Display module and display device

Abstract

The embodiment of the present application discloses a display module and a display device, both of which comprise a light guide plate and an appearance structure layer, the appearance structure layer covers the non-light-out surface, the non-light-in surface and the second surface of the light guide plate; the appearance structure layer comprises an appearance layer and a reflection layer, and the appearance layer is covered on the side of the reflection layer away from the light guide plate. The embodiment of the present application adopts the appearance structure layer to cover the non-light-out surface, the non-light-in surface and the second surface of the light guide plate as an appearance structure, so that the conventional appearance frame can be saved in the display device; secondly, the display module of the embodiment of the present application also saves the conventional back plate and the glue frame, and simplifies the backlight module; therefore, the embodiment saves the conventional appearance frame, the back plate and the glue frame, simplifies the structure and the assembly steps, and greatly improves the assembly efficiency.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] In most common LCD monitors, the monitor frame forms the monitor's appearance, and the LCD panel is attached to the backlight module's frame using flexible adhesive tape. The backlight module includes a backplate and a frame, which form a cavity containing a light guide plate and optical films.

[0003] In the process of researching and practicing existing technologies, the inventors of this application discovered that liquid crystal displays have many components and are relatively complicated to assemble. Summary of the Invention

[0004] This application provides a display module and display device that can save on the backplate and frame of the backlight module and the outer frame of the display.

[0005] This application provides a display module, which includes a backlight module and a display panel disposed on the light-emitting side of the backlight module. The backlight module includes:

[0006] A light guide plate includes a peripheral side surface and a first surface and a second surface disposed opposite to each other. In the thickness direction of the light guide plate, the peripheral side surface connects the first surface and the second surface. The first surface includes a light-emitting surface and a non-light-emitting surface, the non-light-emitting surface surrounding the peripheral side of the light-emitting surface. The peripheral side surface includes a light-incident surface and a non-light-incident surface, the light-incident surface being configured to transmit light into the interior of the light guide plate.

[0007] An external structural layer covers the non-light-emitting surface, non-light-incident surface, and second surface of the light guide plate;

[0008] The exterior structure layer includes an exterior layer and a reflective layer, with the exterior layer covering the side of the reflective layer away from the light guide plate.

[0009] Optionally, in some embodiments of this application, the hardness of the outer layer is greater than the hardness of the reflective layer.

[0010] Optionally, in some embodiments of this application, both the reflective layer and the appearance layer are coatings.

[0011] Optionally, in some embodiments of this application, the backlight module includes an optical film disposed on the light-emitting surface of the light guide plate, and the edge portion of the optical film overlaps with the appearance structure layer.

[0012] Optionally, in some embodiments of this application, the display module includes a first circuit board and a second circuit board, one end of the first circuit board is connected to the display panel, the other end of the first circuit board is connected to the second circuit board, and the second circuit board is disposed on the area of ​​the appearance structure layer corresponding to the non-light-emitting surface of the light guide plate;

[0013] The light guide plate supports the second circuit board on the non-light-emitting surface. The second circuit board is fixed to the appearance structure layer by an adhesive layer. The second circuit board has a second connector, which is configured to plug into and cooperate with the first connector of the control module.

[0014] Accordingly, this application also provides a display device, which includes a display module and a control module, wherein the display module is the display module as described in any of the above embodiments;

[0015] The control module includes a housing and a control component. The control component is disposed within the housing. A portion of the housing extending beyond the control component forms a slot. A portion of the display module is inserted into the slot. The control component is configured to control the display module to display.

[0016] Optionally, in some embodiments of this application, the display module includes a first circuit board and a second circuit board. One end of the first circuit board is connected to the display panel, and the other end of the first circuit board is connected to the second circuit board. The second circuit board is disposed on the area of ​​the appearance structure layer corresponding to the non-light-emitting surface of the light guide plate. The second circuit board is disposed on the side adjacent to the light-incident surface of the light guide plate. The side of the display module having the light-incident surface is inserted into the slot. The housing covers the non-display area of ​​the second circuit board, the first circuit board, and the display panel.

[0017] Optionally, in some embodiments of this application, the control component includes a main control board and a first connector, the second circuit board has a second connector, the first connector is disposed on the side of the main control board near the display module, the main control board is configured to control the display panel display through the first connector and the second connector, and the first connector and the second connector are plugged into each other.

[0018] Optionally, in some embodiments of this application, the control component further includes a light-emitting device, which is disposed on the side of the main control board near the light guide plate. The light-emitting device is disposed opposite to the light incident surface of the light guide plate, and the main control board is configured to control the light-emitting device to emit light.

