Telescopic display

Abstract

A display may have a stretchable portion with a hermetically sealed rigid pixel island. A flexible interconnect region may be interposed between the hermetically sealed rigid pixel islands. These hermetically sealed rigid pixel islands may include organic light emitting diode (OLED) pixels. The conductive cutting structure may have an undercut that causes discontinuity in the conductive OLED layer to mitigate lateral leakage. The conductive dicing structure may also be electrically connected to a cathode for the OLED pixels and provide a cathode voltage to the cathode. A first inorganic passivation layer and a second inorganic passivation layer may be formed over the OLED pixels. A plurality of discrete portions of an organic inkjet printed layer may be interposed between the first inorganic passivation layer and the second inorganic passivation layer.

Description

[0001] This application claims priority to U.S. Patent Application No. 18 / 483,653, filed Oct. 10, 2023, and U.S. Provisional Patent Application No. 63 / 476,496, filed Dec. 21, 2022, the entire disclosures of which are hereby incorporated by reference. BACKGROUND OF THE INVENTION

[0002] The present disclosure generally relates to electronic devices and, more particularly, to electronic devices having a display.

[0003] Electronic devices typically include a display. For example, an electronic device may have an organic light-emitting diode (OLED) display based on organic light-emitting diode pixels. In this type of display, each pixel includes a light-emitting diode and a thin-film transistor for controlling the application of a signal to the light-emitting diode to produce light. The light-emitting diode may include an OLED layer positioned between an anode and a cathode. Conventional displays can be rigid. SUMMARY OF THE INVENTION

[0004] A display may include: a first organic light-emitting diode pixel including a first electrode; a second organic light-emitting diode pixel including a second electrode; a common electrode for the first organic light-emitting diode pixel and the second organic light-emitting diode pixel; a conductive layer having a first portion forming part of the first organic light-emitting diode pixel and a second portion forming part of the second organic light-emitting diode pixel; and a conductive structure interposed between the first electrode and the second electrode. The conductive structure may have an undercut that causes a discontinuity in the conductive layer, and the conductive structure is electrically connected to the common electrode.

[0005] A display may include: a plurality of pixels, where each pixel has a respective anode; a common cathode for the plurality of pixels; organic light-emitting diode layers for the plurality of pixels interposed between the anodes and the common cathode; a first inorganic passivation layer formed over the common cathode; a second inorganic passivation layer formed over the first inorganic passivation layer; and an organic layer having a plurality of discrete portions positioned between the first inorganic passivation layer and the second inorganic passivation layer. In some portions of the first inorganic passivation layer and the second inorganic passivation layer, there are portions that do not include the organic layer between the first inorganic passivation layer and the second inorganic passivation layer.

[0006] A display may include: a plurality of hermetically sealed rigid pixel islands; and a flexible interconnect region interposed between the plurality of hermetically sealed rigid pixel islands. Each hermetically sealed rigid pixel island may include: at least one organic light emitting diode pixel having an organic light emitting diode layer interposed between a first electrode and a second electrode; and a conductive cut structure that causes a discontinuity in one of the organic light emitting diode layers and is electrically connected to the second electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic diagram of an exemplary electronic device having a display according to some embodiments.

[0008] Figure 2 is a schematic diagram of an exemplary display according to some embodiments.

[0009] Figure 3 is a top view of an exemplary display having rigid pixel islands on a flexible substrate according to some embodiments.

[0010] Figure 4 is a cross-sectional side view of an exemplary display having rigid pixel islands on a flexible substrate according to some embodiments.

[0011] Figure 5 is a top view of an exemplary rigid pixel island according to some embodiments.

[0012] Figure 6 is a cross-sectional side view of an exemplary rigid pixel island having a conductive cut structure according to some embodiments.

[0013] Figure 7 is a cross-sectional side view of an exemplary rigid pixel island having a conductive cut structure with two associated undercuts according to some embodiments.

[0014] Figure 8 is a top view of an exemplary display having a rigid central portion and a stretchable edge portion according to some embodiments.

[0015] Figure 9 is a cross-sectional side view of an exemplary display having a rigid central portion and a stretchable edge portion according to some embodiments.

[0016] Figure 10 is a cross-sectional side view of an edge of a rigid pixel island having an OLED layer and a passivation layer etched simultaneously according to some embodiments.

[0017] Figure 11A cross-sectional side view of an edge of a rigid pixel island having an OLED layer and a passivation layer etched at different times, according to some embodiments.

[0018] Figure 12 A cross-sectional side view of an exemplary display having an inkjet-printed planarization layer between a first passivation layer and a second passivation layer, according to some embodiments.

[0019] Figure 13 A cross-sectional side view of an edge of a rigid pixel island having an OLED layer and a passivation layer etched simultaneously and then covered by a touch inorganic layer and a touch sensor metal layer, according to some embodiments.

[0020] Figure 14 A cross-sectional side view of an edge of a rigid pixel island having a cathode dehumidification layer, according to some embodiments. Detailed Description

[0021] Figure 1 Exemplary types of electronic devices that may be provided with a display are shown. The electronic device 10 may be a computing device such as a laptop computer, a computer monitor including an embedded computer, a tablet computer, a cellular phone, a media player, or other handheld or portable electronic device, a smaller device (such as a wristwatch device, a pendant device, a headset or earpiece device, a device embedded in glasses, or other equipment worn on a user's head, or other wearable or micro devices), a display, a computer monitor including an embedded computer, a computer monitor not including an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which electronic equipment having a display is installed in a kiosk or a vehicle), or other electronic equipment. The electronic device 10 may have the shape of a pair of glasses (e.g., a support frame), may form a housing having a helmet shape, or may have other configurations for assisting in mounting and fixing components of one or more displays on or near a user's head.

[0022] As Figure 1 shown, the electronic device 10 may include control circuitry 16 for supporting the operation of the device 10. The control circuitry may include storage devices such as hard disk drive storage, non-volatile memory (e.g., flash memory configured to form a solid state drive or other electrically programmable read only memory), volatile memory (e.g., static random access memory or dynamic random access memory), and the like. Processing circuitry in the control circuitry 16 may be used to control the operation of the device 10. The processing circuitry may be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio chips, application specific integrated circuits, etc.

