Composite filter component and high-frequency module

Abstract

Provided are a multi-band-supporting composite filter component and a high-frequency module with which degradation of amplification characteristics can be suppressed. The composite filter component is provided with: a first filter that passes through a first frequency band reception band; a second filter that passes through a second frequency band reception band; a third filter that passes through a third frequency band reception frequency band that can be received simultaneously with the first frequency band; a fourth filter that passes through a fourth band reception band that can be received simultaneously with the second band; a first input bump connected to the first filter and the third filter; a second input bump connected to the second filter and the fourth filter; a first output bump connected to the first filter; a second output bump connected to the second filter; a third output bump connected to the third filter; and a fourth output bump connected to the fourth filter, the first output bump being disposed adjacent to the second output bump, and the third output bump being disposed adjacent to the fourth output bump.

Description

Technical Field

[0001] The present invention relates to a composite filter component and a high-frequency module including the composite filter component. Background Art

[0002] A high-frequency front-end circuit supporting multiple frequency bands is disclosed in Patent Document 1. In the circuit structure shown in Patent Document 1, a filter and a low-noise amplifier are connected by wiring via a band selection switch. Since one low-noise amplifier can amplify multiple frequency bands, it has a structure capable of being connected to multiple filters. Figure 4 In the circuit structure shown, the filter and the low-noise amplifier are connected by wiring via a band selection switch. Since one low-noise amplifier can amplify multiple frequency bands, it has a structure capable of being connected to multiple filters.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2018-19392 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] However, in the high-frequency front-end circuit (high-frequency module) disclosed in Patent Document 1, when multiple filters and multiple low-noise amplifiers are connected by wiring, wiring crossovers occur in the area between the multiple filters and the multiple low-noise amplifiers. When wiring crossovers occur in the above area, the parasitic capacitance increases near the input terminal of the low-noise amplifier, and the noise figure of the low-noise amplifier rises, resulting in deterioration of the amplification characteristics. In addition, not only in the receiving path but also in the transmitting path, when wiring crossovers occur in the area between multiple power amplifiers and multiple filters for connecting the multiple power amplifiers and the multiple filters, the parasitic capacitance increases near the output terminal of the power amplifier. As a result, a parasitic capacitance is added to the low-impedance power amplifier, and the impedance matching degree between the power amplifier and the filter decreases, leading to deterioration of the amplification characteristics of the power amplifier. Figure 4 As a result, a parasitic capacitance is added to the low-impedance power amplifier, and the impedance matching degree between the power amplifier and the filter decreases, leading to deterioration of the amplification characteristics of the power amplifier.

[0008] Therefore, the present invention provides a composite filter component and a high-frequency module supporting multiple frequency bands that can suppress deterioration of amplification characteristics.

[0009] Solutions to the Problems

[0010] A composite filter component according to one aspect of the present invention includes: a first filter having a first passband including a reception band of a first frequency band; a second filter having a second passband including a reception band of a second frequency band; a third filter having a third passband including a reception band of a third frequency band, the third frequency band being receivable simultaneously with the first frequency band; a fourth filter having a fourth passband including a reception band of a fourth frequency band, the fourth frequency band being receivable simultaneously with the second frequency band; a first input bump connected to an input end of the first filter and an input end of the third filter; a second input bump connected to an input end of the second filter and an input end of the fourth filter; a first output bump connected to an output end of the first filter; a second output bump connected to an output end of the second filter; a third output bump connected to an output end of the third filter; and a fourth output bump connected to an output end of the fourth filter, wherein among the first output bump, the second output bump, the third output bump, and the fourth output bump, the first output bump and the second output bump are arranged adjacent to each other, and the third output bump and the fourth output bump are arranged adjacent to each other.

[0011] In addition, a composite filter component according to one aspect of the present invention includes: a first filter having a first passband including a transmission band of a first frequency band; a second filter having a second passband including a transmission band of a second frequency band; a third filter having a third passband including a transmission band of a third frequency band, the third frequency band being transmittable simultaneously with the first frequency band; a fourth filter having a fourth passband including a transmission band of a fourth frequency band, the fourth frequency band being transmittable simultaneously with the second frequency band; a first output bump connected to an output end of the first filter and an output end of the third filter; a second output bump connected to an output end of the second filter and an output end of the fourth filter; a first input bump connected to an input end of the first filter; a second input bump connected to an input end of the second filter; a third input bump connected to an input end of the third filter; and a fourth input bump connected to an input end of the fourth filter, wherein among the first input bump, the second input bump, the third input bump, and the fourth input bump, the first input bump and the second input bump are arranged adjacent to each other, and the third input bump and the fourth input bump are arranged adjacent to each other.

[0012] Effects of the Invention

[0013] According to the present invention, it is possible to provide a multi-band supported composite filter component and a high-frequency module capable of suppressing deterioration of amplification characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1A It is a circuit structure diagram of the high-frequency module and the communication device according to Embodiment 1.

[0015] Figure 1B It is a top view of the high-frequency module related to Embodiment 1.

[0016] Figure 2A It is a top view and a cross-sectional view of the composite filter component related to Example 1.

[0017] Figure 2B It is a top view and a cross-sectional view of the composite filter component related to Example 2.

[0018] Figure 2C It is a top view and a cross-sectional view of the composite filter component related to Example 3.

[0019] Figure 2D It is a top view and a cross-sectional view of the composite filter component related to Example 4.

[0020] Figure 3 It is a detailed cross-sectional view of the composite filter component related to Example 1.

[0021] Figure 4 It is a circuit structure diagram of the high-frequency module related to Variant 1 of Embodiment 1.

[0022] Figure 5 It is a top view and a cross-sectional view of the composite filter component related to Example 5.

[0023] Figure 6 It is a circuit structure diagram of the high-frequency module related to Variant 2 of Embodiment 1.

[0024] Figure 7A It is a top view and a cross-sectional view of the composite filter component related to Example 6.

[0025] Figure 7B It is a top view and a cross-sectional view of the composite filter component related to Example 7.

[0026] Figure 8A It is a circuit structure diagram of the high-frequency module related to Variant 3 of Embodiment 1.

[0027] Figure 8B It is a top view of the composite filter component related to Example 8.

[0028] Figure 9A It is a circuit structure diagram of the high-frequency module related to Variant 4 of Embodiment 1.

[0029] Figure 9B It is a top view of the composite filter component related to Example 9.

[0030] Figure 10A It is a circuit structure diagram of the high-frequency module related to Variant 5 of Embodiment 1.

[0031] Figure 10B It is a top view of the composite filter component related to Example 10.

[0032] Figure 11A It is a circuit structure diagram of the high-frequency module related to Modification Example 6 of Embodiment 1.

[0033] Figure 11B It is a top view of the composite filter component related to Example 11.

[0034] Figure 12 It is a circuit structure diagram of the high-frequency module and the communication device related to Embodiment 2.

[0035] Figure 13A It is a top view and a cross-sectional view of the composite filter component related to Example 12.

[0036] Figure 13B It is a top view and a cross-sectional view of the composite filter component related to Example 13.

[0037] Figure 14 It is a circuit structure diagram of the high-frequency module related to the modification of Embodiment 2.

[0038] Figure 15 It is a top view and a cross-sectional view of the composite filter component related to Example 14. Detailed implementation manners

[0039] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments described below represent general or specific examples. The numerical values, shapes, materials, structural elements, arrangements of structural elements, connection manners, etc. shown in the following embodiments are examples, and the gist thereof is not intended to limit the present invention.

[0040] In addition, each drawing is a schematic diagram appropriately emphasized, omitted, or adjusted in ratio for representing the present invention, and is not necessarily strictly illustrated, and sometimes differs from the actual shape, positional relationship, and ratio. In each drawing, the same reference numerals are given to substantially the same structures, and sometimes the repeated description is omitted or simplified.

[0041] In the following drawings, the x-axis and the y-axis are axes orthogonal to each other in a plane parallel to the main surface of the module substrate or the composite filter component. Specifically, when the module substrate or the composite filter component has a rectangular shape when viewed from above, the x-axis is parallel to the first side of the module substrate or the composite filter component, and the y-axis is parallel to the second side of the module substrate or the composite filter component orthogonal to the first side. In addition, the z-axis is an axis perpendicular to the main surface of the module substrate or the composite filter component, and the positive direction thereof represents the upward direction, and the negative direction thereof represents the downward direction.

[0042] In the circuit structure of the present disclosure, "connection" includes not only the case of direct connection through connection terminals and / or wiring conductors, but also the case of electrical connection via other circuit elements. "Connected between A and B" means being connected to both A and B between A and B.

[0043] In the component configuration of the present invention, "a component is disposed on a substrate" includes a component being disposed on the main surface of the substrate and a component being disposed within the substrate. "A component is disposed on the main surface of the substrate" includes not only the case where the component is disposed in contact with the main surface of the substrate, but also the case where the component is disposed above the main surface in a non-contact manner (for example, the component is stacked on other components disposed in contact with the main surface). In addition, "a component is disposed on the main surface of the substrate" may also include a component being disposed in a recess formed in the main surface. "A component is disposed within the substrate" includes not only the case where the component is encapsulated within the module substrate, but also the case where although all of the component is disposed between the two main surfaces of the substrate, a part of the component is not covered by the substrate, and the case where only a part of the component is disposed within the substrate.

[0044] In addition, in the component configuration of the present invention, "viewing the main surface from above" means observing an object by orthographically projecting it onto the xy plane from the positive side of the z axis. "A and B overlap when viewed from above" means that at least a part of the region of A orthographically projected onto the xy plane overlaps with at least a part of the region of B orthographically projected onto the xy plane. In addition, "A is disposed between B and C" means that at least one of the plurality of line segments connecting any point in B and any point in C passes through A.

[0045] In addition, in the component configuration of the present invention, "A and B are disposed adjacent to each other" means that A and B are disposed close to each other. Specifically, it means that there are no other circuit components in the space where A and B face each other. In other words, "A and B are disposed adjacent to each other" means that none of the plurality of line segments starting from any point on the surface of A facing B and reaching B along the normal direction of the surface passes through circuit components other than A and B. Here, a circuit component means a component including an active element and / or a passive element. That is, a circuit component includes an active component and a passive component and does not include an electromechanical component. Among them, an active component includes a transistor or a diode, etc., a passive component includes an inductor, a transformer, a capacitor or a resistor, etc., and an electromechanical component includes a terminal, a connector or a wiring, etc.

[0046] In the present invention, a "terminal" means a point where a conductor within an element ends. In addition, when the impedance of the conductor between elements is sufficiently low, a terminal is interpreted not only as a single point, but also as any point on the conductor between elements or the entire conductor. In addition, a "bump" means a protruding electrode such as a spherical, cylindrical, conical, prismatic, or pyramidal shape among "terminals".

[0047] In the bump configuration of the present invention, "bump A and bump B are adjacently disposed" means that in the space where bump A and bump B face each other, there is no bump (HOT bump (hot bump)) to which a signal potential is applied. Specifically, it means that none of the multiple (linear) line segments from any point on the surface of bump A to bump B pass through a HOT bump. In addition, in the space where bump A and bump B face each other, there may also be a bump (GND bump (ground bump)) to which a ground potential is applied.

[0048] In addition, "three or more bumps are adjacently disposed" means that in the space where any two of the three or more bumps face each other, there is no HOT bump other than the three or more bumps. Therefore, one of the three or more bumps may also be present in the space where any two of the three or more bumps face each other.

[0049] In addition, terms indicating the relationship between elements such as "parallel" and "perpendicular", terms indicating the shape of elements such as "rectangle", and numerical ranges represent substantially equivalent ranges. For example, they also include an error of about a few percent, rather than only representing a strict meaning.

[0050] The "passband of a filter" is the part of the spectrum that is transmitted through the filter and is defined as the frequency band in which the output power does not attenuate by more than 3 dB compared to the maximum output power. Thus, the high-frequency end and the low-frequency end of the passband of a band-pass filter are determined as the frequencies of the two points at which the output power attenuates by 3 dB compared to the maximum output power, with the higher frequency and the lower frequency.

[0051] The "receiving band" refers to the frequency band used for reception in a communication device. For example, in frequency-division duplex (FDD: Frequency Division Duplex), different frequency bands are used as the transmitting band and the receiving band, and in time-division duplex (TDD: Time Division Duplex), the same frequency band is used as the transmitting band and the receiving band. In particular, when the communication device is installed in a user terminal (UE: User Equipment) of a cellular network, if it is FDD, the uplink operation band is used as the transmitting band, and the downlink operation band is used as the receiving band. Conversely, when the communication device is installed as a base station (BS: Base Station) of a cellular network, the downlink operation band is used as the transmitting band, and the uplink operation band is used as the receiving band.

[0052] (Embodiment 1)

[0053] [1.1 Structure of High-Frequency Module 1 and Communication Device 4]

[0054] First, with reference to Figure 1A the circuit structure and component configuration structure of the high-frequency module 1 and the communication device 4 according to this embodiment will be described. Figure 1A FIG. is a circuit diagram of the high-frequency module 1 and the communication device 4 according to Embodiment 1. In addition, Figure 1A an exemplary circuit structure of the high-frequency module 1 and the communication device 4 is shown, and the high-frequency module 1 and the communication device 4 can be mounted using any of a variety of circuit mounting and circuit technologies. Therefore, the description of the high-frequency module 1 and the communication device 4 provided below should not be construed in a limiting manner.

[0055] The communication device 4 is mounted on a UE of a cellular network, and typically is a mobile phone, a smart phone, a tablet computer, a wearable device, etc. In addition, the communication device 4 can also be an IoT (Internet of Things) sensor device, a medical / health device, an automobile, an unmanned aerial vehicle (UAV) (so-called drone), an automated guided vehicle (AGV). Additionally, the communication device 4 can also be mounted on a BS of a cellular communication system.

[0056] As Figure 1A shown, the communication device 4 includes the high-frequency module 1, the antenna 2, and an RFIC (Radio Frequency Integrated Circuit) 3.

[0057] The high-frequency module 1 can transmit high-frequency signals between the antenna 2 and the RFIC 3. The internal structure of the high-frequency module 1 will be described later.

[0058] The antenna 2 is connected to the antenna connection terminal 200 of the high-frequency module 1. The antenna 2 can receive a high-frequency signal from the outside of the communication device 4 and provide it to the high-frequency module 1. Also, the antenna 2 can transmit the high-frequency signal provided from the high-frequency module 1 to the outside of the communication device 4. In addition, the antenna 2 may not be included in the communication device 4. Additionally, the communication device 4 can also include multiple antennas.

[0059] RFIC 3 is an example of a signal processing circuit that processes high-frequency signals. Specifically, RFIC 3 can perform signal processing on a high-frequency reception signal input via the reception path of high-frequency module 1, such as down-conversion, and output the reception signal generated after this signal processing to a BBIC (Baseband Integrated Circuit). Also, RFIC 3 can perform signal processing on a transmission signal input from the BBIC, such as up-conversion, and output the high-frequency transmission signal generated after this signal processing to high-frequency module 1. Additionally, RFIC 3 can also include a control unit for controlling switches, low-noise amplifiers, etc. provided in high-frequency module 1. Furthermore, part or all of the control unit can also be provided outside RFIC 3. For example, it can also be included in the BBIC or high-frequency module 1.

[0060] Next, the circuit structure of high-frequency module 1 according to this embodiment will be described. High-frequency module 1 includes a composite filter component 10, low-noise amplifiers 31 and 32, switches 20, 21, and 22, inductors 41, 42, 43, and 44, an antenna connection terminal 200, and signal output terminals 110 and 120.

[0061] Composite filter component 10 includes filters 100a, 100b, 100c, and 100d, input bumps 101 and 102, and output bumps 111, 112, 113, and 114.

[0062] Filter 100d has a first passband including a reception band (ALR) of frequency band AL (first frequency band). Filter 100c has a second passband including a reception band (BLR) of frequency band BL (second frequency band). Filter 100b has a third passband including a reception band (AMR) of frequency band AM (third frequency band). Filter 100a has a fourth passband including a reception band (BMR) of frequency band BM (fourth frequency band). Filters 100d and 100c are respectively an example of one of the first filter and the second filter and the other of the first filter and the second filter, and filters 100b and 100a are respectively an example of one of the third filter and the fourth filter and the other of the third filter and the fourth filter.

[0063] In addition, filters 100d and 100c can also be respectively an example of one of the third filter and the fourth filter and the other of the third filter and the fourth filter. In this case, filters 100b and 100a are respectively an example of one of the first filter and the second filter and the other of the first filter and the second filter.

[0064] The frequency band AL (the first frequency band) and the frequency band AM (the third frequency band) are a combination of frequency bands that can be received simultaneously, and the frequency band BL (the second frequency band) and the frequency band BM (the fourth frequency band) are a combination of frequency bands that can be received simultaneously. That is to say, the signals of the frequency band AL (the first frequency band) and the frequency band AM (the third frequency band) can be received simultaneously, and the signals of the frequency band BL (the second frequency band) and the frequency band BM (the fourth frequency band) can be received simultaneously.

[0065] The input bump 102 is an example of the first input bump and is connected to the input end of the filter 100d and the input end of the filter 100b. The input bump 101 is an example of the second input bump and is connected to the input end of the filter 100c and the input end of the filter 100a.

[0066] Accordingly, the input ends of the two filters 100a and 100c that can be received simultaneously are commonly connected to the input bump 101, and the input ends of the two filters 100b and 100d that can be received simultaneously are commonly connected to the input bump 102. Therefore, the number of input bumps of the composite filter component 10 can be reduced, and miniaturization can be achieved. Moreover, by reducing the number of input bumps of the composite filter component 10, the number of terminals of the switch 20 can be reduced, so that the disconnection capacitance generated at the terminals of the switch 20 can be reduced.

[0067] The output bump 114 is an example of the first output bump and is connected to the output end of the filter 100d. The output bump 113 is an example of the second output bump and is connected to the output end of the filter 100c. The output bump 112 is an example of the third output bump and is connected to the output end of the filter 100b. The output bump 111 is an example of the fourth output bump and is connected to the output end of the filter 100a.

[0068] Among the output bumps 111 to 114, the output bump 111 and the output bump 112 are arranged adjacent to each other, and the output bump 113 and the output bump 114 are arranged adjacent to each other.

[0069] The low-noise amplifier 32 is an example of the first low-noise amplifier and can amplify the signals of ALR and BLR. Since the frequency bands AL and BL are a combination of frequency bands that are not received simultaneously with each other, the low-noise amplifier 32 can be connected to both the filter 100d whose passband includes ALR and the filter 100c whose passband includes BLR. Thus, the input end of the low-noise amplifier 32 is connected to the output bumps 113 and 114 via the switch 22.

[0070] The low-noise amplifier 31 is an example of a second low-noise amplifier and is capable of amplifying the signals of AMR and BMR. The frequency bands AM and BM are combinations of frequency bands that are received at different times from each other. Therefore, the low-noise amplifier 31 can be connected to both the filter 100b with a passband including AMR and the filter 100a with a passband including BMR. Thus, the input terminal of the low-noise amplifier 31 is connected to the output bumps 111 and 112 via the switch 21.

[0071] The switch 20 is connected between the antenna connection terminal 200 and the composite filter unit 10 and switches the connection between the antenna 2 and the input bump 101 and the connection between the antenna 2 and the input bump 102. The switch 21 is connected between the low-noise amplifier 31 and the composite filter unit 10 and switches the connection between the low-noise amplifier 31 and the output bump 111 and the connection between the low-noise amplifier 31 and the output bump 112. The switch 22 is connected between the low-noise amplifier 32 and the composite filter unit 10 and switches the connection between the low-noise amplifier 32 and the output bump 113 and the connection between the low-noise amplifier 32 and the output bump 114.

[0072] The inductor 41 is connected between the output bump 111 and the switch 21 and is used to achieve impedance matching between the composite filter unit 10 and the low-noise amplifier 31. The inductor 42 is connected between the output bump 112 and the switch 21 and is used to achieve impedance matching between the composite filter unit 10 and the low-noise amplifier 31. The inductor 43 is connected between the output bump 113 and the switch 22 and is used to achieve impedance matching between the composite filter unit 10 and the low-noise amplifier 32. The inductor 44 is connected between the output bump 114 and the switch 22 and is used to achieve impedance matching between the composite filter unit 10 and the low-noise amplifier 32. In addition, each of the inductors 41 to 44 may also be a matching circuit composed of at least one of an inductor and a capacitor. Further, the high-frequency module 1 of the present embodiment may not include at least one of the switches 20 to 22 and the inductors 41 to 44.

[0073] In a conventional composite filter component including a plurality of filters 100a to 100d, the filters 100b (AMR) and 100d (ALR) capable of simultaneous reception are connected to the input bump 102, and the filters 100a (BMR) and 100c (BLR) capable of simultaneous reception are connected to the input bump 101. In order to make the wirings connecting the input bumps to the respective filters short and non-crossing, in the composite filter component, the filters 100b and 100d are arranged adjacent to each other, and the filters 100a and 100c are arranged adjacent to each other. On the other hand, in order to make the wirings connecting the output bumps to the respective filters short and non-crossing, on the output side of the composite filter component, since the filters 100b and 100d are arranged adjacent to each other, the output bump 114 connected to the filter 100d is made adjacent to the output bump 112 connected to the filter 100b, and since the filters 100a and 100c are arranged adjacent to each other, the output bump 111 connected to the filter 100a is made adjacent to the output bump 113 connected to the filter 100c. In the low-noise amplifiers 31 and 32 that receive the received signals output from the composite filter component, it is difficult to receive two signals received simultaneously with one low-noise amplifier, and it is desirable to distribute and receive these two signals to the low-noise amplifiers 31 and 32, respectively. Therefore, the adjacent output bumps 112 and 114 are distributively connected to the low-noise amplifiers 31 and 32, and the adjacent output bumps 111 and 113 are distributively connected to the low-noise amplifiers 31 and 32. In this way, in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32, a crossing of the connection wirings occurs, and a parasitic capacitance due to the above crossing is generated near the input ends of the low-noise amplifiers 31 and 32. The closer the generated parasitic capacitance is to the input end of the low-noise amplifier, the more the noise figure of the low-noise amplifier deteriorates.

[0074] In contrast, in the above structure of the composite filter component 10 according to the present embodiment, on the input side of the composite filter component 10, the filters 100b (AMR) and 100d (ALR) that can be received simultaneously are connected to the input bump 102, and the filters 100a (BMR) and 100c (BLR) that can be received simultaneously are connected to the input bump 101. On the other hand, on the output side of the composite filter component 10, the output bump 114 connected to the filter 100d is adjacent to the output bump 113 connected to the filter 100c, and the output bump 112 connected to the filter 100b is adjacent to the output bump 111 connected to the filter 100a. Accordingly, when connecting the filter 100d (and its connected output bump 114) and the filter 100c (and its connected output bump 113) that are not received simultaneously to the low-noise amplifier 32, and connecting the filter 100b (and its connected output bump 112) and the filter 100a (and its connected output bump 111) that are not received simultaneously to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 in such a way that the wirings connecting the output bumps 111 to 114 to the low-noise amplifiers 31 and 32 do not cross. Thus, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of the wirings is generated near the input ends of the low-noise amplifiers 31 and 32.

[0075] Therefore, no crossing of the wirings occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32. Thus, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and it is possible to suppress the deterioration of the amplification characteristics on the output side of the composite filter component 10.

[0076] In addition, since there is no crossing of the wirings between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32, the high-frequency module 1 can be made low-profile.

[0077] Furthermore, the frequency bands AL, AM, BL, BM, and the frequency bands that appear in subsequent embodiments are frequency bands for communication systems constructed using radio access technology (RAT: Radio Access Technology), and are predefined by standardization organizations etc. (such as 3GPP (registered trademark) and IEEE etc.). As examples of communication systems, 5GNR (5th Generation New Radio) systems, LTE (Long Term Evolution) systems, and WLAN (Wireless Local Area Network) systems etc. can be cited.

[0078] The frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 25 for LTE or n25 for 5G NR. The frequency band BM is, for example, Band 66 for LTE or n66 for 5G NR.

[0079] In addition, the frequency band combinations that can be received simultaneously are predefined by a standardization organization or the like. The frequency band combinations that can be received simultaneously are defined, for example, as the frequency band combinations for CA, EN-DC, NR-DC (New Radio - Dual Connectivity), or NE-DC (New Radio E-UTRAN - Dual Connectivity).

