Display device, device and method for manufacturing display device

Abstract

The invention relates to a display device, a device for manufacturing the display device, and a method for manufacturing the display device. The apparatus for manufacturing a display apparatus includes: a molding unit including: a frame including a first surface and a second surface opposite the first surface and in which a mask opening passing from the first surface to the second surface is defined; and a plate disposed adjacent to the first surface of the frame to define a molding space with the frame. The plate includes: a first plate disposed in the mask opening and having a plurality of holes defined therein; and a second plate having a plate shape and disposed on the first surface of the frame to overlap the at least plurality of holes in a plane, and the first plate moves in a direction perpendicular to each of the first surface and the second surface in a space between the first surface and the second surface of the frame.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the priority and all benefits derived therefrom of Korean Patent Application No. 10-2024-0008897, filed on January 19, 2024, the content of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present disclosure relate herein to a display device and an apparatus and method for manufacturing a display device. Background Art

[0004] Display devices are used in various multimedia devices such as televisions, mobile phones, tablet computers, and game consoles to provide image information to a user. The display device may include a display panel for providing image information and a protective layer for protecting the display panel from external influences.

[0005] The protective layer protects the display panel from the external environment by preventing the display panel from being deformed by an external impact and effectively dissipating heat generated in the display panel. The protective layer has a structure in which a plurality of functional layers are laminated to apply various functions for protecting the display panel.

[0006] Research is being conducted on a display device including a single-layer protective layer having integrated various functions for protecting a display panel and a manufacturing method therefor. Summary of the Invention

[0007] The present disclosure provides a display device having improved reliability by disposing a single coating layer under a display panel.

[0008] The present disclosure also provides an apparatus and method for manufacturing a display device having improved process efficiency and reliability.

[0009] Embodiments of the present invention provide an apparatus for manufacturing a display device, the apparatus including a molding unit including: a frame including a first surface and a second surface opposite to the first surface, wherein a mask opening is defined in the frame and extends from the first surface through to the second surface; and a plate disposed adjacent to the first surface of the frame, wherein a molding space is defined by the frame and the plate, wherein the plate includes: a first plate disposed in the mask opening, wherein a plurality of holes are defined in the first plate; and a second plate having a plate shape and disposed on the first surface of the frame to overlap at least the plurality of holes in a plane, and the first plate moves in a direction perpendicular to each of the first surface and the second surface in a space between the first surface and the second surface of the frame.

[0010] In an embodiment, the second plate may be detachably coupled to the frame.

[0011] In an embodiment, the second plate may include a plurality of protrusions respectively embedded in a plurality of holes defined in the first plate.

[0012] In an embodiment, the device may further include a control unit configured to control the movement of the first plate.

[0013] In an embodiment, the molding unit may further include a support member disposed in the mask opening and connected to the frame to divide the mask opening into a plurality of openings.

[0014] In an embodiment, the support member may be integrally formed with the frame as a single and inseparable component.

[0015] In an embodiment, the mask opening may include a first opening and a second opening separated from each other by the support member. The first plate may include: a first sub-plate disposed in the first opening; and a second sub-plate disposed in the second opening, and each of the first sub-plate and the second sub-plate may be movable in a direction perpendicular to each of the first surface and the second surface.

[0016] In an embodiment, a mother panel may be disposed on the second surface of the frame. The mother panel may include: one surface; an opposite surface opposite to the one surface; a substrate disposed between the one surface and the opposite surface; and a display element layer disposed on the substrate to face the one surface and overlapping the mask opening between the one surface and the opposite surface, and the opposite surface of the mother panel may contact the frame.

[0017] In an embodiment, the first plate may include metal.

[0018] In an embodiment, the first plate may be made of the same material as the frame.

[0019] In an embodiment of the present invention, a method for manufacturing a display device includes: preparing a molding unit including a frame, a first plate, and a second plate, wherein a mask opening is defined in the frame and extends from a first surface of the frame through to a second surface of the frame, the first surface and the second surface face each other, the first plate is disposed in the mask opening and a plurality of holes are defined in the first plate, the second plate has a plate shape and is disposed on the first surface of the frame to overlap the plurality of holes in a plane; providing a resin into a molding space defined by the frame, the first plate, and the second plate with the second surface of the molding unit being arranged to face upward; disposing a mother panel on the second surface of the frame; inverting the molding unit and the mother panel so that the first surface of the frame faces upward with the mother panel disposed on the second surface of the frame; exposing the plurality of holes defined in the first plate by removing the second plate; curing the resin by supplying heat to the resin; extruding the resin by moving the first plate in a direction towards the mother panel; and removing the molding unit.

[0020] In an embodiment, supplying heat to the resin and extruding the resin may be performed simultaneously.

[0021] In an embodiment, the mother panel may include: a front surface; a rear surface opposite to the front surface; a substrate disposed between the front surface and the rear surface; and a display element layer disposed on the substrate to face the front surface and overlapping with a mask opening between the front surface and the rear surface, and the rear surface of the mother panel may be in contact with the frame.

[0022] In an embodiment, a protective layer may be formed by curing the resin and extruding the resin, and the protective layer may have a thickness smaller than the thickness of the resin before curing the resin.

[0023] In an embodiment, in the extruded resin, a pattern corresponding to a plurality of holes may be formed on the bottom surface of the protective layer spaced apart from the mother panel.

[0024] In an embodiment, the mother panel may include a plurality of unit panels, and the molding unit may further include a support member disposed in the mask opening to divide the mask opening into a plurality of openings respectively corresponding to the plurality of unit panels.

[0025] In an embodiment, the first plate may include a plurality of sub-plates respectively disposed in the plurality of openings.

[0026] In an embodiment, the method may further include: after removing the molding unit, cutting the mother panel along a cutting line corresponding to an edge of each of the plurality of unit panels.

[0027] In an embodiment, the resin may include: a matrix resin containing a thermosetting resin and a plurality of fillers dispersed in the matrix resin.

[0028] In an embodiment of the present invention, a display device includes a display panel and a protective layer, the protective layer including: a matrix layer disposed on a rear surface of the display panel and including a thermosetting resin; and a plurality of fillers dispersed in the matrix layer, wherein the protective layer has a top surface adjacent to the rear surface of the display panel and a bottom surface opposite to the top surface and spaced apart from the rear surface, and the protective layer includes a plurality of grooves defined on the bottom surface of the protective layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] By describing embodiments of the present invention in more detail with reference to the accompanying drawings, the above and other features of the embodiments of the present invention will become more apparent, in the drawings:

[0030] Figure 1 is a perspective view showing a display device according to an embodiment of the present invention;

[0031] Figure 2 is showingFigure 1 Exploded perspective view of the display device shown in

[0032] Figure 3 is a cross-sectional view showing some components of a display device according to an embodiment of the present invention;

[0033] Figure 4 is a cross-sectional view showing a display module according to an embodiment of the present invention;

[0034] Figure 5A and Figure 5B is a schematic exploded perspective view of a device for manufacturing a display device according to an embodiment of the present invention;

[0035] Figures 6A to 6C is a cross-sectional view of a molding unit of a device for manufacturing a display device according to an embodiment of the present invention;

[0036] Figure 7A and Figure 7B is a plan view of a component of a device for manufacturing a display device according to an embodiment of the present invention;

[0037] Figure 8 is a plan view of a mother panel according to an embodiment of the present invention;

[0038] Figure 9 is along Figure 8 Cross-sectional view taken along line II-II';

[0039] Figure 10A and Figure 10B is a plan view of a component of a device for manufacturing a display device according to an embodiment of the present invention; and

[0040] Figures 11A to 11J is a schematic diagram showing some processes of a method for manufacturing a display device according to an embodiment. Detailed Description

[0041] The present invention will now be described more fully hereinafter with reference to the accompanying drawings in which various embodiments are shown. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0042] In this specification, it will be understood that when a component (or region, layer, part) is referred to as being "on", "connected to" or "coupled to" another component, the one component may be directly disposed on / connected to / coupled to the other component, or there may also be an intervening third component.

[0043] In this application, it will be understood that when a layer, film, region or plate is "directly contacting" another layer, film, region or plate, no additional layer, film, region or plate can exist between the layer, film, region or plate and the other layer, film, region or plate. It will also be understood that when an element or layer is referred to as being "on" another element or layer, the element or layer can be directly on the other element or layer, or one or more intervening elements or layers can also exist.

[0044] Like reference numerals always refer to like elements. Additionally, in the drawings, the thickness, ratios, and dimensions of components are exaggerated for clarity.

[0045] It will be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. The terms are only used to distinguish one component from other components. For example, without departing from the scope of the appended claims, a first element that is referred to as the first element in one embodiment can be referred to as the second element in another embodiment. Unless stated to the contrary, singular terms can include the plural form.

[0046] Furthermore, for ease of description, spatial relative terms such as "beneath", "below", "above", and "on" can be used herein to describe the relationship of an element and / or feature shown in the drawings to another element(s) and / or feature(s). The terms can be relative concepts and are described based on the orientation shown in the drawings.