[0023] Input-output circuits in device 10, such as input-output device 12, can be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input-output device 12 can include buttons, joysticks, rollers, touchpads, keypads, keyboards, microphones, speakers, audio generators, vibrators, cameras, sensors, light-emitting diodes and other status indicators, data ports, etc. A user can control the operation of device 10 by supplying commands via input-output device 12 and can receive status information and other outputs from device 10 using the output resources of input-output device 12.

[0024] Input-output device 12 can include one or more displays, such as display 14. Display 14 can be a liquid crystal display, an organic light-emitting diode display, or any other desired type of display. Display 14 can be a touchscreen display that includes a touch sensor for acquiring touch input from a user, or display 14 can be insensitive to touch. The touch sensor of display 14 can be based on an array of capacitive touch sensor electrodes, an acoustic touch sensor structure, a resistive touch component, a force-based touch sensor structure, a light-based touch sensor, or other suitable touch sensor arrangements. The touch sensor for display 14 can be formed by electrodes formed on a common display substrate having the pixels of display 14, or can be formed by a separate touch sensor panel that overlaps the pixels of display 14. If desired, display 14 can be insensitive to touch (i.e., the touch sensor can be omitted). Display 14 in electronic device 10 can be a heads-up display that can be viewed without the user having to move away from a typical viewing point, or can be a head-mounted display incorporated into a device worn on the user's head. If desired, display 14 can also be a holographic display for displaying holograms.

[0025] Control circuit 16 can be used to run software on device 10, such as operating system code and application programs. During the operation of device 10, the software running on control circuit 16 can display images on display 14.

[0026] Figure 2 Illustration of an exemplary display. As Figure 2 shown, display 14 can include layers, such as substrate layer 26. Substrate layers such as layer 26 can be formed from a rectangular planar material layer or a material layer having other shapes (e.g., circular or other shapes having one or more curved edges and / or straight edges). The substrate layer of display 14 can include a glass layer, a polymer layer, a silicon layer, a composite film containing polymer materials and inorganic materials, a metal foil, etc.

[0027] The display 14 may have an array of pixels 22 for displaying images to a user, such as pixel array 28. The pixels 22 in the array 28 may be arranged in rows and columns. The edges of the array 28 may be straight or curved (i.e., each row and / or each column of the pixels 22 in the array 28 may have the same length or may have different lengths). Any suitable number of rows and columns may be present in the array 28 (e.g., ten or more, one hundred or more, or one thousand or more, etc.). The display 14 may include pixels 22 of different colors. By way of example, the display 14 may include red pixels, green pixels, and blue pixels.

[0028] The display driver circuit 20 may be used to control the operation of the pixels 28. The display driver circuit 20 may be formed of integrated circuits, thin film transistor circuits, and / or other suitable circuits. Figure 2 An exemplary display driver circuit 20 includes a display driver circuit 20A and additional display driver circuits such as a gate driver circuit 20B. The gate driver circuit 20B may be formed along one or more edges of the display 14. For example, the gate driver circuit 20B may be arranged along the left and right sides of the display 14, as Figure 2 shown.

[0029] As Figure 2 shown, the display driver circuit 20A (e.g., one or more display driver integrated circuits, thin film transistor circuits, etc.) may include communication circuitry for communicating with the system control circuit via a signal path 24. The path 24 may be formed of traces on a flexible printed circuit or other cables. The control circuit may be located on one or more printed circuits in the electronic device 10. During operation, the control circuit (e.g., Figure 1 the control circuit 16) may provide image data to a display driver integrated circuit in a circuit such as circuit 20 for causing an image to be displayed on the display 14. Figure 2 The display driver circuit 20A of

[0030] is located at the top of the display 14. This is merely exemplary. The display driver circuit 20A may be located at both the top and bottom of the display 14, or may be located in other parts of the device 10. Figure 2 In order to display an image on the pixels 22, the display driver circuit 20A may provide corresponding image data to the data lines D while sending control signals to a supporting display driver circuit such as the gate driver circuit 20B via a signal path 30. With

[0031] The gate driver circuit 20B (sometimes referred to as a gate line driver circuit or a horizontal control signal circuit) can be implemented using one or more integrated circuits and / or can be implemented using thin-film transistor circuits on the substrate 26. The horizontal control line G (sometimes referred to as a gate line, a scan line, an emission control line, etc.) extends horizontally across the display 14. Each gate line G is associated with a corresponding row of pixels 22. If desired, there can be multiple horizontal control lines such as the gate line G associated with each row of pixels. Separate control signal paths and / or global signal paths in the display 14 can also be used to distribute other signals (e.g., power signals, etc.).

[0032] The gate driver circuit 20B can assert control signals on the gate lines G in the display 14. For example, the gate driver circuit 20B can receive a clock signal and other control signals from the circuit 20A on the path 30 and, in response to the received signals, can assert the gate line signals on the gate lines G in sequence starting from the gate line signal G in the first row of pixels 22 in the array 28. When each gate line is asserted, data from the data line D can be loaded into the corresponding row of pixels. In this way, control circuits such as the display driver circuits 20A and 20B can provide signals for the pixels 22 to indicate that the pixels 22 display a desired image on the display 14. Each pixel 22 can have a light-emitting diode and circuits (e.g., thin-film circuits on the substrate 26) that respond to the control signals and data signals from the display driver circuit 20.

[0033] The gate driver circuit 20B can include gate driver circuit blocks, such as gate driver row blocks. Each gate driver row block can include circuits such as output buffers and other output driver circuits, register circuits (e.g., registers that can be chained together to form a shift register), and signal lines, power lines, and other interconnects. Each gate driver row block can provide one or more gate signals to one or more corresponding gate lines in the corresponding pixel row of the pixel array in the active area of the display 14.

