Paperboard adjusting and gluing synchronous processing method and system

Abstract

The invention relates to the technical field of paperboard processing, and discloses a paperboard adjusting and gluing synchronous processing method and system.The paperboard adjusting and gluing synchronous processing method comprises the steps that the distribution of paperboards is measured in real time, and the paperboard thickness, the paperboard angle, the edge position and the identification area of the paperboards are analyzed through the distribution; generating paperboard deformation data of the paperboard according to the paperboard thickness, the paperboard angle, the edge position and the identification area, and judging whether the paperboard is subjected to paperboard deformation adjustment or not according to the paperboard deformation data; the glue rheological property of the gluing head in the working area is detected; based on the paperboard deformation data, the rotation angle of the gluing head is analyzed, the moving distance of the gluing head is analyzed, and the glue pump flow of the gluing head is determined through the paperboard deformation data and the rheological property of glue; and according to the rotating angle, the moving distance and the glue pump flow, the gluing head and the paperboard are driven to be subjected to deformation synchronization, a deformation synchronization result is obtained, and the deformation synchronization result serves as a synchronous processing result between the paperboard and the gluing head. According to the invention, the reliability of synchronous treatment of paperboard adjustment and gluing can be improved.

Description

Technical Field

[0001] The present invention relates to a method and system for synchronous processing of cardboard adjustment and gluing, belonging to the technical field of cardboard processing. Background Art

[0002] Currently, the process of synchronous processing of cardboard adjustment and gluing refers to the process of adjusting the position, posture and gluing parameters of the cardboard to make the gluing process match the movement and state of the cardboard, so as to improve the gluing efficiency and quality.

[0003] At present, the traditional method captures the deformation of the cardboard by taking image data of the cardboard through a camera. The resolution of an ordinary camera may not be sufficient to capture the minute deformation of the cardboard. Especially during long-distance monitoring, the actual size corresponding to a single pixel is relatively large, resulting in a significant decrease in the accuracy of coordinate extraction. In addition, when the target texture is simple or the optical path is bent, it is difficult to provide reasonable and reliable deformation monitoring results using vision technology for deformation monitoring. This makes the reliability of capturing minute deformation by the traditional method insufficient. Secondly, the existing indicators for evaluating cardboard deformation have a single source and lack diversification. Thirdly, the traditional method of calculating the rotation angle of the glue applicator head using Euler angles or other methods may have problems such as gimbal lock, which makes the reliability of the traditional method of calculating the rotation angle of the glue applicator head insufficient. Therefore, the reliability of the existing synchronous processing of cardboard adjustment and gluing is insufficient. Summary of the Invention

[0004] The present invention provides a method and system for synchronous processing of cardboard adjustment and gluing, and its main purpose is to improve the reliability of synchronous processing of cardboard adjustment and gluing.

[0005] To achieve the above object, a method for synchronous processing of cardboard adjustment and gluing provided by the present invention includes:

[0006] Coating a fluorescent material on the cardboard to obtain a fluorescent cardboard. When the fluorescent cardboard enters the working area, the fluorescence distribution of the fluorescent cardboard is measured in real time, and the thickness, angle, edge position and identification area of the fluorescent cardboard are analyzed using the fluorescence distribution;

[0007] Generating cardboard deformation data of the fluorescent cardboard through the thickness, angle, edge position and identification area of the fluorescent cardboard, and using the cardboard deformation data to determine whether the fluorescent cardboard undergoes cardboard deformation adjustment;

[0008] When the fluorescent cardboard undergoes cardboard deformation adjustment, detecting the rheological properties of the glue flow of the glue applicator head in the working area, and uploading the cardboard deformation data and the rheological properties of the glue flow to the central controller in the working area;

[0009] In the central controller, based on the cardboard deformation data, analyze the rotation angle of the glue applicator head, based on the cardboard deformation data, analyze the moving distance of the glue applicator head, and use the cardboard deformation data and the rheological properties of the glue to determine the glue pump flow rate of the glue applicator head;

[0010] According to the rotation angle, the moving distance, and the glue pump flow rate, drive the deformation synchronization between the glue applicator head and the fluorescent cardboard to obtain a deformation synchronization result, and use the deformation synchronization result as the synchronization processing result between the fluorescent cardboard and the glue applicator head.

[0011] Optionally, coating the fluorescent material on the cardboard to obtain the fluorescent cardboard includes:

[0012] Identify the identification area of the cardboard;

[0013] Query the top vertex and the bottom vertex of the identification area;

[0014] Coat different wavelength fluorescences on the top vertex and the bottom vertex respectively to obtain fluorescent vertices;

[0015] Coat a protective resin outside the fluorescence of the fluorescent vertices to obtain protective vertices;

[0016] Use the cardboard containing the protective vertices as the fluorescent cardboard.

[0017] Optionally, using the fluorescence distribution to analyze the thickness, angle, edge position, and identification area of the fluorescent cardboard includes:

[0018] Obtain the fluorescence wavelength and fluorescence coordinates in the fluorescence distribution;

[0019] After matching the fluorescence wavelength with a preset wavelength, extract the vertex coordinates of the fluorescent cardboard from the fluorescence coordinates;

[0020] Determine the identification area of the fluorescent cardboard from the vertex coordinates;

[0021] Select the origin coordinates from the vertex coordinates;

[0022] Extract the two-dimensional plane coordinates of the vertex coordinates;

[0023] Perform principal component analysis on the two-dimensional plane coordinates to obtain the first principal component direction and the second principal component direction;

[0024] Use the following formula to calculate the thickness of the fluorescent cardboard:

[0025]

[0026] Where h represents the thickness of the fluorescent cardboard, I represents the measured fluorescence intensity of the fluorescent cardboard, μ represents the effective absorption coefficient of the fluorescent cardboard, and I0 represents the initial fluorescence intensity of the fluorescent cardboard;

[0027] Calculate the normal vector of the surface formed by the first principal component direction and the second principal component direction;

[0028] Perform vector normalization on the normal vector to obtain a normalized vector;

[0029] Determine the third direction through the normalized vector;

[0030] Construct a three-dimensional coordinate system of the fluorescent cardboard using the origin coordinates, the first principal component direction, the second principal component direction, and the third direction;

[0031] Identify the edge positions between the vertex coordinates;

[0032] Based on the three-dimensional coordinate system and the edge positions, calculate the fluorescent cardboard angle of the fluorescent cardboard using the following formula:

[0033]

[0034] Where θ x 、θ y 、θ z represent the fluorescent cardboard angle, θ x represents the fluorescent cardboard angle relative to the first principal component direction in the three-dimensional coordinate system, θ y represents the fluorescent cardboard angle relative to the second principal component direction in the three-dimensional coordinate system, θ z represents the fluorescent cardboard angle relative to the third direction in the three-dimensional coordinate system, Δz represents the projected distance of the edge position in the third direction, Δy represents the projected distance of the edge position in the second principal component direction, and Δx represents the projected distance of the edge position in the first principal component direction.

