Liquid cooling heat dissipation device and electronic equipment

Abstract

The invention discloses a liquid cooling heat dissipation device and electronic equipment. Compared with air cooling heat dissipation, the liquid cooling heat dissipation device is more energy-saving, high in heat dissipation efficiency, small in occupied space and convenient to maintain heating devices. The liquid cooling heat dissipation device comprises a support, a cold plate and a heat conduction assembly. The cold plate and the heat conduction assembly are arranged in the first direction, the cold plate is fixedly connected with the support, the heat conduction assembly comprises a heat conduction plate, the heat conduction plate is connected with the cold plate in a heat conduction mode, the heating device and the heat conduction assembly are arranged in a stacked mode in the second direction, and the heating device is detachably connected to the support. The heat conduction assembly is detachably connected to the heating device, and the first direction is perpendicular to the second direction.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a liquid cooling heat dissipation device and an electronic device. Background Art

[0002] With the continuous development of data centers, the demand for network data transmission and data processing has increased exponentially, and the performance of PCIE cards in servers also needs to be improved. As the performance of PCIE cards improves, their power consumption also increases. PCIE cards mostly adopt air-cooled heat dissipation solutions, and PCIE cards are usually installed at the end of the server. The air flow of air-cooled heat dissipation flows from the front end to the rear end. When it reaches the rear end, the temperature of the air flow rises, which is not conducive to the heat dissipation of PCIE cards. Therefore, the traditional air-cooled heat dissipation can no longer meet the heat dissipation requirements of PCIE cards. Summary of the Invention

[0003] To solve the above problems, a liquid cooling heat dissipation device and an electronic device provided by this application have higher heat dissipation efficiency, are more energy-saving, occupy relatively less space, and are more convenient for maintaining heat-generating devices compared with air-cooled heat dissipation.

[0004] In a first aspect, an embodiment of this application provides a liquid cooling heat dissipation device for dissipating heat from a heat-generating device. The liquid cooling heat dissipation device includes: a bracket, a cold plate, and a heat conduction component. The cold plate and the heat conduction component are arranged side by side along a first direction. The cold plate is fixedly connected to the bracket. The heat conduction component includes a heat conduction plate, and the heat conduction plate is thermally connected to the cold plate. The heat-generating device is detachably connected to the bracket, and the heat-generating device and the heat conduction component are stacked along a second direction. The heat conduction component is detachably connected to the heat-generating device. The first direction is perpendicular to the second direction.

[0005] In the above embodiment, the liquid cooling heat dissipation device can be installed in the chassis of the server. The heat-generating device can be, for example, a PCIE card. The heat-generating device is detachably installed on the bracket. During assembly, first, the heat-generating device and the heat conduction component are assembled together to form a module, and then the module as a whole is installed on the bracket, which is convenient for maintaining the heat-generating device. This module can be called the first module. The heat conduction plate is attached to the cold plate and can transfer the heat of the heat-generating device to the cold plate. There is circulating coolant in the cold plate, and heat dissipation of the heat-generating device is achieved through the dual effects of direct contact heat conduction and liquid convection heat transfer. The cold plate and the heat conduction component are arranged side by side along the first direction, and the heat-generating device and the heat conduction component are stacked along the second direction. Such an orthogonal layout optimizes the heat flow path in a compact space, and the heat-generating device and the heat conduction component are detachably connected and modularly installed after being combined into a module, which is convenient for maintaining the heat-generating device.

[0006] In one embodiment, the heat conduction assembly includes a heat conduction plate and a fixing clip, the fixing clip is connected to the heat conduction plate, the fixing clip and the heat conduction plate enclose a containing space, and the heating device is detachably installed in the containing space. This facilitates the replacement and maintenance of the heating device in the later stage, and the fixing clip is compatible with various types of heating devices, thereby improving the versatility of the liquid cooling device.

