Circuit boards and switches

Abstract

The present application discloses a circuit board and a switch, belonging to the field of switch technology. The circuit board includes: at least one first circuit board, the first circuit board is configured with a switching chip, at least one proximal connector is arranged along the circumference of the switching chip, the distance between each proximal connector and the switching chip is less than the target distance threshold, and each proximal connector is connected to the switching chip; a plurality of second circuit boards, each second circuit board is configured with at least one optical module interface, and the proximal connector is connected to at least one optical module interface through a flying wire cable. When the switch of the present application needs to support different forms of optical module interfaces, it only needs to replace the second circuit board, which improves the flexibility and convenience of operation, reduces the design cost and processing cost of the switching chip board, improves the flexibility of replacement, and improves the maintainability of the whole machine; shortens the PCIe routing length on the circuit board, and reduces the complexity of the PCIe routing on the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of switches, and in particular to a circuit board and a switch. Background Art

[0002] A switch is a network device that forwards electrical (optical) signals and provides a dedicated electrical (optical) signal path for any two nodes connected to the switch. Common switches include Ethernet switches, telephone voice switches, and fiber optic switches. Switches can provide a variety of external interfaces, such as optical module interfaces, service network ports, management network ports, and debug serial ports. In related technologies, when users want to expand multiple different types of optical module interfaces, they need to design multiple switch chip boards to respectively carry different types of optical module interfaces. Most of the circuits of the switch chip are reused multiple times, and only a small part of the circuits of the different types of optical module interfaces are modified. This increases the design and processing costs of the board. In addition, in order to match different types of optical module interfaces, the entire machine needs to replace different switch chip boards, resulting in waste of switch chip boards, poor replacement flexibility, and low maintainability of the entire machine. Summary of the Invention

[0003] This application aims to solve at least one of the technical problems existing in the related art. To this end, this application proposes a circuit board and a switch. When it is necessary to support different types of optical module interfaces, only the second circuit board needs to be replaced. This improves the flexibility and convenience of operation, reduces the design and processing costs of the switch chip board, increases the flexibility of replacement, and improves the maintainability of the entire machine. It also shortens the PCIe routing length on the circuit board and reduces the complexity of the PCIe routing on the circuit board.

[0004] In a first aspect, the present application provides a circuit board, comprising:

[0005] At least one first circuit board, wherein the first circuit board is configured with a switching chip, and at least one proximal connector is arranged along the circumference of the switching chip, wherein the distance between each proximal connector and the switching chip is less than a target distance threshold, and each proximal connector is connected to the switching chip;

[0006] A plurality of second circuit boards are provided, each of the second circuit boards is configured with at least one optical module interface, and the proximal connector is connected to at least one of the optical module interfaces via a flying lead cable.

[0007] According to the circuit board provided in the embodiment of the present application, by designing the switching chip on a first circuit board and designing the optical module interface on another second circuit board, the switching chip only needs to be designed once, and there is no need for repeated design, which can reduce R&D costs. When it is necessary to support different forms of optical module interfaces, it is only necessary to replace the second circuit board, which improves the flexibility and convenience of operation. There is no need to replace different switching chip boards in the entire machine, which reduces the design cost and processing cost of the switching chip board, improves the flexibility of replacement, and improves the maintainability of the entire machine; and a proximal connector is closely arranged around the switching chip for accessing the optical module interface through a flying wire cable, which effectively reduces the loss of PCIe high-speed signals, extends the transmission distance of PCIe signals, and improves the anti-interference ability of the overall system; shortens the routing length of PCIe on the circuit board, reduces the complexity of PCIe routing on the circuit board, reduces the number of board layers of the board, reduces the board material requirements of the circuit board, and thus reduces the design cost and processing cost of the switching chip board.

[0008] In a circuit board according to an embodiment of the present application, the switching chip is configured with at least one interconnection channel, and the interconnection channel is connected to the proximal connector via a connecting cable; the at least one proximal connector is arranged in a one-to-one correspondence with the at least one interconnection channel.

[0009] In a circuit board according to an embodiment of the present application, the lengths of the connection cables between the interconnection channels and the proximal connectors are substantially the same.

[0010] In a circuit board according to an embodiment of the present application, the lengths of the flying lead cables are substantially the same.

[0011] In a circuit board of one embodiment of the present application, the first circuit board is configured with a programmable logic device, the programmable logic device is respectively connected to the switching chip and each of the second circuit boards, and the programmable logic device is used to obtain the low-speed signal corresponding to each of the second circuit boards.

[0012] In a circuit board of one embodiment of the present application, the first circuit board is configured with multiple first low-speed signal connectors, the first low-speed signal connectors are installed near the edge of the second circuit board, and the programmable logic device is connected to each of the first low-speed signal connectors.

[0013] In a circuit board of one embodiment of the present application, the second circuit board is configured with a second low-speed signal connector, and the second low-speed signal connector is installed near the edge of the first circuit board. Each second low-speed signal connector is arranged opposite to each first low-speed signal connector, and each first low-speed signal connector is connected to each second low-speed signal connector via a cable.

[0014] In a circuit board according to an embodiment of the present application, the at least one optical module interface includes at least one of a double-density four-channel small pluggable optical module interface, a pluggable optical module interface, an eight-channel small pluggable optical module interface, and an extended-density eight-channel small pluggable optical module interface.

[0015] In a circuit board according to an embodiment of the present application, when the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked up and down.

