A scalable Tbps high-speed optical transceiver communication system

Abstract

The present invention relates to the field of optical communication technology and discloses a scalable Tbps high-speed optical transceiver communication system, comprising an array transceiver, a single transceiver, a power module, and a network interface communication module. The array transceiver comprises a sub-array transmitter, a sub-array receiver, and a first digital signal processing module, wherein the number and position of the sub-array transmitters are adapted to the number and position of the sub-array receivers. The scalable Tbps high-speed optical transceiver communication system transmits various high-speed information streams through an optical transmitter integrated with a single-wavelength or multi-wavelength VSCEL array and driven by independent addressing. A receiver array equipped with high-speed photodetectors can receive various types of information sent by the transmitter. By designing both the transmitter and the receiver in the same module, parallel full-duplex communication can be provided. Due to its scalability, the fixed single total link rate of the communication transceiver is spatially adjustable and is not limited by the capacity requirements of the data center.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a scalable Tbps high-speed optical transceiver communication system. Background Art

[0002] Wireless optical communication, also known as free-space optical communication, is a candidate technology for high-speed wireless communications and a powerful complement to existing microwave and radio frequency communications. Its wide available spectrum, strong confidentiality, robust electromagnetic interference resistance, low power consumption, compact size, and high transmission capacity perfectly meet the demands of the nation and the times for communication equipment. With the rise of short-range wireless communications and the maturity of new light-emitting diode (LED) devices at the beginning of this century, new applications for short-range wireless optical communication emerged. In very short-range communication scenarios, such as chip-to-chip, chip-to-printed circuit board (PCB), and PCB-to-PCB, optical connections are all required. Indoors, Li-Fi has become a consumer product and is gradually being deployed in some fixed consumer electronics and appliances, with some industrial applications also in demand. Outdoor deployments are also rapidly developing in new areas of smart transportation and smart cities, such as intelligent transportation and streetlight communication. Light sources can include ultraviolet, visible, and infrared light. However, in the current application research and development stage of space optical communication, the mainstream is the LED visible light communication system. However, how to balance or even break the bandwidth-power limitation is the bottleneck of the LED communication system.

[0003] Currently, existing LED communications are unable to support optical interconnection with single-link rates exceeding 10Gbps and total rates exceeding 1Tbps. Furthermore, the LED light source is too divergent, and after passing through a strongly attenuated link to reach the receiving end, it is difficult to provide a high signal-to-noise ratio, resulting in poor light source characteristics. Furthermore, many existing wireless optical communication systems are incompatible with Ethernet interfaces and most switches and communication interface protocols. The data communication rate of their single-link intensity modulation direct detection scheme is limited and cannot be improved due to factors such as device bandwidth and the strong attenuation of the link, resulting in poor scalability. If LED or LD arrays are used for wireless optical communication, heat accumulation and heat dissipation often need to be considered. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention provides a scalable Tbps high-speed optical transceiver communication system with optical interconnects capable of supporting single-link transmission rates exceeding 10 Gbps and total transmission rates exceeding 1 Tbps. "Scalable" here refers to the ability to spatially tune the system's total transmission rate by combining multiple sub-links exceeding 10 Gbps. A single link uses a VCSEL as the light source. Its concentrated circular spot facilitates coupling, and its spot can be further shaped by peripheral optical modules. The system integrates multiple VCSEL pixel sources into a single module to form an array front end. The VCSEL's surface-emitting properties facilitate large-scale module testing of individual VCSEL links. Each single link is compatible with most commercial switch communication protocols, including 10G Ethernet interfaces and USB transmission. This highly scalable solution allows for the parallel transmission of multiple data streams using spatial resources, and modules can be stacked to meet application requirements. The system's transmitter light source can utilize multiple wavelengths or a single wavelength, typically using VCSEL devices near 850 nm for transmission over multimode fiber. This solution solves the problems of low signal rate, difficulty in integration, poor compatibility and scalability in optical interconnect modules where traditional LED communications have difficulty supporting single links above 10Gbps and total rates above 1Tbps. It can support more capacity at the same communication density.

