Chip mounting device capable of being isolated from external environment

Abstract

The invention discloses a chip loading device capable of being isolated from the external environment, and relates to the field of semiconductor wafer storage and transportation, the chip loading device comprises a storage box, the storage box comprises an outer box and an inner box, one side of the outer box is provided with an exhaust hole, and one side of the storage box is provided with a sealing cabin door; the sealing cabin door comprises an outer door used for blocking the outer box and an inner door used for blocking the inner box, a negative pressure assembly is movably installed at the bottom of the outer box, and an air filtering assembly is installed on the side face of the outer box. A traditional single-layer FOUP box body is arranged to be a double-layer box body composed of the outer box body and the inner box body, meanwhile, air in the gap between the inner box body and the outer box body is sucked by arranging the miniature negative pressure pump, and by means of the low-pressure dust removal principle, the air entering the gap between the inner box body and the outer box body is filtered by the air filtering assembly and then enters the gap. Namely, the gap between the inner box and the outer box is created into a low-voltage and dust-free protection area, so that the dust-free protection area can be used for performing multiple protection on the inner box.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor wafer storage and transportation, and specifically to a chip loading device capable of isolating from the external environment. Background Art

[0002] In the semiconductor manufacturing industry, a FOUP box is a container used for storing and transporting semiconductor wafers, especially used during the wafer processing. Its main function is to protect the wafers during transportation and storage and prevent contamination. The FOUP box is usually made of plastic or other materials and has a closed design. It can be opened through a front door for wafer insertion and removal.

[0003] The FOUP box usually consists of a box body, a front door, a sealing ring, and an identification label. Some FOUP boxes also have mushroom heads on the top or side, which can cooperate with automated systems such as automated transfer systems and robots to reduce manual operation. The FOUP box can be directly transported by equipment such as automated systems. A sealing ring is installed between the front door and the box body of the FOUP to reduce dust entering the box body. The front door of the FOUP box is also designed to cooperate with many semiconductor devices such as semiconductor etching machines and wafer loaders. A locking mechanism or a mechanical lock is usually set between the front door and the box body of the FOUP for fixation. Mechanical devices that can open the front door of the FOUP box are installed in many semiconductor devices. That is, when the FOUP box is in use, the wafers stored in the FOUP box are directly transported and transferred by the automated system. When the FOUP box reaches a certain semiconductor processing device, the outer shell of the semiconductor processing device is hermetically docked with the FOUP box, and the internal mechanical device directly opens the locking mechanism or mechanical lock of the FOUP front door from the inside of the semiconductor processing device and then removes the front door to achieve wafer insertion and removal, which can effectively reduce the entry of particulate dust in the air into the semiconductor processing device and the inside of the FOUP box and achieve dust-free processing.

[0004] The FOUP box is widely used in the semiconductor manufacturing industry. It can not only transport wafers but also store wafers. However, the FOUP box needs to be cleaned and maintained regularly in a dust-free environment. Especially after the FOUP box is used outside the dust-free workshop, problems such as loose sealing between the front door and the box body may occur during long-term use of the FOUP box as a storage component (such as aging of the sealing ring, loose cooperation of the locking mechanism and mechanical lock), which may cause dust particles that may exist in the air to enter the inside of the box body and contaminate the wafers. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a chip loading device capable of isolating from the external environment to solve the technical problems mentioned in the above background.

[0006] To achieve the above object, the present invention provides the following technical solution: A chip mounting device capable of being isolated from the external environment, including a storage box. The storage box includes an outer box and an inner box, and an exhaust hole is provided on one side of the outer box. A sealing hatch is provided on one side of the storage box, and the sealing hatch includes an outer door for blocking the outer box and an inner door for blocking the inner box. A negative pressure component is movably installed at the bottom of the outer box, and an air filtration component is installed on the side of the outer box. The negative pressure component includes a box body, and a micro negative pressure pump is installed inside the box body. The micro negative pressure pump is connected to an electric control three-way valve, and a first air inlet hole is connected to the side of the electric control three-way valve. And a hose is connected between the first air inlet hole and the exhaust hole.

