Server Architecture

Abstract

The present application relates to the field of server technology, and in particular to a server architecture, comprising: a chassis; a central backplane vertically arranged in the chassis to divide the interior of the chassis into a first space near a front window and a second space near a rear window; a first power supply module arranged in a lower area of ​​the first space; a first processor module arranged in a middle area above the first power supply module; and a second processor module arranged in an upper area above the first processor module; wherein the upper area has a front area near the front window and a rear area away from the front window, and the second processor module is at least located in the rear area.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a server architecture. Background Art

[0002] In the design process of liquid-cooled servers, based on the differentiated design of the processor modules, for example, the configured graphics processor modules often have different heights and depths, and the number of expansion slots and hard drives in the server architecture also have different emphases. In response to different usage scenarios, the current server architecture is often designed as a large and comprehensive structure, that is, a server architecture with a large number of expansion slots and hard drives. Alternatively, several different server products are designed in a targeted manner, that is, some server architectures are configured with more expansion slots, while other server architectures are configured with more hard drives, etc. However, both of the above methods will cause repeated development, which in turn leads to high costs and low demand satisfaction. Summary of the Invention

[0003] In view of the above-mentioned background technical problems, the present application provides a server architecture to at least solve the problem of insufficient applicability of the server architecture in the related art.

[0004] The present application provides a plug-in box mechanism, comprising: a chassis; a central backplane, vertically arranged on the chassis to divide the interior of the chassis into a first space near the front window and a second space near the rear window; a first power supply module, arranged in a lower area of ​​the first space; a first processor module, arranged in a middle area above the first power supply module; and a second processor module, arranged in an upper area above the first processor module; wherein the upper area has a front area near the front window and a rear area away from the front window, and the second processor module is at least located in the rear area.

[0005] Based on the above-mentioned server architecture, the front area in the chassis is located above the middle area, and the front area is located in front of the rear area. To this end, the front area adjacent to the middle area and the rear area respectively can be used as expansion areas of the middle area and the rear area respectively, which can be used to configure hard disk modules and second processor modules. Through such a design, on the basis of not adjusting other areas within the server architecture, only by configuring different modular modules in the upper area and the middle area, the server architecture can be adapted to second processor modules with different heights and / or depths. The server architecture can also be targeted with different numbers of expansion slots and / or hard drives by configuring suitable modules, so as to enhance the flexibility of the design, thereby avoiding repeated design of the server architecture and reducing design costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0007] Figure 1 is a cross-sectional schematic diagram of the server architecture of an embodiment of the present application;

[0008] Figure 2 This is a structural diagram of the first box cover configured in the server architecture of an embodiment of the present application;

[0009] Figure 3 This is a structural diagram of the server architecture configured with a second box cover in an embodiment of the present application;

[0010] Figure 4 is based on Figure 1 The schematic diagram of the structure of the first embodiment of the server architecture configured with the second processor module;

[0011] Figure 5 is based on Figure 4 An exploded view of the server architecture shown;

[0012] Figure 6 is based on Figure 5 A schematic diagram of a first air cooling unit of the server architecture configuration shown;

[0013] Figure 7 is based on Figure 1 A schematic diagram of the structure of the second embodiment of the server architecture configured with a second processor module;

[0014] Figure 8 is based on Figure 7 An exploded view of the server architecture shown;

[0015] Figure 9 is based on Figure 1 A schematic diagram of the structure of the third embodiment of the server architecture configured with a second processor module;

[0016] Figure 10 is based on Figure 9 An exploded view of the server architecture shown;

[0017] Figure 11 is based on Figure 9 A schematic diagram of a first air cooling unit and a second air cooling unit configured in a server architecture is shown;

[0018] Figure 12 is a three-dimensional diagram of the plug-in mechanism of an embodiment of the present application;

[0019] Figure 13 yes Figure 12 A three-dimensional diagram of the inserting mechanism from another perspective;

[0020] Figure 14 yes Figure 13 A partial enlarged view of the first fan plate and the first beam-shaped member shown;

[0021] Figure 15 yes Figure 12 A perspective view of the first fan module in a lower position is shown;

[0022] Figure 16 yes Figure 12 A perspective view of the first fan module in a high position is shown;

[0023] Figure 17 yes Figure 13 A partial enlarged view of the second fan plate, the second beam-shaped member, and the third beam-shaped member;

[0024] Figure 18 yes Figure 17 A stereogram from an upward perspective;

[0025] Figure 19 yes Figure 17 An exploded view of the second beam-shaped member and the third beam-shaped member portion is shown;

[0026] Figure 20 yes Figure 12 A perspective view of the second fan module shown;

[0027] Figure 21 yes Figure 13 The illustrated plug-in mechanism is configured with a perspective view of a centrally located back panel;

[0028] Figure 22 yes Figure 21 A partial enlarged view of the center back panel is shown;

[0029] Figure 23 yes Figure 21 Exploded view of the back plate bracket shown;

[0030] Figure 24 yes Figure 12 A perspective view of the main frame portion of the plug-in mechanism shown;

[0031] Figure 25 yes Figure 24 A partial enlarged view of the support plate portion shown;

[0032] Figure 26 yes Figure 24 A partial enlarged view of the assembly portion of the bracket and the support plate of the plug-in mechanism shown;

[0033] Figure 27 yes Figure 24 A partial enlarged view of the baffle and elastic member of the inserting mechanism shown;

[0034] Figure 28 yes Figure 24 A partial enlarged view of the first space of the inserting mechanism is shown, showing the stop portion;

[0035] Figure 29 yes Figure 12 A perspective view of the second power module shown;

[0036] Figure 30 yes Figure 29 A partial enlarged view of the fixing plate portion shown;

[0037] Figure 31 It is a three-dimensional diagram of the server architecture of an embodiment of the present application.

[0038] The above drawings include the following reference numerals:

[0039] 100. Insertion mechanism;

[0040] 110, main frame; 111, bracket; 1111, partition; 1112, stop pin; 112, base; 1121, groove; 1122, screw hole; 113, first installation space; 114, stopper; 115, second installation space;

[0041] 120, first air cooling unit; 121, first fan module; 1211, first position limiting portion; 1212, first electrical matching portion; 122, first fan plate; 1221, first electrical connection portion; 1222, third electrical matching portion A; 123, first beam member;

[0042] 130, second air cooling unit; 131, second fan plate; 1311, second electrical connection portion; 1312, third electrical matching portion B; 132, second fan module; 1321, second position-limiting portion; 1322, second electrical matching portion; 133, second beam-shaped member; 134, third beam-shaped member; 1341, slot;

[0043] 140, support plate; 141, pipe hole; 142, stop groove; 143, fixing hole;

[0044] 150. Second power module; 151. Housing; 152. Power supply body; 153. Power handle; 1531. Transition section; 1532. Bend section; 1533. Limiting groove; 1534. Fixing plate; 154. Fastener;

[0045] 160, baffle, 161, elastic member;

[0046] 200, chassis; 201, chassis body; 202, chassis cover; 2021, first chassis cover; 2022, second chassis cover; 203, I-nail; 204, fastener hole;

[0047] 210, first space; 211, lower area; 212, middle area; 213, upper area;

[0048] 220, Second Space;

[0049] 230. First power module;

[0050] 240. Second processor module;

[0051] 250. First processor module;

[0052] 260, hard disk module;

[0053] 270, switch board;

[0054] 280, motherboard;

[0055] 290, power distribution module;

[0056] 2100, communication card;

[0057] 300, center back panel; 310, back panel bracket; 311, first plate-shaped member; 312, second plate-shaped member. DETAILED DESCRIPTION

[0058] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0059] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0060] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0061] Figure 1 It is a cross-sectional schematic diagram of the server architecture of an embodiment of the present application.

[0062] This application provides a server architecture, referring to Figure 1As shown, the system includes a chassis 200, a center backplane 300, a first power module 230, a first processor module 250, and a second processor module 240. The center backplane 300 is vertically mounted on the chassis 200 to divide the interior of the chassis 200 into a first space 210 near the front window and a second space 220 near the rear window. The first power module 230 is mounted in a lower region 211 of the first space 210. The first processor module 250 is mounted in a middle region 212 above the first power module 230. The second processor module 240 is mounted in an upper region 213 above the first processor module 250. The upper region 213 has a front region near the front window and a rear region away from the front window. The second processor module 240 is located at least in the rear region 2132.

[0063] First, it should be noted that the chassis 200 in this application has a depth (direction), height (direction), and width (direction) that are orthogonal to each other. The depth can be understood as the direction extending between the front window and the rear window of the chassis 200, the height can be understood as the direction extending from the bottom end (e.g., the bottom plate of the chassis 200) to the top end (e.g., the top plate of the chassis lid) of the chassis 200, and the width can be understood as the direction extending from the left end to the right end of the chassis 200. Unless otherwise specified, the depth (direction), height (direction), and width (direction) in the following embodiments can be understood in this manner.

[0064] In some exemplary embodiments, referring to Figure 1 As shown, the chassis 200 is divided into a first space 210 and a second space 220 along the depth direction with the middle back panel 300 as the boundary. In detail, in the first space 210, there are stacked from bottom to top a lower area 211, a middle area 212 and an upper area 213, and the upper area 213 is further arranged relative to the front window (which can be regarded as Figure 1 As shown, the position of the window opened on the left side of the chassis is divided into a front area 2131 and a rear area 2132. According to the different depths of different second processor modules 240, the second processor module 240 can be located only in the rear area 2132.

