Miniature LED lamp strip or lamp for transportation industry

Abstract

The present disclosure provides an aesthetically pleasing micro LED lighting strip for a transport vehicle, wherein the aesthetically pleasing micro LED lighting strip comprises: a substrate; a plurality of miniature LED splicing blocks; an adhesive tape; a protective layer; and a connecting member for connecting the micro LED tiles integrated into a transport vehicle to provide aesthetic illumination on the exterior of the vehicle.

Description

[0001] Background Art and Technical Field

[0002] The present disclosure generally relates to an aesthetically pleasing micro LED lighting strip for a transportation vehicle.

[0003] The transportation industry is any industry, business, or institution that transports people or property from one place to another (whether by rail, highway, air, or water), and all associated operations and services in addition thereto; and also includes the storage or warehousing of goods or property, as well as the repair, parking, rental, maintenance, or cleaning of vehicles. The exterior of a vehicle can be the front, rear, side, top, or underside of any vehicle. In the transportation industry, there is a need for exterior aesthetic lighting, which requires a wide range of sizes, shapes, colors, etc., and needs to be attached to all areas of the exterior of the vehicle.

[0004] Currently, aesthetic lighting is provided by LEDs or bulbs, which are expensive and may be too bulky for some exterior components of the vehicle, resulting in limited locations where the aesthetic lighting can be positioned on the exterior of the vehicle.

[0005] Finally, the current aesthetic lighting in the transportation industry generates a large amount of heat, which may damage the aesthetic lighting or the main body parts or components of the vehicle over time. These aesthetic lighting devices also use a large amount of electricity to generate aesthetic lighting, which may pose a problem for vehicle owners.

[0006] Therefore, there is a need in the prior art to provide an aesthetically pleasing micro LED lighting strip for a transportation vehicle. Summary of the Invention

[0007] The present invention relates to a method of integrating an aesthetically pleasing micro LED lighting strip for a transportation vehicle, the method comprising: having a micro LED strip having a substrate, a plurality of micro LED splicing blocks, and a protective layer; having an adhesive strip in the micro LED strip; having a connecting member for connecting the micro LED splicing blocks, and wherein the micro LED lighting strip is attached to the transportation vehicle by the adhesive strip to provide the required lighting. Brief Description of the Drawings

[0008] Figure 1: Illustrates the integration of transferred microdevices and electro-optic thin film devices in a hybrid structure according to one embodiment.

[0009] Figure 2: Illustrates an embodiment of a rigid flat micro LED for external strip lighting

[0010] Figure 3: Illustrates a flexible flat micro LED for external strip lighting of a vehicle according to one embodiment.

[0011] Figure 4: Illustrate the fabrication of a micro-LED flexible external strip unit according to an embodiment.

[0012] Figure 5: Illustrate a micro-LED having a substrate colored to match the color of the vehicle and positioned on the vehicle according to an embodiment.

[0013] Figure 6: Illustrate a micro-LED strip having a transparent substrate to match the transparent glass of the vehicle according to an embodiment.

[0014] Figure 7: Illustrate a micro-LED strip having a colored pixel array in an external strip lighting unit for a vehicle according to an embodiment.

[0015] Figure 8: Illustrate a micro-LED having a colored pixel array integrated into the attachment of the body part of a vehicle according to an embodiment. Detailed Description

[0016] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which like reference numerals throughout several figures denote like elements and in which example embodiments are shown. However, the embodiments of the claims may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The examples set forth herein are non-limiting examples and are merely examples among other possible examples. The present disclosure describes a structure, system, and method for integrating micro-LED internal and external lighting into a transportation vehicle.

[0017] Figure 1AShows an example of integrating the microdevice 106 to be transferred with the electro-optic thin film device 112 in a hybrid structure. This is an example of an integrated micro-LED tile, which is later picked up and placed into an array of tiles. It should be clear to those skilled in the art that there are many ways to produce micro-LED tiles and integrate them into an array of tiles, such as in US20160218143A1 where microdevices are integrated into a system substrate. In multiple hybrid structure embodiments, an array of microdevices 106 is transferred onto a receptor substrate 102 and contact pads 104, and the thin film electro-optic device is integrated into the receptor substrate 102 and contact pads 104. The microdevice 106 can be transferred and bonded to the bond pads 104 of the receptor substrate 100. In one case, a dielectric layer 108 is formed over the substrate 102 to cover the exposed electrodes and conductive layers. Lithography and etching can be used to pattern the dielectric layer 108. Then, a conductive layer 110 is deposited and patterned to form the bottom electrode of the thin film electro-optic device 112. The dielectric layer 108 can be eliminated if there is no risk of unwanted coupling between the bottom electrode 110 and other conductive layers in the receptor substrate. However, this dielectric layer can also be used as a planarization layer to make the electro-optic device 112 easier to fabricate. A bulk layer 114 is deposited over the substrate 102 to cover the electrodes 110 and the edges of the microdevices 106. Then, the thin film electro-optic device 112 is formed over this structure. An organic light emitting diode (OLED) device is an example of a thin film electro-optic device, which can be formed using different techniques such as but not limited to shadow masking, lithography, and printed patterning. Finally, the top electrode 118 of the electro-optic thin film device 112 is deposited and patterned if needed. In embodiments where the thickness of the microdevice 106 is significantly high, cracking or other structural problems may occur within the bottom electrode 110. In these embodiments, the planarization layer can be used with or without the dielectric layer 108 to solve this problem.

