LED lamp bead, preparation method thereof and backlight module

Abstract

The invention discloses an LED lamp bead, a preparation method thereof and a backlight module, and relates to the field of semiconductor photoelectric devices. The LED lamp bead comprises: a substrate; the LED chip is fixedly arranged on the substrate; the light distribution component is provided with a light distribution channel and an accommodating hole; the light distribution component is fixedly connected with the substrate; the accommodating hole and the substrate are enclosed to form an accommodating cavity for accommodating the LED chip; the light scattering component is provided with a plurality of light outlets; the light scattering component is fixedly connected with the light distribution component; one end of the light distribution channel is communicated with the containing cavity, and the other end of the light distribution channel is communicated with the light outlet, so that light emitted by the LED chip is distributed through the light distribution channel and then is emitted out through the light outlet. According to the LED lamp, the light-emitting angle of the LED lamp beads can be increased.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor optoelectronic devices, and in particular to an LED lamp bead, a preparation method thereof, and a backlight module. Background Art

[0002] Conventional LED lamp beads usually have good directivity (strong central light intensity and weak peripheral light intensity), that is, their emission angles are small, resulting in uneven light distribution and making it difficult to meet the requirements of large-range uniform illumination. On the other hand, existing backlight modules for displays usually consist of a substrate, LED lamp beads, lenses, and diffusion sheets; the smaller the emission angle of the LED lamp beads, the stronger the light intensity directly above the LED lamp beads and the weaker the light intensity at the edges, resulting in alternating bright and dark, that is, uneven light mixing; at this time, it is necessary to reduce the spacing between the LED lamp beads so that the emission edges of two LED lamp beads overlap to achieve the same emission intensity as directly above the LED lamp beads. After reducing the spacing between the LED lamp beads, a larger number of LED lamp beads are required. In addition, when the emission angle of the LED lamp beads is small, without reducing the spacing between the LED lamp beads, if a uniform light mixing effect is to be obtained, it is necessary to increase the distance between the LED and the diffusion sheet (light mixing distance) so that the light emitted from the edges of the LED lamp beads overlaps at a farther place, and at this time the backlight module will be thicker. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a flip-chip LED lamp bead and a preparation method thereof, which can increase the emission angle of the LED lamp bead.

[0004] Another technical problem to be solved by the present invention is to provide a backlight module.

[0005] To solve the above problems, the present invention discloses an LED lamp bead, which includes: A substrate; An LED chip, which is fixed on the substrate; A light distribution component, which is provided with a light distribution channel and a receiving hole; the light distribution component is fixedly connected to the substrate; the receiving hole and the substrate enclose a receiving cavity for receiving the LED chip; and A light scattering component, which is provided with a plurality of light exit ports; the light scattering component is fixedly connected to the light distribution component; One end of the light distribution channel is communicated with the receiving cavity, and the other end is communicated with the light exit port, so that the light emitted by the LED chip is distributed through the light distribution channel and then emitted through the light exit port.

[0006] As an improvement of the above technical solution, the cross-section of the light scattering component is rectangular, and a plurality of light exit ports are arrayed on its surface; The light-emitting ports are distributed along the first direction and / or the second direction of the light-scattering component; the first direction is perpendicular to the second direction.

[0007] As an improvement to the above technical solution, the accommodating hole is hemispherical; The longitudinal section of the light-emitting port is trapezoidal in reverse.

[0008] As an improvement to the above technical solution, the light-emitting port includes a first light-emitting port and a second light-emitting port. The projection of the first light-emitting port on the substrate is located inside the projection of the accommodating hole on the substrate; the projection of the second light-emitting port on the substrate is located outside the projection of the accommodating hole on the substrate; The light distribution channel includes a first light distribution channel and a second light distribution channel. The first light distribution channel is used to connect the first light-emitting port and the accommodating cavity, and the second light distribution channel is used to connect the second light-emitting port and the accommodating cavity; The width of the first light distribution channel remains consistent from one side of the accommodating cavity to one side of the first light-emitting port, and the width of the second light distribution channel gradually increases from one side of the accommodating cavity to one side of the second light-emitting port.

