Sounding device, preparation method thereof and display device

Abstract

The invention provides a sound production device, a preparation method thereof and a display device, and relates to the technical field of acoustics. The plurality of supporting part groups are arranged on the first substrate in an array manner; and a first conductive layer, a first protective layer and a sounding vibration layer. Wherein each supporting part group comprises at least one supporting part, the supporting parts are in direct contact with the first substrate, the first conductive layer is located on the side, where the supporting part groups are arranged, of the first substrate, and the orthographic projection of the first conductive layer on the first substrate and the orthographic projection of the supporting part groups on the first substrate are not overlapped. The first protection layer covers at least partial area of the supporting part and the first conductive layer; the sounding vibration layer is positioned on one side, far away from the first substrate, of the supporting part group; the supporting part group is located in a cavity structure formed by the first substrate and the sound production vibration layer. The sound production device is high in quality and good in directional sound production effect.

Description

Technical Field

[0001] This application relates to the field of acoustic technologies, and in particular, to a sound generating device, a method for manufacturing the same, and a display device. Background Art

[0002] With the increase in audio-visual scenarios, the directional sound technology has emerged. Through the modulation of an audio signal and an ultrasonic carrier signal, the directional sound technology emits sound wave energy in a concentrated manner, forming an audible sound wave with strong directivity, breaking the law that sound propagates in all directions, and creating an independent audio space that does not interfere with the surrounding environment. Summary of the Invention

[0003] Embodiments of this application provide a sound generating device, a method for manufacturing the same, and a display device. No other film layer is provided between the support portion of the sound generating device and the first substrate, such that the support portion is in direct contact with the first substrate. During the vibration of the sound generating device, the risk of the support portion falling off is greatly reduced, thereby improving the quality of the sound generating device and ensuring the directional sound emission effect of the sound generating device.

[0004] Embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a sound generating device, which includes:

[0006] A first substrate;

[0007] A plurality of support portion groups arranged in an array on the first substrate, each support portion group including at least one support portion, and the support portion being in direct contact with the first substrate;

[0008] A first conductive layer, located on a side of the first substrate where the support portion group is provided, and a positive projection of the first conductive layer on the first substrate does not overlap with a positive projection of the support portion group on the first substrate;

[0009] A first protective layer, covering at least a partial region of the support portion and the first conductive layer;

[0010] A sound generating vibration layer, located on a side of the support portion group away from the first substrate; the support portion group is located in a cavity structure formed by the first substrate and the sound generating vibration layer.

[0011] In at least one embodiment of this application, the sound generating device further includes a plurality of organic portions arranged in an array, and the organic portions are located on a side of the first protective layer away from the first substrate; wherein, the organic portions cover the support portion group.

[0012] In at least one embodiment of this application, the sound generating device includes a light-transmitting region and a non-light-transmitting region surrounding the light-transmitting region;

[0013] The sound - generating device further includes an organic part, the organic part is located on a side of the first protective layer away from the first substrate, and a positive projection of the organic part on the first substrate at least covers a part of the first substrate located in the light - transmissive area.

[0014] In at least one embodiment of the present application, each of the support parts includes a first sub - layer and a second sub - layer, the second sub - layer is located on a side of the first sub - layer away from the first substrate, and an outer contour of a positive projection of the second sub - layer on the first substrate is located inside an outer contour of a positive projection of the first sub - layer on the first substrate.

[0015] In at least one embodiment of the present application, an area of a positive projection of the second sub - layer on the first substrate is greater than or equal to 50% of an area of a positive projection of the first sub - layer on the first substrate.

[0016] In at least one embodiment of the present application, the second sub - layer includes at least one elevation part, and a height of the organic part in a direction perpendicular to a plane where the first substrate is located is greater than or equal to a height of the elevation part in a direction perpendicular to the plane where the first substrate is located.

[0017] In at least one embodiment of the present application, a thickness of the organic part in a direction perpendicular to a plane where the first substrate is located at a middle area of a planar figure of the organic part is greater than or equal to a thickness of the organic part in a direction perpendicular to the plane where the first substrate is located at an edge position of the planar figure of the organic part.

[0018] In at least one embodiment of the present application, the second sub - layer includes at least two of the elevation parts, adjacent two of the elevation parts are connected to each other, and the organic part covers surfaces of the elevation parts on a side away from the first substrate.

[0019] In at least one embodiment of the present application, the second sub - layer includes at least two of the elevation parts, there is a first gap between adjacent two of the elevation parts, and the organic part extends into the first gap.

[0020] In at least one embodiment of the present application, the first protective layer is discontinuously provided at a position of the first gap, a partial area of the first sub - layer is exposed at the first gap, and the organic part is in direct contact with the first sub - layer at the position of the first gap.

[0021] In at least one embodiment of the present application, each of the support part groups includes at least two of the support parts, there is a second gap between adjacent two of the support parts in the same support part group, and the organic part extends into the second gap.

[0022] In at least one embodiment of the present application, the first protective layer and the first conductive layer are discontinuously arranged at the position of the second gap, the second gap exposes a partial area of the first substrate, and the organic part is in direct contact with the first substrate at the position of the second gap.

[0023] In at least one embodiment of the present application, the height of the first sub-layer in the direction perpendicular to the plane where the first substrate is located and the height of the second sub-layer in the direction perpendicular to the plane where the first substrate is located are both less than or equal to the height of the organic part in the direction perpendicular to the plane where the first substrate is located.

[0024] In at least one embodiment of the present application, the height of the organic part in the direction perpendicular to the plane where the first substrate is located is less than the sum of the height of the first sub-layer in the direction perpendicular to the plane where the first substrate is located and the height of the second sub-layer in the direction perpendicular to the plane where the first substrate is located, and the height of the organic part in the direction perpendicular to the plane where the first substrate is located is greater than half of the sum of the height of the first sub-layer in the direction perpendicular to the plane where the first substrate is located and the height of the second sub-layer in the direction perpendicular to the plane where the first substrate is located.

[0025] In at least one embodiment of the present application, the material of the support part is the same as the material type of the first substrate.

[0026] In at least one embodiment of the present application, the support part and the first substrate are made of the same material, and the support part and the first substrate are of an integral structure.

[0027] In at least one embodiment of the present application, the sound-generating vibration layer includes a second substrate and a second conductive layer located between the second substrate and the organic part, and the cavity structure is formed between the first protective layer and the second conductive layer;

[0028] In the direction perpendicular to the first substrate, the distance between the surface of each organic part away from the first substrate and the first substrate is less than the distance between the second conductive layer and the first substrate.

[0029] In at least one embodiment of the present application, the sound-generating device includes a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area, and the support part group and the organic part are both arranged in the light-transmitting area;

[0030] The non-transmissive region includes a first peripheral trace, a second peripheral trace, a second protective layer, and a bonding portion. The first peripheral trace is located between the first conductive layer and the first protective layer, and the first peripheral trace is electrically connected to the first conductive layer. The second peripheral trace is disposed on a side of the second conductive layer close to the first substrate. The second protective layer covers a side of the second peripheral trace away from the second conductive layer, and the second peripheral trace is electrically connected to the second conductive layer. At least a partial region of the bonding portion is disposed between the first protective layer and the second protective layer.

[0031] In a direction perpendicular to a plane where the first substrate is located, a height of the bonding portion is greater than a distance between a surface of the organic portion away from the first substrate and the first substrate.

[0032] In at least one embodiment of the present application, in a first direction or a second direction, a distance between any two adjacent organic portions is substantially equal.

[0033] In the first direction or the second direction, for an organic portion having a minimum distance to a junction position between the non-transmissive region and the transmissive region, a distance between the organic portion and the junction position is substantially equal to a distance between any other two adjacent organic portions. The first direction and the second direction are perpendicular.

[0034] In a second aspect, an embodiment of the present application provides a display device, including a sound generating device as described in any one of the first aspects, and further including a display panel. The sound generating device is disposed on a light-emitting side of the display panel or inside the display panel. A positive projection of a transmissive region of the sound generating device on the display panel overlaps with a display region of the display panel.

[0035] In at least one embodiment of the present application, the display panel includes a liquid crystal display panel. The sound generating device is disposed on the light-emitting side of the display panel.

[0036] A positive projection of at least a partial support portion on the liquid crystal display panel overlaps with spacers in the liquid crystal display panel.

[0037] In at least one embodiment of the present application, the display panel includes an organic light-emitting diode display panel. The sound generating device is disposed on the light-emitting side of the display panel or inside the display panel.

[0038] In a third aspect, an embodiment of the present application provides a method for manufacturing a sound generating device, which is applied to manufacture a sound generating device as described in any one of the first aspects. The method includes:

[0039] Providing a first substrate film material.