[0080] Figure 1B It is a top view of the high-frequency module 1 according to Embodiment 1. In this figure, a configuration structure example of each circuit component and bump constituting the high-frequency module 1 is shown. (a) of this figure is a view obtained by observing the main surface 90a side of the mounting substrate 90 from the positive side of the z-axis, and (b) of this figure is a perspective view of the main surface 90b side of the mounting substrate 90 from the positive side of the z-axis.

[0081] In addition, in Figure 1B the illustration of the resin member covering the circuit component and the shielding electrode layer formed on the surface of the resin member is omitted. In addition, there may be no resin member and shielding electrode layer.

[0082] As Figure 1B shown, the high-frequency module 1 includes a mounting substrate 90, a composite filter component 10, low-noise amplifiers 31 and 32, switches 20 to 22, and inductors 41 to 44.

[0083] The composite filter component 10, the switch 20, and the inductors 41 to 44 are arranged on the main surface 90a of the mounting substrate 90. The switches 21 and 22, and the low-noise amplifiers 31 and 32 are arranged on the main surface 90b of the mounting substrate 90.

[0084] The mounting substrate 90 has main surfaces 90a (third main surface) and 90b (fourth main surface) facing each other. The mounting substrate 90 forms a ground electrode layer or the like on the main surfaces 90a and 90b. In addition, in Figure 1B the mounting substrate 90 has a rectangular shape in a top view, but the shape of the mounting substrate 90 is not limited to this.

[0085] As the mounting substrate 90, for example, a low-temperature co-fired ceramic (LTCC) substrate or a high-temperature co-fired ceramic (HTCC) substrate having a stacked structure with multiple dielectric layers, a component-embedded substrate, a substrate having a redistribution layer (RDL), or a printed circuit board can be used, but it is not limited to them.

[0086] The composite filter component 10, for example, has a configuration in which (1) it is IC chip-formed using a silicon substrate, (2) filters 100a to 100d are housed in one package, (3) a plurality of piezoelectric substrates are joined via a support layer, or (4) filters 100a to 100d are arranged on one substrate.

[0087] Each of the inductors 41 to 44 is, for example, a surface-mounted chip inductor. In addition, each of the inductors 41 to 44 may be constituted by a coil conductor formed on the mounting substrate 90.

[0088] The low-noise amplifiers 31 and 32 and the switches 21 and 22 are formed in the IC 150.

[0089] Here, the output bumps 113 and 114 are arranged closer to the low-noise amplifier 32 than to the low-noise amplifier 31, and the output bumps 111 and 112 are arranged closer to the low-noise amplifier 31 than to the low-noise amplifier 32.

[0090] Accordingly, the wirings connecting the output bumps 113 and 114 to the low-noise amplifier 32 and the wirings connecting the output bumps 111 and 112 to the low-noise amplifier 31 can be made short. Therefore, the high-frequency module 1 can be made low-loss and miniaturized.

[0091] The wirings 211a, 212a, 213a, and 214a are arranged on the main surface 90a of the mounting substrate 90, and the wirings 211b, 212b, 213b, and 214b are arranged on the main surface 90b of the mounting substrate 90 and inside the mounting substrate 90.

[0092] One end of the wiring 211a is connected to the output bump 111, and the other end is connected to the inductor 41. One end of the wiring 211b is connected to the inductor 41, and the other end is connected to the switch 21. One end of the wiring 212a is connected to the output bump 112, and the other end is connected to the inductor 42. One end of the wiring 212b is connected to the inductor 42, and the other end is connected to the switch 21. One end of the wiring 213a is connected to the output bump 113, and the other end is connected to the inductor 43. One end of the wiring 213b is connected to the inductor 43, and the other end is connected to the switch 22. One end of the wiring 214a is connected to the output bump 114, and the other end is connected to the inductor 44. One end of the wiring 214b is connected to the inductor 44, and the other end is connected to the switch 22.

[0093] The output bumps 111 to 114 are arranged in the order of the output bumps 111, 112, 113, and 114 in the first direction (negative x-axis direction). On the other hand, the input bumps 101 and 102 are arranged in the order of the input bumps 101 and 102 in the first direction (negative x-axis direction).

[0094] According to the above structure of the high-frequency module 1, the wirings 211a to 214a do not cross each other, and in addition, the wirings 211b to 214b do not cross each other. Thus, it is possible to suppress the following situation: a parasitic capacitance caused by the crossing of the wirings is generated near the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32.

[0095] In addition, the wirings 211b to 214b each include a via conductor that penetrates between the main surface 90a and the main surface 90b, so that the wirings 211b to 214b can be shortened. In addition, the circuit components constituting the high-frequency module 1 are distributively arranged on both sides of the mounting substrate 90. Therefore, it is possible to reduce the loss and miniaturize the high-frequency module 1.

[0096] [1.2 Structure of the composite filter component 10A according to Embodiment 1]

[0097] Figure 2AIt is a top view and a cross-sectional view of the composite filter component 10A involved in Embodiment 1. In this figure, a configuration example of each filter and each bump constituting the composite filter component 10A is shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 151 and located between the opposing main surfaces of the filter chip 122. In addition, the b-b plane is a plane parallel to the main surface 153 and located between the opposing main surfaces of the filter chip 121. In addition, the c-c plane is the main surface 153. In addition, the d-d cross-section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. In addition, the e-e cross-section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0098] The composite filter component 10A includes filter chips 121 and 122 stacked on each other, and includes main surfaces 153 (first main surface) and main surface 151 (second main surface) facing each other. The filter chip 121 is an example of a first layered portion, and includes a main surface 153 (first main surface), a filter 100a (BMR), and a filter 100b (AMR). The filter chip 122 is an example of a second layered portion, and includes a main surface 151 (second main surface), a filter 100c (BLR), and a filter 100d (ALR).

[0099] In this embodiment, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump).

[0100] Each of the filter chips 121 (first lamination part) and 122 (second lamination part) of the filter chip, for example, has a function electrode formed in such a way that (1) it is IC chipized using a silicon substrate, (2) two filters are housed in one package, or (3) two filter function electrodes are formed on one piezoelectric substrate. In addition, the composite filter component 10A, for example, has a structure in which the filter chips 121 and 122 are (1) indirectly bonded by electrodes, (2) bonded with an adhesive, and / or (3) resin-molded. In this embodiment, the filter chips 121 and 122 are bonded at the interface 152.

[0101] As Figure 2A shown in (c) of the figure, the composite filter component 10A has a rectangular shape when viewed from above the main surface 153, and has outer sides 301 (first outer side) and 303 (second outer side) facing each other, and outer sides 302 and 304 facing each other. In addition, the composite filter component 10A may be a polygon when viewed from above the main surface 153.

[0102] The output bumps 111 to 114 are arranged on the main surface 153 in the first direction (negative x-axis direction) along the outer side 301 in the order of the output bumps 111, 112, 113, and 114. On the other hand, the input bumps 101 and 102 are arranged on the main surface 153 in the first direction (negative x-axis direction) in the order of the input bumps 101 and 102 in the region between the output bumps 111 to 114 and the outer side 303.

[0103] Accordingly, no wiring crossover occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10A. Therefore, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 10A can be suppressed.

[0104] In addition, the output bumps 111 to 114 may not be arranged linearly in the first direction as Figure 2A shown. The output bumps 111 to 114 only need to be arranged such that the output bump 111 is adjacent to the output bump 112, and the output bump 113 is adjacent to the output bump 114 in the region between the outer side 301 and the input bumps 101 and 102.

[0105] Filters 100c and 100d are arranged in the order of filter 100c and 100d in the first direction (negative x-axis direction). Filters 100a and 100b are arranged in the order of filter 100a and 100b in the first direction (negative x-axis direction). When looking down at the main surfaces 151 and 153, at least a part of filter 100c overlaps with filter 100a, and at least a part of filter 100d overlaps with filter 100b.

[0106] That is to say, in the composite filter component 10A according to this embodiment, by arranging two filters that do not receive simultaneously on one filter chip, the isolation degree of two received signals received simultaneously is improved. In addition, by arranging two filters that receive simultaneously to overlap when looking down, the proximity and crossing of the wirings connected to the input bump 101 and the wirings connected to the input bump 102 are suppressed.

[0107] According to the above configuration structure, the wirings connecting the input bump 101 to filters 100a and 100c and the wirings connecting the input bump 102 to filters 100b and 100d do not cross within the filter chip 121, and also do not cross within the filter chip 122 (refer to Figure 2A (a), (b), and (e)). In addition, the wirings connecting the output bump 111 to filter 100a, the wirings connecting the output bump 112 to filter 100b, the wirings connecting the output bump 113 to filter 100c, and the wirings connecting the output bump 114 to filter 100d do not cross within the filter chip 121, and also do not cross within the filter chip 122 (refer to Figure 2A (a), (b), and (d)).

[0108] That is to say, inside the composite filter component 10A, no crossing occurs for the wirings connecting the input bumps to the filters within the filter chip, and no crossing occurs for the wirings connecting the output bumps to the filters within the filter chip. As a result, the deterioration of the noise figure of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10A can be further suppressed, and the isolation degree of the filters 100a to 100d within the composite filter component 10A can be improved. Therefore, the composite filter component 10A can transmit the received signals of ALR and AMR that pass through simultaneously with low loss, and can transmit the received signals of BLR and BMR that pass through simultaneously with low loss.

[0109] [Structure of the composite filter component 10B according to Embodiment 2]

[0110] Figure 2BIt is a top view and a cross-sectional view of the composite filter component 10B related to Embodiment 2. In this figure, a configuration structure example of each filter and each bump constituting the composite filter component 10B is shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 151 and located between the opposing main surfaces of the filter chip 122. Additionally, the b-b plane is a plane parallel to the main surface 153 and located between the opposing main surfaces of the filter chip 121. Additionally, the c-c plane is the main surface 153. Additionally, the d-d cross-section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. Additionally, the e-e cross-section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0111] Compared with the composite filter component 10A related to Embodiment 1, the configuration structures of the filters 100c and 100d in the filter chip 122 of the composite filter component 10B related to this embodiment are different. Therefore, hereinafter, regarding the composite filter component 10B related to this embodiment, the description of the same structure as that of the composite filter component 10A related to Embodiment 1 will be omitted, and the description will be centered on the structure of the filter chip 122 different from that of the composite filter component 10A.

[0112] In this embodiment, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 111 (fourth output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 112 (third output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump).

[0113] The filters 100c and 100d are arranged in the order of the filter 100d and 100c in the first direction (negative x-axis direction). The filters 100a and 100b are arranged in the order of the filter 100a and 100b in the first direction (negative x-axis direction). When looking down at the main surfaces 151 and 153, at least a part of the filter 100c overlaps with the filter 100b, and at least a part of the filter 100d overlaps with the filter 100a.

[0114] That is to say, in the composite filter component 10B involved in this embodiment, by arranging two filters that do not receive signals simultaneously on one filter chip, the isolation degree of two received signals received simultaneously is improved. In addition, by arranging two filters that receive signals simultaneously on different filter chips and arranging them so that they do not overlap in a top view, the distance between the two filters that receive signals simultaneously is ensured, thereby further improving the isolation degree of two received signals received simultaneously.

[0115] According to the above configuration structure, the wiring connecting the input bump 101 to the filters 100a and 100c and the wiring connecting the input bump 102 to the filters 100b and 100d do not cross inside the filter chip 121, and do not cross inside the filter chip 122 (refer to Figure 2B (a), (b), and (e) of). In addition, the wiring connecting the output bump 111 to the filter 100d, the wiring connecting the output bump 112 to the filter 100c, the wiring connecting the output bump 113 to the filter 100a, and the wiring connecting the output bump 114 to the filter 100b do not cross inside the filter chip 121, and do not cross inside the filter chip 122 (refer to Figure 2B (a), (b), and (d) of).

[0116] That is to say, inside the composite filter component 10B, no crossing occurs for the wiring connecting the input bump to the filter inside the filter chip, and no crossing occurs for the wiring connecting the output bump to the filter inside the filter chip. Thereby, the deterioration of the noise figure of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10B can be suppressed, and the isolation degree of the filters 100a to 100d inside the composite filter component 10B can be improved. Therefore, the composite filter component 10B can transmit the received signals in the frequency band ALR and the frequency band AMR that pass through simultaneously with low loss, and can transmit the received signals in the frequency band BLR and the frequency band BMR that pass through simultaneously with low loss.

[0117] [Structure of the composite filter component 10C involved in Embodiment 1.4]

[0118] Figure 2CIt is a top view and a sectional view of the composite filter component 10C involved in Embodiment 3. In this figure, a configuration structural example of each filter and each bump constituting the composite filter component 10C is shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 151 and located between the opposing main surfaces of the filter chip 122. Further, the b-b plane is a plane parallel to the main surface 153 and located between the opposing main surfaces of the filter chip 121. Further, the c-c plane is the main surface 153. Further, the d-d section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. Further, the e-e section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0119] Compared with the composite filter component 10A involved in Embodiment 1, the configuration structures of the filters 100a to 100d in the filter chips 121 and 122 of the composite filter component 10C involved in this embodiment are different. Therefore, hereinafter, regarding the composite filter component 10C involved in this embodiment, the description of the same structures as those of the composite filter component 10A involved in Embodiment 1 is omitted, and the description is centered on the structures of the filter chips 121 and 122 different from those of the composite filter component 10A.

[0120] The filter chip 121 is an example of a first laminated portion, and includes a main surface 153 (first main surface), a filter 100b (AMR), and a filter 100d (ALR). The filter chip 122 is an example of a second laminated portion, and includes a main surface 151 (second main surface), a filter 100a (BMR), and a filter 100c (BLR).

[0121] In this embodiment, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump).

[0122] Filters 100b and 100d are arranged in the order of filters 100b and 100d in the first direction (negative x-axis direction). Filters 100a and 100c are arranged in the order of filters 100a and 100c in the first direction (negative x-axis direction). When looking down at the main surfaces 151 and 153, at least a part of filter 100c overlaps with filter 100d, and at least a part of filter 100a overlaps with filter 100b.

[0123] That is to say, in the composite filter component 10C according to the present embodiment, by arranging two filters that receive signals simultaneously on one filter chip, the wiring connecting the two filters that receive signals simultaneously to the output bumps is prevented from approaching each other.

[0124] According to the above configuration structure, the wiring connecting the input bumps 101 to filters 100a and 100c and the wiring connecting the input bumps 102 to filters 100b and 100d do not cross within the filter chip 121, and do not cross within the filter chip 122 (refer to Figure 2C (a), (b) and (e) of the figure). In addition, the wiring connecting the output bump 111 to filter 100a, the wiring connecting the output bump 112 to filter 100b, the wiring connecting the output bump 113 to filter 100c, and the wiring connecting the output bump 114 to filter 100d do not cross within the filter chip 121, and do not cross within the filter chip 122 (refer to Figure 2C (a), (b) and (d) of the figure).

[0125] That is to say, inside the composite filter component 10C, no crossing occurs for the wiring connecting the input bumps to the filters within the filter chip, and no crossing occurs for the wiring connecting the output bumps to the filters within the filter chip. Thereby, the deterioration of the noise figure of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10C can be suppressed, and the isolation degree of the filters 100a to 100d within the composite filter component 10C can be improved. Therefore, the composite filter component 10C can transmit the received signals in the frequency band ALR and the received signals in the frequency band AMR that pass through simultaneously with low loss, and can transmit the received signals in the frequency band BLR and the received signals in the frequency band BMR that pass through simultaneously with low loss.

[0126] [Structure of the composite filter component 10D according to Embodiment 4]

[0127] Figure 2DIt is a top view and a cross-sectional view of the composite filter component 10D related to Embodiment 4. In this figure, the configuration structures of the respective filters and the respective bumps constituting the composite filter component 10D are shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 151 and located between the opposing main surfaces of the filter chip 122. Further, the b-b plane is a plane parallel to the main surface 153 and located between the opposing main surfaces of the filter chip 121. Further, the c-c plane is the main surface 153. Further, the d-d cross-section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. Further, the e-e cross-section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0128] Compared with the composite filter component 10A related to Embodiment 1, the composite filter component 10D related to the present embodiment has different configuration structures of the filters 100a to 100d in the filter chips 121 and 122. Therefore, hereinafter, regarding the composite filter component 10D related to the present embodiment, the description of the same structures as those of the composite filter component 10A related to Embodiment 1 will be omitted, and the description will be centered on the structures of the filter chips 121 and 122 different from those of the composite filter component 10A.

[0129] The filter chip 121 is an example of a first laminated portion, and includes a main surface 153 (first main surface), a filter 100a (BMR), a filter 100c (BLR), and a filter 100d (ALR). The filter chip 122 is an example of a second laminated portion, and includes a main surface 151 (second main surface) and a filter 100b (AMR).

[0130] In the present embodiment, the filter 100d is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump).

[0131] The filters 100a, 100c, and 100d are arranged in the order of filters 100a, 100c, and 100d in the first direction (negative x-axis direction). When looking down at the main surfaces 151 and 153, at least a part of the filter 100b overlaps with the filter 100d.

[0132] That is to say, in the composite filter component 10D according to this embodiment, by arranging the two filters 100b and 100d that receive signals simultaneously to overlap when looking down, and arranging the two filters 100a and 100c that receive signals simultaneously in one filter chip 121, the proximity and crossing of the wirings connected to the input bump 101 and the wirings connected to the input bump 102 are suppressed. In addition, by arranging the three filters 100a, 100c, and 100d in the filter chip 121 close to the output bumps 111 to 114, the wirings connecting the three filters to the output bumps are shortened.

[0133] According to the above configuration structure, the wirings connecting the input bump 101 to the filters 100a and 100c and the wirings connecting the input bump 102 to the filters 100b and 100d do not cross inside the filter chip 121, and also do not cross inside the filter chip 122 (refer to Figure 2D (a), (b), and (e) of Figure 2D ). In addition, the wirings connecting the output bump 111 to the filter 100a, the wirings connecting the output bump 112 to the filter 100b, the wirings connecting the output bump 113 to the filter 100c, and the wirings connecting the output bump 114 to the filter 100d do not cross inside the filter chip 121, and also do not cross inside the filter chip 122 (refer to

[0134] (a), (b), and (d) of

[0135] In addition, the configurations of filter 100d and filter 100b can be swapped. Additionally, filter 100b can be disposed on filter chip 121, and filter 100a or filter 100c can be disposed on filter chip 122. In this case, at least a part of filter 100a and filter 100c overlap when viewed from above.

[0136] [1.6 Stacked Structure of Composite Filter Component 10A Related to Embodiment 1]

[0137] Next, a specific example of the stacked structure of composite filter component 10A related to Embodiment 1 is shown. Figure 3 It is a detailed cross-sectional view of composite filter component 10A related to Embodiment 1.

[0138] Composite filter component 10A includes filter chips 121 and 122 stacked on each other, and filter chips 121 and 122 are joined by a support layer 325 disposed on the outer peripheral portion.

[0139] Filter chip 121 is an example of a first chip, and includes filter 100a (BMR) and filter 100b (AMR). In addition, filter chip 121 includes a piezoelectric substrate 326. Filters 100a and 100b are surface acoustic wave filters formed on piezoelectric substrate 326. Filter chip 122 is an example of a second chip, and includes filter 100c (BLR) and filter 100d (ALR). In addition, filter chip 122 includes a piezoelectric substrate 327. Filters 100c and 100d are surface acoustic wave filters formed on piezoelectric substrate 327.

[0140] On the main surface of piezoelectric substrate 326 facing piezoelectric substrate 327, an IDT electrode 330a constituting filter 100a and an IDT electrode 330b constituting filter 100b are formed. On the main surface of piezoelectric substrate 327 facing piezoelectric substrate 326, an IDT electrode 330c constituting filter 100c and an IDT electrode 330d constituting filter 100d are formed. That is, IDT electrodes 330a to 330d and the wirings connected to them are disposed in the hollow space surrounded by piezoelectric substrates 326 and 327 and support layer 325.

[0141] According to the above structure, the above-mentioned hollow space is an air layer with a relative dielectric constant of 1. Therefore, when the wirings formed on the piezoelectric substrate 326 and the wirings formed on the piezoelectric substrate 327 cross when the piezoelectric substrates 326 and 327 are viewed from above, the parasitic capacitance generated is smaller than that generated when the wirings formed on the dielectric substrate cross. Therefore, the isolation between the filters 100a and 100b and the filters 100c and 100d can be improved. In addition, compared with the wirings formed on the main surface of the piezoelectric substrate 326 facing the mounting substrate 90, for example, the wirings formed in the above-mentioned hollow space can ensure a large distance from the ground layer formed on the mounting substrate 90, so that the parasitic capacitance generated between the composite filter component 10A and the mounting substrate 90 can be made small.

[0142] Therefore, the composite filter component 10A can transmit the received signals in the frequency band ALR and the received signals in the frequency band AMR that pass through simultaneously with low loss, and can transmit the received signals in the frequency band BLR and the received signals in the frequency band BMR that pass through simultaneously with low loss.

[0143] In addition, the above structure in which the filter chips 121 and 122 each include a piezoelectric substrate, and the IDT electrodes and the wirings connected thereto are arranged in the hollow space between the filter chip 121 and the filter chip 122 can also be applied to the composite filter components 10B, 10C, and 10D.

[0144] [Structure of the high-frequency module 1A according to Modification 1.7]

[0145] Figure 4 It is a circuit structure diagram of the high-frequency module 1A according to Modification 1 of Embodiment 1. As shown in this figure, the high-frequency module 1A according to this modification includes a composite filter component 11, low-noise amplifiers 31 and 32, switches 20A, 21A, and 22A, inductors 41, 42, 43, 44, 45, and 46, an antenna connection terminal 200, and signal output terminals 110 and 120. The high-frequency module 1A according to this modification is different from the high-frequency module 1 according to Embodiment 1 in the following aspect: there are 3 groups of 2 frequency bands for simultaneous reception. Hereinafter, regarding the high-frequency module 1A according to this modification, the description of the same structure as that of the high-frequency module 1 according to Embodiment 1 will be omitted, and the description will be centered on the different structures.

[0146] The composite filter component 11 includes filters 100a, 100b, 100c, 100d, 100e, and 100f, input bumps 101, 102, and 103, and output bumps 111, 112, 113, 114, 115, and 116.

[0147] The filter 100d has a first passband including a reception band (ALR) that includes a frequency band AL (first frequency band). The filter 100c has a second passband including a reception band (BLR) that includes a frequency band BL (second frequency band). The filter 100b has a third passband including a reception band (AMR) that includes a frequency band AM (third frequency band). The filter 100a has a fourth passband including a reception band (BMR) that includes a frequency band BM (fourth frequency band). The filter 100f has a fifth passband including a reception band (CLR) that includes a frequency band CL (fifth frequency band). The filter 100e has a sixth passband including a reception band (CMR) that includes a frequency band CM (sixth frequency band).

[0148] The filters 100d and 100c are respectively an example of one of the first filter and the second filter and an example of the other of the first filter and the second filter. The filters 100b and 100a are respectively an example of one of the third filter and the fourth filter and an example of the other of the third filter and the fourth filter. The filters 100f and 100e are respectively an example of one of the fifth filter and the sixth filter and an example of the other of the fifth filter and the sixth filter.

[0149] In addition, the filters 100d and 100c may respectively be an example of one of the third filter and the fourth filter and an example of the other of the third filter and the fourth filter. In this case, the filters 100b and 100a are respectively an example of one of the first filter and the second filter and an example of the other of the first filter and the second filter.

[0150] The signal of the frequency band AL (first frequency band) and the signal of the frequency band AM (third frequency band) can be received simultaneously. The signal of the frequency band BL (second frequency band) and the signal of the frequency band BM (fourth frequency band) can be received simultaneously. The signal of the frequency band CL (fifth frequency band) and the signal of the frequency band CM (sixth frequency band) can be received simultaneously.

[0151] The input bump 102 is an example of a first input bump and is connected to the input end of the filter 100d and the input end of the filter 100b. The input bump 101 is an example of a second input bump and is connected to the input end of the filter 100c and the input end of the filter 100a. The input bump 103 is an example of a third input bump and is connected to the input end of the filter 100e and the input end of the filter 100f.

