Display module and device

Abstract

The embodiment of the invention provides a display module and a display device. The display module comprises a display panel, a first surface, a screen heat dissipation film and a chip. Wherein the first surface is the surface, located on the light emitting side of the display panel, of the display module; the screen heat dissipation film is located on the backlight side of the display panel. The chip is located on the side, away from the display panel, of the screen heat dissipation film. The display module further comprises a first heat resistance layer and / or a second heat resistance layer. Wherein in the stacking direction of the display panel and the screen heat dissipation film, the first heat resistance layer is located between the first surface and the screen heat dissipation film, and the second heat resistance layer is located between the screen heat dissipation film and the chip. The user experience is improved, the service life of the display panel is prolonged, and the safety coefficient of the user is improved.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display module and device. Background Art

[0002] With the progress and development of science and technology, the use scenarios of display panels are increasing, and the sizes are also tending to diversify. In some large-size display panels in related technologies, such as vehicle central control screens and touch panels, in their application scenarios, users often only touch the surface of the light-emitting side of the display panel. At this time, if the temperature of the surface of the light-emitting side of the display panel rises quickly, it will reduce the user experience, reduce the service life of the display panel, and pose a safety hazard. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a display module and a device to enhance the user experience, extend the service life of the display panel, and improve the user's safety factor.

[0004] In the first aspect, the embodiment of the present application provides a display module, comprising: a display panel, a first surface, a screen heat dissipation film, and a chip. The first surface is the surface of the display module located on the light-emitting side of the display panel; the screen heat dissipation film is located on the backlight side of the display panel; the chip is located on the side of the screen heat dissipation film away from the display panel; the display module also includes: a first heat-resisting layer, and / or a second heat-resisting layer; wherein, along the stacking direction of the display panel and the screen heat dissipation film, the first heat-resisting layer is located between the first surface and the screen heat dissipation film, and the second heat-resisting layer is located between the screen heat dissipation film and the chip.

[0005] In a possible implementation of the first aspect, the display module further includes: a cover plate and an optical adhesive. The cover plate is located on the light-emitting side of the display panel, and the cover plate includes the first surface; the optical adhesive is located on the side of the cover plate facing the display panel; the display panel includes: a polarizer. The polarizer is located on the side of the optical adhesive facing the display panel; wherein the first heat-resistant layer includes at least one first heat-insulating layer, and at least one of the cover plate, the optical adhesive, and the polarizer includes the at least one first heat-insulating layer.

[0006] In a possible implementation manner of the first aspect, the first thermal insulation layer includes aerogel or an airbag.

[0007] In a possible implementation of the first aspect, the device further includes: a cover plate and an optical adhesive. The cover plate is located on the light-emitting side of the display panel, and the cover plate includes the first surface; the optical adhesive is located on a side of the cover plate facing the display panel; The display panel includes: a polarizer. The polarizer is located on the side of the optical adhesive away from the cover plate; wherein, the first heat insulation layer includes at least one second heat insulation layer; along the stacking direction of the display panel and the screen heat dissipation film, at least one of the space between the cover plate and the optical adhesive and the space between the optical adhesive and the polarizer includes the at least one second heat insulation layer.

[0008] In a possible implementation manner of the first aspect, the display module further includes: a cover plate and an optical adhesive. The cover plate is located on the light-emitting side of the display panel, and the cover plate includes the first surface; the optical adhesive is located on the side of the cover plate facing the display panel; the display panel includes: a polarizer and a touch layer. The polarizer is located on the side of the optical adhesive away from the cover plate; the touch layer is located on the side of the polarizer away from the cover plate; wherein, the first heat insulation layer includes at least one second heat insulation layer; along the stacking direction of the display panel and the screen heat dissipation film, at least one of the space between the cover plate and the optical adhesive, the space between the optical adhesive and the polarizer, and the space between the polarizer and the touch layer includes the at least one second heat insulation layer.

