Expansion pressure forming method and system for plate type heat exchange plate

Abstract

The invention relates to the field of mechanical engineering, and discloses a pressure-rising forming method and system for a plate type heat exchange plate, and the method comprises the steps: defining the specification and performance of the plate type heat exchange plate, and configuring a double-layer closed pressure-rising heat exchange plate of the plate type heat exchange plate; the contact area of the forming mold and the double-layer closed pressure-rising heat exchange plate is calculated, and the mold locking pressure of an upper mold cavity and a lower mold cavity of the forming mold on the double-layer closed pressure-rising heat exchange plate is determined; the forming force of the double-layer closed pressure-rising heat exchange plate is calculated, a forming medium material for filling a heat exchange plate cavity corresponding to the double-layer closed pressure-rising heat exchange plate is determined, and the forming pressure, the forming time, the forming medium flow and the forming medium temperature which need to be provided by a high-pressure pump are determined; the pressure-rising forming control module is used for simulating a liquid high-pressure pressure-rising process of the double-layer closed pressure-rising heat exchange plate and constructing the liquid high-pressure pressure-rising process; and high-pressure cold pressure rising is conducted on the double-layer closed pressure rising heat exchange plate, and the target plate type heat exchange plate is obtained. The production quality of the plate type heat exchange plate and the runner optimization forming technology can be improved.

Description

Technical Field

[0001] The present invention relates to a method and system for pressure boosting and forming of plate heat exchange plates, belonging to the field of mechanical engineering. Background Art

[0002] A plate heat exchange plate refers to a heat exchange element formed by shaping a metal thin plate (usually made of corrosion-resistant materials such as stainless steel and titanium) through a specific process, with a complex flow channel structure. Through the special flow channel design on the heat exchange plate, the turbulence degree of the fluid is increased, thereby improving the heat exchange efficiency.

[0003] Traditional manufacturing methods of plate heat exchange plates usually adopt stamping or machining, mainly using a press and a mold to plastically deform a metal sheet to form the required shape. These methods have problems such as the grains of the metal being elongated, broken, and refined during the cold deformation process of the material, and the sharp temperature rise, resulting in a decrease in the plasticity and toughness of the metal, a reduction in the chemical stability of the metal material, a reduction in corrosion resistance, and an increase in solubility, thereby reducing the quality of the plate heat exchange plate.

[0004] Therefore, there is an urgent need for a solution to improve the production quality of plate heat exchange plates and the flow channel optimization forming technology. Summary of the Invention

[0005] The present invention provides a method and system for pressure boosting and forming of plate heat exchange plates, and its main purpose is to improve the production quality of plate heat exchange plates and the flow channel optimization forming technology.

[0006] To achieve the above purpose, a method for pressure boosting and forming of plate heat exchange plates provided by the present invention includes:

[0007] Define the specifications and performance of the plate heat exchange plate. According to the specifications and performance, determine the type of heat exchange plate material for the plate heat exchange plate. According to the type of heat exchange plate material, configure the double-layer sealed pressure boosting heat exchange plate for the plate heat exchange plate;

[0008] Obtain the flow channel shape of the plate heat exchange plate, determine the forming mold and the upper and lower mold cavity shapes of the plate heat exchange plate. According to the forming mold and the flow channel shape, calculate the contact area between the corresponding upper and lower mold cavities of the forming mold and the double-layer sealed pressure boosting heat exchange plate. According to the contact area, determine the clamping pressure of the forming mold on the double-layer sealed pressure boosting heat exchange plate;

[0009] Analyze the material yield strength of the double-layer sealed pressure-boosting heat exchange plate. According to the material yield strength, calculate the forming force of the double-layer sealed pressure-boosting heat exchange plate, determine the forming medium material for filling the heat exchange plate cavity corresponding to the double-layer sealed pressure-boosting heat exchange plate, configure the high-pressure pump for the forming medium material, and determine the forming pressure, forming time, forming medium flow rate, and forming medium temperature that the high-pressure pump needs to provide according to the forming pressure;

[0010] Based on the mold clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, simulate the liquid high-pressure pressure-boosting process of the double-layer sealed pressure-boosting heat exchange plate, collect the process parameters of the liquid high-pressure pressure-boosting process in real time, and construct a pressure-boosting forming control module for the liquid high-pressure pressure-boosting process according to the process parameters;

[0011] Based on the pressure-boosting forming control module, use a preset large-tonnage mold clamping device and the high-pressure pump to perform high-pressure cold pressure-boosting on the double-layer sealed pressure-boosting heat exchange plate to obtain the target plate heat exchanger.

[0012] Optionally, the determining the heat exchange plate material type of the plate heat exchanger according to the specification and the performance includes:

[0013] Analyze the heat exchange medium of the plate heat exchanger according to the specification and the performance;

[0014] Determine the medium temperature, medium pressure, and medium characteristics of the heat exchange medium;

[0015] Preliminarily determine the candidate material types of the plate heat exchanger according to the medium temperature, the medium pressure, and the medium characteristics;

[0016] Analyze the thermal conductivity, corrosion resistance, and mechanical strength of the candidate materials corresponding to the candidate material types;

[0017] Screen out the heat exchange plate material types of the candidate material types according to the thermal conductivity, the corrosion resistance, and the mechanical strength.

[0018] Optionally, the calculating the contact areas between the corresponding upper and lower die cavities of the forming mold and the double-layer sealed pressure-boosting heat exchange plate according to the flow channel shape includes:

[0019] Determine the cross-sectional shape and the number of flow channels of the flow channel corresponding to the flow channel shape according to the flow channel shape;

[0020] Measure the cross-sectional parameters of the flow channel according to the cross-sectional shape;

[0021] Analyze the flow channel dimensions of the flow channel shape;

[0022] Calculate the contact area of the double-layer sealed pressure-boosting heat exchange plate according to the cross-sectional parameters, the number of flow channels, and the flow channel size.

[0023] Optionally, determining the clamping pressure of the forming die on the double-layer sealed pressure-boosting heat exchange plate according to the contact area includes:

[0024] Determine the material elastic modulus and material tangent modulus of the double-layer sealed pressure-boosting heat exchange plate;

[0025] Analyze the total material strain, material plastic strain, and material yield stress of the double-layer sealed pressure-boosting heat exchange plate during pressure-boosting forming;

[0026] Calculate the clamping pressure of the forming die on the double-layer sealed pressure-boosting heat exchange plate according to the contact area, the material elastic modulus, the material tangent modulus, the total material strain, the material plastic strain, and the material yield stress.

[0027] Optionally, calculating the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the material yield strength includes:

[0028] Analyze the forming area of the double-layer sealed pressure-boosting heat exchange plate;

[0029] Identify the risk factors of the double-layer sealed pressure-boosting heat exchange plate during the forming process;

[0030] Calculate the forming risk coefficient of the double-layer sealed pressure-boosting heat exchange plate according to the risk factors;

[0031] Calculate the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the forming area, the material yield strength, and the forming risk coefficient.