[0035] Optionally, the determining whether the fluorescent cardboard undergoes cardboard deformation adjustment using the cardboard deformation data includes:

[0036] Obtain the thickness of the fluorescent cardboard, the fluorescent cardboard angle, the edge position, and the identification area in the cardboard deformation data;

[0037] Calculate the standard deviation of the thickness of the fluorescent cardboard at consecutive moments;

[0038] Analyze the high-frequency energy value of the edge position;

[0039] Calculate the regional distance between the identification area and a preset template area;

[0040] Calculate the cardboard deformation score of the fluorescent cardboard according to the thickness standard deviation, the fluorescent cardboard angle, the high-frequency energy value, and the area distance by using the following formula:

[0041]

[0042] where Deformation Score represents the cardboard deformation score, w1, w2, w3, and w4 represent pre-fitted weight coefficients, and σ h represents the thickness standard deviation, h0 represents the reference thickness in the undeformed state, and θ x represents the fluorescent cardboard angle relative to the first principal component direction in the three-dimensional coordinate system, and θ y represents the fluorescent cardboard angle relative to the second principal component direction in the three-dimensional coordinate system, and θ z represents the fluorescent cardboard angle relative to the third direction in the three-dimensional coordinate system, E represents the high-frequency energy value, E0 represents the reference energy value in the undeformed state, D represents the area distance, and D max represents the maximum area distance;

[0043] Judge whether the fluorescent cardboard has cardboard deformation adjustment according to the score interval where the cardboard deformation score is located.

[0044] Optionally, the detection of the rheological properties of the glue flow of the glue applicator head in the working area includes:

[0045] After embedding a periodic nano-column array inside the glue applicator head, generate a photonic crystal microcavity inside the glue applicator head;

[0046] When the glue flow in the glue applicator head passes through the photonic crystal microcavity, identify the resonance wavelength of the photonic crystal microcavity;

[0047] Analyze the viscosity and shear stress of the glue based on the resonance wavelength;

[0048] When the glue flow in the glue applicator head passes through the photonic crystal microcavity, identify the transmitted light intensity corresponding to the photonic crystal microcavity;

[0049] Analyze the elastic modulus of the glue based on the transmitted light intensity;

[0050] Take the viscosity, the shear stress, and the elastic modulus as the rheological properties of the glue flow.

[0051] Optionally, the analysis of the rotation angle of the glue applicator head based on the cardboard deformation data includes:

[0052] Based on the cardboard deformation data, generate a rotation matrix of the glue applicator head by using a preset quaternion method;

[0053] The quaternion method includes:

[0054] R(θ x , θ y , θ z ) = Quaternions(θ x , θ y , θ z )

[0055] Among them, R(θ x , θ y , θ z ) represents a rotation matrix, and θ x represents the angle of the fluorescent cardboard relative to the first principal component direction in the three-dimensional coordinate system, and θ y represents the angle of the fluorescent cardboard relative to the second principal component direction in the three-dimensional coordinate system, and θ z represents the angle of the fluorescent cardboard relative to the third direction in the three-dimensional coordinate system. Quaternions represents the quaternion method;

[0056] Based on the rotation matrix, calculate the rotation angle of the glue applicator head using the following formula:

[0057]

[0058] Among them, α, β, and γ represent the rotation angles. α represents the rotation angle around the X-axis of the rectangular coordinate system of the glue applicator head, β represents the rotation angle around the Y-axis of the rectangular coordinate system of the glue applicator head, and γ represents the rotation angle around the Z-axis of the rectangular coordinate system of the glue applicator head. R 32 represents the value in the second column of the third row in the rotation matrix, and R 33 represents the value in the third column of the third row in the rotation matrix, and R 31 represents the value in the first column of the third row in the rotation matrix, and R 21 represents the value in the first column of the second row in the rotation matrix, and R 11 represents the value in the first column of the first row in the rotation matrix.

[0059] Optionally, analyzing the moving distance of the glue applicator head based on the cardboard deformation data includes:

[0060] Based on the cardboard deformation data, generate the movement matrix of the glue applicator head using the following formula:

[0061]

[0062] Among them, It represents a movement matrix, where ΔX, ΔY, and ΔZ are the movement distances of the glue - applying head along the X, Y, and Z axes, L0 is the edge position of the fluorescent cardboard in the ideal and non - deformed state, TPS is the thin - plate spline algorithm, L represents the set of discrete coordinate points of the cardboard edge position, h represents the thickness of the fluorescent cardboard, and h0 represents the reference thickness in the non - deformed state;

[0063] Extract the movement distance of the glue - applying head from the movement matrix.

[0064] Optionally, the step of determining the glue pump flow rate of the glue - applying head by using the cardboard deformation data and the glue rheological properties includes:

[0065] Extract the data features corresponding to the cardboard deformation data;

[0066] Concatenate the data features into a feature vector;

[0067] Input the feature vector into a preset flow rate recognition model to identify the glue pump flow rate corresponding to the feature vector through the flow rate recognition model;

[0068] Among them, the data features include thickness mean, thickness standard deviation, angle deformation intensity, edge descriptor, and normalized rheological properties, and the flow rate recognition model includes a fully - connected layer, a temporal convolutional network, and a long - short - term memory network.

[0069] Optionally, the step of driving the deformation synchronization between the glue - applying head and the fluorescent cardboard according to the rotation angle, the movement distance, and the glue pump flow rate to obtain a deformation synchronization result includes:

[0070] Drive the angle synchronization between the glue - applying head and the fluorescent cardboard according to the rotation angle to obtain an angle synchronization result;

[0071] Drive the translation synchronization between the glue - applying head and the fluorescent cardboard according to the movement distance to obtain a translation synchronization result;

[0072] Drive the flow rate synchronization between the glue - applying head and the fluorescent cardboard according to the glue pump flow rate to obtain a flow rate synchronization result;

[0073] Take the angle synchronization result, the translation synchronization result, and the flow rate synchronization result as the deformation synchronization result.

[0074] To solve the above problems, the present invention also provides a cardboard adjustment and glue - applying synchronization processing system, and the system includes:

[0075] A fluorescence analysis module, which is used to coat a fluorescent material on a cardboard to obtain a fluorescent cardboard. When the fluorescent cardboard enters the working area, it measures the fluorescence distribution of the fluorescent cardboard in real time, and analyzes the thickness, angle, edge position and identification area of the fluorescent cardboard by using the fluorescence distribution;

[0076] A deformation judgment module, which is used to generate cardboard deformation data of the fluorescent cardboard through the thickness, angle, edge position and identification area of the fluorescent cardboard, and judge whether the fluorescent cardboard undergoes cardboard deformation adjustment by using the cardboard deformation data;

[0077] A data upload module, which is used to detect the rheological properties of the glue flow of the glue applicator head in the working area when the fluorescent cardboard undergoes cardboard deformation adjustment, and upload the cardboard deformation data and the rheological properties of the glue flow to the central controller in the working area;

[0078] A flow rate determination module, which is used to analyze the rotation angle of the glue applicator head based on the cardboard deformation data in the central controller, analyze the moving distance of the glue applicator head based on the cardboard deformation data, and determine the glue pump flow rate of the glue applicator head by using the cardboard deformation data and the rheological properties of the glue flow;

[0079] A deformation synchronization module, which is used to drive deformation synchronization between the glue applicator head and the fluorescent cardboard according to the rotation angle, the moving distance and the glue pump flow rate, obtain a deformation synchronization result, and use the deformation synchronization result as the synchronization processing result between the fluorescent cardboard and the glue applicator head.

