Display device of semiconductor light-emitting element and manufacturing device thereof

Abstract

The embodiment relates to a display device of a semiconductor light emitting element and a manufacturing device thereof. A display device of a semiconductor light emitting element according to an embodiment includes: a substrate of a first display module and a substrate of a second display module disposed adjacent to each other; a plurality of semiconductor light-emitting element assemblies disposed on the substrates of the first display module and the second display module, respectively; a first side surface wiring and a second side surface wiring which are arranged on the side surfaces of the substrates of the first display module and the second display module, respectively, and which are electrically connected to the semiconductor light-emitting element assembly; a lower sealing layer disposed on the lower side between the substrate of the first display module and the substrate of the second display module; and a resin layer disposed on the lower sealing layer between the substrate of the first display module and the substrate of the second display module.

Description

Technical Field

[0001] The embodiments relate to a display device using semiconductor light emitting elements and a manufacturing device thereof. Background Art

[0002] Large area display devices include liquid crystal displays (LCDs), OLED displays, and micro-LED displays (Micro-LED displays).

[0003] A micro-LED display is a display that uses semiconductor light emitting elements, i.e., micro-LEDs, with a diameter or cross-sectional area of 100 μm or less as display elements.

[0004] Since a micro-LED display uses semiconductor light emitting elements, i.e., micro-LEDs, as display elements, it has excellent performance in many characteristics such as contrast ratio, response speed, color reproducibility, viewing angle, luminance, resolution, lifespan, luminous efficiency, or brightness.

[0005] In particular, a micro-LED display can separate and combine images in a modular manner, so it has the advantages of freely adjusting the size or resolution and can realize a flexible display.

[0006] However, a large-scale micro-LED display requires millions of micro-LEDs or more. Therefore, there is a technical problem in that it is difficult to transfer micro-LEDs to a display panel quickly and accurately.

[0007] Transfer technologies developed in recent years include a pick-and-place process, a Laser Lift-off method, or a self-assembly method. Among them, the self-assembly method is a method in which semiconductor light emitting elements automatically find assembly positions in a fluid, and is a method that is beneficial for realizing a large-screen display device.

[0008] On the other hand, a display device using conventional semiconductor light emitting elements is manufactured by transferring semiconductor light emitting elements to a substrate such as a TFT substrate or a wiring substrate. However, there is a problem in that productivity decreases due to a transfer defect rate of semiconductor light emitting elements, etc., and in particular, the production yield of a large area display device is extremely low.

[0009] To solve such problems, in recent years, a'multi-screen display device' has been developed in which a plurality of semiconductor light emitting element display modules having relatively small sizes are spliced together to realize a large display device.

[0010] However, in the case of a multi-screen display device, a gap region may occur between the connected unit display devices due to the frame region existing at the edge of each unit display device. The frame region exists through side electrodes (or side wirings) and the like, and the side electrodes (or side wirings) are used to electrically connect the components arranged on the upper part of the substrate and the components arranged on the lower part of the substrate.

[0011] When a multi-screen display device displays an image in the entire area, such gap areas cause the image to appear disconnected and inconsistent because the gaps or boundaries between modules are 'visually recognized' as seams, thereby reducing the immersion of the image.

[0012] On the other hand, in the prior art, research has been conducted to improve the seams between modules in a multi-display device in which a plurality of display modules are spliced together.

[0013] For example, the existing patent 1 (Korean Publication No.: 10-2019-0046684) discloses a structure in which a light absorbing layer is arranged on the side of each mold, but there is the following limitation: there is still a gap on the light absorbing layer between adjacent display modules, thereby there is a seam.

[0014] In addition, the existing patent 2 (Korea Publication No.: 10-2020-0014057) discloses a structure in which a PR film is arranged on the seam area between modules, but there is still an empty space between the modules, so that in the case of poor adhesion of the PR film, the seam area may cause visibility problems. In addition, the seam area is an empty space, so it is difficult to attach a PR film to this area, and when PR is also attached to the pixel, it may cause pixel failure.

[0015] On the other hand, in the prior art, a plurality of display modules are spliced on a predetermined frame or cabinet, but no additional physical connection is attempted between the side areas of adjacent display modules, so there is a problem of weak device reliability.

[0016] On the other hand, in a display device using internal technology, even if the gap between the spliced display modules is physically and mechanically reduced or eliminated, there is still a problem that the boundary line is optically and visually recognized as a seam.

[0017] Therefore, it is not enough to just physically eliminate the gaps between the display modules, but it is necessary to achieve a level where the seams cannot be recognized optically.

[0018] In addition, in internal technologies, in a multi-screen display device formed by splicing multiple display modules, a height difference is generated on the upper surface of the spliced display modules, thereby causing a surface step between the display modules.

[0019] Therefore, even if the gap between the display modules is filled, when a surface step is generated between the display modules, an obvious seam is still optically recognized. Summary of the Invention

[0020] Technical Problem

[0021] One technical problem of the embodiment is to solve the problem of low instrumental reliability between the side regions of adjacent display modules when splicing multiple display modules.

[0022] In addition, one technical problem of the embodiment is not to stay at the level of physically removing the gap between the display modules, but to reach the level where the seam cannot be optically or visually recognized.

[0023] In addition, one technical problem of the embodiment is to solve the problem that even if the gap between the display modules is filled, when a surface step is generated between the display modules, an obvious seam is optically recognized.

[0024] In addition, one technical problem of the embodiment is to solve the problem of the seam phenomenon caused by the V-shaped void (V) when filling the gap between the display modules.

[0025] The technical problems of the embodiment are not limited to this, but include all problems that can be grasped through the entire specification.

[0026] Means for Solving the Technical Problem

[0027] The display device of the semiconductor light-emitting element according to the embodiment includes: substrates of a first display module and a second display module, which are arranged adjacent to each other; a plurality of semiconductor light-emitting element assemblies, which are respectively arranged on the substrates of the first display module and the second display module; a first side wiring and a second side wiring, which are respectively arranged on the sides of the substrates of the first display module and the second display module and are electrically connected to the semiconductor light-emitting element assemblies; a lower sealing layer, which is arranged on the lower side between the substrates of the first display module and the second display module; and a resin layer, which is arranged on the lower sealing layer between the substrates of the first display module and the second display module.

[0028] The above resin layer includes a resin layer disposed in the boundary region between the above first display module and the above second display module and having an inclined upper surface.

[0029] The upper surface of the above inclined resin layer is flat.

[0030] The upper surface of the above inclined resin layer is parallel to the connecting line between the first planarization layer on the above first display module and the second planarization layer on the above second display module.

[0031] The above resin layer includes a porous adhesive resin layer.

[0032] The above resin layer includes a viscoelastic resin layer.

[0033] In addition, a manufacturing apparatus for a display device of a semiconductor light-emitting element includes: a display device including a plurality of display modules; an upper sealing layer disposed on the above plurality of display modules; a lower sealing layer disposed below the above plurality of display modules; and an injection device that injects a resin material into a separated space formed by the above upper sealing layer and the above lower sealing layer.

[0034] The above injection device for injecting the resin material includes a plurality of injection devices, and at least one of the above plurality of injection devices includes an injection and pressurization device that injects and pressurizes the resin material.

[0035] At least one of the plurality of above injection devices includes a suction device that sucks the resin material.

