Image sensor

Abstract

The present disclosure discloses an image sensor including: a first pixel sensing group including a first green sensing pixel, a second green sensing pixel, and a third green sensing pixel; a second pixel sensing group including a fourth green sensing pixel, a fifth green sensing pixel, and a sixth green sensing pixel; a first floating diffusion node FD shared by the first green sensing pixel and the second green sensing pixel; and a second FD shared by the fourth green sensing pixels and the fifth green sensing pixels, in which the first to third green sensing pixels are sequentially arranged in the first direction, in which the fourth to sixth green sensing pixels are sequentially arranged in the first direction, and in which the fourth to sixth green sensing pixels are sequentially arranged in the second direction. The second pixel sensing group is disposed directly adjacent to the first pixel sensing group in a second direction perpendicular to the first direction.

Description

[0001] This application is a divisional application of the patent application for invention titled "Image Sensor and Its Operating Method" with the application date of March 18, 2020, application number 202010190218.3.

[0002] Cross-reference to Related Applications

[0003] Korean Patent Application No. 10-2019-0033727, titled "Image Sensor and Its Operating Method", filed with the Korean Intellectual Property Office on March 25, 2019, is incorporated herein by reference in its entirety. Technical Field

[0004] Embodiments relate to an image sensor, and more particularly, to an image sensor including sensing pixels sharing a floating diffusion node and phase detection pixels sharing a microlens. Background Art

[0005] An image sensor captures a two-dimensional image or a three-dimensional image of an object. The image sensor generates an image of the object by using a photoelectric conversion device that responds to the intensity of light reflected from the object. With the development of complementary metal-oxide semiconductor (CMOS) technology, CMOS image sensors using CMOS have been widely used. Summary of the Invention

[0006] According to one or more embodiments, an image sensor includes: a first pixel sensing group including a first green sensing pixel, a second green sensing pixel, and a third green sensing pixel; a second pixel sensing group including a fourth green sensing pixel, a fifth green sensing pixel, and a sixth green sensing pixel; a first floating diffusion node FD shared by the first green sensing pixel and the second green sensing pixel; and a second FD shared by the fourth green sensing pixel and the fifth green sensing pixel, wherein the first green sensing pixel to the third green sensing pixel are sequentially arranged in a first direction, wherein the fourth green sensing pixel to the sixth green sensing pixel are sequentially arranged in the first direction, and wherein the second pixel sensing group is placed directly adjacent to the first pixel sensing group in a second direction perpendicular to the first direction.

[0007] According to one or more embodiments, an image sensor includes: a first pixel sensing group including first to fourth sensing pixels; a second pixel sensing group including fifth to eighth sensing pixels; a first floating diffusion node FD shared by the first to fourth sensing pixels; and a second FD shared by the fifth and eighth sensing pixels, wherein the first to eighth sensing pixels are configured to sense light corresponding to a green wavelength band, and wherein the second pixel sensing group is placed directly adjacent to the first pixel sensing group in a first direction.

[0008] According to one or more embodiments, an image sensor includes: a first pixel sensing group including first to fourth sensing pixels; a second pixel sensing group including fifth to eighth sensing pixels; a first floating diffusion node FD shared by the first to fourth sensing pixels; and a second FD shared by the fourth and eighth sensing pixels, wherein the first to eighth sensing pixels are configured to sense light corresponding to a blue wavelength band, and wherein the second pixel sensing group is placed directly adjacent to the first pixel sensing group in a first direction.

[0009] According to one or more embodiments, an image sensor includes a pixel array, where the pixel array includes a first unit pixel and a same color filter, where the first unit pixel includes a first sensing pixel adjacent in a column direction and a second sensing pixel adjacent in the column direction, the first sensing pixel and the second sensing pixel are adjacent in a row direction, and the same color filter overlaps with the first sensing pixel and the second sensing pixel. The first sensing pixel shares a first floating diffusion node. The second sensing pixel shares a second floating diffusion node.

[0010] According to one or more embodiments, an image sensor includes: a pixel array that outputs pixel signals, the pixel array including a plurality of sensing pixels and a plurality of phase detection pixels; a timing controller configured to output a control signal based on operation mode information indicating a normal shooting mode or a high dynamic range (HDR) shooting mode; and a read circuit configured to output pixel data based on the control signal and the pixel signals, where some of the plurality of sensing pixels may share a floating diffusion node and output pixel signals through one column line.

[0011] According to one or more embodiments, a method of operating an image sensor includes: sequentially outputting pixel signals by a plurality of sensing pixels through a shared floating diffusion node; receiving operation mode information indicating a normal shooting mode or a high dynamic range (HDR) shooting mode; when the operation mode information indicates the normal shooting mode, performing an analog binning operation on the pixel signals; and when the operation mode information indicates the HDR shooting mode, performing at least one of a reconstruction operation and a dynamic range compression (DRC) operation on the pixel signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Features will become apparent to those skilled in the art from a detailed description of exemplary embodiments with reference to the attached drawings, in which:

[0013] Figure 1 An image capturing device according to an embodiment is shown;

[0014] Figure 2 An image sensor according to an embodiment is shown;

[0015] Figure 3 A pixel array according to an embodiment is shown;

[0016] Figure 4 A unit pixel group according to an embodiment is shown;

[0017] Figures 5A to 5D A unit pixel group according to an embodiment is shown, the unit pixel group including a plurality of sensing pixels having various exposure time periods in a high dynamic range (HDR) shooting mode;

[0018] Figure 6A A circuit diagram of a sensing pixel group including a plurality of sensing pixels according to an embodiment is shown;

[0019] Figure 6B is applied to Figure 6A A waveform diagram of signals applied to the sensing pixel group shown;

[0020] Figure 7 A flowchart of a method of operating an image sensor according to an embodiment is shown;

[0021] Figure 8 Image processing operations in a normal shooting mode according to an embodiment are shown;

[0022] Figure 9 Image processing operations in a normal shooting mode according to an embodiment are shown;

[0023] Figure 10 Image processing operations in a high dynamic range (HDR) shooting mode according to an embodiment are shown;

[0024] Figure 11 Shows an image processing operation in HDR shooting mode according to an embodiment;

[0025] Figure 12 Shows a cross-sectional view of the structure of a phase detection pixel group according to an embodiment;

[0026] Figures 13A to 13D Shows a view of a phase detection pixel group and a microlens according to an embodiment, wherein the phase detection pixel group includes a plurality of phase detection pixels; and

[0027] Figure 14 Shows an image processing system according to an embodiment. Detailed implementation

[0028] Figure 1 Shows an image capturing device 1000 according to an embodiment. Refer to Figure 1 , the image capturing device 1000 may include a shooting unit 1100, an image sensor 100, and a processor 1200. The image capturing device 1000 may acquire image data by shooting an object S and may perform an autofocus function.

