Image sensing device including pixel coordinate pattern

Abstract

Disclosed is an image sensing device including a pixel coordinate pattern representing coordinate values of unit pixels. The image sensing device includes: a substrate configured to include a photoelectric conversion element; a plurality of conductive lines disposed over the first surface of the substrate; and a plurality of pixel coordinate patterns disposed between the conductive lines to correspond to the unit pixels and configured to indicate coordinate values of the corresponding unit pixels.

Description

Technical Field

[0001] The technology and implementation disclosed in this patent document generally relate to an image sensing device including a pixel coordinate pattern representing coordinate values of unit pixels. Background Art

[0002] Image sensing devices that convert an optical image into an electrical signal are used in various electronic devices. With the latest developments in the automotive, medical, computer, and communication industries, the demand for highly integrated and high-performance image sensing devices has rapidly increased in various electronic devices such as digital cameras, camcorders, personal communication systems (PCS), video game consoles, surveillance cameras, medical microcameras, robots, etc.

[0003] Image sensing devices can be broadly classified into charge-coupled device (CCD)-based image sensing devices and complementary metal-oxide-semiconductor (CMOS)-based image sensing devices. Recently, CMOS-based image sensing devices have been widely used because analog control circuits and digital control circuits can be directly implemented as a single integrated circuit (IC). Summary of the Invention

[0004] Various embodiments of the disclosed technology relate to an image sensing device that can more quickly and accurately locate the position of each pixel during defect analysis (e.g., reverse engineering) of the pixel.

[0005] In one embodiment of the disclosed technology, an image sensing device may include: a substrate configured to include a photoelectric conversion element; a plurality of conductive lines disposed above a first surface of the substrate; and a plurality of pixel coordinate patterns disposed between the conductive lines to correspond to unit pixels and configured to indicate coordinate values of the corresponding unit pixels.

[0006] In one embodiment of the disclosed technology, an image sensing device may include: a substrate configured to support a plurality of components, the plurality of components including a plurality of unit pixels, each of the plurality of unit pixels including a photoelectric conversion element for sensing light; a plurality of conductive lines supported by the first surface of the substrate and configured to electrically connect one component among the plurality of components to another component; and a plurality of pixel coordinate patterns disposed between the plurality of conductive lines such that each of the plurality of pixel coordinate patterns corresponds to one of the plurality of unit pixels to indicate coordinate values of one of the plurality of unit pixels.

[0007] It should be understood that the foregoing general description and the following detailed description of the disclosed technology are both illustrative and explanatory and are intended to provide further explanation of the disclosed subject matter claimed. Brief Description of the Drawings

[0008] When considered in conjunction with the accompanying drawings, the above and other features and advantageous aspects of the disclosed technology will become apparent with reference to the following detailed description.

[0009] Figure 1 FIG. is a schematic diagram illustrating an exemplary structure of an image sensing device according to some implementations of the disclosed technology.

[0010] Figure 2 FIG. is an illustration of Figure 1 FIG. is a diagram illustrating an example of conductive lines of a metal one (M1) layer formed above a front surface of a substrate in a pixel array of

[0011] Figure 3 FIG. is an illustration of Figure 2 FIG. is an enlarged view of an example of a unit pixel region in which a pixel coordinate pattern of

[0012] Figure 4 FIG. is an illustration of Figure 3 FIG. is a cross-sectional view of an example of a unit pixel region taken along line X-X′ shown in

[0013] Figure 5 FIG. is a diagram illustrating example values of individual patterns assigned to a pixel coordinate pattern according to some implementations of the disclosed technology.

[0014] Figure 6 FIG. is a diagram illustrating examples of a pixel coordinate pattern and a non-coordinate pattern.

[0015] Figure 7 FIG. is a diagram illustrating an example of a pixel coordinate pattern formed in units of 100 unit pixels.

[0016] Figure 8 FIG. is a diagram illustrating an example of a pixel coordinate pattern formed for each unit pixel.

[0017] Figure 9 FIG. is a diagram illustrating examples of a pixel coordinate pattern and a coordinate position pattern for use in an eight shared pixel structure according to some implementations of the disclosed technology.