[0036] Advantages of the Invention

[0037] The display device of the semiconductor light-emitting element according to the embodiment has the following technical effects: It can solve the problem of low instrumental reliability between the side regions of adjacent display modules when splicing a plurality of display modules.

[0038] For example, according to the embodiment, by directly bonding between modules with a resin layer of a porous adhesive substance as a medium, there is no gap itself between the modules, thus achieving a perfect seamless splicing. In addition, according to the embodiment, by directly bonding between modules with a resin layer such as a porous adhesive substance as a medium, there is no need to additionally fix the modules, so the structural reliability is excellent.

[0039] In addition, the display device of the semiconductor light-emitting element according to the embodiment does not stop at the level of physically removing the gap between the display modules, but reaches the level where the seam cannot be recognized optically and visually.

[0040] For example, in the embodiment, the upper sealing layer 810 and the lower sealing layer 820 are disposed on the space between adjacent first display modules 700a, second display modules 700b, third display modules 700c, and fourth display modules 700d, and are respectively in close contact with the planarization film 750 and the wiring protection layer 742 to form a sealed space, thereby having a special technical effect of enabling the resin layer to uniformly and rapidly fill the space in such a manner that it neither overflows from the space nor leaves an empty space.

[0041] For example, a resin layer such as a porous adhesive substance in the embodiment is used as a soft porous substance for a joint light absorption layer, thereby having a special technical effect of scattering the reflection generated by external light into the porous space and being absorbed (trapped), thus reducing joint recognition.

[0042] Specifically, in the embodiment, as a resin layer such as a porous adhesive substance is disposed between adjacent first display module 700a and second display module 700b, there is a special technical effect that its boundary line is not optically or visually recognized as a joint.

[0043] In addition, the display device of the semiconductor light-emitting element in the embodiment has the following technical effect: it can solve the problem that even if the gap between the display modules is filled, when a surface step is generated between the display modules, it is optically recognized as an obvious seam.

[0044] For example, the embodiment has the following special technical effect: even if there is a height difference between the upper surface 700aT of the first display module and the upper surface 700bT of the second display module in the splicing, as a resin layer of a porous adhesive substance is disposed and used as a joint light absorption layer, the reflection generated by external light is scattered into the porous space and absorbed, thereby avoiding being optically and visually recognized as a seam.

[0045] In addition, the display device of the embodiment disposes a resin layer of a viscoelastic substance on the first display module 700a and the second display module 700b. Such a resin layer of a viscoelastic substance reduces the reflection generated by external light, thereby being able to reduce joint recognition.

[0046] In addition, according to the embodiment, it has the following special technical effect: as the gap between the display modules is filled, even if a surface step is generated between the display modules, the problem of being optically recognized as a seam can be solved.

[0047] For example, according to the third embodiment, there is a special technical effect as follows: Even if there is a height difference between the upper surface 700aT of the first display module to be spliced and the upper surface 700bT of the second display module, with the second resin layer 792 configured to be inclined, the step E-SS in the embodiment is covered by the inclined second resin layer 792, thereby being able to solve the problem of being optically recognized as a seam.

[0048] The technical effects of the embodiment are not limited to this, but include all effects that can be grasped through the entire specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is an illustrative diagram of the living room of a house equipped with the display device of the embodiment.

[0050] Figure 2 It is a block diagram schematically showing the display device of the embodiment.

[0051] Figure 3 It shows Figure 2 An example of the circuit diagram of the pixel.

[0052] Figure 4 It is Figure 1 An enlarged view of the first panel area in the display device.

[0053] Figure 5 It is along Figure 4 A cross-sectional view cut along the B1 - B2 line of the A2 area.

[0054] Figure 6 It is an illustrative diagram of the light-emitting element of the embodiment being assembled to the substrate by a self-assembly method.

[0055] Figure 7 It is an illustrative diagram of a multi-screen display device including multiple display panels of internal technology.

[0056] Figure 8 It includes Figure 7 An illustrative surface photo of the first area of the display device with the multiple display panels shown.

[0057] Figure 9a It includes Figure 7 An illustrative surface photo of the second area C2 of the display device 700 with the multiple display panels shown.

[0058] Figure 9b It is Figure 9a The 3D contour file data of each component.

[0059] Figure 9cIt is a product photo of a case where a predetermined resin is filled in a boundary region between a first display module 600a and a second display module 600b in an internal technology by backfilling.

[0060] Figure 10 It is a side view of a boundary region between display modules of the display device 700 of the first embodiment.

[0061] Figure 11 It is a side view of a boundary region between display modules of the display device 702 of the second embodiment.

[0062] Figure 12a It is an illustrative diagram of a manufacturing method of the display device 700 of the first embodiment.

[0063] Figure 12b It is another illustrative diagram of a manufacturing method of the display device 700 of the first embodiment.

[0064] Figure 13 It is an illustrative diagram of a manufacturing device 800 of a display device of an embodiment.

[0065] Figure 14a It is an illustrative diagram of a multi-screen display device 700 including a plurality of display panels of an embodiment.

[0066] Figure 14b It is Figure 14a An illustrative diagram of a surface photo of a third region C3 of the display device 700 shown in

[0067] Figure 14c It is Figure 14a An illustrative diagram of a surface photo of a fourth region C4 of the display device 700 shown in

[0068] Figure 15a It is a side view of a boundary region between display modules of the display device 703 of the third embodiment.

[0069] Figure 15b It is Figure 15a 3D contour file data of each component of Detailed Description

[0070] Hereinafter, with reference to the accompanying drawings, embodiments disclosed in this specification will be described in detail. In the following description, the suffixes'module' and 'unit' for components are given or mixed for convenience in writing the specification, and they do not have a meaning or function to distinguish from each other. In addition, the accompanying drawings are used to assist in understanding the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited to the content in the drawings. In addition, when referring to an element such as a layer, region, or substrate existing 'on' another component, this means that it directly exists on the other component or there are other intermediate components in between.

[0071] The display devices described in this specification include digital TVs, mobile phones, smartphones, laptop computers, digital broadcast terminals, PDAs (personal digital assistants), PMPs (portable multimedia players), navigation devices, slate PCs, tablet PCs, ultra-books, desktop computers, etc. However, even for newly developed product forms in the future, the structures of the embodiments described in this specification are also applicable to displayable devices.

[0072] Hereinafter, a light-emitting element of an embodiment and a display device including the light-emitting element will be described.

[0073] Figure 1 The living room of a house in which a display device 100 of an embodiment is arranged is shown.

[0074] The display device 100 of the embodiment displays the states of various electronic products such as a washing machine 101, a cleaning robot 102, and an air purifier 103, communicates with each electronic product based on an IOT substrate, and can also control various electronic products based on the set data of the user.

[0075] The display device 100 of the embodiment includes a flexible display provided on a thin and flexible substrate. While maintaining the characteristics of a conventional flat panel display, the flexible display can also be bent or rolled up like paper.

[0076] In the flexible display, the time information is represented by independently controlling the light emission of unit pixels arranged in a matrix form. A unit pixel refers to the smallest unit for representing one color. The unit pixels of the flexible display can be represented by light-emitting elements. In the embodiment, the light-emitting element can be a micro-LED or a nano-LED, but is not limited thereto.

[0077] Figure 2 is a block diagram schematically showing a display device according to an embodiment, Figure 3 is a circuit diagram showing an example of a pixel of Figure 2 .

