Blue light enhanced sunlight full spectrum LED lamp bead and manufacturing process and method thereof

Abstract

The invention discloses a blue light enhanced sunlight full spectrum LED lamp bead and a manufacturing process and method thereof, and belongs to the technical field of LED lamp bead production, the blue light enhanced sunlight full spectrum LED lamp bead comprises the following structures: an LED chip, a fluorescent coating, a carrier material, a packaging material, a heat dissipation material and a driving circuit; the carrier material is arranged on the periphery of the LED chip in a point coating mode, uniform distribution of the carrier material can be effectively guaranteed, the stability of the LED chip installed on the support can be guaranteed, uniform stress of the LED chip is guaranteed, the service life of the LED chip is prolonged, meanwhile, after a driving circuit is installed, various performance tests are conducted, and the service life of the LED chip is prolonged. According to the LED lamp bead, the use effect of a finished product in an extreme environment can be guaranteed, lamp beads are 2835 lamp beads, the color rendering index of the lamp beads is 97 or above, the average color rendering index of the lamp beads is 98, the wavelength of the lamp beads is 380-780 nm, and the lamp beads emit light at the angle of 15 degrees, so that the overall performance and the use effect of the final product are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED lamp bead production, and particularly relates to a blue-light enhanced sunlight full-spectrum LED lamp bead and its manufacturing process and method. Background Art

[0002] The working principle of an LED lamp bead is based on the PN junction characteristics of semiconductor materials. When a forward bias voltage is applied, the potential barrier of the PN junction drops, and holes in the P region and electrons in the N region diffuse towards each other. Near the PN junction, when electrons and holes recombine, the excess energy is released in the form of light, thereby generating light. During production, the manufacturing process and method of LED lamp beads need to be applied.

[0003] Chinese Patent Publication (CN105789410B) discloses an anti-sulfuration LED lamp bead and its manufacturing process, aiming to provide an anti-sulfuration LED lamp bead and its manufacturing process that can not only effectively prevent sulfur elements and the like from passing through the fluorescent glue and entering the bottom of the bracket to react with silver by sulfuration, but also effectively prevent problems such as LED chip peeling and falling off. It includes a bracket, a receiving groove provided on the bracket, and an LED chip provided on the bottom surface of the receiving groove. The feature is that an epoxy resin isolation layer is provided on the bottom surface of the receiving groove, the bottom surface of the LED chip is located within the epoxy resin isolation layer, and the top surface of the LED chip is located above the epoxy resin isolation layer. Although the current LED lamp bead manufacturing process can achieve the production of LED lamp beads, it does not classify the lamp beads at the end, resulting in the inability to achieve personalized configuration of the lamp beads and poor actual application effects. To solve this problem, there is an urgent need for a blue-light enhanced sunlight full-spectrum LED lamp bead and its manufacturing process and method. Summary of the Invention

[0004] The purpose of the present invention is to propose a blue-light enhanced sunlight full-spectrum LED lamp bead and its manufacturing process and method to solve the problem that although the current LED lamp bead manufacturing process can achieve the production of LED lamp beads, it does not classify the lamp beads at the end, resulting in the inability to achieve personalized configuration of the lamp beads and poor actual application effects.

[0005] To achieve the above purpose, the present invention adopts the following technical scheme: A blue-light enhanced sunlight full-spectrum LED lamp bead includes the following structures: an LED chip, a fluorescent coating, a carrier material, a packaging material, a heat dissipation material, and a driving circuit.

[0006] As a further description of the above technical scheme:

[0007] The LED chip is made of a specific semiconductor material capable of emitting blue light and can emit blue light. The mounting bracket is made of a metal material with high temperature resistance and high conductivity, and the packaging material is selected from one of transparent silicone and epoxy resin.