[0018] Figure 10 FIG. is a diagram illustrating an example shape of a coordinate position pattern according to some implementations of the disclosed technology. DETAILED DESCRIPTION

[0019] This patent document provides implementations and examples of an image sensing device including a pixel coordinate pattern, which can be used to substantially solve one or more technical or engineering problems and alleviate limitations or drawbacks encountered in some other image sensing devices. The disclosed technology can be implemented in some embodiments to provide an image sensing device that can more quickly and accurately locate the position of each pixel during defect analysis of the pixels.

[0020] Reference will now be made in detail to certain embodiments, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. In the following description, detailed descriptions of related known configurations or functions incorporated herein will be omitted to avoid obscuring the subject matter.

[0021] Hereinafter, various embodiments will be described with reference to the drawings. However, it should be understood that the disclosed technology is not limited to the specific embodiments, but includes various modifications, equivalents, and / or alternatives of the embodiments. The embodiments of the disclosed technology can provide various effects that can be directly or indirectly recognized by the disclosed technology.

[0022] Figure 1 is a block diagram illustrating an example of an image sensing device based on some implementations of the disclosed technology.

[0023] Referring to Figure 1 , the image sensing device may include a pixel array 100, a row driver 200, a correlated double sampler (CDS) 300, an analog-to-digital converter (ADC) 400, an output buffer 500, a column driver 600, and a timing controller 700. Figure 1 The components of the image sensing device shown in are discussed by way of example only, and this patent document covers many other changes, substitutions, variations, alterations, and modifications. In this patent document, the term "pixel" may be used to indicate an image sensing pixel configured to detect incident light to generate an electrical signal carrying an image in the incident light.

[0024] The pixel array 100 may include a plurality of unit pixels (PX) arranged in rows and columns continuously. Each unit pixel PX may generate a pixel signal corresponding to incident light through the conversion of the incident light. In this case, each unit pixel (PX) may include a photoelectric conversion element for converting the incident light into photo charges, and a plurality of pixel transistors for outputting a pixel signal by reading out the photo charges received from the photoelectric conversion element. The plurality of unit pixels may generate pixel signals based on pixels or based on pixel groups, where the unit pixels in each pixel group share at least some internal circuits (e.g., pixel transistors). For example, a pixel block may include 4 shared pixel blocks in which four unit pixels share a floating diffusion (FD) region and pixel transistors, or 8 shared pixel blocks in which eight unit pixels share a floating diffusion (FD) region and pixel transistors.

[0025] The pixel array 100 may receive drive signals (e.g., row selection signals, reset signals, transmit (or transfer) signals, etc.) from the row driver 200. When receiving the drive signals, the unit pixels may be activated to perform operations corresponding to the row selection signal, the reset signal, and the transmit signal.

[0026] The pixel array 100 may include pixel transistors for sending drive signals to the unit pixels and conductive lines for sending pixel signals generated from the unit pixels. When the image sensing device has a backside illumination (BSI) structure for receiving incident light through the back surface of the substrate, the conductive lines may be formed above the front surface of the substrate.

[0027] The row driver 200 may activate the pixel array 100 based on control signals provided by a controller circuit such as the timing controller 700 to perform certain operations on the unit pixels in the corresponding rows. In some implementations, the row driver 200 may select one or more pixel groups arranged in one or more rows of the pixel array 100. The row driver 200 may generate a row selection signal to select one or more rows from among the plurality of rows. The row driver 200 may sequentially enable the reset signal and the transmit signal for the unit pixels arranged in the selected rows. The pixel signals generated by the unit pixels arranged in the selected rows may be output to the correlated double sampler (CDS) 300.

[0028] A correlated double sampler (CDS) 300 can use correlated double sampling to remove unwanted offset values of a unit pixel. In one example, the correlated double sampler (CDS) 300 can remove unwanted offset values of a unit pixel by comparing the output voltages of pixel signals (of the unit pixel) obtained before and after accumulating the optical charge generated by incident light at a sensing node (i.e., a floating diffusion (FD) node). As a result, the CDS 300 can obtain a pixel signal generated only by incident light without introducing noise. In some implementations, when receiving a clock signal from the timing controller 700, the CDS 300 can sequentially sample and hold the voltage levels of a reference signal and a pixel signal provided to each of multiple column lines from the pixel array 100. That is, the CDS 300 can sample and hold the voltage levels of the reference signal and the pixel signal corresponding to each column in the columns of the pixel array 100. In some implementations, the CDS 300 can transmit the reference signal and the pixel signal in each column as a correlated double sampling (CDS) signal to the ADC 400 based on a control signal from the timing controller 700.