[0152] The output bump 114 is an example of the first output bump and is connected to the output terminal of the filter 100d. The output bump 113 is an example of the second output bump and is connected to the output terminal of the filter 100c. The output bump 112 is an example of the third output bump and is connected to the output terminal of the filter 100b. The output bump 111 is an example of the fourth output bump and is connected to the output terminal of the filter 100a. The output bump 116 is an example of the fifth output bump and is connected to the output terminal of the filter 100f. The output bump 115 is an example of the sixth output bump and is connected to the output terminal of the filter 100e.

[0153] Among the output bumps 111 to 116, the output bump 116 is arranged adjacent to at least one of the output bumps 114 and 113, and the output bump 115 is arranged adjacent to at least one of the output bumps 112 and 111.

[0154] In addition, in the composite filter component 11 according to this modification example, the output bumps 111 to 116 are illustrated as being arranged in the order of the output bumps 111, 112, 115, 113, 114, and 116. However, it is sufficient that at least one of the output bumps 113, 114, and 116 is not arranged between the output bumps 111, 112, and 115, and at least one of the output bumps 111, 112, and 115 is not arranged between the output bumps 113, 114, and 116. For example, the output bumps 111 to 116 may also be arranged in the order of the output bumps 111, 115, 112, 113, 116, and 114. In this case, the output bump 116 is arranged adjacent to the output bumps 114 and 113, and the output bump 115 is arranged adjacent to the output bumps 112 and 111.

[0155] The low-noise amplifier 32 is an example of the first low-noise amplifier and can amplify the signals of the ALR, BLR, and CLR. Since the frequency bands AL, BL, and CL are combinations of frequency bands received at different times, the low-noise amplifier 32 can be connected to the filter 100d whose passband includes the ALR, the filter 100c whose passband includes the BLR, and the filter 100f whose passband includes the CLR. Thus, the input terminal of the low-noise amplifier 32 is connected to the output bumps 113, 114, and 116 via the switch 22A.

[0156] The low-noise amplifier 31 is an example of a second low-noise amplifier and can amplify signals of AMR, BMR, and CMR. The frequency bands AM, BM, and CM are combinations of frequency bands received simultaneously with each other. Therefore, the low-noise amplifier 31 can be connected to the filter 100b whose passband includes AMR, the filter 100a whose passband includes BMR, and the filter 100e whose passband includes CMR. Thus, the input terminal of the low-noise amplifier 31 is connected to the output bumps 111, 112, and 115 via the switch 21A.

[0157] The switch 20A is connected between the antenna connection terminal 200 and the composite filter unit 11 and switches the connection between the antenna 2 and the input bump 101, the connection between the antenna 2 and the input bump 102, and the connection between the antenna 2 and the input bump 103. The switch 21A is connected between the low-noise amplifier 31 and the composite filter unit 11 and switches the connection between the low-noise amplifier 31 and the output bump 111, the connection between the low-noise amplifier 31 and the output bump 112, and the connection between the low-noise amplifier 31 and the output bump 115. The switch 22A is connected between the low-noise amplifier 32 and the composite filter unit 11 and switches the connection between the low-noise amplifier 32 and the output bump 113, the connection between the low-noise amplifier 32 and the output bump 114, and the connection between the low-noise amplifier 32 and the output bump 116.

[0158] The inductor 45 is connected between the output bump 115 and the switch 21A and is used to achieve impedance matching between the composite filter unit 11 and the low-noise amplifier 31. The inductor 46 is connected between the output bump 116 and the switch 22A and is used to achieve impedance matching between the composite filter unit 11 and the low-noise amplifier 32. In addition, the high-frequency module 1A of this modified example may not include at least one of the switches 20A to 22A and the inductors 41 to 46.

[0159] In the above structure, on the input side of the composite filter unit 11, the filters 100b (AMR) and 100d (ALR) that can be received simultaneously are connected to the input bump 102, the filters 100a (BMR) and 100c (BLR) that can be received simultaneously are connected to the input bump 101, and the filters 100e (CMR) and 100f (CLR) that can be received simultaneously are connected to the input bump 103. On the other hand, on the output side of the composite filter unit 11, the output bump 114 connected to the filter 100d, the output bump 113 connected to the filter 100c, and the output bump 116 connected to the filter 100f are adjacent, and the output bump 112 connected to the filter 100b, the output bump 111 connected to the filter 100a, and the output bump 115 connected to the filter 100e are adjacent.

[0160] Accordingly, when connecting the filters 100d (the output bumps 114 connected thereto), the filters 100c (the output bumps 113 connected thereto), and the filters 100f (the output bumps 116 connected thereto) that are not received simultaneously to the low-noise amplifier 32, and connecting the filters 100b (the output bumps 112 connected thereto), the filters 100a (the output bumps 111 connected thereto), and the filters 100e (the output bumps 115 connected thereto) that are not received simultaneously to the low-noise amplifier 31, the filters 100a to 100f can be connected to the low-noise amplifiers 31 and 32 in such a manner that the wirings connecting the output bumps 111 to 116 to the low-noise amplifiers 31 and 32 do not cross. Thereby, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of the wirings is generated near the input ends of the low-noise amplifiers 31 and 32. Accordingly, no crossing of the wirings occurs in the region between the output bumps 111 to 116 and the low-noise amplifiers 31 and 32, so that the deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and the deterioration of the amplification characteristics on the output side of the composite filter component 11 can be suppressed.

[0161] The frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 25 for LTE or n25 for 5G NR. The frequency band BM is, for example, Band 66 for LTE or n66 for 5G NR. The frequency band CL is, for example, Band 39 for LTE or n39 for 5G NR. The frequency band CM is, for example, Band 34 for LTE or n34 for 5G NR.

[0162] [1.8 Structure of the composite filter component 11A according to Embodiment 5]

[0163] As a specific structural example of the composite filter component 11 included in the high-frequency module 1A according to Modification 1, the composite filter component 11A according to Embodiment 5 is shown. Figure 5It is a top view and a cross-sectional view of the composite filter component 11A involved in Embodiment 5. In this figure, the configuration structures of the respective filters and the respective bumps constituting the composite filter component 11A are shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 154 and located between the opposing main surfaces of the filter chip 124. Further, the b-b plane is a plane parallel to the main surface 156 and located between the opposing main surfaces of the filter chip 123. Further, the c-c plane is the main surface 156. Further, the d-d cross-section is a plane perpendicular to the main surface 156 and passing through the output bumps 111 to 116. Further, the e-e cross-section is a plane perpendicular to the main surface 156 and passing through the input bumps 101 to 103.

[0164] The composite filter component 11A includes filter chips 123 and 124 stacked on each other, and includes main surfaces 156 (first main surface) and main surface 154 (second main surface) facing each other. The filter chip 123 is an example of a first layered portion, and includes a main surface 156 (first main surface), filters 100a (BMR), 100b (AMR), and 100e (CMR). The filter chip 124 is an example of a second layered portion, and includes a main surface 154 (second main surface), filters 100c (BLR), 100d (ALR), and 100f (CLR).

[0165] In the present embodiment, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump). The filter 100f is an example of a fifth filter and is connected to the input bump 103 (third input bump) and the output bump 116 (fifth output bump). The filter 100e is an example of a sixth filter and is connected to the input bump 103 (third input bump) and the output bump 115 (sixth output bump).

[0166] Each of the filter chips 123 and 124 in the filter chip, for example, has a function electrode formed in such a way that (1) it is IC chip-formed using a silicon substrate, (2) two filters are housed in one package, or (3) two filter function electrodes are formed on one piezoelectric substrate. In addition, the composite filter component 11A, for example, has a structure in which the filter chips 123 and 124 are joined by at least one of (1) indirect electrode bonding, (2) adhesive bonding, and (3) resin molding. The filter chips 123 and 124 are joined at the interface 155.

[0167] As Figure 5 shown in (c) of FIG., the composite filter component 11A has a rectangular shape when viewed from above the main surface 156, and has outer sides 311 (first outer side) and 313 (second outer side) facing each other and outer sides 312 and 314 facing each other. In addition, the composite filter component 11A may be a polygon when viewed from above the main surface 156.

[0168] The output bumps 111 to 116 are arranged on the main surface 156 in the first direction (negative x-axis direction) along the outer side 311 in the order of output bumps 111, 115, 112, 113, 116, and 114. On the other hand, the input bumps 101 to 103 are arranged in the first direction (negative x-axis direction) in the order of input bumps 101, 103, and 102 in the region between the output bumps 111 to 116 and the outer side 313 on the main surface 156.

[0169] Accordingly, no wiring crossover occurs in the region between the output bumps 111 to 116 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 11A. Therefore, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 11A can be suppressed.

[0170] In addition, the output bumps 111 to 116 may not be arranged linearly in the first direction as Figure 5 shown. The output bumps 111 to 116 only need to be arranged such that in the region between the outer side 311 and the input bumps 101 to 103, the output bumps 111, 112, and 115 are arranged adjacent to each other, and the output bumps 113, 114, and 116 are arranged adjacent to each other.

[0171] The filters 100c, 100d, and 100f are arranged in the order of filters 100c, 100f, and 100d in the first direction (negative x-axis direction). The filters 100a, 100b, and 100e are arranged in the order of filters 100a, 100e, and 100b in the first direction (negative x-axis direction). When the main surfaces 154 and 156 are viewed from above, at least a part of the filter 100c overlaps with the filter 100a, at least a part of the filter 100e overlaps with the filter 100f, and at least a part of the filter 100d overlaps with the filter 100b.

[0172] That is to say, in the composite filter component 11A according to the present embodiment, by arranging three filters that do not receive signals simultaneously on one filter chip, the isolation degree of two received signals received simultaneously is improved. In addition, by arranging two filters that receive signals simultaneously to overlap when viewed from above, the proximity and crossing of the wirings connected to the input bump 101, the wirings connected to the input bump 102, and the wirings connected to the input bump 103 are suppressed.

[0173] According to the above configuration structure, the wirings connecting the input bump 101 to the filters 100a and 100c, the wirings connecting the input bump 102 to the filters 100b and 100d, and the wirings connecting the input bump 103 to the filters 100e and 100f do not cross within the filter chip 123 and do not cross within the filter chip 124 (refer to Figure 5 (a), (b), and (e) of Figure 5 . In addition, the wirings connecting the output bump 111 to the filter 100a, the wirings connecting the output bump 112 to the filter 100b, the wirings connecting the output bump 113 to the filter 100c, the wirings connecting the output bump 114 to the filter 100d, the wirings connecting the output bump 115 to the filter 100e, and the wirings connecting the output bump 116 to the filter 100f do not cross within the filter chip 123 and do not cross within the filter chip 124 (refer to (a), (b), and (d) of .

[0174] That is to say, inside the composite filter component 11A, there is no crossing of the wirings that connect the input bumps to the filter within the filter chip, and there is no crossing of the wirings that connect the output bumps to the filter within the filter chip. As a result, it is possible to further suppress the deterioration of the noise figures of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 11A, and it is possible to improve the isolation of the filters 100a to 100f within the composite filter component 11A. Therefore, the composite filter component 11A can transmit the received signals in the frequency band AL and the received signals in the frequency band AM that pass through simultaneously with low loss, can transmit the received signals in the frequency band BL and the received signals in the frequency band BM that pass through simultaneously with low loss, and can transmit the received signals in the frequency band CL and the received signals in the frequency band CM that pass through simultaneously with low loss.

[0175] [Structure of the high-frequency module 1B according to Modification Example 2]

[0176] Figure 6 It is a circuit structure diagram of the high-frequency module 1B according to Modification Example 2 of Embodiment 1. As shown in this figure, the high-frequency module 1B according to this modification example includes a composite filter component 12, low-noise amplifiers 31, 32, and 33, switches 20B, 21B, 22B, and 23B, inductors 41 to 46, an antenna connection terminal 200, and signal output terminals 110, 120, and 130. The high-frequency module 1B according to this modification example is different from the high-frequency module 1A according to Modification Example 1 in the following aspect: reception is performed for three frequency bands simultaneously. Hereinafter, regarding the high-frequency module 1B according to this modification example, the description of the same structure as that of the high-frequency module 1A according to Modification Example 1 will be omitted, and the description will be centered on the different structures.

[0177] The composite filter component 12 includes filters 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h, input bumps 101, 102, and 103, and output bumps 111, 112, 113, 114, 115, 116, 117, and 118.

[0178] The filter 100d has a first passband including a reception band (ALR) that includes a frequency band AL (first frequency band). The filter 100c has a second passband including a reception band (BLR) that includes a frequency band BL (second frequency band). The filter 100b has a third passband including a reception band (AMR) that includes a frequency band AM (third frequency band). The filter 100a has a fourth passband including a reception band (BMR) that includes a frequency band BM (fourth frequency band). The filter 100f has a fifth passband including a reception band (CLR) that includes a frequency band CL (fifth frequency band). The filter 100e has a sixth passband including a reception band (CMR) that includes a frequency band CM (sixth frequency band). The filter 100g has a seventh passband including a reception band (AHR) that includes a frequency band AH (seventh frequency band). The filter 100h has an eighth passband including a reception band (BHR) that includes a frequency band BH (eighth frequency band). The filters 100d and 100c are respectively an example of one of the first filter and the second filter and the other of the first filter and the second filter. The filters 100b and 100a are respectively an example of one of the third filter and the fourth filter and the other of the third filter and the fourth filter. The filters 100f and 100e are respectively an example of one of the fifth filter and the sixth filter and the other of the fifth filter and the sixth filter. The filters 100g and 100h are respectively an example of one of the seventh filter and the eighth filter and the other of the seventh filter and the eighth filter.

[0179] Signals of the frequency band AL (first frequency band), signals of the frequency band AM (third frequency band), and signals of the frequency band AH (seventh frequency band) can be received simultaneously. Signals of the frequency band BL (second frequency band), signals of the frequency band BM (fourth frequency band), and signals of the frequency band BH (eighth frequency band) can be received simultaneously. Signals of the frequency band CL (fifth frequency band) and signals of the frequency band CM (sixth frequency band) can be received simultaneously.

[0180] The input bump 102 is an example of a first input bump and is connected to the input ends of the filter 100d, the filter 100b, and the filter 100g. The input bump 101 is an example of a second input bump and is connected to the input ends of the filter 100c, the filter 100a, and the filter 100h. The input bump 103 is an example of a third input bump and is connected to the input ends of the filter 100e and the filter 100f.

[0181] The output bump 114 is an example of the first output bump and is connected to the output terminal of the filter 100d. The output bump 113 is an example of the second output bump and is connected to the output terminal of the filter 100c. The output bump 112 is an example of the third output bump and is connected to the output terminal of the filter 100b. The output bump 111 is an example of the fourth output bump and is connected to the output terminal of the filter 100a. The output bump 116 is an example of the fifth output bump and is connected to the output terminal of the filter 100f. The output bump 115 is an example of the sixth output bump and is connected to the output terminal of the filter 100e. The output bump 118 is an example of the seventh output bump and is connected to the output terminal of the filter 100g. The output bump 117 is an example of the eighth output bump and is connected to the output terminal of the filter 100h.

[0182] Among the output bumps 111 to 114, 117, and 118, the output bump 114 is disposed adjacent to the output bump 113, the output bump 112 is disposed adjacent to the output bump 111, and the output bump 117 is disposed adjacent to the output bump 118.

[0183] In addition, in the composite filter component 12 according to this modification example, the output bumps 111, 112, and 115 are illustrated as being arranged in the order of the output bumps 111, 112, and 115, but it is sufficient that at least one of the output bumps 113, 114, 116, 117, and 118 is not disposed between the output bumps 111, 112, and 115. Further, the output bumps 113, 114, and 116 are illustrated as being arranged in the order of the output bumps 113, 114, and 116, but it is sufficient that at least one of the output bumps 111, 112, 115, 117, and 118 is not disposed between the output bumps 113, 114, and 116. For example, the output bumps 111, 112, and 115 may be arranged in the order of the output bumps 111, 115, and 112 or in the order of the output bumps 115, 111, and 112. For example, the output bumps 113, 114, and 116 may be arranged in the order of the output bumps 113, 116, and 114 or in the order of the output bumps 116, 113, and 114.

[0184] The low-noise amplifier 33 is an example of the third low-noise amplifier and can amplify the signals of AHR and BHR. Since the frequency bands AH and BH are combinations of frequency bands received at different times from each other, the low-noise amplifier 33 can be connected to the filter 100g whose passband includes AHR and the filter 100h whose passband includes BHR. Thus, the input terminal of the low-noise amplifier 33 is connected to the output bumps 117 and 118 via the switch 23B.

[0185] The switch 20B is connected between the antenna connection terminal 200 and the composite filter component 12. The switch 21B is connected between the low-noise amplifier 31 and the composite filter component 12. The switch 22B is connected between the low-noise amplifier 32 and the composite filter component 12. The switch 23B is connected between the low-noise amplifier 33 and the composite filter component 12.

[0186] In addition, the high-frequency module 1B of this modification example may not include at least one of the switches 20B to 23B and the inductors 41 to 46.

[0187] In the above structure, on the input side of the composite filter component 12, the filters 100b (AMR), 100d (ALR), and 100g (AHR) that can receive signals simultaneously are connected to the input bump 102, and the filters 100a (BMR), 100c (BLR), and 100h (BHR) that can receive signals simultaneously are connected to the input bump 101. On the other hand, on the output side of the composite filter component 12, the output bump 114 connected to the filter 100d is adjacent to the output bump 113 connected to the filter 100c, the output bump 112 connected to the filter 100b is adjacent to the output bump 111 connected to the filter 100a, and the output bump 118 connected to the filter 100g is adjacent to the output bump 117 connected to the filter 100h.

[0188] Accordingly, when connecting the filters 100d (the output bump 114 connected thereto), 100c (the output bump 113 connected thereto), and 100f (the output bump 116 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 32, connecting the filters 100b (the output bump 112 connected thereto), 100a (the output bump 111 connected thereto), and 100e (the output bump 115 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 31, and connecting the filters 100g (the output bump 118 connected thereto) and 100h (the output bump 117 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 33, the filters 100a to 100h can be connected to the low-noise amplifiers 31 to 33 in such a way that the wirings connecting the output bumps 111 to 118 to the low-noise amplifiers 31 to 33 do not cross. Thus, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of wirings is generated near the input ends of the low-noise amplifiers 31 to 33. Accordingly, no crossing of wirings occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 to 33 and suppress the degradation of the amplification characteristics on the output side of the composite filter component 12.

[0189] The frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 25 for LTE or n25 for 5G NR. The frequency band BM is, for example, Band 66 for LTE or n66 for 5G NR. The frequency band CL is, for example, Band 39 for LTE or n39 for 5G NR. The frequency band CM is, for example, Band 34 for LTE or n34 for 5G NR. The frequency band AH is, for example, Band 40 for LTE or n40 for 5G NR. The frequency band BH is, for example, Band 30 for LTE or n30 for 5G NR.

[0190] Furthermore, in the high-frequency module 1B according to this modification example, the filters 100g or 100h may be absent. In this case, the configuration structure of the output bumps is as follows: the output bumps 111, 112, and 115 are arranged adjacent to each other, the output bumps 113, 114, and 116 are arranged adjacent to each other, and the output bump 117 or 118 is arranged individually between the output bumps 111, 112, and 115 and the output bumps 113, 114, and 116.

[0191] [1.10 Structure of the composite filter component 12A according to Embodiment 6]

[0192] As a specific structural example of the composite filter component 12 included in the high-frequency module 1B according to Modification Example 2, the composite filter component 12A according to Embodiment 6 is shown. Figure 7A are a top view and a cross-sectional view of the composite filter component 12A according to Embodiment 6. In this figure, a configuration structure example of each filter and each bump constituting the composite filter component 12A is shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. Furthermore, the a-a plane is a plane parallel to the main surface 157 and located between the opposing main surfaces of the filter chip 126. In addition, the b-b plane is a plane parallel to the main surface 159 and located between the opposing main surfaces of the filter chip 125. In addition, the c-c plane is the main surface 159. In addition, the d-d cross-section is a plane perpendicular to the main surface 159 and passing through the output bumps 111 to 118. In addition, the e-e cross-section is a plane perpendicular to the main surface 159 and passing through the input bumps 101 to 103.

[0193] The composite filter component 12A includes filter chips 125 and 126 stacked on top of each other, and includes main surfaces 159 (first main surface) and 157 (second main surface) facing each other. The filter chip 125 is an example of a first lamination part, and includes a main surface 159 (first main surface), filters 100a (BMR), 100b (AMR), 100e (CMR), and 100g (AHR). The filter chip 126 is an example of a second lamination part, and includes a main surface 157 (second main surface), filters 100c (BLR), 100d (ALR), 100f (CLR), and 100h (BHR).

[0194] In this embodiment, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump). The filter 100f is an example of a fifth filter and is connected to the input bump 103 (third input bump) and the output bump 116 (fifth output bump). The filter 100e is an example of a sixth filter and is connected to the input bump 103 (third input bump) and the output bump 115 (sixth output bump). The filter 100g is an example of a seventh filter and is connected to the input bump 102 (first input bump) and the output bump 118 (seventh output bump). The filter 100h is an example of an eighth filter and is connected to the input bump 101 (second input bump) and the output bump 117 (eighth output bump).

[0195] As Figure 7A shown in (c) of, the composite filter component 12A has a rectangular shape when viewed from above the main surface 159, and has outer edges 321 (first outer edge) and 323 (second outer edge) facing each other and outer edges 322 and 324 facing each other. In addition, the composite filter component 12A may be a polygon when viewed from above the main surface 159.

[0196] The output bumps 111 to 118 are arranged on the main surface 159 in the first direction (negative x-axis direction) along the outer edge 321 in the order of the output bumps 111, 115, 112, 117, 118, 113, 116, and 114. On the other hand, the input bumps 101 to 103 are arranged on the main surface 159 in the first direction (negative x-axis direction) in the order of the input bumps 101, 103, and 102 in the region between the output bumps 111 to 118 and the outer edge 323.

[0197] Accordingly, no wiring crossover occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33 arranged on the output side of the complex filter component 12A. Therefore, the deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and the degradation of the amplification characteristics on the output side of the complex filter component 12A can be suppressed.

[0198] In addition, the output bumps 111 to 118 may not be arranged linearly in the first direction as Figure 7A shown. The output bumps 111 to 118 only need to be as follows: in the region between the outer edge 321 and the input bumps 101 to 103, the output bumps 111, 112, and 115 are arranged adjacent to each other, the output bumps 113, 114, and 116 are arranged adjacent to each other, and the output bumps 117 and 118 are arranged adjacent to each other.

[0199] The filters 100c, 100d, 100f, and 100h are arranged in the first direction (negative x-axis direction) in the order of the filters 100h, 100c, 100f, and 100d. The filters 100a, 100b, 100e, and 100g are arranged in the first direction (negative x-axis direction) in the order of the filters 100a, 100e, 100b, and 100g.

[0200] That is, in the complex filter component 12A according to the present embodiment, by arranging the three filters 100a, 100c, and 100h that perform reception simultaneously close to the input bump 101, arranging the three filters 100b, 100d, and 100g that perform reception simultaneously close to the input bump 102, and arranging the two filters 100e and 100f that perform reception simultaneously close to the input bump 103, the proximity and crossover of the wirings connected to the input bump 101, the wiring connected to the input bump 102, and the wiring connected to the input bump 103 are suppressed.

[0201] According to the above configuration structure, the wirings connecting the input bumps 101 to the filters 100a, 100c, and 100h, the wirings connecting the input bumps 102 to the filters 100b, 100d, and 100g, and the wirings connecting the input bumps 103 to the filters 100e and 100f do not cross within the filter chip 125 and do not cross within the filter chip 126 (refer to Figure 7A (a), (b), and (e) of Figure 7A ). In addition, the wirings connecting the output bump 111 to the filter 100a, the wirings connecting the output bump 112 to the filter 100b, the wirings connecting the output bump 113 to the filter 100c, the wirings connecting the output bump 114 to the filter 100d, the wirings connecting the output bump 115 to the filter 100e, the wirings connecting the output bump 116 to the filter 100f, the wirings connecting the output bump 117 to the filter 100h, and the wirings connecting the output bump 118 to the filter 100g do not cross within the filter chip 125 and do not cross within the filter chip 126 (refer to Figure 7A (a), (b), and (d) of

[0202] That is to say, inside the composite filter component 12A, no crossing occurs for the wirings connecting the input bumps to the filters within the filter chip, and no crossing occurs for the wirings connecting the output bumps to the filters within the filter chip. Thereby, it is possible to further suppress the deterioration of the noise figure of the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 12A, and it is possible to improve the isolation degree of the filters 100a to 100h within the composite filter component 12A. Therefore, the composite filter component 12A can transmit the received signals in the simultaneously passed frequency bands AL, AM, and AH with low loss, can transmit the received signals in the simultaneously passed frequency bands BL, BM, and BH with low loss, and can transmit the received signals in the simultaneously passed frequency bands CL and CM with low loss.

