High-power high-frequency RFID circuit based on MTK platform

Abstract

The invention discloses a high-power high-frequency RFID circuit based on an MTK platform, the circuit comprises a mainboard and a high-power high-frequency RFID module, the mainboard is provided with an MTK platform chip and an expansion interface, a first communication interface of the MTK platform chip is connected with a second communication interface of the expansion interface, and the expansion interface is connected with the high-power high-frequency RFID module through an FPC flat cable; the circuit further comprises a power supply circuit, the enabling end of the MTK platform chip is connected with the signal input end of the power supply circuit, and the first power supply end of the power supply circuit is connected with the second power supply end of the expansion interface. According to the embodiment of the invention, efficient and stable operation of the high-power and high-frequency RFID module can be ensured, and the electromagnetic compatibility of the circuit can be improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic circuit design, and particularly to a high-power high-frequency RFID circuit based on the MTK platform. Background Art

[0002] Most of the existing high-power high-frequency RFID (Radio Frequency Identification) modules are designed on the main board. The advantage is that the power supply capacity and signal transmission characteristics of the main board can be fully utilized to improve the data transmission rate. Since the high-power high-frequency RFID module is directly designed on the main board, it will generate relatively high power consumption and temperature during operation. If the heat dissipation design of the main board is not good, it may cause overheating of the module or other parts of the main board, thereby affecting the stability and service life of the system; in addition, the high-power high-frequency RFID module may generate electromagnetic interference during operation, affecting the normal operation of other components on the main board. At the same time, high-frequency signals are more sensitive to the electromagnetic environment and are easily affected by external electromagnetic interference.

[0003] Therefore, the existing high-power high-frequency RFID circuits have problems of low stability and poor anti-interference ability. Summary of the Invention

[0004] The present invention provides a high-power high-frequency RFID circuit based on the MTK platform, aiming to solve the problems of low stability and poor anti-interference ability existing in some high-power high-frequency RFID circuits.

[0005] In a first aspect, the present invention provides a high-power high-frequency RFID circuit based on the MTK platform. The circuit includes a main board and a high-power high-frequency RFID module. An MTK platform chip and an expansion interface are provided on the main board. A first communication interface of the MTK platform chip is connected to a second communication interface of the expansion interface, and the expansion interface is connected to the high-power high-frequency RFID module through an FPC cable;

[0006] The circuit further includes a power supply circuit. An enable end of the MTK platform chip is connected to a signal input end of the power supply circuit, and a first power supply end of the power supply circuit is connected to a second power supply end of the expansion interface.

[0007] Further, when the communication interface of the high-power high-frequency RFID module is a UART serial port, the AB4 pin, AA7 pin, W7 pin, and M26 pin of the MTK platform chip serve as the first communication interface, and the third pin, fourth pin, fifth pin, and sixth pin of the expansion interface serve as the second communication interface.

[0008] Further, when the communication interface of the high-power high-frequency RFID module is an I2C interface, the J3 pin and the J4 pin of the MTK platform chip serve as the first communication interface, and the fifteenth pin and the sixteenth pin of the expansion interface serve as the second communication interface.

[0009] Further, when the communication interface of the high-power high-frequency RFID module is an SPI interface, the AD1 pin, the AC1 pin, the AC2 pin, and the AD2 pin of the MTK platform chip serve as the first communication interface, and the eighth pin, the ninth pin, the tenth pin, and the eleventh pin of the expansion interface serve as the second communication interface.

[0010] Further, when the communication interface of the high-power high-frequency RFID module is a USB interface, the C27 pin and the B27 pin of the MTK platform chip serve as the first communication interface, and the eighteenth pin and the nineteenth pin of the expansion interface serve as the second communication interface.

[0011] Further, when the communication interface of the high-power high-frequency RFID module is a USB interface, the first communication interface is connected to the second communication interface through a USB analog switch circuit.

[0012] Further, the USB analog switch circuit includes an analog switch chip, and a main USB interface and a slave USB interface are provided on the analog switch chip; wherein, the fourth pin and the fifth pin of the analog switch chip serve as the main USB interface, and the sixth pin and the seventh pin of the analog switch chip serve as the slave USB interface;

[0013] The signal detection end of the analog switch chip is connected to the first communication interface, and the slave USB interface is connected to the second communication interface; wherein, the first pin and the second pin of the analog switch chip serve as the signal detection end.

