MEMS pressure sensor test system and test method

Abstract

The invention provides an MEMS pressure sensor test system, and the system comprises a test circuit board which comprises a test module and a plurality of test clamps which are connected with each other and are used for connecting a to-be-tested pressure sensor, and the test module is used for obtaining the test data of the to-be-tested pressure sensor; the test container is used for accommodating the test circuit board and providing a test environment for the to-be-tested pressure sensor; and the upper computer is electrically connected with the test container and the test module and is used for controlling the test container and sending an acquisition instruction to the test module so as to acquire test data of the pressure sensor to be tested. The test circuit board is provided with a plurality of test fixtures, and the test fixtures can be connected with the to-be-tested pressure sensors, so that the test module can test the to-be-tested pressure sensors in batches, and the test efficiency of the test system can be improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor device testing, and particularly to a MEMS pressure sensor testing system and a testing method thereof. Background Art

[0002] A MEMS (Micro Electro Mechanical Systems) pressure sensor is a device that is fabricated using MEMS technology and integrates a pressure-sensitive core with a signal processing integrated circuit for measuring external pressure, and is widely used in fields such as the automotive industry, industrial process control, and aerospace. The performance of the MEMS pressure sensor needs to be tested both after development and before use to ensure the reliability of its use.

[0003] Currently, both the test accuracy and test efficiency for the performance testing of MEMS pressure sensors are relatively low. Summary of the Invention

[0004] In view of this, the purpose of this application is to propose a MEMS pressure sensor testing system and a testing method thereof.

[0005] Based on the above purpose, this application provides a MEMS pressure sensor testing system, including:

[0006] A test circuit board, including a test module and a plurality of test jigs for connecting the pressure sensor to be tested, the test module is used to obtain the test data of the pressure sensor to be tested;

[0007] A test container for accommodating the test circuit board to provide a test environment for the pressure sensor to be tested;

[0008] An upper computer, electrically connected to the test container and the test module, is used to control the test container and send an acquisition instruction to the test module to obtain the test data of the pressure sensor to be tested.

[0009] Further, based on the acquisition instruction of the upper computer, the test module obtains the test data of a plurality of the pressure sensors to be tested in a preset order and sends it to the upper computer.

[0010] Further, the test module includes a main control module and an electrical signal conversion module connected to each other. The main control module is connected to the test fixture, and the electrical signal conversion module is connected to the host computer. The main control module is configured to send an acquisition instruction to the test fixture to acquire test data of the pressure sensor under test on the test fixture, and send the test data to the electrical signal conversion module. The electrical signal conversion module converts the received test data and then sends it to the host computer.

[0011] The electrical signal conversion module is configured to receive an instruction from the host computer, convert the received instruction, and then send it to the main control module.

[0012] Further, the test circuit board further includes an isolation module. The test fixture is connected to the main control module through the isolation module. The main control module sends an acquisition instruction and acquires test data of the pressure sensor under test on the test fixture through the isolation module.

[0013] Further, the test system further includes a programmable test power supply. The programmable test power supply is connected to the test module, the test fixture, and the isolation module to provide power for the pressure sensor under test, the test module, and the isolation chip.

[0014] The programmable test power supply is connected to the host computer, and the host computer is configured to control the programmable test power supply.

[0015] Further, the test circuit board further includes a power control module. The power control module is connected to the test module, the test fixture, and the isolation module. The programmable test power supply is connected to the power control module.

[0016] Further, the test fixture includes a fixture base and a fixture protective cover. The fixture base is located on the test circuit board. The fixture protective cover is stacked and rotatably connected to the fixture base. The fixture base is provided with insertion and extraction holes adapted to the periphery of the connection end of the pressure sensor under test, and the fixture protective cover is provided with induction holes adapted to the sensing end of the pressure sensor under test. The insertion and extraction holes and the induction holes are arranged opposite to each other.

[0017] Further, the test container includes a pressure fixture and a temperature chamber. The test circuit board is connected to the pressure fixture and is located inside the pressure fixture. The pressure fixture is located inside the temperature chamber. The pressure fixture and the temperature chamber jointly provide a test environment for the pressure sensor under test connected to the test circuit board.

[0018] Further, the pressure fixture includes a fixture body and a fixture cover that are detachably and sealingly connected. One end of the fixture body away from the fixture cover is provided with a connection pipeline and a control pipeline. The test circuit board is connected to the host computer through the connection pipeline, and the pressure fixture is connected to the host computer through the control pipeline.

