Display device

Abstract

A display device may include: a display panel; a cover layer disposed on the display panel; a film layer disposed on the cover layer; a transparent adhesive layer disposed between the display panel and the cover layer; and a transparent resin layer disposed between the cover layer and the film layer. The thickness of the transparent resin layer may be different from the thickness of the transparent adhesive layer.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit and priority of Korean Patent Application No. 10 - 2023 - 0189294, filed in Korea on December 22, 2023, which is hereby incorporated by reference in its entirety for all purposes. Technical field

[0003] The present disclosure relates to a display device. Background art

[0004] With the development of the information society, various demands for display devices for displaying images are increasing, and various types of display devices such as liquid crystal display (LCD) devices and organic light - emitting diode (OLED) display devices are used.

[0005] In a display device, a self - emissive type OLED display device has superior viewing angles and contrast ratios compared to LCDs, and is lighter, thinner, and has low power consumption because an OLED does not require a separate backlight. In addition, the OLED display device has the advantages of being drivable with a low DC voltage, having a fast response speed, and particularly low manufacturing costs. Summary of the invention

[0006] An OLED display device may include a cover layer for protecting a display panel, and the cover layer may include glass or plastic. When the cover layer is formed of glass, a film layer or the like may be further provided on the cover layer to prevent the glass from cracking when subjected to an external impact.

[0007] One aspect of the present disclosure aims to provide a display device that can minimize the lifting between a bonding layer and a film layer caused by an external impact or can maximize the durability of the cover layer against cracks.

[0008] One aspect of the present disclosure aims to provide a display device that can increase the external visibility of a groove caused by an external impact and can improve the display quality.

[0009] One aspect of the present disclosure aims to provide a display device having excellent adhesion between a cover layer and a film layer.

[0010] One aspect of the present disclosure aims to provide a thin - film display device that can reduce the thickness of a bonding member for bonding an upper structure.

[0011] Other features and aspects will be set forth in the following description, and will be in part apparent from the description, or may be learned by practice of the inventive concepts provided herein. Other features and aspects of the inventive concepts may be realized and obtained by structures particularly pointed out in the written description, or its equivalents, its claims, and the appended drawings.

[0012] A display device according to one or more embodiments of the present disclosure may include: a display panel, a cover layer disposed on the display panel, a film layer disposed on the cover layer, a transparent adhesive layer disposed between the display panel and the cover layer, and a transparent resin layer disposed between the cover layer and the film layer. The thickness of the transparent resin layer may be different from the thickness of the transparent adhesive layer.

[0013] A display device according to one or more embodiments of the present disclosure may include: a display panel including a folding region, a first non-folding region on a first side of the folding region, and a second non-folding region on a second side of the folding region different from the first side of the folding region; a cover layer disposed on the display panel; a film layer disposed on the cover layer; a transparent adhesive layer disposed between the display panel and the cover layer; and a transparent resin layer disposed between the cover layer and the film layer. The modulus of the transparent resin layer may be different from the modulus of the transparent adhesive layer.

[0014] A display device according to one or more embodiments of the present disclosure may include: a display panel, a transparent adhesive layer on the display panel; a cover layer having a glass material on the transparent adhesive layer; a transparent resin layer on the cover layer; and a film layer having a polymer organic material on the cover layer.

[0015] According to some embodiments of the present disclosure, a transparent resin may be disposed between a cover layer for protecting a display panel and a film layer for protecting the cover layer. The transparent resin may have a smaller thickness and a greater modulus than a bonding member (e.g., a transparent adhesive) for bonding other components of the display device. Therefore, according to some embodiments of the present disclosure, by minimizing the deformation of the transparent resin, even when an external impact is caused by a sharp object on the upper part of the display device, the occurrence of lifting between the film layer and the bonding layer or cracks in the cover layer caused by an external force can be minimized.

[0016] According to some embodiments of the present disclosure, the appearance visibility of the display device can be increased and the display quality can be improved.

[0017] In addition, since the deformation of the transparent resin can be minimized even when an external force is generated by a sharp object on the upper part of the display device, thereby minimizing the occurrence of lifting or cracks caused by the corresponding external force, the display device can be provided with increased durability and improved lifespan.

[0018] In addition, since a transparent resin having a small thickness is disposed between a cover layer for protecting a display panel and a film layer for protecting the cover layer, a display device having a small thickness can be realized.

[0019] By viewing the following drawings and detailed embodiments, other systems, methods, features, and advantages will be, or will become, apparent to those skilled in the art. It is intended that all such additional systems, methods, features, and advantages be included within this specification, within the scope of the present disclosure, and be protected by the present disclosure. Nothing in this section shall be taken as a limitation on the present disclosure. Further aspects and advantages are discussed in connection with the aspects of the present disclosure.

[0020] It should be understood that both the foregoing description and the following description are exemplary and explanatory and are intended to provide further explanation of the inventive concept claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this disclosure. The drawings illustrate aspects and embodiments of the present disclosure and, together with the description, serve to explain the principles and examples of the present disclosure.

[0022] Figure 1 is a perspective view of a display device in a flat state or a restored state according to an embodiment of the present disclosure.

[0023] Figure 2 is Figure 1 a front elevation view of the display device shown in a folded state.

[0024] Figure 3 is along Figure 1 a cross-sectional view of the display device taken along line I-I′ in

[0025] Figure 4 is a schematic diagram showing a first experimental example of the present disclosure.

[0026] Figure 5 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0027] Figures 6 to 8 is a view showing a manufacturing method of a display device according to an embodiment of the present disclosure.

[0028] Figure 9 is a schematic diagram showing a second experimental example of the present disclosure.

[0029] Figure 10 is a front elevation view of a second sample of a third experimental example of the present disclosure.

[0030] Figure 11 is according to some embodiments of the present disclosure Figure 3 a cross-sectional view of a display panel of a display device.

[0031] Throughout the accompanying drawings and the detailed description, unless otherwise specified, the same reference numerals should be understood to refer to the same elements, features, and structures. The dimensions, lengths, and thicknesses of layers, regions, and elements, as well as the illustrations thereof, may be exaggerated for clarity, illustration, and / or convenience. Detailed Description

[0032] Now, reference will be made in detail to embodiments of the present disclosure, examples of which may be illustrated in the accompanying drawings. In the following description, when a detailed description of a well-known method, function, structure, or configuration may unnecessarily obscure aspects of the present disclosure, its detailed description may be omitted for the sake of brevity. Additionally, repeated descriptions may be omitted for the sake of brevity. The progression of the described processing steps and / or operations is a non-limiting example.

[0033] The order of the steps and / or operations is not limited to that set forth herein and may be changed to an order different from that described herein, except where the steps and / or operations necessarily occur in a particular order. In one or more examples, two consecutive operations may be performed substantially concurrently, or the two operations may be performed in a reverse order or in a different order depending on the functions or operations involved.

[0034] Unless otherwise specified, the same reference numerals may refer to the same elements throughout the specification, even if they are shown in different drawings. Unless otherwise specified, the same reference numerals may be used throughout the specification and the drawings to refer to the same or substantially the same elements. In one or more aspects, unless otherwise specified, the same elements (or elements with the same name) in different drawings may have the same or substantially the same functions and properties. The names of the various elements used in the following explanations are chosen for convenience only and may therefore be different from the names used in actual products.

[0035] The advantages and features of the present disclosure and methods for achieving them are elucidated by the embodiments described with reference to the accompanying drawings. However, the present disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are examples and are provided so that the present disclosure may be thorough and complete, to assist those skilled in the art in understanding the inventive concept without limiting the scope of protection of the present disclosure.

[0036] For expressions such as an element (e.g., a layer, film, region, component, section, etc.) being "connected", "bonded", "attached", "adhered" to another element, the element can not only be directly connected, bonded, attached, adhered to another element, but also be indirectly connected, bonded, attached, adhered to another element in the case where one or more intermediate elements are provided or interposed between the elements, unless otherwise specified.

[0037] For the description of an element (e.g., a layer, a film, a region, a component, a section, etc.) "contacting", "overlapping", etc. with another element, the element can not only directly contact, directly overlap, etc. with another element, but also indirectly contact, indirectly overlap, etc. with another element when one or more intermediate elements are disposed or interposed between the elements, unless otherwise specified.

