Display panel, preparation method thereof and display device

Abstract

The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an insulating layer, a first electrode and a pixel definition layer. The insulating layer is located on one side of the substrate and comprises a protruding part and a concave part, and the protruding part protrudes in the direction away from the substrate relative to the concave part. At least part of the first electrode is located on the side, away from the substrate, of the protruding part. The pixel definition layer comprises a pixel definition part, and the pixel definition part is located on the side, away from the substrate, of the sunken part; the pixel defining part is enclosed to form a pixel opening, and the orthographic projection of the pixel opening on the substrate is overlapped with the orthographic projection of the first electrode on the substrate. The display effect of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel, a preparation method thereof, and a display device. Background Art

[0002] Flat panel display devices based on technologies such as Organic Light Emitting Diode (OLED) and Light Emitting Diode (LED) are widely used in various consumer electronic products such as mobile phones, televisions, laptop computers, and desktop computers due to advantages such as high picture quality, power saving, thin body, and wide application range, and have become the mainstream in display panels. In the preparation process of traditional display panels, the light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of traditional OLED processes on display screen size, resolution, and other screen body performances, and has the advantages of high performance, full domain size, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A record the relevant content of the fine metal maskless technology for reference.

[0003] However, there are still some problems in the display panel that need to be solved urgently. Summary of the Invention

[0004] Based on this, the present application provides a display panel, a preparation method thereof, and a display device that can improve the display effect.

[0005] To achieve the above object, on the one hand, a display panel is provided, including:

[0006] A substrate;

[0007] An insulating layer located on one side of the substrate. The insulating layer includes a protruding portion and a recessed portion, and the protruding portion protrudes away from the substrate relative to the recessed portion;

[0008] A first electrode, at least a part of which is located on the side of the protruding portion away from the substrate;

[0009] A pixel definition layer, which includes pixel definition parts located on the side of the recessed portion away from the substrate; the pixel definition parts enclose to form a pixel opening, and the orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first electrode on the substrate.

[0010] In one embodiment, the first electrode includes a main body portion located on the surface of the convex portion away from the substrate.

[0011] There is a height difference between the surface of the pixel defining portion away from the substrate and the surface of the main body portion of the first electrode away from the substrate, and the height difference is less than or equal to 1 μm.

[0012] And / or, the height of the surface of the pixel defining portion away from the substrate is greater than or less than the height of the surface of the main body portion of the first electrode away from the substrate.

[0013] In one embodiment, the height of the surface of the pixel defining portion away from the substrate is greater than the height of the surface of the main body portion of the first electrode away from the substrate.

[0014] The pixel defining portion includes a first portion with a height higher than that of the main body portion of the first electrode. Along the direction away from the center of the pixel opening, the height of the side wall of the first portion facing the pixel opening gradually increases.

[0015] And / or, the side wall of the first portion facing the pixel opening is inclined, or the surface of the side wall of the first portion facing the pixel opening includes a curved surface.

[0016] And / or, the pixel defining portion further includes a second portion located on the side of the first portion close to the substrate. The second portion extends beyond the first portion towards the pixel opening, and the height of the side away from the substrate of the second portion is equal to the height of the surface of the main body portion of the first electrode away from the substrate.

[0017] In one embodiment, the orthographic projection of the first electrode on the substrate is located within the orthographic projection of the pixel opening on the substrate.

[0018] And / or, the side away from the substrate of the pixel opening exposes the entire surface of the first electrode away from the substrate.

[0019] And / or, the area of the orthographic projection of the first electrode on the substrate is equal to the area of the orthographic projection of the pixel opening on the substrate.

[0020] In one embodiment, the orthographic projection of the surface of the first electrode away from the substrate on the substrate does not overlap with the orthographic projection of the pixel defining portion on the substrate.

[0021] And / or, the orthographic projection of the first electrode on the substrate does not overlap with the orthographic projection of the recessed portion on the substrate.

[0022] And / or, the outer edge of the surface of the first electrode away from the substrate coincides with the edge of the orthographic projection of the pixel defining portion on the substrate facing the first electrode.

[0023] And / or, the orthographic projection of the gap between adjacent first electrodes on the substrate is located within the orthographic projection of the recessed portion on the substrate.

[0024] In one embodiment, the orthographic projection of the recessed portion on the substrate is located within the orthographic projection of the pixel defining portion on the substrate; or, the orthographic projection of the pixel defining portion on the substrate is located within the orthographic projection of the recessed portion on the substrate;

[0025] And / or, the area of the orthographic projection of the bottom of the recessed portion on the substrate is equal to the area of the orthographic projection of the surface of the pixel defining portion close to the substrate on the substrate;

[0026] And / or, the surface of the protruding portion away from the substrate does not contact the pixel defining portion.

[0027] In one embodiment, the orthographic projection of the first electrode on the substrate is located within the orthographic projection of the protruding portion on the substrate, and / or, the area of the orthographic projection of the first electrode on the substrate is equal to the area of the orthographic projection of the protruding portion on the substrate;

[0028] And / or, the orthographic projection of the protruding portion on the substrate is located within the orthographic projection of the first electrode on the substrate. The first electrode includes a main body portion, the main body portion is located on the surface of the protruding portion away from the substrate, the pixel defining portion includes a first part and a second part, the first part is higher than the main body portion of the first electrode, and the second part is located on the side of the first part close to the substrate, and the second part contacts the first electrode.

[0029] In one embodiment, the distance between the surface of the pixel defining portion close to the substrate and the substrate in the thickness direction of the substrate is less than the distance between at least a part of the surface of the first electrode close to the substrate and the substrate in the thickness direction of the substrate;

[0030] And / or, the orthographic projection of the pixel defining portion on the substrate overlaps with the orthographic projection of the recessed portion on the substrate;

[0031] And / or, the orthographic projection of the side wall of the pixel defining portion facing the pixel opening on the substrate overlaps with the orthographic projection of the side wall of the recessed portion on the substrate;

[0032] And / or, the orthographic projection of the side wall of the pixel defining portion facing the pixel opening on the substrate overlaps with the orthographic projection of the side wall of the protruding portion on the substrate;

[0033] And / or, at least a part of the pixel defining portion is located within the recessed portion;

[0034] And / or, the pixel defining portion includes an inorganic insulating material;

[0035] And / or, the insulating layer includes an organic insulating material;

[0036] And / or, the insulating layer contacts the first electrode;

[0037] And / or, the recessed portion does not penetrate through the insulating layer;

[0038] And / or, the concave portion is in a grid shape;

[0039] And / or, there are multiple convex portions, and the multiple convex portions are arranged at intervals.

[0040] In one embodiment, the surface of the pixel defining portion away from the substrate is flush with the surface of the first electrode away from the substrate.

[0041] In one embodiment, the display panel includes:

[0042] An isolation structure, located on the side of the pixel defining portion away from the substrate, the isolation structure encloses an isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0043] In one embodiment, the orthographic projection of the isolation structure on the substrate overlaps with the orthographic projection of the concave portion on the substrate.

[0044] In one embodiment, the isolation structure includes a first isolation structure and a second isolation structure that are sequentially stacked along the direction away from the substrate;

[0045] The orthographic projection of the side of the first isolation structure away from the substrate on the substrate is located within the orthographic projection of the second isolation structure on the substrate,

[0046] The isolation structure further includes a third isolation structure, the third isolation structure is located between the pixel defining portion and the first isolation structure, and the orthographic projection of the first isolation structure on the substrate is located within the orthographic projection of the third isolation structure on the substrate.

[0047] In one embodiment, the orthographic projection of the isolation structure on the substrate does not overlap with the orthographic projection of the first electrode on the substrate;

[0048] And / or, the display panel further includes:

[0049] A light-emitting layer, located on the side of the first electrode away from the substrate;

[0050] A second electrode, located on the side of the light-emitting layer away from the substrate;

[0051] The isolation structure includes a conductive material, and the second electrode is electrically connected to the isolation structure;

[0052] The light-emitting layer covers a partial surface of the pixel defining portion away from the substrate.

