Configurable optical connector module

Abstract

An optical connector module having a plurality of discrete optical seats (B) of input / output optical signals, each optical seat comprising: a base (B) defining an array of reflective surfaces (MM) and supporting an array of optical fibers (F) defining optical channels, the input / output of which is optically aligned with a respective reflective surface (MM), therefore, optical input / output of the corresponding optical bench is formed. A carrier (CB) collectively supports an optical bench (B), on which the optical bench (B) is fixedly mounted in a desired spatial arrangement, the optical input / output of the optical bench being matched to the optical input / output of an external optical component. The carrier (CB) is configured to be physically connected to an external component. The carrier includes a passive alignment feature (PA) for removably coupling to an external component, where the carrier (CB) is at least one of mounted directly to the top of the external component, or removably mounted to the external component via a socket or base positioned relative to the input / output of the external component.

Description

[0001] Priority Claim

[0002] This application claims priority to the following applications: (a) U.S. Provisional Patent Application No. 63 / 406,621, filed on September 14, 2022; (b) U.S. Provisional Patent Application No. 63 / 420,042, filed on October 27, 2022; and (c) U.S. Provisional Patent Application No. 63 / 492,704, filed on March 28, 2023. These applications are hereby incorporated by reference in their entirety as if fully set forth herein. All publications mentioned below are hereby incorporated by reference in their entirety as if fully set forth herein. Field of the Invention

[0003] The present invention relates to the optical in-and-out coupling of optoelectronic components (e.g., photonic integrated circuits (PICs)), and more particularly to the optical connection between an optical fiber and a PIC. Background of the Invention

[0004] A photonic integrated circuit (PIC) or integrated optical circuit is part of an emerging technology that uses light as a means of communication rather than an electric current. A PIC device integrates multiple (at least two) photonic functions and thus is similar to an electronic integrated circuit. The main difference between the two is that a photonic integrated circuit provides functions for information signals applied at optical wavelengths, which are typically in the visible spectrum or the near infrared 850 nm - 1650 nm.

[0005] PICs are used in various applications in the fields of telecommunications, instrumentation, sensing, and signal processing. PIC devices (e.g., in the form of silicon photonic chips packaged as SiPICs) typically use optical waveguides to route optical signals and / or interconnect various on-chip components such as optical switches, couplers, routers, splitters, multiplexers / demultiplexers, modulators, amplifiers, wavelength converters, optoelectronic (O / E) and electro-optic (E / O) signal converters (e.g., photodiodes, lasers), etc. Waveguides in PIC devices are typically on-chip solid light conductors that guide light due to the refractive index difference between the core and the cladding of the waveguide.

[0006] For proper operation, a PIC typically requires efficient coupling of light between an external optical fiber and one or more on-chip waveguides. Considering the advantage of using light as the basis for circuit operation in PIC devices, which is that its energy cost for high-speed signal transmission is significantly less than that of an electronic chip, an effective coupling that maintains this advantage between a PIC device and other optical devices such as an optical fiber is an important aspect of a PIC.

[0007] One of the most expensive components in a photonics network is the fiber optic connector. The current state of the art attempts to use polymer connector components to achieve tight alignment tolerances, but polymers have several fundamental drawbacks. First, they are elastically compliant and thus prone to deformation under external loading. Second, they are dimensionally unstable and will change in size and shape, especially when subjected to high temperatures, such as in computers and network hardware. Third, the coefficient of thermal expansion (CTE) of polymers is much larger than that of the materials commonly used in PIC devices. Thus, temperature cycling results in misalignment and mechanical stress between the optical fibers and the optical elements on the PIC device. In some cases, such as wave soldering, polymers cannot withstand the processing temperatures employed when soldering the PIC device to a printed circuit board.

[0008] In addition, PIC devices can have many optical input / output configurations, which will require the optical connector to be designed to be compatible with the optical input / output configuration of the PIC device. Each application and PIC may require a different spatial location for the optical I / O ports, which is a challenge for the standardization of fiber optic connectors.

[0009] In the latest developments of photonics devices, optical multi-chip modules (MCMs) are being implemented to allow multiple integrated circuits and multiple PICs to be modularly incorporated into a larger complex package. This helps to increase the yield of traditional monolithic integrated circuits. The multi-chip module (MCM) consists of multiple PICs mounted on a unified common support (e.g., an organic PCB or a glass interposer), which may include other discrete components, such that in use it can be regarded as a monolithic larger PIC. For example, the MCM can contain an ASIC (e.g., at the center of the MCM), a memory stack, and / or PICs surrounding the ASIC. In the MCM, optical signal input / output (I / O) units are provided on the surface or edge of the PIC.

[0010] For an MCM with multiple PICs, and PICs that can have different optical input / output I / O configurations (e.g., different numbers of I / O channels and different locations on the PIC), accommodating the optical and mechanical connections of multiple PICs in the MCM is a further design challenge. Given the different optical I / O configurations in multiple chips, different optical connectors with different matching I / O configurations are required, which will result in a more cumbersome process for implementing the connection of different optical connectors to multiple PCIs in the MCM. Once the connection is formed, it is permanent and cannot be disassembled, separated, or split without breaking the integrity of the connection, thus making it impossible to reinstall the fiber optic array onto the PIC. In other words, the fiber optic array cannot be detachably connected to the PIC, and the connection and separation of the fiber optic array will be destructive and irreversible (i.e., non-reconnectable).

[0011] Senko Advanced Components, Inc., the co-assignee of the present application, has developed a patented Metal PIC Connector (MPC) that overcomes the above disadvantages of polymer connector assemblies. The MPC improves the optical and mechanical compatibility of optical connectors with PIC devices.

[0012] U.S. Patent Publication No. 2016 / 0161686A1 (co-assigned to the assignee of the present application and incorporated herein by reference in its entirety) discloses a detachable metal optical connector for optoelectronic devices. The disclosed detachable optical connector includes an elastomeric averaging coupling implementation to provide an improved method of optically coupling the input / output of an optical fiber to a PIC, which improves tolerance, manufacturability, ease of use, functionality, and reliability at reduced cost. In a well-designed and pre-loaded elastomeric averaging coupling, repeatability is approximately inversely proportional to the square root of the number of contact points.

[0013] There is a need for an improved optical connector for PIC devices (especially MCMs), preferably with an improved detachable mechanical coupling, for connecting an optical connector to multiple PICs in an MCM to reduce cost and improve flexibility, tolerance, manufacturability, ease of use, functionality, and reliability. SUMMARY OF THE INVENTION

[0014] The present invention overcomes the disadvantages of the prior art by providing an improved optical connector module for optically coupling to an external component, such as a PIC device within an MCM, which provides flexibility for a pre-configured optical mount in the optical connector module to match the optical input / output position / configuration in the external optical component. A detachable mechanical coupling can be implemented to further provide flexibility, tolerance, manufacturability, ease of use, functionality, and reliability at reduced cost. A process for achieving precise assembly of the optical connector module is developed, in which the optical mount is optically aligned with the optical input / output position / configuration in the external optical component.

[0015] With the above as an introduction, the present invention will be outlined below in conjunction with the illustrated embodiments.

