Target substrate, display panel, laser transfer method and display device

Abstract

The invention discloses a target substrate, a display panel, a laser transfer method and a display device.The target substrate is applied to laser transfer of a light-emitting diode and comprises a bottom plate; the at least two bearing glue layers are arranged on the bottom plate at intervals in the first direction. According to the above mode, the target substrate in the present application exposes the redundant position for subsequent dead pixel repair on the base plate, thereby effectively avoiding the process of damaging and removing the cured bearing adhesive layer by the dead pixel repair process, effectively avoiding the risk of disconnection of the conductive connection of the light emitting diode, and improving the repair yield; and moreover, the automation of dead pixel repair can be realized, so that the stability and mass production of dead pixel repair are ensured, and the implementation cost is relatively low.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a target substrate, a display panel, a laser transfer method and a display device. Background Art

[0002] Nowadays, in the laser transfer of LEDs (light-emitting diodes), bad pixels are usually unavoidable, that is, some LEDs cannot be normally lit.

[0003] However, the existing bad pixel repair process usually requires first removing the adhesive layer at the bad pixel on the target substrate that supports the light-emitting diode, which will bring the risk of broken conductive connections of the light-emitting diode. In addition, the adhesive layer is difficult to remove, and the automation of bad pixel repair cannot be effectively realized, and thus the stability and mass production of bad pixel repair cannot be guaranteed, and the implementation cost is also high. Summary of the invention

[0004] The present application provides a target substrate, a display panel, a laser transfer method and a display device to solve the problem in the prior art that the target substrate in the bad pixel repair process of the laser transfer method will bring the risk of broken conductive connections of the light-emitting diode, and the adhesive layer is difficult to remove, and the automation of the bad pixel repair cannot be effectively realized, and thus the stability and mass production of the bad pixel repair cannot be guaranteed, and the cost of implementation is also high.

[0005] To solve the above technical problems, a technical solution adopted in the present application is: to provide a target substrate for use in laser transfer of light-emitting diodes, wherein the target substrate comprises: a base plate; and at least two receiving adhesive layers arranged on the base plate at intervals along a first direction.

[0006] The distance between each two adjacent receiving adhesive layers is equal.

[0007] Wherein, the distance between each two adjacent receiving adhesive layers is not less than the width of each receiving adhesive layer in the first direction.

[0008] The receiving adhesive layers are rectangular in shape, and the receiving adhesive layers are parallel to each other.

[0009] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a display panel, wherein the display panel includes: a target substrate, including a bottom plate and at least two receiving adhesive layers, at least two receiving adhesive layers are arranged on the bottom plate at intervals along a first direction; a plurality of light-emitting diodes are arranged at intervals on each receiving adhesive layer.

[0010] The distance between each two adjacent receiving adhesive layers is equal.

[0011] Among them, the distance between every two adjacent receiving adhesive layers is not less than the width of each receiving adhesive layer in the first direction.

[0012] To solve the above technical problems, another technical solution adopted by this application is: to provide a laser transfer method, wherein the laser transfer method includes: forming an adhesive layer on a target substrate; wherein, the adhesive layer includes a first polyimide adhesive layer and a receiving adhesive layer, and a receiving adhesive layer is provided between every two adjacent first polyimide adhesive layers; removing the first polyimide adhesive layer on the target substrate; transferring the light-emitting diodes on the transfer substrate to a predetermined point on the receiving adhesive layer.

[0013] Among them, before the step of transferring the light-emitting diodes on the transfer substrate to a predetermined point on the receiving adhesive layer, it further includes: forming a groove on the transfer substrate; filling the groove to form a second polyimide adhesive layer; disposing light-emitting diodes on the second polyimide adhesive layer, or on the second polyimide adhesive layer and the transfer substrate; wherein, the center point of the light-emitting diode and the center point of the second polyimide adhesive layer coincide in the projection on the transfer substrate.

[0014] To solve the above technical problems, another technical solution adopted by this application is: to provide a display device, wherein the display device includes the display panel described in any one of the above.

