Robot gripper and material cutting method

Abstract

This application discloses a robotic gripper and a wafer unloading method, relating to the field of semiconductor manufacturing technology. The robotic gripper includes a wafer loading / unloading control device, a support structure connected to the end of the wafer loading / unloading control device, and multiple adsorption element groups uniformly arranged on the support structure. Some adsorption element groups are equipped with retractable movable mechanisms. When the movable mechanisms extend or retract, the wafer planes on the adsorption element groups connected to the movable mechanisms and the wafer planes on the other adsorption element groups are parallel to each other and form a gap, enabling the simultaneous loading and unloading of multiple wafers. Through the above configuration, this application achieves the technical effect of loading and unloading multiple wafers in a single operation, improving wafer loading and unloading efficiency while reducing the time the robotic gripper occupies the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a robotic gripper and a method for unloading materials. Background Technology

[0002] Wafer polishing is one of the key processes in semiconductor manufacturing. It is mainly used to flatten the wafer surface to ensure the accuracy and yield of subsequent processes such as photolithography and thin film deposition.

[0003] The wafer polishing and grinding process takes place on the planetary wheel of the polishing and grinding equipment. After polishing and grinding, the wafer needs to be removed from the planetary wheel and placed in a buffer device for humidification. The buffer device is typically filled with water to keep the wafer moist. Currently, the unloading robot can usually only transport and buffer single wafers, resulting in long robot time during the unloading process and low efficiency of the entire polishing and grinding process.

[0004] Therefore, in order to improve the efficiency of wafer unloading and release the robotic arm in a timely manner, the applicant has developed a robotic gripper that can transport multiple wafers at the same time, enabling the simultaneous picking and placing of multiple wafers. Summary of the Invention

[0005] To address the shortcomings of existing technologies, one of the objectives of this application is to provide a robotic gripper capable of simultaneously picking up and placing multiple wafers.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] A robotic gripper, comprising:

[0008] include:

[0009] Upper and lower film control device

[0010] A support structure, connected to the end of the upper and lower control device and driven to move by the upper and lower drive device; and

[0011] Multiple adsorption element groups are disposed on the support structure and used to adsorb multiple wafers on the planetary wheel;

[0012] Some of the adsorption components are provided with a retractable movable mechanism;

[0013] When the active mechanism extends or shortens, the plane of the wafer on the adsorption assembly connected to the active mechanism and the plane of the wafer on the other adsorption assemblies are parallel to each other and form a gap.

[0014] With the above configuration, the number of adsorption groups is set according to the number of wafers on the planetary wheel, and the relative positions of the adsorption groups are consistent with the relative positions of the wafers on the planetary wheel. Multiple adsorption groups can simultaneously adsorb all wafers on the planetary wheel and transport them. After the moving mechanism adjusts the position of the wafers, the wafers are driven to a vertical position by the wafer loading and unloading control device. Then, all wafers are simultaneously placed in their corresponding buffer devices for storage and humidification. The moving mechanism design prevents the wafers on the adsorption groups from interfering with each other during placement after the wafers are positioned, thereby protecting the wafers and improving the efficiency of picking and placing.

[0015] Furthermore, the adsorption assembly includes

[0016] Structural plate, connected to the supporting structure; and

[0017] A flexible rod is provided in the middle of the structural plate;

[0018] The flexible rod extends from the connection point between the adjacent structural plate and the supporting structure in a direction away from the connection point. One end of the flexible rod near the connection point is fixed, and the other end is cantilevered.

[0019] Both the structural plate and the flexible rod are equipped with negative pressure suction cups for picking up wafers; the negative pressure suction cup on the structural plate is located near the connection between the structural plate and the supporting structure, while the negative pressure suction cup on the flexible rod is located at the end away from the flexible rod where it is fixed.