[0007] By adopting the above technical solution, by setting the traditional single-layer FOUP box body to a double-layer box body jointly composed of an outer box and an inner box, the entry of dust can be reduced. In this application, the inner and outer boxes are sealed by the inner and outer doors at the same time. First of all, the double-layer design will use two sets of sealing rings to improve the sealing performance and reduce the entry of dust. At the same time, the air in the gap between the inner and outer boxes is sucked by setting a micro negative pressure pump. Then, the air outside the outer box is at normal pressure, the air inside the inner box is also at normal pressure, and the air between the inner and outer boxes is at low pressure. Using the principle of low-pressure dust removal, the air entering the gap between the inner and outer boxes is filtered by the air filtration component and then enters. That is to say, a low-pressure and dust-free protection area is created in the gap between the inner and outer boxes. And the air inside the inner box is at normal pressure. According to the principle of air kinetics, air tends to flow from high pressure to low pressure. Therefore, the dust-free protection area can be used to provide multiple protections for the inner box.

[0008] The present invention is further configured such that two sets of engaging frames are symmetrically provided at the bottom of the outer box, and a reinforcing plate is provided on the side of the outer box. Two first extension plates matching the engaging frames are provided on the side of the box body, and a second extension plate is provided on the side of the box body. And the second extension plate and the reinforcing plate are fixed by setting a threaded rod.

[0009] Preferably, by providing an engaging frame and a reinforcing plate at the bottom of the outer box, the negative pressure component can be movably installed at the bottom of the outer box, so as to facilitate the disassembly and replacement of the negative pressure component.

[0010] The present invention is further configured such that a storage battery is provided inside the box body, and the storage battery is rechargeable and can provide energy for the micro negative pressure pump.

[0011] Preferably, by providing a storage battery inside the box body, the storage battery is rechargeable and can provide energy for the operation of the micro negative pressure pump. Then, the negative pressure component as a whole can be installed at the bottom of the storage box as a spare part for use.

[0012] The present invention is further configured such that a base is provided at the bottom of the box body, and a third sealing ring is installed at the bottom of the base. A second air inlet is also connected to one side of the electronic control three-way valve, and the second air inlet extends to the bottom of the base.

[0013] Preferably, by providing a base and a third sealing ring at the bottom of the box body, and then using the control of the electronic control three-way valve during the operation of the micro negative pressure pump, the micro negative pressure pump can be freely switched to draw air through the second air inlet. Thus, the negative pressure assembly and the storage box can be fixed to the workbench by the principle of negative pressure adsorption, improving the stability of the storage box when inserting and extracting the wafers.

[0014] The present invention is further configured such that the air filtration assembly includes a housing installed on the side of the outer box. One end of the housing is provided with an air inlet, and an efficient filter element is movably installed inside the housing. A regulating valve is connected to the top of the housing, and one end of the regulating valve is connected to an exhaust port, and the exhaust port is communicated with the inner wall of the outer box.

[0015] Preferably, by providing the air filtration assembly, the air entering between the outer box and the inner box can be filtered, reducing the entry of dusty air into the inner box. The regulating valve is electrically controlled and can control the flow rate of the air input between the outer box and the inner box, thereby cooperating with the micro negative pressure pump to keep the space between the outer box and the inner box in a low-pressure state for a long time.

[0016] The present invention is further configured such that a first sealing ring is provided on the side of the outer door, and the first sealing ring is used to improve the sealing performance between the outer door and the outer box.

[0017] Preferably, the sealing performance can be improved by providing a first sealing ring at the docking and installation position between the outer door and the outer box.

[0018] The present invention is further configured such that a second sealing ring is provided on the side of the inner door, and the second sealing ring is used to improve the sealing performance between the inner door and the inner box.

[0019] Preferably, the sealing performance can be improved by providing a second sealing ring at the docking and installation position between the inner door and the inner box.