[0029] The ADC 400 is used to convert the analog CDS signal received from the CDS 300 into a digital signal. In some implementations, the ADC 400 can be implemented as a ramp comparison type ADC. The analog-to-digital converter (ADC) 400 can compare the ramp signal received from the timing controller 700 with the CDS signal received from the CDS 300, and thus can output a comparison signal indicating the comparison result between the ramp signal and the CDS signal. The analog-to-digital converter (ADC) 400 can count the level transition time of the comparison signal in response to the ramp signal received from the timing controller 700, and can output a count value indicating the counted level transition time to the output buffer 500.

[0030] The output buffer 500 can temporarily store column-based image data provided from the ADC 400 based on the control signal of the timing controller 700. The image data received from the ADC 400 can be temporarily stored in the output buffer 500 based on the control signal of the timing controller 700. The output buffer 500 can provide an interface to compensate for the data rate difference or the transmission rate difference between the image sensing device and other devices.

[0031] The column driver 600 can select the columns of the output buffer 500 when receiving a control signal from the timing controller 700, and sequentially output the image data temporarily stored in the selected columns of the output buffer 500. In some implementations, when receiving an address signal from the timing controller 700, the column driver 600 can generate a column selection signal based on the address signal, use the column selection signal to select the columns of the output buffer 500, and can control the image data received from the selected columns of the output buffer 500 to be output as an output signal.

[0032] The timing controller 700 can generate signals for controlling the operations of the row driver 200, the ADC 400, the output buffer 500, and the column driver 600. The timing controller 700 can provide a clock signal, a control signal for timing control, and an address signal for selecting a row or a column required for the operations of the corresponding components of the image sensing device to the row driver 200, the column driver 600, the ADC 400, and the output buffer 500. In some implementations, the timing controller 700 can include a logic control circuit, a phase-locked loop (PLL) circuit, a timing control circuit, a communication interface circuit, and the like.

[0033] Figure 2 is an example showing the conductive wires of a metal layer (e.g., “metal one” (M1) layer) formed above the front surface of a substrate in a pixel array of Figure 1 and the pixel coordinate patterns formed between the conductive wires based on some implementations of the disclosed technology. Figure 3 is an enlarged view of an example of a unit pixel region in which the pixel coordinate patterns of Figure 2 are formed based on some implementations of the disclosed technology. Figure 4 is a cross-sectional view of an example of a unit pixel region taken along the line X-X’ shown in Figure 3 based on some implementations of the disclosed technology.

[0034] Referring to Figures 2 to 4 , the pixel array 100 can include conductive wires 110 and pixel coordinate patterns 120.

[0035] The conductive wires 110 can be formed above the front surface of the substrate 102 in which the photoelectric conversion element (PD) is formed, and can include conductive wires configured to transfer electrical signals between different components. For example, the conductive wires can be used to send a driving signal and an operating voltage to the pixel transistors of the unit pixel, and send the pixel signals generated by the unit pixel. For example, as Figure 4As shown, in the case of an image sensing device having a backside illumination (BSI) structure in which a color filter 104 and a lens layer 106 are formed above the back surface of a substrate 102, conductive lines 110 may be formed in an interconnect layer (in some implementations, the interconnect layer may be referred to as a wiring layer) 108 formed above the front surface of the substrate 102. The interconnect layer 108 may include conductive lines formed in each of a multi-layer structure (M1, M2, M3). That is, the interconnect layer 108 may include a multi-layer structure (M1, M2, M3) composed of conductive lines. The conductive lines 110 based on one embodiment may represent conductive lines formed in a layer (e.g., M1 layer) having many empty spaces between adjacent conductive lines. For example, the conductive lines 110 may be formed at the metal layer closest to the substrate 102 among all the metal layers of the interconnect layer 108.

[0036] The conductive lines 110 may include a first conductive line and second conductive lines (112, 114x, 114y).

[0037] The first conductive line 112 may include a plurality of conductive lines adjacent to each other and extending in parallel along a second direction. The first conductive line 112 may be formed as bar-shaped conductive lines separated from each other, and may be formed corresponding to each unit pixel (PX). For example, the first conductive line 112 may be formed in the same pattern based on pixels.

