Display module and manufacturing method

Abstract

The invention provides a display module and a manufacturing method, and is applied to the technical field of display. The display module comprises a light-emitting panel and a back plate, a plurality of light-emitting light sources are arranged on the light-emitting panel, and the back plate is located on the side, away from the light-emitting side, of the light-emitting panel; the heat dissipation layer is located between the light-emitting panel and the back plate, the heat dissipation layer comprises a plurality of heat dissipation units, the heat dissipation units are made of phase change materials, and the orthographic projection of each light-emitting light source on the plane where the heat dissipation layer is located is overlapped with one heat dissipation unit. By adopting the display module and utilizing heat absorption in the phase change process of the phase change material, rapid cooling of the light-emitting light source during short-time high-frequency heat release is realized, so that effective heat dissipation of the display device is ensured; in addition, the heat dissipation units and the light-emitting light sources are correspondingly arranged, so that heat emitted by the light-emitting light sources can be effectively dissipated through the corresponding heat dissipation units, uniform heat dissipation of the light-emitting panel is guaranteed, and the problem of serious color cast caused by too high temperature is avoided.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] In recent years, high-division, high-brightness, and high-color-gamut surface light source Mini LED display devices have become a hot topic in industry research. In the Mini LED backlight structure, a direct-down design is used to densely arrange blue chips or blue lamp beads on the PCB / glass substrate, thereby achieving smaller-scale regional dimming. More ICs are used in the light board circuit to achieve local dimming and regional control dimming.

[0003] The Mini LED display device with the above structure has the problem of dense circuit wiring at the IC position and severe color deviation in the panel due to excessive temperature. In addition, since electronic devices work normally in the range of 70℃ to 80℃, the reliability will decrease by 50% for every 10℃ increase in temperature. Therefore, the reliability of electronic devices is also greatly affected by temperature. The heat dissipation problem of this type of display device has become a technical key in the research and development process of electronic equipment. Summary of the invention

[0004] The technical solution of the present invention aims to provide a display module and a manufacturing method for solving the problem of poor heat dissipation in a Mini LED display device and severe color deviation caused by excessive temperature.

[0005] One embodiment of the present invention provides a display module, comprising:

[0006] A light-emitting panel and a back plate, wherein the light-emitting panel is provided with a plurality of light sources, and the back plate is located on a side of the light-emitting panel away from a light-emitting side;

[0007] The heat dissipation layer is located between the light-emitting panel and the back plate. The heat dissipation layer includes a plurality of heat dissipation units. The heat dissipation units are made of phase change material. The orthographic projection of each of the light-emitting light sources on the plane where the heat dissipation layer is located overlaps with one of the heat dissipation units.

[0008] Optionally, in the display module, a cross-sectional area of the heat dissipation unit gradually decreases in a direction from the light-emitting panel to the back plate.

[0009] Optionally, in the display module, the shape of the heat dissipation unit includes one or more of a triangular pyramid shape, a quadrangular pyramid shape, a hemispherical shape and an irregular shape.

[0010] Optionally, in the display module, the plurality of heat dissipation units are separated from each other.

[0011] Optionally, for the display module described above, each of the heat dissipation units is respectively connected to the light-emitting panel and the backplane.

[0012] Optionally, for the display module described above, among the multiple heat dissipation units, at least one of the heat dissipation units is internally provided with a driving chip.

[0013] Optionally, for the display module described above, the heat dissipation layer further includes a substrate, and multiple heat dissipation units are fabricated on the substrate; alternatively, multiple heat dissipation units are fabricated on the backplane, or multiple heat dissipation units are fabricated on the light-emitting panel.

[0014] Optionally, for the display module described above, the substrate is made of FR4 copper-clad laminate or aluminum material.

[0015] One embodiment of the present invention further provides a manufacturing method, which is applied to the display module described in any one of the above, and the manufacturing method includes:

[0016] Providing the light-emitting panel and the backplane;

[0017] Fabricating the heat dissipation layer between the light-emitting panel and the backplane.

[0018] Optionally, for the manufacturing method described above, fabricating the heat dissipation layer between the light-emitting panel and the backplane includes:

[0019] Fabricating multiple heat dissipation units by performing multi-layer spraying on the substrate, the backplane or the light-emitting panel to form the heat dissipation layer; wherein, for one heat dissipation unit, the area of the phase change material sprayed in each layer is different; or

[0020] Fabricating multiple heat dissipation units by dripping phase change material at multiple positions on the substrate, the backplane or the light-emitting panel to form the heat dissipation layer.