[0018] In another embodiment, the microdevice 106 can have a device electrode 116. This electrode can be common among other microdevices 106 in the system substrate. In this case, the planarization layer (if present) and / or the bulk structure 114 cover the electrode 116 to avoid any short circuit between the electro-optic device 112 and the device electrode 116.

[0019] Figure 1BIllustrated is a structure in which devices are shared among several pixels (or sub - pixels) after post - processing to deposit a common electrode and a color - conversion layer. Here, the micro - device 106 is not fully patterned, but the horizontal situation is engineered such that the contacts 104 define the areas allocated to each pixel. The system substrate 102 has contact pads 104 and the donor substrate has micro - devices 106. After transferring the micro - devices 106 to the system substrate 102, post - processing such as depositing a common electrode 120, a color - conversion layer 122, color filters, etc. can be performed. However, the methods described in this disclosure and other possible methods can be used.

[0020] After forming the active regions, the described color - conversion layer can be added to the pixel (or sub - pixel) active regions. If the active regions of the pixels (or sub - pixels) are covered by a reflective layer, this can provide a higher fill factor and higher performance and avoid color leakage from the side pixels (or sub - pixels). In another embodiment, the micro - device 106 is grown on a buffer / sacrificial layer.

[0021] Figure 2 (including Figure 2A and Figure 2B ) shows an embodiment of a rigid flat micro - LED for external strip lighting. Figure 2AShows a top view of an embodiment of a rigid flat micro-LED for external strip lighting of a vehicle. The figure shows a micro-LED strip 201, which may include a rigid substrate 202, a series of micro-LED segments 204, an adhesive tape 206, and a protective layer 208 to produce external lighting for a vehicle. The micro-LED strip 201 may contain a series of serially connected micro-LED segments 204, which can produce light visible as aesthetic lighting in any color or made to be programmable in color. The micro-LED strip 201 can be attached to the vehicle via the adhesive tape. The micro-LED strip 201 can be produced in any length to provide the desired aesthetic lighting. The micro-LED strip 201 may contain micro-LED segments 204 produced in multiple sizes to increase the width of the micro-LED strip 201 to provide the desired aesthetic lighting. In some embodiments, the micro-LED strip 201 may contain micro-devices such as micro-LED segments 204, contact pads, circuit layers, and the rigid substrate 202, and be encapsulated in the protective layer 208. The rigid substrate 202 can be made of glass, silicon, plastic, or any other common material. The rigid substrate 202 may also have active electronic components such as, but not limited to, transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate. In some cases, the rigid substrate 202 can be a rigid substrate 202 having electrical signal rows and electrical signal columns. In one example, the rigid substrate 202 can be a sapphire substrate on which an LED layer is grown monolithically on top, and the rigid substrate 202 can be a backplane having a circuitry for driving the micro-LED devices. The micro-LED segment 204 contains a plurality of micro-LED (light-emitting diode) arrays, where each micro-LED serves as a pixel and can be driven to emit light. The micro-LED includes a number of micro-LEDs that are self-emitting per display pixel. The micro-LED is a modular technology. For example, the panel consists of tiny red, green, and blue LEDs and is connected to form a larger whole. In some embodiments, the micro-LED segments 204 can be produced in multiple sizes to increase the width of the micro-LED strip 201. The adhesive tape 206 can be a tape having a substance such as glue, starch, paste, adhesive, etc., which binds the micro-LED strip to another material by adhering to the surfaces of the micro-LED strip 201 and the other material to provide aesthetic lighting, the other material such as the exterior of a vehicle. The protective layer 208 can be a casing for protecting the micro-LED strip 201 from environmental elements or conditions. The protective layer 208 can be made of glass, silicon, plastic, etc., where an anti-glare protective film covers the micro-LED strip 201 and the micro-LED segments 204. For example, the protective layer 208 can be silicon dioxide SiO2 or another suitable material that can be deposited over the micro-LED segments 204 and / or the micro-LED strip 201 via physical vapor deposition, chemical vapor deposition, or spin coating processes.

[0022] Figure 2B Shows a cross-sectional view of an embodiment of a rigid flat micro-LED for external strip lighting of a vehicle. The micro-LED strip 201 includes an adhesive strip 206 that is positioned on the bottom of the micro-LED strip 201, below the rigid substrate 202, but is connected or bonded to the rigid substrate. The rigid substrate 202 is positioned on top of the adhesive layer 206, and a series of individual micro-LED patches 204 are positioned on top of the substrate 202, and the rigid substrate is in contact with the protective layer 208 through the spaces between the micro-LED patches 204. The micro-LED patches 204 are positioned on top of the substrate 202 and are encapsulated in the protective layer 208, which is positioned on top of the micro-LED patches 204 and the substrate 202.