[0203] [1.11 Structure of the composite filter component 12B according to Embodiment 7]

[0204] As a specific structural example of the composite filter component 12 included in the high-frequency module 1B according to Modification 2, the composite filter component 12B according to Embodiment 7 is shown. Figure 7BThis is a top view and a cross-sectional view of the composite filter component 12B related to Embodiment 7. Compared with the composite filter component 12A related to Embodiment 6, the configuration structures of the respective filters of the filter chips 125 and 126 are different. Hereinafter, regarding the composite filter component 12B related to this embodiment, the description of the same structure as that of the composite filter component 12A related to Embodiment 6 will be omitted, and the description will be centered on the different structures.

[0205] The composite filter component 12B includes filter chips 125 and 126 stacked on each other, and includes a main surface 159 (first main surface) and a main surface 157 (second main surface) facing each other. The filter chip 125 is an example of a first laminated portion, and includes a main surface 159 (first main surface), filters 100b (AMR), 100d (ALR), 100e (CMR), and 100g (AHR). The filter chip 126 is an example of a second laminated portion, and includes a main surface 157 (second main surface), filters 100a (BMR), 100c (BLR), 100f (CLR), and 100h (BHR).

[0206] As Figure 7B shown in (c) of, the composite filter component 12B has a rectangular shape when viewed from above the main surface 159, and has outer sides 321 (first outer side) and 323 (second outer side) facing each other and outer sides 322 and 324 facing each other. In addition, the composite filter component 12B may be polygonal when viewed from above the main surface 159.

[0207] The output bumps 111 to 118 are arranged on the main surface 159 in the first direction (negative x-axis direction) along the outer side 321 in the order of output bumps 115, 111, 112, 117, 118, 113, 114, and 116. On the other hand, the input bumps 101 to 103 are arranged in the first direction (negative x-axis direction) in the order of input bumps 101, 103, and 102 in the region between the output bumps 111 to 118 and the outer side 323 on the main surface 159.

[0208] Accordingly, no wiring crossing occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 12B. Therefore, deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 12B can be suppressed.

[0209] In addition, the output bumps 111 to 118 may not be like Figure 7Bare linearly arranged in the first direction as shown. The output bumps 111 to 118 only need to be as follows: in the region between the outer edge 321 and the input bumps 101 to 103, the output bumps 111, 112, and 115 are arranged adjacent to each other, the output bumps 113, 114, and 116 are arranged adjacent to each other, and the output bumps 117 and 118 are arranged adjacent to each other.

[0210] The filters 100a, 100c, 100f, and 100h are arranged in the first direction (negative x-axis direction) in the order of filters 100a, 100h, 100c, and 100f. The filters 100b, 100d, 100e, and 100g are arranged in the first direction (negative x-axis direction) in the order of filters 100e, 100b, 100g, and 100d.

[0211] That is to say, in the composite filter component 12B according to this embodiment, three filters 100a, 100c, and 100h that are received simultaneously are arranged on the filter chip 126, and three filters 100b, 100d, and 100g that are received simultaneously are arranged on the filter chip 125. In addition, three filters 100a, 100b, and 100e that are not received simultaneously are collectively arranged on the positive x-axis side, and three filters 100c, 100d, and 100f that are not received simultaneously are collectively arranged on the negative x-axis side. Thereby, each filter is close to the output bump connected to the filter, and the crossing between the wirings connected to each output bump is suppressed.

[0212] In addition, when the frequency band AL is Band 3 for LTE or n3 for 5GNR, the frequency band AM is Band 1 for LTE or n1 for 5GNR, the frequency band BL is Band 25 for LTE or n25 for 5GNR, the frequency band BM is Band 66 for LTE or n66 for 5GNR, the frequency band AH is Band 40 for LTE or n40 for 5GNR, and the frequency band BH is Band 30 for LTE or n30 for 5GNR, the frequency range including ALR, AMR, and AHR is larger than the frequency range including BLR, BMR, and BHR. When receiving multiple signals simultaneously, the larger the above frequency range, the greater the so-called beamforming loss. In addition, when comparing the filter chips 125 and 126, the filter chip 125 configured closer to the input bump can make the connection wiring shorter. From this perspective as well, the filters 100b, 100d, and 100g are arranged on the filter chip 125, and the filters 100a, 100c, and 100h are arranged on the filter chip 126. Thereby, the beamforming loss of the composite filter component 12B can be reduced.

[0213] In addition, in the case of receiving signals in multiple frequency bands simultaneously, the beamforming loss in the frequency bands on the low-frequency side is large. From this perspective, in the filter chip 125, the filter 100d among the filters 100b, 100d, and 100g connected to the input bump 102 is arranged closest to the input bump 102. Thereby, the beamforming loss of the composite filter component 12B can be reduced.

[0214] According to the above configuration structure, the wirings connecting the input bump 101 to the filters 100a, 100c, and 100h, the wirings connecting the input bump 102 to the filters 100b, 100d, and 100g, and the wirings connecting the input bump 103 to the filters 100e and 100f do not cross inside the filter chip 125 and do not cross inside the filter chip 126 (refer to Figure 7B (a), (b), and (e) of Figure 7B . In addition, the wirings connecting the output bump 111 to the filter 100a, the wirings connecting the output bump 112 to the filter 100b, the wirings connecting the output bump 113 to the filter 100c, the wirings connecting the output bump 114 to the filter 100d, the wirings connecting the output bump 115 to the filter 100e, the wirings connecting the output bump 116 to the filter 100f, the wirings connecting the output bump 117 to the filter 100h, and the wirings connecting the output bump 118 to the filter 100g do not cross inside the filter chip 125 and do not cross inside the filter chip 126 (refer to

[0215] (a), (b), and (d) of

[0216] In addition, in the composite filter component 12B involved in this embodiment, the filters 100e and 100f may not be provided. In this case, the filter chip 125 includes the filters 100b, 100d, and 100g, and the filter chip 126 includes the filters 100a, 100c, and 100h. The filters 100a, 100c, and 100h are arranged in the order of filters 100a, 100h, and 100c in the first direction, and the filters 100b, 100d, and 100g are arranged in the order of filters 100b, 100g, and 100d in the first direction. In addition, the input bumps 103, output bumps 117, and 118 are deleted, and the output bumps 111 to 116 are arranged on the main surface 159 in the order of output bumps 115, 111, 112, 113, 114, and 116 in the first direction. On the other hand, the input bumps 101 and 102 are arranged in the region between the output bumps 111 to 116 and the outer edge 323 on the main surface 159 in the order of input bumps 101 and 102 in the first direction.

[0217] [Structure of the high-frequency module 1C according to Modification Example 3 of 1.12]

[0218] Figure 8A It is a circuit structure diagram of the high-frequency module 1C according to Modification Example 3 of Embodiment 1. As shown in this figure, the high-frequency module 1C according to this modification includes a composite filter component 13, low-noise amplifiers 31 and 32, a power amplifier 36, switches 20, 21, 22, and 24, inductors 41 to 44, an antenna connection terminal 200, signal output terminals 110 and 120, and a signal input terminal 140. The high-frequency module 1C according to this modification is different from the high-frequency module 1 according to Embodiment 1 in the following aspect: a transmission circuit is added. Hereinafter, regarding the high-frequency module 1C according to this modification, the description of the same structure as that of the high-frequency module 1 according to Embodiment 1 is omitted, and the description will be centered on the different structure.

[0219] The composite filter component 13 includes filters 100a, 100b, 100c, 100d, 100j, 100k, 100l, and 100m, input bumps 101, 102, 161, 162, 163, and 164, and output bumps 111, 112, 113, and 114.

[0220] The filters 100a to 100d have the same structure as the filters 100a to 100d included in the composite filter component 10 according to Embodiment 1, and thus the description thereof is omitted.

[0221] Filter 100j has a passband including a transmission band (ALT) with a frequency band AL. Filter 100k has a passband including a transmission band (BLT) with a frequency band BL. Filter 100l has a passband including a transmission band (AMT) with a frequency band AM. Filter 100m has a passband including a transmission band (BMT) with a frequency band BM.

[0222] Signals in the frequency band AL (first frequency band) and signals in the frequency band AM (third frequency band) can be transmitted and received simultaneously, and signals in the frequency band BL (second frequency band) and signals in the frequency band BM (fourth frequency band) can be transmitted and received simultaneously.

[0223] Input bump 102 is an example of a first input bump and is connected to the input ends of filter 100d, filter 100b, the output end of filter 100j, and the output end of filter 100l. Input bump 101 is an example of a second input bump and is connected to the input ends of filter 100c, filter 100a, the output end of filter 100k, and the output end of filter 100m.

[0224] Among output bumps 111 to 114, output bump 111 and output bump 112 are arranged adjacent to each other, and output bump 113 and output bump 114 are arranged adjacent to each other.

[0225] Input bump 161 is connected to the input end of filter 100j. Input bump 162 is connected to the input end of filter 100l. Input bump 163 is connected to the input end of filter 100k. Input bump 164 is connected to the input end of filter 100m.

[0226] Power amplifier 36 can amplify signals of ALT, AMT, BLT, and BMT.

[0227] Switch 20 is connected between antenna connection terminal 200 and composite filter component 13. Switch 21 is connected between low-noise amplifier 31 and composite filter component 13. Switch 22 is connected between low-noise amplifier 32 and composite filter component 13. Switch 24 is connected between power amplifier 36 and composite filter component 13.

[0228] In addition, the high-frequency module 1C of this modification example may not include at least one of switches 20 to 22, 24 and inductors 41 to 44.

[0229] According to the above structure, when connecting the filter 100d (the output bump 114 connected thereto) and the filter 100c (the output bump 113 connected thereto) that are received at different times to the low-noise amplifier 32, and connecting the filter 100b (the output bump 112 connected thereto) and the filter 100a (the output bump 111 connected thereto) that are received at different times to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 in such a way that the wirings connecting the output bumps 111 to 114 to the low-noise amplifiers 31 and 32 do not cross. Thus, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of wirings is generated near the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and it is possible to suppress the deterioration of the amplification characteristics on the output side of the composite filter component 13.

[0230] Next, as a specific structural example of the composite filter component 13 included in the high-frequency module 1C according to Modification 3, the composite filter component 13A according to Embodiment 8 is shown. Figure 8B It is a top view of the composite filter component 13A according to Embodiment 8.

[0231] As shown in this figure, the composite filter component 13A has a rectangular shape when viewed from above the main surface 261, and has outer sides 331 and 333 facing each other and outer sides 332 and 334 facing each other. In addition, the composite filter component 13A may be a polygon when viewed from above the main surface 261.

[0232] The output bumps 111 to 114 are arranged on the main surface 261 in the order of the output bumps 111, 112, 113, and 114 in the first direction (negative x-axis direction) along the outer side 331. On the other hand, the input bumps 101 and 102 are arranged in the order of the input bumps 101 and 102 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 114 and the outer side 333 on the main surface 261. And the input bumps 161 to 164 are arranged in the order of the input bumps 164, 163, 162, and 161 in the first direction (negative x-axis direction) in the region between the input bumps 101 and 102 and the outer side 333 on the main surface 261.

[0233] Accordingly, no crossing of wirings occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 13A. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and it is possible to suppress the deterioration of the amplification characteristics on the output side of the composite filter component 13A.

[0234] In addition, the input bumps 161 to 164 through which signals are transmitted are arranged apart from the output bumps 111 to 114 through which only received signals pass, so that the isolation between transmission and reception can be ensured.

[0235] In addition, the output bumps 111 to 114 may not be arranged linearly in the first direction as Figure 8B shown. It is sufficient that the output bumps 111 to 114 are as follows: in the region between the outer side 331 and the input bumps 101 and 102, the output bumps 111 and 112 are arranged adjacent to each other, and the output bumps 113 and 114 are arranged adjacent to each other.

[0236] In addition, in Modification 3 and Embodiment 8, the frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 25 for LTE or n25 for 5G NR. The frequency band BM is, for example, Band 66 for LTE or n66 for 5G NR.

[0237] In addition, in this case, a part of the frequency of ALT (B3T) overlaps with the frequency of BMT (B66T). In response to this, as Figure 8B shown, between the input bump 161 through which the signal of ALT passes and the input bump 164 through which the signal of BMT passes, input bumps 162 and 163 through which the signals of AMT and BLT whose frequencies do not overlap with the frequencies of ALT and BMT pass are arranged.

[0238] Accordingly, the isolation between the wirings connecting the input bumps 161 to 164 to the power amplifier 36 can be ensured.

[0239] [Structure of the high-frequency module 1D according to Modification 4]

[0240] Figure 9A is a circuit structure diagram of the high-frequency module 1D according to Modification 4 of Embodiment 1. As shown in this figure, the high-frequency module 1D according to this modification includes a composite filter component 14, low-noise amplifiers 31 and 32, a power amplifier 36, switches 20A, 21A, 22A, and 25, an antenna connection terminal 200, signal output terminals 110 and 120, and a signal input terminal 140. The high-frequency module 1D according to this modification is different from the high-frequency module 1C according to Modification 3 in the following aspect: the composite filter component 14 includes a filter for TDD. Hereinafter, regarding the high-frequency module 1D according to this modification, the description of the same structure as that of the high-frequency module 1C according to Modification 3 is omitted, and the description will be centered on the different structure.

[0241] The composite filter component 14 includes filters 100a, 100b, 100c, 100d, 100e, 100f, 100j, 100k, 100l, and 100m, input bumps 101, 102, 103, 161, 162, 163, and 164, output bumps 111, 112, 113, and 114, and input / output bumps 165 and 166.

[0242] Filters 100a to 100d and 100j to 100m have the same structure as the filters 100a to 100d and 100j to 100m included in the composite filter component 13 according to the third modification example, and thus the description thereof is omitted.

[0243] Filter 100f has a fifth passband including a transmission band and a reception band (CLTR) of frequency band CL (the fifth frequency band). Filter 100e has a sixth passband including a transmission band and a reception band (CMTR) of frequency band CM (the sixth frequency band). Filters 100f and 100e are filters for TDD that allow transmission signals and reception signals to pass through in a time-division manner.

[0244] Signals of frequency band AL (the first frequency band) and signals of frequency band AM (the third frequency band) can be transmitted and received simultaneously, signals of frequency band BL (the second frequency band) and signals of frequency band BM (the fourth frequency band) can be transmitted and received simultaneously, and signals of frequency band CL (the fifth frequency band) and signals of frequency band CM (the sixth frequency band) can be transmitted and received simultaneously.

[0245] Input bump 102 is an example of a first input bump and is connected to the input end of filter 100d, the input end of filter 100b, the output end of filter 100j, and the output end of filter 100l. Input bump 101 is an example of a second input bump and is connected to the input end of filter 100c, the input end of filter 100a, the output end of filter 100k, and the output end of filter 100m. Input bump 103 is an example of a third input bump and is connected to one end of filter 100e and one end of filter 100f.

[0246] Among output bumps 111 to 114, output bump 111 and output bump 112 are arranged adjacent to each other, and output bump 113 and output bump 114 are arranged adjacent to each other.

[0247] Input bump 161 is connected to the input end of filter 100j. Input bump 162 is connected to the input end of filter 100l. Input bump 163 is connected to the input end of filter 100k. Input bump 164 is connected to the input end of filter 100m.

[0248] The input / output bump 165 is an example of the sixth output bump and is connected to the other end of the filter 100e. The input / output bump 166 is an example of the fifth output bump and is connected to the other end of the filter 100f.

[0249] The power amplifier 36 can amplify the signals of ALT, AMT, BLT, BMT, CLTR, and CMTR.

[0250] The switch 20A is connected between the antenna connection terminal 200 and the composite filter component 14. The switch 21A is connected between the low-noise amplifier 31 and the composite filter component 14. The switch 22A is connected between the low-noise amplifier 32 and the composite filter component 14. The switch 25 is connected between the power amplifier 36 and the composite filter component 14.

[0251] In addition, the high-frequency module 1D of this modification example may not include at least one of the switches 20A to 22A and 25.

[0252] According to the above structure, when connecting the filters 100d (the output bump 114 connected thereto) and 100c (the output bump 113 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 32, and connecting the filters 100b (the output bump 112 connected thereto) and 100a (the output bump 111 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 in such a way that the wirings connecting the output bumps 111 to 114 to the low-noise amplifiers 31 and 32 do not cross. As a result, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of the wirings is generated near the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32 and suppress the deterioration of the amplification characteristics on the output side of the composite filter component 14.

[0253] Next, as a specific structural example of the composite filter component 14 included in the high-frequency module 1D according to Modification Example 4, the composite filter component 14A according to Embodiment 9 is shown. Figure 9B It is a top view of the composite filter component 14A according to Embodiment 9.

[0254] As shown in this figure, the composite filter component 14A has a rectangular shape when viewed from above the main surface 171, and has outer sides 341 and 343 facing each other and outer sides 342 and 344 facing each other. In addition, the composite filter component 14A may be a polygon when viewed from above the main surface 171.

[0255] The output bumps 111 to 114 and the input / output bumps 165 to 166 are arranged on the main surface 171 in the first direction (negative x-axis direction) along the outer edge 341 in the order of the output bumps 111, 112, 113, 114, the input / output bumps 165, and 166. On the other hand, the input bumps 101 to 103 are arranged in the order of the input bumps 101, 102, and 103 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 114 and the input / output bumps 165 to 166 and the outer edge 343 on the main surface 171. And the input bumps 161 to 164 are arranged in the order of the input bumps 164, 163, 162, and 161 in the first direction (negative x-axis direction) in the region between the input bumps 101 to 103 and the outer edge 343 on the main surface 171.

[0256] Accordingly, no crossovers of wirings connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 disposed on the output side of the complex filter component 14A are generated in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32. Therefore, deterioration of the noise figures of the low-noise amplifiers 31 and 32 in the case of simultaneously receiving the reception signals of the frequency bands AL and AM and in the case of simultaneously receiving the reception signals of the frequency bands BL and BM can be suppressed, and deterioration of the amplification characteristics on the output side of the complex filter component 14A can be suppressed.

[0257] In addition, the input bumps 161 to 164 and the input / output bumps 165 to 166 through which the transmission signals pass are arranged separately from the output bumps 111 to 114 through which only the reception signals pass. Therefore, the isolation between transmission and reception can be ensured.

[0258] In addition, the output bumps 111 to 114 do not have to be arranged linearly in the first direction as shown in Figure 9B It is sufficient that the output bumps 111 and 112 are arranged adjacent to each other, and the output bumps 113 and 114 are arranged adjacent to each other in the region between the outer edge 341 and the input bumps 101 to 103.

[0259] In addition, in the complex filter component 14A according to the present embodiment, the filters 100j to 100m may not be provided. In this case, in the configuration structure of the input bumps and the output bumps shown in Figure 9B it is only necessary to delete the input bumps 161 to 164, and the configuration structures of the input bumps 101 to 103, the output bumps 111 to 114, and the input / output bumps 165 to 166 remain unchanged.

[0260] In addition, in Modification Example 4 and Embodiment 9, the frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 25 for LTE or n25 for 5G NR. The frequency band BM is, for example, Band 66 for LTE or n66 for 5G NR. The frequency band CL is, for example, Band 39 for LTE or n39 for 5G NR. The frequency band CM is, for example, Band 34 for LTE or n34 for 5G NR.

[0261] In addition, in this case, a part of the frequency of ALT (B3T) overlaps with the frequency of BMT (B66T). Regarding this, as Figure 9B shown, between the input bump 161 through which the signal of ALT passes and the input bump 164 through which the signal of BMT passes, input bumps 162 and 163 through which the signals of AMT and BLT whose frequencies do not overlap with the frequencies of ALT and BMT pass are arranged.

[0262] Accordingly, it is possible to ensure the isolation degree between the wirings connecting the input bumps 161 to 164 and the power amplifier 36.

[0263] [1.14 Structure of High-Frequency Module 1E Related to Modification Example 5]

[0264] Figure 10A is a circuit structure diagram of the high-frequency module 1E related to Modification Example 5 of Embodiment 1. As shown in this figure, the high-frequency module 1E related to this modification example includes a composite filter component 15, low-noise amplifiers 31 and 32, a power amplifier 36, switches 20, 21, 22, and 26, an antenna connection terminal 200, signal output terminals 110 and 120, and a signal input terminal 140. The high-frequency module 1E related to this modification example is different from the high-frequency module 1C related to Modification Example 3 in the following aspect: the number of input bumps connected to the transmission filter included in the composite filter component 15 is larger. Hereinafter, regarding the high-frequency module 1E related to this modification example, the description of the same structure as that of the high-frequency module 1C related to Modification Example 3 is omitted, and the description will be centered on the different structure.

[0265] The composite filter component 15 includes filters 100a, 100b, 100c, 100d, 100j, 100k, 100l, 100m, 100n, and 100p (not shown), input bumps 101, 102, 161, 162, 163, 164, 167, and 168, and output bumps 111, 112, 113, and 114.

[0266] Filter 100d (ALR) is connected to input bump 102 and output bump 114. Filter 100c (BLR) is connected to input bump 101 and output bump 113. Filter 100b (AMR) is connected to input bump 102 and output bump 112. Filter 100a (BMR) is connected to input bump 101 and output bump 111.

[0267] Filter 100j (A1T) is connected to input bumps 102 and 168. Filter 100k (A2T) is connected to input bumps 102 and 167. Filter 100l (A3T) is connected to input bumps 102 and 164. Filter 100m (A4T) is connected to input bump 101 and 163. Filter 100n (A5T) is connected to input bump 101 and 162. Filter 100p (A6T) is connected to input bump 101 and 161.

[0268] In addition, in the composite filter component 15A according to this modification example and the following Embodiment 10, for example, ALR is a co - band including reception bands for Band12, 13, and 14 for LTE or a co - band including reception bands for n12, 13, and 14 for 5GNR. AMR is, for example, a reception band for Band5 for LTE or a reception band for n5 for 5GNR. BLR is, for example, a co - band including reception bands for Band20 and 28 for LTE or a co - band including reception bands for n20 and 28 for 5GNR. BMR is, for example, a reception band for Band8 for LTE or a reception band for n8 for 5GNR.

[0269] A1T is, for example, a co - band including transmission bands for Band13 and 14 for LTE or a co - band including transmission bands for n13 and 14 for 5GNR. A2T is, for example, a transmission band for Band12 for LTE or a transmission band for n12 for 5GNR. A3T is, for example, a transmission band for Band5 for LTE or a transmission band for n5 for 5GNR. A4T is, for example, a transmission band for Band28 for LTE or a transmission band for n28 for 5GNR. A5T is, for example, a transmission band for Band20 for LTE or a transmission band for n20 for 5GNR. A6T is, for example, a transmission band for Band8 for LTE or a transmission band for n8 for 5GNR.

[0270] The signals of ALR and AMR can be received simultaneously, and the signals of BLR and BMR can be received simultaneously.

[0271] The input bump 102 is an example of the first input bump and is connected to the input ends of the filters 100d, 100b, the output ends of the filters 100j, 100k, and the output end of the filter 100l. The input bump 101 is an example of the second input bump and is connected to the input ends of the filters 100c, 100a, the output ends of the filters 100m, 100n, and the output end of the filter 100p.

[0272] Among the output bumps 111 to 114, the output bump 111 and the output bump 112 are arranged adjacent to each other, and the output bump 113 and the output bump 114 are arranged adjacent to each other.

[0273] The power amplifier 36 can amplify the signals of A1T to A6T.

[0274] The switch 26 is connected between the power amplifier 36 and the composite filter unit 15. In addition, the high-frequency module 1E of this modification example may not include at least one of the switches 20 to 22 and 26.

[0275] According to the above structure, when connecting the filters 100d (the output bump 114 connected thereto) and 100c (the output bump 113 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 32, and connecting the filters 100b (the output bump 112 connected thereto) and 100a (the output bump 111 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 in such a manner that the wirings connecting the output bumps 111 to 114 to the low-noise amplifiers 31 and 32 do not cross. As a result, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of the wirings is generated near the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figures of the low-noise amplifiers 31 and 32 and suppress the degradation of the amplification characteristics on the output side of the composite filter unit 15.