[0047] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, as used herein, "a", "one", "the", and "at least one" do not denote a limitation of quantity and are intended to include both the singular and the plural. Thus, a reference to "an element" followed by a reference to "the element" in a claim includes one element and a plurality of elements. For example, unless the context clearly dictates otherwise, "element" and "at least one element" have the same meaning. "At least one" should not be construed as limiting "one" or "a". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0048] It will be understood that, as used in this specification, the terms "includes" and / or "including" or "comprises" and / or "comprising" specify the presence of the stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0049] Taking into account the measurements under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximate" as used herein includes the stated value and means within an acceptable deviation of the particular value determined by a person of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, or 5% of the stated value.

[0050] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. Terms defined in a general dictionary should be interpreted as having the same meaning as in the context of the relevant art, and unless explicitly defined in the description, these terms are not desirably or overly interpreted to have a formal meaning.

[0051] Embodiments are described herein with reference to cross-sectional views that are schematic illustrations of ideal embodiments. As such, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but include deviations in shape due to, for example, manufacturing. For example, regions shown or described as flat will generally have rough and / or non-linear features. Additionally, sharp corners shown may be rounded. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

[0052] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0053] Figure 1 is a perspective view of a display device according to an embodiment of the present invention. Figure 2 is Figure 1 an exploded perspective view of the display device shown in

[0054] Referring to Figure 1 , where an embodiment in which the display device DD is a mobile phone is shown as an example. However, embodiments of the present invention are not limited to the display device DD. In an embodiment, for example, the display device DD may be a small or medium-sized display device such as a tablet computer, a navigation system for a vehicle, a gaming machine, a wearable device, or a camera.

[0055] The display device DD can display an image IM through the active area AA-DD. The active area AA-DD can include a plane defined by a first direction DR1 and a second direction DR2. The active area AA-DD can also include a curved surface bent from one side of the plane defined by the first direction DR1 and the second direction DR2. As Figure 1 shown, the display device DD according to an embodiment includes two curved surfaces bent from two opposite side surfaces of the plane defined by the first direction DR1 and the second direction DR2, respectively. However, embodiments of the present invention are not limited to the shape of the active area AA-DD. In an embodiment, for example, the active area AA-DD can include only a plane or can also include at least two curved surfaces, for example, four curved surfaces bent from four side surfaces of the plane, respectively.

[0056] Although the first direction DR1 to the fourth direction DR4 are shown in Figure 1 and the following drawings, the directions indicated by the first direction DR1, the second direction DR2, the third direction DR3, and the fourth direction DR4, which are relative concepts, can be converted relative to each other.

[0057] In this specification, the top surface of each component is parallel to the plane defined by the first direction DR1 and the second direction DR2. The thickness direction of each component indicates the third direction DR3. The fourth direction DR4 is opposite to the third direction DR3. The third direction DR3 represents the upward direction, and the fourth direction DR4 represents the downward direction. In addition, the upper side (or upper part) and the lower side (or lower part) of each component are distinguished by the third direction DR3 and the fourth direction DR4. In this embodiment, the expression "on the plane" can mean when observed on the plane defined by the first direction DR1 and the second direction DR2, that is, when observed in the third direction DR3.

[0058] The display device DD can include an active area AA-DD and a peripheral area NAA-DD disposed adjacent to the active area AA-DD. The active area AA-DD can correspond to the display area AA (refer to Figure 2 ) of a display panel DP (refer to Figure 2 ), and the peripheral area NAA-DD can correspond to the non-display area NAA (refer to Figure 2 ) of the display panel DP.

[0059] The peripheral area NAA-DD that blocks light signals can be disposed outside the active area AA-DD to surround the active area AA-DD. In an embodiment, the peripheral area NAA-DD can be disposed on the side surface of the display device DD instead of on the front surface of the display device DD. In an embodiment, the peripheral area NAA-DD can be omitted.

[0060] Referring to Figure 1 and Figure 2 , an embodiment of the display device DD may include a window WM, a housing HU, a display module DM, a circuit board DC, and an upper member UM.

[0061] The display device DD according to an embodiment may include a window WM disposed on the display module DM. The window WM may be disposed at an outer surface of the display device DD or define an outer surface of the display device DD. Although not shown, the window WM may include a substrate (also referred to as a base), and may further include functional layers such as an anti-reflection layer, an anti-fingerprint layer, and an optical layer for controlling the phase.

[0062] The upper member UM of the display device DD may be disposed between the window WM and the display module DM. The upper member UM may include an anti-reflection layer and an input detection sensor. The anti-reflection layer may reduce the reflectance of external light. The input detection sensor may detect an external input from a user. The upper member UM may further include an adhesive layer that couples the anti-reflection layer and the input detection sensor.

[0063] The display module DM may be disposed below the upper member UM. The display module DM may include a display panel DP and a protective layer LM disposed below the display panel DP.

[0064] The display panel DP includes a display area AA for displaying an image IM and a non-display area NAA disposed adjacent to the display area AA. That is, the front surface of the display panel DP may include the display area AA and the non-display area NAA. The display area AA may be activated by an electrical signal.

[0065] The non-display area NAA may be adjacent to the display area AA. The non-display area NAA may surround the display area AA. A driving circuit or driving lines for driving the display area AA, various signal lines or pads for supplying an electrical signal to the display area AA, or electronic components may be disposed in the non-display area NAA.

[0066] The display panel DP may include a light-emitting element layer DP-ED (also referred to as a display element layer) including an organic light-emitting element, a quantum dot light-emitting element, a micro light-emitting diode (LED) light-emitting element, or a nano LED light-emitting element (refer to Figure 9 ). The light-emitting element layer DP-ED (refer to Figure 9 ) may be a component that substantially generates an image.

[0067] The display device DD may include a circuit board DC connected to the display panel DP. The circuit board DC may include a flexible board CF and a main board MB. The flexible board CF may include an insulating film and wires mounted on the insulating film. The wires may be connected to the pads PD to electrically connect the circuit board DC and the display panel DP. In an embodiment, the flexible board CF may be omitted, and in this case, the main board MB may be directly connected to the display panel DP.

[0068] The main board MB may include signal lines and electronic components (not shown). The electronic components may be connected to the signal lines and electrically connected to the display panel DP. The electronic components may generate various electrical signals such as signals for generating the image IM or signals for detecting an external input, or process the detected signals. In addition, the main board MB may be provided as a plurality of main boards MB respectively corresponding to a plurality of electrical signals to be generated and processed. However, embodiments of the present invention are not limited thereto.

[0069] The protective layer LM may be disposed under the display panel DP. The protective layer LM may support the display panel DP and perform a heat dissipation function of dissipating heat generated from the display panel DP. The protective layer LM will be described in detail with reference to Figure 4 The protective layer LM will be described in detail.

[0070] The housing HU may be disposed under the display module DM. The display module DM and the like may be accommodated in the housing HU. The housing HU may be coupled to the window WM to define the appearance of the display device DD.

[0071] Figure 3 is a cross-sectional view showing some components of the display device DD according to an embodiment of the present invention. Figure 4 is a cross-sectional view showing a display module according to an embodiment of the present invention. Specifically, Figure 4 is a cross-sectional view showing the display panel DP and the protective layer LM among the components of the display device.

[0072] Refer to Figure 3 According to an embodiment of the present invention, the display device DD may include a window WM, an upper member UM, a display panel DP, a circuit board DC, and a protective layer LM.

[0073] In an embodiment, the window WM may cover the front surface of the display panel DP. The window WM may include a base substrate WM-BS and a border pattern WM-BZ. The base substrate WM-BS includes a transparent first base layer such as a glass substrate or a transparent film. The border pattern WM-BZ may have a multi-layer structure. The multi-layer structure may include a colored color layer and a black light-shielding layer. The colored color layer and the black light-shielding layer may be provided by a deposition, printing, or coating process. In another embodiment, the border pattern WM-BZ may be omitted from the window WM and provided to the upper member UM instead of the base substrate WM-BS.

[0074] In an embodiment, the upper member UM includes an anti-reflection layer UM-1 and an input sensor UM-2.

[0075] The anti-reflection layer UM-1 can reduce the reflectivity of external light. The anti-reflection layer UM-1 can include a retarder and / or a polarizer. The anti-reflection layer UM-1 can include a polarizing film or a color filter. The color filter can have a predetermined arrangement. The arrangement of the color filter can be determined in consideration of the emission color of pixels included in the display panel DP. The anti-reflection layer UM-1 can further include a spacer layer adjacent to the color filter.

[0076] The input sensor UM-2 can include a plurality of electrodes (not shown) for detecting an external input, traces (not shown) connected to the plurality of electrodes, and an organic layer and / or an inorganic layer for insulating / protecting the plurality of electrodes or the traces. In an embodiment, the input sensor UM-2 can be a capacitive sensor, but embodiments of the present invention are not limited thereto.

