Preparation method of color-changing keycap

Abstract

The invention discloses a color-changing keycap preparation method which comprises the following steps: adding temperature color-changing powder into a keycap base material for injection molding at the injection molding temperature of 200-220 DEG C. The key cap has the function of changing color along with temperature change; the environment temperature is indicated; the working temperature of equipment can be displayed to prevent overheating; body surface temperatures of an operator and a user can be displayed; the key cap of the two-color process is subjected to two-time injection molding, so that the surface color change effect can be realized, and the character does not change the color.

Description

Technical Field

[0001] The present invention relates to the field of production of color-changing keycaps, and particularly to a method for preparing color-changing keycaps. Background Art

[0002] A keycap is a component covering a key switch on a keyboard. Its main functions are to provide a contact surface for pressing keys, enhance the typing experience, and serve as a decoration. Common materials include ABS plastic, PBT plastic, metal, etc., and each material has different hand feelings and durability. Currently, the color of keycaps is usually fixed. Therefore, the present invention proposes a method for preparing color-changing keycaps. Summary of the Invention

[0003] The present invention provides a method for preparing color-changing keycaps to solve the technical problems mentioned in the background art.

[0004] A method for preparing color-changing keycaps includes the following steps:

[0005] Under the condition that the injection temperature is 200 - 220 °C, temperature-changing powder is added to the keycap base material for injection molding.

[0006] Preferably, the keycap base material is selected from one of ABS, PC, and PBT.

[0007] Preferably, the model of the temperature-changing powder is the Chameleon T series in the thermosensitive color-changing microcapsules of Insilico.

[0008] Preferably, the mass ratio between the temperature-changing powder and the keycap base material is 1:95 - 105.

[0009] Preferably, the mass ratio between the temperature-changing powder and the keycap base material is 1:100.

[0010] Preferably, when the keycap base material is selected as ABS, the injection pressure is 60 - 100 MPa; when the keycap base material is selected as PBT, the injection pressure is 80 - 120 MPa; when the keycap base material is selected as PC, the injection pressure is 70 - 110 MPa; the holding pressure is 30% - 50% of the injection pressure to prevent sink marks and ensure color stability; the back pressure is 3 - 8 MPa to ensure uniform mixing of the temperature-changing powder and the melt.

[0011] Preferably, when the keycap base material is selected as ABS, the mold temperature is 50 - 70 °C; when the keycap base material is selected as PBT, the mold temperature is 60 - 80 °C; when the keycap base material is selected as PC, the mold temperature is 80 - 100 °C.

[0012] Beneficial effects achieved by the present invention:

[0013] The present invention provides a method for preparing a color-changing keycap. The keycap has the function of changing color with temperature, indicating the ambient temperature, being able to display the operating temperature of the device to prevent overheating, and being able to display the body surface temperature of the operator or user. The keycap of the two-color process is injection-molded twice, which can achieve the effect of surface color change while the characters do not change color. Detailed Embodiment

[0014] The technical solution of the present invention will be introduced and described in detail below.

[0015] The embodiment of the present invention provides a method for preparing a color-changing keycap, including the following steps:

[0016] Under the condition that the injection temperature is 200 - 220 °C, the temperature-changing powder is added to the keycap base material for injection molding.

[0017] In this embodiment, the keycap base material is selected from one of ABS, PC, and PBT.

[0018] In this embodiment, the model of the temperature-changing powder is the Chameleon T series in the temperature-sensitive color-changing microcapsules of Insilico.

[0019] In this embodiment, the mass ratio between the temperature-changing powder and the keycap base material is 1:95 - 105.

[0020] In this embodiment, the mass ratio between the temperature-changing powder and the keycap base material is 1:100.