[0038] The second conductive lines (114x, 114y) may be located at a boundary region between adjacent unit pixels (PX), and may be formed to extend along a first direction (e.g., X direction) and a second direction (e.g., Y direction). The second conductive lines (114x, 114y) may be connected to each other, and may be formed to surround the first conductive line 112.

[0039] A pixel coordinate pattern 120 may be formed in an empty region between the conductive lines 110 to correspond to unit pixels in the pixel array 100. For example, the pixel coordinate pattern 120 may be formed in a region defined by the second conductive lines (114x, 114y) in a corresponding unit pixel region.

[0040] The pixel coordinate pattern 120 may represent coordinate values indicating the position where the corresponding unit pixel is located within the pixel array 100. For example, the pixel coordinate pattern 120 may indicate the order in which the corresponding unit pixel is located in each of the first direction and the second direction. For example, the pixel coordinate pattern 120 may respectively indicate at which positions the corresponding unit pixel is located in the first direction and the second direction. The pixel coordinate pattern 120 may be formed in units of a predetermined number of unit pixels within the pixel array 100. For example, the pixel coordinate pattern 120 may be formed one by one at intervals of 100 unit pixels in each of the first direction and the second direction. Alternatively, the pixel coordinate pattern 120 may be formed to correspond to the unit pixels respectively.

[0041] Each pixel coordinate pattern 120 may include a plurality of individual patterns (x1, x2, y1, y2) representing X coordinate values and Y coordinate values. In each pixel coordinate pattern 120, two (corresponding to the value obtained by dividing the total number of individual patterns included in each pixel coordinate pattern by 2) upper patterns (x1, x2) may be patterns representing X coordinate values, and two lower patterns (y1, y2) may be patterns representing Y coordinate values.

[0042] Although Figure 3 An example case is shown in which the pixel coordinate pattern 120 includes four individual patterns (x1, x2, y1, y2) linearly arranged in the second direction, but the disclosed technology is not limited thereto, and it should be noted that the four individual patterns (x1, x2, y1, y2) may also be linearly arranged in the first direction as needed. In addition, the number of individual patterns included in the pixel coordinate pattern 120 may increase or decrease according to the period (or interval) of forming the pixel coordinate pattern 120 or the size of the entire pixel array. For ease of description, an example case in which the pixel coordinate pattern 120 includes four individual patterns will be discussed.

[0043] In addition, although Figure 3 An example case is shown in which the pixel coordinate pattern 120 is formed at the upper left end of the unit pixel region, but the disclosed technology is not limited thereto, and it should be noted that the pixel coordinate pattern may be formed anywhere between the conductive lines (112, 114x, 114y). In addition, the pixel coordinate pattern 120 may be formed in a metal layer other than the M1 layer.

[0044] Figure 5 is a diagram illustrating example values of individual patterns assigned to the pixel coordinate pattern based on some implementations of the disclosed technology. Figure 6 is a diagram illustrating examples of the pixel coordinate pattern and the non-coordinate pattern.

[0045] Referring to Figure 5 and Figure 6, one of the values from 0 to 9 is assigned to each individual pattern. For example, in the case where there are ten individual patterns, each of the ten individual patterns can be used to indicate one of the values from 0 to 9 (e.g., the first pattern among the ten individual patterns is used to indicate "0", the second pattern among the ten individual patterns is used to indicate "1",..., the tenth pattern among the ten individual patterns is used to indicate "9"). In some implementations, a combination of patterns formed on the empty space of the pixel array can be used to indicate coordinate values to indicate the coordinates or positions of the unit pixels corresponding to the combination of patterns on the pixel array. In some implementations, the areas of the individual patterns can have the same size as each other. For example, as Figure 5 shown, each of the individual patterns can have a shape in which a different-shaped area of the same size (e.g., 1 / 4 area) is removed from a square of the same size. That is, each of the individual patterns can be formed into various shapes having 3 / 4 of the area of a square of the same size. Figure 5 The shapes of the individual patterns are shown by way of example only, and the individual patterns can also be formed into various other shapes as needed.

[0046] Based on Figure 5 the pattern values, the value indicated by the pixel coordinate pattern shown in Figure 3 can be represented by (12, 34). Here, the exact position of the corresponding unit pixel can be determined based on the period (or interval) of forming the pixel coordinate pattern. For example, assuming that the pixel coordinate pattern is formed in each of the first direction and the second direction for every 100 unit pixels, the coordinate value indicated by (12, 34) can be represented by P(1200, 3400). That is, the unit pixel can correspond to the pixel located at the 1200th pixel in the first direction and the 3400th pixel in the second direction. If the pixel coordinate pattern is formed for each unit pixel, P(12, 34) can be used as the coordinate value of the corresponding unit pixel.

