Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof, and belongs to the technical field of display. The light-emitting layer is arranged on one side of the substrate, the light-emitting layer comprises a pixel definition layer and a light-emitting functional layer located on the pixel definition layer, the pixel definition layer defines a plurality of opening areas on the substrate, and the light-emitting functional layer and the opening areas are overlapped; and the isolation layer is arranged on the pixel definition layer, the isolation layer is distributed around the opening area, and the orthographic projection of the isolation layer on the substrate and the orthographic projection of the light-emitting function layer on the substrate are not overlapped. According to the display panel and the preparation method thereof provided by the invention, the problem of transverse electric leakage crosstalk generated by the light-emitting functional layer in the display panel can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a display panel, a preparation method thereof, and a display device. Background Art

[0002] In recent years, due to the advantages of self-luminescence (without a backlight source), wide viewing angle, low power consumption, flexible (folding and curling) display, etc., active matrix organic light emitting devices (AMOLEDs) are one of the most promising display technologies currently.

[0003] However, due to OLED materials, hardware devices, and the complexity of the process, etc., the cost of OLEDs is often high. Moreover, with the increasing popularity of OLED display products, consumers' requirements for color deviation, efficiency, display image quality, etc. are increasing day by day. And for the OLED screens prepared by the currently commercially mature thermal evaporation process, there is a problem that the bottom gray scale image quality is difficult to meet customer requirements due to inevitable lateral leakage of the light-emitting functional layer. Summary of the Invention

[0004] The present application aims to provide a display panel and a preparation method thereof, aiming to reduce the problem of lateral leakage crosstalk generated in the light-emitting functional layer of the display panel.

[0005] In a first aspect of an embodiment of the present application, a display panel is provided, including:

[0006] A substrate;

[0007] A light-emitting layer, disposed on one side of the substrate, the light-emitting layer includes a pixel definition layer and a light-emitting functional layer located on the pixel definition layer, the pixel definition layer defines a plurality of opening regions on the substrate, and the light-emitting functionality overlaps with the opening regions;

[0008] An isolation layer, the isolation layer is distributed around the opening regions, and a positive projection of the isolation layer on the substrate does not overlap with a positive projection of the light-emitting functional layer on the substrate.

[0009] Optionally, the pixel definition layer defines a plurality of isolation regions on the substrate, the isolation regions correspond to the opening regions one by one, and the isolation regions are disposed around the corresponding opening regions;

[0010] The isolation layer is disposed in the isolation regions.

[0011] Optionally, the width of the isolation region is greater than or equal to 10 μm and less than or equal to 15 μm.

[0012] Optionally, the thickness of the isolation layer is greater than or equal to 0.30 μm and less than or equal to 0.60 μm.

[0013] Optionally, the material of the isolation layer includes a cyano compound or an azobenzene-containing compound.

[0014] A second aspect of the embodiments of the present application provides a display device, comprising the display panel provided in the first aspect of the embodiments of the present application.

[0015] A third aspect of an embodiment of the present application provides a method for manufacturing a display panel, the method comprising:

[0016] providing a substrate;

[0017] forming a pixel definition layer on one side of the substrate, wherein the pixel definition layer defines a plurality of opening areas on the substrate;

[0018] forming an isolation layer on the pixel definition layer, wherein the isolation layer is distributed around the opening area;

[0019] A light-emitting functional layer is formed on the pixel definition layer, the light-emitting functional layer overlaps with the opening area, and the orthographic projection of the isolation layer on the substrate does not overlap with the orthographic projection of the light-emitting functional layer on the substrate.

[0020] Optionally, in the step of forming an isolation layer on the pixel definition layer, the preparation method includes:

[0021] A plurality of isolation regions are formed on the pixel definition layer around the opening region, a liquid isolation layer is formed in the isolation region, and the isolation layer is exposed to light to solidify the isolation layer.