[0040] A halftone mask is used to simultaneously form a first substrate and a plurality of support portion groups arranged in an array on the first substrate; each support portion group includes at least one support portion, the support portion is in direct contact with the first substrate, each support portion includes a first sub-layer and a second sub-layer, the second sub-layer is located on a side of the first sub-layer away from the first substrate, and an outer contour of a positive projection of the second sub-layer on the first substrate is located inside an outer contour of a positive projection of the first sub-layer on the first substrate;

[0041] A first conductive layer is formed, and a positive projection of the first conductive layer on the first substrate does not overlap with a positive projection of the support portion group on the first substrate;

[0042] A first protective layer is formed, and the first protective layer covers at least a partial area of the support portion and the first conductive layer.

[0043] An embodiment of the present application provides a sounding device, a preparation method thereof, and a display device. The sounding device includes: a first substrate; a plurality of support portion groups arranged in an array on the first substrate; and a first conductive layer, a first protective layer, and a sounding vibration layer; wherein, each support portion group includes at least one support portion, the support portion is in direct contact with the first substrate, the first conductive layer is located on a side of the first substrate where the support portion group is provided, a positive projection of the first conductive layer on the first substrate does not overlap with a positive projection of the support portion group on the first substrate, the first protective layer covers at least a partial area of the support portion and the first conductive layer, and the sounding vibration layer is located on a side of the support portion group away from the first substrate; the support portion group is located in a cavity structure formed by the first substrate and the sounding vibration layer. Since no other film layer is provided between the support portion of the sounding device and the first substrate, the support portion is in direct contact with the first substrate; in addition, the first protective layer covers at least a partial area of the support portion, and the first protective layer can also protect the support portion. During the vibration of the sounding device, the risk of the support portion falling off is greatly reduced, thereby improving the quality of the sounding device and ensuring the directional sounding effect of the sounding device.

[0044] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other objects, features, and advantages of the present application more obvious and understandable, the following specifically gives the specific implementation manners of the present application. Description of the Drawings

[0045] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0046] Figure 1 FIG. 4 is a schematic partial structure diagram of a sound generating device in a related art provided by an embodiment of the present application;

[0047] Figure 2 For Figure 1 FIG. 10 is a scanning electron microscope image of the sound generating device shown before the support pillar falls off;

[0048] Figure 3 For Figure 1 FIG. 16 is a scanning electron microscope image of the sound generating device shown after the support pillar falls off;

[0049] Figures 4 to 15 FIG. 20 is a schematic cross-sectional structure diagram of twelve sound generating devices provided by an embodiment of the present application;

[0050] Figure 16 And Figure 17 FIG. 26 is a schematic top view structure diagram of two sound generating devices provided by an embodiment of the present application;

[0051] Figure 18 And Figure 19 FIG. 32 is a schematic cross-sectional structure diagram of two display devices provided by an embodiment of the present application;

[0052] Figures 20 to 28 FIG. 36 is a schematic diagram of nine intermediate structures of a sound generating device during the manufacturing process provided by an embodiment of the present application. Detailed implementation manners

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the present application.

[0054] In the embodiments of the present application, terms such as "first", "second", "third", "fourth", etc. are used to distinguish the same items or similar items with basically the same functions and effects, only for clearly describing the technical solutions in the embodiments of the present application, and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features.

[0055] In the embodiments of the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0056] In the description of the specification, terms such as "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples", etc. are intended to indicate that specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present application. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics described above may be included in any one or more embodiments or examples in any appropriate manner.

[0057] In the embodiments of the present application, the meaning of "a plurality" is two or more, and the meaning of "at least one" is one or more, unless otherwise clearly and specifically defined.

[0058] Features such as "parallel", "perpendicular", and "identical" used in the embodiments of the present application include the strict sense of "parallel", "perpendicular", "identical", etc., as well as cases such as "substantially parallel", "substantially perpendicular", "substantially identical", etc. that include a certain tolerance. Considering measurement and tolerances related to the measurement of a specific quantity (for example, limitations of the measurement system), it means within the acceptable deviation range for a specific value determined by those of ordinary skill in the art. For example, "substantially" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0059] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted in an open, inclusive sense, that is, "including, but not limited to".

[0060] The polygons in this specification are not in the strict sense and can be approximate triangles, parallelograms, trapezoids, pentagons, hexagons, etc. There may be some small deformations caused by tolerances.

[0061] With the increase of audio-visual scenarios, the directional sound emission technology has emerged. The directional sound emission technology modulates an audio signal with an ultrasonic carrier signal and utilizes the directivity characteristics of ultrasonic waves to make the emitted sound wave energy concentrated, forming an audible sound wave with strong directivity, breaking the law that sound spreads in all directions, and creating an independent audio space that does not interfere with the surrounding environment.

[0062] In the related art, a directional sound emitting device generally includes a first electrode, a second electrode, and a support pillar 3-4 located between the first electrode and the second electrode. A cavity is formed between the first electrode and the second electrode. The support pillar is disposed on the first electrode, and the second electrode can vibrate. The support pillar is used to control the sound wave direction of the sound emitting device. However, as Figure 1 shown, the sound emitting device includes a first electrode 3-2 and an electrode protection layer 3-3 sequentially disposed on a substrate 3-1, and the support pillar 3-4 is disposed on the electrode protection layer 3-3; Combining Figure 2 and Figure 3 shown SEM (Scanning Electron Microscope) images, during the vibration of the directional sound emitting device, the support pillar 4 is extremely likely to fall off. Among them, Figure 2 is the SEM image before the support pillar 3-4 falls off, Figure 3 is the SEM image after the support pillar 3-4 falls off; In this way, on the one hand, after the support pillar 3-4 falls off, it falls into other areas of the sound emitting device, causing the light transmittance of the sound emitting device to be non-uniform, which may reduce the aesthetic appearance. On the other hand, the falling off of the support pillar 3-4 changes the direction of directional sound emission, and it is extremely likely to cause sound leakage, reducing the effect of directional sound emission. When the sound emitting device is applied to a display device, the falling off of the support pillar 3-4 is very likely to cause the problem of uneven brightness in the display area of the display device, reducing the display effect.

[0063] Based on this, embodiments of the present application provide a sound emitting device, a preparation method thereof, and a display device. As Figures 4 to 15 shown, the sound emitting device includes:

[0064] A first substrate 1;

[0065] A plurality of support portion groups 2G arranged in an array on the first substrate 1. Each support portion group 2G includes at least one support portion 2, and the support portion 2 is in direct contact with the first substrate 1;

[0066] A first conductive layer 3, located on one side of the first substrate 1 where the support portion group 2G is provided. The orthographic projection of the first conductive layer 3 on the first substrate 1 does not overlap with the orthographic projection of the support portion group 2G on the first substrate 1;

[0067] A first protection layer 4, covering at least a part of the area of the support portion 2 and the first conductive layer 3;

[0068] A sound emitting vibration layer 6, located on the side of the support portion group 2G away from the first substrate 1; The support portion group 2G is located in a cavity structure Q formed by the first substrate 1 and the sound emitting vibration layer 6.

[0069] Here, the material of the first substrate 1 is not limited.

[0070] In some examples, the material of the first substrate 1 can be made of one or more materials such as glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone. This embodiment includes but is not limited to this.

[0071] In some examples, the first substrate 1 can be a rigid substrate or a flexible substrate;

[0072] When the first substrate 1 is a flexible substrate, the first substrate 1 can include a single-layer flexible material layer; or, the first substrate 1 can include a first flexible material layer, a first inorganic non-metallic material layer, a second flexible material layer, and a second inorganic non-metallic material layer that are sequentially stacked. Among them, the materials of the first flexible material layer and the second flexible material layer are made of materials such as polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The materials of the first inorganic non-metallic material layer and the second inorganic non-metallic material layer are made of silicon nitride (SiNx) or silicon oxide (SiOx), etc., which are used to improve the water and oxygen resistance of the first substrate 1. The first inorganic non-metallic material layer and the second inorganic non-metallic material layer are also called barrier layers; in this way, the reliability of the sound-emitting device can be improved and its service life can be extended.

[0073] When the first substrate 1 is a rigid substrate, the first substrate 1 can include a glass substrate.

[0074] It should be noted that when the sound-emitting device is applied in a display device, the first substrate can be set as a flexible substrate to reduce the thickness of the sound-emitting device, thereby reducing the volume of the display device, making the display device thinner and lighter, and expanding its application scenarios.

[0075] In some examples, the materials of the first substrate 1 and the support group 2G are of the same type. The adhesion force between the support group 2G and the first substrate 1 is greater during the vibration of the sound-emitting device, and the risk of the support 2 in the support group 2G falling off is smaller.

[0076] In an exemplary embodiment, the materials of the first substrate 1 and the support group 2G are both light-transmitting materials.

