Film cutting and pasting system for high-hardness screen protector

Abstract

The invention discloses a film cutting and pasting system for a high-hardness screen protector. The film cutting and pasting system comprises a film cutting device, a size film with the hardness of at least 5H and a film pasting device. The film cutting device can cut the size film through a film cutting tool according to the film pasting device and a mobile device, and then the screen protection sticker suitable for the film pasting device and the mobile device is formed. Therefore, the film cutting and pasting system for the high-hardness screen protector can realize customized screen film pasting from the size film to the completion of film pasting of the mobile equipment.

Description

Technical Field

[0001] The present invention relates to a protective film system and a tool, and particularly to a film cutting and pasting system for a high-hardness screen protective film, which is applicable to cutting a size film with a hardness of at least 5H. Background Art

[0002] Existing film cutting tools are only applicable to cutting soft films with a hardness less than 3H to form conform to the shapes of various mobile devices. However, it is difficult to form a screen protective film with a hardness above 5H to conform to the shapes and qualities of various mobile devices (such as: easy to have burrs or structures that scratch hands) through the existing cutting methods. Therefore, for manufacturers dealing with mobile device film pasting, they can only correspond to different mobile device models by stocking multiple shapes of the screen protective film with a hardness above 5H. This not only greatly increases the inventory cost but also is difficult to meet the film pasting requirements of small-brand mobile devices.

[0003] Therefore, the inventor believes that the above defects can be improved, and thus specifically devotes himself to research and combines the application of scientific principles, and finally proposes the present invention with a reasonable design and effectively improves the above defects. Summary of the Invention

[0004] An object of an embodiment of the present invention is to provide a film cutting and pasting system for a high-hardness screen protective film, which can effectively improve the defects that may be generated by the existing cutting methods.

[0005] An embodiment of the present invention discloses a film cutting and pasting system for a high-hardness screen protector. The film cutting and pasting system for the high-hardness screen protector includes: a film cutting device, which includes: a carrying body; a displacement mechanism installed on the carrying body and capable of moving relative to the carrying body; a processing module installed on the carrying body; wherein, the processing module is electrically coupled to the displacement mechanism to drive the displacement mechanism to move sequentially along a screen cutting path and a hole position cutting path that are different from each other; wherein, the screen cutting path is used to correspond to the contour of the screen of a mobile device; and a film cutting tool installed on the displacement mechanism; wherein, the film cutting tool defines a transverse reference plane perpendicular to its long axis direction and a longitudinal reference plane perpendicular to the transverse reference plane. The film cutting tool includes: a supporting section; and a cutting section connected to the supporting section, and the cutting section has a first side surface, a second side surface corresponding to the first side surface, a secondary cutting edge surface connected to the first side surface, and a main cutting edge surface connected to the second side surface and the secondary cutting edge surface; wherein, the main cutting edge surface and the secondary cutting edge surface are connected to form a main cutting edge, and the main cutting edge is located above the longitudinal reference plane; wherein, the first side surface and the longitudinal reference plane are clamped with an oblique angle between 1 degree and 3 degrees, a first angle between 43 degrees and 47 degrees is formed between the main cutting edge and the transverse reference plane, and the main cutting edge has a length between 0.98 mm and 1.a first height of 0.8 mm; and a sizing film that can be cut into a screen protector through a cutting operation of the film cutting device; wherein the sizing film includes: a use layer having a hard film and an adhering film formed on the hard film; wherein the hard film has a hardness of at least 5H; a buffer layer including a first buffer film attached to the hard film and a second buffer film attached to the first buffer film; wherein the hardness of the hard film, the hardness of the first buffer film, and the hardness of the second buffer film decrease in sequence, and the thickness of the hard film, the thickness of the first buffer film, and the thickness of the second buffer film decrease in sequence; and a bottom layer attached to the adhering film; and wherein when the sizing film is placed in the film cutting device for the cutting operation, the bottom layer of the sizing film is fixed to the carrier body, and the displacement mechanism is driven by the processing module, and the main edge of the cutting tool first cuts along the hole position cutting path with respect to the buffer layer and the use layer to form a positioning profile having a plurality of positioning holes, and then cuts along the screen cutting path to form a screen profile inside the positioning profile, so that the use layer and the buffer layer jointly form a screen block and a positioning block surrounding the screen block and having a plurality of the positioning holes; and a film applicator located downstream of the film cutting device, and the film applicator is formed with: a receiving cavity for positioning the mobile device; and a plurality of positioning posts located on opposite sides of the receiving cavity; wherein the relative positions of the plurality of positioning posts are the same as the relative positions of the plurality of positioning holes of the positioning profile, and the relative positions of the plurality of positioning posts corresponding to the screen of the mobile device are the same as the relative positions of the plurality of positioning holes corresponding to the screen profile; wherein when the receiving cavity of the film applicator positions the mobile device and the plurality of positioning holes of the positioning block are respectively installed on the plurality of positioning posts, the screen block faces the screen of the mobile device and can be pressed to adhere to the screen.

