Ceramic packaging card and manufacturing process of ceramic packaging card

Abstract

The technical scheme of the invention discloses a ceramic packaging card and a manufacturing process of the ceramic packaging card, and is used for solving the problems that an existing card body is easy to wear and deform, poor in high temperature resistance / corrosion resistance, low in safety level, easy to tamper, low in signal interference and low in function integration level. The plastic card can avoid the falling risk of split bonding and reduce the fracture risk caused by external force, and meanwhile, due to the ceramic material, the plastic card is more suitable for high-temperature and high-corrosion scenes compared with a common plastic card. Wherein the antenna unit is arranged in the ceramic packaging card, the chip is positioned through a mounting groove formed by punching or milling and is electrically connected with the antenna unit, and the antenna unit is combined in the integrated ceramic base body in a co-firing mode so as to reduce interface impedance. And interference is shielded through the ceramic matrixes on the two sides, signal attenuation is reduced, and the misreading rate in a strong electromagnetic field is reduced.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of identification cards, and specifically relates to a ceramic encapsulated card and a manufacturing process thereof. Background Art

[0002] Traditional smart cards are mostly made of plastic materials such as PVC and PET or metal materials. Plastic cards are prone to wear, deformation, and are not resistant to high temperatures; metal cards require an additional electromagnetic shielding layer, which affects signal sensitivity. In addition, the existing anti-counterfeiting means of ceramic cards are single and are easily counterfeited; the integration process of the antenna and the chip is complex and it is difficult to be compatible with high-frequency signal transmission. Therefore, there is an urgent need for a ceramic encapsulated card and a manufacturing process that are integrally formed, highly reliable, and support multi-functional integration. Summary of the Invention

[0003] To solve the above technical problems, the present disclosure provides a ceramic encapsulated card. The ceramic encapsulated card includes an integrated ceramic substrate formed by co-firing two flexible green tapes, and an antenna unit and a chip are integrated inside. The antenna unit is formed on at least one flexible green tape by screen printing process or arranged by means of preformed high-temperature resistant coil embedding. The chip is positioned by an installation groove formed by punching or milling and is electrically connected to the antenna unit.

[0004] In one embodiment, the flexible green tape is embedded with micro-letters and / or anti-counterfeiting patterns, and the micro-letters and / or anti-counterfeiting patterns are integrally formed with the ceramic substrate through a sintering process.

[0005] In one embodiment, the flexible green tape is a soft sheet made by mixing ceramic powder and binder.

[0006] In one embodiment, the thickness of the flexible green tape is between 0.1 mm and 2.0 mm.

[0007] In one embodiment, the ceramic substrate is provided with a decorative groove, and one or more of noble metal blocks, wood chips, stones, resins, ceramics, glasses, ores are inlaid in the decorative groove.

[0008] In one embodiment, the surface of the ceramic encapsulated card is provided with a decorative layer, and the decorative layer is an electroplated layer, a printed layer or a laser engraved layer.

[0009] In one embodiment, the ceramic encapsulated card is a non-contact smart card or a dual-interface card.

[0010] The present disclosure provides a manufacturing process of a ceramic encapsulated card, including the following steps:

[0011] Mix ceramic powder and binder to make a flexible green ceramic tape, and at least one flexible green ceramic tape is provided with antenna units; stack the flexible green ceramic tapes in alignment, and add a ceramic sintering adhesive to bond the flexible green ceramic tapes; sinter the flexible green ceramic tapes into an integral ceramic matrix through a co-firing process; the sintered ceramic matrix is cut and polished by laser into a flat and smooth ceramic sheet; electroplate and / or print and / or laser engrave the appearance layer of the ceramic sheet.

[0012] In one embodiment, the antenna units are formed on the flexible green ceramic tape by screen printing process, or are arranged by means of embedding preformed high-temperature resistant coils.