[0038] It can be understood that although the terms "first", "second", etc. may be used herein to describe various elements (e.g., a layer, a film, a region, a component, a section, a member, a part, a zone, a region, a portion, a step, an operation, etc.), these terms are only used to distinguish one element from another. For example, without departing from the scope of the present disclosure, the first element may represent the second element, and similarly, the second element may represent the first element. Additionally, without departing from the scope of the present disclosure, the first element, the second element, etc. may be arbitrarily named according to the convenience of those skilled in the art. For clarity, the functions or structures of these elements (e.g., the first element, the second element, etc.) are not limited by the ordinal number or the name in front of the element. Additionally, the first element may include one or more first elements. Similarly, the second element (etc.) may include one or more second elements (etc.).

[0039] Spatially relative terms, such as "lower", "below", "under", "upper", "above", "over", etc., may be used to describe the correlation between various elements (e.g., a layer, a film, a region, a component, a section, etc.) as shown in the drawings. Spatially relative terms should be understood to include terms in addition to the directions illustrated in the drawings that also include different directions of the element during use or in operation. For example, if the element shown in the drawing is flipped, the element described as "lower", "below" another element will be oriented "above" the other element. Thus, the term "below" (exemplary term) may include "above" and "below". Similarly, the exemplary terms "upper", "above" may include both the directions of "above" and "below".

[0040] When using terms such as "comprising", "having", "including", "containing", "constituting", "made of", "formed of", "consisting of", etc. with respect to one or more elements (e.g., a layer, a film, a region, a component, a section, a member, a part, a zone, a region, a portion, a step, an operation, etc.), one or more other elements may be added, unless terms such as "only" are used. The terms used in the present disclosure are only used to describe specific exemplary embodiments and are not intended to limit the scope of the present disclosure. Singular forms of terms may include plural forms, unless the context clearly indicates otherwise.

[0041] The features of the various embodiments of the present disclosure may be combined or combined with each other partially or wholly, and may be operable with each other differently and technically driven as can be fully understood by those skilled in the art. The embodiments of the present disclosure may be implemented independently of each other, or may be implemented together in a co-dependent relationship.

[0042] In the following description, various exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. In addition, for ease of description, the proportions, dimensions, sizes, and thicknesses of each of the elements illustrated in the drawings may be different from the actual proportions, dimensions, sizes, and thicknesses, and thus, the embodiments of the present disclosure are not necessarily limited to the proportions, dimensions, sizes, and thicknesses illustrated in the drawings. In some embodiments, the drawings are drawn to scale, and the features in the drawings may serve as additional disclosure regarding the structure, features, and functions of the display device discussed herein.

[0043] Figure 1 is a perspective view of the display device 10 according to an embodiment of the present disclosure in a flat state or a restored state. Figure 2 is a front view showing the display device 10 according to an embodiment of the present disclosure in a folded state.

[0044] Referring to Figure 1 and Figure 2 , the display device 10 according to an embodiment of the present disclosure may be a foldable display device. The display device 10 may include a folding area FA extending in a first direction DR1, a first non-folding area NFA1 provided on one side of the folding area FA in a second direction DR2, and a second non-folding area NFA2 provided on the other side of the folding area FA in the second direction DR2. The folding area FA may have a longer dimension in the first direction DR1 and a shorter dimension in the second direction DR2.

[0045] As Figure 2 shown, the display device 10 may be folded with respect to the folding area FA or folded within the folding area FA. For example, when the display device 10 is folded, the first non-folding area NFA1 and the second non-folding area NFA2 may be arranged to overlap each other in the thickness direction when the first non-folding area NFA1 and the second non-folding area NFA2 face each other.

[0046] However, embodiments of the present disclosure are not limited thereto, and the display device 10 may be a stretchable display device or a bendable display device. In the present disclosure, a stretchable display device may be referred to as a display device that can display an image even when bent or stretched. A foldable display device and a stretchable display device may have higher flexibility than a general display device. The shape of the stretchable display device may be freely changed according to a user's operation, for example, by bending or stretching the stretchable display device. For example, when a user holds and pulls an end of the stretchable display device, the stretchable display device may be stretched by the user's force. Or, when the user arranges the stretchable display device on an uneven wall, the stretchable display device may be set to bend along the shape of the wall surface. In addition, when the force applied by the user is removed, the stretchable display device may return to its original state (or shape).

[0047] Figure 3 is a cross-sectional view of the display device 10 taken along line I-I' in Figure 1 .

[0048] Referring to Figure 3 , the display device 10 according to an embodiment of the present disclosure may include a lower structure DWM and an upper structure UPM disposed on the lower structure DWM.

[0049] The lower structure DWM may include a display panel 100, a polarization layer 200, a backplane layer 600, a first plate layer 800, and a second plate layer 900. The display panel 100, the polarization layer 200, the backplane layer 600, the first plate layer 800, and the second plate layer 900 may be referred to as components, for example, a display component, a polarization component, a backplane component, a first plate component, and a second plate component, or other similar terms, for example, layers, parts, etc., but embodiments of the present disclosure are not limited thereto.

[0050] The display panel 100 may include a plurality of pixels disposed in a display area of a substrate and driving components for driving the pixels disposed in a non-display area around the display area.

[0051] The pixels may include transistors TFT connected to the driving components through control signal lines and light-emitting elements OLED connected to the transistors TFT.

[0052] The transistors TFT are turned on or off according to control signals applied through the control signal lines to adjust the magnitude of the current applied to the light-emitting elements OLED.

[0053] The light-emitting elements OLED may emit light with a brightness corresponding to the magnitude of the current applied through the transistors TFT. The light-emitting elements OLED may include organic light-emitting diodes, but embodiments of the present disclosure are not limited thereto.

[0054] The base substrate may include a flexible substrate. For example, the base substrate may be an insulating plastic substrate made of one of polyimide, polyethersulfone, polyethylene terephthalate, and polycarbonate, but embodiments of the present disclosure are not limited thereto. Since the base substrate of the display panel 100 includes a flexible substrate, the display device 10 may be implemented as a foldable, stretchable, or bendable display device, but embodiments of the present disclosure are not limited thereto. Refer to Figure 11 to provide other details of the display panel 100.

[0055] The backplane layer 600 may be disposed below the display panel 100 and may be referred to as the backplane 600. The backplane layer 600 may be disposed below the display panel 100 to support the display panel 100. The backplane layer 600 may include a material capable of supporting the display panel 100. For example, the backplane layer 600 may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but embodiments of the present disclosure are not limited thereto. The backplane layer 600 may constantly maintain the curvature of the display panel 100 when the display device 10 is folded and suppress wrinkles from occurring on the upper surface of the display panel 100. The polarizing layer 200 may be disposed above the display panel 100. The polarizing layer 200 may polarize the light emitted from the display panel 100 at a polarization angle. The polarizing layer 200 may emit the light polarized at the polarization angle to the outside. The polarizing layer 200 may include a function of blocking the reflection of light other than the light polarized at the polarization angle among external light.

[0056] The plate layer 800 and the plate layer 900 may be disposed below the backplane layer 600. The plate layer 800 and the plate layer 900 may include a first plate layer 800 and a second plate layer 900 disposed below the first plate layer 800. Each of the plate layer 800 and the plate layer 900 may include a metal. For example, each of the plate layer 800 and the plate layer 900 may include stainless steel, but embodiments of the present disclosure are not limited thereto.

[0057] The second layer 900 may include a pattern SLP disposed in the folding region FA. The first layer 800 may be disposed on the second layer 900 so as to prevent the pattern SLP from being visible. In other words, the first layer 800 may include the pattern SLP. For example, the pattern SLP may be set to correspond to the folding region FA. The pattern SLP can improve the folding performance of the display device by enabling the second layer 900 of the folding region to be easily folded and easily restored to its original state after folding. For example, the pattern SLP may be set to be spaced apart from each other at a certain interval (or distance). The pattern SLP may be an opening pattern, but embodiments of the present disclosure are not limited thereto. In one embodiment, the pattern SLP is a series of protrusions or ridges separated by intervals or openings that extend through the thickness of the second layer 900. The openings contribute to improving the flexibility of the second layer 900 by making the regions including the protrusions or ridges more easily expandable and contractible. For example, when the first non-folding region NFA1 and the second non-folding region NFA2 are folded downward around the folding region, the protrusions or ridges collapse or compress together to eliminate the spaces or openings. The missing material in the spaces or openings relieves the pressure at the folding position and makes the second layer 900 more flexible in this region.

