Integrated direct-current filter capacitor power module

Through integrated design and integrated packaging of DC filter capacitor modules, the installation difficulties, poor heat dissipation and high cost of existing devices are solved, and convenient installation, rapid maintenance and efficient heat dissipation are achieved, meeting the application needs of high-power power supplies.

CN120281168APending Publication Date: 2025-07-08CHENGDU HONGYU BOHAN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202510420105.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-03
Publication Date
2025-07-08

AI Technical Summary

Technical Problem

The existing DC filter capacitor devices are inconvenient to install, difficult to maintain, poor heat dissipation effect and high cost, making it difficult to meet the application needs of high-power power supplies.

Method used

Adopting an integrated design, capacitor core sets, polar terminals, IGBT busbars, parallel conductive sheets, etc. are integrated on the shell, and encapsulated with epoxy resin, combining heat dissipation structures and insulating materials to simplify the installation process and improve heat dissipation efficiency.

Benefits of technology

It realizes convenient installation, fast maintenance, low cost, high heat dissipation and high flow capacity, reduces manual installation costs, reduces power loss, and improves the filtering capacity of the capacitor.

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Abstract

The invention relates to an integrated direct-current filter capacitor power module, which comprises a shell, a capacitor core group, a first polarity terminal, a second polarity terminal, a first insulated gate bipolar transistor (IGBT) busbar, a second IGBT busbar, a first parallel conducting strip, a second parallel conducting strip and epoxy resin, the capacitor core group, the first parallel conducting strip, the second parallel conducting strip, the inner end of the first polarity terminal, the inner end of the second polarity terminal, the inner end of the first IGBT busbar and the inner end of the second IGBT busbar are arranged in the shell through the opening, and the opening is packaged by the epoxy resin. The capacitor core group, the first polarity terminal, the second polarity terminal, the first IGBT busbar, the second IGBT busbar, the first parallel conducting strip and the second parallel conducting strip are all integrated on the shell and then are packaged by epoxy resin, and compared with a previous filtering device, the filtering device disclosed by the invention adopts an integrated design, is simplified in structure, convenient and easy to install and short in installation time, and is suitable for large-scale popularization and application. And the comprehensive cost is reduced.
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Description

Technical Field

[0001] The present invention relates to the technical field of filter capacitor power modules, and particularly to an integrated DC filter capacitor power module. Background Art

[0002] In recent years, with the development requirements of low carbon, energy conservation, and cost reduction, the applications of high-power power supplies in heating, smelting, melting, welding, UPS power supplies, photovoltaic inverters, energy storage, etc. have gradually increased. Currently, the power of high-power power supplies has gradually increased from the original 5kW - 25kW to 100kW or even above 500kW.

[0003] As an indispensable key filtering component in the circuit, capacitors play a crucial role in fields such as induction heating, electron beam welding, and photovoltaic inverters. Since capacitors generate heat under the action of high-frequency ripple current, the following direct filter capacitor devices are usually used in the industry as filtering components, such as Figure 1 As shown, it includes multiple cylindrical aluminum shell capacitors a and a composite busbar c. Multiple cylindrical aluminum shell capacitors are connected in parallel on the composite busbar c. However, the above direct filter capacitor device has the following disadvantages: 1. Each cylindrical aluminum shell capacitor a is individually installed on the composite busbar c, and a bottom plate b needs to be installed at the bottom of the composite busbar. This type of direct filter capacitor device is not convenient for installation. With the increasing labor cost year by year, the installation time-consuming by manual is long, and the cost will gradually increase. 2. In addition, it is difficult to replace the capacitor components of this type of direct filter capacitor device, and it is not convenient for maintenance. 3. The adjacent two cylindrical aluminum shells are ventilated and cooled by spacing a certain distance, and the heat dissipation effect is poor. Therefore, the structure of the existing direct filter capacitor device needs to be further improved. Summary of the Invention

[0004] The purpose of the present invention is to provide an integrated DC filter capacitor power module with an integrated structure, convenient installation, and low cost. The present invention can meet the application requirements of convenient installation and maintenance, high current-carrying capacity, high heat dissipation capacity, low comprehensive cost, and high comprehensive performance.