[0016] In one aspect of the present invention, an optical connector module includes a plurality of discrete optical mounts for inputting / outputting optical signals. Each optical mount includes: a base that defines an array of reflective surfaces and supports an array of optical waveguides (e.g., an optical fiber array), the optical waveguide array defining optical channels that are optically aligned with corresponding reflective surfaces for inputting / outputting, thereby forming the optical input / outputs of the corresponding optical mounts. A carrier commonly supports the optical mounts, wherein the optical mounts are fixedly attached to the carrier in a desired spatial arrangement, and wherein the optical input / outputs of the optical mounts are configured to match the optical input / outputs of external optical components. The carrier is configured to physically connect to an external component. When the connector module is connected to an external optical component, optical signals are coupled between the optical waveguides in the optical mounts and the external component.

[0017] In one embodiment, at least two of the plurality of optical mounts are configured to support different numbers of waveguides to define different numbers of channels in the corresponding optical mounts. In another embodiment, at least two of the optical mounts are arranged in a lateral configuration on the carrier, wherein the optical channels are arranged laterally on the two optical mounts. In one embodiment, the optical mounts are arranged to have substantially collinear optical input / outputs.

[0018] In one embodiment, at least one of the optical mounts is a metal optical mount, wherein the base is metal, and wherein each reflective surface is defined as a reflection-free form optical surface exposed away from the base, so as to turn the incident light of the optical signal at a non-zero angle and / or shape the mode field of the incident light of the optical signal.

[0019] In one embodiment, the carrier includes interface features for physically mating and connecting to an external component. For example, the interface features may include passive alignment features that match complementary passive alignment features on the external component for detachably coupling the connector module to the external component. The carrier is directly mounted on top of the external component or detachably mounted to the external component (e.g., via a socket or a base located relative to the input / output of the external component, where the socket may be mounted on top of the external component or a base near the edge of the external component). The socket may include a base near the edge of the external component. The carrier may be directly mounted on top of the external component or detachably mounted to the external component via a socket or a base located relative to the input / output at the top of the external component (e.g., mounted on top of the external component or near the edge of the external component).

[0020] In one embodiment, the carrier includes a backplane that is commonly attached to the base of the optical bench on a side that does not face the external component. The side of the backplane that faces the external component includes passive alignment features. The backplane can be configured to be removably mounted directly on top of the external component, where complementary passive alignment features are defined to match the passive alignment features on the backplane. In an alternative embodiment, the backplane is removably mounted to the external component via a socket attached to the top of the external component or positioned near the edge of the external component, where the socket includes complementary passive alignment features that match the passive alignment features on the backplane.

[0021] In another embodiment, the carrier further includes a cover plate (e.g., a silicon or metal cover plate) that is commonly mounted to the base of the optical bench on a side that has input / output of optical signals, where the side of the cover plate that faces the external component includes passive alignment features. The optical bench is sandwiched between the cover plate and the backplane of the carrier. The carrier can be configured to be removably mounted directly on top of the external component, where complementary passive alignment features are defined to match the complementary alignment features on the cover plate. In an alternative embodiment, the cover plate is removably mounted to the external component via a socket attached to the top of the external component or positioned at the end of the external component, where the socket includes complementary passive alignment features that match the complementary passive alignment features on the cover plate.

[0022] In one embodiment, the external component includes another optical connector module of a similar structure, whereby two optical connector modules can be optically coupled to transmit optical signals. In another embodiment, the external component includes an optical device, which can be a photonic integrated circuit (PIC), and can also be a multi-chip module (MCM) including a plurality of discrete PICs mounted on a unified common support.

[0023] In one embodiment, at least one optical bench support includes waveguides of an optical fiber array, and the base of at least one optical bench includes an array of alignment features that support the optical fiber array, where the longitudinal axes of the optical fiber array are in a plane.

[0024] In one embodiment, the passive alignment features include resilient averaging features.

[0025] In one embodiment, the passive alignment features include kinematic coupling.

[0026] In one embodiment, the surface features and / or passive alignment features of the optical bench are formed by metal stamping of a body made of a malleable metal material.

[0027] In another embodiment, the surface features used in passive alignment are etched into silicon.

[0028] In another embodiment, the surface features used in passive alignment are molded into the glass.

[0029] Another aspect of the present invention relates to a method of assembling an optical connector module for optically coupling to an external component, comprising providing a plurality of discrete optical benches for input / output optical signals, each optical bench comprising: a base defining an array of reflective surfaces and supporting an array of optical waveguides, the optical waveguide array defining optical channels whose input / output is optically aligned with the respective reflective surfaces to form the optical input / output of the optical bench. By fixedly mounting the optical benches on a carrier in a desired spatial arrangement, the optical benches are jointly supported on the carrier, wherein the optical input / output of the optical benches matches the optical input / output of the external optical component. The carrier is configured to physically connect to the external component, whereby, in the case where the connector module is connected to the external optical component, optical signals are coupled between the optical waveguides in the optical benches and the external component.

[0030] Another aspect of the present invention relates to a method of optically coupling waveguide light to an external component, comprising: providing a plurality of discrete optical benches for input / output optical signals, each optical bench comprising: a base defining an array of reflective surfaces and supporting an array of optical waveguides, the optical waveguide array defining optical channels whose input / output is optically aligned with the respective reflective surfaces to form the optical input / output of the optical bench. A component form is provided that conforms to the optical input / output and passive alignment features corresponding to the external component to be optically coupled to the waveguide. The optical bench is actively aligned to the component form. After the optical bench has been actively aligned to the component form to form an optical connector module, a carrier is fixedly mounted to the optical bench, wherein the carrier is jointly attached to the base of the optical bench on a side not facing the external component. The carrier is configured to physically connect to the external component, wherein, when the optical bench is mounted to the carrier, the optical input / output of the optical bench matches the optical input / output of the external optical component. The thus assembled optical connector module is then removed from the component form. In the case where the connector module is connected to the external optical component, optical signals are coupled between the optical waveguides in the optical bench and the external component.

[0031] In another embodiment, the carrier includes passive alignment features that match complementary passive alignment features on an external component for detachably coupling the connector module to the external component, where the carrier is directly mounted on top of the external component or is detachably mounted to the external component via a socket attached to the top of the external component. The carrier may include a backplane that is commonly attached to the base of the optical bench on a side not facing the external component, where the side of the backplane facing the external component includes passive alignment features. The backplane is detachably directly mounted on top of the external component, where the passive alignment features are defined to match complementary passive alignment features on the backplane, or where the backplane is detachably mounted to the external component via a socket attached to the top of the external component, where the socket includes complementary passive alignment features that match the passive alignment features on the backplane.

[0032] In another embodiment, the carrier further includes a cover plate (e.g., a silicon cover plate) that is commonly mounted to the base of the optical bench on a side having input / output of optical signals, where the side of the cover plate facing the external component includes passive alignment features. The carrier is detachably directly mounted on top of the external component, where the complementary passive alignment features are defined to match the passive alignment features on the cover plate, or where the cover plate is detachably mounted to the external component via a socket attached to the top of the external component, where the socket includes complementary passive alignment features that match the passive alignment features on the cover plate.

[0033] In one embodiment, by providing the same grating coupling locations and alignment features as the external component to be optically coupled to the waveguide, and further providing a loopback optical waveguide connection for active alignment of the optical bench, the component form conforms to the optical input / output and passive alignment features corresponding to the external component.