[0019] Based on the same inventive concept, the present disclosure also provides a method for testing a MEMS pressure sensor, which is applied to the MEMS pressure sensor testing system as described above. The testing method includes:

[0020] Install the pressure sensor to be tested on the test fixture of the test circuit board;

[0021] Place the test circuit board in the test container;

[0022] Operate the host computer to start the test container;

[0023] Operate the host computer to send an acquisition instruction to the test module of the test circuit board to acquire the test data of the pressure sensor to be tested.

[0024] As can be seen from the above, a MEMS pressure sensor testing system provided by the present application, by setting a test circuit board, a test container and a host computer, the test circuit board is provided with a plurality of test fixtures to simultaneously connect a plurality of pressure sensors to be tested, the test circuit board is provided with a test module to acquire the test data of the pressure sensor to be tested, the test container is used to provide a test environment for the pressure sensor to be tested, the host computer is connected to the test circuit board and the test container, so as to control the test container and the test circuit board through the host computer, control the test environment provided by the test container through the host computer, so that the pressure sensor to be tested is in different test environments, and then facilitate the test module to acquire the test data of the pressure sensor to be tested in different test environments, send an acquisition instruction to the test module through the host computer to acquire the test data of the pressure sensor to be tested in different test environments, avoid repeatedly building a test environment during the test process, and thus is beneficial to improving the test efficiency of the test system. In addition, a plurality of test fixtures are provided on the test circuit board, and the test fixtures can connect the pressure sensor to be tested, so that the test module can perform batch testing on the pressure sensor to be tested, which is further beneficial to improving the test efficiency of the test system. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the present application or related technologies, the following will briefly introduce the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 This is a schematic structural diagram of the test circuit board according to an embodiment of the present application;

[0027] Figure 2 This is a schematic structural diagram of the MEMS pressure sensor test system according to an embodiment of the present application;

[0028] Figure 3 This is a schematic structural diagram of the test fixture according to an embodiment of the present application;

[0029] Figure 4 This is a schematic structural diagram of the pressure fixture according to an embodiment of the present application;

[0030] Figure 5 This is a schematic flow structure diagram of the MEMS pressure sensor test method according to an embodiment of the present application.

[0031] In the figure: 100, test circuit board; 110, test module; 111, main control module; 112, electrical signal conversion module; 120, test fixture; 121, fixture base; 1211, insertion and extraction hole; 122, fixture protection cover; 1221, induction hole; 130, isolation module; 140, power control module; 200, test container; 210, pressure fixture; 211, fixture main body; 2111, connection pipeline; 2112, control pipeline; 212, fixture cover; 220, temperature chamber; 300, host computer; 400, programmable test power supply. Detailed implementation manners

[0032] In order to make the objectives, technical solutions and advantages of the present application more clear and understandable, the present application will be further described in detail below with reference to specific embodiments and the accompanying drawings.

[0033] It should be noted that unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the ordinary meanings understood by those of ordinary skill in the field to which the present application belongs. The "first", "second" and similar terms used in the embodiments of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or objects appearing before this term cover the elements or objects listed after this term and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0034] As described in the background art, the test accuracy and test efficiency of the current performance test for MEMS pressure sensors are both relatively low. In traditional test methods, a programmable power supply is mostly used to power the pressure sensor, a pressure controller is controlled to load pressure on the pressure sensor, and then test equipment such as an oscilloscope and a digital multimeter are connected one by one through an adapter device to conduct tests on different items. The test takes a long time, has low efficiency, many human errors, and a large labor intensity. With the sharp increase in the demand for pressure sensors, some batch testing methods have emerged. However, the current batch testing methods still have the following defects: First, on the hardware circuit, the test expansion of MEMS pressure sensors is achieved by adding a data selector. For example, a microcontroller unit is used to control the ADG1608 chip to switch to the next sensor, resulting in a large size of the test circuit board and limited batch testing numbers, unable to meet the requirements of large-scale batch testing and the development requirements of current sensors; Second, the connection between the test circuit and the MEMS pressure sensor still uses the form of metal pins, which leads to the fact that in various reliability assessment tests, the metal pins are extremely vulnerable to external environmental interference, resulting in large test errors, and at least 4 pins are required for each MEMS pressure sensor, limiting the large-scale testing of MEMS pressure sensors.

[0035] Based on this, the present application proposes a MEMS pressure sensor test system and a test method to improve the test accuracy of MEMS pressure sensors while improving the test efficiency, which is beneficial to the large-scale batch testing of MEMS pressure sensors.

[0036] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0037] In some embodiments, the present application provides a MEMS pressure sensor test system, as Figure 1 and Figure 2 shown, including:

[0038] A test circuit board 100, including a connected test module 110 and a plurality of test fixtures 120 for connecting the pressure sensor to be tested, and the test module 110 is used to obtain the test data of the pressure sensor to be tested;

[0039] A test container 200, used to accommodate the test circuit board 100 to provide a test environment for the pressure sensor to be tested;

[0040] An upper computer 300, electrically connected to the test container 200 and the test module 110, used to control the test container 200 and send an acquisition instruction to the test module 110 to obtain the test data of the pressure sensor to be tested.