[0077] In an embodiment, when manufacturing the display panel DP, the input sensor UM-2 can be directly provided on the encapsulation layer through a continuous process. However, embodiments of the present invention are not limited thereto. In another embodiment, for example, the input sensor UM-2 can be manufactured as a panel separate from the display panel DP and then attached to the display panel DP through an adhesive layer.

[0078] In an embodiment, an adhesive layer (not shown) can be additionally provided between the window WM and the anti-reflection layer UM-1, and an adhesive layer can be additionally provided between the anti-reflection layer UM-1 and the input sensor UM-2. Each of the window WM, the anti-reflection layer UM-1, and the input sensor UM-2 can be coupled through the adhesive layer.

[0079] In an embodiment, the circuit board DC can include a flexible board CF and a main board MB. The flexible board CF according to an embodiment can be assembled in a bent state. Thus, the main board MB can be disposed on the rear surface of the display panel DP and stably accommodated in a space provided by the housing HU (refer to Figure 2 ). In an embodiment, for example, the flexible board CF can be bent toward the rear surface of the display panel DP and disposed under the protective layer LM. However, embodiments of the present invention are not limited thereto. In another embodiment, the flexible board CF can be omitted, and in this case, the main board MB can be directly disposed under the protective layer LM or mounted in the protective layer LM.

[0080] The protective layer LM is disposed under the display panel DP. The protective layer LM can be directly disposed under the display panel DP to contact the bottom surface of the display panel DP. The protective layer LM can contact the circuit board DC. In an embodiment, for example, the protective layer LM can contact the main board MB.

[0081] Referring to Figure 3 and Figure 4 , a protective layer LM may be provided on the bottom surface of the display panel DP. The protective layer LM may have a top surface L-UF adjacent to the bottom surface of the display panel DP and a bottom surface L-LF opposite to the top surface L-UF and spaced apart from the bottom surface of the display panel DP. In the display module DM according to an embodiment of the present invention, as Figure 4 shown, only the protective layer LM may be provided under the display panel DP. That is, the lowermost surface of the display module DM may be defined by the bottom surface L-LF of the protective layer LM. Therefore, the thickness of the display device DD including the display module DM according to the embodiment can be reduced, the components of the display device DD can be simplified, and the efficiency of the process for manufacturing the display device DD according to the embodiment can be improved.

[0082] In an embodiment, a predetermined pattern may be provided on the bottom surface L-LF of the protective layer LM. The pattern may correspond to a transfer pattern provided in the process of extruding resin through a plate having a plurality of holes defined therein when curing the resin for providing the protective layer LM. When the resin is extruded through the plate having a plurality of holes defined therein, the curing speed and the solvent evaporation rate may be different between the portion of the resin overlapping with the plurality of holes and the portion of the resin not overlapping with the plurality of holes. Therefore, a pattern corresponding to the shape of the holes defined in the plate may be provided on the bottom surface L-LF of the protective layer LM. The pattern may have a shape recessed or protruding from the bottom surface L-LF of the protective layer LM. A method of forming the protective layer LM will be described in detail later with reference to Figure 5A .

[0083] In an embodiment, as Figure 4 shown, the protective layer LM may include a matrix layer BS and a plurality of fillers FP dispersed in the matrix layer BS. The protective layer LM may be a single layer including the matrix layer BS and the plurality of fillers FP. The plurality of fillers FP may be fillers dispersed in the matrix layer BS.

[0084] Since the protective layer LM includes the matrix layer BS and the plurality of fillers FP, the protective layer LM can perform various functions in the display module DM. For example, the protective layer LM can support the display panel DP. The protective layer LM can protect the display panel DP from the display device DD (refer to Figure 1) The externally applied physical impact. The protective layer LM can perform a heat dissipation function to radiate the heat generated in the display panel DP. The protective layer LM can perform an electromagnetic wave blocking function. The protective layer LM can perform a light blocking function. However, embodiments of the present invention are not limited to the functions of the protective layer LM. For example, the protective layer LM can additionally perform other functions depending on the thickness and material of the protective layer LM. Since the single-layer protective layer LM performs the functions of supporting the display panel DP, heat dissipation, and blocking electromagnetic waves, the display device DD (refer to Figure 1 ) can have a reduced thickness, have simplified components, and improve the efficiency in the process of manufacturing the display device DD (refer to Figure 1 ).

[0085] The protective layer LM can have a thickness of about 30 micrometers (μm) or more to about 300 μm or less. The protective layer LM can have a viscosity of about 100 centipoise (cps) or more to about 100,000 cps or less. In an embodiment, for example, the protective layer LM can have a viscosity of about 3,000 cps. Thus, the protective layer LM can support the display panel DP in the display module DM.

[0086] Each of the plurality of fillers FP can include an organic material or an inorganic material. In an embodiment, for example, each of the plurality of fillers FP can include graphite or metal particles. Each of the plurality of fillers FP can perform the same function as each other or different functions from each other. Thus, the protective layer LM can perform various functions such as supporting, heat dissipation, light blocking, and electromagnetic wave blocking for the display device DD (refer to Figure 1 ).

[0087] In an embodiment, the plurality of fillers FP can include a light blocking material. Since the protective layer LM includes the plurality of fillers FP containing or formed of a light blocking material, the protective layer LM can have a black color. As an example, the light blocking material can be a black pigment or a black dye. Alternatively, the light blocking material can be a carbon-based material such as graphene or graphite. In such an embodiment where the plurality of fillers FP includes a light blocking material, the protective layer LM can effectively prevent the light emitted from the display panel DP from leaking downward from the display panel DP.

[0088] The plurality of fillers FP can have an average diameter of about 1 μm or more to about 70 μm or less. In an embodiment, for example, each of the plurality of fillers FP can have an average diameter of about 10 μm or more to about 50 μm or less. In an embodiment, as Figure 4As shown, the fillers FP have substantially the same diameter as each other, but embodiments of the present invention are not limited thereto. In an embodiment, for example, the fillers FP may have a substantially monodisperse distribution or a polydisperse distribution obtained by mixing a plurality of particles having a monodisperse distribution.

[0089] The plurality of fillers FP may have a content of about 30 weight percent (wt%) or more and about 80 wt% or less with respect to all the materials included in the protective layer LM. In an embodiment, for example, the plurality of fillers FP may have a content of about 50 wt% or more and about 80 wt% or less with respect to all the materials (or the total content of the protective layer LM) included in the protective layer LM.

[0090] The base layer BS may provide a base material in which a plurality of fillers FP are dispersed. The base layer BS may include an organic material. The base layer BS may include at least one selected from an acrylic polymer, a urethane polymer, a silicone polymer, and an imide polymer. The base layer BS may include a material having a predetermined strength or rigidity.

[0091] In an embodiment, the base layer BS may include a curable resin. In an embodiment, for example, the base layer BS may include a thermosetting resin. In an embodiment in which the plurality of fillers FP include a light-blocking material, the light transmittance may decrease, and thus the photo-curing efficiency of the resin used to provide the protective layer LM may decrease. That is, when the protective layer LM is provided by using a photo-curing method, light in the ultraviolet wavelength range used as a light source may be absorbed by the light-blocking material included in the plurality of fillers FP, thereby reducing the exposure sensitivity of the protective layer LM. Although the plurality of fillers FP include a light-blocking material, embodiments of the present invention may use a thermo-curing method to provide the protective layer LM to exhibit high curing efficiency, thereby effectively preventing uncured base resin from remaining in the protective layer LM. Therefore, the durability and reliability of the protective layer LM can be improved.

[0092] A display device DD according to an embodiment of the present invention may include a protective layer LM that performs various functions below a display panel DP to obtain the effects of reducing the thickness of the display device DD and simplifying the components of the display device DD. Since the display panel DP includes light-emitting elements that cause various side effects, a typical display device DD generally further includes a plurality of functional members or layers such as a light-blocking layer, a heat-dissipating layer, a buffer layer, and a support layer below the display panel DP to compensate for these side effects. In an embodiment of the present invention, providing the protective layer LM that performs the above functions enables the effects of reducing the thickness, simplifying the components, and improving the manufacturing process efficiency to be obtained while performing the functions of a plurality of typical functional layers. By disposing the protective layer LM below the display panel DP, the display device DD according to an embodiment of the present invention may have improved impact resistance against external impacts of the display panel DP.