[0009] In a possible implementation manner of the first aspect, along the stacking direction of the display panel and the screen heat dissipation film, the projected area of the display panel is a first area, and the projected area of the first heat insulation layer is a second area, and the first area is greater than or equal to the second area.

[0010] In a possible implementation manner of the first aspect, the display module further includes: a first support layer. Along the stacking direction of the display panel and the screen heat dissipation film, the first support layer is located between the display panel and the screen heat dissipation film; The first heat insulation layer includes at least one first heat dissipation layer, and the first support layer includes the at least one first heat dissipation layer.

[0011] In a possible implementation manner of the first aspect, the display module further includes: a second support layer. Along the stacking direction of the display panel and the screen heat dissipation film, the second support layer is at least partially located between the chip and the screen heat dissipation film; the second heat insulation layer includes at least one second heat dissipation layer, and the second support layer includes the at least one second heat dissipation layer; along the stacking direction of the display panel and the screen heat dissipation film, the second heat dissipation layer covers the chip.

[0012] In a possible implementation manner of the first aspect, the screen heat dissipation film includes: a first heat dissipation metal layer and at least one second heat dissipation metal layer, and the first heat dissipation metal layer and the second heat dissipation metal layer are stacked along a first direction, and the first direction is parallel to the stacking direction of the display panel and the screen heat dissipation film.

[0013] In a possible implementation of the first aspect, the first heat-dissipating metal layer is located on the side of the second heat-dissipating metal layer away from the display panel, and the preparation material of the first heat-dissipating metal layer includes copper.

[0014] In a possible implementation of the first aspect, the thickness of the first heat-dissipating metal layer is greater than or equal to 20 μm and less than or equal to 200 μm.

[0015] In a second aspect, an embodiment of the present application provides a display device, including the display module provided in the first aspect.

[0016] The display module provided in the embodiment of the present application includes a first heat-insulating layer and / or a second heat-insulating layer to block the temperature of the first surface from rising too fast. Specifically, the first heat-insulating layer is located between the first surface and the screen heat-dissipating film, and can reduce the heat transmitted from the heat source position to the first surface by heat dissipation or heat insulation, thereby playing a heat-insulating role and controlling the temperature rise rate of the first surface. The second heat-insulating layer is located between the screen heat-dissipating film and the chip, and can dissipate the heat as soon as possible through heat dissipation, thereby reducing the heat transmitted from the heat source position (such as IC, pixel circuit, etc.) to the first surface, achieving a heat-insulating effect, and finally controlling the temperature rise rate of the first surface. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Schematic diagram of a display module provided by an embodiment of the present application; Figure 2 Schematic diagram of a display module provided by an embodiment of the present application; Figure 3 Schematic diagram of a display module provided by an embodiment of the present application; Figure 4 Schematic diagram of a display module provided by an embodiment of the present application; Figure 5 Schematic diagram of a display module provided by an embodiment of the present application; Figure 6 Schematic diagram of a display module provided by an embodiment of the present application; Figure 7 Schematic diagram of a display module provided by an embodiment of the present application; Figure 8 Schematic diagram of a display module provided by an embodiment of the present application; Figure 9 Schematic diagram of a display module provided by an embodiment of the present application; Figure 10 Schematic diagram of a display module provided by an embodiment of the present application; Figure 11 Schematic diagram of a display module provided by an embodiment of the present application; Figure 12 Schematic diagram of a display module provided by an embodiment of the present application; Figure 13 Schematic diagram of a display module provided by an embodiment of the present application; Figure 14 Schematic diagram of a display module provided by an embodiment of the present application; Figure 15 Schematic diagram of a display module provided by an embodiment of the present application; Figure 16 Schematic diagram of a display module provided by an embodiment of the present application; Figure 17 Schematic diagram of a display module provided by an embodiment of the present application; Figure 18 Schematic diagram of a display module provided by an embodiment of the present application; Figure 19 Schematic diagram of a display module provided by an embodiment of the present application.