[0080] Compared with the problems described in the background art, in the embodiments of the present invention, a fluorescent material is coated on the cardboard to provide a more accurate means of deformation measurement. The fluorescent material can enhance the contrast and detectability of the cardboard surface, making the acquisition of deformation data more accurate and reliable. In the embodiments of the present invention, the thickness, angle, edge position, and identification area of the fluorescent cardboard are analyzed by using the fluorescence distribution to provide a quantitative index for the deformation of the cardboard. Further, in the embodiments of the present invention, it is determined whether the fluorescent cardboard undergoes cardboard deformation adjustment by using the cardboard deformation data, so as to be able to more objectively evaluate the deformation degree of the cardboard during the gluing process, facilitate comparison with the standard value or other samples, and help to more accurately judge the quality of the cardboard. The deformation of the cardboard is judged by means of multi-source data fusion to improve the reliability of deformation judgment. In the embodiments of the present invention, the rheological properties of the glue flow of the glue applicator head in the working area are detected to control the glue flow according to different rheological properties of the glue flow. In the embodiments of the present invention, based on the cardboard deformation data, the rotation angle of the glue applicator head is analyzed, and the quaternion method is used to calculate the rotation angle, which has the advantages of high calculation efficiency and good numerical stability. Compared with the traditional Euler angle or other methods, the quaternion method can avoid problems such as gimbal lock and can more accurately describe the attitude and position changes of an object in three-dimensional space, providing a more reliable calculation basis for the precise positioning and motion control of the glue applicator head. Further, in the embodiments of the present invention, the glue pump flow rate of the glue applicator head is determined by using the cardboard deformation data and the rheological properties of the glue flow, and the neural network is used to output the glue pump flow rate, which can realize the adaptive regulation of the glue pump flow rate. The neural network can learn various parameters and patterns in the gluing process and automatically adjust the glue pump flow rate according to the real-time monitored data to adapt to different gluing requirements and working conditions changes, improving the automation and intelligent level of the gluing process. Therefore, the cardboard adjustment and gluing synchronization processing method and system provided by the embodiments of the present invention can improve the reliability of cardboard adjustment and gluing synchronization processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] Figure 1 FIG. is a schematic flowchart of a cardboard adjustment and gluing synchronization processing method provided by an embodiment of the present invention;

[0082] Figure 2 FIG. is a schematic block diagram of a system for implementing the cardboard adjustment and gluing synchronization processing provided by an embodiment of the present invention.

[0083] The implementation, functional features, and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0084] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0085] The embodiments of the present application provide a method for synchronously processing cardboard adjustment and gluing. The execution subject of the cardboard adjustment and gluing synchronous processing method includes, but is not limited to, at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiments of the present application. In other words, the cardboard adjustment and gluing synchronous processing method can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to: a single server, a server cluster, a cloud server, or a cloud server cluster, etc.

[0086] Embodiment 1:

[0087] Referring to Figure 1 As shown, it is a schematic flowchart of the cardboard adjustment and gluing synchronous processing method provided by an embodiment of the present invention.

[0088] In this embodiment, the cardboard adjustment and gluing synchronous processing method includes:

[0089] S1. Coating a fluorescent material on the cardboard to obtain a fluorescent cardboard. When the fluorescent cardboard enters the working area, the fluorescent distribution of the fluorescent cardboard is measured in real time, and the fluorescent cardboard thickness, fluorescent cardboard angle, edge position, and identification area of the fluorescent cardboard are analyzed using the fluorescent distribution.

[0090] In the embodiments of the present invention, the cardboard refers to a thick paper sheet formed by processing various pulps and interweaving fibers, and is often used in fields such as packaging. For example, in the case of corrugated cardboard, during the gluing process, the cardboard needs to be fixed and adjusted to ensure the uniformity and accuracy of gluing. During the gluing process, equipment such as corrugating rolls and pressure rolls are used. These devices will cause the cardboard to be subjected to uneven pressure during the gluing process, resulting in deformation. The corrugating roll rotates to press the base paper into a corrugated shape, forming the core structure of the corrugated cardboard. The pressure roll cooperates with the corrugating roll to apply pressure to the corrugated cardboard to ensure the flatness and bonding effect of the corrugated cardboard. In addition, if the temperature of the corrugating roll, pressure roll, or preheating roll is too high or too low, the cardboard will have poor forming during the gluing process and deform. Finally, the general process of cardboard processing needs to be explained: the preheating roll preheats the cardboard to an appropriate temperature; the preheated cardboard enters the corrugating roll, and the corrugating roll rotates to press the cardboard into a corrugated shape; the corrugated cardboard then passes through the pressure roll, and the pressure roll cooperates with the corrugating roll to apply pressure to the corrugated cardboard to ensure the flatness and bonding effect of the corrugated cardboard; the cardboard that has undergone corrugation forming and pressure bonding enters the gluing device, and the gluing device coats glue on the crests of the corrugated cardboard to ensure the bonding effect of the corrugated cardboard.

[0091] Furthermore, in the embodiments of the present invention, by coating a fluorescent material on the cardboard, a more precise deformation measurement method is provided. The fluorescent material can enhance the contrast and detectability of the cardboard surface, making the acquisition of deformation data more accurate and reliable.

[0092] In one embodiment of the present invention, coating a fluorescent material on the cardboard to obtain a fluorescent cardboard includes: identifying the identification area of the cardboard; querying the top vertices and bottom vertices of the identification area; coating different wavelength fluorescences on the top vertices and the bottom vertices respectively to obtain fluorescent vertices; coating a protective resin outside the fluorescence of the fluorescent vertices to obtain protected vertices; and using the cardboard containing the protected vertices as the fluorescent cardboard.

[0093] Among them, the identification area refers to all the areas of the cardboard that need to be coated with glue. When the cardboard is placed flat in the working area, the identification area is defaulted to the front and back sides of the cardboard, and the front and back sides are also called the top surface and the bottom surface. The top vertices and the bottom vertices refer to the 4 vertices P1, P2, P3, and P4 of the cardboard. Here, it is defaulted that the cardboard is a rectangular cardboard, and the rectangular cardboard is also a commonly used cardboard shape in the industry. The protective resin is used to prevent the fluorescent dots on the vertices from peeling off due to mechanical wear, such as transparent photosensitive resin.

[0094] Exemplarily, the process of coating different wavelength fluorescences on the top vertices and the bottom vertices respectively is as follows: pre-coating fluorescent dots with a unique wavelength combination at the four corners of the cardboard, such as P1, P2, the left vertices 520nm + 620nm, P3, P4, the right vertices 620nm + 800nm, etc.

[0095] Further, in the embodiment of the present invention, the fluorescence distribution refers to the distribution information of the wavelength and coordinates of the fluorescent dots.

[0096] Optionally, the process of measuring the fluorescence distribution of the fluorescent cardboard in real time refers to the process of capturing the fluorescence distribution by using a high-resolution spectral camera. It should be noted that through a spectrometer or a hyperspectral camera, the spectral distribution of the fluorescence signal can be recorded. From the mapping relationship between the spectral distributions of different sizes and the corresponding wavelengths, the wavelength of the fluorescent dots can be determined. Furthermore, through a microscope or an imaging system, the position of the fluorescent dots in space can be recorded to provide coordinate information.

[0097] Further, the embodiment of the present invention analyzes the thickness, angle, edge position, and identification area of the fluorescent cardboard by using the fluorescence distribution to provide a quantitative index for the deformation of the cardboard.