[0021] At least one of the above technical solutions in the specific embodiments of the present invention has the following beneficial effects:

[0022] In the display module according to the embodiment of the present invention, a heat dissipation layer is provided between the light-emitting panel and the backplane. The heat dissipation layer includes multiple heat dissipation units made of phase change material. By using the heat absorption during the phase change process of the phase change material, rapid cooling is achieved when the light-emitting source releases heat in a short time and at a high rate, so as to ensure effective heat dissipation of the display device; in addition, the heat dissipation units are arranged corresponding to the light-emitting sources, so that the heat released by the light-emitting sources can be effectively dissipated through the corresponding heat dissipation units, ensuring uniform heat dissipation of the light-emitting panel and avoiding the problem of serious color deviation caused by excessive temperature. Description of the Drawings

[0023] Figure 1is a schematic cross-sectional structure diagram of a display module according to an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the planar structure of a light-emitting panel in a display module according to an embodiment of the present invention;

[0025] Figure 3 It is a schematic diagram of implementation mode 1 of the heat dissipation layer in the display module according to the embodiment of the present invention;

[0026] Figure 4 It is a schematic diagram of a second implementation mode of the heat dissipation layer in the display module according to an embodiment of the present invention;

[0027] Figure 5 It is a schematic diagram of implementation mode 3 of the heat dissipation layer in the display module described in the embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and advantages to be solved by the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0029] In order to solve the problem of poor heat dissipation and severe color deviation caused by excessive temperature in a Mini LED display device, an embodiment of the present invention provides a display module, wherein a heat dissipation layer is arranged between the light-emitting panel and the back panel, and the heat dissipation layer includes a plurality of heat dissipation units made of phase change material, and the heat dissipation units are arranged corresponding to the light sources. In this way, the heat absorption during the phase change process of the phase change material is utilized to achieve rapid cooling of the light source when it releases heat at a high temperature for a short time, so as to achieve effective heat dissipation of the display device; in addition, since the plurality of heat dissipation units are arranged one-to-one with the plurality of light sources, the heat released by the light sources can be effectively dissipated through the corresponding heat dissipation units, so as to ensure uniform heat dissipation of the light-emitting panel and avoid the problem of severe color deviation caused by excessive temperature.

[0030] One embodiment of the present invention provides a display module, such as Figure 1 As shown, the display module includes:

[0031] A light emitting panel 10 and a back plate 20, wherein the light emitting panel 10 is provided with a plurality of light sources 11, and the back plate 20 is located on a side of the light emitting panel 10 away from a light emitting side;

[0032] The heat dissipation layer 30 is located between the light emitting panel 10 and the back plate 20 . The heat dissipation layer 30 includes a plurality of heat dissipation units 31 . The heat dissipation units 31 are made of phase change material. The orthographic projection of each light source 11 on the plane where the heat dissipation layer 30 is located overlaps with one of the heat dissipation units 31 .

[0033] In an embodiment of the present invention, optionally, the light-emitting panel 10 includes, but is not limited to, only a mini-LED panel, and may also be an ordinary LED or an OLED display panel, etc. Optionally, the light-emitting panel 10 is formed as a surface light source panel.

[0034] By using the display panel described in this embodiment, by providing a heat dissipation layer including a phase change material between the light-emitting panel 10 and the backplane 20, the problem of serious color deviation of the panel caused by uneven temperature distribution on the light-emitting panel 10 with multiple light-emitting light sources 11 is solved by the phase change material.

[0035] Specifically, by providing a heat dissipation unit 31 made of a phase change material between the light-emitting panel 10 and the backplane 20, when the light-emitting light source 11 emits heat, the phase change process of the phase change material is used for heat absorption, and the heat released by the light-emitting light source 11 can be absorbed. Moreover, by using the principle of thermal expansion and contraction of the phase change material, the volume of the phase change material expands due to heat absorption and approaches the backplane 20, so that the heat of the light-emitting light source 11 can be evenly cooled by conduction and finally dissipated from the surface of the backplane 20. When the temperature drops to a certain temperature, the volume of the phase change material can contract and return to its original state, thus achieving a certain uniform heat dissipation effect.