[0014] Further, the power supply circuit includes a power supply chip, a twenty-third resistor, a twenty-fourth resistor, and a battery power supply. The first end of the twenty-third resistor is connected to the first end of the twenty-fourth resistor, and the connection point serves as the signal input end of the power supply circuit. The second end of the twenty-third resistor is connected to the fourth end of the power supply chip, and the fifth end of the power supply chip is connected to the battery power supply; wherein, a sixth capacitor and a seventh capacitor are connected in parallel between the power supply chip and the battery power supply.

[0015] Further, the power supply circuit includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth coil, a nineteenth resistor, and a twentieth resistor;

[0016] The first end of the first capacitor is connected to the first end of the power supply chip, the second end of the first capacitor is connected to the first end of the sixth coil, and the connection point is connected to the sixth end of the power supply chip. The first end of the second capacitor is simultaneously connected to the first end of the nineteenth resistor and the first end of the twentieth resistor, and the connection point is connected to the third end of the power supply chip. The second end of the sixth coil is simultaneously connected to the second end of the second capacitor, the second end of the nineteenth resistor, the first end of the third capacitor, the first end of the fourth capacitor, and the first end of the fifth capacitor, and the connection point serves as the first power supply terminal of the power supply circuit.

[0017] Further, an electromagnetic shielding film is attached to the outer surface of the FPC cable.

[0018] The present invention discloses a high-power high-frequency RFID circuit based on the MTK platform. The circuit includes a main board and a high-power high-frequency RFID module. An MTK platform chip and an expansion interface are provided on the main board. The first communication interface of the MTK platform chip is connected to the second communication interface of the expansion interface, and the expansion interface is connected to the high-power high-frequency RFID module through an FPC cable. The circuit further includes a power supply circuit. The enable terminal of the MTK platform chip is connected to the signal input terminal of the power supply circuit, and the first power supply terminal of the power supply circuit is connected to the second power supply terminal of the expansion interface. In the embodiment of the present invention, the MTK platform chip externally connects the high-power high-frequency RFID module through the expansion interface. Since the high-power high-frequency RFID module exists independently, the efficient and stable operation of the high-power high-frequency RFID module can be ensured. In addition, by externally connecting the high-power high-frequency RFID module through the expansion interface, a certain physical distance is maintained between the high-power high-frequency RFID module and the MTK platform chip and the power supply circuit. This design helps to reduce the direct impact of the electromagnetic radiation generated by the high-power high-frequency RFID module during operation on the MTK platform chip, thereby improving the electromagnetic compatibility of the circuit to a certain extent. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for description in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 is a schematic diagram of a high-power high-frequency RFID circuit provided by an embodiment of the present invention;

[0021] Figure 2 is a circuit schematic diagram of the expansion interface provided by an embodiment of the present invention.

[0022] Figure 3 It is the schematic diagram of the first part of the circuit of the MTK platform chip provided by an embodiment of the present invention;

[0023] Figure 4 It is the schematic diagram of the power supply circuit provided by an embodiment of the present invention;

[0024] Figure 5 It is the schematic diagram of the second part of the circuit of the MTK platform chip provided by an embodiment of the present invention;

[0025] Figure 6 It is the schematic diagram of the third part of the circuit of the MTK platform chip provided by an embodiment of the present invention;

[0026] Figure 7 It is the schematic diagram of the fourth part of the circuit of the MTK platform chip provided by an embodiment of the present invention;

[0027] Figure 8 It is the schematic diagram of the USB analog switch circuit provided by an embodiment of the present invention.

[0028] Among them, the reference numerals in the figure are as follows:

[0029] 10. Circuit; 11. Main board; 12. High-power high-frequency RFID module; 13. MTK platform chip; 14. Power supply circuit; 15. USB analog switch circuit; J31. Expansion interface; U13. Power supply chip; U18. Analog switch chip. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] It should be understood that when used in this specification and the appended claims, the terms "comprises" and "comprising" indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their groups.