[0009] As an improvement to the above technical solution, the accommodating hole and the light distribution channel are both filled with a phosphor formed by curing a fluorescent glue; The light-emitting port is filled with a light-scattering body formed by curing a light-scattering glue; the light-scattering glue includes silicone resin and light-scattering particles, and the content of the light-scattering particles in the light-scattering glue is 1 wt% to 5 wt%; the light-scattering particles are PMMA microspheres, PS microspheres or silicone resin particles.

[0010] Correspondingly, the present invention also discloses a preparation method of an LED lamp bead for preparing the above-mentioned LED lamp bead, which includes: Forming a light-emitting port on a first substrate to obtain a light-scattering component; Forming an accommodating hole and a light distribution channel on a second substrate to obtain a light distribution component; Fixing an LED chip to a substrate to obtain a first intermediate; Fixing and connecting the first intermediate with the light distribution component and the light-scattering component to obtain an LED lamp bead.

[0011] As an improvement to the above technical solution, the step of forming a light-emitting port on the first substrate to obtain a light-scattering component includes: Providing a first substrate; Opening a plurality of light-emitting ports penetrating the first substrate on the first substrate to obtain a second intermediate; Forming a first adhesive layer on the surface of the second intermediate; Filling the light-diffusing glue in the light outlet and curing it to form a light-diffusing body; The first adhesive layer is removed to obtain a light-scattering component.

[0012] As an improvement of the above technical solution, the step of forming the accommodation hole and the light distribution channel on the second substrate to obtain the light distribution component includes: providing a second substrate; forming a receiving hole on one side of the second substrate; forming a light distribution channel connected to the containing hole on a side of the second substrate away from the containing hole to obtain a third intermediate; A reflective layer is formed on the surfaces of the accommodating hole and the light distribution channel to obtain a light distribution component.

[0013] As an improvement of the above technical solution, the step of fixedly connecting the first intermediate body with the light distribution component and the light scattering component to obtain the LED lamp bead includes: The light scattering component is fixedly connected to the light distribution component to obtain a fourth intermediate body; Injecting packaging glue or fluorescent glue into the containing hole and the light distribution channel of the fourth intermediate body to obtain a fifth intermediate body; forming a second adhesive layer on the substrate of the first intermediate to obtain a sixth intermediate; The fifth intermediate is bonded to the sixth intermediate, and the fluorescent glue or packaging glue is cured to obtain an LED lamp bead.

[0014] Correspondingly, the present invention also discloses a backlight module, which includes the above-mentioned LED lamp beads.

[0015] The implementation of the present invention has the following beneficial effects: The LED lamp bead in one embodiment of the present invention includes a substrate, an LED chip, a light distribution component and a light scattering component. The light distribution component is provided with a receiving hole and a light distribution channel, which is fixedly connected to the substrate. The receiving hole and the substrate are enclosed to form a receiving cavity, and the LED chip is arranged in the receiving cavity. The light scattering component is fixedly connected to the light distribution component, and a plurality of light outlets are provided. One end of the light distribution channel is connected to the receiving cavity, and the other end is connected to the light outlet. Based on the above structure, the light emitted by the LED chip can be distributed to the light outlet through the light distribution channel, which forms a surface light source with uniform light output, thereby effectively improving the lighting effect. At the same time, the number of LED chips used in the backlight module based on the LED lamp bead is reduced, and the cost and power consumption of the backlight module are reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the cross-sectional structure of an LED lamp bead in one embodiment of the present invention; Figure 2It is a top view structural schematic diagram of an astigmatic component in an embodiment of the present invention; Figure 3 It is a cross-sectional structural schematic diagram of a second intermediate after step S14 in an embodiment of the present invention; Figure 4 It is a cross-sectional structural schematic diagram of a third intermediate after step S23 in an embodiment of the present invention; Figure 5 It is a cross-sectional structural schematic diagram of a fifth intermediate after step S42 in an embodiment of the present invention; Figure 6 It is a schematic diagram of the principle of bonding between a fifth intermediate and a sixth intermediate in step S44 in an embodiment of the present invention.

