Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises a substrate base plate, the substrate base plate comprises a display area, and the display area is provided with a light-emitting element; the at least one circle of blocking dam is located on the substrate and arranged around the display area, and an undercut structure is arranged on the side face of the blocking dam; the first inorganic packaging layer is located on the side, away from the substrate, of the blocking dam, and the first inorganic packaging layer is broken at the undercut structure. The packaging effect of the display panel can be improved.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and particularly to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) display devices have been listed as the next-generation display technologies with great development prospects because of their advantages such as being thin, light, having a wide viewing angle, being self-luminous, having continuously adjustable emission colors, low cost, fast response speed, low energy consumption, low driving voltage, a wide operating temperature range, simple production processes, high luminous efficiency, and being flexible for display. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a display panel, a manufacturing method thereof, and a display device, which can improve the encapsulation effect of the display panel.

[0004] To solve the above technical problem, the embodiments of the present invention provide the following technical solutions:

[0005] On the one hand, a display panel is provided, including:

[0006] A substrate, the substrate includes a display area, and a light-emitting element is disposed in the display area;

[0007] At least one circle of barrier ribs disposed on the substrate and surrounding the display area, and a bottom cut structure is disposed on a side surface of the barrier rib;

[0008] A first inorganic encapsulation layer located on a side of the barrier rib away from the substrate, and the first inorganic encapsulation layer breaks at the bottom cut structure.

[0009] In some embodiments, the bottom cut structure is located at a position of the barrier rib close to the substrate.

[0010] In some embodiments, the display panel further includes:

[0011] An organic encapsulation layer located on a side of the first inorganic encapsulation layer away from the substrate, and the organic encapsulation layer fills the bottom cut structure.

[0012] In some embodiments, the display panel further includes:

[0013] A second inorganic encapsulation layer located on a side of the organic encapsulation layer away from the substrate, and the second inorganic encapsulation layer is continuously disposed at the barrier rib.

[0014] In some embodiments, the height of the bottom cut structure is 0.5 - 2 micrometers, and the depth of the bottom cut structure is 0.1 - 10 micrometers.

[0015] In some embodiments, the undercut structure includes a side surface that forms an angle with the substrate, and the angle formed between the side surface and the substrate is 1°-80°.

[0016] An embodiment of the present invention further provides a display device, including the display panel as described above.

[0017] An embodiment of the present invention further provides a method for manufacturing a display panel, including:

[0018] Providing a substrate, the substrate includes a display area, and forming a light-emitting element in the display area;

[0019] Forming at least one circle of barrier ribs around the display area on the substrate, and an undercut structure is formed on the side surface of the barrier ribs;

[0020] Forming a first inorganic encapsulation layer on the substrate on which the barrier ribs are formed by chemical vapor deposition, and the first inorganic encapsulation layer breaks at the undercut structure.

[0021] In some embodiments, the method further includes:

[0022] Forming an organic encapsulation layer on the substrate on which the first inorganic encapsulation layer is formed, and the organic encapsulation layer fills the undercut structure.

[0023] In some embodiments, the method further includes:

[0024] Forming a second inorganic encapsulation layer on the substrate on which the organic encapsulation layer is formed, and the second inorganic encapsulation layer is continuously provided at the barrier ribs.

[0025] The embodiments of the present invention have the following beneficial effects:

[0026] In the above solution, an undercut structure is provided on the side surface of the barrier ribs. After the first inorganic encapsulation layer is formed, the first inorganic encapsulation layer can break at the undercut structure, so that the first inorganic encapsulation layer is divided into multiple segments, thereby making the water vapor intrusion path become multiple segments, which can increase the difficulty of water vapor intrusion, improve the waterproof performance of the display panel, and ensure the encapsulation effect of the display panel. Description of the Drawings

[0027] Figure 1 It is a plan view of the display panel;

[0028] Figure 2 It is a cross-sectional view of the display panel in the XX direction in the related art;

[0029] Figure 3 It is a schematic diagram of the water vapor intrusion path of the display panel in the related art;

[0030] Figure 4 Schematic diagram of forming a barrier dam according to an embodiment of the present invention;

[0031] Figure 5 Schematic diagram of forming a first inorganic encapsulation layer according to an embodiment of the present invention;

[0032] Figure 6 Enlarged schematic diagram of the barrier dam according to an embodiment of the present invention;

[0033] Figure 7 Schematic diagram of forming an organic encapsulation layer according to an embodiment of the present invention;

[0034] Figure 8 Schematic diagram of forming a second inorganic encapsulation layer according to an embodiment of the present invention;

[0035] Figure 9 Schematic diagram of the water vapor intrusion path of the display panel according to an embodiment of the present invention.

