Backlight lamp panel, preparation method thereof and display equipment

Abstract

The invention relates to the technical field of backlight display, in particular to a backlight lamp panel which comprises a substrate with a conductive structure, an LED chip, an optical lens and a reflection module, and the optical lens and the reflection module are arranged on the side, provided with the LED chip, of the substrate. A groove is formed in the face, away from the substrate, of the optical lens, and the bottom of a groove body of the groove is sunken in the direction close to the substrate to form a first groove body. The reflection module comprises a first reflection piece arranged in the first groove body; the projection center of the first reflection piece on the substrate coincides with the projection center of the LED chip on the substrate. According to the backlight lamp panel, the optical lens with the groove and the first reflecting piece is arranged, light which is directly irradiated to the position over the LED chip is partially dispersed on the two sides of the LED chip and then is emitted, the emergent light is transversely laid flat along the plane where the substrate is located, and therefore the light emitting uniformity of the backlight lamp panel is greatly improved, and the visual effect of the backlight lamp panel is improved. The invention further provides a preparation method of the backlight lamp panel and display equipment. The display equipment comprises the backlight lamp panel.

Description

Technical Field

[0001] The present invention relates to the technical field of backlight display, and particularly relates to a backlight panel, a preparation method thereof, and a display device.

Background Art

[0002] With the development of LED technology, people design and choose to manufacture LED display screens of various sizes according to different visual requirements. When the viewing environment of the user is far from the LED display screen, in order to facilitate viewers at a relatively long distance to clearly see the display content completely and reduce production costs, a backlight panel with a relatively large pitch is usually selected to make a large display screen.

[0003] However, for the existing backlight panels with a large pitch, since the light-emitting area of a single LED lamp bead is relatively large, the phenomenon of uneven light emission within a single light-emitting area is likely to occur, resulting in bright and dark bands when the backlight panel displays the light effect, which affects the viewing experience of the viewers.

Summary of the Invention

[0004] To solve the problem that the existing backlight panel with a relatively large pitch has uneven light emission within the light-emitting area of a single LED lamp bead, which affects the visual effect, the present invention provides a backlight panel, a preparation method thereof, and a display device.

[0005] The solution of the present invention to solve the technical problem is to provide a backlight panel, a preparation method thereof, and a display device. The backlight panel includes a substrate, and a conductive structure is provided on the substrate;

[0006] An LED chip, the LED chip is disposed on the substrate and connected to the substrate;

[0007] An optical lens, the optical lens is disposed on one side of the substrate where the LED chip is disposed; a groove is formed on the surface of the optical lens away from the substrate, and the bottom of the groove body is recessed towards the substrate to form a first groove body;

[0008] A reflection module, the reflection module includes a first reflection member disposed in the first groove body;

[0009] The projection center of the first reflection member on the substrate coincides with the projection center of the LED chip on the substrate.

[0010] Preferably, the optical lens further includes a second groove body opened between two adjacent LED chips; the reflection module includes a second reflection member disposed in the second groove body.

[0011] Preferably, the thickness range of the optical lens is between 0.3 mm and 2 mm.

[0012] Preferably, one end of the first groove body close to the substrate has a certain distance from the LED chip, and the range of the distance is 0.1 mm to 1 mm.

[0013] Preferably, the surfaces of the first reflector and the second reflector away from the substrate are parallel to the plane where the substrate is located.

[0014] Preferably, the plane where the highest point of the optical lens is located is higher than the surfaces of the first reflector and the second reflector away from the substrate.

[0015] Preferably, for two adjacent second groove bodies, a transition part chamfered in the direction of the LED chip is provided at the intersection.

[0016] The method for manufacturing the backlight panel includes the following steps:

[0017] S1: Provide a substrate provided with a conductive structure, and dispose an LED chip on one surface of the substrate, and connect the pins of the LED chip to the pads of the substrate;

[0018] S2: Injection-mold an optical lens with grooves, and mount the optical lens on one side of the substrate where the LED chip is disposed; a first groove is opened directly above the LED chip corresponding to the optical lens, and second grooves are formed at intervals between two adjacent LED chips;

[0019] S3: Dispense glue in the first groove and the second groove respectively to form a first reflector and a second reflector.