[0016] In a circuit board according to an embodiment of the present application, when the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is six, and every two second circuit boards are stacked up and down, and each second circuit board is configured with six double-density four-channel small form-factor pluggable optical module interfaces.

[0017] In a circuit board according to an embodiment of the present application, when the at least one optical module interface includes the pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked up and down.

[0018] In the circuit board of one embodiment of the present application, when the at least one optical module interface includes the pluggable optical module interface, the number of the multiple second circuit boards is six, and every two second circuit boards are stacked up and down, and each second circuit board is configured with three pluggable optical module interfaces.

[0019] In a circuit board according to an embodiment of the present application, when the at least one optical module interface includes the eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

[0020] In a circuit board of an embodiment of the present application, when the at least one optical module interface includes the eight-channel small form-factor pluggable optical module interface, the number of the multiple second circuit boards is three, and three eight-channel small form-factor pluggable optical module interfaces are configured on one side of each second circuit board, and three eight-channel small form-factor pluggable optical module interfaces are configured on the other side of each second circuit board.

[0021] In a circuit board according to an embodiment of the present application, when the at least one optical module interface includes the extended-density eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

[0022] In a circuit board of an embodiment of the present application, when the at least one optical module interface includes the extended-density eight-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is three, and the second circuit boards are configured with three extended-density eight-channel small form-factor pluggable optical module interfaces.

[0023] In a second aspect, the present application provides a switch, including:

[0024] The circuit board according to the first aspect;

[0025] A heat dissipation device, wherein the heat dissipation device and the first circuit board are respectively arranged on both sides of the switching chip.

[0026] In a switch according to an embodiment of the present application, the first circuit board is configured with a plurality of proximal connectors, the plurality of proximal connectors are arranged around the switching chip, and the heat dissipation device has a gap for avoiding the proximal connectors.

[0027] In a switch according to one embodiment of the present application, the heat dissipation device includes a first part and a second part that are connected, the first part covers the switching chip, the second part is installed on the first circuit board, the orthographic projection of the second part does not cover the proximal connector, and the second parts are arranged at intervals along the circumference of the switching chip, and the gap is formed between the first part and the second part.

[0028] In a switch according to an embodiment of the present application, the proximal connector is provided on each of the first side, the second side, and the third side of the switch chip; and the second part includes:

[0029] a first sub-part, located on a fourth side of the switching chip and connected to the first part;

[0030] The second sub-part is located outside the corner between the first side and the second side of the switching chip, and outside the corner between the second side and the third side of the switching chip, and the second sub-part is connected to the first part through a connecting section, and the connecting section passes through the gap between the two adjacent proximal connectors.

[0031] The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0032] By designing the switching chip on a first circuit board, designing the optical module interface on another second circuit board, and setting the optical module interfaces to be connected to the switching chip respectively, the switching chip only needs to be designed once, and there is no need for repeated design, which can reduce R&D costs. When it is necessary to support different forms of optical module interfaces, it is only necessary to replace the second circuit board, which improves the flexibility and convenience of operation, and there is no need to replace different switching chip boards in the entire machine, which reduces the design cost and processing cost of the switching chip boards, improves the flexibility of replacement, and improves the maintainability of the entire machine.

[0033] Furthermore, the optical module interface is designed separately on a circuit board. When it is necessary to support different forms of optical module interfaces, only the optical module interface board needs to be replaced, which makes the operation more flexible and convenient.

[0034] Furthermore, by forming a gap between the first part and the second part of the heat dissipation device to avoid the connector, the heat dissipation effect of the switching chip is ensured while avoiding the heat dissipation device interfering with the cable arrangement of the connector, thereby improving the user experience.

[0035] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0037] Figure 1 This is a schematic diagram of a system block diagram of a circuit board provided in an embodiment of the present application;

[0038] Figure 2 This is one of the structural diagrams of the circuit board provided in the embodiment of the present application;

[0039] Figure 3 This is the second structural diagram of the circuit board provided in the embodiment of the present application;

[0040] Figure 4 This is the third structural diagram of the circuit board provided in the embodiment of the present application;

[0041] Figure 5 This is the fourth structural diagram of the circuit board provided in the embodiment of the present application;

[0042] Figure 6 This is the fifth structural diagram of the circuit board provided in the embodiment of the present application;

[0043] Figure 7 This is the sixth structural diagram of the circuit board provided in the embodiment of the present application;

[0044] Figure 8 This is the seventh structural diagram of the circuit board provided in the embodiment of the present application;

[0045] Figure 9 This is the eighth structural diagram of the circuit board provided in the embodiment of the present application;

[0046] Figure 10 This is the ninth structural diagram of the circuit board provided in the embodiment of the present application;

[0047] Figure 11 This is the tenth structural diagram of the circuit board provided in the embodiment of the present application;

[0048] Figure 12 This is the eleventh structural diagram of the circuit board provided in the embodiment of the present application;

[0049] Figure 13 This is the twelfth structural diagram of the circuit board provided in the embodiment of the present application;

[0050] Figure 14 This is the thirteenth structural diagram of the circuit board provided in the embodiment of the present application;

[0051] Figure 15 This is a schematic diagram of the structure of the switch provided in the embodiment of the present application.