[0034] In another embodiment, the external component includes a multi-chip module (MCM) that includes a plurality of discrete PICs mounted on a unified common support, where the component form includes PICs that are the actual PICs used in the analog MCM to facilitate active alignment of the optical bench for assembling the optical connector module. The component form also includes passive alignment features. The passive alignment features are provided on top of the MCM or on a component socket attached to the top of the MCM

[0035] With reference to the foregoing summary, the present invention may be further discussed below to support the features recited in the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] To more fully understand the nature and advantages of the present invention and the preferred mode of use, reference should be made to the following detailed description read in conjunction with the accompanying drawings. In the following drawings, like reference numerals denote the same or similar components throughout the drawings.

[0037] Figure 1A is a schematic plan view of the bottom side of an optical connector module according to an embodiment of the present invention, where the optical bench is exposed; Figure 1B is a schematic plan view of the opposite top side of another similar-structured optical connector module according to an embodiment of the present invention, where the optical bench is hidden; Figure 1C is optically coupled to Figure 1B the optical connector module shown in Figure 1A schematic plan view of the optical connector module shown.

[0038] Figure 2A shows an optical bench supporting an optical fiber array according to an embodiment of the present invention; Figure 2B shows according to another embodiment of the present invention Figure 2A the optical bench with a glass cover plate shown in

[0039] Figure 3A is a schematic top plan view of a PIC inside an optical multi-chip module (MCM) according to an embodiment of the present invention, having a base near its edge; Figure 3B is a schematic plan view of the top side of an optical connector module according to an embodiment of the present invention, where the optical bench is hidden; Figure 3C is optically coupled to Figure 3A the base shown in Figure 3B schematic plan view of the optical connector module of Figure 3D is another embodiment where the optical connector module is permanently connected to the MCM.

[0040] Figure 4A is a perspective view of an optical connector module optically coupled to a PIC within an MCM according to an embodiment of the present invention; Figure 4B is Figure 4A top view of Figure 4C is a top view of an MCM and a base with passive alignment features according to an embodiment of the present invention; Figure 4D is according to an embodiment of the present invention Figure 4A schematic plan view of the bottom side of the optical connector module shown, where the optical bench is exposed; Figure 4E schematically shows the relative dimensions and positions of the input / outputs on the surface of the PIC or on the optical fibers supported in the optical bench shown in Figure 4D

[0041] Figure 5A is a perspective view of an optical connector module optically coupled to an MCM according to an embodiment of the present invention; Figure 5B is a perspective view of an optical connector module according to an embodiment of the present invention, which is optically coupled to an MCM adjacent to a heat sink.

[0042] ​Figure 6A Shows an elastic averaging passive alignment feature disposed on the top surface of an MCM according to an embodiment of the present invention; Figure 6B Shows an elastic averaging passive alignment feature disposed on a cover plate that will be attached to the underside of an optical connector module; Figure 6C Schematically shows the mating of the elastic averaging feature when the optical connector module is detachably coupled to the top surface of the MCM; Figure 6D Is along Figure 6C Cross-sectional view taken along line 6D-6D in

[0043] Figure 7A Shows the detachable coupling of an optical connector module having a cover plate to an MCM according to an embodiment of the present invention; Figure 7B Is a cross-sectional view.

[0044] Figures 8A to 8E Illustrates the process of assembling Figure 7A And 7B The optical connector module in the illustrated embodiment.

[0045] Figure 9A Shows the detachable coupling of an optical connector module having a cover plate to an MCM through a socket according to an embodiment of the present invention; Figure 9B Is a cross-sectional view.

[0046] Figures 10A to 10D Shows the process of assembling Figure 9A And 9B The optical connector module in the illustrated embodiment.

[0047] Figure 11A Shows the detachable coupling of an optical connector module to an MCM according to an embodiment of the present invention; Figure 11B Is a cross-sectional view.

[0048] Figures 12A to 12E Shows the process of assembling Figure 11A And 11B The optical connector module in the illustrated embodiment.

[0049] Figure 13A Shows the detachable coupling of an optical connector module to an MCM through a socket according to an embodiment of the present invention; Figure 13B Is a cross-sectional view.

[0050] Figures 14A to 14D Illustrates the process of assembling Figure 13A And 13B The optical connector module in the illustrated embodiment.

[0051] Figure 15A Schematically illustrates complementary resilient averaging features on opposing mating surfaces of an optical connector side and a base side, according to one embodiment of the present invention; Figure 15B and 15C shows perspective and side views of a detachable coupling between a connector and a base.

[0052] Figure 16A Schematically illustrates contact points between complementary arrays of resilient averaging features, according to one embodiment of the present invention; Figure 16B is a schematic perspective view showing contact between complementary bumps in a complementary array of resilient averaging features, according to one embodiment of the present invention; Figure 16C is a schematic view according to one embodiment of the present invention, showing contact between complementary bumps in a complementary array of resilient averaging features. DETAILED DESCRIPTION

[0053] The present invention will be described below with reference to the accompanying drawings and various embodiments. Although the present invention is described in terms of the best mode for achieving the purposes of the present invention, those skilled in the art will understand that variations can be made in light of these teachings without departing from the spirit or scope of the present invention.

[0054] The overall configuration of a configurable optical connector module M of the present invention will be discussed with reference to FIGS. 1 - 4. Figure 1A is a schematic plan view of the bottom side of an optical connector module M according to one embodiment of the present invention, in which the optical bench B is exposed. In Figure 1A , the optical connector module M includes a plurality of discrete optical benches B for input / output optical signals, which are commonly supported by a carrier. The carrier includes a backplane CB that commonly supports the optical benches B, on which the optical benches B are fixedly mounted in a desired spatial arrangement, where the optical input / output IO of the optical benches B matches the existing optical input / output of external optical components (e.g., optical input and output grating couplers). In the case where the connector module M is connected to an external optical component, optical signals are coupled between the optical waveguides (e.g., in the form of optical fibers F) in the optical benches and the external component. Strain relief SR is provided to hold the optical fiber cable including the optical fiber F. In one embodiment, the carrier includes interface features for physically mating and connecting to an external component. For example, the interface features can include passive alignment features that match complementary passive alignment features on the external component for detachably coupling the connector module to the external component.

[0055] The optical bench B can be configured to be similar to the optical bench B shown in Figure 2A and 2B . As shown in Figure 2AAs shown, the optical bench B includes a defined array of micromirrors MM, which corresponds to an array of waveguides in the form of optical fibers F. In the illustrated embodiment, the optical bench B includes a base or body b that supports an array of optical fibers F that transmit optical signals. The optical bench accurately supports the exit ends of the optical fibers F relative to the micromirror array M and further with reference to the exterior of the body b (e.g., Figure 1B the top side in

[0056] More specifically, the body b of the optical bench B defines a structured feature that includes an alignment structure. The alignment structure includes an open slot G for holding the bare portion of the optical fiber F (with an exposed cladding, no protective buffer layer, and no substrate / sheath layer), and a structured reflective surface (e.g., eight, twelve, eighteen, or twenty micromirrors MM). The size of the open slot G is designed to receive the end section of the optical fiber F and is positioned to accurately position the end section of the optical fiber F in alignment with the mirror array MM along the optical path. The end face (input / output end) of each optical fiber F is maintained at a predetermined distance relative to the corresponding micromirror MM. A clamping plate PL is provided to hold the optical fiber F in the respective groove G, e.g., by clamping the optical fiber F against the slot G.