[0065] Taking the example of first processor module 250 being a central processing unit (CPU) module and second processor module 240 being a graphics processing unit (GPU) module, the GPU module is arranged in upper region 213 above the CPU module. Compared to related art designs that place the CPU module and / or hard disk module above the GPU module, this design allows for greater height flexibility in the placement of the GPU module (i.e., second processor module 240). For example, this design can meet the height requirements of vertically arranged full-height and / or half-height GPU cards within the GPU module; it can also accommodate the width requirements (e.g., single-width or double-width) of different numbers of GPU cards placed horizontally.

[0066] In addition, continue to refer to Figure 1 As shown, the front area 2131 and the rear area 2132 in the upper area 213 are arranged adjacent to each other. Therefore, the arrangement of the GPU module (i.e., the second processor module 240) along the depth direction can also be more flexible. For example, if the GPU module is configured with a GPU card of shorter depth (which can be a GPU card with a depth less than or equal to 580 mm), or a half-length GPU card, the GPU module can occupy only the rear area 2132, and the front area 2131 can be used to configure other modules. On the contrary, if the GPU module is configured with a GPU card of longer depth (which can be a GPU card with a depth greater than 580 mm, for example, a GPU card with a depth of 680 mm), or a full-length GPU card, part of the GPU card can be extended into the front area 2131 to meet the assembly requirements of GPU modules with different depths.

[0067] The above-mentioned GPU cards can be understood as standard cards that comply with the PCI-E specification. Based on the standard cards, GPU cards are often also configured with a variety of common specifications. Among them, the height is halved to become a half-height GPU card, the length (which can be understood as the depth along the chassis) is halved to become a half-length GPU card, and the width is doubled to become a double-width GPU card.

[0068] Figure 2 This is a structural diagram of the first box cover configured in the server architecture of an embodiment of the present application. Figure 3 It is a structural diagram of the second box cover configured in the server architecture of an embodiment of the present application.

[0069] According to the embodiments of this application, referring to Figure 2 and Figure 3As shown, the chassis 200 includes a housing 201 and a cover 202. The upper portion of the housing 201 forms an opening. The cover 202 is detachably mounted on the housing 201. The cover 202 comprises a top plate and side plates symmetrically disposed on either side of the top plate, with the side plates extending downward. The cover 202 includes a first cover 2021 and a second cover 2022. Either the first cover 2021 or the second cover 2022 is mounted on the housing 201. The side plates of the second cover 2022 are at least 1U higher than the side plates of the first cover 2021.

[0070] In some exemplary embodiments, referring to Figure 2 and Figure 3 As shown, the upper portion of the chassis 201 is opened. With the rear window of the chassis 200 as the projection plane, the chassis cover 202 is configured as an inverted U-shaped structure when projected along the depth direction of the chassis 200. The cover 202 is buckled onto the opening of the chassis 200 to seal the chassis 201. Specifically, the chassis 201 itself is configured to have a height of 4U. Furthermore, the first cover 2021 is correspondingly configured to have a height of 1U, while the second cover 2022 is correspondingly configured to have a height of 2U. In other words, when the first cover 2021 is assembled to the chassis 201, the overall height of the chassis 200 is 5U. Similarly, when the second cover 2022 is assembled to the chassis 201, the overall height of the chassis 200 is 6U. U is the abbreviation for unit, which represents the unit of rack size or server external dimensions. 1U is equal to 4.445 centimeters.

[0071] Taking a 5U-high chassis as an example, the lower area 211 can be understood as the area at the bottom of the chassis that is approximately 1U high, the middle area 212 can be understood as the area above the lower area 211 that is approximately 3U high, and the upper area 213 can be understood as the area above the middle area 212 that is approximately 1U high. Similarly, taking a 6U-high chassis 200 as an example, the lower area 211 can be understood as the area at the bottom of the chassis 200 that is approximately 1U high, the middle area 212 can be understood as the area above the lower area 211 that is approximately 3U high, and the upper area 213 can be understood as the area above the middle area 212 that is approximately 2U high.

[0072] In such an embodiment, compared with the related art in which the box cover 202 is configured as a roughly rectangular plate structure, the present application expands the overall height of the chassis 200 through the box cover design of an inverted U-shaped structure. On the basis of sharing the same box body 201, the height space of the box body 201 can be expanded only by replacing the box cover 202, thereby making the design of the server architecture more flexible.

[0073] Figure 4 is based on Figure 1The structure diagram of the first embodiment of the server architecture configured with the second processor module is shown. Figure 5 is based on Figure 4 An exploded view of the server architecture is shown.

[0074] Reference Figure 4 and Figure 5 In the first embodiment shown, the server architecture further includes a hard disk module 260. Hard disk module 260 is located in front area 2131. When hard disk module 260 is located in front area 2131, second processor module 240 is located in rear area 2132. The embodiment in which hard disk module 260 is located in central area 212 will be described in the second and third embodiments below.

[0075] According to the embodiments of this application, referring to Figure 4 and Figure 5 As shown, the server architecture also includes a motherboard 280, a switch board 270, and a communication card 2100. The motherboard 280 is located in the middle area 212, and the first processor module 250 is located on and interconnected with the motherboard 280. The switch board 270 is located in the middle area 212, connected to the motherboard 280, and interconnected with the first processor module 250 through the motherboard 280. The communication card 2100 is located in the middle area 212 and connected to the expansion slot of the switch board 270.

[0076] According to the embodiments of this application, referring to Figure 4 and Figure 5 As shown, the second processor module 240 is connected to the expansion slot of the switch board 270 .

[0077] According to the embodiments of this application, referring to Figure 4 and Figure 5 As shown, the hard disk module 260 is disposed above the communication card 2100 and located in the front area 2131 .

[0078] According to the first embodiment, referring to Figure 4 As shown, the chassis 200 is configured as a 5U chassis. In its first space 210 located in front of the central backplane 300, the first power supply module 230 is located in the lower area 211; the main board 280, the switch board 270, the first processor module 250 and the communication card 2100 are located in the middle area 212; the hard disk module 260 is located in the front area 2131 in the upper area 213, and the second processor module 240 is located in the rear area 2132 in the upper area 213.

[0079] In this first embodiment, the middle region 212 may include at least one of a mainboard 280, a switch board 270, a hard disk module 260, and a communication card 2100. The mainboard 280 includes, but is not limited to, a dual-CPU mainboard, i.e., two CPUs may be provided on the mainboard 280. It should be understood that the embodiments of the present application are not limited thereto, and in other embodiments, the mainboard 280 may also be provided with other numbers of CPUs.

[0080] On this basis, the switch board 270 can specifically be a PCIe switch board, and the switching unit of the switch board 270 can be electrically connected to at least one of the second processor module 240 and the communication card 2100. The second processing module 240 can be the aforementioned GPU, and the communication card 2100 can be a network interface card (i.e., a Network Interface Card, hereinafter referred to as a NIC). In this way, the CPU on the mainboard 280 can be interconnected with at least one of the communication card 2100 and the second processor module 240 via the switching unit of the switch board 270. It should be understood that the embodiments of the present application are not limited to this. In other embodiments, the second processing module 240 can also be interconnected with other mainboards via the switch board 270 and the communication card 2100.

[0081] Furthermore, the switch board 270 can also be electrically connected to the multiple hard disks of the hard disk module 260, and at least a portion of the hard disks are arranged on the hard disk backplane. In this way, the CPU can perform read operations or write operations on the hard disks of the hard disk module 260 via the switch board 270 (specifically, it can be a switch unit connected to the CPU) to expand the CPU's memory. The second processor module 240 can also perform read operations or write operations on the hard disks of the hard disk module 260 via the switch board 270. Based on this, the switch board 270 can exchange data of at least two of the first processor module 250 (i.e., the above-mentioned CPU), the second processor module 240 (i.e., the above-mentioned GPU), the communication card 2100, or the hard disk based on the PCIe protocol.

[0082] Furthermore, the middle area 212 may also include expansion cards, specifically four x16 risers, through which the CPU of the mainboard is interconnected with the switching units of the switch board 270. It should be understood that the embodiments of the present application are not limited thereto. In other embodiments, the expansion cards may be of other numbers and / or may provide bandwidth of other channel numbers.

[0083] Based on the topological relationship between the above components in the first embodiment, continue to refer to Figure 5As shown, the hard drive module 260, motherboard 280, and switch board 270 are assembled on the same frame. Projected across the width of the chassis 200, the hard drive module 260, motherboard 280, and frame form a roughly L-shaped structure. This L-shaped frame can be slidably mounted within the chassis 200 through the front window. When the L-shaped frame is assembled within the chassis 200, the lower portion, where the motherboard 280 and switch board 270 are located, is located in the middle region 212. The upper portion, where the hard drive module 260 is located, is located in the front region 2131. The second processor module 240 can be located in the rear region 2132. In other words, the second processor module 240 (i.e., the GPU) is blocked by the hard drive module 260 and cannot be exposed to the front window.

[0084] On this basis, for the server architecture of the first embodiment, the hard disk module 260 includes but is not limited to 18 2.5-inch hard disks, of which 10 2.5-inch hard disks are arranged in the front area 2131, and the 10 2.5-inch hard disks are arranged in two rows in the height direction, and the 5 2.5-inch hard disks in each row are arranged horizontally at intervals along the width direction of the chassis 200; in addition, 8 2.5-inch hard disks are arranged vertically in the middle area 212 near the front window, and are distributed side by side along the width direction of the chassis 200.