[0007] In one embodiment, the heat conducting plate includes a first heat conducting portion and a second heat conducting portion arranged in a stepped shape, the heat generating device includes a first heat source and a second heat source, the first heat conducting portion is heat-conductingly connected to the first heat source, and the second heat conducting portion is heat-conductingly connected to the second heat source. Multiple heat conducting portions can adapt to the heights of different heat sources on the heat generating device, thereby improving the heat dissipation efficiency of each heat source.

[0008] In one embodiment, a heat-conducting boss is provided on one side of the heat-conducting plate facing the heating device, and the heat-conducting boss is heat-conductingly connected to the first heat source. The heat-conducting boss can make the connection between the heat-conducting plate and the first heat source tighter, reduce thermal resistance, and improve heat transfer efficiency.

[0009] In one embodiment, the heat-conducting assembly further comprises a heat pipe, and the heat pipe is mounted on a side of the heat-conducting plate away from the heating device; the heat pipe comprises a first end and a second end, the first end is in contact with the first heat-conducting part, and the second end is in contact with the second heat-conducting part. The heat pipe has a capillary structure inside, and is a highly efficient passive heat transfer component based on phase change heat transfer and capillary force driven cycle. The heat pipe can balance the temperature of the heat-conducting plate, so that the temperature of the first heat-conducting part and the second heat-conducting part tends to be balanced, reducing the high temperature of the first heat-conducting part or the second heat-conducting part of the heat-conducting plate, which is not conducive to heat dissipation and affects the heat dissipation efficiency.

[0010] In one embodiment, the heating device has a conductive connection portion, which is plugged into a slot of the bracket, and the slot is located at the mounting portion of the bracket. The cold plate has an avoidance hole, and the avoidance hole is used to allow the conductive connection portion of the heating device to pass through to prevent the cold plate and the heating device from interfering with each other.

[0011] In one embodiment, a thermally conductive gasket is provided between the heat conductive plate and the cold plate. The thermally conductive gasket fills the gap between the contact surfaces of the heat conductive plate and the cold plate through compression deformation, thereby reducing the interface thermal resistance caused by air and improving the heat transfer effect between the heat conductive plate and the cold plate.

[0012] In one embodiment, the cold plate has a water inlet and a water outlet, and both the water inlet and the water outlet are equipped with quick-connect connectors, which are used to connect to external pipelines to facilitate replacement or expansion of the cold plate.

[0013] In one embodiment, the bracket has a plurality of mounting positions arranged along the second direction, and each mounting position mounts one of the heating devices and one of the heat conduction components. The provision of a plurality of mounting positions on the bracket enables the mounting of a plurality of first modules formed by the heating devices and the heat conduction components, and a cold plate can dissipate heat from a plurality of heating devices simultaneously, effectively utilizing the space and improving the heat dissipation efficiency.

[0014] On the other hand, an embodiment of the present application further provides an electronic device, which includes a PCIE card and the liquid cooling heat dissipation device described above, and the PCIE card is detachably connected to the bracket. After the PCIE card and the liquid cooling heat dissipation device are assembled, a second module is formed. Multiple second modules can be configured in the electronic device to expand the PCIE card. The multiple first modules and second modules in the electronic device can be disassembled and replaced as needed. The electronic device of the present application adopts a modular design, which can achieve decoupling of each module, can adapt to different types of PCIE cards and servers with different configuration requirements, and has strong adaptability. And it has good scalability and assembly convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 An exploded view of the liquid cooling heat dissipation device and the heating device provided by an embodiment of the present application;

[0016] Figure 2 An assembly view of the liquid cooling heat dissipation device and the heating device provided by an embodiment of the present application;

[0017] Figure 3 An assembly view of the heat conduction component provided by an embodiment of the present application;

[0018] Figure 4 An exploded view of the heat conduction component provided by an embodiment of the present application;

[0019] Figure 5 A rear view of the first module provided by an embodiment of the present application;

[0020] Figure 6 A structural diagram of the heating device provided by an embodiment of the present application;

[0021] Figure 7 A structural diagram of the first module provided by an embodiment of the present application;

[0022] Figure 8 A structural diagram of the electronic device provided by an embodiment of the present application.