[0078] Referring to Figure 2 and Figure 3 , the display device according to the embodiment includes a display panel 10, a driving circuit 20, a scan driving unit 30, and a power supply circuit 50.

[0079] The display device 100 according to the embodiment drives a light-emitting element by an active matrix (AM) method or a passive matrix (PM) method.

[0080] The driving circuit 20 includes a data driving unit 21 and a timing control unit 22.

[0081] The display panel 10 is divided into a display area DA and a non-display area NDA disposed around the display area DA. The display area DA is an area where pixels PX are formed to display an image. The display panel 10 may include data lines (D1 to Dm, where m is an integer of 2 or more), scan lines (S1 to Sn, where n is an integer of 2 or more) intersecting the data lines (D1 to Dm), a high-potential voltage line for supplying a high-potential voltage, a low-potential voltage line for supplying a low-potential voltage, and pixels PX connected to the data lines (D1 to Dm) and the scan lines (S1 to Sn).

[0082] Each pixel PX includes a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The first sub-pixel PX1 emits first-color light having a first wavelength, the second sub-pixel PX2 emits second-color light having a second wavelength, and the third sub-pixel PX3 emits third-color light having a third wavelength. The first-color light may be red light, the second-color light may be green light, and the third-color light may be blue light, but is not limited thereto. In addition, Figure 2 illustrates a case where each pixel PX includes 3 sub-pixels, but is not limited thereto. That is, each pixel PX includes 4 or more sub-pixels.

[0083] The first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may be respectively connected to at least one of the data lines (D1 to Dm), at least one of the scan lines (S1 to Sn), and the high-potential voltage line. As Figure 3 shown, the first sub-pixel PX1 may include a light-emitting element LD and a plurality of transistors and at least one capacitor Cst for supplying current to the light-emitting element LD.

[0084] Although not shown, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may each also include only one light-emitting element LD and at least one capacitor Cst.

[0085] The light-emitting element LD may be a semiconductor light-emitting diode including a first electrode, a plurality of conductive-type semiconductor layers, and a second electrode. Here, the first electrode may be an anode electrode, and the second electrode may be a cathode electrode, but is not limited thereto.

[0086] Refer to Figure 3 , the plurality of transistors include a driving transistor DT that supplies current to the light-emitting element LD, and a scanning transistor ST that supplies a data voltage to the gate of the driving transistor DT. The driving transistor DT includes a gate connected to the source of the scanning transistor ST, a source connected to a high-potential voltage line to which a high-potential voltage is applied, and a drain connected to the first electrode of the light-emitting element LD. The scanning transistor ST includes a gate connected to a scanning line (Sk, where k is an integer satisfying 1 ≤ k ≤ n), a source connected to the gate of the driving transistor DT, and a drain connected to a data line (Dj, where j is an integer satisfying 1 ≤ j ≤ m).

[0087] The capacitor Cst is formed between the gate and the source of the driving transistor DT. The storage capacitor Cst compensates for the difference value between the gate voltage and the source voltage of the driving transistor DT.

[0088] The driving transistor DT and the scanning transistor ST are formed of thin film transistors. Additionally, Figure 3 focuses on the case where the driving transistor DT and the scanning transistor ST are formed of P-type MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), but the embodiments are not limited thereto. The driving transistor DT and the scanning transistor ST may also be formed of N-type MOSFETs. In this case, the positions of the source and the drain of each of the driving transistor DT and the scanning transistor ST may be changed.

[0089] Additionally, Figure 3 illustrates the case where the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 each include a 2T1C (2 transistors - 1 capacitor) having one driving transistor DT, one scanning transistor ST, and one capacitor Cst, but the embodiments are not limited thereto. The first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may each also include a plurality of scanning transistors ST and a plurality of capacitors Cst.

[0090] Refer back to Figure 2, the driving circuit 20 outputs signals and voltages for driving the display panel 10. To this end, the driving circuit 20 includes a data driving unit 21 and a timing control unit 22.

[0091] The data driving unit 21 receives digital video data DATA and a source control signal DCS from the timing control unit 22. The data driving unit 21 converts the digital video data DATA into an analog data voltage according to the source control signal DCS and supplies it to the data lines (D1 to Dm) of the display panel 10.

[0092] The timing control unit 22 receives digital video data DATA and a timing signal from the host system. The timing signal includes a vertical sync signal, a horizontal sync signal, a data enable signal, and a dot clock. The host system may be an application processor of a smart phone or a tablet PC, a monitor, a system-on-chip of a TV, etc.

[0093] The scan driving unit 30 receives a scan control signal SCS from the timing control unit 22. The scan driving unit 30 generates a scan signal according to the scan control signal SCS and supplies it to the scan lines (S1 to Sn) of the display panel 10. The scan driving unit 30 includes a plurality of transistors and is formed in the non-display area NDA of the display panel 10. Alternatively, the scan driving unit 30 may be formed by an integrated circuit. In this case, it may be mounted on a gate flexible film attached to the other side of the display panel 10.

[0094] The power supply circuit 50 generates a high-potential voltage VDD and a low-potential voltage VSS for driving the light-emitting elements LD of the display panel 10 from the main power supply and supplies them to the high-potential voltage line and the low-potential voltage line of the display panel 10. In addition, the power supply circuit 50 generates a driving voltage for driving the driving circuit 20 and the scan driving unit 30 from the main power supply and supplies it.

[0095] Figure 4 is Figure 1 an enlarged view of the first panel area A1 in the display device.

[0096] According to Figure 4 , the display device 100 of the embodiment is manufactured by instrumentally connecting and electrically connecting a plurality of panel areas such as the first panel area A1 by splicing.

[0097] The first panel area A1 includes a plurality of light-emitting elements 150 arranged according to each unit pixel ( Figure 2 of PX).

[0098] For example, the unit pixel PX includes a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. For example, a plurality of red light-emitting elements 150R are disposed in the first sub-pixel PX1, a plurality of green light-emitting elements 150G are disposed in the second sub-pixel PX2, and a plurality of blue light-emitting elements 150B are disposed in the third sub-pixel PX3. The unit pixel PX may further include a fourth sub-pixel in which no light-emitting element is disposed, but this is not limited thereto. On the other hand, the light-emitting element 150 may be a semiconductor light-emitting element.

[0099] Next, Figure 5 is a cross-sectional view taken along line B1-B2 of area A2. Figure 4

[0100] Referring to Figure 5 , the display device 100 of the embodiment includes a substrate 200, assembly lines 201, 202, a first insulating layer 211a, a second insulating layer 211b, a third insulating layer 206, and a plurality of light-emitting elements 150.

[0101] The assembly lines include a first assembly line 201 and a second assembly line 202 spaced apart from each other. The first assembly line 201 and the second assembly line 202 are used to generate dielectrophoresis (DEP) force for assembling the light-emitting element 150. In addition, the first assembly line 201 and the second assembly line 202 are electrically connected to the electrodes of the light-emitting element and function as electrodes of the display panel.

[0102] The assembly lines 201, 202 are formed of a transparent conductive electrode ITO or include a metal material having excellent conductivity. For example, the assembly lines 201, 202 are formed of at least any one of titanium (Ti), chromium (Cr), nickel (Ni), aluminum (Al), platinum (Pt), gold (Au), tungsten (W), molybdenum (Mo), or an alloy thereof.