[0006] Optionally, the main edge has a knife tip away from the support section and a top end adjacent to the support section, and the knife edge surface has a bottom edge connected to the knife tip and a top edge connected to the top end; wherein the first side surface and the second side surface are spaced apart from each other, and the cutting section has: a first end surface connected to the first side surface, the second side surface, and the bottom edge of the knife edge surface to jointly form the knife tip; and a second end surface connected to the first side surface, the second side surface, and the top edge of the knife edge surface to jointly form the top end.

[0007] Optionally, the first end surface is formed with a secondary edge extending from the knife tip, and the secondary edge has a second height of between 4 microns and 6 microns corresponding to the major axis direction.

[0008] Optionally, the secondary cutting edge surface is elongated and parallel to the main blade, the width of the secondary cutting edge surface is between 0.01 mm and 0.03 mm, and the area of the main cutting edge surface is at least 5 times the area of the secondary cutting edge surface.

[0009] Optionally, the bottom side of the main cutting edge surface has a height between 0.73 mm and 0.77 mm corresponding to the major axis direction, the support section defines a center line parallel to the major axis direction, and the distance between the first side surface and the center line is less than the distance between the second side surface and the center line; a second angle between 91 degrees and 91.5 degrees is formed between the second side surface and the transverse reference plane.

[0010] Optionally, the cutting section is integrally formed and connected to the support section, the film cutting tool includes a mounting section, and the support section is welded and fixed to the mounting section.

[0011] Optionally, the dimension film has an identification code located in the buffer layer, the film cutting device further includes a scanner mounted on the carrier body, which is electrically coupled to the processing module; wherein, the film cutting and pasting system for the high-hardness screen protector includes a cloud server electrically coupled to the processing module and the scanner; wherein, when the dimension film is fixed to the carrier body, the scanner can scan the identification code to generate a signal, and the cloud server can receive the signal through the processing module to allow the film cutting device to perform the cutting operation.

[0012] Optionally, the thickness of the second buffer film is 75% - 90% of the thickness of the first buffer film, and the thickness of the first buffer film is 60% - 75% of the thickness of the hard film.

[0013] Optionally, the sum of the thickness of the first buffer film and the thickness of the second buffer film is 95% - 105% of the thickness of the bonding film, and the thickness of the hard film is 75% - 90% of the thickness of the bonding film.

[0014] Optionally, the support section has an annular side surface, the first side surface is a flat surface, the second side surface is an arc surface connected to the flat surface, and the arc surface is flush with the annular side surface of the support section.

[0015] In summary, the film cutting and pasting system for the high-hardness screen protector disclosed in the embodiments of the present invention, through the combination of the film cutting device, the dimension film, and the pasting device, enables the film cutting device to perform the cutting operation on the dimension film with at least 5H hardness according to the pasting device and the mobile device, so as to form the screen protector applicable to the pasting device and the mobile device, which has no burrs and no hand-scratching structure, thereby enabling the film cutting and pasting system for the high-hardness screen protector to realize the customized screen pasting from the dimension film to the completion of pasting on the mobile device.

[0016] Furthermore, the film cutting and pasting system for the high-hardness screen protector disclosed in the embodiments of the present invention has specific conditions in the cutting section (such as: the angle range of the bevel angle, the configuration of the secondary cutting edge surface, the first angle corresponding to the main cutting edge is between 43 degrees and 47 degrees, and the first height of the main cutting edge is between 0.98 mm and 1.08 mm), which is beneficial to cutting the dimension film (or the hardened film) with at least 5H hardness.

[0017] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not impose any limitation on the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the film cutting and pasting system for the high-hardness screen protector according to Embodiment 1 of the present invention.

[0019] Figure 2 Three-dimensional schematic diagram of the film cutting tool according to Embodiment 1 of the present invention.

[0020] Figure 3 For Figure 2 Three-dimensional schematic diagram from another perspective.

[0021] Figure 4 For Figure 2 Front view schematic diagram.

[0022] Figure 5 For Figure 2 Side view schematic diagram.