[0032] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in this specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0033] It should also be further understood that the term "and / or" used in the specification and appended claims of the present invention refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0034] Please refer to Figure 1 , Figure 1 , which is a schematic diagram of a high-power high-frequency RFID circuit provided by an embodiment of the present invention. The present invention proposes a high-power high-frequency RFID circuit 10 based on the MTK platform. The circuit 10 includes a main board 11 and a high-power high-frequency RFID module 12. An MTK platform chip 13 and an expansion interface J31 are arranged on the main board 11. A first communication interface of the MTK platform chip 13 is connected to a second communication interface of the expansion interface J31. The expansion interface J31 is connected to the high-power high-frequency RFID module 12 through an FPC cable. The circuit 10 further includes a power supply circuit 14. An enable end of the MTK platform chip 13 is connected to a signal input end of the power supply circuit 14. A first power supply end of the power supply circuit 14 is connected to a second power supply end of the expansion interface J31.

[0035] In this embodiment, both the MTK platform chip 13 and the expansion interface J31 are arranged on the main board 11. The MTK platform chip 13 externally connects the high-power high-frequency RFID module 12 through the expansion interface J31. The high-power high-frequency RFID module 12 exists independently, which can ensure the efficient and stable operation of the high-power high-frequency RFID module compared with the prior art. There is a certain physical distance between the high-power high-frequency RFID module 12, the MTK platform chip 13, and the power supply circuit 14. This design helps to reduce the direct influence of the electromagnetic radiation generated when the high-power high-frequency RFID module 12 works on the MTK platform chip 13, thereby improving the electromagnetic compatibility of the circuit 10 to a certain extent. In the embodiment of the present invention, the high-power high-frequency RFID module 12 is compatible with various interfaces (such as UART serial port, I2C interface, SPI interface, USB interface, etc.). The MTK platform chip 13 is compatible with the high-power high-frequency RFID module 12 through the expansion interface J31, with high flexibility.

[0036] The circuit 10 further includes a power supply circuit 14. An enable end of the MTK platform chip 13 is connected to a signal input end of the power supply circuit 14. A first power supply end of the power supply circuit 14 is connected to a second power supply end of the expansion interface J31. Among them, the twenty-second pin and the twenty-third pin of the expansion interface J31 are connected, and the connection point is used as the second power supply end (specifically, please refer to Figure 2); The AC24 pin of the MTK platform chip serves as the enabling terminal (for specific reference, see Figure 3 ). Specifically, the MTK platform chip 13 sends a control signal to the power supply circuit 14 through the enabling terminal, so that the power supply circuit 14 outputs a voltage value corresponding to the control signal; preferably, the voltage value output by the power supply circuit 14 is 5V.

[0037] In an embodiment, as shown in Figure 1 、 Figure 2 and Figure 5 , when the communication interface of the high-power high-frequency RFID module 12 is a UART serial port, the AB4 pin, AA7 pin, W7 pin, and M26 pin of the MTK platform chip 13 serve as the first communication interface, and the third pin, fourth pin, fifth pin, and sixth pin of the expansion interface J31 serve as the second communication interface.

[0038] In this embodiment, when the communication interface of the high-power high-frequency RFID module 12 is a UART serial port, the AB4 pin, AA7 pin, W7 pin, and M26 pin of the MTK platform chip 13 serve as the first communication interface, the third pin, fourth pin, fifth pin, and sixth pin of the expansion interface J31 serve as the second communication interface, the first communication interface is connected to the second communication interface, and the expansion interface J31 is connected to the high-power high-frequency RFID module 12 through an FPC cable. The MTK platform chip 13 in the embodiment of the present invention can externally connect the high-power high-frequency RFID module 12 through the expansion interface J31 to achieve the transmission function.

[0039] In an embodiment, as shown in Figure 1 、 Figure 2 and Figure 5 , when the communication interface of the high-power high-frequency RFID module 12 is an I2C interface, the J3 pin and J4 pin of the MTK platform chip 13 serve as the first communication interface, and the fifteenth pin and sixteenth pin of the expansion interface J31 serve as the second communication interface.

[0040] In this embodiment, when the communication interface of the high-power high-frequency RFID module 12 is an I2C interface, the J3 pin and J4 pin of the MTK platform chip 13 serve as the first communication interface, the fifteenth pin and sixteenth pin of the expansion interface J31 serve as the second communication interface, and the first communication interface is connected to the second communication interface to realize the communication connection between the MTK platform chip 13 and the high-power high-frequency RFID module 12.