[0029] All operations of the image capturing device 1000 may be controlled by the processor 1200. The processor 1200 may provide control signals and / or information for the operations of each component to the lens driver 1120, the timing controller 120, etc. For example, the processor 1200 may provide operation mode information INFO_MD indicating a normal shooting mode or a high dynamic range (HDR) shooting mode to the timing controller 120.

[0030] The shooting unit 1100 may include a lens 1110 and a lens driver 1120. The lens 1110 may include at least one lens. In addition, the shooting unit 1100 may further include an aperture and an aperture driving unit.

[0031] The lens driver 1120 may exchange information about focus detection with the processor 1200 and may adjust the position of the lens 1110 in response to a control signal provided by the processor 1200. The lens driver 1120 may drive the lens 1110 in a direction in which the distance between the object S and the lens 1110 increases or decreases to adjust the distance between the lens 1110 and the object S. Depending on the position of the lens 1110, the object S may be in focus or out of focus.

[0032] The image capturing device 1000 may perform phase detection autofocusing (PDAF). For example, when the distance between the lens 1110 and the object S is relatively short, the lens 1110 may be out of the in-focus position of the object S, and a phase difference may occur between the images captured by the image sensor 100. In response to a control signal provided from the processor 1200, the lens driver 1120 may move the lens 1110 in a direction in which the distance between the object S and the lens 1110 increases.

[0033] Alternatively, when the distance between the lens 1110 and the object S is relatively long, the lens 1110 may be out of focus, and a phase difference may occur between the images captured by the image sensor 100. In response to a control signal provided from the processor 1200, the lens driver 1120 may move the lens 1110 in a direction in which the distance between the object S and the lens 1110 decreases.

[0034] The image sensor 100 may convert the light incident on the image sensor 100 into image data. The image sensor 100 may include a pixel array 110, a timing controller 120, and an image signal processor 130. The optical signal transmitted through the lens 1110 may reach the light receiving surface of the pixel array 110 and determine an image of the object S.

[0035] The pixel array 110 may be a Complementary Metal Oxide Semiconductor Image Sensor (CIS) that converts an optical signal into an electrical signal. The exposure period and sensitivity of the pixel array 110 may be adjusted by the timing controller 120. The pixel array 110 may include a plurality of sensing pixels and a plurality of phase detection pixels. The sensing pixels may operate to output image data of the object S, and each of the phase detection pixels may detect a phase difference between the image data of the object S and operate to move the lens 1110. Specific embodiments regarding the sensing pixels and the phase detection pixels will be described later.

[0036] The processor 1200 may receive the image data from the image signal processor 130, perform various image after-processing operations on the image data, and perform phase difference calculation.

[0037] For example, the processor 1200 may perform post-image processing operations to adjust one or more image parameters for the image data received from the sensing pixels, such as brightness, light and shadow, gamma, luminance, etc. The post-image processing operations may include various operations for improving image quality, such as noise reduction, gamma correction, color filter array interpolation, color matrix, color correction, color enhancement, etc. Next, the processor 1200 may perform image compression operations to generate an image file, and may also restore the image data by using the image file.

[0038] As another example, the processor 1200 may perform phase difference calculations on the image data received from the phase detection pixels. The processor 1200 may obtain the position of focus, the direction of focus, the distance between the object S and the image sensor 100, etc. based on the results of the phase difference calculations. The processor 1200 may output a control signal to the lens driver 1120 based on the results of the phase difference calculations to move the position of the lens 1110.

[0039] According to an embodiment, the image capturing device 1000 may be included in various electronic devices. For example, the image capturing device 1000 may be installed in electronic devices such as cameras, smart phones, wearable devices, Internet of Things (IoT) devices, tablet personal computers (PCs), notebook PCs, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation devices, and display devices. In addition, the image capturing device 1000 may be installed in electronic devices provided as components in vehicles, furniture, manufacturing equipment, doors, various measuring devices, etc.

[0040] Figure 2 An image sensor 100 according to an embodiment is shown. According to Figure 2 , the image sensor 100 may include a pixel array 110, a timing controller 120, an image signal processor 130, a row driver 140, and a read circuit 150.

[0041] The pixel array 110 may include a plurality of sub-pixels arranged in a matrix, and the plurality of sub-pixels may include a plurality of sensing pixels SPX and a plurality of phase detection pixels PPX. For example, the sub-pixel may be a sensing pixel SPX, and as another example, the sub-pixel may be a phase detection pixel PPX. Each of the plurality of sub-pixels may include a light sensing device, such as a photodiode. The light sensing device may generate photo-charge according to light incident from the outside. The plurality of pixels may convert the photo-charge into a voltage or current signal to output the voltage or current signal as a pixel signal SIG_PX through a plurality of column lines CL1 to CLn.

[0042] The pixel signal SIG_PX may include an image signal output from the sensing pixel SPX and a phase signal output from the phase detection pixel PPX. For example, the plurality of sensing pixels SPX may output an image signal corresponding to Figure 1 the object S as the pixel signal SIG_PX, and as another example, the plurality of phase detection pixels PPX may generate a phase signal for calculating a phase difference between images generated by photographing the object S.

[0043] According to an embodiment, the pixel array 110 may include a plurality of sensing pixel groups SPXG. The plurality of sensing pixel groups SPXG may be arranged adjacent to each other in the row direction. The plurality of sensing pixels (e.g., SPX1 to SPX3) included in the sensing pixel group SPXG may share a floating diffusion node (e.g., Figure 6A the floating diffusion node FD shown). The plurality of sensing pixels may output the pixel signal SIG_PX through an extended column line. In this case, the plurality of sensing pixels SPX included in the sensing pixel group SPXG may include color filters of the same color. The sensing pixels SPX included in the same column may output the pixel signal SIG_PX in units of rows. For example, among the plurality of sensing pixels SPX included in the sensing pixel group SPXG, the first sensing pixel SPX1 arranged in the first row, the second sensing pixel SPX2 arranged in the second row, and the third sensing pixel SPX3 arranged in the third row may sequentially output the pixel signal SIG_PX. By using the pixel signal SIG_PX output from the plurality of sensing pixels SPX, a high-quality image may be obtained at a low illumination level.

[0044] According to an embodiment, the plurality of phase detection pixels (e.g., PPX1 and PPX2) included in the phase detection pixel group PPXG may include a same microlens (e.g., Figure 12(micro lens ML). The phase detection pixels PPX can increase the number of pixels per unit area of the pixel array 110 by sharing the micro lens. In this case, the plurality of phase detection pixels PPX included in the phase detection pixel group PPXG may include color filters of the same color, because light in the same wavelength band is used for phase difference calculation.