[0077] Exemplarily, the materials of the first substrate 1 and the support group 2G are both organic materials.

[0078] Exemplarily, the materials of the first substrate 1 and the support group 2G are both inorganic materials.

[0079] For example, the materials of the first substrate 1 and the support group 2G are both glass.

[0080] For example, the first substrate 1 and the support group 2G are an integrated structure.

[0081] Among them, the "integrated structure" means that it is prepared from the same raw materials in the same preparation step and has the same final material composition.

[0082] Each support part group 2G includes at least one support part 2, and each support part 2 is in direct contact with the first substrate 1; at least one includes one or more; a plurality means two or more.

[0083] Among them, as Figures 4 to 9 shown, each support part group 2G includes one support part 2; as Figures 10 to 15 shown, each support part group 2G includes two support parts 2.

[0084] Among the multiple support part groups 2G arranged in the above array, the number of support parts 2 included in each support part group 2G is the same, the structure of each support part group 2G is the same, and the size of each support part group 2G is the same; to ensure the uniform arrangement of each support part group 2G in the sound generating device, thereby improving the effect of directional sound generation of the sound generating device and the uniformity of sound wave propagation.

[0085] Here, the number of support parts 2 included in each support part group 2G is not limited.

[0086] Exemplarily, for simplicity of design, it can be set that each support part group 2G only includes one support part 2, so that the structures and sizes of all support parts 2 in the sound generating device are the same.

[0087] Among them, the structure of the above support part 2 includes the planar graph of the support part 2 and the shape of the cross-sectional graph of the support part 2, and the size of the above support part 2 includes height, planar size and cross-sectional size. The planar size is the size of the planar graph of the orthographic projection of the support part 2 on the first substrate 1, and the cross-sectional size is the size of the cross-sectional graph of the support part 2 along the direction perpendicular to the first substrate 1.

[0088] Exemplarily, in some embodiments, in order to improve the product reliability of the sound generating device and reduce the risk of the support part 2 falling off during the sound generating vibration, as Figures 10 to 15 shown, it can be set that each support part group 2G includes two or more support parts 2. In this way, the more the number of support parts 2, the smaller the vibration energy received by each support part 2 under the same vibration energy, thereby greatly reducing the risk of the support part 2 falling off.

[0089] When each support part group 2G includes two or more support parts 2, here, the structures and sizes of the multiple (two or more) support parts 2 in the same support part group 2G are not limited; taking the example that each support part group 2G includes two support parts 2 (the first support part and the second support part), it can include but is not limited to the following situations:

[0090] First, the structures and dimensions of the first support portion and the second support portion are the same.

[0091] Second, the structures of the first support portion and the second support portion are the same, but the dimensions are not completely the same, that is, one or two of the height, planar dimension, and cross-sectional dimension are different.

[0092] For example, the heights of the first support portion and the second support portion are different;

[0093] For example, the planar dimensions of the first support portion and the second support portion are different;

[0094] For example, the cross-sectional dimensions of the first support portion and the second support portion are different.

[0095] Third, the structures of the first support portion and the second support portion are different.

[0096] For example, the shapes of the planar figures of the first support portion and the second support portion are different. Specifically, the shape of the planar figure of the first support portion can be arc-shaped, and the shape of the planar figure of the first support portion can be a combination of arc-shaped and polygonal.

[0097] Among them, the arc can include a circle, an ellipse, a semi-circle, a semi-ellipse, a sector, etc., and the polygon can include a triangle, a quadrilateral, a pentagon, a hexagon, etc.

[0098] In the drawings provided in the embodiments of the present application, the structures and dimensions of two or more support portions 2 included in each support portion group 2G are the same as an example for drawing.

[0099] Here, the material of the first conductive layer 3 is not limited.

[0100] In some examples, the material of the first conductive layer 3 is a light-transmissive conductive material;

[0101] Exemplarily, the material of the first conductive layer 3 is a metal. At this time, in order to achieve light transmittance, the metal film layer has a small thickness. For example, the thickness of the metal film layer is nanoscale.

[0102] Exemplarily, the material of the first conductive layer 3 is a metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0103] It should be noted that the sound-emitting device can be a directional sound-emitting device and is applied to form a display device with a directional sound-emitting function on a display panel. Among them, the sound-emitting device is usually arranged on the light-emitting side of the display panel. Therefore, it is required that most regions of the sound-emitting device have good light-transmitting performance.

[0104] In some embodiments, the first conductive layer 3 can be referred to as an ultrasonic electrode, which is configured to generate ultrasonic signals under the control of an electrical signal. Each support portion 2 can play a role in adjusting the directional transmission of ultrasonic waves, and the sound - generating vibration layer 6 vibrates after receiving the ultrasonic signals.

[0105] In an exemplary embodiment, as Figure 4 shown, the support portion group 2G is located in the cavity structure Q formed by the first substrate 1 and the sound - generating vibration layer 6, and there are gaps between the support portions 2 in the support portion group 2G and the sound - generating vibration layer 6, that is, the support portions 2 do not contact the sound - generating vibration layer 6; and there are gaps between the first protective layer 4 and the sound - generating vibration layer 6, that is, the first protective layer 4 does not contact the sound - generating vibration layer 6.

[0106] Among them, the situation where the first protective layer 4 covers at least part of the support portion 2 includes but is not limited to the following:

[0107] First, the first protective layer 4 covers a partial area of the support portion 2;

[0108] For example, the first protective layer 4 covers the edge area of the support portion group 2G and does not cover the middle area of the support portion group 2G;

[0109] Specifically, when the support portion group 2G includes one support portion 2, the first protective layer 4 covers the side surface of the support portion 2 and does not cover the surface of the support portion 2 away from the first substrate 1; or, the first protective layer 4 covers the side surface of the support portion 2 and the peripheral area of the surface of the support portion 2 away from the first substrate 1, and does not cover the middle area of the surface of the support portion 2 away from the first substrate 1.

[0110] Second, the first protective layer 4 covers the entire area of the support portion 2.

[0111] In an exemplary embodiment, the material of the first protective layer 4 is an insulating material, which is used to isolate the first conductive layer 3 from other conductive materials to avoid short - circuits in the circuit.

[0112] Exemplarily, the material of the first protective layer 4 can be an inorganic insulating material;

[0113] For example, the inorganic insulating material can be one or a combination of silicon nitride, silicon oxide, or silicon oxynitride.

[0114] In addition, the first protective layer 4 can also protect the first conductive layer 3, avoiding corrosion or damage to the first conductive layer 3 due to factors such as water vapor in the external environment during use.

[0115] In an embodiment of the present application, since no other film layer is provided between the support portion 2 of the sound generating device and the first substrate 1, the support portion 2 is in direct contact with the first substrate 1; in addition, the first protective layer 4 covers at least a part of the support portion 2, and the first protective layer 4 can also protect the support portion 2. During the vibration of the sound generating device, the risk of the support portion 2 falling off is greatly reduced, thereby improving the quality of the sound generating device and ensuring the directional sound effect of the sound generating device.

[0116] In at least one embodiment of the present application, as Figure 5 shown, the sound generating device includes a light-transmitting region T and a non-light-transmitting region FT surrounding the light-transmitting region T;

[0117] The sound generating device further includes an organic portion 5, the organic portion 5 is located on the side of the first protective layer 4 away from the first substrate 1, and the orthographic projection of the organic portion 5 on the first substrate 1 at least covers the part of the first substrate 1 located in the light-transmitting region T.

[0118] In an exemplary embodiment, as Figure 5 shown, the organic portion 5 is a continuous structure covering the entire surface, and the organic portion 5 covers most of the region of the first protective layer 3.

[0119] Among them, the orthographic projection of the organic portion 5 on the first substrate 1 at least covering the part of the first substrate 1 located in the light-transmitting region T includes, but is not limited to, the following situations:

[0120] First, the orthographic projection of the organic portion 5 on the first substrate 1 covers the part of the first substrate 1 located in the light-transmitting region T;

[0121] Second, the orthographic projection of the organic portion 5 on the first substrate 1 covers the part of the first substrate 1 located in the light-transmitting region T and the part of the first substrate 1 located in the non-light-transmitting region FT.

[0122] In at least one embodiment of the present application, as Figures 6 to 9 、 Figures 13 to 15 shown, the sound generating device further includes a plurality of organic portions 5 arranged in an array, the organic portions 5 are located on the side of the first protective layer 4 away from the first substrate 1; among them, the organic portions 5 cover the support portion group 2G.

[0123] In an exemplary embodiment, as Figures 6 to 9 、 Figures 13 to 15 shown, the number of the organic portions 5 is the same as the number of the support portion groups 2G, one organic portion 5 covers one support portion group 2G, and the orthographic projection of the organic portion 5 on the first substrate 1 and the orthographic projection of the region between two adjacent support portion groups 2G on the first substrate 1 do not overlap each other.