[0019] Optionally, in some embodiments of this application, some components of the main control board are disposed on the side of the main control board away from the display module, and the width of the components located on the side of the main control board away from the display module is greater than the width of the light-emitting device;

[0020] A receiving groove is formed on the side of the outer casing away from the display module, and the components located on the side of the main control board away from the display module are disposed in the receiving groove.

[0021] Optionally, in some embodiments of this application, the control component further includes thermally conductive adhesive, and a boss is formed on the side of the housing away from the display module. The boss is disposed on one side of the receiving groove, and the main control board is attached to the boss by the thermally conductive adhesive.

[0022] Optionally, in some embodiments of this application, the control component further includes a light-emitting device and a third circuit board. The third circuit board is disposed on the side of the main control board near the display module. The light-emitting device is connected to the side of the third circuit board near the display module, and the light-emitting device is disposed opposite to the light-incident surface of the light guide plate. The first connector is disposed on the main control board and is located on one side of the third circuit board.

[0023] Optionally, in some embodiments of this application, the control component includes a heat sink bracket and thermally conductive adhesive. The heat sink bracket is disposed between the third circuit board and the main control board. The third circuit board is disposed on the heat sink bracket via the thermally conductive adhesive. The main control board is disposed on the housing.

[0024] The heat dissipation bracket has an opening, through which the first connector extends toward the display module; the heat dissipation bracket has a clearance groove on the side facing the main control board, and at least some of the components of the main control board are disposed in the clearance groove.

[0025] Optionally, in some embodiments of this application, the control component further includes a light-emitting device and a third circuit board. The third circuit board is disposed on the side of the main control board near the display module. The light-emitting device is connected to the side of the third circuit board near the display module, and the light-emitting device is disposed opposite to the light-incident surface of the light guide plate. The first connector is disposed on the side of the third circuit board near the display module, and the first connector is located on the side of the light-emitting device.

[0026] The control component further includes a third connector and a fourth connector. The third connector is disposed on the side of the third circuit board away from the first connector, and the fourth connector is disposed on the side of the main control board close to the third connector. The third connector and the fourth connector are connected together.

[0027] Optionally, in some embodiments of this application, the control component further includes a heat sink bracket and thermally conductive adhesive. The heat sink bracket is disposed between the third circuit board and the main control board. The third circuit board is disposed on the heat sink bracket via the thermally conductive adhesive. The main control board is disposed on the housing.

[0028] The heat dissipation bracket has an opening, through which the third connector passes and connects to the fourth connector; the heat dissipation bracket has a clearance groove on the side facing the main control board, and at least some of the components of the main control board are disposed in the clearance groove.

[0029] Optionally, in some embodiments of this application, the display module includes a light-shielding adhesive located on the outer periphery of the optical film of the backlight module. The light-shielding adhesive is disposed on the area of ​​the appearance structure layer corresponding to the non-light-emitting surface of the light guide plate. The display panel is connected and disposed on the side of the light-shielding adhesive away from the light guide plate. There is a gap between the optical film and the light-shielding adhesive.

[0030] Optionally, in some embodiments of this application, the display device further includes a rear cover plate disposed on the side of the appearance structure layer away from the display panel, and the thickness of the light guide plate is less than or equal to 2 mm.

[0031] The backlight module and display device of this application embodiment both include a light guide plate and an outer structural layer. The light guide plate includes a peripheral side surface and a first surface and a second surface disposed opposite to each other. The first surface includes a light-emitting surface and a non-light-emitting surface. The non-light-emitting surface surrounds the peripheral side of the light-emitting surface. The peripheral side surface includes a light-incident surface and a non-light-incident surface. The light-incident surface is configured to transmit light into the interior of the light guide plate. The outer structural layer covers the non-light-emitting surface, the non-light-incident surface and the second surface of the light guide plate. The outer structural layer includes an outer layer and a reflective layer. The outer layer covers the side of the reflective layer away from the light guide plate.

[0032] It is understood that the embodiments of this application use an appearance structure layer to cover the non-light-emitting surface, non-light-incident surface, and second surface of the light guide plate as the appearance structure, thereby saving the conventional appearance frame in the display device; secondly, the backlight module of the display module of the embodiments of this application also saves the conventional back plate and frame, simplifying the backlight module; therefore, this embodiment simplifies the structure and assembly steps by saving the conventional appearance frame, back plate, and frame, greatly improving assembly efficiency; in addition, the reflective layer is integrated into the appearance structure layer, which can simplify the structure of the module and reduce the thickness of the backlight module. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of the display module provided in this embodiment;

[0034] Figure 2 yes Figure 1 A schematic diagram of the cross-section along line AA;

[0035] Figure 3 This is a top view of the backlight module in the display module provided in the embodiment of this application;

[0036] Figure 4 yes Figure 3 A schematic diagram of the cross section along line BB;