[0017] In the figure, 1 is a substrate, 2 is an LED chip, 3 is a light distribution component, 31 is a receiving hole, 32 is a light distribution channel, 321 is a first light distribution channel, 322 is a second light distribution channel, 4 is an astigmatic component, 41 is a light output port, 411 is a first light output port, 412 is a second light output port, 5 is a receiving cavity, 6 is a phosphor, 7 is an astigmatic body, 110 is a first base material, 120 is a first bonding layer, 200 is a second base material, 300 is a fifth intermediate, 400 is a sixth intermediate, and 410 is a second bonding layer. Detailed implementation manners

[0018] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0020] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of this application, "a plurality of" means two or more unless otherwise specifically defined.

[0021] In the description of this application, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection, an electrical connection or a connection capable of mutual communication; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] See Figure 1 , an embodiment of the present invention discloses an LED lamp bead, which includes a substrate 1, an LED chip 2, a light distribution component 3 and a light scattering component 4. The light distribution component 3 is provided with a receiving hole 31 and a light distribution channel 32. One side of the light distribution component 3 is fixedly connected to the substrate 1, and the receiving hole 31 and the substrate 1 enclose a receiving cavity 5, and the LED chip 2 is arranged in the receiving cavity 5. The other side of the light distribution component 3 is fixedly connected to the light scattering component 4. The light scattering component 4 is provided with a plurality of light output ports 41. One end of the light distribution channel 32 is communicated with the receiving cavity 5, and the other end is communicated with the light output ports 41. Based on the above structure, the light emitted by the LED chip 2 can be distributed to the light output ports 41 through the light distribution channel 32 and emitted, which forms a surface light source with uniform light output, thereby effectively improving the lighting effect. At the same time, the number of LED chips 2 used in the backlight module based on this LED lamp bead is reduced, and the cost and power consumption of the backlight module are reduced.

[0023] Specifically, the substrate 1 is a commonly used BT substrate, FR-4 substrate or ceramic substrate in the art, but not limited thereto. The LED chip 2 can be a blue LED chip, a green LED chip, a red LED chip or a purple LED chip, but not limited thereto. Preferably, the LED chip 2 is a blue LED chip, which has the characteristics of high brightness and low energy consumption.

[0024] Specifically, the optical distribution component 3 is made of materials such as PMMA (polymethyl methacrylate), PC (polycarbonate), and PS (polystyrene). To ensure the optical distribution effect, the optical distribution component 3 can be made of a material with a high overall reflectivity, or a reflective layer (not shown in the figure) can be provided on the surfaces of the optical distribution channels 32 and the accommodation holes 31 of the optical distribution component 3. The reflective layer can be a white paint layer or a metal layer to enhance the light reflectivity and the brightness of the LED lamp beads. Preferably, in some embodiments, the optical distribution component 3 is a PC board with a high reflectivity. After adding reflective fillers (such as TiO2, aluminum powder, etc.) to the PC preparation raw materials, it is produced by a melt extrusion process, and reflective layers are provided on the surfaces of the optical distribution channels 32 and the accommodation holes 31. The reflective layer is an Al metal layer deposited by chemical vapor deposition, which can further improve the light utilization rate.

[0025] Specifically, the accommodation holes 31 are opened on one side of the optical distribution component 3, and their depth is less than the thickness of the optical distribution component 3 to ensure the distribution of the light emitted by the LED chips 2 through the optical distribution channels 32. The longitudinal section of the accommodation holes 31 can be rectangular, semi-circular (or nearly semi-circular), elliptical, arched, or trapezoidal, but is not limited thereto. The cross-section of the accommodation holes 31 is rectangular, circular, elliptical, but is not limited thereto. It should be noted that the longitudinal section in the present invention refers to the section along the thickness direction of the substrate 1 (or the LED chip 2), and the cross-section refers to the section parallel to the plane of the substrate 1. The size of the accommodation holes 31, and the shapes of their cross-sections and longitudinal sections can be determined according to factors such as the specific number of LED chips 2 and the arrangement of the connection lines. In some embodiments, the LED lamp beads include 3 LED chips 2, namely a red LED chip, a green LED chip, and a blue LED chip. The accommodation holes 31 are generally hemispherical, that is, their cross-sections are circular and their longitudinal sections are semi-circular.