[0034] For some electronic devices, it may be desirable for the display 14 to be stretchable. For example, a stretchable display can allow the display to have portions with compound curvature (curvature along multiple axes). To allow the display to be highly stretchable, the display can have rigid pixel islands connected by highly stretchable interconnect regions.

[0035] Figure 3 is a top view of an exemplary stretchable display having rigid pixel islands and highly stretchable interconnect regions. As Figure 3As shown, display 14 may include rigid pixel islands 42 (sometimes referred to as rigid pixel portions 42, rigid portions 42, etc.). Each rigid pixel island 42 includes one or more pixels 22. Rigid pixel islands may be relatively rigid (e.g., less than a 1% tensile strain threshold). However, the rigid pixel islands are connected by flexible interconnect regions 46.

[0036] The flexible interconnect region 46 may be formed, for example, by a flexible substrate 48 (sometimes referred to as a polymer layer 48, a highly stretchable polymer material 48, a substrate 48, a stretchable substrate 48, a flexible substrate 48, etc.). The flexible substrate 48 may be formed by a polymer material or another desired material. The flexible substrate 48 may have a Young's modulus of less than 10 GPa, less than 5 GPa, less than 3 GPa, less than 2 GPa, less than 1 GPa, etc. The highly stretchable polymer material 48 may be formed as a blanket layer across the entire display. In the rigid pixel islands 42, additional pixel components are included on top of the highly stretchable polymer material, so that the flexibility of the rigid pixel islands is reduced. However, between the rigid pixel islands, the highly stretchable polymer material maintains its flexibility.

[0037] The flexible interconnect regions 46 between the rigid pixel islands may have a tensile strain threshold greater than 10%, greater than 15%, greater than 20%, etc. By including flexible interconnect regions between the rigid pixel islands, the entire display may have a tensile strain threshold greater than 3% (e.g., 5%, between 3% and 10%, etc.).

[0038] Metal signal lines such as signal line 44 may be included in a flexible interconnect region 46 (sometimes referred to as a flexible interconnect portion 46). Signal line 44 may be used to form a data line (e.g., Figure 2 data lines D), gate lines (eg, Figure 2 The signal lines 44 may include gate lines G in the flexible substrate 48), power lines, etc. The signal lines may have footprints with one or more bends to improve the stretchability of the signal lines. The signal lines 44 may sometimes be referred to as having a serpentine shape. The signal lines 44 overlap with the flexible substrate 48 and may be formed of any desired material (e.g., titanium).

[0039] If desired, one or more portions of polymer layer 48 may be removed in flexible interconnect 46 to improve the stretchability of the display. As shown, there may be one or more optional cutouts such as cutout 50. The cutouts may be formed between rigid pixel islands. The cutouts do not overlap with signal lines 44 (which are formed on polymer layer 48). Including the cutouts may improve the stretchability of display 14.

[0040] Figure 4 is a cross-sectional side view of an exemplary display having rigid pixel islands. Figure 4As shown, the polymer substrate 48 extends beneath the rigid pixel islands. A metal shielding layer 52 (sometimes referred to as a bottom shielding metal (BSM) 52, metal layer 52, etc.) is formed on the substrate 48. The metal layer 52 can help improve the robustness of the rigid pixel islands to avoid damage during patterning and hermetic sealing (e.g., during manufacturing). The metal layer 52 can also protect the rigid pixel islands from damage during operation of the electronic device 10. The metal layer can be relatively rigid (e.g., more rigid than the substrate 48). In other words, the metal layer 52 can have a higher Young's modulus compared to the substrate 48.

[0041] One or more insulating layers (such as insulating layers 54 and 56) can be formed above the metal layer. The insulating layers 54 and 56 can be formed of a dielectric material such as polyimide, an organic resin, or any other desired material. One or more conductive components (e.g., signal lines and / or vias) for controlling the operation of the pixels in the rigid pixel islands can be embedded in or formed on the insulating layers.

[0042] Figure 4 Shown is a way in which the conductive layer 58 (sometimes referred to as the metal layer 58) can have portions embedded within one or more of the insulating layers 56. The conductive layer 58 can serve as a signal line for the display. As an example, the conductive layer 58 can provide a cathode voltage to the pixels of the rigid pixel island 42.

[0043] The pixels in the rigid pixel island 42 can be organic light-emitting diode (OLED) pixels. In Figure 4 it, two OLED pixels are shown. The first pixel 22-1 has a corresponding electrode 62-1, and the second pixel 22-2 has a corresponding electrode 62-2. Each electrode 62 can receive a per-pixel voltage to control the light emitted by that pixel. The pixels can share a common electrode 66, which is provided with a common voltage for all the pixels in the rigid pixel island. In the example described herein, the electrodes 62-1 and 62-2 are anodes, and the electrode 66 is a common cathode. However, it should be understood that the opposite arrangement (where the electrodes 62-1 and 62-2 are cathodes and the electrode 66 is a common anode) can alternatively be used if desired.

[0044] An organic light emitting diode layer, such as organic light emitting diode layer 64, may be interposed between electrode 62 and common electrode 66. The organic light emitting diode layer may include a hole injection layer, a hole transport layer, an emission layer, an electron transport layer, and an electron injection layer (as a possible arrangement). The OLED layer may include a first OLED layer 64-1 for the first pixel 22-1 and a second OLED layer 64-2 for the second pixel 22-2. The first pixel 22-1 may emit light of a first color, and thus the OLED layer 64-1 includes an emission layer of the first color. The second pixel 22-2 may emit light of a second color, and thus the OLED layer 64-2 includes an emission layer of the second color. A pixel defining layer 86 may be included, which defines an opening through which the pixel emits light. The pixel defining layer 86 may be light transmissive (e.g., having a transmittance greater than 40%, greater than 60%, greater than 80%, greater than 90%, etc.).