[0019] Label description 100, display module; 101, chip; 102, first heat insulation layer; 1021, first heat insulation layer; 1022, second heat insulation layer; 1023, first heat dissipation layer; 103, second heat insulation layer; 1031, second heat dissipation layer; 110, display panel; 111, polarizer; 112, touch layer; 120, screen heat dissipation film; 121, first heat dissipation metal layer; 122, second heat dissipation metal layer; 130, cover plate; 131, first surface; 140, optical adhesive; 150, first support layer; 160, second support layer. Detailed implementation manners

[0020] In order to better understand the technical solution of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0021] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0022] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms "a", "the" and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0023] It should be understood that the term " / or" used herein is only a correlative relationship describing related objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the related objects before and after.

[0024] Combined Figures 1 to 3 As shown, the embodiments of the present application provide a display module 100, including: a display panel 110, a first surface 131, a screen heat dissipation film 120, and a chip 101. Among them, the first surface 131 is the surface of the display module 100 on the light-emitting side of the display panel 110. As Figure 1 shown, the light-emitting side of the display panel 110 is located on the lower side. Therefore, the first surface 131 is the lower surface of the display module 100. The screen heat dissipation film 120 is located on the backlight side of the display panel 110. The screen heat dissipation film 120 is used for heat dissipation and is attached to the backlight side of the display panel 110. In a possible implementation manner, the screen heat dissipation film 120 is a multi-layer composite structure, for example, including: an adhesive layer and a heat dissipation metal layer, and the heat dissipation metal layer is attached to the backlight side of the display panel 110 through the adhesive layer. Among them, the heat dissipation metal layer is made of a material with good thermal conductivity, such as metal or nano material, etc. The chip 101 is located on the side of the screen heat dissipation film 120 away from the display panel 110. In a possible implementation manner, the chip 101 includes the display driving chip 101 of the display panel 110, and the display driving chip 101 of the display panel 110 is electrically connected to the display panel 110 through a flexible circuit board.

[0025] The display module 100 includes: a first heat insulation layer 102, and / or, a second heat insulation layer 103. For example, in a possible implementation manner, as Figure 1 shown, the display module 100 includes: a first heat insulation layer 102; or in another possible implementation manner, as Figure 2 shown, the display module includes a second heat insulation layer 103. Or, in a possible implementation manner, as Figure 3 shown, the display module includes a first heat insulation layer 102 and a second heat insulation layer 103.

[0026] Among them, the first heat insulation layer 102 and the second heat insulation layer 103 are respectively used to reduce the temperature rising rate of the first surface 131. The first heat insulation layer 102 can reduce the temperature rising speed of the first surface 131 by means of heat insulation and / or heat dissipation. The second heat insulation layer 103 can reduce the temperature rising speed of the first surface 131 by heat dissipation. Among them, along the stacking direction of the display panel 110 and the screen heat dissipation film 120, the first heat insulation layer 102 is located between the first surface 131 and the screen heat dissipation film 120, and the second heat insulation layer 103 is located between the screen heat dissipation film 120 and the chip 101.

[0027] In the embodiment of the present application, the first heat insulation layer 102 is located between the first surface 131 and the screen heat dissipation film 120, and can reduce the heat transferred from the heat source position (such as IC, pixel circuit, etc.) to the first surface 131 by heat dissipation or heat insulation, so as to play a heat insulation role and control the temperature rising rate of the first surface 131. The second heat insulation layer 103 is located between the screen heat dissipation film 120 and the chip 101, and can dissipate the heat as soon as possible by heat dissipation, so as to reduce the heat transferred from the heat source position (such as IC, pixel circuit, etc.) to the first surface 131, realize the heat insulation effect, and finally control the temperature rising rate of the first surface 131.