[0020] With the above setup, after the negative pressure suction cup picks up the wafer, the wafer lifting and lowering control device applies an upward force to the support structure, lifting the wafer upward. Because there is polishing fluid between the wafer and the wafer placement platform of the planetary wheel, the surface tension of the polishing fluid hinders the wafer's movement. This causes a lag in the upward movement of the flexible rod at the connection point with the wafer when the structural plate moves the wafer upward. Simultaneously, the flexible rod bends due to its flexibility, resulting in a situation where one end of the wafer is lifted while the other end remains attached to the planetary wheel. At this point, the wafer is tilted and can better resist the surface tension of the polishing fluid, thus preventing wafer cracking during upward movement. It should be noted that because the elastic deformation of the flexible rod buffers the surface tension of the polishing fluid, the wafer remains on the same plane, thereby protecting the wafer's integrity.

[0021] Furthermore, the flexible rod is positioned along the diameter of the wafer picked up by the corresponding adsorption assembly.

[0022] The above settings make the wafer more uniform and reasonable in terms of force. On the one hand, the wafer can better bear the pressure during the pressing process of the adsorption assembly, so as to stably discharge the polishing fluid between the wafer and the planetary wheel. On the other hand, the wafer can bear a more uniform force when it is lifted.

[0023] Furthermore, the structural plate has a receiving groove extending through its thickness in the middle, and the flexible rod is at least partially located in the receiving groove.

[0024] With the above configuration, the flexible rod deforms during the process of adsorbing and lifting the wafer. The receiving groove, which extends through the thickness of the structural plate, provides greater deformation space for the flexible rod, avoiding interference with its deformation. Simultaneously, the through-groove also allows operators to easily observe the movement trajectory and status of the flexible rod, facilitating timely adjustments to the operation or changes in the lifting force.

[0025] Furthermore, both ends of the receiving groove are located on the structural plate, and the flexible rod is located inside the receiving groove.

[0026] The above design enhances the overall integrity of the structural panel, reduces the impact of the opening of the receiving groove on the overall strength of the structural panel, and allows the flexible rod to be hidden inside the receiving groove, which facilitates the installation of the negative pressure suction cup and protects the flexible rod during the installation of the adsorption assembly.

[0027] Furthermore, at least one negative pressure suction cup is provided on both sides of the flexible rod on the structural plate, and the number of negative pressure suction cups on both sides of the flexible rod on the structural plate is the same.

[0028] With the above settings, the negative pressure suction cup ensures that the wafer experiences more uniform force on both sides of the flexible rod when adsorbing it, thereby reducing the probability of the wafer breaking due to uneven force.

[0029] Furthermore, the negative pressure suction cup on the flexible rod is disposed at one of the cantilevered ends of the flexible rod.

[0030] The above configuration allows the distance between the negative pressure suction cups on the flexible rod and the negative pressure suction cups on the structural plate to be closer to the wafer's diameter. This ensures that the wafer edges are also subjected to force when lifted, reducing the probability of edge breakage. Simultaneously, the flexible rod can also release greater deformation capacity to counteract the tension of the polishing fluid, allowing the wafer to be detached from the planetary wheel more quickly, easily, and safely.

[0031] Furthermore, multiple fixed suction cups are provided on the structural plate near the position where the negative pressure suction cup is provided on the flexible rod, and the multiple fixed suction cups are symmetrically arranged on both sides of the flexible rod.

[0032] With the above configuration, when the suction assembly presses down on the wafer to discharge the polishing slurry beneath it, the fixed suction cup can cooperate with the negative pressure suction cup to ensure more uniform pressure on the wafer, thus accelerating the discharge of the polishing slurry. Symmetrically positioning the fixed suction cups on both sides of the flexible rod further facilitates drainage.

[0033] Furthermore, the support structure is provided with fork arms for transporting single wafers.

[0034] With the above setup, a single wafer can be transported to the required location without changing the robot gripper, saving equipment costs and shortening the handling path.

[0035] The second objective of this application is to provide a feeding method that enables efficient transportation of multiple wafers in a single operation.

[0036] To achieve the above objectives, this application adopts the following technical solution:

[0037] A material handling method using a robotic gripper includes the following steps:

[0038] The mobile robot gripper moves to the planetary wheel and picks up 3 or 4 wafers from the planetary wheel;

[0039] The mobile robot gripper moves to the buffer device and adjusts the position of the corresponding wafer through the moving mechanism, so that the plane where the wafer is located on the adsorption assembly connected to the moving mechanism and the planes where the other wafers are located are spaced apart and parallel to each other;

[0040] The moving robotic gripper keeps the wafers upright and simultaneously places all the wafers on the robotic gripper onto the cache device.