[0032] Optionally, determining the forming pressure that the high-pressure pump needs to provide, the forming time of the double-layer sealed pressure-boosting heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force includes:

[0033] Analyze the fluid characteristics of the forming medium material, where the fluid characteristics include: forming medium viscosity and forming medium density;

[0034] Calculate the medium pressure loss of the high-pressure pump according to the fluid characteristics;

[0035] Analyze the system pressure loss during the process of the high-pressure pump providing pressure;

[0036] Calculate the forming pressure that the high-pressure pump needs to provide according to the forming force, the medium pressure loss, and the system pressure loss;

[0037] Analyze the pipe diameter and working process of the high-pressure pump, and analyze the flow velocity of the molding medium material in the working process;

[0038] Calculate the molding medium flow rate of the molding medium material according to the pipe diameter and the flow velocity;

[0039] Analyze the molding cavity volume of the double-layer sealed pressure-boosting heat exchange plate;

[0040] Calculate the filling time of the double-layer sealed pressure-boosting heat exchange plate according to the molding cavity volume and the molding medium flow rate;

[0041] Determine the pressure holding time of the double-layer sealed pressure-boosting heat exchange plate according to the molding pressure and the filling time;

[0042] Calculate the molding time of the double-layer sealed pressure-boosting heat exchange plate according to the filling time and the pressure holding time;

[0043] Calculate the molding heat during the molding process of the double-layer sealed pressure-boosting heat exchange plate, and determine the specific heat capacity of the molding medium material;

[0044] Based on the molding heat, the molding medium flow rate, and the specific heat capacity, determine the molding medium temperature of the molding medium material.

[0045] Optionally, the calculating the medium pressure loss of the high-pressure pump according to the fluid characteristics includes:

[0046] Analyze the pipe length and pipe roughness of the high-pressure pump;

[0047] Calculate the flow coefficient of the molding medium material corresponding to the high-pressure pump according to the fluid characteristics;

[0048] Analyze the flow type of the molding medium material according to the flow coefficient, where the flow type includes: laminar flow and turbulent flow;

[0049] Calculate the medium pressure loss of the high-pressure pump according to the flow type, the pipe length, and the pipe roughness;

[0050] Optionally, the simulating the liquid high-pressure pressure-boosting process of the double-layer sealed pressure-boosting heat exchange plate based on the clamping force, the molding pressure, the molding time, the molding medium flow rate, and the molding medium temperature includes:

[0051] Construct the material geometric model of the double-layer sealed pressure-boosting heat exchange plate;

[0052] Define the mold model of the molding mold corresponding to the double-layer sealed pressure-boosting heat exchange plate;

[0053] Register the geometric model of the material and the mold model to obtain a registered combined model;

[0054] Define the boundary conditions and loading path of the registered combined model according to the clamping pressure, the forming pressure, the forming time, the flow rate of the forming medium, and the temperature of the forming medium;

[0055] Simulate the liquid high-pressure boosting process of the double-layer airtight boosting heat exchange plate by using the registered combined model according to the boundary conditions and the loading path.

[0056] Optionally, the boosting forming control module for constructing the liquid high-pressure boosting process according to the process parameters includes:

[0057] Analyze the abnormal state of the liquid high-pressure boosting process according to the process parameters, and identify the abnormal influencing factors of the abnormal state;

[0058] Determine the control requirements of the liquid high-pressure boosting process according to the abnormal influencing factors;

[0059] Define the control logic of the liquid high-pressure boosting process according to the control requirements;

[0060] Configure the sensors and controllers in the liquid high-pressure boosting process according to the control logic;

[0061] Integrate the boosting forming control module of the liquid high-pressure boosting process based on the sensors, the controllers, and the control logic.

[0062] To solve the above problems, the present invention also provides a boosting forming system for a plate heat exchanger, and the system includes:

[0063] A material determination module, which is used to clarify the specifications and performance of the plate heat exchanger, determine the type of heat exchange plate material of the plate heat exchanger according to the specifications and the performance, and configure the double-layer airtight boosting heat exchange plate of the plate heat exchanger according to the type of heat exchange plate material;

[0064] A clamping pressure calculation module, which is used to obtain the flow channel shape of the plate heat exchanger, determine the forming mold of the plate heat exchanger, calculate the contact area between the corresponding upper and lower mold cavities of the forming mold and the double-layer airtight boosting heat exchange plate according to the forming mold and the flow channel shape, and determine the clamping pressure of the forming mold on the double-layer airtight boosting heat exchange plate according to the contact area;

[0065] The forming parameter calculation module is used to analyze the material yield strength of the double-layer sealed pressure-expanded heat exchange plate, calculate the forming force of the double-layer sealed pressure-expanded heat exchange plate according to the material yield strength, determine the forming medium material for filling the heat exchange plate cavity corresponding to the double-layer sealed pressure-expanded heat exchange plate, configure the high-pressure pump for the forming medium material, and determine the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed pressure-expanded heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force;

[0066] The pressure-expanded forming module is used to simulate the liquid high-pressure pressure-expanded process of the double-layer sealed pressure-expanded heat exchange plate based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, collect the process parameters of the liquid high-pressure pressure-expanded process in real time, and construct a pressure-expanded forming control module for the liquid high-pressure pressure-expanded process according to the process parameters;

[0067] The heat exchange plate production module is used to perform high-pressure cold pressure expansion on the double-layer sealed pressure-expanded heat exchange plate by using a preset large-tonnage clamping device and the high-pressure pump based on the pressure-expanded forming control module to obtain a target plate heat exchanger.

[0068] Compared with the problems described in the background art, by determining the heat exchange plate material type of the plate heat exchanger plate according to the specifications and the performance, the embodiments of the present invention can accelerate the heat transfer, thereby improving the heat exchange efficiency, reducing the energy loss, and at the same time reducing the failure rate and downtime of the heat exchange plate during use; optionally, by determining the heat exchange plate material type of the plate heat exchanger plate according to the specifications and the performance, the embodiments of the present invention can accelerate the heat transfer, thereby improving the heat exchange efficiency, reducing the energy loss, and at the same time reducing the failure rate and downtime of the heat exchange plate during use; by determining the forming pressure that the high-pressure pump needs to provide, the forming time of the double-layer airtight pressure-boosted heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force, all the flow channels of all the heat exchange plates can be completely formed, eliminating the influence of the sudden change of metal rapid stretching deformation grains, so as to achieve an accurate forming effect; by simulating the liquid high-pressure pressure-boosted process of the double-layer airtight pressure-boosted heat exchange plate based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, the embodiments of the present invention can accurately simulate the pressure-boosting process, and can achieve precise control of the forming of the heat exchange plate, improving the accuracy and consistency of the product; by constructing a pressure-boosting forming control module for the liquid high-pressure pressure-boosted process according to the process parameters, the embodiments of the present invention can accurately adjust and maintain process parameters such as pressure, position, temperature, and speed, so as to achieve a high-precision and high-consistency forming effect, and realize the automation of the forming process, reducing manual intervention and improving production efficiency; finally, by using a preset large-tonnage clamping device and the high-pressure pump to perform high-pressure cold pressure-boosting on the double-layer airtight pressure-boosted heat exchange plate based on the pressure-boosting forming control module, the target plate heat exchanger plate can be obtained, and the pressure and the movement of the mold can be accurately controlled, ensuring the dimensional accuracy and shape consistency of the plate heat exchanger plate, reducing product defects, and at the same time the automatic control can shorten the production cycle, reduce manual intervention, and improve the continuous operation time and efficiency of the production line. Therefore, the pressure-boosting forming method and system for the plate heat exchanger plate provided by the embodiments of the present invention can improve the production quality of the plate heat exchanger plate and the flow channel optimization forming technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] Figure 1 It is a schematic flow chart of a pressure-boosting forming method for a plate heat exchanger plate provided by an embodiment of the present invention;

[0070] Figure 2 It is a schematic process flow chart of implementing the pressure-boosting forming method for the plate heat exchanger plate provided by an embodiment of the present invention.