[0005] To achieve the above optical interconnection that can support single link speed of more than 10Gbps and total speed of more than 1Tbps. This solution uses a "building block" structure optical transceiver design, which can be customized according to the needs of interconnection to achieve rate adaptation. The concentrated VCSEL light spot used is conducive to coupling and further shaping. Concentrating multiple VCSEL pixel light sources in the same module is conducive to large-scale module testing and communication from 10Gbps to Tbps and above. The single-link connection is compatible with most commercial switch communication protocols such as 10G Ethernet interface and USB transmission. This highly scalable solution allows the use of spatial resources to transmit multiple data streams in parallel, and can stack modules according to the needs of application scenarios. Multiple wavelengths or a single wavelength can be selected to increase the required communication rate. The present invention provides the following technical solutions: A scalable Tbps high-speed optical transceiver communication system, including an array transceiver, a single transceiver, a power module and a network interface communication module. The array transceiver includes sub-array transmitters, sub-array receivers and a first digital signal processing module. The number and position of the sub-array transmitters are adapted to the number and position of the sub-array receivers.

[0006] The sub-array transmitter uses an addressable array driver group and a surface-emitting VCSEL array as a light source;

[0007] The sub-array receiver adopts an addressable array amplifier group and a surface receiving light detector array;

[0008] The single transceiver includes a single transmitter, a single receiver and a second digital signal processing module, and the number and position of the single transmitters are adapted to the number and position of the single receivers.

[0009] Preferably, the single transmitter includes an addressable VCSEL driver and a high-bandwidth VCSEL light source group, which realizes high-speed transmission through high-speed serial transmission at the electrical port to low-speed parallel transmission at the optical port and then to high-speed serial transmission at the electrical port; the single receiver is composed of a post-amplifier combined with a PIN or APD photodetector array group.

[0010] Preferably, the first digital signal processing module and the second digital signal processing module both include encoding and modulating the input signal into a format suitable for channel transmission, and adopt different signal transmission formats according to the characteristics of the multi-mode optical fiber, network communication and free space optical communication adopted; the array driver group and the array amplifier group both adopt multiple discrete devices for independent modulation, and are integrated through CMOS chip integration and have addressing functions.

[0011] Preferably, the network interface communication module is internally provided with a variety of switch protocols, and a single sub-link can be used for compatible G Ethernet access, has good communication protocol compatibility with current network facilities, and supports both plug-in and network cable connection methods.

[0012] Preferably, the detectors in the sub-array receiver adopt an array structure composed of PIN or APD photodetectors based on silicon (Si) or gallium arsenide (GaAs), and the readout circuit module has an addressable function.

[0013] Preferably, a reflective device and a microlens can be added inside the array transceiver and the single transceiver to realize the lateral output of light for the multimode optical fiber communication system, and the number and position of the microlenses are adapted to the number and position of the surface-emitting VCSEL array and / or the single VCSEL light source group.

[0014] Preferably, a semiconductor heat dissipation module is provided at the bottom of the surface-emitting VCSEL array, and the semiconductor heat dissipation module is packaged together with the surface-emitting VCSEL array using semiconductor cooling fins.

[0015] Preferably, the network interface communication module further needs to select a serial-to-parallel converter according to actual conditions. When the input is a single high-speed data stream, the serial-to-parallel converter is selected to convert the high-speed data stream into a low-speed data stream and transmit it to the sub-array transmitter or the single transmitter respectively. If the input is multiple data streams, they are directly connected to the sub-array transmitter or the single transmitter respectively without going through the serial-to-parallel converter.

[0016] Preferably, the serial-to-parallel converter plus the parallel-to-serial converter cooperate to connect multiple array transceivers or single transceivers. When in use, they can be individually addressed and driven to increase the number of spatial channels and expand the transmission capacity. At the same time, the same signal drive can be loaded to increase the coverage of signal transmission and the communication stability of the link.

[0017] Compared with the prior art, the present invention provides a scalable Tbps high-speed optical transceiver communication system with the following advantages:

[0018] This scalable Tbps high-speed optical transceiver communication system, by using single-pixel LD or VCSEL devices, can support optical interconnection with a single link rate of more than 10Gbps and a total rate of more than 1Tbps. Through the concentrated light spot characteristics of its VCSEL, coupling and further shaping are carried out to effectively avoid the situation where the signal-to-noise ratio is reduced by passing through the link with strong attenuation. At the same time, the easy integration and easy driving characteristics of VCSEL enable the system to concentrate multiple pixel sources in the same module, which is suitable for large-scale module testing and production. By setting up multiple switch protocols inside the network interface communication module, the system is compatible with 10G Ethernet access and supports both plug-in and network cable connection methods.