[0045] Figure 4 The rigid pixel island of also includes one or more conductive cut structures. Figure 4 The first conductive cut structure 68-1 (sometimes referred to as the first conductive cut structure portion 68-1), the second conductive cut structure 68-2 (sometimes referred to as the second conductive cut structure portion 68-2), and the third conductive cut structure 68-3 (sometimes referred to as the third conductive cut structure portion 68-3) are shown. The conductive cut structure may provide a cathode voltage to the cathodes 66 of the pixels in the rigid pixel island 42. One or more conductive vias 60 may be included that electrically connect the conductive layer 58 to the conductive cut structure 68. Thus, the conductive cut structure 68 (sometimes referred to as the conductive cut structure portion 68) receives the cathode voltage from the conductive layer 58 and the vias 60. The conductive cut structure may be in direct contact with the cathode 66.

[0046] In addition to providing the cathode voltage to the cathode 66, the cut structure 68 may also cause a discontinuity in one or more of the layers in the OLED layer 64. In the absence of a discontinuity in the OLED layer 64, lateral leakage may cause crosstalk between pixels. For example, when pixel 22-1 is turned on and pixel 22-2 is normally off, leakage current may pass through the conductive OLED layer to pixel 22-2 and cause the normally off pixel 22-2 to emit light undesirably.

[0047] As will be shown and discussed in more detail in conjunction with Figure 6 and Figure 7 The cut structure 68 may have an undercut that causes a discontinuity in the OLED layer 64 during deposition of the OLED layer 64. The cut structure may also cause a discontinuity in the cathode 66 during deposition of the cathode 66. However, since the cut structure 68 is conductive and in direct contact with the cathode 66, the cathode voltage is still distributed across the cathodes for all pixels in the pixel as needed.

[0048] One or more encapsulation layers may be formed over the pixels in the rigid pixel islands. The one or more encapsulation layers may contribute to the rigidity of the rigid pixel islands. Accordingly, these encapsulation layers are omitted in the flexible interconnect regions 46 between the rigid pixel islands. However, each rigid pixel island still includes a corresponding encapsulation layer such that each rigid pixel island is hermetically sealed.

[0049] As Figure 4 shown, a first passivation layer 70 is formed over the cathode 66. The passivation layer 70 may be formed of, for example, an inorganic material. The passivation layer 70 may be deposited using, for example, chemical vapor deposition (CVD) or atomic layer deposition (ALD). During the deposition of the passivation layer 70, there may be gaps between the portion of the passivation layer 70 over the anode and the portion of the passivation layer 70 over the cut structure. If not attended to, these gaps may cause defects in the hermetic seal of the rigid pixel islands.

[0050] To ensure a hermetic seal in the rigid pixel islands 42, a planarization layer 74 (sometimes referred to as an inkjet printed layer 74, an organic layer 74, etc.) may be formed in the gaps between the passivation layers 70. The planarization layer 74 may be formed of an organic material (e.g., deposited using inkjet printing). During the formation of the planarization layer 74, the planarization layer 74 may be deposited across the rigid pixel islands (e.g., via inkjet printing). Subsequently, most of the planarization layer 74 is removed. However, multiple discrete portions of the planarization layer 74 remain in small gaps in the passivation layer 70 (e.g., between the portion of the passivation layer 70 over the anode and the portion of the passivation layer 70 over the cut structure). This effectively planarizes the passivation layer 70 and allows an additional passivation layer 72 to be formed over the passivation layer 70.

[0051] Including multiple discrete portions of the layer 74 (e.g., only when necessary and not a blanket layer across the entire display or rigid pixel island) allows for an effective hermetic seal while reducing the thickness of the rigid pixel islands as well as the manufacturing cost and complexity.

[0052] The passivation layer 72 may be formed of, for example, an inorganic material. The passivation layer 72 may be deposited using, for example, chemical vapor deposition (CVD) or atomic layer deposition (ALD). The passivation layers 70 and 72 and the inkjet printed layer 74 together form a hermetic seal that prevents moisture from reaching the OLED layer 64 in the rigid pixel islands 42. As Figure 4 shown, in some portions of the first inorganic passivation layer 70 and the second inorganic passivation layer 72, there are portions that do not include the layer 74 between the first inorganic passivation layer and the second inorganic passivation layer.

[0053] The passivation layer 70 may have a thickness of less than 2 microns, less than 1 micron, less than 500 nanometers, less than 300 nanometers, less than 200 nanometers, etc. The passivation layer 72 may have a thickness of less than 2 microns, less than 1 micron, less than 500 nanometers, less than 300 nanometers, less than 200 nanometers, etc.

[0054] An additional planarization layer 76 (sometimes referred to as an encapsulation layer 76) may be formed over the passivation layer 72. The planarization layer 76 may be formed of an organic material (e.g., deposited using inkjet printing).

[0055] An additional layer 78 may be formed over the planarization layer 76. The layer 78 may be an inorganic dielectric layer formed under the touch sensor metal 80. The layer 78 may sometimes be referred to as an inorganic touch layer.

[0056] Upon initial deposition, the combination of the passivation layers 70 and 72 and the planarization layer 74 may maintain continuity (e.g., an airtight seal) over the dicing structure 68. However, the dicing structure may create seams in the stacked layers, which over time may be infiltrated by moisture and expand, ultimately creating openings that undesirably expose the underlying OLED layers to moisture.

[0057] To mitigate moisture infiltration through the seams in the passivation layers 70 and 72, a metal layer 80 may be formed over the dicing structure. The metal layer 80 blocks moisture from infiltrating the seams in the passivation layers 70 and 72, thereby improving the robustness of the rigid pixel islands. Additionally, the metal layer 80 may also optionally serve as the touch sensor metal of the touch-sensitive layer. This example is merely illustrative. If desired, the metal layer 80 may be formed of a material different from the touch sensor metal (and during a different manufacturing step).