[0071] Figure 3 It is a schematic module diagram of implementing the pressure-boosting forming method for the plate heat exchanger plate provided by an embodiment of the present invention.

[0072] The realization of the object, functional features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Specific embodiments

[0073] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0074] The embodiment of the present application provides a method for pressure boosting and forming a plate heat exchanger plate. The execution subject of the method for pressure boosting and forming the plate heat exchanger plate includes but is not limited to at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiment of the present application. In other words, the method for pressure boosting and forming the plate heat exchanger plate can be executed by software or hardware installed on a terminal device or a server device. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc.

[0075] Embodiment 1:

[0076] Referring to Figure 1 As shown, it is a schematic flowchart of the method for pressure boosting and forming a plate heat exchanger plate provided by an embodiment of the present invention. In this embodiment, the method for pressure boosting and forming the plate heat exchanger plate includes:

[0077] S1. Define the specifications and performance of the plate heat exchanger plate. According to the specifications and the performance, determine the type of heat exchanger plate material for the plate heat exchanger plate. According to the type of heat exchanger plate material, configure the double-layer sealed pressure boosting heat exchanger plate of the plate heat exchanger plate.

[0078] In the embodiment of the present invention, by defining the specifications and performance of the plate heat exchanger plate, the heat transfer area can be increased and the dirt deposition can be reduced by selecting appropriate heat exchanger plate materials and designs, thereby improving the heat transfer efficiency and reducing the energy loss. Among them, the specifications refer to the specific physical parameters and design standards of the plate heat exchanger plate, such as size, material, etc. The performance refers to the functionality and efficiency shown in actual applications, such as heat exchange performance, fluid mechanics performance, mechanical performance, etc.

[0079] In the embodiment of the present invention, by determining the type of heat exchanger plate material for the plate heat exchanger plate according to the specifications and the performance, the heat transfer can be accelerated, thereby improving the heat transfer efficiency and reducing the energy loss. At the same time, the failure rate and downtime of the heat exchanger plate during use can be reduced. Among them, the type of heat exchanger plate material refers to various materials used to manufacture the heat exchanger plates in a plate heat exchanger. These materials are selected according to their physical properties, chemical properties and processing performance to meet specific specifications and performance, such as titanium materials, stainless steel, aluminum and other alloys.

[0080] As an embodiment of the present invention, the determining the type of heat exchanger plate material for the plate heat exchanger plate according to the specifications and the performance includes:

[0081] Analyze the heat transfer medium of the plate heat exchanger plate according to the specifications and the performance.

[0082] Determine the medium temperature, medium pressure and medium characteristics of the heat transfer medium.

[0083] According to the medium temperature, the medium pressure and the medium characteristics, preliminarily determine the candidate material types of the plate heat exchanger plate.

[0084] Analyze the thermal conductivity, corrosion resistance and mechanical strength of the candidate materials corresponding to the candidate material types.

[0085] According to the thermal conductivity, the corrosion resistance and the mechanical strength, screen out the heat exchanger plate material types of the candidate material types.

[0086] Among them, the heat transfer medium refers to the fluid that flows in the plate heat exchanger and transfers heat through the heat exchanger plate, such as brine, hot water, lubricating oil, fuel oil, etc. The medium temperature refers to the actual temperature at which the heat transfer medium is located during the heat transfer process. The medium pressure refers to the pressure exerted by the heat transfer medium on the heat exchanger plate or other heat transfer components during the heat transfer process. The medium characteristics refer to the physical and chemical properties exhibited by the heat transfer medium during the heat transfer process, such as density, viscosity, corrosiveness, toxicity, etc. The candidate material types refer to a group of potential material types used to manufacture heat exchanger plates or other heat transfer components when selecting heat exchanger materials. The thermal conductivity refers to the amount of heat transferred per unit time through a unit area under a unit temperature difference during the steady-state heat conduction process of the candidate material. The corrosion resistance refers to the ability of the candidate material to resist chemical or electrochemical reactions and cause corrosion under specific environmental conditions. The mechanical strength refers to the ability of the candidate material to resist deformation and fracture when subjected to external forces, such as compressive strength, tensile strength, etc.

[0087] Optionally, to analyze the thermal conductivity, corrosion resistance and mechanical strength of the candidate materials corresponding to the candidate material types, the thermal conductivity of the candidate materials can be determined by the laser flash method, the corrosion resistance of the candidate materials can be analyzed by electrochemical impedance spectroscopy, and the mechanical strength of the candidate materials can be analyzed by in-situ testing techniques.

[0088] In the embodiment of the present invention, by configuring the double-layer sealed pressure-boosting heat exchanger plate of the plate heat exchanger according to the heat exchanger plate material type, the sealing performance of the weld can be ensured, which plays a key role in the subsequent pressure-boosting forming, and at the same time, the working quality of the self-pressurized heat exchanger plate is guaranteed. Among them, the double-layer sealed pressure-boosting heat exchanger plate refers to an alloy material formed by double-layer welding to form a closed cavity, and these materials can withstand the stress in a high-pressure environment and can maintain the structural integrity in the cold pressure-boosting process.

[0089] Optionally, the double-layer sealed pressure-boosting heat exchange plate of the plate heat exchange plate configured according to the material type of the heat exchange plate can be edge-sealed by laser welding technology and configured with internal pressure-bearing strengthening points by resistance welding. For example, obtain the heat exchange plate material of the plate heat exchange plate, weld the corresponding material edges of the heat exchange plate material by laser welding technology to obtain a double-layer sealed material, identify the pressure-bearing strengthening points of the double-layer sealed material, and based on the pressure-bearing strengthening points, weld the double-layer sealed material by resistance welding to obtain a double-layer sealed pressure-boosting heat exchange plate.

[0090] S2. Obtain the flow channel shape of the plate heat exchange plate, determine the forming die of the plate heat exchange plate, calculate the contact area between the corresponding upper and lower die cavities of the forming die and the double-layer sealed pressure-boosting heat exchange plate according to the flow channel shape, and determine the clamping force of the forming die on the double-layer sealed pressure-boosting heat exchange plate according to the contact area.

[0091] In the embodiment of the present invention, obtaining the flow channel shape of the plate heat exchange plate can help optimize the pressure-boosting shaping process, reduce unnecessary stress concentration, and prevent the heat exchange plate from deforming or being damaged during the pressure-boosting process. Among them, the flow channel shape refers to the geometric shape of the path and channel through which the fluid flows in the plate heat exchanger.

[0092] In the embodiment of the present invention, determining the forming die of the plate heat exchange plate can fix the heat exchange plate material, provide uniform pressure during the welding process, ensure the weld quality, reduce the leakage risk, and improve the reliability and service life of the heat exchanger. Among them, the forming die refers to a pair of tools used to form and fix the flow channel structure of the heat exchange plate in the manufacture of the plate heat exchanger.