[0053] In one embodiment, in the direction from away from the substrate to close to the substrate, the orthographic projection area of the convex portion on the substrate gradually increases;

[0054] And / or,

[0055] In the direction from away from the substrate to close to the substrate, the orthographic projection area of the first electrode on the substrate gradually increases.

[0056] On the other hand, a method for manufacturing a display panel is provided. The method for manufacturing a display panel includes:

[0057] Providing a substrate;

[0058] Forming an insulating layer and a first electrode on one side of the substrate. The insulating layer includes a protruding portion and a recessed portion. The protruding portion protrudes away from the substrate relative to the recessed portion. At least a part of the first electrode is located on the side of the protruding portion away from the substrate;

[0059] Forming a pixel definition layer on the side of the insulating layer away from the substrate. The pixel definition layer includes pixel definition portions. The pixel definition portions are located on the side of the recessed portion away from the substrate; the pixel definition portions enclose a pixel opening, and the orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first electrode on the substrate.

[0060] In one embodiment, forming an insulating layer and a first electrode on one side of the substrate includes:

[0061] Forming an insulating material layer on one side of the substrate;

[0062] Forming a first electrode material layer on the side of the insulating material layer away from the substrate;

[0063] Etching the first electrode material layer and the insulating material layer in sequence to form the first electrode and the insulating layer including the recessed portion and the protruding portion.

[0064] In one embodiment, forming an insulating layer and a first electrode on one side of the substrate includes:

[0065] Forming an insulating material layer on one side of the substrate;

[0066] Etching the insulating material layer to form an insulating layer including a recessed portion and a protruding portion;

[0067] Forming a first electrode material layer covering the insulating layer;

[0068] Etching the first electrode material layer to form the first electrode located on the side of the protruding portion away from the substrate.

[0069] In one embodiment, forming a pixel definition layer on the side of the insulating layer away from the substrate includes:

[0070] Forming a pixel definition material layer on the side of the insulating layer and the first electrode away from the substrate;

[0071] Etching the pixel definition material layer to form a pixel opening in the pixel definition material layer. The pixel opening exposes the first electrode, and at least a part of the remaining pixel definition material layer forms the pixel definition portion;

[0072] There is a height difference between the surface of the pixel defining portion away from the substrate and the surface of the main body portion of the first electrode away from the substrate, and the height difference is less than or equal to 1 μm. The main body portion of the first electrode is located on the surface away from the substrate of the convex portion.

[0073] In one embodiment, after etching the pixel defining material layer to form a pixel opening in the pixel defining material layer, it includes:

[0074] Form an isolation structure on the side of the pixel defining portion away from the substrate. The isolation structure encloses to form an isolation opening, and the isolation opening exposes at least a part of the first electrode;

[0075] Form a light-emitting layer and a second electrode on the side of the first electrode away from the substrate. The second electrode is located on the side of the light-emitting layer away from the substrate and is connected to the isolation structure.

[0076] In one embodiment, forming a pixel defining layer on the side of the insulating layer away from the substrate includes:

[0077] Form a pixel defining material layer located on the side of the first electrode and the insulating layer away from the substrate;

[0078] Form an isolation material layer located on the side of the pixel defining material layer away from the substrate;

[0079] Etch the isolation material layer and the pixel defining material layer in sequence to form an isolation opening and a pixel opening. The pixel opening exposes the first electrode, and at least a part of the remaining pixel defining material layer forms the pixel defining portion, and at least a part of the remaining isolation material layer forms the isolation structure;

[0080] After forming the pixel defining layer on the side of the insulating layer away from the substrate, it includes:

[0081] Form a light-emitting layer and a second electrode on the side of the first electrode away from the substrate. The second electrode is located on the side of the light-emitting layer away from the substrate and is connected to the isolation structure.

[0082] On the other hand, a display device is provided, and the display device includes the display panel described in any of the foregoing embodiments.

[0083] The display panel, its manufacturing method, and the display device of the present application have the following beneficial effects: By forming a convex portion and a concave portion on the insulating layer, and disposing at least a part of the first electrode on the side of the convex portion away from the substrate, and the pixel defining portion is located on the side of the concave portion away from the substrate, the first electrode can be elevated, the height of the pixel defining portion can be reduced, and further the height difference between the surface of the first electrode away from the substrate and the surface of the pixel defining layer (for example, the pixel defining portion) away from the substrate can be reduced. Then, when forming the second electrode (for example, the cathode), the surface of the first electrode away from the substrate and the surface of the pixel defining layer away from the substrate can be relatively flush, which is beneficial to forming a continuous second electrode (for example, the cathode), reducing the risk of breakage of the second electrode at the side wall of the pixel defining portion facing the pixel opening, and further improving the display effect of the display panel. Description of the Drawings

[0084] To more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0085] Figure 1 Schematic cross-sectional structure diagram of the anode formed in the related art;

[0086] Figure 2 Schematic cross-sectional structure diagram of the pixel defining material layer formed in the related art;

[0087] Figure 3 Schematic cross-sectional structure diagram of the isolation material layer formed in the related art;

[0088] Figure 4 Schematic diagram of the etching process of the isolation material layer in the related art;

[0089] Figure 5 Schematic cross-sectional structure diagram of the isolation in the related art;

[0090] Figure 6 Schematic cross-sectional structure diagram of the pixel defining portion formed in the related art;

[0091] Figure 7 Flowchart of the manufacturing method of the display panel provided in an embodiment;

[0092] Figure 8 Schematic cross-sectional structure diagram after forming the insulating layer and the first electrode provided in an embodiment;

[0093] Figure 9Schematic cross-sectional structure diagram after forming a pixel defining material layer in an embodiment;

[0094] Figure 10 Schematic cross-sectional structure diagram after forming a pixel defining portion in an embodiment;

[0095] Figure 11 Schematic cross-sectional structure diagram of a display panel provided in an embodiment;

[0096] Figure 12A Schematic cross-sectional structure diagram of a display panel provided in another embodiment;

[0097] Figure 12B Schematic cross-sectional structure diagram of a display panel provided in yet another embodiment;

[0098] Figure 13 Schematic cross-sectional structure diagram after forming a pixel defining portion in yet another embodiment;

[0099] Figure 14 Schematic cross-sectional structure diagram after forming a pixel defining material layer provided in still another embodiment;

[0100] Figure 15 Schematic cross-sectional structure diagram after forming an isolation material layer provided in still another embodiment;

[0101] Figure 16 Schematic diagram of the etching process of the isolation material layer provided in still another embodiment;

[0102] Figure 17 Schematic cross-sectional structure diagram after forming an isolation structure provided in still another embodiment;

[0103] Figure 18 Schematic cross-sectional structure diagram after forming a pixel defining portion provided in still another embodiment;

[0104] Figure 19 Schematic cross-sectional structure diagram after forming a pixel defining material layer provided in yet another embodiment;

[0105] Figure 20 Schematic cross-sectional structure diagram after forming a pixel defining portion provided in yet another embodiment;

[0106] Figure 21 Top view of an insulating layer provided in an embodiment.

[0107] Explanation of the figure marks: 100-display panel; 110-substrate; 120-insulating layer; 121-convex portion; 122-recessed portion; 130-first electrode; 140-pixel definition portion; 1400-pixel definition material layer; 141-second portion; 142-first portion; 150-isolation structure; 1500-isolation material layer; 152-first isolation structure; 1520-first isolation material layer; 153-second isolation structure; 1530-second isolation material layer; 151-third isolation structure; 1510-third isolation material layer; 160-light-emitting layer; 170-second electrode; 181--first inorganic encapsulation layer; 182-organic encapsulation layer; 183-second inorganic encapsulation layer.