[0023] Figure 3 shows an embodiment of a flexible flat micro-LED for external strip lighting Figure 3AShows a top view of an embodiment of a flexible flat micro-LED for external strip lighting of a vehicle. The figure shows a micro-LED strip 301, which may include a flexible substrate 302, a series of micro-LED patch blocks 304, an adhesive tape 306, and a protective layer 308 to produce external lighting for a vehicle. The micro-LED strip 301 may contain a series of serially-connected micro-LED patch blocks 304, which series may produce light visible as aesthetic lighting in any color or made programmable in color. The micro-LED strip 301 may be attached to a vehicle via the adhesive tape 306. The micro-LED strip 301 may be produced in any length to provide the desired aesthetic lighting. The micro-LED strip 301 may contain micro-LED patch blocks 304 produced in multiple sizes to increase the width of the micro-LED strip 301 to provide the desired aesthetic lighting. In some embodiments, the micro-LED strip 301 may contain micro-devices such as micro-LED patch blocks 304, contact pads, circuit layers, and the flexible substrate 302, and be encapsulated in the protective layer 308. The flexible substrate 302 may be made of glass, silicon, plastic, or any other common material. The flexible substrate 302 may also have active electronic components such as, but not limited to, transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate. In some cases, the flexible substrate 302 may be a flexible substrate having electrical signal rows and electrical signal columns. In one example, the flexible substrate 302 may be a sapphire substrate with an LED layer grown monolithically on top of it, and the flexible substrate 302 may be a backplane having circuitry for driving the micro-LED devices. The micro-LED patch block 304 contains a plurality of micro-LED (light-emitting diode) arrays, where each micro-LED serves as a pixel and may be driven to emit light. The micro-LED includes a number of micro-LEDs that are self-emitting per display pixel. The micro-LED is a modular technology. For example, a panel consists of a series of tiny red, green, and blue LEDs and is connected together to form a larger whole. In some embodiments, the micro-LED patch blocks 304 may be produced in multiple sizes to increase the width of the micro-LED strip 301. In some embodiments, the micro-LED patch blocks 304 may be produced to be flexible, twistable, stretchable, etc. to match or exceed the flexibility of the micro-LED strip 304. The adhesive tape 306 may be a tape having a substance such as glue, starch, paste, adhesive, etc., which binds the micro-LED strip to another material by adhering to the surfaces of the micro-LED strip 301 and the other material to provide aesthetic lighting, the other material such as the exterior of a vehicle. The protective layer 308 may be a housing for protecting the micro-LED strip 301 from environmental elements or conditions. The protective layer 308 may be made of glass, silicon, plastic, etc., where an anti-glare protective film covers the micro-LED strip 301 and the micro-LED patch blocks 304.For example, the protective layer 308 can be silicon dioxide SiO2 or another suitable material that can be deposited over the micro-LED tiles 304 and / or the micro-LED strip 301 by physical vapor deposition, chemical vapor deposition, or spin coating processes. The protective layer 308 can be formed to match or enhance the flexibility of the micro-LED strip 301. In some embodiments, the protective layer 308 can cover individual micro-LED tiles 304 rather than the entire micro-LED strip to enhance the flexibility of the micro-LED strip 301. Figure 3B A cross-sectional view of an embodiment of a flexible flat micro-LED for external strip lighting for a vehicle is shown. The micro-LED strip 301 includes an adhesive strip 306 that is positioned on the bottom of the micro-LED strip 301, below the rigid substrate 302, but is connected or bonded to the rigid substrate. The rigid substrate 302 is positioned on top of the adhesive layer 306, and a series of individual micro-LED tiles 304 are positioned on top of the substrate 302, and the rigid substrate contacts the protective layer 308 through the spaces between the micro-LED tiles 304. The micro-LED tiles 304 are positioned on top of the substrate 302 and are encapsulated in the protective layer 308, which is positioned on top of the micro-LED tiles 304 and the substrate 302.