[0023] Reference Signs:

[0024] 1 - Bracket; 2 - Cold plate; 3 - Heat conduction component; 100 - Heating device; 00 - Mounting position; 101 - Bracket body; 102 - Mounting part; 110 - Mounting plate; 111 - Circuit board; 301 - Heat conduction plate; 302 - Fixed clamp; 3021 - Hook; 30211 - Hook part; 3022 - Connecting plate; 3010 - Heat conduction boss; 113 - Chip; 303 - Heat pipe; 0 - Connecting piece; 114 - Optical communication device; 3011 - First heat conduction part; 3012 - Second heat conduction part; 3013 - Mounting groove; 3014 - Narrower side; 3031 - First end; 3032 - Second end; 115 - Conductive connection part; 20 - Avoidance hole; 201 - Water inlet; 202 - Water outlet; 203 - Quick connector; 200 - PCIE card; 300 - Liquid cooling heat dissipation device; 400 - Pipeline; 500 - Chassis. Detailed implementation mode

[0025] To make the objectives, technical solutions and advantages of the present application clearer, the following describes embodiments of the present application in further detail with reference to the accompanying drawings.

[0026] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above", "said", "this" are also intended to include the forms such as "one or more", unless there is a clear indication to the contrary in the context.

[0027] Reference to "an embodiment" or "a specific embodiment" etc. described in this specification means that a specific feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. The terms "include", "comprise", "have" and their variants all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0028] A PCIE (Peripheral Component Interconnect Express) card is a hardware device used to expand the functions of a computer and is connected to the system through a PCIE slot on the motherboard. The PCIE card expands the functions of the computer through a high-speed interface, and common types include: graphics cards, storage expansion cards, network cards, sound cards, USB expansion cards, acquisition cards, RAID cards, acceleration cards, Thunderbolt interface cards, etc.

[0029] The PCIE card is often installed at the very end of the server chassis, while high-power-consuming devices such as CPUs and memories are usually arranged at the front end of the chassis. When the server uses air cooling, the air in the chassis flows from the front end to the rear end, that is, it cools the devices such as CPUs and memories first, and then cools the PCIE card. Since the high-power-consuming devices generate a large amount of heat, the temperature of the air will rise after passing through these high-power-consuming devices. When it reaches the PCIE card, the temperature of the air is relatively high, and the heat taken away from the PCIE card is reduced, resulting in a poor heat dissipation effect of the PCIE card.

[0030] In some related technologies, the following several structural forms are adopted for the heat dissipation of the PCIE card: The first is to add a wind guide cover structure in the chassis. The wind guide cover is used to direct the air flow to the PCIE card as much as possible and isolate the hot air flowing through the high-power-consuming devices, thereby optimizing the heat dissipation of the PCIE card. Although this can optimize the heat dissipation of the PCIE card to a certain extent, the air flow in the system is fixed, which may lead to poor heat dissipation of other high-power-consuming devices such as CPUs and memories, and at the same time, the wind guide cover structure will also bring troubles to the system structure design.

[0031] The second is to increase the area of the heat sink of the PCIE card. However, the space in the chassis is limited. Increasing the area of the heat sink will occupy more space, and the available space for other devices in the chassis will be reduced. Moreover, in the process of increasing the power consumption of the PCIE card, since the PCIE cards are of standard size, the number of power supply devices on the PCIE card will also increase accordingly, so the challenges of the structural design of the PCIE card itself will increase significantly.

[0032] The third is to use a more powerful fan. The power consumption and cost corresponding to high-specification fans will both increase significantly. For the heat dissipation design of the server system, power consumption and cost are both important control indicators, and increasing the fan specification will result in a decrease rather than an increase in the overall benefit.

[0033] Since the above several heat dissipation forms are not ideal, in order to solve the heat dissipation problem of the PCIE card in the server, this application provides a liquid cooling heat dissipation device and an electronic device, which are more energy-saving and have a higher heat dissipation efficiency compared with air cooling. The occupied space is relatively small, and the maintenance of the PCIE card is also more convenient.