[0093] Figure 5A And Figure 5B is a schematic exploded perspective view showing an apparatus for manufacturing a display device according to an embodiment of the present invention. Specifically, Figure 5B is a perspective view showing Figure 5A the inverted state of the apparatus for manufacturing a display device shown in Figure 5B In Figures 6A to 6C is a cross-sectional view showing a molding unit MU of an apparatus for manufacturing a display device according to an embodiment of the present invention. Figures 6A to 6C is a cross-sectional view taken along line I-I' in Figure 5A

[0094] Referring to Figure 5A , Figure 5B , and Figures 6A to 6C , an apparatus for manufacturing a display device according to an embodiment of the present invention may include a molding unit MU. The molding unit MU may include a frame FM and a plate PT. The plate PT may include a first plate PT1 and a second plate PT2. The molding unit MU may provide a molding space defined within the molding unit MU by the frame FM and the plate PT. The molding space may represent a space in which a resin RS, which will be described later, is processed. The molding space defined by the frame FM and the plate PT may have a planar shape corresponding to the planar shape of a protective layer LM shown in Figure 2

[0095] The frame FM may constitute a sidewall of the molding unit MU. The frame FM may include a first surface SF1 and a second surface SF2 opposite to the first surface SF1. The first surface SF1 may define a bottom surface of the frame FM, and the second surface SF2 may define a top surface of the frame FM. Each of the first surface SF1 and the second surface SF2 may be parallel to a plane defined by a first direction DR1 and a second direction DR2. A mask opening M-OP may be defined in the frame FM in a direction from the first surface SF1 to the second surface SF2 (i.e., the thickness direction) that passes through or extends through the frame FM. The mask opening M-OP may be defined by an inner surface of the frame FM. The inner surface of the frame FM may extend in the thickness direction and be connected to each of the first surface SF1 and the second surface SF2.

[0096] In an embodiment, the frame FM may include a metallic material. In an embodiment, for example, the frame FM may include stainless steel (SUS).

[0097] ​​The plate PT can be arranged to be adjacent to the first surface SF1 of the frame FM. The plate PT and the frame FM can define a molding space. The plate PT can be coupled to the frame FM to define the molding space. A molding material such as resin can be filled into the molding space defined by the plate PT and the frame FM. The plate PT includes a first plate PT1 and a second plate PT2 that are separable from each other.

[0098] In an embodiment, as Figures 6A to 6C shown, the first plate PT1 can be disposed in a mask opening M-OP defined in the frame FM. The first plate PT1 can move in the vertical direction within the molding space. The first plate PT1 can move between the first surface SF1 and the second surface SF2 within the mask opening M-OP of the frame FM. The first plate PT1 can move between the first surface SF1 and the second surface SF2 in a direction perpendicular to each of the first surface SF1 and the second surface SF2 (i.e., in the third direction DR3 or the fourth direction DR4). The first plate PT1 can move away from or closer to the second surface SF2 of the frame FM to change the volume of the molding space.

[0099] In an embodiment, the first plate PT1 can be made of the same material as the frame FM. The first plate PT1 can include a metal. In an embodiment, for example, the first plate PT1 can include stainless steel (SUS).

[0100] In an embodiment, the apparatus for manufacturing a display device according to the embodiment may further include a control unit (or controller) CU that controls or adjusts the movement of the first plate PT1. The molding unit MU can be connected to the control unit CU via a cable or via a wireless communication module to send electrical signals to and receive electrical signals from the control unit CU. The molding unit MU can receive a control signal CS from the control unit CU to change the position of the first plate PT1 in the vertical direction. Here, the control unit CU can be any conventional controller including a circuit for generating a control signal for controlling the movement of the plate.

[0101] A plurality of holes OH can be defined in the first plate PT1. The plurality of holes OH can be used to improve heat transfer to the molding material when the molding material cures. In addition, the plurality of holes OH can be used to easily discharge the evaporated solvent when the molding material cures. The first plate PT1 can have a bottom surface P-SF1 adjacent to the second plate PT2 and a top surface P-SF2 opposite to the bottom surface P-SF1. In an embodiment, as Figure 5A and Figure 5BAs shown, each of the plurality of holes OH can be defined from the top surface P-SF2 of the first plate PT1 through the first plate PT1 to the bottom surface P-SF1 of the first plate PT1. When observed on a plane defined by the first direction DR1 and the second direction DR2 or in the vertical direction, each of the plurality of holes OH can have a circular shape. However, embodiments of the present invention are not limited to the shape of each of the plurality of holes OH. Each of the plurality of holes OH can have one of various other shapes such as a polygonal shape, an elliptical shape, and a bar shape. In an embodiment, as Figure 5A and Figure 5B shown, the plurality of holes OH can be spaced apart from each other at a constant distance or interval, but embodiments of the present invention are not limited thereto. In another embodiment, for example, the plurality of holes OH can be spaced apart from each other at an arbitrary distance.

[0102] The second plate PT2 can have a plate shape. The second plate PT2 can be disposed on the first surface SF1 of the frame FM to overlap with the plurality of holes OH defined in the first plate PT1 on a plane defined by the first direction DR1 and the second direction DR2. The second plate PT2 can contact the first surface SF1 of the frame FM. The second plate PT2 can overlap with the plurality of holes OH. The second plate PT2 can be disposed to overlap with the plurality of holes OH and is used to prevent the molding material filled in the molding space from leaking out through the plurality of holes OH.

[0103] In an embodiment, the second plate PT2 can be made of the same material as the frame FM. The second plate PT2 can include metal. In an embodiment, for example, the second plate PT2 can include stainless steel (SUS). However, embodiments of the present invention are not limited to the material of the second plate PT2.

[0104] As Figures 6A to 6C shown, the second plate PT2 can be detachably coupled to the frame FM. The second plate PT2 can be coupled to the first surface SF1 of the frame FM. Various types of coupling methods can be used to separate the second plate PT2 and the frame FM. In an embodiment, for example, the second plate PT2 can be coupled to and fixed to the frame FM by a mechanical fastening method such as screw fastening.

[0105] In an embodiment, the second plate PT2 can further include a plurality of protrusions PR. The second plate PT2 can include a top surface adjacent to the frame FM and a bottom surface opposite to the top surface. The plurality of protrusions PR can be disposed on the top surface of the second plate PT2 adjacent to the first plate PT1. The plurality of protrusions PR can have a shape protruding from the top surface of the second plate PT2 in the third direction DR3. The plurality of protrusions PR can have a shape integral with the base plate of the second plate PT2.

[0106] A plurality of protrusions PR may respectively correspond to a plurality of holes OH defined in the first plate PT1. Each of the plurality of protrusions PR may have a height equal to the thickness of the first plate PT1. However, embodiments of the present invention are not limited thereto. In an embodiment, for example, each of the plurality of protrusions PR may have a height greater than or less than the thickness of the first plate PT1. The plurality of protrusions PR may be respectively embedded into the plurality of holes OH. The plurality of protrusions PR may have a shape corresponding to the shape of the plurality of holes OH. Depending on the shape of the holes OH, the protrusions PR may have various shapes.

[0107] The plurality of protrusions PR may be embedded in an upward direction from below the molding unit MU. The plurality of protrusions PR may be coupled to the plurality of holes OH to provide a bottom surface of the molding unit MU in contact with the molding material. The bottom surface provided by the coupling of the protrusions PR and the holes OH may be connected to the inner surface of the frame FM to define a molding space. Each of the bottom surface provided by the coupling of the protrusions PR and the holes OH and the inner surface of the frame FM may contact the molding material.

[0108] In an embodiment, the molding unit MU may further include a support ST that divides the mask opening M-OP into a plurality of openings. The support ST may be disposed in the mask opening M-OP. The support SP may be connected to the frame FM. The support SP may be connected to the inner surface of the frame FM. The support ST may have a shape integral with the frame FM, or may be integrally formed with the frame FM as a single integral and non-separable component. In an embodiment, the thickness of the support ST in the third direction DR3 may be substantially equal to the thickness of the frame FM in the third direction DR3. However, embodiments of the present invention are not limited thereto. In another embodiment, for example, the thickness of the support ST in the third direction DR3 may be different from the thickness of the frame FM in the third direction DR3.

[0109] As Figure 5A and Figure 5B shown, the mask opening M-OP defined in the frame FM may include a first opening M-OP1 and a second opening M-OP2 divided by the support ST. The first opening M-OP1 and the second opening M-OP2 divided by the support ST may have the same area as each other in a plane. However, embodiments of the present invention are not limited thereto. In an embodiment, for example, the position of the support ST may be variously changed in the mask opening M-OP according to the design of the area of the molding space.

[0110] In an embodiment, a plurality of first plates PT1 may be provided. Since the mask opening M-OP is divided into a plurality of openings by the support ST, the first plates PT1 may be provided in plurality corresponding to the openings. In an embodiment, for example, the first plate PT1 may include a plurality of sub-plates corresponding to the plurality of divided openings. Each of the plurality of sub-plates may be disposed in a corresponding opening to be movable in a vertical direction.

[0111] As Figure 5A and Figure 5B shown, the first plate PT1 may include a first sub-plate PT1-1 corresponding to the first opening M-OP1 and a second sub-plate PT1-2 corresponding to the second opening M-OP2. The first sub-plate PT1-1 may be disposed in the first opening M-OP1. The second sub-plate PT1-2 may be disposed in the second opening M-OP2. Each of the first sub-plate PT1-1 and the second sub-plate PT1-2 may move in a direction perpendicular to each of the first surface SF1 and the second surface SF2 between the first surface SF1 and the second surface SF2 of the frame FM.

[0112] Referring Figure 5B , a mother panel M-DP as an object to be processed may be disposed on the second surface SF2 of the frame FM. The mother panel M-DP may be placed and fixed on the second surface SF2 of the frame FM. The mother panel M-DP may include or be divided into a plurality of unit panels U-DP (refer to Figure 8 ). The mother panel M-DP will be described in detail later with reference to Figures 8 to 9 .