[0020] Preferably, in the above step S1, the first groove and the second groove are injection-molded and integrally formed when the optical lens is injection-molded.

[0021] The display device includes the backlight panel according to any one of claims 1-7 and a support structure for mounting the backlight panel.

[0022] Compared with the prior art, the backlight panel, the method for manufacturing the same and the display device of the present invention have the following advantages:

[0023] 1. The backlight panel of the present invention includes a substrate with a conductive structure thereon; the backlight panel includes an LED chip disposed on and connected to the substrate; the backlight panel includes an optical lens disposed on one side of the substrate where the LED chip is located; a groove is formed on the side of the optical lens away from the substrate, and the bottom of the groove body is recessed towards the substrate to form a first groove body; the backlight panel further includes a reflection module, and the reflection module includes a first reflection member disposed in the first groove body; the projection center of the first reflection member on the substrate coincides with the projection center of the LED chip on the substrate. By providing an optical lens with a groove and a first reflection member, part of the light directly emitted by the LED chip above is dispersed on both sides of the LED chip and then emitted, so that the emitted light is horizontally flattened along the plane of the substrate, thereby greatly increasing the light emission uniformity of the backlight panel and improving the visual effect of the backlight panel.

[0024] 2. The optical lens of the present invention further includes a second groove body formed between two adjacent LED chips; the reflection module includes a second reflection member disposed in the second groove body. Through the second reflection members arranged around the LED chips, the light emitted by each LED chip along the arrangement of the second groove body is respectively divided into single light-emitting regions, and the light emitted by each LED chip towards the light-emitting region where the adjacent LED chip is located is isolated, which is beneficial to forming independent light-emitting regions for each LED chip and greatly reducing the halo effect generated on the backlight panel.

[0025] 3. The thickness range of the optical lens of the present invention is between 0.3 mm and 2 mm. By restricting the thickness range of the optical lens, the overall thickness of the backlight panel is further restricted, which is beneficial to preparing a backlight panel with an extremely thin thickness.

[0026] 4. One end of the first groove body close to the substrate has a certain distance from the LED chip, and the distance range is 0.1 mm to 1 mm. By setting the distance between the first groove body and the LED chip, when the thickness of the optical lens is limited, the distance between the first reflection member and the upper surface of the LED chip is appropriately increased, and the possible emission range of the light after entering the first reflection member is increased as much as possible, so as to improve the uniformity of the light dispersed to the entire optical lens, and further improve the brightness uniformity of the backlight panel.

[0027] 5. The surfaces of the first reflection member and the second reflection member away from the substrate are parallel to the plane where the substrate is located. By setting the upper surfaces of the two reflection members to be parallel, it is convenient for both to reflect light uniformly and avoid the uneven light emission effect of bright and dark above the first reflection member and the second reflection member.

[0028] 6. The plane where the highest point of the optical lens of the present invention is located is higher than the side of the first reflector away from the substrate and the side of the second reflector away from the substrate. By designing that the maximum height of the optical lens is higher than the highest points of the first reflector and the second reflector, on the one hand, it is convenient for the structure of the optical lens to be formed in one step, reducing the production complexity of the backlight panel; on the other hand, the light transmission of the part of the optical lens higher than the reflector makes up for the possible dark band at the top of the reflector, greatly enhancing the overall visual effect of the backlight panel.

[0029] 7. For two adjacent second grooves of the present invention, a transition part chamfered in the direction of the LED chip is provided at the intersection. By providing a transition part at the intersection of adjacent second grooves, when light is incident at the intersection, the transition part smooths the incident light and then disperses and reflects it, effectively guiding the propagation path of the light path, greatly improving the light utilization rate and visual effect of the backlight panel, and avoiding the generation of shadows at the intersection.