[0008] This article also discloses a manufacturing process and method for blue light enhanced sunlight full-spectrum LED lamp beads, including the following steps:

[0009] S1. Inspect each group of materials;

[0010] S2. Take out the mounting bracket and perform certain processing on it;

[0011] S3. Take out the LED chip and fixedly install it on the bracket;

[0012] S4. Dot an appropriate amount of carrier material around the LED chip;

[0013] S5. Perform phosphor coating;

[0014] S6. Place the LED lamp beads coated with phosphor in a drying oven for drying;

[0015] S7. Conduct performance testing;

[0016] S8. Perform spectral separation and color separation processing on the LED lamp beads;

[0017] S9. Package and store the finished products.

[0018] As a further description of the above technical solution:

[0019] In step S2, when taking out the mounting bracket and performing certain processing on it, the processing steps are: place the mounting bracket in a cleaning device, add cleaning liquid for ultrasonic cleaning, and quickly dry it after cleaning to ensure that the surface is clean and free of impurities.

[0020] As a further description of the above technical solution:

[0021] In step S3, when taking out the LED chip and fixedly installing it on the bracket, the fixing method adopts one of conductive adhesive bonding and welding.

[0022] As a further description of the above technical solution:

[0023] In step S4, when dotting an appropriate amount of carrier material around the LED chip, the thickness of the applied carrier material is 4 - 6 mm, and pay attention to controlling the dotting amount and position during the dotting process.

[0024] As a further description of the above technical solution:

[0025] In step S5, when performing phosphor coating, different spectral distributions and color qualities are achieved by adjusting the ratio of the phosphor and the coating process.

[0026] As a further description of the above technical solution:

[0027] In S6, the LED chip coated with phosphor is installed on a bracket and encapsulated using encapsulation materials. After encapsulation, a heat dissipation structure is installed on one side of the LED chip and placed in a drying oven for drying to heat and cure the materials. The drying temperature is 40 - 60 °C and the drying time is 15 - 20 min.

[0028] As a further description of the above technical solution:

[0029] In S7, a drive circuit is installed and performance tests are conducted. The performance tests mainly include luminous flux test, color temperature test, and color rendering index test.

[0030] As a further description of the above technical solution:

[0031] In S8, the LED lamp beads are subjected to spectral separation and color separation processing, and the lamp beads with the same light color and brightness are grouped into one category for different groupings.

[0032] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are as follows:

[0033] This method arranges the carrier material around the LED chip by means of dot coating, which can effectively ensure the uniform distribution of the carrier material, thus ensuring the stability of the LED chip installed on the bracket, ensuring the uniform stress of the LED chip, improving the service life of the LED chip. At the same time, after the drive circuit is installed, various performance tests are carried out, which can ensure the use effect of the finished product in extreme environments. And the lamp beads use 2835 lamp beads, with a color rendering index of over 97, an average color rendering index of 98, a wavelength of 380 - 780 nm, and light emission at a 15-degree angle, improving the overall performance and use effect of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a flowchart of a manufacturing process and method for blue light enhanced sunlight full-spectrum LED lamp beads. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0036] Embodiment 1

[0037] Please refer to Figure 1, the present invention provides a technical solution: a blue light enhanced sunlight full-spectrum LED lamp bead, including the following structures: an LED chip, a fluorescent coating, a carrier material, a packaging material, a heat dissipation material, and a driving circuit. Among them, the LED chip is made of a specific semiconductor material capable of emitting blue light and can emit blue light. The mounting bracket is made of a metal material with high temperature resistance and high conductivity, and the packaging material is selected as transparent silicone.

[0038] This article also discloses a manufacturing process and method for blue light enhanced sunlight full-spectrum LED lamp beads, including the following steps:

[0039] S1. Check each group of materials;

[0040] S2. Take out the mounting bracket and perform certain processing on it. The processing steps are as follows: Place the mounting bracket in a cleaning device, add a cleaning solution for ultrasonic cleaning, and quickly dry it after cleaning to ensure that the surface is clean and free of impurities;

[0041] S3. Take out the LED chip and fix it on the bracket. The fixing method is welding;

[0042] S4. Dot-apply an appropriate amount of carrier material around the LED chip. The thickness of the applied carrier material is 4 mm. Pay attention to controlling the dot-application amount and position during the dot-application process;