[0113] The mother panel M-DP may include one surface D-UF and another surface (or opposite surface) D-LF opposite to the one surface D-UF. In the present specification, one surface D-UF may correspond to the top surface of the mother panel M-DP, and another surface D-LF may correspond to the bottom surface of the mother panel M-DP. Each of the one surface D-UF and the another surface D-LF may be parallel to a plane defined by a first direction DR1 and a second direction DR2. A plurality of protective layers LM (refer to Figure 2 ) may be provided on the another surface D-LF of the mother panel M-DP by a device for manufacturing a display device according to an embodiment.

[0114] In an embodiment, the apparatus for manufacturing a display device according to the embodiment may further include a driving unit (not shown), which reverses the mother panel M-DP and the molding unit MU in the vertical direction in a state where the mother panel M-DP is disposed on the second surface SF2 of the frame FM. The driving unit may rotate the mother panel M-DP and the molding unit MU by 180° based on a horizontal rotation axis in a state where the mother panel M-DP is disposed on the molding unit MU. Accordingly, the mother panel M-DP and the molding unit MU may be reversed in the vertical direction.

[0115] Figure 7A and Figure 7B is a plan view showing one component of the apparatus for manufacturing a display device according to an embodiment of the present invention. Figure 7A and Figure 7B is a plan view showing the frame FM constituting the molding unit MU (refer to Figure 5A ).

[0116] Referring together to Figure 5A 、 Figure 5B 、 Figure 7A and Figure 7B , in the apparatus for manufacturing a display device according to an embodiment, the molding unit MU may include a support ST. The support ST may divide the mask opening M-OP into a plurality of openings.

[0117] Referring to Figure 7A and Figure 7B , the support ST may be disposed in the mask opening M-OP. In a plan view, the support ST may have a rod shape extending in the second direction DR2. The mask opening M-OP may be divided by the support ST into a first opening M-OP1 and a second opening M-OP2. The first opening M-OP1 and the second opening M-OP2 may be spaced apart from each other in the first direction DR1. In an embodiment, the first opening M-OP1 and the second opening M-OP2 may have the same area in a plane.

[0118] Referring together to Figure 7A 、 Figure 7B and Figure 8 , the plurality of openings divided by the support ST may respectively correspond to the unit panels U-DP included in the mother panel M-DP. That is, Figure 8 the unit panels U-DP included in the mother panel M-DP shown in

[0119] As Figure 7AAs shown, in an embodiment, a plurality of support members ST may be provided. The support member ST may include a first sub-support member ST1 and a second sub-support member ST2. Each of the first sub-support member ST1 and the second sub-support member ST2 may be disposed in the mask opening M-OP. Each of the first sub-support member ST1 and the second sub-support member ST2 may be connected to the frame FM. Each of the first sub-support member ST1 and the second sub-support member ST2 may be connected to the inner surface of the frame FM. The first sub-support member ST1 and the second sub-support member ST2 may have a shape integral with the frame FM or be integrally formed with the frame FM as a single integral and inseparable component.

[0120] The mask opening M-OP may be divided by the first sub-support member ST1 and the second sub-support member ST2 into a first opening M-OP1, a second opening M-OP2, and a dummy opening S-OP. The dummy opening S-OP may be defined between the first sub-support member ST1 and the second sub-support member ST2. In a plane defined by a first direction DR1 and a second direction DR2, the first opening M-OP1 and the second opening M-OP2 may be spaced apart from each other, and the dummy opening S-OP may be interposed between the first opening M-OP1 and the second opening M-OP2.

[0121] In the apparatus for manufacturing a display device according to an embodiment, the first opening M-OP1 and the second opening M-OP2 in the molding unit MU may be filled with a molding material. In addition, as Figure 7A shown, when the dummy opening S-OP is defined between the sub-support members ST1 and ST2, the dummy opening S-OP may also be filled with a molding material. Accordingly, a resin may be provided on a portion of the mother panel M-DP, which is an object to be processed, overlapping with the dummy opening S-OP.

[0122] In addition, in the present specification, embodiments of the present invention are not limited to Figure 7A and Figure 7B the number, position, and extending direction of the support member ST, and the number, position, and extending direction of the support member ST may be variously changed according to the design of the molding space area (i.e., the design of the area of the molding space) and / or the number of unit panels included in the mother panel.

[0123] Figure 8 is a plan view showing Figure 5B the mother panel M-DP in Figure 8 is a plan view showing the mother panel M-DP seen from the top surface D-UF of the mother panel M-DP in Figure 5B is a plan view showing the mother panel M-DP seen from the top surface D-UF of the mother panel M-DP in Figure 9 is a cross-sectional view taken along the line II-II' of Figure 8 is a cross-sectional view taken along the line II-II' of

[0124] Referring to Figure 8, the mother panel M-DP may include a plurality of unit panels U-DP. Each of the plurality of unit panels U-DP may correspond to the display panel DP in Figure 2 . In this specification, the unit panel U-DP may be referred to as the display panel. In Figure 8 , for ease of explanation, the unit panel U-DP is shown as a dashed line.

[0125] Referring together to Figure 2 , Figure 5B and Figure 8 , a plurality of protective layers LM (refer to Figure 2 ) overlapping the plurality of unit panels U-DP may be disposed on the bottom surface D-LF of the mother panel M-DP by a device for manufacturing a display device according to an embodiment. After the plurality of protective layers LM (refer to Figure 2 ) are provided on the bottom surface D-LF of the mother panel M-DP, each of the plurality of unit panels U-DP may be cut into individual unit panels U-DP. Figure 8 The edges of the unit panel U-DP represented by the dashed line in

[0126] In an embodiment, as shown in Figure 8 , each of the plurality of unit panels U-DP may have a rectangular shape having a short side extending in a first direction DR1 and a long side extending in a second direction DR2, but the embodiments of the present invention are not limited thereto.

[0127] Referring to Figure 9 , a display panel DP according to an embodiment of the present invention includes a substrate base BL, a circuit layer DP-CL disposed on the substrate base BL, a light-emitting element layer DP-ED, and a packaging layer ENL. The substrate base BL may include a plastic substrate, a glass substrate, a metal substrate, and an organic / inorganic composite substrate. In an embodiment, for example, the substrate base BL may include at least one polyimide layer.

[0128] The circuit layer DP-CL includes at least one insulating layer, a semiconductor pattern, and a conductive pattern. The insulating layer includes at least one inorganic layer and at least one organic layer. The semiconductor pattern and the conductive pattern may constitute signal lines, a pixel driving circuit, and a scan driving circuit. In addition, the circuit layer DP-CL may include a metal layer.

[0129] The light-emitting element layer DP-ED includes display elements such as light-emitting elements. In an embodiment, for example, the light-emitting element may include an organic light-emitting element, a quantum dot light-emitting element, a micro light-emitting diode (LED) light-emitting element, or a nano LED light-emitting element. The light-emitting element layer DP-ED may also include an organic layer such as a pixel defining layer.

[0130] The light-emitting element layer DP-ED may be disposed on the display area AA. The non-display area NAA may be disposed outside the display area AA to surround the display area AA, and the light-emitting element may not be disposed on the non-display area NAA.

[0131] The encapsulation layer ENL may be disposed on the light-emitting element layer DP-ED to cover the light-emitting element layer DP-ED. The encapsulation layer ENL may be disposed on the circuit layer DP-CL to seal the light-emitting element layer DP-ED. The encapsulation layer ENL may be a thin-film encapsulation layer including a plurality of organic thin films and inorganic thin films. The encapsulation layer ENL may include a thin-film encapsulation layer having a laminated structure of an inorganic layer / an organic layer / an inorganic layer. However, embodiments of the present invention are not limited to the laminated structure of the encapsulation layer ENL.

[0132] Similar to the mother panel M-DP (refer to Figure 8 ), the display panel DP may include a surface D-UF and another surface (or back surface) D-LF opposite to the one surface D-UF. The one surface D-UF may correspond to the top surface of the display panel DP, and the another surface D-LF may correspond to the bottom surface of the display panel DP. The one surface D-UF may be defined by the top surface of the encapsulation layer ENL. The another surface D-LF may be defined by the bottom surface of the substrate base BL. In an embodiment, the substrate base BL, the circuit layer DP-CL, the light-emitting element layer DP-ED, and the encapsulation layer ENL may be disposed between the one surface D-UF and the another surface D-LF of the display panel DP.

[0133] In an embodiment, the light-emitting element layer DP-ED may be disposed on the substrate base BL to face the one surface D-UF. As described above, since the unit panel U-DP (refer to Figure 8 ) overlaps with the openings M-OP1 (refer to Figure 5B ) and M-OP2 (refer to Figure 5B ) respectively, the light-emitting element layer DP-ED may overlap with the corresponding opening among the openings M-OP1 and M-OP2 on the plane defined by the first direction DR1 and the second direction DR2.