[0020] The present invention is further configured such that a plurality of groups of first movable frames and second movable frames are movably installed on the side of the outer door, and the first movable frames, the second movable frames and the outer door are connected by a first spring. A plurality of fitting grooves matching the first movable frames and the second movable frames are provided on the side of the outer box.

[0021] Preferably, by movably installing a plurality of groups of first movable frames and second movable frames on the side of the outer door and engaging them into the fitting grooves on the side of the outer box, the sealing performance between the storage box and the sealed hatch door can be improved.

[0022] The present invention is further configured such that a guiding support disc is rotatably connected to the side of the outer door. The guiding support disc is matched with the first movable frame and the second movable frame, a ratchet wheel is provided at the top of the guiding support disc, and a knob is installed on the top of the ratchet wheel. The knob can cooperate with the automated transportation system.

[0023] Preferably, by providing the guiding support disc, multiple groups of the first movable frame and the second movable frame can be driven to move simultaneously. The cooperation of the ratchet wheel and the limiting component can prevent the guiding support disc from loosening.

[0024] The present invention is further configured such that a cover plate for covering multiple groups of the first movable frame and the second movable frame is provided on the side of the outer door, and a limiting component for restricting the rotation of the ratchet wheel is provided on the top of the cover plate.

[0025] Preferably, by providing the cover plate, multiple groups of the first movable frame and the second movable frame can be covered. The cover plate and the outer door are installed by screws, so that the overall sealed hatch is convenient for assembly, disassembly and maintenance.

[0026] The present invention is further configured such that the limiting component includes a mounting seat, a ejector rod is movably installed inside the mounting seat, and the ejector rod and the mounting seat are connected by a second spring. A magnetic block is installed at one end of the ejector rod, and the magnetic block can cooperate with the automated transportation system.

[0027] Preferably, by providing the limiting component and the ratchet wheel, the rotation of the guiding support disc can be restricted, thereby preventing multiple groups of the first movable frame and the second movable frame from loosening.

[0028] The present invention is further configured such that a mushroom head is provided on the top of the outer box, and the mushroom head can cooperate with the automated transportation system.

[0029] Preferably, by providing the mushroom head on the top of the outer box, the automated transportation system can transport and store the box by clamping and fixing the mushroom head.

[0030] In summary, the present invention mainly has the following beneficial effects: By setting the traditional single-layer FOUP box body into a double-layer box body composed of an outer box and an inner box, the present invention can reduce the entry of dust. In this application, the inner and outer boxes are sealed by the inner and outer doors. First, the double-layer design uses two sets of sealing rings, which can improve the sealing performance and reduce the entry of dust; Meanwhile, the air in the gap between the outer box and the inner box is sucked by a micro negative pressure pump, so that the air outside the outer box is at normal pressure, the air inside the inner box is also at normal pressure, and the air between the outer box and the inner box is at low pressure. Using the principle of low-pressure dust removal, the air entering the gap between the outer box and the inner box is filtered by the air filter assembly and then enters. That is, a low-pressure and dust-free protection area is created in the gap between the outer box and the inner box. Since the air inside the inner box is at normal pressure, according to the principle of air kinetics, air tends to flow from high pressure to low pressure. Therefore, the dust-free protection area can be used to provide multiple protections for the inner box; Compared with the traditional FOUP box, the gap between the box body and the front door installation docking is exposed to the external environment at normal pressure. Once the sealing ring ages or the locking parts loosen, dust particles in the air will enter the inside of the box body. In this application, since the gap between the inner box and the inner door during installation docking is in a low-pressure dust-free area, the air in the low-pressure dust-free area is cleaner after being filtered by the air filter assembly compared with the external air. Even if a small amount of dust accidentally enters the low-pressure dust-free area (when the filter element fails), due to the relatively high air pressure inside the inner box, the risk of these small amounts of dust entering the inside of the inner box is relatively low. Therefore, in this application, the double-layer design of the FOUP box can not only improve the sealing performance of the box body structurally, but also create a low-pressure dust-free space by combining the principle of negative pressure dust removal and the principle of air flow to provide multiple protections for the inner box, and can improve the cleanliness level of the FOUP when storing wafers.