[0036] Reference numerals

[0037] 10 Display panel

[0038] 11 Display area

[0039] 20 Substrate

[0040] 21 Driving circuit layer

[0041] 22, 32 First inorganic encapsulation layer

[0042] 23, 33 Second inorganic encapsulation layer

[0043] 24, 34 Barrier dam

[0044] 25 Light-emitting element

[0045] 26, 36 Organic encapsulation layer

[0046] 27 Undercut structure

[0047] 271 Side surface Detailed implementation manners

[0048] To make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will be described in detail with reference to the accompanying drawings and specific embodiments.

[0049] Figure 1 Schematic plan view of the display panel, Figure 2 Schematic cross-sectional view of the display panel in the XX direction in the related art, as Figure 1 and Figure 2As shown, the display panel 10 includes a display area 11, on which a driving circuit layer and a light-emitting element are provided; the display panel 10 further includes at least one circle of barrier ribs 34 disposed around the display area 11. The display panel 10 may include one circle of barrier ribs 34 or multiple circles of barrier ribs 34, so as to Figure 1 take Figure 1 as an example, the display panel 10 includes two circles of barrier ribs 34.

[0050] As Figure 2 shown, the display panel includes a substrate 20, and a driving circuit layer 21, a light-emitting element 25, a barrier rib 34, a first inorganic encapsulation layer 32, an organic encapsulation layer 36 and a second inorganic encapsulation layer 33 located on the substrate 20. Among them, the organic encapsulation layer 36 is located within the barrier rib 34, and the first inorganic encapsulation layer 32, the organic encapsulation layer 36 and the second inorganic encapsulation layer 33 form the encapsulation structure of the display panel.

[0051] With the development of display products, the display panel is developing towards a narrow bezel direction. However, as the bezel of the display panel becomes narrower, the encapsulation path of the encapsulation structure will be shortened, and the encapsulation difficulty of the display panel will increase. As Figure 3 shown, after the display panel is cut at the position shown by the dashed box in the figure, the cross-sections of the first inorganic encapsulation layer 32 and the second inorganic encapsulation layer 33 of the encapsulation structure will be exposed, the compactness of the first inorganic encapsulation layer 32 and the second inorganic encapsulation layer 33 will decrease, and the interface between the first inorganic encapsulation layer 32 and the driving circuit layer 21 is likely to form a water vapor intrusion channel as shown by the arrow in Figure 3 . The narrow bezel display product greatly shortens the bezel of the display panel, which will lead to the shortening of the water vapor intrusion channel, resulting in the decline of the encapsulation effect of the display panel. Water vapor is likely to enter the display area, directly affecting the organic electroluminescent material of the light-emitting element and causing it to fail, resulting in a high incidence of poor reliability.

[0052] Embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device, which can improve the encapsulation effect of the display panel.

[0053] Embodiments of the present invention provide a display panel, as Figures 4 - 8 shown, including:

[0054] A substrate 20, the substrate 20 includes a display area, and a light-emitting element 25 is provided in the display area;

[0055] At least one circle of barrier ribs 24 disposed on the substrate 20 and surrounding the display area, and an undercut structure 27 is provided on the side surface of the barrier rib 24;

[0056] A first inorganic encapsulation layer 22 located on the side of the barrier rib 24 away from the substrate 20, and the first inorganic encapsulation layer 22 is broken at the undercut structure 27.

[0057] In this embodiment, a bottom cut structure is provided on the side of the barrier dam. After the first inorganic encapsulation layer is formed, the first inorganic encapsulation layer can break at the bottom cut structure, so that the first inorganic encapsulation layer is divided into multiple segments, thereby making the water vapor intrusion path become multiple segments, which can increase the difficulty of water vapor intrusion, improve the waterproof performance of the display panel, and ensure the encapsulation effect of the display panel.