[0041] In an embodiment, as shown in Figure 1 、 Figure 2 andFigure 6 As shown, when the communication interface of the high-power high-frequency RFID module 12 is an SPI interface, the AD1 pin, AC1 pin, AC2 pin, and AD2 pin of the MTK platform chip 13 serve as the first communication interface, and the eighth pin, ninth pin, tenth pin, and eleventh pin of the expansion interface J31 serve as the second communication interface.

[0042] In this embodiment, when the communication interface of the high-power high-frequency RFID module 12 is an SPI interface, the AD1 pin, AC1 pin, AC2 pin, and AD2 pin of the MTK platform chip 13 serve as the first communication interface, and the eighth pin, ninth pin, tenth pin, and eleventh pin of the expansion interface J31 serve as the second communication interface. The first communication interface is connected to the second communication interface to achieve the communication connection between the MTK platform chip 13 and the high-power high-frequency RFID module 12.

[0043] In one embodiment, as Figure 1 、 Figure 2 and Figure 7 shown, when the communication interface of the high-power high-frequency RFID module 12 is a USB interface, the C27 pin and B27 pin of the MTK platform chip 13 serve as the first communication interface, and the eighteenth pin and nineteenth pin of the expansion interface J31 serve as the second communication interface.

[0044] In this embodiment, when the communication interface of the high-power high-frequency RFID module 12 is a USB interface, the C27 pin and B27 pin of the MTK platform chip 13 serve as the first communication interface, and the eighteenth pin and nineteenth pin of the expansion interface J31 serve as the second communication interface. The first communication interface is connected to the second communication interface to achieve the communication connection between the MTK platform chip 13 and the high-power high-frequency RFID module 12.

[0045] In one embodiment, as Figure 1 and Figure 8 shown, when the communication interface of the high-power high-frequency RFID module 12 is a USB interface, the first communication interface is connected to the second communication interface through the USB analog switch circuit 15.

[0046] In this embodiment, the MTK platform chip 13 has only one USB interface. To avoid affecting the function of the main USB interface, the MTK platform chip 13 can achieve master-slave switching through the USB analog switch circuit 15.

[0047] In one embodiment, as Figure 8As shown, the USB analog switch circuit 15 includes an analog switch chip U18, and a main USB interface and a slave USB interface are provided on the analog switch chip U18. Among them, the fourth pin and the fifth pin of the analog switch chip U18 serve as the main USB interface, and the sixth pin and the seventh pin of the analog switch chip U18 serve as the slave USB interface. The signal detection end of the analog switch chip U18 is connected to the first communication interface, and the slave USB interface is connected to the second communication interface. Among them, the first pin and the second pin of the analog switch chip U18 serve as the signal detection end.

[0048] In this embodiment, the signal detection end of the analog switch chip U18 is connected to the first communication interface, and the slave USB interface is connected to the second communication interface. In an embodiment of the present invention, the first communication interface is connected to the second communication interface through the analog switch chip U18, thereby realizing master-slave switching. Among them, the first pin and the second pin of the analog switch chip U18 serve as the signal detection end.

[0049] The analog switch chip U18 detects the level signal from the MTK platform chip 13 through the signal detection end. When the level signal is low, the analog switch chip U18 switches to be used as the main USB interface. When the level signal is high, the analog switch chip U18 switches to be used as the slave USB interface. The slave USB interface is connected to the second communication interface to realize the USB interface transmission of the high-power high-frequency RFID module 12.

[0050] In an embodiment, as Figure 4 shown, the power supply circuit 14 includes a power supply chip U13, a twenty-third resistor, a twenty-fourth resistor, and a battery power supply. The first end of the twenty-third resistor is connected to the first end of the twenty-fourth resistor, and the connection point serves as the signal input end of the power supply circuit 14. The second end of the twenty-third resistor is connected to the fourth end of the power supply chip U13, and the fifth end of the power supply chip U13 is connected to the battery power supply. Among them, a sixth capacitor and a seventh capacitor are connected in parallel between the power supply chip U13 and the battery power supply.