[0041] Specifically, the test fixture 120 is used to connect the pressure sensor to be tested, and the test module 110 is connected to the test fixture 120 to connect to the pressure sensor to be tested, so as to obtain the test data of the pressure sensor to be tested.

[0042] The test container 200 provides a test environment for the test circuit board 100, and thus provides a test environment for the pressure sensor to be tested located on the test circuit board 100, so that the test module 110 can obtain the test data of the pressure sensor to be tested under different test environments.

[0043] The host computer 300 is connected to both the control end and the monitoring end of the test container 200, so that the host computer 300 can control and monitor the test environment provided by the test container 200, facilitating the test of the pressure sensor to be tested by the test system.

[0044] The host computer 300 is connected to the test module 110 of the test circuit board 100, so that the host computer 300 can send a acquisition instruction to the test module 110. The test module 110 acquires the test data of the pressure sensor to be tested according to the acquisition instruction and sends it to the host computer 300.

[0045] The host computer 300 processes and analyzes the environmental data of the test environment provided by the test container 200 and the test data of the pressure sensor to be tested acquired by the test module 110 to obtain the performance index of the pressure sensor to be tested.

[0046] Exemplarily, the test container 200 is a pressure vessel, the test circuit board 100 is located inside the pressure vessel, the host computer 300 controls the test environment of the test container 200 to be 10 Kpa, and can monitor the actual environmental conditions of the test container 200. When the actual environment of the test container 200 reaches 10 Kpa and is stable at 10 Kpa, the host computer 300 sends an acquisition instruction to the test module 110. The test module 110 immediately acquires the test data (the pressure data sensed by the pressure sensor to be tested) of the pressure sensor to be tested and sends it to the host computer 300. The host computer 300 comprehensively analyzes the test data and the environmental data to obtain the sensitivity of the pressure sensor to be tested in terms of pressure sensing.

[0047] In this embodiment, by providing a test circuit board 100, a test container 200, and a host computer 300, a plurality of test jigs 120 are provided on the test circuit board 100 to simultaneously connect a plurality of pressure sensors to be tested. A test module 110 is provided on the test circuit board 100 to obtain test data of the pressure sensors to be tested. The test container 200 is used to provide a test environment for the pressure sensors to be tested. The host computer 300 is connected to the test circuit board 100 and the test container 200, so as to control the test container 200 and the test circuit board 100 through the host computer 300, control the test environment provided by the test container 200 through the host computer 300, and further enable the pressure sensors to be tested to be in different test environments. Furthermore, it is convenient for the test module 110 to obtain the test data of the pressure sensors to be tested under different test environments. By sending an acquisition instruction from the host computer 300 to the test module 110 to obtain the test data of the pressure sensors to be tested under different test environments, it is possible to avoid repeatedly setting up the test environment during the test process, which is beneficial to improving the test efficiency of the test system. In addition, a plurality of test jigs 120 are provided on the test circuit board 100, and the test jigs 120 can connect the pressure sensors to be tested, enabling the test module 110 to perform batch testing on the pressure sensors to be tested, which is further beneficial to improving the test efficiency of the test system.

[0048] In some embodiments, based on the acquisition instruction from the host computer 300, the test module 110 obtains the test data of a plurality of the pressure sensors to be tested in a preset order and sends the test data to the host computer 300.

[0049] Specifically, after receiving the acquisition instruction from the host computer 300, the test module 110 sequentially obtains the test data of the pressure sensors to be tested connected to each of the test jigs 120 in a preset order, and sends the obtained test data to the host computer 300.

[0050] Exemplarily, there are 7 test jigs 120 on the test circuit board 100, each of the test jigs 120 is connected to a pressure sensor to be tested, and each of the test jigs 120 has a serial number (1, 2, 3,...). The preset order is 1 → 2 → 3 → 4 → 5 → 6 → 7. After the test module 110 obtains the test data of the test jig 120 with the serial number "1", it sends the test data to the host computer 300, and so on. Therefore, the order of the test data received by the host computer 300 is the same as the preset order.

[0051] Exemplarily, there are 7 test fixtures 120 on the test circuit board 100. Each test fixture 120 is connected to one of the pressure sensors to be tested, and each test fixture 120 has a serial number (1, 2, 3...). The preset order is 1→2→3→4→5→6→7. The test module 110 obtains the test data of the test fixture 120 with the serial number "1" and has a serial number stamp of "1". Therefore, the test data sent by the test module 110 to the host computer 300 has a serial number stamp, so that the host computer 300 can distinguish the received test data.