[0058] In this embodiment, a driving circuit layer 21 and a light-emitting element 25 are provided in the display area of the display panel. The driving circuit layer 21 includes film layers such as a gate metal layer, a gate insulating layer, a source-drain metal layer, an interlayer insulating layer, and a planarization layer. A barrier dam 24 is provided around the display area, and a bottom cut structure 27 is provided on the side of the barrier dam 24 as Figure 4 shown. As Figure 5 shown, after the first inorganic encapsulation layer 22 is formed, the first inorganic encapsulation layer 22 can break at the bottom cut structure 27, so that the first inorganic encapsulation layer 22 is divided into multiple segments. In this way, the water vapor intrusion path can be made into multiple segments, increasing the difficulty of water vapor intrusion, thereby improving the waterproof performance of the display panel, ensuring the encapsulation effect of the display panel, and improving the reliability of the display panel.

[0059] In this embodiment, the display panel 10 may include a single circle of barrier dams 24 or multiple circles of barrier dams 24. Taking Figure 4 and Figure 5 as an example, the display panel 10 may include two circles of barrier dams 34.

[0060] The bottom cut structure 27 may be located at any position on the side of the barrier dam 24, as long as it ensures that the first inorganic encapsulation layer 22 can break. In some embodiments, as Figure 4 and Figure 5 shown, the bottom cut structure 27 may be located at the position of the barrier dam 24 close to the substrate 20, that is, at the bottom of the barrier dam 24.

[0061] In this embodiment, the first inorganic encapsulation layer 22 is formed on the substrate 20 with the barrier dam 24 by chemical vapor deposition (CVD). The first inorganic encapsulation layer 22 may be made of silicon nitride or silicon oxide. Due to the existence of the bottom cut structure 27 and the gas flow characteristics of the CVD coating, the coverage rate of the film layer at the position of the bottom cut structure 27 will decrease, and finally no coating is formed at the bottom of the bottom cut structure 27. Taking one of the barrier dams as an example, as Figure 6 shown, the first inorganic encapsulation layer 22 is divided into multiple segments at the barrier dam 24, forming four interfaces A, B, C, and D. The four interfaces A, B, C, and D are formed by coating in the CVD process. The interfaces are firm and not easily invaded by water vapor, which can improve the waterproof performance of the display panel, ensure the encapsulation effect of the display panel, and improve the reliability of the display panel.

[0062] In this embodiment, in order to ensure that the first inorganic encapsulation layer 22 can break at the position where the undercut structure 27 is located, as Figure 4 shown, the height h of the undercut structure 27 can be set to 0.5 - 2 microns, and the depth d of the undercut structure 27 can be set to 0.1 - 10 microns. The height h of the undercut structure 27 is greater than the thickness of the first inorganic encapsulation layer 22, so that when the first inorganic encapsulation layer 22 is formed on the substrate 20 with the dam 24, it can be ensured that the first inorganic encapsulation layer 22 breaks.

[0063] As Figure 4 shown, the undercut structure 27 includes a side surface 271 at an angle with the substrate 20. If the angle α between the side surface 271 and the substrate 20 is too small, the first inorganic encapsulation layer 22 may not necessarily break at the position where the undercut structure 27 is located. In this embodiment, α is set to 1° - 80°, specifically it can be 60 - 80°, so that it can be ensured that the first inorganic encapsulation layer 22 can break at the position where the undercut structure 27 is located.

[0064] In this embodiment, as Figure 7 shown, the display panel further includes: an organic encapsulation layer 26 on the side of the first inorganic encapsulation layer 22 away from the substrate 20, and the organic encapsulation layer 26 fills the undercut structure 27. In the related art, the organic encapsulation layer is only located within the dam. In this embodiment, the organic encapsulation layer 26 is formed by printing at the position of the dam 24. The height of the organic encapsulation layer 26 is lower than the height of the dam 24, but the organic encapsulation layer 26 can fill the gap at the undercut structure 27. The organic encapsulation layer 26 includes a large number of pores and can adsorb water vapor. Thus, even if water vapor invades along the first inorganic encapsulation layer 22, when passing through the organic encapsulation layer 26, the water vapor will be adsorbed by the pores in the organic encapsulation layer 26, thereby extending the water vapor invasion path, blocking the invasion of water vapor, further improving the waterproof performance of the display panel, ensuring the encapsulation effect of the display panel, and improving the reliability of the display panel.