[0051] In this embodiment, the power supply circuit 14 includes a power supply chip U13, a twenty-third resistor, and a twenty-fourth resistor. The first end of the twenty-third resistor is connected to the first end of the twenty-fourth resistor, and the connection point serves as the signal input end of the power supply circuit 14. The second end of the twenty-fourth resistor is grounded, and the second end of the twenty-third resistor is connected to the fourth end of the power supply chip U13. The present invention can ensure the stable operation of the circuit by setting the twenty-third resistor and the twenty-fourth resistor.

[0052] The power supply circuit 14 further includes a battery power supply. The fifth terminal of the power supply chip U13 is connected to the battery power supply, and the battery power supply is used to supply power to the power supply circuit 14. Among them, a sixth capacitor and a seventh capacitor are connected in parallel between the power supply chip U13 and the battery power supply, which can achieve a filtering effect.

[0053] In one embodiment, as Figure 4 shown, the power supply circuit 14 includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth coil, a nineteenth resistor, and a twentieth resistor. The first terminal of the first capacitor is connected to the first terminal of the power supply chip U13, the second terminal of the first capacitor is connected to the first terminal of the sixth coil, and the connection point is connected to the sixth terminal of the power supply chip U13. The first terminal of the second capacitor is simultaneously connected to the first terminal of the nineteenth resistor and the first terminal of the twentieth resistor, and the connection point is connected to the third terminal of the power supply chip U13. The second terminal of the sixth coil is simultaneously connected to the second terminal of the second capacitor, the second terminal of the nineteenth resistor, the first terminal of the third capacitor, the first terminal of the fourth capacitor, and the first terminal of the fifth capacitor, and the connection point serves as the first power supply terminal of the power supply circuit 14.

[0054] In this embodiment, the first terminal of the first capacitor is connected to the first terminal of the power supply chip U13, the second terminal of the first capacitor is connected to the first terminal of the sixth coil, and the connection point is connected to the sixth terminal of the power supply chip U13. The first terminal of the second capacitor is simultaneously connected to the first terminal of the nineteenth resistor and the first terminal of the twentieth resistor, and the connection point is connected to the third terminal of the power supply chip U13. The second terminal of the twentieth resistor is grounded. The second terminal of the sixth coil is simultaneously connected to the second terminal of the second capacitor, the second terminal of the nineteenth resistor, the first terminal of the third capacitor, the first terminal of the fourth capacitor, and the first terminal of the fifth capacitor, and the connection point serves as the first power supply terminal of the power supply circuit 14. The second terminals of the third capacitor, the fourth capacitor, and the fifth capacitor are all grounded.

[0055] In one embodiment, as Figure 1 shown, an electromagnetic shielding film is attached to the outer surface of the FPC cable.

[0056] In this embodiment, an electromagnetic shielding film is attached to the outer surface of the FPC cable to reduce external electromagnetic interference. The length of the FPC cable is not greater than 10 CM to ensure the stability of signal transmission.

[0057] The present invention discloses a high-power high-frequency RFID circuit based on the MTK platform. The circuit includes a main board and a high-power high-frequency RFID module. An MTK platform chip and an expansion interface are provided on the main board. A first communication interface of the MTK platform chip is connected to a second communication interface of the expansion interface. The expansion interface is connected to the high-power high-frequency RFID module through an FPC cable. The circuit further includes a power supply circuit. An enable terminal of the MTK platform chip is connected to a signal input terminal of the power supply circuit. A first power supply terminal of the power supply circuit is connected to a second power supply terminal of the expansion interface. In the embodiment of the present invention, the MTK platform chip externally connects the high-power high-frequency RFID module through the expansion interface. Since the high-power high-frequency RFID module exists independently, the efficient and stable operation of the high-power high-frequency RFID module can be ensured. In addition, by externally connecting the high-power high-frequency RFID module through the expansion interface, a certain physical distance is maintained between the high-power high-frequency RFID module and the MTK platform chip and the power supply circuit. This design helps to reduce the direct impact of the electromagnetic radiation generated when the high-power high-frequency RFID module works on the MTK platform chip, thereby improving the electromagnetic compatibility of the circuit to a certain extent.