[0098] Wherein, the thickness of the fluorescent cardboard refers to the height between the top surface and the bottom surface. The angle of the fluorescent cardboard means that when the fluorescent cardboard is placed flat in the working area, with P1 of the fluorescent cardboard as the origin O(0,0,0), the horizontal direction of the cardboard length as the X-axis, the horizontal direction of the width as the Y-axis, and the direction perpendicular to the horizontally placed cardboard as the Z-axis, the angles at which the fluorescent cardboard deviates from the X-axis, Y-axis, and Z-axis are detected. It should be noted that the fluorescent cardboard will have angular deviation, while the tabletop on which the fluorescent cardboard is placed will not. Here, the X-axis, Y-axis, and Z-axis are relative to the tabletop. For example, the tabletop direction along the cardboard length is the X-axis, and the edge position refers to the sides of the rectangular fluorescent cardboard.

[0099] In an embodiment of the present invention, the method of analyzing the fluorescent cardboard thickness, fluorescent cardboard angle, edge position, and identification area of the fluorescent cardboard by using the fluorescence distribution includes: obtaining the fluorescence wavelength and fluorescence coordinates in the fluorescence distribution; after matching the fluorescence wavelength with a preset wavelength, extracting the vertex coordinates of the fluorescent cardboard from the fluorescence coordinates; determining the identification area of the fluorescent cardboard from the vertex coordinates; selecting the origin coordinates from the vertex coordinates; extracting the two-dimensional plane coordinates of the vertex coordinates; performing principal component analysis on the two-dimensional plane coordinates to obtain the first principal component direction and the second principal component direction; calculating the fluorescent cardboard thickness of the fluorescent cardboard by using the following formula:

[0100]

[0101] Wherein, h represents the fluorescent cardboard thickness, I represents the measured fluorescence intensity of the fluorescent cardboard, μ represents the effective absorption coefficient of the fluorescent cardboard, and I0 represents the initial fluorescence intensity of the fluorescent cardboard;

[0102] Calculating the normal vector of the surface formed by the first principal component direction and the second principal component direction; performing vector normalization on the normal vector to obtain a normalized vector; determining a third direction through the normalized vector; constructing a three-dimensional coordinate system of the fluorescent cardboard by using the origin coordinates, the first principal component direction, the second principal component direction, and the third direction; identifying the edge positions between the vertex coordinates; and calculating the fluorescent cardboard angle of the fluorescent cardboard by using the following formula based on the three-dimensional coordinate system and the edge positions:

[0103]

[0104] Wherein, θ x 、θ y 、θ z represent the fluorescent cardboard angle, θ x represents the fluorescent cardboard angle relative to the first principal component direction in the three-dimensional coordinate system, θ y represents the fluorescent cardboard angle relative to the second principal component direction in the three-dimensional coordinate system, θz The fluorescent cardboard angle relative to the third direction in the three-dimensional coordinate system is represented by, the projection distance of the edge position in the third direction is represented by Δz, the projection distance of the edge position in the second principal component direction is represented by Δy, and the projection distance of the edge position in the first principal component direction is represented by Δx.

[0105] Among them, the preset wavelength refers to the wavelength information respectively belonging to the left vertex and the right vertex recorded in advance, the origin coordinate is the P1 vertex of the fluorescent cardboard, the two-dimensional plane coordinate refers to the X-axis and Y-axis coordinates, the first principal component direction is the X-axis, the second principal component direction is the Y-axis, and the normal vector refers to the vector normal to the surface formed by the first principal component direction and the second principal component direction. The calculation formula is as follows:

[0106]

[0107] Among them, h represents the thickness of the fluorescent cardboard.

[0108] Optionally, the process of performing principal component analysis on the two-dimensional plane coordinates to obtain the first principal component direction and the second principal component direction means: calculating the covariance matrix of the two-dimensional plane coordinates X i =(x i , y i ). Calculate the eigenvectors and corresponding eigenvalues of the covariance matrix. The eigenvector corresponding to the largest eigenvalue is the X-axis direction, and the eigenvector corresponding to the second largest eigenvalue corresponds to the Y-axis direction. Further, the process of performing vector normalization on the normal vector to obtain the normalized vector means dividing the vector components of this normal vector on the X, Y, and Z axes by the length of this normal to obtain the unit vector.

[0109] It should be noted that regarding the formula for calculating the thickness of the fluorescent cardboard, this formula is based on the inversion of the cardboard thickness according to the Lambert-Beer law. The Lambert-Beer law is the basic law of spectrophotometry and describes the relationship between the absorption intensity of a substance for a certain wavelength of light and the concentration of the absorbing substance and the thickness of its liquid layer. I represents the measured fluorescence intensity of the fluorescent cardboard, μ represents the effective absorption coefficient of the fluorescent cardboard, and I0 represents the initial fluorescence intensity of the fluorescent cardboard. Here, I is the mean value of the fluorescence intensity in the height direction of the fluorescent cardboard. The calculation formula of μ is as follows:

[0110]

[0111] Among them, h calrepresents the thickness of the standard cardboard sample, and I0 represents the initial fluorescence intensity of the fluorescent cardboard. Here, the initial fluorescence intensity is explained. The initial fluorescence intensity refers to the fluorescence intensity without thickness attenuation (ideal zero thickness) or the theoretical fluorescence intensity under the calibrated environment, I cal represents the average fluorescence intensity in the measured cardboard height direction of the standard cardboard sample;

[0112] Further, regarding the formula for calculating the fluorescent cardboard angle of the fluorescent cardboard, this formula is designed based on the geometric projection of vectors and trigonometric functions, θ x reflects the warping or bending of the cardboard in the length direction, θ y reflects the twisting or tilting of the cardboard in the width direction, θ z reflects the warping of the cardboard in the height direction.

[0113] S2. Generate the cardboard deformation data of the fluorescent cardboard through the fluorescent cardboard thickness, the fluorescent cardboard angle, the edge position, and the identification area, and use the cardboard deformation data to determine whether the fluorescent cardboard undergoes cardboard deformation adjustment.

[0114] It should be noted that the cardboard deformation data is the data of the fluorescent cardboard thickness, the fluorescent cardboard angle, the edge position, and the identification area. Here, the fluorescent cardboard thickness, the fluorescent cardboard angle, the edge position, and the identification area are simplified to be represented by the term cardboard deformation data.

[0115] Further, in the embodiment of the present invention, by using the cardboard deformation data to determine whether the fluorescent cardboard undergoes cardboard deformation adjustment, it is possible to more objectively evaluate the deformation degree of the cardboard during the gluing process, facilitate comparison with the standard value or other samples, contribute to more accurately judging the quality of the cardboard, and judge the cardboard deformation through the multi-source data fusion method to improve the reliability of the deformation judgment.

[0116] In an embodiment of the present invention, the use of the cardboard deformation data to determine whether the fluorescent cardboard undergoes cardboard deformation adjustment includes: obtaining the fluorescent cardboard thickness, the fluorescent cardboard angle, the edge position, and the identification area in the cardboard deformation data; calculating the thickness standard deviation of the fluorescent cardboard thickness at consecutive moments; analyzing the high-frequency energy value of the edge position; calculating the area distance between the identification area and a preset template area; and calculating the cardboard deformation score of the fluorescent cardboard according to the thickness standard deviation, the fluorescent cardboard angle, the high-frequency energy value, and the area distance by using the following formula:

[0117]

[0118] Among them, Deformation Score represents the cardboard deformation score, w1, w2, w3, w4 represent pre-fitted weight coefficients, and σ h represents the thickness standard deviation, h0 represents the reference thickness in the non-deformed state, and θ x represents the fluorescent cardboard angle relative to the first principal component direction in the three-dimensional coordinate system, and θ y represents the fluorescent cardboard angle relative to the second principal component direction in the three-dimensional coordinate system, and θ z represents the fluorescent cardboard angle relative to the third direction in the three-dimensional coordinate system, E represents the high-frequency energy value, E0 represents the reference energy value in the non-deformed state, D represents the regional distance, and D max represents the maximum regional distance;

[0119] Judge whether the fluorescent cardboard has cardboard deformation adjustment according to the score interval where the cardboard deformation score is located.