[0045] The timing controller 120 can control the row driver 140 by providing a timing control signal TC to the row driver 140, so that the pixel array 110 accumulates charges by absorbing light, temporarily stores the accumulated charges, and outputs an electrical signal to the external area of the pixel array 110 according to the stored charges.

[0046] According to an embodiment, the timing controller 120 can control the exposure period of the sensing pixels SPX or the phase detection pixels PPX with reference to the operation mode information INFO_MD. For example, the operation mode information INFO_MD can indicate a general shooting mode or an HDR shooting mode.

[0047] For example, the timing controller 120 can transmit a timing control signal TC to the row driver 140 based on the operation mode information INFO_MD indicating the general shooting mode, so that the first sensing pixel SPX1 in the first row, the second sensing pixel SPX2 in the second row, and the third sensing pixel SPX3 in the third row have the same exposure period. As another example, the timing controller 120 can transmit a timing control signal TC to the row driver 140 based on the operation mode information INFO_MD indicating the HDR shooting mode, so that the sensing pixels SPX1 in the first row, the sensing pixels SPX2 in the second row, and the sensing pixels SPX3 in the third row have different exposure periods.

[0048] According to an embodiment, the timing controller 120 can control at least one of the image signal processor 130 and the read circuit 150 with reference to the operation mode information INFO_MD.

[0049] For example, the timing controller 120 can control the read circuit 150 and the image signal processor 130 to perform analog merging and digital merging based on the operation mode information INFO_MD indicating the general shooting mode. Analog merging may refer to the operation of merging pixel signals SIG_PX output from sensing pixels (e.g., the first sensing pixel SPX1, the second sensing pixel SPX2, and the third sensing pixel SPX3) sharing a floating diffusion node FD. Digital merging may refer to the operation of merging the pixel data PDTA that has been analog merged. The analog merging and digital merging will be described in detail with reference to Figures 7 to 9 Analog merging and digital merging will be described in detail.

[0050] As another example, the timing controller 120 may control the image signal processor 130 to perform a reconstruction operation and a dynamic range compression (DRC) operation based on the operation mode information INFO_MD indicating the HDR shooting mode. The control of the image signal processor 130 will be described in detail with reference to Figure 7 and Figures 10 to 11 The control of the image signal processor 130 will be described in detail.

[0051] The row driver 140 may generate signals (e.g., a reset control signal RS, a transfer control signal TX, a selection signal SEL, etc.) to control the pixel array 110 and provide the signals to the plurality of sub-pixels in the pixel array 110. The row driver 140 may determine the activation timing and deactivation timing of the reset control signal RS, the transfer control signal TX, and the selection signal SELS for the plurality of sensing pixels SPX and the plurality of phase detection pixels PPX.

[0052] The read circuit 150 may perform an analog combining operation and a correlated double sampling operation. The read circuit 150 may output pixel data PDTA as a result of the correlated double sampling operation to the image signal processor 130 or the processor 1200. The output of the read circuit 150 will be described in detail with reference to Figure 8 The output of the read circuit 150 will be described in detail.

[0053] The image signal processor 130 may perform various signal processing operations on the pixel data PDTA. The image signal processor 130 may perform a digital combining operation, noise reduction processing, gain adjustment, waveform normalization processing, interpolation processing, white balance processing, gamma processing, edge enhancement processing, etc. In addition, when performing PDAF, the image signal processor 130 may cause the processor 1200 to perform a phase difference calculation by outputting the phase information of the phase detection pixels to the processor 1200. In an embodiment, the image signal processor 130 may be provided in a general image processor (e.g., the processor 1200 (see Figure 1 )) located outside the image sensor 100.

[0054] Figure 3 is a diagram of the pixel array 110 according to an embodiment. Figure 4 is a diagram of a unit pixel group UPX according to an embodiment. Figure 4 is Figure 3 an enlarged view of the unit pixel group UPXG shown in

[0055] Referring to Figure 3 , the pixel array 110 may include a plurality of unit pixel groups UPXG, and the unit pixel group UPXG may include a plurality of unit pixels UPX. Referring to Figure 4, the unit pixel UPX may include a plurality of sub-pixels, and the plurality of sub-pixels include color filters identical to each other. For example, the sub-pixel may be a sensing pixel SPX or a phase sensing pixel PPX.

[0056] According to an embodiment, the unit pixel group UPXG may include a red unit pixel, a blue unit pixel, and a green unit pixel that together form a Bayer pattern. In other words, the unit pixel group UPXG may be formed into an RGBG Bayer pattern (also referred to as an RGB Bayer pattern). In an implementation, the unit pixel group UPXG may include various patterns, such as a red, green, blue, white (RGBW) pattern, a cyan, yellow, green, magenta (CYGM) pattern, a red, green, blue, emerald (RGBE) pattern, a cyan, magenta, yellow, white (CMYW) pattern, etc.

[0057] Reference Figure 3 and Figure 4 , the sensing pixel group SPXG may include a plurality of sensing pixels SPX arranged in a matrix (e.g., an M*N matrix, where N and M are natural numbers respectively). The plurality of sensing pixels SPX adjacent to each other in the column direction may share a floating diffusion node FD. For example, one unit pixel UPX may include M rows and N columns of sensing pixels SPX that share N floating diffusion nodes FD. For example, the sensing pixels SPX arranged in the same column may share the same floating diffusion node FD. For convenience, in Figure 4 , only the green sensing pixels are shown as sharing the floating diffusion node FD, but the same can be applied to the red sensing pixels and the blue sensing pixels.

[0058] Figures 5A to 5D is a diagram of a unit pixel group according to an embodiment, and the unit pixel group includes a plurality of sensing pixels having various exposure periods in the HDR shooting mode.

[0059] Reference Figures 5A to 5D , the unit pixel UPX may include a plurality of sensing pixels L, M, and S. For example, the unit pixel UPX may include a plurality of sensing pixels SPX arranged in an M*N matrix (e.g., a 3*3 matrix).

[0060] According to an embodiment, in the HDR shooting mode, the light sensing devices included in the plurality of sensing pixels SPX may have different exposure time periods. For example, the first sensing pixel L may include a light sensing device exposed for a first time period, the second sensing pixel M may include a light sensing device exposed for a second time period, and the third sensing pixel S may include a light sensing device exposed for a third time period. Here, the first time period may be longer than the second time period, and the second time period may be longer than the third time period, such as long, medium, and short time periods.

[0061] Reference Figure 5A , the unit pixel group UPXG may include a first unit pixel UPX1, a second unit pixel UPX2, a third unit pixel UPX3, and a fourth unit pixel UPX4 having the same exposure time period. For each column in the first unit pixel UPX1, the first unit pixel UPX1 may include a first sensing pixel group SPXG1, a second sensing pixel group SPXG2, and a third sensing pixel group SPXG3. Each sensing pixel group SPXG may include a plurality of sensing pixels SPX in a column, and adjacent sensing pixels may have different exposure time periods.