[0037] Figure 5 This is a front view structural diagram of the display device provided in the embodiment of this application in a standing state;

[0038] Figure 6 yes Figure 5 Schematic diagram of the cross section of the CC line;

[0039] Figure 7 yes Figure 5 Schematic diagram of the cross section of the DD line;

[0040] Figure 8 This is a schematic diagram of the structure of a control module for a display device provided in an embodiment of this application;

[0041] Figure 9 This is another schematic diagram of the control module of the display device provided in the embodiments of this application;

[0042] Figure 10 This is another structural schematic diagram of the control module of the display device provided in the embodiments of this application;

[0043] Figure 11 This is another structural schematic diagram of the display device provided in the embodiments of this application. Detailed Implementation

[0044] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific implementation methods described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, the embodiments can be combined with each other but will not be described in detail one by one. Unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device; the terms "first," "second," "third," etc. are only used as markings and do not impose numerical requirements or establish a sequence.

[0045] This application provides a backlight module, a display module, and a display device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0046] Please refer to Figures 1 to 2 This application provides a display module p1, which includes a backlight module 100 and a display panel 200 disposed on the light-emitting side of the backlight module 100.

[0047] Optionally, the display panel 200 is an LCD display panel.

[0048] Please refer to Figures 1 to 4 The backlight module 100 includes a light guide plate 10 and an outer structural layer 20.

[0049] The light guide plate 10 includes a peripheral side surface 11 and a first surface 12 and a second surface 13 disposed opposite to each other. In the thickness direction of the light guide plate 10, the peripheral side surface 11 connects the first surface 12 and the second surface 13. The first surface 12 includes a light-emitting surface 12a and a non-light-emitting surface 12b, with the non-light-emitting surface 12b surrounding the periphery of the light-emitting surface 12a. The peripheral side surface 11 includes a light-incident surface 11a and a non-light-incident surface 11b. The light-incident surface 11a is configured to guide light into the interior of the light guide plate 10. The outer structural layer 20 covers the non-light-emitting surface 12b, the non-light-incident surface 11b, and the second surface 13 of the light guide plate 10.

[0050] The outer structure layer 20 includes an outer layer 21 and a reflective layer 22, with the outer layer 21 covering the side of the reflective layer 22 away from the light guide plate 10.

[0051] It is understood that, in this embodiment, the backlight module 100 of the display module p1 uses an appearance structure layer 20 to cover the non-light-emitting surface 12b, the non-light-incident surface 11b, and the second surface 13 of the light guide plate 10 as an appearance structure, thereby saving the conventional appearance frame in the display device. Secondly, the backlight module 100 of the display module p1 in this embodiment also saves the conventional back plate and frame, simplifying the backlight module 100. Therefore, this embodiment simplifies the structure, thins the backlight module 100, and reduces assembly steps by saving the conventional appearance frame, back plate, and frame, greatly improving assembly efficiency. In addition, the reflective layer 22 is integrated into the appearance structure layer, which can simplify the structure of the module and reduce the thickness of the backlight module.

[0052] Optionally, both the outer layer 21 and the reflective layer 22 may cover at least the entire surface of the light guide plate 10, including the non-light-emitting surface 12b, the non-light-incident surface 11b, and the second surface 13.

[0053] Optionally, in some embodiments of this application, the appearance structure layer 20 does not cover the light incident surface 11a of the light guide plate 10.

[0054] Optionally, in some embodiments of this application, the appearance structure layer 20 also covers a portion of the light-incident surface 11a of the light guide plate 10. That is, the appearance structure layer 20 has multiple cutouts in the portion of the light-incident surface 11a, and each cutout is configured to allow light emitted by the light-emitting device to pass through. The appearance structure layer 20 is disposed between two adjacent cutouts to improve light utilization.

[0055] Optionally, in some embodiments of this application, the light guide plate 10 is further provided with a groove corresponding to the area of ​​the cutout, the groove being configured to accommodate the light-emitting device to improve light utilization.

[0056] Optionally, in some embodiments of this application, the hardness of the outer layer 21 is greater than the hardness of the reflective layer 22.

[0057] It is understandable that the outer layer 21 is located on the outermost side of the backlight module 100 and the display device. Therefore, the outer layer 21 has a high hardness, which can play the role of wear resistance, scratch prevention and protection of the reflective layer 22.

[0058] Optionally, the material of the reflective layer 22 is not specifically limited, as long as it can reflect light. The color of the appearance layer 21 can be selected according to actual needs, and this application does not impose any restrictions, such as black.

[0059] Optionally, in some embodiments of this application, both the reflective layer 22 and the appearance layer 21 are coatings.