[0034] In a first aspect, an embodiment of this application provides a liquid cooling heat dissipation device. Figure 1 The explosion diagram of the liquid cooling heat dissipation device provided by an embodiment of this application and the heat generating device Figure 2 The assembly diagram of the liquid cooling heat dissipation device provided by an embodiment of this application and the heat generating device. As Figure 1 and Figure 2As shown in the figure, the liquid cooling device includes: a bracket 1, a cold plate 2, and a heat conduction component 3. Among them, the cold plate 2 is fixedly installed on the bracket 1, and the cold plate 2 and the heat conduction component 3 are arranged along the first direction M. The heat conduction component 3 includes a heat conduction plate 301, and the heat conduction plate 301 is thermally connected to the cold plate 2. The heating device 100 is detachably connected to the bracket 1, and the heat conduction component 3 is detachably connected to the heating device 100. The heating device 100 and the heat conduction component 3 are stacked along the second direction N. A relatively large side surface of the heat conduction plate 301 is thermally connected to the heating device 100, and a relatively narrow side surface of the heat conduction plate 301 is thermally connected to the cold plate 2. The heat conduction plate 301 is used to transfer the heat of the heating device 100 to the cold plate 2. The above-mentioned first direction M is perpendicular to the second direction N.

[0035] In the above embodiment, the liquid cooling device can be installed in the chassis of the server. The heating device 100 can be, for example, a PCIE card. The heating device 100 is detachably installed on the bracket 1. During assembly, first, the heating device 100 and the heat conduction component 3 are assembled together to form a module, and then the module as a whole is installed on the bracket 1, which is convenient for maintaining the heating device 100. This module can be called the first module. Two adjacent side surfaces of the heat conduction plate 301 are respectively in contact with the cold plate 2 and the heating device 100, and can transfer the heat of the heating device 100 to the cold plate 2. The cold plate 2 has circulating coolant, and the heat dissipation of the heating device 100 is achieved through the dual effects of direct contact heat conduction and liquid convection heat transfer. The orthogonal layout of the cold plate 2, the heat conduction component 3, and the heating device 100 optimizes the heat flow path in a compact space. Moreover, the heating device 100 and the heat conduction component 3 are detachably connected and installed modularly after being combined into the first module, which is convenient for maintaining the heating device 100.

[0036] Please continue to refer to Figure 1 and Figure 2, in one embodiment, the bracket 1 has a plurality of mounting positions 00 arranged along the second direction N. Each mounting position 00 can mount a heat-conducting component 3 and a heating device 100, that is, one bracket 1 can mount multiple first modules, expanding the number of heating devices 100 in a limited space, thereby improving the device performance. Moreover, one cold plate 2 can dissipate heat from multiple heating devices 100 simultaneously, maximizing the use of space and improving the heat dissipation efficiency. Specifically, the bracket 1 may include a bracket body 101 and a mounting portion 102 arranged in an L shape. The bracket body 101 is provided with a slot (not shown in the figure), and this slot is used for plugging in the heating device 100 to electrically connect the heating device 100 with other hardware devices. The mounting portion 102 is used for fixing the heating device 100. The heating device 100 includes a circuit board 111 and a mounting plate 110. The mounting plate 110 is fixedly connected to the end of the circuit board 111. The mounting plate 110 and the mounting portion 102 are detachably connected by fasteners such as screws. In this embodiment, the bracket 1 can specifically be provided with three mounting positions 00, that is to say, this bracket 1 can mount three heating devices 100. This bracket 1 is applicable to a 2U standard server. A 2U server refers to a server that conforms to the standard rack size, and its height is 2 rack units (2U). Here, "U" is the height unit when the server and network equipment are installed in the rack, and 1U is equal to 1.75 inches (about 4.45 cm), so the height of a 2U server is 3.5 inches (about 8.89 cm). The width and depth of a 2U server are usually compatible with the standard 19-inch rack size. After the heating device 100 and the liquid cooling and heat dissipation device are assembled, a module is formed, and this module can be called a second module. Multiple second modules can be configured in the server to expand the heating device 100, and modular installation facilitates the later maintenance of the device.