[0108] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the embodiments and / or examples currently described, and the best modes of these inventions currently understood. DETAILED DESCRIPTION

[0109] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0110] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0111] In each embodiment, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in each embodiment can be understood according to the specific situation.

[0112] It should be understood that when an element or layer is referred to as "on", "adjacent to", "connected to" another element or layer, it can be directly on, adjacent to, connected or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as "directly on", "directly adjacent to", "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Thus, without departing from the teachings of this embodiment, the first element, component, region, layer or part discussed below may be denoted as the second element, component, region, layer or part.

[0113] Spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. are used herein to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, an element or feature described as "under", "beneath" or "underneath" another element or feature will be oriented "on" the other element or feature. Thus, the exemplary terms "under" and "beneath" can include both the upper and lower orientations. In addition, the device may also have additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are to be interpreted accordingly.

[0114] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that when the terms "comprise" and / or "include" are used in this specification, the presence of the stated features, integers, steps, operations, elements and / or components can be determined, but one or more other features, integers, steps, operations, elements, components and / or groups are not excluded. Also, as used herein, the term "and / or" includes any and all combinations of the associated listed items. At least part may include part or all.

[0115] Embodiments of the present application are described with reference to cross-sectional views that are schematic diagrams of ideal embodiments (and intermediate structures) of the present application, such that variations in the shapes shown can be expected due to, for example, manufacturing techniques and / or tolerances. Accordingly, embodiments of the present application should not be limited to the specific shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing techniques. The regions shown in the figures are substantially schematic, and their shapes do not represent the actual shapes of the regions of the device and do not limit the scope of the embodiments of the present application.

[0116] Please refer to Figures 1 to 6 , the display effect of the display panel in the related art is not good. Specifically, please refer to Figure 1 , Figure 2 and Figure 3 , when preparing the display panel, a pixel defining material layer 12 and an isolation material layer 13 are often first formed on a substrate 10 and an anode 11. After that, please refer to Figure 4 and Figure 5 , the isolation material layer 13 can be etched step by step to form an isolation structure 14. Please refer to Figure 6 , the pixel defining material layer 12 can be etched based on the isolation structure 14 to form a pixel defining portion 12a. At this time, a relatively steep taper is formed on the portion of the pixel defining portion 12a covering the anode 11 (as shown at A in Figure 6 ). The present application has found through research that when forming the cathode in subsequent steps, the cathode is prone to break at this position, thereby affecting the display effect of the display panel.

[0117] Based on this, in one embodiment, a display panel 100 is provided. Figure 7 is a manufacturing method for the display panel 100, Figures 8 to 18 is a schematic diagram of an intermediate cross-sectional structure obtained by the manufacturing method of the display panel 100. Specifically, the display panel 100 may include a substrate 110, an insulating layer 120, a first electrode 130, and a pixel defining layer.

[0118] Please refer to Figure 8 , the substrate 110 may be a substrate. For example, the display panel may include a plurality of pixel circuits arranged in an array on the substrate or the substrate, and the pixel circuits may include thin film transistors and storage capacitors, etc. In addition, the substrate 110 may also be provided with multiple layers of signal traces and corresponding insulating layers, etc. The specific form of the substrate 110 is not limited in this embodiment. The first electrode can be connected to the pixel circuit through a via hole penetrating the insulating layer 120.

[0119] Exemplarily, the first electrode 130 may be an anode. Of course, the first electrode 130 may also be a cathode, which is not limited here. A plurality of spaced-apart first electrodes 130 may be provided in the display panel 100. The material of the first electrode 130 may include conductive materials such as metals.

[0120] For example, the display panel further includes a driving circuit layer located between the substrate 110 and the insulating layer 120. For example, the driving circuit layer may include pixel circuits. The first electrode may be connected to the driving circuit layer through a via hole penetrating the insulating layer 120.

[0121] The insulating layer 120 is located on one side of the substrate 110. The insulating layer 120 may include an organic layer and / or an inorganic layer. The material of the insulating layer 120 may include an organic material, such as an organic insulating material.

[0122] The surface of the substrate 110 may be uneven. At this time, the insulating layer 120 may be provided to cover the substrate 110 to obtain a flat surface, which is beneficial to the formation of other structures. The material of the insulating layer 120 may include an organic insulating material.

[0123] The insulating layer 120 may include a protruding portion 121 and a recessed portion 122. Specifically, the insulating layer 120 may include a plurality of spaced-apart protruding portions 121. The protruding portion 121 may protrude away from the substrate 110 relative to the recessed portion 122. Exemplarily, the recessed portion 122 is in a grid shape. The recessed portion 122 may not penetrate the insulating layer 120. For example, the recessed portion 122 does not penetrate the insulating layer 120. For example, the recessed portion 122 may be a groove. The protruding portion 121 protrudes away from the substrate 110 at a position corresponding to the mesh hole of the grid-shaped recessed portion 122 (please refer to Figure 21 ). The specific size of the protruding portion 121 is not limited in this embodiment. At this time, the first electrode 130 may be located on the side of the protruding portion 121 away from the substrate 110, and the protruding portion 121 may be correspondingly arranged with the first electrode 130. For example, the height of the surface of the protruding portion 121 away from the substrate is higher than the bottom of the recessed portion 122. For example, the distance between the surface of the pixel defining portion close to the substrate and the substrate in the thickness direction Z of the substrate is less than the distance between at least a part of the first electrode (such as the main body portion 131) close to the substrate and the substrate in the thickness direction Z of the substrate. For example, the insulating layer 120 is in contact with the first electrode 130.

[0124] Please refer to Figure 9 and Figure 10 , the pixel defining layer may include a pixel defining portion 140. Exemplarily, the pixel defining portion includes an inorganic insulating material, such as one or more of silicon oxide, silicon nitride, and silicon oxynitride.

[0125] The pixel defining portion 140 encloses to form a pixel opening. At this time, the pixel defining portion 140 can be used to form a plurality of pixels and insulate and isolate the cathode and the anode. The pixel defining portion 140 can be located on the side of the recessed portion 122 away from the substrate 110. The orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first electrode 130 on the substrate 110, so that at least a part of the first electrode 130 is exposed by the pixel defining portion 140. As an example, the pixel defining layer can expose the entire first electrode 130.

[0126] It can be understood that, referring to Figure 11 , a light emitting layer 160 and a second electrode 170 can also be provided in the display panel 100. The light emitting layer 160 in a plurality of pixel openings can be used to emit a variety of different colors of light. For example, the light emitting layer 160 in a plurality of pixel openings can be respectively used to emit red, blue or green light. Exemplarily, the second electrode 170 can be a cathode, and at this time the first electrode 130 is an anode. Alternatively, the second electrode 170 can also be set as an anode, and at this time the first electrode 130 is a cathode. Specifically, the light emitting layer 160 can be located on the side of the first electrode 130 away from the substrate 110. Exemplarily, the light emitting layer 160 can also extend to the surface of the pixel defining portion 140 away from the substrate 110. The second electrode 170 can be located on the side of the light emitting layer 160 away from the substrate 110, and the second electrode 170 can extend from above the first electrode 130 to above the pixel defining portion 140.

[0127] In this embodiment, by forming the convex portion 121 and the concave portion 122 on the insulating layer 120 and arranging the first electrode 130 on the side of the convex portion 121 away from the substrate 110, and the pixel defining portion is located on the side of the concave portion away from the substrate, the first electrode 130 can be lifted, the height of the pixel defining portion can be reduced, and further the height difference between the surface of the first electrode 130 away from the substrate 110 and the surface of the pixel defining portion 140 away from the substrate 110 can be reduced. After that, when forming the second electrode 170 (such as a cathode), the surface of the first electrode 130 away from the substrate 110 and the surface of the pixel defining portion 140 away from the substrate 110 can be relatively flush, which is beneficial to forming a continuous second electrode 170 (such as a cathode), reducing the risk of the second electrode breaking at the side wall of the pixel defining portion facing the pixel opening, and further improving the display effect of the display panel 100.