[0124] The material of the above-mentioned organic part 5 is an organic material. Additionally, the specific material of the above-mentioned organic part 5 is not limited herein. For example, the organic material can be a composite material of synthetic resin, rubber, resin and fiber, a composite material of rubber and fiber, etc.

[0125] Exemplarily, the material of the above-mentioned organic part 5 can be a synthetic resin. For example, the material of the above-mentioned organic part 5 can be one of polymethyl methacrylate (PMMA), polystyrene (PS), polycarbonate (PC), allyl diglycol carbonate (CR-39), polyimide (PI), polyethylene terephthalate (PET), or epoxy optical plastic.

[0126] Exemplarily, the material of the above-mentioned organic part 5 can be an elastic organic material.

[0127] In the embodiments of the present application, by providing the organic part 5 in the sound generating device, as Figure 5 、 Figures 6 to 9 、 Figures 13 to 15 shown, the organic part 5 is provided on the support part 2. The organic part 5 (being an organic material) can buffer the vibration energy. During the vibration of the sound generating device, the risk of the support part 5 falling off is greatly reduced, thereby improving the quality of the sound generating device and ensuring the directional sound emission effect of the sound generating device. Additionally, when the sound vibrating layer 6 vibrates, even if the amplitude of the sound vibrating layer 6 is relatively large and it comes into contact with the organic part 5, since the hardness of the organic material is smaller than that of the inorganic material and it has a certain elasticity, the probability of the sound vibrating layer 6 being damaged is greatly reduced, improving the service life of the sound generating device.

[0128] In at least one embodiment of the present application, as Figures 4 to 15 shown, each support part 2 includes a first sub-layer 21 and a second sub-layer 22. The second sub-layer 22 is located on the side of the first sub-layer 21 away from the first substrate 1, and the outer contour of the orthographic projection of the second sub-layer 22 on the first substrate 1 is located within the outer contour of the orthographic projection of the first sub-layer 21 on the first substrate 1.

[0129] The materials of the above-mentioned first sub-layer 21 and second sub-layer 22 are not limited herein. Exemplarily, the material types of the above-mentioned first sub-layer 21 and second sub-layer 22 are the same as the material type of the first substrate 1.

[0130] Exemplarily, the materials of the first sub-layer 21, the second sub-layer 22, and the first substrate 1 are all inorganic materials.

[0131] Exemplarily, the above-mentioned first sub-layer 21 and second sub-layer 22 are of an integrated structure.

[0132] Among them, that the outer contour of the positive projection of the second sub-layer 22 on the first substrate 1 is located within the outer contour of the positive projection of the first sub-layer 21 on the first substrate 1 means that the area of the positive projection of the second sub-layer 22 on the first substrate 1 is smaller than the area of the positive projection of the first sub-layer 21 on the first substrate 1.

[0133] Exemplarily, the geometric center of the positive projection of the second sub-layer 22 on the first substrate 1 substantially overlaps with the geometric center of the positive projection of the first sub-layer 21 on the first substrate 1.

[0134] In the embodiments of the present application, by setting each support portion 2 to include a first sub-layer 21 and a second sub-layer 22, and the outer contour of the positive projection of the second sub-layer 22 on the first substrate 1 is located within the outer contour of the positive projection of the first sub-layer 21 on the first substrate 1; in this way, each support portion 2 has a larger surface area on the side away from the first substrate 1. When the first protective layer 4 covers the support portion 2, there is a larger contact area between the first protective layer 4 and the support portion 2, so that the first protective layer 4 can play a better protective role for the support portion 2, largely avoiding the problem of the support portion 2 falling off during the vibration of the sound-emitting device. In addition, when the support portion 2 is arranged in the above manner and an organic portion 5 is arranged on the side of the first protective layer 4 away from the first substrate 1, the organic portion 5 can have a larger contact area with the first protective layer 4, thereby increasing the adhesion between the organic portion 5 and the first protective layer 4, further reducing the risk of the organic portion 5 falling off during the vibration of the sound-emitting device, and improving the directional sound generation effect and reliability of the sound-emitting device.

[0135] In at least one embodiment of the present application, as Figures 4 to 15 shown, the area of the positive projection of the second sub-layer 22 on the first substrate 1 is greater than or equal to 50% of the area of the positive projection of the first sub-layer 21 on the first substrate 1.

[0136] Exemplarily, the area of the positive projection of the second sub-layer 22 on the first substrate 1 is greater than 50% of the area of the positive projection of the first sub-layer 21 on the first substrate 1;

[0137] Exemplarily, the area of the positive projection of the second sub-layer 22 on the first substrate 1 is equal to 50% of the area of the positive projection of the first sub-layer 21 on the first substrate 1.

[0138] For example, the area of the positive projection of the second sub-layer 22 on the first substrate 1 is equal to 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 98% of the area of the positive projection of the first sub-layer 21 on the first substrate 1.

[0139] In an embodiment of the present application, by setting the area of the orthographic projection of the second sub-layer 22 on the first substrate 1 to be smaller than the area of the orthographic projection of the first sub-layer 21 on the first substrate 1, and the area of the orthographic projection of the second sub-layer 22 on the first substrate 1 to be greater than or equal to 50% of the area of the orthographic projection of the first sub-layer 21 on the first substrate 1, while having a larger contact area between the first protective layer 4 and the support portion 2, it is possible to avoid the support portion 2 having a relatively sharp top (the second sub-layer 22). When the sound-generating vibration layer 6 contacts the film layer on the support portion 2 during the vibration of the sound-generating device, the relatively sharp top (the second sub-layer 22) of the support portion 2 can be prevented from damaging the sound-generating vibration layer 6, thereby improving the product quality and service life of the sound-generating device.

[0140] In at least one embodiment of the present application, as Figures 4 to 9 shown, the second sub-layer 22 includes at least one heightening portion 22A. Taking the Figure 6 markings in the figure as an example, the height H2 of the organic portion 5 in the direction perpendicular to the plane of the first substrate 1 is greater than or equal to the height H1 of the heightening portion 22A in the direction perpendicular to the plane of the first substrate 1.

[0141] In an embodiment of the present application, since the organic portion 5 is made of an organic material and has certain elasticity and buffering effects, by setting the height H2 of the organic portion 5 in the direction perpendicular to the plane of the first substrate 1 to be greater than or equal to the height H1 of the heightening portion 22A in the direction perpendicular to the plane of the first substrate 1, it is possible to avoid the organic portion 5 damaging the sound-generating vibration layer 6 when the sound-generating vibration layer 6 contacts the organic portion 5 during the vibration of the sound-generating device, thereby improving the product quality and service life of the sound-generating device.

[0142] In at least one embodiment of the present application, as Figures 6 to 9 、 Figures 13 to 15 shown, (taking the Figures 6 to 9 and Figure 13 markings as an example) at the middle region of the planar pattern of the organic portion 5, the thickness H3 of the organic portion 5 in the direction perpendicular to the plane of the first substrate 1 is greater than or equal to the thickness H4 of the organic portion 5 at the edge position of the planar pattern of the organic portion 5 in the direction perpendicular to the plane of the first substrate 1.

[0143] Here, no specific limitation is imposed on the boundary position between the middle region and the edge position of the planar pattern of the organic portion 5. Among them, the edge position is arranged around the middle region, and the specific sizes of the edge position and the middle region can be determined according to the size of the organic portion 5.

[0144] Among them, in the middle region of the planar pattern of the organic part 5, the thickness H3 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 is greater than or equal to the thickness H4 of the organic part 5 at the edge position of the planar pattern of the organic part 5 in the direction perpendicular to the plane of the first substrate 1, including but not limited to the following situations:

[0145] First, in a local area of the sound - producing device, the thickness H3 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 in the middle region of the planar pattern of the organic part 5 is greater than the thickness H4 of the organic part 5 at the edge position of the planar pattern of the organic part 5 in the direction perpendicular to the plane of the first substrate 1; in a local area of the sound - producing device, the thickness H3 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 in the middle region of the planar pattern of the organic part 5 is equal to the thickness H4 of the organic part 5 at the edge position of the planar pattern of the organic part 5 in the direction perpendicular to the plane of the first substrate 1;

[0146] Second, in some sound - producing devices, the thickness H3 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 in the middle region of the planar pattern of the organic part 5 is greater than the thickness H4 of the organic part 5 at the edge position of the planar pattern of the organic part 5 in the direction perpendicular to the plane of the first substrate 1;

[0147] Third, in some sound - producing devices, the thickness H3 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 in the middle region of the planar pattern of the organic part 5 is equal to the thickness H4 of the organic part 5 at the edge position of the planar pattern of the organic part 5 in the direction perpendicular to the plane of the first substrate 1;

[0148] Among them, both the thickness H3 and the thickness H4 refer to the average thickness.