[0103] A first insulating layer 211a is disposed between the first assembly line 201 and the second assembly line 202, and a second insulating layer 211b is disposed on the first assembly line 201 and the second assembly line 202. The first insulating layer 211a and the second insulating layer 211b may be an oxide film, a nitride film, etc., but are not limited thereto.

[0104] The light-emitting elements 150 include a red light-emitting element 150R, a green light-emitting element 150G, and a blue light-emitting element 150B, respectively, for constituting a unit pixel (sub-pixel), but are not limited thereto, and may also include a red phosphor and a green phosphor, etc., to respectively exhibit red and green.

[0105] ​The substrate 200 can be formed of glass or polyimide. Additionally, the substrate 200 can include flexible materials such as PEN (Polyethylene Naphthalate) and PET (Polyethylene Terephthalate). Additionally, the substrate 200 can be a light-transmissive material, but is not limited thereto.

[0106] The third insulating layer 206 includes insulating and flexible materials such as polyimide, PEN, and PET, and can be integrally formed with the substrate 200 to form a single substrate.

[0107] The third insulating layer 206 is a conductive adhesive layer having adhesiveness and conductivity. The conductive adhesive layer has flexibility and can achieve the flexible function of the display device. For example, the third insulating layer 206 is an anisotropic conductive film (ACF), an anisotropic conductive medium, a solution containing conductive particles, or other conductive adhesive layers. The conductive adhesive layer has electrical conductivity in the vertical direction with respect to the thickness and electrical insulation in the horizontal direction with respect to the thickness.

[0108] The third insulating layer 206 includes an assembly hole 203 into which the light-emitting element 150 is inserted (refer to Figure 6 ). Therefore, during self-assembly, the light-emitting element 150 can be easily inserted into the assembly hole 203 of the third insulating layer 206. The assembly hole 203 can be referred to as an insertion hole, a fixing hole, an alignment hole, etc.

[0109] The distance between the assembly lines 201 and 202 is smaller than the width of the light-emitting element 150 and the width of the assembly hole 203, and the assembly position of the light-emitting element 150 using an electric field can be fixed more precisely.

[0110] The third insulating layer 206 is formed on the assembly lines 201 and 202 to protect the assembly lines 201 and 202 in the fluid 1200 and prevent leakage of the current flowing on the assembly lines 201 and 202. An inorganic insulator such as silicon dioxide or aluminum oxide or an organic insulator is formed on the third insulating layer 206 in a single layer or multiple layers.

[0111] Additionally, the third insulating layer 206 includes insulating and flexible materials such as polyimide, PEN, and PET, and can also be integrally formed with the substrate 200 to form a single substrate.

[0112] The third insulating layer 206 is an insulating layer having adhesiveness or a conductive adhesive layer having conductivity. The third insulating layer 206 has flexibility and can achieve the flexible function of the display device.

[0113] The third insulating layer 206 has partition walls, and assembly holes 203 are formed through the partition walls. For example, when forming the substrate 200, a part of the third insulating layer 206 is removed, and thus the light-emitting elements 150 are respectively assembled into the assembly holes 203 of the third insulating layer 206.

[0114] Assembly holes 203 for bonding the light-emitting elements 150 are formed on the substrate 200, and the surface on which the assembly holes 203 are formed is in contact with the fluid 1200. The assembly holes 203 guide the light-emitting elements 150 to be assembled to the correct positions.

[0115] On the other hand, the assembly holes 203 have shapes and sizes corresponding to the shapes of the light-emitting elements 150 to be assembled to the corresponding positions. Thereby, it is possible to prevent other light-emitting elements from being assembled into the assembly holes 203 or multiple light-emitting elements from being assembled.

[0116] Figure 6 It is a diagram showing an example in which light-emitting elements according to an embodiment are assembled to a substrate by a self-assembly method, and the self-assembly method of the light-emitting elements will be described with reference to this diagram.

[0117] The substrate 200 is a panel substrate of a display device. In the following description, the case where the substrate 200 is a panel substrate of a display device is taken as an example for description, but the embodiment is not limited thereto.

[0118] Refer to Figure 6 , a plurality of light-emitting elements 150 are put into a chamber 1300 filled with a fluid 1200. The fluid 1200 may be water such as ultrapure water, but is not limited thereto. The chamber may be referred to as a water tank, a box, a container, etc.

[0119] After that, the substrate 200 is disposed on the chamber 1300. According to an embodiment, the substrate 200 may also be put into the chamber 1300.

[0120] As Figure 5 shown, a pair of assembly lines 201 and 202 corresponding to the respectively assembled light-emitting elements 150 are disposed on the substrate 200.

[0121] Refer to Figure 6 , after disposing the substrate 200, an assembly device 1100 including a magnetic body moves along the substrate 200. As the magnetic body, for example, a magnet or an electromagnet can be used. The assembly device 1100 moves in a state of being in contact with the substrate 200 in order to maximize the region involved in the magnetic field into the fluid 1200. According to an embodiment, the assembly device 1100 includes a plurality of magnetic bodies or a magnetic body having a size corresponding to the substrate 200. In this case, the moving distance of the assembly device 1100 is limited within a specified range.

[0122] Due to the magnetic field generated by the assembling device 1100, the light-emitting element 150 in the chamber 1300 moves toward the assembling device 1100.

[0123] During the movement of the light-emitting element 150 toward the assembling device 1100, it enters the assembling hole 203 through dielectrophoretic force (DEP force) and contacts the substrate 200.

[0124] Specifically, the assembly lines 201 and 202 form an electric field through an externally supplied power source, and a dielectrophoretic force is formed between the assembly lines 201 and 202 through this electric field. Through this dielectrophoretic force, the light-emitting element 150 is fixed in the assembling hole 203 on the substrate 200.

[0125] Due to the electric field applied by the assembly lines 201 and 202 formed on the substrate 200, it is possible to prevent the light-emitting element 150 in contact with the substrate 200 from being detached due to the movement of the assembling device 1100. According to the embodiment, by using the self-assembly method of the above electromagnetic field, the time required to separately assemble the light-emitting elements 150 onto the substrate 200 can be significantly shortened, so that a large-area high-pixel display can be realized more quickly and economically.

[0126] At this time, a predetermined solder layer (not shown) is formed between the light-emitting element 150 assembled in the assembling hole 203 of the substrate 200 and the assembling electrode, thereby improving the bonding force of the light-emitting element 150.

[0127] Next, a molding layer (not shown) is formed in the assembling hole 203 of the substrate 200. The molding layer can be a light-transmissive resin or a resin including a reflective substance and a scattering substance.

[0128] Figure 7 A multi-screen display device 600 including multiple display panels with internal technologies is shown.

[0129] Refer to Figure 7 , the multi-screen display device 600 is embodied in a form where multiple display panels 600a to 600d are spliced. For example, the multi-screen display device 600 may include a first display panel 600a, a second display panel 600b, a third display panel 600c, and a fourth display panel 600d, but is not limited thereto. The above multiple display panels 600a to 600d can respectively be display devices manufactured by the self-assembly method described above, but are not limited thereto.

[0130] In the internal technology, the multi-screen display device 600 can be used as a large-area display device that provides one image through multiple display panels 600a to 600d. The gaps between adjacent display devices can be reduced by minimizing the side border areas of the multiple display panels 600a to 600d respectively.

