Light-emitting substrate, backlight module and display device

Abstract

Disclosed is a light emitting substrate. The light-emitting substrate comprises a substrate, and a bonding pad group, a light-emitting chip, a signal line group and a protection structure which are located on the substrate. And the bonding pad group is connected with the light-emitting chip. The signal line group at least comprises two signal lines which are correspondingly connected with the bonding pad group respectively, the orthographic projection of the signal lines on the substrate has a first contour, the first contour comprises a plurality of edges which are connected in sequence, and any two connected edges have an intersection point. The protection structure is located on the side, away from the substrate, of the light-emitting chip, and the orthographic projection of the light-emitting chip on the substrate is located in the orthographic projection of the protection structure on the substrate. The orthographic projection of the protection structure on the substrate has a second contour, the intersection points comprise a target first intersection point which is located in the second contour and has the smallest distance with the second contour, a safe distance is formed between the target first intersection point and the second contour, and / or the intersection points comprise a target second intersection point which is located outside the second contour and has the smallest distance with the second contour, and a safe distance is formed between the target second intersection point and the second contour. A safe distance exists between the target second intersection point and the second contour.

Description

Light-emitting substrate, backlight module, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate, a backlight module, and a display device. Background Art

[0002] Mini LED (Mini Organic Light-Emitting Diode) / Micro LED (Micro Organic Light-Emitting Diode) display devices have the advantages of high brightness, clear display and low power consumption, and have good application prospects.

[0003] Summary of the Invention

[0004] On the one hand, a light-emitting substrate is provided. The light-emitting substrate includes a substrate, and a pad group, a light-emitting chip, a signal line group and a protective structure located on the substrate. The pad group includes two pads, and the two pads are respectively connected to two pins of the light-emitting chip. The signal line group includes at least two signal lines respectively connected to two pads in the pad group, and there is a gap between any adjacent signal lines. The orthographic projection of any signal line in the signal line group on the substrate has a first contour, and the first contour includes a plurality of sequentially connected edges, any edge is a line without an inflection point, and any two connected edges have an intersection, and the two edges have an angle at the extension directions of the intersection. The protective structure is located on the side of the light-emitting chip away from the substrate. The orthographic projection of the light-emitting chip on the substrate is located within the orthographic projection of the protective structure on the substrate. The positive projection of the protective structure on the substrate has a second contour, and the intersection includes a target first intersection point located within the second contour and with the minimum distance from the second contour, and a safety distance is formed between the target first intersection point and the second contour, and / or, the intersection also includes a target second intersection point located outside the second contour and with the minimum distance from the second contour, and a safety distance is formed between the target second intersection point and the second contour.

[0005] In some embodiments, the second outline includes a plurality of first portions and a plurality of second portions alternately connected end to end, any first portion is located within the orthographic projection of any signal line in the signal line group on the substrate, and any second portion does not overlap with the orthographic projection of any signal line in the signal line group on the substrate; the sum of the lengths of the plurality of first portions is greater than the sum of the lengths of the plurality of second portions.

[0006] In some embodiments, the second contour is circular, and the ratio of the length L1 of the second portion to the circumference C of the second contour satisfies the following relationship: Wherein, R is the radius of the second contour, and d is the length of the safety distance.

[0007] In some embodiments, the second contour is circular, and the ratio of the length L1 of the second portion to the circumference C of the second contour satisfies the following relationship: Wherein, R is the radius of the second contour, and G is the distance between two signal lines in one signal line group.

[0008] In some embodiments, the signal line connected to the pad is divided into a plurality of sequentially connected sub-sections, and the extension directions of two mutually connected sub-sections intersect. Among the plurality of sub-sections, the sub-section connected to the pad is a first sub-section, and along the arrangement direction of the two pads in the pad group, the line width of the first sub-section is greater than the length of the pad.

[0009] In some embodiments, the sub-sections except the first sub-section among the plurality of sub-sections are second sub-sections, and the line width of the second sub-section is less than or equal to the line width of the first sub-section.

[0010] In some embodiments, the second outline includes a plurality of first portions and a plurality of second portions alternately connected end to end, any first portion is located within the orthographic projection of any signal line in the signal line group on the substrate, and any second portion does not overlap with the orthographic projection of any signal line in the signal line group on the substrate; the sum of the lengths of the plurality of first portions is less than the sum of the lengths of the plurality of second portions.

[0011] In some embodiments, the signal line connected to the pad is divided into a plurality of sequentially connected sub-portions, and the extension directions of two interconnected sub-portions intersect. The plurality of sub-portions includes a third sub-portion, an orthographic projection of the third sub-portion on the substrate does not overlap with an orthographic projection of the protection structure on the substrate, and a safety distance is maintained between the third sub-portion and the second outline.

[0012] In some embodiments, within the second outline: the signal line connected to the pad includes at least three sub-portions connected sequentially, and extension directions of two mutually connected sub-portions intersect.

[0013] In some embodiments, within the second outline: a plurality of the sub-portions of at least one signal line connected to the pad group surround at least a portion of the light-emitting chip connected to the pad group.

[0014] In some embodiments, the signal line connected to the pad is divided into a plurality of sequentially connected sub-sections, and the extension directions of two mutually connected sub-sections intersect. Among the plurality of sub-sections, the sub-section connected to the pad is a first sub-section, and along a direction perpendicular to the extension of the first sub-section, the line width of the first sub-section is substantially equal to the length of the pad.

[0015] In some embodiments, the line widths of any two sub-portions in the same signal line are substantially equal.

[0016] In some embodiments, the length of the safety distance is greater than or equal to 0.3 mm.

[0017] In some embodiments, the light-emitting substrate further comprises a reflective layer, the reflective layer being located on a side of the signal line facing away from the substrate, the reflective layer comprising a hollow area, and the orthographic projection of the pad on the substrate being located within the orthographic projection of the hollow area on the substrate.

[0018] In some embodiments, the thickness of the signal line is greater than or equal to 20 μm.

[0019] In some embodiments, a cross-sectional profile of the protection structure perpendicular to a plane of the substrate bulges away from the substrate.

[0020] In another aspect, a backlight module is provided, comprising: a light-emitting substrate as described in any one of the above embodiments.

[0021] In another aspect, a display device is provided, comprising: a liquid crystal display panel and a backlight module as described in any of the above embodiments, wherein the liquid crystal display panel is located on the light-emitting side of the backlight module.

[0022] In another aspect, a display device is provided, comprising: a light-emitting substrate as described in any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and do not limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, etc. involved in the embodiments of the present disclosure.

[0024] FIG1 is a top view of a display device according to some embodiments;

[0025] FIG2 is a structural diagram of a display device according to some embodiments;

[0026] FIG3 is a structural diagram of a display device according to some other embodiments;

[0027] FIG4 is a structural diagram of a portion of a light-emitting substrate according to some possible implementations;

[0028] FIG5 is a cross-sectional view taken along the line AA' in FIG4;

[0029] FIG6 is a partial structural diagram of a light-emitting substrate according to other possible implementations;

[0030] FIG7 is a cross-sectional view taken along the line BB' in FIG6;

[0031] FIG8 is a structural diagram of a red ink-covered area of ​​a light-emitting substrate after a high-temperature and high-humidity reliability test according to some embodiments;

[0032] FIG9 is a structural diagram of a portion of a light-emitting substrate provided according to some embodiments;

[0033] FIG10 is a partial enlarged view of F in FIG9 ;

[0034] FIG11 is a partial structural diagram of a light-emitting substrate according to some other embodiments;

[0035] FIG12 is a partial enlarged view of E in FIG11 ;

[0036] FIG13 is a partial structural diagram of a light-emitting substrate according to some further embodiments;

[0037] FIG14 is a partial structural diagram of a light-emitting substrate according to some further embodiments;

[0038] FIG15 is a structural diagram of a red ink-covered area of ​​a light-emitting substrate after a high-temperature and high-humidity reliability test according to some embodiments;

[0039] FIG16 is a partial enlarged view of S in FIG9 ;

[0040] FIG17 is a cross-sectional view of a light emitting substrate according to some embodiments. DETAILED DESCRIPTION

[0041] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0042] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0043] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0044] When describing some embodiments, the word "connected" and its derivatives may be used. The term "connected" should be understood broadly. For example, "connected" can mean fixed, removable, or integrated; it can be directly connected or indirectly connected through an intermediary. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0045] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0046] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0047] As used herein, the term "if" is optionally interpreted to mean "when" or "upon," depending on the context.

[0048] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0049] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0050] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0051] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0052] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0053] FIG. 1 is a top view of a display device according to some embodiments.

[0054] As shown in FIG. 1 , some embodiments of the present disclosure provide a display device 1000 .

[0055] Exemplarily, the display device 1000 can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is expected that the display device of the embodiments described can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0056] Exemplarily, the display device 1000 may be any one of a liquid crystal display device (LCD), a Mini LED (Mini Light-Emitting Diode, Mini LED) display device, and a Micro LED (Micro Light-Emitting Diode, Micro LED) display device.

[0057] FIG. 2 is a structural diagram of a display device according to some embodiments.

[0058] As shown in FIG2 , when the display device 1000 is a liquid crystal display device, the display device 1000 includes a backlight module 300 and a liquid crystal display panel 200. The liquid crystal display panel 200 is located on the light-emitting side of the backlight module 300. The backlight module 300 is used to provide light for the liquid crystal display panel 200, so that the liquid crystal display panel 200 can display images.

[0059] The main structure of the liquid crystal display panel 200 includes an array substrate 210 , a cell substrate 220 , and a liquid crystal layer 230 disposed between the array substrate 210 and the cell substrate 220 .

[0060] In some examples, the cell substrate 220 may be a color filter substrate (CF).

[0061] In some embodiments, as shown in FIG3 , the backlight module 300 includes a light emitting substrate 100. The light emitting substrate 100 is used to provide light to the liquid crystal display panel so that the liquid crystal display panel can display images.

[0062] As can be understood, light can be emitted through the light-emitting substrate 100 of the backlight module 300 and illuminate the liquid crystal layer 230. By adjusting the arrangement of the liquid crystal molecules in the liquid crystal layer 230, the intensity of light passing through the liquid crystal layer 230 can be adjusted, thereby adjusting the intensity of light irradiating the cell substrate 220. The cell substrate 220 can be a color filter substrate. In this way, by adjusting the intensity of light irradiating the different color photoresist units, the display device 1000 can display color images.

[0063] In some examples, the light-emitting substrate 100 includes a plurality of light-emitting chips, and the plurality of light-emitting chips are all configured to emit white light.

[0064] It can be understood that the backlight module 300 can achieve regional dimming in a small range by closely arranging a large number of light-emitting chips, so that the backlight module 300 can have better brightness uniformity and higher color contrast within a smaller mixing distance, which is conducive to making the terminal product equipped with the backlight module 300 have ultra-thin, high color rendering and energy-saving characteristics.