[0052] Reference numerals:

[0053] Circuit board 110; first circuit board 120; switching chip 130; second circuit board 140;

[0054] Optical module interface 150; proximal connector 260; flying lead cable 250; programmable logic device CPLD;

[0055] Heat dissipation device 160; first portion 170; connecting section 180; first sub-portion 190;

[0056] The second subsection 200; a double-density four-channel small form-factor pluggable optical module interface 210;

[0057] Pluggable optical module interface 220; eight-channel small pluggable optical module interface 230;

[0058] An extended density eight-channel small form-factor pluggable optical module interface 240; a first low-speed signal connector 270;

[0059] The second low-speed signal connector 280 . DETAILED DESCRIPTION

[0060] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0061] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0062] 1. In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limiting this application.

[0063] 2. In the description of this application, “plurality” means two or more.

[0064] The circuit board 110 provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0065] like Figure 1 As shown, the circuit board 110 includes at least one first circuit board 120 and a plurality of second circuit boards 140 .

[0066] In this embodiment, the printed circuit board 110 (PCB) is a support for electronic components and can serve as a carrier for electrically connecting the electronic components to each other.

[0067] The number of the at least one first circuit board 120 may be one or more, and the number of the at least one first circuit board 120 may be determined based on the type and number of optical module interfaces to be connected.

[0068] Each first circuit board 120 is configured with a switching chip 130 , and the switching chip 130 only needs to be designed once.

[0069] The switch chip 130 may be a PCIe Gen6 Switch chip (PCIe sixth-generation switch chip), where “PCIe” is the abbreviation for “Peripheral Component Interconnect Express”, which is a “high-speed serial computer expansion bus standard”.

[0070] The PCIe Gen6 Switch chip can support a single-channel data transmission rate of 64 GT / s. The PCIe Gen6 Switch chip supports multi-port and multi-form universal motherboard design.

[0071] The first circuit board 120 is configured with at least one proximal connector 260 .

[0072] At least one proximal connector 260 may be disposed circumferentially along the switch chip 130 .

[0073] The proximal connector 260 may be a connector packaged close to the switch chip 130 .

[0074] The distance between each proximal connector 260 and the switching chip 130 is less than a target distance threshold, wherein the size of the target distance threshold can be user-defined and is not limited in this application.

[0075] Each proximal connector 260 is connected to the switching chip 130 .

[0076] The plurality of second circuit boards 140 are used to carry optical module interfaces.

[0077] Multiple optical module interfaces are used to interconnect multiple network nodes and realize data exchange function of multiple network nodes.

[0078] Each second circuit board 140 may be configured with at least one optical module interface 150 . The number of the at least one optical module interface 150 may be one or more, and the number of the optical module interfaces 150 may be configured based on demand.

[0079] The proximal connector 260 may be connected to at least one optical module interface 150 via a Fly Pass Cable 250 (FPC).

[0080] At least one optical module interface 150 may be arranged based on the type of the optical module interface 150 to be connected, and the number of optical module interfaces 150 connected to one proximal connector 260 may be determined based on the type of the optical module interface 150 .

[0081] The optical module interface 150 can serve as a connector to connect to the switch chip 130 .

[0082] One end of the flying lead cable 250 is a connector close to the chip package (ie, the proximal connector 260 ), and the other end is a connector of the optical module interface 150 (which may be the optical module interface 150 ).

[0083] The flying lead cable 250 supports the transmission rate of the PCIe Gen6 Switch chip, and the flying lead cable 250 supports high-speed signal transmission.

[0084] In the present application, the proximal connector 260 is directly connected to the optical module interface 150 through a set of flying wire cables 250 that support PCIe Gen6 rates. There will no longer be a PCIe routing design on the optical module interface board (second circuit board 140). The PCIe high-speed signal can be transmitted through the flying wire cable 250, which effectively reduces the loss of PCIe high-speed signals, extends the transmission distance of PCIe signals, and improves the anti-interference ability of the overall system; shortens the PCIe routing length on the circuit board 110, reduces the complexity of the PCIe routing on the circuit board 110, reduces the number of board layers of the board, and reduces the board material requirements of the circuit board 110, thereby reducing the design cost and processing cost of the switch chip 130 board.

[0085] When multiple optical module interfaces 150 are configured on the second circuit board 140 , the arrangement of the multiple optical module interfaces 150 can be customized based on the chassis size of the circuit board 110 and user needs, and this application does not limit this.

[0086] like Figure 1 As shown, the optical module interface can be designed on the second circuit board 140, and the optical module interface board can be divided into three circuit boards, that is, the number of the multiple second circuit boards 140 can be three, or can be other numbers, which is not limited in this application.

[0087] In this application, the optical module interface is designed separately on a circuit board. When it is necessary to support different forms of optical module interfaces, only the optical module interface board needs to be replaced, which makes the operation more flexible and convenient.

[0088] The optical module interface board is divided into a plurality of second circuit boards 140 . When an interface of a certain interface board fails, the failed second circuit board 140 can be directly replaced, thereby improving maintainability.

[0089] In some embodiments, the layout and routing of other PCIe high-speed lines such as the CPU (central processing unit) and GPU (graphics processing unit) in the server can also use a combination of the proximal connector 260 and the flying lead cable 250, thereby reducing design difficulty and development costs.