[0036] In addition, for display products, due to the red shift of the peak wavelength of the blue light chip caused by temperature increase, when the emission wavelength of the chip does not match the excitation wavelength of the phosphor or quantum dot, the electro-optical conversion efficiency is reduced. In addition, when the temperature rises, the phosphor or quantum dot decays very seriously at high temperature, affecting the service life. In the display module described in the embodiment of the present invention, by providing a heat dissipation unit 31 made of a phase change material between the light-emitting panel 10 and the backplane 20, the heat generated during the electro-optical conversion process of the light-emitting panel 10 during the use of the display device can be transmitted to the backplane 20 through the heat dissipation unit 31 for uniform heat dissipation, thereby realizing the chromaticity uniformity of the backlight / module screen.

[0037] As shown in the following table, for the Mini LED display module, the LED brightness attenuation and color point change at different temperatures are as follows:

[0038]

[0039] Therefore, according to the LED brightness attenuation and color point change states at different temperatures in the above table, by adjusting the temperature of the backlight / module screen, not only can the picture quality, brightness, and color points of the electronic display product have a better display effect and improved consistency, but also the service life of the product can be improved, making the performance and cost performance of the product higher.

[0040] In the embodiments of the present invention, the phase change materials used to fabricate the heat dissipation unit may include one or more of organic phase change materials such as paraffin, polyolefin, higher fatty acids, and alcohols, or may also include one or more of inorganic phase change materials such as simple salts, high-temperature molten salts, mixed salts, alkali metals, and alloys. Optionally, the phase change material further includes a high thermal conductivity material, such as adding metal foam, which can increase the phase change heat transfer capacity by 3 to 10 times, greatly improve the temperature control ability of the phase change device, improve the uniformity of the temperature field through gradient design, and accelerate the melting speed of the phase change material to enhance the heat dissipation effect.

[0041] For the phase change material fabricated using these materials, when the temperature of an object is higher than the phase change temperature, the material absorbs and stores heat to lower the temperature of the object; when the temperature of the object is lower than the phase change temperature, the material releases the stored heat to increase the temperature of the object. In this way, by utilizing the phase change process of the phase change material to store or release heat, temperature control of the object can be achieved.

[0042] Therefore, in the display module described in the embodiments of the present invention, phase change heat absorption is utilized to achieve cooling during a short period of high heat generation power, and temperature control of a large-fluctuation thermal environment is achieved through continuous phase change heat absorption and heat release.

[0043] In one embodiment of the present invention, one implementation manner is as Figure 1 and Figure 2 shown, the orthographic projection of the light-emitting light source 11 on the plane where the heat dissipation layer 30 is located overlaps with one of the heat dissipation units 31. That is, as Figure 1 shown, a plurality of light-emitting units 11 on the light-emitting panel 11 are formed into a structure corresponding one-to-one with the plurality of heat dissipation units 31 on the heat dissipation layer 30. With this implementation manner, by utilizing the heat concentration characteristic at the setting position of the light-emitting light source 11, one heat dissipation unit 31 is correspondingly provided for each light-emitting light source 11, and the heat dissipation unit 31 effectively dissipates heat from the corresponding light-emitting light source 11 to ensure uniform heat dissipation of the light-emitting panel and avoid the problem of serious color deviation caused by excessive temperature.

[0044] In one embodiment of the present invention, optionally, as Figure 1 shown, in the direction from the light-emitting panel 10 to the backplane 20, the cross-sectional area of the heat dissipation unit 31 gradually decreases. Optionally, each heat dissipation unit 31 is respectively connected to the light-emitting panel 10 and the backplane 20. With this implementation structure, the heat dissipation unit 31 made of the phase change material is formed into a structure in which the cross-sectional area of the heat dissipation unit 31 gradually decreases in the direction from the light-emitting panel 10 to the backplane 20, so as to achieve uniform heat dissipation in the direction from the light-emitting panel 10 to the backplane 20.