[0058] The polarization layer 200 may include a first retardation layer disposed in sequence and in direct contact with each other or separated by an adhesive layer, a second retardation layer disposed on the first retardation layer, and a polarization layer disposed on the second retardation layer. In Figure 3 this, although an example in which the polarization layer 200 and the display panel 100 are separated from each other is shown, embodiments of the present disclosure are not limited thereto, and the polarization layer 200 may be included in the display panel 100 or a part of the display panel 100.

[0059] The lower structure DWM may further include a bonding layer or an adhesive layer configured to bond (or connect) the components 100, 200, 600, 800, and 900. The lower structure DWM may include a first bonding layer 710, a second bonding layer 720, a fourth bonding layer 740, a fifth bonding layer 750, and a sixth bonding layer 760.

[0060] The first bonding layer 710 may be disposed between the display panel 100 and the polarization layer 200. The first bonding layer 710 may connect or bond to the display panel 100 and the polarization layer 200.

[0061] The second bonding layer 720 may be disposed between the polarization layer 200 and the cover layer 300. The second bonding layer 720 may connect or bond to the polarization layer 200 and the cover layer 300.

[0062] The fourth bonding layer 740 may be disposed between the backplane layer 600 and the display panel 100. The fourth bonding layer 740 may connect or bond to the backplane layer 600 and the display panel 100.

[0063] The fifth bonding layer 750 may be disposed between the backplane layer 600 and the first plate layer 800. The fifth bonding layer 750 may be connected or bonded to the backplane layer 600 and the first plate layer 800.

[0064] The sixth bonding layer 760 may be disposed between the first plate layer 800 and the second plate layer 900. The sixth bonding layer 760 may be connected or bonded to the first plate layer 800 and the second plate layer 900.

[0065] The first bonding layer 710, the second bonding layer 720, the fourth bonding layer 740, the fifth bonding layer 750, and the sixth bonding layer 760 may each include a transparent adhesive. For example, the transparent adhesive may be a transparent resin (OCR) or a transparent adhesive (OCA). In an embodiment of the present disclosure, the first bonding layer 710, the second bonding layer 720, the fourth bonding layer 740, the fifth bonding layer 750, and the sixth bonding layer 760 may each include a transparent adhesive (OCA).

[0066] The thickness t2 of the second bonding layer 720 may be about 50 μm or more. The thickness t2 of the second bonding layer 720 may be the thickness of the transparent adhesive (OCA) included in the second bonding layer 720. In some embodiments, when the thickness t2 of the second bonding layer 720 is less than about 50 μm, the stress generated when the cover layer 300 is folded, stretched, or bent causes the second bonding layer 720 to deform. In some embodiments, the properties of the second bonding layer 720 allow the thickness t2 to be less than about 50 μm without deforming the second bonding layer 720.

[0067] The modulus (e.g., storage modulus or elastic modulus) of the second bonding layer 720 may be in the range of about 1 kPa to about 100 kPa. When the modulus of the second bonding layer 720 is less than about 10 kPa, the material of the second bonding layer 720 may flow during the formation of the second bonding layer 720, and thus the stamping yield of the second bonding layer 720 may be reduced. For example, when the modulus of the second bonding layer 720 is low, the ends of the second bonding layer 720 may deform during stamping, resulting in poor appearance and non-peeled release material. When the modulus of the second bonding layer 720 exceeds about 100 kPa, the cover layer 300 cannot relieve the stress generated during folding, stretching, or bending, and thus the second bonding layer 720 may deform. Future developments or other changes in the second bonding layer 720 may allow the modulus of the second bonding layer 720 to be less than about 10 kPa without deforming. Preferably, for the purposes of the present disclosure, the modulus of the second bonding layer 720 is about 10 kPa to about 100 kPa. Unless otherwise specified, the relative term "about" means the stated numerical value or feature plus or minus 5%.

[0068] The upper structure UPM may include a cover layer 300.

[0069] The cover layer 300 may be disposed on the polarization layer 200. The cover layer 300 may be formed of glass or a glass material including quartz. The cover layer 300 may be disposed on the display panel 100 to protect the components (e.g., the lower structure DWM) disposed below the cover layer 300 from the outside. Since the display device 10 may be implemented as a foldable, stretchable, or bendable display device, the cover layer 300 should have flexibility. Thus, the cover layer 300 may have a modulus (e.g., Young's modulus or elastic modulus) of 70 GPa or less, and the cover layer 300 may have a thickness t3 of about 100 μm or less. However, when the thickness t3 of the cover layer 300 is too small, the components disposed below the cover layer 300 cannot be sufficiently protected, and thus the cover layer 300 may, for example, preferably have a thickness of at least about 20 μm. Modifications and / or future developments to the cover layer 300 may enable the thickness t3 of the cover layer 300 to be less than about 20 μm while sufficiently protecting the display device or the display panel. The cover layer 300 may be a cover layer formed by chemical strengthening, but the embodiments of the present disclosure are not limited thereto. The cover layer 300 may be a cover window, a window cover, or a cover member. The embodiments of the present disclosure are not limited thereto.

[0070] The cover layer 300 can protect the components disposed below the cover layer 300 from the outside, but as described above, since the cover layer 300 is formed of a glass material, the cover layer 300 is damaged by an external force, generating glass fragments. The glass fragments may break to the outside of the display device 10. According to an embodiment of the present disclosure, to prevent the fragmentation of the glass fragments due to the damage of the cover layer 300 or to increase the durability of the cover layer 300, another layer may be further included on the cover layer 300. For example, a film layer 400 and a coating layer 500 may be further included on the cover layer 300.

[0071] The film layer 400 may protect the cover layer 300. The film layer 400 may be a thin film sheet of a polymer organic material. The film layer 400 may have a high transmittance of more than 88%, a heat resistance of 100 °C or more, and 80×10 -6a coefficient of thermal expansion of less than / K, but embodiments of the present disclosure are not limited thereto. Accordingly, the film layer 400 may not deteriorate in a high temperature and high humidity or thermal shock environment (e.g., below 100 °C), and damage to the film layer 400 can be prevented. For example, the film layer 400 may be formed of a material having a low coefficient of thermal expansion and thermal stability. For example, the film layer 400 may be formed of polyimide (PI), (poly) norbornene, highly heat-resistant polyethylene terephthalate (PET), epoxy resin, polyurethane, etc., but embodiments of the present disclosure are not limited thereto. Additionally, for example, the film layer 400 may be formed of a copolymer. For example, the film layer 400 may be formed of a copolymer obtained by copolymerizing polymethyl methacrylate (PMMA) with PMMA, a copolymer obtained by copolymerizing polycarbonate (PC) with PI, a copolymer obtained by copolymerizing PMMA with PI, or a copolymer obtained by copolymerizing polyurethane, but embodiments of the present disclosure are not limited thereto. The thickness t4 of the film layer 400 may be about 150 μm or less, but embodiments of the present disclosure are not limited thereto. When the thickness t4 of the film layer 400 exceeds 150 μm, the flexibility of the display device 10 is less than desired for a foldable, stretchable, or bendable display device. When the thickness t4 of the film layer 400 is about 25 μm or more, the cover layer 300 can be protected. For example, when the thickness t4 of the film layer 400 is about 25 μm or more, physical damage to the cover layer 300 can be prevented and even when the cover layer 300 is damaged or broken to generate glass fragments, the glass fragments can be prevented from breaking out to the outside. In an embodiment, the film layer 400 may exceed 150 μm in the case where the material composition or other properties of the film layer 400 are modified.