[0090] According to the circuit board 110 provided in the embodiment of the present application, by designing the switching chip 130 on a first circuit board 120 and designing the optical module interface 150 on another second circuit board 140, it is only necessary to design the switching chip 130 once, without repeated design, which can reduce R&D costs. When it is necessary to support different forms of optical module interfaces, it is only necessary to replace the second circuit board 140, thereby improving the flexibility and convenience of operation, and there is no need to replace different switching chip 130 boards on the entire machine, thereby reducing the design cost and processing cost of the switching chip 130 board, and improving the flexibility of replacement. And improve the maintainability of the whole machine; and the proximal connector 260 is closely arranged around the switching chip 130, which is used to access the optical module interface 150 through the flying wire cable 250, effectively reducing the loss of PCIe high-speed signals, extending the transmission distance of PCIe signals, and improving the anti-interference ability of the overall system; shortening the PCIe routing length on the circuit board 110, reducing the complexity of the PCIe routing on the circuit board 110, reducing the number of board layers of the board, and reducing the board material requirements of the circuit board 110, thereby reducing the design cost and processing cost of the switching chip 130 board.

[0091] Continue to refer Figure 1 In some embodiments, the switch chip 130 is configured with at least one interconnect channel.

[0092] In this embodiment, the switch chip 130 may support one or more groups of interconnection channels, such as Figure 1 As shown, the switch chip 130 can support 9 groups of x16 PCIe Lanes, wherein each interconnect channel (x16 PCIe Lanes) can have 16 data channels (Lanes), and each channel can include a pair of differential signal lines and can be used for bidirectional full-duplex transmission.

[0093] The interconnection channels can be connected to the proximal connector 260 via a connecting cable. For example, each group of x16 PCIe Lanes can be connected to the proximal connector 260 after a cable is drawn out from the switch chip 130 .

[0094] Each interconnection channel can be connected to the optical module interface 150 via the proximal connector 260 .

[0095] like Figure 1 As shown, the switch chip 130 may include pins 0 to 8, and each pin may be connected to a proximal connector 260 .

[0096] In the present application, after the x16 interconnection channel is led out from the switching chip 130, it is immediately connected to the proximal connector 260, which helps to shorten the PCIe routing length on the first circuit board 120 and reduce the complexity of the PCIe routing on the board, thereby reducing the number of PCB layers of the board, reducing the PCB board requirements, and reducing the design cost and processing cost of the switching chip 130 board.

[0097] A group of x16 PCIe Lanes is connected to a proximal connector 260. Only nine proximal connectors 260 are required around the switch chip 130. The overall design meets the PCIe line requirements while ensuring a very compact layout of the switch chip 130 and the proximal connector 260, which helps to minimize the length of the PCIe traces on the PCB. The layout of the switch board is relatively simple, and the number of cables between the switch board and the optical module interface board is relatively small, making cable management simpler. This does not affect the fan's airflow path and the heat dissipation design.

[0098] In some embodiments, the lengths of the connecting cables between each interconnecting channel and the proximal connector 260 are substantially the same.

[0099] In this embodiment, the lengths of the connecting cables between each interconnecting channel and the proximal connector 260 may be the same or substantially the same. For example, the difference between the lengths of the connecting cables between each interconnecting channel and the proximal connector 260 may be less than a first length threshold, wherein the value of the first length threshold may be user-defined and is not limited in this application.

[0100] In some embodiments, the lengths of the flying lead cables 250 are substantially the same.

[0101] In this embodiment, the lengths of the flying wire cables 250 may be the same or substantially the same. For example, the difference between the lengths of the flying wire cables 250 may be less than a second length threshold, wherein the value of the second length threshold may be user-defined and is not limited in this application.

[0102] By using a flying wire cable 250 to interconnect the proximal connector 260 with the optical module interface 150, it can be ensured that the PCIe trace lengths from the switching chip 130 to each proximal connector 260 are basically consistent, and the lengths of each flying wire cable 250 are basically consistent, which can ensure that the PCIe trace lengths from all optical module interfaces of the circuit board 110 to the switching chip 130 are basically consistent, thereby ensuring that the delay time of each signal is basically the same, reducing the wiring difficulty of the board and reducing the design cost.

[0103] like Figure 1 As shown, in some embodiments, the first circuit board 120 may be configured with a programmable logic device (CPLD).

[0104] In this embodiment, a Complex Programmable Logic Device (CPLD) may be connected to the switch chip 130 and each second circuit board 140 , respectively.

[0105] The programmable logic device CPLD can be used to obtain the low-speed signal corresponding to each second circuit board 140 (ie, the optical module interface board).

[0106] The low-speed signal may include a reset signal, an interrupt signal, an I2C (Inter-Integrated Circuit, serial communication protocol) signal, a low-power control signal, and an optical module interface type ID signal. The low-speed signal may implement functions such as type identification, reset control, and status detection for the optical module interface 150.

[0107] Different types of optical modules require different low-speed signals. Compatible designs can be made to be compatible with the low-speed signals of multiple optical modules.

[0108] The programmable logic device CPLD can also be responsible for controlling the power-on or power-off timing, reset signal and hot-swap control logic of the switching chip 130. The CPLD can also provide common external indication interfaces, such as the LED status indicator and ERROR alarm indicator of each optical module interface 150.

[0109] In some embodiments, the first circuit board 120 is configured with a plurality of first low-speed signal connectors 270 .

[0110] In this embodiment, the plurality of first low-speed signal connectors 270 may be mounted near an edge of the second circuit board 140 .

[0111] The programmable logic device CPLD may be connected to each of the first low-speed signal connectors 270 .

[0112] In some embodiments, the second circuit board 140 is configured with a second low-speed signal connector 280 .