[0024] Figure 4Shows an implementation of fabricating a micro-LED flexible external tape unit. The figure shows a roll-to-roll manufacturing method of micro-LEDs, in which the micro-LED splicing block 406 is attached to the flexible substrate from the supply reel 402. The roll-to-roll attachment of the micro-LED splicing block on the flexible substrate 401 can be a process of creating a micro-LED tape on a roll of flexible substrate such as glass, silicon, plastic, etc. Roll-to-roll processing is a manufacturing method used in manufacturing, which embeds, coats, prints, or laminates on the flexible wound substrate material when it is continuously supplied from one roll to another roll according to different applications. The roll-to-roll attachment of the micro-LED splicing block on the flexible substrate 401 may include a supply reel of the flexible substrate 402, a take-up reel 404, a plurality of micro-LED splicing blocks 406, a die attachment station 408, the attachment 410 or bonding of the micro-LED splicing block 406 to the flexible substrate on the die attachment station 408. The supply reel of the flexible substrate 402 provides a continuous supply of the flexible substrate to the die attachment station 408 by continuously unwinding the flexible substrate onto the assembly line and then performing the attachment 410 of the micro-LED splicing block 406. The take-up reel 404 continuously takes up the completed micro-LED tape containing the micro-LED splicing blocks 406 attached or bonded to the flexible substrate. The micro-LED splicing block 404 is attached to the flexible substrate provided by the supply reel of the flexible substrate 202 through the attachment 410 on the die attachment station 408. The micro-LED splicing block 404 contains a plurality of micro-LED (light-emitting diode) arrays, where each micro-LED serves as a pixel and can be driven to emit light. The micro-LED includes a number of micro-LEDs that are self-luminous per display pixel. The micro-LED is a modular technology. For example, the panel consists of a series of tiny red, green, and blue LEDs and is connected together to form a larger whole. In some embodiments, the micro-LED splicing block 404 can be produced in multiple sizes to increase the width of the micro-LED tape. In some embodiments, the micro-LED splicing block 404 can be produced to be flexible, twistable, stretchable, etc., to match or exceed the flexibility of the micro-LED tape 404. The die attachment station 408 can assist the bonding process of the micro-LED splicing block 406 to the flexible substrate by applying heat and pressure for the attachment 410 to fix the micro-LED splicing block 406 to the flexible substrate. The attachment 410 can be the bonding or fixing of the micro-LED splicing block 406 to the flexible substrate, which may include a predetermined amount of time, pressure, and heat supplied by the die attachment station 408. In some embodiments, the process may include providing a protective layer above the micro-LED splicing block 406, which can be a cover for protecting the micro-LED tape from environmental elements or conditions. The protective layer can be made of glass, silicon, plastic, etc., where an anti-glare protective film covers the micro-LED tape and the micro-LED splicing block 406.For example, the protective layer may be silicon dioxide SiO2 or another suitable material that can be deposited over the micro-LED die 406 and / or the micro-LED strip by physical vapor deposition, chemical vapor deposition, or spin coating processes.

[0025] FIG. 5 (including Figure 5A and Figure 5B ) shows embodiments of micro-LEDs with a colored substrate that matches the color of the carrier. Figure 5AShows an embodiment of a micro-LED having a substrate colored to match the color of a vehicle. The figure shows a colored micro-LED strip 501, which includes a rigid or flexible substrate 502, a colored substrate 504, and a series of micro tiles 506 positioned on the colored substrate 504. The colored micro-LED strip 501 can include a flexible or rigid substrate 502, a series of micro-LED tiles 506, an adhesive strip, and a protective layer to produce external aesthetic lighting for a vehicle. The micro-LED strip 501 can contain a series of serially connected micro-LED tiles 506 that can produce light visible as aesthetic lighting in any color or made to be programmable colors. The colored micro-LED strip 501 can be attached to the vehicle by an adhesive strip that can be the same color as the vehicle. The colored micro-LED strip 501 can be produced in any length to provide the desired aesthetic lighting. The colored micro-LED strip 501 can contain micro-LED tiles 506 produced in multiple sizes to increase the width of the colored micro-LED strip 501 to provide the desired aesthetic lighting. In some embodiments, the colored micro-LED strip 501 can contain micro-devices encapsulated in a protective layer, such as micro-LED tiles 506, contact pads, circuit layers, and a rigid or flexible colored substrate 502. The rigid or flexible colored substrate 502 can be made of glass, silicon, plastic, or any other common material. The rigid or flexible colored substrate 502 can be produced in multiple colors to match the multiple colors of a vehicle, such as black, white, blue, red, silver, etc. The rigid or flexible colored substrate 502 allows the colored micro-LED strip 501 to blend into the color of the vehicle because the color of the rigid or flexible colored substrate 502 matches the color of the vehicle. The rigid or flexible colored substrate 502 can also have active electronic components, such as but not limited to transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate. In some cases, the rigid or flexible colored substrate 502 can be a rigid or flexible colored substrate 502 having electrical signal rows and electrical signal columns. In one example, the rigid or flexible colored substrate 502 can be a sapphire substrate on which an LED layer is monolithically grown on top, and the rigid or flexible colored substrate 502 can be a backplane having circuitry for driving the micro-LED devices. The color of the vehicle 510 can be a characteristic of the vehicle that produces a different perception on the eye due to the way the object reflects or emits light, such as black, white, blue, red, silver, etc. The micro-LED tile 506 contains multiple micro-LED (light-emitting diode) arrays, where each micro-LED serves as a pixel and can be driven to emit light. The micro-LED includes several micro-LEDs that are self-luminous per display pixel. The micro-LED is a modular technology. For example, a panel consists of a series of tiny red, green, and blue LEDs and is connected together to form a larger whole.In some embodiments, the micro-LED splicing blocks 506 can be produced in multiple sizes to increase the width of the colored micro-LED strip 501. In some embodiments, the micro-LED splicing blocks 506 can be produced to be flexible, twisted, stretched, etc., to match or exceed the flexibility of the colored micro-LED strip 506. The vehicle 508 can be something for transporting people or goods, especially on land, such as cars, sedans, trucks, carts, buses, vans, SUVs, motorcycles, etc., such as a first emergency response vehicle like a police car, a fire truck, an ambulance, etc., and off-road vehicles such as ATVs (All-Terrain Vehicles), UTVs (Utility Task Vehicles), sand buggies, dune buggies, endurance off-road vehicles or off-road motorcycles or off-road locomotives, trail bikes, etc. Figure 5B An embodiment is shown of a micro-LED with a substrate colored to match the color of the vehicle, positioned on the vehicle. This figure shows the colored micro-LED strip 501 positioned on the vehicle 510 and colored to match the color of the vehicle 508. The colored micro-LED strip 501 can include a flexible or rigid substrate 502, a series of micro-LED splicing blocks 506, an adhesive strip, and a protective layer to produce exterior aesthetic lighting for the vehicle. The micro-LED strip 501 can contain a series of serially connected micro-LED splicing blocks 506, and this series of serially connected micro-LED splicing blocks can produce light visible as aesthetic lighting in any color or made to be programmable in color. The colored micro-LED strip 501 can be attached to the vehicle by an adhesive strip that can be the same color as the vehicle. The colored micro-LED strip 501 can be produced in any length to provide the desired aesthetic lighting. The colored micro-LED strip 501 can contain micro-LED splicing blocks 506 produced in multiple sizes to increase the width of the colored micro-LED strip 501 to provide the desired aesthetic lighting. In some embodiments, the colored micro-LED strip 501 can contain micro-devices wrapped in a protective layer, such as micro-LED splicing blocks 506, contact pads, circuit layers, and a rigid or flexible colored substrate 502. The color of the vehicle 510 can be the property of the vehicle that produces a different perception on the eye due to the way the object reflects or emits light, such as black, white, blue, red, silver, etc. The vehicle 508 can be something for transporting people or goods, especially on land, such as cars, sedans, trucks, carts, buses, vans, SUVs, motorcycles, etc., such as a first emergency response vehicle like a police car, a fire truck, an ambulance, etc., and off-road vehicles such as ATVs (All-Terrain Vehicles), UTVs (Utility Task Vehicles), sand buggies, dune buggies, endurance off-road vehicles or off-road motorcycles or off-road locomotives, trail bikes, etc.