[0022] Optionally, in the step of forming a light-emitting functional layer on the pixel definition layer, the preparation method includes:

[0023] forming a light-emitting functional layer on the side of the pixel definition layer and the cured isolation layer facing away from the substrate;

[0024] exposing the solidified isolation layer to liquidize the isolation layer, and squeezing the light-emitting functional layer in the isolation region to break the light-emitting functional layer in the isolation region and embed it into the liquidized isolation layer;

[0025] The isolation layer is exposed again to solidify the isolation layer mixed with the broken light-emitting functional layer again.

[0026] Optionally, before the step of exposing the solidified isolation layer to liquidize the isolation layer, the preparation method further comprises:

[0027] A pre - encapsulation layer is formed on the side of the light - emitting functional layer facing away from the substrate.

[0028] Beneficial effects:

[0029] This application provides a display panel, a preparation method thereof, and a display device. The display panel includes a substrate, a light - emitting layer, and an isolation layer. The light - emitting layer includes a pixel definition layer and a light - emitting functional layer. The pixel definition layer defines a plurality of opening regions on the substrate, the light - emitting functional layer overlaps with the opening regions, the isolation layer is distributed around the opening regions, and the orthographic projection of the isolation layer on the substrate does not overlap with the orthographic projection of the light - emitting functional layer on the substrate. By using the isolation layer, each light - emitting part in the light - emitting layer can be isolated, thereby reducing the problem of lateral leakage crosstalk generated by the light - emitting functional layer in the display panel and improving the display effect of the display panel. Description of the drawings

[0030] In order to more clearly illustrate the technical solutions of the embodiments of this application, the drawings required for the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] Figure 1 is a schematic plan view of a display panel proposed in an embodiment of this application;

[0032] Figure 2 is Figure 1 a schematic cross - sectional view of the C - C' section in

[0033] Figure 3 is a chemical reaction formula of a compound containing an azobenzene functional group proposed in an embodiment of this application;

[0034] Figure 4 is a blue - light spectrum diagram proposed in an embodiment of this application;

[0035] Figure 5 is a step - flow chart of a preparation method of a display panel proposed in an embodiment of this application;

[0036] Figure 6 is a schematic structural view of completing the preparation of the pixel definition layer in a preparation method of a display panel proposed in an embodiment of this application;

[0037] Figure 7 is a schematic structural view of completing the preparation of the liquid isolation layer in a preparation method of a display panel proposed in an embodiment of this application;

[0038] Figure 8 is a schematic structural view of completing the first curing of the isolation layer in a preparation method of a display panel proposed in an embodiment of this application;

[0039] Figure 9 It is a schematic structural diagram for completing the preparation of the light-emitting functional layer in a method for preparing a display panel according to an embodiment of the present application;

[0040] Figure 10 It is a schematic structural diagram for completing the liquefaction of the isolation layer in a method for preparing a display panel according to an embodiment of the present application;

[0041] Figure 11 It is a schematic structural diagram for extruding the light-emitting functional layer in the isolation area in a method for preparing a display panel according to an embodiment of the present application;

[0042] Figure 12 It is a schematic structural diagram for completing the second curing of the isolation layer in a method for preparing a display panel according to an embodiment of the present application;

[0043] Figure 13 It is a schematic flow diagram for completing the preparation of red sub-pixels according to an embodiment of the present application;

[0044] Figure 14 It is a schematic flow diagram for completing the preparation of green sub-pixels according to an embodiment of the present application;

[0045] Figure 15 It is a schematic flow diagram for completing the preparation of blue sub-pixels according to an embodiment of the present application.