[0030] 8. The present invention provides a method for preparing a backlight panel, including the following steps: S1: Provide a substrate provided with a conductive structure, and arrange an LED chip on one side of the substrate, and connect the pins of the LED chip to the pads of the substrate; S2: Injection-mold an optical lens with a groove 41, and install the optical lens on the side of the substrate where the LED chip is arranged; a first groove is opened directly above the LED chip corresponding to the optical lens, and a second groove is formed at intervals between two adjacent LED chips; S3: Dispense glue in the first groove and the second groove respectively to form a first reflector and a second reflector. By opening the first groove and the second groove corresponding to the LED chip in the optical lens, it is convenient to provide a better support effect when setting the first reflector and the second reflector on the backlight panel, and improve the dispensing accuracy, greatly improving the production efficiency and production accuracy of the backlight panel.

[0031] 9. In step S1 of the present invention, the first groove and the second groove are injection-molded and integrally formed when the optical lens is injection-molded. By the process method of integrally forming the groove with the optical lens, the deformation influence of the optical lens caused by subsequent post-processing such as opening the groove later is minimized, the preparation process cost of the backlight panel is reduced, and at the same time, the opening accuracy of the first groove and the second groove is improved.

[0032] 10. The present invention also provides a display device, including a backlight panel and a support structure for installing the backlight panel, which has the same beneficial effects as the above-mentioned backlight panel and will not be elaborated here.

Description of the Drawings

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for description in the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0034] Figure 1 is a sectional view of the backlight panel provided by the first embodiment of the present invention.

[0035] Figure 2 is an optical path example diagram of the backlight panel provided by the first embodiment of the present invention.

[0036] Figure 3 is a top view of the backlight panel provided by the first embodiment of the present invention.

[0037] Figure 4 is a flowchart of the method for manufacturing a backlight panel provided by the second embodiment of the present invention.

[0038] Figure 5 is a block diagram of the display device provided by the third embodiment of the present invention.

[0039] Explanation of the reference numerals in the drawings:

[0040] 1. Backlight panel; 2. Substrate; 3. LED chip; 4. Optical lens; 5. Reflection module; 6. Display device;

[0041] 41. Groove; 42. First groove body; 43. Second groove body; 44. Transition part; 51. First reflector; 52. Second reflector; 61. Support structure.

Detailed implementation manners

[0042] In order to make the purpose, technical solutions and advantages of the present invention clearer, the following further details the present invention in conjunction with the drawings and implementation examples. It should be understood that the specific implementation examples described herein are only used to explain the present invention and are not used to limit the present invention.

[0043] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0044] In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0045] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to the specific circumstances.

[0046] In addition, the terms "mounted", "arranged", "provided with", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, or there may be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0047] Please refer to Figures 1-3 , a backlight panel 1 is provided in the first embodiment of the present invention, including a substrate 2 having a conductive structure thereon; an LED chip 3 disposed on the substrate 2 and connected to the substrate 2; an optical lens 4 disposed on one side of the substrate 2 where the LED chip 3 is disposed; a groove 41 formed on a surface of the optical lens 4 away from the substrate 2, and the bottom of the groove body of the groove 41 is recessed towards the substrate 2 to form a first groove body 42; a reflection module 5, the reflection module 5 includes a first reflection member 51 disposed in the first groove body 42; the projection center of the first reflection member 51 on the substrate 2 coincides with the projection center of the LED chip 3 on the substrate 2.

[0048] Specifically, in this embodiment, the optical lens 4 is formed by injection molding and uses silicone as the material.

[0049] Understandably, when light is emitted from the LED chip 3, the light emitted directly upward by the LED chip 3 is reflected by the first reflector 51 and then dispersed away from the LED chip 3 within the optical lens 4. After being reflected twice by the substrate 2, the light is directed towards the inclined surface of the groove 41 and finally refracted out of the optical lens 4 through the groove 41, so that part of the emitted light of the LED chip 3 is evenly dispersed around the side of the LED chip 3, facilitating the light to be emitted from the optical lens 4 and spread horizontally, greatly enhancing the light emission uniformity and visual effect of the backlight panel 1.