[0276] Next, as a specific structural example of the composite filter unit 15 included in the high-frequency module 1E according to Modification Example 5, the composite filter unit 15A according to Embodiment 10 is shown. Figure 10B It is a top view of the composite filter unit 15A according to Embodiment 10.

[0277] As shown in this figure, the composite filter unit 15A has a rectangular shape when viewed from above the main surface 181, and has outer sides 351 and 353 facing each other and outer sides 352 and 354 facing each other. In addition, the composite filter unit 15A may be a polygon when viewed from above the main surface 181.

[0278] The output bumps 111 to 114 are arranged on the main surface 181 in the first direction (negative x-axis direction) along the outer edge 351 in the order of the output bumps 111, 112, 113, and 114. On the other hand, the input bumps 101 and 102 are arranged in the first direction (negative x-axis direction) in the order of the input bumps 101 and 102 in the region between the output bumps 111 to 114 and the outer edge 353 on the main surface 181. Further, the input bumps 161 to 164 and 167 to 168 are arranged in the first direction (negative x-axis direction) in the order of the input bumps 161, 162, 163, 164, 167, and 168 in the region between the input bumps 101 to 102 and the outer edge 353 on the main surface 181.

[0279] Accordingly, no wiring crossover occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the complex filter component 15A. Therefore, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the complex filter component 15A can be suppressed.

[0280] In addition, the input bumps 161 to 164 and 167 to 168 through which the transmission signal passes are arranged apart from the output bumps 111 to 114 through which only the reception signal passes. Therefore, the isolation between transmission and reception can be ensured.

[0281] In addition, the output bumps 111 to 114 do not have to be arranged linearly in the first direction as Figure 10B shown. It is sufficient that the output bumps 111 and 112 are arranged adjacent to each other, and the output bumps 113 and 114 are arranged adjacent to each other in the region between the outer edge 341 and the input bumps 101 to 103.

[0282] In addition, the filter 100d (ALR) is a filter having a passband including a co-frequency band of the reception bands for Band 13 and 14 for LTE or a co-frequency band of the reception bands for n13 and 14 for 5G NR. In addition, the filter 100c (BLR) is a filter having a passband including a co-frequency band of the reception bands for Band 20 and 28 for LTE or a co-frequency band of the reception bands for n20 and 28 for 5G NR.

[0283] Accordingly, it is possible to reduce the number of output bumps on the receiving side, and it is possible to miniaturize the complex filter component 15A. In addition, it is possible to reduce the number of wirings connecting the low-noise amplifiers 31 and 32 to the output bumps of the complex filter component 15A, and thus it is possible to suppress the proximity between the wirings. Therefore, it is possible to reduce the parasitic capacitance generated in the above-mentioned wirings, and thus it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and it is possible to suppress the deterioration of the amplification characteristics on the output side of the complex filter component 15A.

[0284] [Structure of the high-frequency module 1F according to Modification Example 6 of 1.15]

[0285] Figure 11A FIG. is a circuit configuration diagram of the high-frequency module 1F according to Modification Example 6 of Embodiment 1. As shown in this figure, the high-frequency module 1F according to this modification includes a complex filter component 16, low-noise amplifiers 31, 32, and 33, switches 20B, 21B, 22B, and 23B, an antenna connection terminal 200, and signal output terminals 110, 120, and 130. The high-frequency module 1F according to this modification is mainly different from the high-frequency module 1B according to Modification Example 2 in the following aspect: the number of input bumps included in the complex filter component 16 is large. Hereinafter, regarding the high-frequency module 1F according to this modification, the description of the same structure as that of the high-frequency module 1B according to Modification Example 2 will be omitted, and the description will be centered on the different structure.

[0286] The complex filter component 16 includes filters 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h (not shown), input bumps 101, 102, 103, and 104, and output bumps 111, 112, 113, 114, 115, 116, 117, and 118.

[0287] The filter 100d (ALR) is connected to the input bump 102 and the output bump 114. The filter 100c (BLR) is connected to the input bump 101 and the output bump 113. The filter 100b (AMR) is connected to the input bump 102 and the output bump 112. The filter 100a (BMR) is connected to the input bump 101 and the output bump 111. The filter 100e (CMR) is connected to the input bump 104 and the output bump 115. The filter 100f (CLR) is connected to the input bump 104 and the output bump 116. The filter 100g (AHR) is connected to the input bump 102 and the output bump 117. The filter 100h (DLR) is connected to the input bump 103 and the output bump 118.

[0288] In addition, in this modified example and the following Example 11, the frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 25 for LTE or n25 for 5G NR. The frequency band BM is, for example, Band 66 for LTE or n66 for 5G NR. The frequency band CL is, for example, Band 39 for LTE or n39 for 5G NR. The frequency band CM is, for example, Band 34 for LTE or n34 for 5G NR. The frequency band AH is, for example, Band 32 for LTE or n32 for 5G NR. The frequency band DL is, for example, the coordinated frequency band of Band 11 and 21 for LTE or the coordinated frequency band of n11 and 21 for 5G NR.

[0289] The signals of the frequency band AL, the signals of the frequency band AM, and the signals of the frequency band AH can be received simultaneously. The signals of the frequency band BL and the signals of the frequency band BM can be received simultaneously. The signals of the frequency band CL and the signals of the frequency band CM can be received simultaneously.

[0290] The input bump 102 is connected to the input ends of the filter 100d (B3), the filter 100b (B1), and the filter 100g (B32). The input bump 101 is connected to the input ends of the filter 100c (B25) and the filter 100a (B66). The input bump 103 is only connected to the input end of the filter 100h (B11 / 21). The input bump 104 is connected to the input ends of the filter 100e (B34) and the filter 100f (B39).

[0291] The output bump 114 is connected to the output end of the filter 100d (B3). The output bump 113 is connected to the output end of the filter 100c (B25). The output bump 112 is connected to the output end of the filter 100b (B1). The output bump 111 is connected to the output end of the filter 100a (B66). The output bump 116 is connected to the output end of the filter 100f (B39). The output bump 115 is connected to the output end of the filter 100e (B34). The output bump 118 is connected to the output end of the filter 100h (B11 / 21). The output bump 117 is connected to the output end of the filter 100g (B32).

[0292] Among the output bumps 111 to 118, the output bump 114, the output bump 113, and the output bump 116 are arranged adjacent to each other. The output bump 112, the output bump 111, and the output bump 115 are arranged adjacent to each other. The output bump 117 and the output bump 118 are arranged adjacent to each other.

[0293] The low-noise amplifier 31 can amplify the signals of AMR (B1), BMR (B66), and CMR (B34). The frequency bands AM, BM, and CM are combinations of frequency bands that are not received simultaneously with each other. Therefore, the low-noise amplifier 31 can be connected to the filter 100b whose passband includes AMR, the filter 100a whose passband includes BMR, and the filter 100e whose passband includes CMR. Thus, the input terminal of the low-noise amplifier 31 is connected to the output bumps 111, 112, and 115 via the switch 21B.

[0294] The low-noise amplifier 32 can amplify the signals of ALR (B3), BLR (B25), and CLR (B39). The frequency bands AL, BL, and CL are combinations of frequency bands that are not received simultaneously with each other. Therefore, the low-noise amplifier 32 can be connected to the filter 100d whose passband includes ALR, the filter 100c whose passband includes BLR, and the filter 100f whose passband includes CLR. Thus, the input terminal of the low-noise amplifier 32 is connected to the output bumps 113, 114, and 116 via the switch 22B.

[0295] The low-noise amplifier 33 can amplify the signals of AHR (B32) and DLR (B11 / 21). The frequency bands AH and DL are combinations of frequency bands that are not received simultaneously with each other. Therefore, the low-noise amplifier 33 can be connected to the filter 100g whose passband includes AHR and the filter 100h whose passband includes DLR. Thus, the input terminal of the low-noise amplifier 33 is connected to the output bumps 117 and 118 via the switch 23B.

[0296] The switch 20B is connected between the antenna connection terminal 200 and the composite filter unit 16. The switch 21B is connected between the low-noise amplifier 31 and the composite filter unit 16. The switch 22B is connected between the low-noise amplifier 32 and the composite filter unit 16. The switch 23B is connected between the low-noise amplifier 33 and the composite filter unit 16. In addition, the high-frequency module 1F of this modification example may not include at least one of the switches 20B to 23B.

[0297] In the above structure of the composite filter component 16 according to this modification example, on the input side of the composite filter component 16, the filters 100a (B66) and 100c (B25) that can receive signals simultaneously are connected to the input bump 101, the filters 100b (B1), 100d (B3), and 100g (B32) that can receive signals simultaneously are connected to the input bump 102, the filter 100h (B11 / 21) is individually connected to the input bump 103, and the filters 100e (B34) and 100f (B39) that can receive signals simultaneously are connected to the input bump 104. On the other hand, on the output side of the composite filter component 16, the output bump 114 connected to the filter 100d (B3), the output bump 113 connected to the filter 100c (B25), and the output bump 116 connected to the filter 100f (B39) are adjacent to each other, the output bump 112 connected to the filter 100b (B1), the output bump 111 connected to the filter 100a (B66), and the output bump 115 connected to the filter 100e (B34) are adjacent to each other, and the output bump 117 connected to the filter 100g (B32) and the output bump 118 connected to the filter 100h (B11 / 21) are adjacent to each other. Accordingly, when connecting the filters 100d, 100c, and 100f that do not receive signals simultaneously to the low-noise amplifier 32, connecting the filters 100b, 100a, and 100e that do not receive signals simultaneously to the low-noise amplifier 31, and connecting the filters 100g and 100h that do not receive signals simultaneously to the low-noise amplifier 33, the filters 100a to 100h can be connected to the low-noise amplifiers 31 to 33 in such a way that the wirings connecting the output bumps 111 to 118 to the low-noise amplifiers 31 to 33 do not cross. As a result, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of wirings is generated near the input ends of the low-noise amplifiers 31 to 33. Accordingly, no crossing of wirings occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33, so that deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 16 can be suppressed.

[0298] Next, as a specific structural example of the composite filter component 16 included in the high-frequency module 1F according to Modification Example 6, the composite filter component 16A according to Embodiment 11 is shown. Figure 11B It is a top view of the composite filter component 16A according to Embodiment 11.

[0299] As shown in the figure, the composite filter component 16A has a rectangular shape when viewed from above the main surface 191, and has outer sides 361 and 363 facing each other and outer sides 362 and 364 facing each other. In addition, the composite filter component 16A can also be a polygon when viewed from above the main surface 191.

[0300] The output bumps 111 to 118 are arranged on the main surface 191 in the first direction (negative x-axis direction) along the outer side 361 in the order of output bumps 111, 112, 115, 117, 118, 113, 114, and 116. On the other hand, the input bumps 101 to 104 are arranged in the first direction (negative x-axis direction) in the order of input bumps 101, 102, 103, and 104 in the region between the output bumps 111 to 118 and the outer side 363 on the main surface 191.

[0301] Accordingly, no wiring crossover occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 16A. Therefore, deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 16A can be suppressed.

[0302] In addition, the output bumps 111 to 118 may not be arranged linearly in the first direction as Figure 11B shown. It is sufficient that the output bumps 111 to 118 are arranged such that in the region between the outer side 361 and the input bumps 101 to 104, the output bumps 111, 112, and 115 are arranged adjacent to each other, the output bumps 113, 114, and 116 are arranged adjacent to each other, and the output bumps 117 and 118 are arranged adjacent to each other.

[0303] [1.16 Effects, etc.]

[0304] As described above, the composite filter component 10 according to the present embodiment includes: a filter 100d having a first passband including a reception band of frequency band AL; a filter 100c having a second passband including a reception band of frequency band BL; a filter 100b having a third passband including a reception band of frequency band AM, where frequency band AM and frequency band AL can be received simultaneously; a filter 100a having a fourth passband including a reception band of frequency band BM, where frequency band BM and frequency band BL can be received simultaneously; an input bump 102 connected to the input ends of the filter 100d and the filter 100b; an input bump 101 connected to the input ends of the filter 100c and the filter 100a; an output bump 114 connected to the output end of the filter 100d; an output bump 113 connected to the output end of the filter 100c; an output bump 112 connected to the output end of the filter 100b; and an output bump 111 connected to the output end of the filter 100a. Among the output bumps 111 to 114, the output bump 114 and the output bump 113 are arranged adjacent to each other, and the output bump 112 and the output bump 111 are arranged adjacent to each other.

[0305] Accordingly, when connecting the filters 100d and 100c that are not received simultaneously to the low-noise amplifier 32 and connecting the filters 100b and 100a that are not received simultaneously to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 in such a way that the wirings connecting the output bumps 111 to 114 to the low-noise amplifiers 31 and 32 do not cross. Thus, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of the wirings is generated near the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to provide a multi-band support composite filter component 10 that can suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32.

[0306] In addition, for example, the composite filter components 10A to 10D have main surfaces 153 and 151 facing each other. When looking down at the main surface 153, the composite filter components 10A to 10D are polygons having outer sides 301 and 303 facing each other. The output bumps 111 to 114 are arranged on the main surface 153 in the first direction along the outer side 301 in the order of the output bumps 111, 112, 113, and 114, and the input bumps 101 and 102 are arranged on the main surface 153 between the output bumps 111 to 114 and the outer side 303.

[0307] Accordingly, no wiring crossover occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 disposed on the output side of the composite filter components 10A to 10D. Therefore, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter components 10A to 10D can be suppressed.

[0308] Further, for example, the composite filter component 10A according to the first embodiment includes filter chips 121 and 122 stacked on each other. The filter chip 121 includes a main surface 153, filters 100a and 100b. The filter chip 122 includes a main surface 151, filters 100c and 100d. The filters 100c and 100d are arranged in the order of the filters 100c and 100d in the first direction. The filters 100a and 100b are arranged in the order of the filters 100a and 100b in the first direction. When the main surfaces 151 and 153 are viewed from above, at least a part of the filter 100d overlaps with the filter 100b, and at least a part of the filter 100c overlaps with the filter 100a.

[0309] Accordingly, by arranging two filters that do not receive signals simultaneously on one filter chip and arranging two filters that receive signals simultaneously on different filter chips, the isolation degree of two received signals received simultaneously can be improved. Further, by arranging two filters that receive signals simultaneously to overlap when viewed from above, the proximity and crossover of the wiring connected to the input bump 101 and the wiring connected to the input bump 102 can be suppressed.

[0310] Further, for example, the composite filter component 10B according to the second embodiment includes filter chips 121 and 122 stacked on each other. The filter chip 121 includes a main surface 153, filters 100a and 100b. The filter chip 122 includes a main surface 151, filters 100c and 100d. The filters 100c and 100d are arranged in the order of the filters 100d and 100c in the first direction. The filters 100a and 100b are arranged in the order of the filters 100a and 100b in the first direction. When the main surfaces 151 and 153 are viewed from above, at least a part of the filter 100d overlaps with the filter 100a, and at least a part of the filter 100c overlaps with the filter 100b.

[0311] Accordingly, by arranging two filters that do not receive signals simultaneously on one filter chip and arranging two filters that receive signals simultaneously on different filter chips and arranging them not to overlap when viewed from above, the isolation degree of two received signals received simultaneously can be improved.

[0312] For another example, in the composite filter components 10A to 10D, the filter chip 121 includes a piezoelectric substrate 326, and the filters 100a and 100b are formed on the piezoelectric substrate 326. The filter chip 122 includes a piezoelectric substrate 327, and the filters 100c and 100d are formed on the piezoelectric substrate 327.

[0313] According to the above structure, the hollow space where the IDT electrodes (functional electrodes) are formed on the piezoelectric substrates 326 and 327 is an air layer with a relative dielectric constant of 1. Therefore, the parasitic capacitance generated when the wirings formed on the piezoelectric substrate 326 cross the wirings formed on the piezoelectric substrate 327 is smaller than the parasitic capacitance generated when the wirings formed on the dielectric substrate cross each other. Therefore, the isolation between the filters 100a and 100b and the filters 100c and 100d can be improved.

[0314] For another example, the composite filter component 10C according to Embodiment 3 includes filter chips 121 and 122 stacked on top of each other. The filter chip 121 includes a main surface 153, filters 100b and 100d, and the filter chip 122 includes a main surface 151, filters 100a and 100c. The filters 100b and 100d are arranged in the order of filters 100b and 100d in the first direction, and the filters 100a and 100c are arranged in the order of filters 100a and 100c in the first direction. When looking down at the main surfaces 151 and 153, at least a part of the filter 100d overlaps with the filter 100c, and at least a part of the filter 100b overlaps with the filter 100a.

[0315] Accordingly, by arranging the two filters that receive signals simultaneously on one filter chip, it is possible to prevent the wirings connecting the two filters that receive signals simultaneously to the output bumps from approaching each other.

[0316] For another example, in the composite filter component 10C, the filter chip 121 includes a piezoelectric substrate 326, and the filters 100b and 100d are formed on the piezoelectric substrate 326. The filter chip 122 includes a piezoelectric substrate 327, and the filters 100a and 100c are formed on the piezoelectric substrate 327.

[0317] According to the above structure, the hollow space where the IDT electrodes (functional electrodes) are formed on the piezoelectric substrates 326 and 327 is an air layer with a relative dielectric constant of 1. Therefore, the parasitic capacitance generated when the wirings formed on the piezoelectric substrate 326 cross the wirings formed on the piezoelectric substrate 327 is smaller than the parasitic capacitance generated when the wirings formed on the dielectric substrate cross each other. Therefore, the isolation between the filters 100b and 100d and the filters 100a and 100c can be improved.

[0318] Further, for example, the composite filter component 11 according to Modification 1 further includes: a filter 100f having a fifth passband including a reception band in a frequency band CL; a filter 100e having a sixth passband including a reception band in a frequency band CM different from the frequency band CL, the frequency band CM and the frequency band CL being capable of being received simultaneously; an input bump 103 connected to an input end of the filter 100f and an input end of the filter 100e; an output bump 116 connected to an output end of the filter 100f; and an output bump 115 connected to an output end of the filter 100e. Among the output bumps 111 to 116, the output bump 116 is arranged adjacent to the output bumps 113 and 114, and the output bump 115 is arranged adjacent to the output bumps 111 and 112.

[0319] Accordingly, in a case where the filters 100d, 100c, and 100f that do not receive simultaneously are connected to the low-noise amplifier 32, and the filters 100a, 100b, and 100e that do not receive simultaneously are connected to the low-noise amplifier 31, the filters 100a to 100f can be connected to the low-noise amplifiers 31 and 32 in such a manner that the wirings connecting the output bumps 111 to 116 to the low-noise amplifiers 31 and 32 do not cross. Thus, it is possible to suppress the following situation: a parasitic capacitance caused by the crossing of the wirings is generated near the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to provide the composite filter component 11 that supports multiple frequency bands and can suppress the deterioration of the noise figures of the low-noise amplifiers 31 and 32.

[0320] Further, for example, the composite filter component 14A according to Embodiment 9 further includes: a filter 100f having a fifth passband including a transmission band and a reception band in a frequency band CL; a filter 100e having a sixth passband including a transmission band and a reception band in a frequency band CM; an input bump 103 connected to one end of the filter 100f and one end of the filter 100e; an input / output bump 166 connected to the other end of the filter 100f; and an input / output bump 165 connected to the other end of the filter 100e. The filters 100f and 100e are respectively filters for TDD. The composite filter component 14A has a first main surface and a second main surface facing each other. In a case of looking down on the first main surface, the composite filter component 14A is a polygon having outer sides 341 and 343 facing each other. The output bumps 111 to 114 and the input / output bumps 165 to 166 are arranged in this order of the output bumps 111, 112, 113, 114, the input / output bump 165, and the input / output bump 166 in a first direction along the outer side 341 on the first main surface, and the input bumps 101 to 103 are arranged in this order of the input bump 101, the input bump 102, and the input bump 103 in the first direction in a region between the output bumps 111 to 114 and the input / output bumps 165 to 166 and the outer side 343 on the first main surface.

[0321] Accordingly, no crossovers of wirings connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 disposed on the output side of the complex filter component 14A are generated in the region therebetween. Therefore, deterioration of the noise figure of the low-noise amplifiers 31 and 32 in the case of simultaneously receiving the reception signals of the frequency bands AL and AM and in the case of simultaneously receiving the reception signals of the frequency bands BL and BM can be suppressed, and deterioration of the amplification characteristics on the output side of the complex filter component 14A can be suppressed. In addition, the input / output bumps 165 to 166 through which the transmission signal passes are disposed apart from the output bumps 111 to 114 through which only the reception signal passes, so that the isolation between transmission and reception can be ensured.

[0322] Further, for example, the complex filter component 12 according to Modification 2 further includes: a filter 100g having a seventh passband including a reception frequency band of a frequency band AH different from the frequency bands AL and AM, and the frequency band AH can be received simultaneously with the frequency bands AL and AM; a filter 100h having an eighth passband including a reception frequency band of a frequency band BH different from the frequency bands BL and BM, and the frequency band BH can be received simultaneously with the frequency bands BL and BM; an output bump 118 connected to the output end of the filter 100g; and an output bump 117 connected to the output end of the filter 100h. The input bump 102 is connected to the input end of the filter 100d, the input end of the filter 100b, and the input end of the filter 100g. The input bump 101 is connected to the input end of the filter 100c, the input end of the filter 100a, and the input end of the filter 100h. Among the output bumps 111 to 114 and 117 to 118, the output bump 114 is disposed adjacent to the output bump 113, the output bump 112 is disposed adjacent to the output bump 111, and the output bump 118 is disposed adjacent to the output bump 117.

[0323] Accordingly, in the case of connecting the filters 100d and 100c that are not received simultaneously to the low-noise amplifier 32, connecting the filters 100b and 100a that are not received simultaneously to the low-noise amplifier 31, and connecting the filters 100g and 100h that are not received simultaneously to the low-noise amplifier 33, the filters 100a to 100d and 100g to 100h can be connected to the low-noise amplifiers 31 to 33 in such a manner that the wirings connecting the output bumps 111 to 114 and 117 to 118 and the low-noise amplifiers 31 to 33 do not cross. Thereby, the following situation can be suppressed: parasitic capacitance caused by the crossover of the wirings is generated near the input ends of the low-noise amplifiers 31 to 33. Therefore, a complex filter component 12 supporting multiple frequency bands that can suppress deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be provided.

[0324] Further, for example, the high-frequency modules 1, 1A to 1E according to Embodiment 1 include: a mounting substrate 90 having main surfaces 90a and 90b facing each other; any one of the composite filter components 10 to 15 disposed on the mounting substrate 90; and low-noise amplifiers 31 and 32 disposed on the mounting substrate 90, wherein the input end of the low-noise amplifier 32 is connected to output bumps 113 and 114, and the input end of the low-noise amplifier 31 is connected to output bumps 111 and 112.

[0325] Accordingly, it is possible to provide the multi-band high-frequency modules 1, 1A to 1E that can suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32.

[0326] Further, for example, in the high-frequency modules 1, 1A to 1E, the output bumps 113 and 114 are arranged closer to the low-noise amplifier 32 than to the low-noise amplifier 31, and the output bumps 111 and 112 are arranged closer to the low-noise amplifier 31 than to the low-noise amplifier 32.

[0327] Accordingly, it is possible to shorten the wirings connecting the output bumps 113 and 114 to the low-noise amplifier 32 and the wirings connecting the output bumps 111 and 112 to the low-noise amplifier 31. Therefore, it is possible to reduce the loss and miniaturize the high-frequency modules 1, 1A to 1E.

[0328] (Embodiment 2)

[0329] In Embodiment 1, a structure for suppressing the deterioration of the amplification characteristics by suppressing the wiring crossover of the receiving circuit is illustrated. However, in the present embodiment, a structure for suppressing the deterioration of the amplification characteristics by suppressing the wiring crossover of the transmitting circuit is illustrated.