[0041] This application provides a robotic gripper that transports multiple wafers by setting up multiple adsorption component groups. In conjunction with an active mechanism, the position of the wafers adsorbed on some of the adsorption component groups is adjusted so that the plane of the wafers on the adsorption component group connected to the active mechanism and the plane of the wafers on the other adsorption component groups are spaced apart and parallel to each other, thereby achieving the technical effect of placing all the wafers on the robotic gripper into the buffer device at the same time. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the robot gripper in the embodiments of this application;

[0043] Figure 2 A schematic diagram of the supporting structure and adsorption assembly;

[0044] Figure 3 This is a schematic diagram of the adsorption assembly after the wafer has been adsorbed.

[0045] Figure 4 A schematic diagram of the support structure and adsorption assembly from another perspective;

[0046] Figure 5 This is a simulation diagram of the forces acting on the adsorption assembly in Experiment 1;

[0047] Figure 6 This is a simulation diagram of the forces acting on the adsorption assembly in Experiment 2;

[0048] Figure 7 This is a simulation diagram of the forces acting on the adsorption assembly in Experiment 3.

[0049] Figure label:

[0050] 100. Loading / unloading control device;

[0051] 200. Support structure; 210. Fork arm;

[0052] 300. Adsorption component assembly; 310. Movable mechanism; 320. Structural plate; 321. Receiving groove; 322. Fixed suction cup; 330. Flexible rod;

[0053] 400. Negative pressure suction cup. Detailed Implementation

[0054] To enable those skilled in the art to better understand the present application, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0055] It should be noted that the directional terms such as up, down, left, right, front, and back, or ordinal numbers such as "first," "second," "third," and "fourth" mentioned in this document are introduced for ease of description based on the accompanying drawings and do not imply any limitation on the order of the components. Furthermore, since some parts of the components provided in the above embodiments have the same function, this specification uses a unified naming convention for these parts. The above provides a detailed description of the pipe connection device provided by the relevant technical solution. Specific embodiments have been used in this document for illustration. The descriptions of the above embodiments are only for helping to understand the method and core ideas of the present invention and are not intended to limit the present invention in any way.

[0056] like Figure 1 As shown, this application provides a robotic gripper for transporting materials back and forth between a loading module, a loading buffer module, a polishing and grinding machine, and a unloading buffer module. The robotic gripper includes a loading / unloading control device 100, a support structure 200 connected to the loading / unloading control device 100, and a plurality of adsorption component groups 300 fixed to the support structure 200.

[0057] Optionally, the upper and lower panel control device 100 is a robotic arm used to control the movement of the support structure 200.

[0058] Optionally, the support structure 200 is provided with a fork arm 210 for handling single wafers. Optionally, the fork arm 210 has a U-shaped sheet structure and has an adsorption function, which can remove and handle single wafers from the loading module.

[0059] Optionally, the number and arrangement of multiple adsorption element groups 300 on the support structure 200 can be consistent with the number and placement of wafers on the planetary wheel. Three or four wafers can be placed on the planetary wheel, meaning three or four adsorption element groups 300 can be arranged. For example... Figure 2 and 3 As shown, taking the arrangement of three adsorption element groups 300 as an example, the interval between adjacent adsorption element groups 300 is consistent, and the fork arm 210 is set between two of the adsorption element groups 300.

[0060] Specifically, some of the adsorption components 300 are equipped with a retractable movable mechanism 310, which can be a pneumatic slide or other linear telescopic structure.

[0061] In some embodiments, one of the adsorption element groups 300 is provided with an active mechanism 310 (not shown in the figure). When the wafer is in a horizontal state, when the active mechanism 310 is shortened, the horizontal plane of the wafer on the adsorption element group 300 connected to the active mechanism 310 is above the horizontal plane of the wafer on the other adsorption element groups 300, so that the three wafers can be placed in the buffer device without interfering with each other.