[0005] The purpose of the present invention is achieved as follows: An integrated DC filter capacitor power module includes a housing, a capacitor core group, a first polar terminal, a second polar terminal, a first IGBT busbar, a second IGBT busbar, a first parallel conductive sheet, a second parallel conductive sheet, and epoxy resin. An opening is provided on the housing. The capacitor core group, the first parallel conductive sheet, the second parallel conductive sheet, the inner ends of the first polar terminal, the inner ends of the second polar terminal, the inner ends of the first IGBT busbar, and the inner ends of the second IGBT busbar are inserted into the housing through this opening. The opening is encapsulated with epoxy resin. The first parallel conductive sheet is attached to one side of the capacitor core group, and the second parallel conductive sheet is attached to the other side of the capacitor core group. The capacitor core group is formed by arranging multiple capacitor cores side by side. The first parallel conductive sheet is connected in parallel to one ends of the multiple capacitor cores, and the second parallel conductive sheet is connected in parallel to the other ends of the multiple capacitor cores. The inner ends of the first IGBT busbar and the second IGBT busbar are respectively connected to the first parallel conductive sheet and the second parallel conductive sheet. The inner ends of the first polar terminal and the second polar terminal are respectively connected to the first parallel conductive sheet and the second parallel conductive sheet. The first IGBT busbar and the second IGBT busbar are arranged in pairs. The outer ends of the first IGBT busbar and the second IGBT busbar are spaced apart and arranged side by side. Multiple first IGBT polar terminals are provided at the outer end of the first IGBT busbar, and multiple second IGBT polar terminals are provided at the outer end of the second IGBT busbar corresponding to the positions of the multiple first IGBT polar terminals. The first IGBT polar terminals and the second IGBT polar terminals correspond to each other one by one. In the present invention, the capacitor core group, the first polar terminal, the second polar terminal, the first IGBT busbar, the second IGBT busbar, the first parallel conductive sheet, and the second parallel conductive sheet are all integrated on the housing and then encapsulated with epoxy resin. Compared with the previous filter devices, the present invention adopts an integrated design, with a simplified structure, convenient installation, easy operation, short installation time, and reduced comprehensive cost. The present invention does not require an additional composite busbar, reducing the use of the composite busbar and at the same time reducing the labor installation cost.

[0006] The present invention can be further improved as follows.

[0007] As a further solution, it includes at least two of the first IGBT busbars and at least two of the second IGBT busbars. The opening is rectangular. The first polar terminal and the second polar terminal are respectively located at the first side edge and the second side edge of the opening. At least one pair of the first IGBT busbar and the second IGBT busbar are located at the third side edge of the opening, and at least one pair of the first IGBT busbar and the second IGBT busbar are located at the fourth side edge of the opening.

[0008] As a further solution, the first IGBT busbar, the first parallel conductive sheet, and the first polar terminal are integrally arranged, and the second IGBT busbar, the second parallel conductive sheet, and the second polar terminal are integrally arranged.

[0009] As a further solution, the first IGBT busbar and the second IGBT busbar are vertically arranged at the middle position of the opening, and the first polarity terminal and the second polarity terminal are arranged at one side edge of the opening.

[0010] As a further solution, the opening is arranged on the end face with a smaller area of the housing. Only one said first IGBT busbar and one said second IGBT busbar are provided at the opening. The first IGBT busbar and the second IGBT busbar are arranged at the first side edge of the opening, and the first polarity terminal and the second polarity terminal are arranged at the second side edge of the opening.

[0011] As a further solution, silicone insulating strips are arranged on the four peripheral edges of the opening, so as to avoid the leakage of the capacitor power module.

[0012] As a further solution, insulating paper is arranged between the outer ends of the first IGBT busbar and the second IGBT busbar, and the layer withstand voltage value of the insulating paper ≥ 4kv.AC.

[0013] As a further solution, a heat dissipation structure is arranged on the housing. The heat dissipation structure is integrally arranged with the housing or the heat dissipation structure is mounted on the plane of the housing.

[0014] As a further solution, the heat dissipation structure is a heat dissipation tooth group or a heat dissipation fin group. The thickness of the heat dissipation tooth group or the heat dissipation fin group is greater than 10mm, so as to enhance the heat dissipation capacity of the housing and be more conducive to heat dissipation.