[0019] 2. This scalable Tbps high-speed optical transceiver communication system can be expanded into multiple arrays to utilize equipment space resources and transmit multiple data streams in parallel. Modules can be superimposed according to the needs of the application scenario, and the required communication rate can be increased by selecting multiple wavelengths or a single wavelength. At the same time, when the single-link data rate remains unchanged, the overall rate increase is achieved through spatial channel multiplexing. Furthermore, through the design of the printed circuit board, the number of channels of the "driver-light source-microlens-channel-microlens-detector-amplifier" coupling pair in the channel transceiver can be customized and expanded according to actual needs, so that the overall data rate or communication reliability can be regulated and improved.

[0020] 3. This scalable Tbps high-speed optical transceiver communication system is responsible for sending various high-speed information streams through an optical transmitter integrated with a single-wavelength or multi-wavelength VSCEL array driven by independent addressing. High-speed transmission is achieved through high-speed serial transmission at the electrical port to low-speed parallel transmission at the optical port and then to high-speed serial transmission at the electrical port. A receiver array equipped with high-speed photodetectors receives various types of information sent by the transmitter. By designing both the transmitter and the receiver in the same module, parallel full-duplex communication can be effectively provided. Through its scalability, the single-link rate of the communication transceiver is fixed and the total link rate is spatially adjustable, which is not limited by the capacity requirements of the data center. The transmitting array can be customized according to the application scenario to increase the number of spatial links of the transceiver. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the communication between array transceivers in a scalable Tbps high-speed optical transceiver communication system proposed by the present invention;

[0022] Figure 2 This is a schematic diagram of bidirectional high-speed communication of an array transceiver in a scalable Tbps high-speed optical transceiver communication system proposed by the present invention;

[0023] Figure 3 This is a schematic diagram of array vertical emission and side emission in a scalable Tbps high-speed optical transceiver communication system proposed by the present invention;

[0024] Figure 4 This is a schematic diagram of a single transceiver in a scalable Tbps high-speed optical transceiver communication system proposed by the present invention;

[0025] Figure 5 A schematic diagram of a single transceiver coupling for a scalable Tbps high-speed optical transceiver communication system proposed by the present invention;

[0026] Figure 6 This is a schematic diagram of a single light source and an array light source in a scalable Tbps high-speed optical transceiver communication system proposed by the present invention.

[0027] In the figure: 1, array transceiver; 101, sub-array transmitter; 102, sub-array receiver; 103, first digital signal processing module; 104, semiconductor heat dissipation module;

[0028] 2. Single transceiver; 201. Single transmitter; 202. Single receiver; 203. Second digital signal processing module;

[0029] 3. Power module; 4. Network interface communication module; 5. Reflection device; 6. Microlens; 7. Serial-to-parallel converter; 8. Parallel-to-serial converter. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] A scalable Tbps high-speed optical transceiver communication system includes an array transceiver 1, a single transceiver 2, a power supply module 3 and a network interface communication module 4, wherein the single light source and the monolithic array light source are visible Figure 6 , set it on a printed circuit board (PCB), and expand the number of channels of the "driver-light source-microlens-channel-microlens-detector-amplifier" coupling pair in the channel transceiver according to actual needs, so that the total data rate or communication reliability can be controlled and improved. Its visible light or invisible light single pixel or array VCSEL serves as the light source of the scalable system, so that the system can achieve scalability of total rate growth through spatial channel multiplexing when the single link data rate remains unchanged. Specifically, for example, the array transceiver 1 and / or the single transceiver 2 can be tailored to support the connection of a high-speed dense link module with multiple low-speed single-link or few-link modules;

