Display panel, display device and manufacturing method of display panel

Abstract

The invention discloses a display panel, a display device and a manufacturing method of the display panel. The display panel comprises a substrate, the substrate comprises a display area and a non-display area, the non-display area comprises a hole, and the display area surrounds at least part of the hole; the non-display area between the display area and the hole is provided with at least two inorganic layers; each inorganic layer is provided with a blocking groove, the blocking grooves surround at least part of the holes, the blocking grooves penetrate through the at least two inorganic layers, each blocking groove comprises a main body part and side concave parts communicated with the main body part, and the side concave parts are arranged on the two sides of the main body part and communicated with the area, close to the substrate, of the main body part; wherein the etching rates of the at least two inorganic layers are gradually reduced in the direction away from the substrate. The manufacturing difficulty of the display panel can be reduced, and the process cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and particularly to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] An organic light-emitting diode (OLED) is an optoelectronic device that emits light through carrier injection and recombination. OLEDs have attracted much attention due to their good light emission uniformity, thinness, bendability, flexibility, stretchability, etc.

[0003] However, the manufacturing cost of existing OLED display panels is relatively high. Summary of the Invention

[0004] The present invention provides a display panel, a display device, and a method for manufacturing a display panel to reduce the manufacturing difficulty of the display panel and the process cost.

[0005] According to one aspect of the present invention, a display panel is provided, including:

[0006] a substrate, the substrate includes a display area and a non-display area, the non-display area includes holes, and the display area surrounds at least part of the holes;

[0007] at least two inorganic layers are provided in the non-display area between the display area and the holes;

[0008] a blocking groove is provided in the inorganic layer, the blocking groove surrounds at least part of the holes, the blocking groove penetrates through the at least two inorganic layers, the blocking groove includes a main body portion and side concave portions communicating with the main body portion, the side concave portions are provided on both sides of the main body portion and communicate with the area of the main body portion adjacent to the substrate;

[0009] wherein, along the direction away from the substrate, the etching rate of the at least two inorganic layers gradually decreases.

[0010] Optionally, the at least two inorganic layers include a first inorganic layer and at least one second inorganic layer;

[0011] the first inorganic layer is provided on a side of the at least one second inorganic layer away from the substrate;

[0012] the total thickness of the at least one second inorganic layer is greater than the thickness of the first inorganic layer.

[0013] Optionally, the total thickness of the at least one second inorganic layer is greater than or equal to 3000 Å.

[0014] Optionally, the etching rates of different inorganic layers are different, and the thickness of the inorganic layer gradually decreases in a direction away from the substrate.

[0015] Optionally, the width of the main body portion is greater than or equal to 15 microns and less than or equal to 30 microns, and the width of the side concave portion is greater than or equal to 0.5 micron and less than or equal to 1.5 microns.

[0016] Optionally, the material of the first inorganic layer includes silicon oxide, and the material of the second inorganic layer includes silicon nitride.

[0017] According to another aspect of the present invention, there is provided a display device, including: the display panel according to any embodiment of the present invention.

[0018] According to another aspect of the present invention, there is provided a method for manufacturing a display panel, including:

[0019] Providing a substrate; wherein, the substrate includes a display area and a non-display area, the non-display area includes a hole area, and the display area surrounds at least part of the hole area;

[0020] Providing at least two inorganic layers in the non-display area between the display area and the hole area; wherein, the etching rate of the at least two inorganic layers gradually decreases in a direction away from the substrate;

[0021] Providing a blocking groove in the inorganic layer, wherein, the blocking groove surrounds at least part of the hole area, the blocking groove penetrates through the at least two inorganic layers, the blocking groove includes a main body portion and side concave portions communicated with the main body portion, the side concave portions are disposed on both sides of the main body portion and are communicated with a region of the main body portion adjacent to the substrate.

[0022] Optionally, providing a blocking groove in the inorganic layer includes:

[0023] Providing a first photoresist layer on the surface of the inorganic layer;

[0024] Patterning the first photoresist layer;

[0025] Etching the inorganic layer to form the blocking groove;

[0026] Removing the first photoresist layer.