[0057] In Figure 2B the illustrated embodiment, a transparent glass, quartz, sapphire, or silicon plate cover T is also provided to cover the exposed surface on the optical bench B to protect the micromirrors MM. In one embodiment, the optical bench B can be filled with a refractive index-matching epoxy between the mirror surface MM and the plate cover T.

[0058] In one embodiment, each mirror MM is an exposed free surface of the base b of the optical bench B (i.e., a surface exposed to air or a surface not inside the body of the base of the optical bench), which has an exposed reflective free side facing away from the body B. The exposed reflective free side includes a structured reflective surface profile at which light is guided to and from the optical fiber F and is guided to and from an external component, to which the connection module M is optically coupled. Each mirror MM bends, reflects (e.g., at a non-zero angle such as 90 degrees), and / or reshapes the incident light. Depending on the geometry and shape (e.g., curvature) of the structured reflective surface profile, the mirror MM can collimate, expand, or focus the incident light beam. For example, the structured reflective surface profile can include one of the following geometries / profiles: (a) ellipsoidal, (b) off-axis parabolic, or (c) other free-form optical surfaces. For example, to provide optical power, the mirror surface can individually or superposed have any of the following surface geometric curvature functions: ellipsoidal or hyperbolic conic foci, toroidal aspheres with various even or odd aspheric terms, X-Y aspheric curves with various even or odd aspheric terms, Zernike polynomials of various orders, and various families of simpler surfaces included in these functions. These surfaces can also be free-form surfaces that are asymmetric along any plane or vector. The mirror MM can be defined on the body b by stamping a malleable metal material. Various malleable metals that can be stamped with tool steel or tungsten carbide tools can constitute the body of the mirror, including any 300 or 400 series stainless steel, any composition of Kovar alloy, any precipitation or solution-hardened metal, and any alloy of silver, aluminum, gold, or copper. At long wavelengths above 1310 nm, aluminum is highly reflective (>98%) and can be economically formed by stamping. The reflective surface including the metal portion of the optical bench B can be any of the above metals or any highly reflective metal coating applied by sputtering, evaporation, or electroplating processes.

[0059] Several earlier patent disclosures commonly assigned to the assignee of the present application can be used as references for stamping the formation of the optical bench B.

[0060] U.S. Patent Application Publication No. US2015 / 0355420A1 discloses an optical coupler in the form of an optical bench for routing optical signals for an optical communication module, particularly an optical coupler in the form of an optical bench, wherein a structured surface having a surface profile for bending, reflecting, and / or reshaping incident light is defined on a metal base. Alignment structures are defined on the base, and the alignment structures are configured with surface features to facilitate positioning of optical components (e.g., optical fibers) on the base in optical alignment with the structured surface to allow light to be transmitted along a defined path between the structured surface and the optical components. The structured surface and the alignment structures are integrally defined on the base by stamping a malleable metal material of the base. The alignment structures contribute to passive alignment of optical components on the base in optical alignment with the structured surface to allow light to be transmitted along a defined path between the structured surface and the optical components.

[0061] U.S. Patent No. 7,343,770 discloses a novel precision stamping system for manufacturing parts with small tolerances. This innovative stamping system can be implemented in various stamping processes to produce the components disclosed herein. These stamping processes involve stamping bulk materials (e.g., metal blanks) to form final overall geometries and geometries of surface features with tight (i.e., small) tolerances, including reflective surfaces having a desired geometry that is precisely aligned with other defined surface features.

[0062] U.S. Patent Application Publication US2016 / 0016218A1 further discloses a composite structure including a base having a main portion and an auxiliary portion made of different metal materials. The base and the auxiliary portion are formed by stamping. When the auxiliary portion is stamped, it interlocks with the base while forming desired structured features on the auxiliary portion, such as structured reflective surfaces, optical fiber alignment features, etc. By this method, relatively less critical structural features can be formed on the body of the base with less effort to maintain relatively large tolerances, while relatively more critical structural features on the auxiliary portion are more precisely formed by further considering sizing, geometry, and / or finish with relatively small tolerances. The auxiliary portion may include another composite structure of two different metal materials having different properties for stamping different structural features. This stamping method improves the earlier stamping process in U.S. Patent No. 7,343,770, wherein the bulk material being stamped is a homogeneous material (e.g., a metal strip such as Kovar alloy, aluminum, etc.). The stamping process produces structural features from a single homogeneous material. Thus, different features will share the properties of the material, which may not be optimized for one or more of the features. For example, a material having properties suitable for stamping alignment features may not have properties suitable for stamping reflective surface features having optimal light reflection efficiency to reduce optical signal loss.

[0063] Further reference may be made to the above patent publications to form the optical bench B and further form the passive alignment features of the metal components disclosed hereinafter.

[0064] Reference Figure 1A , the carrier backplane CB is commonly attached to the base of the optical bench on the side not facing the external components. In Figure 1A the illustrated embodiment, at least two optical benches B are arranged in a lateral configuration on the carrier backplane CB, wherein the optical channels / optical inputs / outputs IO are arranged laterally on the two optical benches. The optical benches B may be arranged with the optical inputs / outputs IO in a substantially collinear manner. At least two optical benches B are configured to support different numbers of waveguides to define different numbers of channels for the respective optical benches.

[0065] The backplane CB is configured to be physically and removably connected to the external components using passive alignment features PA (e.g., elastomeric averaging features) provided near the two ends of the backplane BP, on the side of the backplane CB facing the external components, as Figure 1A schematically shown. The structure of the passive alignment features will be discussed in more detail in connection with further embodiments below. For example, the passive alignment features may include complementary elastomeric averaging features, such as those shown in FIG. 15, which will be discussed later below.

[0066] In one embodiment, the external component includes another optical connector module of a similar structure, whereby the two optical connector modules can be optically coupled to transmit optical signals. In other words, the external component optically coupled to by the optical connector module M is merely another optical connector module M' of a similar structure (or otherwise optically and mechanically compatible). Figure 1B is a schematic plan view of the opposite top side of another optical connector module M', which includes a structure similar to Figure 1A the connector module M shown in Figure 1B (in Figure 1C which the optical bench B is hidden and not visible). Figure 1A is a schematic plan view of the optical connector module M shown in Figure 1B optically coupled to

[0067] shown similar optical connector module M'.

[0068] In another embodiment, the external component includes an optical device, which may be a photonic integrated circuit (PIC), and may also be a multi-chip module (MCM) including a plurality of discrete PICs mounted on a unified common support. Figure 3Ais a schematic top view of an external component in the form of an optical multi-chip module (MCM), the MCM having a base F near its edge. The MCM and the base F can be mounted on a printed circuit board or a socket (not shown). The MCM includes an optical input / output MIO. The base F includes passive alignment features PA (three sets of passive alignment features PA as shown). Figure 3B is a schematic plan view of the top side of an optical connector module M1, where the optical bench B is hidden from view. The connector module M1 is generally similar to Figure 1A the connector module M discussed in a previous embodiment of Figure 2A and 2B . In Figure 3B the embodiment of Figure 3C is Figure 3B a schematic plan view of the optical connector module M1 that is removably and optically coupled to Figure 3A the base F shown. The base F provides a removable physical coupling where the optical bench B extends to overlap the MCM input / output region. The optical input / output IO of the optical bench B is optically aligned with the input / output MIO of the MCM, as Figure 3C schematically shown.