[0047] As Figure 6 shown, the individual pattern indicating "none" shown in Figure 5 can be formed to correspond to the unit pixel in which the pixel coordinate pattern 120 is not formed. For example, in the unit pixel area where the coordinate value is not displayed, no pattern can be formed as shown in Figure 2 or a non-coordinate pattern 130 can be formed as shown in Figure 6 . Similar to the pixel coordinate pattern, the non-coordinate pattern 130 can be formed into a shape in which four individual patterns indicating "none" are linearly arranged in the second direction.

[0048] Figure 7 is a diagram illustrating an example of a pixel coordinate pattern formed in units of 100 unit pixels.Figure 8 This is a diagram illustrating an example state in which a pixel coordinate pattern is formed for each unit pixel. For ease of description, Figure 7 and Figure 8 only show the pixel coordinate patterns.

[0049] Referring to Figure 7 , the pixel coordinate pattern 121 may refer to the pixel coordinate pattern positioned first in each of the first direction (X direction) and the second direction (Y direction) within the pixel array 100. Therefore, the unit pixel corresponding to the pixel coordinate pattern 121 is the pixel at the position corresponding to the coordinate value P(100, 100) in the pixel array. That is to say, the pixel coordinate pattern 121 can indicate that the unit pixel at the position where the pixel coordinate pattern 121 is formed is the 100th pixel in each of the first direction and the second direction.

[0050] The pixel coordinate pattern 122 may refer to the pixel coordinate pattern positioned second in the first direction and first in the second direction within the pixel array 100. Therefore, the unit pixel corresponding to the pixel coordinate pattern 122 is the pixel at the position corresponding to the coordinate value P(200, 100) in the pixel array. That is to say, the pixel coordinate pattern 122 can indicate that the unit pixel at the position where the pixel coordinate pattern 122 is formed is the 200th pixel in the first direction and, at the same time, the 100th pixel in the second direction.

[0051] The pixel coordinate pattern 123 may refer to the pixel coordinate pattern positioned first in the first direction and second in the second direction within the pixel array 100. Therefore, the unit pixel corresponding to the pixel coordinate pattern 123 is the pixel at the position corresponding to the coordinate value P(100, 200) in the pixel array 100. That is to say, the pixel coordinate pattern 123 can indicate that the unit pixel at the position where the pixel coordinate pattern 123 is formed is the 100th pixel in the first direction and, at the same time, the 200th pixel in the second direction.

[0052] Similarly, the pixel coordinate patterns (124, 126) can respectively indicate that the coordinate values of the unit pixels at the positions where the pixel coordinate patterns (124, 126) are formed are P(1200, 100) and P(1200, 1200).

[0053] In the unit pixel regions where the pixel coordinate patterns (121 to 126) are not formed, no pattern may be formed as shown in Figure 7 , or a non - coordinate pattern 130 may be formed as shown in Figure 6 .

[0054] When performing reverse engineering for defect analysis, the position of a unit pixel can be confirmed more quickly and accurately through these pixel coordinate patterns.

[0055] Referring to Figure 8 , the pixel coordinate pattern 120' can be formed to correspond to each unit pixel respectively. For example, by increasing the number of individual patterns representing the X coordinate value and the Y coordinate value in each pixel coordinate pattern, a pixel coordinate pattern 120' indicating the position of the corresponding unit pixel can be formed for each unit pixel.

[0056] In this way, when the pixel coordinate pattern 120' is formed for each unit pixel, the position of the unit pixel can be identified more accurately.

[0057] Figure 9 is a diagram illustrating examples of pixel coordinate patterns and coordinate position patterns for use in eight shared pixel structures, exemplifying some implementations based on the disclosed technology. Figure 10 is a diagram illustrating an example shape of a coordinate position pattern based on some implementations of the disclosed technology.