[0045] Optionally, the shape of the heat dissipation unit 31 includes one or more of a triangular pyramid shape, a quadrangular pyramid shape, a hemispherical shape, and an irregular shape. In one implementation manner, optionally, as Figure 3 andFigure 4 As shown, the multiple heat dissipation units 31 on the heat dissipation layer 30 include one or more of a triangular pyramid shape, a quadrangular pyramid shape, and a hemispherical shape. In another embodiment, optionally, as Figure 5 shown, the multiple heat dissipation units 31 on the heat dissipation layer 30 may also include an irregular shape, that is, in the direction from the light-emitting panel 10 to the backplane 20, the cross-sectional area of the heat dissipation unit 31 gradually decreases, but the structure with the gradually decreasing cross-sectional area is an irregular shape; the above Figure 3 and Figure 5 shown in the embodiment, the multiple heat dissipation units 31 may be in a mutually connected structure, that is, one heat dissipation unit 31 is mutually connected with the adjacent heat dissipation unit. In another embodiment, optionally, as Figure 4 shown, the multiple heat dissipation units 31 may be in a mutually separated structure.

[0046] Optionally, when the shape of the heat dissipation unit 31 is a triangular pyramid shape, a quadrangular pyramid shape, or a hemispherical shape, the display module described in the embodiment of the present invention can be applied to a Mini LED display module with a mixing light distance (Optical Distance, OD) value (that is, the distance between the lamp board and the diffusion board) between 0 and 5 mm and the number of partitions greater than 1000, to solve the problem that heat cannot be quickly and evenly distributed during the electro-optical conversion process due to a large number of light-emitting sources and a small OD; optionally, when the shape of the heat dissipation unit 31 is an irregular shape, the display module described in the embodiment of the present invention can be applied to a Mini LED display module with an OD value between 5 and 12 mm and the number of partitions between 500 and 1000, to solve the problem of uniform heat dissipation of a display module with not particularly dense light-emitting sources; optionally, the mutually separated structure of the multiple heat dissipation units 31 can be applied to a Mini LED display module with an OD value above 12 mm and the number of partitions below 500. Adopting this implementation structure can meet the heat dissipation requirements of the display module and also reduce the manufacturing cost of the display module.

[0047] It should be noted that the shape of the above heat dissipation unit 31 is only for illustrative purposes and is not specifically limited thereto.

[0048] In the embodiment of the present invention, the shape of the multiple heat dissipation units 31 on the heat dissipation layer 30 may be one of the shapes of the above embodiments, or may include multiple different shapes.

[0049] Adopting the heat dissipation layer 30 of the above embodiment, the multiple heat dissipation units 31 are respectively arranged in one-to-one correspondence with multiple light-emitting sources 11, and in the direction from the light-emitting panel 10 to the backplane 20, the cross-sectional area of the heat dissipation unit 31 gradually decreases, realizing uniform heat dissipation in the direction from the light-emitting panel 10 to the backplane 20.

[0050] In an embodiment of the present invention, optionally, the heat dissipation layer 30 further includes a substrate, and a plurality of heat dissipation units are fabricated on the substrate; alternatively, a plurality of heat dissipation units 31 are fabricated on the backplane 20, or a plurality of heat dissipation units 31 are fabricated on the light-emitting panel 10.

[0051] Optionally, in one implementation, a plurality of heat dissipation units 31 can be fabricated on a substrate to form the heat dissipation layer 30. With this implementation, before assembling the display module, the heat dissipation layer 30 can be fabricated first, and when assembling the display module, the fabricated heat dissipation layer 30 is disposed between the light-emitting panel 10 and the backplane 20.

[0052] Optionally, the substrate is made of, but not limited to, only FR4 copper-clad laminate or aluminum material.

[0053] In another implementation, a plurality of heat dissipation units 31 can be fabricated on the light-emitting panel 10. Specifically, before assembling the display module, a plurality of heat dissipation units 31 are fabricated on the surface of the light-emitting panel 10 facing away from the light-emitting surface, that is, on the surface facing the backplane 20. When assembling the display module, the light-emitting panel 10 and the backplane 20 are assembled, and the heat dissipation layer 30 is disposed facing the backplane 30, so that the heat dissipation layer 30 is disposed between the light-emitting panel 10 and the backplane 20.