[0050] Understandably, on the one hand, the design of the groove 41 enables all the light emitted from the optical lens 4 to pass through the inclined surface of the groove 41 and be refracted during emission, which helps to concentrate the light towards the direction close to the LED chip 3, avoiding light scattering and affecting the light emission of adjacent LED chips 3. On the other hand, the groove 41 simultaneously shortens the propagation path of the light within the optical lens 4, reduces the internal loss of the light, and greatly improves the light utilization rate of the backlight panel 1.

[0051] Specifically, in this embodiment, in order to improve the reflectivity of the substrate 2 to the incident light, the surface of the substrate 2 connected to the LED chip 3 is a high-reflection white oil surface.

[0052] Understandably, part of the light that is reflected twice by the substrate 2 and then directed towards the optical lens 4 is refracted out of the optical lens 4, and the rest is reflected and redirected towards the substrate 2, repeating the above light path reflection steps. Finally, the light after multiple reflections is emitted through the optical lens 4, further improving the distribution uniformity of the horizontally spread light.

[0053] Understandably, among the light emitted by the LED chip 3 in all directions, the light with a larger emission angle is not reflected by the first reflector 51 and directly hits the inclined surface of the groove 41. After being reflected by the inclined surface, it is directed towards the substrate 2 and repeats the above multiple reflection process within the optical lens 4.

[0054] Furthermore, the optical lens 4 further includes a second groove 43 opened between two adjacent LED chips 3; the reflection module 5 includes a second reflector 52 disposed within the second groove 43.

[0055] Understandably, the second groove 43 surrounds the LED chip 3 and divides each LED chip 3 into a separate light-emitting area; when the emission angle of the light emitted by the LED chip 3 is too large, the light directly hits the edge of this light-emitting area, that is, the second groove 43, and is reflected back into this light-emitting area through the reflection of the second reflector 52, preventing the light from entering the light-emitting areas of adjacent LED chips 3, thus preventing light mixing and the generation of a halo effect on the backlight panel 1.

[0056] Understandably, part of the light reflected by the second reflector 52 is directed towards the substrate 2 for multiple reflections, and the remaining part of the light is refracted and exits at the groove 41 of the optical lens 4.

[0057] Specifically, in this embodiment, the groove shape of the second groove body 43 is a cuboid, and the inner wall of the second groove body 43 is perpendicular to the substrate 2.

[0058] Understandably, the design where the inner wall of the groove is perpendicular to the substrate 2 is conducive to the uniform reflection of light, avoiding the second reflector 52 from affecting the uniformity of the light distribution when the light exits from the groove 41, thereby avoiding bright and dark bands on the backlight panel 1, and greatly simplifying the optical path design and manufacturing complexity of the optical lens 4.

[0059] Furthermore, the thickness range of the optical lens 4 is between 0.3 mm and 2 mm.

[0060] Understandably, the overall thickness of the backlight panel 1 changes with the adjustment of the thickness of the optical lens 4, that is, the thickness of the optical lens 4 affects the minimum value of the thickness of the backlight panel 1; when the thickness range of the optical lens 4 is between 0.3 mm and 2 mm, the optical lens 4 maximally limits the overall thickness of the backlight panel 1 while ensuring its normal use performance, which is conducive to the preparation of an extremely thin backlight panel 1, reducing the path length of light propagation inside the optical lens 4, thereby reducing light loss and improving the brightness and light utilization rate of the backlight panel 1.

[0061] Furthermore, one end of the first groove body 42 close to the substrate 2 has a certain distance from the LED chip 3, and the distance range is 0.1 mm to 1 mm.

[0062] Understandably, when the distance between the first groove body 42 and the upper surface of the LED chip 3 is too small, part of the light reflected by the first reflector 51 is retroreflected to the LED chip 3, increasing the light loss and at the same time increasing the heat dissipation burden of the LED chip 3.

