Crystalline silicon plate breaking equipment convenient to position

Abstract

The invention discloses crystal silicon plate breaking equipment convenient to position, and relates to the technical field of crystal silicon plate treatment, the crystal silicon plate breaking equipment comprises two symmetrically arranged conveying devices, two sets of transmission devices are arranged between the two conveying devices, and mounting frames are fixedly mounted on the two sides of the transmission devices; through the arrangement of the clamping metal block, when the crystal silicon plate is broken, the clamping metal block can be clamped at the scribing position of the crystal silicon plate, further support is provided for the breaking position of the crystal silicon plate, the clamping metal block is clamped at the pre-scribing position, physical support and stress guide can be provided for the crystal silicon plate, it is ensured that breaking is controllably carried out along the scribing position, and the breaking efficiency is improved. The fracture deviation problem caused by stress deviation is reduced, accidental crack growth in the fracture process can be limited through the supporting effect of the clamping metal block, extra cracks are prevented from being generated at defects such as grain boundaries and impurities, the plate fragmentation probability is reduced, and in addition, splashing fragments are reduced through centralized control over local stress in the crystalline silicon plate breaking process.

Description

Technical Field

[0001] The present invention relates to the technical field of crystalline silicon sheet processing, and particularly to a breaking device for crystalline silicon sheets that is convenient for positioning. Background Art

[0002] Crystalline silicon sheets are flat materials made of high-purity monocrystalline silicon or polycrystalline silicon, and are the core basic materials in the fields of photovoltaics, semiconductors, electronics, etc. To save costs, some crystalline silicon sheets are made of polycrystalline silicon. In the prior art, during the processing of polycrystalline silicon sheets, it is necessary to perform pre-scoring on the crystalline silicon sheets, and then use mechanical equipment to break the crystalline silicon sheets according to the pre-scored positions. If external forces (such as cutting, stamping) are directly applied to the crystalline silicon sheets, it may cause cracking or delamination due to excessive local stress. The breaking process reduces mechanical vibration and impact by controlling the stress point and fracture speed, and protects the integrity of the material surface and edges; When breaking crystalline silicon materials, the prior art is to directly fix one end of the crystalline silicon sheet, and then apply a downward pressure to the surface of the crystalline silicon sheet to complete the breaking process of the crystalline silicon sheet. When breaking, the breaking surface of polycrystalline silicon is usually not smooth, showing uneven granular or "ice crystal" - like textures. This is because polycrystalline silicon is composed of multiple small grains with random orientations, and the bonding force between grains is weak. During fracture, it spreads randomly along the grain boundaries, forming a rough cross-section. Moreover, during the breaking process of polycrystalline silicon sheets, one end of the crystalline silicon sheet (near the center of the crystalline silicon sheet) is usually fixed, and then when pressure is applied to the edge of the crystalline silicon sheet, the pre-scored line of the crystalline silicon sheet is located between the two. The breaking device only applies a downward pressure from one side. When the pressure is applied only from one side, the side of the crystalline silicon sheet close to the force application point will bear a large local stress, while the stress on the side far from the force application point is small. This uneven stress distribution causes the fracture to start spreading from the stress concentration area (near the force application point), rather than evenly breaking along the pre-scored line, resulting in a large stress concentration in the local area. The fracture in the non-pre-scored area will produce serrated edges or cracking notches, and at the same time, a large number of irregular fragments will be generated, affecting the subsequent use of the crystalline silicon sheet; In view of this, we propose a breaking device for crystalline silicon sheets that is convenient for positioning to solve the above problems. Summary of the Invention

[0003] Technical Problems to be Solved In view of the above, in view of the deficiencies of the prior art, the present invention provides a breaking device for crystalline silicon sheets that is convenient for positioning to solve the problems raised in the above background art.

[0004] Technical Solutions

[0005] To achieve the above object, the present invention provides the following technical solution: A breaking device for crystalline silicon plates that is convenient for positioning, including two symmetrically arranged conveying devices, and two sets of transmission devices are arranged between the two conveying devices. Installation frames are fixedly installed on both sides of the transmission device. An electric control cylinder I is fixedly installed on the installation frame. The output shaft at the bottom of the electric control cylinder I penetrates the installation frame, and the output shaft at the bottom of the electric control cylinder I is fixedly connected with a downward pressure metal plate. An electric control cylinder II is fixedly installed on the installation frame. The output shaft at the bottom of the electric control cylinder II penetrates the installation frame, and the output shaft at the bottom of the electric control cylinder II is fixedly connected with a positioning roller. A guiding rod is fixedly installed on the top of the downward pressure metal plate. The downward pressure metal plate is slidably connected to the inside of the installation frame through the guiding rod. It also includes an auxiliary breaking component arranged on the positioning roller; The auxiliary breaking component includes positioning connecting rods fixedly connected at equal intervals on the outer surface of the positioning roller close to the downward pressure metal plate. One end of the positioning connecting rod away from the positioning roller is rotatably connected with a driven connecting rod in a damped manner. The other ends of the driven connecting rods away from the positioning connecting rods are commonly fixedly connected with a hollow limiting plate. A clamping metal block is slidably connected inside the hollow limiting plate. Metal round rods are fixedly connected at equal intervals to the top of the clamping metal block. Positioning springs are sleeved on the outer surfaces of the metal round rods. Spring telescopic rods are rotatably connected at equal intervals to the outer surface of the top of the hollow limiting plate. Auxiliary wheels are spherically hinged at equal intervals to the outer surface of the bottom of the hollow limiting plate close to the positioning roller.