[0060] Understandably, compared to the use of adhesive to fix the outer layer 21 and the reflective layer 22, both the reflective layer 22 and the outer layer 21 are coatings, which can further thin the backlight module 100. Moreover, the double coating setting avoids light leakage caused by adhesion error and the difference in thermal expansion coefficients between the adhesive layer and the light guide plate 10.

[0061] Optionally, the absolute value of the difference between the thermal expansion coefficient of the reflective layer 22 and the thermal expansion coefficient of the light guide plate 10 is less than 10 ppm / ℃, so as to reduce the risk of the two peeling off due to thermal expansion.

[0062] Optionally, in some embodiments of this application, one side of the reflective layer 22 is covalently connected to the light guide plate 10, and the other side of the reflective layer 22 is also covalently connected to the outer layer 21, so as to improve the bonding strength between the light guide plate 10 and the outer layer 21 and the reflective layer 22, thereby reducing the risk of peeling due to different coefficients of thermal expansion.

[0063] Optionally, in some embodiments of this application, the backlight module 100 includes an optical film 30, which is disposed on the light-emitting surface 12a of the light guide plate 10. The edge portion of the optical film 30 overlaps with the appearance structure layer 20.

[0064] It is understandable that the edge portion of the optical film 30 and the appearance structure layer 20 are overlapped to ensure that the light emitted from the light-emitting surface 12a of the light guide plate 10 will penetrate the optical film 30.

[0065] Optionally, the optical film 30 is attached to the light guide plate 10 by adhesive bonding.

[0066] Please refer to Figure 1 and Figure 2 Optionally, in some embodiments of this application, the display module p1 includes a first circuit board 401 and a second circuit board 402. One end of the first circuit board 401 is connected to the display panel 200, and the other end of the first circuit board 401 is connected to the second circuit board 402. The second circuit board 402 is disposed on the area of ​​the appearance structure layer 20 corresponding to the non-light-emitting surface 12b of the light guide plate 10.

[0067] The portion of the light guide plate 10 located on the non-light-emitting surface 12b supports the second circuit board 402.

[0068] It is understandable that the light guide plate 10 is extended at one end corresponding to the first circuit board 401 and the second circuit board 402 to support the first circuit board 401 and the second circuit board 402, without the need for additional brackets to support and fix the first circuit board 401 and the second circuit board 402.

[0069] Optionally, in some embodiments of this application, the second circuit board 402 is fixed to the appearance structure layer 20 by an adhesive layer 403.

[0070] Understandably, compared to conventional displays where the support tongues of the circuit board and backplate are connected by threads, this embodiment uses an inner adhesive layer 403, which can reduce the risk of abnormal noise.

[0071] Optionally, in some embodiments of this application, the thermal conductivity of the outer layer 21 is lower than that of the reflective layer 22 and the light guide plate 10. That is, the thermal insulation effect of the outer layer 21 is relatively better, which can reduce the impact of heat on the adhesive layer 403 and improve the firmness of the fixation between the second circuit board 402 and the outer structure layer 20.

[0072] Optionally, the first circuit board 401 is a flexible circuit board or a flip-chip film, and the second circuit board 402 is a rigid circuit board, such as a printed circuit board.

[0073] Optionally, in some embodiments of this application, the display module p1 includes a light-shielding adhesive 404, which is located on the outer periphery of the optical film of the backlight module 100. The light-shielding adhesive 404 is disposed on the appearance structure layer 20 in the area corresponding to the non-light-emitting surface 12b of the light guide plate 10. The display panel 200 is connected and disposed on the side of the light-shielding adhesive 404 away from the light guide plate 10. A gap exists between the optical film 30 and the light-shielding adhesive 404.

[0074] Understandably, using light-shielding adhesive 404 to connect the display panel 200 and the backlight module 100 can reduce the risk of light leakage. Secondly, the gap between the optical film 30 and the light-shielding adhesive 404 can meet the space requirements for thermal expansion of the optical film 30 and also serve to limit the optical film 30.

[0075] Optionally, the gap width between the optical film 30 and the light-shielding adhesive 404 is between 0.2 mm and 0.6 mm, for example, it can be 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm or 0.6 mm.

[0076] Accordingly, this application also provides a backlight module 100 for the display module p1. The structure of the backlight module 100 is described in detail below. Figures 1 to 4 The relevant explanations in the text will not be repeated here.

[0077] Please refer to Figures 5 to 7 This application also provides a display device 1000, which includes a display module p1 and a control module 300. The display module p1 is the display module p1 described in any of the above embodiments.

[0078] It should be noted that the structure of the display module p1 of the display device 1000 in this application embodiment is similar to or the same as the structure of the display module p1 in any of the above embodiments. For details, please refer to... Figures 1 to 4Therefore, the relevant explanations will not be repeated here.