[0026] Figure 6 shows an embodiment of a micro-LED strip with a transparent substrate to match the transparent glass of the vehicle. Figure 6AShows embodiments of a rigid or flexible micro-LED strip with a transparent substrate that matches the transparency of the glass or window of a vehicle. The transparent micro-LED strip 601 may include a flexible or rigid substrate 602, a series of micro-LED patch blocks 604, an adhesive tape 606, and a protective layer 608 to produce aesthetic lighting for the exterior of the vehicle. The transparent micro-LED strip 601 may contain a series of serially connected micro-LED patch blocks 604 that can produce light visible as aesthetic lighting in any color or made programmable in color. The transparent micro-LED strip 601 may be attached to the vehicle via the adhesive tape 606. The transparent micro-LED strip 601 may be produced in any length to provide the desired aesthetic lighting. The transparent micro-LED strip 601 may contain micro-LED patch blocks 604 produced in multiple sizes to increase the width of the colored micro-LED strip 601 to provide the desired aesthetic lighting. In some embodiments, the transparent micro-LED strip 601 may contain micro-devices such as micro-LED patch blocks 604, contact pads, circuit layers, and a rigid or flexible transparent substrate 602 and be encapsulated in a protective layer 608. The transparent substrate 602 may be made of glass, silicon, plastic, or any other common material. The transparent substrate 602 may be a flexible transparent substrate 602 or a rigid transparent substrate 602. The transparent substrate 602 allows the transparent micro-LED strip 601 to blend into the color of the vehicle because the transparency of the rigid or flexible transparent substrate 602 will visually match the color of the vehicle. The transparent substrate 602 may also have active electronic components such as, but not limited to, transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate. In some cases, the rigid or flexible transparent substrate 602 may be a rigid or flexible transparent substrate 602 with rows and columns of electrical signals. In one example, the rigid or flexible transparent substrate 602 may be a sapphire substrate on which an LED layer is monolithically grown on top, and the rigid or flexible transparent substrate 602 may be a backplane with a circuit system for driving the micro-LED devices. The micro-LED patch block 606 contains multiple micro-LED (light-emitting diode) arrays, where each micro-LED serves as a pixel and can be driven to emit light. The micro-LED includes a number of micro-LEDs that are self-emitting per display pixel. The micro-LED is a modular technology. For example, a panel consists of a series of tiny red, green, and blue LEDs and is connected together to form a larger whole. In some embodiments, the micro-LED patch block 606 may be produced in multiple sizes to increase the width of the transparent micro-LED strip 601. In some embodiments, the micro-LED patch block 606 may be produced to be flexible, twistable, stretchable, etc. to match or exceed the flexibility of the transparent micro-LED strip 606.The adhesive tape 606 can be a tape with a transparent substance such as glue, starch, paste, adhesive, etc., which binds the transparent micro-LED tape 601 to another material by adhering to the surfaces of the transparent micro-LED tape and the other material to provide aesthetic lighting, the other material such as the exterior of a vehicle. The protective layer 608 can be a casing for protecting the transparent micro-LED tape 601 from environmental elements or conditions. The protective layer 608 can be made of a transparent material such as glass, silicon, plastic, etc., where an anti-glare protective film covers the transparent micro-LED tape 601 and the micro-LED splicing blocks 604. For example, the protective layer 608 can be silicon dioxide SiO2 or another suitable material that can be deposited over the micro-LED splicing blocks 604 and / or the transparent micro-LED tape 601 by physical vapor deposition, chemical vapor deposition, or spin coating processes. Figure 6B A cross-sectional view of an embodiment of a transparent micro-LED tape 601 for external strip lighting of a vehicle is shown. The transparent micro-LED tape 601 includes an adhesive tape 606 that is positioned on the bottom of the transparent micro-LED tape 601, below the transparent substrate 602, but is connected or bonded to the transparent substrate. The transparent substrate 602 is positioned on top of the transparent adhesive layer 606, and a series of individual micro-LED splicing blocks 604 are positioned on top of the transparent substrate 602, and the transparent substrate is in contact with the transparent protective layer 608 through the spaces between the micro-LED splicing blocks 604. The micro-LED splicing blocks 604 are positioned on top of the transparent substrate 602 and are encapsulated in the transparent protective layer 608, which is positioned on top of the micro-LED splicing blocks 604 and the transparent substrate 602.