[0093] In the embodiment of the present invention, calculating the contact area between the corresponding upper and lower die cavities of the forming die and the double-layer sealed pressure-boosting heat exchange plate according to the flow channel shape can ensure that the pressure applied to the heat exchange plate during the pressure-boosting shaping process is uniform, which helps to avoid local overpressure or underpressure, thereby ensuring the overall shape and dimensional accuracy of the heat exchange plate. Among them, the contact area refers to the area of the region where the forming die contacts the surface of the heat exchange plate during the pressure-boosting shaping process of the plate heat exchange plate.

[0094] As an embodiment of the present invention, calculating the contact area between the corresponding upper and lower die cavities of the forming die and the double-layer sealed pressure-boosting heat exchange plate according to the flow channel shape includes:

[0095] Determine the cross-sectional shape and the number of flow channels corresponding to the flow channel shape according to the flow channel shape;

[0096] Measure the cross-sectional parameters of the flow channel according to the cross-sectional shape;

[0097] Analyze the flow channel dimensions of the flow channel shape;

[0098] Calculate the contact area of the double-layer sealed pressure-boosting heat exchange plate according to the cross-section parameters, the number of flow channels, and the size of the flow channels.

[0099] Among them, the cross-section shape refers to the geometric shape of the cross-section of the flow channel perpendicular to the flow direction, such as rectangle, trapezoid, arc, etc. The cross-section parameters refer to the specific geometric dimensions or characteristic parameters describing the cross-section shape of the flow channel, such as the length and width of a rectangle, the chord length and arc length of an arc, etc. The flow channel size refers to the specific dimensional parameters describing the geometric shape and size of the flow channel. These dimensional parameters are used to define the overall structure of the flow channel, including the length, width, height, spacing, etc. of the flow channel. In an embodiment of the present invention, by determining the clamping pressure of the forming die on the double-layer sealed pressure-boosting heat exchange plate according to the contact area, it can be ensured that the material remains stable during the forming process and does not undergo displacement or deformation. Among them, the clamping pressure refers to the pressure applied to the heat exchange plate material by the forming die to keep the material in a specific position and form.

[0100] As an embodiment of the present invention, determining the clamping pressure of the forming die on the double-layer sealed pressure-boosting heat exchange plate according to the contact area includes:

[0101] Determine the material elastic modulus and material tangent modulus of the double-layer sealed pressure-boosting heat exchange plate;

[0102] Analyze the total material strain, plastic material strain, and material yield stress of the double-layer sealed pressure-boosting heat exchange plate during pressure-boosting forming;

[0103] According to the contact area, the material elastic modulus, the material tangent modulus, the total material strain, the plastic material strain, and the material yield stress, use the following formula to calculate the clamping pressure of the forming die on the double-layer sealed pressure-boosting heat exchange plate:

[0104]

[0105] Among them, G represents the clamping pressure, M represents the contact area, T represents the material elastic modulus, b represents the total material strain, Q represents the material tangent modulus, s represents the plastic material strain, f represents the material yield stress, u represents the area integration variable, and du represents the integration of the area integration variable.

[0106] Among them, the elastic modulus of the material refers to an important physical quantity that measures the rigidity of the material and is usually used to describe the ability of the material to resist deformation. The tangent modulus of the material refers to the slope of the material on the non-linear stress-strain curve. The total strain of the material refers to the total amount of deformation that occurs during the stress process of the material. The plastic strain of the material refers to the permanent deformation that occurs when the material is subjected to an external force beyond its elastic limit. The yield stress of the material refers to the minimum stress value at which plastic deformation begins when the material is subjected to an external force.

[0107] Optionally, the elastic modulus and tangent modulus of the material of the double-layer sealed pressure-boosting heat exchange plate can be determined by non-contact measurement techniques, such as optical strain measurement, laser ultrasonic measurement, etc.

[0108] S3. Analyze the yield strength of the material of the double-layer sealed pressure-boosting heat exchange plate, calculate the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the yield strength of the material, determine the forming medium material for filling the heat exchange plate cavity corresponding to the double-layer sealed pressure-boosting heat exchange plate, configure the high-pressure pump for the forming medium material, and determine the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed pressure-boosting heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force.

[0109] By analyzing the yield strength of the material of the double-layer sealed pressure-boosting heat exchange plate in the embodiment of the present invention, it can be ensured that the material will not undergo unwanted deformation due to exceeding its yield point during the forming process, thereby ensuring the dimensional accuracy and structural integrity of the heat exchange plate. Among them, the yield strength of the material refers to the critical stress value at which the material transitions from the elastic deformation stage to the plastic deformation stage when subjected to an external force.

[0110] Optionally, the analysis of the yield strength of the material of the double-layer sealed pressure-boosting heat exchange plate can detect the sound waves generated by internal cracks and deformations during the loading process of the double-layer sealed pressure-boosting heat exchange plate through acoustic emission technology, so as to determine the yield strength of the material of the double-layer sealed pressure-boosting heat exchange plate.

[0111] By calculating the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the yield strength of the material in the embodiment of the present invention, it can be ensured that the material will not exceed its yield strength during the forming process, thereby avoiding unnecessary plastic deformation and ensuring the forming accuracy and dimensional stability of the product. Among them, the forming force refers to the force that needs to be applied to the material to cause plastic deformation and fill it into the mold cavity.

[0112] As an embodiment of the present invention, the calculation of the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the yield strength of the material includes:

[0113] Analyze the forming area of the double-layer sealed pressure-boosting heat exchange plate;

[0114] Identify the risk factors during the forming process of the double-layer sealed pressure-boosting heat exchange plate;

[0115] Calculate the forming risk coefficient of the double-layer sealed pressure-boosting heat exchange plate according to the risk factors;

[0116] Calculate the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the forming area, the material yield strength, and the forming risk coefficient by using the following formula:

[0117] X = D × S × (1 - γ)

[0118] Wherein, X represents the forming force of the double-layer sealed pressure-boosting heat exchange plate, D represents the material yield strength, S represents the forming area, and γ represents the forming risk coefficient.

[0119] Wherein, the forming area refers to the area of the part of the double-layer sealed pressure-boosting heat exchange plate that undergoes pressure-boosting deformation. The risk factors refer to the risk factors existing during the forming process of the double-layer sealed pressure-boosting heat exchange plate, such as temperature, speed, humidity, equipment stability, etc. The forming risk coefficient refers to a numerical value used to quantify the risk level during the material forming process.

[0120] Optionally, the risk factors during the forming process of the double-layer sealed pressure-boosting heat exchange plate can be identified by simulating the forming process through finite element analysis technology.

[0121] In an embodiment of the present invention, by determining the forming medium material for filling the heat exchange plate cavity corresponding to the double-layer sealed pressure-boosting heat exchange plate, it can ensure that the material is evenly filled into the heat exchange plate cavity, reduce forming defects, and improve the dimensional accuracy and surface quality of the product. Wherein, the forming medium material refers to a substance used for filling, transmitting pressure, or assisting in forming during the forming process, such as silica gel, polyurethane, nitrogen, carbon dioxide, etc.