[0063] Understandably, in order to better reflect the light emitted by the LED chip 3 and increase the reflection angle that the first reflector 51 can reflect, the distance between the first groove body 42 and the upper surface of the LED chip 3 needs to be appropriately increased; due to the limitation of the overall thickness of the backlight panel 1, when the distance between the first groove body 42 and the upper surface of the LED chip 3 ranges from 0.1 mm to 1 mm, the first reflector 51 has a better reflection effect on the incident light, improving the uniformity of the light dispersed to the entire optical lens 4 and enhancing the brightness uniformity and visual effect of the backlight panel 1.

[0064] Furthermore, the surfaces of the first reflector 51 and the second reflector 52 away from the substrate 2 are parallel to the plane where the substrate 2 is located.

[0065] Understandably, the parallel planes of the first reflector 51 and the second reflector 52 are conducive to uniformly reflecting light, avoiding uneven brightness at the center and around the optical lens 4, and improving the light output effect of the backlight panel 1.

[0066] Understandably, the planar surface design of the reflection module 5 is conducive to the processing and treatment during the dispensing preparation process, and improves the preparation accuracy of the first reflector 51 and the second reflector 52.

[0067] Furthermore, the plane where the highest point of the optical lens 4 is located is higher than the side of the first reflector 51 away from the substrate 2 and the side of the second reflector 52 away from the substrate 2.

[0068] Specifically, the distance range between the plane of the highest point of the optical lens 4 and the side of the first reflector 51 away from the substrate 2 is 0.1 mm to 1.5 mm.

[0069] More specifically, the distance range between the plane of the highest point of the optical lens 4 and the side of the second reflector 52 away from the substrate 2 is 0.2 mm to 1.5 mm.

[0070] Understandably, since the first reflector 51 and the second reflector 52 reflect most of the incident light, there is a problem of relatively low brightness in the upper area of the side of the reflection module 5 away from the substrate 2, resulting in bright and dark bands, and further affecting the visual effect of the backlight panel 1.

[0071] The design that the optical lens 4 is higher than the first reflector 51 adjusts the light-gathering effect, so that part of the light emitted from the optical lens 4 away from the LED chip 3 gathers directly above the first reflector 51, compensating for the possible dark band above the first reflector 51 and enhancing the overall visual effect of the backlight panel 1.

[0072] The design that the optical lens 4 is higher than the second reflector 52 makes there be a light-transmitting structure higher than the groove body on both sides of the groove body of the second reflector 52, facilitating the transmission of a certain amount of light to compensate for the possible dark band at the top of the second reflector 52 and enhancing the overall visual effect of the backlight panel 1.

[0073] Understandably, the design that the height of the optical lens 4 is greater than that of the reflection module 5 facilitates the one-time molding of the optical lens 4 structure during preparation, greatly reducing the process implementation difficulty and preparation complexity of the backlight panel 1.

[0074] Furthermore, at the intersection of two adjacent second grooves 43, a transition portion 44 chamfered in the direction of the LED chip 3 is provided.

[0075] Specifically, when the light emitted by the LED chip 3 enters the intersection of two adjacent second grooves 43, it enters the transition portion 44 and is gently dispersed and then reflected, and propagates again within the optical lens 4.

[0076] Understandably, the transition part 44 effectively guides the propagation of the optical path, avoiding the absorption or scattering of more reflected light during the reflection of the right-angle reflection structure, greatly improving the light utilization rate and visual effect of the backlight panel 1, and reducing the shadow generated at the intersection of two adjacent second groove bodies 43.

[0077] Understandably, the chamfer structure of the transition part 44 also reduces the heat accumulation during the reflection of light, facilitating the improvement of the heat dissipation effect of the optical lens 4, and being beneficial to maintaining the stable operating temperature of the LED chip 3, improving the use effect and service life of the backlight panel 1.