[0027] Optionally, etching the inorganic layer to form the blocking groove includes:

[0028] Etching the at least two inorganic layers until other film layers adjacent to the substrate side of the inorganic layer are exposed;

[0029] Coating a second photoresist layer on the surface of the exposed other film layers;

[0030] Continue to etch the inorganic layer to form the blocking groove;

[0031] Removing the first photoresist layer includes:

[0032] Removing the first photoresist layer and the second photoresist layer.

[0033] In the display area of the display panel according to the embodiment of the present invention, there are at least two inorganic layers provided between the display area and the hole. The inorganic layer is provided with a blocking groove. The blocking groove surrounds at least part of the hole. The blocking groove penetrates through at least two inorganic layers. The blocking groove includes a main body portion 1 and side concave portions communicating with the main body portion. The side concave portions are arranged on both sides of the main body portion and communicate with the area of the main body portion adjacent to the substrate; the etching rates of at least two inorganic layers gradually decrease in the direction away from the substrate. When forming the blocking groove, the closer the inorganic layer is to the substrate, the faster the etching speed and the larger the etching width. Through the etching process, a blocking groove with side concave portions can be formed. The film formation method is simple, the requirements for equipment are low, the process cost can be effectively reduced, and after using the inorganic layer to form the blocking groove, the film stress matching degree is high, and the possibility of defects such as film layer peeling or structure collapse is minimized.

[0034] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0036] Figure 1 is a schematic diagram of a display panel provided by an embodiment of the present invention;

[0037] Figure 2 is Figure 1 a partial enlarged view of the display panel in

[0038] Figure 3 is Figure 2 a cross-sectional view of the display panel in along the section line AA;

[0039] Figure 4 is a schematic diagram of a display device provided by an embodiment of the present invention;

[0040] Figure 5 is a flowchart of a manufacturing method of a display panel provided by an embodiment of the present invention;

[0041] Figure 6 It is a schematic diagram of the manufacturing process of a display panel provided by an embodiment of the present invention;

[0042] Figure 7 It is a schematic diagram of the manufacturing process of another display panel provided by an embodiment of the present invention. Detailed implementation manners

[0043] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0044] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0045] An embodiment of the present invention provides a display panel, Figure 1 It is a schematic diagram of a display panel provided by an embodiment of the present invention, Figure 2 is Figure 1 a partial enlarged view of the display panel in Figure 3 is Figure 2 a sectional view of the display panel along the section line AA in Figures 1 - 3 , the display panel includes:

[0046] a substrate 10, the substrate 10 includes a display area 11 and a non-display area 12, the non-display area 12 includes a hole 21, and the display area 11 surrounds at least part of the hole 21;

[0047] At least two inorganic layers 20 are provided in the non-display area 22 between the display area 11 and the hole 21;

[0048] The inorganic layer 20 is provided with a blocking groove 30. The blocking groove 30 surrounds at least part of the hole 21. The blocking groove 30 penetrates at least two layers of the inorganic layer 20. The blocking groove 30 includes a main body portion 301 and side concave portions 302 communicating with the main body portion 301. The side concave portions 302 are arranged on both sides of the main body portion 301 and communicate with the area of the main body portion 301 adjacent to the substrate 10.

[0049] Wherein, the etching rate of at least two layers of the inorganic layer 20 gradually decreases in the direction away from the substrate 10.

[0050] Specifically, the substrate 10 can be a flexible substrate or a rigid substrate. The non-display area 12 may include the hole 21, the non-display area 22 between the display area 11 and the hole 21, and the border area 23. The border area 23 surrounds the display area 10. The display area 10 is used for displaying images, and the non-display area 12 does not display images. The hole 21 is used for arranging an optical sensor. Exemplarily, the optical sensor includes a camera, etc. The hole 21 may penetrate the substrate 10 or may not penetrate the substrate 10, and this embodiment does not make specific limitations.

[0051] The blocking groove 30 is used to block the transmission path of water and oxygen from the hole 21 to the display area 11. The blocking groove 30 includes the main body portion 301 and the side concave portions 302, so that the film layer above at least two layers of the inorganic layer 20 is disconnected at the side concave portions 302 of the blocking groove 30, better blocking the transmission path of water and oxygen from the hole 21 to the display area 11. Exemplarily, one side of at least two layers of the inorganic layer 20 away from the substrate 10 may include an organic film layer such as an organic light-emitting layer. The organic film layer is disconnected at the side concave portions 302, preventing water and oxygen at the hole 21 from being transmitted to the display area 11 through the organic layer. The etching rate of at least two layers of the inorganic layer 20 gradually decreases in the direction away from the substrate 10. All the etching rates of the inorganic layer 20 may be different, or the etching rates of some of the inorganic layer 20 may be the same. This embodiment does not make specific limitations.