[0043] S5. Perform phosphor coating. By adjusting the ratio and coating process of the phosphor, different spectral distributions and color qualities can be achieved;

[0044] S6. Install the LED chip coated with phosphor on the bracket and encapsulate it with the packaging material. After encapsulation, install the heat dissipation structure on one side of the LED chip, place it in a drying oven for drying to heat and cure the materials. The drying temperature is 40 °C and the drying time is 15 min;

[0045] S7. Install the driving circuit and perform performance tests. The performance tests mainly include luminous flux test, color temperature test, and color rendering index test;

[0046] S8. Perform spectral separation and color separation on the LED lamp beads, classify the lamp beads with the same light color and brightness into one category, and perform different groupings;

[0047] S9. Package and store the finished products.

[0048] In this embodiment, the carrier material is arranged around the LED chip by dot-application, which can effectively ensure the uniform distribution of the carrier material, thereby ensuring the stability of the LED chip installed on the bracket, ensuring the uniform stress of the LED chip, and improving the service life of the LED chip.

[0049] Example 2

[0050] Please refer to Figure 1 , the present invention provides a technical solution: a blue light enhanced sunlight full-spectrum LED lamp bead, including the following structures: an LED chip, a fluorescent coating, a carrier material, a packaging material, a heat dissipation material and a driving circuit. Among them, the LED chip is made of a specific semiconductor material capable of emitting blue light and can emit blue light. The mounting bracket is made of a metal material with high temperature resistance and high conductivity, and the packaging material is selected as epoxy resin.

[0051] This article also discloses a manufacturing process and method for blue light enhanced sunlight full-spectrum LED lamp beads, including the following steps:

[0052] S1. Inspect each group of materials;

[0053] S2. Take out the mounting bracket and perform certain processing on it. The processing steps are as follows: Place the mounting bracket in a cleaning device, add a cleaning solution for ultrasonic cleaning, and quickly dry it after cleaning to ensure that the surface is clean and free of impurities;

[0054] S3. Take out the LED chip and fixedly install it on the bracket. The fixing method is to bond and fix it with conductive glue;

[0055] S4. Dot an appropriate amount of carrier material around the LED chip. The thickness of the applied carrier material is 5 mm. Pay attention to controlling the dotting amount and position during the dotting process;

[0056] S5. Perform phosphor coating. By adjusting the ratio and coating process of the phosphor, different spectral distributions and color qualities can be achieved;

[0057] S6. Install the LED chip coated with phosphor on the bracket and encapsulate it with the packaging material. After encapsulation, install the heat dissipation structure on one side of the LED chip and place it in a drying oven for drying to heat and cure the materials. The drying temperature is 50 °C and the drying time is 20 min;

[0058] S7. Install the driving circuit and perform performance tests. The performance tests mainly include luminous flux test, color temperature test and color rendering index test;

[0059] S8. Perform spectral sorting and color separation on the LED lamp beads, classify the lamp beads with the same light color and brightness into one category, and perform different groupings;

[0060] S9. Package and store the finished products.

[0061] In this embodiment, after the driving circuit is installed, various performance tests are carried out, which can ensure the use effect of the finished product in extreme environments. Moreover, the lamp beads use 2835 lamp beads, with a color rendering index of over 97, an average color rendering index of 98, a wavelength of 380 - 780 nm, and a light emission at a 15-degree angle, improving the overall performance and use effect of the final product.

[0062] Example 3

[0063] Please refer to Figure 1 , the present invention provides a technical solution: a blue light enhanced sunlight full spectrum LED lamp bead, including the following structures: an LED chip, a fluorescent coating, a carrier material, a packaging material, a heat dissipation material and a driving circuit. Among them, the LED chip is made of a specific semiconductor material capable of emitting blue light and can emit blue light. The mounting bracket is made of a metal material with high temperature resistance and high conductivity, and the packaging material is selected as transparent silica gel.