[0065] In some examples, the backlight module in the display device 1000 may further include an optical film, which is located on the side of the light-emitting substrate 100 close to the liquid crystal display panel. The optical film may include a reflective sheet, a diffuser, a brightness enhancement film (prism sheet), a diffuser, etc., and may be used to improve the brightness and uniformity of light.

[0066] FIG3 is a structural diagram of a display device according to some other embodiments.

[0067] As shown in FIG. 3 , when the display device 1000 is a Mini LED display device or a Micro LED display device, the display device 1000 includes a display panel, and the display panel includes at least one light-emitting substrate 100 .

[0068] The difference between the display device 1000 shown in FIG. 3 and the display device 1000 shown in FIG. 2 is that the display device 1000 shown in FIG. 3 does not require a backlight module, and can directly utilize the light-emitting substrate 100 in the display panel to directly realize image display.

[0069] In some examples, the display device 1000 may include multiple light-emitting substrates 100, which are spliced ​​together to form the display device 1000. Alternatively, the display device 1000 may include one light-emitting substrate 100. FIG3 illustrates an example in which the display device 1000 may include multiple light-emitting substrates 100.

[0070] In some examples, the light-emitting substrate 100 includes a plurality of light-emitting chips, and the plurality of light-emitting chips are configured to emit red light, green light, and blue light, so that the display device 1000 can achieve color display.

[0071] In some examples, the display device 1000 may further include an anti-reflection film layer and a protective cover plate. The anti-reflection film layer is located between the light-emitting substrate 100 and the protective cover plate. The anti-reflection film layer includes a polarizer, which may be a circular polarizer. The polarizer can reduce external light emission and prevent the light-emitting substrate 100 from reflecting ambient light, thereby causing glare.

[0072] In some embodiments, the display device 1000 can adopt chip-on-board packaging (COB) technology to further reduce the spacing between the light-emitting chips in the light-emitting substrate 100, improve the resolution of the display device 1000, thereby improving the visual effect of the display device 1000, reducing the thickness of the display device 1000, and improving the applicability of the display device 1000.

[0073] Figure 4 is a partial structural diagram of a light-emitting substrate according to some feasible methods, Figure 5 is a cross-sectional diagram along the AA' direction in Figure 4, Figure 6 is a partial structural diagram of a light-emitting substrate according to other feasible methods, and Figure 7 is a cross-sectional diagram along the BB' direction in Figure 6.

[0074] 4 to 7 , some embodiments of the present disclosure provide a light-emitting substrate 100. The light-emitting substrate 100 includes a substrate 10, and a plurality of pad groups 20, a plurality of signal line groups 30, and a plurality of light-emitting chips 40 located on the substrate 10. The pad group 20 includes two pads 21.

[0075] In some examples, the substrate 10 may be an aluminum substrate. Using an aluminum substrate for the substrate 10 in the light-emitting substrate 100 can meet the light-emitting substrate 100's requirements for bendability, thereby enabling the display device 1000 to achieve a curved display and further improving the applicability of the display device 1000. Furthermore, it can also meet the heat dissipation requirements of the light-emitting substrate 100 in the display device 1000.

[0076] In some examples, the light-emitting chip 40 may be a micro light-emitting diode (Micro LED) or a mini light-emitting diode (Mini LED). Compared to traditional diodes (LEDs), using a micro LED or a mini LED as a light source can achieve more refined dynamic control and improve the dynamic contrast of the display device 1000.

[0077] In some examples, the light-emitting chip 40 may include, in a direction away from the substrate 10, a first pin, a first semiconductor layer electrically connected to the first pin, a light-generating layer, a second semiconductor layer, and a second pin electrically connected to the second semiconductor layer. The second pin is located between the second semiconductor layer and the substrate 10. In other words, the light-emitting chip 40 may be a flip-chip LED.

[0078] When different voltages are applied to the first pin and the second pin respectively to form an electric field therebetween, a PN junction with a potential barrier can be formed between the first semiconductor layer and the second semiconductor layer. The carriers in the first semiconductor layer and the carriers in the second semiconductor layer will enter the light generating layer and recombine. At this time, the excess energy will be released in the form of light, thereby directly converting electrical energy into light energy, so that the light-emitting chip 40 can emit light.

[0079] In some examples, the first semiconductor layer may be one of an N-type semiconductor and a P-type semiconductor, and the second semiconductor layer 224 may be the other of the N-type semiconductor and the P-type semiconductor.

[0080] In some examples, the first pin electrically connected to the first semiconductor layer may be the anode of the light emitting chip 40, and the second pin electrically connected to the second semiconductor layer may be the cathode of the light emitting chip 40. However, some embodiments of the present disclosure are not limited thereto.

[0081] In some examples, the light generating layer may be a multiple quantum well layer (MQW).

[0082] If the display device 1000 is a liquid crystal display (LCD), the light-emitting substrate 100 serves as the backlight source for the LCD. Each light-emitting chip 40 can be independently controlled, enabling local dimming and high-dynamic range (HDR) effects, improving the display quality of the display device 1000.

[0083] When the display device 1000 is a Mini LED display device or a Micro LED display device, the plurality of light-emitting chips 40 (eg, Micro LED, Mini LED, etc.) on the light-emitting substrate 100 emit light to directly display a pattern.

[0084] For example, the plurality of light-emitting chips 40 may be light-emitting elements capable of emitting light of the same color, such as blue LEDs, red LEDs, green LEDs, or yellow LEDs. Thus, the display device 1000 may be a monochrome display device, such as an instrument dial, a signal indicator screen, or the like.

[0085] For example, the plurality of light-emitting chips 40 may include light-emitting elements of multiple different colors, such as at least two of a red LED, a green LED, a blue LED, a yellow LED, etc., and the light-emitting chips 40 of different colors may be independently controlled. In this way, the display device 1000 can perform color display by mixing light.

[0086] In some examples, the plurality of light emitting chips 40 on the light emitting substrate 100 are arranged in multiple rows and columns. For the convenience of description, the present disclosure uses the plurality of light emitting chips 40 arranged in a matrix as an example for description.

[0087] As shown in Figures 4 and 6 , the light-emitting substrate 100 may also have multiple signal line groups 30 formed on the substrate 10. Each signal line group 30 may be connected to a corresponding light-emitting chip 40 via a pad group 20. Each signal line group 30 may include at least two signal lines 31, with spaces between any adjacent signal lines 31 to prevent short circuits. The light-emitting substrate 100 can use the signal lines in the signal line group 30 to transmit drive signals to the light-emitting chip 40 via the pads 21, causing the light-emitting chip 40 to emit light.

[0088] In some examples, when the signal line group 30 includes two signal lines 31, the two signal lines 31 are respectively connected to two corresponding pads 21 in the pad group 20. That is, the two signal lines 31 are respectively electrically connected to two pins of the light-emitting chip 40 using two pads. For example, one of the two signal lines 31 is connected to one pin of the light-emitting chip 40 through one pad 21 in the pad group 20, and the other signal line 31 is electrically connected to another pin of the light-emitting chip 40 through another pad 21 in the pad group 20, thereby achieving electrical connection between the signal line group 30 and the light-emitting chip 40.

[0089] In other examples, each signal line group 30 may include at least three signal lines 31: the multiple signal lines 31 in the signal line group 30 are divided into two types of signal lines 31, namely, a first type of signal line 31A and a second type of signal line 31B. The first type of signal line 31A is the two signal lines 31 correspondingly connected to the two pads 21 in the pad group 20. The second type of signal line 31B is the signal line 31 in the same signal line group 30 except for the first type of signal line 31A.

[0090] It should be noted that the present disclosure does not limit the type and number of the second signal lines 31B. The second signal lines 31B may be signal lines 31 surrounding the corresponding light-emitting chip 40 and connected to other light-emitting chips 40.

[0091] In some examples, the light emitting chip 40 can be fixedly connected to the pad 21 and the signal line 31 on the substrate 10 using COB (Chip On Board, IC bare chip fixed to a printed circuit board by binding) technology.

[0092] Based on this, the width, length, and thickness of the signal lines 31 in the light-emitting substrate 100 affect the upper limit of the maximum current that the corresponding signal lines 31 can carry. The signal lines 31 in currently developed light-emitting substrates 100 are required to carry higher currents. Therefore, the signal lines 31 in the light-emitting substrate 100 need to be widened and thickened to increase the cross-sectional area of ​​the signal lines 31 perpendicular to the substrate 10. This reduces the impedance of the signal lines 31, allowing them to carry higher currents and meet the current requirements of the light-emitting substrate 100.

[0093] In some embodiments, the thickness of the signal line 31 is greater than or equal to 20 μm. This configuration allows the signal line 31 to be thicker, which helps reduce the impedance of the signal line. Furthermore, the thicker signal line 31 can also relatively increase the heat dissipation area of ​​the signal line 31, thereby improving the heat dissipation effect of the signal line 31.

[0094] In some examples, the thickness of the signal line 31 ranges from approximately 20 μm to 35 μm.

[0095] When the thickness of the signal line 31 is equal to or close to 20 μm, the signal line 31 can have a better heat dissipation effect and carry a higher current, and can also prevent the thickness of the signal line 31 from being too thick and affecting the light-emitting substrate 100 from being thin.

[0096] When the thickness of the signal line 31 is equal to or close to 35 μm, the signal line 31 can have a better heat dissipation effect and carry a higher current while meeting the requirements of lightweight and thin light-emitting substrate 100 .

[0097] For example, the thickness of the signal line 31 may be any one of 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, or 35 μm. However, the embodiment of the present disclosure is not limited thereto.

[0098] Taking the thickness of the signal line 31 as about 30 μm as an example, the signal line 31 has a better heat dissipation effect and can carry a higher current to meet the requirements of the light-emitting substrate 100 .

[0099] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the thickness of the signal line 31 fluctuates within the range of 10%×30μm, it can also be considered that the thickness of the signal line 31 satisfies 30μm.

[0100] Because the COB solution directly bonds the light-emitting chip 40 to the substrate, the chip's poor water and oxygen resistance must be considered during application. Therefore, referring to Figures 4 to 7 , the light-emitting substrate 100 in this embodiment may also include a protective structure 50. The protective structure 50 is located on the side of the light-emitting chip 40 facing away from the substrate 10, and the orthographic projection of the light-emitting chip 40 on the substrate 10 is positioned within the boundaries of the protective structure's orthographic projection on the substrate 10.

[0101] With this arrangement, the protective structure 50 can be used to cover the light-emitting chip 40. The protective structure 50 can protect the light-emitting chip 40, improve the problem that external water vapor can contact the light-emitting chip 40, thereby improving the problem that the light-emitting chip 40 has poor water and oxygen resistance, and increasing the life of the light-emitting chip 40.