[0006] Preferably, the included angle between the positioning connecting rod and the driven connecting rod is obtuse. The hollow limiting plate is inclined downward toward the downward pressure metal plate with reference to the vertical plane where the positioning roller is located. The top of the metal round rod penetrates and extends to the top of the hollow limiting plate. The positioning spring is arranged inside the hollow limiting plate. One end of the spring telescopic rod away from the hollow limiting plate is rotatably connected with the outer surface of the top of the positioning roller. The auxiliary wheel is inclined toward the positioning roller with reference to the plane where the hollow limiting plate is located.

[0007] Preferably, it also includes an auxiliary positioning component arranged on the installation frame; The auxiliary positioning component includes a positioning ring fixedly connected to the guiding rod on the top of the downward pressure metal plate. A connecting rack is fixedly connected to the outer surface of the positioning ring. A helical gear is engaged with the outer surface of the bottom of the connecting rack. A rotating wheel is fixedly connected to the bottom of the helical gear. A driven rack is engaged with the side tooth surface of the rotating wheel. The bottom of the rotating wheel is rotatably connected with a support base. One end of the driven rack facing the positioning roller is slidably connected with a limiting sleeve. A pressing plate is fixedly connected to the end of the limiting sleeve away from the driven rack. Connecting springs are fixedly connected to the outer surfaces of both sides of the bottom of the pressing plate.

[0008] Preferably, the bottom of the rotating wheel is rotatably connected to the center of the support base. The support base is fixedly connected to the upper surface of the installation frame. A through groove adapted to the size of the connecting rack is opened inside the installation frame. The inside of the limiting sleeve is hollow. A chute adapted to the size of the pressing plate is opened inside the installation frame.

[0009] Preferably, a limiting spring is arranged inside the limiting sleeve. One end of the driven rack arranged inside the limiting sleeve is fixedly connected to the limiting spring. Both ends of the pressing plate are slidably connected to the inside of the mounting frame through sliding grooves, and the connecting spring is arranged inside the sliding grooves.

[0010] Preferably, it further includes a sealing component arranged on the pressing plate; The sealing component includes telescopic sleeves symmetrically and fixedly installed on both sides of the pressing plate. Auxiliary plates are fixedly connected to the tops of the telescopic sleeves. A special-shaped plate is fixedly connected to the outer surface of the lower pressing metal plate close to the positioning roller; One end of the telescopic sleeve away from the pressing plate is fixedly connected to the outer surface of the mounting frame, and the side surface of the telescopic sleeve is attached to the outer surface of the lower pressing metal plate.

[0011] Preferably, it further includes a collecting component arranged on the pressing plate; The collecting component includes an inclined pushing plate fixedly connected to the outer surface of the pressing plate close to the lower pressing metal plate. A shielding plate is fixedly connected to the outer surface of the bottom end of the inclined pushing plate away from the pressing plate. Vertical guiding plates are fixedly connected to the outer surface of the bottom end of the inclined pushing plate at equal intervals. A hollowed-out supporting plate is fixedly connected to the outer surface of the mounting frame.

[0012] Preferably, a hollowed-out groove is penetrated and opened inside the hollowed-out supporting plate close to the lower pressing metal plate. Through grooves are penetrated and opened at equal intervals inside the hollowed-out supporting plate close to the pressing plate. The bottom end of the shielding plate is slidably connected to the upper surface of the hollowed-out supporting plate.

[0013] Preferably, the vertical guiding plates are horizontally slidably connected to the through grooves opened inside the hollowed-out supporting plate.

[0014] Beneficial effects

[0015] Compared with the prior art, the present invention provides a breaking device for crystalline silicon plates that is convenient for positioning, and has the following beneficial effects: Through the setting of the clamping metal block, when breaking the crystalline silicon plate, it can be clamped at the scribed line on the crystalline silicon plate, providing further support for the breaking position of the crystalline silicon plate. The clamping metal block is clamped at the pre-scribed line, which can provide physical support and stress guidance for the crystalline silicon plate, ensuring that the fracture proceeds controllably along the scribed line position, reducing the fracture deviation problem caused by stress deviation. The supporting effect of the clamping metal block can limit the accidental crack propagation during the fracture process, avoid generating additional cracks from defects (such as grain boundaries, impurities), reduce the probability of plate fragmentation. In addition, by controlling the local stress concentration during the breaking process of the crystalline silicon plate, the generation of flying fragments is reduced; Through the setting of the extrusion plate, during the process of breaking the crystalline silicon plate, the edge of the crystalline silicon plate can be extruded to ensure that the edge of the crystalline silicon plate is in the same horizontal plane during the breaking process, avoiding the skew of the crystalline silicon plate, thereby realizing the positioning during the breaking process of the crystalline silicon plate. The extrusion plate corrects the tilt of the crystalline silicon plate caused by its own gravity or uneven stress by uniformly applying an external force, forcing the edge to remain in the preset plane, thereby guiding the fracture to proceed along the pre-scored line; Through the dual settings of the clamping metal block and the extrusion plate, during the process of breaking the crystalline silicon plate, the force at the scored line of the crystalline silicon plate is in a balanced state. The clamping metal block disperses the concentrated stress at the pre-scored line through local rigid support, and the extrusion plate avoids the edge cracking or delamination of the plate due to uneven stress by uniformly applying pressure. Under the dual action, the dynamic impact during the fracture of the plate is reduced, and the generation of edge fractures or microcracks is reduced; Through the settings of the auxiliary plate and the special-shaped plate, during the process of breaking the crystalline silicon plate, a protective layer can be formed outside the crystalline silicon plate to absorb and restrain the impact energy generated by the fracture of the plate at the moment of breaking, inhibiting the high-speed flying of fragments. At the same time, the protective layer can cover the entire path of the plate fracture to form a physical barrier. In addition, the protective layer confines the fragments generated by the fracture within a controllable range, avoiding the waste of resources caused by the flying of fragments everywhere; Through the settings of the inclined push plate, the baffle plate and the hollowed-out support plate, the waste of the crystalline silicon plate after the breaking process can be quickly collected, and the inclined settings of the inclined push plate and the baffle plate can buffer the impact force at the moment after the fracture of the waste of the crystalline silicon plate. At the same time, as the batch breaking process of the crystalline silicon plate progresses, the inclined push plate and the baffle plate can further clean the waste of the crystalline silicon plate remaining on the hollowed-out support plate. The inclined push plate and the baffle plate can periodically push the waste to prevent it from accumulating on the hollowed-out support plate; BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall external structure of the present invention; Figure 2 For the present invention Figure 1 is a schematic diagram of the structure from another perspective; Figure 3 is a schematic diagram of the positional relationship at the lower pressing metal plate of the present invention; Figure 4 For the present invention Figure 3 is an enlarged schematic diagram of the structure at A in the present invention; Figure 5 is a schematic diagram of the positional relationship at the installation frame of the present invention; Figure 6 For the present invention Figure 5 is an enlarged schematic diagram of the structure at B in the present invention; Figure 7 For the present invention Figure 5 is an enlarged schematic diagram of the structure at C in the present invention; Figure 8 Schematic diagram of the connection relationship at the positioning ring of the present invention; Figure 9 Schematic diagram of the positional relationship at the extrusion plate of the present invention; Figure 10 Schematic diagram of the connection relationship at the hollow pallet of the present invention; Figure 11 Schematic diagram of the positional relationship at the connecting rack of the present invention; Figure 12 For the present invention Figure 11 Enlarged schematic diagram of the structure at position D in; Figure 13 Schematic diagram of the positional relationship at the clamping metal block of the present invention.