[0131] Through internal technology, as the gap area between display devices decreases, when outputting an image, it is possible to minimize the dark area generation region generated through the gap area, thereby minimizing the sense of discontinuity that can be displayed in the entire screen of the multi-screen display device 600.

[0132] On the other hand, referring to Figure 7 , although the physical interval, that is, the gap, between multiple display panels of the internal technology decreases, from an optical perspective, there is a problem that this gap or boundary line is 'visually recognized' as a seam S1.

[0133] For example, Figure 8 is an exemplary surface photograph of the first region C1 of the display device 600 including Figure 7 the multiple display panels shown.

[0134] Specifically, Figure 8 is a surface photograph of the first boundary region C1 of the first display module 600a and the second display module 600b, and there is a predetermined gap G1 between the side member 600am of the adjacent first display panel and the side member 600bm of the second display panel. Figure 8 The 3D profile file data P1 regarding each component is shown in the photograph.

[0135] In the display device of the internal technology, there is a problem that it is difficult to physically and mechanically reduce or eliminate the gap G1 between the spliced display modules with the prior art, and there is also a problem that even if the gap is eliminated, it is still optically and visually recognized as a seam S1.

[0136] Therefore, it is not sufficient to simply physically eliminate the gap between the display modules, but a level where the seam cannot be optically recognized is required.

[0137] In addition, in the internal technology, multiple display modules are spliced on a predetermined frame or cabinet, but independent physical bonding cannot be achieved between the side regions of adjacent display modules, so there is a problem of weak instrumental reliability.

[0138] Next, Figure 9a is an exemplary surface photograph of the second region C2 of the display device 600 including Figure 7 the multiple display panels shown, Figure 9b is the 3D profile file data P2 regarding Figure 9a each component.

[0139] Specifically, Figure 9aIt is a surface photo of the second boundary region C2 of the first display module 600a and the second display module 600b. There is a specified second gap G2 between the side member 600am of the adjacent first display panel and the side member 600bm of the second display panel.

[0140] Figure 9b It is about Figure 9a The 3D contour profile data P2 of each component. A height difference is generated between the upper surface 600aT of the spliced first display panel and the upper surface 600bT of the second display panel, resulting in a surface step SS between the display modules.

[0141] Next, Figure 9c It is a product photo R1 of the case where a specified resin is filled into the boundary region between the first display module 600a and the second display module 600b in the internal technology in a backfilling manner. Figure 9c It includes Figure 9c The 3D contour profile data P2B of each component.

[0142] According to the internal technology, even if the gap between the display modules is filled, in the case of a surface step between the display modules, as Figure 9a and Figure 9b shown, there is a problem that an obvious seam S2 is optically and visually recognized.

[0143] In addition, according to the internal technology, in the case where there is no sealing cover layer in the embodiment and a specified resin is filled into the gap between the display modules, not only a surface step between the display modules is generated, but also a seam phenomenon occurs optically and visually due to the V-shaped void V.

[0144] Regarding this, one technical problem of the embodiment is to solve the problem of weak instrumental reliability between the side regions of adjacent display modules when splicing multiple display modules.

[0145] In addition, one technical problem of the embodiment is not to stop at the level of physically eliminating the gap between the display modules, but to reach the level where no seam is optically and visually recognized.

[0146] In addition, one technical problem of the embodiment is to solve the problem that even if the gap between the display modules is filled and a surface step between the display modules is generated, an obvious seam is optically recognized.

[0147] In addition, one technical problem of the embodiment is to solve the problem of the seam phenomenon caused by the V-shaped void V when filling the gap between display modules.

[0148] Hereinafter, a display device according to an embodiment for solving the above technical problem will be specifically described.

[0149] Figure 10 Fig. a is a side view of a boundary region between display modules of a display device 700 according to a first embodiment (hereinafter, the 'first embodiment' will be abbreviated as the 'embodiment'). For example, Figure 11 is a side view of a boundary region between a first display module 700a and a second display module 700b.

[0150] The display device 700 according to the embodiment is a display device including a plurality of display modules.

[0151] For example, the above display device 700 can be manufactured by splicing a plurality of display modules. After the pitches PX between semiconductor light-emitting element assemblies 710 on adjacent display modules 700a and 700b are matched and closely arranged, the display device is manufactured by a fixed splicing method.

[0152] Refer to Figure 10 , the display device 700 according to the embodiment includes at least one of a first module substrate 701, a second module substrate 702, a semiconductor light-emitting element assembly 710, a side wiring 741, a wiring protective layer 742, a resin layer 790, a planarization film 750, a black matrix 720, an optical adhesive layer 760, a cover film 770, and a lower sealing layer 820.

[0153] For example, the display device 700 according to the embodiment includes a first module substrate 701 and a second module substrate 702 disposed below the first module substrate 701.

[0154] The above first module substrate 701 is a TFT substrate formed with TFTs (thin film transistors) and wirings, and the above second module substrate 702 is a PCB configured with circuits such as a voltage power supply for driving a timing controller, a memory, and a semiconductor light-emitting element assembly 710 or various wirings.

[0155] In addition, the above second module substrate 702 is a PCB formed with a driving unit that applies signals to the gate wiring and data wiring of the first module substrate 701 respectively. In this case, a plurality of wiring electrodes 721 and 722 are formed on the first module substrate 701 and the second module substrate 702.

[0156] In addition, according to the embodiment, TFTs, wirings, and various circuits are formed on the second module substrate 702, and the first module substrate 701 can be embodied as a protective substrate for protecting the TFTs and wirings.

[0157] In addition, the display device 700 of the embodiment may also include only one substrate, for example, only the first module substrate 701. In this case, the features related to the lower surface of the second module substrate 702 described later can be equally applied to the lower surface of the first module substrate 701.

[0158] A plurality of semiconductor light-emitting element assemblies 710 are arranged in an array form on the first module substrate 701. For example, a plurality of semiconductor light-emitting element assemblies 710 formed in a plurality of rows and columns are arranged on the first module substrate 701.

[0159] The semiconductor light-emitting element assembly 710 can adopt the technical features of the semiconductor light-emitting element 150 described above.

[0160] The plurality of semiconductor light-emitting element assemblies 710 are respectively arranged at a prescribed interval PX and function as one pixel, and at least one semiconductor light-emitting element is provided in the semiconductor light-emitting element assembly 710.

[0161] For example, when the pixel includes red (R), green (G), and blue (B) sub-pixels, the semiconductor light-emitting element assembly 710 may include a first semiconductor light-emitting element 710a that emits red light, a second semiconductor light-emitting element 710b that emits green light, and a third semiconductor light-emitting element 710c that emits blue light, but is not limited thereto.

[0162] For example, the first semiconductor light-emitting element 710a, the second semiconductor light-emitting element 710b, and the third semiconductor light-emitting element 710c are all elements that emit one color, for example, blue light, and a phosphor or QD (quantum dot) is arranged on the element to exhibit various colors through color conversion.

[0163] The embodiment includes wiring electrodes 721 electrically connected to the plurality of semiconductor light-emitting element assemblies 710 on the first module substrate 701.

[0164] In addition, a plurality of wiring electrodes (not shown) formed in a vertical direction with respect to the wiring electrodes 721 may also be formed on the first module substrate 701. For example, when the first module substrate 701w is a TFT substrate, the wiring electrodes 721 are embodied by data wirings or gate wirings, etc., and the wiring electrodes formed perpendicular to the wiring electrodes 721 are embodied by wirings different from the wiring electrodes 721.