[0052] In this embodiment, the test module 110 obtains the test data of the pressure sensor to be tested based on the acquisition instruction, and sequentially obtains the test data of multiple pressure sensors to be tested according to the preset order, so that the process of the test module 110 obtaining the test data of multiple pressure sensors to be tested proceeds in an orderly manner, which is beneficial to improving the test efficiency of the test system.

[0053] In some embodiments, as Figure 1 shown, the test module 110 includes a main control module 111 and an electrical signal conversion module 112 connected to each other. The main control module 111 is connected to the test fixture 120, and the electrical signal conversion module 112 is connected to the host computer 300. The main control module 111 is used to send an acquisition instruction to the test fixture 120 to obtain the test data of the pressure sensor to be tested on the test fixture 120, and send the test data to the electrical signal conversion module 112. The electrical signal conversion module 112 converts the received test data and then sends it to the host computer 300;

[0054] The electrical signal conversion module 112 is used to receive the instruction from the host computer 300, and convert the received instruction and then send it to the main control module 111.

[0055] Specifically, the main control module 111 has functions of sensor control, data processing, and data uploading. The main control module 111 obtains the test data of the pressure sensor under test connected to the test fixture 120 through the sensor control function. The electrical signal conversion module 112 is a communication module between the main control module 111 and the host computer 300. The acquisition instruction sent by the host computer 300 is converted by the electrical signal conversion module 112 and then sent to the main control module 111, so that the main control module 111 can clarify the instruction of the host computer 300. Correspondingly, the test data obtained by the main control module 111 is sent to the electrical signal conversion module 112, and after being converted by the electrical signal conversion module 112, it is sent to the host computer 300. The electrical signal conversion module 112 converts the type of electrical signal for the communication between the host computer 300 and the main control module 111.

[0056] Exemplarily, the electrical signal conversion module 112 is a level conversion chip, which can convert the test data signal into a level signal such as RS232 or RS485 and output it. The main control module 111 includes a single-chip microcomputer chip and a peripheral circuit connected thereto. It obtains the test data (such as pressure, temperature, etc.) of the pressure sensor under test through the test fixture 120 as a TTL level signal. The main control module 111 sends the test data to the electrical signal conversion module 112, and the electrical signal conversion module 112 performs type conversion on the test data and then outputs it to the host computer 300. The host computer 300 sends an acquisition instruction (as an RS232 or RS485 level signal) to the electrical signal conversion module 112, and the electrical signal conversion module 112 converts the acquisition instruction into a TTL level signal and sends it to the main control module 111.

[0057] In this embodiment, the test module 110 includes a main control module 111 and an electrical signal conversion module 112, enabling the test module 110 to divide the work in obtaining the test data of the pressure sensor under test and communicating with the host computer 300, which is beneficial to the communication efficiency between the test module 110 and the host computer 300 and the test fixture 120, and further beneficial to improving the test efficiency of the test system.

[0058] In some embodiments, as Figure 1 shown, the test circuit board 100 further includes an isolation module 130. The test fixture 120 is connected to the main control module 111 through the isolation module 130. The main control module 111 sends an acquisition instruction and obtains the test data of the pressure sensor under test on the test fixture 120 through the isolation module 130.

[0059] Specifically, the isolation module 130 isolates the pressure sensor under test connected between the main control module 111 and the test fixture 120, which can prevent the situation that the main control module 111 is damaged by the pressure sensor under test during the power supply offset test. It can also prevent the connection between the pressure sensor under test and the main control module 111 from being interfered by other external signals, affecting the test data obtained by the main control module 111, thereby helping to improve the test accuracy and service life of the test system.

[0060] It should be noted that the power supply offset test is used to test the reliability of the pressure sensor under test under different power supplies. Therefore, the main control module 111 needs to obtain the test data of the pressure sensor under test under different power supplies (the test data is transmitted in the form of electrical signals) to obtain its reliability index. Since the performance of the pressure sensor under test is unknown, under different power supplies, there may be a situation where the electrical signal of the pressure sensor under test obtained by the main control module 111 is too large, burning out the main control module 111.

[0061] Exemplarily, the isolation module 130 is an isolation chip.

[0062] In some embodiments, as Figure 2 shown, the test system further includes a programmable test power supply 400, which is connected to the test module 110, the test fixture 120, and the isolation module 130 to provide power for the pressure sensor under test, the test module 110, and the isolation chip.

[0063] The programmable test power supply 400 is connected to the host computer 300, and the host computer 300 is used to control the programmable test power supply 400.