[0017] In the figure: 11, conveying device; 12, transmission device; 13, installation frame; 14, electric control cylinder I; 15, pressing metal plate; 16, electric control cylinder II; 17, positioning roller; 21, positioning connecting rod; 22, driven connecting rod; 23, hollow limiting plate; 24, clamping metal block; 25, metal round rod; 26, positioning spring; 27, spring telescopic rod; 28, auxiliary wheel; 31, positioning ring; 32, connecting rack; 33, helical gear; 34, runner; 35, driven rack; 36, support base; 37, limiting sleeve; 38, extrusion plate; 39, connecting spring; 41, telescopic sleeve; 42, auxiliary plate; 43, special-shaped plate; 51, inclined push plate; 52, shielding plate; 53, vertical guiding plate; 54, hollow pallet; 5501, hollow groove; 5502, through groove. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiments of the present invention Please refer to Figures 1 to 5 , Figure 7 and Figure 9, A breaking device for crystalline silicon plates that is convenient for positioning, including two symmetrically arranged conveying devices 11. There are two groups of transmission devices 12 arranged between the two conveying devices 11. Installation frames 13 are fixedly installed on both sides of the transmission device 12. An electric control cylinder 14 is fixedly installed on the installation frame 13. The output shaft at the bottom of the electric control cylinder 14 penetrates through the installation frame 13. The output shaft at the bottom of the electric control cylinder 14 is fixedly connected to a pressing metal plate 15. An electric control cylinder 16 is fixedly installed on the installation frame 13. The output shaft at the bottom of the electric control cylinder 16 penetrates through the installation frame 13. The output shaft at the bottom of the electric control cylinder 16 is fixedly connected to a positioning roller 17. A guide rod is fixedly installed on the top of the pressing metal plate 15. The pressing metal plate 15 is slidably connected to the inside of the installation frame 13 through the guide rod. It further includes an auxiliary breaking component arranged on the positioning roller 17; The auxiliary breaking component includes positioning connecting rods 21 fixedly connected to the outer surface of the positioning roller 17 near the pressing metal plate 15 at equal intervals. The ends of the positioning connecting rods 21 far from the positioning roller 17 are all rotatably connected to driven connecting rods 22 in a damping manner. The ends of the driven connecting rods 22 far from the positioning connecting rods 21 are jointly fixedly connected to a hollow limiting plate 23. A clamping metal block 24 is slidably connected inside the hollow limiting plate 23. Metal round rods 25 are fixedly connected to the top of the clamping metal block 24 at equal intervals. Positioning springs 26 are sleeved on the outer surfaces of the metal round rods 25. Spring telescopic rods 27 are rotatably connected to the outer surface of the top of the hollow limiting plate 23 at equal intervals. Auxiliary wheels 28 are spherically hinged to the outer surface of the bottom of the hollow limiting plate 23 near the positioning roller 17 at equal intervals.

[0020] Among them, the angle between the positioning connecting rod 21 and the driven connecting rod 22 is an obtuse angle. The hollow limiting plate 23 is inclined towards the pressing metal plate 15 with the vertical plane where the positioning roller 17 is located as a reference. The top of the metal round rod 25 penetrates and extends to the top of the hollow limiting plate 23. The positioning spring 26 is arranged inside the hollow limiting plate 23. The end of the spring telescopic rod 27 far from the hollow limiting plate 23 is rotatably connected to the outer surface of the top of the positioning roller 17. The auxiliary wheel 28 is inclined towards the positioning roller 17 with the plane where the hollow limiting plate 23 is located as a reference.

[0021] Among them, the height of the bottom end of the clamping metal block 24 is lower than the height of the bottom end of the positioning roller 17. The clamping metal block 24 is wider at the top and narrower at the bottom. The size of the bottom end of the clamping metal block 24 is smaller than the width of the scribed line on the crystalline silicon plate.