[0113] In this embodiment, each second low-speed signal connector 280 is mounted near an edge of the first circuit board 120 .

[0114] Each second low-speed signal connector 280 is disposed opposite to each first low-speed signal connector 270 .

[0115] Each first low-speed signal connector 270 is connected to each second low-speed signal connector 280 through a cable.

[0116] like Figure 1As shown, the programmable logic device CPLD can be connected to a first low-speed signal connector 270 through the internal wiring of the first circuit board 120, and the first low-speed signal connector 270 can be connected to the second low-speed signal connector 280 on the second circuit board 140 through a cable.

[0117] In this application, a programmable logic device CPLD is provided to be connected to the second low-speed signal connector 280 using an ordinary cable to obtain the low-speed signal of each second circuit board 140 (optical module interface board), thereby reducing hardware complexity and lowering development costs.

[0118] In some embodiments, the at least one optical module interface 150 includes at least one of a double-density quad small form-factor pluggable optical module interface 210 , a pluggable optical module interface 220 , an octal small form-factor pluggable optical module interface 230 , and an extended-density octal small form-factor pluggable optical module interface 240 .

[0119] In this embodiment, in the Quad Small FormFactor Pluggable-Double Density (QSFP-DD) optical module interface 210 , the rate of each channel is up to 25 Gb / s or 50 Gb / s.

[0120] The pluggable optical module interface 220 (400 Gigabits Form-factor Pluggable, CDFP) has 16 channels, a maximum data rate of 28 Gbps, and a total bandwidth of 400 Gbps.

[0121] The Octal Small Form-factor Pluggable (OSFP) 230 optical module interface has a rate of up to 25 Gb / s or 50 Gb / s per channel and supports 100G or 200G transmission.

[0122] The Octal Small Form-factor Pluggable-eXtended Density (OSFP-XD) 240 optical module interface supports a data rate of 212.5 Gb / s per channel over single-mode fiber. Through parallel transmission through eight independent channels, its total bandwidth reaches 1.6 Tb / s (8 × 212.5 Gb / s).

[0123] like Figure 2An example of an FPC cable supporting two QSFP-DD interfaces is provided. The FPC cable interconnects the proximal connector 260 with two QSFP-DD optical module interfaces. The proximal connector 260 supports a group of x16 PCIe Lanes, and one QSFP-DD optical module interface supports x8 PCIe Lanes. Two QSFP-DD optical module interfaces can be set.

[0124] In some embodiments, when the at least one optical module interface 150 includes a double-density quad small form-factor pluggable optical module interface 210 (QSFP-DD), the number of the at least one first circuit board 120 is two.

[0125] In some embodiments, when at least one optical module interface 150 includes a double-density four-channel small pluggable optical module interface 210, the number of the plurality of second circuit boards 140 is six, and every two second circuit boards 140 are stacked up and down, and each second circuit board 140 is configured with six double-density four-channel small pluggable optical module interfaces 210.

[0126] In this embodiment, the chassis height of the circuit board 110 is 1U, which is approximately 44.45 mm; the width of the chassis is 19 inches, which is approximately 482.6 mm; the height of the QSFP-DD optical module interface is 12.45 mm and the width is 20.55 mm; the front window of the entire machine can be arranged with a maximum of two layers of QSFP-DD optical module interfaces, with each layer having a maximum of 18 QSFP-DD optical module interfaces; and 6 QSFP-DD optical module interfaces can be arranged on each second circuit board 140.

[0127] Two first circuit boards 120 may be placed inside the circuit board 110 . Each first circuit board 120 is provided with a switching chip 130 . The two first circuit boards 120 may be stacked one above the other.

[0128] like Figure 3 As shown, six second circuit boards 140 can be placed inside the circuit board 110, and every two second circuit boards 140 are stacked. Six QSFP-DD optical module interfaces can be placed on each second circuit board 140, wherein every two QSFP-DD optical module interfaces are as shown in FIG. Figure 2 Place as shown.

[0129] Continue to refer Figure 3 The whole machine can provide 36 QSFP-DD optical module interfaces. The number of interfaces of the circuit board 110 has been maximized, thereby realizing the data exchange function of 36 nodes.

[0130] like Figure 4As shown, the switch chip 130 can be placed in the center of the first circuit board 120, and the left side, right side and top side of the switch chip 130 can be close to the switch chip 130 to prevent three proximal connectors 260, that is, a total of 9 proximal connectors 260 can be set around the switch chip 130, and each proximal connector 260 leads to a group of x16 PCIe Lanes, which can be connected through Figure 2 The FPC cable shown connects two QSFP-DD optical module interfaces.

[0131] In the actual implementation process, you can refer to Figure 4 The connection method shown here is used for cable interconnection, which can maintain the normalization of FPC cable length and ensure consistent PCIe signal delay on different optical module interfaces.

[0132] Figure 5 An example of an FPC cable supporting a pluggable optical module interface 220 (CDFP) is provided. The FPC cable interconnects a proximal connector 260 and a CDFP-type optical module interface. The proximal connector 260 supports a set of x16 PCIe Lanes. A CDFP-type optical module interface can support x16 PCIe Lanes, and a CDFP-type optical module interface can be set.

[0133] In some embodiments, when the at least one optical module interface 150 includes a pluggable optical module interface 220 , the number of the at least one first circuit board 120 is two, and the two first circuit boards 120 are stacked one on top of the other.