[0027] Figure 7 shows an embodiment of a micro-LED tape with a colored pixel array in an external strip lighting unit for a vehicle. Figure 7AA top view of an embodiment of a flat micro-LED with a colored pixel array for external strip lighting of a vehicle is shown. The figure shows a micro-LED strip 701, which may include a substrate 702, a series of micro-LED splicing blocks 704, an adhesive tape 706, and a protective layer 708 to produce external lighting for a vehicle. The micro-LED strip 701 may contain a series of serially connected micro-LED splicing blocks 704, which can produce light visible as aesthetic lighting in any color or made to be programmable in color. The micro-LED strip 701 can be attached to the vehicle through the adhesive tape 706. The micro-LED strip 701 can be produced in any length to provide the desired aesthetic lighting. The micro-LED strip 701 may contain micro-LED splicing blocks 704 produced in multiple sizes to increase the width of the micro-LED strip 701 to provide the desired aesthetic lighting. In some embodiments, the micro-LED strip 701 may contain micro-devices, such as micro-LED splicing blocks 704, contact pads, circuit layers, and the substrate 702, and is encapsulated in the protective layer 708. The substrate 702 can be made of glass, silicon, plastic, or any other common material. The substrate 702 may also have active electronic components, such as but not limited to transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate. In some cases, the substrate 702 can be a substrate 702 with electrical signal rows and electrical signal columns. In one example, the substrate 702 can be a sapphire substrate on which an LED layer is monolithically grown on top, and the substrate 702 can be a backplane with a circuit system for driving the micro-LED devices. In some embodiments, the substrate 702 can be a flexible or rigid substrate 702. In some embodiments, the substrate 702 can be transparent or colored to match the external or internal components of the vehicle. The micro-LED splicing block 704 contains a plurality of micro-LED (light-emitting diode) arrays, where each micro-LED serves as a pixel and can be driven to emit light. The micro-LED includes several micro-LEDs that are self-luminous per display pixel. The micro-LED is a modular technology. For example, the panel consists of a series of tiny red, green, and blue LEDs and is connected together to form a larger whole. The micro-LED splicing block 704 may contain a colored pixel array to allow each micro-LED splicing block 704 to produce different color patterns or produce different color patterns within each micro-LED splicing block 704. In some embodiments, the micro-LED splicing blocks 704 can be individually controlled to produce various color patterns on a single micro-LED strip 701. In some embodiments, the micro-LED splicing blocks 704 can be produced in multiple sizes to increase the width of the micro-LED strip 701. In some embodiments, the micro-LED splicing blocks 704 can be produced to be flexible, twisted, stretched, etc., to match or exceed the flexibility of the micro-LED strip 704.The adhesive tape 706 can be a tape with substances such as glue, starch, paste, adhesive, etc., which binds the micro-LED tape 701 to another material by adhering to the surfaces of the micro-LED tape and the other material to provide aesthetic lighting, where the other material is such as the exterior of a vehicle. The protective layer 708 can be a casing for protecting the micro-LED tape 701 from environmental elements or conditions. The protective layer 708 can be made of glass, silicon, plastic, etc., where an anti-glare protective film covers the micro-LED tape 701 and the micro-LED splicing blocks 704. For example, the protective layer 708 can be silicon dioxide SiO2 or another suitable material that can be deposited over the micro-LED splicing blocks 704 and / or the micro-LED tape 701 by physical vapor deposition, chemical vapor deposition, or spin coating processes. The protective layer 708 can be produced to match or enhance the flexibility of the micro-LED tape 701. In some embodiments, the protective layer 708 can cover individual micro-LED splicing blocks 704 instead of covering the entire micro-LED tape to enhance the flexibility of the micro-LED tape 701. Figure 7B A cross-sectional view of an embodiment of a flat micro-LED with a colored pixel array for external strip lighting of a vehicle is shown. The micro-LED tape 701 includes an adhesive tape 706 that is positioned on the bottom of the micro-LED tape 701, below the rigid substrate 702, but is connected or bonded to the rigid substrate. The rigid substrate 702 is positioned on top of the adhesive layer 706, and a series of individual micro-LED splicing blocks 704 are positioned on top of the substrate 702, and the rigid substrate contacts the protective layer 708 through the spaces between the micro-LED splicing blocks 704. The micro-LED splicing blocks 704 are positioned on top of the substrate 702 and are wrapped in the protective layer 708, which is positioned on top of the micro-LED splicing blocks 704 as well as the substrate 702.