[0064] Specifically, the programmable test power supply 400 is used to provide power for the test module 110, the test fixture 120, and the isolation module 130 on the test circuit board 100, so that the test module 110 and the isolation module 130 can operate normally and play their corresponding roles, enabling the pressure sensor under test connected to the test fixture 120 to operate normally or output test data under different power supplies.

[0065] Specifically, the programmable test power supply 400 is used to provide a test power supply for the pressure sensor under test. The programmable test power supply 400 can apply test power supplies with different voltages to the pressure sensor under test under the control of the host computer 300 to meet the test conditions of the pressure sensor under test.

[0066] It should be noted that both the main control module 111 and the level conversion module require power supply support, and they are both connected to the programmable power supply. Multiple test fixtures 120 are arranged in parallel, so that the programmable power supply can be connected to the multiple test fixtures 120, thereby simplifying the connection between the test fixtures 120 and the programmable test power supply 400.

[0067] In this embodiment, the programmable test power supply 400 provides power supply support for the test circuit board 100, so that the test circuit board 100 can complete the test of the pressure sensor to be tested. The programmable test power supply 400 is under the control of the host computer 300, and adjusts the power supply support for the test circuit board 100, so that the pressure sensor to be tested can be tested under the action of power supplies with different voltages, which is beneficial to improving the test range and test efficiency of the test system.

[0068] In some embodiments, as Figure 1 shown, the test circuit board 100 further includes a power control module 140. The power control module 140 is connected to the test module 110, the test fixture 120, and the isolation module 130, and the programmable test power supply 400 is connected to the power control module 140.

[0069] Specifically, the programmable test power supply 400 provides power for the test fixture 120, the isolation module 130, and the test module 110 through the power control module 140. The power control module 140 can process the programmable test power supply 400, so that the power supply voltage provided by the programmable power supply for the test fixture 120, the isolation module 130, and the test module 110 is stable, which is beneficial to the stable operation of the test system.

[0070] In addition, the setting of the power control module 140 can realize the separate processing of the power supplies of the test fixture 120 and the test module 110, so that the test circuit board 100 can apply different powers to the pressure sensor to be tested for testing.

[0071] In some embodiments, as Figure 3 shown, the test fixture 120 includes a fixture base 121 and a fixture protection cover 122. The fixture base 121 is located on the test circuit board 100. The fixture protection cover 122 is stacked with the fixture base 121 and is rotatably connected. The fixture base 121 is provided with insertion and extraction holes 1211 adapted to the periphery of the connection end of the pressure sensor to be tested, and the fixture protection cover 122 is provided with induction holes 1221 adapted to the induction end of the pressure sensor to be tested. The insertion and extraction holes 1211 and the induction holes 1221 are arranged opposite to each other.

[0072] Specifically, the test fixture 120 is located on the test circuit board 100 for connecting the pressure sensor to be tested. The test fixture 120 includes a fixture base 121 and a fixture protection cover 122. The fixture base 121 is located on the test circuit board 100 and is connected to the isolation chip and the power control module 140. The insertion and extraction hole 1211 on the fixture base 121 is used to connect the pressure sensor to be tested. The pressure sensor to be tested is connected to the insertion and extraction hole 1211 in an insertion and extraction manner. When the pressure sensor to be tested is inserted into the insertion and extraction hole 1211, the fixture base 121 is connected to the pressure sensor to be tested, and further the pressure sensor to be tested is connected to the isolation chip and the power control module 140. The fixture protection cover 122 is arranged in a fitting manner with the plane where the insertion and extraction hole 1211 is located to limit the pressure sensor to be tested in the insertion and extraction hole 1211, so that the pressure sensor to be tested is stably connected to the test fixture 120. The induction hole 1221 on the fixture protection cover 122 is arranged opposite to the insertion and extraction hole 1211 for the pressure sensor to be tested to sense the test environment and meet the test conditions of the pressure sensor to be tested.

[0073] In addition, the fixture protection cover 122 is rotationally connected to the fixture base 121 through a torsion spring. By applying a force to the torsion spring, the fixture protection cover 122 is separated from the fixture base 121, which facilitates the connection between the pressure sensor to be tested and the insertion and extraction hole 1211. When the force applied to the torsion spring is released, the fixture protection cover 122 approaches the fixture base 121 and is arranged in a fitting manner with the fixture base 121, which can limit and protect the pressure sensor to be tested and is beneficial to the stable connection between the pressure sensor to be tested and the test fixture 120.

[0074] It should be noted that the pressure sensor to be tested includes an integrally arranged pressure-sensitive core and a signal processing integrated circuit. The signal processing integrated circuit is used to be connected to the fixture base 121, and the pressure-sensitive core is used to be exposed through the induction hole 1221 to sense the test environment.