[0134] In some embodiments, when at least one optical module interface 150 includes a pluggable optical module interface 220 , the number of the plurality of second circuit boards 140 is six, and every two second circuit boards 140 are stacked up and down, and each second circuit board 140 is configured with three pluggable optical module interfaces 220 .

[0135] In this embodiment, the height of the CDFP optical module interface is 12.45 mm and the width is 36.74 mm. The front window of the entire machine can be arranged with a maximum of two layers of CDFP optical module interfaces, with a maximum of 9 CDFP optical module interfaces on each layer. Three CDFP optical module interfaces can be arranged on each interface board.

[0136] Two first circuit boards 120 may be placed inside the circuit board 110 . Each first circuit board 120 is provided with a switching chip 130 . The two first circuit boards 120 may be stacked one above the other.

[0137] like Figure 6As shown, six second circuit boards 140 can be placed inside the circuit board 110, with every two second circuit boards 140 stacked. Three CDFP optical module interfaces can be placed on each second circuit board 140. The whole machine can provide 18 CDFP optical module interfaces. The number of interfaces of the circuit board 110 has been maximized, thereby realizing the data exchange function of 18 nodes.

[0138] like Figure 7 As shown, each proximal connector 260 can lead to a set of x16 PCIe Lanes. Figure 5 The FPC cable shown is connected to a CDFP optical module interface.

[0139] like Figure 8 An example of an FPC cable that supports two eight-channel small form-factor pluggable optical module interfaces 230 (OSFP) is provided. The FPC cable interconnects a proximal connector 260 and two OSFP optical module interfaces into one. The proximal connector 260 supports a group of x16 PCIe Lanes, and one OSFP optical module interface supports x8 PCIe Lanes. Two OSFP optical module interfaces can be set.

[0140] In some embodiments, when the at least one optical module interface 150 includes an octal small form-factor pluggable optical module interface 230 , the number of the at least one first circuit board 120 is one.

[0141] In some embodiments, when at least one optical module interface 150 includes an eight-channel small pluggable optical module interface 230, the number of the plurality of second circuit boards 140 is three, and three eight-channel small pluggable optical module interfaces 230 are configured on one side of each second circuit board 140, and three eight-channel small pluggable optical module interfaces 230 are configured on the other side of each second circuit board 140.

[0142] In this embodiment, the height of the OSFP optical module interface is 14.65 mm and the width is 24.08 mm. The front window of the entire machine can be arranged with a maximum of two layers of OSFP optical module interfaces, with each layer having a maximum of 9 OSFP optical module interfaces. Six OSFP optical module interfaces can be arranged on each interface board.

[0143] A first circuit board 120 may be placed inside the circuit board 110 , and a switching chip 130 is provided on the first circuit board 120 .

[0144] like Figure 9 As shown, three second circuit boards 140 can be placed inside the circuit board 110, and each second circuit board 140 can correspond to prevent six OSFP optical module interfaces, such as Figure 10 As shown, two OSFP optical module interfaces can be installed on a PCB in an upper and lower back-sticking manner. For example, three OSFP optical module interfaces can be placed on one side of the second circuit board 140, and three OSFP optical module interfaces can be placed on the other side of the second circuit board 140. The whole machine can provide 18 OSFP optical module interfaces, and the number of interfaces of the circuit board 110 has been maximized, thereby realizing the data exchange function of 18 nodes.

[0145] like Figure 11 As shown, each proximal connector 260 leads to a set of x16 PCIe Lanes, which can be Figure 8 The FPC cable shown connects two OSFP optical module interfaces.

[0146] In this application, by using the upper and lower back-sticking method, two OSFP optical module interfaces are installed on a second circuit board 140, which can reduce the thickness of one layer of PCB and ensure that the front window of the circuit board 110 can be laid out with two layers of OSFP optical module interfaces.

[0147] like Figure 12 An example of an FPC cable supporting an extended-density eight-channel small form-factor pluggable optical module interface 240 (OSFP-XD) is provided. The FPC cable interconnects a proximal connector 260 and an OSFP-XD optical module interface. The proximal connector 260 supports a group of x16 PCIe Lanes, and an OSFP-XD optical module interface supports x16 PCIe Lanes. Therefore, an OSFP-XD optical module interface can be configured.

[0148] In some embodiments, when the at least one optical module interface 150 includes an extended-density eight-channel small form-factor pluggable optical module interface 240 , the number of the at least one first circuit board 120 is one.

[0149] In some embodiments, when at least one optical module interface 150 includes an extended-density eight-channel small form-factor pluggable optical module interface 240 , the number of the plurality of second circuit boards 140 is three, and the second circuit boards 140 are configured with three extended-density eight-channel small form-factor pluggable optical module interfaces 240 .

[0150] In this embodiment, the height of the OSFP-XD optical module interface is 16.65 mm and the width is 23.98 mm. The front window of the entire machine can only be arranged with one layer of OSFP-XD optical module interfaces. This layer can be arranged with a maximum of 9 OSFP-XD optical module interfaces, and 3 OSFP-XD optical module interfaces are arranged on each interface board.

[0151] A first circuit board 120 may be placed inside the circuit board 110 , and a switching chip 130 is provided on each first circuit board 120 .