[0023] Figure 6 For Figure 3 Front view schematic diagram.

[0024] Figure 7 For Figure 6 Enlarged schematic diagram of part VII.

[0025] Figure 8 For Figure 1Schematic diagram of the film cutting tool for cutting the film of the above dimensions along the screen cutting path.

[0026] Figure 9 For Figure 1 Schematic diagram of the film cutting tool for cutting the film of the above dimensions along the hole position cutting path.

[0027] Figure 10 Schematic diagram of film pasting of the film cutting and pasting system for the high-hardness screen protector in the first embodiment of the present invention.

[0028] Figure 11 For Figure 10 Schematic diagram of subsequent film pasting action.

[0029] Figure 12 For Figure 11 Schematic diagram of subsequent film pasting action.

[0030] Figure 13 For Figure 12 Schematic diagram of subsequent film pasting action.

[0031] Figure 14 Stereoscopic schematic diagram of the film cutting tool in the second embodiment of the present invention.

[0032] Figure 15 Stereoscopic schematic diagram of another film cutting tool in the second embodiment of the present invention.

[0033] Figure 16 For Figure 15 Stereoscopic schematic diagram from another perspective.

[0034] Figure 17 For Figure 15 Front view schematic diagram.

[0035] Figure 18 For Figure 15 Side view schematic diagram.

[0036] Figure 19 For Figure 16 Front view schematic diagram. Detailed implementation manners

[0037] The following are specific embodiments to illustrate the implementation of the "Film Cutting and Film Applying System for High-Hardness Screen Protectors" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions. This is hereby stated in advance. The following embodiments will further detail the related technical content of the present invention, but the disclosed content is not used to limit the protection scope of the present invention.

[0038] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another, or one signal from another. Additionally, the term "or" used herein should, depending on the actual situation, possibly include any one or a combination of multiple of the associated listed items.

[0039] [Embodiment 1]

[0040] Please refer to Figures 1 to 13 as shown, which is Embodiment 1 of the present invention. This embodiment discloses a film cutting and film applying system for high-hardness screen protectors, which includes a film cutting device 100, a size film 200 applicable to the film cutting device 100, a cloud server 300 electrically coupled to the film cutting device 100, and a film applicator 400 located downstream of the film cutting device 100 (such as: Figures 10 to 13 ), but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the film cutting and film applying system for high-hardness screen protectors may also omit the cloud server 300 according to actual needs.

[0041] It should be noted first that the film cutting and film applying system for high-hardness screen protectors is preferably applied to manufacturers dealing with mobile device film application, and can thus select the model of the mobile device, and perform a cutting operation on the size film 200 through the film cutting device 100 to form a corresponding screen protector 200S, thereby achieving the effect of customized film cutting. That is to say, a film cutting device that is not in the form of customization is different from the film cutting and film applying system for high-hardness screen protectors referred to in this embodiment. In addition, it should be noted that the mobile device is described as a mobile phone in this embodiment, but in other embodiments not shown in the present invention, the mobile device can also vary according to actual needs (such as: tablet computer, watch, or camera).

[0042] Furthermore, in this embodiment, the size film 200 includes a bottom layer 201, a buffer layer 202, and a use layer 203 clamped between the bottom layer 201 and the buffer layer 202. Among them, the use layer 203 has a hard film 2031 and an adhesive film 2032 located on opposite sides respectively, and the bottom layer 201 is attached to the adhesive film 2032 of the use layer 203, while the buffer layer 202 is attached to the hard film 2031 of the use layer 203. Furthermore, in order to facilitate the size film 200 not to produce burrs after being cut and the cutting edge to be smooth and not scratchy, the size film 200 preferably has at least some of the following features, but not limited thereto. The adhesive film 2032 is formed on the hard film 2031, and the hard film 2031 has a hardness of at least 5H. The buffer layer 202 includes a first buffer film 202a attached to the hard film 2031 and a second buffer film 202b attached to the first buffer film 202a. In addition, the bottom layer 201 can be a cut-proof plate 201a, or the bottom layer 201 can include the plate 201a and a dust removal film 201b connected between the plate 201a and the adhesive film 2032, and the present invention does not limit this here.