[0037] It should be noted that the number of mounting positions 00 of the bracket 1 is not limited to three in the above embodiment, and can also be other numbers, such as one, two, four, five, etc. The size of the bracket 1 and the mounting positions 00 can be designed according to the size of the chassis, or can be selected according to the performance requirements of the server for the heating device 100, and the present application does not make specific limitations. The liquid cooling and heat dissipation device is not limited to being installed in a 2U server, and can also be installed in other sizes of servers, such as 1U, 4U, etc.

[0038] The above-mentioned riser 1 can be a hardware component used to expand and redirect PCIE slots, mainly solving the problem of PCIE card installation caused by chassis space limitations or motherboard layouts. Its core function is to flexibly adjust the physical position and direction of the PCIE card, so as to adapt to different chassis structures. In compact chassis (such as blade servers, small workstations), the motherboard may not directly provide enough physical space to install multiple PCIE cards. The riser 1 extends the PCIE slot to other positions (such as vertical installation or side-by-side arrangement) through an adapter method, making full use of the internal space of the chassis.

[0039] Figure 3 An assembly diagram of the heat conduction component provided for an embodiment of the present application Figure 4 An exploded view of the heat conduction component provided for an embodiment of the present application Figure 5 The back view of the first module provided for an embodiment of the present application. As Figures 3 to 5 As shown, in one embodiment, the heat conduction component 3 can include a heat conduction plate 301 and a fixing clip 302. The fixing clip 302 is connected to the heat conduction plate 301, and the fixing clip 302 is used to fix the heat generating device 100 to the heat conduction plate 301. The fixing clip 302 includes a hook 3021 and a connecting plate 3022. The connecting plate 3022 is fixedly connected to the heat conduction plate 301, and the hook 3021 is located at the edge of the connecting plate 3022. The number of hooks 3021 can be four, for example, but is not limited to this number. After the fixing clip 302 is assembled with the heat conduction plate 301, the connecting plate 3022 is located on the side of the heat conduction plate 301 facing away from the heat generating device 100, and the hooks 3021 surround the outer periphery of the heat conduction plate 301 and extend toward the side where the heat generating device 100 is installed. The hook 3021 is L-shaped, and the hook 3021 and the heat conduction plate 301 enclose a receiving space, and the heat generating device 100 is detachably installed in the receiving space. The hook 3021 can be elastic, and the hook portion 30211 at the end of the hook 3021 away from the connecting plate 3022 inclines toward the connecting plate 3022. After the heat generating device 100 is assembled in the receiving space, the hook portion 30211 of the hook 3021 contacts the heat generating device 100, and applies a certain pressure to the heat generating device 100 in the direction of the heat conduction plate 301, so that the heat generating device 100 is closely attached to the heat conduction plate 301, reducing the thermal resistance and improving the heat transfer efficiency. Since the hook 3021 is elastic, the thickness of the receiving space can be finely adjusted, which can be compatible with various models of heat generating devices 100, improving the versatility of the liquid cooling and heat dissipation device. The above-mentioned various models of heat generating devices 100 can be, for example, 10G, 25G, 100G network cards, etc.

[0040] In one embodiment, a heat conduction boss 3010 is provided on the side of the heat conduction plate 301 facing the heat generating device 100, and the heat conduction boss 3010 is in heat conduction connection with the heat generating device 100. Figure 6The structural diagram of a heating device provided by an embodiment of the present application. In combination with Figure 4 and Figure 6 , the heating device 100 includes a circuit board 111 and a chip 113, and the chip 113 is mounted on the surface of the circuit board 111. The chip 113 is a heat source. The position of the heat conducting boss 3010 corresponds to the position of the chip 113. To improve the heat conduction effect, a heat conducting gasket can also be provided between the heat conducting boss 3010 and the chip 113. There are microscopic unevennesses between the surface of the heat conducting boss 3010 and the chip 113, and the heat conducting gasket fills the gaps through compressive deformation, reducing the interfacial thermal resistance caused by air. The material of the heat conducting gasket may contain one or several of the following components: silicone, acrylic, polyurethane (PU), aluminum oxide (Al2O3), boron nitride (BN), aluminum nitride (AlN), graphene. The heat conducting gasket can also be replaced by coating a heat conducting material.