[0072] The coating layer 500 may be disposed on the film layer 400. The coating layer 500 may be formed by being coated on the upper surface of the film layer 400. Accordingly, in some embodiments, the coating layer 500 is in direct contact with the film layer 400. Since the coating layer 500 enables the front surface of the cover layer 300 to perform a touch function, the coating layer 500 may be implemented as a surface protection layer having a more enhanced strength. When the coating layer 500 is formed as a surface protection layer, the coating layer 500 may be formed of a resin having a relatively high hardness when cured, such as an acrylic resin, an epoxy resin, or a silicone-based compound. Additionally, as needed, the coating layer 500 may have an anti-fingerprint (AF) or anti-reflection (AR) function. The coating layer 500 may be implemented by synthesizing a resin having such a function or by forming various patterns (e.g., a pattern such as a moth eye). The coating layer 500 may be a hard coating, but embodiments of the present disclosure are not limited thereto. The third bonding layer 730 may be disposed between the cover layer 300 and the film layer 400. The third bonding layer 730 may bond or connect the cover layer 300 and the film layer 400. The third bonding layer 730 may include the same materials as the first bonding layer 710, the second bonding layer 720, and the fourth bonding layer 740, but embodiments of the present disclosure are not limited thereto.

[0073] On the upper part of the display device 10 according to an embodiment of the present disclosure, physical deformation may occur in the components of the display device 10 due to external sharp objects.

[0074] When a sharp object presses the upper surface of the display device 10 with a predetermined force, physical deformation may occur in the third bonding layer 730. For example, an air gap may be formed at the interface between the third bonding layer 730 and the film layer 400.

[0075] The thickness t1 of the third bonding layer 730 may be about 50 μm or more. The thickness t1 of the third bonding layer 730 may be the thickness of the transparent adhesive (OCA) included in the third bonding layer 730. The modulus (e.g., storage modulus) of the third bonding layer 730 may be in the range of about 10 kPa to about 100 kPa.

[0076] Therefore, due to the large thickness t1 and relatively small modulus of the third bonding layer 730, when a sharp object presses the upper surface of the display device 10 with a predetermined force, the third bonding layer 730 with a large thickness t1 and a small modulus can be physically deformed. The film layer 400 is lifted from the third bonding layer 730 due to the pressing of the third bonding layer 730 caused by the physical deformation of the third bonding layer 730, thereby forming an air gap at the interface between the third bonding layer 730 and the film layer 400. The corresponding air gap may be visible from the outside, resulting in a poor appearance or poor display quality of the display device 10 and affecting the durability of the display device 10, and thus, the lifespan of the display device 10 may be reduced. In addition, when the sharp object is pressed with a greater force, cracks may be generated in the cover layer 300 provided below the third bonding layer 730. Therefore, in Figure 4 the first experimental example of Figure 3 the thickness of the third bonding layer 730 is configured to be smaller, and the modulus (e.g., storage modulus) is configured to be larger.

[0077] Figure 4 is a schematic diagram showing the first experimental example of the present disclosure.

[0078] For Figure 4 the first experimental example of

[0079] When a sharp object PP presses the upper surface of the display device 10 with a predetermined force, the portions of the layers of the upper structure UPM′ where lifting and cracking occur are inspected. The tip of the sharp object PP may be formed with a tip portion TIP, and the tip portion TIP may have a diameter of, for example, 300 μm to 1000 μm, but the embodiments of the present disclosure are not limited thereto.

[0080] The first experimental example of the present disclosure was measured in the compression mode and was carried out under the following conditions: in the compression mode, the diameter of the tip portion TIP of the sharp object PP that applies a force to the upper surface of the upper structure is in the range of 0.2 mm to 1 mm, and a force of 0.25 kgf gradually increases from the point where the tip portion TIP of the sharp object PP contacts the surface of the coating 500′, and the lifting of the film layer 400′ can be observed through an optical microscope. For example, when the film layer 400′ is lifted by about 80 μm or more from the third bonding layer 730′, the lifting of the film layer 400′ can be observed through an optical microscope.

[0081] The first sample may be an upper structure including a cover layer 300′ having a thickness of 90 μm, a third bonding layer 730′ having a thickness of 5 μm, a film layer 400′ having a thickness of 30 μm, and a coating 500′ having a thickness of 40 μm, which are sequentially provided. The modulus (e.g., Young's modulus or elastic modulus) of the cover layer 300′ is 70 GPa or less, the modulus (e.g., storage modulus or elastic modulus) of the third bonding layer 730′ is in the range of 50 kPa to 500 kPa, and the modulus (e.g., Young's modulus or elastic modulus) of the film layer 400′ is in the range of 2 GPa to 8 GPa. The third bonding layer 730′ is formed of a transparent resin (OCR). The thicknesses and moduli of the layers configured in the first sample do not limit the content of the present disclosure.

[0082] The second sample may be an upper structure including a cover layer 300′ having a thickness of 90 μm, a third bonding layer 730′ having a thickness of 8 μm, a film layer 400′ having a thickness of 30 μm, and a hard coating 500′ having a thickness of 40 μm, which are sequentially provided. The modulus of the cover layer 300′ is 70 GPa or less, the modulus of the third bonding layer 730′ is in the range of 50 kPa to 500 kPa, and the modulus of the film layer 400′ is in the range of 2 GPa to 8 GPa. The third bonding layer 730′ may be formed of a transparent resin (OCR). The thicknesses and moduli of the layers configured in the second sample do not limit the content of the present disclosure.

[0083] The third sample may be an upper structure including a cover layer 300' with a thickness of 90 μm, a third bonding layer 730' with a thickness of 15 μm, a film layer 400' with a thickness of 30 μm, and a hard coating 500' with a thickness of 40 μm, which are arranged in sequence. The modulus of the cover layer 300' is 70 GPa or less, the modulus of the third bonding layer 730' is in the range of 1 kPa to 100 kPa, and the modulus of the film layer 400' is in the range of 2 GPa to 8 GPa. The third bonding layer 730' may be formed of a transparent adhesive (OCA). The thicknesses and moduli of the layers configured in the third sample do not limit the content of the present disclosure.

[0084] The fourth sample may be an upper structure including a cover layer 300' with a thickness of 90 μm, a third bonding layer 730' with a thickness of 25 μm, a film layer 400' with a thickness of 30 μm, and a hard coating 500' with a thickness of 40 μm, which are arranged in sequence. The modulus of the cover layer 300' is 70 GPa or less, the modulus of the third bonding layer 730' is in the range of 1 kPa to 100 kPa, and the modulus of the film layer 400' is in the range of 2 GPa to 8 GPa. The third bonding layer 730' is formed of a transparent adhesive (OCA). The thicknesses and moduli of the layers configured in the fourth sample do not limit the content of the present disclosure.

[0085] In the first sample, it was confirmed that when a sharp object PP was applied to the upper structures 300', 730', 400', and 500' with a force of 1.5 kgf or more, the film layer 400' lifted from the upper surface of the third bonding layer 730'. When measured using an optical microscope, when the film layer 400' lifted from the upper surface of the third bonding layer 730', the image of the white dots could be visible. The generated dots may cause poor appearance visibility of the display device. Additionally, in the first sample, it was confirmed that when the sharp object PP was applied to the upper structures 300', 730', 400', and 500' with a force of 5.25 kgf or more, cracks occurred in the cover layer 300'.

[0086] In the second sample, it was confirmed that when a sharp object PP was applied to the upper structures 300', 730', 400', and 500' with a force of 1.5 kgf or more, the film layer 400' lifted from the upper surface of the third bonding layer 730'. Additionally, in the second sample, it was confirmed that when the sharp object PP was applied to the upper structures 300', 730', 400', and 500' with a force of 5.00 kgf or more, cracks occurred in the cover layer 300'.

[0087] In the third sample, it was confirmed that when a sharp object PP was applied to the upper structures 300′, 730′, 400′, and 500′ with a force of 0.75 kgf or more, the film layer 400′ was lifted from the upper surface of the third bonding layer 730′. Additionally, in the third sample, it was confirmed that when a sharp object PP was applied to the upper structures 300′, 730′, 400′, and 500′ with a force of 4.25 kgf or more, cracks occurred in the cover layer 300′.

[0088] In the fourth sample, it was confirmed that when a sharp object PP was applied to the upper structures 300′, 730′, 400′, and 500′ with a force of 0.5 kgf or more, the film layer 400′ was lifted from the upper surface of the third bonding layer 730′. Additionally, in the fourth sample, it was confirmed that when a sharp object PP was applied to the upper structures 300′, 730′, 400′, and 500′ with a force of 4.00 kgf or more, cracks occurred in the cover layer 300′.