[0149] In the embodiments of the present application, during the vibration of the sound - producing device, since the probability of contact between the middle region of the planar pattern of the organic part 5 and the sound - producing vibration layer 6 is relatively large, by setting the thickness H3 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 in the middle region of the planar pattern of the organic part 5 to be greater than or equal to the thickness H4 of the organic part 5 at the edge position of the planar pattern of the organic part 5 in the direction perpendicular to the plane of the first substrate 1; in this way, the middle region of the planar pattern of the organic part 5 has greater elasticity and buffering effect, while avoiding damage to the sound - producing vibration layer 6, and enabling the middle region of the planar pattern of the organic part 5 to have better resilience after being compressed, thereby improving the service performance of the organic part 5 and enhancing the use effect and service life of the sound - producing device.

[0150] In at least one embodiment of the present application, as Figure 7As shown, the second sub-layer 22 includes at least two raised portions 22A, which are connected between adjacent two raised portions 22A, and the organic portion 5 covers the surfaces of the raised portions 22A on the side away from the first substrate 1.

[0151] Exemplarily, as Figure 7 shown, the first protective layer 4 covers the surfaces of the raised portions 22A on the side away from the first substrate 1 and is in direct contact with the surfaces of the raised portions 22A on the side away from the first substrate 1, and the organic portion 5 covers the overlapping portions of the first protective layer 4 and the surfaces of the raised portions 22A on the side away from the first substrate 1.

[0152] In at least one embodiment of the present application, as Figure 8 and Figure 9 shown, the second sub-layer 22 includes at least two raised portions 22A, and there is a first gap X1 between adjacent two raised portions 22A, and the organic portion 5 extends into the first gap X1.

[0153] In an exemplary embodiment, as Figure 8 shown, in the first gap X1, the first protective layer 4 covers the side surfaces of the raised portions 22A located in the first gap X1 and also covers the area between adjacent two raised portions 22A; that is to say, the part of the first protective layer 4 covering the side surfaces of the raised portions 22A close to the first gap X1 serves as the side walls of the first gap X1, and the part of the first protective layer 4 located between adjacent two raised portions 22A serves as the bottom of the first gap X1. At this time, the organic portion 5 extends into the first gap X1 and is in direct contact with the first protective layer 4 in the first gap X1.

[0154] In an exemplary embodiment, as Figure 9 shown, in the first gap X1, the first protective layer 4 covers the side surfaces of the raised portions 22A located in the first gap X1 and does not cover the area between adjacent two raised portions 22A, that is to say, the part of the first protective layer 4 covering the side surfaces of the raised portions 22A close to the first gap X1 serves as the side walls of the first gap X1; a part of the first sub-layer 21 serves as the bottom of the first gap X1.

[0155] In at least one embodiment of the present application, as Figure 9 shown, the first protective layer 4 is discontinuously provided at the position of the first gap X1, the first gap X1 exposes a part of the area of the first sub-layer 21, and the organic portion 5 is in direct contact with the first sub-layer 21 at the position of the first gap X1.

[0156] In an embodiment of the present application, by providing that the first protective layer 4 is discontinuously provided at the position of the first gap X1, the first gap X1 exposes a partial area of the first sub-layer 21, and the organic part 5 is in direct contact with the first sub-layer 21 at the position of the first gap X1, the number of film layers in the local area between the organic part 5 and the support part 2 can be reduced, and the adhesion between the part of the organic part 5 near the middle area and the support part 2 can be further improved, thereby reducing the risk of the organic part 5 falling off the support part 2 during the vibration of the sound generating device, and improving the quality and reliability of the sound generating device.

[0157] In at least one embodiment of the present application, as Figure 12 and Figure 15 shown, each support part group 2G includes at least two support parts 2, and two adjacent support parts 2 in the same support part group 2G are connected to each other.

[0158] In at least one embodiment of the present application, as Figure 13 、 Figure 14 shown, each support part group 2G includes at least two support parts 2, and there is a second gap X2 between two adjacent support parts 2 in the same support part group 2G, and the organic part 5 extends into the second gap X2.

[0159] In an exemplary embodiment, as Figure 13 shown, a first conductive layer 3 and a first protective layer 4 are provided at the bottom of the second gap X2, and a first protective layer 4 is provided on the side wall of the second gap X2.

[0160] In at least one embodiment of the present application, as Figure 14 shown, the first protective layer 4 and the first conductive layer 3 are discontinuously provided at the position of the second gap X2, the second gap X2 exposes a partial area of the first substrate 1, and the organic part 5 is in direct contact with the first substrate 1 at the position of the second gap X2.

[0161] In an embodiment of the present application, by providing that the first protective layer 4 and the first conductive layer 3 are discontinuously provided at the position of the second gap X2, the second gap X2 exposes a partial area of the first substrate 1, and the organic part 5 is in direct contact with the first substrate 1 at the position of the second gap X2, the number of film layers in the local area between the organic part 5 and the first substrate 1 can be reduced, and the adhesion between the part of the organic part 5 near the middle area and the first substrate 1 can be further improved, thereby reducing the risk of the organic part 5 falling off the support part 2 during the vibration of the sound generating device, and improving the quality and reliability of the sound generating device.

[0162] In at least one embodiment of the present application, as Figure 6 and Figure 14As shown, the height H5 of the first sub-layer 21 in the direction perpendicular to the plane of the first substrate 1 and the height H1 of the second sub-layer 22 in the direction perpendicular to the plane of the first substrate 1 are both less than or equal to the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1.

[0163] In an exemplary embodiment, the height H5 of the first sub-layer 21 in the direction perpendicular to the plane of the first substrate 1 and the height H1 of the second sub-layer 22 in the direction perpendicular to the plane of the first substrate 1 are both less than the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1.

[0164] In an exemplary embodiment, the height H5 of the first sub-layer 21 in the direction perpendicular to the plane of the first substrate 1 and the height H1 of the second sub-layer 22 in the direction perpendicular to the plane of the first substrate 1 are both equal to the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1.

[0165] In an exemplary embodiment, the height H5 of the first sub-layer 21 in the direction perpendicular to the plane of the first substrate 1 is less than the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1, and the height H1 of the second sub-layer 22 in the direction perpendicular to the plane of the first substrate 1 is equal to the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1.

[0166] In an exemplary embodiment, the height H5 of the first sub-layer 21 in the direction perpendicular to the plane of the first substrate 1 is equal to the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1, and the height H1 of the second sub-layer 22 in the direction perpendicular to the plane of the first substrate 1 is less than the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1.

[0167] Wherein, the above-mentioned height H5, height H2 and height H1 all refer to the average height.

[0168] In at least one embodiment of the present application, the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 is less than the sum of the height H5 of the first sub-layer 21 in the direction perpendicular to the plane of the first substrate 1 and the height H1 of the second sub-layer 22 in the direction perpendicular to the plane of the first substrate 1, that is, H2 < (H1 + H5), and the height H2 of the organic part 5 in the direction perpendicular to the plane of the first substrate 1 is greater than half of the sum of the height H5 of the first sub-layer 21 in the direction perpendicular to the plane of the first substrate 1 and the height H1 of the second sub-layer 22 in the direction perpendicular to the plane of the first substrate 1, that is, H2 > (H1 + H5) / 2.

[0169] In at least one embodiment of the present application, the material of the support part 2 is the same as the material type of the first substrate 1.

[0170] Exemplarily, the materials of the support part 2 and the first substrate 1 are both inorganic materials;

[0171] For example, the materials of the support part 2 and the first substrate 1 can both be at least one of silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiOxNy).

[0172] In at least one embodiment of the present application, the materials of the support part 2 and the first substrate 1 are the same, and the support part 2 and the first substrate 1 are an integrated structure.

[0173] In the embodiments of the present application, by setting the materials of the support part 2 and the first substrate 1 to be the same, and the support part 2 and the first substrate 1 to be an integrated structure, the best adhesion force can be achieved between the support part 2 and the first substrate 1. During the vibration of the sound-emitting device, even if the support part 2 receives strong vibration energy, the support part 2 can transfer the vibration it receives to the first substrate 1, thereby playing a self-protection role and avoiding the detachment of the support part 2 during vibration, maximizing the reliability of the support part 2; at this time, even if the organic part 5 on the upper side of the support part 2 detaches, due to the existence of the support part 2, the support part 2 can still achieve the effect of directional sound transmission, greatly improving the yield and service life of the sound-emitting device.