[0062] The first sensing pixel group SPXG1 may include sensing pixels L, S, M arranged in sequence in the column direction in the order of the second sensing pixel M, the third sensing pixel S, and the first sensing pixel L. For each column, the sensing pixel group SPXG2 may sequentially include the first sensing pixel L, the second sensing pixel M, and the third sensing pixel S. The third sensing pixel group SPXG3 may sequentially include the third sensing pixel S, the first sensing pixel L, and the second sensing pixel M.

[0063] Reference Figure 5B , some of the first unit pixel UPX1 to the fourth unit pixel UPX4 may have different exposure time period patterns. For example, unit pixels UPX located in the same column may have the same exposure time period pattern, and unit pixels UPX located in the same row may have different exposure time period patterns. For example, the first unit pixel UPX1 and the third unit pixel UPX3 may have the same exposure time period pattern, the first unit pixel UPX1 and the second unit pixel UPX2 may have different exposure time period patterns, and the second unit pixel UPX2 and the fourth unit pixel UPX4 may have the same exposure time period pattern.

[0064] For each column in the fourth unit pixel UPX4, the fourth unit pixel UPX4 may include a fourth sensing pixel group SPXG4, a fifth sensing pixel group SPXG5, and a sixth sensing pixel group SPXG6. The fourth sensing pixel group SPXG4 may include sensing pixels L, S, and M sequentially arranged in the column direction in the order of the third sensing pixel S, the first sensing pixel L, and the second sensing pixel M. For each column, the sensing pixel group SPXG5 may sequentially include the first sensing pixel L, the second sensing pixel M, and the third sensing pixel S. The sixth sensing pixel group SPXG6 may sequentially include the second sensing pixel M, the third sensing pixel S, and the first sensing pixel L.

[0065] Reference Figure 5C , some of the first unit pixel UPX1 to the fourth unit pixel UPX4 may have different exposure period patterns. For example, unit pixels adjacent to each other in the diagonal direction may have the same exposure period pattern. The first unit pixel UPX1 and the fourth unit pixel UPX4 may have the same exposure period pattern, and the second unit pixel UPX2 and the third unit pixel UPX3 may have the same exposure period pattern.

[0066] Reference Figures 5A to 5C , each unit pixel UPX may include a plurality of sensing pixels SPX, and each sensing pixel included in one unit pixel UPX may include an exposure period different from that of adjacent sensing pixels. For example, for the first unit pixel UPX1, the pixels adjacent to the second sensing pixel M located at the center are the first sensing pixel L or the third sensing pixel S.

[0067] Reference Figure 5D , the unit pixel group UPXG may include the first unit pixel UPX1 to the fourth unit pixel UPX4 having different exposure period patterns. Each of the first unit pixel UPX1 to the fourth unit pixel UPX4 may include: a first sensing pixel group SPXG1 including the third sensing pixel S, a second sensing pixel group SPXG2 including the second sensing pixel M, and a third sensing pixel group SPXG3 including the first sensing pixel L. In addition, the first unit pixel UPX1 to the fourth unit pixel UPX4 may include a plurality of sensing pixels SPX in each column, and the sensing pixels SPX may have the same exposure period.

[0068] Figure 6A is a circuit diagram of a sensing pixel group including a plurality of sensing pixels according to an embodiment. Figure 6B is applied to Figure 6A the waveform diagram form of the signals of the sensing pixel group shown.

[0069] Reference Figure 6A, the sensing pixel group SPXG may include a plurality of sensing pixels SPX1 to SPX3 adjacent to each other in the column direction. The sensing pixel SPX may include a photosensing device PD, and the row driver 140 may control the operation of the transfer transistor TX under the control of the timing controller 120. The transfer transistor TX may be turned on to output the photo charge accumulated by the photosensing device PD.

[0070] For example, the first sensing pixel SPX1 may include a first photosensing device PD11. The first sensing pixel SPX1 may further include a first transfer transistor TX1 that controls the output of the photo charge accumulated by the first photosensing device PD11. The row driver 140 may apply a first transfer signal TG1 to the first transfer transistor TX1 based on a timing control signal TC transmitted from the timing controller 120. For example, the timing controller 120 may apply a first transfer signal TG1 indicating that the transfer transistor TX1 is turned on. Thus, the first photosensing device PD11 may output photo charge to the floating diffusion node FD. Similarly, the timing controller 120 may control the row driver 140 to control the second transfer transistor TX2 and the third transfer transistor TX3 to output the photo charge charged by the second photosensing device PD12 and the third photosensing device PD13 to the same floating diffusion node FD, respectively.

[0071] The timing controller 120 may turn on the selection transistor SX to output the photo charge charged in the floating diffusion node FD as a pixel signal SIG_PX to the reading circuit 150. For example, the timing controller 120 may transmit a timing control signal TC to the row driver 140 to transmit a selection signal SEL indicating turn-on. Thus, the selection transistor SX connected to the column line COL may be turned on. The photo charge accumulated in the floating diffusion node FD may be amplified by the driving voltage VDD applied to the driving transistor DX and may be converted into a pixel signal SIG_PX. That is, the photo charge accumulated in the floating diffusion node FD may be converted into a pixel signal SIG_PX and may be output to the reading circuit 150 via the selection transistor SX.

[0072] Reference Figure 6B , based on the photo charge obtained during each of the first exposure period T1, the second exposure period T2, and the third exposure period T3, the first sensing pixel SPX1 to the third sensing pixel SPX3 may output pixel signals SIG_PX at different time points T4 to T6.

[0073] At the time point Ta, the timing controller 120 may transmit a logic high reset signal RS to the reset transistor RX to reset the floating diffusion node FD. In this case, the reset transistor RX is turned on, and a voltage having the same level as the level of the driving voltage VDD may be applied to the floating diffusion node FD.

[0074] At time point Tb, the timing controller 120 may reset the logic high first transmission signal TG1 to the gate electrode of the first transmission transistor TX1. Accordingly, the first photosensing device PD11 may completely discharge the optical charge charged by the first photosensing device PD11 to the floating diffusion node FD, and the first photosensing device PD11 may be in a reset state.

[0075] During time period T1, the first photosensing device PD11 may acquire optical charge. That is, the first sensing pixel SPX1 may have an exposure time period as long as time period T1. Similarly, the second sensing pixel SPX2 may have an exposure time period as long as time period T2, and the third sensing pixel SPX3 may have an exposure time period as long as time period T3.

[0076] According to an embodiment, the optical charges output from the first photosensing device PD11, the second photosensing device PD12, and the third photosensing device PD13 may be respectively transferred to the floating diffusion node FD at different time points (e.g., time point T4, time point T5, and time point T6). Next, the first sensing pixel SPX1 to the third sensing pixel SPX3 may sequentially output pixel signals SIG_PX according to the order in which the floating diffusion node FD receives the optical charges. The sequentially output pixel signals SIG_PX may be used for an analog merging operation described below.