[0028] As Figure 1 shown, in an embodiment of the present application, the display module 100 further includes: a cover plate 130 and an optical adhesive 140. The cover plate 130 is located on the light-emitting side of the display panel 110, and the cover plate 130 includes a first surface 131, that is, the first surface 131 is the surface of the cover plate 130 facing away from the display panel 110. The optical adhesive 140 is located on the side of the cover plate 130 facing the display panel 110. The optical adhesive 140 is used to bond the cover plate 130 and the display panel 110 together. The display panel 110 includes: a polarizer 111. The polarizer 111 is located on the side of the optical adhesive 140 facing the display panel 110. Among them, the first heat insulation layer 102 includes at least one first heat insulation layer 1021, and at least one of the cover plate 130, the optical adhesive 140 and the polarizer 111 includes at least one first heat insulation layer 1021.

[0029] The first heat insulation layer 1021 is used for heat insulation between the heat source position and the first surface 131, restricting the heat flow to the first surface 131, aiming to reduce the temperature rising rate of the first surface 131.

[0030] For example, in a possible implementation manner, as Figure 1 shown, the cover plate 130 includes at least one first heat insulation layer 1021. That is, the cover plate 130 is made into a composite structure, and at least one first heat insulation layer 1021 is arranged inside it. Among them, as Figure 4As shown, when the cover plate 130 includes at least two first heat insulation layers 1021, the at least two first heat insulation layers 1021 are parallel to each other. And the at least two first heat insulation layers 1021 are stacked along the first direction X, and the first direction X is parallel to the stacking direction of the polarizer 111 and the cover plate 130.

[0031] In this implementation, the cover plate 130 includes at least one first heat insulation layer 1021, and the first heat insulation layer 1021 can effectively block the heat transfer to the first surface 131. The first heat insulation layer 1021 is arranged in the cover plate 130. On the one hand, it is beneficial to reduce the heating rate of the first surface 131, and on the other hand, it is beneficial to reduce the degree of modification to the internal structure of the display panel 110.

[0032] As Figure 5 or Figure 6 shown, in a possible implementation, the optical adhesive 140 includes at least one first heat insulation layer 1021. Among them, as Figure 6 shown, when the optical adhesive 140 includes at least two first heat insulation layers 1021, the at least two first heat insulation layers 1021 are parallel to each other. And the at least two first heat insulation layers 1021 are stacked along the first direction X, and the first direction X is parallel to the stacking direction of the polarizer 111 and the cover plate 130.

[0033] In this implementation, the optical adhesive 140 including at least one first heat insulation layer 1021 can achieve heat insulation during the gluing process, increasing the distance between the first heat insulation layer 1021 and the first surface 131, which is beneficial to further improve the heat insulation effect to reduce the heating efficiency of the first surface 131.

[0034] As Figure 7 or Figure 8 shown, in a possible implementation, the polarizer 111 includes at least one first heat insulation layer 1021. Among them, as Figure 8 shown, when the polarizer 111 includes at least two first heat insulation layers 1021, the at least two first heat insulation layers 1021 are parallel to each other. And the at least two first heat insulation layers 1021 are stacked along the first direction X, and the first direction X is parallel to the stacking direction of the polarizer 111 and the cover plate 130.

[0035] In this implementation, along the first direction X, the polarizer 111 is farther away from the first surface 131 and closer to the light source position, which can further improve the heat insulation effect.

[0036] In a possible implementation, the first heat insulation layer 1021 includes aerogel or airbag.

[0037] In this implementation manner, the process flow of the aerogel is simple, which is conducive to reducing the production cost. Moreover, the air bubbles presented by the aerogel in the solid state have a heat insulation effect, which can help reduce the heating rate of the first surface 131. Similarly, the airbag is filled with gas, and the thermal conductivity of the gas is very low. The airbag also uses gas for heat insulation. Among them, the airbag can be an airbag with a regular shape, such as a spherical shape, an ellipsoidal shape, a polyhedron (a cube or a cuboid, etc.) or other regular shapes. The airbag can also be an irregular shape, such as a bubble shape randomly formed in the process.

