessarily limited to being only applied to Figure 17 and Figure 18 the vehicle display device 300 provided on the vehicle 10, and can be applied to various display devices.

[0134] Embodiments of the present disclosure can be applied to various display devices. For example, the present disclosure is applicable to various display devices such as display devices for vehicles, ships, and airplanes, portable communication devices, display devices for exhibitions or information transmission, medical display devices, and the like.

[0135] The above is an explanation of the embodiments and should not be construed as limiting the embodiments. Although several embodiments are described, those skilled in the art will easily understand that many modifications are possible in the embodiments without substantially departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure. Therefore, it should be understood that the above is an explanation of various embodiments and is not construed as being limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the present disclosure.

Claims

1. A display device comprising: A substrate including a light emitting region and a non-light emitting region; A light-emitting element is disposed in the light-emitting region on the substrate; a light-transmitting layer disposed on the light-emitting element, the light-transmitting layer including a plurality of openings spaced apart from each other, the light-transmitting layer including a plasma-treated surface portion; as well as A plurality of light control patterns are disposed in the plurality of openings.

2. The display device according to claim 1, wherein: Each of the plurality of light-controlling patterns has a trapezoidal shape in cross-section, the trapezoidal shape having a width that decreases as a distance from the light emitting element increases.

3. The display device according to claim 1, wherein: The plurality of light-controlling patterns include an organic material including at least one material selected from the group consisting of a black pigment and a black dye.

4. The display device according to claim 1, wherein: The plasma treated surface portion includes nitrogen gas.

5. The display device according to claim 1, wherein: For the same etching process, an upper portion of the light transmitting layer including the plasma treated surface portion has a first etching rate, and a lower portion of the light transmitting layer excluding the upper portion has a second etching rate different from the first etching rate.

6. The display device according to claim 5, wherein: The first etching rate is less than the second etching rate.

7. The display device according to claim 1, wherein: The plurality of light-controlling patterns are spaced apart from each other in a first direction, and each of the plurality of light-controlling patterns longitudinally extends in a second direction crossing the first direction.

8. The display device according to claim 1, wherein: The light-transmitting layer includes a transparent organic material.

9. The display device according to claim 1, wherein: The plurality of light-controlling patterns overlap the light-emitting area and the non-light-emitting area.

10. The display device according to claim 1, wherein: The plurality of light-controlling patterns do not overlap the light-emitting area and overlap the non-light-emitting area.

11. A method for manufacturing a display device, the method comprising: forming a light emitting element in a light emitting region on a substrate; forming an organic layer on the light-emitting element; forming a plasma-treated surface portion by plasma-treating a surface of the organic layer; forming a light-transmitting layer on the light-emitting element by patterning the organic layer, the light-transmitting layer including a plurality of openings spaced apart from each other; as well as A plurality of light-controlling patterns are formed in the plurality of openings.

12. The method according to claim 11, before forming the light transmission layer, further comprising: forming a hard mask layer on the organic layer; forming a photosensitive organic pattern on the hard mask layer; as well as The organic layer and the hard mask layer are patterned simultaneously using the photosensitive organic pattern as a mask.

13. The method according to claim 12, wherein: The plasma treatment of the surface of the organic layer is performed before forming the hard mask layer.

14. The method according to claim 12, wherein: The plasma treatment of the surface of the organic layer is performed after forming the hard mask layer.

15. The method according to claim 11, wherein: The plasma treated surface portion includes nitrogen gas.

16. The method according to claim 11, wherein: The plasma treatment of the surface of the organic layer is performed by an ion implantation process or a dry plasma treatment.

17. The method according to claim 11, wherein: For the same etching process, an upper portion of the light transmitting layer including the plasma treated surface portion has a first etching rate, and a lower portion of the light transmitting layer excluding the upper portion has a second etching rate different from the first etching rate.

18. The method according to claim 17, wherein: The first etching rate is less than the second etching rate.

19. The method according to claim 11, wherein: The plurality of light-controlling patterns include an organic material including at least one material selected from the group consisting of a black pigment and a black dye.

20. The method according to claim 11, wherein: When forming the light transmitting layer, the organic layer is patterned through a dry etching process.

21. A display device, comprising: A light emitting element is disposed on a substrate; a light transmission layer disposed on the light emitting element, the light transmission layer comprising a plurality of openings spaced apart from each other; as well as a plurality of light control patterns, arranged in the plurality of openings, Each of the plurality of light-controlling patterns has a trapezoidal shape in cross-section, and the trapezoidal shape has a width that decreases as a distance from the light-emitting element increases.

22. The display device according to claim 21, wherein: An upper surface of each of the plurality of light-controlling patterns is concave.

23. The display device according to claim 21, wherein: A packaging layer is provided on the light emitting element; and A touch sensing layer is disposed between the light emitting element and the light transmission layer.

24. The display device according to claim 21, wherein: The plurality of light-controlling patterns include an organic material including at least one material selected from the group consisting of a black pigment and a black dye, and The light-transmitting layer includes a transparent organic material.

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