[0065] In some embodiments, as Figure 8 shown, the display panel further includes:

[0066] A second inorganic encapsulation layer 23 located on a side of the organic encapsulation layer 26 away from the substrate 20, and the second inorganic encapsulation layer 23 is continuously provided at the dam 24. The second inorganic encapsulation layer 23 can be prepared from silicon nitride or silicon oxide. The second inorganic encapsulation layer 23 can be prepared by chemical vapor deposition. The second inorganic encapsulation layer 23 has good compactness, can cover the organic encapsulation layer 26 and the first inorganic encapsulation layer 22, and forms an encapsulation structure with the organic encapsulation layer 26 and the first inorganic encapsulation layer 22 to ensure the encapsulation effect of the display panel and improve the reliability of the display panel.

[0067] As Figure 9 shown, the dashed line with an arrow indicates the water vapor intrusion path. It can be seen that the water vapor intrusion path is divided into multiple segments, which can reduce the probability of water vapor intruding into the interior of the display panel; and the four interfaces A, B, C, and D are formed by using the CVD process, the interfaces are firm and not easily broken through by water vapor, and have good water blocking performance; the organic encapsulation layer 26 can extend the water vapor intrusion path and block the intrusion of water vapor; thus, at the position of one dam 24, eight water vapor interception interfaces can be formed: 1. The interface between the first inorganic encapsulation layer 22 and the driving circuit layer 21; 2. Interface D; 3. Organic encapsulation layer 26; 4. Interface C; 5. The interface between the first inorganic encapsulation layer 22 and the dam 24; 6. Interface B; 7. Organic encapsulation layer 26; 8. Interface A. If two dams 24 are provided, sixteen water vapor interception interfaces can be formed, which can ensure the encapsulation effect of the display panel and improve the reliability of the display panel.

[0068] An embodiment of the present invention further provides a display device, including the display panel as described above.

[0069] The display device includes, but is not limited to: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply, etc. Those skilled in the art can understand that the structure of the above display device does not constitute a limitation on the display device. The display device may include more or fewer components as described above, or combine some components, or have different component arrangements. In an embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, etc.

[0070] The display device may be: a television, a display, a digital photo frame, a mobile phone, a tablet computer, or any product or component with a display function. Among them, the display device further includes a flexible circuit board, a printed circuit board, and a backplane.

[0071] An embodiment of the present invention further provides a method for manufacturing a display panel, including:

[0072] Provide a substrate, the substrate includes a display area, and light-emitting elements are formed in the display area;

[0073] Form at least one circle of barrier ribs around the display area on the substrate, and an undercut structure is formed on the side surface of the barrier ribs;

[0074] Form a first inorganic encapsulation layer on the substrate on which the barrier ribs are formed by chemical vapor deposition, and the first inorganic encapsulation layer breaks at the undercut structure.

[0075] In this embodiment, an undercut structure is provided on the side surface of the barrier ribs. In this way, after the first inorganic encapsulation layer is formed, the first inorganic encapsulation layer can break at the undercut structure, so that the first inorganic encapsulation layer is divided into multiple segments, thereby making the water vapor intrusion path become multiple segments, which can increase the difficulty of water vapor intrusion, improve the waterproof performance of the display panel, and ensure the encapsulation effect of the display panel.

[0076] As Figures 4 - 8 shown, the manufacturing method of the display panel in this embodiment includes:

[0077] Step 1, as Figure 4 shown, provide a substrate 20, form a driving circuit layer 21 and barrier ribs 24 on the substrate 20, and an undercut structure 27 is formed at the bottom of the barrier ribs 24;

[0078] Among them, the driving circuit layer 21 includes film layers such as a gate metal layer, a gate insulating layer, a source-drain metal layer, an interlayer insulating layer, and a planarization layer.