[0102] In some embodiments, as shown in FIG. 5 , the cross-sectional profile of the protection structure 50 perpendicular to the plane of the substrate 10 bulges away from the substrate.

[0103] In this configuration, the protective structure 50 not only covers the light-emitting chip 40 and protects the light-emitting chip 40, but also functions as a lens. Positioning the protective structure 50 on the side of the light-emitting chip 40 facing away from the substrate 10 increases the light emission angle of the light-emitting chip 40, thereby improving the light efficiency of the light-emitting substrate 100 and the brightness uniformity of the light-emitting substrate 100.

[0104] In some examples, the cross-sectional shape of the protection structure 50 in a plane perpendicular to the substrate 10 can be a semicircle. This design can not only utilize the protection structure 50 to protect the light-emitting chip 40, but also utilize the protection structure 50 to improve the light emission angle of the light-emitting chip 40, thereby improving the brightness uniformity of the light-emitting substrate 100.

[0105] In some examples, the protective structure 50 may be a protective adhesive. For example, the protective adhesive may be a silicone adhesive. In actual manufacturing, a packaging method using a spot application of the protective adhesive can save materials and reduce costs. However, the disclosed embodiments are not limited thereto.

[0106] In some embodiments, as shown in Figures 6 and 7 , the maximum span of the second profile N corresponding to the protective structure 50 can range from 4.46 mm to 4.66 mm. The maximum span of the second profile N can also be understood as the equivalent diameter of the second profile N. The "equivalent diameter" is the diameter of a circle having the same area as the second profile.

[0107] When the maximum span of the second outline N corresponding to the protective structure 50 is within the range of 4.46 mm to 4.66 mm, it can meet the requirements of the relevant manufacturing process accuracy and ensure that the orthographic projection of the light-emitting chip 40 on the substrate 10 is located within the boundary of the orthographic projection of the protective structure 50 on the substrate 10, thereby protecting the light-emitting chip 40. In addition, it can also prevent the maximum span of the second outline N corresponding to the protective structure 50 from being too large, which may easily cause the protective structure 50 to crack.

[0108] For example, the maximum span of the second profile N corresponding to the protective structure 50 is approximately 4.46 mm, 4.5 mm, 4.56 mm, 4.6 mm, or 4.66 mm. However, the embodiments of the present disclosure are not limited thereto.

[0109] Taking the maximum span of the second contour N corresponding to the protection structure 50 as approximately 4.56 mm as an example, the protection structure 50 can not only protect the light-emitting chip 40, but also meet the requirements of the existing process and reduce the problem of cracking of the protection structure 50.

[0110] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the maximum span of the second contour N corresponding to the protective structure 50 fluctuates within the range of 4.56mm±0.1mm, it can also be considered that the maximum span of the second contour N corresponding to the protective structure 50 satisfies and is equal to 4.56mm.

[0111] In some examples, when the second outline N corresponding to the orthographic projection of the protection structure 50 on the substrate 10 is circular, the maximum span of the second outline N corresponding to the protection structure 50 may be the diameter of the second outline N. However, the embodiments of the present disclosure are not limited thereto. The second outline N corresponding to the orthographic projection of the protection structure 50 on the substrate 10 may also be other shapes, such as an ellipse.

[0112] In some embodiments, as shown in FIG6 and FIG7 , the height of the protection structure 50 along the thickness direction Z of the substrate 10 ranges from 1.4 mm to 1.55 mm. The height of the protection structure 50 along the thickness direction Z of the substrate 10 can be the distance between the highest point of the protection structure 50 on the side closest to the substrate 10 and the highest point of the protection structure 50 on the side away from the substrate.

[0113] When the height of the protection structure 50 is within the range of 1.4 mm to 1.55 mm, the protection structure 50 can better expand the light emission angle of the light emitting chip 40 covered by its orthographic projection, and is conducive to improving the brightness uniformity of the light emitting substrate 100 .

[0114] Illustratively, the height of the protection structure 50 is approximately 1.4 mm, 1.41 mm, 1.45 mm, 1.48 mm, 1.5 mm, or 1.55 mm.

[0115] Taking the case where the height of the protection structure 50 is about 1.48 mm as an example, the protection structure 50 can not only protect the light emitting chip 40 but also act as a lens to improve the brightness uniformity of the light emitting substrate 100 .

[0116] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the height of the protective structure 50 fluctuates within the range of 1.48±0.07mm, it can also be considered that the height of the protective structure 50 satisfies and is equal to 1.48mm.

[0117] In some examples, when the cross-sectional shape of the protective structure 50 in a plane perpendicular to the substrate 10 is a semicircle, the height of the protective structure 50 may be the radius of the semicircle. However, the embodiments of the present disclosure are not limited thereto. The second profile N corresponding to the orthographic projection of the protective structure 50 on the substrate 10 may also be other protrusions, such as a semi-elliptical shape.

[0118] The above embodiment primarily describes the thickness of the signal line 31, the shape, maximum span, and height of the protective structure 50, with reference to the relevant drawings. However, the inventors have discovered that, because the light-emitting substrate 100 includes multiple light-emitting chips 40, corresponding pad groups 20, and signal line groups 30, among other components, providing a protective structure 50 to protect the light-emitting chips 40 can easily crack. This can result in the protective structure 50 failing to effectively isolate the light-emitting chips 40 from moisture and protect them.

[0119] Specifically, because the light-emitting substrate 100 includes multiple light-emitting chips 40, corresponding multiple solder pad groups 20, multiple signal line groups 30, and other components, the signal lines 31 in the light-emitting substrate 100 need to be routed around. Specifically, the two signal lines 31 in the signal line group 30 connected to the two pins of the light-emitting chip 40 may need to be routed around to prevent the two signal lines 31, after being connected to the two solder pads 21, from interfering with the arrangement of other components, such as the light-emitting chips 40.

[0120] Illustratively, the orthographic projection of any signal line 31 in the signal line group 30 on the substrate 10 has a first profile M. The first profile M includes a plurality of sequentially connected edges M1. Each edge M1 is a line without an inflection point. Any two connected edges M1 have an intersection H. The two edges M1 have an angle in their respective extension directions at the intersection H. It can be understood that any two connected edges M1 intersect at the intersection H to form a corner V of the signal line 31.

[0121] Based on this, the angle formed between any two connected sides M1 can be adjusted to adjust the bending of the corresponding signal line 31, so that the signal line 31 can avoid other devices in the light-emitting substrate 100, thereby improving the problem of short circuit of the signal line 31.

[0122] It should be noted that the side M1 of the first contour M can be a straight side or a curved side. As shown in Figure 4, the upper square first-type signal line 31A is defined as the first first-type signal line 31Aa, and the first first-type signal line 31Aa is equivalent to including four sides M1 connected end to end. In addition, the four sides M1 of the first first-type signal line 31Aa are all straight sides. The lower first-type signal line 31A is defined as the second first-type signal line 31Ab, and the second first-type signal line 31Ab is equivalent to including three sides M1 connected end to end. Among them, the three sides M1 of the second first-type signal line 31Ab include two straight sides and one curved side. The angle between the curved side and the straight side can be the angle between the tangent of the curved side and the straight side. The lower second-type signal line 31B is equivalent to including five sides M1 connected end to end. Among them, the five sides M1 of the second-type signal line 31B include four straight sides and one curved side.

[0123] As shown in Figures 4 and 6 , the orthographic projection of the protective structure 50 on the substrate 10 has a second profile N. Since the protective structure 50 completely covers the light-emitting chip 40, the orthographic projection of the protective structure 50 on the substrate 10 overlaps with the orthographic projection of the side of the signal line 31 connected to the light-emitting chip 40 on the substrate 10. In other words, the orthographic projection of the signal line 31 on the substrate 10 overlaps with the second profile N. However, after the signal line 31 is routed and avoided, the orthographic projection of the corner V of the signal line 31 on the substrate 10 may overlap with the second profile N. In other words, at least one of the multiple intersection points H in the first profile M will overlap with the second profile N.

[0124] However, since there is a gap between any two adjacent signal lines 31, and the signal lines 31 are relatively thick, a deep groove is formed between any two adjacent signal lines 31 and the gap therebetween. At the corner V (intersection H) of one of the two adjacent signal lines 31, the extension direction of the outline of the signal line 31 changes, thereby increasing the gap between the signal line 31 and the other adjacent signal line 31 at the corner V (intersection H), which is equivalent to increasing the width of the groove Q formed by the gap between the two signal lines 31 and the gap therebetween.

[0125] Specifically, as shown in FIG4 , two adjacent signal lines 31 are described as an example, namely, a first type-one signal line 31Aa and a second type-two signal line 31B located below. The second type-two signal line 31B includes a first side M1a adjacent to the first type-one signal line 31Aa, and a second side M1b connected to the first side M1a and adjacent to the second type-one signal line 31Ab. The first side M1a and the second side M1b of the second type-two signal line 31B intersect at a first intersection Ha.

[0126] Because the second side M1b of the second signal line 31B corresponds to the second signal line 31B bending away from the first first signal line 31Aa, the spacing between the second signal line 31B and the first first signal line 31Aa changes starting at the first intersection Ha of the second signal line 31B. That is, the space (spacing) between the second signal line 31B and the first first signal line 31Aa increases at the location where the second signal line 31B's extension direction changes. As a result, the groove formed by the second side M1b of the second signal line 31B, the first first signal line 31Aa, and the space therebetween has a wider groove width. That is, the groove width of the first groove formed by the second side M1b of the second signal line 31B, the first first signal line 31Aa, and the space therebetween is greater than the groove width of the second groove formed by the first side M1a of the second signal line 31B, the first first signal line 31Aa, and the space therebetween.

[0127] As shown in the above structure, when other film layers are set on the protective structure 50 and the signal line group 30, the other film layers between the protective structure 50 and the signal line group 30 can fill the first groove and the second groove. Among them, since the groove width of the second groove is relatively small, the other film layers between the protective structure 50 and the signal line group 30 can basically fill the second groove, or significantly raise the groove bottom of the second groove to reduce the groove depth of the second groove. However, since the groove width of the first groove is relatively large, the other film layers between the protective structure 50 and the signal line group 30 cannot fill the groove. That is, the groove depth of the first groove is still relatively large. Exemplarily, the other film layers of the protective structure 50 and the signal line group 30 can be reflective layers. The reflective layer will be elaborated in detail below and will not be repeated here.