[0152] like Figure 13 As shown, three second circuit boards 140 can be placed inside the circuit board 110, and each second circuit board 140 can be provided with three OSFP-XD optical module interfaces. The whole machine can provide nine OSFP-XD optical module interfaces. The number of interfaces of the circuit board 110 has been maximized, thereby realizing the data exchange function of nine nodes.

[0153] like Figure 14 As shown, each proximal connector 260 leads to a set of x16 PCIe Lanes, which can be Figure 12 The FPC cable shown is connected to an OSFP-XD optical module interface.

[0154] like Figure 2 、 Figure 5 、 Figure 8 and Figure 12 As shown, the end of the proximal connector 260 can be fixed, that is, the same proximal connector 260 can be connected to different optical module interfaces 150 through different flying wire cables 250. When different optical module interfaces 150 need to be expanded, it is only necessary to replace the interface board corresponding to the optical module interface 150.

[0155] It should be noted that the circuit board 110 provided in the embodiment of the present application can support but is not limited to four different forms of optical module interfaces: QSFP-DD, CDFP, OSFP and OSFP-XD. If it is necessary to support more forms of optical module interfaces, it is only necessary to develop a separate interface board and directly reuse the existing Switch board to develop a new circuit board 110 to meet market demand.

[0156] like Figure 1 As shown, in some embodiments, the first circuit board 120 may include a control board connector.

[0157] In this embodiment, the control board connector may be connected to the switching chip 130 through the first interface and the second interface.

[0158] The first interface may include an I2C interface (Inter-Integrated Circuit) or an RST interface (Reset), etc. The I2C interface can realize data reading, writing and configuration, etc.;

[0159] The control signal corresponding to the RST interface can be used to restore the switch chip 130 or a specific module to an initial state so as to restart work or resolve a fault.

[0160] The second interface may include a UART interface (Universal Asynchronous Receiver / Transmitter), an SDB interface (B port 485 data transmission), an INT interface (Interrupt), a GPIO interface (General Purpose Input / Output), and the like.

[0161] The UART interface can be used to communicate with external devices to transmit and receive data. The interrupt signal corresponding to the INT interface can be used to notify the processor that an event has occurred and needs to be processed immediately. The GPIO interface can be used to implement simple interactions with external devices, such as controlling the on and off of LED indicators and reading button status.

[0162] An embodiment of the present application also provides a switch.

[0163] The switch includes a circuit board 110 and a heat dissipation device 160 .

[0164] In this embodiment, the circuit board 110 is the circuit board 110 described in any of the above embodiments.

[0165] like Figure 15 As shown, the heat dissipation device 160 and the first circuit board 120 can be respectively arranged on both sides of the switching chip 130 , that is, the switching chip 130 can be placed on the first circuit board 120 , and then the heat dissipation device 160 is arranged above the switching chip 130 .

[0166] In some embodiments, the heat dissipation device 160 may be a heat sink.

[0167] In this embodiment, the coverage area of ​​the heat sink may be larger than the area of ​​the switch chip 130 .

[0168] In some embodiments, the first circuit board 120 may be configured with a plurality of proximal connectors 260 .

[0169] In this embodiment, a plurality of proximal connectors 260 may be disposed around the switch chip 130 .

[0170] The heat dissipation device 160 has a notch for accommodating the connector.

[0171] In some embodiments, the heat sink 160 may include a first portion 170 and a second portion connected thereto.

[0172] In this embodiment, the first portion 170 may cover the switch chip 130 .

[0173] The second part can be installed on the first circuit board 120, the orthographic projection of the second part does not cover the proximal connector 260, and the second part is arranged at intervals along the circumference of the switching chip 130, and the gap of the heat dissipation device 160 is formed between the first part 170 and the second part.

[0174] In some embodiments, the first side, the second side, and the third side of the switch chip 130 are all provided with a proximal connector 260 ; the second part may include: a first sub-part 190 and a second sub-part 200 .

[0175] In this embodiment, the first sub-portion 190 is located on the fourth side of the switch chip 130 and is connected to the first portion 170 .

[0176] The second sub-portion 200 is located outside the corner between the first side and the second side of the switching chip 130, and outside the corner between the second side and the third side of the switching chip 130, and the second sub-portion 200 is connected to the first portion 170 through the connecting section 180, and the connecting section 180 passes through the gap between the two adjacent proximal connectors 260.

[0177] In some embodiments, copper tubes are arranged inside the heat dissipation device 160 .

[0178] In this embodiment, a copper tube may be used inside the heat dissipation device 160 to diffuse heat to the first sub-portion 190 and the second sub-portion 200 of the heat dissipation device 160 , thereby increasing the heat dissipation area and improving the heat dissipation effect.

[0179] In some embodiments, the heat dissipation device 160 includes a plurality of heat dissipation fins arranged at intervals.

[0180] In this embodiment, the spacing between two adjacent heat dissipation fins may be 1.5 mm, or may be other values, which may be customized based on user needs and is not limited in this application.

[0181] The thickness of each heat dissipation fin can be 1.0 mm, or can be other values, which can be customized based on user needs and is not limited in this application.

[0182] For example, when the thickness of the heat sink is 1.0 mm and the spacing between two adjacent heat sinks is 1.5 mm, compared with traditional heat sinks (including heat sinks with a thickness of 1.2 mm and a spacing of 2.0 mm), the number of heat sinks can be increased by 28% in the same area, thereby further improving the heat dissipation effect.