[0022] Among them, the auxiliary wheel 28 is used to keep the hollow limiting plate 23 moving stably on the crystalline silicon plate and avoid deviation.

[0023] Further embodiments Please refer to Figure 5 、 Figure 6 And Figures 8 to 12 , The breaking device for crystalline silicon plates that is convenient for positioning further includes an auxiliary positioning component arranged on the installation frame 13; The auxiliary positioning assembly includes a positioning ring 31 fixedly connected to the guiding rod on the top of the pressing metal plate 15. A connecting rack 32 is fixedly connected to the outer surface of the positioning ring 31. A helical gear 33 is meshed with the outer surface of the bottom end of the connecting rack 32. A runner 34 is fixedly connected to the bottom end of the helical gear 33. A driven rack 35 is meshed with the side tooth surface of the runner 34. The bottom end of the runner 34 is rotatably connected to a support base 36. One end of the driven rack 35 facing the positioning roller 17 is slidably connected to a limiting sleeve 37. A pressing plate 38 is fixedly connected to the end of the limiting sleeve 37 away from the driven rack 35. Connecting springs 39 are fixedly connected to the outer surfaces of both sides of the bottom end of the pressing plate 38.

[0024] Among them, the bottom end of the runner 34 is rotatably connected to the center of the support base 36. The support base 36 is fixedly connected to the upper surface of the mounting frame 13. A through groove adapted to the size of the connecting rack 32 is formed inside the mounting frame 13. The inside of the limiting sleeve 37 is hollow. A sliding groove adapted to the size of the pressing plate 38 is formed inside the mounting frame 13.

[0025] Among them, a limiting spring is arranged inside the limiting sleeve 37. One end of the driven rack 35 arranged inside the limiting sleeve 37 is fixedly connected to the limiting spring. Both ends of the pressing plate 38 are slidably connected to the inside of the mounting frame 13 through the sliding grooves, and the connecting spring 39 is arranged inside the sliding grooves.

[0026] Further embodiments Please refer to Figure 3 、 Figure 9 and Figure 10 , the breaking device for crystalline silicon plates facilitating positioning further includes a closing assembly arranged on the pressing plate 38; The closing assembly includes telescopic sleeves 41 symmetrically and fixedly installed on both sides of the pressing plate 38. Auxiliary plates 42 are fixedly connected to the top ends of the telescopic sleeves 41. A special-shaped plate 43 is fixedly connected to the outer surface of the pressing metal plate 15 close to the positioning roller 17; One end of the telescopic sleeve 41 away from the pressing plate 38 is fixedly connected to the outer surface of the mounting frame 13, and the side surface of the telescopic sleeve 41 is attached to the outer surface of the pressing metal plate 15.

[0027] Among them, the special-shaped plate 43 is composed of two horizontal plates with different vertical heights and an inclined plate connecting the two horizontal plates, and the angles between the horizontal plates and the inclined plate are both obtuse angles.

[0028] Further embodiments Please refer to Figure 9 、 Figure 10 and Figure 13 , the breaking device for crystalline silicon plates facilitating positioning further includes a collecting assembly arranged on the pressing plate 38; The collection component includes an inclined push plate 51 fixedly connected to the outer surface of the extrusion plate 38 near the lower pressing metal plate 15. A shielding plate 52 is fixedly connected to the outer surface of the bottom end of the inclined push plate 51 away from the extrusion plate 38. Vertically guiding plates 53 are fixedly connected to the outer surface of the bottom end of the inclined push plate 51 at equal intervals. A hollowed-out support plate 54 is fixedly connected to the outer surface of the installation frame 13.

[0029] Among them, a hollowed-out groove 5501 is penetrated and opened inside the hollowed-out support plate 54 near the lower pressing metal plate 15. Through grooves 5502 are penetrated and opened inside the hollowed-out support plate 54 near the extrusion plate 38 at equal intervals. The bottom end of the shielding plate 52 is slidably connected to the upper surface of the hollowed-out support plate 54.

[0030] Among them, the vertically guiding plates 53 are horizontally slidably connected to the through grooves 5502 opened inside the hollowed-out support plate 54.