[0134] In an embodiment, as shown in Figure 9 , the one surface D-UF of the display panel DP may have a stepped portion between the display area AA and the non-display area NAA, but for the sake of convenience of explanation, the one surface D-UF is shown as a flat surface in the mother panel M-DP in Figure 5B .

[0135] Although in Figure 8 and Figure 9Among them, the unit panel U-DP included in the mother panel M-DP only includes the display panel DP, but the embodiments of the present invention are not limited thereto. For example, the unit panel U-DP included in the mother panel M-DP may be in a state where the upper member UM (refer to Figure 2 ) is coupled to the display panel DP or in a state where the upper member UM (refer to Figure 2 ) and the window WM (refer to Figure 2 ) are coupled to the display panel DP.

[0136] Figure 10A And Figure 10B are plan views showing a component of a device for manufacturing a display device according to an embodiment of the present invention. Figure 10A And Figure 10B are plan views showing the plate PT constituting the molding unit MU.

[0137] Referring together to Figure 5A , Figure 5B , Figure 10A and Figure 10B , the molding unit MU may include a plate PT that defines a molding space with the frame FM. The plate PT may include a first plate PT1 in which a plurality of holes OH are defined and a second plate PT2 disposed on the second surface SF2 of the frame FM to overlap with the plurality of holes OH.

[0138] As Figure 10A and Figure 10B shown, the first plate PT1 and the second plate PT2 may overlap each other on a plane defined by a first direction DR1 and a second direction DR2. The second plate PT2 may completely overlap with the plurality of holes OH defined in the first plate PT1. In an embodiment where the first plate PT1 includes a plurality of sub-plates PT1-1 and PT1-2, the second plate PT2 may overlap with each of the plurality of sub-plates PT1-1 and PT1-2 on a plane. The second plate PT2 may completely overlap with the plurality of holes OH defined in each of the plurality of sub-plates PT1-1 and PT1-2.

[0139] As Figure 10A and Figure 10B shown, in an embodiment, each of the plurality of holes OH defined in the first plate PT1 may have various shapes. Each of the plurality of holes OH may have a circular shape, an oval shape, a polygonal shape, or a closed line shape including at least some curves. In an embodiment, for example, the plurality of holes OH may have a rectangular shape as shown in Figure 10A , or may have a linear rod shape or a shape extending in one direction as shown in Figure 10B . Although in Figure 10BAn embodiment is shown as an example in which each of the plurality of holes OH has a shape extending in a first direction DR1, but the present embodiment is not limited thereto. In addition, the number and arrangement direction of the plurality of holes OH can be variously changed.

[0140] In an embodiment, the second plate PT2 may include a plurality of protrusions PR corresponding to the shape of the plurality of holes OH. In an embodiment, for example, when each of the plurality of holes OH has a rectangular shape as shown in Figure 10A each of the plurality of protrusions PR may have a rectangular shape. In an embodiment, when each of the plurality of holes OH has a shape extending in one direction as shown in Figure 10B each of the plurality of protrusions PR may have a shape extending in the same direction as the extending direction of each of the plurality of holes OH. However, embodiments of the present invention are not limited thereto. In an embodiment, for example, the plurality of protrusions PR may be omitted according to process conditions.

[0141] Figures 11A to 11J is a view showing some processes of a method for manufacturing a display device according to an embodiment of the present invention. Specifically, Figures 11A to 11J shows a process of forming a protective layer LM provided under a display panel DP in a display device DD according to an embodiment by using a device for manufacturing a display device according to an embodiment of the present invention. Figures 11A to 11G , Figure 11I and Figure 11J are cross-sectional views showing some processes of a method for manufacturing a display device according to an embodiment of the present invention. Figure 11H is a plan view showing some processes of a method for manufacturing a display device according to an embodiment of the present invention. In addition, Figure 11A is along Figure 5A in the line I-I'. Hereinafter, a method for manufacturing a display device according to an embodiment of the present invention will be described with reference to Figures 11A to 11J Here, the same reference numerals are assigned to configurations identical to those of the display device in Figures 1 to 10B and any repeated detailed descriptions will be omitted.

[0142] A method for manufacturing a display device according to an embodiment of the present invention may include: a process of preparing a molding unit including a frame FM, a first plate PT1, and a second plate PT2; a process of providing a resin RS into a molding space defined by the frame FM, the first plate PT1, and the second plate PT2; a process of disposing a mother panel M-DP on the molding unit MU; a process of inverting the molding unit MU and the mother panel M-DP in a vertical direction; a process of removing the second plate PT2 from the molding unit MU; a process of curing the resin RS provided in the molding space; and a process of extruding the resin RS by moving the first plate PT1 closer to the mother panel M-DP.

[0143] Referring Figure 11A and Figure 11B , a method for manufacturing a display device according to an embodiment of the present invention includes the preparation of a molding unit MU and the provision of a resin RS to the molding unit MU.

[0144] Referring Figure 11A , an embodiment of the molding unit MU may include a frame FM and a plate PT. The frame FM may have a first surface SF1 and a second surface SF2, which face away from each other in the thickness direction of the frame FM. The first surface SF1 may correspond to the bottom surface of the frame FM, and the second surface SF2 may correspond to the top surface of the frame FM. The second surface SF2 may define the top surface of the molding unit MU. A mask opening M-OP passing through the frame FM may be defined in the frame FM in a direction from the first surface SF1 to the second surface SF2. The plate PT may be disposed adjacent to the first surface SF1 of the frame FM. The plate PT may include a first plate PT1 disposed in the mask opening M-OP and having a plurality of holes OH defined therein, and a second plate PT2 having a plate shape and disposed on the first surface SF1 of the frame FM to overlap with the plurality of holes OH. The frame FM, the first plate PT1, and the second plate PT2 may be coupled to each other to define a molding space of the molding unit MU. In this specification, the height of the molding space may represent the vertical distance from the top surface of the first plate PT1 to the second surface SF2 of the frame FM in a state where the frame FM and the plate PT are coupled to each other.

[0145] Referring Figure 11B , a method for manufacturing a display device according to an embodiment of the present invention may include a process of providing a resin RS into a molding space defined by the frame FM, the first plate PT1, and the second plate PT2. The resin RS may be provided into the molding space in a state where the molding unit MU (referring to Figure 11A ) is disposed such that the second surface SF2 of the frame FM faces upward.

[0146] The resin RS can be provided in various ways. In an embodiment, for example, the resin RS can be provided into the molding space through a nozzle (not shown). The nozzle (not shown) can be disposed above the molding unit MU, and the resin RS can be discharged from the nozzle (not shown) toward the molding space defined in the molding unit MU. The process of providing the resin onto the object to be processed by using the nozzle (not shown) can be defined as a dispensing printing process. As the dispensing printing process, an inkjet method, an ejection valve method, and a slit coating method can be used.

[0147] The resin RS can be provided to the mask opening M-OP. In an embodiment in which the molding unit MU includes a support ST that divides the mask opening M-OP into a plurality of openings M-OP1 and M-OP2, the resin RS can be provided to each of the divided openings M-OP1 and M-OP2. In an embodiment, in the case where a plurality of supports ST are provided, the resin RS can be provided to a dummy opening S-OP defined between the plurality of supports ST1 and ST2. In a plane (or when viewed in the third direction DR3), the dummy opening S-OP may not overlap with the unit panel U-DP (refer to Figure 8 ). In a plane, the dummy opening S-OP can correspond to the region between adjacent unit panels U-DP (refer to Figure 8 ). The resin RS provided in the dummy opening S-OP can be provided on the bottom surface D-LF (refer to Figure 11C ) of the mother panel M-DP (refer to Figure 11C ) adjacent to the edge of the unit panel U-DP (refer to Figure 8 ).

[0148] The region on the bottom surface D-LF of the mother panel M-DP that overlaps with the support ST can be a region where no resin is provided. The region of the mother panel M-DP that overlaps with the support ST and where no resin RS is provided can be a region where scribing is performed in a subsequent process of cutting the mother panel M-DP.

[0149] In an embodiment, the resin RS provided to the molding unit MU can have a first thickness d1. The first thickness d1 of the resin RS can be substantially equal to the height of the molding space defined in the molding unit MU. The height of the molding space can represent the vertical distance from the top surface of the first plate PT1 to the second surface SF2 of the frame FM in a state where the frame FM and the plate PT are coupled to each other. In an embodiment, the molding space can have a height of about 30 μm or more to about 700 μm or less. In an embodiment, for example, the molding space can have a height of about 400 μm.

[0150] The resin RS can include a matrix resin and a plurality of fillers FP dispersed in the matrix resin (refer to Figure 4)。In an embodiment, the matrix resin may include a thermosetting resin. Features identical to those described above Figure 4 may be applied to the plurality of fillers included in the resin RS.