[0015] The beneficial effect of this application is: different from the prior art, the target substrate in this application is applied in the laser transfer of light-emitting diodes. At least two receiving adhesive layers in the target substrate are specifically arranged at intervals on the bottom plate along the first direction to expose the redundant positions on the bottom plate for subsequent dead pixel repair, thereby effectively avoiding the process of damaging and removing the cured receiving adhesive layer in the dead pixel repair process, effectively avoiding the risk of disconnection of the conductive connection of the light-emitting diodes, and improving the dead pixel repair yield; and it can also effectively realize the automation of dead pixel repair to ensure the stability and mass production of dead pixel repair, and the implementation cost is also relatively low. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings. Among them:

[0017] Figure 1 It is a schematic structural diagram of an embodiment of the target substrate of this application;

[0018] Figure 2 It is a schematic structural diagram of an embodiment of the display panel of this application;

[0019] Figure 3a It is a schematic flowchart of the first embodiment of the laser transfer method of the present application;

[0020] Figures 3b - 3d It is Figure 3a a schematic structural diagram of an embodiment corresponding to S31 - S33 in;

[0021] Figure 4a It is a schematic flowchart of the second embodiment of the laser transfer method of the present application;

[0022] Figures 4b - 4d It is Figure 4a a schematic structural diagram of an embodiment corresponding to S43 - S46 in;

[0023] Figure 5 It is a schematic framework diagram of an embodiment of the display device of the present application. Specific Embodiments

[0024] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0025] The terms "first", "second", and "third" in the present application are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0026] Reference to "embodiments" in this application means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0027] The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0028] Please refer to Figure 1 , Figure 1 FIG. is a schematic structural diagram of an embodiment of the target substrate of the present application. In this embodiment, the target substrate 10 includes: a bottom plate 11 and at least two receiving adhesive layers 12.

[0029] It is worth noting that the target substrate 10 is applied in the laser transfer of light-emitting diodes, and the laser transfer is specifically applied to the manufacturing process of a display module. The display module may include: a substrate, on one surface of which a thin-film transistor layer is formed; a plurality of LEDs, that is, light-emitting diodes, arranged on the thin-film transistor layer; and a wiring connection circuit arranged on the back surface of the substrate.

[0030] Among them, the substrate can be understood as the target substrate 10, which can be one of any reasonable material plates such as a glass substrate, a flexible substrate, and a plastic substrate, and can also be called a "backplane"; the LED can specifically be composed of an inorganic light-emitting material and can be understood as a semiconductor chip that can emit light by itself when powered.

[0031] It can be understood that during the manufacturing process of the display module, the LED usually corresponds to a plurality of LEDs of different colors, such as red LEDs, green LEDs, and blue LEDs. When arranged on the target substrate 10, a specific arrangement method needs to be satisfied. Therefore, usually, a plurality of LEDs of different colors need to be transferred to the relay substrate at the same time, and then the plurality of LEDs are secondarily transferred from the relay substrate to the corresponding positions on the target substrate 10 by using a laser transfer method.

[0032] Among them, the relay substrate can be understood as a transfer substrate for setting light-emitting diodes and a carrier plate for sequentially transferring the light-emitting diodes to the corresponding positions on the target substrate 10; while the target substrate 10 can be understood as a carrier plate for receiving the transfer of each LED in the laser transfer and a circuit board for providing each driving signal for the LED to light up each LED.

[0033] Specifically, at least two receiving adhesive layers 12 are arranged on the bottom plate 11 at intervals along the first direction X, that is, a part of the bottom plate 11 will be exposed from the gap between every two adjacent receiving adhesive layers 12.

[0034] For the convenience of understanding, a receiving glue layer 12 is provided on the bottom plate 11. The position area used to receive the transferred light-emitting diodes is called the in-situ position, and the exposed part of the bottom plate 11, which is the reserved position for subsequent repair of the dead pixels of the light-emitting diodes, is called the redundant position.