[0077] During time period T4, the timing controller 120 may output the first transmission signal TG1 and the selection signal SEL as logic high signals, respectively, and may output the reset signal as a logic low signal. In response thereto, the optical charge charged by the first photosensing device PD11 included in the first sensing pixel SPX1 during time period T1 may be transferred to the floating diffusion node FD, converted into a pixel signal SIG_PX, and output. Similarly, the second sensing pixel SPX2 may charge optical charge during time period T2, and during time period T5, the second sensing pixel SPX2 may transfer the optical charge to the floating diffusion node FD, convert the optical charge into a pixel signal SIG_PX, and output the pixel signal SIG_PX. The third sensing pixel SPX3 may charge optical charge during time period T3. During time period T6, the third sensing pixel SPX3 may transfer the optical charge to the floating diffusion node FD, convert the optical charge into a pixel signal SIG_PX, and output the pixel signal SIG_PX.

[0078] Reference Figure 6B, the timing controller 120 may receive operation mode information INFO_MD indicating a general shooting mode and may control the first sensing pixel SPX1, the second sensing pixel SPX2, and the third sensing pixel SPX3 to have the same exposure time period. In other words, the timing controller 120 may control the row driver such that the transfer signals TG output in time period T1, time period T2, and time period T3 are substantially the same as each other.

[0079] Reference Figure 6B , the timing controller 120 may receive operation mode information INFO_MD indicating an HDR shooting mode and may control the first sensing pixel SPX1, the second sensing pixel SPX2, and the third sensing pixel SPX3 to have different exposure time periods. In other words, the timing controller 120 may control the row driver such that the transfer signals TG output in time period T1, time period T2, and time period T3 are different from each other.

[0080] Will refer to Figure 5A , Figure 6A And Figure 6B Describe the operation of the sensing pixels in the HDR shooting mode. The second sensing pixel group SPXG2 may include a first sensing pixel L having an exposure time period as long as the first time period, a second sensing pixel M having an exposure time period as long as the second time period, and a third sensing pixel S having an exposure time period as long as the third time period. The first time period may be longer than the second time period, and the second time period may be longer than the third time period. In this case, Figure 5A The first sensing pixel L, the second sensing pixel M, and the third sensing pixel S shown may respectively correspond to Figure 6A The first sensing pixel SPX1, the second sensing pixel SPX2, and the third sensing pixel SPX3 shown. That is, the first sensing pixel L having the longest exposure time period may obtain photo charges for time period T1, and the third sensing pixel S having the shortest exposure time period may obtain photo charges for time period T3.

[0081] Reference Figure 6B , the first sensing pixel SPX1, the second sensing pixel SPX2, and the third sensing pixel SPX3 may output the photo charges obtained in the photosensing device PD at different time points. For example, in time period T4, the first sensing pixel SPX1 may transfer the photo charges from the first photosensing device PD11 to the floating diffusion node FD, convert the photo charges into pixel signals SIG_PX, and output the pixel signals SIG_PX through the column line COL. Similarly, the second sensing pixel SPX2 may output the pixel signals SIG_PX in time period T5, and the third sensing pixel SPX3 may output the pixel signals SIG_PX in time period T6.

[0082] Figure 7 It is a flowchart of an operation method of the image sensor 100 according to an embodiment.

[0083] In step S310, a pixel signal SIG_PX (S310) can be received from the pixel array 110. For example, the pixel array 110 may include a plurality of sensing pixels SPX, and at least some of the sensing pixels SPX may share a floating diffusion node FD.

[0084] In step S320, various image processes can be performed according to the shooting mode of the pixel signal SIG_PX. The timing controller 120 can control the image sensor 100 based on operation mode information INFO_MD indicating a normal shooting mode or an HDR shooting mode. For example, in the normal shooting mode, the image sensor 100 can perform a merging operation including at least one of an analog merging operation and a digital merging operation based on the pixel signal SIG_PX. As another example, in the HDR shooting mode, the image sensor 100 can perform at least one of a reconstruction operation and a DRC operation based on the pixel signal SIG_PX. In other words, the pixel signals sequentially output from the shared floating diffusion node can be used individually (normal shooting mode) or synthesized (HDR shooting mode).

[0085] In step S330, when the image sensor 100 is in the normal shooting mode, the image sensor 100 can determine whether to perform a merging operation. For example, the timing controller 120 can transmit a control signal RC including information on whether to perform a merging operation to the read circuit 150.

[0086] In step S340, the image sensor 100 can perform a merging operation. For example, the image sensor 100 can perform an analog merging operation. The image sensor 100 can merge the pixel signals SIG_PX sequentially output from the sensing pixels SPX sharing the same floating diffusion node FD. In this case, since the electrical signals output from the sensing pixels SPX can be added together, a bright image can be obtained under low light levels. As another example, the image sensor 100 can perform a digital merging operation. In this case, the image sensor 100 can perform a digital merging operation based on the data that has been analog merged.

[0087] In step S350, the image sensor 100 can perform a remosaic operation. For example, the remosaic operation can be an operation of rearranging the order of data obtained from each sensing pixel SPX with respect to the pixel data PDTA quantized by the read circuit 150. By doing so, an image with a resolution corresponding to the number of sensing pixels SPX can be obtained.

[0088] In steps S360 and S370, in the HDR shooting mode, the image sensor 100 may perform a reconstruction operation and perform a DRC operation on the data on which the reconstruction operation has been performed.

[0089] Figure 8 An image processing operation in a general shooting mode according to an embodiment is shown. The read circuit 150 may include a merging determiner 151, a correlated double sampler (CDS) 152, an analog-digital converter (ADC) 153, and a buffer 154.

[0090] The merging determiner 151 may receive the pixel signal SIG_PX output from the pixel array 110 and may receive, for example, the pixel signal SIG_PX output from the plurality of sensing pixels SPX. According to an embodiment, in the general shooting mode, the timing controller 120 may control the merging determiner 151 to perform an analog merging operation.

[0091] Figure 9 An image processing operation in a general shooting mode according to an embodiment is shown. Refer to Figure 9 , the merging determiner 151 may perform an analog merging operation 21 on the pixel signal to output the analog-merged data 22. The merging determiner 151 may merge the pixel signals SIG_PX obtained from the plurality of sensing pixels SPX included in the unit pixel UPX. For example, the merging determiner 151 may perform an analog merging operation on the pixel signals SIG_PX obtained from the plurality of sensing pixels SPX sharing the floating diffusion node FD. In other words, the merging may be performed on the pixel signals SIG_PX obtained from the sensing pixels SPX arranged in the same column included in the unit pixel UPX. As another example, the merging determiner 151 may perform a merge on the pixel signals SIG_PX sequentially output from the first sensing pixel SPX1 (see Figure 6A ), the second sensing pixel SPX2 (see Figure 6A ), and the third sensing pixel SPX3 (see Figure 6A ) that share the floating diffusion node FD and are arranged in the same column of the pixel array 110.