[0013] In one embodiment, the co-firing process is a low-temperature co-fired ceramic process, and the sintering temperature is 850°C to 900°C, and the antenna units are printed with silver or copper paste; or the co-firing process is a high-temperature co-fired ceramic process, and the sintering temperature is 1300°C to 1600°C, and the antenna units adopt tungsten, molybdenum or graphene conductive materials.

[0014] In one embodiment, the chip is positioned through the mounting groove, and the mounting groove is formed by punching on the flexible green ceramic tape, or is milled by a engraving machine on the sintered ceramic matrix.

[0015] A ceramic package card and a manufacturing process thereof provided by the present disclosure are used to solve the problems of easy wear, easy deformation, poor high-temperature resistance / corrosion resistance, low security level and easy tampering, signal interference, and low function integration degree of the existing card body. In the present disclosure, the ceramic package card adopts an integral ceramic matrix formed by sintering, which can avoid the risk of falling off of split bonding and reduce the risk of fracture caused by external force. At the same time, due to its own ceramic material, it is more suitable for high-temperature and high-corrosion scenarios than ordinary plastic cards. Among them, the antenna units are arranged inside the ceramic package card, the chip is positioned through the mounting groove formed by punching or milling, and is electrically connected to the antenna units. The antenna units are co-fired and combined inside the integral ceramic matrix to reduce the interface impedance, and the interference is shielded by the ceramic matrix on both sides, the signal attenuation is reduced, and the misreading rate in a strong electromagnetic field is reduced. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art.

[0017] Figure 1 is a cross-sectional view of the ceramic package card;

[0018] Figure 2 is a front structural schematic diagram of the ceramic package card;

[0019] Figure 3 is an exploded perspective view of the three-dimensional structure of the ceramic package card.

[0020] 1. Flexible green tape; 2. Decorative layer; 3. Antenna element; 4. Chip; 5. Mounting groove; 6. Decorative groove. Detailed implementation manners

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] Traditional smart cards are mostly made of plastic materials such as PVC and PET or metal materials. Plastic cards are easy to wear, deform, and are not resistant to high temperatures; metal cards need to be additionally provided with an electromagnetic shielding layer, which affects signal sensitivity. In addition, the existing ceramic cards have a single anti-counterfeiting means and are easy to be counterfeited; the integration process of the antenna and the chip is complex and it is difficult to be compatible with high-frequency signal transmission. Therefore, there is an urgent need for a ceramic packaging card and a manufacturing process that are integrally formed, highly reliable, and support multi-functional integration.

[0023] To solve the defects and problems existing in the existing smart cards, the present disclosure provides a ceramic packaging card. The following is a further elaboration and explanation of the solution with reference to specific embodiments and attached Figure 1 - attached Figure 3 drawings.

[0024] The present disclosure provides a ceramic packaging card, including an integrated ceramic matrix formed by co-firing and sintering two pieces of flexible green tape 1 in alignment. An antenna element 3 and a chip 4 are integrated inside it. The ceramic packaging card adopts a sintered integrated ceramic matrix, which can avoid the risk of falling off of split bonding and reduce the risk of fracture caused by external forces. At the same time, due to its own ceramic material, it is more suitable for high-temperature and high-corrosion scenarios than ordinary plastic cards. Among them, the antenna element can be formed on at least one piece of flexible green tape 1 by screen printing technology and located on the opposite side of the flexible green tape 1, or can be arranged inside the ceramic packaging card by the way of embedding a preformed high-temperature resistant coil. The antenna element 3 is co-fired and combined inside the integrated ceramic matrix to reduce the interface impedance, and shields interference through the ceramic matrix on both sides, reduces signal attenuation and reduces the misreading rate in a strong electromagnetic field. The chip 4 is positioned by a mounting groove 5 formed by punching or milling and is electrically connected to the antenna element 3. Optionally, the ceramic packaging card can be sintered from two or more pieces of flexible green tape 1, and multiple pieces of green tape and the antenna element 3 between the green tapes can be stacked as needed.