[0174] In at least one embodiment of the present application, as Figures 4 to 15 shown, the sound-emitting vibration layer 6 includes a second substrate 62 and a second conductive layer 61 located between the second substrate 62 and the organic part 5, and a cavity structure Q is formed between the first protective layer 4 and the second conductive 61 layer; along the direction perpendicular to the first substrate 1, the distance between the surface of each organic part 5 away from the first substrate 1 and the first substrate 1 is less than the distance between the second conductive layer 61 and the first substrate 1.

[0175] In an exemplary embodiment, the material of the second substrate 62 is a flexible material to vibrate during the sound emission of the sound-emitting device.

[0176] In some examples, the material of the second substrate 62 can be made of one or more materials such as polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone. This embodiment includes but is not limited to this.

[0177] In some examples, the second substrate 62 can include a single-layer flexible material layer to avoid reducing its vibration efficiency due to a large number of film layers or a large thickness.

[0178] Here, the material of the second conductive layer 61 is not limited.

[0179] In some examples, the material of the second conductive layer 61 is a light-transmitting conductive material;

[0180] Exemplarily, the material of the second conductive layer 61 is metal. At this time, in order to achieve light transmittance, the metal film layer has a small thickness. For example, the thickness of the metal film layer is at the nanometer level.

[0181] Exemplarily, the material of the second conductive layer 61 is metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0182] Here, the absolute value of the difference between the distance from the surface of each organic part 5 away from the first substrate 1 to the first substrate 1 and the distance from the second conductive layer 61 to the first substrate 1 in the direction perpendicular to the first substrate 1 is not limited. Specifically, it can be designed according to the size of the sound-emitting device, the material of the sound-emitting vibration layer 6, the thickness of the sound-emitting vibration layer 6, and the sound-emitting power of the sound-emitting device.

[0183] In the embodiments of the present application, in the stationary state, each organic part 5 does not contact the sound-emitting vibration layer 6.

[0184] In some embodiments, in the state where the sound-emitting device emits sound, at least part of the organic part 5 contacts the sound-emitting vibration layer 6.

[0185] Compared with the related art where the support part 2 or the organic part 5 is directly in contact with the sound-emitting vibration layer 6 in the stationary state, in the embodiments of the present application, by setting the distance from the surface of each organic part 5 away from the first substrate 1 to the first substrate 1 in the direction perpendicular to the first substrate 1 to be less than the distance from the second conductive layer 61 to the first substrate 1, there is a certain space between each organic part 5 and the sound-emitting vibration layer 6. In practical applications, the sound-emitting vibration layer 6 can have a larger amplitude, and the damage caused by the vibration of the sound-emitting vibration layer 6 to the organic part 5 is smaller, which can extend the service life of the sound-emitting device. In addition, while being beneficial for the support part group 2G to play a role in directionally propagating ultrasonic signals and adjusting the directional sound transmission effect, the uniformity of directional sound transmission is improved, thereby improving the quality of the sound-emitting device and ensuring the directional sound emission effect of the sound-emitting device.

[0186] In at least one embodiment of the present application, as Figures 4 to 15 shown, the sound-emitting device includes a light-transmitting area T and a non-light-transmitting area FT surrounding the light-transmitting area T, and the support part group 2G and the organic part 5 are both arranged in the light-transmitting area T;

[0187] The non-light-transmitting region FT includes a first peripheral trace Z1, a second peripheral trace Z2, a second protective layer 7, and a bonding portion 8. The first peripheral trace Z1 is located between the first conductive layer 3 and the first protective layer 4, and the first peripheral trace Z1 is electrically connected to the first conductive layer 3. The second peripheral trace Z2 is disposed on the side of the second conductive layer 61 close to the first substrate 1. The second protective layer 7 covers the side of the second peripheral trace Z2 away from the second conductive layer 61. The second peripheral trace Z2 is electrically connected to the second conductive layer 61. At least a partial region of the bonding portion 8 is disposed between the first protective layer 4 and the second protective layer 7.

[0188] In a direction perpendicular to the plane where the first substrate 1 is located, the height of the bonding portion 8 is greater than the distance between the surface of the organic portion 5 away from the first substrate 1 and the first substrate 1.

[0189] In an exemplary embodiment, both the first peripheral trace Z1 and the second peripheral trace Z2 are disposed around the light-transmitting region T.

[0190] Here, the specific materials of the first peripheral trace Z1 and the second peripheral trace Z2 are not limited.

[0191] Exemplarily, the first peripheral trace Z1 and the second peripheral trace Z2 include a metal or a metal oxide. For example, the metal may include one or a combination of gold (Au), silver (Ag), copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti). For example, the metal oxide may include indium tin oxide (ITO) or indium zinc oxide (IZO).

[0192] Here, whether the materials and line widths of the first peripheral trace Z1 and the second peripheral trace Z2 are the same is not limited, and it can be specifically determined according to the product design.

[0193] In some embodiments, in order to simplify the design and reduce the difficulty of the manufacturing process, the materials of the first peripheral trace Z1 and the second peripheral trace Z2 can be designed to be the same.

[0194] In an exemplary embodiment, the material of the second protective layer 7 is an inorganic material.

[0195] In an exemplary embodiment, the material of the second protective layer 7 is an insulating material, which is used to isolate the second peripheral trace Z2 from other conductive materials to avoid short circuits in the circuit. In addition, the second protective layer 7 can also protect the second peripheral trace Z2 and prevent the second peripheral trace Z2 from being corroded or damaged due to factors such as moisture in the external environment during use.

[0196] Exemplarily, the material of the second protective layer 7 can be an inorganic insulating material.

[0197] For example, the inorganic insulating material may be one or a combination of one or more of silicon nitride, silicon oxide, or silicon oxynitride.

[0198] In an exemplary embodiment, the material of the bonding portion 8 described above may include any one of glue, adhesive material, tape, binder, and frame glue (Seal).

[0199] The bonding portion 8 is disposed in the non-light-transmitting region FT, and the shape of the orthographic projection pattern of the bonding portion 8 on the first substrate 1 is annular, wherein the width of the annulus is less than or equal to the width of the non-light-transmitting region FT.

[0200] Wherein, at least a partial region of the bonding portion 8 being disposed between the first protective layer 4 and the second protective layer 7 includes, but is not limited to, the following cases:

[0201] First, a partial region of the bonding portion 8 is disposed between the first protective layer 4 and the second protective layer 7, and a partial region of the bonding portion 8 is disposed between the first protective layer 4 and the second conductive layer 61;

[0202] Second, the entire region of the bonding portion 8 is disposed between the first protective layer 4 and the second protective layer 7.

[0203] In an embodiment of the present application, by setting the height of the bonding portion 8 in a direction perpendicular to the plane of the first substrate 1 to be greater than the distance between the surface of the organic portion 5 away from the first substrate 1 and the first substrate 1, in this way, there is a certain space between each organic portion 5 and the sound generating vibration layer 6. In practical applications, the sound generating vibration layer 6 can have a larger amplitude, and the damage caused by the vibration of the sound generating vibration layer 6 to the organic portion 5 is smaller, which can extend the service life of the sound generating device. Additionally, while being beneficial for the support portion group 2G to play a role in directionally propagating ultrasonic signals and adjusting the directional sound transmission effect, the uniformity of directional sound transmission is improved, thereby improving the quality of the sound generating device and ensuring the directional sound emission effect of the sound generating device.

[0204] In at least one embodiment of the present application, as Figure 16 and Figure 17 shown, along the first direction (e.g., the horizontal direction) or the second direction (e.g., the vertical direction), the distance L or L' between any two adjacent organic portions 5 is substantially equal;

[0205] Along the first direction (e.g., the horizontal direction) or the second direction (e.g., the vertical direction), for the organic portion 5 with the smallest distance to the boundary position between the non-light-transmitting region FT and the light-transmitting region T, the distance L0 between it and the boundary position is substantially equal to the distance L between any other two adjacent organic portions 5, and the first direction (e.g., the horizontal direction) and the second direction (e.g., the vertical direction) are perpendicular.

[0206] In an embodiment of the present application, by setting that for the organic part 5 with the minimum distance to the boundary position between the non-light-transmitting region FT and the light-transmitting region T along the first direction (e.g., the horizontal direction) or the second direction (e.g., the vertical direction), the distance L0 between it and the boundary position is approximately equal to the distance L between any other two adjacent organic parts 5, so that the organic parts 5 in the region of the sound-emitting device close to the non-light-transmitting region FT can be evenly arranged; in addition, since the organic part 5 is arranged on the support part group 2G, for the support part group 2G with the minimum distance to the boundary position between the non-light-transmitting region FT and the light-transmitting region T, the distance between it and the boundary position is approximately equal to the distance between any other two adjacent support part groups 2G, which helps the support part group 2G to be evenly distributed on the first substrate 1, so as to be conducive to the support part group 2G to play a role in directionally propagating ultrasonic signals and adjusting the directional sound transmission effect, while improving the uniformity of directional sound transmission, thereby improving the quality of the sound-emitting device and ensuring the directional sound emission effect of the sound-emitting device.