[0046] Explanation of reference numerals: 10, substrate; 20, driving circuit layer; 31, first pixel electrode; 32, pixel definition layer; 33, isolation layer; 34, light-emitting functional layer; A, opening area; B, isolation area. Detailed implementation manners

[0047] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0048] In the related art, the device functional layer of the OLED display panel often includes more than a dozen film layers, among which the OpenMask and FMM (Fine Metal Mask) Mask processes are used to evaporate the RGB common layer and the light-emitting layer. Due to the extremely high manufacturing cost of the FMM Mask and the high cost of OLED materials, it is difficult to reduce the production cost of the OLED display panel. In addition, since the red, green, and blue sub-pixels are affected by the film layer structure and the intrinsic characteristics of the material, the starting voltage of the RGB pixels is different. Usually, the starting voltage of the RGB sub-pixels is red < green < blue. At the same time, due to the large influence of low-temperature polysilicon field-effect transistors, OLED display panels often have the following problems: 1) crosstalk between different pixels at low grayscale; 2) poor uniformity of screen brightness; and if the process technology such as Open Mask is used to control the FMM cost, it is difficult to overcome the crosstalk image quality problem caused by the lateral current in the common layer.

[0049] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which are intended to reduce the problem of lateral leakage crosstalk generated by the light-emitting functional layer 34 in the display panel.

[0050] Reference Figure 1 and Figure 2 As shown, a display panel disclosed in an embodiment of the present application includes a substrate 10 , a light-emitting layer and an isolation layer 33 .

[0051] Specifically, the substrate 10 may be a flexible substrate or a rigid substrate. When the substrate 10 is a flexible substrate, the display panel may have properties such as being bendable or foldable; when the substrate 10 is a rigid substrate, the rigidity requirements of the display panel may be met; the performance of the specific substrate 10 is determined according to the actual requirements of the product.

[0052] Reference Figure 2 As shown, the display panel further includes a driving circuit layer 20 disposed on the substrate 10 .

[0053] Specifically, the driving circuit layer 20 may include a thin film transistor. Among them, the thin film transistor may be a top gate type, and the thin film transistor may include an active layer, a first gate insulating layer, a gate, a second gate insulating layer, an interlayer dielectric layer, a source, and a drain. Specifically, the active layer may be formed on the substrate 10, the first gate insulating layer covers the active layer, the gate is formed on the side of the first gate insulating layer away from the active layer, the second gate insulating layer covers the gate and the first gate insulating layer, the interlayer dielectric layer covers the second gate insulating layer, the source and the drain are formed on the side of the interlayer dielectric layer away from the substrate 10 and are respectively located on opposite sides of the gate, and the source and the drain may be respectively contacted with the opposite sides of the active layer through vias (e.g., metal vias). It should be understood that the thin film transistor may also be a bottom gate type.

[0054] Referring to Figure 2 as shown, the light-emitting layer includes a first pixel electrode 31 and a pixel definition layer 32 formed in sequence on the interlayer dielectric layer. It should be understood that the display panel may further include a light-emitting functional layer 34 and a second pixel electrode (not shown in the figure).

[0055] The first pixel electrode 31 can be electrically connected to the drain through a metal via. The first pixel electrode 31 can be an anode, and this anode can be made of materials such as ITO (indium tin oxide), indium zinc oxide (IZO), zinc oxide (ZnO), etc.; the pixel definition layer 32 can be made of an organic material, for example: organic materials such as photoresist, and the pixel definition layer 32 has a plurality of opening regions A exposing the first pixel electrode 31; the light-emitting functional layer 34 covers the pixel definition layer 32, the light-emitting functional layer 34 overlaps with the opening region A, and the light-emitting functional layer 34 can include functional layers such as an electron injection layer (EIL), an electron transport layer (ETL), an electroluminescent layer (EML), a hole injection layer (HIL), a hole transport layer (HTL), and a hole blocking layer (HBL); the second pixel electrode covers the light-emitting functional layer 34, and the polarity of the second pixel electrode is opposite to the polarity of the first pixel electrode 31; this second pixel electrode can be a cathode, and this cathode can be made of metal materials such as lithium (Li), aluminum (Al), magnesium (Mg), silver (Ag), etc.

[0056] It should be noted that the first pixel electrode 31, the light-emitting functional layer 34, and the second pixel electrode can form a light-emitting sub-pixel. Among them, the display panel can include a plurality of light-emitting sub-pixels arranged in an array. In addition, it should also be noted that the first pixel electrodes 31 of each light-emitting sub-pixel are independent of each other, and the second pixel electrodes of each light-emitting sub-pixel are connected integrally; that is, the second pixel electrode is an integral structure provided on the display panel and is a common electrode for multiple display devices.