[0015] As a further solution, the capacitor core group, the first parallel conductive sheet and the second parallel conductive sheet are jointly wrapped by an insulating material. The insulating material is mica paper or aramid fiber paper or glass fiber or carbon fiber or heat shrink sleeve, so as to avoid the leakage of the capacitor power module.

[0016] As a further solution, pattern hollow holes are arranged at the positions of the first parallel conductive sheet and the second parallel conductive sheet corresponding to the ends of the capacitor core. The pattern hollow holes are in the shape of mosaic or clover or star or rhombus.

[0017] As a further solution, the outer side walls of two adjacent capacitor cores in the capacitor core group are abutted against each other, so that the structure of the power module of the present invention is compact and has a small volume.

[0018] The capacitor core is a flat capacitor core or a cylindrical capacitor core.

[0019] As a further solution, the capacitor core is prepared into a cylindrical or flat shape by winding a metallized film. The metallized film is obtained by subjecting PS or PP or EPN or PET or PEN or PPS or PEEK or PEEKK or PI or PTFE or PEI or PMI to plasma roughening treatment, and then performing metallization evaporation.

[0020] As a further solution, an evaporated metal layer is provided on the metallized film. The evaporated metal layer includes a non-thickened area, a transition area, and a thickened area, and the transition area is located between the non-thickened area and the thickened area; the width range of the thickened area is 3-5 mm, and the sheet resistance range is 1-4 Ω; the width range of the transition area is 6-30 mm, and the sheet resistance range is between 10-20 Ω; the sheet resistance range of the non-thickened area is 15-60 Ω.

[0021] As a further solution, the evaporated metal layer is one or several materials of aluminum, copper, zinc, or silver in a composite or multi-layer material structure.

[0022] As a further solution, a metal layer is sprayed on the end of the capacitor core, and the material of the metal layer is: tin-zinc, zinc, aluminum, or zinc-aluminum alloy.

[0023] As a further solution, the two ends of the capacitor core are respectively welded to the first parallel conductive sheet and the second parallel conductive sheet. The end of the capacitor core uses a brazing material as the welding material, and the brazing material is tin-zinc, zinc, aluminum, or silver; the welding method for the end of the capacitor core is laser welding, electron beam welding, or soldering iron welding.

[0024] The beneficial effects of the present invention are as follows: (1) In the present invention, the capacitor core group, the first polarity terminal, the second polarity terminal, the first IGBT busbar, the second IGBT busbar, the first parallel conductive sheet, and the second parallel conductive sheet are all integrated on the housing and then encapsulated with epoxy resin. Compared with the previous capacitor filtering device, the present invention adopts an integrated design, with a simplified structure, convenient installation, easy installation, short installation time, and reduced comprehensive cost. The present invention does not require an additional composite busbar, reduces the use of the composite busbar, and at the same time reduces the labor installation cost.

[0025] (2) The structure of the present invention is compact and small in size. The present invention adopts a parallel integrated design of flat capacitor cores or cylindrical capacitor cores, and the capacitor duty cycle is significantly improved. Compared with the series and parallel connection of multiple capacitors of the same type, the volume is reduced by half.

[0026] (3) The present invention has a smaller parasitic inductance. The capacitor core adopts a flat capacitor core design, and the inductance is lower than that of the cylindrical capacitor core. It can reduce the external connection loop, reduce the parasitic inductance, greatly reduce the volume while reducing the parasitic inductance, and at the same time reduce the power loss in the circuit.

[0027] (4) The capacitor housing of the present invention dissipates heat through a heat dissipation structure, with strong heat dissipation ability and high heat dissipation efficiency.

[0028] (5) The present invention has a strong current-carrying capacity of the capacitor. Since the overall parasitic inductance of the present invention is reduced, the power loss of the entire capacitor is reduced, the heat generation is reduced, and the filtering ability of the capacitor bank with the same capacitance is enhanced.

[0029] (6) The on-site maintenance and replacement of the present invention are convenient and fast. The present invention can meet the needs of customers at the application site to replace by themselves. The replacement of components of the previous capacitive filtering device was difficult and not convenient for maintenance.

[0030] (7) The IGBT busbar of the present invention is directly installed in the housing, and the thickness of the IGBT busbar can be adjusted and designed according to the magnitude of the current. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic structural diagram of an existing DC filtering capacitor device.