[0026] Specifically, the LED chips 2 are arranged in the accommodation cavities 5 formed by the enclosure of the accommodation holes 31 and the substrate 1 and are fixed by welding or bonding. The inside of the accommodation cavities 5 can also be filled with encapsulating glue or fluorescent glue to improve the light effect and protect the chips. Preferably, in some embodiments, the accommodation cavities 5 and the optical distribution channels 32 are both filled with phosphors 6 formed by curing fluorescent glue.

[0027] Specifically, one end of the optical distribution channel 32 is connected to the receiving hole 31, and the other end is connected to the light-emitting port 41. The inner wall of the channel is smooth and provided with a reflective layer to reduce light loss. The shape, quantity, and distribution position of the optical distribution channel 32 can be set according to specific application requirements. In some embodiments, the longitudinal section of the optical distribution channel 32 is linear, and multiple optical distribution channels 32 are radially distributed, that is, multiple optical distribution channels 32 radially extend around the center of the receiving hole 31. This distribution method can improve the uniformity of light distribution. Specifically, the cross-section of the optical distribution channel 32 can be circular or elliptical, but is not limited thereto. Preferably, in some embodiments, the receiving hole 31 is hemispherical, and one ends of multiple optical distribution channels 32 are evenly distributed on the spherical surface of the receiving hole 31.

[0028] Specifically, the light-diffusing component 4 can be made of materials such as PMMA, PC, PS, etc. The surface of the light-diffusing component 4 is provided with a light-emitting port 41 to achieve light emission. The light-emitting port 41 is a light-transmissive solid structure in the shape of a concave lens, or the light-emitting port 41 is a through-hole structure, but is not limited thereto. In addition, to prevent light leakage, the light-diffusing component 4 can reflect the light in parts other than the part that shoots towards the light-emitting port 41. For example, a highly reflective filler can be used to design the entire light-diffusing component 4 into a component with a high reflectivity, or a reflective layer can be designed on the side of the light-emitting port. The light-diffusing component 4 is integrally plate-shaped, and its cross-section can be circular, elliptical, or rectangular, which can be specifically determined according to the shape of the substrate 1, the quantity and shape of the LED chips 2. Preferably, in some embodiments, a light-diffusing body 7 formed by curing a light-diffusing glue is filled in the light-emitting port 41; the light-diffusing glue includes silicone resin and light-diffusing particles, and the content of the light-diffusing particles is 1 wt% - 5 wt%; the light-diffusing particles are PMMA microspheres, PS microspheres, or silicone resin particles. The main function of the light-diffusing body 7 is to make the light distribution more uniform through refraction and scattering, and improve the display effect.

[0029] Specifically, according to the requirements of light distribution, the cross-section of the light-emitting port 41 can be circular, elongated, square, or wavy, but is not limited thereto. The longitudinal section of the light-emitting port 41 is rectangular or trapezoidal, but is not limited thereto. Preferably, in some embodiments, the longitudinal section of the light-emitting port 41 is an inverted trapezoid, which can further optimize the light-diffusing effect, prevent glare; and can improve light uniformity and optimize the display effect.

[0030] Preferably, in some embodiments, referring to Figure 2 , the cross-section of the light-diffusing component 4 is rectangular, and a plurality of light-emitting ports 41 are arrayed and distributed on its surface. The light-emitting ports 41 are distributed along the first direction (length direction) and / or the second direction (width direction) of the light-diffusing component 4; the first direction is perpendicular to the second direction. Based on this distribution method, the light-emitting angle of the LED lamp beads can be further improved.