[0025] In one embodiment, the flexible green ceramic tape 1 is embedded with microtext and / or anti-counterfeiting patterns, and the microtext and / or anti-counterfeiting patterns are integrally formed with the ceramic matrix through a sintering process. The microtext and anti-counterfeiting patterns can be designed inside or on the surface of the ceramic matrix, and the embedded anti-counterfeiting features cannot be removed by surface grinding, having a higher anti-counterfeiting level.

[0026] In one embodiment, the flexible green ceramic tape 1 is a soft sheet made by mixing ceramic powder and an adhesive. The adhesive can be selected from one or more of polyvinyl alcohol, polyacrylate, cellulose derivatives, polyethylene glycol, polyvinylpyrrolidone, and epoxy resin according to the sintering temperature to enhance the adhesion between the green ceramic tapes and reduce the thermal decomposition residues.

[0027] In one embodiment, the flexible green ceramic tape 1 is made by a calendering process, with moderate flexibility and a thickness between 0.1 mm and 2.0 mm. The green ceramic tape is easy to process and does not deform easily after sintering. In other embodiments, the thickness can also be adjusted as needed.

[0028] In one embodiment, the ceramic matrix is provided with a decorative groove 6, and the decorative groove 6 is inlaid with one or more of noble metal blocks, wood chips, stones, resins, ceramics, glasses, and ores to form an appearance pattern with recognition and aesthetics. Optionally, the inlay material is arranged in the installation groove 5 or in other decorative grooves 6 independently opened from the installation groove 5.

[0029] In one embodiment, the surface of the ceramic packaging card is provided with a decorative layer 2, and the decorative layer 2 is an electroplated layer, a printed layer, or a laser engraved layer. A metal film with stable properties such as electroless nickel plating followed by electroplating with gold can be selected, or a printed gradient color pattern can be selected, or anti-counterfeiting graphics such as two-dimensional codes and microtext can be engraved on the surface of the ceramic packaging card.

[0030] In one embodiment, the antenna unit 3 supports NFC communication and is applicable to contactless smart cards; the chip 4 is arranged corresponding to the installation groove 5 outside the antenna unit 3 and its pins are connected to external contact pads, applicable to dual-interface cards. In another embodiment, the ceramic packaging card can embed a magnetic stripe in the magnetic stripe groove on the edge of the matrix, thereby being compatible with three methods of swiping, inserting, and induction, expanding the application scenarios, and being applicable to membership cards, gift cards, recharge cards, transportation cards, financial cards, etc.

[0031] The present disclosure provides a manufacturing process for a ceramic packaging card, including the following steps:

[0032] Mix ceramic powder and binder to make a flexible green tape 1, and an antenna unit 3 is disposed on at least one flexible green tape 1; stack the flexible green tapes 1 in alignment, and add a ceramic sintering adhesive to bond the flexible green tapes 1; sinter the flexible green tapes 1 into an integral ceramic matrix through a co-firing process; the sintered ceramic matrix is cut and polished by laser into a flat and smooth ceramic sheet; electroplate and / or print and / or laser engrave the appearance layer of the ceramic sheet. This ceramic encapsulation card uses the flexible green tape 1 and the built-in antenna unit 3 to be co-fired and sintered to form an integral ceramic matrix, and the antenna unit 3 is tightly combined with the ceramic matrix, so as to provide a ceramic encapsulation card with integral molding, strong anti-counterfeiting property, high structural strength, stable chemical properties and capable of shielding interference.

[0033] In one embodiment, the antenna unit 3 is formed on the flexible green tape 1 through a screen printing process, or is arranged by using a preformed high-temperature resistant coil embedding method, and then the antenna unit 3 is sintered inside the ceramic matrix through a co-firing process. Optionally, the antenna unit 3 is made of silver, copper, tungsten, molybdenum or graphene conductive material.