[0120] Among them, the thickness standard deviation refers to the standard deviation of the fluorescent cardboard thickness obtained at the historical moment and the current moment when currently judging whether the fluorescent cardboard has cardboard deformation adjustment, and does not include the fluorescent cardboard thickness at future moments. The high-frequency energy value at the edge position refers to the energy value of the high-frequency component (frequency > 50Hz) obtained by analyzing the edge contour through wavelet transform. The specific operation method is to record the image information of the edge position of the fluorescent cardboard through an imaging system. Through wavelet transform, the image can be decomposed at different scales, separating the high-frequency part from the low-frequency part. The regional distance between the identification area and the preset template area refers to the Hausdorff distance calculated between the identification area and the template identification area based on the non-rigid registration algorithm. The Hausdorff distance is used to measure the distance between two subsets in space, and it is defined as the maximum distance from one set to the nearest point in the other set. The non-rigid registration algorithm is used to handle the registration problem between images or point sets with non-linear changes in shape or position. Similarly, the process of calculating the regional distance between the identification area and the preset template area requires the imaging system to record the coordinate point information of the fluorescent points of the fluorescent cardboard, and then perform coordinate point registration on the coordinate point information of the fluorescent cardboard and the template coordinate point information. After registration, the Hausdorff distance is calculated. The score interval refers to the numerical interval corresponding to whether there is deformation. For example, there is no deformation in the range of 0 to 0.2, and deformation occurs when it is greater than 0.2.

[0121] It should be noted that regarding the formula for calculating Deformation Score, this formula integrates multi-modal data such as fluorescent cardboard thickness, fluorescent cardboard angle, edge position, and identification area. Among them, w1, w2, w3, w4 are parameters obtained in advance through the least squares method or other parameter fitting algorithms, and D max represents the maximum regional distance, and D maxis the maximum value within the historical moments of the current moment (including the current moment).

[0122] S3. When the cardboard deformation adjustment occurs on the fluorescent cardboard, detect the rheological properties of the glue flow of the glue applicator head in the working area, and upload the cardboard deformation data and the rheological properties of the glue flow to the central controller in the working area.

[0123] In an embodiment of the present invention, by detecting the rheological properties of the glue flow of the glue applicator head in the working area, the glue flow rate is controlled according to different rheological properties of the glue.

[0124] Among them, the rheological properties of the glue flow include viscosity, shear stress, and elastic modulus.

[0125] In an embodiment of the present invention, detecting the rheological properties of the glue flow of the glue applicator head in the working area includes: after embedding a periodic nano-column array inside the glue applicator head, generating a photonic crystal microcavity inside the glue applicator head; when the glue flow in the glue applicator head flows through the photonic crystal microcavity, identifying the resonance wavelength of the photonic crystal microcavity; analyzing the viscosity and shear stress of the glue based on the resonance wavelength; when the glue flow in the glue applicator head flows through the photonic crystal microcavity, identifying the transmitted light intensity corresponding to the photonic crystal microcavity; analyzing the elastic modulus of the glue based on the transmitted light intensity; taking the viscosity, the shear stress, and the elastic modulus as the rheological properties of the glue flow.

[0126] Among them, the periodic nano-column array refers to a periodically arranged silicon dioxide / silicon nano-column array, and the lattice constant corresponding to these arrays is approximately 500 nm. It should be noted that a photonic crystal microcavity is a periodically arranged dielectric structure. When a periodic nano-column array is embedded inside the glue applicator head, these nano-column arrays constitute the periodic structure of the photonic crystal. Further, regarding the resonance wavelength, when light propagates into the photonic crystal, it will be locally confined in the photonic crystal microcavity. By measuring the transmission spectrum of the photonic crystal microcavity, an obvious resonance peak can be observed, and the wavelength corresponding to this peak is the resonance wavelength. The transmitted light intensity reflects the light transmission ability of the photonic crystal microcavity to light of a specific wavelength.

[0127] Optionally, the process of identifying the resonance wavelength of the photonic crystal microcavity when the glue flow in the glue applicator head flows through the photonic crystal microcavity means that when the glue flow passes through the photonic crystal microcavity, the resonance wavelength of the photonic crystal microcavity can be identified through spectral analysis. The specific method is to measure the transmission spectrum or reflection spectrum of the photonic crystal microcavity, and an obvious resonance peak is observed. The wavelength corresponding to this peak is the resonance wavelength. Further, the process of analyzing the viscosity and shear stress of the glue based on the resonance wavelength means that: Δλ res represents the resonance wavelength, k ηrepresents the calibration coefficient, where $\dot{\gamma}$ represents the shear rate, $\tau$ represents the viscosity, and $\eta$ represents the shear stress. The principle of this formula design is that the viscosity of the glue affects the flow shear stress, the shear stress causes changes in the surface stress of the microcavity, and the changing stress changes the resonance wavelength through the photoelastic effect. Therefore, the viscosity and shear stress can be calculated through the resonance wavelength. Further, when the glue flow in the glue applicator head passes through the photonic crystal microcavity, identifying the transmitted light intensity corresponding to the photonic crystal microcavity refers to the process of identifying the corresponding transmitted light intensity by measuring the transmission spectrum of the photonic crystal microcavity. Further, the formula for analyzing the elastic modulus of the glue based on the transmitted light intensity is as follows: where $\Delta I$ trans represents the transmitted light intensity, $k$ G represents the coupling coefficient between light illumination and mechanical stress, and $G$ represents the elastic modulus. The reason for this formula design is that the elastic modulus of the glue causes small deformations of the microcavity nanostructure, the small deformations change the local light field intensity, and ultimately cause changes and fluctuations in the transmitted light intensity.

[0128] Further, in the embodiment of the present invention, the central controller is mainly used to receive data for processing and analysis, and issue instructions to operate and control the equipment.

[0129] S4. In the central controller, based on the cardboard deformation data, analyze the rotation angle of the glue applicator head, based on the cardboard deformation data, analyze the moving distance of the glue applicator head, and use the cardboard deformation data and the rheological properties of the glue flow to determine the glue pump flow rate of the glue applicator head.

[0130] In the embodiment of the present invention, by analyzing the rotation angle of the glue applicator head based on the cardboard deformation data and using the quaternion method to calculate the rotation angle, it has the advantages of high calculation efficiency and good numerical stability. Compared with the traditional Euler angles or other methods, the quaternion method can avoid problems such as gimbal lock and can more accurately describe the attitude and position changes of an object in three-dimensional space, providing a more reliable calculation basis for the precise positioning and motion control of the glue applicator head.