[0028] Figure 8 shows an embodiment of a micro-LED with a colored pixel array integrated into the attachment of the body parts of a vehicle. Figure 8AShows an embodiment of an integrated micro-LED strip 801 encapsulated in the body parts, components, accessories, etc. of a vehicle. The integrated micro-LED strip 801 may include a rigid substrate 802, micro-LED tiles 806, and a protective layer to generate external lighting for the vehicle. The micro-LED strip 801 may contain a series of serially connected micro-LED tiles 804 that can generate light visible as aesthetic lighting in any color or made to be programmable in color. The micro-LED strip 801 can be attached to the vehicle by being embedded or wrapped in the body parts, components, accessories, etc. of the vehicle. The micro-LED strip 801 can be produced in any length to provide the desired aesthetic lighting. The micro-LED strip 801 may contain micro-LED tiles 804 produced in multiple sizes to increase the width of the micro-LED strip 801 to provide the desired aesthetic lighting. In some embodiments, the micro-LED strip 801 may contain micro-devices such as micro-LED tiles 804, contact pads, circuit layers, and substrate 802 and be wrapped in a protective layer. The rigid substrate 802 can be made of glass, silicon, plastic, or any other common material. The rigid substrate 802 may also have active electronic components such as, but not limited to, transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate. In some cases, the rigid substrate 802 can be a substrate with electrical signal rows and electrical signal columns. In one example, the rigid substrate 802 can be a sapphire substrate with an LED layer grown monolithically on top of it, and the rigid substrate 802 can be a backplane with a circuit system for driving the micro-LED devices. In some embodiments, the rigid substrate 802 can be a colored rigid substrate 802 that matches the color of the body parts, components, accessories, etc. of the vehicle. The micro-LED tile 804 contains multiple micro-LED (light-emitting diode) arrays, where each micro-LED serves as a pixel and can be driven to emit light. The micro-LEDs include several micro-LEDs that are self-luminous per display pixel. The micro-LED is a modular technology. For example, a panel consists of a series of tiny red, green, and blue LEDs and is connected together to form a larger whole. The micro-LED tile 804 may contain an array of colored pixels to allow each micro-LED tile 804 to generate different color patterns or different color patterns within each micro-LED tile 804. In some embodiments, the micro-LED tiles 804 can be individually controlled to generate various color patterns on a single micro-LED strip 801. In some embodiments, the micro-LED tiles 804 can be produced in multiple sizes to increase the width of the micro-LED strip 801. In some embodiments, the micro-LED tiles 804 can be produced to be flexible, twistable, stretchable, etc. to match or exceed the flexibility of the micro-LED strip 804. Figure 8BA top view of an integrated micro-LED strip 801 encapsulated in a body part, component, accessory, etc. of a vehicle is shown. The integrated micro-LED strip 801 may include a rigid substrate 802, micro-LED mosaics 806, and a protective layer to generate external lighting for the vehicle. The micro-LED strip 801 may contain a series of serially-connected micro-LED mosaics 804 that can generate light visible as aesthetic lighting in any color or made programmable in color. The micro-LED strip 801 may be attached to the vehicle by being embedded or wrapped in a body part, component, accessory, etc. of the vehicle. The micro-LED strip 801 may be produced in any length to provide the desired aesthetic lighting. The micro-LED strip 801 may contain micro-LED mosaics 804 produced in multiple sizes to increase the width of the micro-LED strip 801 to provide the desired aesthetic lighting. In some embodiments, the micro-LED strip 801 may contain micro-devices, such as micro-LED mosaics 804, contact pads, circuit layers, and substrate 802, and be wrapped in a protective layer. The color of the vehicle 804 may be a property of the vehicle that produces different sensations on the eye due to the way an object reflects or emits light, such as black, white, blue, red, silver, etc. The body part 808 of the vehicle may be any external or internal component, accessory, or section of the vehicle. For example, the external body part 808 may be, but is not limited to, a door, hood, trunk, bumper, bumper end, fender panel, inner fender, fender, front apron, outer door panel, sill plate, dog leg, wheel arch, wheel well, rear quarter panel, fender extension, front quarter panel, firewall, fender flare, etc. For example, the internal body part 808 may be, but is not limited to, an instrument panel, steering wheel, horn, headset, glove box, door handle, seat, headrest, carpet, hardwood floor, shin pad, ceiling, door trim, door opening trim, door seal strip, sill trim, assist grip, sun visor, rear parcel shelf, etc. Figure 8CShows a cross-sectional view of an integrated micro-LED strip 801 encapsulated within the body parts, components, accessories, etc. of a vehicle. The figure shows a micro-LED mosaic block 806 positioned on top of a rigid substrate 802 and encapsulated or wrapped within the body part 808 of the vehicle. The micro-LED mosaic block 804 contains multiple arrays of micro-LEDs (light-emitting diodes), where each micro-LED serves as a pixel and can be driven to emit light. The micro-LEDs include a number of micro-LEDs that are self-emitting per display pixel. Micro-LEDs are a modular technology. For example, the panel consists of a series of tiny red, green, and blue LEDs and is connected together to form a larger whole. The micro-LED mosaic block 804 can contain an array of colored pixels to allow each micro-LED mosaic block 804 to produce different color patterns or different color patterns within each micro-LED mosaic block 804. In some embodiments, the micro-LED mosaic blocks 804 can be individually controlled to produce various color patterns on a single micro-LED strip 801. In some embodiments, the micro-LED mosaic blocks 804 can be produced in multiple sizes to increase the width of the micro-LED strip 801. In some embodiments, the micro-LED mosaic blocks 804 can be produced to be flexible, twisted, stretched, etc. to match or exceed the flexibility of the micro-LED strip 804. The rigid substrate 802 can be made of glass, silicon, plastic, or any other commonly used material. The rigid substrate 802 can also have active electronic components, such as but not limited to transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate. In some cases, the rigid substrate 802 can be a substrate with electrical signal rows and electrical signal columns. In one example, the rigid substrate 802 can be a sapphire substrate with an LED layer grown monolithically on top of it, and the rigid substrate 802 can be a backplane with a circuit system for driving the micro-LED devices. In some embodiments, the rigid substrate 802 can be a colored rigid substrate 802 that matches the color of the body parts, components, accessories, etc. of the vehicle. The color of the vehicle 810 can be the property of the vehicle that produces different sensations on the eye due to the way the object reflects or emits light, such as black, white, blue, red, silver, etc. The body part 808 of the vehicle can be any external or internal component, accessory, or section of the vehicle. For example, the external body part 808 can be but not limited to doors, hoods, trunks, bumpers, bumper ends, curtain panels, inner fenders, fenders, front aprons, outer lower door panels, sill plates, doglegs, wheel arch panels, wheel covers, rear quarter panels, fender extensions, front quarter panels, firewalls, fender flares, etc. For example, the internal body part 808 can be but not limited to instrument panels, steering wheels, horns, headphones, glove boxes, door handles, seats, headrests, carpets, hardwood floors, shin pads, ceilings, door trim, door opening trim, door seals, sill trim, assist grips, sun visors, rear window sills, etc.