[0041] In one embodiment, the heat conducting component 3 may further include a heat pipe 303, and the heat pipe 303 is mounted on the side of the heat conducting plate 301 away from the heating device 100. The heat pipe 303 has a capillary structure and is an efficient passive heat transfer component based on phase change heat transfer and capillary force-driven circulation. It realizes the rapid directional transfer of heat through the evaporation and condensation processes of the internal working fluid, while maintaining a very small temperature difference. The heat pipe 303 has a closed vacuum cavity, filled with a volatile working fluid (such as water, ammonia, liquid metal) inside, and the cavity wall is attached with a capillary structure (Wick Structure). It transfers heat from the second end (evaporation section) with a higher temperature to the first end (condensation section) with a lower temperature through the phase change cycle of the working fluid (liquid → gas → liquid) and the liquid reflux driven by capillary force. The heat pipe 303 has the core characteristics of ultra-high thermal conductivity, temperature uniformity, and passive operation, and does not require adding power components to make the condensed working fluid flow back. The extending direction of the heat conducting plate 301 is the third direction P, and the first direction M, the second direction N, and the third direction P are perpendicular to each other. The heat pipe 303 also extends in the third direction P, used to average the temperature of the heat conducting plate 301, and reduce the formation of a hot spot in a certain area of the heat conducting plate 301, such as the area in contact with the heat source, which is not conducive to heat dissipation. When preparing the heat conducting plate 301, an installation groove 3013 can be provided on the side of the heat conducting plate 301 away from the heating device 100, and the heat pipe 303 is embedded and installed in the heat conducting plate 301. To improve the heat transfer efficiency, the heat pipe 303 can be designed as a flat structure, so that the upper and lower surfaces facing away from each other along the second direction N are planes. In this way, the contact area between the heat pipe 303 and the heat conducting plate 301 can be larger, improving the heat transfer efficiency. The heat pipe 303 can be installed on the heat conducting plate 301 through a connector 0, or can be welded to the heat conducting plate 301.

[0042] The heat conduction component 3 may include multiple heat pipes 303. The number of heat pipes 303 may be one, two, three, etc., and can be set according to factors such as the width of the heat conduction plate 301 and the number of heat sources. The present application does not make specific limitations on the number of heat pipes 303.

[0043] In some of the above embodiments, the heat conduction plate 301 may be a flat plate structure. Please continue to refer to Figure 4 and Figure 6 , when the PCIE card is a network card, the circuit board 111 of the PCIE card usually has a chip 113 and an optical communication device 114, and both the chip 113 and the optical communication device 114 are heat sources. The optical communication device 114 may specifically be an optical module. Along the direction perpendicular to the circuit board 111, the height of the optical communication device 114 is greater than the height of the chip 113. In order to achieve efficient heat dissipation for heat sources of different heights. In one embodiment, the heat conduction plate 301 may be designed in a stepped shape. Specifically, the heat conduction plate 301 includes a first heat conduction part 3011 and a second heat conduction part 3012, and the first heat conduction part 3011 and the second heat conduction part 3012 are not on the same horizontal plane. The heating device 100 includes a first heat source (chip 113) and a second heat source (optical communication device 114), and the first heat conduction part 3011 is in thermal connection with the first heat source, and the second heat conduction part 3012 is in thermal connection with the second heat source.

[0044] In other embodiments, the heat conduction plate 301 is not limited to the flat plate structure or the stepped structure in the above some embodiments, and may also be other special-shaped structures (not shown in the figure). For example, the surface of the heat conduction plate 301 facing the heating device 100 has multiple grooves or protrusions, the grooves correspond to the heat source devices with higher heights, and the protrusions correspond to the heat source devices with lower heights. The heat conduction plate 301 with a special-shaped structure can adapt to the heights of different heat sources on the heating device 100.