[0122] In an embodiment of the present invention, by configuring a high-pressure pump for the forming medium material, it can provide the necessary pressure to ensure that the forming medium material can effectively fill the mold cavity and apply sufficient pressure to the material to achieve the expected forming effect. Wherein, the high-pressure pump refers to a pump device capable of providing high-pressure fluid transportation.

[0123] In the embodiments of the present invention, by determining the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed pressure-boosting heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force, all flow channels of all heat exchange plates can be completely formed, eliminating the influence of sudden grain change caused by rapid metal stretching deformation, thereby achieving an accurate forming effect. The forming pressure refers to the pressure exerted on the forming material by the high-pressure fluid (usually water or oil) generated by the high-pressure pump. The forming time refers to the total time required from the start of the high-pressure pump to the completion of the entire pressure-boosting forming process. Among them, the forming time includes the filling time and the pressure-holding time. The forming medium flow rate refers to the volume of the medium (such as water-based emulsion or hydraulic oil) injected into the forming cavity by the high-pressure pump per unit time. The forming medium temperature refers to the temperature of the medium (usually liquid or gas) used in the forming process to achieve precise control of the forming medium temperature, thereby eliminating the adverse effect of rapid temperature rise during stamping in the forming process.

[0124] As an embodiment of the present invention, the determining the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed pressure-boosting heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force includes:

[0125] Analyze the fluid characteristics of the forming medium material, where the fluid characteristics include: forming medium viscosity and forming medium density;

[0126] Calculate the medium pressure loss of the high-pressure pump according to the fluid characteristics;

[0127] Analyze the system pressure loss during the process of the high-pressure pump providing pressure;

[0128] Calculate the forming pressure required by the high-pressure pump according to the forming force, the medium pressure loss, and the system pressure loss;

[0129] Analyze the pipeline diameter and working process of the high-pressure pump, and analyze the flow velocity of the forming medium material in the working process;

[0130] Calculate the forming medium flow rate of the forming medium material according to the pipeline diameter and the flow velocity by using the following formula:

[0131]

[0132] Among them, RQ represents the forming medium flow rate, π represents the pi, h represents the pipeline diameter, and k represents the flow velocity;

[0133] Analyze the forming cavity volume of the double-layer sealed pressure-boosting heat exchange plate;

[0134] According to the volume of the forming cavity and the flow rate of the forming medium, the filling time of the double-layer sealed pressure-boosting heat exchange plate is calculated using the following formula:

[0135]

[0136] where t c represents the filling time, and RQ represents the flow rate of the forming medium;

[0137] According to the forming pressure and the filling time, determine the pressure-holding time of the double-layer sealed pressure-boosting heat exchange plate;

[0138] According to the filling time and the pressure-holding time, calculate the forming time of the double-layer sealed pressure-boosting heat exchange plate;

[0139] Calculate the forming heat during the forming process of the double-layer sealed pressure-boosting heat exchange plate, and determine the specific heat capacity of the forming medium material;

[0140] Based on the forming heat, the flow rate of the forming medium, and the specific heat capacity, determine the temperature of the forming medium material of the forming medium.

[0141] Among them, the fluid characteristics refer to the physical properties exhibited by the forming medium material under high-pressure conditions. The viscosity of the forming medium refers to the degree of internal resistance to flow of the forming medium material used during the forming process. The density of the forming medium refers to the mass of the forming medium material per unit volume. The medium pressure loss refers to the pressure loss caused by the viscosity and density of the fluid itself during fluid flow. The system pressure loss refers to the pressure loss caused by factors such as friction, turbulence, and local obstacles in various parts of the system (such as pipes, valves, elbows, pumps, etc.) during fluid flow. The pipe diameter refers to the inner diameter of the pipe. The working process refers to the entire process from the start of operation of the high-pressure pump to the liquid pressure-boosting forming of the heat exchange plate by the forming medium material. The flow velocity refers to the speed at which the forming medium material moves in the pipe. The volume of the forming cavity refers to the effective space volume that the forming medium (such as hydraulic oil or water-based liquid) needs to fill during high-pressure boosting forming. The filling time refers to the duration required for the high-pressure pump to inject and completely fill the forming cavity with the forming medium. The pressure-holding time refers to the duration for which the system maintains a constant high-pressure state after the forming medium completely fills the cavity. The forming heat refers to the heat generated due to the pressure-boosting forming (grain stretching) of the double-layer sealed pressure-boosting heat exchange plate. The specific heat capacity refers to the heat required to raise the temperature of a unit mass of the forming medium by 1 degree Celsius (or 1 Kelvin).

[0142] Optionally, the volume of the forming cavity of the double-layer sealed pressure-boosting heat exchange plate can be analyzed through CAD software modeling, such as SolidWorks, CATIA, Creo, etc.

[0143] Optionally, calculating the medium pressure loss of the high-pressure pump according to the fluid characteristics includes:

[0144] Analyzing the pipe length and pipe roughness of the high-pressure pump;

[0145] According to the fluid characteristics, use the following formula to calculate the flow coefficient of the formed medium material corresponding to the high-pressure pump:

[0146]

[0147] where, LN represents the flow coefficient, h represents the pipe diameter corresponding to the high-pressure pump, p represents the density of the formed medium corresponding to the fluid characteristics, k represents the flow velocity of the formed medium material, and N represents the viscosity of the formed medium corresponding to the fluid characteristics;

[0148] According to the flow coefficient, analyze the flow type of the formed medium material, where the flow type includes: laminar flow and turbulent flow;

[0149] According to the flow type, the pipe length, and the pipe roughness, use the following formula to calculate the medium pressure loss of the high-pressure pump:

[0150]

[0151] where, ΔU represents the medium pressure loss, β c represents the laminar friction factor when the flow type is laminar flow, β t represents the turbulent friction factor when the flow type is turbulent flow, LN represents the flow coefficient, ln represents the natural logarithm function with base e, a represents the pipe roughness, h represents the pipe diameter, k represents the flow velocity, Z represents the pipe length, and g represents the acceleration due to gravity, represents the operator corresponding to the flow type. When the flow type is laminar flow, is 1. When the flow type is turbulent flow, is 0.

[0152] Among them, the pipeline length refers to the total length from the outlet of the high-pressure pump to the heat exchange plate cavity where the forming medium material finally reaches. The pipeline roughness refers to the surface characteristics of the inner wall of the pipeline. The flow coefficient refers to a dimensionless number used to describe the proportional relationship between the inertial force and the viscous force of fluid flow. The flow type refers to the flow state of the forming medium material in the pipeline or open channel. Laminar flow refers to an orderly flow state in which the fluid flows in the form of parallel layers without cross-mixing between the layers. Turbulent flow refers to a disorderly flow state in which the velocity, pressure, and direction of the fluid change rapidly and randomly over time and space. The turbulent friction factor refers to the friction loss used to describe turbulent flow in the pipeline. The laminar friction factor refers to a dimensionless parameter used to describe the friction loss in laminar flow in the pipeline.

[0153] S4. Based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, simulate the liquid high-pressure boosting process of the double-layer sealed boosting heat exchange plate, collect the process parameters of the liquid high-pressure boosting process in real time, and construct a boosting forming control module for the liquid high-pressure boosting process according to the process parameters.