[0128] Based on this, when the boundary (second outline N) of the orthographic projection of the protection structure 50 on the substrate 10 overlaps with the first intersection Ha on the second-type signal line 31B, the boundary of the protection structure 50 will be located at a position where the extension direction of the outline boundary of the second-type signal line 31B changes. Consequently, at this position, the boundary of the protection structure 50 is likely to shrink inward or expand outward to the position where the extension direction of the second-type signal line 31B changes. In other words, the boundary (second outline N) of the orthographic projection of the protection structure 50 on the substrate 10 will be formed within the first groove formed by the second side M1b of the second-type signal line 31B, the first first-type signal line 31Aa, and the space between them.

[0129] Therefore, the boundary of the protective structure 50 passes through the step with a large height difference formed by the second side M1b of the second-type signal line 31B and the substrate 10. The boundary of the protective structure 50 also passes through the step formed by the first-type signal line 31Aa and the substrate 10. Due to the large height difference between the signal line 31 and the substrate 10, the protective structure 50 formed at the location with the height difference is prone to cracking due to its own stress. In other words, the protective structure 50 is prone to cracking at the height difference formed by the corner V (intersection H) of the signal line 31. Where the protective structure 50 cracks, its oxygen-blocking capacity decreases.

[0130] FIG. 8 is a structural diagram of a red ink-covered area of ​​a light-emitting substrate after a high-temperature and high-humidity reliability test according to some embodiments.

[0131] Since the boundary (second contour N) of the positive projection of the protection structure 50 on the substrate 10 overlaps with the corner V (intersection H) of the signal line 31, cracks will appear at the corner V (intersection H) of the signal line 31 corresponding to the second contour N of the protection structure 50.

[0132] Based on this, after approximately 12 hours of high-temperature, high-humidity reliability testing on the light-emitting substrate 100, as shown in FIG8 , a large amount of red ink gradually enters the area covered by the protective structure 50 from the crack at the corner V (intersection H) of the signal line 31 corresponding to the second contour N of the protective structure 50 (the area where the red ink invades the protective structure 50 is indicated by the dotted box in FIG8 ). Consequently, the light-emitting chip 40 covered by the protective structure 50 will still be corroded by the red ink, shortening the lifespan of the light-emitting chip 40.

[0133] Figure 9 is a partial structural diagram of a light-emitting substrate provided according to some embodiments, Figure 10 is a partial enlarged diagram of F in Figure 9, Figure 11 is a partial structural diagram of a light-emitting substrate provided according to other embodiments, Figure 12 is a partial enlarged diagram of E in Figure 11, Figure 13 is a partial structural diagram of a light-emitting substrate provided according to still other embodiments, and Figure 14 is a partial structural diagram of a light-emitting substrate provided according to still other embodiments.

[0134] Based on this, as shown in Figures 9 to 14 , the light-emitting substrate 100 provided in the embodiments of the present disclosure further includes a protective structure 50. The protective structure 50 is located on the side of the light-emitting chip 40 facing away from the substrate 10. The orthographic projection of the protective structure 50 on the substrate 10 has a second profile N. The orthographic projection of the light-emitting chip 40 on the substrate 10 is set to be within the boundary (second profile N) of the orthographic projection of the protective structure 50 on the substrate 10. Furthermore, the intersection H where any two connected edges M1 on the first profile M corresponding to any signal line 31 intersect is set to have a safe distance from the second profile N corresponding to the protective structure 50.

[0135] The "safety distance" refers to the minimum distance between the intersection point H and the second contour N, taking into account possible process errors that may occur during the manufacturing process of the light-emitting substrate 100. In other words, if the intersection point H where any two consecutive edges M1 on the first contour M corresponding to any signal line 31 intersect is set at a safety distance from the second contour N corresponding to the protective structure 50, even if process errors occur during the manufacturing process of the light-emitting substrate 100, the intersection point H where any two consecutive edges M1 on the first contour M corresponding to any signal line 31 intersect will still have a distance from the second contour N corresponding to the protective structure 50 to prevent the intersection point H of the signal line 31 from overlapping the second contour N corresponding to the edge of the protective structure 50.

[0136] This arrangement allows for a reserved space between the boundary (second outline N) of the protective structure 50 and the intersection H of the first outline M corresponding to any signal line 31. This allows the intersection H on the signal line 31 to avoid the second outline N corresponding to the protective structure 50, preventing the boundary (second outline N) of the protective structure 50 from becoming stuck at the corner V of the signal line 31. This reduces the probability of the boundary of the protective structure 50 forming at uneven locations, thereby reducing the probability of cracking in the protective structure 50. This ensures the water-resistant and oxygen-resistant performance of the protective structure 50, thereby extending the lifespan of the light-emitting chip 40.

[0137] In some examples, as shown in Figures 9 and 10 , the plurality of intersections H include a plurality of first intersections H1 . The orthographic projections of the first intersections H1 on the substrate 10 are located within the second outline N. That is, the orthographic projections of the protection structure 50 on the substrate 10 cover the orthographic projections of the first intersections H1 on the signal line 31 on the substrate 10 .

[0138] In this case, the multiple first intersection points H1 include at least one target first intersection point H11 having the smallest distance from the second contour N. A safety distance may be set between the first intersection point H11 and the second contour N. Setting a safety distance between the target first intersection point H11 having the smallest distance from the second contour N and the second contour N indicates that any first intersection point H1 among the multiple first intersection points H1 is at least the safety distance away from the second contour N.

[0139] That is, when the protection structure 50 covers multiple first intersections H1 of the signal line 31 , a safe distance may be set between the boundary (second outline N) of the protection structure 50 and the orthographic projection of the target first intersection H11 it covers on the substrate 10 .

[0140] This design is equivalent to adjusting the signal line 31 so that the first intersection point H1 that may overlap with the second outline N moves inward. This ensures that the target first intersection point H11 moves inward into the second outline N and is kept at a safe distance from the second outline N. In other words, each first intersection point H1 can be kept at a safe distance or greater from the second outline N.

[0141] Based on this, the boundary (second outline N) of the protective structure 50 can be prevented from overlapping with the first intersection H1 on the signal line 31, thereby preventing the boundary (second outline N) of the protective structure 50 from being formed in the groove Q at the position corresponding to the first intersection H1 on the signal line 31, reducing the probability of cracking of the protective structure 50, and thus improving the life of the light-emitting chip 40.

[0142] In other examples, as shown in Figures 11 and 12, the plurality of intersections H may include a plurality of second intersections H2. The orthographic projections of the second intersections H2 on the substrate 10 do not overlap with the orthographic projections of the protection structure 50 on the substrate 10. It can also be understood that the intersections H outside the second outline N among the plurality of intersections H on the signal line 31 are second intersections H2.

[0143] In this case, the plurality of second intersection points H2 include at least one target second intersection point H21 having the smallest distance from the second contour N. A safety distance may be set between the second intersection point H21 and the second contour N. Setting a safety distance between the target second intersection point H21 having the smallest distance from the second contour N and the second contour N indicates that any second intersection point H2 among the plurality of second intersection points H2 is at least the safety distance away from the second contour N.

[0144] That is, when the orthographic projection of the protective structure 50 on the substrate 10 does not cover multiple second intersections H2 of the signal line 31, a safety distance can be set between the boundary (second contour N) of the protective structure 50 and its uncovered target second intersection H21 orthographic projection on the substrate 10.

[0145] This design is equivalent to adjusting the signal line 31 so that the second intersection point H2 that may overlap with the second outline N is moved outward, ensuring that the target second intersection point H21 is moved outside the second outline N and a safe distance is maintained between the target second intersection point H21 and the second outline N. In other words, each second intersection point H2 is spaced at or above the safe distance from the second outline N.

[0146] Based on this, the boundary (second outline N) of the protective structure 50 can be prevented from overlapping with the second intersection H2 on the signal line 31, thereby preventing the boundary (second outline N) of the protective structure 50 from being formed in the groove Q at the position corresponding to the second intersection H2 on the signal line 31, reducing the probability of cracking of the protective structure 50, and thus improving the life of the light-emitting chip 40.

[0147] In some further embodiments, as shown in Figures 13 and 14, the orthographic projection of a partial intersection H of the signal line 31 on the substrate 10 is located within the second contour N, and the orthographic projection of another partial intersection H of the multiple signal lines 31 in a signal line group 30 on the substrate 10 does not overlap with the orthographic projection of the protective structure 50 on the substrate 10, that is, the orthographic projections of another partial intersection H of the multiple signal lines 31 in a signal line group 30 on the substrate 10 are all located outside the second contour N.

[0148] The intersection point H located within the second outline N is defined as a first intersection point H1 , and the intersection point H outside the second outline N is defined as a second intersection point H2 .

[0149] At this time, the plurality of first intersection points H1 include at least one target first intersection point H11 having the smallest distance from the second contour N, and the plurality of second intersection points H2 include at least one target second intersection point H21 having the smallest distance from the second contour N.

[0150] A safety distance may be set between the first intersection point H11 and the second contour N, and a safety distance may be set between the second intersection point H21 and the second contour N. Based on this, any first intersection point H1 among the plurality of first intersection points H1 may be spaced at least the safety distance from the second contour N, and any second intersection point H2 among the plurality of second intersection points H2 may be spaced at least the safety distance from the second contour N.

[0151] This design can prevent the boundary (second outline N) of the protective structure 50 from overlapping with the intersection H (first intersection H1 and second intersection H2) on the signal line 31, thereby preventing the boundary (second outline N) of the protective structure 50 from being formed in the groove Q at the position corresponding to the intersection H (first intersection H1 and second intersection H2) on the signal line 31, reducing the probability of cracking of the protective structure 50, and thus improving the life of the light-emitting chip 40.

[0152] FIG. 15 is a structural diagram of a red ink-covered area of ​​a light-emitting substrate after a high-temperature and high-humidity reliability test according to some embodiments.

[0153] After approximately 12 hours of high-temperature, high-humidity reliability testing of the light-emitting substrate 100 provided by the present embodiment, it was found that the red ink was largely isolated outside its boundary (second outline N) by the protective structure 50. Furthermore, the protective structure 50 effectively protects the light-emitting chip 40 from damage by water and oxygen, thereby ensuring the lifespan of the light-emitting chip 40.

[0154] In summary, when the protective structure 50 is provided on the light-emitting substrate 100 provided in the embodiments of the present disclosure, the position of the orthographic projection of the boundary (second outline N) of the protective structure 50 and the intersection H of the signal line 31 on the substrate 10 can be adjusted to maintain a safe distance between the two. Furthermore, the problem of cracking in the protective structure 50 can be alleviated, thereby improving the reliability of the protective structure 50. This ensures that the protective structure 50 protects the light-emitting chip 40, thereby enhancing the quality of the light-emitting substrate 100.

[0155] In some embodiments, as shown in FIG. 9 to FIG. 13 , the length d of the safety distance is greater than or equal to 0.3 mm, for example, it may be 0.35 mm, 0.4 mm, 0.45 mm, or 0.5 mm.