[0035] Among them, when it is subsequently detected that at least some of the light-emitting diodes on the receiving glue layer 12 cannot be normally lit, conductive glue can be directly sprayed on the pads at the positions corresponding to the dead pixels in the redundant position to reattach the light-emitting diodes, instead of, as currently, disposing the entire receiving glue layer 12 on the substrate of the bottom plate 11 to cover all the pads under the receiving glue layer 12. When a dead pixel appears, it is necessary to first destroy and remove the cured receiving glue layer 12 on the redundant position to expose the pads at the dead pixel position before performing dead pixel repair.

[0036] It can be seen from this that by disposing at least two receiving glue layers 12 in the target substrate 10 at intervals along the first direction X on the bottom plate 11 to expose the redundant positions on the bottom plate 11 for subsequent dead pixel repair, the process of destroying and removing the cured receiving glue layer 12 in the dead pixel repair process is effectively avoided, the risk of disconnection of the conductive connection of the light-emitting diodes is effectively avoided, and the yield of dead pixel repair is improved; and it can also effectively realize the automation of dead pixel repair to ensure the stability and mass production of dead pixel repair, and the implementation cost is also relatively low.

[0037] Optionally, the distance between every two adjacent receiving glue layers 12 is equal.

[0038] Optionally, the distance between every two adjacent receiving glue layers 12 is not less than the width of each receiving glue layer 12 in the first direction X. When a dead pixel appears in the light-emitting diodes subsequently disposed on the receiving glue layer 12, a new light-emitting diode can be attached to the redundant position between every two adjacent receiving glue layers 12 to connect with the pads at the dead pixel position, thereby replacing the failed light-emitting diode.

[0039] Optionally, the receiving glue layer 12 is rectangular, and each receiving glue layer 12 is parallel to each other.

[0040] Please refer to Figure 2 , Figure 2 FIG. is a schematic structural diagram of an embodiment of the display panel of the present application. In this embodiment, the display panel 20 includes: a target substrate 21 and a plurality of light-emitting diodes 22.

[0041] Specifically, the target substrate 21 further includes a bottom plate 211 and at least two receiving glue layers 212, and at least two receiving glue layers 212 are specifically disposed on the bottom plate 211 at intervals along the first direction X to expose part of the bottom plate 211 from the gaps between every two adjacent receiving glue layers 212.

[0042] Among them, a plurality of the light-emitting diodes 22 are arranged at intervals on each receiving adhesive layer 212, and specifically are arranged at intervals on each receiving adhesive layer 212 according to a preset arrangement manner, so as to be used for lighting to realize picture display in the subsequent process.

[0043] Optionally, the distance between every two adjacent receiving adhesive layers 212 is equal.

[0044] Optionally, the distance between every two adjacent receiving adhesive layers 212 is not less than the width of each receiving adhesive layer 212 in the first direction X. When a dead pixel appears in the light-emitting diode 22 arranged on the receiving adhesive layer 212 subsequently, a new light-emitting diode 22 can be pasted on the redundant position between every two adjacent receiving adhesive layers 212 to realize connection with the pad at the dead pixel position, so as to replace the failed light-emitting diode 22.

[0045] Optionally, the receiving adhesive layer 212 is rectangular, and the receiving adhesive layers 212 are parallel to each other.

[0046] Please refer to Figures 3a - 3d , where Figure 3a is a schematic flowchart of the first embodiment of the laser transfer method of the present application, Figures 3b - 3d is Figure 3a a schematic structural diagram of an embodiment corresponding to S31-S33 in

[0047] S31: Form an adhesive layer on the target substrate.

[0048] It should be noted that the laser transfer method in this embodiment is specifically applied to the manufacturing process of a display module. The display module may include: a substrate, on one surface of which a thin-film transistor layer is formed; a plurality of LEDs arranged on the thin-film transistor layer; and a wiring connection circuit arranged on the back surface of the substrate.