[0058] As discussed above with reference to Figure 2 and Figure 3 , the first conductive line 112 can be formed repeatedly in the same pattern based on pixels. However, in a structure where multiple unit pixels share a floating diffusion (FD) region and a pixel transistor, the first conductive line 112' can be formed repeatedly in units of multiple unit pixels corresponding to a pixel group (PXG). For example, in a 4 - shared pixel structure or an 8 - shared pixel structure, the conductive line formed in the shape shown in Figure 3 can be formed repeatedly in units of a pixel group (PXG) including 4 unit pixels or 8 unit pixels. Figure 9 shows an example case where the conductive line 110' of the M1 layer is formed in the same shape as in Figure 3 in units of a pixel group (PXG) including 8 unit pixels.

[0059] The pixel array 100 may include a conductive line 110', a pixel coordinate pattern 120, and a coordinate position pattern 140.

[0060] The conductive line 110 may include a first conductive line and a second conductive line (112', 114x', 114y'). The first conductive line and the second conductive line (112', 114x', 114y') can be formed in the same shape as the first conductive line and the second conductive line (112, 114x, 114y) shown in Figure 2 and Figure 3 , in units of a pixel group (PXG). Additionally, in some implementations, Figure 9 the pixel coordinate pattern 120 shown inFigure 2 and Figure 3 The only difference between the embodiments of Figure 3 and Figure 2 is that the pixel coordinate pattern 120 is formed to correspond to the pixel group (PXG). Therefore, the detailed description of the conductive line 110' and the pixel coordinate pattern 120 will be omitted here.

[0061] The coordinate position pattern 140 can be formed to correspond to the pixel group (PXG) in which the pixel coordinate pattern 120 is formed. For example, the pixel coordinate pattern 120 and the coordinate position pattern 140 can be formed together as a pair in the same pixel group (PXG) area. Although Figure 9 an example case where the coordinate position pattern 140 is located below the pixel coordinate pattern 120 is shown, the disclosed technology is not limited thereto, and the coordinate position pattern 140 can be formed at any position in the empty area between the conductive lines 110' in the corresponding pixel group (PXG) area.

[0062] The coordinate position pattern 140 can indicate which unit pixel among all the unit pixels belonging to the corresponding pixel group (PXG) is related to the pixel coordinate pattern 120.

[0063] In Figure 9 the eight shared pixel structures shown, one pixel group (PXG) can be divided into eight unit pixel areas (e.g., the areas divided by the dashed lines) PX1 to PX8. However, since the pixel coordinate pattern 120 is formed in the empty area between the conductive lines 110', the area where the pixel coordinate pattern 120 is formed and the area of the corresponding unit pixel may not match each other. For example, from Figure 9 it can be seen that the pixel coordinate pattern 120 can be formed as an area spanning the unit pixels (PX1, PX3) starting from the upper left end of the pixel group (PXG). However, the actual pixel coordinate pattern 120 can be, for example, a pattern representing the coordinate values of the unit pixel PX8 located at the lower right end of the pixel group (PXG) area. Therefore, the shared pixel structure requires the coordinate position pattern 140 to indicate which unit pixel among the unit pixels belonging to the pixel group (PXG) is related to the pixel coordinate pattern 120.

[0064] As can be seen from Figure 10 it, the coordinate position pattern 140 can be formed in such a shape that any one of the eight individual patterns arranged in the same structure (e.g., (2×4) structure) as the unit pixels (PX1 to PX8) arranged in the pixel group (PXG) is removed. Here, the position of the individual pattern removed among the eight individual patterns can be the position of the unit pixel corresponding to the pixel coordinate pattern 120 in the corresponding pixel group (PXG). Figure 9The coordinate position pattern 140 shown in [description] can indicate that the pixel coordinate pattern 120 corresponds to the unit pixel PX8 located at the lower right end among the unit pixels (PX1 to PX8) arranged in a (2×4) structure.

[0065] Although, for ease of description, Figure 9 only 8 shared pixel structures are illustrated, the disclosed technology is not limited thereto, and the coordinate position pattern 140 of 4 shared pixel structures can also be formed in a shape in which any one of the four individual patterns arranged in a (2×2) structure is removed as needed. The above coordinate position pattern 140 can also be applied to shared pixel structures arranged in another M×N structure (where each of M and N is a natural number of 2 or more).

[0066] As is apparent from the above description, an image sensing device based on some implementations of the disclosed technology can more quickly and accurately confirm the position of each pixel during defect analysis of the pixels.

[0067] Embodiments of the disclosed technology can provide various effects that can be directly or indirectly identified through the above patent documents.