[0131] In an embodiment of the present invention, analyzing the rotation angle of the glue applicator head based on the cardboard deformation data includes: generating a rotation matrix of the glue applicator head based on the cardboard deformation data through a preset quaternion method; the quaternion method includes:

[0132] $R(\theta$ x , $\theta$ y , $\theta$ z ) = Quaternions($\theta$ x , $\theta$ y , $\theta$ z )

[0133] wherein, R(θ x , θ y , θ x ) represents a rotation matrix, and θ x represents the angle of the fluorescent cardboard relative to the direction of the first principal component in the three-dimensional coordinate system, θ y represents the angle of the fluorescent cardboard relative to the direction of the second principal component in the three-dimensional coordinate system, θ z represents the angle of the fluorescent cardboard relative to the third direction in the three-dimensional coordinate system, and Quaternions represents the quaternion method;

[0134] Based on the rotation matrix, the rotation angle of the glue applicator head is calculated using the following formula:

[0135]

[0136] wherein, α, β, and γ represent the rotation angles, α represents the rotation angle about the X-axis of the rectangular coordinate system of the glue applicator head, β represents the rotation angle about the Y-axis of the rectangular coordinate system of the glue applicator head, γ represents the rotation angle about the Z-axis of the rectangular coordinate system of the glue applicator head, and R 32 represents the value in the 3rd row and 2nd column of the rotation matrix, R 33 represents the value in the 3rd row and 3rd column of the rotation matrix, R 31 represents the value in the 3rd row and 1st column of the rotation matrix, R 21 represents the value in the 2nd row and 1st column of the rotation matrix, R 11 represents the value in the 1st row and 1st column of the rotation matrix.

[0137] It should be noted that for the glue applicator head, the coordinate system where the glue applicator head is located has the center of the glue nozzle as the origin, the Z-axis is perpendicular to the spraying direction of the glue nozzle, and the X / Y axes are aligned with the base of the robotic arm. The above rotation angles and subsequent moving distances are all data in the coordinate system where the glue applicator head is located. Regarding the process of generating the rotation matrix of the glue applicator head through the preset quaternion method based on the cardboard deformation data, the above embodiments simplify the specific calculation process, and the detailed explanation is as follows: First, the angular data in the cardboard deformation data is converted into quaternions q w , q x , q y , q z :

[0138]

[0139] Next, the quaternions are converted into a rotation matrix R:

[0140]

[0141] wherein the R here is R(θ x , θ y , θz )。

[0142] In one embodiment of the present invention, analyzing the moving distance of the glue applicator head based on the cardboard deformation data includes: generating a moving matrix of the glue applicator head based on the cardboard deformation data by using the following formula:

[0143]

[0144] Wherein, represents the moving matrix, ΔX, ΔY, and ΔZ are the moving distances of the glue applicator head on the X, Y, and Z axes, L0 is the edge position of the fluorescent cardboard in an ideal and undeformed state, TPS is the thin plate spline algorithm, L represents the set of discrete coordinate points of the cardboard edge position, h represents the thickness of the fluorescent cardboard, and h0 represents the reference thickness in the undeformed state;

[0145] Extract the moving distance of the glue applicator head from the moving matrix.

[0146] It should be noted that regarding TPS(L, L0) x , TPS(L, L0) y The calculation process is as follows: Wherein a1, a x , a y are the coefficients of the linear part, used to fit the control points in the linear space, w i is the weight of each control point, used to multiply the displacement between the control point and the target point, N is the number of discrete coordinate points in L, U(∥(x i , y i )-(x, y)∥) represents the displacement between L and L0 on the X axis, U() represents the radial basis function, used to calculate the displacement between L0 and L, and the calculation method of TPS(L, L0) y is the same as that of TPS(L, L0) x Similarly, just replace the displacement between L and L0 on the X axis with the displacement on the Y axis.

[0147] Further, in the embodiment of the present invention, by using the cardboard deformation data and the rheological properties of the glue to determine the glue pump flow rate of the glue applicator head, and using a neural network to output the glue pump flow rate, the adaptive regulation of the glue pump flow rate can be realized. The neural network can learn various parameters and patterns in the gluing process, automatically adjust the glue pump flow rate according to the real-time monitored data, so as to adapt to different gluing requirements and working condition changes, and improve the automation and intelligent level of the gluing process.

[0148] Wherein, the glue pump flow rate refers to the amount of glue transported by the glue pump per unit time, usually expressed in milliliters per second (ml / s) or milliliters per minute (ml / min).

[0149] In one embodiment of the present invention, determining the glue pump flow rate of the glue application head by using the cardboard deformation data and the glue rheological properties includes: extracting data features corresponding to the cardboard deformation data; splicing the data features into a feature vector; inputting the feature vector into a preset flow rate recognition model to identify the glue pump flow rate corresponding to the feature vector through the flow rate recognition model; wherein, the data features include thickness mean, thickness standard deviation, angle deformation intensity, edge descriptor and normalized rheological properties, and the flow rate recognition model includes a fully connected layer, a temporal convolutional network and a long short-term memory network.

[0150] Wherein, the angle deformation intensity refers to The edge descriptor is an edge descriptor generated based on the extracted edge point coordinates, mainly including the coordinates of the edge points, the gradient amplitude and direction of the edge points, and local features, such as Harris corner response values or SIFT descriptors. The normalized rheological property refers to the result of normalizing the glue rheological property, which is achieved by Z-Score.

[0151] The fully connected layer includes 128 neurons and a ReLU activation function. The temporal convolutional network is a deep learning model specifically used for processing time series data. It combines the parallel processing ability of a convolutional neural network (CNN) and the long-term dependence modeling ability of a recurrent neural network (RNN), becoming a powerful tool in sequence modeling tasks. The temporal convolutional network has 3 layers. The input end of the temporal convolutional network is connected to the fully connected layer, and the output end of the temporal convolutional network is connected to the long short-term memory network. The feature vector refers to a multi-dimensional matrix obtained by splicing the data features.

[0152] S5. According to the rotation angle, the moving distance and the glue pump flow rate, drive the deformation synchronization between the glue application head and the fluorescent cardboard to obtain a deformation synchronization result, and use the deformation synchronization result as the synchronization processing result between the fluorescent cardboard and the glue application head.

[0153] In one embodiment of the present invention, driving the deformation synchronization between the glue application head and the fluorescent cardboard according to the rotation angle, the moving distance and the glue pump flow rate to obtain a deformation synchronization result includes: driving the angle synchronization between the glue application head and the fluorescent cardboard according to the rotation angle to obtain an angle synchronization result; driving the translation synchronization between the glue application head and the fluorescent cardboard according to the moving distance to obtain a translation synchronization result; driving the flow rate synchronization between the glue application head and the fluorescent cardboard according to the glue pump flow rate to obtain a flow rate synchronization result; and using the angle synchronization result, the translation synchronization result and the flow rate synchronization result as the deformation synchronization result.