[0151] Referring to Figure 11C , a method for manufacturing a display device according to an embodiment of the present invention may include a process of disposing a mother panel M-DP on a molding unit MU. As Figure 11C shown, the mother panel M-DP may be disposed on the second surface SF2 of the frame FM. The bottom surface D-LF of the mother panel M-DP may contact the second surface SF2 of the frame FM. The mother panel M-DP may be placed and fixed on the second surface SF2 of the frame FM. By disposing the mother panel M-DP on the molding unit MU, a closed space in which a molding space filled with the resin RS is blocked from the outside may be formed.

[0152] In a plane, compared with each of the unit panels U-DP (refer to Figure 8 ), the openings M-OP1 and M-OP2 defined in the frame FM may be disposed inside. That is, in a plane defined by a first direction DR1 and a second direction DR2, the planar area of each of the openings M-OP1 and M-OP2 defined in the frame FM may be smaller than the planar area of each of the plurality of unit panels U-DP (refer to Figure 8 ). However, the embodiments of the present invention are not limited thereto. For example, the planar area of each of the openings M-OP1 and M-OP2 defined in the frame FM may be equal to the planar area of each of the plurality of unit panels U-DP (refer to Figure 8 ).

[0153] Referring to Figure 11D , a method for manufacturing a display device according to an embodiment of the present invention may include a process of inverting the mother panel M-DP on the molding unit MU in a vertical direction or turning the mother panel M-DP on the molding unit MU upside down. The molding unit MU and the mother panel M-DP may be inverted in a vertical direction such that the first surface SF1 of the frame FM faces upward in a state where the mother panel M-DP is disposed on the second surface SF2 of the frame FM. In a vertically inverted state, the mother panel M-DP may be disposed below the molding unit MU. In a vertically inverted state, the top surface D-UF of the mother panel M-DP may face downward, and the bottom surface D-LF of the mother panel M-DP may face upward.

[0154] In the process of vertically inverting the molding unit MU and the mother panel M-DP, the resin RS filled in the molding space may not be separated from the molding space. Since the molding space filled with the resin RS forms a closed space blocked from the outside by the mother panel M-DP, the resin RS may not be separated from the molding space in the process of vertically inverting the molding unit MU and the mother panel M-DP.

[0155] Referring to Figure 11E , a method of manufacturing a display device according to an embodiment of the present invention may include a process of exposing a plurality of holes OH defined in the first plate PT1 by removing the second plate PT2.

[0156] After vertically inverting the molding unit MU and the mother panel M-DP so that the first surface SF1 of the frame FM faces upward, the second plate PT2 may be removed from the molding unit MU to expose a plurality of holes OH defined in the first plate PT1. When the second plate PT2 is removed, portions of the resin RS provided to the openings M-OP1 and M-OP2 may be exposed by the plurality of holes OH. In addition, since the second plate PT2 is removed, portions of the resin RS provided in the dummy opening S-OP may be exposed to the outside. The plurality of holes OH may be used to improve heat transfer to the resin RS in the process of curing the resin RS by supplying heat to the resin RS, which will be described later. In addition, the plurality of holes OH may serve as a path for easily discharging the evaporating solvent when the resin RS is thermally cured.

[0157] Referring to Figure 11F , a method of manufacturing a display device according to an embodiment of the present invention may include a process of curing the resin RS by supplying heat HT and a process of extruding the resin RS by moving the first plate PT1 closer to the mother panel M-DP. In an embodiment, the process of curing the resin RS by supplying heat HT and the process of extruding the resin RS by moving the first plate PT1 closer to the mother panel M-DP may be performed simultaneously.

[0158] The resin RS provided to the openings M-OP1 and M-OP2 and the dummy opening S-OP may be cured by a thermal curing method. Since heat HT is supplied to the resin RS provided in the openings M-OP1 and M-OP2 and the dummy opening S-OP, the resin RS provided to the openings M-OP1 and M-OP2 and the dummy opening S-OP may be cured. As Figure 11F shown, heat HT may be supplied to the resin RS in a state where the second plate PT2 is removed and the plurality of holes OH are exposed to the outside.

[0159] While the resin RS is being cured, the first plate PT1 can move closer to the mother panel M-DP. The first plate PT1 can move downward toward the mother panel M-DP, and the resin RS provided in the molding space can be extruded by the movement of the first plate PT1. In an embodiment, the resin RS can have a second thickness d2. The second thickness d2 of the cured resin RS can be different from the first thickness d1 of the resin RS before curing provided in the molding space. The second thickness d2 of the cured resin RS can be less than the first thickness d1 of the resin RS before curing. In an embodiment, the second thickness d2 can be about 30 μm or greater and about 300 μm or less. In an embodiment, for example, the second thickness d2 can be about 200 μm. In the present specification, the second thickness d2 of the cured resin RS can represent the vertical distance from the top surface P-SF2 of the first plate PT1 to the bottom surface D-LF of the mother panel M-DP, and the vertical distance is measured in a state where the resin RS is extruded by the first plate PT1. The second thickness d2 of the cured resin RS can correspond to the thickness of the protective layer LM formed after the resin RS is cured.

[0160] In an embodiment, the resin layer RS can include a thermosetting resin. The thermosetting resin can shrink during thermal curing. As the curing is performed, the thermosetting resin can decrease in volume due to solvent evaporation. Here, when the evaporation efficiency of the solvent is low, since the degree of shrinkage of the solvent in the entire resin RS is different, it may not be possible to obtain a uniform thin film. In an embodiment of the present invention, when the resin RS is cured, since the resin RS is extruded by the first plate PT1 having a plurality of holes OH, the solvent evaporation efficiency can be improved, and the degree of shrinkage of the solvent in the entire resin RS can be substantially uniform. Therefore, a protective layer LM having uniform thin film characteristics can be formed.

[0161] Refer to Figure 11G and Figure 11H , a method for manufacturing a display device according to an embodiment of the present invention can include a process of removing the molding unit MU (refer to Figure 11A ). After the protective layer LM is formed, the molding unit MU can be removed from the mother panel M-DP. Therefore, the protective layer LM can remain on the bottom surface D-LF of the mother panel M-DP.

[0162] Refer to together Figures 11F to 11H , as the resin RS provided in each of the openings M-OP1 and M-OP2 is cured, a plurality of protective layers LM corresponding to the plurality of unit panels U-DP can be formed on the bottom surface D-LF of the mother panel M-DP. The protective layers LM can be respectively provided on the bottom surfaces D-LF of the unit panels U-DP. In addition, the resin RS provided in the dummy opening S-OP can be cured to form a dummy layer DUM on the bottom surface D-LF of the mother panel M-DP.

[0163] Figure 11H is a plan view showing a protective layer LM and a dummy layer DUM on a bottom surface D-LF of a mother panel M-DP provided in Figure 11G . In Figure 11H , the edges of the unit panel U-DP are represented by dashed lines, and the edges of the unit panel U-DP can be used as cutting lines in a cutting process to be described later.

[0164] Referring to Figure 11H , on a plane, the area of each of the plurality of protective layers LM can be smaller than the area of each of the plurality of unit panels U-DP. That is, on a plane, the edges of the protective layer LM can be provided inside the edges of the unit panel U-DP. On a plane, the protective layer LM can have a shape corresponding to the openings M-OP1 (refer to Figure 11F ) and M-OP2 (refer to Figure 11F ). The dummy layer DUM can be formed on a portion of the bottom surface D-LF of the mother panel M-DP corresponding to the region between adjacent unit panels U-DP. On a plane, the dummy layer DUM can have a shape corresponding to the dummy opening S-OP. On a plane, the dummy layer DUM can not overlap with the unit panel U-DP. The dummy layer DUM can be provided outside each of the unit panels U-DP.

[0165] In an embodiment, a pattern corresponding to a plurality of holes OH can be formed on the bottom surface of the protective layer LM. The pattern can be a transfer pattern formed in a process of extruding a resin RS through a first plate PT1. On a plane, the pattern formed on the bottom surface of the protective layer LM can have a shape corresponding to the shape of the plurality of holes OH. A part of the bottom surface of the protective layer LM extruded by the first plate PT1 can form a flat surface. The portion of the bottom surface of the protective layer LM overlapping with the plurality of holes OH can have a pattern corresponding to the plurality of holes OH. The pattern can be recessed or protruded from the bottom surface of the protective layer LM. In an embodiment, for example, as shown in Figure 11G , the protective layer LM can include a plurality of grooves HP recessed from the bottom surface of the protective layer LM. The portion of the bottom surface of the protective layer LM overlapping with the plurality of holes OH can have a curing rate and a solvent evaporation rate different from those of a part not overlapping with the plurality of holes OH. Therefore, a pattern corresponding to the shape of the plurality of holes OH can be formed on the bottom surface of the protective layer LM.

[0166] Referring to Figure 11I and Figure 11J , a method for manufacturing a display device according to an embodiment of the present invention can further include a process of cutting the mother panel M-DP.

[0167] After the process of removing the molding unit MU from the mother panel M-DP, a process of cutting the mother panel M-DP along a cutting line corresponding to the edge of each of the plurality of unit panels U-DP is performed.

[0168] Referring Figure 11I , the mother panel M-DP can be flipped or inverted in the third direction DR3. That is, the mother panel M-DP can be vertically reversed. Thus, the top surface D-UF of the mother panel M-DP can face upward, and the bottom surface D-LF of the mother panel M-DP can face downward.