[0079] The barrier ribs 24 can be made of metal. The display panel in this embodiment can include one circle of barrier ribs 24, or can include multiple circles of barrier ribs 24. Taking Figure 4 and Figure 5 as an example, the display panel can include two circles of barrier ribs 34. Specifically, a barrier rib transition structure can be formed by using multiple layers of metal. After the barrier rib transition structure is formed, the side surface of the barrier rib transition structure is etched to form an undercut structure 27.

[0080] The undercut structure 27 can be located at any position on the side surface of the barrier ribs 24, as long as it ensures that the first inorganic encapsulation layer 22 can break. In some embodiments, as Figure 4 and Figure 5 shown, the undercut structure 27 can be located at a position of the barrier ribs 24 close to the substrate 20, that is, at the bottom of the barrier ribs 24.

[0081] In this embodiment, in order to ensure that the first inorganic encapsulation layer 22 can break at the position where the undercut structure 27 is located, as Figure 4As shown, the height h of the undercut structure 27 can be set to 0.5 - 2 μm, and the depth d of the undercut structure 27 can be set to 0.1 - 10 μm. The height h of the undercut structure 27 is greater than the thickness of the first inorganic encapsulation layer 22, so that when the first inorganic encapsulation layer 22 is formed on the substrate 20 with the barrier dam 24 formed thereon, it can be ensured that the first inorganic encapsulation layer 22 breaks.

[0082] As Figure 4 shown, the undercut structure 27 includes a side surface 271 that forms an angle with the substrate 20. If the angle α formed between the side surface 271 and the substrate 20 is too small, the first inorganic encapsulation layer 22 may not necessarily break at the position of the undercut structure 27. In this embodiment, α is set to 1° - 80°, specifically it can be 60 - 80°, so that it can be ensured that at the position of the undercut structure 27, the first inorganic encapsulation layer 22 can break.

[0083] Step 2: As Figure 5 shown, the first inorganic encapsulation layer 22 is formed on the substrate 20 with the barrier dam 24 formed thereon by chemical vapor deposition, and the first inorganic encapsulation layer 22 breaks at the undercut structure;

[0084] The first inorganic encapsulation layer 22 can be made of silicon nitride or silicon oxide. Due to the existence of the undercut structure 27 and the characteristics of the CVD coating gas flow, the film coverage rate at the position of the undercut structure 27 will decrease, and finally no coating is formed at the bottom of the undercut structure 27. Taking one of the barrier dams as an example, as Figure 6 shown, the first inorganic encapsulation layer 22 is divided into multiple segments at the barrier dam 24, forming four interfaces A, B, C, and D. The four interfaces A, B, C, and D are formed by coating in the CVD process. The interfaces are firm and not easily invaded by water vapor, which can improve the waterproof performance of the display panel, ensure the encapsulation effect of the display panel, and improve the reliability of the display panel.

[0085] Step 3: As Figure 7 shown, an organic encapsulation layer 26 is formed on the substrate 20 with the first inorganic encapsulation layer 22 formed thereon, and the organic encapsulation layer 26 fills the undercut structure 27;

[0086] In the related art, the organic encapsulation layer is only located within the dam. In this embodiment, an organic encapsulation layer 26 is formed by printing at the position where the dam 24 is located. The height of the organic encapsulation layer 26 is lower than that of the dam 24, but the organic encapsulation layer 26 can fill the notch at the undercut structure 27. The organic encapsulation layer 26 includes a large number of pores and can adsorb water vapor. In this way, even if water vapor invades along the first inorganic encapsulation layer 22, when passing through the organic encapsulation layer 26, the water vapor will be adsorbed by the pores in the organic encapsulation layer 26, thereby extending the water vapor invasion path, blocking the invasion of water vapor, further improving the waterproof performance of the display panel, ensuring the encapsulation effect of the display panel, and improving the reliability of the display panel.

[0087] Step 4, as Figure 8 shown, a second inorganic encapsulation layer 23 is formed on the substrate 20 on which the organic encapsulation layer 26 is formed, and the second inorganic encapsulation layer 23 is continuously provided at the dam 24.