[0057] Referring to Figure 1 and Figure 2 as shown, in the embodiment of the present application, an isolation layer 33 is provided on the pixel definition layer. The isolation layer 33 is distributed around the opening region A, and the orthographic projection of the isolation layer 33 on the substrate 10 does not overlap with the orthographic projection of the light-emitting functional layer 34 on the substrate 10.

[0058] Specifically, the isolation layer 33 is located between any two adjacent opening regions A, and the light-emitting functional layer 34 is disconnected at the position where the isolation layer 33 is located. That is to say, the isolation layer 33 can separate each opening region A, so that the light-emitting functional layer 34 forms independent light-emitting sub-pixels in each opening region A.

[0059] In this way, the isolation layer 33 can reduce the problem of lateral leakage crosstalk generated by the light-emitting functional layer 34 in the display panel and improve the display effect of the display panel.

[0060] In the embodiment of the present application, an isolator layer 33 is formed using a reversible material, and the reversible property of the isolator layer 33 is used to disconnect the light-emitting functional layer 34.

[0061] Specifically, referring to Figure 1 As shown, in the embodiment of the present application, the pixel definition layer 32 further defines a plurality of isolation regions B on the substrate 10. The isolation regions B correspond one-to-one with the opening regions A, and the isolation regions B are distributed around the corresponding opening regions A. That is, after the pixel definition layer 32 is prepared, the opening regions A and the isolation regions B are formed using photolithography technology. Among them, the width of the isolation region B is greater than or equal to 10 μm and less than or equal to 15 μm; the width of the isolation region B refers to the dimension of the isolation region B in the direction perpendicular to its extending direction, and the extending direction of the isolation region B refers to the direction in which the isolation extends along the opening region A (if the orthographic projection shape of the opening region A on the substrate 10 is circular, the width of the isolation region B refers to the dimension of the isolation region B in the radial direction of the opening region A).

[0062] After the isolation region B is formed, a liquid isolator layer 33 can be formed in the isolation region B, and then the liquid isolator layer 33 is irradiated using an exposure process to change the liquid isolator layer 33 into a solid state; then, a light-emitting functional layer 34 can be formed on the side of the pixel definition layer 32 facing away from the substrate 10. At this time, the light-emitting functional layer 34 also covers the isolator layer 33 below it; then, the solid isolator layer 33 is irradiated using an exposure process to change the solid isolator layer 33 into a liquid state, and air pressure is used to squeeze the light-emitting functional layer 34 on the liquid isolator layer 33, so that this part of the light-emitting functional layer 34 breaks and is embedded in the liquid isolator layer 33; finally, the liquid isolator layer 33 is cured using an exposure process to make the isolator layer 33 wrap and fix the broken light-emitting functional layer 34 to avoid crack generation.

[0063] In this way, the light-emitting functional layer 34 can be disconnected using the isolator layer 33, so that each light-emitting sub-pixel is independent, thereby reducing the problem of lateral leakage crosstalk generated by the light-emitting functional layer 34 in the display panel. At the same time, when the display panel of the present application lights up blue light, as Figure 4 shown, no interference phenomenon occurs, that is to say, the isolator layer of the present application effectively avoids the problem of lateral leakage crosstalk of the light-emitting functional layer.

[0064] In one embodiment, the thickness of the isolation layer 33 is greater than or equal to 0.30 μm and less than or equal to 0.60 μm. For example, the thickness of the isolation layer 33 may be 0.30 μm, 0.35 μm, 0.40 μm, 0.50 μm, 0.55 μm, 0.60 μm, etc., and those skilled in the art may set the thickness according to actual needs. Setting the thickness of the isolation layer 33 within this range can ensure that the isolation layer 33 completely covers the broken light-emitting functional layer 34 after solidification.