[0031] The present invention can improve the sealing performance between the sealing hatch door and the outer box and the inner box by arranging multiple groups of first movable frames and second movable frames. The multiple groups of first movable frames and second movable frames are inserted into the fitting grooves of the outer box from multiple angles, improving the sealing performance of the entire circumference of the outer box edge. And a limiting component is arranged on the sealing hatch door to prevent the multiple groups of first movable frames and second movable frames from loosening, and the sealing performance of the sealing hatch door can be maintained for a long time. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the distribution of the storage box, mushroom head, air filter assembly and negative pressure assembly of the present invention; Figure 3 It is a schematic diagram of the storage box structure of the present invention; Figure 4 It is a schematic diagram of the distribution of the outer box and the inner box of the present invention; Figure 5 It is a schematic diagram of the distribution of the outer box, the inner box and the sealing hatch door of the present invention; Figure 6 It is a schematic diagram of the air filter assembly structure of the present invention; Figure 7 It is a schematic diagram of the negative pressure assembly structure of the present invention; Figure 8Schematic diagram of the internal structure of the negative pressure component of the present invention; Figure 9 Schematic diagram of the distribution of the box body, base, third sealing ring and second air inlet hole of the present invention; Figure 10 Schematic diagram of the distribution of the outer door, inner door, first sealing ring and second sealing ring of the present invention; Figure 11 Schematic diagram of the distribution of the outer door, cover plate and limiting component of the present invention; Figure 12 Schematic diagram of the distribution of the outer door and multiple groups of first movable frames and second movable frames of the present invention; Figure 13 Schematic diagram of the structure of the limiting component of the present invention.

[0033] Explanation of reference numerals: 1. Storage box; 101. Outer box; 102. Inner box; 103. Fitting groove; 104. Exhaust hole; 105. Clamping frame; 106. Reinforcing plate; 2. Mushroom head; 3. Sealed hatch door; 301. Outer door; 302. Inner door; 303. First sealing ring; 304. Second sealing ring; 305. First movable frame; 306. Second movable frame; 307. First spring; 308. Guide support disc; 309. Ratchet; 310. Knob; 311. Cover plate; 4. Air filtration component; 401. Housing; 402. Air inlet; 403. High-efficiency filter element; 404. Regulating valve; 405. Exhaust port; 5. Negative pressure component; 501. Box body; 502. First extension plate; 503. Second extension plate; 504. Threaded rod; 505. Energy storage battery; 506. Micro negative pressure pump; 507. Electric control three-way valve; 508. First air inlet hole; 509. Second air inlet hole; 510. Base; 511. Third sealing ring; 6. Limiting component; 601. Mounting seat; 602. Thumb rod; 603. Second spring; 604. Magnet. Detailed implementation manners

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as limiting the present invention.

[0035] Next, the embodiments of the present invention will be described according to the overall structure of the present invention.

[0036] Please refer to Figures 1 - 13, A chip mounting device capable of being isolated from the external environment, including a storage box 1. The storage box 1 includes an outer box 101 and an inner box 102. An exhaust hole 104 is provided on one side of the outer box 101. A sealed hatch 3 is provided on one side of the storage box 1. The storage box 1 adopts a double-layer design and is docked with the sealed hatch 3, which can improve the sealing performance structurally. The sealed hatch 3 includes an outer door 301 for blocking the outer box 101 and an inner door 302 for blocking the inner box 102. A negative pressure component 5 is movably installed at the bottom of the outer box 101. The negative pressure component 5 is used to extract the air between the outer box 101 and the inner box 102, so that a low pressure is maintained between the outer box 101 and the inner box 102. An air filtration component 4 is installed on the side of the outer box 101. The air filtration component 4 is used to filter the air entering between the outer box 101 and the inner box 102, improving the cleanliness of the air entering between the outer box 101 and the inner box 102. The negative pressure component 5 includes a box body 501, and a micro negative pressure pump 506 is installed inside the box body 501. The micro negative pressure pump 506 is connected to an electronic control three-way valve 507. A first air inlet hole 508 is connected to the side of the electronic control three-way valve 507. And a hose is provided for connecting between the first air inlet hole 508 and the exhaust hole 104.