[0062] In other embodiments, two of the adsorption groups 300 are provided with a movable mechanism 310. When the wafer is in a horizontal state, when the movable mechanism 310 is extended, the horizontal plane of the wafer on the adsorption group 300 connected to the movable mechanism 310 is located below the horizontal plane of the wafer on the other adsorption groups 300, so that the three wafers can be placed in the buffer device without interfering with each other.

[0063] Combination Figure 3 and Figure 4 Optionally, the adsorption assembly 300 includes a structural plate 320 and a flexible rod 330 disposed in the middle of the structural plate 320. The flexible rod 330 extends from the connection position between the structural plate 320 and the support structure 200 away from the connection position. One end of the flexible rod 330 near the connection position is fixed to the structural plate 320, and the other end is cantilevered. Both the structural plate 320 and the flexible rod 330 are provided with negative pressure suction cups 400 for picking up wafers. The negative pressure suction cup 400 on the structural plate 320 is disposed near the connection position between the structural plate 320 and the support structure 200, and the negative pressure suction cup 400 on the flexible rod 330 is disposed away from the fixed end of the flexible rod 330.

[0064] After the adsorption assembly 300 adsorbs the wafer through the negative pressure suction cup 400, the wafer loading and unloading control device 100 drives the support structure 200 to move upward and applies an upward force to the wafer through the negative pressure suction cup 400 on the structure plate 320. The presence of polishing fluid and the flexible deformation capability of the flexible rod 330 make the upward force applied to the wafer by the negative pressure suction cup 400 on the flexible rod 330 smaller, thereby achieving the technical effect of slowly lifting the wafer from one side to overcome the tension of the polishing fluid.

[0065] Optionally, the flexible rod 330 is set along the diameter of the wafer picked up by the corresponding adsorption assembly 300 in the length direction, so that the polishing liquid under the wafer can be discharged more stably when the adsorption assembly presses down on the wafer.

[0066] Optionally, the structural plate 320 has a receiving groove 321 extending through its thickness direction in the middle, and the flexible rod 330 is at least partially located in the receiving groove 321, which can both allow the structural plate 320 to better avoid the deformation of the flexible rod 330 and protect the connection position between the flexible rod 330 and the structural plate 320.

[0067] In some embodiments, one end of the receiving groove 321 is located on the structural plate 320, and the other end passes through the end face of the structural plate 320, so that one cantilevered end of the flexible rod 330 passes through the through end of the receiving groove 321 (not shown in the figure).

[0068] In other embodiments, both ends of the receiving groove 321 are located on the structural plate 320, and the flexible rod 330 is located within the receiving groove 321. Specifically, the thickness of the flexible rod 330 is less than the thickness of the structural plate 320, so that the flexible rod 330 in the non-operating state can be completely hidden within the receiving groove 321, thereby protecting the flexible rod 330. This arrangement provides sufficient deformation space for the flexible rod 330 while ensuring better integrity of the structural plate 320.

[0069] Optionally, at least one negative pressure suction cup 400 is provided on both sides of the flexible rod 330 on the structural plate 320, and the number of negative pressure suction cups 400 on both sides of the flexible rod 330 is the same. Specifically, one negative pressure suction cup 400 is provided on each side of the flexible rod 330, and the two negative pressure suction cups 400 are symmetrically arranged with the flexible rod 330 as the line of symmetry.

[0070] Optionally, the negative pressure suction cup 400 on the flexible rod 330 is disposed at one cantilevered end of the flexible rod 330, so that the distance between the negative pressure suction cup 400 on the structural plate 320 and the negative pressure suction cup 400 on the flexible rod 330 is closer to the diameter of the wafer, thereby facilitating the removal of the wafer from the planetary wheel with polishing fluid.

[0071] Optionally, multiple fixed suction cups 322 are provided on the structural plate 320 at positions adjacent to the negative pressure suction cups 400 on the flexible rod 330, and the multiple fixed suction cups 322 are symmetrically arranged on both sides of the flexible rod 330. Specifically, two fixed suction cups 322 are provided on the structural plate 320.