[0031] The working process and principle of the overall content of the above embodiments are as follows: The staff places the silicon wafer sheet to be processed on the conveying device 11. The silicon wafer sheet is conveyed to the transmission device 12 via the conveying device 11. Subsequently, the staff starts the electric control cylinder one 14 and the electric control cylinder two 16, prompting the positioning roller 17 fixedly connected to the bottom end of the electric control cylinder two 16 to fix the edge of the silicon wafer sheet on the upper surface of the transmission device 12. The lower pressing metal plate 15 fixedly connected to the bottom end of the electric control cylinder one 14 breaks the edge of the silicon wafer sheet, completing the breaking process of the silicon wafer sheet. It should be noted that, as shown in the figure, there are four groups of breaking components in the breaking equipment for the silicon wafer sheet, that is, the equipment can break four silicon wafer sheets simultaneously. It should be noted that in the above process, the start and operation of the conveying device 11, the transmission device 12, the electric control cylinder one 14, and the electric control cylinder two 16 are all prior arts, so no more details will be described here. In addition, before the silicon wafer sheet is broken, a scribing process needs to be carried out on its upper surface to determine the breaking position of the silicon wafer sheet. And the scribing position on the silicon wafer sheet is between the lower pressing metal plate 15 and the positioning roller 17. The scribing position of the silicon wafer sheet is not on the transmission device 12, that is, the scribing position of the silicon wafer sheet is in a suspended state. Specifically, both the conveying device 11 and the transmission device 12 are composed of multiple conveying rollers. The conveying rollers are connected by a transmission belt. And one of the conveying rollers is fixedly connected to the output shaft end of the motor. When the motor starts, the conveying rollers rotate, and then through the transmission belt, multiple conveying rollers rotate synchronously, so that the conveying device 11 and the transmission device 12 convey the silicon wafer sheet to the designated position. Moreover, during the transmission of crystalline silicon plates, due to the certain weight of the crystalline silicon plates themselves, when the staff starts the motor and conveys the crystalline silicon plates to the breaking position through the conveying device 11 and the transmission device 12, the relatively large size of the crystalline silicon plates themselves will keep their original positions during the conveying process, that is, the positions where the staff places the crystalline silicon plates on the conveying device 11 and the transmission device 12, thereby avoiding the deviation of the crystalline silicon plates during the conveying process. In addition, the conveying of the crystalline silicon plates by the conveying device 11 and the transmission device 12 are both prior arts, so no more details will be given here. During the above process, as the second electric control cylinder 16 starts to drive the positioning roller 17 to press down until the positioning roller 17 contacts the upper surface of the crystalline silicon plate, the hollow limiting plate 23 fixedly installed with the positioning roller 17 through the positioning connecting rod 21 and the driven connecting rod 22 will press down accordingly. At the same time, the clamping metal block 24 slidably connected inside the hollow limiting plate 23 will also press down accordingly. It should be noted that the bottom height of the clamping metal block 24 is lower than the bottom height of the positioning roller 17. Therefore, before the positioning roller 17 contacts the crystalline silicon plate, the clamping metal block 24 will first contact the upper surface of the crystalline silicon plate. At the same time, the auxiliary wheel 28 spherically hinged to the outer surface of the bottom end of the hollow limiting plate 23 will also contact the upper surface of the crystalline silicon plate simultaneously. After the bottom end of the clamping metal block 24 contacts the top surface of the crystalline silicon plate, the positioning roller 17 will continue to move downward under the action of the second electric control cylinder 16. During the above process, along with the continuous movement of the positioning roller 17, the bottom end of the clamping metal block 24 will move on the upper surface of the crystalline silicon plate in a direction away from the positioning roller 17. During this process, the movement of the clamping metal block 24 is affected by the downward pressure of the positioning roller 17 and the upper surface of the crystalline silicon plate. Since the position of the crystalline silicon plate is fixed, with the continuous movement of the positioning roller 17, the driven connecting rod 22 fixedly connected to the hollow limiting plate 23 will move in a direction away from the positioning roller 17 with its connection point with the positioning connecting rod 21 as the fulcrum. The movement of the hollow limiting plate 23 will synchronously drive the movement of the clamping metal block 24 until the bottom end of the clamping metal block 24 moves to the scribed line on the upper surface of the crystalline silicon plate and the bottom end of the clamping metal block 24 is stuck inside the scribed line. It should be noted that the clamping metal block 24 is wider at the top and narrower at the bottom. The bottom size of the clamping metal block 24 is smaller than the width of the scribed line on the crystalline silicon plate. At the same time, the scribed line on the crystalline silicon plate has a certain depth to ensure the breaking treatment effect of the crystalline silicon plate, which is sufficient for the bottom end of the clamping metal block 24 to be stuck in. After the clamping metal block 24 is clamped on the crystalline silicon plate, as the positioning roller 17 continues to press down, the clamping metal block 24 is restricted by the crystalline silicon plate and cannot continue to move on the upper surface of the crystalline silicon plate. Therefore, the position of the hollow limiting plate 23 cannot continue to move. As the positioning roller 17 presses down, the included angles between the positioning connecting rod 21 and the driven connecting rod 22 between the hollow limiting plate 23 and the positioning roller 17 will gradually decrease. At the same time, the spring telescopic rod 27 rotatably connected to the top of the hollow metal plate will be synchronously squeezed and in a contracted state; During the above process, when the hollow limiting plate 23 moves, the clamping metal block 24 will always be in a fitting state with the crystalline silicon plate on the upper surface of the crystalline silicon plate under the action of the positioning spring 26 and the metal round rod 25. At this time, the positioning spring 26 is in a compressed state. When the clamping metal block 24 moves to the scribed line, the clamping metal block 24 will extend out of the inside of the hollow limiting plate 23 under the extended state of the positioning spring 26 until it is clamped into the scribed line of the crystalline silicon plate; At the same time, the movement of the hollow limiting plate 23 on the crystalline silicon plate is restricted by the auxiliary wheel 28. The auxiliary wheel 28 is used to keep the hollow limiting plate 23 moving stably on the crystalline silicon plate and avoid deviation; When the clamping metal block 24 is inserted into the pre-scribed line of the crystalline silicon plate, at the edge of the crystalline silicon plate, the positioning roller 17 applies a clamping force to the edge of the crystalline silicon plate, and the pressing metal plate 15 applies a downward extrusion force to the crystalline silicon plate. At this time, the pre-scribed line position of the crystalline silicon plate is located between the positioning roller 17 and the pressing metal plate 15. At this time, the force on the crystalline silicon plate is analyzed. To ensure the breaking process of the crystalline silicon plate, the pre-scribed line position of the crystalline silicon plate is in a suspended state at this time. When the pressing metal plate 15 applies pressure, the acting force of the pressing metal plate 15 acts preferentially on the contact position between the pressing metal plate 15 and the crystalline silicon plate. At this time, the side of the crystalline silicon plate close to the force application point will bear a large local stress, while the stress on the side far from the force application point is small. When applying unilateral pressure, the stress direction may form an angle (θ) with the pre-scribed line direction, resulting in the crack propagation path deviating from the pre-scribed line. According to the maximum circumferential stress criterion in fracture mechanics, the crack will propagate along the direction perpendicular to the maximum principal stress (σ1), that is, θ = 1 / 2 arctan(σ1 / σ2), where σ1 and σ2 are the maximum and minimum principal stresses respectively. When applying unilateral pressure, the direction of σ1 is inconsistent with the pre-scribed line, resulting in crack deflection; When the clamping metal block 24 is clamped at the pre-scribed line, its sharp edge or specific shape will form an artificial stress concentration point (similar to a "crack source") at the pre-scribed line position. When an external pressure is applied, the stress will be concentrated preferentially in the pre-scribed line area in contact with the clamping metal block 24, prompting the crack to start from the pre-scribed line and expand along the pre-scribed line direction. The shape design of the clamping metal block 24 can limit the crack propagation path, thereby avoiding the situation of edge cracking during the breaking process of the crystalline silicon plate; By setting the clamping metal block 24, during the breaking process of the crystalline silicon plate, it can be clamped at the scribed position on the crystalline silicon plate to provide further support for the breaking position of the crystalline silicon plate. The clamping metal block 24 is clamped at the pre-scribed line, which can provide physical support and stress guidance for the crystalline silicon plate, ensuring that the fracture proceeds controllably along the scribed position, reducing the fracture offset problem caused by stress deviation. The supporting effect of the clamping metal block 24 can limit the accidental crack propagation during the fracture process, avoid generating additional cracks from defects (such as grain boundaries, impurities), and reduce the probability of the plate breaking into pieces. In addition, by controlling the local stress concentration during the breaking process of the crystalline silicon plate, the generation of flying fragments is