[0085] Furthermore, six PCIe slots are provided on either side of the eight vertically arranged 2.5-inch hard drives (i.e., a total of 12 PCIe slots on both sides). These PCIe slots may be full-height, half-length (FHHL) PCIe slots. Two of the six PCIe slots on the same side are connected to the CPU, and the remaining four are connected to the GPU.

[0086] According to the embodiment of this application, continue to refer to Figure 4 and Figure 5 As shown, the server architecture further includes a power distribution module 290. The power distribution module 290 is disposed in the middle area 212 and plugged into the middle backplane 300. The first power module 230 is interconnected with the power distribution module 290.

[0087] According to the embodiment of this application, continue to refer to Figure 4 and Figure 5As shown, the server architecture also includes a plug-in mechanism 100 that is detachably disposed in the second space 220 of the chassis 200. The plug-in mechanism 100 includes a main frame 110, an air cooling unit, and a second power supply module 150. The air cooling unit is disposed on the main frame 110 and faces at least the second processor module 240. The second power supply module 150 is disposed on the main frame 110 and is located below the air cooling unit. The second power supply module 150 is interconnected with the power distribution module 290 via the central backplane 300. The first power supply module 230 is configured to supply power to at least the second processor module 240, and the second power supply module 150 is configured to supply power to at least the first processor module 250.

[0088] In some exemplary embodiments, referring to Figure 4 As shown, the first power module 230 is disposed in the lower area 211 of the chassis 200. The second power module 150 is disposed in the second space 220, for example, in the base portion of the plug-in mechanism 100, as will be described in detail in the following embodiments. Furthermore, the power distribution module 290 is connected to the center backplane 300 via a busbar (also known as a busbar). The power distribution module 290 can be a power distribution unit (PDU).

[0089] In some exemplary embodiments, the first power module 230 includes, but is not limited to, being configured with five 54V power supply units (PSUs), and the second power module 150 includes, but is not limited to, being configured with two 12V power supply units (PSUs). Specifically, the five 54V PSUs in the first power module 230 are arranged side by side along the width of the chassis 200, while the two 12V PSUs in the second power module 150 are stacked along the height of the chassis 200. Furthermore, the first power module 230 includes, but is not limited to, being configured to supply power to the second processor module 240 (i.e., the GPU) and an air cooling unit (which may be the first air cooling unit 120 and / or the second air cooling unit 130 described below), while the second power module 150 includes, but is not limited to, being configured to supply power to the first processor module 250.

[0090] In some exemplary embodiments, the five 54V PSUs in the first power module 230 are electrically connected to the PDU via dual-input AC power cables to provide 54V input. Furthermore, the two 12V PSUs in the second power module 150 are blind-plugged via a busbar to provide 12V input to the center backplane 300. Furthermore, the power of the 54V PSUs includes, but is not limited to, being configured to 3300W, and the power of the 12V PSUs includes, but is not limited to, being configured to 3200W. The five 54V PSUs can provide a total power of 16.5kW, but the actual rated power required by the power-consuming equipment is configured to be less than or equal to 13.2kW. Therefore, the five 54V PSUs form a redundant design, so even if one 54V PSU fails, the other four 54V PSUs can still meet power requirements. The two 12V PSUs utilize a CRPS redundancy design, meaning both 12V PSUs operate simultaneously, and if either 12V PSU fails, the system automatically switches to the other PSU to ensure power continuity. It should be understood that the embodiments of the present application are not limited thereto. For example, the first power module 230 and / or the second power module 150 may use power supply units with other rated power and rated voltage, or may be configured with other different numbers of power supply units.

[0091] According to an embodiment of the present application, the hard disk module 260 is disposed on the side of the communication card 2100 and is located in the middle region 212. For details, please refer to the following second and third embodiments.

[0092] Figure 6 is based on Figure 5 Schematic diagram of the first air cooling unit of the server architecture configuration shown. Figure 7 is based on Figure 1 The second embodiment of the server architecture shown is a structural diagram of configuring a second processor module. Figure 8 is based on Figure 7 An exploded view of the server architecture is shown.

[0093] According to the second embodiment, referring to Figure 6 As shown, the chassis 200 is configured as a 5U chassis. In its first space 210 located in front of the central backplane 300, the first power supply module 230 is located in the lower area 211; the main board 280, the switch board 270, the first processor module 250, the hard disk module 260 and the communication card 2100 are located in the middle area 212; the second processor module 240 is located in the rear area 2132 in the upper area 213, and extends to the front area 2131.

[0094] In this second embodiment, the middle area 212 may include at least one of a mainboard 280, a switch board 270, a hard disk module 260, and a communication card 2100. Mainboard 280 may include, but is not limited to, a dual-core CPU mainboard, i.e., it may be equipped with two CPUs. In this second embodiment, the topological relationship between mainboard 280, switch board 270, hard disk module 260, and communication card 2100 is similar to that of the first embodiment and will not be further described.

[0095] Furthermore, the middle area 212 may also include an expansion card, specifically two x16 FHHL Risers, and the CPU of the mainboard is interconnected with the switching unit of the switch board 270 via the FHHL Risers.

[0096] Based on the second embodiment, refer to Figure 6 and Figure 7 As shown, the hard drive module 260, motherboard 280, and switch board 270 are assembled into a common frame. This frame, unlike the first embodiment described above, is roughly cubic in shape. When this roughly cubic frame is assembled within the chassis 200, the hard drive module 260, motherboard 280, and switch board 270 are all located in the middle area 212. Furthermore, the second processor module 240 is located in the upper area, spanning the front area 2131 and the rear area 2132. In other words, the second processor module 240 (i.e., the GPU) is exposed to the front window. Because the second processor module 240 is exposed to the front window, it can be interconnected with other components configured in the server architecture via interconnect cables.

[0097] On this basis, the server architecture of the second embodiment includes, but is not limited to, two horizontally arranged PCIe slots, which are connected to the CPU. Furthermore, four vertically arranged PCIe slots are provided on either side of the two slots (i.e., a total of eight PCIe slots on both sides), and these four PCIe slots are connected to the GPU.

[0098] Furthermore, on the same side of the vertically arranged PCIe slot, four E1.S disk hard disk backplanes are arranged at intervals along the height direction of the chassis 200 (ie, a total of eight E1.S disk hard disk backplanes are arranged on both sides).

[0099] Figure 6 is based on Figure 5 Schematic diagram of the first air cooling unit of the server architecture configuration shown.

[0100] Based on the 5U chassis of the first embodiment and the second embodiment, refer to Figure 6As shown, a first air cooling unit 120 is configured in the plug-in mechanism of the server architecture. The relevant features of the first air cooling unit 120 will be further described in the following embodiments.

[0101] Figure 9 is based on Figure 1 The third embodiment of the server architecture shown is a structural diagram of a second processor module. Figure 10 is based on Figure 9 An exploded view of the server architecture is shown.

[0102] According to the third embodiment, referring to Figure 9 As shown, the chassis 200 is configured as a 6U chassis. In its first space 210 located in front of the central backplane 300, the first power supply module 230 is located in the lower area 211; the main board 280, the switch board 270, the first processor module 250, the hard disk module 260 and the communication card 2100 are located in the middle area 212; the second processor module 240 is located in the rear area 2132 in the upper area 213, and extends to the front area 2131.

[0103] In this third embodiment, the middle area 212 may include at least one of a mainboard 280, a switch board 270, a hard disk module 260, and a communication card 2100. The mainboard 280 may include, but is not limited to, a dual-CPU mainboard, i.e., it may be equipped with two CPUs. In the third embodiment, the topological relationship between the mainboard 280, switch board 270, hard disk module 260, and communication card 2100 is similar to that of the first and second embodiments described above and will not be further described.

[0104] Based on the third embodiment, refer to Figure 9 and 10 As shown, the hard disk module 260, motherboard 280, and switch board 270 are assembled in the same frame. The hard disk module 260, motherboard 280, and switch board 270 are all located in the middle area 212. Furthermore, the second processor module 240 is located in the upper area, spanning the front area 2131 and the rear area 2132. In other words, the second processor module 240 (i.e., the GPU) is exposed to the front window. Because the second processor module 240 is exposed to the front window, it can be interconnected with other components configured in the server architecture via interconnection cables.

[0105] On this basis, for the server architecture of the third embodiment, the hard disk module 260 includes but is not limited to having 8 U.2 disk hard disk backplanes, which are vertically arranged and distributed side by side along the width direction of the chassis 200.

[0106] Furthermore, on both sides of the eight vertically arranged U.2 hard drive backplanes, there are six PCIe slots, each provided with, but not limited to, six PCIe slots (i.e., a total of 12 PCIe slots on both sides). These PCIe slots may be full-height, half-length (FHHL) PCIe slots. Of the six PCIe slots on the same side, two are connected to the CPU, and the remaining four are connected to the GPU.

[0107] Figure 11 is based on Figure 9 The schematic diagram of the first air cooling unit and the second air cooling unit of the server architecture configuration is shown. Figure 12 This is a three-dimensional diagram of the insertion box mechanism according to an embodiment of the present application. Figure 13 yes Figure 12 A three-dimensional view of the insertion mechanism from another perspective is shown.