[0092] Refer back to Figure 8, the related dual sampler 152 may sample and save the combined data. The related dual sampler 152 may perform dual sampling on a certain noise level and the level of the generated output voltage, and may output a level corresponding to the gap therebetween. In addition, the related dual sampler 152 may receive the lamp signal generated by the lamp signal generator, compare the lamp signal, and output the result of the comparison. The analog-to-digital converter 153 may convert the analog signal corresponding to the level of the output received from the related dual sampler 152 into a digital signal. The buffer 154 may latch the digital signal, and the latched signal may be sequentially output to the image signal processor 130 or to the outside of the image sensor 100 (e.g., the processor 1200).

[0093] The image signal processor 130 may receive the pixel data PDTA and perform a digital combining operation. Refer to Figure 8 and Figure 9 , the image signal processor 130 may receive the pixel data PDTA 22 on which analog combining has been performed and output the digitally combined data 23. For example, the image signal processor 130 may combine multiple pieces of data included in each of the unit pixels UPX into one piece of data. As another example, the image signal processor 130 may receive the data that has been analog combined in the row direction and may perform digital combining in the column direction. In this case, the image signal processor 130 may output the data 23 having a resolution divided from the resolution according to the number of pixels arranged in the pixel array 110 to match the resolution of the sensing pixels included in the unit pixel UPX.

[0094] Refer to Figure 8 and Figure 9 , the image signal processor 130 may perform a pixel rearrangement operation. The image signal processor 130 may rearrange multiple pieces of pixel data PDTA obtained from the sensing pixels SPX to match the Bayer pattern. In this case, the timing controller 120 may control the combining determiner 151 not to perform an analog combining operation. The image signal processor 130 may perform a pixel rearrangement operation on the pixel data PDTA from the reading circuit 150 to output the data 24 having the same resolution as the resolution according to the number of pixels arranged in the pixel array 110. That is, when the pixel rearrangement operation is performed, the image sensor 100 may output a high-resolution image.

[0095] Figure 10 is a flowchart of an image processing operation in the HDR shooting mode according to an embodiment. Refer to Figure 10, the timing controller 120 can control the read circuit 150 to output pixel data PDTA based on the pixel signal SIG_PX. For example, in the HDR shooting mode, the timing controller 120 can control the merge determiner 151 not to perform an analog merge operation. That is, the merge determiner 151 can output the pixel signal SIG_PX received from the pixel array 110 to the correlated double sampler 152. The subsequent operations of the read circuit 150 are described above with reference to Figure 8 and Figure 9 and will not be described again.

[0096] The timing controller 120 can control the image signal processor 130 to perform a reconstruction operation and a dynamic range compression (DRC) operation. The reconstructor 131 can receive the pixel data PDTA, reconstruct multiple pieces of data obtained from the sensing pixels SPX, and synthesize the multiple pieces of data. In other words, the reconstructor 131 can receive multiple pieces of data with different exposure time periods and output image data with an increased dynamic range. The DRC unit 132 can perform a compression operation on the image data received from the reconstructor 131 without losing the dynamic range. By using the compression function performed by the DRC unit 132, a general-purpose processor (e.g., the processor 1200) can be used for image post-processing operations.

[0097] Figure 11 shows the image processing operations in the HDR shooting mode according to an embodiment. Referring to Figure 11 , the image signal processor 130 can obtain the image data 26 by performing a reconstruction operation and a DRC operation on the pixel data 25 output from the read circuit 150 without losing the resolution and the dynamic range. The image signal processor 130 can obtain the image data 26 with an improved dynamic range by reconstructing the pixel data 25 with various exposure time periods. In addition, by performing the DRC operation, the dynamic range loss of the image data 26 and the image data 26 can be output to the external area of the image sensor (e.g., the processor 1200).

[0098] According to an embodiment, the image data 26 can be obtained based on multiple pieces of pixel data 25 collected on the basis of different exposure time periods. For example, referring to the multiple pieces of pixel data 25, the multiple pieces of pixel data 25 can include multiple pieces of pixel data set to have a long exposure time period L, a medium exposure time period M, and a short exposure time period S.

[0099] According to an embodiment, the resolution of the image data 26 can be lower than the resolution of the pixel data 25. For example, the image signal processor 130 can perform a reconstruction operation to reconstruct nine identically colored pixels among the multiple pieces of pixel data 25 into a single image pixel.

[0100] Meanwhile, performed by the image signal processor 130 and referring toFigures 7 to 10 The described operations may also be performed by the processor 1200. For example, the digital merging operation, the pixel rearrangement operation, the reconstruction operation, and the DRC operation may alternatively be performed in a general image processor (e.g., the processor 1200), or may be performed together by the general image processor.

[0101] Figure 12 is a cross-sectional view of the structure of a phase detection pixel group PPXG according to an embodiment. Refer to Figure 12 , the phase detection pixel group PPXG may include a plurality of phase detection pixels PPX. In Figure 12 , for ease of explanation, the phase detection pixel group PPXG includes two phase detection pixels PPX1 and PPX2. As will be referred to later in Figures 13A to 13D , the phase detection pixel group PPXG may include various numbers of phase detection pixels PPX.

[0102] Refer to Figure 12 , each of the phase detection pixels PPX may include a photosensing device PD. In addition, when light is incident on the phase detection pixel PPX from the microlens ML, light in a certain wavelength band may be incident on the photosensing device PD through the color filter CF. The photosensing device PD may output an electrical signal according to the incident light. For example, the photosensing device PD may output an electrical signal to a transfer transistor (e.g., Figure 6A the transfer transistor TX1 shown).

[0103] According to an example embodiment, the plurality of phase detection pixels PPX may share one microlens ML. For example, a first photosensing device PD1 included in a first phase detection pixel PPX1 and a second photosensing device PD2 included in a second phase detection pixel PPX2 may receive light from the microlens ML. In other words, the first phase detection pixel PPX1 and the second phase detection pixel PPX2 may be adjacent to each other, and the microlens ML may cover the first phase detection pixel PPX1 and the second phase detection pixel PPX2.

[0104] According to an example embodiment, the phase detection pixels PPX sharing the microlens ML may respectively include color filters CF having the same color. For example, the color filter CF may have red, blue, green, or any suitable wavelength. The substrate SB may be included in the peripheral region of the photosensing device PD.

[0105] According to an example embodiment, the phase detection pixels PPX sharing the microlens ML may have the same exposure period. When performing the PDAF operation, other parameters except the phase difference are similar or substantially the same to each other.