[0078] Please refer to Figure 1 、 Figure 3 and Figure 4 , the second embodiment of the present invention provides a method for manufacturing a backlight panel 1, including the following steps:

[0079] S1: Provide a substrate 2 provided with a conductive structure, and dispose the LED chip 3 on one surface of the substrate 2, and connect the pins of the LED chip 3 to the pads of the substrate 2;

[0080] S2: Injection mold an optical lens 4 having a groove 41, and align the optical lens 4 with the LED chip 3 for installation; a first groove body 42 is opened directly above the LED chip 3 corresponding to the optical lens 4, and a second groove body 43 is formed at intervals between two adjacent LED chips 3;

[0081] S3: Dispense glue in the first groove body 42 and the second groove body 43 respectively to form a first reflector 51 and a second reflector 52.

[0082] Injection molding is a manufacturing process in which molten material is injected into a mold and then cooled and solidified to form the required shape; when manufacturing a backlight panel, injection molding is beneficial to realizing the integrated packaging of the substrate 2 and the optical lens 4, and is suitable for manufacturing optical lenses 4 with complex shapes and high precision and stability requirements.

[0083] Specifically, in this embodiment, the alignment error between the optical lens 4 and the LED chip 3 is within 0.1 mm, and the dimensional error of the optical lens 4 is within 0.05 mm.

[0084] Understandably, in the above step S2, the optical lens 4 can be directly molded on the substrate 2, avoiding the possible generation of bubbles or uneven adhesion during the bonding process of the two, thereby ensuring the tight combination of the optical lens 4 and the substrate 2, improving the dimensional accuracy of the optical lens 4; at the same time, simplifying the production process of the optical lens 4 and greatly improving the production efficiency.

[0085] Understandably, in the above step S2, the optical lens 4 is optionally adhesively bonded to the substrate 2 after being injection-molded externally. This process allows the optical lens 4 to be molded and bonded separately in different environments, providing greater flexibility for the preparation of the optical lens 4.

[0086] Further, in step S3 of the present embodiment, the first reflector 51 and the second reflector 52 are formed by dispensing a high-reflection white glue.

[0087] The high-reflection white glue is a commonly used material in LED packaging. It is usually prepared with epoxy resin or silicone as the base material and functional additives such as tackifiers and fillers added thereto. The main function of the high-reflection white glue is to reflect the light emitted by the LED chip 3 through its own high-reflection characteristics, optimize the propagation path and light output path of the light inside the backlight panel 1, and improve the light utilization rate, light output intensity and light output effect of the backlight panel 1.

[0088] Specifically, in the present embodiment, in order to ensure the light reflection effect of the two reflectors, the high-reflection white glue used to prepare the first reflector 51 fills at least 80% of the first groove 42, and the high-reflection white glue used to prepare the second reflector 52 fills at least 80% of the second groove 43.

[0089] More specifically, the dispensing temperature range for forming the first reflector 51 and the second reflector 52 by dispensing is 45°C to 55°C to ensure that the high-reflection white glue can be fully cured and form the first reflector 51 and the second reflector 52, preventing the first reflector 51 and the second reflector 52 from having irregular shapes due to insufficient curing, thereby affecting their control effect on the light path.

[0090] Understandably, through the opening of the first groove 42 and the second groove 43, the backlight panel 1 can more accurately locate the setting positions when setting the first reflector 51 and the second reflector 52, and play a better supporting role for the two reflectors, greatly improving the dispensing accuracy, and improving the production efficiency and production accuracy of the backlight panel 1.

[0091] Specifically, in the present embodiment, the substrate 2 is prepared with a high-reflection white oil plate having a reflectivity higher than 85% to reduce the light loss generated when the light is reflected at the substrate 2 and facilitate multiple reflections of the light inside the optical lens 4.

[0092] Further, in step S1, the first groove 42 and the second groove 43 are injection-molded and integrally formed when the optical lens 4 is injection-molded.

[0093] Specifically, the opening position of the second groove 43 does not coincide with the position of the necessary injection molding runner reserved in the optical lens 4.