[0068] Although multiple exemplary embodiments have been described, it should be understood that various modifications or enhancements of the disclosed embodiments and other embodiments can be designed based on the content described and / or illustrated in this patent document.

[0069] Cross - reference to related applications

[0070] This patent document claims the priority and benefit of Korean Patent Application No. 10 - 2024 - 0007627, filed on January 17, 2024, which is incorporated herein by reference in its entirety as part of the disclosure of this patent document.

Claims

1. An image sensing device, the image sensing device comprising: A substrate configured to support a plurality of components, the plurality of components including a plurality of unit pixels, each of the plurality of unit pixels including a photoelectric conversion element for sensing light; A plurality of conductive lines supported by a first surface of the substrate and electrically connecting one component of the plurality of components to another component; And A plurality of pixel coordinate patterns disposed between the plurality of conductive lines such that each of the plurality of pixel coordinate patterns corresponds to one of the plurality of unit pixels to indicate a coordinate value of one of the plurality of unit pixels.

2. The image sensing device according to claim 1, wherein, The pixel coordinate pattern indicates the positions of the corresponding unit pixel in a first direction and a second direction different from the first direction within the pixel array.

3. The image sensing device according to claim 2, wherein The pixel coordinate patterns are formed at intervals of a predetermined number of unit pixels along the first direction and the second direction.

4. The image sensing device according to claim 2, wherein The pixel coordinate patterns are formed to correspond to the unit pixels respectively.

5. The image sensing device according to claim 1, wherein Each of the pixel coordinate patterns includes a plurality of individual patterns, wherein each of the plurality of individual patterns is assigned a value corresponding to a value from 0 to 9.

6. The image sensing device according to claim 5, wherein, The plurality of individual patterns include: A plurality of first individual patterns representing the coordinate value of the corresponding unit pixel along the first direction; and A plurality of second individual patterns representing the coordinate value of the corresponding unit pixel along a second direction different from the first direction.

7. The image sensing device according to claim 6, wherein The plurality of first individual patterns and the plurality of second individual patterns are arranged in a row.

8. The image sensing device according to claim 5, wherein The plurality of individual patterns have the same size as each other.

9. The image sensing device according to claim 8, wherein Each of the plurality of individual patterns has a shape obtained by removing a different shaped area of the same size from a rectangular shape of the same size.

10. The image sensing device according to claim 1, the image sensing device further comprising: A plurality of non - coordinate patterns disposed between the plurality of conductive lines to correspond to the unit pixels among the plurality of unit pixels in which the pixel coordinate patterns are not formed.

11. The image sensing device according to claim 1, wherein, The conductive lines include: A first conductive line formed in the same pattern for each unit pixel; and A second conductive line extending along a first direction and a second direction different from the first direction and surrounding the first conductive line.

12. The image sensing device according to claim 11, wherein Each of the pixel coordinate patterns is disposed in an area defined by the second conductive line.

13. The image sensing device according to claim 1, wherein, The conductive lines include: A first conductive wire, the first conductive wire being formed in the same pattern for each pixel group in which a plurality of unit pixels are arranged in an M×N structure, where each of M and N is a natural number of 2 or greater; and A second conductive wire, the second conductive wire extending in a first direction and a second direction different from the first direction and surrounding the first conductive wire.

14. The image sensing device according to claim 13, the image sensing device further comprising: A coordinate position pattern, the coordinate position pattern being formed within a pixel group in which the pixel coordinate pattern is formed and indicating which unit pixel among the plurality of unit pixels belonging to the corresponding pixel group is associated with the pixel coordinate pattern.

15. The image sensing device according to claim 14, wherein The coordinate position pattern is formed in a shape obtained by removing at least one individual pattern corresponding to the position of the unit pixel corresponding to the pixel coordinate pattern from among a plurality of individual patterns arranged in an M×N structure.

16. The image sensing device according to claim 1, wherein The pixel coordinate pattern is provided between one or more conductive wires of the plurality of conductive wires closest to the first surface of the substrate.

17. An image sensing device, the image sensing device comprising: A substrate, the substrate including a photoelectric conversion element; A plurality of conductive wires, the plurality of conductive wires being provided above a first surface of the substrate; And A plurality of pixel coordinate patterns, the plurality of pixel coordinate patterns being provided between the conductive wires to correspond to unit pixels and indicating coordinate values of the corresponding unit pixels.

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