[0031] Preferably, in some embodiments, refer to Figure 1 , the light-emitting port 41 includes a first light-emitting port 411 and a second light-emitting port 412. The projection of the first light-emitting port 411 on the substrate 1 is located inside the projection of the accommodation hole 31 on the substrate 1; the projection of the second light-emitting port 412 on the substrate 1 is located outside the projection of the accommodation hole 31 on the substrate 1; the light distribution channel 32 includes a first light distribution channel 321 and a second light distribution channel 322. The first light distribution channel 321 is used to connect the first light-emitting port 411 and the accommodation cavity 5, and the second light distribution channel 322 is used to connect the second light-emitting port 412 and the accommodation cavity 5; the width of the first light distribution channel 321 remains consistent from one side of the accommodation cavity 5 to one side of the first light-emitting port 411, and the width of the second light distribution channel 322 gradually increases from one side of the accommodation cavity 5 to one side of the second light-emitting port 412. Through this design, not only the light distribution is effectively controlled, but also the overall brightness and color uniformity are significantly improved, ensuring a high-quality display effect at different viewing angles.

[0032] Correspondingly, the present invention also discloses a preparation method of an LED lamp bead for preparing the above-mentioned LED lamp bead, which specifically includes the following steps: S1: Form a light-emitting port on the first substrate to obtain a light-diffusing component; Specifically, the first substrate 110 can be a substrate with a high overall reflectivity. For example, after adding a reflective filler (such as TiO2, aluminum powder, etc.) to PC resin, a PC sheet produced by a melt extrusion process; it can also be a PMMA material with a high light transmittance.

[0033] Specifically, forming the light-emitting port 41 can refer to opening a hole in the first substrate 110 to form a through hole penetrating the first substrate 110; it can also refer to forming a concave lens structure at some positions by controlling the shape of the mold during the molding process to disperse light, but it is not limited thereto.

[0034] Preferably, in some embodiments, step S1 includes: S11: Provide a first substrate; Specifically, the first substrate 110 is a PC sheet with a high reflectivity, prepared by a melt extrusion process.

[0035] S12: Open a plurality of light-emitting ports penetrating the first substrate on the first substrate to obtain a second intermediate; Specifically, drill holes in the first substrate 110 to form the light-emitting port 41.

[0036] S13: Form a first adhesive layer on the surface of the second intermediate; Specifically, the first adhesive layer 120 is a UV film, but it is not limited thereto. Refer to Figure 3, the first adhesive layer 120 covers one side of the second intermediate. More specifically, when the longitudinal section of the light exit 41 is an inverted trapezoid, the first adhesive layer 120 covers the side of its short base. By forming a UV film, it can prevent the overflow from the light exit 41 during the injection of the diffusing glue, and optimize the specific morphology of the diffuser.

[0037] S14: Fill the light exit with diffusing glue and cure it to form a diffuser; Specifically, the diffusing glue is a transparent resin containing diffusing particles. The transparent resin can be epoxy resin, silicone resin, etc., but not limited thereto. The diffusing particles can be silica particles, barium sulfate particles, PMMA microspheres, PS microspheres or silicone resin particles, etc., but not limited thereto. Preferably, in some embodiments, the diffusing glue includes silicone resin and diffusing particles, and the content of the diffusing particles in the diffusing glue is 1-5 wt%; the diffusing particles are PMMA microspheres, PS microspheres or silicone resin particles.

[0038] After filling the light exit 41 with diffusing glue, it can be cured by ultraviolet light irradiation, high-temperature curing, etc., but not limited thereto. Preferably, in some embodiments, it is baked at 120°C to 150°C for 1h to 2h to achieve curing.

[0039] S15: Remove the first adhesive layer to obtain a diffusing component.

[0040] S2: Form a receiving hole and a light distribution channel on the second substrate to obtain a light distribution component; Specifically, the second substrate 200 can be a substrate with a high reflectivity as a whole, such as a PC board produced by a melt extrusion process after adding a reflective filler (such as TiO2, aluminum powder, etc.) to PC resin; or it can be a PMMA material with a high light transmittance.