[0094] Understandably, the process method of integrally molding the two slots when injecting the optical lens 4 simplifies the preparation complexity of the optical lens 4, avoids the possible influence on the shape of the optical lens 4 itself when the first slot 42 and the second slot 43 are formed after the optical lens 4 is molded, greatly improves the setting accuracy of the first slot 42 and the second slot 43, is conducive to the shape of the first reflector 51 and the second reflector 52 formed subsequently being more precise and regular, and further optimizes the light reflection effect of the first reflector 51 and the second reflector 52.

[0095] Please refer to Figure 5 , the third embodiment of the present invention further provides a display device 6, including a backlight board 1 and a support structure 61 for mounting the backlight board 1.

[0096] Compared with the prior art, the backlight board, its preparation method and the display device of the present invention have the following advantages:

[0097] 1. The backlight board of the present invention includes a substrate, and a conductive structure is provided on the substrate; the backlight board includes an LED chip, and the LED chip is disposed on the substrate and connected to the substrate; the backlight board includes an optical lens, and the optical lens is disposed on one side of the substrate where the LED chip is provided; a groove is formed on the surface of the optical lens away from the substrate, and the bottom of the groove of the groove is recessed toward the substrate to form a first slot; the backlight board further includes a reflection module, and the reflection module includes a first reflector disposed in the first slot; the projection center of the first reflector on the substrate coincides with the projection center of the LED chip on the substrate. By providing an optical lens with a groove and a first reflector, part of the light directly emitted by the LED chip directly above is dispersed on both sides of the LED chip and then emitted, so that the emitted light is horizontally paved along the plane of the substrate, thereby greatly increasing the light emission uniformity of the backlight board and improving the visual effect of the backlight board.

[0098] 2. The optical lens of the present invention further includes a second slot opened between two adjacent LED chips; the reflection module includes a second reflector disposed in the second slot. By the second reflector disposed around the LED chip, the arrangement of each LED chip along the second slot is respectively divided into a single light-emitting area, and the light emitted by each LED chip in the direction of the light-emitting area where the adjacent LED chip is located is isolated, which is conducive to forming an independent light-emitting area for each LED chip and greatly reducing the halo effect generated on the backlight board.

[0099] 3. The thickness range of the optical lens of the present invention is between 0.3 mm and 2 mm. By limiting the thickness range of the optical lens, the overall thickness of the backlight board is further limited, which is conducive to preparing a backlight board with an extremely thin thickness.

[0100] 4. One end of the first tank body of the present invention close to the substrate has a certain distance from the LED chip, and the range of the distance is from 0.1 mm to 1 mm. By setting the distance between the first tank body and the LED chip, when the thickness of the optical lens is limited, the distance between the first reflector and the upper surface of the LED chip is appropriately increased, and the light-emitting range after the light enters the first reflector is increased as much as possible, so as to improve the uniformity of the light scattered to the entire optical lens, and further improve the brightness uniformity of the backlight panel.

[0101] 5. The surfaces of the first reflector and the second reflector of the present invention away from the substrate are parallel to the plane where the substrate is located. By setting the upper surfaces of the two reflectors parallel, it is convenient for the two to reflect light evenly, and to avoid the uneven light-emitting effect of bright and dark above the first reflector and the second reflector.

[0102] 6. The plane where the highest point of the optical lens of the present invention is located is higher than the surface of the first reflector away from the substrate and the surface of the second reflector away from the substrate. Through the design that the maximum height of the optical lens is higher than the highest points of the first reflector and the second reflector, on the one hand, it is convenient for the structure of the optical lens to be formed in one step, reducing the production complexity of the backlight panel; on the other hand, the light transmission of the part of the optical lens higher than the reflector makes up for the possible dark band at the top of the reflector, greatly enhancing the overall visual effect of the backlight panel.