[0154] Compared with the problems described in the background art, in the embodiment of the present invention, a fluorescent material is coated on the cardboard to provide a more precise means of deformation measurement. The fluorescent material can enhance the contrast and detectability of the cardboard surface, making the acquisition of deformation data more accurate and reliable. In the embodiment of the present invention, the fluorescent cardboard thickness, fluorescent cardboard angle, edge position and identification area of the fluorescent cardboard are analyzed by using the fluorescence distribution to provide a quantitative index for the deformation of the cardboard. Further, in the embodiment of the present invention, it is judged whether the fluorescent cardboard undergoes cardboard deformation adjustment by using the cardboard deformation data, so as to be able to more objectively evaluate the deformation degree of the cardboard during the gluing process, facilitate comparison with the standard value or other samples, and help to more accurately judge the quality of the cardboard. The deformation of the cardboard is judged by means of multi-source data fusion to improve the reliability of deformation judgment. In the embodiment of the present invention, the rheological properties of the glue flow of the glue applicator head in the working area are detected to control the glue flow according to different rheological properties of the glue flow. In the embodiment of the present invention, based on the cardboard deformation data, the rotation angle of the glue applicator head is analyzed, and the quaternion method is used to calculate the rotation angle, which has the advantages of high calculation efficiency and good numerical stability. Compared with the traditional Euler angle or other methods, the quaternion method can avoid problems such as gimbal lock and can more accurately describe the attitude and position changes of an object in three-dimensional space, providing a more reliable calculation basis for the precise positioning and motion control of the glue applicator head. Further, in the embodiment of the present invention, the glue pump flow of the glue applicator head is determined by using the cardboard deformation data and the rheological properties of the glue flow, and the glue pump flow is output by using a neural network, so as to realize the adaptive regulation of the glue pump flow. The neural network can learn various parameters and patterns in the gluing process and automatically adjust the glue pump flow according to the real-time monitored data to adapt to different gluing requirements and working conditions changes, improving the automation and intelligent level of the gluing process. Therefore, the cardboard adjustment and gluing synchronization processing method and system provided by the embodiment of the present invention can improve the reliability of cardboard adjustment and gluing synchronization processing.

[0155] Embodiment 2:

[0156] As Figure 2 shown, it is a functional module diagram of a cardboard adjustment and gluing synchronization processing system of the present invention.

[0157] The cardboard adjustment and gluing synchronization processing system 200 of the present invention can be installed in an electronic device. According to the functions realized, the cardboard adjustment and gluing synchronization processing system may include a fluorescence analysis module 201, a deformation judgment module 202, a data upload module 203, a flow rate determination module 204 and a deformation synchronization module 205. The modules of the present invention can also be referred to as units, which refer to a series of computer program segments that can be executed by the processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0158] In the embodiments of the present invention, the functions of each module / unit are as follows:

[0159] The fluorescence analysis module 201 is configured to coat a fluorescence material on a cardboard to obtain a fluorescent cardboard, and when the fluorescent cardboard enters the working area, measure the fluorescence distribution of the fluorescent cardboard in real time, and analyze the thickness, angle, edge position and identification area of the fluorescent cardboard by using the fluorescence distribution;

[0160] The deformation judgment module 202 is configured to generate cardboard deformation data of the fluorescent cardboard through the thickness, angle, edge position and identification area of the fluorescent cardboard, and judge whether the fluorescent cardboard undergoes cardboard deformation adjustment by using the cardboard deformation data;

[0161] The data uploading module 203 is configured to detect the rheological properties of the glue flow of the glue head in the working area when the fluorescent cardboard undergoes cardboard deformation adjustment, and upload the cardboard deformation data and the rheological properties of the glue flow to the central controller in the working area;

[0162] The flow rate determination module 204 is configured to analyze the rotation angle of the glue head in the central controller based on the cardboard deformation data, analyze the moving distance of the glue head based on the cardboard deformation data, and determine the glue pump flow rate of the glue head by using the cardboard deformation data and the rheological properties of the glue flow;

[0163] The deformation synchronization module 205 is configured to drive deformation synchronization between the glue head and the fluorescent cardboard according to the rotation angle, the moving distance and the glue pump flow rate to obtain a deformation synchronization result, and use the deformation synchronization result as the synchronization processing result between the fluorescent cardboard and the glue head.

[0164] Specifically, each module in the cardboard adjustment and glue application synchronization processing system 200 in the embodiments of the present invention adopts the same technical means as those in the Figure 1 cardboard adjustment and glue application synchronization processing method described above, and can produce the same technical effects, which will not be elaborated here.

[0165] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms.

[0166] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A cardboard adjustment and gluing synchronous processing method, characterized in that The method includes: Coating a fluorescent material on a cardboard to obtain a fluorescent cardboard. When the fluorescent cardboard enters the working area, the fluorescence distribution of the fluorescent cardboard is measured in real time, and the thickness, angle, edge position, and identification area of the fluorescent cardboard are analyzed using the fluorescence distribution. Generating cardboard deformation data of the fluorescent cardboard based on the thickness, angle, edge position, and identification area of the fluorescent cardboard, and determining whether the fluorescent cardboard undergoes cardboard deformation adjustment using the cardboard deformation data. When the fluorescent cardboard undergoes cardboard deformation adjustment, the rheological properties of the glue flow of the glue applicator head in the working area are detected, and the cardboard deformation data and the rheological properties of the glue flow are uploaded to the central controller in the working area. In the central controller, based on the cardboard deformation data, the rotation angle of the glue applicator head is analyzed, based on the cardboard deformation data, the moving distance of the glue applicator head is analyzed, and the glue pump flow rate of the glue applicator head is determined using the cardboard deformation data and the rheological properties of the glue flow. According to the rotation angle, the moving distance, and the glue pump flow rate, the deformation synchronization between the glue applicator head and the fluorescent cardboard is driven to obtain a deformation synchronization result, and the deformation synchronization result is used as the synchronization processing result between the fluorescent cardboard and the glue applicator head.

2. The cardboard adjustment and glue application synchronous processing method according to claim 1, characterized in that, The coating of the fluorescent material on the cardboard to obtain a fluorescent cardboard includes: Identifying the identification area of the cardboard. Querying the top vertex and the bottom vertex of the identification area. Coating different wavelength fluorescences on the top vertex and the bottom vertex respectively to obtain fluorescent vertices. Coating a protective resin on the outside of the fluorescence of the fluorescent vertices to obtain protected vertices. Using the cardboard containing the protected vertices as the fluorescent cardboard.

3. The cardboard adjustment and glue coating synchronous processing method according to claim 1, characterized in that The analyzing of the thickness, angle, edge position, and identification area of the fluorescent cardboard using the fluorescence distribution includes: Obtaining the fluorescence wavelength and fluorescence coordinates in the fluorescence distribution. After matching the fluorescence wavelength with a preset wavelength, extracting the vertex coordinates of the fluorescent cardboard from the fluorescence coordinates. Determining the identification area of the fluorescent cardboard from the vertex coordinates. Selecting the origin coordinates from the vertex coordinates. Extracting the two-dimensional plane coordinates of the vertex coordinates. Performing principal component analysis on the two-dimensional plane coordinates to obtain the first principal component direction and the second principal component direction. Calculating the thickness of the fluorescent cardboard using the following formula: where h represents the thickness of the fluorescent cardboard, I represents the measured fluorescence intensity of the fluorescent cardboard, μ represents the effective absorption coefficient of the fluorescent cardboard, and I0 represents the initial fluorescence intensity of the fluorescent cardboard. Calculating the normal vector of the surface formed by the first principal component direction and the second principal component direction. Normalizing the normal vector to obtain a normalized vector. Determining a third direction through the normalized vector. Constructing a three-dimensional coordinate system of the fluorescent cardboard using the origin coordinates, the first principal component direction, the second principal component direction, and the third direction. Identifying the edge position between the vertex coordinates. Based on the three-dimensional coordinate system and the edge position, calculate the fluorescence cardboard angle of the fluorescence cardboard using the following formula: Among them, θ x , θ y , θ z represent the angles of the fluorescent cardboard, θ x represents the angle of the fluorescent cardboard relative to the direction of the first principal component in the three-dimensional coordinate system, θ y represents the angle of the fluorescent cardboard relative to the direction of the second principal component in the three-dimensional coordinate system, θ z represents the angle of the fluorescent cardboard relative to the third direction in the three-dimensional coordinate system. Δz represents the projection distance of the edge position in the third direction, Δy represents the projection distance of the edge position in the direction of the second principal component, and Δx represents the projection distance of the edge position in the direction of the first principal component.