[0156] When the distance between the second contour N corresponding to the protective structure 50 and the intersection H on the signal line 31 (the target first intersection H11 and the target second intersection H21) is equal to or close to 0.3 mm, it can be ensured that there is still a distance between the second contour N corresponding to the protective structure 50 and the intersection H on the signal line 31 (the target first intersection H11 and the target second intersection H21) in the presence of manufacturing process errors, thereby reducing the overlap of the orthographic projections of the second contour N corresponding to the protective structure 50 and the intersection H on the signal line 31 (the first intersection H1 and the second intersection H2) on the substrate 10.

[0157] Furthermore, the required safety distance will not be excessively long, which would require significant adjustments to the structural layout of the signal lines 31. In other words, the structural layout of the signal lines 31 in the light-emitting substrate 100 can be adjusted slightly to alleviate the problem of cracks in the protective structure 50. This reduces the likelihood of cracks in the protective structure 50, allowing it to better protect the light-emitting chip 40 and improve the quality of the light-emitting substrate 100.

[0158] In some examples, the length d of the safety distance is approximately any one of 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, or 0.7 mm. However, the embodiments of the present disclosure are not limited thereto.

[0159] Taking the length d of the safety distance as about 0.3 mm as an example, the layout of the signal line 31 in the light-emitting substrate 100 can be slightly adjusted to improve the problem of cracks in the protection structure 50 .

[0160] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the length d of the safety distance is within the range of about 10% above and below 0.3 mm, it can also be considered that the length d of the safety distance satisfies 0.3 mm.

[0161] The above embodiment, combined with the relevant drawings, describes setting a safe distance between the intersection point H on the first contour M corresponding to the signal line 31 and the boundary (second contour N) of the protective structure 50. Specifically, a safe distance is set between the orthographic projection of the corner V of the signal line 31 on the substrate 10 and the second contour N of the protective structure 50 to mitigate the problem of cracking of the protective structure 50. The following describes the corresponding arrangement relationship between the protective structure 50 and the signal line 31, depending on the different arrangements of the signal line 31 in the light-emitting substrate 100, to further mitigate the problem of cracking of the protective structure 50.

[0162] In some embodiments, as shown in Figures 9 and 11 , the sum of the projected areas of the plurality of signal lines 31 in the light-emitting substrate 100 on the substrate 10 accounts for more than 30% of the total area of ​​the light-emitting substrate 100. For example, the sum of the projected areas of the plurality of signal lines 31 in the light-emitting substrate 100 on the substrate 10 accounts for approximately 45% of the total area of ​​the light-emitting substrate 100.

[0163] Since the signal lines 31 in the light-emitting substrate 100 are generally made of metal, which generally has good heat dissipation, this design allows the signal lines 31 to have a relatively large width, which can reduce the impedance of the signal lines 31, allowing the signal lines 31 to better carry higher currents, thereby improving the light-emitting effect of the light-emitting substrate 100; at the same time, it can also improve the heat dissipation effect of the light-emitting substrate 100.

[0164] In some embodiments, as shown in Figures 9 to 12, the second contour N includes a plurality of first portions N1 and a plurality of second portions N2 that are alternately connected end to end, any first portion N1 is located within the orthographic projection of any signal line 31 in the signal line group 30 on the substrate 10, and any second portion N2 does not overlap with the orthographic projection of any signal line 31 in the signal line group 30 on the substrate 10; the sum of the lengths of the plurality of first portions N1 is greater than the sum of the lengths of the plurality of second portions N2.

[0165] As set above, it is equivalent to dividing the second contour N corresponding to the orthographic projection of the protection structure 50 on the substrate 10 into two parts, the two parts being a first part N1 and a second part N2. The first part N1 of the second contour N is the part where the second contour N overlaps with the orthographic projection of the signal line 31 on the substrate 10, and the second part N2 of the second contour N is the part where the second contour N does not overlap with the orthographic projection of the signal line 31 on the substrate 10.

[0166] Within the same second contour, the sum of the lengths of the multiple first portions N1 is greater than the sum of the lengths of the multiple second portions N2. In other words, the portion of the second contour that overlaps with the orthographic projection of the signal line 31 on the substrate 10 is greater than the portion of the second contour N that does not overlap with the orthographic projection of the signal line 31 on the substrate 10. In other words, the portion of the protection structure 50 that overlaps with the orthographic projection of the signal line 31 on the substrate 10 is greater than the portion that does not overlap with the orthographic projection of the signal line 31 on the substrate 10.

[0167] Based on this, it can be seen that the signal line 31 has a larger projection area on the substrate 10. In other words, the signal line 31 has a larger line width, which can improve the heat dissipation effect of the light-emitting substrate 100 and reduce the impedance of the signal line 31, so that the signal line 31 can better carry higher current, thereby improving the light-emitting effect of the light-emitting substrate 100.

[0168] In some embodiments, as shown in FIG9 and FIG10 , when the sum of the lengths of the plurality of first portions N1 is greater than the sum of the lengths of the plurality of second portions N2, taking the second contour as a circle as an example, there is at least one target second portion N2, and when the target second portion N2 and the target first intersection H11 of the first contour M have a safety distance d, the length of the target second portion N2 satisfies the following relationship: Among them, α is the fillet corresponding to the second part N2, θ is half of the fillet corresponding to the second part N2, R is the radius of the second contour N, and d is the length of the safety distance.

[0169] Based on this, the ratio of the length L1 of the second portion N2 to the perimeter C of the second contour N is set to satisfy the following relationship: Wherein, R is the radius of the second profile N, and d is the length of the safety distance.

[0170] In other words, the perimeter C of the second outline N corresponding to the protection structure 50 is greater than the perimeter of the second outline N having the target second portion N2. The size of the protection structure 50 is greater than the size of the protection structure 50 having the target second portion N2. In other words, this is equivalent to relatively increasing the maximum span of the second outline N corresponding to the protection structure 50 along the arrangement direction of the two pads 21 in the vertical pad group 20, so that the maximum span of the second outline N corresponding to the protection structure 50 is greater than the length of the portion of the signal line 31 it covers, thereby ensuring that the distance between the target first intersection H11 and the second outline N is greater than or equal to the safety distance d.

[0171] When the distance between the target first intersection point H11 and the second contour N is greater than or equal to the safety distance d, any first intersection point H1 among the plurality of first intersection points H1 can have a distance from the second contour N that is the safety distance d or greater.

[0172] Based on this, the boundary (second outline N) of the protective structure 50 can be prevented from overlapping with the first intersection H1 on the signal line 31, thereby preventing the boundary (second outline N) of the protective structure 50 from being formed in the groove Q at the position corresponding to the first intersection H1 on the signal line 31, reducing the probability of cracking of the protective structure 50, and thus improving the life of the light-emitting chip 40.

[0173] It should be noted that “relatively increasing the maximum span of the second outline N corresponding to the protection structure 50 along the arrangement direction X of the two pads 21 in the vertical pad group 20 ” may include the following two ways.

[0174] The first method is to increase the maximum span of the second outline N corresponding to the protection structure 50 along the arrangement direction X perpendicular to the two pads 21 in the pad group 20, so that the distance between the first intersection H1 (target first intersection H11) and the second outline N is greater than or equal to the safety distance d. In other words, by adjusting the protection structure, the projected area of ​​the protection structure 50 on the substrate 10 is increased, thereby increasing the distance between the boundary of the protection structure 50 (the second outline N) and the first intersection H1 it covers, so that it is greater than or equal to the safety distance d.

[0175] The second method is to reduce the line width of the portion of the signal line 31 covered by the protective structure 50 so that the distance between the first intersection H1 (target first intersection H11) and the second outline N is greater than or equal to the safety distance d. In other words, by adjusting the signal line 31 and reducing its line width, the distance between the boundary of the protective structure 50 (the second outline N) and the first intersection H1 it covers is increased to greater than or equal to the safety distance d.

[0176] In some embodiments, as shown in FIG11 and FIG12 , when the sum of the lengths of the plurality of first portions N1 is greater than the sum of the lengths of the plurality of second portions N2, a target second portion N2 is provided. When the target second portion N2 and the target second intersection H21 of the first profile M have a safety distance d, the length of the target second portion N2 satisfies the following relationship: Wherein, α is the fillet corresponding to the second portion N2 , θ is half of the fillet corresponding to the second portion N2 , R is the radius of the second profile N, and G is the distance between two signal lines 31 in a signal line group 30 .

[0177] Based on this, the ratio of the length L1 of the second portion N2 to the perimeter C of the second contour N is set to satisfy the following relationship: Here, R is the radius of the second profile N, and G is the distance between two signal lines 31 in a signal line group 30 .

[0178] That is, the perimeter C of the second outline N corresponding to the protection structure 50 is smaller than the perimeter of the second outline N having the target second portion N2. The size of the protection structure 50 is smaller than the size of the protection structure 50 having the target second portion N2. In other words, this is equivalent to relatively reducing the maximum span of the second outline N corresponding to the protection structure 50 along the arrangement direction of the two pads 21 in the vertical pad group 20, so that the maximum span of the second outline N corresponding to the protection structure 50 is smaller than the length of the portion of the signal line 31 it covers, thereby ensuring that the second intersection H2 (target second intersection H21) moves outward to a distance greater than or equal to the safety distance d from the second outline N.

[0179] When the distance between the target second intersection point H21 and the second contour N is greater than or equal to the safety distance d, any second intersection point H2 among the plurality of second intersection points H2 can have a distance from the second contour N that is greater than or equal to the safety distance d.

[0180] Based on this, the boundary (second outline N) of the protective structure 50 can be prevented from overlapping with the second intersection H2 on the signal line 31, thereby preventing the boundary (second outline N) of the protective structure 50 from being formed in the groove Q at the position corresponding to the second intersection H2 on the signal line 31, reducing the probability of cracking of the protective structure 50, and thus improving the life of the light-emitting chip 40.

[0181] It should be noted that “relatively reducing the maximum span of the second outline N corresponding to the protection structure 50 along the arrangement direction X of the two pads 21 in the vertical pad group 20 ” may include the following two ways.

[0182] The first method is to reduce the maximum span of the second outline N corresponding to the protection structure 50 along the arrangement direction X perpendicular to the two pads 21 in the pad group 20, so that the distance between the second intersection H2 (target second intersection H21) and the second outline N is greater than or equal to the safety distance d. In other words, by adjusting the protection structure, the projected area of ​​the protection structure 50 on the substrate 10 is reduced, thereby increasing the distance between the boundary of the protection structure 50 (the second outline N) and the second intersection H2 it does not cover, so that the distance is greater than or equal to the safety distance d.