[0065] In one embodiment, the material of the isolation layer 33 may include a cyano compound or an azobenzene compound. Selecting these two materials to form the isolation layer 33 allows the isolation layer 33 to be solidified or liquid-transformed under the irradiation of light of different wavelengths; for example, in the embodiment of the present application, irradiating the isolation layer 33 with visible light of 530nm wavelength can transform the isolation layer 33 from liquid to solid; irradiating the isolation layer 33 with light of 360nm wavelength can transform the isolation layer 33 from solid to liquid. The chemical reaction structure is as follows: Figure 3 shown.

[0066] In one embodiment, the display panel further includes an encapsulation layer, and the encapsulation layer is disposed on a side of the light emitting layer facing away from the substrate 10 .

[0067] Specifically, the encapsulation layer may include a first inorganic encapsulation film layer, an organic encapsulation film layer, and a second inorganic encapsulation film layer which are stacked in sequence. The first inorganic encapsulation film layer and the second inorganic encapsulation film layer may be obtained by two chemical vapor deposition processes respectively, or may be formed by a physical vapor deposition process. The materials of the first inorganic encapsulation film layer and the second inorganic encapsulation film layer may be selected from inorganic materials such as silicon nitride and silicon oxide; the organic encapsulation film layer is manufactured by an inkjet printing process, or may be formed by a spraying process. The materials of the organic encapsulation film layer may be acrylic-based polymers, silicon-based polymers, and the like.

[0068] Figure 5 A flowchart of a method for preparing a display panel is shown. Figure 5 As shown, the embodiment of the present application also discloses a method for preparing a display panel, the method comprising:

[0069] Step 201: Provide a substrate 10.

[0070] Specifically, the substrate 10 may be a flexible substrate or a rigid substrate. When the substrate 10 is a flexible substrate, the display panel may have properties such as being bendable or foldable; when the substrate 10 is a rigid substrate, the rigidity requirements of the display panel may be met; the performance of the specific substrate 10 is determined according to the actual requirements of the product.

[0071] Step 202: Form a pixel definition layer 32 on one side of the substrate 10. The pixel definition layer 32 defines a plurality of opening regions A on the substrate 10.

[0072] Specifically, the pixel definition layer 32 can be made of an organic material, such as an organic material like photoresist.

[0073] Step 203: Form an isolation layer 33 on the pixel definition layer 32. The isolation layer 33 is distributed around the opening region A.

[0074] Specifically, the material of the isolation layer 33 can include a cyanide compound or an azobenzene-containing compound.

[0075] In step 203, the preparation method includes:

[0076] Step 2031: Form a plurality of isolation regions B around the opening region A on the pixel definition layer 32. Form a liquid isolation layer 33 in the isolation regions B and expose the isolation layer 33 to cure the isolation layer 33, as Figure 6 and Figure 7 shown.

[0077] Specifically, the isolation regions B correspond one-to-one with the opening regions A, and the isolation regions B are distributed around the corresponding opening regions A. That is, after preparing the pixel definition layer 32, the opening regions A and the isolation regions B are formed by using photolithography technology. The width of the isolation region B is greater than or equal to 10 μm and less than or equal to 15 μm. The thickness of the liquid isolation layer 33 is greater than or equal to 0.30 μm and less than or equal to 0.60 μm.

[0078] Meanwhile, the liquid isolation layer 33 can be irradiated with visible light with a wavelength of 530 nm for about 2 min to perform the first curing of the liquid isolation layer 33, as Figure 8 shown.

[0079] Step 204: Form a light-emitting functional layer 34 on the pixel definition layer 32. The light-emitting functional layer 34 overlaps with the opening region A, and the orthographic projection of the isolation layer 33 on the substrate 10 has no overlap with the orthographic projection of the light-emitting functional layer 34 on the substrate 10.