[0041] Specifically, the receiving hole 31 and the light distribution channel 32 can be formed by a cutting process, such as by a laser cutting process, but not limited thereto.

[0042] Preferably, in some embodiments, step S2 includes: S21: Provide a second substrate; Specifically, the second substrate 200 is a PC board with a high reflectivity, which is prepared by a melt extrusion process.

[0043] S22: Form a receiving hole on one side of the second substrate; Specifically, the receiving hole 31 is formed on the second substrate 200 by a laser cutting process, but not limited thereto.

[0044] S23: Form a light distribution channel with one end communicating with the receiving hole on the side of the second substrate facing away from the receiving hole to obtain a third intermediate; Specifically, the optical distribution channel 32 can be formed by processes such as mechanical drilling and laser cutting, but is not limited thereto. The structure of the third intermediate obtained in this step is as shown in Figure 4 shown.

[0045] S24: Form a reflective layer on the surfaces of the accommodation holes and the optical distribution channels; Specifically, the entire third intermediate can be immersed in a reflective coating to form a reflective layer (not shown in the figure), or a reflective layer can be deposited on the inner surfaces of the accommodation holes 31 and the optical distribution channels 32 by chemical vapor deposition, but is not limited thereto.

[0046] S3: Fix the LED chip to the substrate to obtain a first intermediate; Specifically, the LED chip 2 can be fixed on the substrate 1 by fixing methods such as welding or bonding with a conductive adhesive, but is not limited thereto.

[0047] It should be noted that in the present invention, steps S1, S2, and S3 are not in a specific order, and can be implemented simultaneously or in any order, but are not limited thereto.

[0048] S4: Fix the first intermediate to the optical distribution component and the light diffusing component to obtain an LED lamp bead.

[0049] Specifically, the first intermediate can be connected to the optical distribution component and the light diffusing component in sequence, but is not limited thereto. Preferably, in some embodiments, step S4 includes: S41: Fix the light diffusing component to the optical distribution component to obtain a fourth intermediate; Specifically, an adhesive can be coated on the surface of the light diffusing component, and then the light diffusing component can be bonded to the optical distribution component 3, but is not limited thereto.

[0050] S42: Inject encapsulating glue or fluorescent glue into the accommodation holes and the optical distribution channels of the fourth intermediate to obtain a fifth intermediate; Specifically, in some embodiments, fluorescent glue or encapsulating glue is injected into the accommodation holes 31 and the optical distribution channels 32 of the fourth intermediate to obtain a fifth intermediate 300. The structure of the fifth intermediate 300 is as shown in Figure 5 shown.

[0051] S43: Form a second adhesive layer on the substrate of the first intermediate to obtain a sixth intermediate; Specifically, referring to Figure 6 , the second adhesive layer 410 is distributed in the area outside the accommodation holes 31.

[0052] S44: Bond the fifth intermediate to the sixth intermediate and cure the fluorescent glue or encapsulating glue to obtain an LED lamp bead.

[0053] Specifically, referring to Figure 6, the sixth intermediate 400 and the fifth intermediate 300 are bonded by a second bonding layer 410 provided on the sixth intermediate 400, but not limited thereto.

[0054] Preferably, in some embodiments, after curing is completed, it further includes a step of cutting the obtained LED lamp beads into individual lamp beads, but not limited thereto.

[0055] Correspondingly, the present invention also discloses a backlight module, which includes the above-mentioned LED lamp beads and a backplane for supporting and fixing the LED lamp beads. Specifically, the light-emitting angle of the LED lamp beads of the present invention can reach more than 170°, which also enables the thickness of the backlight module to be greatly reduced and eliminates the use of lenses.

[0056] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0057] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An LED lamp bead, characterized in that, include: substrate; An LED chip is fixed on the substrate; A light distribution component, which is provided with a light distribution channel and a receiving hole; the light distribution component is fixedly connected to the substrate; the receiving hole and the substrate are enclosed to form a receiving cavity for receiving the LED chip; and A light-scattering component, which is provided with a plurality of light outlets; the light-scattering component is fixedly connected to the light distribution component; One end of the light distribution channel is communicated with the accommodating cavity, and the other end is communicated with the light outlet, so that the light emitted by the LED chip is distributed through the light distribution channel and then emitted through the light outlet.