[0032] The network interface communication module 4 is internally configured with a variety of switch protocols. For example, a single sub-link can be used for compatible 10G Ethernet access, which has good communication protocol compatibility with current network facilities and supports both plug-and-play and network cable connection. The network interface communication module 4 also needs to select a serial-to-parallel converter 7 according to actual conditions. When the input is a single high-speed data stream, the serial-to-parallel converter 7 is selected to convert the high-speed data stream into a low-speed data stream and transmit it to the sub-array transmitter 101 or the single transmitter 201 respectively. If the input is multiple data streams, the serial-to-parallel converter is not used. 7, directly connected to the sub-array transmitter 101 or the single transmitter 201, and also includes a serial-to-parallel converter 7 and a parallel-to-serial converter 8 to cooperate with multiple array transceivers 1 or single transceivers 2. When in use, they can be individually addressed and driven, increasing the number of spatial channels and expanding the transmission capacity. At the same time, the same signal drive can be loaded to increase the coverage of signal transmission and the communication stability of the link. Through the serial-to-parallel converter 7 and the parallel-to-serial converter 8 before the transmitter, a single high-speed data stream can be converted into multiple low-speed data streams. At the back side of the receiver detector, the multiple low-speed data streams can be merged into a single high-speed data stream;

[0033] See also Figure 1, showing a schematic diagram of a scalable Tbps high-speed optical transceiver communication system communicating with each other, wherein each array transceiver 1 includes 1 to N sub-array transmitters 101 and corresponding 1 to N sub-array receivers 102, and the array transceiver 1 includes a sub-array transmitter 101, a sub-array receiver 102 and a first digital signal processing module 103, and the number and position of the sub-array transmitters 101 are adapted to the number and position of the sub-array receivers 102; the sub-array transmitter 101 uses an array driver group with a surface-emitting VCSEL array as a light source, and the number of light source sub-links can be customized according to actual conditions; the sub-array receiver 102 uses an array amplifier group with a surface-receiving light detector array, and the size of the receiving array is determined according to the number of light source sub-links. The detector in the sub-array receiver 102 is specifically based on silicon (Si) or gallium arsenide (GaAs). The array structure is composed of PIN or APD photodetectors. Different materials can be selected for design according to the actual wavelength. For the array transceiver 1 in this array form, a single pixel under the large array is a plurality of VCSEL sub-array devices, usually with a wavelength of 940nm. The bandwidth is limited but the optical power is high, which can support communication at a longer distance and can use a higher-order modulation format. The array driver group and the array amplifier group are independently modulated by multiple discrete devices. At the same time, they are integrated through CMOS tape-out and have an addressing function. Its independent addressing function can be used to connect with multiple array transceivers 1 to perform paired communication between low-rate modules and high-rate modules. The array can be integrated on-chip or arranged relatively sparsely on the PCB board as a transmitting subsystem. The array addressing can be performed in the controller to control specific devices to emit optical signals.

[0034] See also Figure 2 and Figure 3, showing the conceptual diagram of the array transceiver 1 entering the reflective device 5 and the microlens 6 to realize the lateral output and reception of light, as well as the comparison diagram of vertical emission and lateral emission entering the reflective device 5 and the microlens 6. The array transceiver 1 and the single transceiver 2 in the system can also be added with a reflective device 5 and a microlens 6 to enable the system to have an external optical system. The VCSEL light source and the light detector in the array transceiver 1 are expanded in N×N. The VCSEL array is integrated on a compact single chip to increase the channel capacity for the expansion of the light source under the regular arrangement. A semiconductor heat dissipation module 104 is provided at the bottom of the surface-emitting VCSEL array. The semiconductor heat dissipation module 104 is usually packaged together with a semiconductor cooling plate and the surface-emitting VCSEL array. The microlens 6 can also be replaced by a free-form surface lens. The laser light of the VCSEL array is directly coupled to the optical system such as the microlens 6 array and the reflective device. In free space, it is used to realize the lateral output of light for an optical communication system of a multimode optical fiber or a high-speed optical fiber with a pigtail, and the number and position of its microlenses 6 are adapted to the number and position of the surface-emitting VCSEL or / and single VCSEL light source group. The reflector 5 and the microlens 6 cooperate to increase the central collimated light power. If it is independently addressed and driven, it can also collimate the light output of the optical fiber to avoid mutual interference between multiple channels. The array transceiver 1 and the single transceiver 2 are both compatible with both pigtails and non-pigtails. For example, modules coupled in free space require spatial alignment, which is suitable for high-definition audio and video transmission scenarios of televisions where the product is strictly fixed in position and not easily obstructed. Connections with multimode optical fibers are suitable for module interconnection scenarios within data centers that require high reliability and high stability for continuous use and are difficult to align links in free space, thereby expanding the use scenarios of the system.