[0080] Specifically, the light-emitting functional layer 34 covers the pixel definition layer 32, and the light-emitting functional layer 34 can include functional layers such as an electron injection layer (EIL), an electron transport layer (ETL), a photoluminescent layer (EML), a hole injection layer (HIL), a hole transport layer (HTL), and a hole blocking layer (HBL), as Figure 9 shown.

[0081] In step 204, the preparation method further includes:

[0082] Step 2041 : forming a light-emitting functional layer 34 on the side of the pixel definition layer 32 and the cured isolation layer 33 facing away from the substrate 10 .

[0083] Step 2042 : exposing the solidified isolation layer 33 to liquefy the isolation layer 33 , and squeezing the light-emitting functional layer 34 of the isolation region B to break the light-emitting functional layer 34 of the isolation region B and embed it into the liquefied isolation layer 33 .

[0084] Specifically, before exposing the cured isolation layer 33, a pre-packaging layer can be formed on the side of the light-emitting functional layer 34 facing away from the substrate 10. The thickness of the pre-packaging layer is greater than or equal to 0.02 μm and less than or equal to 0.05 μm. The material of the pre-packaging layer can be silicon nitride.

[0085] Then, the solid isolation layer 33 is irradiated with light of 360 nm wavelength for about 2 minutes to convert the solid isolation layer 33 into a liquid state. Figure 10 As shown; the device is then transferred to another vacuum chamber, the pressure of the vacuum chamber is evacuated to 1Pa-2Pa, and nitrogen is filled into the vacuum chamber. After staying for about 240s, the light-emitting functional layer 34 above the isolation layer 33 is evenly squeezed by the gas pressure of the nitrogen, so that this part of the light-emitting functional layer 34 is broken and embedded in the liquid isolation layer 33, as shown Figure 11 shown.

[0086] Step 2043: Expose the isolation layer 33 again to solidify the isolation layer 33 mixed with the broken light-emitting functional layer 34 again.

[0087] Specifically, the isolation layer 33 can be irradiated with light of 530 nm wavelength for about 3 minutes to allow the isolation layer 33 to be cured for the second time. During the second curing process, the isolation layer 33 will cover and fix the broken light-emitting functional layer 34, thereby avoiding the generation of cracks. Figure 12 shown.

[0088] The display panel prepared by the preparation method provided in the embodiment of the present application can use the isolation layer 33 to separate the light-emitting functional layer 34, thereby effectively blocking the light-emitting functional layer 34 from generating lateral leakage. The preparation method is simple to implement and can reduce the preparation cost of the display panel.

[0089] In one embodiment, the embodiment of the present application also provides a preparation method, in which the isolation layer 33 can be used to achieve the preparation of sub-pixels of different colors, wherein the sub-pixels of different colors can include red sub-pixels, blue sub-pixels and green sub-pixels.

[0090] Specifically, the preparation method comprises:

[0091] Step 301: Form a pixel definition layer 32 on the substrate 10, and form a plurality of opening regions A and isolation regions B.

[0092] Specifically, different opening regions A can correspond to forming sub-pixels of different colors.

[0093] Step 302: After forming a liquid isolation layer 33 in the opening regions A corresponding to the blue sub-pixels and the green sub-pixels, form a first layer of light-emitting functional layer 34 on the side of the pixel definition layer 32 facing away from the substrate 10.

[0094] Specifically, in this step, the light-emitting functional layer 34 covers the pixel definition layer 32 entirely, and the light-emitting functional layer 34 is the light-emitting functional layer 34 corresponding to the red sub-pixels, as shown in Figure 13 (a) and Figure 13 (b). And after forming the first layer of light-emitting functional layer 34, it is necessary to form a pre-encapsulation layer CVD1-1 and a layer of protective layer FL1 on the first layer of light-emitting functional layer 34. The protective layer FL1 is a thermally liquefiable material, such as a ruthenium coordination compound, as shown in Figure 13 (c).

[0095] Step 303: Expose the opening region A corresponding to the green sub-pixels to liquefy the isolation layer 33 in the opening region A corresponding to the green sub-pixels, and squeeze the first layer of light-emitting functional layer 34 in the opening region A corresponding to the green sub-pixels to break the first layer of light-emitting functional layer 34 in the opening region A corresponding to the green sub-pixels.