[0058] As Figure 4 shown, a black pixel definition layer 82 may be formed over the touch sensor metal 80 and the inorganic layer 78. The black pixel definition layer 82 may be light-impermeable (e.g., having a transmittance of less than 40%, less than 30%, less than 15%, less than 5%, etc.). The black pixel definition layer 82 may define the openings through which the pixels 22-1 and 22-2 emit light. As Figure 4 shown, color filter elements may be formed in the openings in the pixel definition layer 82. A first color filter element 88-1 is formed over the anode 62-1 of the pixel 22-1. For example, when the pixel 22-1 is a blue pixel, the color filter element 88-1 may be a blue color filter element that allows blue light to pass through and blocks light of other colors. A second color filter element 88-2 is formed over the anode 62-2 of the pixel 22-2. For example, when the pixel 22-2 is a green pixel, the color filter element 88-2 may be a green color filter element that allows green light to pass through and blocks light of other colors.

[0059] The spacer 84 may be formed at the edge of the rigid pixel island. A portion of the pixel definition layer 82 may be formed above the spacer 84. The spacer is formed outside the perimeter of the rigid pixel island (e.g., not overlapping with the encapsulation layer and / or the OLED layer of the rigid pixel island). For example, the spacer may be formed to be in direct contact with the substrate 48 (or attached to the substrate 48 with an adhesive layer).

[0060] Figure 5 Is Figure 4 a top view of the rigid pixel island. Specifically, Figure 4 a cross-sectional side view of which may be taken along Figure 5 line 90 in Figure 5 As shown, the cut structure portion may be formed as part of a continuous cut structure that defines a grid in which anodes for the pixels are formed. In other words, the grid of the cut structure completely surrounds laterally the first anode 62-1 in the corresponding opening in the grid, completely surrounds laterally the second anode 62-2 in the corresponding opening in the grid, and so on. In Figure 5 the example of, the rigid pixel island 42 includes 4 pixels having corresponding anodes 62-1, 62-2, 62-3, and 62-4. In one illustrative example, the rigid pixel island may include two green pixels, one red pixel, and one blue pixel. This example is only illustrative. Generally speaking, each rigid pixel island may include any desired number of pixels of any desired corresponding color.

[0061] Figure 6 is a cross-sectional side view showing the cut structure 68. As shown, the cut structure 68 has an undercut (sometimes referred to as a recess, cavity, hole, notch, etc.). The undercut is a void in the cut structure material that is still covered by a portion of the cut structure. As Figure 6 shown, the undercut may have a width 104 and a height 102. In this arrangement, the width 104 is defined as the distance between the edge of the portion 94-3 of the cut structure and the edge of the portion 94-2 of the cut structure. The height 102 is defined as the distance between the lower surface of the portion 94-3 of the cut structure and the upper surface of the portion 94-1 of the cut structure. The width 104 and the height 102 may each be any desired distance (e.g., less than 1 micron, less than 500 nanometers, less than 250 nanometers, less than 150 nanometers, less than 100 nanometers, less than 75 nanometers, less than 50 nanometers, less than 35 nanometers, less than 25 nanometers, less than 20 nanometers, greater than 10 nanometers, greater than 20 nanometers, between 10 and 100 nanometers, etc.). The height 102 and the width 104 may be the same or different. In one example, the height 102 may be less than 50 nanometers, and the width 104 may be greater than 20 nanometers.

[0062] In Figure 6In the example, the cutting structure 68 can be formed by portions 94-1, 94-2, and 94-3 (sometimes referred to as layers 94-1, 94-2, and 94-3). The portions 94-1, 94-2, and 94-3 can optionally be formed during respective deposition steps. Each portion can be formed of any desired conductive material.

[0063] Each of the portions 94-1, 94-2, and 94-3 can have a thickness equal to any desired distance (e.g., less than 1 micron, less than 500 nanometers, less than 250 nanometers, less than 150 nanometers, less than 100 nanometers, less than 75 nanometers, less than 50 nanometers, less than 35 nanometers, less than 25 nanometers, less than 20 nanometers, greater than 10 nanometers, greater than 20 nanometers, between 10 nanometers and 100 nanometers, etc.). These thicknesses can be the same or different.

[0064] The angles of the edges of the portions 94-1, 94-2, and 94-3 can be selected to control the discontinuity of the stacked organic light-emitting diode layers. As Figure 6 shown, portion 94-1 has an edge surface that is angled 98 with respect to the planar upper surface of the insulating layer 56 (and with respect to the planar lower surface of portion 94-1). Portion 94-2 has an edge surface that is angled 100 with respect to the planar upper surface of the insulating layer 56 (and with respect to the planar lower surface of portion 94-2). Portion 94-3 has an edge surface that is angled 96 with respect to the planar upper surface of the insulating layer 56 (and with respect to the planar lower surface of portion 94-3). The angles 96, 98, and 100 can be the same or different. Each of the angles can be any desired angle (e.g., between 45° and 90°, between 25° and 135°, between 45° and 55°, between 55° and 65°, between 75° and 85°, between 85° and 95°, between 45° and 65°, between 70° and 90°, between 10° and 45°, less than 90°, etc.).

[0065] In Figure 6 a portion of layer 94-1 is not covered by layer 94-3. In other words, layer 94-1 extends past the edge of layer 94-3 (e.g., toward the center of the anode). The width 106 of the portion of layer 94-1 that is not covered by layer 94-3 can be any desired distance (e.g., less than 1 micron, less than 500 nanometers, less than 250 nanometers, less than 150 nanometers, less than 100 nanometers, less than 75 nanometers, less than 50 nanometers, less than 35 nanometers, less than 25 nanometers, less than 20 nanometers, less than 10 nanometers, greater than 10 nanometers, greater than 20 nanometers, between 10 nanometers and 100 nanometers, greater than 40 nanometers, etc.). The portion of layer 94-1 that is not covered by layer 94-3 can be referred to as the stepped portion of the cutting structure.

[0066] Each side of the cutting structure may have Figure 6 an arrangement of the type shown to cause a discontinuity in the OLED layer 64.

[0067] Figure 6 It is further shown that in addition to being formed in the gap between the portion of the passivation layer 70 above the anode and the portion of the passivation layer 70 above the cutting structure, the inkjet printing layer 74 may also be formed under particles such as particles 92. During manufacturing, particles may fall on the display. The planarization layer 74 may be selectively formed around the particles on the display to ensure an airtight seal formed by the passivation layers 70 and 72.