[0165] According to an embodiment, the above wiring electrode 721 corresponds to a common electrode connected to the p-electrode or n-electrode of each of the plurality of semiconductor light-emitting elements 710.

[0166] On the other hand, the wiring electrode 721 formed on the first module substrate 701 is electrically connected to a voltage power supply or a circuit of the second module substrate 702, thereby receiving a signal related to the driving of the plurality of semiconductor light-emitting element assemblies 710 or receiving power.

[0167] The display device 700 according to the embodiment further includes a plurality of electrode pads (not shown) formed in an edge region on the upper surface of the first module substrate 701 and side electrodes 741 formed on the side surface of the display module. The plurality of electrode pads and the side electrodes 741 are formed of a conductive metal (such as Cu, Ag, etc.).

[0168] The above side electrodes 741 are respectively formed on the sides of the first module substrate 701 and the second module substrate 702. One end of the side electrode 741 is formed to be in contact with the side surface of the electrode pad on the first module substrate 701, and the other end is connected to a second wiring electrode 722 formed under the second module substrate 702.

[0169] In addition, after forming the semiconductor light-emitting element assembly 710 in the display device 700 according to the embodiment, the second module substrate 702 is bonded (adhered) to the lower part of the first module substrate 701, and a planarization layer 750 is formed on the first module substrate 701.

[0170] The above planarization layer 750 is formed to have a predetermined thickness so as to cover the upper surface of the first module substrate 701 and the semiconductor light-emitting element assembly 710. The planarization layer 750 provides a flat surface to the upper part of the display device 700 and fixes the position of the semiconductor light-emitting element assembly 710.

[0171] The above planarization layer 750 corresponds to an encapsulation layer for protecting the semiconductor light-emitting element assembly 710.

[0172] Such a planarization layer 750 is formed by processes such as molding or hot melt. For example, the planarization layer 750 can be embodied by an acrylic resin, a polyimide resin, an epoxy resin, a polyurethane resin, etc. as a light-transmitting or fluorescent material.

[0173] Next, the embodiment includes an optical adhesive layer 760 on the above planarization layer 750. The above optical adhesive layer 760 can be a transparent adhesive material such as OCA (Optical Clear Adhesive) or OCR (Optically Clear Resin), but is not limited thereto.

[0174] Next, the embodiment may include a thin film layer 770 on the above-mentioned optical adhesive layer 760. The above-mentioned thin film layer 770 includes various optical films such as a polarization film, an AG film, and an AR film for preventing a quality decline (such as a decline in black contrast, etc.) caused by external light incident on an electrode present on the upper surface of the first module substrate 701 being irradiated to the outside together with light emitted from the semiconductor light-emitting element.

[0175] On the other hand, according to the internal technology, there is a problem that the gap between display modules is recognized as a seam due to the gap between display modules. In particular, when the display device is converted to a black state, the seam is more obvious.

[0176] In addition, according to the internal technology, there is a problem that it is difficult to attach an adhesive layer or a front cover using OCA or the like due to the empty space between modules.

[0177] In addition, according to the internal technology, when attaching the front cover, the cover is bent due to the step (empty space) at the seam portion, resulting in a problem that the seam is more prominent.

[0178] In response to this, the display device 700 of the embodiment disposes a resin layer 790 on the first display module 700a and the second display module 700b to solve the above technical problems.

[0179] The above-mentioned resin layer 790 is a porous adhesive resin layer. For example, the porous adhesive resin layer of the embodiment uses at least one or more porous substances such as polyurethane foam or PP (Polypropylene), TPU (Thermo Plastic Polyurethane), TPO (Thermo Plastic Olefin), and styrofoam.

[0180] In addition, the porous adhesive resin layer of the embodiment further includes a urethane resin, a terpene resin, etc. as an adhesive substance. In addition, the embodiment further includes thermoplastic resins such as polystyrene, polyethylene, polypropylene, methacrylic acid, and acrylic acid, and is prepared by mixing a black pigment in the thermoplastic resin.

[0181] The resin layer 790 including the above-mentioned porous adhesive resin layer is applied as a seam light-absorbing layer by a soft porous substance, thereby having a technical effect of reducing seam recognition by absorbing reflection generated by external light in the porous space.

[0182] The above-mentioned porous adhesive resin layer is a foam series that forms an air layer with a porous substance and has a black color for absorbing light. In addition, the above-mentioned porous adhesive resin layer can use a foaming resin or an air-dispersed resin, etc.

[0183] The above-mentioned porous adhesive resin layer includes a soft resin and has elasticity, so that when it is compressed and fixed between the first display module 700a and the second display module 700b to match a specified pitch PX, instrumental damage can be prevented, and thus the pitch can be firmly maintained.

[0184] The thickness of the above-mentioned resin layer 790 is formed to be 200 μm or less, preferably 150 μm or less, but is not limited thereto.

[0185] The density of the above-mentioned resin layer 790 can be 0.15 to 0.4 g / cm3, but is not limited thereto.

[0186] In addition, the embodiment further includes a light-absorbing soft resin of polyurethane, epoxy, or silicone series.

[0187] In addition, in the embodiment, the above-mentioned resin layer 790 includes a viscoelastic resin layer. The viscoelastic resin layer of the above-mentioned embodiment includes materials such as epoxy or rubber.

[0188] In addition, the above-mentioned viscoelastic resin layer further includes a polyurethane resin as an adhesive substance, terpene resin, etc. In addition, the viscoelastic resin layer of the embodiment further includes thermoplastic resins such as polystyrene, polyethylene, polypropylene, methacrylic acid, and acrylic acid, and is prepared by mixing a black pigment in the thermoplastic resin.

[0189] The viscoelastic resin layer of the embodiment is applied to the joint light-absorbing layer to absorb the reflection generated by external light, thereby having the technical effect of reducing joint recognition.

[0190] Next, the embodiment includes a lower sealing layer 820 on the lower side of the interval between the adjacent first display module 700a and the second display module 700b.

[0191] The above-mentioned lower sealing layer 820 and the upper sealing layer 810 described in the subsequent manufacturing method together form a sealed space in the interval between the adjacent first display module 700a and the second display module 700b to uniformly fill the resin layer.

[0192] The above-mentioned lower sealing layer 820 is disposed in the lower interval between the first display module 700a and the second display module 700b before the module frame 705 is coupled to a plurality of modules.

[0193] Alternatively, the lower sealing layer 820 described above is disposed in the lower space between the first display module 700a and the second display module 700b in a state of being mounted on the connection frame 705a of the module frame 705.

[0194] The lower sealing layer 820 described above includes an adhesive film such as PSA, a cross-sectional tape, or a hot-melt material.

[0195] In addition, in another embodiment, the lower sealing layer 820 may be omitted to form a sealed space. For example, in another embodiment, when connecting the module frames 705, an O-ring or the like made of a rubber material is added to form a sealed space.

[0196] Next, Figure 11 is a side view of the boundary region between the display modules of the display device 702 according to the second embodiment.

[0197] The second embodiment may adopt the technical features of the first embodiment. Below, the description will focus on the features of the first embodiment.

[0198] In the second embodiment, the second lower sealing layer 822 is disposed in the lower space between the first display module 700a and the second display module 700b before the module frame 705 is coupled to a plurality of modules, and the second lower sealing layer 822 is spaced apart from the module frame 705.