[0079] Optionally, the display device 1000 may be an application of at least one of the following: smartphone, tablet, mobile phone, video phone, e-book reader, desktop computer, laptop, netbook, workstation, server, personal digital assistant, portable media player, MP3 player, television, mobile medical device, camera, game console, digital camera, car navigation system, in-vehicle display, electronic billboard, ATM, or wearable device, VR device, AR device.

[0080] The control module 300 includes a housing 31 and a control component 32, which is disposed within the housing 31. A portion of the housing 31 extending beyond the control component 32 forms a slot 31a, into which a portion of the display module p1 is inserted. The control component 32 is configured to control the display of the display module p1.

[0081] It is understandable that the display device 1000 integrates the appearance structure into the backlight module 100, that is, it uses the appearance layer 21 to replace the appearance frame of the conventional display, thereby saving the steps of assembling the appearance frame and reducing the thickness of the display device 1000.

[0082] Secondly, the display module p1 and the control module 300 are plugged in and connected, which simplifies the assembly steps of conventional displays and improves the assembly efficiency of display device 1000.

[0083] In addition, in some embodiments of this application, the control module 300 is also configured as a base to support and fix the display module p1, thereby eliminating the need for an additional base to support the display module p1.

[0084] Optionally, in some embodiments of this application, the second circuit board 402 is disposed on the side adjacent to the light incident surface 11a of the light guide plate 10. The side of the display module p1 having the light incident surface 11a is inserted into the slot 31a. The housing 31 covers the non-display area of ​​the second circuit board 402, the first circuit board 401, and the display panel 200.

[0085] Understandably, the non-display area of ​​the display panel 200, the first circuit board 401, and the second circuit board 402 are housed within the slot 31a to prevent them from being seen by the user. The housing 31 is configured as an exterior casing to enhance the aesthetic appearance of the display device 1000 while also providing protection.

[0086] Optionally, the housing 31 can be a metal housing or a plastic housing.

[0087] Please refer to Figure 7 and Figure 8 , Figure 8The diagram shown is a structural schematic of the control module 300.

[0088] Optionally, in some embodiments of this application, the control component 32 includes a main control board 321 and a first connector 322. The second circuit board 402 has a second connector 323. The first connector 322 is disposed on the side of the main control board 321 near the display module p1. The main control board 321 is configured to control the display panel 200 via the first connector 322 and the second connector 323. The first connector 322 and the second connector 323 are plugged into each other.

[0089] Understandably, the first connector 322 and the second connector 323 are plugged into each other to facilitate the insertion of the display module p1 into the slot 31a. Optionally, the first connector 322 has one of a protrusion and a recess, and the second connector 323 has the other of a protrusion and a recess, to achieve the plugging and mating of the first connector 322 and the second connector 323.

[0090] In some embodiments of this application, the control component 32 includes a light-emitting device 32a, which is disposed on the side of the main control board 321 near the light guide plate 10. The light-emitting device 32a is disposed opposite to the light incident surface of the light guide plate 10. The main control board 321 is configured to control the light-emitting device 32a to emit light.

[0091] It is understandable that the main control board 321 is electrically connected to both the first connector 322 and the light-emitting device 32a, so that the main control board 321 can control both the display panel 200 and the light-emitting device 32a at the same time, thereby saving a circuit board and simplifying the structure of the control module 300.

[0092] Optionally, the main control board 321 extends along the length of the display panel 200, and multiple light-emitting devices 32a are arranged along the length of the display panel 200.

[0093] Optionally, the light-emitting device 32a can be a light-emitting diode or other light source.

[0094] Optionally, in some embodiments of this application, some components 32b of the main control board 321 are disposed on the side of the main control board 321 away from the display module p1. The height h1 of the components 32b located on the side of the main control board 321 away from the display module p1 is greater than the height h2 of the light-emitting device 32a.

[0095] A receiving groove 31b is formed on the side of the housing 31 away from the display module p1. Components 32b located on the side of the main control board 321 away from the display module p1 are disposed in the receiving groove 31b.

[0096] Understandably, the main control board 321 has multiple components 32b. Based on the height of the light-emitting device 32a, components higher than the light-emitting device 32a are considered taller, and those lower are considered shorter. Placing the taller components 32b on the back of the main control board 321 avoids interference between the taller components 32b and the light guide plate 10, thus allowing for a smaller gap between the light-emitting device 32a and the light guide plate 10, thereby reducing light loss.

[0097] Secondly, the component 32b is placed in the receiving slot 31b to facilitate the assembly and cooperation of the main control board 321 and the housing 31.