[0106] Figures 13A to 13DA view of a phase detection pixel group and a microlens according to an embodiment, where the phase detection pixel group includes a plurality of phase detection pixels. Refer to Figures 13A to 13D , the pixel array 110 may include a plurality of unit pixel groups UPXG, and the unit pixel group UPXG may include a plurality of unit pixels UPX. For example, the unit pixel UPX may include at least one of a sensing pixel SPX and a phase detection pixel PPX. As another example, the unit pixel group UPXG may be formed such that the plurality of unit pixels UPX form a Bayer pattern.

[0107] In addition, the microlens ML covers at least a part of the unit pixel group UPXG, and a plurality of unit pixels UPX including the microlens ML may be adjacent to each other. For example, a first unit pixel UPXa and a second unit pixel UPXb including the microlens ML may be arranged adjacent to each other. Since the first unit pixel UPXa and the second unit pixel UPXb having different color filters respectively include the phase detection pixel PPX, the loss of the pixel signal SIG_PX of a certain color can be reduced.

[0108] The sensing pixel SPX included in the unit pixel group UPXG may have various exposure periods as described above with reference to Figures 5A to 5D etc. The plurality of phase detection pixels PPX included in the phase detection pixel group PPXG may have the same exposure period.

[0109] Refer to Figure 13A , the microlens ML covers the phase detection pixel group PPXG including the first phase detection pixel PPX1 and the second phase detection pixel PPX2. The first phase detection pixel PPX1 and the second phase detection pixel PPX2 may be respectively included in the first unit pixel UPXa and the second unit pixel UPXb.

[0110] In other words, the first unit pixel UPXa and the second unit pixel UPXb may respectively include the first phase detection pixel PPX1 and the second phase detection pixel PPX2 included in the phase detection pixel group PPXG, and the microlens ML may cover the first phase detection pixel PPX1 and the second phase detection pixel PPX2.

[0111] According to an example embodiment, the phase detection pixels PPX included in the phase detection pixel group PPXG may include color filters having the same color. Although Figure 13A the color filter used for the phase detection pixel PPX is shown as green, any other suitable color filter may be used.

[0112] According to an example embodiment, the phase detection pixels PPX included in the phase detection pixel group PPXG may have the same exposure period. For example, the exposure period may include those referred to aboveFigure 5A a described first time period, and accurate phase data can be obtained by exposure over a long time period. In an embodiment, the phase detection pixels can have various exposure time periods (e.g., the second time period or the third time period described above with reference to Figure 5A .

[0113] According to an exemplary embodiment, at least a part of one unit pixel (e.g., UPXa) and at least a part of another unit pixel (e.g., UPXb) can include a single microlens ML.

[0114] Referring to Figure 13B , the microlens ML covers a phase detection pixel group PPXG including four phase detection pixels PPX1, PPX2, PPX3, and PPX4. In other words, the microlens ML can cover the first phase detection pixel PPX1 to the fourth phase detection pixel PPX4. The phase detection pixels PPX can be respectively included in the first unit pixel UPXa and the second unit pixel UPXb. In this case, the phase detection pixels PPX included in the pixel detection pixel group PPXG can have the same color filter and the same exposure time period.

[0115] Referring to Figure 13C , the microlens ML can be formed to cover a phase detection pixel group PPXG including six phase detection pixels PPX1, PPX2, PPX3, PPX4, PPX5, and PPX6. That is, the microlens ML can cover the first phase detection pixel PPX1 to the sixth phase detection pixel PPX6. The phase detection pixels PPX can be respectively included in the first unit pixel UPXa and the second unit pixel UPXb. The description of the color filter and the exposure time period is the same as above.

[0116] Referring to Figures 13A to 13C , the phase detection pixel group PPXG can be included in some unit pixels (e.g., the first unit pixel UPXa and the second unit pixel UPXb), but referring to Figure 13D , the phase detection pixel group PPXG can be included in all unit pixels (e.g., UPXa to UPXd).

[0117] Referring to Figure 13D , the microlens ML covers a phase detection pixel group PPXG including four phase detection pixels PPX5, PPX6, PPX7, and PPX8. That is, the microlens ML can cover the fifth phase detection pixel PPX5 to the eighth phase detection pixel PPX8. In this case, the phase detection pixel group PPXG can occupy a part of each of the unit pixels UPXa to UPXd.

[0118] Figure 14FIG. 2000 shows an image processing system according to an embodiment. Figure 14 The illustrated image processing system 2000 may include a computer system, a camera system, a scanner, a vehicle navigation system, a video phone, a security system, and a motion detection system that require image data. Referring Figure 14 to FIG. 2000, the image processing system 2000 may include a central processing unit (CPU) or a processor 2010, a non-volatile memory 2020, an imaging device 2030 including an image sensor, an input / output (I / O) device 2040, and a random access memory (RAM) 2050. The CPU 2010 may communicate with the non-volatile memory 2020, the imaging device 2030, the input / output (I / O) device 2040, and the RAM 2050 via a bus 2060.

[0119] Included in Figure 14 the image processing system 2000, the imaging device 2030 may include the above-described image sensor according to an embodiment. The image data output from the imaging device 2030 may be transmitted to the CPU 2010, the non-volatile memory 2020, the input / output (I / O) device 2040, and the RAM 2050 via the bus 2060. For example, the image sensor included in the imaging device 2030 may include sensing pixels sharing a floating diffusion node, and may also include phase detection pixels sharing a microlens. An image may be acquired by using the sensing pixels, or an autofocus function may be performed by using the phase detection pixels.

[0120] Embodiments provide a lightweight image sensor that improves low-light characteristics by summing multiple pixel data, obtains a high-resolution image by using information on light received in each pixel, and performs a high dynamic range (HDR) operation and a phase detection autofocus (PDAF) operation.

[0121] In an image sensor according to an exemplary embodiment, low-brightness characteristics may be improved by summing information of multiple sensing pixels. In addition, a high-resolution image may be obtained through a pixel rearrangement operation. In addition, in a unit pixel having multiple sensing pixels, an HDR operation may be performed by changing exposure time periods of the multiple sensing pixels. In addition, by appropriately adopting the shape of a microlens, phase detection pixels may be included in the unit pixel, and a PDAF operation may be performed.