[0032] Figure 2 is a schematic structural diagram of an integrated DC filtering capacitor power module according to Embodiment 1 of the present invention.

[0033] Figure 3 is a schematic structural diagram of an integrated DC filtering capacitor power module according to Embodiment 1 of the present invention from another angle.

[0034] Figure 4 is a top view of an integrated DC filtering capacitor power module according to Embodiment 1 of the present invention.

[0035] Figure 5 is a schematic structural diagram of a capacitor core according to Embodiment 1 of the present invention.

[0036] Figure 6 is Figure 4 a cross-sectional view taken along line A-A in

[0037] Figure 7 is Figure 4 a cross-sectional view taken along line B-B in

[0038] Figure 8 is an exploded view of an integrated DC filtering capacitor power module according to Embodiment 1 of the present invention.

[0039] Figure 9 is a schematic structural diagram of an integrated DC filtering capacitor power module according to Embodiment 2 of the present invention.

[0040] Figure 10 is a schematic structural diagram of an integrated DC filtering capacitor power module according to Embodiment 2 of the present invention from another angle.

[0041] Figure 11 is a schematic structural diagram of an integrated DC filtering capacitor power module according to Embodiment 3 of the present invention.

[0042] Figure 12 is a schematic structural diagram of an integrated DC filtering capacitor power module according to Embodiment 3 of the present invention from another angle.

[0043] Figure 13 It is the top view of the integrated DC filtering capacitor power module in the third embodiment of the present invention.

[0044] Figure 14 It is Figure 13 the cross-sectional view at C-C in

[0045] Figure 15 It is Figure 13 the cross-sectional view at D-D in

[0046] Figure 16 It is the exploded view of the integrated DC filtering capacitor power module in the third embodiment of the present invention.

[0047] Figure 17 It is the structural schematic diagram of the integrated DC filtering capacitor power module in the fourth embodiment of the present invention.

[0048] Figure 18 It is the structural schematic diagram of the integrated DC filtering capacitor power module in the fourth embodiment of the present invention from another angle.

[0049] Figure 19 It is the top view of the integrated DC filtering capacitor power module in the fourth embodiment of the present invention.

[0050] Figure 20 It is Figure 19 the cross-sectional view at E-E in

[0051] Figure 21 It is Figure 19 the cross-sectional view at F-F in

[0052] Figure 22 It is the exploded view of the integrated DC filtering capacitor power module in the fourth embodiment of the present invention.

[0053] Figure 23 It is the structural schematic diagram of the integrated DC filtering capacitor power module in the fifth embodiment of the present invention.

[0054] Figure 24 It is the structural schematic diagram of the integrated DC filtering capacitor power module in the fifth embodiment of the present invention from another angle.

[0055] Figure 25 It is the left view of the integrated DC filtering capacitor power module in the fifth embodiment of the present invention.

[0056] Figure 26 It is Figure 25 the cross-sectional view at E-E in

[0057] Figure 27 It is the right view of the integrated DC filtering capacitor power module in the fifth embodiment of the present invention.

[0058] Figure 28 It isFigure 27 Cross-sectional view at F-F

[0059] Figure 29 It is an exploded view of the integrated DC filter capacitor power module according to the fifth embodiment of the present invention. Specific implementation mode

[0060] The present invention will be further described below in conjunction with the drawings and embodiments.

[0061] In the first embodiment, as Figures 1 to 8 shown, an integrated DC filter capacitor power module includes a housing 1, a capacitor core group 2, a first polarity terminal 3, a second polarity terminal 4, two first IGBT busbars 5, two second IGBT busbars 6, a first parallel conductive sheet 7, a second parallel conductive sheet 8, and an epoxy resin 13. An opening 11 is provided on the housing 1. The capacitor core group 2, the first parallel conductive sheet 7, the second parallel conductive sheet 8, the inner ends of the first polarity terminal 3, the inner ends of the second polarity terminal 4, the inner ends of the two first IGBT busbars 5, and the inner ends of the two second IGBT busbars 6 are inserted into the housing 1 through this opening 11. The epoxy resin 13 encapsulates the opening 11. The first parallel conductive sheet 7 is attached to one side of the capacitor core group 2, and the second parallel conductive sheet 8 is attached to the other side of the capacitor core group 2. The capacitor core group 2 is formed by arranging a plurality of capacitor cores 21 side by side. The first parallel conductive sheet 7 is connected in parallel to one end of the plurality of capacitor cores 21, and the second parallel conductive sheet 8 is connected in parallel to the other end of the plurality of capacitor cores 21. The inner ends of the first IGBT busbars 5 and the inner ends of the second IGBT busbars 6 are respectively connected to the first parallel conductive sheet 7 and the second parallel conductive sheet 8. The inner ends of the first polarity terminal 3 and the inner ends of the second polarity terminal 4 are respectively connected to the first parallel conductive sheet 7 and the second parallel conductive sheet 8.