[0069] For assembling the connector module M1, its optical bench B actively aligns with an MCM or equivalent component form (which may include a "main MCM", a "main PIC", and / or a base) to provide a reference for optically aligning the connector module M1 to the intended MCM. After active alignment, the backplane CB1 is fixedly attached to the back of the optical bench B (e.g., by epoxy, laser welding, soldering, etc.). The use of the "main MCM" as an alignment reference will be discussed in more detail below in connection with the embodiments of FIGS. 7-14.

[0070] Figure 3D is another embodiment where the optical connector module M1' is permanently attached to the MCM. In this embodiment, after the optical bench B is actively aligned with the intended MCM, the connector module M1' is permanently attached to the MCM without the need to implement passive alignment features for detachable connection.

[0071] Figures 4A to 4E Details Figures 3A to 3C the schematic configuration shown. Figure 4A is a perspective view of an optical connector module M2 physically and optically coupled to an MCM according to another embodiment of the present invention; Figure 4B is Figure 4ATop plan view. The MCM is supported on the PCB, and the connector module M2 is detachably coupled to the PCB via a base FD1 located near the MCM.

[0072] Figure 4C is a top view of the base FD1 and the MCM with passive alignment features; Figure 4D is Figure 4A a plan view of the bottom side of the optical connector module M2 shown in, where the optical bench B is exposed (i.e., the optical input / output IO side). Compared with Figures 3A to 3C the schematic diagram shown, the connector module M2 is different in terms of the relative position with respect to the MCM and the backplane CB2 and the relative dimensions of the three optical benches B with respect to the complementary passive alignment features.

[0073] In this embodiment, the complementary passive alignment features include a concave cavity W (e.g., a hemispherical well) provided on the top surface of the base FD1 and complementary protrusions P (e.g., hemispherical protrusions) provided at complementary positions on the carrier backplane CB2. As shown, the protrusions P are provided at positions on the backplane CB2 located between the optical fiber cables (F). The base FD1 can be an integral extension of the MCM body or chassis, having integrated passive alignment features.

[0074] Figure 4E Schematically shows the relative dimensions and positions of the input / output IO of the optical fiber F supported in the Figure 4D optical bench B shown. The same spatial arrangement of the IO ports exists on the external device (MCM or optical connector). The input / output IO of the connector module M2 includes 16-8-16 optical channels supported by three optical benches B.

[0075] As explained in connection with the previous embodiment, the optical bench is actively aligned to the component form (e.g., the "main MCM") that the connector module M2 is to be coupled to. Then the backplane CB1 is fixedly attached to the body / base b of the optical bench B to fix the relative position of the optical bench B and further with respect to the optical input / output of the MCM, thereby producing the connector module M2. The component form is only used during the assembly process. Once assembled, the connector module M2 is removed from the component form, and it can be mechanically coupled (i.e., detachably coupled using passive alignment features) and optically coupled to the MCM corresponding to the component form. The process of assembling the optical connector module involving active alignment using the component form will be further explained in connection with the embodiments of FIGS. 7 to 14.

[0076] The benefits of the configurable optical connector module of the present invention include:

[0077] 1. Flexibility in terms of different numbers of optical fibers based on the combination of optical benches (e.g., 3 optical benches B with 16-8-16 optical fibers in FIG. 4).

[0078] 2. An optical bench shown in the middle of the connector module can be used with polarization-maintaining optical fibers such that the cable is routed to an external laser source.

[0079] 3. The connector module can be detachable / dismountable using passive alignment features and can achieve high repeatability accuracy based on elastic averaging alignment.

[0080] 4. The connector module is low profile and has a coefficient of thermal expansion (CTE) that matches the silicon chip of the MCM.

[0081] Figure 5A is a perspective view of an optical connector module optically coupled to an MCM according to another embodiment of the present invention. In this embodiment, the optical connector module M2' has a backplane CB2' that supports six optical benches B, but can otherwise have a structure similar to that of the optical connector module M2 in the previous embodiment. The structure of the connector module M2' is similar to that of the connector module 2 in the previous embodiment except for the total number of optical channels of the connector module M2'.

[0082] Figure 5B is a perspective view of an optical connector module according to an embodiment of the present invention, which is optically coupled to an MCM adjacent to an optional cooling plate CP. Various modifications can be made to the optical connector module and the MCM to achieve detachable coupling.

[0083] As described above, the carrier can include interface features for physically mating and connecting to external components. For example, the interface features can include passive alignment features that match complementary passive alignment features on the external component for detachably coupling the connector module to the external component. The carrier can be directly mounted on top of the external component or detachably mounted to the external component via a socket attached to the top of the external component.

[0084] Referring to FIG. 6, according to an embodiment of the present invention, passive alignment features based on elastic averaging features are provided on the MCM and the optical connector module. Specifically, Figure 6A an elastic averaging passive alignment feature EA1 provided on the top surface of the MCM is shown. Figure 6B a complementary elastic averaging passive alignment feature EA2 provided on the cover plate C attached to the underside of the optical connector module M3 is shown. Figure 6C is a plan view schematically showing the mating of the elastic averaging features when the optical connector module is detachably coupled to the top surface of the MCM. Figure 6D is along Figure 6C sectional view taken along line 6D-6D in

[0085] The elastic averaging feature EA1 includes an array of discrete bumps BP1 etched into the top surface of the MCM. As Figure 6D more clearly shown, spaces for the discrete bumps BP1 are formed by etching the material of the MCM (e.g., silicon in the case of a silicon-based MCM). As Figure 6A shown, the array of elastic averaging features EA1 includes four longitudinal sub-arrays SA1, where a ridge R divides the array of features EA1 into two longitudinal sub-arrays SA1 on each side of the ridge R. The ridge R forms a "window" for an optical signal to pass through a material that is transparent to the operating wavelength of the intended optical signal. As will be explained later in connection with Figure 7B the explanation, the mirror of the optical connector M3 is aligned with the beam input / output grating coupler in the MCM within the region of the ridge R.

[0086] The cover plate C can be made of glass or silicon, which is optically transparent to the operating wavelength of the intended optical signal between the optical fiber F and the MCM. Silicon is transparent to light in the common infrared (IR) band used for optical communication (e.g., 1310 nm - 1550 nm). The elastic averaging feature EA2 includes a complementary array of bumps BP2 etched into the facing surface of the cover plate C. The array of EA2 includes two longitudinal sub-arrays SA2, and the two longitudinal sub-arrays SA2 are separated by a space of a certain width to accommodate the ridge between the two sub-arrays SA2.

[0087] In this embodiment, the cover plate C corresponds to Figure 6A half of the array EA1 of the MCM in Figure 7B where the two sub-arrays SA2 match the two sub-arrays SA1, as Figure 6C more clearly shown. As Figure 6D schematically shown, when the cover plate C is detachably coupled to the top surface of the MCM, the corresponding sub-arrays SA1 and SA2 form mating contacts, where the elastic averaging features EA1 and EA2 produce a substantially four-point contact for each bump (BP1, BP2), rather than for the bumps around the perimeter of each sub-array.