[0052] The blocking groove 30 is formed on at least two layers of the inorganic layer 20, and the etching rate of at least two layers of the inorganic layer 20 gradually decreases in the direction away from the substrate 10. When forming the blocking groove 30, the closer the inorganic layer 20 is to the substrate 10, the faster the etching speed and the larger the etching width. The blocking groove 30 can be formed by an etching process, reducing the process difficulty.

[0053] In the non-display area 22 between the display area 11 and the hole 21 of the display panel according to an embodiment of the present invention, at least two inorganic layers 20 are provided. The inorganic layer 20 is provided with a blocking groove 30. The blocking groove 30 surrounds at least part of the hole 21. The blocking groove 30 penetrates through at least two inorganic layers 20. The blocking groove 30 includes a main body portion 301 and side concave portions 302 communicated with the main body portion 301. The side concave portions 302 are arranged on both sides of the main body portion 301 and are communicated with the area of the main body portion 301 adjacent to the substrate 10. The etching rate of at least two inorganic layers 20 gradually decreases in the direction away from the substrate 10. When the blocking groove 30 is formed, the closer the inorganic layer 20 is to the substrate 10, the faster the etching speed and the larger the etching width. Through the etching process, the blocking groove 30 with side concave portions 302 can be formed. The film forming method is simple, the requirements for equipment are low, the process cost can be effectively reduced, and after the blocking groove 30 is formed by using the inorganic layer 20, the film stress matching degree is high, and the possibility of defects such as film layer peeling or structure collapse is minimized to the greatest extent.

[0054] Optionally, at least two inorganic layers 20 include a first inorganic layer 201 and at least one second inorganic layer 202;

[0055] The first inorganic layer 201 is arranged on the side of at least one second inorganic layer 202 away from the substrate 10;

[0056] The total thickness of at least one second inorganic layer 202 is greater than the thickness of the first inorganic layer 201.

[0057] Specifically, the display panel may include one, two or more second inorganic layers 202. The etching rate of the second inorganic layer 202 is greater than that of the first inorganic layer 201. The etching rates of at least one second inorganic layer 202 may be the same or different.

[0058] Since the etching rate of the second inorganic layer 202 is greater than that of the first inorganic layer 201, all or most of the side concave portions 302 are formed in the second inorganic layer 202. If the total thickness of at least one second inorganic layer 202 is too small, the width of the side concave portion 302 is likely to be too large during etching, and the film layer on the side of the side concave portion 302 away from the substrate 10 is likely to collapse. By setting the total thickness of at least one second inorganic layer 202 to be greater than the thickness of the first inorganic layer 201, the width of the side concave portion 302 is prevented from being too large, and the film layer on the side of the side concave portion 302 away from the substrate 10 is prevented from collapsing.

[0059] Optionally, the total thickness of at least one second inorganic layer 202 is greater than or equal to 3000 Å, so that the width of the formed side concave portion 302 is not too large, and the film layer on the side of the side concave portion 302 away from the substrate 10 is prevented from collapsing.

[0060] Optionally, the etching rates of different inorganic layers 20 are different, and the thickness of the inorganic layer 20 gradually decreases in the direction away from the substrate 10.

[0061] Specifically, the etching rates of different inorganic layers 20 are different, that is, the etching rates of all inorganic layers 20 are different. The etching rate of the inorganic layer 20 gradually decreases in the direction away from the substrate 10, which can be a linear decrease or a curved decrease, and can be specifically determined according to the shape of the side concave portion 302 to be formed.

[0062] In the direction away from the substrate 10, the thickness of the inorganic layer 20 gradually decreases, that is, the thinner the inorganic layer 20 with a smaller etching rate, and the thicker the inorganic layer 20 with a larger etching rate. Such a setting can avoid an excessive etching width of the inorganic layer 20 with a larger etching rate and prevent the side concave portion 302 from collapsing due to being too wide.