[0075] In this embodiment, the test fixture 120 and the pressure sensor to be tested are connected in an insertion and extraction manner through the insertion and extraction hole 1211, which simplifies the connection between the pressure sensor to be tested and the test fixture 120, is beneficial to improving the connection efficiency between the test fixture 120 and the pressure sensor to be tested, and further improves the test efficiency of the test system.

[0076] In some embodiments, such as Figure 2As shown, the test container 200 includes a pressure clamp 210 and a temperature chamber 220. The test circuit board 100 is connected to the pressure clamp 210 and is located inside the pressure clamp 210. The pressure clamp 210 is located inside the temperature chamber 220. The pressure clamp 210 and the temperature chamber 220 together provide a test environment for the pressure sensor under test connected to the test circuit board 100.

[0077] Specifically, the pressure clamp 210 is used to provide different pressure environments for the pressure sensor under test, and the temperature chamber 220 is used to provide different temperature environments for the pressure sensor under test. The pressure clamp 210 and the temperature chamber 220 together provide different temperature and pressure test environments for the pressure sensor under test to obtain test data of the pressure sensor under test at different temperatures and pressures.

[0078] It should be noted that the pressure clamp 210 is a sealed structure to make the pressure environment provided by the pressure clamp 210 stable, and the temperature chamber 220 is also a sealed structure to make the environment provided by the temperature chamber 220 for the pressure sensor under test stable. The host computer 300 is respectively connected to the pressure clamp 210 and the temperature chamber 220 to control and monitor the test environments provided by the pressure clamp 210 and the temperature chamber 220.

[0079] In this embodiment, the test container 200 includes the pressure clamp 210 and the temperature chamber 220 to provide different ambient temperatures and ambient pressures for the pressure sensor under test, and thus provide different test environments, which is beneficial to testing the pressure sensor under test and thus beneficial to improving the test efficiency of the test system.

[0080] In some embodiments, as Figure 4 shown, the pressure clamp 210 includes a clamp body 211 and a clamp cover 212 that are detachably and sealingly connected. A connection pipeline 2111 and a control pipeline 2112 are provided at one end of the clamp body 211 away from the clamp cover 212. The test circuit board 100 is connected to the host computer 300 through the connection pipeline 2111, and the pressure clamp 210 is connected to the host computer 300 through the control pipeline 2112.

[0081] Specifically, the clamp body 211 and the clamp cover 212 are detachably connected to facilitate placing the test circuit board 100 inside the pressure clamp 210. The clamp body 211 and the clamp cover 212 are sealingly connected. When the clamp body 211 is connected to the clamp cover 212, the inside of the pressure clamp 210 is sealed, which is beneficial for the pressure clamp 210 to provide a stable pressure environment.

[0082] In addition, the test circuit board 100 is located within the pressure fixture 210. In order to connect the test circuit board 100 to the host computer 300 and the programmable test power supply 400, connection pipelines 2111 are provided on the pressure fixture 210. One end of each connection pipeline 2111 is located within the pressure fixture 210 for connecting to the power control module 140 and the test module 110 of the test circuit board 100, and the other end is located outside the pressure fixture 210 for connecting to the host computer 300 and the programmable test power supply 400. One end of the control pipeline 2112 is in communication with the interior of the pressure fixture 210, and the other end is used to connect to the host computer 300 so that the host computer 300 can control the internal pressure of the pressure fixture 210.

[0083] It should be noted that the control pipeline 2112 and the host computer 300 are connected through a pressure controller. The host computer 300 controls the pressure controller, and the pressure controller controls the control pipeline 2112, thereby controlling the internal pressure of the pressure fixture 210.

[0084] In this embodiment, the connection pipelines 2111 and the control pipeline 2112 of the pressure fixture 210 are hermetically connected to the fixture body 211 to avoid affecting the sealing performance of the pressure fixture 210. At the same time, it can also enable the test circuit board 100 within the pressure fixture 210 to be connected to the external structure, and facilitate the host computer 300 to control the internal pressure of the pressure fixture 210, which is beneficial to improving the practicality of the pressure fixture 210 and further beneficial to improving the test accuracy of the test system.

[0085] In addition, it should be noted that the pressure fixture 210 is located within the temperature chamber 220. In order to ensure the connection between the pressure fixture 210 and the external structure without affecting the airtightness of the temperature chamber 220, through holes adapted to the outer perimeters of the control pipeline 2112 and the connection pipelines 2111 are provided on the side wall of the temperature chamber 220, so that the control pipeline 2112 and the connection pipelines 2111 can pass through the side wall of the temperature chamber 220 to connect to the external structure. At the same time, a sealing arrangement is made around the through holes on the side wall of the temperature chamber 220. The pressure fixture 210 and the temperature chamber 220 are applicable to the testing of multiple test circuit boards 100. Only need to open the fixture cover 212 of the pressure fixture 210, place different test circuit boards 100 within the pressure fixture 210, and connect them to the connection pipelines 2111 within the pressure fixture 210.