[0108] Reference Figures 11 to 13 As shown, the air cooling unit in the server architecture provided by the present application includes a first air cooling unit 120. The first air cooling unit 120 includes a first fan plate 122 and at least two first fan modules 121. The first fan plate 122 is arranged on the main frame 110, and the first fan plate 122 is provided with a first electrical connection portion 1221. At least two first fan modules 121 are arranged on the main frame 110, and have a first electrical matching portion 1212 connected to the first electrical connection portion 1221. At least one first fan module 121 is at a different height from the other first fan modules 121. Among them, the first electrical matching portion 1212 of the first fan module 121 in a high position and the first fan module 121 in a low position are both connected to the same first fan plate 122.

[0109] In such an embodiment, the plug-in mechanism 100 sets at least two first fan modules 121 in the first air-cooling unit 120 at different heights. The first fan module 121 at a high position and / or a low position and the main frame 110 can utilize the height difference between the first fan module 121 to form a space for coupling with the liquid cooling unit configured for the server. The liquid cooling unit in the server architecture at least includes cooling elements, pipes, pumps and other devices. Among them, the cooling element can be a cold plate, which can be set on the above-mentioned first processor module 250 and / or second processor module 240. Specifically, the cold plate can be abutted against the CPU or GPU to form heat exchange; and the pipes connected to the cold plate are passed through the plug-in mechanism 100 to the outside of the rear window of the server architecture.

[0110] Based on the 5U chassis structure configured in the first and second embodiments above, Figure 6The arrangement of the first air cooling unit 120 shown in FIG. 1 is as follows; based on the chassis structure configured as 5U in the third embodiment above, reference may be made to FIG. Figures 11 to 13 The arrangement of the first air cooling unit 120 and the second air cooling unit 130 is shown. It should be noted that, Figure 12 and Figure 13 The embodiment shown also shows a first air cooling unit 120 and a second air cooling unit 130, wherein: Figure 6 、 Figure 12 and Figure 13 In the embodiment shown, the first air cooling unit 120 adopts a similar design. Figure 12 and Figure 13 The first air cooling unit 120 is shown Figure 6 The embodiment shown will be described.

[0111] On this basis, the first air-cooling unit 120 is positioned in the upper region 213 of the second space 220, facing the first space 210. The lower space formed by the high-positioned first fan module 121 and the plug-in mechanism 100 can also be the upper space formed by the upper space formed by the first fan module 121 and the plug-in mechanism 100 (details will be explained in the following embodiments). Since the air-cooling unit's piping does not need to be horizontally avoided, the blind spots within the server where air cooling is not possible can be effectively reduced, fully utilizing the space within the plug-in mechanism 100 and the server chassis. This allows for greater flexibility in the placement of the first fan module 121 within the first air-cooling unit 120 and facilitates heat dissipation for electronic components at different heights within the server.

[0112] In addition, in the related art, different fan boards are often configured to form electrical connections for fan modules at different heights. In this embodiment, by connecting the first fan modules 121 at different heights to the same first fan board 122, the number of first fan boards 122 required to be arranged is correspondingly reduced, which not only saves the space in the server occupied by arranging multiple fan boards, but also reduces the coupling difficulty caused by interference with the pipelines of the liquid cooling unit caused by arranging multiple fan boards.

[0113] According to the embodiments of this application, referring to Figure 12 and Figure 13 As shown, the first air cooling unit 120 includes at least three first fan modules 121. At least two first fan modules 121 are disposed at the same height and arranged side by side.

[0114] In some exemplary embodiments, referring to Figure 12 and Figure 13As shown, the first air cooling unit 120 includes, but is not limited to, five first fan modules 121. Specifically, four of the first fan modules 121 are arranged side by side at the same height of the main frame 110, i.e., the first fan modules 121 at the lower position; another first fan module 121 is arranged at a height higher than the other first fan modules 121 on the main frame 110, i.e., the first fan module 121 at the higher position.

[0115] In some exemplary embodiments, the upper first fan module 121 is positioned in the middle of the first air cooling unit 120. For example, in the aforementioned first air cooling unit 120 having five first fan modules 121, the upper first fan module 121 can be positioned between the other four lower first fan modules 121. Specifically, the spacing between the upper first fan module 121 and the bottom of the main frame 110 should be configured to be larger than the pipe diameter of the liquid cooling unit configured in the server architecture. This allows the space defined by the first air cooling unit 120 and the main frame 110 to couple with the server's liquid cooling unit (e.g., a liquid cooling unit). It should be understood that the embodiments of the present application are not limited to this.

[0116] For example, the first air cooling unit 120 may include 2, 3, 4, 5, 6, 7, 8, 9, or any other number of first fan modules 121 .

[0117] For another example, in the first air cooling unit 120 , at least two first fan modules 121 may be configured to be higher than other first fan modules 121 .

[0118] For another example, the high-positioned first fan module 121 may be disposed outside the middle portion of the first air-cooling unit 120 .

[0119] Figure 14 yes Figure 13 A partial enlarged view of the first fan plate and the first beam-shaped member is shown.

[0120] According to the embodiments of this application, referring to Figure 13 and Figure 14 As shown, the first air cooling unit 120 further includes a first beam 123. The first beam 123 is horizontally disposed between two facing end surfaces of the main frame 110. The first fan plates 122 are stacked on the first beam 123.

[0121] In some exemplary embodiments, referring to Figure 13 and Figure 14As shown, the first beam-shaped member 123 includes, but is not limited to, a sheet-like structure configured in an approximately rectangular shape, specifically, a metal sheet. The term "approximately rectangular" can be understood as meaning that the first beam-shaped member 123 has a short side and a long side that is significantly longer than the short side, and visually, the long side and the short side enclose a quadrilateral sheet-like structure. However, due to the assembly requirements of the first beam-shaped member 123 with the main frame 110 and / or the first fan plate 122, one or more end surfaces of the first beam-shaped member 123 are provided with grooves, through-holes, protrusions, and other structures, resulting in the first beam-shaped member 123 not meeting the strict geometric definition of a rectangle. Specifically, the longitudinal ends of the first beam-shaped member 123 are connected to the facing end surfaces of the main frame 110 (specifically, the end surfaces of the base 112). The first beam-shaped member 123 is connected to the main frame 110 by, but is not limited to, riveting, welding, bolting, snap-fitting, or any other means. Furthermore, the end surface of the first beam-shaped member 123 facing the first fan plate 122 is further provided with a limiting structure corresponding to the first fan plate 122 .

[0122] In some exemplary embodiments, the first fan plate 122 is stacked on the first beam 123. Specifically, an I-shaped nail is disposed on the upper end surface of the first beam 123, and a calabash hole is provided on the first fan plate 122 at a position facing the I-shaped nail. The calabash hole and the I-shaped nail cooperate to ensure accurate assembly of the first fan plate 122 and the first beam 123. This ensures accurate positioning of the first electrical connection portion 1221 of the first fan plate 122 and the first electrical mating portion 1212 of the first fan module 121.

[0123] Furthermore, the first beam 123 is further provided with screw holes, so that after the first fan plate 122 is assembled on the first beam 123 , the first fan plate 122 can be tightly fixed to the first beam 123 by fasteners (such as screws, etc.).

[0124] According to the embodiments of this application, referring to Figure 13 and Figure 14 As shown, the first fan plate 122 has a first end surface and a second end surface that are separated from each other. The first end surface and the second end surface are respectively provided with a first electrical connection portion 1221. The first electrical connection portion 1221 on the first end surface is connected to the first electrical connection portion 1212 of the first fan module 121 at a lower position, and the first electrical connection portion 1221 on the second end surface is connected to the first electrical connection portion 1212 of the first fan module 121 at a higher position.

[0125] In some exemplary embodiments, the first fan plate 122 and the first beam 123 are stacked, the first end surface of the first fan plate 122 is in contact with the first beam 123, and the second end surface of the first fan plate 122 is away from the first beam 123. Figure 13 and Figure 14 In the embodiment shown, the first beam-shaped member 123 is horizontally arranged on the main frame 110, and the first fan plate 122 is arranged on the first beam-shaped member 123. Therefore, the first end surface can be understood as the lower end surface of the first fan plate 122, and the second end surface can be understood as the upper end surface of the first fan plate 122.

[0126] It should be noted that the above-mentioned first end face and second end face are only for distinguishing the different end faces of the first fan plate 122. Therefore, for different usage scenarios, the above-mentioned first end face can also be understood as the upper end face of the first fan plate 122, and the second end face can also be understood as the lower end face of the first fan plate 122.

[0127] In some exemplary embodiments, the upper end surface of the first fan plate 122 is respectively provided with a plurality of first electrical connection portions 1221. Specifically, the number of the first electrical connection portions 1221 provided on the first fan plate 122 should be configured to be greater than or equal to the number of the first electrical matching portions 1212 provided on the first fan module 121 that needs to be connected to the first fan plate 122. Figure 13 and Figure 14 In the illustrated embodiment, to connect the five first fan modules 121 to the same first fan plate 122, at least five first electrical connectors 1221 are required on the first fan plate 122. The four lower first fan modules 121 can connect to the first electrical connectors 1221 provided on the second end surface (i.e., the upper end surface) of the first fan plate 122, while the one higher first fan module 121 can connect to the first electrical connector 1221 provided on the first end surface (i.e., the lower end surface) of the first fan plate 122. It should be understood that the embodiments of the present application are not limited to this.

[0128] For example, the first fan plate 122 may be equipped with more first electrical connection portions 1221 than the first air-cooling unit 120 (the first electrical connection portions 1212). This means that after each first fan module 121 is connected to the first fan plate 122, some first electrical connection portions 1221 remain unused. This allows the first fan plate 122 to be adapted for other implementations or usage scenarios, allowing it to be replaced and reused in different scenarios, thus expanding its applicability.