[0029] The functions performed in the processes and methods can be implemented in different orders. Additionally, the steps and operations outlined are provided only as examples, and some of these steps and operations can be optional, combined into fewer steps and operations, or extended into additional steps and operations without departing from the essence of the disclosed embodiments.

Claims

1. A method of integrating an aesthetically pleasing micro-LED lighting strip for a transportation vehicle, the method comprising: Having a micro-LED strip, the micro-LED strip having a substrate, a plurality of micro-LED splicing blocks, and a protective layer; Having an adhesive strip in the micro-LED strip; Having a connecting member for connecting the micro-LED splicing blocks; And Wherein the micro-LED lighting strip is attached to the transportation vehicle through the adhesive strip to provide the required lighting.

2. The method according to claim 1, wherein the micro-LED strip 201 comprises a series of serially connected micro-LED splicing blocks for generating light visible as aesthetic lighting in any color or made programmable in color.

3. The method according to claim 1, wherein the micro-LED strip is produced in any length to provide the required lighting.

4. The method according to claim 1, wherein the micro-LED strip 201 comprises micro-LED splicing blocks produced in a plurality of sizes to increase the width of the micro-LED strip to provide the required lighting.

5. The method according to claim 1, wherein the micro-LED strip comprises micro-devices such as the micro-LED splicing blocks, contact pads, circuit layers, and a rigid substrate encapsulated in the protective layer.

6. The method according to claim 5, wherein the rigid substrate is made of glass, silicon, or plastic, and further, the rigid substrate further has active electronic components such as, but not limited to, transistors, resistors, capacitors, or any other electronic components commonly used in a system substrate.

7. The method according to claim 5, wherein the rigid substrate is a rigid substrate having electrical signal rows and electrical signal columns.

8. The method according to claim 5, wherein the rigid substrate is a sapphire substrate on which an LED layer is monolithically grown on top thereof, and the rigid substrate is a backplane having a circuit system for driving the micro-LED devices.

9. The method according to claim 5, wherein the micro-LED splicing block 204 contains a plurality of micro-LED arrays, wherein each micro-LED serves as a pixel and is driven to emit light.

10. The method according to claim 9, wherein the micro-LEDs include a plurality of micro-LEDs that are self-luminous per display pixel.

11. The method according to claim 5, wherein the panel is made of tiny red, green, and blue micro-LEDs and is connected to form a larger whole.

12. The method according to claim 1, wherein the adhesive strip is a strip having a substance such as glue, starch, paste, or adhesive, which binds the micro-LED strip to another material by adhering to the surfaces of the micro-LED strip and the other material to provide lighting, the other material such as the exterior of the vehicle.

13. The method according to claim 5, wherein the protective layer is a casing for protecting the micro-LED strip from environmental elements or conditions, and further wherein the protective layer is made of glass, silicon or plastic, and wherein an anti-glare protective film covers the micro-LED strip and the micro-LED splicing blocks.

14. The method according to claim 13, wherein the protective layer is silicon dioxide SiO2 deposited over the micro-LED splicing blocks and / or the micro-LED strip by physical vapor deposition, chemical vapor deposition or spin coating processes.

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