[0128] In one embodiment, the first electrode 130 includes a main body portion 131. The main body portion 131 is located on the surface of the convex portion 121 away from the substrate 110. Exemplarily, referring to Figure 10 , the first electrode 130 can only include the main body portion 131. Exemplarily, referring to Figure 20, the first electrode 130 may also include both a main body portion 131 and an extension portion 132 connecting the main body portion 131. The extension portion 132 extends to the area where the recessed portion is located. For example, the orthographic projection of the convex portion 121 on the substrate is located within the orthographic projection of the first electrode 130 on the substrate. For example, the area of the orthographic projection of the first electrode 130 on the substrate is larger than the area of the orthographic projection of the convex portion 121 on the substrate.

[0129] There may be a height difference (Gap) between the surface of the pixel defining portion 140 away from the substrate 110 and the surface of the main body portion 131 of the first electrode 130 away from the substrate 110. For example, please refer to Figure 10 or Figure 12A , the distance H shown in the figure is this height difference. As an example, the height difference may be less than or equal to 1 μm. The height difference may be 1 μm, 0.8 μm, 0.5 μm, 0.3 μm, or 0.1 μm, etc.

[0130] The height of each structure may be the height relative to the substrate or the substrate along the thickness direction of the substrate.

[0131] In one embodiment, please refer to Figure 10 , the height of the surface of the pixel defining portion 140 away from the substrate 110 is greater than the height of the surface of the main body portion 131 of the first electrode 130 away from the substrate 110. For example, the thickness of the pixel defining portion 140 is greater than the sum of the recessed depth of the recessed portion 122 and the thickness of the first electrode 130.

[0132] At the same time, exemplarily, the pixel defining portion 140 includes a first portion 142 with a height higher than that of the first electrode 130. Along the direction away from the center of the pixel opening (for example, the direction from the center of the pixel opening to the edge of the pixel opening or the direction from the pixel opening to the pixel defining portion), the height of the side wall 1421 of the first portion 142 facing the pixel opening gradually increases.

[0133] For example, the side wall 1421 of the first portion 142 facing the pixel opening is inclined, for example, the surface of the side wall 1421 of the first portion 142 facing the pixel opening includes an inclined surface.

[0134] For example, the surface of the side wall 1421 of the first portion 142 facing the pixel opening includes a curved surface.

[0135] For example, the surface of the side wall 1421 of the first portion 142 facing the pixel opening includes an inclined plane.

[0136] At this time, the side wall 1421 of the first portion 142 can be relatively gentle. The light-emitting layer 160 and the second electrode 170 can extend along this gentle side wall 1421, which is beneficial to the continuous formation of the light-emitting layer 160 and the second electrode 170.

[0137] Exemplarily, the pixel defining portion further includes a second portion 141. The second portion 141 is located on the side closer to the substrate 110 of the first portion 142. The orthographic projection of the first portion 142 on the substrate 110 may be located within the orthographic projection of the second portion 141 on the substrate 110. The second portion 142 extends beyond the first portion 141 toward the pixel opening. As Figure 10 shown, the width by which the second portion 142 extends beyond the first portion 141 may be W. The height of the side of the second portion 142 away from the substrate 110 is equal to the height of the surface of the first electrode 130 away from the substrate 110, so as to facilitate a smooth transition at the connection between the first electrode 130 and the pixel defining portion 140, and further facilitate the formation of a continuous second electrode 170. For example, the sidewall of the pixel defining portion facing the pixel opening is stepped.

[0138] It can be understood that in different embodiments of the present application, the recess depth of the recess portion 122 may be greater than, less than, or equal to the thickness of the pixel defining portion 140. In different embodiments of the present application, the recess depth of the recess portion 122 may also be greater than, less than, or equal to the thickness of the first electrode 130.

[0139] In one embodiment, please refer to Figure 12A , the height of the surface of the pixel defining portion 140 away from the substrate 110 is less than the height of the surface of the main body portion 131 of the first electrode 130 away from the substrate 110. For example, the thickness of the pixel defining portion 140 is less than the sum of the recess depth of the recess portion 122 and the thickness of the first electrode 130.

[0140] At this time, in the thickness direction Z of the display panel 100, the pixel defining portion 140 may be lower than the first electrode 130. At this time, the pixel opening may expose the entire first electrode 130, and the area of the first electrode 130 exposed by the pixel opening is larger. This can not only enable a larger contact area between the light emitting layer 160 and the first electrode 130, thereby facilitating the improvement of the light emitting efficiency of the light emitting layer 160, but also facilitate the thinner and lighter of the display panel 100. At the same time, there is no Taper angle in the related art at this position of the pixel defining portion 140, which makes it difficult for the second electrode 170 to break at this position, and further facilitates the improvement of the continuity of the second electrode 170.

[0141] In one embodiment, please refer to Figure 12B, the surface of the pixel defining portion 140 away from the substrate 110 is flush with the surface of the first electrode 130 away from the substrate 110. At this time, the height difference between the surface of the pixel defining portion 140 away from the substrate 110 and the surface of the first electrode 130 away from the substrate 110 is 0. It can be understood that at this time, the light emitting layer 160 and the second electrode 170 can be continuously formed on the surface of the pixel defining portion 140, thereby reducing the probability of breakage of the second electrode 170. For example, the thickness of the pixel defining portion 140 is equal to the sum of the depth of the recessed portion and the thickness of the first electrode 130.

[0142] In one embodiment, please refer to Figure 10 , the orthographic projection of the first electrode 130 on the substrate 110 can be located within the orthographic projection of the pixel opening on the substrate 110. The side of the pixel opening away from the substrate exposes the entire surface of the first electrode 130 away from the substrate. With the same size of the first electrode 130, a larger contact area can be provided between the light emitting layer 160 and the first electrode 130, which is beneficial to improving the light emitting efficiency of the light emitting layer 160.

[0143] Exemplarily, please refer to Figure 10 , the size of the side of the pixel opening away from the substrate 110 can also be larger than the size of the first electrode 130. This can provide a process error for the process of forming the pixel defining portion 140.

[0144] Of course, the setting manner of the first electrode 130 and the pixel opening is not limited to Figure 10 the manner shown. For example, it can also be set that the orthographic projection area of the first electrode 130 on the substrate is equal to the orthographic projection area of the pixel opening on the substrate 110.

[0145] In one embodiment, the orthographic projection of the surface of the first electrode 130 away from the substrate 110 on the substrate 110 does not overlap with the orthographic projection of the pixel defining portion 140 on the substrate 110.

[0146] In one embodiment, the orthographic projection of the first electrode 130 on the substrate 110 does not overlap with the orthographic projection of the recessed portion 122 on the substrate 110.

[0147] In one embodiment, the outer edge of the surface of the first electrode 130 away from the substrate 110 coincides with the edge of the orthographic projection of the pixel defining portion 140 on the substrate 110 facing the first electrode 130 in the orthographic projection on the substrate 110. For example, the outer edge of the surface of the first electrode 130 away from the substrate 110 coincides with the edge of the orthographic projection of the pixel opening on the substrate 110 in the orthographic projection on the substrate 110.

[0148] In one embodiment, the orthographic projection of the gap between adjacent first electrodes 130 on the substrate 110 is located within the orthographic projection of the recessed portion 122 on the substrate 110.

[0149] For example, there is no protrusion between two adjacent pixel openings. For example, a recess is provided between two adjacent pixel openings.

[0150] In one embodiment, the orthographic projection of the recess 122 on the substrate 110 is located within the orthographic projection of the pixel defining portion 140 on the substrate 110.