[0183] The second method is to increase the line width of the portion of the signal line 31 covered by the protective structure 50 so that the distance between the second intersection H2 (target second intersection H21) and the second outline N is greater than or equal to the safety distance d. In other words, by adjusting the signal line 31 and increasing its line width, the distance between the boundary of the protective structure 50 (the second outline N) and the second intersection H2 not covered by it is increased, so that the distance is greater than or equal to the safety distance d.

[0184] In some examples, as shown in Figures 11 and 12, the spacing G between two signal lines 31 in a signal line group 30 can be the spacing between two signal lines 31 in a signal line group 30 that need to be connected to the pad group 20, where the spacing G is approximately 130μm.

[0185] When the spacing between two signal lines 31 in a signal line group 30 that need to be connected to the pad group 20 is equal to or close to 130 μm, it can meet the size requirements of the light-emitting chip 40 that the signal line group 30 needs to connect to, and prevent the light-emitting chip 40 from subsequently having a cold solder joint with the pad 21 on the signal line 31, which is beneficial to improving the quality of the light-emitting substrate 100.

[0186] In some embodiments, as shown in Figures 9 and 11 , the signal line 31 connected to the pad 21 is divided into a plurality of sequentially connected sub-portions 311, with the extension directions of two interconnected sub-portions 311 intersecting. Among the plurality of sub-portions 311, the sub-portion 311 connected to the pad 21 is a first sub-portion 311a. Along the arrangement direction X of the two pads 21 in the pad group 20, the line width of the first sub-portion 311a is greater than the length of the pad 21.

[0187] Such a configuration can increase the size of the sub-portion 311 (first sub-portion 311a) connected to the pad 21, facilitate the subsequent connection of the signal line 31 to the pad 21, and also reduce the occurrence of cold solder joints, thereby improving the quality of the light-emitting substrate 100.

[0188] In some examples, the pad 21 and the first sub-portion 311a of the signal line 31 can be electrically connected via solder. The solder is a conductive material that allows the pad 21 to be securely and electrically connected to the first sub-portion 311a of the signal line 31. For example, the solder can include tin, gold, silver, or copper.

[0189] In some embodiments, as shown in FIG9 and FIG11 , among the plurality of sub-portions 311, the sub-portion 311 connected to the pad 21 is a first sub-portion 311a, and the sub-portions 311 other than the first sub-portion 311a are second sub-portions 311b. The line width of the second sub-portion 311b is less than or equal to the line width of the first sub-portion 311a.

[0190] When the line width of the second sub-section 311b is set to be smaller than the line width of the first sub-section 311a, the line width of the signal line 31 except for the sub-section (first sub-section 311a) connected to the pad 21 is relatively thin, which can facilitate the flexible setting of the signal line 31, so as to simplify the layout of the light-emitting substrate 100.

[0191] In addition, the other end of the signal line 31 away from the first sub-section 311a (the second sub-section 311b) may need to be electrically connected to the driver chip. Setting the line width of the second sub-section 311b to be narrower can also facilitate the connection between the signal line 31 and the pin of the driver chip to prevent short circuit problems.

[0192] When the line width of the second sub-portion 311b is set to be substantially equal to the line width of the first sub-portion 311a, the line width of the signal line 31 is substantially equal at any position. The line width of the signal line 31 can be larger, which helps reduce the impedance of the signal line 31, so that it can carry a higher current to meet the requirements of the light-emitting substrate 100. In addition, the light-emitting substrate 100 can also use the signal line 31 for heat dissipation, thereby improving the heat dissipation effect of the light-emitting substrate 100 and reducing the cost of the light-emitting substrate 100.

[0193] In some embodiments, as shown in FIG11 , the first sub-portions 311 a of two signal lines 31 connected to two pads 21 in a pad group 20 can be arranged relative to each other along the direction in which the two pads 21 are arranged. A gap is provided between the first sub-portions 311 a of the two signal lines 31 to prevent short circuits between the two signal lines 31.

[0194] As described above, in the two signal lines 31, the first sub-portion 311a of the first signal line 31 includes a side close to the first sub-portion 311a of the second signal line 31. The first sub-portion 311a of the second signal line 31 also includes a side close to the first sub-portion 311a of the first signal line 31.

[0195] On the basis that the pad 21 can be located on the side of the signal line 31 facing away from the substrate 10, the orthographic projection of the pad 21 on the substrate 10 can be set to be located on the orthographic projection of the signal line 31 connected thereto on the substrate 10. Based on this, the orthographic projection of the boundary of the pad 21 on the substrate 10 can be set to substantially overlap with the orthographic projection of the side edge of the signal line 31 connected thereto on the substrate 10.

[0196] In other words, the distance between two solder pads 21 in a solder pad group 20 is approximately equal to the distance between the first sub-portions 311a of two signal lines 31 connected to the solder pad group 20 in a signal line group 30. This can facilitate reducing the distance between the two solder pads 21 to facilitate matching the two pins of the corresponding light-emitting chip 40 and reduce the occurrence of cold solder joints.

[0197] In some embodiments, as shown in FIG11 , the first sub-portions 311 a of the two signal lines 31 connected to the two pads 21 in a pad group 20 may be arranged opposite to each other along the direction in which the two pads 21 are arranged. The second sub-portions 311 b of the two signal lines 31 may be located on both sides of the light-emitting chip 40 along a direction perpendicular to the arrangement of the two pads 21.

[0198] In other words, the remaining portions of the two signal lines 31, except for the first sub-portions 311a that need to be in direct contact with the pads 21, can be arranged along the edges of both sides of the light-emitting chip 40. Based on this, the arrangement of the signal lines 31 in the light-emitting substrate 100 can be facilitated, and the signal lines 31 in the light-emitting chip 40 do not need to be routed around to avoid other light-emitting chips 40, thereby simplifying the layout of the light-emitting substrate 100.

[0199] Figure 16 is a partial enlarged view of S in Figure 9. Figure 16 is mainly used to clearly illustrate the structure of the connecting wire 31 and the connection relationship between the connecting wire 31 and the pad 21. Therefore, Figure 16 does not illustrate the protection structure 50.

[0200] In some embodiments, as shown in conjunction with FIG9 and FIG16 , two signal lines 31 are connected to two pads 21 in the pad group 20: one signal line 31 includes an opening 01 on a side adjacent to the other signal line 31, and a connection portion 02 is disposed within the opening 01, communicating with the first signal line 31. The pads 21 are located on a side of the connection portion 02 facing away from the substrate 10. The two pins of the light-emitting chip 40 are electrically connected to the two connection portions 02 through the corresponding pads 21, thereby electrically connecting the light-emitting chip 40 to the two signal lines 31.

[0201] With such a configuration, the opening 01 on the signal line 31 can be used to limit the position of the pins of the light-emitting chip 40, thereby preventing the pins of the light-emitting chip 40 from being connected to the position of the connecting line 31, thereby ensuring that the pins of the light-emitting chip 40 are electrically connected to the connecting portion 02 located in the opening 01, thereby reducing the probability of a cold solder joint in the light-emitting chip 40.

[0202] In some examples, along the arrangement direction X of the two pads 21 in the pad group 20, the length of the connecting portion 02 is substantially equal to the length of the opening 01. Based on this, the size of the connecting portion 02 can be made larger, thereby ensuring the size of the pad 21 disposed thereon, so as to facilitate subsequent electrical connection between the light-emitting chip 40 and the pad 21.

[0203] In some examples, a gap is provided between the openings 01 in the two signal lines 31 connected to the two pads 21 in the pad group 20, thereby ensuring a gap between the two connecting portions 02 located within the two openings 01. This prevents the two pins of the light-emitting chip 40 from being short-circuited after being connected to the two connecting portions 02.

[0204] In other embodiments, as shown in Figures 13 and 14, the sum of the projected areas of the plurality of signal lines 31 in the light-emitting substrate 100 on the substrate 10 accounts for less than or equal to 30% of the total area of ​​the light-emitting substrate 100. For example, the sum of the projected areas of the plurality of signal lines 31 in the light-emitting substrate 100 on the substrate 10 accounts for approximately 25% to 30% of the total area of ​​the light-emitting substrate 100. With this design, the width of the signal lines 31 is smaller, and the design flexibility of the signal lines 31 is greater, thereby facilitating routing without interference between the signal lines 31 and other components in the light-emitting substrate 100, thereby preventing short circuits.

[0205] In some embodiments, as shown in Figures 13 and 14, the second contour N includes a plurality of first portions N1 and a plurality of second portions N2 that are alternately connected end to end, any first portion N1 is located within the orthographic projection of any signal line 31 in the signal line group 30 on the substrate 10, and any second portion N2 does not overlap with the orthographic projection of any signal line 31 in the signal line group 30 on the substrate 10; the sum of the lengths of the plurality of first portions N1 is less than the sum of the lengths of the plurality of second portions N2.

[0206] As set above, it is equivalent to dividing the second contour N corresponding to the orthographic projection of the protection structure 50 on the substrate 10 into two parts, the two parts being a first part N1 and a second part N2. The first part N1 of the second contour N is the part where the second contour N overlaps with the orthographic projection of the signal line 31 on the substrate 10, and the second part N2 of the second contour N is the part where the second contour N does not overlap with the orthographic projection of the signal line 31 on the substrate 10.

[0207] Within the same second contour, the sum of the lengths of the multiple first portions N1 is less than the sum of the lengths of the multiple second portions N2. In other words, the portion of the second contour N that overlaps with the orthographic projection of the signal line 31 on the substrate 10 is less than the portion of the second contour N that does not overlap with the orthographic projection of the signal line 31 on the substrate 10. In other words, the portion of the protection structure 50 that overlaps with the orthographic projection of the signal line 31 on the substrate 10 is less than the portion that does not overlap with the orthographic projection of the signal line 31 on the substrate 10.

[0208] Based on this, it can be seen that the orthographic projection area of ​​the signal line 31 on the substrate 10 is relatively small. In other words, the line width of the signal line 31 is relatively small, thereby increasing the flexibility of the signal line 31 layout and preventing short circuits. Furthermore, the overlap between the corner C (intersection H) of the signal line 31 and the boundary (second outline N) of the protective structure 50 can be further improved, thereby reducing the probability of cracking of the protective structure 50 and improving the quality of the light-emitting substrate 100.

[0209] In some embodiments, as shown in FIG13 , the signal line 31 connected to the pad 21 is divided into multiple sequentially connected sub-portions 311, with the extension directions of two interconnected sub-portions 311 intersecting. The multiple sub-portions 311 include a third sub-portion 311c and a fourth sub-portion 311d. The fourth sub-portion 311d is used to connect the pad 21 and the third sub-portion 311c. The orthographic projection of the third sub-portion 311c on the substrate 10 does not overlap with the orthographic projection of the protection structure 50 on the substrate 10.