[0199] For example, the second lower sealing layer 822 is disposed spaced apart from the connection frame 705a of the module frame 705.

[0200] Below, with reference to Figures 12a to 13 the manufacturing method of the display device 700 according to the embodiment will be described.

[0201] With reference to Figure 12a , in the embodiment, the lower sealing layer 820 is adhered to the lower side of the space between the adjacent first display module 700a and the second display module 700b.

[0202] The first display module 700a and the second display module 700b are in a state where a planarization film 750 is formed.

[0203] The lower sealing layer 820 described above includes an adhesive film such as PSA, a cross-sectional tape, or a hot-melt material.

[0204] The lower sealing layer 820 and the upper sealing layer 810 together form a sealed space in the space between the adjacent first display module 700a and the second display module 700b to uniformly fill the resin layer 790.

[0205] The lower sealing layer 820 described above is configured in the lower interval between the first display module 700a and the second display module 700b before the module frame 705 is coupled to a plurality of modules.

[0206] Alternatively, the lower sealing layer 820 described above is configured in the lower interval between the first display module 700a and the second display module 700b in a state of being mounted on the connection frame 705a of the module frame 705.

[0207] After that, an upper sealing layer 810 is bonded to the upper side of the interval between the adjacent first display module 700a and second display module 700b.

[0208] For example, the upper sealing layer 810 is bonded to the planarization films 750 of the adjacent first display module 700a and second display module 700b.

[0209] According to an embodiment, the upper sealing layer 810 and the lower sealing layer 820 together form a sealed space in the interval between the adjacent first display module 700a and second display module 700b, and the sealed space forms a micro flow path, so that the resin layer 790 is uniformly filled into the sealed space in a manner that is neither insufficient nor overflowing.

[0210] The upper sealing layer 810 includes an adhesive polymer such as a shaped protective film, PDMS, or polyurethane.

[0211] For example, the upper sealing layer 810 is closely attached to the planarization films 750 of the adjacent first display module 700a and second display module 700b to prevent the resin layer 790 from overflowing, and the lower sealing layer 820 is also closely attached to the wiring protective layer 742 disposed on the lower sides of the adjacent first display module 700a and second display module 700b to form a sealed space, so that the resin layer uniformly and rapidly fills the space in a manner that neither overflows nor leaves an empty space.

[0212] Next, Figure 12b is another illustrative view of the manufacturing method of the display device 700 of the first embodiment.

[0213] In the manufacturing method described above, the upper sealing layer 810 is in a state of being overall closely attached to the planarization films 750 of the adjacent first display module 700a and second display module 700b.

[0214] Conversely, Figure 12b Another manufacturing method is characterized in that the second upper sealing layer 810B is only bonded to a partial area of the spaced-apart interval area between the adjacent first display module 700a and second display module 700b.

[0215] According to an embodiment, after filling the resin layer 790 in the sealed space between the adjacent first display module 700a and the second display module 700b, the upper sealing layer 810 is removed, and then the optical adhesive layer 760 and the thin film layer 770 are attached to the planarization film 750.

[0216] Next, Figure 13 FIG. is an exemplary view of a manufacturing apparatus 800 of a display device according to an embodiment.

[0217] The manufacturing apparatus 800 of a display device according to an embodiment includes: a display device 700 including a plurality of display modules; an upper sealing layer 810 disposed on the plurality of display modules; a lower sealing layer 820 disposed under the plurality of display modules; and an injection device 850 configured to inject a resin material into a separated space formed by the upper sealing layer 810 and the lower sealing layer 820.

[0218] The display device 700 includes a first display module 700a, a second display module 700b, a third display module 700c, and a fourth display module 700d.

[0219] The injection device 850 for injecting the resin material includes a first injection device 851, a second injection device 852, a third injection device 853, and a fourth injection device 854.

[0220] At least one of the first injection device 851, the second injection device 852, the third injection device 853, and the fourth injection device 854 is an injection device for injecting the resin material.

[0221] In addition, at least one of the first injection device 851, the second injection device 852, the third injection device 853, and the fourth injection device 854 is a suction device.

[0222] In addition, at least one of the first injection device 851, the second injection device 852, the third injection device 853, and the fourth injection device 854 is an injection and pressurization device for the resin material. For example, at least one of the first injection device 851, the second injection device 852, the third injection device 853, and the fourth injection device 854 can pressurize while injecting the resin material.

[0223] For example, in the first manufacturing apparatus, the first injection device 851 is an injection and pressurization device for the resin material. The remaining second injection device 852, third injection device 853, and fourth injection device 854 are suction devices.

[0224] Alternatively, the first injection device 851 and the second injection device 852 in the second manufacturing device may be resin material injection and pressurization devices. The remaining third injection device 853 and fourth injection device 854 are suction devices.

[0225] Alternatively, the first injection device 851, the second injection device 852, and the third injection device 853 in the third manufacturing device are resin material injection and pressurization devices. The remaining fourth injection device 854 is a suction device.

[0226] Refer to Figure 12a and Figure 13 , in the embodiment, the upper sealing layer 810 and the lower sealing layer 820 together form a sealed space in the gap between the adjacent first display module 700a, second display module 700b, third display module 700c, and fourth display module 700d. Figure 12a Is a part of a cross-sectional view cut along Figure 13 the F1 - F2 line.

[0227] At this time, the resin material is injected and pressurized through at least one of the first injection device 851, the second injection device 852, the third injection device 853, and the fourth injection device 854.

[0228] For example, the resin material is injected and pressurized through the first injection device 851, and the remaining second injection device 852, third injection device 853, and fourth injection device 854 can be used for suction.

[0229] Alternatively, for example, the resin material is injected and pressurized through the first injection device 851, the second injection device 852, and the third injection device 851, and suction is performed through the fourth injection device 854.

[0230] For example, the upper sealing layer 810 and the lower sealing layer 820 are disposed in the space between the adjacent first display module 700a, second display module 700b, third display module 700c, and fourth display module 700d, and are respectively in close contact with the planarization film 750 and the wiring protection layer 742 to form a sealed space, thereby having a special technical effect of enabling the resin layer to uniformly and rapidly fill the space in a manner that neither overflows nor leaves an empty space.

[0231] In the internal technology, when the resin layer is filled without forming a resin layer in the sealed space of the upper sealing layer 810, there are problems such as filling the resin layer to the extent of overflowing the separated space or generating a V-shaped void space.

[0232] In addition, in order to maintain the pixel pitch, the internal technology makes the separation spaces of the display module different from each other, resulting in a problem that it is difficult to precisely fill the resin layer into the separation spaces by methods such as the dispensing method or the photolithography process for light leakage.

[0233] According to the embodiment, when forming the resin layer by using the sealing space of the upper sealing layer 810, due to the unit module manufacturing tolerance, a resin layer with a uniform and flat surface can be formed in the separation spaces between modules with non-fixed intervals each time. In the internal technology, the process time required for the photolithography process is about 2 hours, while when the embodiment is applied, the resin layer can be filled in about 10 seconds. Therefore, it has a special technical effect of being able to significantly improve the process steps.

[0234] In the embodiment, after filling the resin layer in the sealing space, an exposure process can be performed for specified hardening, and then the upper sealing layer 810 is removed. After that, the optical adhesive layer 760 and the thin film layer 770 can be attached on the planarization film 750.