[0062] As a more specific technical solution of the present invention.

[0063] The housing 1 is in a cuboid shape, the opening 11 is in a rectangular shape, the first polarity terminal 3 and the second polarity terminal 4 are respectively located on the first side edge and the second side edge of the opening 11, a pair of first IGBT busbars 5 and second IGBT busbars 6 are located on the third side edge of the opening 11, and the other pair of first IGBT busbars 5 and second IGBT busbars 6 are located on the fourth side edge of the opening 11.

[0064] Connection ears 12 for installation and fixation are provided on the housing 1.

[0065] Silicone insulating strips are provided on the four peripheral edges of the opening 11.

[0066] The first IGBT busbars 5 and the second IGBT busbars 6 are arranged in pairs one by one. The outer ends of the first IGBT busbars 5 and the outer ends of the second IGBT busbars 6 are spaced apart and arranged side by side.

[0067] A plurality of first IGBT polarity terminals 51 are provided at the outer end of the first IGBT busbar 5. At positions corresponding to the plurality of first IGBT polarity terminals 51 at the outer end of the second IGBT busbar 6, a plurality of second IGBT polarity terminals 61 are provided, and the first IGBT polarity terminals and the second IGBT polarity terminals correspond one by one.

[0068] The first IGBT busbar 5, the first parallel conductive sheet 7, and the first polarity terminal 3 are integrally provided, and the second IGBT busbar 6, the second parallel conductive sheet 8, and the second polarity terminal 4 are integrally provided.

[0069] An insulating paper is provided between the outer ends of the first IGBT busbar 5 and the outer end of the second IGBT busbar 6, and the layer withstand voltage value of the insulating paper is ≥ 4 kV.AC.

[0070] The capacitor core group 2, the first parallel conductive sheet 7, and the second parallel conductive sheet 8 are wrapped together by an insulating material, and the insulating material is mica paper or aramid fiber paper or glass fiber or carbon fiber or heat shrink sleeve.

[0071] Patterned hollow holes are provided at positions of the first parallel conductive sheet 7 and the second parallel conductive sheet 8 corresponding to the end of the capacitor core 21, and the patterned hollow holes are in the shape of a mosaic or a clover or a star or a rhombus.

[0072] The outer side walls of two adjacent capacitor cores 21 in the capacitor core group 2 are in contact with each other.

[0073] The capacitor core is a flat capacitor core or a cylindrical capacitor core.

[0074] The capacitor core 21 is prepared into a cylindrical or flat shape by winding a metallized film 22. The metallized film 22 is made of PS or PP or EPN or PET or PEN or PPS or PEEK or PEEKK or PI or PTFE or PEI or PMI through plasma roughening treatment to increase the surface roughness of the metallized film 22, and then metallization evaporation is carried out.

[0075] A metallized evaporation layer 23 is provided on the metallized film 22. The metallized evaporation layer 23 includes a non-thickened area 24, a transition area 25, and a thickened area 26. The transition area is located between the non-thickened area and the thickened area; the width range of the thickened area 26 is 3 - 5 mm, and the range of the sheet resistance value is 1 - 4 Ω; the width range of the transition area 25 is 6 - 30 mm, and the range of the sheet resistance value is between 10 - 20 Ω; the range of the sheet resistance value of the non-thickened area 24 is 15 - 60 Ω.

[0076] The metallized evaporation layer 23 is one or several materials of aluminum or copper or zinc or silver in a composite or multi-layer material structure.

[0077] The ends of the capacitor core 21 are sprayed with a metal layer, and the material of the metal layer is: tin-zinc or zinc or aluminum or zinc-aluminum alloy.