[0072] This application also provides a material cutting method, including the following steps:

[0073] The adsorption assembly 300 is moved above the planetary wheel by the upper and lower control device 100 and adsorbs all the wafers on the planetary wheel. Specifically, the number of wafers on a single planetary wheel can be 3 or 4, and each adsorption assembly 300 adsorbs one wafer.

[0074] The upper and lower wafer control device 100 presses down the support structure 200 to apply pressure to the upper surface of the wafer to discharge the liquid between the wafer and the planetary wheel. Specifically, the discharged liquid is polishing fluid.

[0075] The mobile robot gripper moves to the buffer device and adjusts the position of the corresponding wafer through the movable mechanism 310, so that the plane where the wafer is located on the adsorption assembly 300 connected to the movable mechanism 310 and the planes where the other wafers are located are spaced apart and parallel to each other.

[0076] Optionally, when a single planetary wheel has four wafers, two of the adsorption assembly groups 300 are equipped with movable mechanisms 310. These mechanisms adjust the positions of the corresponding two wafers, ensuring that the planes containing these two wafers are spaced apart from and parallel to the planes containing the other two wafers. Specifically, the two adsorption assembly groups 300 equipped with the movable mechanisms 310 can be extended or shortened.

[0077] Optionally, when a single planetary wheel has 3 wafers;

[0078] In some embodiments, an actuating mechanism 310 is provided on two adsorption element groups 300. The actuating mechanism 310 is extended to adjust the position of two wafers on the corresponding adsorption element group 300. When all wafers are on a horizontal plane, the horizontal plane of the two wafers on the corresponding adsorption element group 300 is lower than the horizontal plane of the remaining wafer.

[0079] In some other embodiments, a movable structure 310 is provided on one of the adsorption element groups 300. The movable mechanism 310 is shortened so that the position of the wafer on the corresponding adsorption element group 300 is adjusted. When all wafers are on a horizontal plane, the horizontal plane of one wafer on the adsorption element group 300 corresponding to the movable mechanism 310 is higher than the horizontal plane of the other two wafers.

[0080] The wafer loading and unloading control device 100 moves the robot gripper to make the wafers vertical and simultaneously places all the wafers on the robot gripper onto the cache device.

[0081] It should be noted that when this application uses three negative pressure suction cups 400 and two fixed suction cups 322, the deformation generated by the flexible rod 330 can smoothly lift the wafer while ensuring that the wafer is not broken by external force. Specifically, a stress simulation test of the adsorption assembly 300 was conducted using a 12-inch wafer as the test object, and the following three sets of tests were set up respectively.

[0082] Experiment 1: such as Figure 5 As shown, when the wafer is lifted in an environment without polishing fluid between the wafer and the planetary wheel, the weight load of the 12-inch wafer is 1.5N. When the total load on the three negative pressure suction cups 400 is designed to be 2N, the maximum deformation of the flexible rod 330 is 1.3mm.

[0083] Experiment 2: such as Figure 6 As shown, when the wafer is lifted in an environment with polishing fluid between the wafer and the planetary wheel, the weight load of the 12-inch wafer is 1.5N, the simulated tension of the polishing fluid between the planetary wheel and the wafer is 3.5N, that is, the total load on the three negative pressure suction cups 400 is 5N, and the maximum deformation of the flexible rod 330 is 2.86mm.

[0084] Experiment 3: such as Figure 7 As shown, when a 20N pressure is applied to the support structure 200, the maximum deformation of the adsorption assembly is 0.09mm.

[0085] When selecting a 12-inch wafer as the object to be lifted, the wafer extraction needs to meet three conditions: first, the wafer must be placed in the slot and the deformation of the flexible rod 330 must not affect the wafer's entry into the corresponding slot for processing or storage; second, the wafer must be able to be tilted and lifted without damage under the resistance of liquid tension; and third, the wafer must be able to withstand uniform force during the pressure drainage process to achieve rapid drainage without being crushed by pressure.