[0330] [2.1 Structure of High-Frequency Module 5 and Communication Device 6]

[0331] First, with reference to Figure 12 the circuit structure and component arrangement structure of the high-frequency module 5 and the communication device 6 according to the present embodiment will be described. Figure 12 is a circuit structure diagram of the high-frequency module 5 and the communication device 6 according to Embodiment 2. In addition, Figure 12 illustrates an exemplary circuit structure of the high-frequency module 5 and the communication device 6, and the high-frequency module 5 and the communication device 6 can be mounted using any one of a variety of circuit mounting and circuit technologies. Therefore, the description of the high-frequency module 5 and the communication device 6 provided below should not be construed in a limiting manner.

[0332] The communication device 6 is installed in a UE of a cellular network, typically a mobile phone, a smart phone, a tablet computer, a wearable device, etc. In addition, the communication device 6 can also be an IoT sensor device, a medical / healthcare device, a vehicle, a UAV, an AGV. Additionally, the communication device 6 can also be installed in a BS of a cellular communication system.

[0333] As Figure 12 shown, the communication device 6 includes a high-frequency module 5, an antenna 2, and an RFIC 3. The high-frequency module 5 is capable of transmitting high-frequency signals between the antenna 2 and the RFIC 3. The internal structure of the high-frequency module 5 will be described later.

[0334] The antenna 2 is connected to the antenna connection terminal 200 of the high-frequency module 5. The antenna 2 transmits the high-frequency signal provided from the high-frequency module 5 to the outside of the communication device 6. Also, the antenna 2 can receive a high-frequency signal from the outside of the communication device 6 and provide it to the high-frequency module 5. In addition, the antenna 2 may not be included in the communication device 6. Additionally, the communication device 6 can include multiple antennas.

[0335] The RFIC 3 is an example of a signal processing circuit that processes high-frequency signals. Specifically, the RFIC 3 processes the transmission signal input from the BBIC through upconversion or the like, and outputs the high-frequency transmission signal generated after the signal processing to the high-frequency module 5. Also, the RFIC 3 can process the high-frequency reception signal input via the reception path of the high-frequency module 5 through downconversion or the like, and output the reception signal generated after the signal processing to the BBIC.

[0336] Next, the circuit structure of the high-frequency module 5 according to the present embodiment will be described. The high-frequency module 5 includes a composite filter component 50, power amplifiers 37 and 38, switches 20, 27, and 28, inductors 61, 62, 63, and 64, an antenna connection terminal 200, and signal input terminals 310 and 320.

[0337] The composite filter component 50 includes filters 500a, 500b, 500c, and 500d, output bumps 501 and 502, and input bumps 511, 512, 513, and 514.

[0338] The filter 500d has a first passband including a transmission band (BLT) with a frequency band BL (first frequency band). The filter 500c has a second passband including a transmission band (ALT) with a frequency band AL (second frequency band). The filter 500b has a third passband including a transmission band (BMT) with a frequency band BM (third frequency band). The filter 500a has a fourth passband including a transmission band (AMT) with a frequency band AM (fourth frequency band). The filters 500d and 500c are respectively an example of one of the first filter and the second filter and the other of the first filter and the second filter, and the filters 500b and 500a are respectively an example of one of the third filter and the fourth filter and the other of the third filter and the fourth filter.

[0339] In addition, the filters 500d and 500c may respectively be an example of one of the third filter and the fourth filter and the other of the third filter and the fourth filter. In this case, the filters 500b and 500a are respectively an example of one of the first filter and the second filter and the other of the first filter and the second filter.

[0340] The frequency band BL (first frequency band) and the frequency band BM (third frequency band) are a combination of frequency bands that can be transmitted simultaneously, and the frequency band AL (second frequency band) and the frequency band AM (fourth frequency band) are a combination of frequency bands that can be transmitted simultaneously. That is, the signal of the frequency band BL (first frequency band) and the signal of the frequency band BM (third frequency band) can be transmitted simultaneously, and the signal of the frequency band AL (second frequency band) and the signal of the frequency band AM (fourth frequency band) can be transmitted simultaneously.

[0341] The output bump 502 is an example of a first output bump and is connected to the output terminals of the filter 500d and the filter 500b. The output bump 501 is an example of a second output bump and is connected to the output terminals of the filter 500c and the filter 500a.

[0342] Accordingly, the output terminals of the two filters 500a and 500c that can be transmitted simultaneously are commonly connected to the output bump 501, and the output terminals of the two filters 500b and 500d that can be transmitted simultaneously are commonly connected to the output bump 502. Therefore, the number of output bumps of the composite filter component 50 can be reduced, and miniaturization can be achieved. And by reducing the number of output bumps of the composite filter component 50, the number of terminals of the switch 20 can be reduced, so that the disconnection capacitance generated at the terminals of the switch 20 can be reduced.

[0343] The input bump 514 is an example of the first input bump and is connected to the input terminal of the filter 500d. The input bump 513 is an example of the second input bump and is connected to the input terminal of the filter 500c. The input bump 512 is an example of the third input bump and is connected to the input terminal of the filter 500b. The input bump 511 is an example of the fourth input bump and is connected to the input terminal of the filter 500a.

[0344] Among the input bumps 511 to 514, the input bump 511 and the input bump 512 are arranged adjacent to each other, and the input bump 513 and the input bump 514 are arranged adjacent to each other.

[0345] The power amplifier 38 is an example of the first power amplifier and can amplify the signals of ALT and BLT. Since the frequency bands AL and BL are combinations of frequency bands that are transmitted at different times from each other, the power amplifier 38 can be connected to both the filter 500d whose passband includes BLT and the filter 500c whose passband includes ALT. Thus, the output terminal of the power amplifier 38 is connected to the input bumps 513 and 514 via the switch 28.

[0346] The power amplifier 37 is an example of the second power amplifier and can amplify the signals of AMT and BMT. Since the frequency bands AM and BM are combinations of frequency bands that are transmitted at different times from each other, the power amplifier 37 can be connected to both the filter 500b whose passband includes BMT and the filter 500a whose passband includes AMT. Thus, the output terminal of the power amplifier 37 is connected to the input bumps 511 and 512 via the switch 27.

[0347] The switch 20 is connected between the antenna connection terminal 200 and the composite filter unit 50 and switches the connection between the antenna 2 and the output terminal 501 and the connection between the antenna 2 and the output terminal 502. The switch 27 is connected between the power amplifier 37 and the composite filter unit 50 and switches the connection between the power amplifier 37 and the input bump 511 and the connection between the power amplifier 37 and the input bump 512. The switch 28 is connected between the power amplifier 38 and the composite filter unit 50 and switches the connection between the power amplifier 38 and the input bump 513 and the connection between the power amplifier 38 and the input bump 514.

[0348] The inductor 61 is connected between the input bump 511 and the switch 27 for achieving impedance matching between the composite filter component 50 and the power amplifier 37. The inductor 62 is connected between the input bump 512 and the switch 27 for achieving impedance matching between the composite filter component 50 and the power amplifier 37. The inductor 63 is connected between the input bump 513 and the switch 28 for achieving impedance matching between the composite filter component 50 and the power amplifier 38. The inductor 64 is connected between the input bump 514 and the switch 28 for achieving impedance matching between the composite filter component 50 and the power amplifier 38. In addition, each of the inductors 61 to 64 may also be a circuit composed of at least one of an inductor and a capacitor.

[0349] In addition, the high-frequency module 5 of the present embodiment may not include at least one of the switches 20, 27, and 28 and the inductors 61 to 64.

[0350] In a conventional composite filter component including a plurality of filters 500a to 500d, the filters 500b (BMT) and 500d (BLT) capable of simultaneous transmission are connected to the output bump 502, and the filters 500a (AMT) and 500c (ALT) capable of simultaneous transmission are connected to the output bump 501. In order to make the wirings connecting the output bumps to the respective filters short and non-crossing, the filters 500b and 500d are arranged adjacent to each other within the composite filter component, and the filters 500a and 500c are arranged adjacent to each other. On the other hand, in order to make the wirings connecting the input bumps to the respective filters short and non-crossing, on the input side of the composite filter component, since the filters 500b and 500d are arranged adjacent to each other, the input bump 514 connected to the filter 500d is made adjacent to the output bump 512 connected to the filter 500b, and since the filters 500a and 500c are arranged adjacent to each other, the input bump 511 connected to the filter 500a is made adjacent to the input bump 513 connected to the filter 500c. In the power amplifiers 37 and 38 that output transmission signals to the composite filter component, it is difficult to output two signals capable of simultaneous transmission from one power amplifier, and it is desired to distribute and output the two signals to the power amplifiers 37 and 38, respectively. Therefore, the adjacent input bumps 512 and 514 are distributively connected to the power amplifiers 37 and 38, and the adjacent input bumps 511 and 513 are distributively connected to the power amplifiers 37 and 38. In this way, in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38, crossovers of connection wirings occur, and parasitic capacitances caused by the above crossovers are generated near the output ends of the power amplifiers 37 and 38. The power amplifiers 37 and 38 have a low impedance at the output ends, and the closer the generated parasitic capacitances are to the output ends of the power amplifiers, the greater the matching loss at the output ends of the power amplifiers and the more deteriorated the amplification characteristics.

[0351] In contrast, in the above-described structure of the composite filter component 50 according to the present embodiment, on the output side of the composite filter component 50, the filters 500b (BMT) and 500d (BLT) capable of simultaneous transmission are connected to the output bump 502, and the filters 500a (AMT) and 500c (ALT) capable of simultaneous transmission are connected to the output bump 501. On the other hand, on the input side of the composite filter component 50, the input bump 514 connected to the filter 500d is adjacent to the input bump 513 connected to the filter 500c, and the input bump 512 connected to the filter 500b is adjacent to the input bump 511 connected to the filter 500a. Accordingly, when connecting the filters 500d (the input bump 514 connected thereto) and 500c (the input bump 513 connected thereto) that do not transmit simultaneously to the power amplifier 38, and connecting the filters 500b (the input bump 512 connected thereto) and 500a (the input bump 511 connected thereto) that do not transmit simultaneously to the power amplifier 37, the filters 500a to 500d can be connected to the power amplifiers 37 and 38 in such a way that the wirings connecting the input bumps 511 to 514 to the power amplifiers 37 and 38 do not cross. Thereby, it is possible to suppress the following situation: parasitic capacitance caused by the crossing of the wirings is generated near the output ends of the power amplifiers 37 and 38.

[0352] Therefore, no crossing of the wirings occurs in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38. Therefore, it is possible to reduce the matching loss of the transmission signals output from the power amplifiers 37 and 38, and it is possible to suppress the deterioration of the amplification characteristics on the input side of the composite filter component 50.

[0353] In addition, since there is no crossing of the wirings between the input bumps 511 to 514 and the power amplifiers 37 and 38, it is possible to make the high-frequency module 5 low-profile.

[0354] The frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 66 for LTE or n66 for 5G NR. The frequency band BM is, for example, Band 25 for LTE or n25 for 5G NR.

[0355] In addition, the high-frequency module 5 may further include a mounting substrate. The composite filter component 50, the switches 20, 27, and 28, the inductors 61 to 64, the power amplifiers 37 and 38 are arranged on the main surface of the mounting substrate.

[0356] The composite filter component 50, for example, is configured in such a way that (1) it is IC chipized using a silicon substrate, (2) filters 500a to 500d are housed in one package, (3) a plurality of piezoelectric substrates are joined via a support layer, or (4) filters 500a to 500d are arranged on one substrate.

[0357] Each of the inductors 61 to 64 is, for example, a surface-mount type chip inductor. In addition, each of the inductors 61 to 64 can also be constituted by a coil conductor formed on the mounting substrate.

[0358] The power amplifiers 37 and 38 can also be formed in one IC. Additionally, the switches 20, 27, and 28 can also be formed in one IC.

[0359] Here, it can also be that the input bumps 513 and 514 are arranged closer to the power amplifier 38 than to the power amplifier 37, and the input bumps 511 and 512 are arranged closer to the power amplifier 37 than to the power amplifier 38.

[0360] Accordingly, the wirings connecting the input bumps 513 and 514 to the power amplifier 38 and the wirings connecting the input bumps 511 and 512 to the power amplifier 37 can be made short. Therefore, the high-frequency module 5 can be made low-loss and miniaturized.

[0361] [Structure of the composite filter component 50A according to Embodiment 12]

[0362] Figure 13A They are a top view and a cross-sectional view of the composite filter component 50A according to Embodiment 12. In this figure, a configuration example of each filter and each bump constituting the composite filter component 50A is shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 551 and located between the opposing main surfaces of the filter chip 522. Additionally, the b-b plane is a plane parallel to the main surface 553 and located between the opposing main surfaces of the filter chip 521. Additionally, the c-c plane is the main surface 553. Additionally, the d-d cross-section is a plane perpendicular to the main surface 553 and passing through the output bumps 501 and 502. Additionally, the e-e cross-section is a plane perpendicular to the main surface 553 and passing through the input bumps 511 to 514.

[0363] The composite filter component 50A includes filter chips 521 and 522 stacked on top of each other, and includes a main surface 553 (first main surface) and a main surface 551 (second main surface) facing each other. The filter chip 521 is an example of a first layered portion, and includes a main surface 553 (first main surface), filters 500d (BLT) and 500a (AMT). The filter chip 522 is an example of a second layered portion, and includes a main surface 551 (second main surface), filters 500b (BMT) and 500c (ALT).

[0364] In the present embodiment, the filter 500d is an example of a first filter and is connected to an output bump 502 (first output bump) and an input bump 514 (first input bump). The filter 500c is an example of a second filter and is connected to an output bump 501 (second output bump) and an input bump 513 (second input bump). The filter 500b is an example of a third filter and is connected to an output bump 502 (first output bump) and an input bump 512 (third input bump). The filter 500a is an example of a fourth filter and is connected to an output bump 501 (second output bump) and an input bump 511 (fourth input bump).

[0365] Each of the filter chips 521 and 522 in the filter chip, for example, has a function electrode formed in such a manner that (1) it is IC chipified using a silicon substrate, (2) two filters are housed in one package, or (3) two filters are formed on one piezoelectric substrate. In addition, the composite filter component 50A, for example, has a mode in which the filter chips 521 and 522 are (1) electrode-indirectly joined, (2) joined with an adhesive, and (3) resin-molded at least one of them. In the present embodiment, the filter chips 521 and 522 are joined at the interface 552.

[0366] As Figure 13A As shown in (c) of, the composite filter component 50A has a rectangular shape when viewed from above the main surface 553, and has outer sides 401 (second outer side) and 403 (first outer side) facing each other and outer sides 402 and 404 facing each other. In addition, the composite filter component 50A may be a polygon when viewed from above the main surface 553.

[0367] The input bumps 511 to 514 are arranged on the main surface 553 in the first direction (negative x-axis direction) along the outer side 403 in the order of the input bumps 514, 513, 512, and 511. On the other hand, the output bumps 501 and 502 are arranged in the first direction (negative x-axis direction) in the order of the output bumps 502 and 501 in the region between the input bumps 511 to 514 and the outer side 401 on the main surface 553.

[0368] Accordingly, no wiring crossover occurs in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38 disposed on the input side of the composite filter component 50A. Therefore, the matching loss of the transmission signals output from the power amplifiers 37 and 38 can be suppressed, and the degradation of the amplification characteristics on the input side of the composite filter component 50A can be suppressed.

[0369] In addition, the input bumps 511 to 514 may not be arranged linearly in the first direction as Figure 13A shown. The input bumps 511 to 514 only need to satisfy the following: in the region between the outer edge 403 and the output bumps 501 and 502, the input bumps 511 and 512 are arranged adjacent to each other, and the input bumps 513 and 514 are arranged adjacent to each other.

[0370] The filters 500d and 500a are arranged in the order of the filters 500d and 500a in the first direction (negative x-axis direction). The filters 500c and 500b are arranged in the order of the filters 500c and 500b in the first direction (negative x-axis direction). When looking down at the main surfaces 551 and 553, at least a part of the filter 500c overlaps with at least a part of the filter 500d, and at least a part of the filter 500a overlaps with at least a part of the filter 500b.

[0371] That is to say, in the composite filter component 50A according to the present embodiment, by arranging two filters that do not transmit simultaneously on one filter chip, the isolation degree of two transmission signals transmitted simultaneously is improved, and the heat dissipation from the filter chip is dispersed. In addition, by arranging two filters that transmit simultaneously on different filter chips and arranging them so as not to overlap when looking down, the distance between the two filters that transmit simultaneously is ensured, and the isolation degree of the two transmission signals transmitted simultaneously is further improved.

[0372] According to the above configuration structure, the wiring connecting the output bump 501 to the filters 500a and 500c and the wiring connecting the output bump 502 to the filters 500b and 500d do not cross inside the filter chip 521, and do not cross inside the filter chip 522 (refer to Figure 13A (a), (b) and (d) of Figure 13A ). In addition, the wiring connecting the input bump 511 to the filter 500a, the wiring connecting the input bump 512 to the filter 500b, the wiring connecting the input bump 513 to the filter 500c, and the wiring connecting the input bump 514 to the filter 500d do not cross inside the filter chip 521, and do not cross inside the filter chip 522 (refer to

[0373] That is to say, inside the composite filter component 50A, no crossing of the wirings connecting the input bumps to the filter occurs within the filter chip, and no crossing of the wirings connecting the output bumps to the filter occurs within the filter chip. Thereby, the matching loss of the transmission signals output from the power amplifiers 37 and 38 disposed on the input side of the composite filter component 50A can be reduced, and the isolation degree of the filters 500a to 500d within the composite filter component 50A can be improved. Therefore, the composite filter component 50A can transmit the simultaneously passing transmission signals of ALT and AMT with low loss, and can transmit the simultaneously passing transmission signals of BLT and BMT with low loss.

[0374] In addition, as Figure 13A (c) shown, when looking down at the main surface 553, the area of the input bump 514 is larger than the area of the input bump 512, and the area of the input bump 511 is larger than the area of the input bump 513.

[0375] The filters 500b and 500c disposed in the filter chip 522 have high heat dissipation property toward the main surface 551 as the top surface. On the other hand, the filters 500a and 500d disposed in the filter chip 521 sandwiched between the filter chip 522 and the mounting substrate have low heat dissipation property to the outside. In this regard, the area of the input bump 514 connected to the filter 500d is made larger than the area of the input bump 512 connected to the filter 500b, and the area of the input bump 511 connected to the filter 500a is made larger than the area of the input bump 513 connected to the filter 500c. Therefore, the heat dissipation property of the filter chip 521 can be improved. Thus, the heat dissipation property of the composite filter component 50A can be improved.

[0376] In addition, a shielding electrode layer 590 can be formed on the main surface 551 of the composite filter component 50A. Thereby, the heat dissipation property from the filter chip 522 toward the main surface 551 side can be further improved.

[0377] In addition, the input bumps 511 to 514 may be arranged in the order of the input bumps 513, 514, 511, and 512 in the first direction. In this case, the input bumps 511 and 514 connected from the filter chip 521 are adjacent, and the dispersion of heat dissipation from the filter chip 521 decreases. In this regard, a shielding plate may be arranged between the filter 500a and the filter 500d, crossing the main surface 553 to the main surface 551 perpendicular to the main surface 553.

[0378] Thereby, the heat conduction between the filter 500a and the filter 500d is suppressed, and thus the heat dissipation property of the composite filter component 50A is improved.

[0379] [Configuration of the composite filter component 50B related to Embodiment 13]

[0380] Figure 13B These are a top view and a cross-sectional view of the composite filter component 50B related to Embodiment 13. In this figure, an example of the configuration structure of each filter and each bump constituting the composite filter component 50B is shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 551 and located between the opposing main surfaces of the filter chip 522. Further, the b-b plane is a plane parallel to the main surface 553 and located between the opposing main surfaces of the filter chip 521. Further, the c-c plane is the main surface 553. Further, the d-d cross-section is a plane perpendicular to the main surface 553 and passing through the output bumps 501 and 502. Further, the e-e cross-section is a plane perpendicular to the main surface 553 and passing through the input bumps 511 to 514.

[0381] Compared with the composite filter component 50A related to Embodiment 12, the configuration structure of the filters in the filter chips 521 and 522 of the composite filter component 50B related to this embodiment is different. Therefore, hereinafter, regarding the composite filter component 50B related to this embodiment, the description of the same structure as that of the composite filter component 50A related to Embodiment 12 is omitted, and the description will be centered on the structure different from that of the composite filter component 50A.

[0382] The composite filter component 50B includes filter chips 521 and 522 stacked on each other, and includes a main surface 553 (first main surface) and a main surface 551 (second main surface) facing each other. The filter chip 521 is an example of a first layered portion and includes a main surface 553 (first main surface), filters 500a (AMT) and 500b (BMT). The filter chip 522 is an example of a second layered portion and includes a main surface 551 (second main surface), filters 500c (ALT) and 500d (BLT).

[0383] In this embodiment, the filter 500d is an example of the first filter and is connected to the output bump 502 (first output bump) and the input bump 513 (first input bump). The filter 500c is an example of the second filter and is connected to the output bump 501 (second output bump) and the input bump 514 (second input bump). The filter 500b is an example of the third filter and is connected to the output bump 502 (first output bump) and the input bump 512 (third input bump). The filter 500a is an example of the fourth filter and is connected to the output bump 501 (second output bump) and the input bump 511 (fourth input bump).

[0384] As Figure 13B shown in (c) of, the composite filter component 50B has a rectangular shape when viewed from above the main surface 553, and has outer sides 411 (second outer side) and 413 (first outer side) facing each other and outer sides 412 and 414 facing each other. In addition, the composite filter component 50B may be a polygon when viewed from above the main surface 553.

[0385] The input bumps 511 to 514 are arranged on the main surface 553 in the first direction (negative x-axis direction) along the outer side 413 in the order of the input bumps 514, 513, 512, and 511. On the other hand, the output bumps 501 and 502 are arranged in the first direction (negative x-axis direction) in the order of the output bumps 502 and 501 in the region between the input bumps 511 to 514 and the outer side 411 on the main surface 553.

[0386] Accordingly, no wiring crossover occurs in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38 arranged on the input side of the composite filter component 50B. Therefore, the matching loss of the transmission signals output from the power amplifiers 37 and 38 can be suppressed, and the deterioration of the amplification characteristics on the input side of the composite filter component 50B can be suppressed.

[0387] In addition, the input bumps 511 to 514 may not be arranged linearly in the first direction as Figure 13B shown. The input bumps 511 to 514 only need to be as follows: in the region between the outer side 413 and the output bumps 501 and 502, the input bumps 511 and 512 are arranged adjacent to each other, and the input bumps 513 and 514 are arranged adjacent to each other.

[0388] Filters 500a and 500b are arranged in the order of filters 500b and 500a in the first direction (negative direction of the x-axis). Filters 500c and 500d are arranged in the order of filters 500c and 500d in the first direction (negative direction of the x-axis). When the main surfaces 551 and 553 are viewed from above, filters 500b and 500c at least partially overlap, and filters 500a and 500d at least partially overlap.

[0389] That is to say, in the composite filter component 50B involved in the present embodiment, by configuring two filters that are not transmitted at the same time to one filter chip, the isolation of two transmission signals that are transmitted at the same time is improved, and the heat dissipation from the filter chip is dispersed. In addition, by configuring two filters that are transmitted at the same time to different filter chips and configured to not overlap when viewed from above, the distance between the two filters that are transmitted at the same time is ensured, and the isolation of the two transmission signals that are transmitted at the same time is further improved.

[0390] In addition, the frequency of BLT (B66T) and the frequency of ALT (B3T) partially overlap, so when the filter 500c and the filter 500d overlap in a plan view of the main surface 551, the isolation deteriorates. Therefore, the filter 500c and the filter 500d are arranged in a planar manner on the same filter chip 522.

[0391] According to the above arrangement, the wiring connecting the output bump 501 to the filters 500a and 500c and the wiring connecting the output bump 502 to the filters 500b and 500d do not cross each other in the filter chip 521, and do not cross each other in the filter chip 522 (see Figure 13B In addition, the wiring connecting the input bump 511 to the filter 500a, the wiring connecting the input bump 512 to the filter 500b, the wiring connecting the input bump 513 to the filter 500d, and the wiring connecting the input bump 514 to the filter 500c do not cross each other in the filter chip 521, and do not cross each other in the filter chip 522 (refer to Figure 13B (a), (b) and (e)).