[0037] In the above embodiment, specifically, please refer to Figure 6 and Figure 7 , Two groups of engaging frames 105 are symmetrically arranged at the bottom of the outer box 101. A reinforcing plate 106 is provided on the side of the outer box 101. Two first extension plates 502 matching the engaging frames 105 are provided on the side of the box body 501. A second extension plate 503 is provided on the side of the box body 501. And the second extension plate 503 and the reinforcing plate 106 are fixed by a threaded rod 504. By providing the engaging frames 105 and the reinforcing plate 106 at the bottom of the outer box 101, the negative pressure component 5 can be movably installed at the bottom of the outer box 101, facilitating the disassembly and replacement of the negative pressure component 5.

[0038] In the above embodiment, specifically, please refer to Figure 8 , A storage battery 505 is provided inside the box body 501. The storage battery 505 is rechargeable and can provide energy for the micro negative pressure pump 506. By providing the storage battery 505 inside the box body 501 and the storage battery 505 being rechargeable, it can provide energy for the operation of the micro negative pressure pump 506. Furthermore, the negative pressure component 5 as a whole can be installed at the bottom of the storage box 1 as a spare part for use.

[0039] In the above embodiment, specifically, please refer to Figure 9, a base 510 is provided at the bottom of the box body 501, and a third sealing ring 511 is installed at the bottom of the base 510. A second air inlet hole 509 is also connected to one side of the electric control three-way valve 507, and the second air inlet hole 509 extends to the bottom of the base 510. By providing the base 510 and the third sealing ring 511 at the bottom of the box body 501, and then the micro negative pressure pump 506 works under the control of the electric control three-way valve 507, so that the micro negative pressure pump 506 can freely switch to draw air through the second air inlet hole 509. Then, the negative pressure assembly 5 and the storage box 1 can be fixed on the workbench by using the principle of negative pressure adsorption, improving the stability of the storage box 1 when inserting and extracting the wafer.

[0040] In the above embodiment, specifically, please refer to Figure 6 , the air filtration assembly 4 includes a housing 401 installed on the side of the outer box 101. One end of the housing 401 is provided with an air inlet 402, and a high-efficiency filter element 403 is movably installed inside the housing 401. The top of the housing 401 is connected to a regulating valve 404, and one end of the regulating valve 404 is connected to an exhaust port 405, and the exhaust port 405 communicates with the inner wall of the outer box 101. By providing the air filtration assembly 4, the air entering between the outer box 101 and the inner box 102 can be filtered, reducing the entry of dusty air into the inner box 102. The regulating valve 404 is electrically controlled and can control the flow rate of the air input between the outer box 101 and the inner box 102, so as to cooperate with the micro negative pressure pump 506 to keep the space between the outer box 101 and the inner box 102 in a low-pressure state for a long time.

[0041] In the above embodiment, specifically, please refer to Figure 10 , a first sealing ring 303 is provided on the side of the outer door 301. The first sealing ring 303 is used to improve the sealing performance between the outer door 301 and the outer box 101. By providing the first sealing ring 303 at the docking and installation position of the outer door 301 and the outer box 101, the sealing performance can be improved.

[0042] In the above embodiment, specifically, please refer to Figure 10 , a second sealing ring 304 is provided on the side of the inner door 302. The second sealing ring 304 is used to improve the sealing performance between the inner door 302 and the inner box 102. By providing the second sealing ring 304 at the docking and installation position of the inner door 302 and the inner box 102, the sealing performance can be improved.