[0049] Among them, the substrate can be understood as the target substrate 101, which can be any reasonable material plate such as a glass substrate, a flexible substrate, and a plastic substrate, and can also be called a "backplane"; the LED is a light-emitting diode 203, which can be specifically composed of an inorganic light-emitting material and can be understood as a semiconductor chip that can emit light by itself when powered.

[0050] It can be understood that during the manufacturing process of the display module, the LED usually corresponds to a plurality of LEDs of different colors, such as red LEDs, green LEDs, and blue LEDs. When arranged on the target substrate 101, a specific arrangement manner needs to be satisfied. Therefore, usually, a plurality of LEDs of different colors need to be transferred to the relay substrate at the same time, and then the plurality of LEDs are transferred from the relay substrate to the corresponding positions on the target substrate 101 by using the laser transfer method as described in this embodiment.

[0051] Among them, the relay substrate can be understood as a transfer substrate for setting the light-emitting diode 203, and it is a carrier plate that transfers the light-emitting diode 203 to corresponding positions on the target substrate 101 in sequence.

[0052] Specifically, as Figure 3b shown, a slit coating mechanism 301 with a special structure is used to synchronously coat the first polyimide adhesive layer 1021 and the receiving adhesive layer 1022 on the target substrate 101 to obtain the adhesive layer 102.

[0053] Among them, the adhesive layer 102 includes a first polyimide adhesive layer 1021 and a receiving adhesive layer 1022, and a receiving adhesive layer 1022 is provided between every two adjacent first polyimide adhesive layers 1021. That is to say, the first polyimide adhesive layer 1021 and the receiving adhesive layer 1022 are specifically arranged alternately along the first direction X on the target substrate 101 in sequence, and the first direction X is perpendicular to the extending direction of the first polyimide adhesive layer 1021.

[0054] It is worth noting that the area on the target substrate 101 where the receiving adhesive layer 1022 is provided can be specifically understood as the in-situ position for receiving the transfer setting of the light-emitting diode 203; while the area on the target substrate 101 where the first polyimide adhesive layer 1021 is provided can be understood as the reserved position for repairing the dead pixels of the light-emitting diode 203, also known as the redundant bit.

[0055] Optionally, at least one outer side of the adhesive layer 102 is the receiving adhesive layer 1022.

[0056] Optionally, both the first polyimide adhesive layer 1021 and the receiving adhesive layer 1022 are rectangular, and the first polyimide adhesive layer 1021 is parallel to the receiving adhesive layer 1022.

[0057] S32: Remove the first polyimide adhesive layer on the target substrate.

[0058] Furthermore, as Figure 3c shown, the first polyimide adhesive layer 1021 on the target substrate 101 is removed. For example, the first polyimide adhesive layer 1021 on the target substrate 101 is irradiated with an ultraviolet lamp to remove the first polyimide adhesive layer 1021, or a polyimide removal reagent is used, or the first polyimide adhesive layer 1021 is removed by high temperature to expose the redundant bit on the target substrate 101.

[0059] S33: Transfer the light-emitting diodes on the transfer substrate to the predetermined points on the receiving adhesive layer.

[0060] Still further, as Figure 3dAs shown, the light-emitting diodes 203 on the transfer substrate are sequentially transferred to predetermined points on the receiving adhesive layer 1022 and arranged in a preset manner.

[0061] It can be understood that since the redundant bits on the target substrate 101 are exposed, when it is detected that at least some of the light-emitting diodes 203 on the receiving adhesive layer 1022 cannot be normally lit, conductive adhesive can be directly sprayed on the pads at the positions corresponding to the bad points in the redundant bits to reattach the light-emitting diodes 203, instead of covering all the pads under the receiving adhesive layer like the current substrate with the receiving adhesive layer laid on the bottom plate as a whole. When there are bad points, it is necessary to first damage and remove the cured receiving adhesive layer on the redundant bits to expose the pads at the bad points, and then repair the bad points.