[0392] That is to say, inside the composite filter component 50B, no crossing occurs for the wirings connecting the input bumps to the filter within the filter chip, and no crossing occurs for the wirings connecting the output bumps to the filter within the filter chip. Thereby, the matching loss of the transmission signals output from the power amplifiers 37 and 38 disposed on the input side of the composite filter component 50B can be reduced, and the isolation degree of the filters 500a to 500d within the composite filter component 50B can be improved. Therefore, the composite filter component 50B can transmit the transmission signals of ALT and AMT passing through simultaneously with low loss, and can transmit the transmission signals of BLT and BMT passing through simultaneously with low loss.

[0393] In addition, as Figure 13B shown in (c), when looking down at the main surface 553, the area of the input bump 512 is larger than the area of the input bump 513, and the area of the input bump 511 is larger than the area of the input bump 514.

[0394] The filters 500c and 500d disposed on the filter chip 522 have high heat dissipation property toward the main surface 551 as the top surface. On the other hand, the filters 500a and 500b disposed on the filter chip 521 sandwiched between the filter chip 522 and the mounting substrate have low heat dissipation property to the outside. In response to this, the area of the input bump 511 connected to the filter 500a is made larger than the area of the input bump 514 connected to the filter 500c, and the area of the input bump 512 connected to the filter 500b is made larger than the area of the input bump 513 connected to the filter 500d. Therefore, the heat dissipation property of the filter chip 521 can be improved. Thus, the heat dissipation property of the composite filter component 50B can be improved.

[0395] In addition, a shielding electrode layer 590 can be formed on the main surface 551 of the composite filter component 50B. Accordingly, the heat dissipation property from the filter chip 522 to the main surface 551 side can be further improved.

[0396] [Structure of the high-frequency module 5A according to the 2.4 modification example]

[0397] Figure 14It is a circuit structure diagram of the high-frequency module 5A according to a modified example of Embodiment 2. As shown in this figure, the high-frequency module 5A according to this modified example includes a composite filter component 51, power amplifiers 37 and 38, switches 20A, 27A, and 28A, inductors 61, 62, 63, 64, 65, and 66, an antenna connection terminal 200, and signal input terminals 310 and 320. The high-frequency module 5A according to this modified example is different from the high-frequency module 5 according to Embodiment 2 in the following aspect: there are 3 groups of frequency bands for simultaneous transmission. Hereinafter, regarding the high-frequency module 5A according to this modified example, the description of the same structure as that of the high-frequency module 5 according to Embodiment 2 is omitted, and the description will be centered on the different structure.

[0398] The composite filter component 51 includes filters 500a, 500b, 500c, 500d, 500e, and 500f, output bumps 501, 502, and 503, and input bumps 511, 512, 513, 514, 515, and 516.

[0399] The filter 500d has a first passband including a transmission frequency band (BLT) of a frequency band BL (first frequency band). The filter 500c has a second passband including a transmission frequency band (ALT) of a frequency band AL (second frequency band). The filter 500b has a third passband including a transmission frequency band (BMT) of a frequency band BM (third frequency band). The filter 500a has a fourth passband including a transmission frequency band (AMT) of a frequency band AM (fourth frequency band). The filter 500f has a passband including a transmission frequency band (CLT) of a frequency band CL. The filter 500e has a passband including a transmission frequency band (CMT) of a frequency band CM.

[0400] Signals of the frequency band BL (first frequency band) and signals of the frequency band BM (third frequency band) can be transmitted simultaneously, and signals of the frequency band AL (second frequency band) and signals of the frequency band AM (fourth frequency band) can be transmitted simultaneously. In addition, signals of the frequency band CL and signals of the frequency band CM are not transmitted simultaneously.

[0401] The output bump 502 is an example of a first output bump and is connected to the output ends of the filter 500d and the filter 500b. The output bump 501 is an example of a second output bump and is connected to the output ends of the filter 500c and the filter 500a. The output bump 503 is connected to the output ends of the filter 500f and the filter 500e.

[0402] The input bump 514 is an example of the first input bump and is connected to the input terminal of the filter 500d. The input bump 513 is an example of the second input bump and is connected to the input terminal of the filter 500c. The input bump 512 is an example of the third input bump and is connected to the input terminal of the filter 500b. The input bump 511 is an example of the fourth input bump and is connected to the input terminal of the filter 500a. The input bump 515 is connected to the input terminal of the filter 500f. The input bump 516 is connected to the input terminal of the filter 500e.

[0403] Among the input bumps 511 to 516, the input bump 511, the input bump 512, and the input bump 516 are arranged adjacent to each other, and the input bump 513, the input bump 514, and the input bump 515 are arranged adjacent to each other.

[0404] The power amplifier 38 is an example of the first power amplifier and is capable of amplifying the signals of ALT, BLT, and CLT. Since the frequency bands AL, BL, and CL are combinations of frequency bands that are transmitted at different times from each other, the power amplifier 38 can be connected to the filter 500d whose passband includes BLT, the filter 500c whose passband includes ALT, and the filter 500f whose passband includes CLT. Thus, the output terminal of the power amplifier 38 is connected to the input bumps 513, 514, and 515 via the switch 28A.

[0405] The power amplifier 37 is an example of the second power amplifier and is capable of amplifying the signals of AMT, BMT, and CMT. Since the frequency bands AM, BM, and CM are combinations of frequency bands that are transmitted at different times from each other, the power amplifier 37 can be connected to the filter 500b whose passband includes BMT, the filter 500a whose passband includes AMT, and the filter 500e whose passband includes CMT. Thus, the output terminal of the power amplifier 37 is connected to the input bumps 511, 512, and 516 via the switch 27A.

[0406] The switch 20A is connected between the antenna connection terminal 200 and the composite filter unit 51. The switch 27A is connected between the power amplifier 37 and the composite filter unit 51. The switch 28A is connected between the power amplifier 38 and the composite filter unit 51.

[0407] The inductor 65 is connected between the input bump 516 and the switch 27A. The inductor 66 is connected between the input bump 515 and the switch 28A.

[0408] In addition, the high-frequency module 5A according to this modification example may not include at least one of the switches 20A, 27A, and 28A and the inductors 61 to 66.

[0409] In the above structure of the composite filter component 51 according to this modification example, on the output side of the composite filter component 51, the filters 500b (BMT) and 500d (BLT) capable of simultaneous transmission are connected to the output bump 502, and the filters 500a (AMT) and 500c (ALT) capable of simultaneous transmission are connected to the output bump 501. On the other hand, on the input side of the composite filter component 51, the input bump 514 connected to the filter 500d, the input bump 513 connected to the filter 500c, and the input bump 515 connected to the filter 500f are adjacent to each other, and the input bump 512 connected to the filter 500b, the input bump 511 connected to the filter 500a, and the input bump 516 connected to the filter 500e are adjacent to each other.

[0410] Accordingly, when connecting the filters 500d (and the input bump 514 connected thereto), 500c (and the input bump 513 connected thereto), and 500f (and the input bump 515 connected thereto) that do not perform simultaneous transmission to the power amplifier 38, and connecting the filters 500b (and the input bump 512 connected thereto), 500a (and the input bump 511 connected thereto), and 500e (and the input bump 516 connected thereto) that do not perform simultaneous transmission to the power amplifier 37, the filters 500a to 500f can be connected to the power amplifiers 37 and 38 in such a way that the wirings connecting the input bumps 511 to 516 to the power amplifiers 37 and 38 do not cross. As a result, the following situation can be suppressed: parasitic capacitance caused by the crossing of wirings is generated near the output ends of the power amplifiers 37 and 38. Accordingly, no crossing of wirings occurs in the region between the input bumps 511 to 516 and the power amplifiers 37 and 38. Therefore, the matching loss of the transmission signals output from the power amplifiers 37 and 38 can be reduced, and the deterioration of the amplification characteristics on the input side of the composite filter component 51 can be suppressed.

[0411] The frequency band AL is, for example, Band 3 for LTE or n3 for 5G NR. The frequency band AM is, for example, Band 1 for LTE or n1 for 5G NR. The frequency band BL is, for example, Band 66 for LTE or n66 for 5G NR. The frequency band BM is, for example, Band 25 for LTE or n25 for 5G NR. The frequency band CL is, for example, Band 39 for LTE or n39 for 5G NR. The frequency band CM is, for example, Band 34 for LTE or n34 for 5G NR.

[0412] [2.5 Structure of the composite filter component 51A according to Embodiment 14]

[0413] As a specific structural example of the composite filter component 51 included in the high-frequency module 5A according to the modification example, the composite filter component 51A according to Embodiment 14 is shown. Figure 15 Figure 15 is a plan view and a cross-sectional view of the composite filter component 51A according to Embodiment 14. In this figure, a configuration structural example of each filter and each bump constituting the composite filter component 51A is shown. (a) of this figure is a view obtained by observing the a-a plane from the positive side of the z-axis, (b) of this figure is a view obtained by observing the b-b plane from the positive side of the z-axis, (c) of this figure is a view obtained by observing the c-c plane from the positive side of the z-axis, (d) of this figure is a view obtained by observing the d-d cross-section from the negative side of the y-axis, and (e) of this figure is a view obtained by observing the e-e cross-section from the negative side of the y-axis. In addition, the a-a plane is a plane parallel to the main surface 554 and located between the opposing main surfaces of the filter chip 524. Further, the b-b plane is a plane parallel to the main surface 556 and located between the opposing main surfaces of the filter chip 523. Further, the c-c plane is the main surface 556. Further, the d-d cross-section is a plane perpendicular to the main surface 556 and passing through the output bumps 501 to 503. Further, the e-e cross-section is a plane perpendicular to the main surface 556 and passing through the input bumps 511 to 516.

[0414] The composite filter component 51A includes filter chips 523 and 524 stacked on each other, and includes main surfaces 556 (first main surface) and main surface 554 (second main surface) facing each other. The filter chip 523 is an example of a first laminated portion, and includes a main surface 556 (first main surface), filters 500a (AMT), 500d (BLT), and 500e (CMT). The filter chip 524 is an example of a second laminated portion, and includes a main surface 554 (second main surface), filters 500b (BMT), 500c (ALT), and 500f (CLT).

[0415] In the present embodiment, the filter 500d is connected to the output bump 502 (first output bump) and the input bump 514 (first input bump). The filter 500c is connected to the output bump 501 (second output bump) and the input bump 513 (second input bump). The filter 500b is connected to the output bump 502 (first output bump) and the input bump 512 (third input bump). The filter 500a is connected to the output bump 501 (second output bump) and the input bump 511 (fourth input bump). The filter 500f is connected to the output bump 503 (third output bump) and the input bump 515 (sixth input bump). The filter 500e is connected to the output bump 503 (third output bump) and the input bump 516 (fifth input bump).

[0416] When the frequency band CL is Band 39 for LTE or n39 for 5G NR, the filter 500f is a filter for TDD. When the frequency band CM is Band 34 for LTE or n34 for 5G NR, the filter 500e is a filter for TDD.

[0417] Each of the filter chips 523 and 524, for example, has a function electrode formed in such a way that (1) it is IC chipified using a silicon substrate, (2) two filters are housed in one package, or (3) two filters are formed on one piezoelectric substrate. In addition, the composite filter component 51A, for example, has a mode in which the filter chips 523 and 524 are (1) joined by indirect electrodes, (2) joined with an adhesive, and (3) resin-molded at least in one of these ways. In this embodiment, the filter chips 523 and 524 are joined at the interface 555.

[0418] As Figure 15 As shown in (c) of [], the composite filter component 51A has a rectangular shape when viewed from above the main surface 556, and has outer sides 421 (second outer side) and 423 (first outer side) facing each other and outer sides 422 and 424 facing each other. In addition, the composite filter component 51A may be a polygon when viewed from above the main surface 556.

[0419] The input bumps 511 to 516 are arranged on the main surface 556 in the first direction (negative x-axis direction) along the outer side 423 in the order of output bumps 513, 514, 516, 515, 511, and 512. On the other hand, the output bumps 501 to 503 are arranged on the main surface 556 in the first direction (negative x-axis direction) in the order of output bumps 502, 503, and 501 in the region between the input bumps 511 to 516 and the outer side 421.

[0420] Accordingly, no wiring crossover occurs in the region between the input bumps 511 to 516 and the power amplifiers 37 and 38 arranged on the input side of the composite filter component 51A. Therefore, the matching loss of the transmission signal output from the power amplifiers 37 and 38 can be suppressed, and the deterioration of the amplification characteristics on the input side of the composite filter component 51A can be suppressed.

[0421] In addition, the input bumps 511 to 516 may not be arranged linearly in the first direction as Figure 15 shown. The input bumps 511 to 516 only need to be arranged such that the input bumps 511, 512, and 515 are adjacent to each other, and the input bumps 513, 514, and 516 are adjacent to each other in the region between the outer side 423 and the output bumps 501 to 503.

[0422] Filters 500a, 500d, and 500e are arranged in the order of filters 500d, 500e, and 500a in the first direction (negative x-axis direction). Filters 500b, 500c, and 500f are arranged in the order of filters 500c, 500f, and 500b in the first direction (negative x-axis direction). When looking down at the main surfaces 554 and 556, at least a part of filter 500d overlaps with filter 500c, at least a part of filter 500e overlaps with filter 500f, and at least a part of filter 500a overlaps with filter 500b.

[0423] That is to say, in the composite filter component 51A according to the present embodiment, three filters that do not transmit simultaneously are arranged on one filter chip. In addition, two filters that transmit simultaneously are assigned to different filter chips and arranged so as not to overlap when looking down. And when looking down, filters 500e and 500f that transmit individually are arranged between the two filters that transmit simultaneously. Thereby, the isolation degree of the two transmission signals that transmit simultaneously is improved.

[0424] According to the above configuration structure, the wirings connecting the output bumps 501 to filters 500a and 500c, the wirings connecting the output bumps 502 to filters 500b and 500d, and the wirings connecting the output bumps 503 to filters 500e and 500f do not cross inside the filter chip 523 and do not cross inside the filter chip 524 (refer to Figure 15 (a), (b), and (d)). In addition, the wirings connecting the input bump 511 to filter 500a, the wirings connecting the input bump 512 to filter 500b, the wirings connecting the input bump 513 to filter 500c, the wirings connecting the input bump 514 to filter 500d, the wirings connecting the input bump 515 to filter 500f, and the wirings connecting the input bump 516 to filter 500e do not cross inside the filter chip 523 and do not cross inside the filter chip 524 (refer to Figure 15 (a), (b), and (e)).

[0425] That is to say, inside the composite filter component 51A, no crossovers of the wirings connecting the input bumps to the filter occur within the filter chip, and no crossovers of the wirings connecting the output bumps to the filter occur within the filter chip. Thereby, it is possible to reduce the matching loss of the transmission signals output from the power amplifiers 37 and 38 disposed on the input side of the composite filter component 51A, and moreover, it is possible to improve the isolation degree of the filters 500a to 500f within the composite filter component 51A. Therefore, the composite filter component 51A can transmit the transmission signals in the frequency band AL and the transmission signals in the frequency band AM that pass through simultaneously with low loss, and can transmit the transmission signals in the frequency band BL and the transmission signals in the frequency band BM that pass through simultaneously with low loss.

[0426] [2.6 Effects, etc.]

[0427] As described above, the composite filter component 50 according to the present embodiment includes: a filter 500d having a first passband including the transmission frequency band of the frequency band BL; a filter 500c having a second passband including the transmission frequency band of the frequency band AL; a filter 500b having a third passband including the transmission frequency band of the frequency band BM, and the frequency band BM and the frequency band BL can be transmitted simultaneously; a filter 500a having a fourth passband including the transmission frequency band of the frequency band AM, and the frequency band AM and the frequency band AL can be transmitted simultaneously; output bumps 502 connected to the output ends of the filter 500d and the filter 500b; output bumps 501 connected to the output ends of the filter 500c and the filter 500a; input bumps 514 connected to the input end of the filter 500d; input bumps 513 connected to the input end of the filter 500c; input bumps 512 connected to the input end of the filter 500b; and input bumps 511 connected to the input end of the filter 500a, wherein among the input bumps 511 to 514, the input bump 514 and the input bump 513 are disposed adjacent to each other, and the input bump 512 and the input bump 511 are disposed adjacent to each other.

[0428] Accordingly, in the case where the filters 500d and 500c that do not transmit simultaneously are connected to the power amplifier 38, and the filters 500b and 500a that do not transmit simultaneously are connected to the power amplifier 37, the filters 500a to 500d can be connected to the power amplifiers 37 and 38 in such a manner that the wirings connecting the input bumps 511 to 514 to the power amplifiers 37 and 38 do not cross. Thereby, it is possible to suppress the following situation: a parasitic capacitance caused by the crossover of the wirings is generated near the output ends of the power amplifiers 37 and 38. Therefore, it is possible to provide a multi-band composite filter component 50 that can reduce the matching loss of the transmission signals output from the power amplifiers 37 and 38.

[0429] For another example, the composite filter components 50A and 50B have main surfaces 553 and 551 facing each other. When looking down at the main surface 553, the composite filter components 50A and 50B are polygons having outer edges 401(411) and 403(413) facing each other. The input bumps 511 to 514 are arranged on the main surface 553 in the first direction along the outer edge 403(413) in the order of input bumps 514, 513, 512, and 511. The output bumps 501 and 502 are arranged on the main surface 553 between the input bumps 511 to 514 and the outer edge 401(411).

[0430] Accordingly, no wiring crossover occurs in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38 arranged on the input side of the composite filter components 50A and 50B. Therefore, the matching loss of the transmission signals output from the power amplifiers 37 and 38 can be suppressed, and the deterioration of the amplification characteristics on the input side of the composite filter components 50A and 50B can be suppressed.

[0431] For another example, the composite filter component 50A according to Embodiment 12 includes filter chips 521 and 522 stacked on each other. The filter chip 521 includes a main surface 553, filters 500a and 500d. The filter chip 522 includes a main surface 551, filters 500b and 500c. The filters 500a and 500d are arranged in the order of filter 500d and 500a in the first direction. The filters 500b and 500c are arranged in the order of filter 500c and 500b in the first direction. When looking down at the main surfaces 551 and 553, at least a part of the filter 500d overlaps with the filter 500c, and at least a part of the filter 500b overlaps with the filter 500a.

[0432] Accordingly, by arranging two filters that do not transmit simultaneously on one filter chip, and arranging two filters that transmit simultaneously on different filter chips and arranging them so as not to overlap when looking down, the isolation degree of two transmission signals that transmit simultaneously can be improved. In addition, the heat dissipation from the filter chips can be dispersed.

[0433] For another example, in the composite filter component 50A, when looking down at the main surface 553, the area of the input bump 514 is larger than the area of the input bump 512, and the area of the input bump 511 is larger than the area of the input bump 513.

[0434] Accordingly, the heat dissipation of the filter chip 521 sandwiched between the filter chip 522 and the mounting substrate can be improved. Therefore, the heat dissipation of the composite filter component 50A can be improved.

[0435] For another example, the composite filter component 50B according to Embodiment 13 includes filter chips 521 and 522 stacked on top of each other. At least a part of the transmission band of frequency band BL overlaps with the transmission band of frequency band AL. The filter chip 521 includes a main surface 553, filters 500a and 500b. The filter chip 522 includes a main surface 551, filters 500c and 500d. The filters 500a and 500b are arranged in the order of filter 500b and 500a in the first direction. The filters 500c and 500d are arranged in the order of filter 500c and 500d in the first direction. When looking down at the main surfaces 551 and 553, at least a part of filter 500b overlaps with filter 500c, and at least a part of filter 500a overlaps with filter 500d.

[0436] Accordingly, by arranging two filters that do not transmit simultaneously on one filter chip, and arranging two filters that transmit simultaneously on different filter chips and arranging them so as not to overlap when looking down, the isolation of two transmission signals transmitted simultaneously can be improved. In addition, the heat dissipation from the filter chip can be dispersed. In addition, by making the filters 500c and 500d whose passband frequencies partially overlap not overlap when looking down, the isolation between the filters 500c and 500d can be improved.

[0437] For another example, in the composite filter component 50B, when looking down at the main surface 553, the area of the input bump 512 is larger than the area of the input bump 513, and the area of the input bump 511 is larger than the area of the input bump 514.

[0438] Accordingly, the heat dissipation of the filter chip 521 sandwiched between the filter chip 522 and the mounting substrate can be improved. Therefore, the heat dissipation of the composite filter component 50B can be improved.

[0439] For another example, the high-frequency modules 5 and 5A according to Embodiment 2 include: a mounting substrate having a third main surface and a fourth main surface facing each other; any one of the composite filter components 50 and 51 disposed on the mounting substrate; and power amplifiers 37 and 38 disposed on the mounting substrate. Among them, the output terminals of the power amplifier 38 are connected to the input bumps 513 and 514, and the output terminals of the power amplifier 37 are connected to the input bumps 511 and 512.

[0440] Accordingly, it is possible to provide the multi-band high-frequency modules 5 and 5A that can reduce the matching loss of the transmission signals output from the power amplifiers 37 and 38.

[0441] Further, for example, in the high-frequency modules 5 and 5A, the input bumps 513 and 514 are configured to be closer to the power amplifier 38 than to the power amplifier 37, and the input bumps 511 and 512 are configured to be closer to the power amplifier 37 than to the power amplifier 38.

[0442] Accordingly, the wirings connecting the input bumps 513 and 514 to the power amplifier 38 and the wirings connecting the input bumps 511 and 512 to the power amplifier 37 can be made short. Therefore, the high-frequency modules 5 and 5A can be made low-loss and miniaturized.

[0443] (Other Embodiments)

[0444] As described above, the composite filter component and the high-frequency module according to the present invention have been described based on the embodiments. However, the composite filter component and the high-frequency module according to the present invention are not limited to the above embodiments. Other embodiments achieved by combining any structural elements in the above embodiments, modification examples obtained by making various modifications that those skilled in the art can think of to the above embodiments without departing from the gist of the present invention, and various devices incorporating the above composite filter component and high-frequency module are also included in the present invention.

[0445] For example, in the circuit structures of the composite filter component and the high-frequency module according to each embodiment, other circuit elements and wirings etc. may be inserted between the paths connecting the respective circuit elements and signal paths disclosed in the drawings.

[0446] In addition, the frequency bands applied in the above embodiments may also be the frequency bands shown below. Hereinafter, the Band X for LTE and the nX for 5G NR are collectively referred to as BX. Combinations of frequency bands (not simultaneously receiving) connected to the same low-noise amplifier are, for example, (1) at least two of B5, B8, and B26, (2) at least two of B12, B13, B14, B20, B28, B29, and n85, (3) B11 + B21 and B32, (4) B71 and n105, (5) at least two of B1, B66, and B34, (6) at least two of B3, B25, B39, and n70, (7) B7 and B41, or (8) B30 and B40.

[0447] Hereinafter, the features of the composite filter component and the high-frequency module described based on the above embodiments, modification examples, and examples are shown.

[0448] <1>A composite filter component, comprising:

[0449] A first filter having a first passband including a reception band of a first frequency band;

[0450] A second filter having a second passband including a reception band of a second frequency band;

[0451] A third filter having a third passband including a reception band of a third frequency band, the third frequency band being capable of being received simultaneously with the first frequency band;

[0452] A fourth filter having a fourth passband including a reception band of a fourth frequency band, the fourth frequency band being capable of being received simultaneously with the second frequency band;

[0453] A first input bump connected to an input end of the first filter and an input end of the third filter;

[0454] A second input bump connected to an input end of the second filter and an input end of the fourth filter;

[0455] A first output bump connected to an output end of the first filter;

[0456] A second output bump connected to an output end of the second filter;

[0457] A third output bump connected to an output end of the third filter; and

[0458] A fourth output bump connected to an output end of the fourth filter,

[0459] wherein, among the first output bump, the second output bump, the third output bump, and the fourth output bump, the first output bump and the second output bump are arranged adjacent to each other, and the third output bump and the fourth output bump are arranged adjacent to each other.

[0460] <2>The composite filter component according to <1>, wherein,

[0461] The composite filter component has a first main surface and a second main surface facing each other. When looking down at the first main surface, the composite filter component is a polygon having a first outer side and a second outer side facing each other.

[0462] The first output bump, the second output bump, the third output bump, and the fourth output bump are arranged on the first main surface in a first direction along the first outer side in the order of the fourth output bump, the third output bump, the second output bump, and the first output bump.

[0463] The first input bump and the second input bump are arranged between the first output bump, the second output bump, the third output bump, the fourth output bump and the second outer side on the first main surface.