[0235] Next, with reference to Figures 14a to 15b the technical effects of the display device 700 of the embodiment will be described.

[0236] Figure 14a A multi-screen display device 700 including a plurality of display panels of the embodiment is shown.

[0237] Figure 14b It is Figure 14a An exemplary surface photograph of the third region C3 of the display device 700 shown.

[0238] Figure 14c It is Figure 14a An exemplary surface photograph of the fourth region C4 of the display device 700 shown.

[0239] With reference to Figure 14a , the display device 700 of the embodiment can be embodied in a form of splicing a plurality of display panels 700a to 700d. For example, the above multi-screen display device 700 includes a first display panel 700a, a second display panel 700b, a third display panel 700c, and a fourth display panel 700d, but is not limited thereto. Each of the above plurality of display panels 700a to 700d can be a display device manufactured by the self-assembly method described above, but is not limited thereto.

[0240] With reference to Figure 14b , different from the Figure 7 display device 600 of the existing internal technology, it has a technical effect that the boundary regions between the plurality of display panels 700a to 700d are not recognized as seams.

[0241] For example, Figure 14b It isFigure 14a An exemplary surface photograph of the third region C3 of the display device 700 is shown, and the 3D contour profile data P3 of each component is displayed on the photograph.

[0242] Specifically, Figure 14b It is a surface photograph of the third boundary region C1 between the first display module 700a and the second display module 700b. With the resin layer 790 disposed between the adjacent first display module 700a and the second display module 700b, it has a special technical effect that its boundary line is not optically or visually recognized as a seam.

[0243] For example, the resin layer 790 of the embodiment is used as a soft porous material as a seam light-absorbing layer, so that the reflection caused by external light is absorbed by the porous space, thereby having a special technical effect of reducing seam recognition.

[0244] Next, according to the embodiment, the resin layer 790 is used as a medium to directly bond between the modules, and there is no gap between the modules itself, thereby having a technical effect of being able to achieve a perfect seamless.

[0245] In addition, according to the embodiment, the resin layer 790 such as a porous adhesive resin layer is used as a medium to directly bond between the modules, so that there is no need to fix the modules separately, and it has a technical effect of excellent structural reliability.

[0246] Next, Figure 14c is Figure 14a An exemplary surface photograph of the fourth region C4 of the display device 700 illustrated in

[0247] Specifically, Figure 14c It is a surface photograph of the fourth boundary region C4 between the first display module 700a and the second display module 700b. Even if there is a height difference between the upper surface 700aT of the first display module and the upper surface 700bT of the second display module to be spliced, with the resin layer 790 such as a porous adhesive resin layer disposed and used as a seam light-absorbing layer, the reflection caused by external light is scattered into the porous space and absorbed, thereby having a special technical effect of not being optically or visually recognized as a seam.

[0248] Next, Figure 15a is a side view of the boundary region between the display modules of the display device 703 according to the third embodiment, Figure 15b is about Figure 15a the 3D contour profile data of each component.

[0249] The display device 703 of the third embodiment may adopt the technical features of the above-mentioned first embodiment or second embodiment. Below, the features of the third embodiment will be mainly described.

[0250] According to the third embodiment, there are the following special technical effects: Even if surface steps are generated between the display modules as the gap between the display modules is filled, the problem of being optically recognized as a seam can be solved.

[0251] For example, the third embodiment includes an inclined second resin layer 792 disposed in the boundary region between the first display module 700a and the second display module 700b. The inclined surface 792S of the second resin layer 792 is substantially parallel to the connection line between the first planarization layer 750a on the first display module 700a and the second planarization layer 750b on the second display module 700b.

[0252] In addition, the inclined surface 792S of the second resin layer 792 is substantially flat.

[0253] In addition, for example, the inclined surface 792S of the second resin layer 792 is arranged not to cross the connection line between the first planarization layer 750a on the first display module 700a and the second planarization layer 750b on the second display module 700b.

[0254] Figure 15b Regarding Figure 15a the 3D profile file data of each component, even if there is a height difference between the upper surface 700aT of the first display module to be spliced and the upper surface 700bT of the second display module, with the inclined second resin layer 792 disposed, the step E-SS in the embodiment is covered by the inclined second resin layer 792, thus having the special technical effect of being able to solve the problem of being optically recognized as a seam.

[0255] The above description is only an illustrative description of the technical idea of the present invention. Those skilled in the art can make various modifications and deformations without departing from the essential characteristics of the present invention.

[0256] Therefore, the embodiments disclosed in the present invention are used to illustrate the technical idea of the present invention, rather than to limit the technical idea of the present invention. The scope of the technical idea of the present invention is not limited to such embodiments.

[0257] The protection scope of the present invention is interpreted by the following claims, and all technical ideas within the equivalent scope are included in the scope of the claims of the present invention.

[0258] Industrial Applicability

[0259] The embodiments can be applied to the field of displays for displaying images or information.

[0260] The embodiments can be applied to the field of displays that use semiconductor light-emitting elements to display images or information.

[0261] The embodiments can be applied to the field of displays that use micro-scale or nano-scale semiconductor light-emitting elements to display images or information.

Claims

1. A display device of a semiconductor light-emitting element, comprising: A substrate of a first display module and a substrate of a second display module, which are arranged adjacent to each other; A plurality of semiconductor light-emitting element assemblies, which are respectively arranged on the substrate of the first display module and the substrate of the second display module; A first side wiring and a second side wiring, which are respectively arranged on the sides of the substrate of the first display module and the substrate of the second display module and are electrically connected to the semiconductor light-emitting element assemblies; A lower sealing layer, which is arranged on the lower side between the substrate of the first display module and the substrate of the second display module; and A resin layer, which is arranged on the lower sealing layer between the substrate of the first display module and the substrate of the second display module.

2. The display device of a semiconductor light-emitting element according to claim 1, wherein The resin layer includes a resin layer with an inclined upper surface arranged in a boundary region between the first display module and the second display module.

3. The display device of a semiconductor light-emitting element according to claim 2, wherein The upper surface of the inclined resin layer is flat.

4. The display device of a semiconductor light-emitting element according to claim 3, wherein The upper surface of the inclined resin layer is parallel to a connection line between a first planarization layer on the first display module and a second planarization layer on the second display module.

5. The display device of a semiconductor light-emitting element according to claim 1, wherein The resin layer includes a porous adhesive resin layer.

6. The display device of a semiconductor light-emitting element according to claim 1, wherein The resin layer includes a viscoelastic resin layer.

7. A manufacturing device of a display device of a semiconductor light-emitting element, comprising: A display device, which includes a plurality of display modules; An upper sealing layer, which is arranged on the plurality of display modules; A lower sealing layer, which is arranged below the plurality of display modules; And An injection device, which injects a resin material into a separated space formed by the upper sealing layer and the lower sealing layer.

8. The manufacturing device of a display device of a semiconductor light-emitting element according to claim 7, wherein The injection device for injecting the resin material includes a plurality of injection devices, and Among them, at least one injection device of the plurality of injection devices includes an injection and pressurization device for injecting and pressurizing the resin material.

9. The manufacturing device of a display device of a semiconductor light-emitting element according to claim 7, wherein At least one injection device of the plurality of injection devices includes a suction device for sucking the resin material.

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