[0068] If desired, as Figure 7 shown, an additional layer such as the inorganic layer 110 may be formed between the conductive cutting structure 68 and the insulating layer 56. As previously combined with Figure 6 discussed, the cutting structure 68 produces an undercut 114. The inorganic layer 110 may have dimensions selected to produce an additional undercut 112. Specifically, the bottom portion of the cutting structure 68 (e.g., Figure 6 portion 94-1 in) may extend beyond the edge of the layer 110 towards the center of the pixel, thereby forming an undercut 112 under the cutting structure. The undercut 112 may cause a discontinuity in at least one layer (e.g., the hole injection layer) in the OLED layer 64 while maintaining continuity in the cathode 66. The cathode has a separate discontinuity caused by the cutting structure 68.

[0069] The example of using the cutting structure 68 and the inorganic layer 110 to produce the undercut 112 is merely illustrative. In another possible arrangement, the pixel definition layer 86 (which may be formed of an organic material) may be shaped to have an undercut that causes a discontinuity in at least one layer in the OLED layer 64. The conductive cutting structure has a separate undercut that causes a discontinuity in the cathode, as previously discussed.

[0070] In the OLED layer 64, the hole injection layer may be very prone to lateral leakage. Therefore, Figure 7 the undercut 112 of

[0071] In this document, examples have been described in which a display with rigid pixel islands is used to form a stretchable display. Specifically, the entire display can have rigid pixel islands and corresponding flexible interconnect regions such that the entire display is stretchable. This example is merely illustrative. In an alternative embodiment, the arrangements described herein with respect to rigid pixel islands can alternatively be used for a rigid display. In other words, a rigid display can be formed from a single rigid pixel island having a pixel array. Even if the display is not stretchable (as in the case where the entire display is rigid), the principles described in connection with rigid pixel islands can be used to form a display with a small inactive border region. Thus, even when the entire display is rigid, the display can use the arrangements described herein.

[0072] In Figure 8 Another alternative embodiment shown, display 14 has a central portion 120 and an edge portion 122. The central portion has a first pixel density (e.g., pixels per inch or PPI), and the edge portion has a second pixel density. The second pixel density can be lower than the first pixel density. The central portion 120 can be formed from a single rigid pixel island including a pixel array. The edge portion 122 can be formed from a plurality of rigid pixel islands 42 connected by flexible interconnect portions 46 (e.g., as Figure 3 shown). Thus, the central portion 120 is rigid while the edge portion 122 is stretchable. This type of arrangement can be used to form a display with a planar central portion 120 and curvature (optionally including compound curvature) in the edge portion 122. The pixel density of the edge portion 122 can be at least 5% less than the pixel density of the central portion 120, at least 10% less than the pixel density of the central portion 120, at least 20% less than the pixel density of the central portion 120, at least 50% less than the pixel density of the central portion 120, etc.

[0073] Figure 9 is Figure 8 A cross-sectional side view of an exemplary display of the type shown. As shown, a plurality of pixels are formed in the rigid central portion 120. In the edge portion 122, discrete rigid pixel islands 42 are connected by flexible interconnect portions 46. Note that details of the OLED layer and the encapsulation layer have been omitted from Figure 9 to avoid obscuring the figures.

[0074] Note that if desired, the display can alternatively have an arrangement with only the central portion 120 (e.g., a completely rigid display) or an arrangement with only the portion 122 (e.g., a completely stretchable display).

[0075] Figure 10 is a cross-sectional side view of the edge of a rigid pixel island. As shown, at the edge of the rigid pixel island, the OLED layer 64 and the passivation layers 70 and 72 can be removed. AtFigure 10 In the example of , the OLED layer 64 and the passivation layers 70 / 72 are etched simultaneously. As a result, a portion of the side surface of the OLED layer 64 is exposed. If not taken care of, moisture may seep into this exposed portion of the OLED layer 64 (e.g., during subsequent processing steps such as the formation of a cover surface touch).

[0076] In Figure 11 In an alternative embodiment shown in , the OLED layer is etched before depositing the passivation layers 70 and 72. This results in the OLED layer 64 being completely encapsulated by the passivation layers 70 and 72 (including the side surfaces of the OLED layer 64 at the etched edges). This type of arrangement can form a complete seal of the OLED layer 64 for subsequent manufacturing (e.g., the formation of a cover surface touch).

[0077] In Figure 4 the foregoing embodiment of , there are multiple discrete portions of the planarization layer 74 (e.g., only when necessary, rather than a blanket layer across the entire display or rigid pixel island). This example is merely illustrative. In Figure 12 In another possible arrangement shown in , the planarization layer 206 is formed between the passivation layers 70 and 72. The planarization layer 206 can be an inkjet printed (IJP) layer formed continuously on the rigid pixel islands (different from the multiple discrete portions in Figure 4 ). The thickness of the planarization layer 206 can be less than 10 microns, less than 15 microns, between 2 microns and 10 microns, etc. The planarization layer 206 can be used to encapsulate and planarize any particles generated during the deposition of the OLED layer 64 and other encapsulation layers.

[0078] The inorganic layer 202 can be formed between the substrate 48 and the insulating layer 56. Additionally, Figure 12 a spacer 204 formed above the cutting structure 68 - 3 is shown. The combination of the cutting structure 68 - 3 and the spacer 204 forms a dam to prevent the overflow of the planarization layer 206. Multiple dams of this type can optionally be included at the edges of the active area of the display. Each cutting structure can optionally be formed of three metal layers (e.g., an aluminum layer interposed between two titanium layers).

[0079] Figure 10 An example of simultaneously etching the OLED layer 64 and the passivation layers 70 / 72 is shown. As a result, a portion of the side surface of the OLED layer 64 is exposed. To prevent moisture from seeping into this exposed portion of the OLED layer 64 (e.g., during subsequent processing steps such as the formation of a cover surface touch), one or more additional layers such as the touch sensor metal 80 and the inorganic touch layer 78 can be formed above the exposed portion of the OLED layer 64 (e.g., as shown in Figure 12 ). Figure 13 An example of this type is shown. As in Figure 13As shown, the touch inorganic layer 78 and the touch sensor metal 80 conform to the side surfaces of the OLED layer 64 , the cathode 66 , the organic layer 212 , and the first and second passivation layers 70 , 72 .