reduced; Subsequently, the staff drives the pressing metal plate 15 to descend through the electric control cylinder 14, and finally contacts the outer surfaces at both ends of the crystalline silicon plate, thereby performing the breaking process on the crystalline silicon plate; During the above process, as the pressing metal plate 15 descends, the positioning ring 31 fixedly connected to the guide rod of the pressing metal plate 15 will move downward accordingly, and drive the connecting rack 32 fixedly connected to its outer surface to move downward synchronously. Since the connecting rack 32 is set as an inclined rack, the helical gear 33 meshing with it will rotate under the action of the connecting rack 32, thereby driving the runner 34 fixedly connected to it to rotate on the support base 36 through the rotation of the helical gear 33; Through the meshing between the driven rack 35 and the runner 34, the driven rack 35 will move on the support base 36 in the direction close to the positioning roller 17 under the action of the runner 34. The movement of the driven rack 35 will cause the pressing plate 38 to move towards the edge of the crystalline silicon plate through the limiting sleeve 37. During the movement of the pressing plate 38, the connecting springs 39 arranged at both ends of it will be compressed synchronously until the pressing plate 38 contacts the edge of the crystalline silicon plate. It should be noted that when the pressing plate 38 is already in contact with the edge of the crystalline silicon plate but the pressing metal plate 15 is still in the descending state, the driven rack 35 will continue to move towards the crystalline silicon plate under the action of the runner 34. At this time, the movement of the driven rack 35 will squeeze the limiting spring arranged inside the limiting sleeve 37, and the position of the pressing plate 38 still closely adheres to the edge of the crystalline silicon plate under the action of the driven rack 35; It should be noted that the settings of the connecting rack 32, the helical gear 33, the runner 34, and the driven rack 35 are to ensure that the limitation of the edge of the crystalline silicon plate by the pressing plate 38 is always in synchronization with the pressing metal plate 15, without the need to use complex sensing devices and additional drive sources to prompt the pressing plate 38 to apply a clamping operation to the edge of the crystalline silicon plate; As the pressing metal plate 15 contacts the upper surface of the crystalline silicon plate, the breaking process of the crystalline silicon plate is carried out; Through the arrangement of the extrusion plate 38, during the process of breaking the crystalline silicon plate, the edge of the crystalline silicon plate can be extruded to ensure that the edge of the crystalline silicon plate is in the same horizontal plane during the breaking process, avoiding the skew of the crystalline silicon plate, thereby realizing the positioning during the breaking process of the crystalline silicon plate. The extrusion plate 38 corrects the inclination of the crystalline silicon plate caused by its own gravity or uneven stress by uniformly applying an external force, forcing the edge to remain in the preset plane, thereby guiding the fracture along the pre-scribed line; Through the dual arrangements of the clamping metal block 24 and the extrusion plate 38, during the process of breaking the crystalline silicon plate, the force at the scribed line of the crystalline silicon plate is in a balanced state. The clamping metal block 24 disperses the concentrated stress at the pre-scribed line through local rigid support, and the extrusion plate 38 avoids the cracking or delamination of the plate edge caused by uneven stress through uniform pressure. Under the dual actions, the dynamic impact during the fracture of the plate is reduced, and the generation of edge fractures or microcracks is reduced; Meanwhile, during the process of the extrusion plate 38 moving towards the edge of the crystalline silicon plate, the telescopic sleeve 41 fixedly connected between the extrusion plate 38 and the mounting frame 13 will be synchronously squeezed and in a contracted state. As the telescopic sleeve 41 contracts, the auxiliary plate 42 fixedly connected to the top of the telescopic sleeve 41 will also move towards the edge of the crystalline silicon plate, and when the surface of the extrusion plate 38 fits the edge of the crystalline silicon plate, the auxiliary plate 42 is located on both sides of the crystalline silicon plate, further limiting the position of the crystalline silicon plate; During the above process, as the pressing metal plate 15 presses down, the special-shaped plate 43 fixedly connected to the pressing metal plate 15 will descend accordingly until the special-shaped plate 43 is above the crystalline silicon plate. It should be noted that the special-shaped plate 43 is composed of two horizontal plates with different vertical heights and an inclined plate connecting the two horizontal plates, and the included angles between the horizontal plate and the inclined plate are all obtuse angles. Therefore, after the auxiliary plate 42 restricts both sides of the crystalline silicon plate, the special-shaped plate 43 will be above the crystalline silicon plate. During the process of the pressing metal plate 15 breaking the crystalline silicon plate, a protective layer is formed at the edge of the breaking position of the crystalline silicon plate to avoid the flying of debris during the breaking process of the crystalline silicon plate; Through the arrangements of the auxiliary plate 42 and the special-shaped plate 43, during the process of breaking the crystalline silicon plate, a protective layer can be formed outside the crystalline silicon plate, which absorbs and restricts the impact energy generated by the fracture of the plate at the moment of breaking, inhibits the high-speed flying of fragments. At the same time, the protective layer can cover the entire path of the plate fracture to form a physical barrier. In addition, the protective layer restricts the fragments generated by the fracture within a controllable range to avoid the waste of resources caused by the flying of fragments everywhere; During the above process, as the moving plate of the pressing plate 38 moves, the inclined pushing plate 51 fixedly connected to the bottom end of the pressing plate 38 will move accordingly. The inclined pushing plate 51 will also drive the shielding plate 52 fixedly connected to its bottom end to move horizontally on the hollowed-out support plate 54 in the direction of the positioning roller 17. At the same time, the vertical guiding plate 53 fixedly connected to the bottom end of the inclined pushing plate 51 will also move horizontally on the hollowed-out support plate 54. When the pressing plate 38 is in contact with the outer surface edge of the crystalline silicon plate, the horizontally moving shielding plate 52 will block the hollowed-out groove 5501 opened on the hollowed-out support plate 54. The inclined pushing plate 51, the shielding plate 52, and the hollowed-out plate will form a collection bin at the bottom of the breakage of the crystalline silicon plate to collect the waste materials that fall after the crystalline silicon plate is broken off; Moreover, after the waste materials of the broken crystalline silicon plate fall, they will contact the inclined planes of the inclined pushing plate 51 and the shielding plate 52. The inclined pushing plate 51 and the shielding plate 52 will buffer the gravity of the falling waste materials, and then fall onto the hollowed-out support plate 54 along the inclined planes of the inclined pushing plate 51 and the shielding plate 52, thereby collecting the processed waste materials; With the completion of the breaking process, the above structure will move in the reverse direction according to the above process under the action of the retraction of the output shafts of the electric control cylinder one 14 and the electric control cylinder two 16, so as to release the fixation of the crystalline silicon plate. In addition, with the movement of the inclined pushing plate 51 and the shielding plate 52, the hollowed-out groove 5501 on the hollowed-out support plate 54 will gradually be exposed. The waste materials originally on the hollowed-out support plate 54 will fall from the hollowed-out support plate 54, and the staff can place a collection device at the bottom of the hollowed-out support plate 54 to collect the waste materials generated during the breaking process. Moreover, with the breaking process of the next crystalline silicon plate and the continuous movement of the inclined pushing plate 51 and the shielding plate 52, the waste materials that have not fallen on the hollowed-out support plate 54 will be pushed to the hollowed-out groove 5501, further completing the collection of waste materials; Through the settings of the inclined pushing plate 51, the shielding plate 52, and the hollowed-out support plate 54, the waste materials of the crystalline silicon plate after the breaking process can be quickly collected. The inclined settings of the inclined pushing plate 51 and the shielding plate 52 can buffer the instantaneous impact force after the breakage of the crystalline silicon plate waste materials. At the same time, with the batch breaking process of the crystalline silicon plate, the inclined pushing plate 51 and the shielding plate 52 can further clean the waste materials of the crystalline silicon plate remaining on the hollowed-out support plate 54. The inclined pushing plate 51 and the shielding plate 52 can periodically push the waste materials to prevent them from accumulating on the hollowed-out support plate 54; With the completion of the breaking process of the crystalline silicon plate, the staff transports the crystalline silicon plate to the next process through the transmission device 12 and the conveying device 11; It should be noted that for the collection process of the waste after breaking the crystalline silicon sheet, first, relatively small debris will fall through the through groove 5502 for the vertical guide plate 53 to move and the hollow groove 5501 provided on the hollow pallet 54 at the initial stage to complete the collection of the small debris. In addition, the breaking process of the crystalline silicon sheet will also generate large pieces of the sheet broken from the pre-scored line of the crystalline silicon sheet. The large pieces of the sheet will be affected by the inclined push plate 51 and the baffle plate 52 during the falling process, slide downward along their inclined planes to buffer the impact force of their falling, and then, under the push of the baffle plate 52, fall through the hollow groove on the hollow pallet 54, thereby reducing the situation that the large waste further breaks due to direct falling during the collection process, ensuring the integrity of the large waste and facilitating the separate collection and treatment of the waste.