[0043] In the above embodiment, specifically, please refer to Figure 4 and Figure 12, multiple sets of first movable frames 305 and second movable frames 306 are movably installed on the side of the outer door 301, and the first movable frames 305, second movable frames 306 and the outer door 301 are connected by arranging first springs 307. Multiple sets of fitting grooves 103 that match the first movable frames 305 and second movable frames 306 are formed on the side of the outer box 101. By movably installing multiple sets of first movable frames 305 and second movable frames 306 on the side of the outer door 301 and engaging them into the fitting grooves 103 on the side of the outer box 101, the sealing performance between the storage box 1 and the sealing hatch 3 can be improved.

[0044] In the above embodiment, specifically, please refer to again Figure 11 and Figure 12 , a guiding support disc 308 is rotatably connected to the side of the outer door 301. The guiding support disc 308 matches the first movable frames 305 and second movable frames 306, and a ratchet wheel 309 is arranged on the top of the guiding support disc 308. And a knob 310 is installed on the top of the ratchet wheel 309. The knob 310 can cooperate with the automated transportation system. By arranging the guiding support disc 308, multiple sets of first movable frames 305 and second movable frames 306 can be driven to move simultaneously. Arranging the ratchet wheel 309 to cooperate with the limiting component 6 can prevent the guiding support disc 308 from loosening.

[0045] In the above embodiment, specifically, please refer to again Figure 11 , a cover plate 311 for covering multiple sets of first movable frames 305 and second movable frames 306 is arranged on the side of the outer door 301, and a limiting component 6 for restricting the rotation of the ratchet wheel 309 is arranged on the top of the cover plate 311. By arranging the cover plate 311, multiple sets of first movable frames 305 and second movable frames 306 can be covered. The cover plate 311 and the outer door 301 are installed by screws. Thus, the overall sealing hatch 3 is convenient for assembly, disassembly and maintenance.

[0046] In the above embodiment, specifically, please refer to again Figure 13 , the limiting component 6 includes a mounting seat 601, and a ejector rod 602 is movably installed inside the mounting seat 601. And the ejector rod 602 and the mounting seat 601 are connected by arranging a second spring 603. A magnetic block 604 is installed at one end of the ejector rod 602. The magnetic block 604 can cooperate with the automated transportation system. By arranging the limiting component 6 and the ratchet wheel 309, the rotation of the guiding support disc 308 can be restricted, and thus multiple sets of first movable frames 305 and second movable frames 306 can be prevented from loosening.

[0047] In the above embodiment, specifically, please refer to again Figure 2 , a mushroom head 2 is arranged on the top of the outer box 101. The mushroom head 2 can cooperate with the automated transportation system. By arranging the mushroom head 2 on the top of the outer box 101, the automated transportation system can transport the storage box 1 by clamping and fixing the mushroom head 2.

[0048] The present invention is specifically working as follows: when the FOUP box is inserting and extracting wafers, for example, when the FOUP box is placed on a wafer loader, the micro negative pressure pump 506 in the negative pressure assembly 5 is started, and the micro negative pressure pump 506 is controlled by the electric three-way valve 507 to work to suck the air in the space at the bottom of the base 510 through the second air inlet hole 509. Under the sealing effect of the third sealing ring 511, the base 510 and the workbench are in a negative pressure state, and then the entire FOUP box can be adsorbed on the workbench through the negative pressure, thereby improving the stability of the FOUP box. Qualitatively, the mechanical device in the semiconductor processing equipment matched with the FOUP box can open the two sets of limit assemblies 6 by magnetic adsorption, release the restrictions of the two sets of limit assemblies 6 on the ratchet 309, and then use the mechanical device to rotate the knob 310. Rotating the knob 310 will drive the guide support plate 308 to rotate, and then the multiple sets of first movable frames 305 and second movable frames 306 will withdraw from the fitting groove 103 under the resetting action of the first spring 307, and then the mechanical device can remove the sealed cabin door 3 to insert and extract the wafer from the inner box 102.