[0021] In this embodiment, when the keycap base material is selected as ABS, the injection pressure is 60 - 100 MPa; when the keycap base material is selected as PBT, the injection pressure is 80 - 120 MPa; when the keycap base material is selected as PC, the injection pressure is 70 - 110 MPa; the holding pressure is 30% - 50% of the injection pressure to prevent sink marks and ensure color stability; the back pressure is 3 - 8 MPa to ensure uniform mixing of the temperature-changing powder and the melt.

[0022] In this embodiment, when the keycap base material is selected as ABS, the mold temperature is 50 - 70 °C; when the keycap base material is selected as PBT, the mold temperature is 60 - 80 °C; when the keycap base material is selected as PC, the mold temperature is 80 - 100 °C.

[0023] Example 1, a method for preparing a color-changing keycap, including the following steps:

[0024] The temperature-changing powder is added to the keycap base material for injection molding, and the injection temperature is 220 °C.

[0025] In this embodiment, the keycap base material is ABS.

[0026] In this embodiment, the temperature-changing powder is the Chameleon T series in the thermosensitive microcapsules of Insilico.

[0027] In this embodiment, the mass ratio between the temperature-changing powder and the keycap substrate is 1:100.

[0028] In this embodiment, when the keycap substrate is selected as ABS, the injection pressure is 80 MPa; the holding pressure is 40% of the injection pressure to prevent sink marks and ensure color stability; the back pressure is 6 MPa to ensure uniform mixing of the temperature-changing powder and the melt.

[0029] In this embodiment, when the keycap substrate is selected as ABS, the mold temperature is 60 °C.

[0030] Example 2, a method for preparing a color-changing keycap, includes the following steps:

[0031] Inject by adding a temperature-changing powder into the keycap substrate, and the injection temperature is 220 °C.

[0032] In this embodiment, the keycap substrate is PC.

[0033] In this embodiment, the temperature-changing powder is the Chameleon T series in the thermosensitive microcapsules of Insilico.

[0034] In this embodiment, the mass ratio between the temperature-changing powder and the keycap substrate is 1:100.

[0035] In this embodiment, when the keycap substrate is selected as PC, the injection pressure is 100 MPa; the holding pressure is 40% of the injection pressure to prevent sink marks and ensure color stability; the back pressure is 6 MPa to ensure uniform mixing of the temperature-changing powder and the melt.

[0036] In this embodiment, when the keycap substrate is selected as PC, the mold temperature is 90 °C.

[0037] It should be noted that in this article, the term "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article or device including that element.

[0038] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification of the present invention, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present invention.

Claims

1. A method for preparing a color-changing keycap, characterized in that: The following steps are involved: Under the condition of injection molding temperature of 200-220°C, temperature color changing powder is added into the key cap base material for injection molding.

2. A method for preparing a color-changing keycap according to claim 1, characterized in that: The keycap substrate is selected from one of ABS, PC and PBT.

3. The method for preparing a color-changing keycap according to claim 1, characterized in that: The model of the temperature-changing color powder is the Chameleon T series of Insilico's temperature-changing color microcapsules.

4. The method for preparing a color-changing keycap according to claim 1, characterized in that: The mass ratio between the temperature color-changing powder and the key cap substrate is 1:95-105.

5. A method for preparing a color-changing keycap according to claim 4, characterized in that: The mass ratio between the temperature color-changing powder and the key cap substrate is 1:

100.

6. The method for preparing a color-changing keycap according to claim 1, characterized in that: When the keycap substrate is ABS, the injection pressure is 60-100MPa; when the keycap substrate is PBT, the injection pressure is 80-120MPa; when the keycap substrate is PC, the injection pressure is 70-110MPa; the holding pressure is 30%-50% of the injection pressure to prevent shrinkage marks and ensure color stability; the back pressure is 3-8MPa to ensure that the temperature color-changing powder is evenly mixed with the melt.

7. The method for preparing a color-changing keycap according to claim 1, characterized in that: When the key cap base material is ABS, the mold temperature is 50-70°C; when the key cap base material is PBT, the mold temperature is 60-80°C; when the key cap base material is PC, the mold temperature is 80-100°C.