2. The LED lamp bead according to claim 1, characterized in that, The cross section of the light-scattering component is rectangular, and a plurality of light outlets are distributed in an array on its surface; The light outlets are distributed along a first direction and / or a second direction of the light scattering component; the first direction is perpendicular to the second direction.

3. The LED lamp bead according to claim 2, wherein The accommodating hole is hemispherical; the longitudinal section of the light outlet is in an inverted trapezoid.

4. The LED lamp bead according to claim 3, wherein The light outlet comprises a first light outlet and a second light outlet, wherein the projection of the first light outlet on the substrate is located inside the projection of the accommodating hole on the substrate; and the projection of the second light outlet on the substrate is located outside the projection of the accommodating hole on the substrate; The light distribution channel comprises a first light distribution channel and a second light distribution channel, the first light distribution channel is used to connect the first light outlet and the accommodating cavity, and the second light distribution channel is used to connect the second light outlet and the accommodating cavity; The width of the first light distribution channel is maintained consistent from one side of the accommodating cavity to one side of the first light outlet, and the width of the second light distribution channel is gradually increased from one side of the accommodating cavity to one side of the second light outlet.

5. The LED lamp bead according to claim 1, wherein The containing hole and the light distribution channel are both filled with fluorescent bodies formed by curing fluorescent glue; The light outlet is filled with a diffuser formed by curing diffuser glue; the diffuser glue includes silicone resin and diffuser particles, and the content of the diffuser particles in the diffuser glue is 1wt%~5wt%; the diffuser particles are PMMA microspheres, PS microspheres or silicone resin particles.

6. A method for preparing an LED lamp bead, which is used to prepare the LED lamp bead according to any one of claims 1 to 5, and is characterized in that, include: forming a light outlet on the first substrate to obtain a light scattering component; forming a receiving hole and a light distribution channel on the second substrate to obtain a light distribution component; Fixing the LED chip to the substrate to obtain a first intermediate; The first intermediate body is fixedly connected with the light distribution component and the light scattering component to obtain an LED lamp bead.

7. The manufacturing method of the LED lamp bead according to claim 6, characterized in that, The step of forming a light outlet on the first substrate to obtain a light scattering component comprises: providing a first substrate; Opening a plurality of light outlets penetrating the first substrate on the first substrate to obtain a second intermediate; forming a first adhesive layer on the surface of the second intermediate; Filling the light-diffusing glue in the light outlet and curing it to form a light-diffusing body; The first adhesive layer is removed to obtain a light-scattering component.

8. The manufacturing method of the LED lamp bead according to claim 6, wherein, The step of forming the accommodation hole and the light distribution channel on the second substrate to obtain the light distribution component comprises: providing a second substrate; forming a receiving hole on one side of the second substrate; forming a light distribution channel connected to the containing hole on a side of the second substrate away from the containing hole to obtain a third intermediate; A reflective layer is formed on the surfaces of the accommodating hole and the light distribution channel to obtain a light distribution component.

9. The preparation method of the LED lamp bead according to claim 6, wherein, The step of fixedly connecting the first intermediate with the optical distribution component and the light-scattering component to obtain an LED lamp bead includes: Fixedly connecting the light-scattering component with the optical distribution component to obtain a fourth intermediate; Injecting encapsulation glue or fluorescent glue into the accommodation hole and the optical distribution channel of the fourth intermediate to obtain a fifth intermediate; Forming a second adhesive layer on the substrate of the first intermediate to obtain a sixth intermediate; Bonding the fifth intermediate with the sixth intermediate, and curing the fluorescent glue or encapsulation glue to obtain an LED lamp bead.

10. A backlight module, characterized in that, An LED lamp bead according to any one of claims 1 to 5 is included.

Images