[0049] During the storage of the FOUP box, for example, when the FOUP box is placed on the storage rack, especially after the FOUP box opens the sealed hatch 3 to insert the wafer, the FOUP box will automatically perform dust removal maintenance. The micro negative pressure pump 506 is started through the control of the circuit board setting program in the box body 501. A hose is connected between the first air inlet 508 and the exhaust hole 104 through the control of the electric three-way valve 507, so that the micro negative pressure pump 506 can work to suck the air between the outer box 101 and the inner box 102 through the first air inlet 508. When the air pressure between the outer box 101 and the inner box 102 gradually decreases, the outside air will actively enter from the air inlet 402, be filtered by the high-efficiency filter element 403, and then pass through the regulating valve 404 and the exhaust hole 404. 405 enters between the outer box 101 and the inner box 102, the regulating valve 404 is an electrically controlled gas flow control valve, which can control and adjust the air flow entering between the outer box 101 and the inner box 102, and a gas pressure sensor is arranged between the outer box 101 and the inner box 102. The gas pressure sensor and the regulating valve 404 work together to feedback data and control the operation of the micro negative pressure pump 506, so that the outer box 101 and the inner box 102 are always in a low pressure state during the dust removal maintenance. That is, the air between the outer box 101 and the inner box 102 is sucked out by the micro negative pressure pump 506, and then the outside air is filtered through the high-efficiency filter element 403 and enters between the outer box 101 and the inner box 102, so as to maintain a low-pressure and dust-free state between the outer box 101 and the inner box 102.

[0050] The gap where the inner box 102 and the inner door 302 are installed and docked is located in the low-pressure dust-free area. Since the air in the inner box 102 is at normal pressure, according to the principle of air dynamics, even if there is a small amount of dust in the air in the low-pressure dust-free area, for example, the dust enters due to the decline in the filtration effect caused by the failure to replace the high-efficiency filter element 403 in time, it is very difficult for the dust to enter the inner box 102 and contaminate the wafers.

[0051] The automatic dust removal function of the FOUP box mainly realizes the isolation of dust by preventing dust from entering. When the FOUP box is in storage and the first sealing ring 303 and the second sealing ring 304 are aged and the sealing performance deteriorates after long-term use, in the traditional single-layer FOUP box, the dust in the normal-pressure air may enter the inside of the storage box 1 through the gap between the sealing hatch 3 and the storage box 1, thus contaminating the wafers. However, in this application, since the FOUP box adopts a double-layer design and is provided with a micro negative pressure pump 506 and an air filtration component 4 at the same time, the risk of dust entering when the first sealing ring 303 and the second sealing ring 304 are aged can be avoided. The double-layer design of the FOUP box can form a low-pressure and dust-free area, and the dust-free area surrounds the gap where the inner box 102 and the inner door 302 are installed and docked. The air in the dust-free area is filtered by the high-efficiency filter element 403, and the relative air cleanliness is higher. Naturally, the risk of dust entering the inner box 102 is smaller, and the air in the inner box 102 is at normal pressure. According to the principle of air dynamics, the air in the low-pressure dust-free area will not actively flow into the inside of the inner box 102.

[0052] The negative pressure component 5 in this application is detachable, and its built-in rechargeable energy storage battery 505 enables each group of FOUP boxes to replace the negative pressure component 5 for use.

[0053] Although the embodiments of the present invention have been shown and described, the specific embodiments are only explanations of the present invention and do not limit the invention. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions and variations without creative contributions to the embodiments according to needs, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A chip mounting device capable of being isolated from the external environment, including a storage box (1), characterized in that: The storage box (1) includes an outer box (101) and an inner box (102), and an exhaust hole (104) is provided on one side of the outer box (101). A sealing hatch (3) is provided on one side of the storage box (1), and the sealing hatch (3) includes an outer door (301) for blocking the outer box (101) and an inner door (302) for blocking the inner box (102). A negative pressure assembly (5) is movably installed at the bottom of the outer box (101), and an air filtering assembly (4) is installed on the side of the outer box (101). The negative pressure assembly (5) includes a box body (501), and a micro negative pressure pump (506) is installed inside the box body (501). The micro negative pressure pump (506) is connected to an electronically controlled three-way valve (507), and a first air inlet hole (508) is connected to the side of the electronically controlled three-way valve (507), and a hose is provided to connect the first air inlet hole (508) and the exhaust hole (104).