[0088] The configuration of the elastic averaging feature shown in FIG. 6 is novel and is the subject of another patent application that claims the common priority of the first filing. For completeness, the structural configuration of the elastic averaging feature is further discussed below with reference to FIG. 15.

[0089] Figure 7AShows the detachable coupling of an optical connector module M3 with a cover plate to an MCM, which realizes the above-mentioned elastic averaging feature. Figure 7B Is a cross-sectional view. Figure 7A Shows three MCMs arranged in a row. Each MCM has two optical connector modules M3 arranged side by side. Figure 7A The leftmost MCM in corresponds to Figure 6A .

[0090] As in the case of the previous embodiment, the carrier in the connector module M3 includes interface features for physically mating and connecting to external components (i.e., an MCM in this case). In this embodiment, referring to Figure 7B , the carrier of the connector module M3 includes a backplane CB3 and a cover plate C as discussed above in FIG. 6, which sandwich the optical bench between them. The detachable interface features include the above-mentioned passive alignment features EA2, which match the complementary passive alignment features EA2 on the MCM for the detachable coupling of the connector module to the MCM. In this embodiment, the carrier cover plate C is detachably directly mounted on the MCM. The elastic averaging passive alignment features on the cover plate C can be formed by lithography and etching. The corresponding alignment features are etched into the MCM.

[0091] The cover plate C can be silicon, which is transparent to light in the common IR band (1310 nm - 1550 nm) for optical communication. As Figure 7B shown, the light beam can pass through the silicon cover plate C between the optical bench B and the MCM.

[0092] In this embodiment, an internal heat sink IHS is provided above the MCM.

[0093] Figures 8A to 8E Shows the process of assembling the Figure 7A and 7B optical connector module as shown in the embodiment of. In Figure 8A , an appropriate optical bench B is selected, which can be configured similar to the Figure 2A or the embodiment in 2B, with the desired number of optical channels / optical fibers. In Figure 8BIn it, a silicon cover plate (with alignment features) is detachably attached to a component form such as a component MCM (AMCM), and the component MCM (AMCM) has the same grating coupler (GC) positions and elastic mean passive alignment features as the actual MCM. The AMCM mimics the actual silicon photonic integrated circuit (PIC) used in the MCM, but the AMCM is only used during the assembly process. The AMCM has optical waveguides and GCs, which can be used for active alignment of the optical bench B before it is fixedly attached to the carriers (in this embodiment, the cover plate C and the backplane CB3). The GC has a loopback connection to allow active alignment of the optical bench B in subsequent steps during the assembly process. This loopback active alignment process can refer to the process of optical passive alignment between an optical connector assembly and an optoelectronic device disclosed in U.S. Patent No. 9,897,769B2 commonly assigned to the assignee of the present application.

[0094] In Figure 8C it, the optical bench B is located on the cover plate C, where the input / output IO of the optical bench B faces the MCM. Under the same load conditions, the mirror MM / fiber F in the optical bench is actively aligned with the loopback GCs in the AMCM. When the desired alignment position is reached, the body of each optical bench is fixedly attached to the cover plate C (e.g., by epoxy resin, laser welding, soldering, etc.). In Figure 8D it, the backplane CB3 (e.g., by epoxy resin, laser welding, soldering, etc.) is fixedly attached to the top surface of the optical bench B as Figure 8C shown. Figure 8E Shows the assembled connector module M3 (flipped) after removal from the AMCM. The connector module M3 in this completed configuration is ready to be detachably coupled to an actual MCM having a compliant optical input / output configuration and passive alignment features EA1 (see Figure 7B ).

[0095] Figure 9A Shows the detachable coupling of an optical connector module with a cover plate to an MCM through a socket according to another embodiment of the present invention; Figure 9B is a cross-sectional view. The configuration of the optical connector module M3 is not different from that of the optical connector module M3 in the previous embodiment. Compared with the previous embodiment of FIG. 7, the actual MCM now includes a socket I attached to the top of the MCM, where the socket I is a separate structure providing passive alignment features EA1. Specifically, a mechanical socket I made of silicon (transparent to the operating wavelength of the optical signal) is permanently attached to the MCM. The socket protects the MCM. In this embodiment, the detachable / dismountable interface is transferred between the mechanical socket I of the optical connector module M3 and the silicon cover plate C.

[0096] Figures 10A to 10D Shows the assembly according to an embodiment of the present invention Figure 9A and9B The process of the optical connector module shown in the embodiment of. Similar to the process discussed in the previous embodiment, an appropriate optical mount B is selected. In Figure 10A , instead of using an AMCM having elastic average alignment features thereon as in the case of the previous embodiment, a similar AMCM' without passive alignment features but having an optically transparent component socket AI with passive alignment features is used to replace the previous AMCM. In this embodiment, with the component socket AI attached to the top of the AMCM', this overall structure provides alignment features as well as optical waveguides and GCs, which can be used for active alignment of the optical mount B, as in the previous embodiment. The remainder of the assembly process is similar to the previous embodiment. In Figure 10A , the cover plate C is detachably coupled to the component socket AI via complementary passive alignment features (in this case, elastic average features). In Figure 10B , the selected optical mount B is actively aligned with the AMCM’ and fixedly connected to the cover plate C. In Figure 10C , the backplane CB3 is fixedly connected to the top of the optical mount B. The assembled optical connector module M3 is similar to the optical connector module M3 in the foregoing embodiments. In this completed configuration, the connector module M3 is ready for detachably coupling to an actual MCM that has a consistent optical input / output configuration and passive alignment features EA1 on the socket I (see Figure 9B ).

[0097] Figure 11A Shows the detachable coupling of an optical connector module to an MCM according to another embodiment of the present invention; Figure 11B is a cross-sectional view. In this embodiment, the optical connector module M4 is mechanically aligned to the MCM using a pattern of detachable passive alignment features AF1 and AF2 provided on the facing surfaces of the carrier backplane CB4 and the top side of the MCM. The passive alignment features can be kinematic or quasi-kinematic coupling features, or elastic average features if there is sufficient interface surface area. On the MCM, the alignment feature AF1 can be cavities or wells (e.g., conical, pyramidal, or hemispherical) distributed on the top surface of the MCM (which can be similar to the distribution shown on the socket I' in Figure 14A ). The backplane CB4 has an edge that extends beyond the optical mount B and downward toward the MCM. Complementary alignment features AF2 (e.g., hemispherical protrusions) are provided on the distal face of this extending edge, as well as on the end faces of the protruding portions between adjacent optical mount B fiber cables, as Figure 12EAs shown. In this embodiment, it is assumed that the cover plate C is not deployed in the optical connector module, and the surface area available on the backplane CB4 for implementing the elastic averaging feature array as the interface surface feature for passive alignment is relatively small. Without the relatively large area required for elastic averaging, the planar size of the backplane CB4 can be minimized for the optical connector module M4.