[0151] In one embodiment, the orthographic projection of the pixel defining portion 140 on the substrate 110 overlaps with the orthographic projection of the recess 122 on the substrate 110. And / or, at least a part of the pixel defining portion 140 is located within the recess 122.

[0152] For example, the orthographic projection of the side wall of the pixel defining portion 140 facing the pixel opening on the substrate 110 overlaps with the orthographic projection of the side wall of the protrusion 121 on the substrate 110. For example, the orthographic projection of the side wall of the pixel defining portion 140 facing the pixel opening on the substrate 110 coincides with the orthographic projection of the side wall of the protrusion 121 on the substrate 110.

[0153] For example, the orthographic projection of the side wall of the pixel defining portion 140 facing the pixel opening on the substrate 110 overlaps with the orthographic projection of the side wall of the recess 122 on the substrate 110. For example, the orthographic projection of the side wall of the pixel defining portion 140 facing the pixel opening on the substrate 110 coincides with the orthographic projection of the side wall of the recess 122 on the substrate 110.

[0154] For example, the side walls of the protrusion 121 and the recess 122 are equivalent to the junction of the protrusion 121 and the recess 122.

[0155] For example, the side wall of the protrusion 121 is in contact with the side wall of the pixel defining portion 140.

[0156] For example, the side wall of the first electrode 130 is in contact with the side wall of the pixel defining portion 140.

[0157] In one embodiment, the orthographic projection of the pixel defining portion 140 on the substrate 110 is located within the orthographic projection of the recess 122 on the substrate 110.

[0158] In one embodiment, the orthographic projection area of the bottom of the recess 122 on the substrate 110 is equal to the orthographic projection area of the surface of the pixel defining portion 140 close to the substrate 110 on the substrate 110.

[0159] In one embodiment, the surface of the protrusion 121 away from the substrate 110 is not in contact with the pixel defining portion 140. The pixel defining portion 140 may be in contact with the recess 122.

[0160] In one embodiment, the surface of the protrusion 121 away from the substrate 110 is spaced from the surface of the pixel defining portion 140 away from the substrate 110.

[0161] In one embodiment, please refer to Figure 8 , the orthographic projection of the first electrode 130 on the substrate 110 is located within the orthographic projection of the convex portion 121 on the substrate 110. In this way, the first electrode will not extend to the concave portion, which can reduce the influence of the first electrode on the flatness of the pixel defining portion 140, and further reduce the influence on the topography of the sidewall of the isolation structure.

[0162] In one embodiment, please refer to Figure 19 and Figure 20 , the orthographic projection of the convex portion 121 on the substrate 110 is located within the orthographic projection of the first electrode 130 on the substrate 110.

[0163] The first electrode 130 includes a main body portion 131. The main body portion 131 is located on the surface of the convex portion 121 away from the substrate 110. The pixel defining portion 140 includes a first portion 142 and a second portion 141. The first portion 142 is higher than the main body portion 131 of the first electrode 130. The second portion 141 is located on the side of the first portion 142 close to the substrate 110. The second portion 142 is in contact with the first electrode 130.

[0164] In one embodiment, the orthographic projection area of the first electrode 130 on the substrate 110 is equal to the orthographic projection area of the convex portion 121 on the substrate 110.

[0165] In one embodiment, please refer to Figure 11 , the display panel 100 may include an isolation structure 150.

[0166] The isolation structure 150 may be located on the side of the pixel defining portion 140 away from the substrate 110. Alternatively, the pixel defining portion 140 may be provided with a relief opening, and the isolation structure 150 may be located in the relief opening.

[0167] For example, the orthographic projection of the isolation structure 150 on the substrate 110 overlaps with the orthographic projection of the concave portion on the substrate 110. For example, the orthographic projection of the isolation structure 150 on the substrate 110 is located within the orthographic projection of the concave portion on the substrate 110. For example, the orthographic projection of the relief opening on the substrate 110 overlaps with the orthographic projection of the concave portion on the substrate 110. For example, the orthographic projection of the relief opening on the substrate 110 is located within the orthographic projection of the concave portion on the substrate 110.

[0168] For example, the orthographic projection of the isolation structure 150 on the substrate 110 does not overlap with the orthographic projection of the convex portion on the substrate 110.

[0169] For example, the orthographic projection of the side of the isolation structure 150 close to the substrate on the substrate 110 does not overlap with the orthographic projection of the convex portion on the substrate 110.

[0170] The isolation structure encloses to form an isolation opening. The orthographic projection of the pixel opening on the substrate 110 is located within the orthographic projection of the isolation opening on the substrate 110. The isolation structure 150 can be used to partition adjacent light-emitting layers 160.

[0171] Further, in a possible example, the orthographic projection of the isolation structure 150 on the substrate 110 does not overlap with the orthographic projection of the first electrode 130 on the substrate 110. At this time, the isolation structure 150 has less shielding effect on the light-emitting layer 160, which is beneficial to improving the light extraction efficiency of the light-emitting layer 160. In another possible example, the orthographic projection of the isolation structure 150 on the substrate 110 and the orthographic projection of the first electrode 130 on the substrate 110 have an overlapping part, which is beneficial to improving the integration degree of the display panel 100.

[0172] Exemplarily, the isolation structure 150 may include a first isolation structure 152 and a second isolation structure 153 which are sequentially stacked along a direction away from the substrate 110. The first isolation structure 152 can be used to support the second isolation structure 153. The orthographic projection of the side of the first isolation structure 152 away from the substrate 110 on the substrate 110 is located within the orthographic projection of the second isolation structure 153 on the substrate 110. The second isolation structure 153 can be used to partition adjacent light-emitting layers 160. For example, the cross-section of the isolation structure 150 perpendicular to the substrate is in a T shape.

[0173] For example, the isolation structure further includes a third isolation structure 151, and the third isolation structure 151 is located between the pixel defining portion 140 and the first isolation structure 152. The orthographic projection of the first isolation structure 152 on the substrate 110 is located within the orthographic projection of the third isolation structure 151 on the substrate 110. Further, the third isolation structure 151 may include a conductive material, and / or the first isolation structure 152 may include a conductive material, and / or the second isolation structure 153 may include a conductive material. For example, the cross-section of the isolation structure 150 perpendicular to the substrate is in an I shape.

[0174] In one embodiment, the display panel further includes a light-emitting layer 160 and a second electrode 170.

[0175] The light-emitting layer 160 is located on the side of the first electrode 130 away from the substrate 110. At least part of the light-emitting layer 160 may be located within the isolation opening. At least part of the second electrode 170 may be located within the isolation opening. At least part of the light-emitting layer 160 may be located within the pixel opening. At least part of the second electrode 170 may be located within the pixel opening. The second electrode 170 is located on the side of the light-emitting layer 160 away from the substrate 110 and extends to the isolation structure 150.

[0176] For example, the isolation structure 150 includes a conductive material, and the second electrode 170 is electrically connected to the isolation structure. For example, the overlapping side of the second electrode 170 overlaps with the isolation structure, and a recess is provided on the overlapping side of the second electrode 170.

[0177] For example, the light-emitting layer 160 covers a partial surface of the pixel defining portion 140 away from the substrate 110. The light-emitting layer 160 and the second electrode 170 may both overlap the isolation structure 150.

[0178] In one embodiment, referring to Figure 11 , the display panel may further include a first inorganic encapsulation layer 181, an organic encapsulation layer 182, and a second inorganic encapsulation layer 183. The first inorganic encapsulation layer 181 may be located within the isolation opening of the isolation structure 150 and may partially extend outside the isolation opening. The organic encapsulation layer 182 covers the first inorganic encapsulation layer 181 within each isolation opening and the isolation structure 150. The second inorganic encapsulation layer 183 may cover the organic encapsulation layer 182.