[0032] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A breaking device for crystalline silicon plates that facilitates positioning, comprising two symmetrically arranged conveying devices (11), two groups of transmission devices (12) are arranged between the two conveying devices (11), mounting frames (13) are fixedly installed on both sides of the transmission device (12), an electric control cylinder one (14) is fixedly installed on the mounting frame (13), the output shaft at the bottom of the electric control cylinder one (14) penetrates through the mounting frame (13), and the output shaft at the bottom of the electric control cylinder one (14) is fixedly connected to a downward pressing metal plate (15). An electric control cylinder two (16) is fixedly installed on the mounting frame (13), the output shaft at the bottom of the electric control cylinder two (16) penetrates through the mounting frame (13), and the output shaft at the bottom of the electric control cylinder two (16) is fixedly connected to a positioning roller (17). A guide rod is fixedly installed on the top of the downward pressing metal plate (15), and the downward pressing metal plate (15) is slidably connected to the inside of the mounting frame (13) through the guide rod. It is characterized in that: It further includes an auxiliary breaking component arranged on the positioning roller (17); The auxiliary breaking component includes positioning connecting rods (21) fixedly connected to the outer surface of the positioning roller (17) near the lower pressing metal plate (15) at equal intervals. One end of each positioning connecting rod (21) far from the positioning roller (17) is rotatably connected to a driven connecting rod (22) with damping. The other ends of the driven connecting rods (22) far from the positioning connecting rods (21) are fixedly connected to a hollow limiting plate (23) together. A clamping metal block (24) is slidably connected inside the hollow limiting plate (23). Metal round rods (25) are fixedly connected to the top of the clamping metal block (24) at equal intervals. Positioning springs (26) are sleeved on the outer surfaces of the metal round rods (25). Spring telescopic rods (27) are rotatably connected to the outer surface of the top of the hollow limiting plate (23) at equal intervals. Auxiliary wheels (28) are spherically hinged to the outer surface of the bottom of the hollow limiting plate (23) near the positioning roller (17) at equal intervals.