[0086] Based on the above embodiments, a plurality of the pressure clamps 210 are connected to the host computer 300, and a test circuit board 100 is provided in each of the pressure clamps 210. The plurality of pressure clamps 210 are located in a temperature chamber 220, so that the pressure sensors to be tested on the plurality of test circuit boards 100 can be tested simultaneously. Thus, the test efficiency of the test system is further improved, which is beneficial to further improve the batch test efficiency of the pressure sensors to be tested.

[0087] In addition, a plurality of the temperature chambers 220 are connected to the host computer 300, and a plurality of the pressure clamps 210 are provided in each of the temperature chambers 220. A test circuit board 100 is provided in each of the pressure clamps 210, so that the pressure sensors to be tested on more test circuit boards 100 can be tested simultaneously. Thus, the test efficiency of the test system is further improved.

[0088] Based on the same inventive concept, the present application also provides a method for testing a MEMS pressure sensor, which is applied to the MEMS pressure sensor test system as described above. As Figure 5 shown, the test method includes:

[0089] Step S100, installing the pressure sensor to be tested on the test fixture 120 of the test circuit board 100;

[0090] Specifically, a plurality of the pressure sensors to be tested are sequentially installed on a plurality of test fixtures 120 on the test circuit board 100, and one pressure sensor to be tested is installed on one test fixture 120.

[0091] Specifically, first, rotate the fixture protection cover 122 of the test fixture 120 to have a gap with the fixture base 121, then insert the pressure sensor to be tested into the insertion and extraction hole 1211 on the fixture base 121, and preferably rotate the fixture protection cover 122 to fit with the fixture base 121, that is, install the pressure sensor to be tested on the test fixture 120.

[0092] Step S200, placing the test circuit board 100 in the test container 200;

[0093] Specifically, place the test circuit board 100 connected with the pressure sensor to be tested in the test container 200, so that the pressure sensor to be tested is in the test environment provided by the test container 200, and further obtain the test data of the pressure sensor to be tested in this test environment.

[0094] Specifically, the test container 200 includes a pressure clamp 210 and a temperature chamber 220. The pressure clamp 210 is located inside the temperature chamber 220. The connection pipeline 2111 and the control pipeline 2112 of the pressure clamp 210 both pass through the side wall of the temperature chamber 220 and are sealed. First, place the test circuit board 100 inside the pressure clamp 210 and connect the test circuit board 100 to the connection pipeline 2111 of the pressure clamp 210. Then, seal the pressure clamp 210 containing the test circuit board 100. Finally, close the temperature chamber 220. The test circuit board 100 is located in the pressure clamp 210, and the pressure clamp 210 is located inside the temperature chamber 220, so that both the temperature chamber 220 and the pressure clamp 210 can provide an environmental effect on the pressure sensor to be tested.

[0095] Step S300: Operate the host computer 300 to start the test container 200.

[0096] Specifically, the tester operates the host computer 300 to make the test container 200 run, so that the test environment provided by the test container 200 is the target test environment.

[0097] Specifically, control the pressure value inside the pressure clamp 210 to be the target pressure value through the host computer 300, and control the temperature value inside the temperature chamber 220 to be the target temperature value.

[0098] Step S400: Operate the host computer 300 to send a acquisition instruction to the test module 110 of the test circuit board 100 to acquire the test data of the pressure sensor to be tested.

[0099] Specifically, according to the test environment situation inside the test container 200, the tester sends an acquisition instruction to the test module 110 of the test circuit board 100, so that the test module 110 acquires the test data of the pressure sensor to be tested under the current test environment. Furthermore, the host computer 300 can acquire the test data to analyze and obtain the performance parameters of the pressure sensor to be tested in combination with the test environment and the test data.

[0100] In addition, an automatic test software can be set on the host computer 300. After startup, the software can regularly send an acquisition instruction to the test module 110 according to the preset test method in combination with the test environment situation, thereby avoiding the tester's real-time observation of the test environment and being beneficial to improving the test efficiency of the test system.

[0101] In this embodiment, the host computer 300 is used to obtain the test data of the pressure sensor to be tested, and analyze the performance parameters of the pressure sensor to be tested by combining the environmental data of the test environment. On the basis of realizing the batch test of the pressure sensor to be tested, the batch calculation of the performance parameters of the pressure sensor to be tested is realized, greatly improving the test efficiency of the test system.