[0038] In the embodiment of the present application, when the first heat insulation layer 1021 includes an airbag, in the implementation process, corresponding gas (such as air, inert gas, etc.) can be injected into the corresponding film layer structure, so that air bubbles are formed in the internal structure of the film layer structure. Such air bubbles are wrapped by the film layer material of the film layer to form an airbag structure, and finally the purpose of heat insulation is achieved.

[0039] As Figures 9 to 12 shown, in a possible implementation manner, the display module 100 further includes: a cover plate 130 and an optical adhesive 140. The cover plate 130 is located on the light-emitting side of the display panel 110, and the cover plate 130 includes a first surface 131. The optical adhesive 140 is located on the side of the cover plate 130 facing the display panel 110. The display panel 110 includes: a polarizer 111. The polarizer 111 is located on the side of the optical adhesive 140 facing away from the cover plate 130. Among them, the first heat insulation layer 102 includes at least one second heat insulation layer 1022. Along the stacking direction of the display panel 110 and the screen heat dissipation film 120, at least one of the space between the cover plate 130 and the optical adhesive 140 and the space between the optical adhesive 140 and the polarizer 111 includes at least one second heat insulation layer 1022.

[0040] Among them, the structure of the second heat insulation layer 1022 can be the same as that of the first heat insulation layer 1021. For example, the second heat insulation layer 1022 includes aerogel or an airbag.

[0041] In this implementation manner, when the display module 100 includes at least two second heat insulation layers 1022, at least two heat insulation layers are parallel to each other. At least two heat insulation layers are stacked along the first direction X, and the first direction X is parallel to the stacking direction of the cover plate 130 and the display panel 110.

[0042] As Figure 9 shown, in a possible implementation manner, along the stacking direction of the display panel 110 and the screen heat dissipation film 120, at least one second heat insulation layer 1022 is included between the cover plate 130 and the optical adhesive 140. In this implementation manner, adding at least one second heat insulation layer 1022 between the cover plate 130 and the optical adhesive 140 can avoid modifying the structures of the cover plate 130 or the optical adhesive 140 itself, which is conducive to reducing costs. Among them, as Figure 10As shown, when there are at least two second heat insulation layers 1022 between the cover plate 130 and the optical adhesive 140, the at least two second heat insulation layers 1022 are parallel to each other. And the at least two second heat insulation layers 1022 are stacked along the first direction X.

[0043] As Figure 11 or Figure 12 As shown, in a possible implementation, along the stacking direction of the display panel 110 and the screen heat dissipation film 120, there is at least one second heat insulation layer 1022 between the optical adhesive 140 and the polarizer 111. In this implementation, adding at least one second heat insulation layer 1022 between the optical adhesive 140 and the polarizer 111 can avoid modifying the structure of the optical adhesive 140 or the polarizer 111 itself, thereby facilitating cost reduction. Among them, as Figure 12 As shown, when there are at least two second heat insulation layers 1022 between the polarizer 111 and the optical adhesive 140, the at least two second heat insulation layers 1022 are parallel to each other. And the at least two second heat insulation layers 1022 are stacked along the first direction X.

[0044] In this implementation, adding a second heat insulation layer 1022 to at least one of the cover plate 130 and the optical adhesive 140, and between the optical adhesive 140 and the polarizer 111 can add a second heat insulation layer 1022 without changing the existing film layer structure, so as to achieve a heat insulation effect and finally show the heating rate of the first surface 131, thereby facilitating the control of production costs.