[0103] 7. For two adjacent second tank bodies of the present invention, a transition part chamfered in the direction of the LED chip is provided at the intersection. By providing a transition part at the intersection of adjacent second tank bodies, when the light enters the intersection, the transition part smooths the incident light and then scatters and reflects it, effectively guiding the propagation path of the light path, greatly improving the light utilization rate and visual effect of the backlight panel, and avoiding the generation of shadows at the intersection.

[0104] 8. The present invention provides a method for preparing a backlight panel, including the following steps: S1: Provide a substrate provided with a conductive structure, and arrange an LED chip on one surface of the substrate, and connect the pins of the LED chip to the pads of the substrate; S2: Injection-mold an optical lens with a groove 41, and install the optical lens on the side of the substrate where the LED chip is arranged; a first tank body is opened directly above the LED chip corresponding to the optical lens, and a second tank body is formed at intervals between two adjacent LED chips; S3: Dispense glue in the first tank body and the second tank body respectively to form a first reflector and a second reflector. By opening the first tank body and the second tank body corresponding to the LED chip on the optical lens, it is convenient for the backlight panel to provide a better support effect when setting the first reflector and the second reflector, and improve the dispensing accuracy, greatly improving the production efficiency and production accuracy of the backlight panel.

[0105] 9. In step S1 of the present invention, the first groove body and the second groove body are injection-molded and integrally formed when the optical lens is injection-molded. By the process method of integrally forming the groove body and the optical lens, the deformation influence of the optical lens caused by post-processing such as additionally opening the groove body later is minimized, the preparation process cost of the backlight board is reduced, and at the same time, the opening precision of the first groove body and the second groove body is improved.

[0106] 10. The present invention also provides a display device, including a backlight board and a support structure for mounting the backlight board, which has the same beneficial effects as the above-mentioned backlight board and will not be elaborated here.

[0107] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A backlight panel, characterized in that, Comprising: A substrate having a conductive structure thereon; An LED chip disposed on and connected to the substrate; An optical lens disposed on one side of the substrate where the LED chip is disposed; a groove is formed on a surface of the optical lens away from the substrate, and a bottom of the groove body is recessed toward the substrate to form a first groove body; A reflection module, the reflection module includes a first reflector disposed in the first groove body; A projection center of the first reflector on the substrate coincides with a projection center of the LED chip on the substrate.

2. The backlight panel according to claim 1, wherein: The optical lens further includes a second groove body formed between two adjacent LED chips; the reflection module includes a second reflector disposed in the second groove body.

3. The backlight panel according to claim 1, wherein: The thickness of the optical lens ranges from 0.3 mm to 2 mm.

4. The backlight panel according to claim 1, characterized in that: One end of the first groove body close to the substrate has a certain distance from the LED chip, and the range of the distance is from 0.1 mm to 1 mm.

5. The backlight panel according to claim 2, characterized in that: A surface of the first reflector and the second reflector away from the substrate is parallel to a plane where the substrate is located.

6. The backlight panel according to claim 5, characterized in that: A plane where the highest point of the optical lens is located is higher than a surface of the first reflector away from the substrate and a surface of the second reflector away from the substrate.

7. The backlight panel according to claim 6, wherein: For two adjacent second groove bodies, a transition portion chamfered in a direction of the LED chip is provided at an intersection.

8. A method for preparing a backlight panel, characterized in that: Including the following steps: S1: Provide a substrate provided with a conductive structure, dispose an LED chip on one surface of the substrate, and connect pins of the LED chip to pads of the substrate; S2: Injection mold an optical lens having a groove, and mount the optical lens on one side of the substrate where the LED chip is disposed; a first groove body is formed directly above the LED chip corresponding to the optical lens, and second groove bodies are formed at intervals between two adjacent LED chips; S3: Dispense glue in the first groove body and the second groove body respectively to form a first reflector and a second reflector.

9. The method for manufacturing a backlight panel according to claim 8, wherein: In the above step S1, the first groove body and the second groove body are injection molded and integrally formed when the optical lens is injection molded.

10. A display device, characterized in that: The display device includes a backlight board according to any one of claims 1-7 and a support structure for mounting the backlight board.

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