[0179] The first inorganic encapsulation layer 181 may include a plurality of inorganic encapsulation portions. The inorganic encapsulation portions are located on the side of the corresponding light-emitting device away from the substrate. The light-emitting device may include a first electrode 130, a light-emitting layer 160, and a second electrode 170 which are sequentially stacked in a direction away from the substrate. A plurality of light-emitting devices may correspond to different inorganic encapsulation portions. The inorganic encapsulation portions corresponding to the plurality of light-emitting devices are spaced apart.

[0180] In one embodiment, referring to Figure 8 , in the direction from away from the substrate 100 to towards the substrate 100, the orthographic projection of the convex portion 121 on the substrate 100 gradually increases, and / or, in the direction from away from the substrate 100 to towards the substrate 100, the orthographic projection of the first electrode 130 on the substrate 100 gradually increases. The shape of the longitudinal section of the convex portion 121 and / or the first electrode 130 may include a right trapezoid. When preparing the pixel defining layer, this inclined surface may be beneficial to the formation of the pixel defining layer and reduce the possibility of holes appearing in the pixel defining layer.

[0181] Based on the same inventive concept, referring to Figure 7 , in one embodiment, a method for manufacturing a display panel 100 is provided. The method for manufacturing the display panel 100 can be used to manufacture the display panel 100 in any of the foregoing embodiments. Specifically, the method for manufacturing the display panel 100 may include the following steps:

[0182] Step S10: Provide a substrate 110.

[0183] Step S20: An insulating layer 120 and a first electrode 130 are formed on one side of a substrate 110. The insulating layer 120 has a convex portion 121 and a concave portion 122. The convex portion 121 protrudes away from the substrate 110 relative to the concave portion 122. At least a part of the first electrode 130 is located on the side of the convex portion 121 away from the substrate 110.

[0184] Step S30: A pixel definition layer is formed on the side of the insulating layer 120 away from the substrate 110. The pixel definition layer includes a pixel definition portion 140. The pixel definition portion 140 is located on the side of the concave portion 122 away from the substrate 110. The pixel definition portion 140 encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate 110 overlaps with the orthographic projection of the first electrode 130 on the substrate.

[0185] In step S10, referring to Figure 8 , the substrate 110 may be a substrate. For example, a display panel may include a plurality of pixel circuits arranged in an array on the substrate or the substrate. The pixel circuit may include a thin film transistor and a storage capacitor, etc. In addition, the substrate 110 may also be provided with multiple layers of signal traces, etc. The signal traces may be electrically connected to the thin film transistor.

[0186] In step S20, referring to Figure 10 , the insulating layer 120 and the first electrode 130 may be formed on one side of the substrate 110. A plurality of spaced convex portions 121 may be formed on the side of the insulating layer 120 away from the substrate 110. The convex portions 121 may protrude in a direction away from the substrate 110. The insulating layer 120 between the convex portions 121 may be the concave portion 122. At the same time, the first electrode 130 may be located on the side of the convex portion 121 away from the substrate 110, and the convex portion 121 may be correspondingly arranged with the first electrode 130.

[0187] In step S30, the material of the pixel definition layer may include an inorganic insulating material. The pixel definition layer may include a pixel definition portion 140. At this time, the pixel definition portion 140 may enclose a pixel opening. Referring to Figure 9 and Figure 12A , the pixel definition portion 140 between adjacent first electrodes 130 may have a surface away from the substrate 110, and this surface may have a small height difference from the surface of the first electrode 130 away from the substrate 110. For example, the height difference may be less than or equal to 1 μm.

[0188] In this embodiment, by forming a convex portion 121 and a concave portion on the insulating layer 120, and disposing at least a part of the first electrode 130 on a side of the convex portion 121 away from the substrate 110, and the pixel defining portion is located on a side of the concave portion away from the substrate, the first electrode 130 can be elevated, the height of the pixel defining portion can be reduced, and further the height difference between the surface of the first electrode 130 away from the substrate 110 and the surface of the pixel defining portion 140 away from the substrate 110 can be reduced. Thereafter, when forming the second electrode 170 (for example, a cathode), the surface of the first electrode 130 away from the substrate 110 and the surface of the pixel defining portion 140 away from the substrate 110 can be relatively flush, which is beneficial to forming a continuous second electrode 170 (for example, a cathode), reducing the risk of breakage of the second electrode at the sidewall of the pixel defining portion facing the pixel opening, and further improving the display effect of the display panel 100.

[0189] In a possible example, step S20 may include:

[0190] Step S21: Form an insulating material layer on one side of the substrate 110.

[0191] Step S22: Form a first electrode material layer on a side of the insulating material layer away from the substrate 110.

[0192] Step S23: Etch the first electrode material layer and the insulating material layer in sequence to form the first electrode 130 and the insulating layer 120 including the concave portion 122 and the convex portion 121.

[0193] In steps S21 to S23, as an example, a deposition process may be used to form the insulating material layer and the like. The deposition process may include, but is not limited to, one or more of a chemical vapor deposition process, an atomic layer deposition process, a high density plasma deposition process, a plasma enhanced deposition process, and a spin-coated dielectric layer process. Thereafter, after etching the first electrode material layer and the insulating material layer, the remaining first electrode material layer may form the first electrode, and the remaining insulating material layer may form the insulating layer 120. The convex portion 121 of the insulating layer 120 may be surrounded by the concave portion 122.

[0194] In this example, the insulating layer 120 and the first electrode 130 may be formed in a single etching process, which improves the manufacturing efficiency of the display panel 100.

[0195] In another possible example, step S20 may include:

[0196] Step S210: Form an insulating material layer on one side of the substrate 110.

[0197] Step S220: Etch the insulating material layer to form the insulating layer 120 including the concave portion 122 and the convex portion 121.

[0198] Step S230: Form a first electrode material layer covering the insulating layer 120.

[0199] Step S240: Etch the first electrode material layer to form a first electrode 130 on the side of the protrusion 121 away from the substrate 110.

[0200] In steps S210 to S240, the insulating layer 120 and the first electrode 130 can be formed step by step. In this process, the size of the protrusion 121 and the size of the first electrode 130 can be precisely controlled. As an example, dry etching or wet etching can be used to form the insulating layer 120 and the first electrode 130. Dry etching includes at least any one of reactive ion etching, inductively coupled plasma etching, or high-density plasma etching. The insulating material layer can include an organic insulating material and / or an inorganic insulating material.

[0201] In one embodiment, step S30 may include:

[0202] Step S31: Form a pixel definition material layer 1400 on the side of the insulating layer 120 and the first electrode 130 away from the substrate 110.

[0203] Step S32: Etch the pixel definition material layer 1400 to form a pixel opening in the pixel definition material layer 1400. The pixel opening exposes at least a part of the first electrode 130, and at least a part of the remaining pixel definition material layer 1400 forms a pixel definition portion 140.

[0204] In steps S31 and S32, please refer to Figure 9 , as an example, the pixel definition material layer 1400 can be formed over the entire surface first. Please refer to Figure 10 . After that, a patterned photoresist layer can be formed on the pixel definition material layer 1400, and the pixel definition material layer 1400 can be etched based on the patterned photoresist layer until the first electrode 130 is exposed.

[0205] There may be a height difference between the surface of the pixel definition portion 140 away from the substrate 110 and the surface of the first electrode 130 (such as the main body portion 131) away from the substrate 110. For example, the height difference can be less than or equal to 1 μm. Specifically, the pixel definition portion 140 can be higher than the first electrode 130 (such as the main body portion 131) (as shown in Figure 10 ), the pixel definition portion 140 can also be lower than the first electrode 130 (such as the main body portion 131) (as shown in Figure 12A ), or the pixel definition portion 140 can be flush with the first electrode 130 (such as the main body portion 131).

[0206] When exposing the first electrode 130, a part of the first electrode 130 can be exposed, or the entire first electrode 130 can also be exposed (as Figure 13 shown). Further, the pixel opening of the pixel defining portion 140 can also be larger than the first electrode 130 (as Figure 10 shown), providing process tolerance for the process of forming the pixel defining portion 140.