[0043] Among them, the hardness of the hard film 2031, the hardness of the first buffer film 202a, and the hardness of the second buffer film 202b decrease in sequence, and the thickness of the hard film 2031, the thickness of the first buffer film 202a, and the thickness of the second buffer film 202b decrease in sequence. In this embodiment, the thickness of the second buffer film 202b is 75% - 90% of the thickness of the first buffer film 202a, and the thickness of the first buffer film 202a is 60% - 75% of the thickness of the hard film 2031. Or rather, the sum of the thickness of the first buffer film 202a and the thickness of the second buffer film 202b is 95% - 105% of the thickness of the adhesive film 2032, and the thickness of the hard film 2031 is 75% - 90% of the thickness of the adhesive film 2032.

[0044] For example, the first buffer film 202a is made of a soft material and its thickness can be between 75 micrometers (μm) - 90 micrometers, the thickness of the second buffer film 202b can be between 95 micrometers - 110 micrometers, the thickness of the hard film 2031 can be between 130 micrometers - 190 micrometers, the adhesive film 2032 is a high-viscosity AB glue and its thickness can be between 150 micrometers - 225 micrometers. The thickness of the plate 201a is between 175 micrometers - 225 micrometers, and the dust removal film 201b is white and its thickness is between 100 micrometers - 150 micrometers.

[0045] In addition, in this embodiment, the sizing film 200 further has an identification code 2021 (such as: QR code) located on the buffer layer 202, and the identification code 2021 can be directly printed on the buffer layer 202 or attached to the buffer layer 202 separately. The present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of layers of the sizing film 200 can also be adjusted and changed according to actual needs (such as: omitting the bottom layer 201).

[0046] Furthermore, the sizing film 200 (or the hardening film 2031) is defined to have a hardness of at least 5H (such as: pencil hardness), and the area of the sizing film 200 is larger than the screen area of any mobile device on the market. Accordingly, any film cutting device only used for cutting soft films is different from the film cutting and laminating system of the high-hardness screen protector referred to in this embodiment.

[0047] Moreover, the material of the sizing film 200 can be adjusted and changed according to actual needs. For example, the sizing film 200 can be a flexible protective film and is made of, for example, polyethylene terephthalate (PET), recycled polyethylene terephthalate (RPET), or polymethyl methacrylate (PMMA), but the present invention is not limited thereto.

[0048] Furthermore, in order to be able to cut the sizing film 200 with a hardness of at least 5H, the film cutting device 100 is configured with a film cutting tool 1 having a specific structural design. That is to say, the structural design of the film cutting tool 1 is the key factor for the film cutting device 100 to be able to cut the sizing film 200 with a hardness of at least 5H (such as: in this embodiment, through the cooperation of the film cutting tool 1 and the sizing film 200, a hardening film 2031 with a hardness of 7H can be achieved, and at the same time, the occurrence of burrs on the laminating film can be avoided and the cutting edge is smooth and does not scratch the hand). Accordingly, in the following of this embodiment, the film cutting tool 1 will be introduced first, and then other components of the film cutting device 100 will be described.

[0049] As Figures 2 to 7 shown, the film cutting tool 1 defines a transverse reference plane P1 perpendicular to its long axis direction L and a longitudinal reference plane P2 perpendicular to the transverse reference plane P1. In this embodiment, the film cutting tool 1 includes a mounting section 11, a support section 12 connected to the mounting section 11, and a cutting section 13 connected to the support section 12. The cutting section 13 is integrally formed and connected to the support section 12, and the support section 12 is welded and fixed to the mounting section 11. That is to say, the film cutting tool 1 is a two-piece joint structure, and preferably, the film cutting tool 1 excludes a one-piece structure formed integrally.

[0050] To put it another way, the mounting section 11 and the cutting section 13 are respectively connected to opposite ends of the supporting section 12, and the supporting section 12 is connected to approximately the center of the end surface of the mounting section 11, while the cutting section 13 is offset relative to the end surface of the supporting section 12, but not limited to this.

[0051] The cutting section 13 has a first side surface 131, a second side surface 132 spaced from the first side surface 131, a primary blade surface 136 connected to the first side surface 131, and a main blade surface 133 connected to the second side surface 132 and the secondary blade surface 136. The first side surface 131, the second side surface 132, and the main blade surface 133 are all planar, and the main blade surface 133 and the secondary blade surface 136 are connected to form a main edge 13a, and the main edge 13a is located on the longitudinal reference plane P2, and the secondary blade surface 136 is elongated and parallel to the main edge 13a.

[0052] The first side surface 131 and the longitudinal reference plane P2 have an oblique angle σ3 between 1 and 3 degrees, the main edge 13a and the transverse reference plane P1 form a first angle σ1 between 43 and 47 degrees, and the main edge 13a has a first height H1 between 0.98 mm and 1.08 mm corresponding to the long axis direction L. In addition, the width W136 of the secondary blade surface 136 is between 0.01 mm and 0.03 mm, and the area of ​​the main blade surface 133 is at least 5 times the area of ​​the secondary blade surface 136.