2. A chip mounting device capable of being isolated from the external environment according to claim 1, characterized in that: Two sets of engaging frames (105) are symmetrically provided at the bottom of the outer box (101), and a reinforcing plate (106) is provided on the side of the outer box (101). Two first extension plates (502) matching the engaging frames (105) are provided on the side of the box body (501), and a second extension plate (503) is provided on the side of the box body (501), and the second extension plate (503) and the reinforcing plate (106) are fixed by a threaded rod (504).

3. The chip mounting device capable of being isolated from the external environment according to claim 2, wherein: A storage battery (505) is provided inside the box body (501). The storage battery (505) is rechargeable and can provide energy for the micro negative pressure pump (506).

4. The chip mounting device capable of being isolated from the external environment according to claim 3, characterized in that: A base (510) is provided at the bottom of the box body (501), and a third sealing ring (511) is installed at the bottom of the base (510). A second air inlet hole (509) is also connected to one side of the electronically controlled three-way valve (507), and the second air inlet hole (509) extends to the bottom of the base (510).

5. The chip mounting device capable of being isolated from the external environment according to claim 4, characterized in that: The air filtering assembly (4) includes a housing (401) installed on the side of the outer box (101), and an air inlet (402) is provided at one end of the housing (401). A high-efficiency filter element (403) is movably installed inside the housing (401). A regulating valve (404) is connected to the top of the housing (401), and an exhaust port (405) is connected to one end of the regulating valve (404), and the exhaust port (405) is communicated with the inner wall of the outer box (101).

6. The chip mounting device capable of being isolated from the external environment according to claim 5, characterized in that: A first sealing ring (303) is provided on the side of the outer door (301). The first sealing ring (303) is used to improve the sealing performance between the outer door (301) and the outer box (101).

7. The chip mounting device capable of being isolated from the external environment according to claim 6, wherein: A second sealing ring (304) is provided on the side of the inner door (302). The second sealing ring (304) is used to improve the sealing performance between the inner door (302) and the inner box (102).

8. A chip mounting device capable of being isolated from the external environment according to claim 7, characterized in that: Multiple groups of first movable frames (305) and second movable frames (306) are movably installed on the side of the outer door (301), and the first movable frames (305), second movable frames (306) and the outer door (301) are connected by arranging first springs (307). Multiple fitting grooves (103) matching the first movable frames (305) and second movable frames (306) are formed on the side of the outer box (101).

9. A chip mounting device capable of being isolated from the external environment according to claim 8, characterized in that: A guiding support disc (308) is rotatably connected to the side of the outer door (301). The guiding support disc (308) matches the first movable frames (305) and second movable frames (306). A ratchet wheel (309) is arranged on the top of the guiding support disc (308), and a knob (310) is installed on the top of the ratchet wheel (309). The knob (310) can cooperate with the automatic transportation system.

10. A chip mounting device capable of being isolated from the external environment according to claim 9, characterized in that: A cover plate (311) for covering multiple groups of first movable frames (305) and second movable frames (306) is arranged on the side of the outer door (301), and a limiting component (6) for restricting the rotation of the ratchet wheel (309) is arranged on the top of the cover plate (311).

11. A chip mounting device capable of being isolated from the external environment according to claim 10, characterized in that: The limiting component (6) includes a mounting seat (601). A ejector rod (602) is movably installed inside the mounting seat (601), and the ejector rod (602) and the mounting seat (601) are connected by arranging a second spring (603). A magnetic block (604) is installed at one end of the ejector rod (602), and the magnetic block (604) can cooperate with the automatic transportation system.

12. A chip mounting device capable of being isolated from the external environment according to claim 11, characterized in that: A mushroom head (2) is arranged on the top of the outer box (101), and the mushroom head (2) can cooperate with the automatic transportation system.

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