[0183] In the present application, a gap is formed between the first part 170 and the second part of the heat dissipation device 160 to avoid the proximal connector 260. On the basis of ensuring the heat dissipation effect of the switching chip 130, the heat dissipation device 160 is avoided from interfering with the cable arrangement of the proximal connector 260, thereby improving the user experience.

[0184] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0185] Through the description of the above embodiments, those skilled in the art will clearly understand that each embodiment can be implemented using software plus a necessary general-purpose hardware platform, or of course, hardware. Based on this understanding, the essence of the above technical solution, or the portion that contributes to the relevant technology, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, or an optical disk, and includes a number of instructions for causing a computer device (such as a personal computer, server, or network device) to execute the methods described in each embodiment or certain portions of the embodiments.

[0186] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board, characterized in that: include: At least one first circuit board, wherein the first circuit board is configured with a switching chip, and at least one proximal connector is arranged along the circumference of the switching chip, wherein the distance between each proximal connector and the switching chip is less than a target distance threshold, and each proximal connector is connected to the switching chip; There are multiple second circuit boards, each of which is configured with at least one optical module interface. The proximal connector is connected to at least one of the optical module interfaces through a flying lead cable. The same proximal connector is connected to different optical module interfaces through different flying lead cables. The number of at least one optical module interface connected to each proximal connector is determined based on the type of the optical module interface.

2. The circuit board according to claim 1, wherein: The switching chip is configured with at least one interconnection channel, and the interconnection channel is connected to the proximal connector via a connecting cable; the at least one proximal connector is arranged in a one-to-one correspondence with the at least one interconnection channel.

3. The circuit board according to claim 2, wherein: The lengths of the connection cables between the interconnecting channels and the proximal connectors are substantially the same.

4. The circuit board according to any one of claims 1 to 3, characterized in that: The lengths of the flying lead cables are substantially the same.

5. The circuit board according to any one of claims 1 to 3, characterized in that: The first circuit board is configured with a programmable logic device, which is connected to the switching chip and each of the second circuit boards respectively. The programmable logic device is used to obtain a low-speed signal corresponding to each of the second circuit boards.

6. The circuit board according to claim 5, characterized in that The first circuit board is configured with a plurality of first low-speed signal connectors, the first low-speed signal connectors are installed near the edge of the second circuit board, and the programmable logic device is connected to each of the first low-speed signal connectors.

7. The circuit board according to claim 6, wherein: The second circuit board is configured with a second low-speed signal connector, which is installed near the edge of the first circuit board. Each of the second low-speed signal connectors is arranged opposite to each of the first low-speed signal connectors, and each of the first low-speed signal connectors is connected to each of the second low-speed signal connectors through a cable.

8. The circuit board according to any one of claims 1 to 3, characterized in that: The at least one optical module interface includes at least one of a double-density four-channel small form-factor pluggable optical module interface, a pluggable optical module interface, an eight-channel small form-factor pluggable optical module interface, and an extended-density eight-channel small form-factor pluggable optical module interface.

9. The circuit board according to claim 8, wherein: In a case where the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked one above the other.

10. The circuit board according to claim 8, wherein: When the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is six, and every two second circuit boards are stacked up and down, and each second circuit board is configured with six double-density four-channel small form-factor pluggable optical module interfaces.

11. The circuit board according to claim 8, wherein: In the case where the at least one optical module interface includes the pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked up and down.

12. The circuit board according to claim 8, wherein: In the case where the at least one optical module interface includes the pluggable optical module interface, the number of the plurality of second circuit boards is six, and every two second circuit boards are stacked up and down, and each second circuit board is configured with three pluggable optical module interfaces.

13. The circuit board according to claim 8, wherein: In a case where the at least one optical module interface includes the eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

14. The circuit board according to claim 8, wherein: When the at least one optical module interface includes the eight-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is three, and three eight-channel small form-factor pluggable optical module interfaces are configured on one side of each second circuit board, and three eight-channel small form-factor pluggable optical module interfaces are configured on the other side of each second circuit board.

15. The circuit board according to claim 8, wherein In a case where the at least one optical module interface includes the extended-density eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

16. The circuit board according to claim 8, wherein: In a case where the at least one optical module interface includes the extended-density eight-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is three, and the second circuit boards are configured with three extended-density eight-channel small form-factor pluggable optical module interfaces.

17. A switch, characterized in that: include: The circuit board according to any one of claims 1 to 16; A heat dissipation device, wherein the heat dissipation device and the first circuit board are respectively arranged on both sides of the switching chip.

18. The switch according to claim 17, wherein: The first circuit board is equipped with a plurality of proximal connectors, and the plurality of proximal connectors are arranged around the switching chip. The heat dissipation device has a gap for avoiding the proximal connectors.

19. The switch according to claim 18, wherein: The heat dissipation device includes a first part and a second part connected to each other, the first part covers the switching chip, the second part is installed on the first circuit board, the orthographic projection of the second part does not cover the proximal connector, and the second part is arranged at intervals along the circumference of the switching chip, and the gap is formed between the first part and the second part.

20. The switch according to claim 19, wherein: The proximal connector is provided on the first side, the second side and the third side of the switching chip; the second part includes: a first sub-part, located on a fourth side of the switching chip and connected to the first part; The second sub-part is located outside the corner between the first side and the second side of the switching chip, and outside the corner between the second side and the third side of the switching chip, and the second sub-part is connected to the first part through a connecting section, and the connecting section passes through the gap between the two adjacent proximal connectors.

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