[0054] In another implementation, optionally, a plurality of heat dissipation units 31 can be fabricated on the backplane 20. Specifically, when assembling the display module, as shown in Figure 1 a plurality of heat dissipation units 31 can be fabricated on the backplane 20 first to form the heat dissipation layer 30, and then the light-emitting panel 10 is covered on the backplane 20 fabricated with a plurality of heat dissipation units 31, so that the heat dissipation layer 30 is disposed between the light-emitting panel 10 and the backplane 20.

[0055] In an embodiment of the present invention, optionally, fabricating the heat dissipation layer 30 between the light-emitting panel 10 and the backplane 20 includes one of the following:

[0056] By spraying or dropping a phase change material on the substrate, the backplane 20 or the light-emitting panel 10, a plurality of heat dissipation units 31 are fabricated to form the heat dissipation layer 30.

[0057] Optionally, spraying the phase change material on the substrate, the backplane 20 or the light-emitting panel 10 includes:

[0058] By performing multi-layer spraying on the substrate, the backplane 20 or the light-emitting panel 10, a plurality of heat dissipation units 31 are fabricated; wherein, for one heat dissipation unit 31, the area of the phase change material sprayed on each layer is different.

[0059] In one implementation of the display module according to the embodiment of the present invention, optionally, as shown in Figure 3As shown, among multiple heat dissipation units 31, a driving chip 60 is disposed inside at least one heat dissipation unit 31.

[0060] Optionally, the heat dissipation unit 31 and the driving chip 60 can be fabricated on a substrate simultaneously, or the heat dissipation unit 31 and the driving chip 60 can be fabricated on the surface of the light-emitting panel 10 facing the backplane 20 simultaneously; alternatively, the driving chip 60 is fabricated on the substrate and the heat dissipation unit 31 is fabricated on the backplane 20; or the driving chip 60 is fabricated on the surface of the light-emitting panel 10 facing the backplane 20 and the heat dissipation unit 31 is fabricated on the backplane 20. The setting manner of the driving chip 60 is not limited herein.

[0061] By adopting the display module described in this embodiment, by disposing the driving chip 60 inside the heat dissipation unit 31 made of a phase change material, the heat generated by the driving chip 60 can be effectively dissipated, and the color deviation problem caused by uneven heat dissipation due to the heat generated by the driving chip 60 can be avoided.

[0062] By adopting the display module described in the embodiment of the present invention, through the method of spraying the phase change material in multiple layers, optionally, the area of the phase change material sprayed in each layer is different to achieve gradient spraying, so that in the direction from the light-emitting panel to the backplane, the cross-sectional area of the heat dissipation unit formed by spraying gradually decreases, which can meet the brightness uniformity requirements of different product display modules and avoid the problems of dot color deviation or local color deviation of the picture due to instantaneous temperature rise.

[0063] In addition, optionally, by adopting the display module described in the embodiment of the present invention, through the method of spraying the phase change material in multiple layers, the uniformity of the sprayed phase change material can be ensured. Optionally, the thickness of the sprayed phase change material is between 35 μm and 65 μm.

[0064] Since there is no support column or light guide plate for the protective glue and optical film stack on the upper surface of the light-emitting panel 10 to maintain its flatness, by adopting the display module described in the embodiment of the present invention, the phase change material sprayed or dropped on the entire surface between the light-emitting panel 10 and the backplane 20 can ensure the flatness between the light-emitting panel 10 and the backplane 20, thereby making the backlight or the picture of the module more uniform.

[0065] In another embodiment, when multiple heat dissipation units are formed by spraying or dropping the phase change material, the shape of the formed heat dissipation unit can be controlled by controlling the standing time and temperature of the sprayed or dropped phase change material, etc., so that the shape of the formed heat dissipation unit is one or more of a triangular pyramid shape, a quadrangular pyramid shape, a hemispherical shape, and an irregular shape.

[0066] According to the above, for the display module according to the embodiments of the present invention, the phase change process of the phase change material is utilized to store or release heat, so as to achieve temperature control of the display module. The display module that realizes temperature control in this way not only has a small volume and a simple structure, but also has the advantages of economy, energy saving, reliable performance, etc.

[0067] It should be noted that the display module according to the embodiments of the present invention further includes an optical film 40 disposed on the light-emitting side of the light-emitting panel and a glue frame 50 disposed around the light-emitting panel and the optical film. The optical film includes a polarizer, a diffusion sheet, a reflector, etc. The structures of the optical film 40 and the glue frame 50 are not the focus of the research of the present invention and will not be described in detail here.