[0089] As a result of the first experimental example of the present disclosure, it was confirmed that compared with the third and fourth samples having a third bonding layer 730′ with thicknesses of 15 μm and 25 μm, the first and second samples having a third bonding layer 730′ with thicknesses of 5 μm and 8 μm used or required a greater force of 0.75 kgf and 1.0 kgf to lift the film layer 400′ from the third bonding layer 730′ or separate it from the third bonding layer 730′. Therefore, it was confirmed that as the thickness of the third bonding layer 730′ became smaller, the deformation of the third bonding layer 730′ caused by an external force became smaller or a greater force was required to generate deformation. Furthermore, it was confirmed that the first sample having a smaller thickness than the second sample and the third sample having a smaller thickness than the fourth sample respectively used or required a greater force than the second sample and the fourth sample to lift the film layer 400′ from the third bonding layer 730′. Thus, it was confirmed that even when the display device included the third bonding layer 730′, as the thickness of the third bonding layer 730′ became smaller or decreased, the deformation of the third bonding layer 730′ was smaller or a greater force was required to generate deformation. The reason for confirming that the first and second samples used a greater force of 0.75 kgf and 1.0 kgf than the third and fourth samples to lift the film layer 400′ from the third bonding layer 730′ was that the modulus of the third bonding layer 730′ of the first and second samples was greater than the modulus of the third bonding layer 730′ of each of the third and fourth samples. Therefore, due to the relatively large modulus of the third bonding layer 730′, it was seen that a relatively large force was required to lift the film layer 400′ from the third bonding layer 730′, thereby increasing the durability of the display device. The experiment confirmed that the thickness was related to the modulus. Thus, a smaller thickness of the third bonding layer 730′ resulted in a layer with a higher modulus that was more suitable for withstanding deformation before deformation occurred or being able to withstand a greater force.

[0090] Therefore, when the third bonding layer 730' is formed of a transparent resin (OCR) having a modulus in the range of 50 kPa to 500 kPa and a thickness of 10 μm or less (for example, in the range of 5 μm to 8 μm), the occurrence of cracks caused by the impact of external sharp objects can be prevented, and the third bonding layer 730' is less deformed. Embodiments thereof will be described with reference to Figure 5 its embodiments.

[0091] Figure 5 is a cross-sectional view of a display device 11 according to one or more embodiments of the present disclosure.

[0092] Referring to Figure 5 , a display device 11 according to another embodiment of the present disclosure may include a third bonding layer 730_1 of an upper structure UPM_1.

[0093] The thickness t1 of the third bonding layer 730_1 according to one or more embodiments of the present disclosure may be about 10 μm or less. Since the thickness t1 of the third bonding layer 730_1 is set to about 10 μm or less, the physical deformation of the third bonding layer 730_1 can be minimized. Therefore, the film layer 400 may not be lifted (or peeled or delaminated or separated) from the third bonding layer 730_1.

[0094] In some embodiments, when the thickness t1 of the third bonding layer 730_1 is too small, the cover layer 300 and the film layer 400 may not be well bonded or adhered by the third bonding layer 730_1. Therefore, in view of the fact that the third bonding layer 730_1 is too thin to bond the film layer 400 and the third bonding layer 730_1, the adhesiveness of the third bonding layer 730_1 may be very low. Therefore, the thickness t1 of the third bonding layer 730_1 may preferably be about 5 μm or more.

[0095] The thickness t4 of the film layer 400 of the display device 11 according to one or more embodiments of the present disclosure may be about 30 times or less the thickness t1 of the third bonding layer 730_1. For example, the film layer 400 may be formed of a transparent polyimide (CPI), but the embodiments of the present disclosure are not limited thereto. For example, the thickness t4 of the film layer 400 may be about 75 μm or less. Since the thickness of the film layer 400 is about 30 times or less the thickness t1 of the third bonding layer 730_1, as Figure 4As shown, when a sharp object presses the upper surface of the display device 10 with a predetermined force, the film layer 400 may not absorb all the forces applied by the sharp object, resulting in the film layer 400 being lifted from the third bonding layer 730_1. To solve such a problem, the storage modulus (or elastic modulus) of the third bonding layer 730_1 can be configured to be greater than the modulus of the second bonding layer 720. For example, the modulus of the third bonding layer 730_1 can be in the range of about 50 kPa to about 500 kPa, but the embodiments of the present disclosure are not limited thereto. Since the storage modulus (or elastic modulus) of the third bonding layer 730_1 is configured to be about 50 kPa or more, the third bonding layer 730_1 can absorb and disperse all the forces applied by the sharp object. Since the storage modulus (or elastic modulus) of the third bonding layer 730_1 is about 500 kPa or less, flexibility can be provided to the third bonding layer 730_1 such that the display device 11 can be implemented as a foldable, stretchable, or bendable display device.

[0096] The modulus of the film layer 400 (e.g., Young's modulus or elastic modulus) can be less than the modulus of the cover layer 300 (e.g., Young's modulus or elastic modulus) and can be greater than the modulus of the third bonding layer 730 (e.g., storage modulus). For example, the modulus of the film layer 400 can be 2 GPa or more. For example, the modulus of the film layer 400 can be in the range of 2 GPa to 8 GPa, but the embodiments of the present disclosure are not limited thereto. For example, since the modulus of the film layer 400 is 8 GPa or less, flexibility can be provided to the film layer 400 such that the display device 10 can be implemented as a foldable, stretchable, or bendable display device.

[0097] Since the thickness t1 of the third bonding layer 730_1 according to one or more embodiments of the present disclosure is configured to be in the range of about 5 μm to about 10 μm or less, it can be seen that the occurrence of cracks caused by the impact of an external sharp object can be further reduced. The present disclosure also contemplates forming the third bonding layer 730_1 having a relatively small thickness t1 on the cover layer 300. Therefore, the display device 11 can be formed with a thin third bonding layer 730_1 by an inkjet printing device IND (see Figure 6 ).

[0098] Figures 6 to 8 is a view showing a manufacturing method of a display device (e.g., display device 11) according to one or more embodiments of the present disclosure. Referring to Figure 6 , a transparent resin material 730a can be coated on the cover layer 300 by an inkjet printing device IND. A plurality of holes H are formed in the head of the inkjet printing device IND. The transparent resin material 730a can be ejected onto the cover layer 300 through the holes H of the head of the inkjet printing device IND. To make Figure 5The thickness t1 of the third bonding layer 730_1 described in [reference] is formed to be about 5 μm to less than about 10 μm. The volume of the transparent resin material 730a ejected through each hole H can be in the range of about 8 pL to about 15 pL. The holes H of the head can have dimensions corresponding to the volume of the transparent resin material 730a. For example, the holes H of the head can have dimensions corresponding to the volume of the transparent resin material 730a having a volume of about 8 pL to about 15 pL. In some embodiments, when the holes H of the head preferably have very small dimensions, the transparent resin materials 730a ejected through the respective holes H aggregate with each other, so that they cannot be ejected well, or an attractive force may be generated between the transparent resin material 730a and the holes H, and thus the transparent resin material 730a may not be ejected well.

[0099] The transparent resin material 730a can have a viscosity of about 7 cps (centipoise) to about 18 cps at about 25 °C to about 45 °C. When the transparent resin material 730a can have a viscosity of more than about 12 cps at about 25 °C to about 45 °C, the transparent resin material 730a ejected through the holes H may not flow on the cover layer 300. Therefore, preferably, the transparent resin material 730a can have a viscosity of about 12 cps or less at about 25 °C to about 45 °C. When the transparent resin material 730a has such a viscosity, the phenomenon that the transparent resin materials 730a do not eject due to aggregation with each other through the respective holes H or the phenomenon that the transparent resin material 730a does not eject due to the generation of an attractive force between the holes H may not occur. Therefore, although in some embodiments, a viscosity of 7 cps to 18 cps at about 25 °C to about 45 °C is sufficient, preferably, the transparent resin material 730a is prepared to have a viscosity of about 12 cps or less at about 25 °C to about 45 °C.