[0053] Accordingly, the film cutting tool 1 passes through the cutting section 13 under certain conditions to facilitate cutting the size film 200. In addition, in order to make the film cutting tool 1 more easily cut the size film 200, the film cutting tool 1 preferably has at least some of the following features, but is not limited thereto.

[0054] Specifically, the support section 12 is defined with a center line C parallel to the long axis direction L, and the center line C is located on the longitudinal reference plane P2 in this embodiment, but is not limited thereto. A distance D131 between the first side surface 131 and the center line C is smaller than a distance D132 between the second side surface 132 and the center line C. A second angle σ2 between 91 degrees and 91.5 degrees is formed between the second side surface 132 and the transverse reference plane P1.

[0055] Furthermore, the main blade 13a has a blade tip 131a away from the support section 12 and a top end 132a adjacent to the support section 12. The main blade face 133 has a bottom edge 1331 connected to the blade tip 131a and a top edge 1332 connected to the top end 132a. Among them, the bottom edge 1331 of the main blade face 133 has a height H1331 of between 0.73 mm and 0.77 mm corresponding to the long axis direction L.

[0056] The cutting section 13 has a first end face 134 and a second end face 135 spaced apart from each other. The first end face 134 is connected to the first side face 131, the second side face 132, and the bottom edge 1331 of the main blade face 133 to jointly form the blade tip 131a. The second end face 135 is connected to the first side face 131, the second side face 132, and the top edge 1332 of the main blade face 133 to jointly form the top end 132a.

[0057] The first side face 131, the first end face 134, the second side face 132, and the second end face 135 are connected and surrounded to form a ring shape and are the ring side faces of the cutting section 13. Among them, there is a blade thickness T13 between the first side face 131 and the second side face 132, and it can be configured with an equal thickness from the first end face 134 to the second end face 135, but it is not limited thereto. That is to say, in other embodiments not shown in the present invention, the blade thickness T13 can also gradually increase from the blade tip 131a to the top end 132a, so as to effectively support the main blade 13a. Further, the blade thickness T13 is preferably 0.26 mm to 0.31 mm, but the present invention is not limited thereto.

[0058] The first end face 134 is formed with a sub-blade 13b extending from the blade tip 131a, and the sub-blade 13b has a second height H2 of between 4 μm and 6 μm corresponding to the long axis direction L. Accordingly, the film cutting tool 1 can make the main blade 13a and the sub-blade 13b cooperate with each other more favorably for cutting the size film 200 through the main blade 13a and the sub-blade 13b with specific conditions, and can effectively avoid the size film 200 from generating burrs on the bonding film 2032, and make the cutting edge smooth and not scratchy.

[0059] It should be further noted that the support section 12 and the cutting section 13 of the film cutting tool 1 are preferably made of tungsten steel or tungsten-containing forged powder high-speed steel, and the outer surface of the cutting section 13 can be further electroplated with a DLC (Diamond Like Carbon) coating, which is an amorphous coating film composed of carbon and hydrogen with both the high hardness of diamond and the lubricity of graphite. Preferably, PVD or PACVD processes are used, but the present invention is not limited thereto. For example, the film cutting tool 1 can also be made of other materials or other hardening treatments can be performed on its outer surface. Furthermore, the support section 12 and the cutting section 13 are made of non-magnetizable materials in this embodiment, while the mounting section 11 is made of magnetizable materials.

[0060] Furthermore, although the film cutting tool 1 is described in this embodiment as being applied to the film cutting device 100, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the film cutting tool 1 can also be used alone (such as for sale) or used in combination with other components according to actual needs.

[0061] As Figure 1 、 Figure 8 and Figure 9 shown above, the above is the structural description of the film cutting tool 1. Next, the other components of the film cutting device 100 will be introduced. The film cutting device 100 includes a carrying body 2, a displacement mechanism 3, a processing module 4, and a scanner 5. The displacement mechanism 3, the processing module 4, and the scanner 5 are all installed on the carrying body 2, and the displacement mechanism 3 and the scanner 5 are electrically coupled to the processing module 4.