[0058] As mentioned above, the above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A high-power high-frequency RFID circuit based on the MTK platform, characterized in that: The circuit includes a mainboard and a high-power high-frequency RFID module, the mainboard is provided with an MTK platform chip and an expansion interface, the first communication interface of the MTK platform chip is connected to the second communication interface of the expansion interface, and the expansion interface is connected to the high-power high-frequency RFID module through an FPC cable; The circuit also includes a power supply circuit, the enable end of the MTK platform chip is connected to the signal input end of the power supply circuit, and the first power supply end of the power supply circuit is connected to the second power supply end of the expansion interface.

2. The high-power high-frequency RFID circuit based on the MTK platform according to claim 1, characterized in that: When the communication interface of the high-power high-frequency RFID module is a UART serial port, the AB4 pin, AA7 pin, W7 pin and M26 pin of the MTK platform chip serve as the first communication interface, and the third pin, fourth pin, fifth pin and sixth pin of the expansion interface serve as the second communication interface.

3. The high-power high-frequency RFID circuit based on the MTK platform according to claim 1, characterized in that: When the communication interface of the high-power high-frequency RFID module is an I2C interface, the J3 pin and the J4 pin of the MTK platform chip serve as the first communication interface, and the fifteenth pin and the sixteenth pin of the extension interface serve as the second communication interface.

4. The high-power high-frequency RFID circuit based on the MTK platform according to claim 1, characterized in that: When the communication interface of the high-power high-frequency RFID module is an SPI interface, the AD1 pin, AC1 pin, AC2 pin and AD2 pin of the MTK platform chip serve as the first communication interface, and the eighth pin, ninth pin, tenth pin and eleventh pin of the extension interface serve as the second communication interface.

5. The high-power high-frequency RFID circuit based on the MTK platform according to claim 1, characterized in that: When the communication interface of the high-power high-frequency RFID module is a USB interface, the C27 pin and the B27 pin of the MTK platform chip serve as the first communication interface, and the eighteenth pin and the nineteenth pin of the extension interface serve as the second communication interface.

6. The high-power high-frequency RFID circuit based on the MTK platform according to claim 1, characterized in that: When the communication interface of the high-power high-frequency RFID module is a USB interface, the first communication interface is connected to the second communication interface through a USB analog switching circuit.

7. The high-power high-frequency RFID circuit based on the MTK platform according to claim 6, characterized in that: The USB analog switching circuit includes an analog switch chip, and the analog switch chip is provided with a master USB interface and a slave USB interface; wherein the fourth pin and the fifth pin of the analog switch chip serve as the master USB interface, and the sixth pin and the seventh pin of the analog switch chip serve as the slave USB interface; The signal detection end of the analog switch chip is connected to the first communication interface, and the slave USB interface is connected to the second communication interface; wherein the first pin and the second pin of the analog switch chip serve as the signal detection end.

8. The high-power high-frequency RFID circuit based on the MTK platform according to claim 1, characterized in that: The power supply circuit includes a power chip, a twenty-third resistor, a twenty-fourth resistor and a battery power supply, wherein the first end of the twenty-third resistor is connected to the first end of the twenty-fourth resistor, and the connection point thereof serves as a signal input end of the power supply circuit, the second end of the twenty-third resistor is connected to the fourth end of the power chip, and the fifth end of the power chip is connected to the battery power supply; wherein a sixth capacitor and a seventh capacitor are arranged in parallel between the power chip and the battery power supply.

9. The high-power high-frequency RFID circuit based on the MTK platform according to claim 8, characterized in that: The power supply circuit includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth coil, a nineteenth resistor and a twentieth resistor; The first end of the first capacitor is connected to the first end of the power chip, the second end of the first capacitor is connected to the first end of the sixth coil, and the connection point is connected to the sixth end of the power chip, the first end of the second capacitor is simultaneously connected to the first end of the nineteenth resistor and the first end of the twentieth resistor, and the connection point is connected to the third end of the power chip, the second end of the sixth coil is simultaneously connected to the second end of the second capacitor, the second end of the nineteenth resistor, the first end of the third capacitor, the first end of the fourth capacitor, and the first end of the fifth capacitor, and the connection point serves as the first power supply end of the power supply circuit.

10. The high-power high-frequency RFID circuit based on the MTK platform according to claim 1, characterized in that: The outer surface of the FPC cable is covered with an electromagnetic shielding film.

Images