[0096] Specifically, after the first layer of light-emitting functional layer 34 in the opening region A corresponding to the green sub-pixels breaks, it will mix into the liquid isolation layer 33. At this time, use a vacuum adsorption device to adsorb the upper part of the opening region A corresponding to the green sub-pixels, and adsorb and remove the isolation layer 33 and the first layer of light-emitting functional layer 34 in the opening region A corresponding to the green sub-pixels, as shown in Figure 13 (d) and Figure 13 (e).

[0097] Step 304: Form a second layer of light-emitting functional layer 34 in the opening region A corresponding to the green sub-pixels.

[0098] Specifically, the second layer of light-emitting functional layer 34 is the light-emitting functional layer 34 corresponding to the green sub-pixels, as shown in Figure 14 (a) and Figure 14 (b). And after forming the second layer of light-emitting functional layer 34, it is necessary to form a pre-encapsulation layer CVD1-1 and a layer of protective layer FE1 on the second layer of light-emitting functional layer 34. The protective layer FE1 is a thermally liquefiable material, such as a ruthenium coordination compound, as shown in Figure 14 (c) and Figure 14 (d).

[0099] Step 305: Expose the opening area A corresponding to the blue sub-pixel, liquefy the isolation layer 33 within the opening area A corresponding to the blue sub-pixel, and squeeze the second light-emitting functional layer 34 within the opening area A corresponding to the blue sub-pixel to break the light-emitting functional layer 34 within the opening area A corresponding to the blue sub-pixel.

[0100] Specifically, after the second light-emitting functional layer 34 within the opening area A corresponding to the blue sub-pixel breaks, it will mix into the liquid isolation layer 33. At this time, use a vacuum adsorption device to adsorb the upper part of the opening area A corresponding to the blue sub-pixel, and adsorb and remove the isolation layer 33 and the second light-emitting functional layer 34 within the opening area A corresponding to the blue sub-pixel, as Figure 14 (e) and Figure 14 (f) shown.

[0101] Step 306: Form a third light-emitting functional layer 34 in the opening area A corresponding to the blue sub-pixel.

[0102] Specifically, this third light-emitting functional layer 34 is the light-emitting functional layer 34 corresponding to the blue sub-pixel, as Figure 15 (a) and Figure 15 (b) shown. And after forming the third light-emitting functional layer 34, a pre-encapsulation layer CVD1-1 and a protective layer FL1 need to be formed on the third light-emitting functional layer 34. This protective layer is a thermally liquefiable material, such as a ruthenium coordination compound.

[0103] Step 307: Infrared heat the opening areas A corresponding to the red sub-pixel and the green sub-pixel to liquefy the protective layer, and squeeze the third light-emitting functional layer 34 in the opening areas A corresponding to the red sub-pixel and the green sub-pixel to break the third light-emitting functional layer 34 within the opening areas A corresponding to the red sub-pixel and the green sub-pixel.

[0104] Specifically, after the third light-emitting functional layer 34 within the opening areas A corresponding to the red sub-pixel and the green sub-pixel breaks, it will mix into the liquid protective layer. At this time, use a vacuum adsorption device to adsorb the upper parts of the opening areas A corresponding to the red sub-pixel and the green sub-pixel, and adsorb and remove the protective layer and the third light-emitting functional layer 34 within the opening areas A corresponding to the red sub-pixel and the green sub-pixel, as Figure 15 (d) and Figure 15 (e) shown. Then cure with light of 530 nm wavelength for about 2 min, and finally three independent color sub-pixels can be obtained, and then their encapsulation can be completed.

[0105] Each light-emitting sub-pixel of the display panel obtained by this preparation method is independent of each other, and the electroluminescent layer (EML) in the light-emitting functional layer 34 in this preparation method may not be formed by the FMM Mask process, thereby greatly reducing the preparation cost of the display panel.