[0045] Continue to refer to Figure 6 , in a further embodiment, the heat pipe 303 includes a first end 3031 and a second end 3032. The first end 3031 is attached to the first heat conduction part 3011, and the second end 3032 is attached to the second heat conduction part 3012 to average the temperature of the entire heat conduction plate 301. The first heat conduction part 3011 and the second heat conduction part 3012 are arranged in a stepped shape, and the heat pipe 303 can also be designed in a stepped shape. The heights of the first end 3031 and the second end 3032 are different to adapt to the heights of the first heat conduction part 3011 and the second heat conduction part 3012.

[0046] Figure 7 The structural diagram of the first module provided by an embodiment of the present application, in combination with Figure 1 and Figure 7In one embodiment, the plug-in direction of the heating device 100 is the first direction M, and the heating device 100 has a conductive connection portion 115 (gold finger), which is located at the edge of the circuit board 111. After the heating device 100 is installed in the liquid cooling heat dissipation device, the conductive connection portion 115 is plugged into the slot of the bracket 1 (not shown in the figure), and the slot is located at the mounting portion 102 of the bracket 1. Since the cold plate 2 is located between the heat conductive component 3 and the mounting portion 102 of the bracket 1, in order to enable the heating device 100 to be plugged into the slot. The cold plate 2 is provided with an avoidance hole 20, and the avoidance hole 20 is used to allow the conductive connection portion 115 of the heating device 100 to pass through. The narrower side 3014 of the heat conductive plate 301 is in contact with the cold plate 2. The number of avoidance holes 20 may correspond to the number of mounting positions 00 on the bracket 1. For example, in some of the above embodiments, there are three mounting positions 00 on the bracket 1, and three first modules can be installed along the second direction N, so the cold plate 2 can be provided with three avoidance holes 20.

[0047] In other embodiments, the number of avoidance holes 20 may not correspond to the number of mounting positions 00 on the bracket 1. If the width of the cold plate 2 along the second direction N is narrow, the outermost gold finger can pass through the outside of the cold plate 2 and be plugged into the slot. Figure 1 The bracket 1 shown can be equipped with three first modules, and the cold plate 2 may be provided with only two avoidance holes 20 .

[0048] The cold plate 2 is the core heat dissipation component in the liquid cooling system. It guides the flow of coolant through the internal flow channel to absorb the heat generated by the heating device 100. In high-density equipment such as servers, the internal structure design of the cold plate 2, the distribution of inlet and outlet water pipes, and the connection method of multiple cold plates 2 directly affect the heat dissipation efficiency. In one embodiment, the cold plate 2 includes a substrate, a flow channel, a water inlet 201 and a water outlet 202. The substrate is made of a high thermal conductivity material, such as copper, aluminum, etc. A flow channel is provided inside the substrate, and the types of flow channels include: serpentine flow channels, parallel flow channels, tree-like flow channels, etc. This application does not specifically limit the type of flow channel. The water inlet 201 and the water outlet 202 are used to connect external pipelines to realize the circulation of the coolant. In this embodiment, the water inlet 201 and the water outlet 202 of the cold plate 2 are located on the same side, both at one end of the cold plate 2 away from the mounting portion 102 of the bracket 1. The water inlet 201 and the water outlet 202 are both installed with quick-connect connectors to facilitate the replacement or expansion of the cold plate 2.

[0049] A thermally conductive gasket may be further provided between the heat conductive plate 301 and the cold plate 2 to improve the heat conductive effect of the heat conductive plate 301 and the cold plate 2 .

[0050] On the other hand, an embodiment of the present application further provides an electronic device. Figure 8 A structural diagram of an electronic device provided in an embodiment of the present application, such as Figure 8As shown, the electronic device includes a PCIE card 200 and the liquid cooling device 300 in some of the above embodiments. The PCIE card 200 is detachably connected to the bracket 1.