[0129] Figure 15 yes Figure 12 A three-dimensional view of the first fan module in a lowered position is shown. Figure 16 yes Figure 12 A three-dimensional view of the first fan module in a high position is shown.

[0130] According to the embodiments of this application, referring to Figure 15and Figure 16 As shown, the first electrical matching portion 1212 of the first fan module 121 at a higher position is disposed at the bottom of the first fan module 121 .

[0131] According to the embodiments of this application, referring to Figure 15 and Figure 16 As shown, the first electrical matching portion 1212 of the first fan module 121 at the lower position is disposed on the top of the first fan module 121 .

[0132] In some exemplary embodiments, referring to Figure 15 and Figure 16 As shown, the first fan module 121 includes a frame and a fan body arranged in the frame, wherein the frame is the installation base of the first fan module 121, and is suitable for connecting the fan body to the main frame 110 of the plug-in mechanism 100 (such as the first installation space described below), and the fan body includes a motor and components such as fan blades installed at the output end of the motor, which are suitable for directional air flow. Furthermore, a first electrical matching portion 1212 is provided in the frame, and the first electrical matching portion 1212 is also electrically connected to the fan body (such as a motor) so that the first fan module 121 can be powered from the outside. The electrical connection portion and the electrical matching portion can adopt electrical connectors. Specifically, one of the electrical connection portion and the electrical matching portion includes but is not limited to a female connector, and the other can adopt a male connector.

[0133] In some exemplary embodiments, the first electrical mating portion 1212 of the upper first fan module 121 is connected to the first electrical connection portion 1221 located on the first end surface (i.e., the lower end surface) of the first fan plate 122. Furthermore, the first electrical mating portion 1212 of the lower first fan module 121 is connected to the first electrical connection portion 1221 located on the second end surface (i.e., the upper end surface) of the first fan plate 122. This means that, with the frame of the first fan module 121 as the projection plane and the axial direction of the fan body as the projection direction, the projections of the lower first fan module 121 and the upper first fan module 121 partially overlap with the first fan plate 122.

[0134] That is, the high-positioned first fan module 121 and the low-positioned first fan module 121 are staggeredly connected to the first fan plate 122, wherein the first electrical mating portion 1212 of the high-positioned first fan module 121 extends below the first fan plate 122, while the first electrical mating portion 1212 of the low-positioned first fan module 121 extends above the first fan plate 122. Therefore, the high-positioned first fan module 121, the low-positioned first fan module 121, and the first fan plate 122 effectively utilize the height space. In this embodiment, the height space occupied by the first air-cooling unit 120 is less than the sum of the height of the two first fan modules 121 and the thickness of the first fan plate 122. This saves a lot of height space and eliminates the need to redesign the height of the main frame 110.

[0135] Furthermore, the difference between the high-positioned first fan module 121 and the low-positioned first fan module 121 lies solely in the location of the first electrical connection portion 1212. Therefore, it can be understood that the high-positioned first fan module 121 and the low-positioned first fan module 121 can utilize the same first fan module 121. Connecting the first fan module 121 to different first electrical connection portions 1221 of the first fan plate 122 is accomplished simply by rotating the first fan module 121 180° around its axis. This expands the use scenarios of the first fan module 121 and allows for its reuse.

[0136] In this embodiment, the coordination of the high-positioned first fan module 121, the low-positioned first fan module 121, and the first fan plate 122 saves space. Furthermore, the positioning of the first electrical mating portion 1212 of the first fan module 121 allows the first fan module 121 and the first fan plate 122 to be reusable, further reducing server architecture costs and assembly difficulty.

[0137] Based on the chassis structure configured as 6U in the third embodiment above, continue to refer to Figure 12 and Figure 13 As shown, the plug-in mechanism 100 also includes a second air-cooling unit 130, which is disposed above the first air-cooling unit 120. The second air-cooling unit 130 includes a second fan plate 131 and a second fan module 132. The second fan plate 131 is disposed on the main frame 110 and has a second electrical connection portion 1311. The second fan module 132 is disposed on the main frame 110 and has a second electrical connection portion 1322 that connects to the second electrical connection portion 1311.

[0138] In some exemplary embodiments, continue to refer to Figure 12 and Figure 13 As shown, the first fan modules 121 in the first air-cooling unit 120 are arranged side by side in a row array. Similarly, the second fan modules 132 in the second air-cooling unit 130 are also arranged in a row array, with each second fan module 132 stacked on at least one first fan module 121 to form a column array. Specifically, within at least one column of fan modules arranged in a column array (i.e., the first fan module 121 and / or the second fan module 132), a spacing may be formed between the fan modules' upper portions and the main frame 110, between their lower portions and the main frame 110, or between both their upper and lower portions and the main frame 110. In other words, the piping of the liquid-cooling unit may pass through the upper portions of the fan modules (i.e., the first fan module 121 and / or the second fan module 132), through the lower portions of the fan modules, or through both the upper and lower portions of the fan modules, to couple the air-cooling unit to the liquid-cooling unit. How to pass, limit and support the pipeline of the liquid cooling unit will be described in the following embodiments.

[0139] Figure 17 yes Figure 13 A partial enlarged view of the second fan plate, the second beam-shaped member and the third beam-shaped member is shown. Figure 18 yes Figure 17 A stereogram from an upward perspective. Figure 19 yes Figure 17 An exploded view of the second beam and the third beam is shown.

[0140] According to the embodiments of this application, referring to Figures 17 to 19 As shown, the second fan plate 131 has a third end surface, and the third end surface is provided with a second electrical connection portion 1311 . And / or, the second electrical matching portion 1322 of the second fan module 132 is provided at the bottom of the second fan module 132 .

[0141] According to the embodiments of this application, referring to Figures 17 to 19 As shown, the second air cooling unit 130 further includes a second beam 133 and / or a third beam 134. The second beam 133, the third beam 134, and the second fan plate 131 are stacked. At least one of the second beam 133 and the third beam 134 is horizontally disposed between two facing end surfaces of the main frame 110.

[0142] In some exemplary embodiments, Figures 17 to 19 As shown, the second air cooling unit 130 may include only the second beam-shaped member 133 , or only the third beam-shaped member 134 , or both the second beam-shaped member 133 and the third beam-shaped member 134 .

[0143] For example, in the case of the second air-cooling unit 130 comprising both the second beam 133 and the third beam 134, the second beam 133, the third beam 134, and the second fan plate 131 are stacked from top to bottom. This helps improve the support strength of the second fan plate 131 and the main frame 110 (e.g., the base 112). Furthermore, the combination of the second beam 133 and the third beam 134 provides a greater thickness, facilitating the provision of structures such as slots 1341 at both ends of the third beam 134 for assembly with the main frame 110, thereby satisfying the assembly requirements of the second fan plate 131 and the main frame 110.

[0144] Furthermore, the second beam 133 and / or the third beam 134 may also be designed similarly to the shape of the first beam 123 of the above-described embodiment, and the first beam 133 and the third beam 134 may interlock to reduce the overall thickness. Furthermore, the surface of the third beam 134 facing the second fan plate 131 may be provided with a retaining structure corresponding to the second fan plate 131. This retaining structure includes, but is not limited to, providing an I-shaped nail 203 on the lower end surface of the third beam 134 and a gourd-shaped hole in the second fan plate 131 to accurately assemble with the I-shaped nail 203. The second beam 133 and / or the third beam 134 may then be secured to the second fan plate 131 using fasteners.

[0145] In some exemplary embodiments, the second air-cooling unit 130 includes, but is not limited to, two second fan modules 132. Specifically, the second electrical mating portions 1322 of the two second fan modules 132 are connected to different second electrical connection portions 1311 of the same second fan plate 131. It should be understood that the embodiments of the present application are not limited to this.

[0146] For example, the second air cooling unit 130 may include 2, 3, 4, 5, 6, 7, 8, 9, or any other number of second fan modules 132 .

[0147] In the above embodiment, the first fan plate 122 is a reusable embodiment, and the second fan plate 131 can be understood as the first fan plate 122 flipped 180° vertically. In other words, the first fan plate 122 and the second fan plate 131 are merely used to distinguish different installation spaces within the above-mentioned plug-in mechanism 100. In some usage scenarios, the first fan plate 122 and the second fan plate 131 are interchangeable.

[0148] For example, when a fan plate is installed at the bottom of the main frame 110, it can be considered the first fan plate 122; when the fan plate is installed at the top of the main frame 110, it can be rotated 180 degrees to become the second fan plate 131. This allows the fan plates to be interchangeable in different installation spaces, improving assembly convenience and reducing the cost of manufacturing multiple fan plates of different specifications.

[0149] Figure 20 yes Figure 1 A three-dimensional view of the second fan module is shown.

[0150] In some exemplary embodiments, referring to Figure 20 As shown, the second fan module 132 includes a frame and a fan body disposed within the frame. The details are similar to those of the first fan module 121 and will not be further described. Furthermore, the second electrical mating portion 1322 of the second fan module 132 is disposed at the bottom of the frame of the second fan module 132, similar in arrangement to the elevated first fan module 121 in the aforementioned embodiment.

[0151] It should be noted that the first fan module 121 and the second fan module 132 are only used to distinguish different installation spaces in the plug-in box mechanism 100 . In some usage scenarios, the first fan module 121 and the second fan module 132 are interchangeable.