[0062] Furthermore, the displacement mechanism 3 can move relative to the carrying body 2, and the processing module 4 can be electrically coupled to the displacement mechanism 3 to drive the displacement mechanism 3 to move sequentially along a screen cutting path and a hole cutting path that are different from each other. In this embodiment, the processing module 4 can establish the screen cutting path and the hole cutting path according to a suitable drawing. The film cutting tool 1 is installed on the displacement mechanism 3 through the mounting section 11 so that the film cutting tool 1 can move synchronously with the displacement mechanism 3. Among them, the mounting section 11 is made of magnetizable material in this embodiment so that the displacement mechanism 3 can fix the mounting section 11 in a magnetic attraction manner, and the displacement mechanism 3 can also drive the mounting section 11 to rotate and change direction during the movement by changing the magnetic force direction corresponding to the mounting section 11.

[0063] In addition, the cloud server 300 is electrically coupled to the processing module 4 and the scanner 5. Thus, when the sizing film 200 is fixed to the carrier body 2, the scanner 5 can scan the identification code 2021 of the sizing film 200 to generate a signal, and the cloud server 300 can receive the signal through the processing module 4 to allow the film cutting device 100 to select a suitable drawing for the cutting operation and the identification of the material of the sizing film 200.

[0064] It should be additionally noted that the processing module 4 further includes a touch screen in this embodiment for the user to input the model of the mobile device to be pasted with the film. Accordingly, the processing module 4 can cause the film cutting device 100 to perform a corresponding cutting operation (e.g., the screen cutting path corresponds to the contour of the screen of the mobile device) according to the model of the mobile device input by the user, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the processing module 4 can also receive a signal from an external device (such as a computer or the user's mobile device) in other ways to obtain the model of the mobile device to be pasted with the film.

[0065] When the sizing film 200 is placed on the film cutting device 100 for the cutting operation to form the screen protector 200S, the sizing film 200 is fixed to the carrier body 2, and the displacement mechanism 3 is driven by the processing module 4, so that the main edge 13a of the cutting knife 1 first cuts along the hole cutting path with respect to the buffer layer 202 and the use layer 203 to form a positioning contour S2 having a plurality of positioning holes 2022, and then cuts along the screen cutting path to form a screen contour S1 inside the positioning contour S2.

[0066] As described above, since the film cutting device 100 cuts into the sizing film 200 from the buffer layer 202 instead of cutting into the sizing film 200 from the bonding film 2032 of the use layer 203, it can effectively reduce the damage to the adhesive layer of the bonding film 2032, avoid the generation of burrs on the use layer 203, and make the cutting edge smooth and not scratchy.

[0067] It should be further noted that the displacement mechanism 3 can drive the film cutting tool 1 to move relative to the sized film 200 in the X-axis direction, Y-axis direction, and Z-axis direction that are perpendicular to each other, and the object to be moved (such as: the film cutting tool 1 or the sized film 200) can be adjusted and changed according to actual needs. For example, the film cutting tool 1 can be driven by the displacement mechanism 3 to move in the X-axis direction and the Z-axis direction, while the sized film 200 is driven by the displacement mechanism 3 to move in the Y-axis direction, so that the film cutting tool 1 can move relative to the sized film 200 along the screen cutting path and the hole position cutting path in sequence.

[0068] Furthermore, after the sized film 200 forms the screen protector 200S through the cutting operation, the use layer 203 and the buffer layer 202 jointly form a screen block 200S1 and a positioning block 200S2 that surrounds the screen block 200S1 and has a plurality of the positioning holes 2022. That is to say, the part 203' of the use layer 203 located within the screen contour S1 is used to adhere to the screen of a mobile device M.

[0069] As Figures 10 to 13 shown, the film applicator 400 is formed with a receiving cavity 401 and a plurality of positioning posts 402 located on opposite sides of the receiving cavity 401. The receiving cavity 401 is used to position the mobile device M. The relative positions of the plurality of positioning posts 402 are the same as the relative positions of the plurality of positioning holes 2022 of the screen contour S1, and the relative positions of the plurality of positioning posts 402 corresponding to the screen of the mobile device M are the same as the relative positions of the plurality of positioning holes 2022 corresponding to the positioning contour S2 (or the edge of the screen block 200S1). It should be noted that the relative positions of the plurality of positioning posts 402 of the film applicator 400 are preferably kept unchanged, but the present invention is not limited thereto.

[0070] Accordingly, when the receiving cavity 401 of the film applicator 400 positions the mobile device M, and the plurality of positioning holes 2022 of the positioning block 200S2 are respectively installed on the plurality of positioning posts 402, the screen block 200S1 (such as: the part 203' of the use layer 203) faces the screen of the mobile device M, so as to be pressed and adhered to the screen.