[0100] Referring to Figure 7 , the transparent resin material 730a coated on the cover layer 300 (see Figure 7 ) can be cured once. The one-time curing can be ultraviolet light UV (marked by an arrow) curing. The one-time curing can be semi-curing. For example, the curing rate of the one-time curing can be in the range of about 70% to about 85% of the final hardness of the fully cured transparent resin material 730a. When the curing rate of the one-time curing is less than about 70%, in the process of arranging the film layer 400 described below on the transparent resin material 730b in Figure 7 , the transparent resin material 730b may flow, resulting in defects, such as flowing to the side of the cover layer 300. In the case where the curing rate of the one-time curing is more than about 85%, when setting the following in the transparent resin material 730b in Figure 8 Figure 7 on the transparent resin material 730b, when setting the following in Figure 8 ​When referring to the film layer 400 described in [reference], the adhesion strength between the film layer 400 and the transparent resin material 730b may be smaller than that of an insufficiently cured sample. An experiment for describing the adhesion strength will be referred to Figure 9 for description.

[0101] Subsequently, referring to Figure 8 , the film layer 400 can be disposed on Figure 8 the transparent resin material 730b, and then secondarily cured to form the transparent resin layer 730. The curing rate of the secondary curing can be about 90% or more. The secondary curing can be UV curing.

[0102] In the present disclosure, although examples in which the primary curing and the secondary curing are UV curing are described, the embodiments of the present disclosure are not limited thereto, and the primary curing and the secondary curing can also be thermal curing or other types of curing, or can be performed in one or more steps.

[0103] Figure 9 is a schematic diagram showing a second experimental example regarding the adhesion strength of the present disclosure.

[0104] In Figure 9 the second experimental example of [reference], for each of the third bonding layers 730' (hereinafter referred to as the fifth sample to the eighth sample) of the first sample to the fourth sample described in Figure 5 [reference], by bonding the substrate BP under the third bonding layer 730', bonding the back film PF on the third bonding layer 730', and changing the substrate BP, the adhesion strength between the third bonding layer 730' and the substrate BP is measured. The second experimental example is measured in a tensile mode, and while pulling the end of the back film PF upward with a jig (marked by an arrow), the adhesion strength between the third bonding layer 730' and the substrate BP is measured (measured in a tensile mode and a 180° peel test is performed). The substrate BP includes a glass substrate formed of the same material as the cover layer 300 formed under the film layer 400 in Figure 8 [reference], or a film substrate formed of the same material as the film layer 400. For example, the material of the film layer 400 can be CPI (transparent polyimide substrate), but the embodiments of the present disclosure are not limited thereto. The back film PF is an etched polyethylene terephthalate (PET), and the peeling rate of the back film PF from the third bonding layer 730' is set to 5 mm / sec.

[0105] As a result of the second experimental example of the present disclosure, in the fifth sample, the adhesion strength to the glass substrate was measured to be 0.5 kgf / inch, and the adhesion strength to the film substrate was measured to be 0.6 kgf / inch. In the sixth sample, the adhesion strength to the glass substrate was measured to be 1.1 kgf / inch, and the adhesion strength to the film substrate was measured to be 1.0 kgf / inch. In the seventh sample, the adhesion strength to the glass substrate was measured to be 1.3 kgf / inch, and the adhesion strength to the film substrate was measured to be 1.1 kgf / inch. In the eighth sample, the adhesion strength to the glass substrate was measured to be 1.6 kgf / inch, and the adhesion strength to the film substrate was measured to be 1.3 kgf / inch.

[0106] As a result of the second experimental example of the present disclosure, it can be seen that the greater the thickness of the third bonding layer 730' of the fifth to eighth samples, the stronger the adhesion strength to the substrate BP. Even in the case of the fifth sample having the smallest thickness, the adhesion strength to the glass substrate was measured to be 0.5 kgf / inch, and the adhesion strength to the film substrate was measured to be 0.6 kgf / inch. The adhesion strength to the glass substrate and the adhesion strength to the film substrate being each 0.5 kgf / inch or more were determined to be sufficient adhesion strengths for the intended use of the display device. Therefore, it can be seen that compared with the seventh and eighth samples having a greater thickness of the third bonding layer 730', even when the thickness of the third bonding layer 730' is less than about 10 μm, the fifth and sixth samples maintain a good or sufficient adhesion state with the substrate BP.

[0107] As a result of the second experimental example, in order to increase the adhesion strength to the CPI substrate (i.e., substrate BP), Figures 6 to 8 the curing rate of the primary curing of the transparent resin layer 730 described in can be set to about 85% or more.

[0108] With reference to Figure 5 According to one or more embodiments of the present disclosure, the adhesion strength between the third bonding layer 730_1 and the cover layer 300 can be in the range of about 0.5 kgf / inch to about 1.1 kgf / inch. The adhesion strength between the third bonding layer 730_1 and the film layer 400 can be in the range of about 0.6 kgf / inch to about 1.0 kgf / inch. Since the adhesion strength between the third bonding layer 730_1 and the cover layer 300 is about 0.5 kgf / inch or more and the adhesion strength between the third bonding layer 730_1 and the film layer 400 is about 0.6 kgf / inch or more, when the display device is folded, stretched, or bent, the cover layer 300 and / or the film layer 400 will not peel off from the third bonding layer 730_1 and can maintain an adhesive or attached state with the third bonding layer 730_1.

[0109] Figure 10 It is a cross-sectional view of the second sample of the third experimental example of the present disclosure.

[0110] Referring to Figure 10 , after arranging the lower structure DWM′ below the upper structure UPM′ of Figure 5 , the third experimental example is carried out. The lower structure DWM′ may include components the same as those of the lower structure DWM of Figure 3 . In the third experiment, after fastening the mutually combined lower structure DMW′ and upper structure UPM′ to the folding jig FZ having a radius of curvature R of 5R (or 5 mm), as Figure 10 shown, the folding of the lower structure DMP′ and the upper structure UPM′ can be repeated. In the third experimental example of the present disclosure, the folding period may be 1 Hz. The appearance of the lower structure DMP′ and the upper structure UPM′ is observed every 10k (10,000) folds. Figure 10 The first to fourth samples of Figure 6 are the same as the first to fourth samples of

[0111] As a result of the third experimental example of the present disclosure, in the first sample, appearance defects occurred at a folding count of 50k. The appearance defects may be defects in which the film layer 400′ is lifted (or peeled off) from the third bonding layer 730′. In the second sample, appearance defects occurred at a folding count of 100k (100,000 times). In the third sample, appearance defects occurred at a folding count of 90k. In the fourth sample, appearance defects occurred at a folding count of 100k. Therefore, it can be seen that appearance defects occur in the second sample and the fourth sample when the folding count increases compared to the first sample and the third sample. It can be seen that the second sample and the fourth sample in which the thickness of the third bonding layer 730′ is relatively greater than the thickness of the third bonding layer 730′ in each of the first sample and the third sample have durability even when folded.

[0112] Figure 11 is a cross-sectional view of the display panel 100 taken along the line II-II′ in Figure 3 .

[0113] The display panel 100 may include a substrate 101, a first thin film transistor 120, a second thin film transistor 130, a light emitting portion (or light emitting layer) 150, a packaging portion (or packaging layer) 170, and a touch portion (or touch sensor array) 180.

[0114] The substrate 101 may include one or more plastic materials. For example, the substrate 101 may be a multi-substrate including a variety of plastic materials such as polyimide, but the embodiments of the present disclosure are not limited thereto.

[0115] The buffer layer 102 may be disposed on the substrate 101. The buffer layer 102 may minimize or reduce the diffusion of moisture or oxygen permeating the substrate 101. The buffer layer 102 may be formed by alternately stacking silicon nitride (SiNx) and silicon oxide (SiOx) at least once, but embodiments of the present disclosure are not limited thereto.

[0116] The first light-blocking layer 126 may be disposed on the buffer layer 102. The first light-blocking layer 126 may prevent light from transmitting through the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 may be disposed to overlap with the first light-blocking layer 126. The first light-blocking layer 126 may include a single layer or multiple layers formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the foregoing metals, but embodiments of the present disclosure are not limited thereto.

[0117] The first insulating layer 103 may be disposed on the first light-blocking layer 126. The first insulating layer 103 may prevent a short circuit between components of the first thin-film transistor 120, the first light-blocking layer 126, and the buffer layer 102. The first insulating layer 103 may be formed of the same material as the buffer layer 102, but embodiments of the present disclosure are not limited thereto. For example, the first insulating layer 103 may be formed of an inorganic material, such as silicon nitride (SiNx) or silicon oxide (SiOx), but embodiments of the present disclosure are not limited thereto.