2. The breaking device for crystalline silicon plates that is convenient for positioning according to claim 1, wherein: The included angle between the positioning connecting rod (21) and the driven connecting rod (22) is obtuse. The hollow limiting plate (23) is inclined towards the lower pressing metal plate (15) with reference to the vertical plane where the positioning roller (17) is located. The top of the metal round rod (25) penetrates and extends to the top of the hollow limiting plate (23). The positioning spring (26) is arranged inside the hollow limiting plate (23). One end of the spring telescopic rod (27) far from the hollow limiting plate (23) is rotatably connected to the outer surface of the top of the positioning roller (17). The auxiliary wheel (28) is inclined towards the positioning roller (17) with reference to the plane where the hollow limiting plate (23) is located.

3. The breaking device for crystalline silicon plates that is convenient for positioning according to claim 1, wherein: It further includes an auxiliary positioning component arranged on the installation frame (13); The auxiliary positioning component includes a positioning ring (31) fixedly connected to the guiding rod on the top of the lower pressing metal plate (15). A connecting rack (32) is fixedly connected to the outer surface of the positioning ring (31). A helical gear (33) is meshed with the outer surface of the bottom of the connecting rack (32). A runner (34) is fixedly connected to the bottom of the helical gear (33). A driven rack (35) is meshed with the side tooth surface of the runner (34). A support base (36) is rotatably connected to the bottom of the runner (34). One end of the driven rack (35) facing the positioning roller (17) is slidably connected to a limiting sleeve (37). An extrusion plate (38) is fixedly connected to the other end of the limiting sleeve (37) far from the driven rack (35). Connecting springs (39) are fixedly connected to the outer surfaces of both sides of the bottom of the extrusion plate (38).

4. A breaking device for crystalline silicon plates that facilitates positioning, as described in claim 3, wherein: The bottom of the runner (34) is rotatably connected to the center of the support base (36). The support base (36) is fixedly connected to the upper surface of the installation frame (13). A through groove adapted to the size of the connecting rack (32) is formed inside the installation frame (13). The inside of the limiting sleeve (37) is hollow. A sliding groove adapted to the size of the extrusion plate (38) is formed inside the installation frame (13).

5. The breaking device for crystalline silicon plates that is convenient for positioning according to claim 4, wherein: A limiting spring is arranged inside the limiting sleeve (37). One end of the driven rack (35) arranged inside the limiting sleeve (37) is fixedly connected to the limiting spring. Both ends of the extrusion plate (38) are slidably connected to the inside of the installation frame (13) through the sliding groove, and the connecting spring (39) is arranged inside the sliding groove.

6. The breaking device for crystalline silicon plates that is convenient for positioning according to claim 3, wherein: It further includes a closing component disposed on the extrusion plate (38); The closing component includes telescopic sleeves (41) symmetrically and fixedly installed on both sides of the extrusion plate (38). Auxiliary plates (42) are fixedly connected to the tops of the telescopic sleeves (41). A special-shaped plate (43) is fixedly connected to the outer surface of the lower pressing metal plate (15) on the side close to the positioning roller (17); One end of the telescopic sleeve (41) far from the extrusion plate (38) is fixedly connected to the outer surface of the installation frame (13), and the side surface of the telescopic sleeve (41) is attached to the outer surface of the lower pressing metal plate (15).

7. A breaking device for crystalline silicon plates that is convenient for positioning according to claim 3, characterized in that: It further includes a collection component disposed on the extrusion plate (38); The collection component includes an inclined push plate (51) fixedly connected to the outer surface of the extrusion plate (38) on the side close to the lower pressing metal plate (15). A shielding plate (52) is fixedly connected to the outer surface of the bottom end of the inclined push plate (51) on the side far from the extrusion plate (38). Vertical guide plates (53) are fixedly connected to the outer surface of the bottom end of the inclined push plate (51) at equal intervals. A hollowed-out support plate (54) is fixedly connected to the outer surface of the installation frame (13).

8. A breaking device for crystalline silicon plates that is convenient for positioning according to claim 7, characterized in that: A hollowed-out groove (5501) is formed through the inside of the hollowed-out support plate (54) on the side close to the lower pressing metal plate (15). Through grooves (5502) are formed through the inside of the hollowed-out support plate (54) on the side close to the extrusion plate (38) at equal intervals. The bottom end of the shielding plate (52) is slidably connected to the upper surface of the hollowed-out support plate (54).

9. The breaking device for crystalline silicon plates that is convenient for positioning according to claim 8, wherein: The vertical guide plates (53) are horizontally slidably connected to the through grooves (5502) formed inside the hollowed-out support plate (54).

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