[0045] As Figures 9 to 14 As shown, in a possible implementation, the display module 100 further includes: a cover plate 130 and an optical adhesive 140. The cover plate 130 is located on the light-emitting side of the display panel 110, and the cover plate 130 includes a first surface 131. The optical adhesive 140 is located on the side of the cover plate 130 facing the display panel 110. The display panel 110 includes: a polarizer 111 and a touch layer 112. The polarizer 111 is located on the side of the optical adhesive 140 facing away from the cover plate 130. The touch layer 112 is located on the side of the polarizer 111 facing away from the cover plate 130. The first heat insulation layer 102 includes at least one second heat insulation layer 1022. Along the stacking direction of the display panel 110 and the screen heat dissipation film 120, at least one of the cover plate 130 and the optical adhesive 140, between the optical adhesive 140 and the polarizer 111, and between the polarizer 111 and the touch layer 112 includes at least one second heat insulation layer 1022. For example, as Figure 13 or Figure 14 As shown, there is at least one second heat insulation layer 1022 between the polarizer 111 and the touch layer 112. Among them, as Figure 14 As shown, when there are at least two second heat insulation layers 1022 between the polarizer 111 and the touch layer 112, the at least two second heat insulation layers 1022 are parallel to each other and are stacked along the first direction X.

[0046] Among them, the structure of the second heat insulation layer 1022 can be the same as that of the first heat insulation layer 1021. For example, the second heat insulation layer 1022 includes aerogel or airbag. When the display module 100 includes at least two second heat insulation layers 1022, the at least two heat insulation layers are parallel to each other. The at least two heat insulation layers are stacked in the first direction X, and the first direction X is parallel to the stacking direction of the cover plate 130 and the display panel 110.

[0047] In this implementation, along the stacking direction of the display panel 110 and the screen heat dissipation film 120, at least one of the spaces between the cover plate 130 and the optical adhesive 140, between the optical adhesive 140 and the polarizer 111, and between the polarizer 111 and the touch layer 112 includes at least one second heat insulation layer 1022, which facilitates adding the second heat insulation layer 1022 in the process flow and avoids changing the film layer structures of the cover plate 130, the polarizer 111, and the touch layer 112.

[0048] In a possible implementation, along the stacking direction of the display panel 110 and the screen heat dissipation film 120, the projected area of the display panel 110 is the first area, and the projected area of the first heat insulation layer 102 is the second area, and the first area is greater than or equal to the second area.

[0049] In this implementation, the projected area of the display panel 110 being greater than or equal to the projected area of the first heat insulation layer 102 can ensure that the first heat insulation layer 102 does not exceed the boundary of the display panel 110, thereby facilitating further improvement of the heat insulation effect. For example, in a possible implementation, along the stacking direction of the display panel 110 and the screen heat dissipation film 120, the projection of the display panel 110 covers the projection of the first heat insulation layer 102.

[0050] As Figure 15 shown, in a possible implementation, the display module 100 further includes: a first support layer 150. The first support layer 150 is along the stacking direction of the display panel 110 and the screen heat dissipation film 120, and the first support layer 150 is located between the display panel 110 and the screen heat dissipation film 120. The first support layer 150 is used to support the display panel 110 and the screen heat dissipation film 120. The first heat insulation layer 102 includes at least one first heat dissipation layer 1023, and the first support layer 150 includes at least one first heat dissipation layer 1023. The first heat dissipation layer 1023 is used for heat dissipation, and the first heat dissipation layer 1023 is made of a material with a relatively high thermal conductivity. For example, the first heat dissipation layer 1023 is made of a material such as copper, gold, or graphene or an alloy.

[0051] As Figure 16 shown, when the first heat insulation layer 102 includes at least two first heat dissipation layers 1023, the at least two first heat dissipation layers 1023 are parallel to each other and are stacked in the first direction X.

[0052] In this implementation, the first support layer 150 is relatively close to the heat source position (pixel circuit and chip 101). Therefore, a first heat dissipation layer 1023 is added to the first support layer 150 to facilitate heat dissipation, reduce the amount of heat transferred from the heat source position to the first surface 131, and thus reduce the heating rate of the first surface 131.