[0118] The first thin-film transistor 120 may be disposed on the first insulating layer 103. The first thin-film transistor 120 may include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0119] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include a metal oxide semiconductor such as indium gallium zinc oxide (IGZO), and a silicon-based semiconductor material such as amorphous silicon or polycrystalline silicon, but embodiments of the present disclosure are not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0120] Since the polycrystalline semiconductor layer has a higher mobility than the amorphous semiconductor layer and the oxide semiconductor layer, the power consumption can be lower and the reliability can be more excellent. Therefore, the driving transistor may be formed of a polycrystalline semiconductor layer or the like.

[0121] The second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be formed of the same material as the first insulating layer 103 and may prevent a short circuit between the first semiconductor layer 123 and another component of the first thin-film transistor 120.

[0122] The first gate 122 may be disposed on the second insulating layer 104. The first gate 122 may be disposed on the second insulating layer 104 and overlap with the channel region of the first semiconductor layer 123. The first gate 122 may include a single layer or multiple layers formed of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or an alloy of the foregoing metals, but embodiments of the present disclosure are not limited thereto. The first gate 122 may be disposed together with the gate line.

[0123] The third insulating layer 105 may be disposed on the first gate 122. The third insulating layer 105 may be formed of the same material as the first insulating layer 103 or the second insulating layer 104.

[0124] The first source 121 and the first drain 124 may be disposed on the third insulating layer 105.

[0125] The first source 121 and the first drain 124 may be electrically connected to the first semiconductor layer 123 through contact holes. The first source 121 and the first drain 124 may be formed of a metal material. For example, the first source 121 and the first drain 124 may include a single layer or multiple layers formed of any one of molybdenum (Mo), aluminum (A1), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the foregoing metals, but embodiments of the present disclosure are not limited thereto.

[0126] The first source 121 and the first drain 124 may be disposed together with the data line. For example, the data line may be formed of the same material as the first source 121 and the first drain 124 and may be formed to be coplanar with the first source 121 and the first drain 124, but embodiments of the present disclosure are not limited thereto.

[0127] The storage electrode 140 may be disposed to be spaced apart from the first thin film transistor 120. The storage electrode 140 may include a first storage electrode 141, a second storage electrode 142, and a third storage electrode 143.

[0128] The first storage electrode 141 may be formed of the same material as the first gate 122 and may be formed to be coplanar with the first gate 122, but embodiments of the present disclosure are not limited thereto.

[0129] The second storage electrode 142 may be disposed on the first storage electrode 141. The second storage electrode 142 may be disposed on the third insulating layer 105, and the third insulating layer 105 between the first storage electrode 141 and the second storage electrode 142 may be used as a dielectric to generate capacitance. The second storage electrode 142 may be formed of the same material as the first storage electrode 141, but embodiments of the present disclosure are not limited thereto.

[0130] The second thin film transistor 130 may be disposed to be spaced apart from the first thin film transistor 120 and the storage electrode 140. The second thin film transistor 130 may include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0131] The second light blocking layer 136 may be disposed coplanar with the second storage electrode 142.

[0132] Similar to the first light blocking layer 126, the second light blocking layer 136 may prevent light from reaching the second semiconductor layer 133, thereby extending the lifespan of the second thin film transistor 130. For example, the second semiconductor layer 133 may be disposed to overlap with the second light blocking layer 136.

[0133] The fourth insulating layer 106 may be disposed on the second light blocking layer 136. The fourth insulating layer 106 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, or the third insulating layer 105, but embodiments of the present disclosure are not limited thereto.

[0134] The second semiconductor layer 133 may be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0135] The second semiconductor layer 133 may include a metal oxide semiconductor such as indium gallium zinc oxide (IGZO), and a silicon-based semiconductor material such as amorphous silicon or polysilicon, but embodiments of the present disclosure are not limited thereto.

[0136] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, or the fourth insulating layer 106, but embodiments of the present disclosure are not limited thereto.

[0137] The second gate electrode 132 may be disposed on the fifth insulating layer 108.

[0138] The second gate electrode 132 may be formed of the same material as the first gate electrode 122. For example, the second gate electrode 132 may include a single layer or multiple layers formed of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or an alloy of the foregoing metals, but embodiments of the present disclosure are not limited thereto.

[0139] The sixth insulating layer 109 may be disposed on the second gate electrode 132. The sixth insulating layer 109 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, the fourth insulating layer 106, or the fifth insulating layer 108, but embodiments of the present disclosure are not limited thereto.

[0140] The first source electrode 121, the first drain electrode 124, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be disposed on the sixth insulating layer 109.

[0141] The third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be formed of the same material as the first source electrode 121 and the first drain electrode 124 and be disposed coplanar with the first source electrode 121 and the first drain electrode 124. For example, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may include a single layer or multiple layers formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the foregoing metals, but the embodiments of the present disclosure are not limited thereto.

[0142] The first thin film transistor 120 may be a driving transistor, and the second thin film transistor 130 may be a switching transistor, but the embodiments of the present disclosure are not limited thereto.

[0143] A first protective layer 111 may be disposed on the first source electrode 121 and the first drain electrode 124.

[0144] The first protective layer 111 may planarize the upper portion of the first thin film transistor 120 and protect the first thin film transistor 120. The first protective layer 111 may be formed of an organic material. For example, the first protective layer 111 may be formed of an organic material containing an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, but the embodiments of the present disclosure are not limited thereto.

[0145] A second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may be formed of the same material as the first protective layer 111, but the embodiments of the present disclosure are not limited thereto.

[0146] The connection electrode 145 may be disposed between the first protective layer 111 and the second protective layer 112.

[0147] The connection electrode 145 may electrically connect the first thin film transistor 120 and the light emitting unit 150. The connection electrode 145 may be formed of the same material as the first source electrode 121 and the first drain electrode 124, but the embodiments of the present disclosure are not limited thereto.

[0148] The connection electrode 145 may include a single layer or multiple layers formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the foregoing metals, but the embodiments of the present disclosure are not limited thereto.

[0149] The light-emitting part (or light-emitting component) 150 may be disposed on the second protective layer 112. The light-emitting part 150 may include an anode 151, an organic layer 152, and a cathode 153.

[0150] The anode 151 may be disposed on the second protective layer 112. The anode 151 may be electrically connected to the first thin-film transistor 120 through a contact hole formed in the second protective layer 112. The anode 151 may be a reflective electrode that reflects light, but embodiments of the present disclosure are not limited thereto. The anode 151 may include a stacked structure of metal materials having a high reflectivity, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), or an APC alloy, and may include a single layer or multiple layers, but embodiments of the present disclosure are not limited thereto.

[0151] The organic layer 152 may be disposed on the anode 151. The organic layer 152 may include one or more light-emitting structures (or light-emitting elements or elements) stacked on the anode 151 in the order of a hole transport layer and an electron transport layer or in the reverse order. The organic layer 152 may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, a micro-mini light-emitting diode, etc., but embodiments of the present disclosure are not limited thereto. For example, the organic layer 152 of the display panel 100 according to an embodiment of the present disclosure may include an organic light-emitting layer. The organic layer 152 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. The organic layer 152 may be a white light-emitting layer, but embodiments of the present disclosure are not limited thereto.

[0152] The cathode 153 may be disposed on the organic layer 152. The cathode 153 may be a transparent electrode that reflects light, but embodiments of the present disclosure are not limited thereto. For example, the cathode 153 may include a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a metal that transmits visible light.

[0153] The bank 154 may be disposed to expose the anode 151. The bank 154 may define an opening (or light-emitting area) of the sub-pixel and may be disposed to cover an edge portion of the anode 151. Each sub-pixel may include a red light-emitting area, a green light-emitting area, and a blue light-emitting area. For example, the sub-pixel may be a pixel, but is not limited by the term.

[0154] The encapsulation part (or encapsulation layer) 170 may be disposed on the bank part 154 or the light-emitting part 150. The encapsulation part 170 may include one or more insulating layers. For example, the encapsulation part 170 may include a first encapsulation layer 171, a second encapsulation layer 172 disposed on the first encapsulation layer 171, and a third encapsulation layer 173 disposed on the second encapsulation layer 172. The encapsulation part 170 may include one or more inorganic layers and one or more organic layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic materials, and the second encapsulation layer 172 may include organic materials, but the embodiments of the present disclosure are not limited thereto.