[0207] In at least one embodiment of the present application, as Figure 16 and Figure 17 shown, the size d3 of the organic part 5 along the first direction (e.g., the horizontal direction) is approximately equal to the size d4 of the organic part 5 along the second direction (e.g., the vertical direction).

[0208] In at least one embodiment of the present application, as Figure 16 and Figure 17 shown, the size d1 between the edge of the support part 2 and the edge of the organic part 5 along the first direction (e.g., the horizontal direction) is approximately equal to the size d2 between the edge of the support part 2 and the edge of the organic part 5 along the second direction (e.g., the vertical direction).

[0209] In at least one embodiment of the present application, the range of the minimum distance between the surface of the organic part 5 far from the first substrate 1 and the first substrate 1 is 4 μm to 15 μm.

[0210] In an exemplary embodiment, the minimum distance between the surface of the organic part 5 far from the first substrate 1 and the first substrate 1 can be 4.5 μm, 5 μm, 5.5 μm, 6.0 μm, 6.5 μm, 7.0 μm, 7.5 μm, 8.0 μm, 8.5 μm, 9.0 μm, 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.5 μm, 12 μm, 12.5 μm, 13 μm, 13.5 μm, 14 μm or 14.5 μm.

[0211] In at least one embodiment of the present application, as Figure 16 and Figure 17 shown, the shapes of the orthographic projection patterns of the support part 2 and the organic part 5 on the first substrate 1 are both arc-shaped.

[0212] Exemplarily, the arc can include a circle, an ellipse, a semi - circle, a semi - ellipse, a sector, a rounded polygon, etc.

[0213] In the embodiments of the present application, by setting the shapes of the orthographic projection patterns of the support part 2 and the organic part 5 on the first substrate 1 to be arcs, in this way, during the vibration of the sound - emitting device, the vibration energy received by the support part 2 and the organic part 5 in all directions can be made as consistent as possible, thereby reducing the problem of detachment of the local areas of the support part 2 and the organic part 5 due to excessive vibration energy, thus improving the quality of the sound - emitting device, the effect of directional sound emission of the sound - emitting device, and the uniformity of sound wave propagation.

[0214] The embodiments of the present application provide a display device, such as Figure 18 and Figure 19 as shown, including the sound - emitting device 100 described in the foregoing text, and further including a display panel 200; the sound - emitting device 100 is disposed on the light - emitting side of the display panel 200 or inside the display panel 200; the orthographic projection of the light - transmissive area T of the sound - emitting device 100 on the display panel 200 overlaps with the display area AA of the display panel 200.

[0215] The above - mentioned display device can be an Organic Light - Emitting Diode (OLED) display device, a Micro LED (Micro Light Emitting Diode) display device, a Mini LED (Mini Light Emitting Diode) display device, or an LCD (Liquid Crystal Display) display device.

[0216] The display device can include any device or product with a display function. For example, the display device can be a smart phone, a mobile phone, an e - book reader, a desktop computer (PC), a laptop PC, a netbook PC, a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head - mounted device, electronic clothing, an electronic bracelet, an electronic necklace, electronic accessories, an electronic tattoo, or a smart watch), a television, etc.

[0217] In at least one embodiment of the present application, as Figure 18 and Figure 19 shown, the display panel includes a liquid crystal display panel; the sound - emitting device 100 is disposed on the light - emitting side of the display panel 200;

[0218] At least a part of the projection of the support portion 2 on the liquid crystal display panel overlaps with the spacers PS in the liquid crystal display panel.

[0219] In an exemplary embodiment, the projection of a part of the support portion 2 on the liquid crystal display panel overlaps with the spacers PS in the liquid crystal display panel.

[0220] In an exemplary embodiment, the projection of each support portion 2 on the liquid crystal display panel overlaps with the corresponding spacer PS in the liquid crystal display panel.

[0221] Wherein, the distribution density of the spacers PS in the liquid crystal display panel is greater than the distribution density of the support portions 2 in the sound generating device 100.

[0222] In the display device provided in the embodiment of the present application, since the sound generating device 100 is disposed on the light emitting side of the display panel 200, by setting at least a part of the projection of the support portion 2 on the liquid crystal display panel to overlap with the spacers PS in the liquid crystal display panel, the interference of the support portion 2 on the display light can be greatly reduced, thereby improving the light emitting efficiency of the display device and enhancing the display effect.

[0223] In at least one embodiment of the present application, the display panel 200 includes an organic light emitting diode display panel (OLED), and the sound generating device 100 is disposed on the light emitting side or inside the display panel 200.

[0224] Exemplarily, when the sound generating device 100 is disposed inside the display panel 200, since the OLED display panel 200 may include a light emitting substrate and a cover plate (or a packaging substrate), the sound generating device 100 may be disposed between the light emitting substrate and the cover plate (or the packaging substrate).

[0225] In some embodiments, when the sound generating device 100 is disposed between the light emitting substrate and the cover plate (or the packaging substrate), the first substrate 1 may be shared with the encapsulation layer or the organic film layer in the light emitting substrate 202, thereby further reducing the thickness of the display device and improving the application flexibility of the display device.

[0226] In an exemplary embodiment, as Figure 18 shown, an annular connecting portion 300 may be provided to fix the sound generating device 100 and the display panel 200 together.

[0227] In an exemplary embodiment, as Figure 19 shown, a planar connecting portion 300 may be provided to fix the sound generating device 100 and the display panel 200 together.

[0228] Wherein, the material of the connecting portion 300 may include frame glue.

[0229] Embodiments of the present application provide a method for manufacturing a sound generating device, which is applied to manufacture the sound generating device described above. The method includes:

[0230] S01. Provide a first substrate film material 101 as shown in Figure 20 Figure;

[0231] Exemplarily, the first substrate film material 101 may be thickened glass; the thickness of the thickened glass is greater than or equal to the sum of the thickness of the first substrate 1 and the thickness of the support part 2.

[0232] S02. Use a halftone mask to simultaneously form the first substrate 1 and a plurality of support part groups 2G arranged in an array on the first substrate 1; each support part group 2G includes at least one support part 2, the support part 2 is in direct contact with the first substrate 1, each support part 2 includes a first sub-layer 21 and a second sub-layer 22, the second sub-layer 22 is located on the side of the first sub-layer 21 away from the first substrate 1, and the outer contour of the orthographic projection of the second sub-layer 22 on the first substrate 1 is located within the outer contour of the orthographic projection of the first sub-layer 21 on the first substrate 1;

[0233] Use a halftone mask to etch the first substrate film material, and simultaneously obtain the first substrate 1 and a plurality of support part groups 2G arranged in an array on the first substrate 1. Among them, the first substrate 1 and the plurality of support part groups 2G are an integrated structure.

[0234] Specifically, S02. Using a halftone mask to simultaneously form the first substrate 1 and a plurality of support part groups 2G arranged in an array on the first substrate 1 includes the following sub-steps:

[0235] Sub-step 1: Form a first layer of photoresist film PR1 on the first substrate film material 101, and use a halftone mask to expose the first layer of photoresist film PR1 to obtain three regions PR1-1, PR1-2, and PR1-3 with different exposure amounts as shown in Figure 21 Figure.

[0236] Sub-step 2: Perform a developing process to remove the photoresist in the PR1-1 region in the first layer of photoresist film PR1 to obtain a structural diagram as shown in Figure 22 Figure.

[0237] Sub-step 3: Using the remaining regions PR1-2 and PR1-3 in the first layer of photoresist film PR1 as a mask, etch the first substrate film material 101 to obtain an intermediate structure 102 of the support part 2 as shown in Figure 23 Figure; Exemplarily, wet etching may be used to etch the first substrate film material 101.

[0238] Sub-step 4: Perform a developing process to remove the photoresist in the PR1-3 region of the first photoresist film PR1, obtaining a structural diagram as shown in Figure 24 the following.

[0239] Sub-step 5: Using the remaining region PR1-2 in the first photoresist film PR1 as a mask, etch the intermediate structure 102 of the support portion 2 as shown in Figure 24 the following to obtain the support portion 2 as shown in Figure 25 the following; remove the remaining region PR1-2 in the first photoresist film PR1.

[0240] S03. Form a first conductive layer 3 as shown in Figure 27 the following, and the orthographic projection of the first conductive layer 3 on the first substrate 1 does not overlap with the orthographic projection of the support portion group 2G on the first substrate 1;

[0241] S04. Form a first protective layer 4 as shown in Figure 27 the following, and the first protective layer 4 covers at least a part of the region of the support portion 2 and the first conductive layer 3.