[0071] [Embodiment 2]

[0072] Please refer to Figures 14 to 19As shown, this is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the same parts will not be elaborated again. The main difference between this embodiment and the first embodiment lies in the cutting section 13 of the film-cutting tool 1, which is specifically described as follows:

[0073] In this embodiment, the film-cutting tool 1 can be adjusted in the cutting section 13 according to design requirements, so as to change the local characteristics of the film-cutting tool 1 (such as the structural strength of the film-cutting tool 1) on the premise of being able to cut the sized film 200 with a hardness of at least 5H. For example, as Figure 14 shown, the film-cutting tool 1 can omit the secondary edge described in the first embodiment in the cutting section 13 according to design requirements.

[0074] Furthermore, as Figures 15 to 19 shown, the support section 12 has an annular side surface, the first side surface 131 is a flat surface 131, and the second side surface 132 is an arc surface 132 connected to the flat surface (that is, the second side surface 132 in this embodiment is arc-shaped and replaces the second side surface, the first end surface and the second end surface in the first embodiment), and the arc surface 132 is flush with the annular side surface of the support section 12. Wherein, the maximum thickness T13 between the flat surface 131 and the arc surface 132 is 40% - 55% of the minimum outer diameter T12 of the support section 12.

[0075] [Technical effects of the embodiments of the present invention]

[0076] To sum up, the film-cutting and film-applying system for a high-hardness screen protector disclosed in the embodiments of the present invention, through the combination of the film-cutting device, the sized film and the film applicator, enables the film-cutting device to cut the sized film with a hardness of at least 5H according to the film applicator and the mobile device, so as to form a screen protector suitable for the film applicator and the mobile device without burrs and no scratching structure, thereby enabling the film-cutting and film-applying system for the high-hardness screen protector to realize customized screen film application from the sized film until the film application of the mobile device is completed.

[0077] Furthermore, the film-cutting and film-applying system for a high-hardness screen protector disclosed in the embodiments of the present invention has specific conditions in the cutting section (such as: the angle range of the bevel angle, the configuration of the secondary cutting edge surface, the first angle corresponding to the main edge is between 43 degrees and 47 degrees, and the first height of the main edge is between 0.98 mm and 1.08 mm, the structural configuration of the sized film), so as to facilitate cutting the sized film (or the hardened film) with a hardness of at least 5H.

[0078] Furthermore, the film cutting tool disclosed in the embodiments of the present invention can also make the main cutting edge and the secondary cutting edge with specific conditions (e.g., the secondary cutting edge has the second height between 4 microns and 6 microns) cooperate with each other more favorably for cutting the size film with a hardness of at least 5H, effectively avoid burrs on the size film in the bonding film, and make the cutting edge smooth and not scratchy.

[0079] The above-disclosed content is only the preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the patent scope of the present invention.

Claims

1. A cutting and pasting system for a high-hardness screen protector, characterized in that The film cutting and pasting system for the high-hardness screen protector includes: A film pasting device, comprising: A carrier body; A displacement mechanism, installed on the carrier body and capable of moving relative to the carrier body; A processing module, installed on the carrier body; wherein, the processing module is electrically coupled to the displacement mechanism to drive the displacement mechanism to move sequentially along a screen cutting path and a hole cutting path that are different from each other; wherein, the screen cutting path is used to correspond to the contour of the screen of a mobile device; and A film cutting tool, installed on the displacement mechanism; wherein, the film cutting tool defines a transverse reference plane perpendicular to its long axis direction and a longitudinal reference plane perpendicular to the transverse reference plane, and the film cutting tool includes: A support section; and A cutting section, connected to the support section, and the cutting section has a first side surface, a second side surface corresponding to the first side surface, a secondary cutting edge surface connected to the first side surface, and a main cutting edge surface connected to the second side surface and the secondary cutting edge surface; wherein, the main cutting edge surface and the secondary cutting edge surface are connected to form a main cutting edge, and the main cutting edge is located above the longitudinal reference plane; Wherein, the first side surface and the longitudinal reference plane form an oblique angle between 1 degree and 3 degrees, a first angle between 43 degrees and 47 degrees is formed between the main cutting edge and the transverse reference plane, and the main cutting edge has a first height between 0.98 mm and 1.08 mm corresponding to the long axis direction; and A dimension film, which can be cut into a screen protector through a cutting operation of the film cutting device; wherein, the dimension film includes: A use layer, having a hard film and an adhesion film formed on the hard film; wherein, the hard film has a hardness of at least 5H; A buffer layer, including a first buffer film attached to the hard film and a second buffer film attached to the first buffer film; wherein, the hardness of the hard film, the hardness of the first buffer film, and the hardness of the second buffer film decrease in sequence, and the thickness of the hard film, the thickness of the first buffer film, and the thickness of the second buffer film decrease in sequence; and A bottom layer, attached to the adhesion film; and Wherein, when the dimension film is placed in the film cutting device for the cutting operation, the bottom layer of the dimension film is fixed to the carrier body, and the displacement mechanism is driven by the processing module to cut the main cutting edge of the film cutting tool relative to the buffer layer and the use layer first along the hole cutting path to form a positioning contour with a plurality of positioning holes, and then cut along the screen cutting path to form a screen contour inside the positioning contour, so that the use layer and the buffer layer jointly form a screen block and a positioning block surrounding the screen block and having a plurality of the positioning holes; and A film pasting device, located downstream of the film cutting device, and the film pasting device is formed with: A containing cavity for positioning the mobile device; and A plurality of positioning posts are located on opposite sides of the accommodating cavity; wherein, the relative positions of the plurality of positioning posts are equivalent to the relative positions of the plurality of positioning holes of the positioning profile, and the relative positions of the plurality of positioning posts corresponding to the screen of the mobile device are equivalent to the relative positions of the plurality of positioning holes corresponding to the screen profile; Wherein, when the mobile device is positioned in the accommodating cavity of the film applicator, and the plurality of positioning holes of the positioning block are respectively installed on the plurality of positioning posts, the screen block faces the screen of the mobile device so as to be pressed and attached to the screen.