[0098] Figures 12A to 12E Illustrates the process of assembling an optical connector module according to an embodiment of the present invention Figure 11A and 11B as shown in the embodiment. In Figure 12A , an appropriate optical mount B is selected and provided. In Figure 12B , the backplane CB4 (with passive alignment features AF2) is detachably coupled to the component MCM (AMCM). As in the earlier embodiment of FIG. 8, the AMCM in this embodiment has the same GC position and alignment features as the actual MCM, but has different passive alignment features AF1 instead of the elastic averaging feature EA1 formed on top of the AMCM. The GC has a loopback connection. In Figure 12C , the selected optical mount B is inserted between the AMCM and the backplane CB4. As in the previous embodiment, the loopback GC of the AMCM is used to actively align the optical mount B to the AMCM under the same load conditions. Then in Figure 12D , after active alignment, the optical mount B is fixedly attached to the backplane CB4. In Figure 12E , the completed connector module M4 is removed from the AMCM. The connector module M4 in this completed configuration is ready to be detachably coupled to an actual MCM having a consistent optical input / output configuration and passive alignment features AF1 (see Figure 11B ).

[0099] Figure 13A Illustrates the detachable coupling of the optical connector module M5 to the MCM through the socket I'; Figure 13Bis a cross-sectional view. In this embodiment, the mechanical socket I' is deployed on top of the MCM for detachably coupling to the backplane CB5. The configuration of the optical connector module M5 is substantially similar to that of the optical connector module M4 in the previous embodiment, except for the absence of the overhanging extended edge of the backplane CB5. Compared with the previous embodiment of FIG. 9, the actual MCM now includes a socket I' attached to the top of the MCM, where the socket I' is a separate structure providing passive alignment feature AF1, which is complementary to the alignment feature AF2 provided on the backplane CB5. In particular, the mechanical socket I' is a frame structure permanently connected to the top of the MCM. Given the open frame structure, the socket 1' no longer needs to be transparent to optical signals. In this embodiment, similar to the embodiment of FIG. 9, the detachable / dismountable interface is transferred between the backplane CB5 of the optical connector module M5 and the mechanical socket I'.

[0100] The passive alignment feature can be a kinematic or quasi-kinematic coupling feature, or an elastic averaging feature if there is sufficient interface surface area. On the socket I', the alignment feature AF1 can be cavities or wells (e.g., conical, pyramidal, or hemispherical) distributed on the top surface of the socket I'. The backplane CB5 has a portion extending beyond the optical bench B. Complementary alignment feature AF2 (e.g., hemispherical protrusions) is provided on the lower side of this extended portion, as well as on the end faces of the protruding portions between adjacent fiber optic cables of the optical bench B, as Figure 14D shown (similar to Figure 12E the previous embodiment shown).

[0101] Figures 14A to 14D shows the process of assembling Figure 13A and 13B the optical connector module as shown in an embodiment of the present invention. Similar to the process discussed in the previous embodiment, an appropriate optical bench B is selected and provided. In Figure 14A , instead of using an AMCM having passive alignment feature AF1 thereon as in the case of the previous embodiment of FIG. 12, a similar AMCM' without passive alignment feature but having a component socket AI' with passive alignment feature AF1 is used to replace the previous AMCM in FIG. 12. In this embodiment, with the component socket AI' attached to the top of the AMCM', this overall structure provides alignment features and optical waveguides and GCs, which can be used for active alignment of the optical bench B as in the previous embodiment.

[0102] The remaining part of the assembly process is similar to the previous embodiment. In Figure 14B , the backplane CB5 (having passive alignment feature AF2) is detachably coupled to the component socket AI' on the AMCM'. In Figure 14CIn this case, the selected optical bench B is inserted between the AMCM' and the backplane CB5. As in the previous embodiment, the optical bench B is actively aligned to the AMCM' using the loopback GC on the AMCM' under the same load conditions. Then, after the active alignment, the optical bench B is fixedly attached to the backplane CB5. In Figure 14D this case, the completed connector module M5 is removed from the AMCM. The connector module M5 in this completed configuration is ready for removably coupling to an actual MCM having a compliant optical input / output configuration and passive alignment features AF1 (see Figure 13B ).

[0103] The above-described backplane may be metallic and have surface features formed by metal stamping, the process of which may be similar to the metal stamping process used above for stamping the metallic optical bench B.

[0104] Figure 15A Schematically shown is a complementary elastic averaging feature according to an embodiment of the present invention, which can be implemented at the opposing mating surfaces of the optical connector module side OM and the base side (which can be an MCM, socket, or base (collectively referred to as the "base" side FO)); Figure 15B and 15C shows a perspective view and a side view of the detachable coupling between the connector side OM and the base side FO. The elastic averaging feature is similar to the elastic averaging features EA1 and EA2 discussed in connection with FIG. 6.

[0105] The features of the elastic averaging coupling shown include:

[0106] a. Improving accuracy by error averaging the number of contact points in an array

[0107] b. More restrictive than precise constraints

[0108] c. Higher load capacity (due to multiple contact points)

[0109] d. Almost as repeatable as precise constraints

[0110] e. Multiple detachable cycles

[0111] f. Confined to elastic deformation of compliant structures

[0112] g. Requiring some preloading force

[0113] h. Improving structural dynamics if not too compliant (shorter unsupported spans and more damping).

[0114] Also referring to Figures 6A to 6D , for this elastic averaging coupling, constraints are established through point contacts. Figure 16A Schematically shows the contact points between complementary arrays of elastic averaging features.Figure 16B is a schematic perspective view showing the contact between complementary bumps BP1 and BP2 in a complementary array exhibiting elastic averaging characteristics. Figure 16C is a schematic graphical view showing the contact between complementary bumps BP1 and BP2 in a complementary array exhibiting elastic averaging characteristics.

[0115] Also refer to Figure 16C , a single contact point C1 between each pair of bumps is due to:

[0116] 1. The convex curvature radii on two bodies

[0117] 2. The slope on the side walls of the bumps

[0118] There is an additional single contact C2 at the vertex of the lower bump BP1 on the base side. The vertex of the upper bump BP2 on the connector side does not contact the base and there is a gap between the vertex of the upper bump and the base.

[0119] In one embodiment, the bumps BP1 and BP2 are constructed by rotating non-uniform rational B-spline (NURBS) curves around two axes, as Figure 16C further schematically shown in. The parametric geometry defining the convex bumps BP1 and BP2 includes the following characteristics:

[0120] a. The convex bumps BP1 and BP2 are parametrically defined using NURBS curves N1 and N2

[0121] b. The curve N1 rotates around the left centerline to construct the base bump BP1

[0122] c. The curve N2 rotates around the right centerline to construct the connector bump BP2

[0123] d. The contact C1 occurs on the symmetry line of the curves N1 and N2.

[0124] e. Tangency is presented at each contact point

[0125] Define a detachable passive alignment coupling between an optical connector module and an external component without using any complementary alignment pins and alignment holes. Although the disclosed embodiments employ a specific elastic averaging feature involving a specific elastic averaging coupling, it should be understood that other types of elastic averaging features may be implemented for the optical connector module of the present invention without departing from the scope and spirit of the present invention. For example, U.S. Patent Publication No. 2016 / 0161686A1 and U.S. Patent No. 11,500,166B2 disclose elastic averaging features suitable for connecting an optical connector to a support base. In addition, the optical connector module and the external component / base may be detachably coupled and passively aligned with each other using passive mechanical alignment other than elastic averaging (such as kinematic or quasi-kinematic alignment), which is constituted by various geometric features on the two bodies. The present invention is not limited to any specific detachable coupling with passive alignment.