4. The cardboard adjustment and glue application synchronous processing method according to claim 1, characterized in that The determination of whether the fluorescence cardboard undergoes cardboard deformation adjustment using the cardboard deformation data includes: Obtain the fluorescence cardboard thickness, fluorescence cardboard angle, edge position, and identification area in the cardboard deformation data; Calculate the thickness standard deviation of the fluorescence cardboard at consecutive moments; Analyze the high-frequency energy value of the edge position; Calculate the area distance between the identification area and a preset template area; According to the thickness standard deviation, the fluorescence cardboard angle, the high-frequency energy value, and the area distance, calculate the cardboard deformation score of the fluorescence cardboard using the following formula: Among them, Deformation Score represents the cardboard deformation score, w1, w2, w3, w4 represent the pre-fitted weight coefficients, σ h represents the thickness standard deviation, h0 represents the reference thickness in the undeformed state, θ x represents the fluorescent cardboard angle relative to the first principal component direction in the three-dimensional coordinate system, θ y represents the fluorescent cardboard angle relative to the second principal component direction in the three-dimensional coordinate system, θ z represents the fluorescent cardboard angle relative to the third direction in the three-dimensional coordinate system, E represents the high-frequency energy value, E0 represents the reference energy value in the undeformed state, D represents the regional distance, D max represents the maximum regional distance; Judge whether the fluorescence cardboard undergoes cardboard deformation adjustment according to the score interval in which the cardboard deformation score is located.

5. The cardboard adjustment and glue application synchronous processing method according to claim 1, characterized in that The detection of the rheological properties of the glue flow of the glue applicator head in the working area includes: After embedding a periodic nano-column array inside the glue applicator head, generate a photonic crystal microcavity inside the glue applicator head; When the glue flow in the glue applicator head flows through the photonic crystal microcavity, identify the resonance wavelength of the photonic crystal microcavity; Analyze the viscosity and shear stress of the glue based on the resonance wavelength; When the glue flow in the glue applicator head flows through the photonic crystal microcavity, identify the transmitted light intensity corresponding to the photonic crystal microcavity; Analyze the elastic modulus of the glue based on the transmitted light intensity; Take the viscosity, the shear stress, and the elastic modulus as the rheological properties of the glue flow.

6. The cardboard adjustment and glue application synchronous processing method according to claim 1, characterized in that, The analysis of the rotation angle of the glue applicator head based on the cardboard deformation data includes: Based on the cardboard deformation data, generate the rotation matrix of the glue applicator head through a preset quaternion method; The quaternion method includes: R(θ x , θ y , θ z ) = Quaternions(θ x , θ y , θ z ) where, R(θ x , θ y , θ z ) represents a rotation matrix, θ x represents the fluorescence cardboard angle relative to the first principal component direction in the three-dimensional coordinate system, θ y represents the fluorescence cardboard angle relative to the second principal component direction in the three-dimensional coordinate system, θ z represents the fluorescence cardboard angle relative to the third direction in the three-dimensional coordinate system, Quaternions represents the quaternion method; Based on the rotation matrix, calculate the rotation angle of the glue applicator head using the following formula: Among them, α, β, and γ represent rotation angles. α represents the rotation angle around the X-axis of the rectangular coordinate system of the glue application head, β represents the rotation angle around the Y-axis of the rectangular coordinate system of the glue application head, γ represents the rotation angle around the Z-axis of the rectangular coordinate system of the glue application head, and R 32 represents the value in the second column of the third row in the rotation matrix, and R 33 represents the value in the third column of the third row in the rotation matrix, and R 31 represents the value in the first column of the third row in the rotation matrix, and R 21 represents the value in the first column of the second row in the rotation matrix, and R 11 represents the value in the first column of the first row in the rotation matrix.

7. The cardboard adjustment and glue application synchronous processing method according to claim 1, characterized in that, The analysis of the moving distance of the glue applicator head based on the cardboard deformation data includes: Based on the cardboard deformation data, generate the moving matrix of the glue applicator head using the following formula: Among them, represents the movement matrix, ΔX, ΔY, and ΔZ are the movement distances of the coating head on the X, Y, and Z axes, L0 is the edge position of the fluorescent cardboard in the ideal and non-deformed state, TPS is the thin plate spline algorithm, L represents the set of discrete coordinate points of the cardboard edge position, h represents the thickness of the fluorescent cardboard, and h0 represents the reference thickness in the non-deformed state; Extract the moving distance of the glue applicator head from the moving matrix.

8. The cardboard adjustment and glue application synchronous processing method according to claim 1, characterized in that The determination of the glue pump flow rate of the glue applicator head using the cardboard deformation data and the rheological properties of the glue flow includes: Extract the data features corresponding to the cardboard deformation data; Concatenate the data features into a feature vector; Input the feature vector into a preset flow rate recognition model to identify the glue pump flow rate corresponding to the feature vector through the flow rate recognition model; Among them, the data features include thickness mean, thickness standard deviation, angle deformation intensity, edge descriptor, and normalized rheological properties, and the flow rate recognition model includes a fully connected layer, a temporal convolutional network, and a long short-term memory network.

9. The cardboard adjustment and glue application synchronous processing method according to claim 1, characterized in that, The driving of deformation synchronization between the glue applicator head and the fluorescence cardboard according to the rotation angle, the moving distance, and the glue pump flow rate to obtain a deformation synchronization result includes: According to the rotation angle, drive angle synchronization between the glue applicator head and the fluorescence cardboard to obtain an angle synchronization result; According to the moving distance, drive translational synchronization between the glue applicator head and the fluorescence cardboard to obtain a translational synchronization result; Drive the flow synchronization between the glue application head and the fluorescent cardboard according to the glue pump flow rate to obtain a flow synchronization result; Use the angle synchronization result, the translation synchronization result, and the flow synchronization result as the deformation synchronization result.

10. A cardboard adjustment and gluing synchronous processing system, characterized in that, The system includes: A fluorescence analysis module for coating a fluorescent material on the cardboard to obtain a fluorescent cardboard, and when the fluorescent cardboard enters the working area, measuring the fluorescence distribution of the fluorescent cardboard in real time, and analyzing the thickness, angle, edge position, and identification area of the fluorescent cardboard using the fluorescence distribution; A deformation judgment module for generating cardboard deformation data of the fluorescent cardboard through the thickness of the fluorescent cardboard, the angle of the fluorescent cardboard, the edge position, and the identification area, and judging whether the fluorescent cardboard undergoes cardboard deformation adjustment using the cardboard deformation data; A data upload module for detecting the rheological properties of the glue flow of the glue application head in the working area when the fluorescent cardboard undergoes cardboard deformation adjustment, and uploading the cardboard deformation data and the rheological properties of the glue flow to the central controller in the working area; A flow rate determination module for analyzing the rotation angle of the glue application head based on the cardboard deformation data in the central controller, analyzing the moving distance of the glue application head based on the cardboard deformation data, and determining the glue pump flow rate of the glue application head using the cardboard deformation data and the rheological properties of the glue flow; A deformation synchronization module for driving the deformation synchronization between the glue application head and the fluorescent cardboard according to the rotation angle, the moving distance, and the glue pump flow rate to obtain a deformation synchronization result, and using the deformation synchronization result as the synchronization processing result between the fluorescent cardboard and the glue application head.

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