[0034] In one embodiment, the co-firing process is a low-temperature co-fired ceramic process, and the sintering temperature is 850°C to 900°C. The antenna unit 3 is printed with silver or copper paste, the sintering temperature is low, and the energy consumption is reduced, which is suitable for mass production. Optionally, in another embodiment, the co-firing process is a high-temperature co-fired ceramic process, and the sintering temperature is 1300°C to 1600°C. The antenna unit 3 uses tungsten, molybdenum or graphene conductive material to ensure that the binder is completely decomposed at high temperature.

[0035] In one embodiment, the chip 4 is positioned through the mounting groove 5. The mounting groove 5 can be formed by precision punching before the green tape lamination. After the chip 4 is embedded, it is fixed by ultrasonic welding. By combining the punching and welding processes, the installation efficiency is improved, and the risk of microcracks in the ceramic matrix caused by post-milling is avoided. Optionally, in another embodiment, the mounting groove 5 is formed by milling with a engraving machine on the sintered ceramic matrix.

[0036] The above has introduced in detail a ceramic encapsulation card and the manufacturing process of the ceramic encapsulation card provided by the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea and method of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A ceramic package card, characterized in that, The ceramic package card includes an integrated ceramic substrate formed by co-firing two flexible green ceramic tapes, with an antenna unit and a chip integrated therein. The antenna unit is formed on at least one flexible green ceramic tape by screen printing process or arranged by using a preformed high-temperature resistant coil embedding method. The chip is positioned by an installation groove formed by punching or milling and is electrically connected to the antenna unit.

2. The ceramic package card according to claim 1, wherein , The flexible green ceramic tape is embedded with micro-letters and / or anti-counterfeiting patterns, and the micro-letters and / or anti-counterfeiting patterns are integrally formed with the ceramic substrate through a sintering process.

3. The ceramic package card according to claim 1, characterized in that , The flexible green ceramic tape is a soft sheet made by mixing ceramic powder and binder, and the thickness of the flexible green ceramic tape is between 0.1 mm and 2.0 mm.

4. The ceramic package card according to claim 1, wherein, The ceramic substrate is provided with a decorative groove, and one or more of noble metal blocks, wood chips, stones, resins, ceramics, glasses, ores are inlaid in the decorative groove.

5. The ceramic package card according to claim 1, wherein , A decorative layer is provided on the surface of the ceramic package card, and the decorative layer is an electroplated layer or a printed layer or a laser engraved layer.

6. The ceramic package card according to any one of claims 1-5, characterized in that, The ceramic package card is a non-contact smart card or a dual-interface card.

7. A manufacturing process for a ceramic packaging card, characterized in that, Including the following steps: Mix ceramic powder and binder to make a flexible green ceramic tape, and an antenna unit is arranged on at least one flexible green ceramic tape; stack the flexible green ceramic tapes in alignment, add a ceramic sintering adhesive to bond the flexible green ceramic tapes; sinter the flexible green ceramic tapes into an integrated ceramic substrate through a co-firing process; the sintered ceramic substrate is cut and polished into a flat and smooth ceramic sheet by laser; electroplate and / or print and / or laser engrave the appearance layer of the ceramic sheet.

8. The manufacturing process of the ceramic package card according to claim 7, characterized in that, The antenna unit is formed on the flexible green ceramic tape by screen printing process or arranged by using a preformed high-temperature resistant coil embedding method.

9. The manufacturing process of the ceramic package card according to claim 7, characterized in that , The co-firing process is a low-temperature co-fired ceramic process, and the sintering temperature is 850 °C to 900 °C, and the antenna unit is printed with silver or copper paste; or the co-firing process is a high-temperature co-fired ceramic process, and the sintering temperature is 1300 °C to 1600 °C, and the antenna unit uses tungsten, molybdenum or graphene conductive materials.

10. The manufacturing process of the ceramic package card according to claim 7, characterized in that , The chip is positioned by the installation groove, and the installation groove is formed by punching the flexible green ceramic tape or by milling with a engraving machine on the sintered ceramic substrate.

Images