[0062] In the above solution, before transferring the light-emitting diodes 203, the first polyimide adhesive layer 1021 is removed to expose the redundant bits on the target substrate 101 for subsequent bad point repair, thus effectively avoiding the process of partially damaging and removing the cured receiving adhesive layer 1022 formed on the target substrate 101 as a whole in the bad point repair process, effectively avoiding the risk of disconnection of the conductive connection of the light-emitting diodes 203, and improving the yield of bad point repair; and it can also effectively realize the automation of bad point repair to ensure the stability and mass production of bad point repair, and the implementation cost is also relatively low.

[0063] Further, in an embodiment, S12 may specifically further include: using an ultraviolet light generating device 302 to irradiate ultraviolet light on the adhesive layer 102 to remove the first polyimide adhesive layer 1021.

[0064] It can be understood that since ultraviolet laser has a very high photon energy, it can break the molecular chain of polyimide, thereby effectively peeling off and removing the first polyimide adhesive layer 1021 and optimizing the spin coating design.

[0065] Further, in an embodiment, S33 may specifically further include: using a laser transfer device to irradiate preset laser from one side of the transfer substrate to the light-emitting diodes 203 to transfer the light-emitting diodes 203 to predetermined points on the receiving adhesive layer 1022.

[0066] It can be understood that when using preset laser to irradiate the light-emitting diodes 203 from the transfer substrate, a hot gas cavity can be formed between the carrier layer and the laser release layer of the transfer substrate, so as to use the hot gas to squeeze the laser release layer and apply a thrust to the light-emitting diodes 203 to transfer the light-emitting diodes 203 to predetermined points on the receiving adhesive layer 1022.

[0067] Optionally, the preset laser is in a periodic waveform, replacing the traditional flat-top light form, thereby effectively reducing the difficulty of spot shaping and the implementation cost. At the same time, it can also ensure uniform force during the LED transfer process through the periodic waveform laser, controlling the fall of the LED within a certain deflection to achieve good LED landing accuracy.

[0068] In one embodiment, the transfer substrate and / or the target substrate 101 can be specifically driven by a power mechanism in a corresponding laser transfer device to move along the X, Y, or Z axis, so that the transfer substrate and the target substrate 101 are arranged in parallel at an interval; specifically, the transfer substrate is parallel and spaced from the target substrate 101 in a direction perpendicular to the target substrate 101, that is, the two are spaced in the height direction, and the transfer substrate and the target substrate 101 perform relative movement to complete the fixed-point transfer of the light-emitting diode 203.

[0069] Please refer to Figures 4a - 4d , in which, Figure 4a is a schematic flowchart of the second implementation manner of the laser transfer method of the present application, Figures 4b - 4d is Figure 4a a schematic structural diagram of an embodiment corresponding to S43 - S46 in Figure 3a The laser transfer method of this embodiment is a schematic flowchart of a refined implementation manner of the laser transfer method in

[0070] S41: Form an adhesive layer on the target substrate.

[0071] S42: Remove the first polyimide adhesive layer on the target substrate.

[0072] Among them, S41 and S42 are the same as S31 and S32 in Figure 3a . For specific details, please refer to S31 and S32 and their related textual descriptions, which will not be elaborated here.

[0073] S43: Form a groove on the transfer substrate.

[0074] Specifically, as shown in Figure 4b , the transfer substrate 201 is patterned to form a groove 2011 on the transfer substrate 201.

[0075] Optionally, the grooves 2011 are specifically arranged uniformly on the transfer substrate 201.

[0076] S44: Fill the groove to form a second polyimide adhesive layer.

[0077] Further, as shown in Figure 4c , a second polyimide adhesive layer 202 is filled in each groove 2011.

[0078] Optionally, the thickness of the second polyimide adhesive layer 202 is equal to the depth of the groove 2011, that is, the second polyimide adhesive layer 202 fills each groove 2011.

[0079] S45: Set light-emitting diodes on the second polyimide adhesive layer, or on the second polyimide adhesive layer and the transfer substrate.