[0098] Optionally, in some embodiments of this application, the control component 32 includes thermally conductive adhesive 324. A boss 31c is formed on the side of the housing 31 away from the display module p1. The boss 31c is disposed on one side of the receiving groove 31b. The main control board 321 is attached to the boss 31c by the thermally conductive adhesive 324.

[0099] Understandably, the main control board 321 is fixed to the boss 31c using thermally conductive adhesive 324 to secure the main control board 321. Furthermore, the thermally conductive adhesive 324 can transfer heat from the main control board 321 to the boss 31c and then distribute it throughout the entire housing 31, improving heat dissipation efficiency.

[0100] Optionally, the housing 31 can be a metal housing or a metal housing with an exterior coating to improve heat dissipation. In addition, since the housing 31 shields the first circuit board 401 and the second circuit board 402, it can reduce the risk of external signals interfering with the first circuit board 401 and the second circuit board 402.

[0101] Figure 9 This diagram illustrates another structural design of the control module 300. Figure 9 In this document, parts that differ from the embodiments described above will be described to avoid redundancy.

[0102] Please refer to Figure 9 In some embodiments of this application, the control component 32 includes a light-emitting device 32a and a third circuit board 325, the third circuit board 325 being disposed on the side of the main control board 321 near the display module p1. The light-emitting device 32a is connected to the side of the third circuit board 325 near the display module p1. The light-emitting device 32a is disposed opposite to the light-incident surface 11a of the light guide plate 10. A first connector 322 is disposed on the main control board 321, and the first connector 322 is located on one side of the third circuit board 325.

[0103] Understandably, compared to Figure 8 The corresponding implementation method of the control module 300, Figure 9The corresponding implementation reduces the difficulty of integrating too many circuits on the main control board 321 by adding a third circuit board 325 to drive the light-emitting device 32a, and also reduces the heat intensity of the main control board 321.

[0104] Optionally, in some embodiments of this application, the control component 32 includes a heat sink bracket 326 and thermally conductive adhesive 324. The heat sink bracket 326 is disposed between the third circuit board 325 and the main control board 321. The third circuit board 325 is mounted on the heat sink bracket 326 via the thermally conductive adhesive 324. The main control board 321 is mounted on the housing 31.

[0105] It is understood that the third circuit board 325 disperses heat to the heat sink 326 via the thermally conductive adhesive 324. Since the heat sink 326 contacts the housing 31, it further disperses heat to the housing 31. Meanwhile, the heat from the main control board 321 is directly dispersed to the housing 31. This embodiment of the application provides two separate heat dissipation paths to cool the third circuit board 325 and the main control board 321 respectively, thereby improving overall heat dissipation efficiency.

[0106] Optionally, in some embodiments of this application, the heat sink bracket 326 has an opening 32d, through which the first connector 322 extends toward the display module p1. A clearance groove 32f is formed on the side of the heat sink bracket 326 facing the main control board 321, and at least a portion of the components 32b of the main control board 321 are disposed within the clearance groove 32f.

[0107] Understandably, the opening 32d facilitates the insertion and mating of the first connector 322 and the second connector 323. Secondly, the component 32b is positioned within the clearance groove 32f to avoid assembly interference and improve the efficiency of heat dissipation from the component 32b to the heat sink 326.

[0108] Figure 10 This is a schematic diagram of another structure of the control module 300. Figure 10 In this document, parts that differ from the embodiments described above will be described to avoid redundancy.

[0109] Please refer to Figure 10 In some embodiments of this application, the control component 32 includes a light-emitting device 32a and a third circuit board 325, the third circuit board 325 being disposed on the side of the main control board 321 near the display module p1. The light-emitting device 32a is connected to the side of the third circuit board 325 near the display module p1. The light-emitting device 32a is disposed opposite to the light-incident surface 11a of the light guide plate 10. A first connector 322 is disposed on the side of the third circuit board 325 near the display module p1, and the first connector 322 is located on the same side as the light-emitting device 32a.

[0110] The control assembly 32 also includes a third connector 327 and a fourth connector 328. The third connector 327 is located on the side of the third circuit board 325 away from the first connector 322. The fourth connector 328 is located on the side of the main control board 321 closer to the third connector 327. The third connector 327 and the fourth connector 328 are connected together.

[0111] Understandable, Figure 10 In the corresponding implementation of the control module 300, the first connector 322 is placed on the third circuit board 325 to avoid the risk of the first connector 322 being too high, causing assembly difficulties.

[0112] Optionally, in some embodiments of this application, the control component 32 includes a heat sink bracket 326 and thermally conductive adhesive 324. The heat sink bracket 326 is disposed between the third circuit board 325 and the main control board 321, and the third circuit board 325 is mounted on the heat sink bracket 326 via the thermally conductive adhesive 324. The main control board 321 is mounted on the housing 31.