[0106] Based on the same inventive concept, an embodiment of the present application further provides a display device, which includes any one of the display panels described above in the embodiments of the present application.

[0107] Specifically, the display device may include a computer monitor, a television, a billboard, a laser printer with a display function, a telephone, a mobile phone, a personal digital assistant (PDA), a laptop computer, a digital camera, a portable video camera, a viewfinder, a vehicle, a large-area wall, a screen in a theater, or a stadium sign, etc.

[0108] It should be noted that the embodiments in this specification are all described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0109] It should also be noted that in this article, the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor can they be understood as indicating or implying relative importance. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or terminal device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or terminal device including the element.

[0110] The above has introduced the technical solution provided by this application in detail. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only for helping to understand this application, and the content of this specification should not be construed as a limitation to this application. At the same time, for those of ordinary skill in the art, according to this application, there will be various forms of changes in the specific implementation manner and application scope. It is not necessary and impossible to enumerate all the implementation manners here, and the obvious changes or variations derived therefrom are still within the protection scope of this application.

Claims

1. A display panel, characterized in that: include: substrate; A light-emitting layer is disposed on one side of the substrate, the light-emitting layer includes a pixel definition layer and a light-emitting function layer located on the pixel definition layer, the pixel definition layer defines a plurality of opening areas on the substrate, and the light-emitting function layer overlaps with the opening areas; An isolation layer is distributed around the opening area, and an orthographic projection of the isolation layer on the substrate does not overlap with an orthographic projection of the light-emitting functional layer on the substrate.

2. The display panel according to claim 1, characterized in that: The pixel definition layer defines a plurality of isolation regions on the substrate, the isolation regions correspond to the opening regions one by one, and the isolation regions are arranged around the corresponding opening regions; The isolation layer is disposed in the isolation region.

3. The display panel according to claim 2, characterized in that: The width of the isolation region is greater than or equal to 10 μm and less than or equal to 15 μm.

4. The display panel according to any one of claims 1 to 3, characterized in that: The thickness of the isolation layer is greater than or equal to 0.30 μm and less than or equal to 0.60 μm.

5. The display panel according to any one of claims 1 to 3, characterized in that: The material of the isolation layer includes cyano compounds or azobenzene-containing compounds.

6. A display device, comprising the display panel according to any one of claims 1 to 5.

7. A method for preparing a display panel, characterized in that: The preparation method comprises: providing a substrate; forming a pixel definition layer on one side of the substrate, wherein the pixel definition layer defines a plurality of opening areas on the substrate; forming an isolation layer on the pixel definition layer, wherein the isolation layer is distributed around the opening area; A light-emitting functional layer is formed on the pixel definition layer, the light-emitting functional layer overlaps with the opening area, and the orthographic projection of the isolation layer on the substrate does not overlap with the orthographic projection of the light-emitting functional layer on the substrate.

8. The method for preparing a display panel according to claim 7, characterized in that: In the step of forming an isolation layer on the pixel definition layer, the preparation method comprises: A plurality of isolation regions are formed on the pixel definition layer around the opening region, a liquid isolation layer is formed in the isolation region, and the isolation layer is exposed to light to solidify the isolation layer.

9. The method for preparing a display panel according to claim 8, characterized in that: In the step of forming a light-emitting functional layer on the pixel definition layer, the preparation method comprises: forming a light-emitting functional layer on the side of the pixel definition layer and the cured isolation layer facing away from the substrate; exposing the solidified isolation layer to liquidize the isolation layer, and squeezing the light-emitting functional layer in the isolation region to break the light-emitting functional layer in the isolation region and embed it into the liquidized isolation layer; The isolation layer is exposed again to solidify the isolation layer mixed with the broken light-emitting functional layer again.

10. The method for preparing a display panel according to claim 9, characterized in that: Before the step of exposing the solidified isolation layer to liquidize the isolation layer, the preparation method further comprises: A pre-packaging layer is formed on the side of the light-emitting functional layer facing away from the substrate.

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