[0242] In an exemplary embodiment, after step S04, forming the first protective layer 4 as shown in Figure 27 the following, and the first protective layer 4 covers at least a part of the region of the support portion 2 and the first conductive layer 3, the method further includes:

[0243] S05. Form an organic portion 5 as shown in Figure 28 the following, and the organic portion 5 is located on the side of the first protective layer 4 away from the first substrate 1; wherein, the organic portion 5 covers the support portion group 2G.

[0244] In the embodiment of the present application, since no other film layer is provided between the support portion 2 of the sound generating device and the first substrate 1, the support portion 2 is in direct contact with the first substrate 1; in addition, the first protective layer 4 covers at least a part of the region of the support portion 2, and the first protective layer 4 can also protect the support portion 2. During the vibration of the sound generating device, the risk of the support portion 2 falling off is greatly reduced, thereby improving the quality of the sound generating device and ensuring the directional sound generating effect of the sound generating device.

[0245] Of course, the above-mentioned sound generating device may further include other steps and manufacturing processes. The embodiments of the present application only introduce the manufacturing methods and steps related to the inventive points. Other steps and processes included in the sound generating device can refer to the introduction in the related art and will not be elaborated here.

[0246] As described above, it is only the specific implementation manner of the present application. However, the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claimed rights.

Claims

1. A sound generating device, characterized in that, The sound - generating device includes: A first substrate; A plurality of support - part groups arranged in an array on the first substrate, each support - part group including at least one support part, and the support part being in direct contact with the first substrate; A first conductive layer located on one side of the first substrate where the support - part group is provided, and a positive projection of the first conductive layer on the first substrate does not overlap with a positive projection of the support - part group on the first substrate; A first protective layer covering at least a part of the region of the support part and the first conductive layer; A sound - generating vibration layer located on a side of the support - part group away from the first substrate; the support - part group is located in a cavity structure formed by the first substrate and the sound - generating vibration layer.

2. The sound generating device according to claim 1, wherein The sound - generating device further includes a plurality of organic parts arranged in an array, and the organic parts are located on a side of the first protective layer away from the first substrate; wherein, the organic parts cover the support - part group.

3. The sound generating device according to claim 1, wherein, The sound - generating device includes a light - transmitting region and a non - light - transmitting region surrounding the light - transmitting region; The sound - generating device further includes an organic part located on a side of the first protective layer away from the first substrate, and a positive projection of the organic part on the first substrate at least covers a part of the first substrate located in the light - transmitting region.

4. The sound generating device according to claim 2, wherein Each support part includes a first sub - layer and a second sub - layer, the second sub - layer being located on a side of the first sub - layer away from the first substrate, and an outer contour of a positive projection of the second sub - layer on the first substrate is located within an outer contour of a positive projection of the first sub - layer on the first substrate.

5. The sound generating device according to claim 4, wherein An area of a positive projection of the second sub - layer on the first substrate is greater than or equal to 50% of an area of a positive projection of the first sub - layer on the first substrate.

6. The sound generating device according to claim 4, characterized in that, The second sub - layer includes at least one height - increasing part, and a height of the organic part in a direction perpendicular to a plane where the first substrate is located is greater than or equal to a height of the height - increasing part in a direction perpendicular to the plane where the first substrate is located.

7. The sound generating device according to claim 4, wherein A thickness of the organic part in a direction perpendicular to a plane where the first substrate is located at a middle region of a planar figure of the organic part is greater than or equal to a thickness of the organic part in a direction perpendicular to the plane where the first substrate is located at an edge position of the planar figure of the organic part.

8. The sound generating device according to claim 7, wherein The second sub - layer includes at least two height - increasing parts, and adjacent two height - increasing parts are connected to each other, and the organic part covers a surface of each height - increasing part on a side away from the first substrate.

9. The sound generating device according to claim 7, wherein, The second sub - layer includes at least two height - increasing parts, and there is a first gap between adjacent two height - increasing parts, and the organic part extends into the first gap.

10. The sound generating device according to claim 9, wherein, The first protective layer is discontinuously provided at a position of the first gap, the first gap exposes a part of the region of the first sub - layer, and the organic part is in direct contact with the first sub - layer at the position of the first gap.

11. The sound generating device according to claim 7, wherein, Each support - part group includes at least two support parts, and there is a second gap between adjacent two support parts in the same support - part group, and the organic part extends into the second gap.

12. The sound emitting device according to claim 11, characterized in that, The first protective layer and the first conductive layer are discontinuously arranged at the position of the second gap, the second gap exposes a partial area of the first substrate, and the organic part is in direct contact with the first substrate at the position of the second gap.

13. The sound generating device according to any one of claims 4 to 12, characterized in that, The height of the first sub-layer in the direction perpendicular to the plane where the first substrate is located and the height of the second sub-layer in the direction perpendicular to the plane where the first substrate is located are both less than or equal to the height of the organic part in the direction perpendicular to the plane where the first substrate is located.

14. The sound generating device according to claim 13, wherein, The height of the organic part in the direction perpendicular to the plane where the first substrate is located is less than the sum of the height of the first sub-layer in the direction perpendicular to the plane where the first substrate is located and the height of the second sub-layer in the direction perpendicular to the plane where the first substrate is located, and the height of the organic part in the direction perpendicular to the plane where the first substrate is located is greater than half of the sum of the height of the first sub-layer in the direction perpendicular to the plane where the first substrate is located and the height of the second sub-layer in the direction perpendicular to the plane where the first substrate is located.

15. The sound generating device according to any one of claims 4 to 12, characterized in that, The material of the support part is the same as the material type of the first substrate.

16. The sound generating device according to claim 15, wherein The support part and the first substrate are made of the same material, and the support part and the first substrate are an integral structure.

17. The sound generating device according to claim 15, wherein, The sound-generating vibration layer includes a second substrate and a second conductive layer located between the second substrate and the organic part, and the cavity structure is formed between the first protective layer and the second conductive layer; In the direction perpendicular to the first substrate, the distance between the surface of each organic part away from the first substrate and the first substrate is less than the distance between the second conductive layer and the first substrate.

18. The sound generating device according to claim 17, wherein The sound-generating device includes a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area, and the support part group and the organic part are both arranged in the light-transmitting area; The non-light-transmitting area includes a first peripheral trace, a second peripheral trace, a second protective layer and a bonding part. The first peripheral trace is located between the first conductive layer and the first protective layer, and the first peripheral trace is electrically connected to the first conductive layer; the second peripheral trace is arranged on the side of the second conductive layer close to the first substrate, the second protective layer covers the side of the second peripheral trace away from the second conductive layer, and the second peripheral trace is electrically connected to the second conductive layer; at least a partial area of the bonding part is arranged between the first protective layer and the second protective layer; In the direction perpendicular to the plane where the first substrate is located, the height of the bonding part is greater than the distance between the surface of the organic part away from the first substrate and the first substrate.

19. The sound generating device according to claim 2, wherein In the first direction or the second direction, the distance between any two adjacent organic parts is approximately equal; In the first direction or the second direction, for the organic part with the smallest distance to the boundary position between the non-light-transmitting area and the light-transmitting area, the distance between it and the boundary position is approximately equal to the distance between any other two adjacent organic parts, and the first direction and the second direction are perpendicular.

20. A display device, characterized in that, It includes a sound-emitting device as described in any one of claims 1-19, and further includes a display panel; the sound-emitting device is disposed on the light-emitting side of the display panel or inside the display panel; the orthographic projection of the light-transmitting area of the sound-emitting device on the display panel overlaps with the display area of the display panel.

21. The display device according to claim 20, wherein The display panel includes a liquid crystal display panel; the sound-emitting device is disposed on the light-emitting side of the display panel. At least a part of the orthographic projection of the support portion on the liquid crystal display panel overlaps with the spacers in the liquid crystal display panel.

22. The display device according to claim 20, characterized in that, The display panel includes an organic light-emitting diode display panel, and the sound-emitting device is disposed on the light-emitting side of the display panel or inside the display panel.

23. A method for preparing a sound generating device, characterized in that, Applied to the preparation of a sound-emitting device as described in any one of claims 1-19, the method includes: Providing a first base film material. Using a halftone mask to simultaneously form a first base and a plurality of support portion groups arranged in an array on the first base; each support portion group includes at least one support portion, the support portion is in direct contact with the first base, each support portion includes a first sub-layer and a second sub-layer, the second sub-layer is located on the side of the first sub-layer away from the first base, and the outer contour of the orthographic projection of the second sub-layer on the first base is located inside the outer contour of the orthographic projection of the first sub-layer on the first base. Forming a first conductive layer, and the orthographic projection of the first conductive layer on the first base does not overlap with the orthographic projection of the support portion group on the first base. Forming a first protective layer, and the first protective layer covers at least a part of the area of the support portion and the first conductive layer.

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