[0169] The cutting tool CT can be disposed on the mother panel M-DP. The cutting tool CT can be provided on the top surface D-UF of the mother panel M-DP. In an embodiment, for example, the cutting tool CT can include a knife or a blade. However, the embodiments of the present invention are not limited thereto.

[0170] In Figure 11I , the edges of the unit panels U-DP are represented by dashed lines, and the edges can define the cutting line CL of the mother panel M-DP. In each of the unit panels U-DP, the cutting line CL can be defined between the protective layer LM and the dummy layer DUM. The cutting tool CT can move along the cutting line CL to separate the unit panels U-DP from the mother panel M-DP. Thus, the plurality of unit panels U-DP can be separated into Figure 11J the individual unit panels U-DP shown in

[0171] Generally, the protective layer LM can be formed on the rear surface of the display panel DP by a screen printing method using a wire mesh mask. The screen printing method places a screen mask having holes defined in a predetermined pattern on a substrate, supplies a resin onto the screen mask, and squeezes the resin by using an extrusion unit such as a squeegee, thereby allowing the resin to pass through the holes in the mask and form a predetermined pattern on the substrate. However, since the screen mask uses steel wires, deflection may occur due to tension, thereby limiting the application thickness of the resin. Therefore, it may not be possible to achieve a protective layer having a thickness greater than a specific level. In addition, when the protective layer LM is formed by using a film attachment method instead of a resin application method, since layers having heat dissipation functions, light blocking functions, electromagnetic wave blocking functions, and shock absorption functions need to be separately provided on the rear surface of the display panel DP, this requires a plurality of processes. Therefore, the process efficiency may be reduced, and the thickness of the protective layer LM increases, reducing the miniaturization or thinning of the display device DD.

[0172] The apparatus and method for manufacturing a display device according to an embodiment of the present invention use a molding unit having a predetermined height and in which a molding space for accommodating a resin is defined to form a protective layer on the rear surface of the display panel, thereby ensuring a thickness sufficient to provide structural stability of the protective layer. In addition, according to an embodiment of the present invention, the protective layer can be formed by directly applying a resin including a plurality of fillers performing various functions on the rear surface of the display panel. Therefore, the process can be simplified, the thickness of the display device can be reduced, the components can be simplified, and the manufacturing process efficiency can be improved. In addition, the method for manufacturing a display device according to an embodiment of the present invention can use a plate in which a plurality of holes are defined and which is vertically movable in the molding space to form a protective layer having uniform thin film characteristics on the rear surface of the display panel. Heat transfer to the resin provided in the molding space can be improved through the plurality of holes, and the uniformity of heat transfer can be increased to improve the curing efficiency. In addition, the solvent evaporated from the resin during thermal curing can be easily discharged through the plurality of holes, thereby improving the durability of the protective layer formed thereafter. Since the volume of the resin decreases due to solvent evaporation during thermal curing, a uniform thin film may not be obtained in the case of low evaporation efficiency. However, according to an embodiment of the present invention, since evaporation of the solvent can be efficiently generated through the plurality of holes, a uniform thin film can be formed and the durability of the protective layer can be improved. Therefore, a display device having improved reliability can be provided.

[0173] The display device according to an embodiment of the present invention can obtain the effect of reducing the thickness of the display device by simplifying a plurality of functional members via a protective layer that performs various functions and is provided under the display panel.

[0174] The apparatus for manufacturing a display device according to an embodiment of the present invention can improve the efficiency of the process of manufacturing the display device and provide a display device including a protective layer having uniform thin film characteristics by including a plate in which a plurality of holes are defined and which is vertically movable in the molding space.

[0175] The method for manufacturing a display device according to an embodiment of the present invention can form a protective layer having uniform thin film characteristics on the rear surface of the display panel by using a plate in which a plurality of holes are defined and which is vertically movable in the molding space. Therefore, a display device having improved reliability can be provided.

[0176] The present invention should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0177] Although the present invention has been specifically shown and described with reference to embodiments thereof, those of ordinary skill in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of the present invention as defined by the appended claims.

Claims

1. An apparatus for manufacturing a display device, wherein, The device includes: A molding unit, including: a frame, the frame including a first surface and a second surface opposite to the first surface, wherein a mask opening is defined in the frame and penetrates from the first surface to the second surface; and a plate, the plate being disposed adjacent to the first surface of the frame, wherein a molding space is defined by the frame and the plate. Wherein, the plate includes: A first plate, disposed in the mask opening, wherein a plurality of holes are defined in the first plate; and A second plate, having a plate shape and disposed on the first surface of the frame to at least overlap the plurality of holes in a plane, and The first plate moves in a direction perpendicular to each of the first surface and the second surface in a space between the first surface and the second surface of the frame.

2. The device according to claim 1, wherein The second plate is detachably coupled to the frame.

3. The device according to claim 1, wherein, The second plate includes a plurality of protrusions respectively embedded in the plurality of holes defined in the first plate.

4. The device according to claim 1, wherein, The device further includes a control unit for controlling the movement of the first plate.

5. The device according to claim 1, wherein, The molding unit further includes a support member, the support member being disposed in the mask opening and connected to the frame to divide the mask opening into a plurality of openings.

6. The device according to claim 5, wherein, The support member is integrally formed with the frame as a single integral and inseparable component.

7. The apparatus according to claim 5, wherein The mask opening includes a first opening and a second opening separated from each other by the support member. The first plate includes: A first sub-plate, disposed in the first opening; and A second sub-plate, disposed in the second opening, and Each of the first sub-plate and the second sub-plate moves in the direction perpendicular to each of the first surface and the second surface.

8. The apparatus according to claim 1, wherein A mother panel is disposed on the second surface of the frame. The mother panel includes: One surface; An opposite surface, opposite to the one surface; A substrate, disposed between the one surface and the opposite surface; and A display element layer, disposed on the substrate to face the one surface, and the display element layer overlaps the mask opening between the one surface and the opposite surface, and The opposite surface of the mother panel contacts the frame.

9. The device according to claim 1, wherein The first plate includes metal.

10. The device according to claim 1, wherein, The first plate and the frame are made of the same material.

11. A method for manufacturing a display device, wherein, The method includes: Preparing a molding unit, the molding unit including: a frame, a mask opening is defined in the frame and penetrates from a first surface of the frame to a second surface of the frame, the first surface and the second surface are opposite to each other; a first plate, disposed in the mask opening and a plurality of holes are defined in the first plate; and a second plate, having a plate shape and disposed on the first surface of the frame to overlap the plurality of holes in a plane. Providing resin into a molding space defined by the frame, the first plate and the second plate in a state where the second surface of the molding unit is arranged to face upward. Arranging a mother panel on the second surface of the frame. Invert the molding unit and the mother panel so that the first surface of the frame faces upward with the mother panel disposed on the second surface of the frame; Expose the plurality of holes defined in the first plate by removing the second plate; Cure the resin by supplying heat to the resin; Extrude the resin by moving the first plate in a direction toward the mother panel; and Remove the molding unit.

12. The method according to claim 11, wherein, The supplying of the heat to the resin and the extruding of the resin are performed simultaneously.

13. The method according to claim 11, wherein, The mother panel includes: One surface; An opposite surface, opposite to the one surface; A substrate, disposed between the one surface and the opposite surface; and A display element layer, disposed on the substrate to face the one surface, and the display element layer overlaps with the mask opening between the one surface and the opposite surface, and The opposite surface of the mother panel contacts the frame.

14. The method according to claim 11, wherein, A protective layer is formed by the curing of the resin and the extruding of the resin, and The protective layer has a thickness smaller than the thickness of the resin before the curing of the resin.

15. The method according to claim 14, wherein, In the extruding of the resin, a pattern corresponding to the plurality of holes is formed on the bottom surface of the protective layer spaced apart from the mother panel.

16. The method according to claim 11, wherein The mother panel includes a plurality of unit panels, and The molding unit further includes a support member disposed in the mask opening to divide the mask opening into a plurality of openings respectively corresponding to the plurality of unit panels.

17. The method according to claim 16, wherein, The first plate includes a plurality of sub-plates respectively disposed in the plurality of openings.

18. The method according to claim 16, wherein, The method further includes: after removing the molding unit, cutting the mother panel along a cutting line corresponding to the edge of each of the plurality of unit panels.

19. The method according to claim 11, wherein, The resin includes: a matrix resin containing a thermosetting resin and a plurality of fillers dispersed in the matrix resin.

20. A display device, wherein, The display device includes: A display panel; and A protective layer, including: A matrix layer, disposed on the rear surface of the display panel and including a thermosetting resin; and A plurality of fillers, dispersed in the matrix layer, wherein the protective layer has a top surface adjacent to the rear surface of the display panel and a bottom surface opposite to the top surface, and the protective layer is spaced apart from the rear surface of the display panel, and The protective layer includes a plurality of grooves defined on the bottom surface of the protective layer.

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