[0068] Another embodiment of the present invention further provides a manufacturing method, which is applied to the display module as described in any one of the above. The manufacturing method includes:

[0069] Providing the light-emitting panel and the backplane;

[0070] Manufacturing the heat dissipation layer between the light-emitting panel and the backplane.

[0071] By adopting the manufacturing method according to the embodiments of the present invention, a heat dissipation layer is provided between the light-emitting panel and the backplane. The heat dissipation layer includes a plurality of heat dissipation units made of a phase change material. The heat absorption during the phase change process of the phase change material is utilized to achieve rapid cooling when the light-emitting light source emits heat in a short time and at a high level, so as to ensure effective heat dissipation of the display device. In addition, the heat dissipation units are correspondingly arranged with the light-emitting light source, so that the heat released by the light-emitting light source can be effectively dissipated through the corresponding heat dissipation units, so as to ensure uniform heat dissipation of the light-emitting panel and avoid the problem of serious color deviation caused by too high temperature.

[0072] Optionally, for the manufacturing method, manufacturing the heat dissipation layer between the light-emitting panel and the backplane includes:

[0073] By spraying or dropping a phase change material on a substrate, the backplane or the light-emitting panel, a plurality of the heat dissipation units are manufactured to form the heat dissipation layer.

[0074] Optionally, for the manufacturing method, spraying a phase change material on a substrate, the backplane or the light-emitting panel includes:

[0075] By performing multi-layer spraying on a substrate, the backplane or the light-emitting panel, a plurality of the heat dissipation units are manufactured; wherein, for one heat dissipation unit, the area of the phase change material sprayed on each layer is different.

[0076] For the specific implementation process during the manufacture of the heat dissipation units by adopting the manufacturing method according to the embodiments of the present invention, reference can be made to the detailed description of the specific implementation structure of the display module according to the embodiments of the present invention, and no repeated description will be given here.

[0077] The above are the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A display module, characterized in that, include: A light-emitting panel and a back plate, wherein the light-emitting panel is provided with a plurality of light sources, and the back plate is located on a side of the light-emitting panel away from a light-emitting side; The heat dissipation layer is located between the light-emitting panel and the back plate. The heat dissipation layer includes a plurality of heat dissipation units. The heat dissipation units are made of phase change material. The orthographic projection of each of the light-emitting light sources on the plane where the heat dissipation layer is located overlaps with one of the heat dissipation units.

2. The display module according to claim 1, wherein The cross-sectional area of the heat dissipation unit gradually decreases from the light-emitting panel to the back plate.

3. The display module according to claim 1, wherein The shape of the heat dissipation unit includes one or more of a triangular pyramid shape, a quadrangular pyramid shape, a hemispherical shape and an irregular shape.

4. The display module according to claim 1, wherein The plurality of heat dissipation units are separated from each other.

5. The display module according to claim 1, wherein Each of the heat dissipation units is connected to the light emitting panel and the back plate respectively.

6. The display module according to claim 1, wherein Among the plurality of heat dissipation units, at least one heat dissipation unit is provided with a driving chip inside.

7. The display module according to claim 1, wherein The heat dissipation layer further comprises a substrate, and the plurality of heat dissipation units are manufactured on the substrate; or, the plurality of heat dissipation units are manufactured on the back plate, or, the plurality of heat dissipation units are manufactured on the light-emitting panel.

8. The display module according to claim 7, wherein The substrate is made of FR4 copper clad plate or aluminum material.

9. A manufacturing method, characterized in that, Applicable to the display module according to any one of claims 1 to 8, the manufacturing method comprising: Providing the light emitting panel and the back panel; The heat dissipation layer is manufactured between the light emitting panel and the back plate.

10. The manufacturing method according to claim 9, characterized in that, The heat dissipation layer is manufactured between the light emitting panel and the back plate, comprising: A plurality of the heat dissipation units are manufactured by performing multi-layer spraying on the substrate, the back plate or the light-emitting panel to form the heat dissipation layer; wherein, corresponding to one heat dissipation unit, the area of each layer of the sprayed phase change material is different; or The phase change material is dripped at multiple positions on the substrate, the back plate or the light-emitting panel to produce multiple heat dissipation units and the heat dissipation layer.

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