[0063] Optionally, the width S of the main body portion 301 is greater than or equal to 15 microns and less than or equal to 30 microns, and the width W of the side concave portion 302 is greater than or equal to 0.5 microns and less than or equal to 1.5 microns.

[0064] Specifically, when the width W of the side concave portion 302 is too small, the cutting effect on the organic film layer is not obvious, which may cause the organic layer to not be disconnected. When the width W of the side concave portion 302 is too large, the film layer above the side concave portion 302 is prone to collapse. By setting the width W of the side concave portion 302 to be greater than 0.5 microns and less than or equal to 1.5 microns, it can ensure that the organic layer is disconnected at the side concave portion 302, can effectively block the water and oxygen transmission path, and can avoid the collapse of the film layer above the side concave portion 302.

[0065] When the width S of the main body portion 301 is too large, it occupies too much area of the non-display area and is likely to affect the structural strength of the non-display area. When the width S of the main body portion 301 is too small, the organic film layer cannot be disconnected well. By setting the width S of the main body portion 301 to be greater than or equal to 15 microns and less than or equal to 30 microns, it can disconnect the organic film layer well, effectively block the water and oxygen transmission path, and ensure that the non-display area has a high structural strength.

[0066] Optionally, the material of the first inorganic layer 201 includes silicon oxide, and the material of the second inorganic layer 202 includes silicon nitride.

[0067] The etching rate of silicon nitride is faster than that of silicon oxide. The longitudinal etching rate: silicon nitride is about 4000 Å / min, and silicon oxide is about 2000 Å / min. The first inorganic layer 201 is made of silicon oxide, and the second inorganic layer 202 is made of silicon nitride, which can better form the blocking groove 30.

[0068] Figure 4 It is a schematic diagram of a display device provided by an embodiment of the present invention. Refer to Figure 4, embodiments of the present invention further provide a display device, and the display device 100 includes the display panel 200 described in any embodiment of the present invention.

[0069] Embodiments of the present invention further provide a method for manufacturing a display panel. Figure 5 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention. Refer to Figure 5 , the method for manufacturing a display panel includes:

[0070] S110: Provide a substrate; wherein, the substrate includes a display area and a non-display area, the non-display area includes a hole area, and the display area surrounds at least part of the hole area;

[0071] S120: Dispose at least two inorganic layers in the non-display area between the display area and the hole area; wherein, the etching rate of at least two inorganic layers gradually decreases in a direction away from the substrate;

[0072] S130: Form a blocking groove in the inorganic layer, wherein the blocking groove surrounds at least part of the hole area, the blocking groove penetrates at least two inorganic layers, the blocking groove includes a main body portion and side concave portions communicated with the main body portion, the side concave portions are disposed on both sides of the main body portion and are communicated with the area of the main body portion adjacent to the substrate.

[0073] In the embodiments of the present invention, by forming the blocking groove in at least two inorganic layers and the etching rate of at least two inorganic layers gradually decreasing in a direction away from the substrate, when forming the blocking groove, the closer the inorganic layer is to the substrate 10, the faster the etching speed and the larger the etching width. Through the etching process, a blocking groove with side concave portions can be formed. The film forming method is simple, the requirements for equipment are low, and the film stress matching degree is high, which maximally reduces the possibility of defects such as film layer peeling or structure collapse.

[0074] Figure 6 is a schematic diagram of the manufacturing process of a display panel provided by an embodiment of the present invention. Optionally, refer to Figure 6 , forming a blocking groove in the inorganic layer 20 includes:

[0075] Dispose a first photoresist layer 41 on the surface of the inorganic layer 20;

[0076] Pattern the first photoresist layer 41;

[0077] Etch the inorganic layer 20 to form a blocking groove;

[0078] Remove the first photoresist layer 41.

[0079] Specifically, Figure 6The patterned first photoresist layer 41 is shown. When at least two inorganic layers 20 are adjacent to the film layer on one side of the substrate 10 and will not be etched by the etching solution for etching the inorganic layer 20, a blocking groove can be directly formed through a single etching process. Since the etching rate of some inorganic layers 20 is relatively fast and their etching width is relatively large, a blocking groove with side recesses can be formed by controlling the etching time.