[0053] As Figure 2 or Figure 17 shown, in a possible implementation, the display module 100 further includes: a second support layer 160. Along the stacking direction of the display panel 110 and the screen heat dissipation film 120, the second support layer 160 is at least partially located between the chip 101 and the screen heat dissipation film 120. The second support layer 160 is used to support the chip 101 and the screen heat dissipation film 120. The second heat insulation layer 103 includes at least one second heat dissipation layer 1031, and the second support layer 160 includes at least one second heat dissipation layer 1031. Along the stacking direction of the display panel 110 and the screen heat dissipation film 120, the second heat dissipation layer 1031 covers the chip 101. The second heat dissipation layer 1031 is used for heat dissipation. The second heat dissipation layer 1031 is relatively close to the chip 101 and can quickly dissipate the heat generated by the chip 101. The second heat dissipation layer 1031 is made of a material with a relatively high thermal conductivity. For example, the second heat dissipation layer 1031 is made of a material such as copper, gold, or graphene or an alloy.

[0054] As Figure 17 shown, the second heat insulation layer 103 includes at least two second heat dissipation layers 1031, and the at least two second heat dissipation layers 1031 are located in the second support layer 160. The at least two second heat dissipation layers 1031 are parallel to each other and stacked along the first direction X.

[0055] In a possible implementation, the first support layer 150 and the second support layer 160 are flexible support layers, and the two can be an integral structure, that is, the second support layer 160 is an extension and bend of the first support layer 150. The second support layer 160 can be located in a partial area of the display module 100, that is, it does not entirely cover the display panel 110. This design can simplify the manufacturing process flow of the first support layer 150 and the second support layer 160, which is beneficial to reducing the production cost of the display module 100.

[0056] As Figure 18 shown, the first heat dissipation layer 1023 and the second heat dissipation layer 1031 are an integral structure. The integral structure of the first heat dissipation layer and the second heat dissipation layer can simplify the process and save process costs.

[0057] As Figure 19As shown, in a possible implementation, the screen heat dissipation film 120 includes: a first heat dissipation metal layer 121 and at least one second heat dissipation metal layer 122. The first heat dissipation metal layer 121 and the second heat dissipation metal layer 122 are stacked along the first direction X, and the first direction X is parallel to the stacking direction of the display panel 110 and the screen heat dissipation film 120.

[0058] In this implementation, the screen heat dissipation film 120 includes at least two heat dissipation metal layers, which can improve the heat dissipation effect and increase the heat dissipation efficiency.

[0059] In a possible implementation, the first heat dissipation metal layer 121 is located on the side of the second heat dissipation metal layer 122 away from the display panel 110, and the preparation material of the first heat dissipation metal layer 121 includes copper. Compared with the screen heat dissipation film 120 in the related art, the screen heat dissipation film 120 provided in this implementation has an additional first heat dissipation metal layer 121, and the preparation material of the first heat dissipation metal layer 121 includes copper. Copper has good heat dissipation characteristics and mature technology, which is beneficial to controlling the production cost.

[0060] In a possible implementation, the thickness of the first heat dissipation metal layer 121 is greater than or equal to 20um and less than or equal to 200um. The thickness of the first heat dissipation metal layer 121 being greater than or equal to 20um and less than or equal to 200um can improve the heat dissipation efficiency, enable the heat generated by the chip 101 to be quickly dissipated, and ultimately achieve the purpose of reducing the temperature rise efficiency of the first surface 131.

[0061] The embodiment of the present application also provides a display device, including the display module 100 provided in any of the foregoing embodiments or implementations. The display device made based on the display module 100 provided in the embodiment of the present application has good heat dissipation or heat insulation performance, thereby facilitating the reduction of the temperature rise rate of the light-emitting surface of its display.

[0062] It should be noted that the various embodiments of the present application can be combined with each other without conflict in technology.

[0063] The above is only the specific implementation manner of the present application. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered within the protection scope of the present application.