[0152] For example, when a fan module is installed at the bottom of the main frame 110, it can be considered as the first fan module 121. When the fan module is installed at the top of the main frame 110, by rotating the fan module 180 degrees around the axis, it can be considered as the second fan module 132. In this way, the fan modules can be interchangeable in different installation spaces, improving the convenience of assembling the fan modules with the main frame 110. In addition, because the first fan module 121 in the lower position, the first fan module 121 in the upper position, and the second fan module 132 are distinguished only by the difference in installation direction, the cost of using at least two fan modules of different specifications is also reduced.

[0153] Figure 21 yes Figure 13 The illustrated perspective view of the insert mechanism is provided with a centrally positioned back panel. Figure 22 yes Figure 21 A partial enlarged view of the center back panel is shown.

[0154] According to the embodiments of this application, referring to Figure 21 and Figure 22As shown, the plug-in mechanism 100 further includes a central backplane 300. The central backplane 300 is vertically mounted on the main frame 110. A third electrical connection portion is provided on the side of the central backplane 300 facing the main frame 110. The first fan plate 122 and the second fan plate 131 are also provided with a third electrical mating portion for connecting to the third electrical connection portion.

[0155] According to the embodiments of this application, referring to Figure 21 and Figure 22 As shown, the back panel bracket 310 is vertically arranged between two facing end surfaces of the main frame 110 , and the central back panel 300 is arranged on the back panel bracket 310 .

[0156] In some exemplary implementations, referring to Figure 21 As shown, the center backplane 300 is connected between two facing end surfaces of the main frame 110 and is arranged in a vertical direction. Specifically, a third electrical connection portion is provided on the end surface of the center backplane 300 facing the air-cooling unit (such as the first fan plate 122 and the second fan plate 131 described above). Correspondingly, the first fan plate 122 is provided with a third electrical mating portion A1222, and the second fan plate 131 is also provided with a third electrical mating portion B1312. These connect to third electrical connections (blocked and not shown) at different heights on the center backplane 300 to form an electrical connection, allowing the first fan module 121 and the second fan module 132 to draw power from the second power supply module 150 via the center backplane 300. Specifically, one of the electrical connection portion and the electrical mating portion includes, but is not limited to, a female connector, while the other may be a male connector. Furthermore, in addition to the third electrical connection portion, the central backplane 300 is also provided with other electrical connectors on its end surface to connect different electronic devices in the server.

[0157] Figure 23 yes Figure 21 Exploded view of the backplate bracket shown.

[0158] According to the embodiments of this application, referring to Figure 21 and Figure 23 As shown, the back panel bracket 310 includes a first plate-shaped member 311 and a second plate-shaped member 312. The first plate-shaped member 311 is connected to the main frame 110 at both ends, and the second plate-shaped member 312 and the center back panel 300 are connected to the opposite end surfaces of the first plate-shaped member 311. The elastic modulus of the second plate-shaped member 312 is configured to be greater than the elastic modulus of the first plate-shaped member 311. The first plate-shaped member 311, the second plate-shaped member 312, and the center back panel 300 may have hollow areas, such as through-holes for heat dissipation.

[0159] In some exemplary embodiments, referring to Figure 21 and Figure 23As shown, the backplane bracket 310 is configured as a double-layer structure, including a first plate-shaped member 311 and a second plate-shaped member 312. The first plate-shaped member 311 and the second plate-shaped member 312 have different elastic moduli. Since the elastic modulus of the second plate-shaped member 312 is configured to be greater than the elastic modulus of the first plate-shaped member 311, the first plate-shaped member 311 is more easily deformed than the second plate-shaped member 312.

[0160] In some exemplary embodiments, the first plate-shaped member 311 is provided with a stepped nut suitable for connecting (e.g., riveting) the board. Furthermore, the second plate-shaped member 312 is connected (e.g., riveted) to the first plate-shaped member 311. The first plate-shaped member 311 may be made of, but not limited to, aluminum alloy, steel, or other materials, and may specifically be formed by integrally molding a profile made of such materials. The second plate-shaped member 312 may be made of, but not limited to, an alloy composed of, for example, iron, carbon, or silicon, and may specifically be formed by casting such materials.

[0161] In such an embodiment, the first plate-like member 311 is more susceptible to deformation than the second plate-like member 312. For this reason, its lower elastic modulus can be used to form holes and grooves to facilitate the installation of the center back panel 300 on the main frame 110. On the contrary, the second plate-like member 312 is less susceptible to deformation than the first plate-like member 311. For this reason, it can be used to support the first plate-like member 311 and the center back panel 300. For example, when the center back panel 300 (pre-installed on the back panel bracket 310) is installed into the main frame 110 from front to back (such as pushed from the front window to the rear window), the second plate-like member 312 can effectively prevent the first plate-like member 311 and the main frame 110 from deformation.

[0162] Figure 24 yes Figure 1 A three-dimensional view of the main frame portion of the plug-in mechanism shown.

[0163] According to the embodiments of this application, referring to Figure 24 As shown, the main frame 110 includes a bracket 111. A partition is provided within the bracket 111 to divide the interior of the bracket 111 into a plurality of first installation spaces 113 in the horizontal and vertical directions. A portion of the first installation spaces 113 is provided with a first fan module 121 or a second fan module 132, while another portion of the first installation spaces 113 is provided with a support plate 140.

[0164] In some exemplary embodiments, referring to Figure 24As shown, the main frame 110 includes a bracket 111 located at the top and a base 112 located at least partially below the bracket 111. A plurality of partitions are disposed within the bracket 111 along the horizontal and / or vertical directions to divide the interior space of the bracket 111 into a plurality of continuous first installation spaces 113. Specifically, the first fan module 121 and the second fan module 132 are slidably disposed in the first installation spaces 113 to allow the first fan module 121 and the second fan module 132 to be assembled to the main frame 110.

[0165] In some exemplary embodiments, referring to Figure 24 As shown, the plurality of first installation spaces 113 separated by the partitions may be non-uniform.

[0166] For example, the volume of the first installation space 113 for assembling the first fan module 121 or the second fan module 132 may be larger than the volume of the first installation space for assembling the support plate 140. Of course, the first installation spaces 113 may also be evenly arranged.

[0167] Further references Figure 24 As shown, at least a portion of the support plate 140 is disposed in the lower space of the elevated first fan module 121. And / or, at least another portion of the support plate 140 is disposed in the upper space of the elevated first fan module 121. And / or, at least another portion of the support plate 140 is offset from the elevated first fan module 121 in the height direction and is horizontally located between the second fan module 132 and the elevated first fan module 121.

[0168] In some exemplary embodiments, referring to Figure 24 As shown, at least one support plate 140 is disposed below the first fan module 121 at a higher position and is located in the lower space between the two first fan modules 121 at a lower position.

[0169] In some exemplary embodiments, referring to Figure 24 As shown, at least two support plates 140 are symmetrically disposed on both sides of the first high-position fan module 121 , and are horizontally located between the first high-position fan module 121 and the adjacent second fan module 132 .

[0170] In this embodiment, the space above or below the fan modules (such as the first fan module 121 and / or the second fan module 132) is used to accommodate the support plate 140 for routing the pipes. Thus, when the plug-in mechanism 100 couples the air-cooling unit with the liquid-cooling unit, the first fan modules 121 can remain arranged side by side. Since no fan module needs to be omitted to accommodate the pipes, this effectively reduces blind spots within the server where air cooling is unavailable, fully utilizing the space within the plug-in mechanism 100 and the server chassis 200.

[0171] Figure 25 yes Figure 24 A partial enlarged view of the support plate portion is shown. Figure 26 yes Figure 24 A partial enlarged view of the assembly part of the bracket and support plate of the plug-in mechanism is shown.

[0172] According to the embodiments of this application, referring to Figure 25 and Figure 26 As shown, the inserting mechanism 100 further includes a support plate 140 disposed on the main frame 110 , and the support plate 140 is provided with a pipe-through hole 141 for passing a pipe.

[0173] In some exemplary embodiments, referring to Figure 25 and Figure 26 As shown, the support plate 140 includes, but is not limited to, a sheet-like structure having a generally rectangular cross-section adapted to fit within the first installation space 113. Specifically, a pipe hole 141 is provided in the middle of the sheet-like support plate 140 to accommodate the passage of the liquid cooling unit's pipes. This pipe hole 141 can be either a single hole (to accommodate either the inlet or outlet pipe) or multiple holes (to accommodate both the inlet and outlet pipes). Furthermore, the support plate 140 is provided with at least one fixing hole 143 surrounding the pipe hole 141 to connect the pipe connectors when the pipes are passed through the support plate 140.

[0174] In some exemplary embodiments, referring to Figure 25 As shown, support plate 140 also has a flange structure that bends toward first installation space 113. Specifically, this flange structure is provided with a retaining groove 142 facing first installation space 113. Correspondingly, a retaining pin 1112 is provided within first installation space 113 formed by bracket 111. Thus, when support plate 140 is installed in first installation space 113, the engagement of retaining groove 142 and retaining pin 1112 effectively limits support plate 140 in position, allowing it to be vertically mounted on bracket 111.

[0175] Figure 27 yes Figure 24 A partial enlarged view of the blocking piece and elastic part of the insertion box mechanism is shown.

[0176] According to the embodiments of this application, referring to Figure 24 and Figure 27 As shown, the first fan module 121 and / or the second fan module 132 are detachably disposed in the first installation space 113. The plug-in mechanism 100 further includes a blocking piece 160 disposed in the first installation space 113. The blocking piece 160 is configured to move between a closed position for sealing the first installation space 113 and an open position for opening the first installation space 113.