[0122] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and interpreted in a general and descriptive sense only and not for purposes of limitation. In some instances, for those of ordinary skill in the art at the time of the filing of this application, it will be apparent that, unless otherwise expressly indicated, features, characteristics, and / or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Accordingly, those skilled in the art will appreciate that various changes may be made in form and detail without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. An image sensor, comprising: A first pixel sensing group, including a first green sensing pixel, a second green sensing pixel, and a third green sensing pixel; A second pixel sensing group, including a fourth green sensing pixel, a fifth green sensing pixel, and a sixth green sensing pixel; A first floating diffusion node FD, shared by the first green sensing pixel and the second green sensing pixel; And A second FD, shared by the fourth green sensing pixel and the fifth green sensing pixel, Wherein, the first green sensing pixel to the third green sensing pixel are sequentially arranged in a first direction, Wherein, the fourth green sensing pixel to the sixth green sensing pixel are sequentially arranged in the first direction, and Wherein, the second pixel sensing group is placed directly adjacent to the first pixel sensing group in a second direction perpendicular to the first direction.

2. The image sensor according to claim 1, further comprising: A third pixel sensing group, including a first red sensing pixel, a second red sensing pixel, and a third red sensing pixel; A fourth pixel sensing group, including a fourth red sensing pixel, a fifth red sensing pixel, and a sixth red sensing pixel; A third FD, shared by the first red sensing pixel and the second red sensing pixel; And A fourth FD, shared by the fourth red sensing pixel and the fifth red sensing pixel, Wherein, the first red sensing pixel to the third red sensing pixel are sequentially arranged in the first direction, Wherein, the fourth red sensing pixel to the sixth red sensing pixel are sequentially arranged in the first direction, Wherein, the third pixel sensing group is placed directly adjacent to the second pixel sensing group in the second direction, and Wherein, the fourth pixel sensing group is placed directly adjacent to the third pixel sensing group in the second direction.

3. The image sensor according to claim 2, wherein, The first pixel sensing group further includes a seventh green sensing pixel placed directly adjacent to the third green sensing pixel in the first direction, and Wherein, the second pixel sensing group further includes an eighth green sensing pixel placed directly adjacent to the sixth green sensing pixel in the first direction.

4. The image sensor according to claim 3, wherein, The third pixel sensing group further includes a seventh red sensing pixel placed directly adjacent to the third red sensing pixel in the first direction, and Wherein, the fourth pixel sensing group further includes an eighth red sensing pixel placed directly adjacent to the sixth red sensing pixel in the first direction.

5. The image sensor according to claim 4, wherein, The first green sensing pixel is configured to have a first exposure period, Wherein, the fourth green sensing pixel is configured to have a second exposure period different from the first exposure period.

6. The image sensor according to claim 4, further comprising a phase detection pixel, the phase detection pixel including a first photosensing device, a second photosensing device, and a single microlens, and Among them, The single microlens is placed on the first photosensing device and the second photosensing device.

7. The image sensor according to claim 6, wherein, The phase detection pixel further includes the same color filter placed on the first photosensing device and the second photosensing device.

8. The image sensor according to claim 4, wherein, The first FD is shared by the first green sensing pixel to the third green sensing pixel, and The second FD is shared by the fourth green sensing pixel and the sixth green sensing pixel.

9. The image sensor according to claim 4, further comprising a fifth pixel sensing group, the fifth pixel sensing group including a ninth green sensing pixel, a tenth green sensing pixel, and an eleventh green sensing pixel, Among them, The fifth pixel sensing group is placed directly adjacent to the first pixel sensing group in the second direction.

10. The image sensor according to claim 9, further comprising a sixth pixel sensing group, the sixth pixel sensing group including a twelfth green sensing pixel, a thirteenth green sensing pixel, and a fourteenth green sensing pixel, Among them, The sixth pixel sensing group is placed directly adjacent to the fifth pixel sensing group in the second direction.

11. An image sensor, comprising: A first pixel sensing group, including a first sensing pixel to a fourth sensing pixel; A second pixel sensing group, including a fifth sensing pixel to an eighth sensing pixel; A first floating diffusion node FD, shared by the first sensing pixel to the fourth sensing pixel; And A second FD, shared by the fifth sensing pixel and the eighth sensing pixel, wherein, the first sensing pixel to the eighth sensing pixel are configured to sense light corresponding to the green wavelength band, and wherein, the second pixel sensing group is placed directly adjacent to the first pixel sensing group in the first direction.

12. The image sensor according to claim 11, further comprising: A third pixel sensing group, including a ninth sensing pixel to a twelfth sensing pixel; A fourth pixel sensing group, including a thirteenth sensing pixel to a sixteenth sensing pixel; A third FD, shared by the ninth sensing pixel to the twelfth sensing pixel; And A fourth FD, shared by the thirteenth sensing pixel to the sixteenth sensing pixel, wherein, the ninth sensing pixel to the sixteenth sensing pixel are configured to sense light corresponding to the red wavelength band, wherein, the third pixel sensing group is placed directly adjacent to the second pixel sensing group in the first direction, and wherein, the fourth pixel sensing group is placed directly adjacent to the third pixel sensing group in the first direction.

13. The image sensor according to claim 12, wherein, The first sensing pixel to the fourth sensing pixel are arranged in sequence in the second direction.

14. The image sensor according to claim 12, further comprising phase detection pixels, the phase detection pixels including a first photosensing device, a second photosensing device, and a single microlens, and Among them, The single microlens is placed on the first photosensing device and the second photosensing device.

15. The image sensor according to claim 12, wherein, The fifth sensing pixel is configured to have a first exposure period, wherein, the sixth sensing pixel is configured to have a second exposure period different from the first exposure period.

16. The image sensor according to claim 15, wherein, The thirteenth sensing pixel is configured to have a first exposure period, wherein, the fourteenth sensing pixel is configured to have a second exposure period.

17. The image sensor according to claim 15, wherein, The thirteenth sensing pixel is configured to have a third exposure period different from the first exposure period and the second exposure period.

18. The image sensor according to claim 13, wherein, The first direction is the row direction.

19. An image sensor, comprising: A first pixel sensing group, including a first sensing pixel to a fourth sensing pixel; A second pixel sensing group, including a fifth sensing pixel to an eighth sensing pixel; A first floating diffusion node FD, shared by the first sensing pixel to the fourth sensing pixel; And A second FD, shared by the fourth sensing pixel and the eighth sensing pixel, wherein, the first sensing pixel to the eighth sensing pixel are configured to sense light corresponding to the blue wavelength band, and wherein, the second pixel sensing group is placed directly adjacent to the first pixel sensing group in the first direction.

20. The image sensor according to claim 19, further comprising: The third pixel sensing group, including the ninth to twelfth sensing pixels; The fourth pixel sensing group, including the thirteenth to sixteenth sensing pixels; The third FD, shared by the ninth to twelfth sensing pixels; And The fourth FD, shared by the thirteenth to sixteenth sensing pixels, wherein, the ninth to sixteenth sensing pixels are configured to sense light corresponding to the green wavelength band, wherein, the third pixel sensing group is placed directly adjacent to the second pixel sensing group in the first direction, and wherein, the fourth pixel sensing group is placed directly adjacent to the third pixel sensing group in the first direction.

Images