[0080] Furthermore, as Figure 4c shown, the outer side dimension of each second polyimide adhesive layer 202 facing the light-emitting diode 203 can specifically be greater than or equal to the outer side dimension of the light-emitting diode 203 facing the second polyimide adhesive layer 202, so as to set the light-emitting diode 203 on the second polyimide adhesive layer 202.

[0081] In other embodiments, the outer side dimension of each second polyimide adhesive layer 202 facing the light-emitting diode 203 can specifically also be less than the outer side dimension of the light-emitting diode 203 facing the second polyimide adhesive layer 202, so as to set the light-emitting diode 203 on the second polyimide adhesive layer 202 and the transfer substrate 201.

[0082] It can be understood that by patterning the transfer substrate 201 to form grooves 2011 on the transfer substrate 201 and filling the grooves 2011 to form the second polyimide adhesive layer 202, the process of etching the second polyimide adhesive layer 202 after forming the second polyimide adhesive layer 202 by whole-plate coating on the transfer substrate 201 is effectively avoided; and by uniformly forming grooves 2011 on the transfer substrate 201 and filling the second polyimide adhesive layer 202, when the second polyimide adhesive layer 202 generates gas during the subsequent laser transfer process, the direction of gas release can be effectively restricted to improve the uniformity of gas release, thereby improving the laser transfer yield; and when the outer side dimension of each second polyimide adhesive layer 202 facing the light-emitting diode 203 is less than the outer side dimension of the light-emitting diode 203 facing the second polyimide adhesive layer 202, the contact area between the second polyimide adhesive layer 202 and the light-emitting diode 203 can also be effectively reduced to more effectively restrict the direction of gas release, thereby improving the uniformity of gas release.

[0083] Optionally, the center point of the light-emitting diode 203 and the center point of the second polyimide adhesive layer 202 coincide in the projection on the transfer substrate 201, that is, the geometric center of each light-emitting diode 203 is aligned with the geometric center of each second polyimide adhesive layer 202 in the direction perpendicular to the transfer substrate 201.

[0084] Optionally, the length of the second polyimide adhesive layer 202 in the second direction Y is not less than one-third of the length of the light-emitting diode 203 in the second direction Y, which is beneficial to improving the uniformity of gas release in the exciton transfer process.

[0085] Preferably, the spacing between the second polyimide adhesive layer 202 and the light-emitting diode 203 in the second direction Y is not greater than 10 micrometers, so as to ensure that the uniformity of gas release in the exciton transfer process can be effectively improved.

[0086] Optionally, the length of the second polyimide adhesive layer 202 in the second direction is not less than one-third of the length of the light-emitting diode 203 in the second direction, which is beneficial to improving the uniformity of gas release in the exciton transfer process.

[0087] Preferably, the spacing between the second polyimide adhesive layer 202 and the light-emitting diode 203 in the second direction is not greater than 10 micrometers, so as to ensure that the uniformity of gas release in the exciton transfer process can be effectively improved.

[0088] Wherein, the first direction X is perpendicular to the second direction Y, and the first direction X and the second direction Y are respectively parallel to the extending directions of the two opposite centerlines of the second polyimide adhesive layer 202; and the second direction Y can specifically be the extending direction of the transfer substrate 201.

[0089] Optionally, the number of the second polyimide adhesive layers 202 is multiple, and the spacing between every two adjacent second polyimide adhesive layers 202 in the second direction Y is not less than one-third of the length of the light-emitting diode 203 in the second direction Y, which is beneficial to improving the uniformity of gas release in the exciton transfer process.

[0090] Optionally, the spacing between every two adjacent second polyimide adhesive layers 202 in the second direction Y is not less than one-third of the length of the light-emitting diode 203 in the second direction Y, which is beneficial to improving the uniformity of gas release in the exciton transfer process.

[0091] S26: Transfer the light-emitting diodes on the transfer substrate to the predetermined points on the receiving adhesive layer.