[0177] According to the embodiments of this application, referring to Figure 24 and Figure 27 As shown, the baffle 160 is pivotally mounted on the wall of the first installation space 113. The inserting mechanism 100 further includes an elastic member 161, which abuts against the baffle 160 and the wall of the first installation space 113 and is configured to apply pressure to the baffle 160 toward the closed position, thereby returning the baffle 160 to the closed position.

[0178] In some exemplary embodiments, referring to Figure 24 and Figure 27 As shown, baffle 160 includes, but is not limited to, being disposed within first installation space 113 for mounting first fan module 121 or second fan module 132. Specifically, baffle 160 is rotatably connected to the partition via a shaft. Furthermore, elastic member 161 includes, but is not limited to, a torsion spring, wherein the middle portion of the torsion spring is sleeved onto the outside of the shaft, and the two arms of the torsion spring (e.g., the upper arm and the shorter arm) respectively press against baffle 160 and the partition, exerting a force on baffle 160 from an open position to a closed position, thereby maintaining first installation space 113 in the closed position.

[0179] In some exemplary embodiments, referring to Figure 27As shown, the baffle 160 includes, but is not limited to, an inward-turned structure, that is, when the baffle 160 is in the closed position, the baffle 160 is located within the first installation space 113. Furthermore, the first fan module 121 and / or the second fan module 132 include, but are not limited to, being detachably disposed in the first installation space 113 in a sliding manner. When the first fan module 121 (or the second fan module 132) is pushed into the first installation space 113, the first fan module 121 (or the second fan module 132) abuts against the baffle 160 to overcome the elastic force of the elastic member 161, thereby causing the baffle 160 to swing to an open position substantially parallel to the inner wall (e.g., the side wall) of the first installation space 113. Similarly, after the first fan module 121 (or the second fan module 132) is removed from the first installation space 113, the barrier 160, under the pressure exerted by the elastic member 161, returns to a closed position, forming an angle with the inner wall (e.g., the side wall) of the first installation space 113. This prevents cold air from flowing back and hindering heat dissipation when the first fan module 121 (or the second fan module 132) is removed from the first installation space 113.

[0180] Figure 28 yes Figure 24 The partially enlarged view of the first space of the insertion mechanism is shown, showing the stop portion.

[0181] According to the embodiments of this application, referring to Figure 28 As shown, a stopper 114 is provided in the first installation space 113, and limiters are provided on the first fan module 121 and the second fan module 132. The stopper 114 provided in the first installation space 113 for accommodating the first fan module 121 in a higher position and the stopper 114 provided in the first installation space 113 for accommodating the first fan module 121 in a lower position are disposed on different end surfaces of the first installation space 113. And / or, the stopper 114 provided in the first installation space 113 for accommodating the first fan module 121 in a lower position and the stopper 114 provided in the first installation space 113 for accommodating the second fan module 132 are disposed on different end surfaces of the first installation space 113.

[0182] According to the embodiments of this application, referring to Figure 28 As shown, one of the stopper portion 114 and the limiting portion is configured as a recessed portion, and the other is configured as a protruding portion engaged with the recessed portion.

[0183] In some exemplary embodiments, referring to Figure 28 As shown, a stopper 114 is provided in the first installation space 113 for assembling the first fan module 121 (or the second fan module 132). Accordingly, the frame of the first fan module 121 is provided with a first limiting portion 1211, and the frame of the second fan module 132 is provided with a second limiting portion 1321.

[0184] In some exemplary embodiments, referring to Figure 28 As shown, the stopper 114 disposed within the first installation space 113 forms a convex portion, and the corresponding concave portion is formed on the limiting portion of the first fan module 121 (or the second fan module 132). The convex portion can be a stop pin protruding from the inner wall of the first installation space 113, and the concave portion can be a stop hole. Thus, when the first fan module 121 (or the second fan module 132) is pushed into the first installation space 113, the stop hole engages and abuts the stop pin, thereby limiting the position of the first fan module 121 (or the second fan module 132). The stopper 114 disposed for the first fan module 121 and the second fan module 132 in the upper position includes, but is not limited to, being disposed at the top of the first installation space 113, while the stopper 114 disposed for the first fan module 121 in the lower position includes, but is not limited to, being disposed at the bottom of the first installation space 113. It should be understood that the embodiments of the present application are not limited to this.

[0185] For example, the stoppers 114 provided for different first installation spaces 113 may also be provided on the left and right parts, respectively. Specifically, the different stoppers 114 can be distinguished by simply making different positions relative to the first installation spaces 113 to achieve a foolproof effect.

[0186] In addition, regarding the above embodiment, where the first fan module 121 and the second fan module 132 are merely used to distinguish different installation spaces within the above-mentioned plug-in mechanism 100, it can be seen that the difference between the first fan module 121 in the lower position and the first fan module 121 and the second fan module 132 in the upper position is that the installation direction is rotated 180 degrees around the axis. To this end, by arranging the stoppers 114 in different positions within the different first installation spaces 113, a foolproof function can be achieved. That is, when the first fan module 121 (or the second fan module 132) is installed in the correct orientation into the first installation space 113, the positions of the stopper 114 and the limiting portion correspond, allowing the first fan module 121 (or the second fan module 132) to be pushed into the first installation space 113. When the first fan module 121 (or the second fan module 132) is installed in the incorrect orientation into the first installation space 113, the stopper 114 abuts against the liquid cooling unit outside the limiting portion, thereby preventing the first fan module 121 (or the second fan module 132) from being pushed into the first installation space 113. This facilitates the installation of the first fan module 121 and the second fan module 132 onto the main frame 110.

[0187] Figure 29 yes Figure 1 A three-dimensional view of the second power module is shown.

[0188] According to the embodiments of this application, referring to Figure 24 and Figure 29 As shown, the main frame 110 further includes a base 112, a bracket 111 is disposed on the base 112, and a second installation space 115 is defined between the bracket 111 and the base 112. The plug-in mechanism 100 further includes a second power module 150, which is detachably disposed in the second installation space 115.

[0189] In some exemplary embodiments, the enclosed area between the bottom of the bracket 111 of the main frame 110 and the base 112 also forms a second installation space 115, which is used to accommodate the second power module 150 in a reciprocating linear movement manner to realize insertion and installation operations and removal and disassembly operations.

[0190] According to the embodiments of this application, referring to Figure 24 and Figure 29 As shown, limiting posts are provided on the inner walls of the base 112 facing each other. The bent section 1532 is provided with a limiting groove 1533 having an opening. When the power-assisting handle 153 is in the first position, the opening of the limiting groove 1533 extends along the direction in which the battery module is inserted into the base 112. When the power-assisting handle 153 is in the second position, the opening of the limiting groove 1533 extends in a direction forming an angle with the insertion direction.

[0191] Figure 30 yes Figure 29 A partial enlarged view of the fixing plate portion is shown.

[0192] According to the embodiments of this application, referring to Figure 29 and Figure 30 As shown, the second power supply module 150 includes a shell 151, a power supply body 152, a power-assisting handle 153 and a fastener 154. The shell 151 has first surfaces arranged opposite to each other, and a second surface located between the two first surfaces. The power supply body 152 is arranged on the shell 151. The power-assisting handle 153 has a transition section 1531 and a bending section 1532 formed at two ends away from each other of the transition section 1531. The bending section 1532 is pivotally connected to the first surface. The power-assisting handle 153 is configured to swing the transition section 1531 between a first position away from the second surface and a second position abutting the second surface. The fastener 154 is arranged between the transition section 1531 and the second surface to keep the power-assisting handle 153 in the second position.

[0193] In some exemplary embodiments, referring to Figure 24 and Figure 29As shown, the power-assisting handle 153 is pivotally connected to the two facing first surfaces of the housing 151 via the bent section 1532, so that the power-assisting handle 153 can swing relative to the second power module 150 (the housing 151), making it easier for the staff to hold the transition section 1531 and thereby push the second power module 150 into (or remove) the second installation space 115. At the same time, through the swinging of the power-assisting handle 153, the limiting groove 1533 formed by the bent section 1532 can be adjusted to face the installation direction, or to a direction that forms an angle with the base. When the limiting groove 1533 faces the installation direction, the limiting groove 1533 can be engaged with the limiting column to accurately install the second power module 150 into the second installation space 115. Once the second power module 150 is fully installed, the operator can swing the transition section 1531 until it abuts the second surface. At this point, the retaining groove 1533 forms an angle with the installation direction, preventing the second power module 150 from escaping from the second installation space 115. In this state, the fixing plate 1534 can be attached to the second surface using fasteners 154 (e.g., screws), effectively maintaining the second power module 150 in this position and preventing it from separating from the plug-in mechanism 100.

[0194] Figure 31 It is a three-dimensional diagram of the server architecture of an embodiment of the present application.

[0195] This application also provides a server architecture, refer to Figure 31 As shown, it includes a chassis 200 and a plug-in mechanism 100 , and the plug-in mechanism 100 is disposed on the rear window of the chassis 200 .

[0196] According to the embodiments of this application, referring to Figure 31 As shown, the central backplane 300 of the subrack mechanism 100 and the chassis 200 define a first installation cavity, while the central backplane 300 and the main frame of the subrack mechanism 100 define a second installation cavity. A liquid cooling unit is disposed within the first installation cavity, and at least part of the liquid cooling unit's piping passes through the main frame 110 of the subrack mechanism 100.