[0154] In the embodiment of the present invention, by simulating the liquid high-pressure boosting process of the double-layer sealed boosting heat exchange plate based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, the boosting process can be accurately simulated, the accurate control of the heat exchange plate forming can be realized, and the accuracy and consistency of the product can be improved. Among them, the liquid high-pressure boosting process refers to a metal forming process carried out at room temperature, using a high-pressure hydraulic system to apply pressure to the double-layer sealed boosting heat exchange plate to cause plastic deformation without heating or temperature rise.

[0155] As an embodiment of the present invention, the simulation of the liquid high-pressure boosting process of the double-layer sealed boosting heat exchange plate based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature includes:

[0156] Construct a material geometric model of the double-layer sealed boosting heat exchange plate;

[0157] Define a die model corresponding to the forming die of the double-layer sealed boosting heat exchange plate;

[0158] Register the material geometric model and the die model to obtain a registered combined model;

[0159] According to the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, define the boundary conditions and loading paths of the registered combined model;

[0160] According to the boundary conditions and the loading path, use the registered combined model to simulate the liquid high-pressure pressure-boosting process of the double-layer airtight pressure-boosting heat exchange plate.

[0161] Among them, the material geometry model refers to a three-dimensional model used to simulate and analyze the double-layer airtight pressure-boosting heat exchange plate. The mold model refers to a three-dimensional model of a forming mold used to guide material forming during the simulation and manufacturing process. The registered combined model refers to a unified model obtained by precisely aligning and combining the material geometry model and the mold model in simulation software. The boundary conditions refer to the restrictive or constraint conditions imposed on the external boundary of the model, such as pressure boundary conditions, displacement boundary conditions, etc. The loading path refers to the variation law of parameters such as force, pressure, displacement, and temperature applied to the material over time.

[0162] Optionally, defining the boundary conditions and loading path of the registered combined model according to the clamping pressure and the forming pressure can be defined by multi-physics field simulation methods, such as thermal-mechanical coupling, fluid-structure interaction, etc.

[0163] In the embodiment of the present invention, by collecting the process parameters of the liquid high-pressure pressure-boosting process in real time, the change of the process parameters can be monitored, and the equipment can be adjusted in time to keep the process parameters within the set range, ensuring the stability and consistency of the forming process. Among them, the process parameters refer to the key variables used to control and monitor the forming process in the liquid high-pressure pressure-boosting process, such as pressure parameters, displacement parameters, temperature parameters, etc.

[0164] In the embodiment of the present invention, by constructing a pressure-boosting forming control module for the liquid high-pressure pressure-boosting process according to the process parameters, the process parameters such as pressure, position, temperature, and speed can be accurately adjusted and maintained, so as to achieve a high-precision and highly consistent forming effect, realize the automation of the forming process, reduce manual intervention, and improve production efficiency. Among them, the pressure-boosting forming control module refers to a control system used to manage and control each parameter and step in the high-pressure cold pressure-boosting forming process.

[0165] As an embodiment of the present invention, constructing the pressure-boosting forming control module for the liquid high-pressure pressure-boosting process according to the process parameters includes:

[0166] Analyze the abnormal state of the liquid high-pressure pressure-boosting process according to the process parameters, and identify the abnormal influencing factors of the abnormal state;

[0167] Determine the control requirements of the liquid high-pressure pressure-boosting process according to the abnormal influencing factors;

[0168] Define the control logic of the liquid high-pressure pressure-boosting process according to the control requirements;

[0169] Configure the sensors and controllers in the high-pressure liquid boosting process according to the control logic;

[0170] Integrate the boosting forming control module of the high-pressure liquid boosting process based on the sensors, the controllers, and the control logic.

[0171] Among them, the abnormal state refers to the unexpected changes in process parameters or equipment operating states during the high-pressure liquid boosting process, which may lead to a decline in product quality, equipment damage, or production interruption, such as abnormal pressure, hydraulic system failure, etc. The abnormal influence factor refers to various factors that may cause abnormal states in the high-pressure liquid boosting process, such as pressure setting, equipment calibration, etc. The control requirement refers to a series of control requirements and conditions that must be met during the high-pressure liquid boosting process to ensure the smooth progress of the process and the stability of product quality, such as pressure control requirements, equipment performance control requirements, etc. The control logic refers to a set of rules on how to adjust and control the output (such as adjusting equipment actions, changing process parameters, etc.) according to the input signals (such as process parameters, equipment states, etc.) in the high-pressure liquid boosting process to achieve the process objectives and ensure product quality. The sensor refers to a type of device that is used to detect and convert physical quantities (such as pressure, temperature, position, speed, etc.) into electrical signals in the high-pressure liquid boosting process, such as pressure sensors, temperature sensors, etc. The controller refers to an electronic device that is used to receive sensor signals, execute control logic, and output control commands to adjust the actuator in the high-pressure liquid boosting process.

[0172] Optionally, according to the control requirements, the control logic of the high-pressure liquid boosting process can be defined by using a genetic algorithm to optimize the control parameters of the high-pressure liquid boosting process, thereby defining the control logic of the high-pressure liquid boosting process.

[0173] S5. Based on the boosting forming control module, use a preset large-tonnage mold clamping device and the high-pressure pump to perform high-pressure cold boosting on the double-layer sealed boosting heat exchange plate to obtain the target plate heat exchanger.

[0174] In the embodiment of the present invention, by performing high-pressure cold boosting on the double-layer sealed boosting heat exchange plate by using a preset large-tonnage mold clamping device and the high-pressure pump based on the boosting forming control module to obtain the target plate heat exchanger, the pressure and mold movement can be precisely controlled, ensuring the dimensional accuracy and shape consistency of the plate heat exchanger, reducing product defects. At the same time, the automated control can shorten the production cycle, reduce manual intervention, and improve the continuous operation time and efficiency of the production line.

[0175] For a further understanding of the boosting forming method of the plate heat exchanger described in this application, refer to Figure 2As shown in the figure, it is a schematic process flow diagram of the method for realizing the pressure boosting forming of the plate heat exchanger plate provided by an embodiment of the present invention. In Figure 2 First, determine the heat exchanger plate material of the heat exchanger plate, and weld the heat exchanger plate material by using laser welding and resistance welding methods to obtain a double-layer sealed pressure boosting heat exchanger plate. Secondly, integrate the double-layer sealed pressure boosting heat exchanger plate into the forming mold, and use a large-tonnage mold clamping device to clamp the double-layer sealed pressure boosting heat exchanger plate to obtain a clamped double-layer sealed pressure boosting heat exchanger plate. Thirdly, use a high-pressure pump to fill the forming medium material into the heat exchanger plate cavity of the clamped double-layer sealed pressure boosting heat exchanger plate to obtain a filled double-layer sealed pressure boosting heat exchanger plate. Finally, perform high-pressure cold pressure boosting forming on the filled double-layer sealed pressure boosting heat exchanger plate to obtain the target plate heat exchanger plate.