[0086] Depend on Figure 5 It can be seen that the maximum deformation of the flexible rod 330 caused by lifting the wafer without resistance is 1.3mm, which meets the requirements for the wafer to enter various slots. From Figure 6 It can be seen that, under the resistance of liquid tension, the maximum deformation of the flexible rod 330 can exceed 2.8mm and reach 2.86mm. Simultaneously, the three negative pressure suction cups 400 are on the same plane, allowing the wafer to tilt but smoothly detach from the liquid tension area, overcoming liquid tension while protecting the wafer's integrity. Figure 7It can be seen that after applying downward pressure to the support structure 200, the maximum deformation of the structural plate 320 is 0.09mm. Therefore, the pressure transmitted to the wafer through the three negative pressure suction cups 400 and the two fixed suction cups 322 is relatively uniform. That is, the upper surface of the wafer bears relatively consistent and evenly distributed pressure, which allows the liquid below to be discharged quickly while avoiding the risk of the wafer breaking under external force.

[0087] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A robotic gripper, characterized in that, include: Upper and lower control device (100). The support structure (200) is connected to the end of the upper and lower control device (100) and is driven to move by the upper and lower drive device; as well as Multiple adsorption element groups (300) are disposed on the support structure (200) and used to adsorb multiple wafers on the planetary wheel; Some of the adsorption components (300) are provided with a retractable movable mechanism (310). When the active mechanism (310) extends or shortens, the plane of the wafer on the adsorption assembly (300) connected to the active mechanism (310) and the plane of the wafer on the other adsorption assembly (300) are separated and parallel to each other; The adsorption assembly (300) includes: Structural plate (320) is connected to the supporting structure (200); and A flexible rod (330) is disposed in the middle of the structural plate (320); The flexible rod (330) extends from the connection point between the adjacent structural plate (320) and the supporting structure (200) in a direction away from the connection point. One end of the flexible rod (330) near the connection point is fixed, and the other end is cantilevered. Both the structural plate (320) and the flexible rod (330) are provided with negative pressure suction cups (400) for picking up wafers; the negative pressure suction cups (400) on the structural plate (320) are located near the connection position between the structural plate (320) and the support structure (200), and the negative pressure suction cups (400) on the flexible rod (330) are located at the end away from the flexible rod (330) that is fixed.

2. The robot gripper according to claim 1, characterized in that, The flexible rod (330) is arranged along the length direction of the wafer picked up by the corresponding adsorption assembly (300).

3. The robot gripper according to claim 1, characterized in that, The structural plate (320) has a receiving groove (321) extending through its thickness direction in the middle, and the flexible rod (330) is at least partially located in the receiving groove (321).

4. The robot gripper according to claim 3, characterized in that, Both ends of the receiving groove (321) are located on the structural plate (320), and the flexible rod (330) is located inside the receiving groove (321).

5. The robot gripper according to any one of claims 2-4, characterized in that, At least one negative pressure suction cup (400) is provided on both sides of the flexible rod (330) on the structural plate (320), and the number of negative pressure suction cups (400) on both sides of the flexible rod (330) is the same.

6. The robot gripper according to claim 1, characterized in that, The negative pressure suction cup (400) on the flexible rod (330) is located at one of the cantilevered ends of the flexible rod (330).

7. The robot gripper according to claim 1, characterized in that, Multiple fixed suction cups (322) are provided on the structural plate (320) near the position where the negative pressure suction cup (400) is provided on the flexible rod (330), and the multiple fixed suction cups (322) are symmetrically arranged on both sides of the flexible rod (330).

8. The robot gripper according to claim 1, characterized in that, The support structure (200) is provided with fork arms (210) for transporting single wafers.

9. A material handling method, comprising using a robot gripper as described in any one of claims 1-8, characterized in that, The steps include: The mobile robot gripper moves to the planetary wheel and picks up 3 or 4 wafers from the planetary wheel; The mobile robot gripper moves to the buffer device and adjusts the position of the corresponding wafer through the active mechanism (310) so that the plane of the wafer on the adsorption assembly (300) connected to the active mechanism (310) and the plane of the other wafers are spaced apart and parallel to each other; The moving robotic gripper keeps the wafers upright and simultaneously places all the wafers on the robotic gripper onto the cache device.

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