[0064] This article also discloses a manufacturing process and method for blue light enhanced sunlight full spectrum LED lamp beads, including the following steps:

[0065] S1. Check each group of materials;

[0066] S2. Take out the mounting bracket and perform certain processing on it. The processing steps are: place the mounting bracket in a cleaning device, add a cleaning solution for ultrasonic cleaning, and quickly dry it after cleaning to ensure that the surface is clean and free of impurities;

[0067] S3. Take out the LED chip and fixedly install it on the bracket. The fixing method is to bond and fix it with conductive glue;

[0068] S4. Dot an appropriate amount of carrier material around the LED chip. The thickness of the applied carrier material is 6 mm. Pay attention to controlling the dotting amount and position during the dotting process;

[0069] S5. Perform phosphor coating. By adjusting the ratio and coating process of the phosphor, different spectral distributions and color qualities can be achieved;

[0070] S6. Install the LED chip coated with phosphor on the bracket and encapsulate it with the packaging material. After encapsulation, install the heat dissipation structure on one side of the LED chip, place it in a drying oven for drying to heat and cure the material. The drying temperature is 60 °C and the drying time is 20 min;

[0071] S7. Install the driving circuit and perform performance tests. The performance tests mainly include luminous flux test, color temperature test and color rendering index test;

[0072] S8. Perform spectral sorting and color sorting on the LED lamp beads, classify the lamp beads with the same light color and brightness into one category, and perform different groupings;

[0073] S9. Package and store the finished products.

[0074] In this embodiment, the carrier material is arranged around the LED chip by means of dot coating, which can effectively ensure the uniform distribution of the carrier material, thus ensuring the stability of the LED chip mounted on the bracket, ensuring the uniform stress on the LED chip, improving the service life of the LED chip. At the same time, after the driving circuit is installed, various performance tests are carried out, which can ensure the use effect of the finished product in extreme environments. The lamp beads adopt 2835 lamp beads, with a color rendering index of over 97 and an average color rendering index of 98, a wavelength of 380 - 780 nm, and the light emission at a 15-degree angle, improving the overall performance and use effect of the final product.

[0075] In Embodiments 1 - 3, it should be noted that:

[0076] The principle of the phosphor ratio applied is as follows:

[0077] 1. When a certain color temperature range or a certain X, Y coordinate point is required, it is necessary to know the wavelength of the blue light chip used. When the wavelength of the chip used (chip wavelength 460 nm in the figure) is known and the coordinate point (x0.44y0.41) to be achieved is known, at this time, a straight line is connected between the chip wavelength point and the coordinate points x and y to be achieved on the CIE diagram and extended to the upper CIE wavelength point. At this time, this wavelength extension point is the emission wavelength of the phosphor required (target phosphor wavelength ~ 585 nm). Therefore, to achieve this color coordinate, the phosphor of this wavelength is required.

[0078] 2. After finding the wavelength of the target phosphor, it is necessary to find the corresponding phosphor to make. However, if only one phosphor is used, the color rendering is relatively low. Therefore, more than two phosphors need to be used for blending, such as red phosphor + green phosphor (the target phosphor wavelength required can be obtained according to the principle of light superposition and color mixing of red phosphor + green phosphor). How to select two phosphors? How to adjust the ratio of the two phosphors? This involves the target phosphor wavelength of the color coordinate to be made and the required color rendering index. The appropriate ratio of red and green phosphors can obtain the required phosphor wavelength. When a higher Ra is required, a red phosphor with a longer wavelength, such as a 650-nm red phosphor (the wider the spectrum, the higher the color rendering index), can be selected and combined with a green phosphor with a wavelength of about 520 nm. It is very easy to achieve a color rendering index of over 98. (When finding the wavelength of the target phosphor required, according to the method in subtitle (1), the product already made is tested to obtain a coordinate point and a straight line is made with the blue light chip wavelength and extended to the wavelength point above the CIE; if the wavelength of this point is longer than the wavelength of the target phosphor, then the proportion of the red phosphor needs to be reduced, and if it is shorter than the target wavelength, the proportion of the red phosphor needs to be increased).