[0088] The second inorganic encapsulation layer 23 can be prepared by using silicon nitride or silicon oxide. The second inorganic encapsulation layer 23 can be prepared by chemical vapor deposition. The second inorganic encapsulation layer 23 has good compactness and can coat the organic encapsulation layer 26 and the first inorganic encapsulation layer 22, and form an encapsulation structure with the organic encapsulation layer 26 and the first inorganic encapsulation layer 22, ensuring the encapsulation effect of the display panel and improving the reliability of the display panel.

[0089] As Figure 9 shown, the dotted line with arrows indicates the water vapor invasion channel. It can be seen that the water vapor invasion channel is divided into multiple segments, which can reduce the probability of water vapor invading into the interior of the display panel; and the four interfaces A, B, C, and D are formed by using the CVD process, the interfaces are firm and not easily broken through by water vapor, and the water blocking performance is good; the organic encapsulation layer 26 can extend the water vapor invasion path and block the invasion of water vapor; in this way, at the position of one dam 24, eight water vapor interception interfaces can be formed: 1. The interface between the first inorganic encapsulation layer 22 and the driving circuit layer 21; 2. Interface D; 3. Organic encapsulation layer 26; 4. Interface C; 5. The interface between the first inorganic encapsulation layer 22 and the dam 24; 6. Interface B; 7. Organic encapsulation layer 26; 8. Interface A. If two dams 24 are provided, sixteen water vapor interception interfaces can be formed, which can ensure the encapsulation effect of the display panel and improve the reliability of the display panel.

[0090] It should be noted that the embodiments in this specification are all described in a progressive manner. The same or similar parts among the embodiments can be referred to each other, and the key points of each embodiment are the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can refer to the partial descriptions of the product embodiments.

[0091] Unless otherwise defined, technical terms or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second" and similar words used in this disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Words such as "comprising" or "including" mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Words such as "upper", "lower", "left", "right" are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0092] It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element, or intervening elements may be present.

[0093] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner.

[0094] As described above, only the specific embodiments of this disclosure are provided, but the protection scope of this disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed in this disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure shall be subject to the protection scope of the claims.

Claims

1. A display panel, characterized in that: include: A base substrate, the base substrate comprising a display area, and the display area is provided with a light-emitting element; At least one circle of barrier dams located on the base substrate and arranged around the display area, wherein the side of the barrier dams is provided with an undercut structure; A first inorganic encapsulation layer is located on a side of the blocking dam away from the substrate, and the first inorganic encapsulation layer is broken at the undercut structure.

2. The display panel according to claim 1, characterized in that: The undercut structure is located at a position where the blocking dam is close to the substrate.

3. The display panel according to claim 1, characterized in that: The display panel further includes: An organic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the base substrate, and the organic encapsulation layer fills the undercut structure.

4. The display panel according to claim 3, characterized in that: The display panel further includes: A second inorganic encapsulation layer is located on a side of the organic encapsulation layer away from the base substrate, and the second inorganic encapsulation layer is continuously disposed at the blocking dam.

5. The display panel according to any one of claims 1 to 4, characterized in that: The height of the undercut structure is 0.5-2 micrometers, the depth of the undercut structure is 0.1-10 micrometers, and the depth of the undercut structure is 0.1-10 micrometers.

6. The display panel according to any one of claims 1 to 4, characterized in that: The undercut structure includes a side surface that forms a certain angle with the substrate, and the angle formed between the side surface and the substrate is 1°-80°.

7. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 6.

8. A method for manufacturing a display panel, characterized in that: include: Providing a base substrate, the base substrate comprising a display area, and forming a light-emitting element in the display area; forming at least one circle of barrier dams surrounding the display area on the base substrate, wherein the side surfaces of the barrier dams are formed with undercut structures; A first inorganic encapsulation layer is formed on the base substrate with the barrier dam formed thereon by chemical vapor deposition, and the first inorganic encapsulation layer is broken at the undercut structure.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The method further comprises: An organic encapsulation layer is formed on the base substrate having the first inorganic encapsulation layer formed thereon, and the organic encapsulation layer fills the undercut structure.

10. The method for manufacturing a display panel according to claim 9, characterized in that: The method further comprises: A second inorganic encapsulation layer is formed on the base substrate having the organic encapsulation layer formed thereon, wherein the second inorganic encapsulation layer is continuously disposed at the barrier dam.

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