[0113] It is understood that the third circuit board 325 disperses heat to the heat sink 326 via the thermally conductive adhesive 324. Since the heat sink 326 contacts the housing 31, it further disperses heat to the housing 31. Meanwhile, the heat from the main control board 321 is directly dispersed to the housing 31. This embodiment of the application provides two separate heat dissipation paths to cool the third circuit board 325 and the main control board 321 respectively, thereby improving overall heat dissipation efficiency.

[0114] The heat sink bracket 326 has an opening 32d, through which the third connector 327 connects to the fourth connector 328. A clearance groove 32f is formed on the side of the heat sink bracket 326 facing the main control board 321. At least a portion of the components 32b of the main control board 321 are disposed within the clearance groove 32f.

[0115] Understandably, the opening 32d facilitates the mating of the third connector 327 and the fourth connector 328. Secondly, the component 32b is positioned within the clearance groove 32f to avoid assembly interference and improve the efficiency of heat dissipation from component 32b to the heat sink 326.

[0116] Figure 11 This is a schematic diagram of another structure of the display device 1000. Figure 11 In this document, parts that differ from the embodiments described above will be described to avoid redundancy.

[0117] Please refer to Figure 11 In some embodiments of this application, the display device 1000 further includes a rear cover plate 500, which is disposed on the side of the appearance structure layer 20 away from the display panel 200. The thickness of the light guide plate 10 is less than or equal to 2 mm.

[0118] It is understandable that, compared to the display device 1000 in the above embodiments, Figure 11 In a corresponding embodiment, the strength of the display device 1000 is improved by adding a rear cover plate 500, thereby reducing the thickness of the light guide plate 10.

[0119] Optionally, the thickness of the light guide plate 10 can be 2 mm, 1.5 mm, 1 mm, 0.9 mm, 0.8 mm, 0.7 mm, or 0.6 mm, etc.

[0120] Optionally, a portion of the rear cover 500 is disposed within the slot 31a. In some embodiments, the rear cover 500 may not be disposed within the slot 31a.

[0121] The backlight module and display device of this application embodiment both include a light guide plate 10 and an outer structural layer 20. The light guide plate 10 includes a peripheral side surface 11 and a first surface 12 and a second surface 13 disposed opposite to each other. The first surface 12 includes a light-emitting surface 12a and a non-light-emitting surface 12b, with the non-light-emitting surface 12b surrounding the periphery of the light-emitting surface 12a. The peripheral side surface 11 includes a light-incident surface and a non-light-incident surface 11b, with the light-incident surface 11a configured to guide light into the interior of the light guide plate 10. The outer structural layer 20 covers the non-light-emitting surface 12b, the non-light-incident surface 11b, and the second surface 13 of the light guide plate 10. The outer structural layer 20 includes an outer layer and a reflective layer, with the outer layer 21 covering the side of the reflective layer 22 away from the light guide plate 10.

[0122] It is understood that the embodiments of this application use an appearance structure layer to cover the non-light-emitting surface 12b, the non-light-incident surface 11b, and the second surface 13 of the light guide plate as the appearance structure, thereby saving the conventional appearance frame in the display device; secondly, the backlight module of the embodiments of this application also saves the conventional back plate and frame, simplifying the backlight module; therefore, by saving the conventional appearance frame, back plate, and frame, this embodiment simplifies the structure and assembly steps, greatly improving assembly efficiency.

[0123] The foregoing has provided a detailed description of a backlight module and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display module, characterized in that, The backlight module includes a backlight module and a display panel disposed on the light-emitting side of the backlight module. The backlight module includes: A light guide plate includes a peripheral side surface and a first surface and a second surface disposed opposite to each other. In the thickness direction of the light guide plate, the peripheral side surface connects the first surface and the second surface. The first surface includes a light-emitting surface and a non-light-emitting surface, the non-light-emitting surface surrounding the peripheral side of the light-emitting surface. The peripheral side surface includes a light-incident surface and a non-light-incident surface, the light-incident surface being configured to transmit light into the interior of the light guide plate. An outer structural layer covers the non-light-emitting surface, non-light-incident surface, and second surface of the light guide plate; the outer structural layer includes an outer layer and a reflective layer, with the outer layer covering the side of the reflective layer away from the light guide plate; The display module includes a first circuit board and a second circuit board. One end of the first circuit board is connected to the display panel, and the other end of the first circuit board is connected to the second circuit board. The second circuit board is disposed on the non-light-emitting surface of the appearance structure layer corresponding to the light guide plate. The portion of the light guide plate located on the non-light-emitting surface supports the second circuit board, and the second circuit board is fixed to the appearance structure layer by an adhesive layer.