[0176] Compared with the problems described in the background art, in the embodiments of the present invention, determining the heat exchange plate material type of the plate heat exchanger plate according to the specifications and the performance can accelerate heat transfer, thereby improving heat exchange efficiency, reducing energy loss, and at the same time reducing the failure rate and downtime of the heat exchange plate during use; optionally, in the embodiments of the present invention, determining the heat exchange plate material type of the plate heat exchanger plate according to the specifications and the performance can accelerate heat transfer, thereby improving heat exchange efficiency, reducing energy loss, and at the same time reducing the failure rate and downtime of the heat exchange plate during use; in the embodiments of the present invention, determining the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed pressure-boosted heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force can completely form all the flow channels of all the heat exchange plates, eliminating the influence of sudden grain change caused by rapid metal stretching deformation, thereby achieving an accurate forming effect; in the embodiments of the present invention, by simulating the liquid high-pressure pressure-boosted process of the double-layer sealed pressure-boosted heat exchange plate based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, it is possible to accurately simulate the pressure-boosted process, achieve precise control of the forming of the heat exchange plate, and improve the accuracy and consistency of the product; in the embodiments of the present invention, by constructing a pressure-boosted forming control module for the liquid high-pressure pressure-boosted process according to the process parameters, it is possible to accurately adjust and maintain process parameters such as pressure, position, temperature, and speed, thereby achieving a high-precision and high-consistency forming effect, realizing the automation of the forming process, reducing manual intervention, and improving production efficiency; finally, in the embodiments of the present invention, by using a preset large-tonnage clamping device and the high-pressure pump to perform high-pressure cold pressure-boosting on the double-layer sealed pressure-boosted heat exchange plate based on the pressure-boosted forming control module, a target plate heat exchanger plate can be obtained, accurately controlling the pressure and the movement of the mold, ensuring the dimensional accuracy and shape consistency of the plate heat exchanger plate, reducing product defects, and at the same time, the automated control can shorten the production cycle, reduce manual intervention, and improve the continuous operation time and efficiency of the production line. Therefore, the pressure-boosted forming method and system for the plate heat exchanger plate provided by the embodiments of the present invention can improve the production quality of the plate heat exchanger plate and the flow channel optimization forming technology.

[0177] Embodiment 2:

[0178] As Figure 3 shown, it is a functional module diagram of a pressure-boosted forming system for a plate heat exchanger plate of the present invention.

[0179] The pressure boosting and forming system 200 of a plate heat exchanger described in the present invention can be installed in an electronic device. According to the functions achieved, the pressure boosting and forming system of the plate heat exchanger may include a material determination module 201, a clamping pressure calculation module 202, a forming parameter calculation module 203, a pressure boosting and forming module 204, and a heat exchanger plate production module 205. The modules described in the present invention may also be referred to as units, which refer to a series of computer program segments that can be executed by the processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0180] In the embodiments of the present invention, the functions of each module / unit are as follows:

[0181] The material determination module 201 is used to clarify the specifications and performance of the plate heat exchanger, determine the type of heat exchanger plate material of the plate heat exchanger according to the specifications and the performance, and configure the double-layer sealed pressure boosting heat exchanger plate of the plate heat exchanger according to the type of heat exchanger plate material;

[0182] The clamping pressure calculation module 202 is used to obtain the flow channel shape of the plate heat exchanger, determine the forming die of the plate heat exchanger, calculate the contact area between the corresponding upper and lower die cavities of the forming die and the double-layer sealed pressure boosting heat exchanger plate according to the forming die and the flow channel shape, and determine the clamping pressure of the forming die on the double-layer sealed pressure boosting heat exchanger plate according to the contact area;

[0183] The forming parameter calculation module 203 is used to analyze the material yield strength of the double-layer sealed pressure boosting heat exchanger plate, calculate the forming force of the double-layer sealed pressure boosting heat exchanger plate according to the material yield strength, determine the forming medium material for filling the heat exchanger cavity corresponding to the double-layer sealed pressure boosting heat exchanger plate, configure the high-pressure pump for the forming medium material, and determine the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed pressure boosting heat exchanger plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force;

[0184] The pressure boosting and forming module 204 is used to simulate the liquid high-pressure boosting process of the double-layer sealed pressure boosting heat exchanger plate based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, collect the process parameters of the liquid high-pressure boosting process in real time, and construct a pressure boosting and forming control module for the liquid high-pressure boosting process according to the process parameters;

[0185] The heat exchanger plate production module 205 is used to perform high-pressure cold boosting on the double-layer sealed pressure boosting heat exchanger plate by using a preset large-tonnage clamping device and the high-pressure pump based on the pressure boosting and forming control module to obtain the target plate heat exchanger.

[0186] Specifically, when the modules in the pressure boosting forming system 200 of the plate heat exchanger plate in the embodiments of the present invention are used, they adopt the same technical means as those in the Figure 1 pressure boosting forming method of the plate heat exchanger plate described therein, and can produce the same technical effects, which will not be elaborated here.

[0187] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms.

[0188] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for pressure bulging forming of a plate heat exchanger plate, characterized in that The method includes: Specify the specifications and performance of the plate heat exchanger plate. According to the specifications and the performance, determine the type of heat exchanger plate material for the plate heat exchanger plate. According to the type of heat exchanger plate material, configure the double-layer sealed pressure-boosted heat exchanger plate of the plate heat exchanger plate; Obtain the flow channel shape of the plate heat exchanger plate, determine the forming die of the plate heat exchanger plate. According to the forming die and the flow channel shape, calculate the contact area between the corresponding upper and lower die cavities of the forming die and the double-layer sealed pressure-boosted heat exchanger plate. According to the contact area, determine the clamping pressure of the forming die on the double-layer sealed pressure-boosted heat exchanger plate; Analyze the material yield strength of the double-layer sealed pressure-boosted heat exchanger plate. According to the material yield strength, calculate the forming force of the double-layer sealed pressure-boosted heat exchanger plate. Determine the forming medium material for filling the heat exchanger cavity corresponding to the double-layer sealed pressure-boosted heat exchanger plate. Configure the high-pressure pump for the forming medium material. According to the forming force, determine the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed pressure-boosted heat exchanger plate, and the forming medium flow rate and forming medium temperature of the forming medium material; Based on the clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, simulate the liquid high-pressure pressure-boosting process of the double-layer sealed pressure-boosted heat exchanger plate. Real-time collect the process parameters of the liquid high-pressure pressure-boosting process. According to the process parameters, construct the pressure-boosting forming control module of the liquid high-pressure pressure-boosting process; Based on the pressure-boosting forming control module, use a preset large-tonnage clamping device and the high-pressure pump to perform high-pressure cold pressure-boosting on the double-layer sealed pressure-boosted heat exchanger plate to obtain the target plate heat exchanger plate.

2. The pressure boosting forming method of the plate heat exchanger plate according to claim 1, characterized in that, The determining the type of heat exchanger plate material for the plate heat exchanger plate according to the specifications and the performance includes: Analyze the heat exchange medium of the plate heat exchanger plate according to the specifications and the performance; Determine the medium temperature, medium pressure, and medium characteristics of the heat exchange medium; According to the medium temperature, the medium pressure, and the medium characteristics, preliminarily determine the candidate material types for the plate heat exchanger plate; Analyze the thermal conductivity, corrosion resistance, and mechanical strength of the candidate materials corresponding to the candidate material types; According to the thermal conductivity, the corrosion resistance, and the mechanical strength, screen out the heat exchanger plate material types of the candidate material types.