[0207] Further, please refer to Figure 11 , after step S32, it may further include:

[0208] Step S40: Form an isolation structure 150 on the side of the pixel defining portion 140 away from the substrate 110. The isolation structure 150 encloses to form an isolation opening, and the isolation opening exposes at least a part of the first electrode 130.

[0209] Step S41: Form a light emitting layer 160 and a second electrode 170 on the side of the first electrode 130 away from the substrate 110. The second electrode 170 is located on the side of the light emitting layer 160 away from the substrate 110 and is connected to the isolation structure 150.

[0210] In steps S40 to S41, the isolation structure 150 may include a third isolation structure 151, a first isolation structure 152, and a second isolation structure 153. The material of the third isolation structure 151 and / or the first isolation structure 152 may include conductive materials such as metals.

[0211] Light emitting layers 160 of different colors and corresponding second electrodes 170 can be formed on the sides of different first electrodes 130 away from the substrate 110.

[0212] The light emitting layer 160 may include a red light emitting layer, a green light emitting layer, and a blue light emitting layer. At this time, the red light emitting layer, the green light emitting layer, and the blue light emitting layer can be prepared according to a preset order. The preparation process of the light emitting layer 160 and the second electrode 170 may include processes such as evaporation and photolithography. The second electrode 170 can be overlapped with the third isolation structure 151 and / or the first isolation structure 152 in the isolation structure 150.

[0213] In this embodiment, the pixel defining portion 140 can be formed first, and then the isolation structure 150 can be formed, so that when forming the pixel defining portion 140, it is not affected by the isolation structure 150, thereby achieving more accurate etching.

[0214] In one embodiment, step S30 may include:

[0215] Step S310: Form a pixel defining material layer 1400 on the side of the first electrode 130 and the insulating layer 120 away from the substrate 110.

[0216] Step S320: Form an isolation material layer 1500 on the side of the pixel defining material layer 1400 away from the substrate 110.

[0217] Step S330: Etch the isolation material layer 1500 and the pixel defining material layer 1400 in sequence to form isolation openings and pixel openings. The pixel openings expose the first electrode 130, and at least part of the remaining pixel defining material layer 1400 forms the pixel defining portion 140, and at least part of the remaining isolation material layer 1500 forms the isolation structure 150.

[0218] After step S30, it may include:

[0219] Correspondingly, step S400: Form a light emitting layer 160 and a second electrode 170 on the side of the first electrode 130 away from the substrate 110. The second electrode 170 is located on the side of the light emitting layer 160 away from the substrate 110 and is connected to the isolation structure 150.

[0220] In step S310, refer to Figure 15 , the pixel defining material layer 1400 may be formed first. Exemplarily, after forming the pixel defining material layer 1400, the pixel defining material layer 1400 may be planarized to form a flat surface.

[0221] In step S320, refer to Figure 15 , the isolation material layer 1500 may include a third isolation material layer 1510, a first isolation material layer 1520, and a second isolation material layer 1530 which are sequentially stacked. The materials of the third isolation material layer 1510, the first isolation material layer 1520, and the second isolation material layer 1530 may all be conductive materials. For example, the material of the third isolation material layer 1510 may include molybdenum, the material of the first isolation material layer 1520 may include aluminum, and the material of the second isolation material layer 1530 may include titanium, etc. Further, the thickness of the first isolation material layer 1520 may be relatively thick.

[0222] After that, the second isolation material layer 1530, the first isolation material layer 1520, and the third isolation material layer 1510 may be etched in sequence until the first electrode 130 is exposed. As an example, a process combining dry etching and wet etching may be used to prepare the isolation structure 150.

[0223] In step S330, refer to Figure 16 , the second isolation material layer 1530 and part of the first isolation material layer 1520 may be etched first using a first etching process. The first etching process may be a dry etching process. After that, refer to Figure 17 and Figure 18, then use a second etching process to etch the remaining first isolation material layer 1520, the third isolation material layer 1510, and the pixel definition material layer 1400 until the first electrode 130 is exposed. The second etching process can be a wet etching process.

[0224] In step S400, light-emitting layers 160 of different colors and corresponding second electrodes 170 can be formed on one side of the plurality of first electrodes 130 away from the substrate 110.

[0225] In this embodiment, by simultaneously forming the isolation structure 150 and the pixel definition portion 140 in one etching process, during the etching process, the pixel definition material layer 1400 can protect the first electrode 130, improving the process yield of the display panel 100.

[0226] It should be understood that although Figure 7 the steps in the flowchart are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise clearly stated in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, Figure 7 at least a part of the steps in

[0227] Based on the same inventive concept, in one embodiment, a display device is provided. The display device can include the display panel 100 in any of the embodiments provided in this application and their combinations. Or, the display device can be prepared using the preparation method of the display panel 100 in any of the embodiments provided in this application and their combinations.

[0228] It can be understood that the display device in the embodiments of this application can be an OLED (Organic Light-Emitting Diode) display device, a QLED (Quantum Dot Light Emitting Diodes) display device, an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, or any product or component with a display function. The embodiments disclosed in this application are not limited thereto.

[0229] In the description of the present application, the descriptions referring to terms such as "some embodiments", "other embodiments", "ideal embodiments", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In the present application, the schematic descriptions of the above terms do not necessarily refer to the same embodiments or examples. In addition, these specific features, structures or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that the "present embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, the appearances of "in one embodiment" or "in an embodiment" throughout the specification do not necessarily refer to the same embodiment.

[0230] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope recorded in the present application.

[0231] The above-described embodiments only represent several implementation manners of the present application, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims. The above is only the preferred implementation manner of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the content of the specification and drawings of the present application under the inventive concept of the present application, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; an insulating layer, located on one side of the substrate, the insulating layer comprising a protruding portion and a recessed portion, the protruding portion protruding in a direction away from the substrate relative to the recessed portion; a first electrode, at least a portion of which is located on a side of the protrusion away from the substrate; A pixel definition layer, the pixel definition layer includes a pixel definition portion, the pixel definition portion is located on a side of the recessed portion away from the substrate; the pixel definition portion encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first electrode on the substrate.

2. The display panel according to claim 1, characterized in that: The first electrode includes a main body portion, and the main body portion is located on a surface of the protruding portion away from the substrate. There is a height difference between the surface of the pixel definition portion away from the substrate and the surface of the main body portion of the first electrode away from the substrate, and the height difference is less than or equal to 1 μm; And / or, a height of the pixel defining portion away from the surface of the substrate is greater than or less than a height of the main body of the first electrode away from the surface of the substrate.

3. The display panel according to claim 1, characterized in that: The height of the pixel definition portion away from the surface of the substrate is greater than the height of the main body of the first electrode away from the surface of the substrate; The pixel definition portion includes a first portion having a height higher than that of the main body portion of the first electrode, and the height of the first portion gradually increases toward the side wall of the pixel opening in a direction away from the center of the pixel opening; And / or, the first portion is arranged to be inclined toward the side wall of the pixel opening, or, the side wall surface of the first portion facing the pixel opening includes a curved surface; And / or, the pixel definition portion also includes a second portion, which is located on a side of the first portion close to the substrate, the second portion extends beyond the first portion toward the pixel opening, and a height of the second portion away from the substrate is equal to a height of the main body of the first electrode away from the surface of the substrate.

4. The display panel according to claim 1, characterized in that: The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the pixel opening on the substrate; And / or, the orthographic projection area of ​​the first electrode on the substrate is equal to the orthographic projection area of ​​the pixel opening on the substrate.