[0051] The electronic device can specifically be a server. The electronic device may include a chassis 500 and multiple liquid cooling devices 300. The multiple liquid cooling devices 300 are installed inside the chassis 500, and the cold plates 2 of each liquid cooling device 300 are connected in series or in parallel through a pipeline 400 and a liquid distributor (not shown in the figure). Figure 6 A connection method with the cold plates 2 connected in series is shown. The liquid distributor is used to divide the main pipeline into multiple branches to ensure balanced flow rate of each cold plate 2. Quick connectors 203 are provided at both the water inlet 201 and the water outlet 202 of the cold plate 2 of each liquid cooling device 300, which is convenient for transferring the pipeline and has high flexibility. After the PCIE card 200 and the liquid cooling device 300 are assembled, a second module is formed. Multiple second modules can be configured in the electronic device to further expand the PCIE card 200. Multiple first modules and second modules in the electronic device can be disassembled and replaced as needed. The electronic device of the present application adopts a modular design, can achieve decoupling of each module, can adapt to different types of PCIE cards 200 and servers with different configuration requirements, and has strong adaptability. And it has good scalability and convenience in assembly.

[0052] In one embodiment, the above pipeline 400 can be a flexible hose and can be bent. The above second modules can be stacked in the N layer along the second direction, or arranged side by side in the first direction M or the third direction P. The specific setting position can be set according to the space layout inside the chassis, and the present application does not make specific settings.

[0053] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these changes and modifications.

Claims

1. A liquid cooling heat dissipation device, characterized in that, include: Brackets, cold plates and thermally conductive components; The cold plate and the heat-conducting component are arranged along a first direction, the cold plate is fixedly connected to the bracket, the heat-conducting component includes a heat-conducting plate, the heat-conducting plate is heat-conductingly connected to the cold plate, the heating device is detachably connected to the bracket, and the heating device and the heat-conducting component are stacked along a second direction, the heat-conducting component is detachably connected to the heating device, and the first direction is perpendicular to the second direction.

2. The liquid cooling and heat dissipation device according to claim 1, characterized in that The heat-conducting assembly further includes a fixing clip, which is connected to the heat-conducting plate. The fixing clip and the heat-conducting plate are combined to form an accommodating space, and the heating device is detachably installed in the accommodating space.

3. The liquid cooling heat dissipation device according to claim 1, characterized in that, The heat conducting plate includes a first heat conducting portion and a second heat conducting portion arranged in a stepped shape, the heat generating device includes a first heat source and a second heat source, the first heat conducting portion is thermally connected to the first heat source, and the second heat conducting portion is thermally connected to the second heat source.

4. The liquid cooling and heat dissipation device according to claim 3, wherein A heat-conducting boss is provided on one side of the heat-conducting plate facing the heat-generating device, and the heat-conducting boss is thermally connected to the first heat source.

5. The liquid cooling heat dissipation device according to claim 3, wherein The heat-conducting assembly also includes a heat pipe, which is installed on a side of the heat-conducting plate away from the heating device; the heat pipe includes a first end and a second end, the first end is in contact with the first heat-conducting part, and the second end is in contact with the second heat-conducting part.

6. The liquid cooling and heat dissipation device according to claim 1, characterized in that The cold plate has an avoidance hole, and the avoidance hole is used for the conductive connection part of the heating device to pass through.

7. The liquid cooling and heat dissipation device according to claim 1, wherein, A thermally conductive gasket is provided between the thermally conductive plate and the cold plate.

8. The liquid cooling and heat dissipation device according to claim 1, characterized in that The cold plate has a water inlet and a water outlet, and both the water inlet and the water outlet are equipped with quick-connect connectors.

9. The liquid cooling heat dissipation device according to claim 1, wherein The bracket has a plurality of mounting positions arranged along the second direction, and each of the mounting positions is provided with a heating device and a heat-conducting component.

10. An electronic device, characterized in that, It comprises a PCIE card and the liquid cooling device according to any one of claims 1 to 9, wherein the PCIE card is detachably connected to the bracket.

Images