[0102] Those of ordinary skill in the art should understand that the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the present application is limited to these examples; under the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the embodiments of the present application as described above, and they are not provided in detail for the sake of brevity.

[0103] In addition, for the sake of simplicity of description and discussion, and in order not to make the embodiments of the present application difficult to understand, the well-known power / ground connections of integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. In addition, the devices may be shown in block diagram form in order to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform on which the embodiments of the present application are to be implemented (i.e., these details should be completely within the understanding of those skilled in the art). In the case where specific details (such as circuits) are set forth to describe the exemplary embodiments of the present application, it will be apparent to those skilled in the art that the embodiments of the present application can be implemented without these specific details or with variations of these specific details. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0104] Although the present application has been described in connection with specific embodiments of the present application, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art based on the foregoing description. For example, other memory architectures (such as dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0105] The embodiments of the present application are intended to cover all such alternatives, modifications, and variations that fall within the broad scope of the claims of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application shall be included within the protection scope of the present application.

Claims

1. A MEMS pressure sensor testing system, characterized in that, Comprising: A test circuit board, including a connected test module and a plurality of test fixtures for connecting pressure sensors to be tested, wherein the test module is used to obtain test data of the pressure sensors to be tested; A test container for accommodating the test circuit board to provide a test environment for the pressure sensors to be tested; A host computer, electrically connected to the test container and the test module, for controlling the test container and sending an acquisition instruction to the test module to obtain test data of the pressure sensors to be tested.

2. The MEMS pressure sensor test system according to claim 1, wherein Based on the acquisition instruction of the host computer, the test module obtains test data of a plurality of the pressure sensors to be tested in a preset order and sends them to the host computer.

3. The MEMS pressure sensor testing system according to claim 2, characterized in that, The test module includes a connected main control module and an electrical signal conversion module. The main control module is connected to the test fixture, and the electrical signal conversion module is connected to the host computer. The main control module is used to send an acquisition instruction to the test fixture to obtain test data of the pressure sensors to be tested on the test fixture and send the test data to the electrical signal conversion module. The electrical signal conversion module converts the received test data and then sends it to the host computer; The electrical signal conversion module is used to receive an instruction from the host computer and convert the received instruction and then send it to the main control module.

4. The MEMS pressure sensor testing system according to claim 3, wherein The test circuit board further includes an isolation module. The test fixture is connected to the main control module through the isolation module. The main control module sends an acquisition instruction and obtains test data of the pressure sensors to be tested on the test fixture through the isolation module.

5. The MEMS pressure sensor testing system according to claim 4, wherein It further includes a programmable test power supply, which is connected to the test module, the test fixture and the isolation module to provide power for the pressure sensors to be tested, the test module and the isolation chip; The programmable test power supply is connected to the host computer, and the host computer is used to control the programmable test power supply.

6. The MEMS pressure sensor testing system according to claim 5, wherein The test circuit board further includes a power control module, which is connected to the test module, the test fixture and the isolation module, and the programmable test power supply is connected to the power control module.

7. The MEMS pressure sensor testing system according to claim 1, wherein, The test fixture includes a fixture base and a fixture protection cover. The fixture base is located on the test circuit board. The fixture protection cover is stacked with the fixture base and is rotatably connected. The fixture base is provided with insertion and extraction holes adapted to the periphery of the connection end of the pressure sensor to be tested, and the fixture protection cover is provided with induction holes adapted to the induction end of the pressure sensor to be tested. The insertion and extraction holes and the induction holes are arranged opposite to each other.

8. The MEMS pressure sensor testing system according to claim 1, wherein The test container includes a pressure fixture and a temperature chamber. The test circuit board is connected to the pressure fixture and is located inside the pressure fixture. The pressure fixture is located inside the temperature chamber. The pressure fixture and the temperature chamber jointly provide a test environment for the pressure sensors to be tested connected to the test circuit board.

9. The MEMS pressure sensor testing system according to claim 8, wherein The pressure fixture includes a fixture body and a fixture cover that are detachably and hermetically connected. One end of the fixture body away from the fixture cover is provided with a connection pipeline and a control pipeline. The test circuit board is connected to the host computer through the connection pipeline, and the pressure fixture is connected to the host computer through the control pipeline.

10. A method for testing a MEMS pressure sensor, characterized in that, Applied to the MEMS pressure sensor test system according to any one of claims 1 to 9, the test method includes: Install the pressure sensor to be tested on the test fixture of the test circuit board; Place the test circuit board in the test container; Operate the host computer to start the test container; Operate the host computer to send an acquisition instruction to the test module of the test circuit board to acquire the test data of the pressure sensor to be tested.

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