[0080] Note that for simplicity, Figure 10 and Figure 11 The cathode 66 is not depicted. However, Figure 13 As shown, cathode 66 may be formed over OLED layer 64. Additionally, organic layer 212 may be formed over cathode 66 such that cathode 66 is interposed between OLED layer 64 and cathode 66.

[0081] During manufacturing, a photoresist may be formed on portions of the OLED layer 64, cathode 66, organic layer 212, and first and second passivation layers 70 and 72 that are not removed during etching. The OLED layer 64, cathode 66, organic layer 212, and first and second passivation layers 70 and 72 are then removed by a dry etching process. After the etching process is completed, the photoresist may be removed (e.g., using an O2 plasma). After the photoresist is removed, the touch inorganic layer 78 may be patterned to cover and directly contact the exposed side surfaces of the OLED layer 64, cathode 66, organic layer 212, and first and second passivation layers 70 and 72. The touch sensor metal 80 is then formed over the touch inorganic layer 78. The touch inorganic layer 78 and the touch sensor metal 80 may prevent moisture from penetrating into the exposed portions of layers such as the OLED layer 64 and causing reliability issues.

[0082] In some cases, etching cathode 66 may be more difficult than desired.To mitigate the cost and complexity of etching edge layers, an organic dewetting layer 214 may be included at the edge. Figure 14 An example of a display with a dewetting layer is shown. A dewetting layer 214 (sometimes referred to as a cathode dewetting layer 214) can be deposited immediately after the cathode 66 during manufacturing and can prevent the cathode 66 from hardening at the edges. Thus, subsequent removal of the cathode is simplified, thereby reducing the cost and complexity of the manufacturing process. The dewetting layer 214 can be included in any of the aforementioned embodiments involving etching the cathode 66. The dewetting layer 214 can be formed in a non-luminous area of the display where the cathode 66 is ultimately removed.

[0083] It is noted that the foregoing embodiments related to the edges of rigid pixel islands are generally applicable to any edge of a substrate in a display. The edge may be formed at the edge of a rigid pixel island within the light emitting region, at the periphery of the light emitting region of the display (even if the rigid pixel islands are not included in the display), etc.

[0084] According to one embodiment, a display is provided, the display including: a first organic light-emitting diode pixel including a first electrode; a second organic light-emitting diode pixel including a second electrode; a common electrode for the first organic light-emitting diode pixel and the second organic light-emitting diode pixel; a conductive layer having a first portion forming part of the first organic light-emitting diode pixel and a second portion forming part of the second organic light-emitting diode pixel; and a conductive structure interposed between the first electrode and the second electrode, the conductive structure having an undercut causing a discontinuity in the conductive layer and the conductive structure being electrically connected to the common electrode.

[0085] According to another embodiment, the first electrode is a first anode, the second electrode is a second anode, and the common electrode is a cathode.

[0086] According to another embodiment, the conductive layer is a hole injection layer.

[0087] According to another embodiment, the display includes a first inorganic passivation layer formed over the common electrode.

[0088] According to another embodiment, the display includes a second inorganic passivation layer formed over the first inorganic passivation layer.

[0089] According to another embodiment, the display includes an organic layer having a plurality of discrete portions located between the first inorganic passivation layer and the second inorganic passivation layer.

[0090] According to another embodiment, the organic layer is an inkjet printed layer.

[0091] According to another embodiment, the display includes a encapsulation layer formed over the second inorganic passivation layer.

[0092] According to another embodiment, the display includes an inorganic layer formed over the encapsulation layer.

[0093] According to another embodiment, the display includes a touch sensor metal layer formed on the inorganic layer and overlapping the undercut of the conductive structure.

[0094] According to another embodiment, the display includes a black pixel defining layer formed over the inorganic layer and the touch sensor metal layer, the black pixel defining layer having an opening and a color filter element formed in the opening.

[0095] According to another embodiment, the display includes an insulating layer, on which the first electrode and the second electrode are formed, and the insulating layer is interposed between the first electrode and the shielding metal layer.

[0096] According to another embodiment, the display includes: a plurality of rigid pixel islands, wherein a first rigid pixel island among the plurality of rigid pixel islands includes the first organic light-emitting diode pixel and the second organic light-emitting diode pixel; and a flexible interconnect region interposed between the plurality of rigid pixel islands.

[0097] According to another embodiment, the flexible interconnect region includes a flexible polymer layer and serpentine conductive signal lines.

[0098] According to one embodiment, a display is provided, the display including: a plurality of pixels, each pixel having a corresponding anode; a common cathode for the plurality of pixels; an organic light-emitting diode layer for the plurality of pixels, the organic light-emitting diode layer being interposed between the anode and the common cathode; a first inorganic passivation layer formed above the common cathode; a second inorganic passivation layer formed above the first inorganic passivation layer; and an organic layer having a plurality of discrete portions located between the first inorganic passivation layer and the second inorganic passivation layer, and in some portions of the first inorganic passivation layer and the second inorganic passivation layer, there are portions that do not include the organic layer between the first inorganic passivation layer and the second inorganic passivation layer.

[0099] According to another embodiment, the plurality of pixels are hermetically sealed by at least the first inorganic passivation layer and the second inorganic passivation layer.

[0100] According to another embodiment, at least one of the plurality of discrete portions of the organic layer is formed under a particle.

[0101] According to another embodiment, the display includes a touch inorganic layer covering side surfaces of the organic light-emitting diode layer, the common cathode, the first inorganic passivation layer, and the second inorganic passivation layer.

[0102] According to another embodiment, the display includes: a substrate on which the plurality of pixels are formed; and a cathode dehumidifying layer located at an edge of the substrate.