[0155] The touch sensor array 180 may include a touch buffer layer 181. The touch buffer layer 181 may be disposed on the encapsulation part 170. For example, the touch buffer layer 181 may be disposed on the third encapsulation layer 173. The touch buffer layer 181 may be formed of the same material as the buffer layer 102, but the embodiments of the present disclosure are not limited thereto. A touch insulating layer 184 may be disposed on the touch buffer layer 181. The touch sensor array 180 may further include the touch insulating layer 184. The touch insulating layer 184 may prevent a short circuit between touch electrodes. The touch insulating layer 184 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers of the foregoing materials, but the embodiments of the present disclosure are not limited thereto. A first touch electrode 185 may be disposed on the touch insulating layer 184. The touch sensor array 180 may further include the first touch electrode 185. The first touch electrode 185 may include a 1a touch electrode 185a extending in a first direction and a 1b touch electrode 185b extending in a second direction different from the first direction.

[0156] A second touch electrode 182 of the touch sensor array 180 may be disposed between the touch buffer layer 181 and the touch insulating layer 184.

[0157] The second touch electrode 182 may be electrically connected to the 1a touch electrode 185a through a contact hole formed in the touch insulating layer 184. For example, the 1a touch electrode 185a and the second touch electrode 182 may extend in the first direction.

[0158] The first touch electrode 185 and the second touch electrode 182 may include a metal material. For example, the first touch electrode 185 and the second touch electrode 182 may be formed of titanium (Ti), nickel (Ni), aluminum (Al), or an alloy of the foregoing metals, and may be formed of three layers such as titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments of the present disclosure are not limited thereto.

[0159] The display device according to various embodiments of the present disclosure may be described as follows.

[0160] A display device according to various embodiments of the present disclosure may include: a display panel, a cover layer disposed on the display panel, a film layer disposed on the cover layer, a transparent adhesive layer disposed between the display panel and the cover layer, and a transparent resin layer disposed between the cover layer and the film layer. The thickness of the transparent resin layer may be different from the thickness of the transparent adhesive layer.

[0161] According to various embodiments of the present disclosure, the thickness of the transparent resin layer may be 10 μm or less.

[0162] According to various embodiments of the present disclosure, the thickness of the film layer may be 30 times or less the thickness of the transparent resin layer.

[0163] According to various embodiments of the present disclosure, the storage modulus of the transparent resin layer may be different from the storage modulus of the transparent adhesive layer.

[0164] According to various embodiments of the present disclosure, the storage modulus of the transparent resin layer may be in the range of 50 kPa to 500 kPa. The storage modulus of the transparent adhesive layer may be in the range of 1 kPa to 100 kPa.

[0165] According to various embodiments of the present disclosure, the storage modulus of the film layer may be greater than the storage modulus of the transparent adhesive layer. The storage modulus of the film layer may be in the range of 2 GPa to 8 GPa.

[0166] According to various embodiments of the present disclosure, the adhesion strength between the transparent resin layer and the cover layer may be in the range of 0.5 kgf / inch to 1.1 kgf / inch. The adhesion strength between the transparent resin layer and the film layer may be in the range of 0.6 kgf / inch to 1.0 kgf / inch.

[0167] According to various embodiments of the present disclosure, the transparent resin layer may be formed by coating a transparent resin material on the cover layer using an inkjet printing method.

[0168] According to various embodiments of the present disclosure, the transparent resin material may be ejected onto the cover layer through holes in the head of an inkjet printing device. The volume of the transparent resin material ejected from the holes may be in the range of 8 pL to 15 pL.

[0169] According to various embodiments of the present disclosure, the viscosity of the transparent resin material at 25°C to 45°C may be in the range of 7 cps to 18 cps.

[0170] According to various embodiments of the present disclosure, the transparent resin material may be coated on the cover layer, the transparent resin material coated once may be cured once, and the film layer may be disposed on the transparent resin material cured once.

[0171] According to various embodiments of the present disclosure, a film layer may be disposed on a transparent resin material cured once and then cured a second time to form a transparent resin layer. The curing rate of the first curing may be in the range of about 70% to about 85%.

[0172] A display device according to various embodiments of the present disclosure may include: a display panel including a folding region, a first non-folding region on a first side of the folding region, and a second non-folding region on a second side of the folding region different from the first side of the folding region; a cover layer disposed on the display panel; a film layer disposed on the cover layer; a transparent adhesive layer disposed between the display panel and the cover layer; and a transparent resin layer disposed between the cover layer and the film layer. The storage modulus of the transparent resin layer may be different from the storage modulus of the transparent adhesive layer.

[0173] According to various embodiments of the present disclosure, the storage modulus of the transparent resin layer may be in the range of 50 kPa to 500 kPa. The storage modulus of the transparent adhesive layer may be in the range of 1 kPa to 100 kPa.

[0174] According to various embodiments of the present disclosure, the storage modulus of the film layer may be greater than the storage modulus of the transparent adhesive layer. The storage modulus of the film layer may be in the range of 2 GPa to 8 GPa.

[0175] According to various embodiments of the present disclosure, the thickness of the transparent resin layer may be 10 μm or less.

[0176] According to various embodiments of the present disclosure, the thickness of the film layer may be 30 times or less the thickness of the transparent resin layer.

[0177] According to various embodiments of the present disclosure, the adhesion strength between the transparent resin layer and the cover layer may be in the range of 0.5 kgf / inch to 1.1 kgf / inch. The adhesion strength between the transparent resin layer and the film layer may be in the range of 0.6 kgf / inch to 1.0 kgf / inch.

[0178] A display device according to multiple embodiments of the present disclosure may include: a display panel, a transparent adhesive layer on the display panel; a cover layer having a glass material on the transparent adhesive layer; a transparent resin layer on the cover layer; and a film layer having a polymer organic material on the cover layer.

[0179] According to multiple embodiments of the present disclosure, the glass material may include quartz.

[0180] According to multiple embodiments of the present disclosure, the glass material may have a heat resistance of 100 °C or higher.

[0181] According to multiple embodiments of the present disclosure, the glass material may have 80×10 -6A coefficient of thermal expansion below / K.

[0182] It will be apparent to those skilled in the art that various modifications and variations can be made to the apparatus of the present disclosure without departing from the scope of the present disclosure. Accordingly, the present disclosure is intended to cover modifications and variations of the present disclosure that fall within the scope of the claims and their equivalents.

Claims

1. A display device, comprising: Display panel; A covering layer, disposed on the display panel; A film layer, disposed on the cover layer; a transparent adhesive layer, disposed between the display panel and the cover layer; as well as a transparent resin layer, disposed between the cover layer and the film layer, The thickness of the transparent resin layer is different from the thickness of the transparent adhesive layer.

2. The display device according to claim 1, wherein: The thickness of the transparent resin layer is 10 μm or less.

3. The display device according to claim 2, wherein: The thickness of the film layer is less than 30 times the thickness of the transparent resin layer.

4. The display device according to claim 1, wherein: The storage modulus of the transparent resin layer is different from the storage modulus of the transparent adhesive layer.

5. The display device according to claim 4, wherein: The storage modulus of the transparent resin layer is in the range of 50 kPa to 500 kPa, and Wherein, the storage modulus of the transparent adhesive layer is in the range of 1 kPa to 100 kPa.

6. The display device according to claim 4, wherein: The storage modulus of the film layer is greater than the storage modulus of the transparent adhesive layer, and Wherein, the storage modulus of the film layer is in the range of 2 GPa to 8 GPa.

7. The display device according to claim 1, wherein: The bonding strength between the transparent resin layer and the cover layer is in the range of 0.5 kgf / inch to 1.1 kgf / inch, and Wherein, the bonding strength between the transparent resin layer and the film layer is in the range of 0.6 kgf / inch to 1.0 kgf / inch.

8. The display device according to claim 1, wherein: The transparent resin material has a viscosity in a range of 7 cps to 18 cps at 25° C. to 45° C.

9. The display device according to claim 1, wherein: The transparent resin material is coated on the cover layer, the coated transparent resin material is once cured, and the film layer is provided on the once cured transparent resin material.

10. The display device according to claim 9, wherein: The film layer is disposed on the transparent resin material that is primarily cured, and then the transparent resin material is secondarily cured to form the transparent resin layer, and a curing rate of the primary curing is in a range of 70% to 85%.

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