[0092] Specifically, as Figure 4d shown, a preset laser is irradiated from one side of the transfer substrate 201 to the light-emitting diodes 203 by using a laser transfer device 303, so as to transfer the light-emitting diodes 203 to the predetermined points on the receiving adhesive layer 1022.

[0093] It can be understood that by uniformly forming grooves 2011 on the transfer substrate 201 and filling them with the second polyimide adhesive layer 202, when laser transferring the light-emitting diodes 203, the direction of gas release can be effectively restricted, so as to improve the uniformity of gas release and further improve the laser transfer yield.

[0094] The present application also provides a display device. Please refer to Figure 5 , Figure 5 which is a schematic structural diagram of an embodiment of the display device of the present application. Among them, the display device 50 includes a display panel 51.

[0095] Among them, the display panel 51 described in this embodiment is the display panel 20 described in any one of the above embodiments. For details, please refer to Figure 2 and the relevant text content, which will not be elaborated here.

[0096] The beneficial effects of the present application are as follows: Different from the prior art, the target substrate in the present application is applied to the laser transfer of light-emitting diodes. At least two receiving adhesive layers in the target substrate are specifically arranged on the bottom plate at intervals along the first direction to expose the redundant positions on the bottom plate for subsequent dead pixel repair, thereby effectively avoiding the process of damaging and removing the cured receiving adhesive layer in the dead pixel repair process, effectively avoiding the risk of disconnection of the conductive connection of the light-emitting diodes, and improving the dead pixel repair yield rate; and it can also effectively realize the automation of dead pixel repair to ensure the stability and mass production of dead pixel repair, and the implementation cost is also relatively low.

[0097] The above is only the embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A target substrate applied in the laser transfer of light-emitting diodes, characterized in that, The target substrate includes: A bottom plate; At least two receiving adhesive layers, which are arranged on the bottom plate at intervals along a first direction.

2. The target substrate according to claim 1, characterized in that, The distance between every two adjacent receiving adhesive layers is equal.

3. The target substrate according to claim 2, characterized in that, The distance between every two adjacent receiving adhesive layers is not less than the width of each receiving adhesive layer in the first direction.

4. The target substrate according to claim 1, characterized in that, The receiving adhesive layers are rectangular, and the receiving adhesive layers are parallel to each other.

5. A display panel, characterized in that, The display panel includes: A target substrate, including a bottom plate and at least two receiving adhesive layers, and at least two receiving adhesive layers are arranged on the bottom plate at intervals along a first direction; A plurality of light-emitting diodes, which are arranged at intervals on each receiving adhesive layer.

6. The target substrate according to claim 5, characterized in that, The distance between every two adjacent receiving adhesive layers is equal.

7. The target substrate according to claim 6, characterized in that, The distance between every two adjacent receiving adhesive layers is not less than the width of each receiving adhesive layer in the first direction.

8. A laser transfer method, characterized in that, The laser transfer method includes: Forming an adhesive layer on the target substrate; wherein, the adhesive layer includes a first polyimide adhesive layer and a receiving adhesive layer, and one receiving adhesive layer is provided between every two adjacent first polyimide adhesive layers; Removing the first polyimide adhesive layer on the target substrate; Transferring the light-emitting diodes on the transfer substrate to a predetermined point on the receiving adhesive layer.

9. The laser transfer method according to claim 8, characterized in that, Before the step of transferring the light-emitting diodes on the transfer substrate to a predetermined point on the receiving adhesive layer, it further includes: Forming a groove in the transfer substrate; Filling the groove to form a second polyimide adhesive layer; Arranging the light-emitting diodes on the second polyimide adhesive layer, or on the second polyimide adhesive layer and the transfer substrate; wherein, the center point of the light-emitting diode and the center point of the second polyimide adhesive layer coincide in the projection on the transfer substrate.

10. A display device, characterized in that, The display device includes the display panel according to any one of claims 5-7.

Images