5. The display panel according to claim 1, characterized in that: The orthographic projection of the surface of the first electrode away from the substrate on the substrate does not overlap with the orthographic projection of the pixel definition portion on the substrate; and / or, an orthographic projection of the first electrode on the substrate does not overlap with an orthographic projection of the recessed portion on the substrate; And / or, an orthographic projection of an outer edge of a surface of the first electrode away from the substrate on the substrate coincides with an edge of an orthographic projection of the pixel defining portion on the substrate toward the first electrode; And / or, the orthographic projection of the gap between adjacent first electrodes on the substrate is located within the orthographic projection of the recessed portion on the substrate.

6. The display panel according to claim 1, characterized in that: The orthographic projection of the recessed portion on the substrate is located within the orthographic projection of the pixel defining portion on the substrate; or, the orthographic projection of the pixel defining portion on the substrate is located within the orthographic projection of the recessed portion on the substrate; And / or, the orthographic projection area of ​​the bottom of the recessed portion on the substrate is equal to the orthographic projection area of ​​the surface of the pixel defining portion close to the substrate on the substrate; And / or, the protrusion is away from the surface of the substrate and does not contact the pixel defining portion.

7. The display panel according to claim 1, characterized in that: The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the protrusion on the substrate, and / or the orthographic projection area of ​​the first electrode on the substrate is equal to the orthographic projection area of ​​the protrusion on the substrate; And / or, the orthographic projection of the raised portion on the substrate is located within the orthographic projection of the first electrode on the substrate, the first electrode includes a main body, the main body is located on the surface of the raised portion away from the substrate, the pixel defining portion includes a first part and a second part, the first part is higher than the main body of the first electrode, the second part is located on a side of the first part close to the substrate, and the second part is in contact with the first electrode.

8. The display panel according to claim 1, characterized in that: The distance between the surface of the pixel definition portion close to the substrate and the substrate along the thickness direction of the substrate is smaller than the distance between the surface of at least part of the first electrode close to the substrate and the substrate along the thickness direction of the substrate; and / or, an orthographic projection of the pixel definition portion on the substrate overlaps with an orthographic projection of the recessed portion on the substrate; And / or, an orthographic projection of a side wall of the pixel defining portion facing the pixel opening on the substrate overlaps with an orthographic projection of a side wall of the recessed portion on the substrate; And / or, an orthographic projection of a side wall of the pixel defining portion facing the pixel opening on the substrate overlaps with an orthographic projection of a side wall of the protruding portion on the substrate; and / or, at least a portion of the pixel defining portion is located within the recessed portion; and / or, the pixel definition portion comprises an inorganic insulating material; and / or, the insulating layer comprises an organic insulating material; and / or, the insulating layer is in contact with the first electrode; and / or, the recessed portion does not penetrate the insulating layer; And / or, the recessed portion is in a grid shape; And / or, there are multiple protrusions, and the multiple protrusions are arranged at intervals.

9. The display panel according to claim 1, characterized in that: A surface of the pixel definition portion away from the substrate is flush with a surface of the first electrode away from the substrate.

10. The display panel according to claim 1, characterized in that: The display panel comprises: An isolation structure, located at a side of the pixel definition portion away from the substrate, the isolation structure encloses an isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate; An orthographic projection of the isolation structure on the substrate overlaps with an orthographic projection of the recessed portion on the substrate.

11. The display panel according to claim 10, characterized in that: The isolation structure comprises a first isolation structure and a second isolation structure which are sequentially stacked in a direction away from the substrate; The orthographic projection of a side of the first isolation structure away from the substrate on the substrate is located within the orthographic projection of the second isolation structure on the substrate, The isolation structure further includes a third isolation structure, wherein the third isolation structure is located between the pixel definition portion and the first isolation structure, and an orthographic projection of the first isolation structure on the substrate is located within an orthographic projection of the third isolation structure on the substrate.

12. The display panel according to claim 10, characterized in that: The orthographic projection of the isolation structure on the substrate does not overlap with the orthographic projection of the first electrode on the substrate; And / or, the display panel further includes: A light-emitting layer, located on a side of the first electrode away from the substrate; A second electrode is located on a side of the light-emitting layer away from the substrate; The isolation structure comprises a conductive material, and the second electrode is electrically connected to the isolation structure; The light emitting layer covers a portion of the surface of the pixel definition portion away from the substrate.

13. The display panel according to claim 1, characterized in that: In a direction from away from the substrate to close to the substrate, the orthographic projection area of ​​the protrusion on the substrate gradually increases; and / or, In a direction from away from the substrate to close to the substrate, the orthographic projection area of ​​the first electrode on the substrate gradually increases.

14. A method for preparing a display panel, characterized in that: The method for preparing the display panel includes: providing a substrate; An insulating layer and a first electrode are formed on one side of the substrate, wherein the insulating layer includes a protruding portion and a recessed portion, wherein the protruding portion protrudes in a direction away from the substrate relative to the recessed portion, and at least a portion of the first electrode is located on a side of the protruding portion away from the substrate; A pixel definition layer is formed on a side of the insulating layer away from the substrate, the pixel definition layer includes a pixel definition portion, the pixel definition portion is located on a side of the recessed portion away from the substrate; the pixel definition portion encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first electrode on the substrate.

15. The method for preparing a display panel according to claim 14, characterized in that: The step of forming an insulating layer and a first electrode on one side of the substrate comprises: forming an insulating material layer on one side of the substrate; forming a first electrode material layer on a side of the insulating material layer away from the substrate; The first electrode material layer and the insulating material layer are sequentially etched to form the first electrode and the insulating layer including the recessed portion and the raised portion.

16. The method for preparing a display panel according to claim 14, characterized in that: The step of forming an insulating layer and a first electrode on one side of the substrate comprises: forming an insulating material layer on one side of the substrate; Etching the insulating material layer to form the insulating layer including the recessed portion and the raised portion; forming a first electrode material layer covering the insulating layer; The first electrode material layer is etched to form the first electrode located on a side of the protrusion away from the substrate.

17. The method for preparing a display panel according to claim 14, characterized in that: The pixel definition layer is formed on a side of the insulating layer away from the substrate, comprising: forming a pixel definition material layer located on a side of the insulating layer and the first electrode away from the substrate; Etching the pixel definition material layer to form a pixel opening in the pixel definition material layer, wherein the pixel opening exposes the first electrode, and at least a portion of the remaining pixel definition material layer forms a pixel definition portion; There is a height difference between the surface of the pixel definition portion away from the substrate and the surface of the main body of the first electrode away from the substrate, and the height difference is less than or equal to 1μm. The main body of the first electrode is located on the surface of the protrusion away from the substrate.

18. The method for preparing a display panel according to claim 17, characterized in that: The etching of the pixel definition material layer, after forming a pixel opening in the pixel definition material layer, comprises: An isolation structure is formed on a side of the pixel definition portion away from the substrate, wherein the isolation structure encloses an isolation opening, and the isolation opening at least exposes a portion of the first electrode; A light-emitting layer and a second electrode are formed on a side of the first electrode away from the substrate. The second electrode is located on a side of the light-emitting layer away from the substrate and is connected to the isolation structure.

19. The method for preparing a display panel according to claim 14, characterized in that: The pixel definition layer is formed on a side of the insulating layer away from the substrate, comprising: forming a pixel definition material layer located on a side of the first electrode and the insulating layer away from the substrate; forming an isolation material layer located on a side of the pixel definition material layer away from the substrate; The isolation material layer and the pixel definition material layer are sequentially etched to form an isolation opening and a pixel opening, wherein the pixel opening exposes the first electrode, at least a portion of the remaining pixel definition material layer forms a pixel definition portion, and at least a portion of the remaining isolation material layer forms an isolation structure; After forming a pixel definition layer on a side of the insulating layer away from the substrate, the method comprises: A light-emitting layer and a second electrode are formed on a side of the first electrode away from the substrate. The second electrode is located on a side of the light-emitting layer away from the substrate and is connected to the isolation structure.

20. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-13.

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