2. The display module according to claim 1, characterized in that, The hardness of the outer layer is greater than that of the reflective layer.

3. The display module according to claim 2, characterized in that, Both the reflective layer and the outer layer are coatings.

4. The display module according to any one of claims 1-3, characterized in that, The backlight module includes an optical film disposed on the light-emitting surface of the light guide plate, and the edge portion of the optical film overlaps with the appearance structure layer.

5. The display module according to claim 4, characterized in that, The second circuit board has a second connector configured to engage with a first connector of the control module.

6. A display device, characterized in that, It includes a display module and a control module, wherein the display module is the display module as described in any one of claims 1-5; The control module includes a housing and a control component. The control component is disposed within the housing. A portion of the housing extending beyond the control component forms a slot. A portion of the display module is inserted into the slot. The control component is configured to control the display module to display.

7. The display device according to claim 6, characterized in that, The second circuit board is disposed on one side of the light-incident surface of the light guide plate, and the display module is inserted into the slot on one side of the light-incident surface. The housing covers the non-display area of ​​the second circuit board, the first circuit board, and the display panel.

8. The display device according to claim 7, characterized in that, The control component includes a main control board and a first connector. The second circuit board has a second connector. The first connector is disposed on the side of the main control board near the display module. The main control board is configured to control the display panel display through the first connector and the second connector. The first connector and the second connector are plugged into each other.

9. The display device according to claim 8, characterized in that, The control component also includes a light-emitting device, which is disposed on the side of the main control board near the light guide plate. The light-emitting device is disposed opposite to the light incident surface of the light guide plate, and the main control board is configured to control the light-emitting device to emit light.

10. The display device according to claim 9, characterized in that, Some components of the main control board are located on the side of the main control board away from the display module, and the width of the components located on the side of the main control board away from the display module is greater than the width of the light-emitting device; A receiving groove is formed on the side of the outer casing away from the display module, and the components located on the side of the main control board away from the display module are disposed in the receiving groove.

11. The display device according to claim 10, characterized in that, The control component also includes thermally conductive adhesive. A boss is formed on the side of the housing away from the display module. The boss is disposed on one side of the receiving groove. The main control board is attached to the boss by the thermally conductive adhesive.

12. The display device according to claim 8, characterized in that, The control component further includes a light-emitting device and a third circuit board. The third circuit board is disposed on the side of the main control board near the display module. The light-emitting device is connected to the side of the third circuit board near the display module and is disposed opposite to the light-incident surface of the light guide plate. The first connector is disposed on the main control board and is located on one side of the third circuit board.

13. The display device according to claim 12, characterized in that, The control component also includes a heat sink bracket and thermally conductive adhesive. The heat sink bracket is disposed between the third circuit board and the main control board. The third circuit board is disposed on the heat sink bracket via the thermally conductive adhesive. The main control board is disposed on the housing. The heat dissipation bracket has an opening, through which the first connector extends toward the display module; the heat dissipation bracket has a clearance groove on the side facing the main control board, and at least some of the components of the main control board are disposed in the clearance groove.

14. The display device according to claim 8, characterized in that, The control component further includes a light-emitting device and a third circuit board. The third circuit board is disposed on the side of the main control board near the display module. The light-emitting device is connected to the side of the third circuit board near the display module and is disposed opposite to the light-incident surface of the light guide plate. The first connector is disposed on the side of the third circuit board near the display module and is located on the side of the light-emitting device. The control component further includes a third connector and a fourth connector. The third connector is disposed on the side of the third circuit board away from the first connector, and the fourth connector is disposed on the side of the main control board close to the third connector. The third connector and the fourth connector are connected together.

15. The display device according to claim 14, characterized in that, The control component also includes a heat sink bracket and thermally conductive adhesive. The heat sink bracket is disposed between the third circuit board and the main control board. The third circuit board is disposed on the heat sink bracket via the thermally conductive adhesive. The main control board is disposed on the housing. The heat dissipation bracket has an opening, through which the third connector passes and connects to the fourth connector; the heat dissipation bracket has a clearance groove on the side facing the main control board, and at least some of the components of the main control board are disposed in the clearance groove.

16. The display device according to any one of claims 6-15, characterized in that, The display module includes a light-shielding adhesive located on the outer periphery of the optical film of the backlight module. The light-shielding adhesive is disposed on the area of ​​the appearance structure layer corresponding to the non-light-emitting surface of the light guide plate. The display panel is connected and disposed on the side of the light-shielding adhesive away from the light guide plate. There is a gap between the optical film and the light-shielding adhesive.

17. The display device according to claim 16, characterized in that, The display device further includes a rear cover plate, which is disposed on the side of the outer structure layer away from the display panel, and the thickness of the light guide plate is less than or equal to 2 mm.

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