2. The film cutting and pasting system for the high-hardness screen protector according to claim 1, wherein The main blade has a blade tip away from the support section and a top end adjacent to the support section. The blade face has a bottom edge connected to the blade tip and a top edge connected to the top end; wherein, the first side face and the second side face are spaced apart from each other, and the cutting section has: A first end face connected to the first side face, the second side face and the bottom edge of the blade face to jointly form the blade tip; and A second end face connected to the first side face, the second side face and the top edge of the blade face to jointly form the top end.

3. The cutting and laminating system for the high-hardness screen protector according to claim 2, wherein The first end face is formed with a secondary blade extending from the blade tip, and the secondary blade has a second height between 4 microns and 6 microns corresponding to the long axis direction.

4. The film cutting and pasting system for the high-hardness screen protector according to claim 1, wherein The secondary blade face is rectangular and parallel to the main blade. The width of the secondary blade face is between 0.01 mm and 0.03 mm, and the area of the main blade face is at least 5 times the area of the secondary blade face.

5. The film cutting and pasting system for the high-hardness screen protector according to claim 2, wherein, The bottom edge of the main blade face has a height between 0.73 mm and 0.77 mm corresponding to the long axis direction. The support section defines a center line parallel to the long axis direction, and the distance between the first side face and the center line is less than the distance between the second side face and the center line; a second angle between 91 degrees and 91.5 degrees is formed between the second side face and the horizontal reference plane.

6. The film cutting and pasting system for the high-hardness screen protector according to claim 1, wherein The cutting section is integrally formed and connected to the support section. The film cutting tool includes a mounting section, and the support section is welded and fixed to the mounting section.

7. The cutting and laminating system for the high-hardness screen protector according to claim 1, characterized in that, The dimension film has an identification code located in the buffer layer. The film cutting device further includes a scanner installed on the carrier body, which is electrically coupled to the processing module; wherein, the film cutting and applying system for the high-hardness screen protector includes a cloud server electrically coupled to the processing module and the scanner; wherein, when the dimension film is fixed to the carrier body, the scanner can scan the identification code to generate a signal, and the cloud server can receive the signal through the processing module to allow the film cutting device to perform the cutting operation.

8. The film cutting and pasting system for the high-hardness screen protector according to claim 1, wherein, The thickness of the second buffer film is 75% to 90% of the thickness of the first buffer film, and the thickness of the first buffer film is 60% to 75% of the thickness of the hardening film.

9. The film cutting and pasting system for the high-hardness screen protector according to claim 1, wherein, The sum of the thickness of the first buffer film and the thickness of the second buffer film is 95% to 105% of the thickness of the bonding film, and the thickness of the hardening film is 75% to 90% of the thickness of the bonding film.

10. The film cutting and pasting system for the high-hardness screen protector according to claim 1, wherein, The support section has an annular side surface, the first side surface is a flat surface, the second side surface is an arc surface connected to the flat surface, and the arc surface is tangent to the annular side surface of the support section.

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