[0079] 3. When the appropriate red, green, and pink phosphors are found and the ratio of the target phosphor is also determined (the ratio of the red phosphor to the green phosphor remains unchanged), if the coordinate points of the product still deviate from the required coordinate points, you can observe on the CIE that the color coordinates of the product, the color coordinate point you want, the wavelength point of the blue LED chip, and the wavelength point of the target phosphor are basically on a straight line. At this time, only the ratio of the silicone to the phosphor (red phosphor + green phosphor) needs to be adjusted. When the color coordinates are lower than the target coordinates, increase the phosphor concentration; when the color coordinates are higher than the target coordinates, decrease the phosphor concentration.

[0080] As described above, it is only the preferred specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A blue light enhanced sunlight full spectrum LED lamp bead, characterized by: The invention comprises the following structures: LED chip, fluorescent coating, carrier material, packaging material, heat dissipation material and driving circuit.

2. The blue light enhanced sunlight full spectrum LED lamp bead according to claim 1, characterized in that: The LED chip is made of a specific semiconductor material capable of emitting blue light, the mounting bracket is made of a high-temperature resistant and highly conductive metal material, and the packaging material is selected from one of transparent silicone and epoxy resin.

3. A production process and method for blue light enhanced sunlight full spectrum LED lamp beads, characterized by: The steps include: S1. Check each group of materials; S2, take out the mounting bracket and process it in a certain way; S3, take out the LED chip and install it on the bracket; S4. Apply an appropriate amount of carrier material around the LED chip; S5, applying phosphor powder; S6, placing the LED lamp beads coated with fluorescent powder in a drying box for drying; S7. Perform performance test; S8, performing light separation and color separation on the LED lamp beads; S9. Pack and store the finished products.

4. The manufacturing process and method of blue light enhanced sunlight full spectrum LED lamp beads according to claim 3 is characterized in that: In S2, the mounting bracket is taken out and subjected to certain treatment, wherein the treatment steps are as follows: the mounting bracket is placed in a cleaning device, a cleaning liquid is added for ultrasonic cleaning, and the mounting bracket is quickly dried after cleaning to ensure that the surface is clean and free of impurities.

5. According to claim 3, a blue light enhanced sunlight full spectrum LED lamp bead manufacturing process and method, characterized in that: In S3, the LED chip is taken out and fixed on the bracket, and the fixing method is one of conductive adhesive bonding and welding.

6. The manufacturing process and method of blue light enhanced sunlight full spectrum LED lamp beads according to claim 3 is characterized in that: In the above S4, a proper amount of carrier material is dotted around the LED chip. The thickness of the applied carrier material is 4-6 mm. During the dot-coating process, attention should be paid to controlling the dot-coating amount and position.

7. The manufacturing process and method of blue light enhanced sunlight full spectrum LED lamp beads according to claim 3 is characterized in that: In S5, phosphor coating is performed, and different spectral distributions and color qualities are achieved by adjusting the phosphor ratio and coating process.

8. The manufacturing process and method of blue light enhanced sunlight full spectrum LED lamp beads according to claim 3 is characterized in that: In S6, the LED chip coated with phosphor is mounted on a bracket and packaged with a packaging material. After packaging, a heat dissipation structure is mounted on one side of the LED chip and placed in a drying box for drying to heat and solidify the material. The drying temperature is 40-60°C and the drying time is 15-20 minutes.

9. The manufacturing process and method of blue light enhanced sunlight full spectrum LED lamp beads according to claim 3, characterized in that: In S7, the driving circuit is installed and a performance test is performed. The performance test mainly includes a luminous flux test, a color temperature test, and a color rendering test.

10. The manufacturing process and method of blue light enhanced sunlight full spectrum LED lamp beads according to claim 3, characterized in that: In the above S8, the LED lamp beads are subjected to light separation and color separation processing, and the lamp beads with the same light color and brightness are classified into one category and divided into different groups.

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