[0078] The two ends of the capacitor core 21 are respectively welded to the first parallel conductive sheet 7 and the second parallel conductive sheet 8. The end of the capacitor core 21 uses a brazing material as the welding material, and the brazing material is tin-zinc or zinc or aluminum or silver; the welding method for the end of the capacitor core 21 is laser welding or electron beam welding or soldering iron welding.

[0079] The working principle of the present invention is: The capacitor power module of the present invention is connected to the load circuit. Multiple capacitor cores filter the current of the load. Multiple IGBT modules in the load circuit are installed on the first IGBT polarity terminal and the second IGBT polarity terminal. Under the action of high-frequency ripple current, multiple capacitor cores 21 will generate heat, and the heat will be transferred to the radiator of the housing 1. When air passes through the heat dissipation structure, heat exchange will occur with the heat dissipation structure, taking away the heat of the heat dissipation structure, thereby dissipating heat for multiple capacitor cores 21, and thus improving the current-carrying capacity and filtering power of the capacitor core group 2.

[0080] Embodiment 2, as Figures 9 to 10 shown, the implementation manner of Embodiment 2 is similar to that of Embodiment 1. The only difference is that: a heat dissipation structure is provided on the housing 1, and the heat dissipation structure is integrally provided with the housing 1 or the heat dissipation structure is mounted on the plane of the housing 1. The heat dissipation structure is a heat dissipation tooth group 17. Of course, the heat dissipation structure can also be a heat dissipation fin group. The thickness of the heat dissipation tooth group 17 or the heat dissipation fin group is greater than 10 mm.

[0081] Embodiment 3, as Figures 11 to 16 shown, the implementation manner of Embodiment 3 is similar to that of Embodiment 1. The only difference is that: this embodiment includes four first IGBT busbars 5 and four second IGBT busbars 6. The first polarity terminal 3 and the second polarity terminal 4 are respectively located on the first side edge and the second side edge of the opening 11. Two pairs of first IGBT busbars 5 and second IGBT busbars 6 are located on the third side edge of the opening 11. Two pairs of first IGBT busbars 5 and second IGBT busbars 6 are located on the fourth side edge of the opening 11. The first IGBT busbar 5, the first parallel conductive sheet 7, and the first polarity terminal 3 are not integrally provided. The second IGBT busbar 6, the second parallel conductive sheet 8, and the second polarity terminal 4 are not integrally provided.

[0082] Embodiment 4, as Figures 17 to 22As shown, the implementation mode of the fourth embodiment is similar to that of the first embodiment. The only difference is that: the first IGBT busbar 5 and the second IGBT busbar 6 are vertically arranged at the middle position of the opening 11, and the first polarity terminal 3 and the second polarity terminal 4 are arranged at one side edge of the opening 11. The first IGBT busbar 5, the first parallel conductive sheet 7, and the first polarity terminal 3 are not integrally arranged, and the second IGBT busbar 6, the second parallel conductive sheet 8, and the second polarity terminal 4 are not integrally arranged.

[0083] Embodiment 5, as Figures 23 to 29 As shown, the implementation mode of the fifth embodiment is similar to that of the first embodiment. The only difference is that: the housing 1 is in a cuboid shape, the opening 11 is in a rectangular shape, the opening 11 is arranged on the end face of the housing 1 with a smaller area, only one first IGBT busbar 5 and one second IGBT busbar 6 are arranged at the opening 11, the first IGBT busbar 5 and the second IGBT busbar 6 are arranged at the first side edge of the opening 11, and the first polarity terminal 3 and the second polarity terminal 4 are arranged at the second side edge of the opening 11. The first IGBT busbar 5, the first parallel conductive sheet 7, and the first polarity terminal 3 are not integrally arranged, and the second IGBT busbar 6, the second parallel conductive sheet 8, and the second polarity terminal 4 are not integrally arranged.