3. The pressure boosting forming method of the plate heat exchanger plate according to claim 1, characterized in that, The calculating the contact area between the upper and lower die cavities of the forming die and the double-layer sealed pressure-boosted heat exchanger plate according to the flow channel shape includes: According to the flow channel shape, determine the cross-sectional shape and the number of flow channels corresponding to the flow channel shape; Measure the cross-sectional parameters of the flow channel according to the cross-sectional shape; Analyze the flow channel dimensions of the flow channel shape; According to the cross-sectional parameters, the number of flow channels, and the flow channel dimensions, calculate the contact area of the double-layer sealed pressure-boosted heat exchanger plate.

4. The pressure boosting forming method of the plate heat exchanger plate according to claim 1, characterized in that, The determining the clamping pressure of the forming die on the double-layer sealed pressure-boosted heat exchanger plate according to the contact area includes: Determine the material elastic modulus and material tangent modulus of the double-layer sealed pressure-boosted heat exchanger plate; Analyze the total strain, plastic strain, and yield stress of the material of the double-layer sealed pressure-boosting heat exchange plate during pressure-boosting forming; Calculate the clamping pressure of the forming die on the double-layer sealed pressure-boosting heat exchange plate according to the contact area, the elastic modulus of the material, the tangent modulus of the material, the total strain of the material, the plastic strain of the material, and the yield stress of the material.

5. The pressure boosting forming method of the plate heat exchanger plate according to claim 1, characterized in that The calculation of the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the yield strength of the material includes: Analyze the forming area of the double-layer sealed pressure-boosting heat exchange plate; Identify the risk factors during the forming process of the double-layer sealed pressure-boosting heat exchange plate; Calculate the forming risk coefficient of the double-layer sealed pressure-boosting heat exchange plate according to the risk factors; Calculate the forming force of the double-layer sealed pressure-boosting heat exchange plate according to the forming area, the yield strength of the material, and the forming risk coefficient.

6. The pressure boosting forming method of the plate heat exchange plate according to claim 1, characterized in that The determination of the forming pressure to be provided by the high-pressure pump, the forming time of the double-layer sealed pressure-boosting heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force includes: Analyze the fluid characteristics of the forming medium material, where the fluid characteristics include: forming medium viscosity and forming medium density; Calculate the medium pressure loss of the high-pressure pump according to the fluid characteristics; Analyze the system pressure loss during the pressure supply process of the high-pressure pump; Calculate the forming pressure to be provided by the high-pressure pump according to the forming force, the medium pressure loss, and the system pressure loss; Analyze the pipe diameter and working process of the high-pressure pump, and analyze the flow velocity of the forming medium material in the working process; Calculate the forming medium flow rate of the forming medium material according to the pipe diameter and the flow velocity; Analyze the forming cavity volume of the double-layer sealed pressure-boosting heat exchange plate; Calculate the filling time of the double-layer sealed pressure-boosting heat exchange plate according to the forming cavity volume and the forming medium flow rate; Determine the pressure-holding time of the double-layer sealed pressure-boosting heat exchange plate according to the forming pressure and the filling time; Calculate the forming time of the double-layer sealed pressure-boosting heat exchange plate according to the filling time and the pressure-holding time; Calculate the forming heat during the forming process of the double-layer sealed pressure-boosting heat exchange plate, and determine the specific heat capacity of the forming medium material; Determine the forming medium temperature of the forming medium material based on the forming heat, the forming medium flow rate, and the specific heat capacity.

7. The pressure boosting forming method of the plate heat exchanger plate according to claim 6, characterized in that, The calculation of the medium pressure loss of the high-pressure pump according to the fluid characteristics includes: Analyze the pipe length and pipe roughness of the high-pressure pump; Calculate the flow coefficient of the forming medium material corresponding to the high-pressure pump according to the fluid characteristics; Analyze the flow type of the forming medium material according to the flow coefficient, where the flow types include: laminar flow and turbulent flow; Calculate the medium pressure loss of the high-pressure pump according to the flow type, the pipe length, and the pipe roughness.

8. The pressure boosting forming method of the plate heat exchanger plate according to claim 1, characterized in that, Based on the mold clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, simulating the liquid high-pressure boosting process of the double-layer sealed boosting heat exchange plate, including: Constructing a material geometric model of the double-layer sealed boosting heat exchange plate; Defining a mold model of the forming mold corresponding to the double-layer sealed boosting heat exchange plate; Registering the material geometric model and the mold model to obtain a registered combined model; Defining boundary conditions and loading paths of the registered combined model according to the mold clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature; Simulating the liquid high-pressure boosting process of the double-layer sealed boosting heat exchange plate by using the registered combined model according to the boundary conditions and the loading paths.

9. The pressure boosting forming method of the plate heat exchanger plate according to claim 1, characterized in that Constructing a boosting forming control module for the liquid high-pressure boosting process according to the process parameters, including: Analyzing the abnormal state of the liquid high-pressure boosting process according to the process parameters and identifying the abnormal influencing factors of the abnormal state; Determining the control requirements of the liquid high-pressure boosting process according to the abnormal influencing factors; Defining the control logic of the liquid high-pressure boosting process according to the control requirements; Configuring sensors and controllers in the liquid high-pressure boosting process according to the control logic; Integrating the boosting forming control module of the liquid high-pressure boosting process based on the sensors, the controllers, and the control logic.

10. A pressure boosting forming system for a plate heat exchanger plate, characterized in that, The system includes: A material determination module for clarifying the specifications and performance of the plate heat exchange plate, determining the heat exchange plate material type of the plate heat exchange plate according to the specifications and the performance, and configuring the double-layer sealed boosting heat exchange plate of the plate heat exchange plate according to the heat exchange plate material type; A mold clamping pressure calculation module for obtaining the flow channel shape of the plate heat exchange plate, determining the forming mold of the plate heat exchange plate, calculating the contact area between the upper and lower mold cavities corresponding to the forming mold and the double-layer sealed boosting heat exchange plate according to the forming mold and the flow channel shape, and determining the mold clamping pressure of the forming mold on the double-layer sealed boosting heat exchange plate according to the contact area; A forming parameter calculation module for analyzing the material yield strength of the double-layer sealed boosting heat exchange plate, calculating the forming force of the double-layer sealed boosting heat exchange plate according to the material yield strength, determining the forming medium material for filling the heat exchange plate cavity corresponding to the double-layer sealed boosting heat exchange plate, configuring a high-pressure pump for the forming medium material, and determining the forming pressure required by the high-pressure pump, the forming time of the double-layer sealed boosting heat exchange plate, and the forming medium flow rate and forming medium temperature of the forming medium material according to the forming force; A boosting forming module for simulating the liquid high-pressure boosting process of the double-layer sealed boosting heat exchange plate based on the mold clamping pressure, the forming pressure, the forming time, the forming medium flow rate, and the forming medium temperature, collecting the process parameters of the liquid high-pressure boosting process in real time, and constructing a boosting forming control module for the liquid high-pressure boosting process according to the process parameters; The heat exchange plate production module is used to perform high-pressure cold expansion on the double-layer sealed pressure-expanded heat exchange plate based on the pressure-expanded forming control module by using a preset large-tonnage mold clamping device and the high-pressure pump to obtain the target plate heat exchanger.

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