[0035] See also Figure 4 and Figure 5The single transceiver 2 includes a single transmitter 201, a single receiver 202, and a second digital signal processing module 203. The single transmitter 201 includes an addressable VCSEL driver and a high-bandwidth VCSEL light source group, and achieves high-speed transmission through the electrical port high-speed serial to the optical port low-speed parallel and then to the electrical port high-speed serial. The single receiver 202 is composed of a post-amplifier and a single-pixel PIN or APD photodetector group. The number and position of the single transmitters 201 are compatible with the number and position of the single receivers 202. For the setting of the single transceiver 2, there is only a single VCSEL device in a single pixel, and a high-bandwidth 850nm VCSEL device is often used. The bandwidth here is usually >10GHz, or even >25GHz. In this case, the optical power is relatively weak, requiring more stringent optical alignment. It is suitable for very short distance communication. Very short distance optical transmission technology (VSR) Very short distance (VSR) refers to a technology that uses optical connection technology and electrical interface specifications to communicate within a maximum connection length of no more than 600 meters. The "very short distance" specifically refers to optical communication technology below 100 meters. Multiple single transmitters 201 can be arranged regularly or irregularly according to actual conditions, and single receivers 202 can be arranged regularly or irregularly at corresponding positions. This allows the combination of multiple single transceivers 2 to achieve spatial scalability and is compatible with the expansion of pixel arrays in free space from single input and single output to multi-input and multi-output based on array structure. For single and array VCSEL devices, 850n is usually selected. m wavelength devices, but the system is not limited to this wavelength and can cover all wavelengths. For example, visible light mainly includes red light in the range of 620nm-680nm, invisible light includes near-infrared light in the range of 810nm-880nm, and near-infrared light in the range of 910nm to 960nm. For different application scenarios, especially module interconnection in data centers, VCSEL devices in the O-band / C-band, that is, VCSEL arrays near 1310nm and 1550nm are used in multi-fiber communication systems. A single transceiver 2 can be used for very short distances and short distances in free space.

[0036] The first digital signal processing module 103 and the second digital signal processing module 203 in the system both encode and modulate the input signal into a format suitable for channel transmission, using different signal transmission formats according to the characteristics of the multimode optical fiber, network communication, and free-space optical communication used. These formats include non-return to zero (NRZ), binary on-off keying (OOK), pulse amplitude modulation (PAM), pulse position modulation (PPM), and pulse width modulation (PWM) adapted to multimode optical fiber transmission, as well as orthogonal frequency division multiplexing (OFDM) adapted to free-space optical transmission.

[0037] Compared to LEDs, the VCSELs used in this system have an extremely low spectral half-width, high photoelectric conversion efficiency, low operating current, small beam divergence, good collimation, and long service life. Compared with traditional LEDs, VCSEL devices, due to their unique structure and excellent luminescence characteristics, have demonstrated potential and unique advantages in free-space communications. Using VCSELs as light sources to build space optical communication systems can achieve better system performance, higher bandwidth, more flexible tunability, and higher transmission rates. Therefore, compared with other short-range wireless communication technologies, the most significant advantage of VCSEL-based wireless optical communication is its high transmission rate. If the appropriate operating wavelength and device are selected, and under certain modulation methods, the transmission rate can reach several Gbps or even tens of Gbps. This allows the operating distance of this VCSEL-based optical transceiver communication system to span several meters to tens of meters or even higher, making it suitable for application scenarios such as between-board (several centimeters) and specific indoor and outdoor (several meters to tens of meters).

[0038] The electrical components mentioned in this article are all connected to an external main controller and 220V / 380V mains electricity, and the main controller can be a conventional known device that performs control such as a computer.