Claims

1. An integrated DC filter capacitor power module includes a housing, a capacitor core group, a first polar terminal, a second polar terminal, a first IGBT busbar, a second IGBT busbar, a first parallel conductive sheet, a second parallel conductive sheet, and epoxy resin. An opening is provided on the housing. The capacitor core group, the first parallel conductive sheet, the second parallel conductive sheet, the inner ends of the first polar terminal, the inner ends of the second polar terminal, the inner ends of the first IGBT busbar, and the inner ends of the second IGBT busbar are inserted into the housing through this opening. The opening is encapsulated with epoxy resin. The first parallel conductive sheet is attached to one side of the capacitor core group, and the second parallel conductive sheet is attached to the other side of the capacitor core group. The capacitor core group is formed by arranging multiple capacitor cores side by side. The first parallel conductive sheet is connected in parallel to one ends of the multiple capacitor cores, and the second parallel conductive sheet is connected in parallel to the other ends of the multiple capacitor cores. The inner ends of the first IGBT busbar and the second IGBT busbar are respectively connected to the first parallel conductive sheet and the second parallel conductive sheet. The inner ends of the first polar terminal and the second polar terminal are respectively connected to the first parallel conductive sheet and the second parallel conductive sheet. The first IGBT busbar and the second IGBT busbar are provided in pairs. The outer ends of the first IGBT busbar and the second IGBT busbar are spaced apart and arranged side by side. Multiple first IGBT polar terminals are provided at the outer end of the first IGBT busbar, and multiple second IGBT polar terminals are provided at the positions corresponding to the multiple first IGBT polar terminals at the outer end of the second IGBT busbar. The first IGBT polar terminals and the second IGBT polar terminals correspond to each other one by one.

2. The integrated DC filter capacitor power module according to claim 1, characterized in that, It includes at least two of the first IGBT busbars and at least two of the second IGBT busbars. The opening is rectangular. The first polar terminal and the second polar terminal are respectively located at the first side edge and the second side edge of the opening. At least one pair of the first IGBT busbar and the second IGBT busbar are located at the third side edge of the opening, and at least one pair of the first IGBT busbar and the second IGBT busbar are located at the fourth side edge of the opening.

3. The integrated DC filter capacitor power module according to claim 1 or 2, characterized in that, The first IGBT busbar, the first parallel conductive sheet, and the first polar terminal are integrally provided, and the second IGBT busbar, the second parallel conductive sheet, and the second polar terminal are integrally provided.

4. The integrated DC filter capacitor power module according to claim 1, characterized in that, The first IGBT busbar and the second IGBT busbar are perpendicularly provided at the middle position of the opening, and the first polar terminal and the second polar terminal are provided at one side edge of the opening.

5. The integrated DC filter capacitor power module according to claim 1, wherein, The opening is provided on the end face of the housing with a smaller area. Only one first IGBT busbar and one second IGBT busbar are provided at the opening. The first IGBT busbar and the second IGBT busbar are provided at the first side edge of the opening, and the first polar terminal and the second polar terminal are provided at the second side edge of the opening.

6. The integrated DC filter capacitor power module according to claim 1, wherein A heat dissipation structure is provided on the housing. The heat dissipation structure is integrally provided with the housing or the heat dissipation structure is mounted on the plane of the housing.

7. The integrated DC filter capacitor power module according to claim 1, characterized in that, The capacitor core group, the first parallel conductive sheet, and the second parallel conductive sheet are wrapped together by an insulating material. The insulating material is mica paper or aramid fiber paper or glass fiber or carbon fiber or heat shrink sleeve.

8. The integrated DC filter capacitor power module according to claim 1, characterized in that, The capacitor core is a flat capacitor core or a cylindrical capacitor core.

9. The integrated DC filter capacitor power module according to claim 8, wherein the capacitor The core is prepared into a cylindrical or flat shape by winding a metallized film. The metallized film is obtained by subjecting PS or PP or EPN or PET or PEN or PPS or PEEK or PEEKK or PI or PTFE or PEI or PMI to plasma roughening treatment, followed by metallization evaporation plating.

10. The integrated DC filtering capacitor power module according to claim 9, wherein A vapor-deposited metal layer is provided on the metallized film. The vapor-deposited metal layer includes a non-thickened area, a transition area, and a thickened area, and the transition area is located between the non-thickened area and the thickened area; the width range of the thickened area is 3 - 5 mm, and the sheet resistance range is 1 - 4 Ω; the width range of the transition area is 6 - 30 mm, and the sheet resistance range is between 10 - 20 Ω; the sheet resistance range of the non-thickened area is 15 - 60 Ω. The vapor-deposited metal layer is one or several materials of aluminum, copper, zinc, or silver in a composite or multi-layer material structure.

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