Claims

1. A display module, characterized in that, Comprising: A display panel; A first surface, which is the surface of the display module on the light-emitting side of the display panel; A screen heat dissipation film, located on the backlight side of the display panel; A chip, located on the side of the screen heat dissipation film away from the display panel; The display module further comprises: a first heat insulation layer, and / or a second heat insulation layer; Wherein, along the stacking direction of the display panel and the screen heat dissipation film, the first heat insulation layer is located between the first surface and the screen heat dissipation film, and the second heat insulation layer is located between the screen heat dissipation film and the chip.

2. The display module according to claim 1, wherein Further comprising: A cover plate, located on the light-emitting side of the display panel, and the cover plate comprises the first surface; An optical adhesive, located on the side of the cover plate facing the display panel; The display panel comprises: a polarizer, located on the side of the optical adhesive facing the display panel; Wherein, the first heat insulation layer comprises at least one first heat insulation sub-layer, and at least one of the cover plate, the optical adhesive and the polarizer comprises the at least one first heat insulation sub-layer.

3. The display module according to claim 2, wherein The first heat insulation sub-layer comprises aerogel or airbag.

4. The display module according to claim 1, wherein Further comprising: A cover plate, located on the light-emitting side of the display panel, and the cover plate comprises the first surface; An optical adhesive, located on the side of the cover plate facing the display panel; The display panel comprises: A polarizer, located on the side of the optical adhesive away from the cover plate; Wherein, the first heat insulation layer comprises at least one second heat insulation sub-layer; along the stacking direction of the display panel and the screen heat dissipation film, at least one of the space between the cover plate and the optical adhesive and the space between the optical adhesive and the polarizer comprises the at least one second heat insulation sub-layer.

5. The display module according to claim 1, wherein Further comprising: A cover plate, located on the light-emitting side of the display panel, and the cover plate comprises the first surface; An optical adhesive, located on the side of the cover plate facing the display panel; The display panel comprises: A polarizer, located on the side of the optical adhesive away from the cover plate; A touch layer, located on the side of the polarizer away from the cover plate; Wherein, the first heat insulation layer comprises at least one second heat insulation sub-layer; along the stacking direction of the display panel and the screen heat dissipation film, at least one of the space between the cover plate and the optical adhesive, the space between the optical adhesive and the polarizer, and the space between the polarizer and the touch layer comprises the at least one second heat insulation sub-layer.

6. The display module according to claim 1, wherein, Along the stacking direction of the display panel and the screen heat dissipation film, the projected area of the display panel is a first area, and the projected area of the first heat insulation layer is a second area, and the first area is greater than or equal to the second area.

7. The display module according to claim 1, wherein Further comprising: A first support layer, along the stacking direction of the display panel and the screen heat dissipation film, the first support layer is located between the display panel and the screen heat dissipation film; The first heat insulation layer comprises at least one first heat dissipation sub-layer, and the first support layer comprises the at least one first heat dissipation sub-layer.

8. The display module according to claim 1, wherein Further comprising: A second support layer, along the stacking direction of the display panel and the screen heat dissipation film, the second support layer is at least partially located between the chip and the screen heat dissipation film; The second heat insulation layer includes at least one second heat dissipation layer, and the second support layer includes the at least one second heat dissipation layer; along the stacking direction of the display panel and the screen heat dissipation film, the second heat dissipation layer covers the chip.

9. The display module according to claim 1, wherein The screen heat dissipation film includes: a first heat dissipation metal layer and at least one second heat dissipation metal layer, the first heat dissipation metal layer and the second heat dissipation metal layer are stacked along a first direction, and the first direction is parallel to the stacking direction of the display panel and the screen heat dissipation film.

10. The display module according to claim 9, wherein, The first heat dissipation metal layer is located on the side of the second heat dissipation metal layer away from the display panel, and the preparation material of the first heat dissipation metal layer includes copper.

11. The display module according to claim 10, wherein The thickness of the first heat dissipation metal layer is greater than or equal to 20um and less than or equal to 200um.

12. A display device, characterized in that, A display module according to any one of claims 1-11.

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