[0039] To summarize, in this scalable Tbps high-speed optical transceiver communication system, when in use, the independently addressing-driven optical transmitter integrated with a single-wavelength or multi-wavelength VSCEL array is responsible for sending various types of information, and the receiver array equipped with a high-speed photodetector can receive various types of information sent by the transmitter. During the design, the transmitter and receiver are both involved in the same module, which can provide parallel full-duplex communication. Due to its scalability, the single-link rate of the transceiver is fixed and the total link rate is not restricted. The device can be customized to expand the transmitting array according to the application scenario, thereby increasing the number of spatial links of the transceiver. For different application scenarios, the distance coverage of the free-space channel ranges from centimeters to tens of meters. For the centimeter level, the system can support communication between chips or boards. As the power of the device increases or there is a relatively large extended light source array, its communication distance or coverage range is significantly improved, that is, it can support meter-level communication applications.

[0040] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0041] In this application, terms such as "upper," "lower," "inner," "middle," "outer," "front," and "back" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0042] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0043] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A scalable Tbps high-speed optical transceiver communication system, characterized by: The invention comprises an array transceiver (1), a single transceiver (2), a power supply module (3) and a network interface communication module (4); the array transceiver (1) comprises a sub-array transmitter (101), a sub-array receiver (102) and a first digital signal processing module (103); the number and position of the sub-array transmitters (101) are adapted to the number and position of the sub-array receivers (102); The sub-array transmitter (101) uses an array driver group in conjunction with a surface-emitting VCSEL array as a light source, wherein the surface-emitting VCSEL array is compactly integrated on a single chip, and a semiconductor heat dissipation module (104) is provided at the bottom of the surface-emitting VCSEL array, wherein the semiconductor heat dissipation module (104) is packaged together with the surface-emitting VCSEL array using a semiconductor cooling fin; The sub-array receiver (102) adopts an array amplifier group and a surface receiving light detector array; The single transceiver (2) comprises a single transmitter (201), a single receiver (202), and a second digital signal processing module (203); the single transmitter (201) comprises an addressable VCSEL driver and a high-bandwidth VCSEL light source group, and realizes high-speed transmission through the electrical port high-speed serial to the optical port low-speed parallel and then to the electrical port high-speed serial; The single receiver (202) is composed of a post-amplifier and a PIN or APD photodetector group; The number and position of the single transmitters (201) are compatible with the number and position of the single receivers (202), and can support optical interconnection with a single link rate of more than 10Gbps and a total rate of more than 1Tbps; The first digital signal processing module (103) and the second digital signal processing module (203) both include encoding and modulating the input signal into a format suitable for channel transmission, and adopting different signal transmission formats according to the characteristics of the adopted multi-mode optical fiber, network communication and free space optical communication; the array driver group and the array amplifier group both adopt multiple discrete devices for independent modulation, and are integrated through CMOS tape-out and have an addressing function; A reflecting device (5) and a microlens (6) are further added to the array transceiver (1) and the single transceiver (2) to realize lateral light output of the multimode optical fiber communication system. The number and position of the microlenses (6) are adapted to the number and position of the surface-emitting VCSEL array and / or the VCSEL light source group.

2. The scalable Tbps high-speed optical transceiver communication system according to claim 1, characterized in that: The network interface communication module (4) is internally provided with a plurality of switch protocols, and a single sub-link is used for being compatible with 10G Ethernet access, has good communication protocol compatibility with current network facilities, and supports both plug-in and network cable connection modes.

3. The scalable Tbps high-speed optical transceiver communication system according to claim 1, characterized in that: The detectors in the sub-array receiver (102) adopt an array structure consisting of PIN or APD photodetectors based on silicon / gallium arsenide.

4. The scalable Tbps high-speed optical transceiver communication system according to claim 1, characterized in that: The network interface communication module (4) also needs to select a serial-to-parallel converter (7) according to actual conditions. When the input is a single high-speed data stream, the serial-to-parallel converter (7) is selected to convert the high-speed data stream into a low-speed data stream and transmit it to the sub-array transmitter (101) or the single transmitter (201). If the input is multiple data streams, they do not pass through the serial-to-parallel converter (7) and are directly connected to the sub-array transmitter (101) or the single transmitter (201).

5. The scalable Tbps high-speed optical transceiver communication system according to claim 4, characterized in that: The serial-to-parallel converter (7) and the parallel-to-serial converter (8) cooperate to connect a plurality of the array transceivers (1) or the single transceiver (2). When in use, the transceivers can be individually addressed and driven, thereby increasing the number of spatial channels and expanding the transmission capacity. At the same time, the same signal drive can be loaded to increase the coverage of the signal transmission and the communication stability of the link.

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