[0103] According to one embodiment, a display is provided that includes: a plurality of hermetically sealed rigid pixel islands; and a flexible interconnect region interposed between the plurality of hermetically sealed rigid pixel islands. Each hermetically sealed rigid pixel island includes: at least one organic light emitting diode pixel having an organic light emitting diode layer interposed between a first electrode and a second electrode; and a conductive cut structure that causes a discontinuity in one of the organic light emitting diode layers and is electrically connected to the second electrode.

[0104] According to another embodiment, each hermetically sealed rigid pixel island further includes: a first inorganic passivation layer formed over the second electrode; a second inorganic passivation layer formed over the first inorganic passivation layer; and an organic inkjet printed layer having a plurality of discrete portions located between the first inorganic passivation layer and the second inorganic passivation layer.

[0105] According to another embodiment, the plurality of hermetically sealed rigid pixel islands are formed on a flexible polymer layer, and the flexible interconnect region includes signal lines located on the flexible polymer layer.

[0106] The foregoing is merely illustrative, and various modifications can be made by those skilled in the art without departing from the scope and essence of the embodiments. The foregoing embodiments can be implemented individually or in any combination.

Claims

1. A display, comprising: A first organic light-emitting diode pixel, the first organic light-emitting diode pixel including a first electrode; A second organic light-emitting diode pixel, the second organic light-emitting diode pixel including a second electrode; A common electrode for the first organic light-emitting diode pixel and the second organic light-emitting diode pixel; A conductive layer, the conductive layer having a first portion forming a part of the first organic light-emitting diode pixel and a second portion forming a part of the second organic light-emitting diode pixel; And A conductive structure, the conductive structure being interposed between the first electrode and the second electrode, wherein the conductive structure has an undercut causing a discontinuity in the conductive layer, and wherein the conductive structure is electrically connected to the common electrode.

2. The display according to claim 1, wherein the first electrode is a first anode, wherein the second electrode is a second anode, and wherein the common electrode is a cathode.

3. The display according to claim 2, wherein the conductive layer is a hole injection layer.

4. The display according to claim 1, further comprising: A first inorganic passivation layer, the first inorganic passivation layer being formed above the common electrode.

5. The display according to claim 4, further comprising: A second inorganic passivation layer, the second inorganic passivation layer being formed above the first inorganic passivation layer.

6. The display according to claim 5, further comprising: An organic layer, the organic layer having a plurality of discrete portions located between the first inorganic passivation layer and the second inorganic passivation layer.

7. The display according to claim 6, wherein the organic layer is an inkjet printed layer.

8. The display according to claim 6, further comprising: A encapsulation layer, the encapsulation layer being formed above the second inorganic passivation layer.

9. The display according to claim 8, further comprising: An inorganic layer, the inorganic layer being formed above the encapsulation layer.

10. The display according to claim 9, further comprising: A touch sensor metal layer, the touch sensor metal layer being formed on the inorganic layer and overlapping the undercut of the conductive structure.

11. The display according to claim 10, further comprising: A black pixel definition layer, the black pixel definition layer being formed above the inorganic layer and the touch sensor metal layer, wherein the black pixel definition layer has an opening; And A color filter element, the color filter element being formed in the opening.

12. The display according to claim 1, further comprising: An insulating layer, wherein the first electrode and the second electrode are formed on the insulating layer; And A shielding metal layer, wherein the insulating layer is interposed between the first electrode and the shielding metal layer.

13. The display according to claim 1, further comprising: A plurality of rigid pixel islands, wherein a first rigid pixel island among the plurality of rigid pixel islands includes the first organic light-emitting diode pixel and the second organic light-emitting diode pixel; And A flexible interconnect region, the flexible interconnect region being interposed between the plurality of rigid pixel islands.

14. The display according to claim 13, wherein the flexible interconnect region comprises a flexible polymer layer and serpentine conductive signal lines.

15. A display comprising: a plurality of pixels, wherein each pixel has a corresponding anode; a common cathode for the plurality of pixels; an organic light emitting diode layer for the plurality of pixels, the organic light emitting diode layer being interposed between the anode and the common cathode; a first inorganic passivation layer formed over the common cathode; a second inorganic passivation layer formed over the first inorganic passivation layer; and an organic layer having a plurality of discrete portions located between the first inorganic passivation layer and the second inorganic passivation layer, wherein in some portions of the first inorganic passivation layer and the second inorganic passivation layer, there are portions that do not include the organic layer between the first inorganic passivation layer and the second inorganic passivation layer.

16. The display according to claim 15, wherein the plurality of pixels are hermetically sealed by at least the first inorganic passivation layer and the second inorganic passivation layer.

17. The display according to claim 15, wherein at least one of the plurality of discrete portions of the organic layer is formed under a particle.

18. The display according to claim 15, further comprising: a touch inorganic layer covering side surfaces of the organic light emitting diode layer, the common cathode, the first inorganic passivation layer, and the second inorganic passivation layer.

19. The display according to claim 15, further comprising: a substrate, wherein the plurality of pixels are formed on the substrate; and a cathode dehumidifying layer located at an edge of the substrate.

20. A display comprising: a plurality of hermetically sealed rigid pixel islands; and a flexible interconnect region interposed between the plurality of hermetically sealed rigid pixel islands, wherein each hermetically sealed rigid pixel island comprises: at least one organic light emitting diode pixel having an organic light emitting diode layer interposed between a first electrode and a second electrode; and a conductive cut structure that causes a discontinuity in one of the organic light emitting diode layers and is electrically connected to the second electrode.

21. The display according to claim 20, wherein each hermetically sealed rigid pixel island further comprises: a first inorganic passivation layer formed over the second electrode; a second inorganic passivation layer formed over the first inorganic passivation layer; and an organic inkjet printed layer having a plurality of discrete portions located between the first inorganic passivation layer and the second inorganic passivation layer.

22. The display according to claim 20, wherein the plurality of hermetically sealed rigid pixel islands are formed on a flexible polymer layer, and wherein the flexible interconnect region comprises signal lines located on the flexible polymer layer.

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