[0464] <3>The composite filter component according to <2>, wherein,

[0465] the composite filter component includes a first layered portion and a second layered portion that are stacked on top of each other,

[0466] the first layered portion includes the first main surface, the third filter, and the fourth filter,

[0467] the second layered portion includes the second main surface, the first filter, and the second filter,

[0468] the first filter and the second filter are arranged in the order of the second filter and the first filter in the first direction,

[0469] the third filter and the fourth filter are arranged in the order of the fourth filter and the third filter in the first direction,

[0470] when looking down at the first main surface and the second main surface,

[0471] at least a part of the first filter overlaps with the third filter,

[0472] at least a part of the second filter overlaps with the fourth filter.

[0473] <4>The composite filter component according to <2>, wherein,

[0474] the composite filter component includes a first layered portion and a second layered portion that are stacked on top of each other,

[0475] the first layered portion includes the first main surface, the third filter, and the fourth filter,

[0476] the second layered portion includes the second main surface, the first filter, and the second filter,

[0477] the first filter and the second filter are arranged in the order of the first filter and the second filter in the first direction,

[0478] the third filter and the fourth filter are arranged in the order of the fourth filter and the third filter in the first direction,

[0479] when looking down at the first main surface and the second main surface,

[0480] at least a part of the first filter overlaps with the fourth filter,

[0481] The second filter and the third filter overlap at least in part.

[0482] <5>The composite filter component according to <3> or <4>, wherein,

[0483] The first chip includes a first piezoelectric substrate,

[0484] The third filter and the fourth filter are formed on the first piezoelectric substrate,

[0485] The second chip includes a second piezoelectric substrate,

[0486] The first filter and the second filter are formed on the second piezoelectric substrate.

[0487] <6>The composite filter component according to <2>, wherein,

[0488] The composite filter component includes a first laminated portion and a second laminated portion laminated on each other,

[0489] The first laminated portion includes the first main surface, the first filter, and the third filter,

[0490] The second laminated portion includes the second main surface, the second filter, and the fourth filter,

[0491] The first filter and the third filter are arranged in the order of the third filter and the first filter in the first direction,

[0492] The second filter and the fourth filter are arranged in the order of the fourth filter and the second filter in the first direction,

[0493] When looking down on the first main surface and the second main surface,

[0494] The first filter and the second filter overlap at least in part,

[0495] The third filter and the fourth filter overlap at least in part.

[0496] <7>The composite filter component according to <6>, wherein,

[0497] The first chip includes a first piezoelectric substrate,

[0498] The first filter and the third filter are formed on the first piezoelectric substrate,

[0499] The second chip includes a second piezoelectric substrate,

[0500] The second filter and the fourth filter are formed on the second piezoelectric substrate.

[0501] <8>The composite filter component according to any one of <1> to <7>, further comprising:

[0502] A fifth filter having a fifth passband including a reception frequency band of a fifth frequency band;

[0503] A sixth filter having a sixth passband including a reception frequency band of a sixth frequency band different from the fifth frequency band, the sixth frequency band being capable of being received simultaneously with the fifth frequency band;

[0504] A third input bump connected to an input end of the fifth filter and an input end of the sixth filter;

[0505] A fifth output bump connected to an output end of the fifth filter; and

[0506] A sixth output bump connected to an output end of the sixth filter,

[0507] Among the first output bump, the second output bump, the third output bump, the fourth output bump, the fifth output bump, and the sixth output bump, the fifth output bump is disposed adjacent to the first output bump and the second output bump, and the sixth output bump is disposed adjacent to the third output bump and the fourth output bump.

[0508] <9>The composite filter component according to any one of <1> to <7>, further comprising:

[0509] A fifth filter having a fifth passband including a transmission frequency band and a reception frequency band of a fifth frequency band;

[0510] A sixth filter having a sixth passband including a transmission frequency band and a reception frequency band of a sixth frequency band;

[0511] A third input bump connected to one end of the fifth filter and one end of the sixth filter;

[0512] A fifth output bump connected to the other end of the fifth filter; and

[0513] A sixth output bump connected to the other end of the sixth filter,

[0514] The fifth filter and the sixth filter are respectively time-division duplex filters,

[0515] The composite filter component has a first main surface and a second main surface facing each other. When looking down at the first main surface, the composite filter component is a polygon having a first outer side and a second outer side facing each other.

[0516] The first output bump, the second output bump, the third output bump, the fourth output bump, the fifth output bump, and the sixth output bump are arranged on the first main surface in the first direction along the first outer side in the order of the fourth output bump, the third output bump, the second output bump, the first output bump, the sixth output bump, and the fifth output bump.

[0517] The first input bump, the second input bump, and the third input bump are arranged on the first main surface in the first direction in the order of the second input bump, the first input bump, and the third input bump in a region between the first output bump, the second output bump, the third output bump, the fourth output bump, the fifth output bump, the sixth output bump and the second outer side.

[0518] <10>The composite filter component according to any one of <1> to <7>, further comprising:

[0519] A seventh filter having a seventh passband including a reception band of a seventh frequency band different from the first frequency band and the third frequency band, the seventh frequency band being capable of simultaneous reception with the first frequency band and the third frequency band;

[0520] An eighth filter having an eighth passband including a reception band of an eighth frequency band different from the second frequency band and the fourth frequency band, the eighth frequency band being capable of simultaneous reception with the second frequency band and the fourth frequency band;

[0521] A seventh output bump connected to an output end of the seventh filter; and

[0522] An eighth output bump connected to an output end of the eighth filter,

[0523] The first input bump is connected to an input end of the first filter, an input end of the third filter, and an input end of the seventh filter,

[0524] The second input bump is connected to an input end of the second filter, an input end of the fourth filter, and an input end of the eighth filter,

[0525] Among the first output bump, the second output bump, the third output bump, the fourth output bump, the seventh output bump, and the eighth output bump, the first output bump and the second output bump are arranged adjacent to each other, the third output bump and the fourth output bump are arranged adjacent to each other, and the seventh output bump and the eighth output bump are arranged adjacent to each other.

[0526] <11>A composite filter component includes:

[0527] A first filter having a first passband including a transmission band of a first frequency band;

[0528] A second filter having a second passband including a transmission band of a second frequency band;

[0529] A third filter having a third passband including a transmission band of a third frequency band, the third frequency band being capable of being transmitted simultaneously with the first frequency band;

[0530] A fourth filter having a fourth passband including a transmission band of a fourth frequency band, the fourth frequency band being capable of being transmitted simultaneously with the second frequency band;

[0531] A first output bump connected to an output end of the first filter and an output end of the third filter;

[0532] A second output bump connected to an output end of the second filter and an output end of the fourth filter;

[0533] A first input bump connected to an input end of the first filter;

[0534] A second input bump connected to an input end of the second filter;

[0535] A third input bump connected to an input end of the third filter; and

[0536] A fourth input bump connected to an input end of the fourth filter,

[0537] wherein, among the first input bump, the second input bump, the third input bump, and the fourth input bump, the first input bump and the second input bump are arranged adjacent to each other, and the third input bump and the fourth input bump are arranged adjacent to each other.

[0538] <12>The composite filter component according to <11>, wherein,

[0539] The composite filter component has a first main surface and a second main surface facing each other. When looking down at the first main surface, the composite filter component is a polygon having a first outer side and a second outer side facing each other.

[0540] The first input bump, the second input bump, the third input bump, and the fourth input bump are arranged in this order of the first input bump, the second input bump, the third input bump, and the fourth input bump in a first direction along the first outer side on the first main surface.

[0541] The first output bump and the second output bump are arranged on the first main surface, between the first input bump, the second input bump, the third input bump, the fourth input bump and the second outer side.

[0542] <13>The composite filter component according to <12>, wherein

[0543] The composite filter component includes a first lamination part and a second lamination part laminated on each other.

[0544] The first lamination part includes the first main surface, the first filter, and the fourth filter.

[0545] The second lamination part includes the second main surface, the second filter, and the third filter.

[0546] The first filter and the fourth filter are arranged in this order of the first filter and the fourth filter in the first direction.

[0547] The second filter and the third filter are arranged in this order of the second filter and the third filter in the first direction.

[0548] When looking down at the first main surface and the second main surface,

[0549] At least a part of the first filter overlaps with the second filter.

[0550] At least a part of the third filter overlaps with the fourth filter.

[0551] <14>The composite filter component according to <13>, wherein

[0552] When looking down at the first main surface, the area of the first input bump is larger than the area of the third input bump, and the area of the fourth input bump is larger than the area of the second input bump.

[0553] <15>The composite filter component according to <11>, wherein

[0554] The composite filter component has a first main surface and a second main surface facing each other, and includes a first lamination part and a second lamination part laminated on each other.

[0555] The transmission frequency band of the first frequency band and the transmission frequency band of the second frequency band overlap at least partially.

[0556] The first lamination portion includes the first main surface, the third filter, and the fourth filter.

[0557] The second lamination portion includes the second main surface, the first filter, and the second filter.

[0558] The third filter and the fourth filter are arranged in the first direction in the order of the third filter and the fourth filter.

[0559] The first filter and the second filter are arranged in the first direction in the order of the second filter and the first filter.

[0560] When looking down on the first main surface and the second main surface,

[0561] At least a part of the first filter overlaps with at least a part of the fourth filter.

[0562] At least a part of the second filter overlaps with at least a part of the third filter.

[0563] <16>The composite filter component according to <15>, wherein

[0564] When looking down on the first main surface, the area of the third input bump is larger than the area of the first input bump, and the area of the fourth input bump is larger than the area of the second input bump.

[0565] <17>A high-frequency module, comprising:

[0566] A mounting substrate having a third main surface and a fourth main surface facing each other;

[0567] The composite filter component according to any one of <1> to <10>, which is arranged on the mounting substrate; and

[0568] A first low-noise amplifier and a second low-noise amplifier, the first low-noise amplifier and the second low-noise amplifier being arranged on the mounting substrate,

[0569] wherein, the input end of the first low-noise amplifier is connected to the first output bump and the second output bump,

[0570] The input end of the second low-noise amplifier is connected to the third output bump and the fourth output bump.

[0571] <18>The high-frequency module according to <17>, wherein

[0572] The first output bump and the second output bump are configured to be closer to the first low-noise amplifier than to the second low-noise amplifier.

[0573] The third output bump and the fourth output bump are configured to be closer to the second low-noise amplifier than to the first low-noise amplifier.

[0574] <19>A high-frequency module includes:

[0575] A mounting substrate having a third main surface and a fourth main surface facing each other;

[0576] The composite filter component according to any one of <11> to <16>, which is disposed on the mounting substrate; and

[0577] A first power amplifier and a second power amplifier, the first power amplifier and the second power amplifier being disposed on the mounting substrate,

[0578] wherein an output terminal of the first power amplifier is connected to the first input bump and the second input bump,

[0579] and an output terminal of the second power amplifier is connected to the third input bump and the fourth input bump.

[0580] <20>The high-frequency module according to <19>, wherein

[0581] The first input bump and the second input bump are configured to be closer to the first power amplifier than to the second power amplifier,

[0582] and the third input bump and the fourth input bump are configured to be closer to the second power amplifier than to the first power amplifier.

[0583] Industrial applicability

[0584] As a high-frequency module supporting multiple frequency bands, the present invention can be widely used in communication devices such as mobile phones.

[0585] Explanation of reference numerals

[0586] 1, 1A, 1B, 1C, 1D, 1E, 1F, 5, 5A: High-frequency module; 2: Antenna; 3: RFIC; 4, 6: Communication device; 10, 10A, 10B, 10C, 10D, 11, 11A, 12, 12A, 12B, 13, 13A, 14, 14A, 15, 15A, 16, 16A, 50, 50A, 50B, 51, 51A: Composite filter component; 20, 20A, 20B, 21, 21A, 21B, 22, 22A, 22B, 23B, 24, 25, 26, 27, 27A, 28, 28A: Switch; 31, 32, 33: Low-noise amplifier; 36, 37, 38: Power amplifier; 41, 42, 43, 44, 45, 46, 61, 62, 63, 64, 65, 66: Inductor; 90: Mounting substrate; 90a, 90b, 151, 153, 154, 156, 157, 159, 171, 181, 191, 261, 551, 553, 554, 556: Main surface; 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100j, 100k, 100l, 100m, 100n, 100p, 500a, 500b, 500c, 500d, 500e, 500f: Filter; 101, 102, 103, 104, 161, 162, 163, 164, 167, 168, 511, 512, 513, 514, 515, 516: Input bump; 110, 120, 130: Signal output terminal; 111, 112, 113, 114, 115, 116, 117, 118, 501, 502, 503: Output bump; 121, 122, 123, 124, 125, 126, 521, 522, 523, 524: Filter chip; 150: IC; 152, 155, 158, 552, 555: Interface; 165, 166: Input / output bump; 200: Antenna connection terminal; 211a, 211b, 212a, 212b, 213a, 213b, 214a, 214b: Wiring; 301, 302, 303, 304, 311, 312, 313, 314, 321, 322, 323, 324, 331, 332, 333, 334, 341, 342, 343, 344, 351, 352, 353, 354, 361, 362, 363, 364, 401, 402, 403, 404, 411, 412, 413, 414, 421, 422, 423, 424: Outer edge; 310, 320, 140: Signal input terminal; 325: Support layer; 326, 327: Piezoelectric substrate; 330a, 330b, 330c, 330d: IDT electrode; 590: Shielding electrode layer.

Claims

1. A composite filter component, comprising: A first filter having a first passband including a reception band of a first frequency band; A second filter having a second passband including a reception band of a second frequency band; A third filter having a third passband including a reception band of a third frequency band, the third frequency band being receivable simultaneously with the first frequency band; A fourth filter having a fourth passband including a reception band of a fourth frequency band, the fourth frequency band being receivable simultaneously with the second frequency band; A first input bump connected to an input end of the first filter and an input end of the third filter; A second input bump connected to an input end of the second filter and an input end of the fourth filter; A first output bump connected to an output end of the first filter; A second output bump connected to an output end of the second filter; A third output bump connected to an output end of the third filter; and A fourth output bump connected to an output end of the fourth filter, wherein, among the first output bump, the second output bump, the third output bump, and the fourth output bump, the first output bump and the second output bump are arranged adjacent to each other, and the third output bump and the fourth output bump are arranged adjacent to each other.

2. The composite filter component according to claim 1, wherein The composite filter component has a first main surface and a second main surface facing each other, and in a plan view of the first main surface, the composite filter component is a polygon having a first outer side and a second outer side facing each other, The first output bump, the second output bump, the third output bump, and the fourth output bump are arranged on the first main surface in the first direction along the first outer side in the order of the fourth output bump, the third output bump, the second output bump, and the first output bump, The first input bump and the second input bump are arranged on the first main surface between the first output bump, the second output bump, the third output bump, the fourth output bump and the second outer side.

3. The composite filter component according to claim 2, wherein The composite filter component includes a first layered portion and a second layered portion stacked on each other, The first layered portion includes the first main surface, the third filter, and the fourth filter, The second layered portion includes the second main surface, the first filter, and the second filter, The first filter and the second filter are arranged in the first direction in the order of the second filter and the first filter, The third filter and the fourth filter are arranged in the first direction in the order of the fourth filter and the third filter, In a plan view of the first main surface and the second main surface, At least a part of the first filter overlaps with the third filter, At least a part of the second filter overlaps with the fourth filter.

4. The composite filter component according to claim 2, wherein The composite filter component includes a first laminated portion and a second laminated portion laminated on each other. The first laminated portion includes the first main surface, the third filter, and the fourth filter. The second laminated portion includes the second main surface, the first filter, and the second filter. The first filter and the second filter are arranged in the order of the first filter and the second filter in the first direction. The third filter and the fourth filter are arranged in the order of the fourth filter and the third filter in the first direction. When looking down on the first main surface and the second main surface. At least a part of the first filter overlaps with the fourth filter. At least a part of the second filter overlaps with the third filter.

5. The composite filter component according to claim 3 or 4, wherein The composite filter component includes a first chip and a second chip laminated on each other. The first chip includes a first piezoelectric substrate. The third filter and the fourth filter are formed on the first piezoelectric substrate. The second chip includes a second piezoelectric substrate. The first filter and the second filter are formed on the second piezoelectric substrate.

6. The composite filter component according to claim 2, wherein The composite filter component includes a first laminated portion and a second laminated portion laminated on each other. The first laminated portion includes the first main surface, the first filter, and the third filter. The second laminated portion includes the second main surface, the second filter, and the fourth filter. The first filter and the third filter are arranged in the order of the third filter and the first filter in the first direction. The second filter and the fourth filter are arranged in the order of the fourth filter and the second filter in the first direction. When looking down on the first main surface and the second main surface. At least a part of the first filter overlaps with the second filter. At least a part of the third filter overlaps with the fourth filter.

7. The composite filter component according to claim 6, wherein The composite filter component includes a first chip and a second chip laminated on each other. The first chip includes a first piezoelectric substrate. The first filter and the third filter are formed on the first piezoelectric substrate. The second chip includes a second piezoelectric substrate. The second filter and the fourth filter are formed on the second piezoelectric substrate.

8. The composite filter component according to any one of claims 1 to 7, wherein, It further includes: A fifth filter having a fifth passband including a reception band of a fifth frequency band; A sixth filter having a sixth passband including a reception band of a sixth frequency band different from the fifth frequency band, and the sixth frequency band can be received simultaneously with the fifth frequency band; A third input bump connected to the input ends of the fifth filter and the sixth filter; A fifth output bump connected to the output end of the fifth filter; and A sixth output bump connected to the output end of the sixth filter. Among the first output bump, the second output bump, the third output bump, the fourth output bump, the fifth output bump, and the sixth output bump, the fifth output bump is disposed adjacent to the first output bump and the second output bump, and the sixth output bump is disposed adjacent to the third output bump and the fourth output bump.

9. The composite filter component according to any one of claims 1 to 7, wherein, Further provided are: a fifth filter having a fifth passband including a transmission band and a reception band of a fifth frequency band; a sixth filter having a sixth passband including a transmission band and a reception band of a sixth frequency band; a third input bump connected to one end of the fifth filter and one end of the sixth filter; a fifth output bump connected to the other end of the fifth filter; and a sixth output bump connected to the other end of the sixth filter, wherein the fifth filter and the sixth filter are respectively time division duplex filters, the composite filter component has a first main surface and a second main surface facing each other, and in a plan view of the first main surface, the composite filter component is a polygon having a first outer side and a second outer side facing each other, the first output bump, the second output bump, the third output bump, the fourth output bump, the fifth output bump, and the sixth output bump are arranged in this order of the fourth output bump, the third output bump, the second output bump, the first output bump, the sixth output bump, and the fifth output bump in a first direction along the first outer side on the first main surface, the first input bump, the second input bump, and the third input bump are arranged in this order of the second input bump, the first input bump, and the third input bump in the first direction in a region between the first output bump, the second output bump, the third output bump, the fourth output bump, the fifth output bump, the sixth output bump and the second outer side on the first main surface.

10. The composite filter component according to any one of claims 1 to 7, wherein, Further provided are: a seventh filter having a seventh passband including a reception band of a seventh frequency band different from the first frequency band and the third frequency band, and the seventh frequency band can be received simultaneously with the first frequency band and the third frequency band; an eighth filter having an eighth passband including a reception band of an eighth frequency band different from the second frequency band and the fourth frequency band, and the eighth frequency band can be received simultaneously with the second frequency band and the fourth frequency band; a seventh output bump connected to an output end of the seventh filter; and an eighth output bump connected to an output end of the eighth filter, the first input bump is connected to an input end of the first filter, an input end of the third filter, and an input end of the seventh filter, the second input bump is connected to an input end of the second filter, an input end of the fourth filter, and an input end of the eighth filter, Among the first output bump, the second output bump, the third output bump, the fourth output bump, the seventh output bump, and the eighth output bump, the first output bump and the second output bump are arranged adjacent to each other, the third output bump and the fourth output bump are arranged adjacent to each other, and the seventh output bump and the eighth output bump are arranged adjacent to each other.

11. A composite filter component, comprising: A first filter having a first passband including a transmission band of a first frequency band; A second filter having a second passband including a transmission band of a second frequency band; A third filter having a third passband including a transmission band of a third frequency band, the third frequency band being capable of being transmitted simultaneously with the first frequency band; A fourth filter having a fourth passband including a transmission band of a fourth frequency band, the fourth frequency band being capable of being transmitted simultaneously with the second frequency band; A first output bump connected to an output end of the first filter and an output end of the third filter; A second output bump connected to an output end of the second filter and an output end of the fourth filter; A first input bump connected to an input end of the first filter; A second input bump connected to an input end of the second filter; A third input bump connected to an input end of the third filter; and A fourth input bump connected to an input end of the fourth filter, wherein, among the first input bump, the second input bump, the third input bump, and the fourth input bump, the first input bump and the second input bump are arranged adjacent to each other, and the third input bump and the fourth input bump are arranged adjacent to each other.

12. The composite filter component according to claim 11, wherein The composite filter component has a first main surface and a second main surface facing each other. When looking down at the first main surface, the composite filter component is a polygon having a first outer side and a second outer side facing each other. The first input bump, the second input bump, the third input bump, and the fourth input bump are arranged on the first main surface in a first direction along the first outer side in the order of the first input bump, the second input bump, the third input bump, and the fourth input bump. The first output bump and the second output bump are arranged on the first main surface between the first input bump, the second input bump, the third input bump, the fourth input bump and the second outer side.

13. The composite filter component according to claim 12, wherein The composite filter component includes a first layered portion and a second layered portion stacked on each other. The first layered portion includes the first main surface, the first filter, and the fourth filter. The second layered portion includes the second main surface, the second filter, and the third filter. The first filter and the fourth filter are arranged in the first direction in the order of the first filter and the fourth filter. The second filter and the third filter are arranged in the first direction in the order of the second filter and the third filter, When looking down at the first main surface and the second main surface, At least a part of the first filter overlaps with the second filter, At least a part of the third filter overlaps with the fourth filter.

14. The composite filter component according to claim 13, wherein, When looking down at the first main surface, the area of the first input bump is larger than the area of the third input bump, and the area of the fourth input bump is larger than the area of the second input bump.

15. The composite filter component according to claim 11, wherein, The composite filter component has a first main surface and a second main surface facing each other, and includes a first laminated portion and a second laminated portion laminated on each other, At least a part of the transmission band of the first frequency band overlaps with the transmission band of the second frequency band, The first laminated portion includes the first main surface, the third filter, and the fourth filter, The second laminated portion includes the second main surface, the first filter, and the second filter, The third filter and the fourth filter are arranged in the first direction in the order of the third filter and the fourth filter, The first filter and the second filter are arranged in the first direction in the order of the second filter and the first filter, When looking down at the first main surface and the second main surface, At least a part of the first filter overlaps with the fourth filter, At least a part of the second filter overlaps with the third filter.

16. The composite filter component according to claim 15, wherein, When looking down at the first main surface, the area of the third input bump is larger than the area of the first input bump, and the area of the fourth input bump is larger than the area of the second input bump.

17. A high-frequency module, comprising: A mounting substrate having a third main surface and a fourth main surface facing each other; The composite filter component according to any one of claims 1 to 10, which is arranged on the mounting substrate; And A first low-noise amplifier and a second low-noise amplifier, the first low-noise amplifier and the second low-noise amplifier are arranged on the mounting substrate, Wherein, the input end of the first low-noise amplifier is connected to the first output bump and the second output bump, The input end of the second low-noise amplifier is connected to the third output bump and the fourth output bump.

18. The high-frequency module according to claim 17, wherein, The first output bump and the second output bump are arranged closer to the first low-noise amplifier than to the second low-noise amplifier, The third output bump and the fourth output bump are arranged closer to the second low-noise amplifier than to the first low-noise amplifier.

19. A high-frequency module, comprising: A mounting substrate having a third main surface and a fourth main surface facing each other; The composite filter component according to any one of claims 11 to 16, which is disposed on the mounting substrate; and a first power amplifier and a second power amplifier, the first power amplifier and the second power amplifier being disposed on the mounting substrate, wherein an output terminal of the first power amplifier is connected to the first input bump and the second input bump, and an output terminal of the second power amplifier is connected to the third input bump and the fourth input bump.

20. The high-frequency module according to claim 19, wherein the first input bump and the second input bump are configured to be closer to the first power amplifier than to the second power amplifier, and the third input bump and the fourth input bump are configured to be closer to the second power amplifier than to the first power amplifier.

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