[0210] In the above structure, since the orthographic projection of the third sub-portion 311c on the substrate 10 is located outside the second outline N, the intersection H included in the third sub-portion 311c is the second intersection H2. The orthographic projection of the second intersection H2 on the third sub-portion 311c on the substrate 10 is a safe distance from the second outline N corresponding to the protective structure 50. Based on this, the boundary (second outline N) of the protective structure 50 can be prevented from overlapping with the second intersection H2 on the signal line 31, thereby preventing the boundary (second outline N) of the protective structure 50 from forming within the groove Q at the position corresponding to the second intersection H2 on the signal line 31. This reduces the probability of cracking in the protective structure 50 and improves the lifespan of the light-emitting chip 40.

[0211] Furthermore, based on setting a safety distance between the orthographic projection of the second intersection point H2 on the third sub-portion 311 c on the substrate 10 and the second contour N corresponding to the protection structure 50 , a safety distance may also be set between the third sub-portion 311 c and the second contour N.

[0212] This configuration not only further increases the distance between the orthographic projection of the second intersection point H2 on the third sub-section 311c on the substrate 10 and the second contour N corresponding to the protective structure 50, ensuring that the distance is greater than or equal to the safety distance, but also increases the distance between the edges M1 on the third sub-section 311c to prevent the second contour N corresponding to the protective structure 50 from overlapping with the edges M1 on the third sub-section 311c. This prevents cracking at the boundary (second contour N) of the protective structure 50 due to the step difference between the edges M1 on the third sub-section 311c and the substrate.

[0213] As described above, the relative positional relationship between the fourth sub-portion 311 d and the protective structure 50 includes the following two types.

[0214] The first type: In the same signal line 31, when multiple sub-sections 311 include a fourth sub-section 311d, one end of the fourth sub-section 311d is connected to the pad 21, and the other end of the fourth sub-section 311d is connected to the third sub-section 311c. Because there is a safety distance between the third sub-section 311c and the second outline N, the side of the fourth sub-section 311d connected to the third sub-section 311c needs to extend outside the second outline N.

[0215] Based on this, the fourth sub-portion 311d includes two parts. The orthographic projection of one part of the fourth sub-portion 311d on the substrate 10 is located within the orthographic projection of the protection structure 50 on the substrate 10. In other words, the fourth sub-portion 311d is located within the second outline N. At this time, the orthographic projection of the other part of the fourth sub-portion 311d on the substrate 10 does not overlap with the orthographic projection of the protection structure 50 on the substrate 10. In other words, the other part of the fourth sub-portion 311d is located outside the second outline N.

[0216] As shown above, the fourth sub-section 311d includes a plurality of intersection points H, including a first intersection point H1 and a second intersection point H2. The first intersection point H1 is located within the second outline N, and the second intersection point H2 is located outside the second outline N. In this case, it is necessary to satisfy the requirement that both the first intersection point H1 and the second intersection point H2 have a safe distance from the second outline N.

[0217] This design can prevent the boundary (second outline N) of the protective structure 50 from overlapping with the intersection H (first intersection H1 and second intersection H2) on the signal line 31, thereby preventing the boundary (second outline N) of the protective structure 50 from being formed at the position corresponding to the intersection H (first intersection H1 and second intersection H2) on the signal line 31, reducing the probability of cracking of the protective structure 50, and thus improving the life of the light-emitting chip 40.

[0218] Second type: In the same signal line 31: When the multiple sub-segments 311 include at least two fourth sub-segments 311d, the fourth sub-segment 311d among the multiple fourth sub-segments 311d needs to be in contact with the third sub-segment 311c. Because there is a safety distance between the third sub-segment 311c and the second outline N, the side of the fourth sub-segment 311d connected to the third sub-segment 311c needs to extend outside the second outline N. In other words, the fourth sub-segment 311d in contact with the third sub-segment 311c consists of two parts. The orthographic projection of the portion of the fourth sub-segment 311d in contact with the third sub-segment 311c on the substrate 10 lies within the orthographic projection of the protection structure 50 on the substrate 10, and the orthographic projection of the other portion of the fourth sub-segment 311d in contact with the third sub-segment 311c on the substrate 10 does not overlap with the orthographic projection of the protection structure 50 on the substrate 10.

[0219] The orthographic projection of the fourth sub-portion 311d among the plurality of fourth sub-portions 311d that does not need to be in contact with the third sub-portion 311c on the substrate 10 is located within the orthographic projection of the protection structure 50 on the substrate 10. In other words, the orthographic projection of the fourth sub-portion 311d among the plurality of fourth sub-portions 311d that is indirectly in contact with the third sub-portion 311c on the substrate 10 is located within the orthographic projection of the protection structure 50 on the substrate 10.

[0220] Based on this, the fourth sub-section 311d, which is in contact with the third sub-section 311c, includes multiple intersection points H, including a first intersection point H1 and a second intersection point H2. The first intersection point H1 is located within the second outline N, while the second intersection point H2 is located outside the second outline N. In this case, it is necessary to ensure that the first intersection point H1 and the second intersection point H2 are both at a safe distance from the second outline N. The fourth sub-section 311d, which is indirectly in contact with the third sub-section 311c, includes multiple intersection points H, all of which are the first intersection point H1. Therefore, a safe distance must be set between the first intersection point H1 and the second outline N. This configuration can reduce the probability of cracking in the protective structure 50, thereby increasing the lifespan of the light-emitting chip 40.

[0221] In some embodiments, as shown in FIG. 14 , within the second outline N, the signal line 31 connected to the pad 21 includes at least three sequentially connected sub-portions 311 (a fourth sub-portion 311 d ), and the extension directions of two interconnected sub-portions 311 intersect.

[0222] As designed above, the orthographic projection of the protective structure 50 on the substrate 10 covers the multiple subsections 311 of the signal line 31 connected to the pad 21. In other words, within the second outline N, the multiple subsections 311 of the signal line 31 are arranged around the light-emitting chip 40. Because the signal line 31 has a certain thickness, the multiple subsections 311 within the second outline N can be reused as retaining walls to block external moisture, further preventing moisture from affecting the lifespan of the light-emitting chip 40 and improving the quality of the light-emitting substrate 100.

[0223] In some embodiments, as shown in FIG. 14 , within the second outline N, a plurality of sub-portions 311 (fourth sub-portion 311 d ) of at least one signal line 31 connected to the pad group 20 may be provided, surrounding at least a portion of the light-emitting chip 40 connected to the pad group 20 .

[0224] This arrangement is equivalent to arranging the signal line 31 connected to the pad group 20 within the second outline N around the light-emitting chip 40. At this time, since the signal line 31 has a certain thickness, the multiple sub-portions 311 (fourth sub-portion 311d) within the second outline N can be reused as a barrier to block external moisture, further preventing moisture from affecting the life of the light-emitting chip 40 and improving the quality of the light-emitting substrate 100.

[0225] The plurality of sub-portions 311 (fourth sub-portion 311 d ) of at least one signal line 31 connected to the pad group 20 surround at least a portion of the light-emitting chip 40 connected to the pad group 20 , which may include the following situations:

[0226] The first type: the plurality of sub-portions 311 (fourth sub-portion 311 d ) of the signal line 31 connected to one pad 21 in the pad group 20 are arranged along at least a portion of the outer edge of the light emitting chip 40 connected to the pad group 20 .

[0227] That is, the plurality of fourth sub-portions 311d of the signal line 31 may be disposed along a portion of the edge of the light emitting chip 40. Alternatively, the plurality of fourth sub-portions 311d of the signal line 31 may surround the light emitting chip 40.

[0228] Based on this, since the signal line 31 has a certain thickness, the multiple sub-portions 311 (the fourth sub-portion 311d) located within the second contour N can be reused as a retaining wall to block external water vapor, further preventing water vapor from affecting the life of the light-emitting chip 40 and improving the quality of the light-emitting substrate 100.

[0229] The second type: multiple sub-portions 311 (fourth sub-portion 311 d ) of two signal lines 31 connected to two pads 21 in the pad group 20 surround at least a portion of the light emitting chip 40 connected to the pad group 20 .

[0230] That is, multiple sub-portions 311 (fourth sub-portion 311d) of the signal line 31 connected to one of the pads 21 in the pad group 20 can be arranged along the outer edge of a portion of the light-emitting chip 40 connected to the pad group 20; and multiple sub-portions 311 (fourth sub-portion 311d) of the signal line 31 connected to another pad 21 in the same pad group 20 can be arranged along the outer edge of another portion of the same light-emitting chip 40.

[0231] Based on this, it is equivalent to arranging two signal lines 31 connected to two pads 21 in the pad group 20 within the second outline N to cooperate with each other to enclose the light-emitting chip 40. In this case, because the signal lines 31 have a certain thickness, the multiple sub-portions 311 (fourth sub-portion 311d) within the second outline N can be reused as a retaining wall. In other words, within the second outline N: Arranging multiple sub-portions 311 along the circumference of the light-emitting chip is equivalent to setting a retaining wall along the circumference of the light-emitting chip.

[0232] As shown in the above structure, not only can the protective structure 50 be used to protect the light-emitting chip 40, but the multiple sub-portions 311 located in the second contour N can also be used to block external water vapor, further preventing water vapor from affecting the life of the light-emitting chip 40 and improving the quality of the light-emitting substrate 100.

[0233] In some examples, five sub-portions 311 (fourth sub-portion 311 d ) of the signal line 31 connected to one pad 21 in the pad group 20 are located in the second outline N.

[0234] The five sequentially connected sub-sections 311 (the fourth sub-section 311d) can be arranged around the light emitting chip 40 to isolate moisture. This can also prevent the problem of short circuits caused by an excessive number of sub-sections 311 within the second outline N, which would result from an overly dense layout of the sub-sections 311 within the second outline N.

[0235] 14 , two pads 21 in pad group 20 are first pad 21a and second pad 21b. Signal lines 31 connected to first pad 21a are first signal lines 31a, and signal lines 31 connected to second pad 21b are second signal lines 31b.

[0236] In the case where the multiple sub-portions 311 (the fourth sub-portion 311d) of the first signal line 31a are arranged along the outer edge of a portion of the light-emitting chip 40 connected to the pad group 20, a portion of the sub-portions 311 of the multiple sub-portions 311 (the fourth sub-portion 311d) connected sequentially in the first signal line 31a that is away from the pad 21 may also be located between a portion of the second signal line 31b (a portion of the sub-portion 311 close to the pad 21 of the multiple sub-portions 311 connected sequentially) and the second contour N.

[0237] In addition, when the multiple sub-portions 311 (the fourth sub-portion 311d) of the second signal line 31b are arranged along the outer edge of another part of the same light-emitting chip 40, the partial sub-portion 311 of the multiple sub-portions 311 connected sequentially in the second signal line 31b that is away from the pad 21 can also be located between part of the first signal line 31a (the partial sub-portion 311 of the multiple sub-portions 311 connected sequentially that is close to the pad 21) and the second contour N.