[0197] In some exemplary embodiments, referring to Figure 31As shown, the plug-in mechanism 100 can be installed through the rear window of the chassis 200. When the plug-in mechanism 100 is installed in the chassis 200, the center backplane 300 (and the backplane bracket 310) provided on the plug-in mechanism 100 divides the interior of the server into two installation cavities (i.e., the first installation cavity and the second installation cavity mentioned above). The area including the front window is used to install various electronic components, specifically central processing unit nodes, image processing unit node holes, data exchange nodes, etc. At least a portion of these electronic components are configured to be electrically connected to the electrical connection portion provided on the center backplane 300. Furthermore, the above-mentioned electronic components can be arranged in layers in the server to meet the design requirements of 4U or 6U, so that the server has a larger expansion area.

[0198] In some exemplary embodiments, in order to meet the heat dissipation requirements of high-energy-consuming electronic devices in the server, the server architecture is also equipped with a liquid cooling unit, which includes at least cooling elements, pipes, pumps and other components. In detail, the cooling element includes but is not limited to a cold plate, which is arranged in the first installation cavity and is tightly fitted with the high-energy-consuming electronic devices to achieve heat exchange; the pipe includes at least a water inlet pipe connected to the liquid inlet end of the cooling element and a water outlet pipe connected to the water outlet end of the cooling element, and the pump is connected to the water inlet pipe and the water outlet pipe respectively, so that the medium can circulate in the cooling element. In order to guide the medium at a higher temperature after heat exchange with the high-energy-consuming electronic devices to the outside of the server, a support plate 140 needs to be provided in the plug-in mechanism 100 to lead the water outlet pipe and / or water inlet pipe of the liquid cooling unit to the outside of the server to release heat.

[0199] In this embodiment, the plug-in mechanism 100 arranges at least two first fan modules 121 in the first air-cooling unit 120 at different heights. The height difference between the first fan modules 121 in the higher and / or lower positions and the main frame 110 can be utilized to create space for coupling with the liquid cooling unit configured for the server. Since there is no need to horizontally avoid the piping provided by the liquid cooling unit, this effectively reduces blind spots within the server where air cooling is unavailable, thereby fully utilizing the space within the plug-in mechanism and the server chassis. This allows for greater flexibility in the placement of the first fan modules 121 in the first air-cooling unit 120.

[0200] In addition, in the related art, different fan boards are often configured to form electrical connections for fan modules at different heights. In this embodiment, by connecting the first fan modules 121 at different heights to the same first fan board 122, the number of first fan boards 122 required to be arranged is correspondingly reduced, which not only saves the space in the server occupied by arranging multiple fan boards, but also reduces the coupling difficulty caused by interference with other devices caused by arranging multiple fan boards.

[0201] The other technical features of the server architecture have been described in detail in the above embodiments of the plug-in mechanism, and the server architecture has similar technical effects as the plug-in mechanism. Therefore, they will not be described in detail.

[0202] According to some exemplary embodiments of the present application, referring to Figure 31 As shown, the inserting mechanism 100 is detachably disposed on the chassis 200 .

[0203] In some exemplary embodiments, referring to Figure 31 As shown, the inserting mechanism 100 is configured to be pushed into the chassis 200 along the rear window of the chassis 200. Specifically, the bottom surface of the chassis 200 is provided with I-shaped nails 203, and the base 112 of the inserting mechanism 100 is provided with corresponding grooves 1121. When the inserting mechanism 100 is pushed into the chassis 200, the I-shaped nails 203 provided on the chassis 200 can be embedded in the grooves 1121, thereby limiting the depth to which the inserting mechanism 100 can be inserted into the chassis 200. Furthermore, the side panels of the chassis 200 are also provided with fastener holes 204, and correspondingly, the side walls of the base 112 of the plug-in mechanism 100 are provided with screw holes 1122. When the I-nail 203 of the chassis 200 is embedded in the groove 1121, the fastener hole 204 is exactly opposite to the screw hole 1122. The staff can insert fasteners (such as screws) into the fastener hole 204 to connect the plug-in mechanism 100 with the chassis 200.

[0204] According to some other exemplary embodiments of the present application, not shown in the figures, the inserting mechanism 100 is integrally provided in the chassis 200 .

[0205] In some exemplary implementations, not shown in the figures, the inserting mechanism 100 may be integrally provided in the chassis 200 , that is, the inserting mechanism 100 cannot be removed from the chassis 200 .

[0206] The above is a detailed introduction to an immersion liquid cooling device and electronic device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server architecture, characterized in that: include: chassis(200); A central back panel (300) is vertically arranged on the chassis (200) to separate the interior of the chassis (200) into a first space (210) near the front window and a second space (220) near the rear window; A first power module (230) is arranged in the lower area (211) of the first space (210); A first processor module (250) is disposed in a middle region (212) above the first power module (230); A second processor module (240) is disposed in an upper region (213) above the first processor module (250); The upper region (213) has a front region (2131) close to the front window and a rear region (2132) away from the front window, and the second processor module (240) is at least located in the rear region (2132); The box insertion mechanism (100) is detachably arranged in the second space (220) of the chassis (200), and the box insertion mechanism (100) comprises: Main frame (110); An air cooling unit is provided on the main frame (110) and faces at least the second processor module (240), the air cooling unit comprising a first air cooling unit (120), the first air cooling unit comprising: A first fan plate (122) is provided on the main frame (110), and the first fan plate (122) is provided with a first electrical connection portion (1221); At least two first fan modules (121) are arranged on the main frame (110) and have a first electrical matching portion (1212) connected to the first electrical connection portion (1221); at least one of the first fan modules (121) is at a different height from the other first fan modules (121); The first fan module (121) at a high position and the first electrical matching portion (1212) of the first fan module (121) at a low position are both connected to the same first fan plate (122).

2. The server architecture according to claim 1, wherein: Also includes: A hard disk module (260) is disposed in the middle region (212) or the front region (2131); When the hard disk module (260) is located in the front area (2131), the second processor module (240) is located in the rear area (2132); and when the hard disk module (260) is located in the middle area (212), part of the second processor module (240) is located in the front area (2131).

3. The server architecture according to claim 2, wherein: Also includes: A mainboard (280) is disposed in the middle region (212), and the first processor module (250) is disposed on the mainboard (280) and interconnected with the mainboard (280).

4. The server architecture according to claim 3, wherein: Also includes: The exchange board (270) is arranged in the middle layer area (212), connected to the main board (280), and interconnected with the first processor module (250) through the main board (280).

5. The server architecture according to claim 4, wherein: The second processor module (240) is connected to the expansion slot of the switch board (270).

6. The server architecture according to claim 4, wherein: Also includes: The communication card (2100) is arranged in the middle layer area (212) and is connected to the expansion slot of the switch board (270).

7. The server architecture according to claim 6, wherein: The hard disk module (260) is arranged above the communication card (2100) and is located in the front area (2131).

8. The server architecture according to claim 6, wherein: The hard disk module (260) is arranged on the side of the communication card (2100) and is located in the middle layer area (212).

9. The server architecture according to claim 1 or 2, characterized in that: The chassis (200) comprises: A box body (201), wherein an upper portion of the box body (201) is formed with an opening; A box cover (202) is detachably arranged on the box body (201), wherein the box cover (202) comprises a top plate and side plates symmetrically arranged on both sides of the top plate, and the side plates extend downward; The box cover (202) comprises a first box cover (2021) and a second box cover (2022), wherein one of the first box cover (2021) and the second box cover (2022) is arranged on the box body (201), and the side panel of the second box cover (2022) is at least 1U higher than the side panel of the first box cover (2021).

10. The server architecture according to claim 1 or 2, characterized in that: Also includes: A power distribution module (290) is disposed in the middle region (212) and plugged into the middle backplane (300); Wherein, the first power supply module (230) and the power distribution module (290) are interconnected.

11. The server architecture according to claim 10, wherein: Also includes: The box insertion mechanism (100) further includes: a second power supply module (150) disposed on the main frame (110) and located below the air cooling unit, the second power supply module (150) being interconnected with the power distribution module (290) via the central backplane (300); The first power supply module (230) is configured to supply power to at least the second processor module (240), and the second power supply module (150) is configured to supply power to at least the first processor module (250).

12. The server architecture according to claim 11, wherein: The first fan plate (122) has a first end surface and a second end surface that are separated from each other, and the first end surface and the second end surface are respectively provided with the first electrical connection portion (1221); The first electrical connection portion (1221) located at the first end surface is connected to the first electrical matching portion (1212) of the first fan module (121) at a lower position, and the first electrical connection portion (1221) located at the second end surface is connected to the first electrical matching portion (1212) of the first fan module (121) at a higher position.

13. The server architecture according to claim 11, wherein: The first electrical matching portion (1212) of the first fan module (121) at a high position is arranged at the bottom of the first fan module (121); And / or, the first electrical matching portion (1212) of the first fan module (121) at a lower position is arranged on the top of the first fan module (121).

14. The server architecture according to claim 11, wherein: The air cooling unit further comprises a second air cooling unit (130) arranged in the upper space of the first air cooling unit (120), and the second air cooling unit (130) comprises: A second fan plate (131) is provided on the main frame (110), and the second fan plate (131) is provided with a second electrical connection portion (1311); The second fan module (132) is arranged on the main frame (110) and has a second electrical matching portion (1322) connected to the second electrical connection portion (1311).

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