[0080] Figure 7 It is a schematic diagram of the manufacturing process of another display panel provided by an embodiment of the present invention. Optionally, referring to Figure 7 Optionally, etching the inorganic layer 20 to form a blocking groove includes:

[0081] Etch at least two inorganic layers 20 until other film layers 50 adjacent to the substrate 10 side of the inorganic layer 20 are exposed;

[0082] Coat a second photoresist layer 42 on the surface of the exposed other film layers 50;

[0083] Continue to etch the inorganic layer 20 to form a blocking groove;

[0084] Removing the first photoresist layer 41 includes:

[0085] Remove the first photoresist layer 41 and the second photoresist layer 42.

[0086] Specifically, when the other film layers 50 can be corroded by the etching solution for etching the inorganic layer 20, after the other film layers 50 are exposed, a second photoresist layer 42 is formed on the surface of the other film layers 50, and then the inorganic layer 20 is etched to form a blocking groove.

[0087] It should be understood that various forms of the flow shown above can be used, reordering, adding or deleting steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitation is made herein.

[0088] The above specific embodiments do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub - combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A display panel, characterized in that, Comprising: A substrate, the substrate comprising a display area and a non-display area, the non-display area comprising holes, and the display area surrounding at least part of the holes; At least two inorganic layers are provided in the non-display area between the display area and the holes; The inorganic layer is provided with a blocking groove, the blocking groove surrounds at least part of the holes, the blocking groove penetrates through the at least two inorganic layers, the blocking groove comprises a main body portion and side concave portions communicating with the main body portion, the side concave portions are arranged on both sides of the main body portion and communicate with the area of the main body portion adjacent to the substrate; Wherein, the etching rate of the at least two inorganic layers gradually decreases in the direction away from the substrate.

2. The display panel according to claim 1, wherein: The at least two inorganic layers comprise a first inorganic layer and at least one second inorganic layer; The first inorganic layer is arranged on the side of the at least one second inorganic layer away from the substrate; The total thickness of the at least one second inorganic layer is greater than the thickness of the first inorganic layer.

3. The display panel according to claim 1, wherein: The total thickness of the at least one second inorganic layer is greater than or equal to 3000 Å.

4. The display panel according to claim 1, wherein: The etching rates of different inorganic layers are different, and in the direction away from the substrate, the thickness of the inorganic layer gradually decreases.

5. The display panel according to claim 1, wherein: The width of the main body portion is greater than or equal to 15 microns and less than or equal to 30 microns, and the width of the side concave portion is greater than or equal to 0.5 micron and less than or equal to 1.5 microns.

6. The display panel according to claim 2, wherein: The material of the first inorganic layer comprises silicon oxide, and the material of the second inorganic layer comprises silicon nitride.

7. A display device, characterized in that, Comprising: The display panel according to any one of claims 1-6.

8. A method for manufacturing a display panel, characterized in that, Comprising: Providing a substrate; wherein, the substrate comprises a display area and a non-display area, the non-display area comprises a hole area, and the display area surrounds at least part of the hole area; At least two inorganic layers are provided in the non-display area between the display area and the hole area; wherein, the etching rate of the at least two inorganic layers gradually decreases in the direction away from the substrate; A blocking groove is provided in the inorganic layer, wherein, the blocking groove surrounds at least part of the hole area, the blocking groove penetrates through the at least two inorganic layers, the blocking groove comprises a main body portion and side concave portions communicating with the main body portion, the side concave portions are arranged on both sides of the main body portion and communicate with the area of the main body portion adjacent to the substrate.

9. The manufacturing method according to claim 8, wherein Providing a blocking groove in the inorganic layer, comprising: Providing a first photoresist layer on the surface of the inorganic layer; Patterning the first photoresist layer; Etching the inorganic layer to form the blocking groove; Removing the first photoresist layer.

10. The manufacturing method according to claim 9, wherein, Etching the inorganic layer to form the blocking groove comprises: Etching the at least two inorganic layers until other film layers adjacent to the substrate side of the inorganic layer are exposed; Coating a second photoresist layer on the surface of the exposed other film layers; Continuing to etch the inorganic layer to form the blocking groove; Removing the first photoresist layer comprises: Remove the first photoresist layer and the second photoresist layer.

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