[0126] Although the present invention has been specifically shown and described with reference to preferred embodiments, those skilled in the art will understand that various changes may be made in form and detail without departing from the spirit, scope, and teachings of the present invention. Therefore, the disclosed invention is considered to be illustrative only and is limited to the scope specified in the appended claims.

Claims

1. An optical connector module for optically coupling to an external component, comprising: A plurality of discrete optical benches for input / output optical signals, each optical bench comprising: a base defining an array of reflective surfaces and supporting an array of optical waveguides, the optical waveguide array defining optical channels with the input / output optically aligned with the corresponding reflective surfaces, thereby forming the optical input / output of the optical bench; A carrier commonly supporting the optical benches, the optical benches being fixedly mounted on the carrier in a desired spatial arrangement, the optical input / output of the optical benches matching the optical input / output of an external optical component, wherein the carrier is configured to physically connect to the external component, Thereby, in the case where the connector module is connected to an external optical component, optical signals are coupled between the optical waveguides in the optical benches and the external component.

2. The optical connector module according to claim 1, wherein at least two of the plurality of optical benches are configured to support different numbers of waveguides to define different numbers of channels for the corresponding optical benches.

3. The optical connector module according to claim 1 or 2, wherein at least two of the optical benches are arranged on the carrier in a lateral configuration, wherein the optical channels are arranged laterally on the two optical benches.

4. The optical connector module according to any one of the preceding claims, wherein at least one of the optical benches is a metal optical bench, wherein the base is metal, and wherein each reflective surface is defined as a reflection-free surface exposed away from the base, deflecting the incident light of the optical signal at a non-zero angle and / or shaping the incident light of the optical signal.

5. The optical connector module according to any one of the above claims, wherein, The carrier includes interface features for physically matingly connecting to the external component, wherein the interface features include passive alignment features that match complementary passive alignment features on the external component for removably coupling the connector module to the external component, wherein the carrier is directly mounted on top of the external component, removably mounted to the external component (i.e., via a socket or a base positioned relative to the input / output of the external component, where the socket can be mounted on top of the external component or a base near the edge of the external component) at least one of them.

6. The optical connector module according to claim 5, wherein, The carrier includes a backplane that is commonly connected to the base of the optical bench on a side not facing the external component, wherein the side of the backplane facing the external component includes passive alignment features.

7. The optical connector module according to claim 5 or 6, wherein, The backplane is removably directly mounted on top of the external component, wherein the complementary passive alignment features are defined to match the passive alignment features on the backplane.

8. The optical connector module according to any one of claims 5 to 7, wherein the backplane is detachably mounted to the external component via a socket attached to the top of the external component or located near the edge of the external component, wherein the socket comprises passive alignment features that match complementary passive alignment features on the backplane.

9. The optical connector module according to claim 8, wherein, The socket includes a base near the edge of the external component.

10. The optical connector module according to any one of claims 5 to 9, wherein, The carrier further includes a cover plate (e.g., a silicon cover plate) that is commonly mounted on the base of the optical bench on the input / output side of the optical signal, wherein the side of the cover plate facing the external component includes the passive alignment features.

11. The optical connector module according to any one of claims 5 to 10, wherein the carrier is removably and directly mounted on top of the external component, and complementary passive alignment features are defined to match the alignment features on the cover plate.

12. The optical connector module according to any one of claims 5 to 11, wherein the cover plate is removably mounted to the external component via a socket attached to the top of the external component or located near the edge of the external component, wherein, The socket includes complementary passive alignment features that match the passive alignment features on the cover plate.

13. The optical connector module according to any one of claims 5 to 12, wherein the socket includes a base located near the edge of the external component.

14. The optical connector module according to any one of the above claims, wherein the external component includes another optical connector or an optical device including a photonic integrated circuit (PIC).

15. The optical connector module according to claim 14, wherein the PIC includes a multi-chip module (MCM), and the multi-chip module (MCM) includes a plurality of discrete PICs mounted on a unified common support.

16. The optical connector module according to any one of the foregoing claims, wherein, At least one optical bench support includes waveguides of an optical fiber array, and the base of the at least one optical bench includes an array of alignment features that support the optical fiber array, wherein the longitudinal axes of the optical fiber array are in a plane.

17. The optical connector module according to any one of the above claims, wherein the passive alignment features include elastic averaging features.

18. The optical connector module according to any one of the foregoing claims, wherein, The surface features of the optical bench and / or the passive alignment features are formed by metal stamping of a body made of a malleable metal material.

19. The optical connector module according to any one of the above claims, wherein, The optical bench is provided with optical input / outputs in a substantially collinear manner.

20. A method of assembling an optical connector module for optically coupling to an external component, comprising: Providing a plurality of discrete optical benches for input / output optical signals, each optical bench including: a base defining an array of reflective surfaces and supporting an array of optical waveguides, the optical waveguide array defining optical channels for optically aligning the input / output with the corresponding reflective surfaces, thereby forming the optical input / output of the optical bench; Co-supporting the optical benches on a carrier by fixedly mounting the optical benches on the carrier in a desired spatial arrangement, wherein the optical input / output of the optical benches matches the optical input / output of the external optical component, and the carrier is configured to be physically connected to the external component, Thereby, when the connector module is connected to the external optical component, optical signals are coupled between the optical waveguides in the optical benches and the external component.

21. A method of optically coupling a waveguide to an external component, comprising: A discrete optical bench providing multiple input / output optical signals, each optical bench comprising: a base defining an array of reflective surfaces and supporting an array of optical waveguides, the optical waveguides defining optical channels that are optically aligned with corresponding reflective surfaces to form the optical input / output of the optical bench; Provided in the form of a component that conforms to the optical input / output and passive alignment features, the passive alignment features corresponding to an external component that will be optically coupled to the waveguide; Actively aligning the optical bench to the form of the component; After the optical bench has been actively aligned to the form of the component to form an optical connector module, fixedly mounting the carrier to the optical bench, wherein the carrier is commonly attached to the base of the optical bench on a side not facing the external component, wherein the carrier is configured to physically connect to the external component, wherein when the optical bench is mounted to the carrier, the optical input / output of the optical bench matches the optical input / output of the external optical component; Removing the optical connector module from the form of the component; Thereby, with the connector module connected to the external optical component, an optical signal is coupled between the optical waveguides in the optical bench and the external component.

22. The method according to claim 21, wherein, The carrier includes passive alignment features that match complementary passive alignment features on the external component for removably coupling the connector module to the external component.

23. The method according to claim 21 or 22, wherein, By providing the same grating coupling locations and alignment features as the external components that will be optically coupled to the waveguide, and further providing a loopback optical waveguide connection for active alignment of the optical bench, the component form conforms to the optical input / output and passive alignment features corresponding to the external components.

24. The method according to any one of claims 21 to 23, wherein, The component form includes a component multi-chip module (component MCM), the component multi-chip module including a plurality of discrete PICs mounted on a unified common support, wherein the component MCM includes a PIC that emulates the actual PIC used in the MCM to facilitate active alignment of the optical bench for assembling the optical connector module.

25. The method according to any one of claims 21 to 24, wherein, The component form further includes passive alignment features, wherein the passive alignment features are provided on top of the component MCM, or the passive alignment features are provided on a component socket attached to the top of the component MCM.

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