[0238] With the above structure, the two signal lines 31 connected to the two pads 21 in the pad group 20 can completely surround the light-emitting chip 40, thereby preventing moisture from entering through the staggered sub-portions 311 of the two signal lines 31. Based on this, the signal lines 31 can be used to further prevent moisture from affecting the life of the light-emitting chip 40, thereby improving the quality of the light-emitting substrate 100.

[0239] In some embodiments, as shown in Figures 13 and 14 , a signal line 31 connected to a pad 21 is divided into a plurality of sequentially connected sub-portions 311, with the extension directions of two interconnected sub-portions 311 intersecting. Among the plurality of sub-portions 311, the sub-portion 311 connected to the pad 21 is a first sub-portion 311a. Along a direction perpendicular to the extension of the first sub-portion 311a, the line width of the first sub-portion 311a is substantially equal to the length of the pad 21.

[0240] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the difference between the line width of the first sub-section 311a and the length of the pad 21 in the direction perpendicular to the extension of the first sub-section 311a fluctuates within 10% of the line width of the first sub-section 311a or 10% of the length of the pad 21, it can also be considered that in the direction perpendicular to the extension of the first sub-section 311a, the line width of the first sub-section 311a and the length of the pad 21 are equal.

[0241] As designed above, the line width of the first sub-portion 311a connected to the pad 21 is substantially equal to the length of the pad 21, which can meet the connection requirements between the pad 21 and the signal line 31. In addition, the line width of the signal line 31 can be narrow, which can facilitate the flexible arrangement of the signal line 31.

[0242] It should be noted that in the above embodiment, when the signal line 31 includes one fourth sub-section, the fourth sub-section is the first sub-section, and when the signal line 31 includes multiple fourth sub-sections, the fourth sub-section among the multiple fourth sub-sections that is directly in contact with the pad 21 is the first sub-section.

[0243] In some embodiments, as shown in Figures 13 and 14 , the line widths of any two sub-portions 311 in the same signal line 31 are substantially equal. This arrangement allows the line widths at any position of the signal line 31 to be substantially equal, thereby simplifying the manufacturing process of the signal line 31.

[0244] In addition, when the line width of the first sub-portion 311a is substantially equal to the length of the pad 21 in a direction perpendicular to the first sub-portion 311a, the line widths of any two sub-portions 311 in the same signal line 31 are substantially equal. This allows the line width of the signal line 31 to be narrower, increasing the flexibility of the signal line 31 design and facilitating the connection with other devices in the light-emitting substrate 100 to prevent short circuits.

[0245] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the difference in line width between any two sub-sections 311 in the same signal line 31 fluctuates within 10% of the line width of any sub-section 311, it can also be considered that along the direction perpendicular to the extension of the first sub-section 311a, the line width of the first sub-section 311a is equal to the length of the pad 21.

[0246] The above embodiments mainly describe the relative positional relationship between the signal line 31 and the protective structure 50 in the light-emitting substrate 100 in conjunction with the accompanying drawings. Other structures in the light-emitting substrate 100 will be described below in conjunction with the accompanying drawings.

[0247] FIG17 is a cross-sectional view of a light emitting substrate according to some embodiments.

[0248] In some embodiments, as shown in FIG17 , the light-emitting substrate 100 further includes a reflective layer 60, which is located on the side of the film layer where the signal lines 31 are located facing away from the substrate 10. The reflective layer 60 includes a portion located on the side of the signal lines 31 facing away from the substrate 10, and also includes a portion located on the substrate 10 within the gaps between adjacent signal lines 31. The reflective layer 60 can reflect light emitted by the light-emitting chip 40 toward the light-emitting direction of the light-emitting substrate 100, thereby improving the light efficiency of the light-emitting substrate 100.

[0249] The reflective layer 60 includes a hollow region 61, and the orthographic projection of the pad 21 on the substrate 10 is located within the orthographic projection of the hollow region 61 on the substrate 10. A window position (hollow region 61) is preset in the reflective layer 60 to prevent the reflective layer 60 from being located between the signal line 31 and the pad 21, thereby affecting the connection between the signal line 31 and the pad 21 and affecting the light output of the light-emitting chip 40.

[0250] In some examples, the orthographic projection of the light emitting chip 40 on the substrate 10 is located within the orthographic projection of the hollow area 61 on the substrate 10. This can prevent the light emitting chip 40 from having a cold solder joint, thereby improving the quality of the light emitting substrate 100.

[0251] In some examples, the reflective layer 60 may be white, thereby achieving a higher reflectivity.

[0252] For example, the reflective layer 60 may be made of white ink to achieve high reflectivity. The white ink may include, for example, a resin (e.g., epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and an organic solvent (e.g., dipropylene glycol methyl ether).

[0253] For example, the material of the reflective layer 60 may further include silicone white glue. In the case where the material of the reflective layer 60 includes white ink or silicone white glue, the reflective layer 60 may be formed by printing the white ink or silicone white glue using a screen printing process.

[0254] In some embodiments, as shown in FIG17 , the light-emitting substrate 100 further includes an insulating layer 70 , which is located between the signal line 31 and the substrate (aluminum substrate) 10 . The insulating layer 70 can be used to prevent the signal line 31 from being connected to other conductive structures within the substrate (aluminum substrate) 10 .

[0255] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A light-emitting substrate, comprising: substrate; A pad group and a light-emitting chip, wherein the pad group includes two pads respectively connected to two pins of the light-emitting chip; A signal line group, comprising at least two signal lines respectively connected to two pads in the pad group, a gap being provided between any adjacent signal lines, an orthographic projection of any signal line in the signal line group on the substrate having a first profile, the first profile comprising a plurality of sequentially connected edges, any edge being a line without an inflection point, any two connected edges having an intersection, and the two edges having an angle in their extension directions at the intersection; A protective structure is located on a side of the light-emitting chip facing away from the substrate; an orthographic projection of the light-emitting chip on the substrate is located within an orthographic projection of the protective structure on the substrate; The positive projection of the protective structure on the substrate has a second contour, and the intersection includes a target first intersection point located within the second contour and with the minimum distance from the second contour, and there is a safety distance between the target first intersection point and the second contour, and / or, the intersection also includes a target second intersection point located outside the second contour and with the minimum distance from the second contour, and there is a safety distance between the target second intersection point and the second contour.

2. The light-emitting substrate according to claim 1, wherein: The second outline includes a plurality of first portions and a plurality of second portions connected alternately end to end, any of the first portions is located within an orthographic projection of any signal line in the signal line group on the substrate, and any of the second portions does not overlap with an orthographic projection of any signal line in the signal line group on the substrate; A sum of lengths of the plurality of first portions is greater than a sum of lengths of the plurality of second portions.

3. The light-emitting substrate according to claim 2, wherein: The second contour is a circle, and the ratio of the length L1 of the second portion to the circumference C of the second contour satisfies the following relationship: Wherein, R is the radius of the second contour, and d is the length of the safety distance.

4. The light-emitting substrate according to claim 2, wherein: The second contour is a circle, and the ratio of the length L1 of the second portion to the circumference C of the second contour satisfies the following relationship: Wherein, R is the radius of the second contour, and G is the distance between two signal lines in one signal line group.

5. The light emitting substrate according to any one of claims 2 to 4, wherein The signal line connected to the pad is divided into a plurality of sub-parts connected in sequence, and the extension directions of two sub-parts connected to each other intersect; Among the multiple sub-sections: the sub-section connected to the pad is a first sub-section, and along the arrangement direction of the two pads in the pad group, the line width of the first sub-section is greater than the length of the pad.

6. The light emitting substrate according to claim 5, wherein: Among the plurality of sub-sections, except the first sub-section, the other sub-sections are second sub-sections; The line width of the second sub-portion is smaller than or equal to the line width of the first sub-portion.

7. The light-emitting substrate according to claim 1, wherein: The second outline includes a plurality of first portions and a plurality of second portions connected alternately end to end, any of the first portions is located within an orthographic projection of any signal line in the signal line group on the substrate, and any of the second portions does not overlap with an orthographic projection of any signal line in the signal line group on the substrate; The sum of the lengths of the plurality of first portions is smaller than the sum of the lengths of the plurality of second portions.

8. The light-emitting substrate according to claim 7, wherein: The signal line connected to the pad is divided into a plurality of sub-parts connected in sequence, and the extension directions of two sub-parts connected to each other intersect; The plurality of sub-portions include a third sub-portion, an orthographic projection of the third sub-portion on the substrate does not overlap with an orthographic projection of the protection structure on the substrate, and the third sub-portion has the safety distance from the second contour.

9. The light-emitting substrate according to claim 7 or 8, wherein: In the second outline: the signal line connected to the pad includes at least three sub-portions connected in sequence, and the extension directions of two sub-portions connected to each other intersect.

10. The light emitting substrate according to claim 9, wherein: In the second contour: The plurality of sub-portions of at least one signal line connected to the pad group surround at least a portion of the light-emitting chip connected to the pad group.

11. The light emitting substrate according to any one of claims 8 to 10, wherein The signal line connected to the pad is divided into a plurality of sub-parts connected in sequence, and the extension directions of two sub-parts connected to each other intersect; Among the plurality of sub-portions: the sub-portion connected to the pad is a first sub-portion, and along a direction perpendicular to the extension of the first sub-portion, a line width of the first sub-portion is substantially equal to a length of the pad.

12. The light emitting substrate according to any one of claims 8 to 11, wherein The line widths of any two sub-portions in the same signal line are substantially equal.

13. The light emitting substrate according to any one of claims 1 to 12, wherein The length of the safety distance is greater than or equal to 0.3 mm.

14. The light-emitting substrate according to any one of claims 1 to 13, further comprising: A reflective layer, located on a side of the signal line facing away from the substrate; The reflective layer includes a hollow area, and the orthographic projection of the pad on the substrate is located within the orthographic projection of the hollow area on the substrate.

15. The light emitting substrate according to any one of claims 1 to 14, wherein The thickness of the signal line is greater than or equal to 20 μm.

16. The light emitting substrate according to any one of claims 1 to 15, wherein The cross-sectional profile of the protection structure is perpendicular to the plane of the substrate and protrudes in a direction away from the substrate.

17. A backlight module, comprising the light-emitting substrate according to any one of claims 1 to 16.

18. A display device comprising: A backlight module, wherein the backlight module is the backlight module according to claim 17; and, The liquid crystal display panel is located on the light-emitting side of the backlight module.

19. A display device comprising: A display panel comprising the light emitting substrate according to any one of claims 1 to 16.

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